MCP73871 Stand-Alone System Load Sharing and Li-Ion/Li-Polymer Battery Charge Management Controller Features Applications • Integrated System Load Sharing and Battery Charge Management - Simultaneously Power the System and Charge the Li-Ion Battery - Voltage Proportional Current Control (VPCC) ensures system load has priority over Li-Ion battery charge current - Low-Loss Power-Path Management with Ideal Diode Operation • Complete Linear Charge Management Controller - Integrated Pass Transistors - Integrated Current Sense - Integrated Reverse Discharge Protection - Selectable Input Power Sources: USB Port or AC-DC Wall Adapter • Preset High Accuracy Charge Voltage Options: - 4.10V, 4.20V, 4.35V or 4.40V - ±0.5% Regulation Tolerance • Constant Current/Constant Voltage (CC/CV) Operation with Thermal Regulation • Maximum 1.8A Total Input Current Control • Resistor Programmable Fast Charge Current Control: 50 mA to 1A • Resistor Programmable Termination Set Point • Selectable USB Input Current Control - Absolute Maximum: 100 mA (L)/500 mA (H) • Automatic Recharge • Automatic End-of-Charge Control • Safety Timer With Timer Enable/Disable Control • 0.1C Preconditioning for Deeply Depleted Cells • Battery Cell Temperature Monitor • Undervoltage Lockout (UVLO) • Low Battery Status Indicator (LBO) • Power-Good Status Indicator (PG) • Charge Status and Fault Condition Indicators • Numerous Selectable Options Available for a Variety of Applications: - Refer to Section 1.0 “Electrical Characteristics” for Selectable Options - Refer to the Product Identification System for Standard Options • Temperature Range: -40°C to +85°C • Packaging: 20-Lead QFN (4 mm x 4 mm) • • • • • • • • 2008-2013 Microchip Technology Inc. GPSs/Navigators PDAs and Smart Phones Portable Media Players and MP3 Players Digital Cameras Bluetooth Headsets Portable Medical Devices Charge Cradles/Docking Stations Toys Description The MCP73871 device is a fully integrated linear solution for system load sharing and Li-Ion/Li-Polymer battery charge management with AC-DC wall adapter and USB port power sources selection. It is also capable of autonomous power source selection between input and battery. Along with its small physical size, the low number of required external components makes the device ideally suited for portable applications. The MCP73871 device automatically obtains power for the system load from a single-cell Li-Ion battery or an input power source (AC-DC wall adapter or USB port). The MCP73871 device specifically adheres to the current drawn limits governed by the USB specification. With an AC-DC wall adapter providing power to the system, an external resistor sets the magnitude of 1A maximum charge current while supporting up to 1.8A total current for system load and battery charge current. The MCP73871 device employs a constantcurrent/constant-voltage (CC/CV) charge algorithm with selectable charge termination point. To accommodate new and emerging battery charging requirements, the constant voltage regulation is fixed with four available options: 4.10V, 4.20V, 4.35V or 4.40V. The MCP73871 device also limits the charge current based on the die temperature during high power or high ambient conditions. This thermal regulation optimizes the charge cycle time while maintaining device reliability. The MCP73871 device includes a low battery indicator, a power-good indicator and two charge status indicators that allow for outputs with LEDs or communication with host microcontrollers. The MCP73871 device is fully specified over the ambient temperature range of -40°C to +85°C. DS20002090C-page 1 MCP73871 Package Types CE VBAT_SENSE IN IN OUT MCP73871 20-Lead QFN* 20 19 18 17 16 OUT 1 15 VPCC 2 SEL 3 14 VBAT EP 21 12 11 8 9 10 TE VSS 7 PG STAT2 6 13 STAT1/LBO PROG2 4 THERM 5 VBAT PROG1 PROG3 VSS * Includes Exposed Thermal Pad (EP); see Table 3-1. Typical Application Circuit MCP73871 Typical Application AC-DC Adapter or USB Port 18, 19 10 μF 2 470 Low Hi Low Hi Low Hi Low Hi DS20002090C-page 2 6 IN 1, 20 System Load 4.7 μF VPCC VBAT 14, 15, 16 4.7 μF PG 470 7 STAT2 470 8 STAT1 LBO 3 SEL 4 OUT PROG2 THERM 5 NTC 10 k PROG1 13 RPROG1 Single-Cell Li-Ion Battery R PROG3 12 PROG3 9 TE 17 CE VSS 10, 11, EP 2008-2013 Microchip Technology Inc. MCP73871 Functional Block Diagram Direction Control 0.2 IN G = 0.001 OUT CURRENT LIMIT 0.2 VREF Ideal Diode, Synchronous Switch + Direction Control VBAT PROG1 G = 0.001 PROG3 G = 0.001 G = 0.001 CURRENT LIMIT + VREF - VPCC VREF/2 + - SEL PROG2 CA + VREF - PRECONDITION + CHRG 361k VBAT_SENSE VREF 89k VREF + 7k VA + - VREF - VREF 190k PG VREF 50 μA THERM + LTVT - CE HTVT - TE TERM + STAT2 UVLO, REFERENCE, CHARGE CONTROL, TIMER, AND STATUS LOGIC + STAT1 VSS VREF (1.21V) 2008-2013 Microchip Technology Inc. DS20002090C-page 3 MCP73871 NOTES: DS20002090C-page 4 2008-2013 Microchip Technology Inc. MCP73871 1.0 ELECTRICAL CHARACTERISTICS † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings† VIN ....................................................................................7.0V All Inputs and Outputs w.r.t. ................ VSS-0.3V to VDD+0.3V (VDD = VIN or VBAT) Maximum Junction Temperature, TJ ............ Internally Limited Storage temperature .....................................-65°C to +150°C ESD protection on all pins Human Body Model (1.5 k in Series with 100 pF)4 kV Machine Model (200 pF, No Series Resistance) .............300V DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, all limits apply for VIN = VREG + 0.3V to 6V, TA = -40°C to +85°C. Typical values are at +25°C, VIN = [VREG (typical) + 1.0V] Parameters Sym Min Typ Max Units Conditions Supply Voltage VIN VREG + 0.3V — 6 V Supply Current ISS — 2500 3750 μA Charging — 260 350 μA Charge Complete — 180 300 μA Standby — 28 50 μA Shutdown (VDD < VBAT – 100 mV or VDD < VSTOP) Supply Input UVLO Start Threshold VSTART VREG + 0.05V VREG + 0.15V VREG + 0.25V V VDD = Low-to-High UVLO Stop Threshold VSTOP VREG – 0.07V VREG + 0.07V VREG + 0.17V V VDD = High-to-Low UVLO Hysteresis VHYS — 90 — mV 4.080 4.10 4.121 V 4.179 4.20 4.221 V 4.328 4.35 4.372 V 4.378 4.40 4.422 -0.5 — +0.5 % TA = +25°C -0.75 — +0.75 % TA = -5°C to +55°C Voltage Regulation (Constant Voltage Mode) Regulated Charge Voltage Regulated Charge Voltage Tolerance VREG VRTOL VDD = [VREG(typical) + 1V] IOUT = 10 mA TA = -5°C to +55°C Line Regulation VBAT/VBAT) / VDD| — 0.08 0.20 %/V Load Regulation VBAT/VBAT| — 0.08 0.18 % IOUT = 10 mA to 150 mA VDD = [VREG(typical) + 1V] PSRR — -47 — dB IOUT = 10 mA, 1 kHz — -40 — dB IOUT = 10 mA, 10 kHz Supply Ripple Attenuation Note 1: 2: VDD = [VREG(typical) + 1V] to 6V IOUT = 10 mA The value is ensured by design and not production tested. The maximum available charge current is also limited by the value set at PROG1 input. 2008-2013 Microchip Technology Inc. DS20002090C-page 5 MCP73871 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all limits apply for VIN = VREG + 0.3V to 6V, TA = -40°C to +85°C. Typical values are at +25°C, VIN = [VREG (typical) + 1.0V] Parameters Sym Min Typ Max Units Conditions 90 100 110 mA PROG1 = 10 k TA = -5°C to +55°C, SEL = Hi 900 1000 1100 mA PROG1 = 1 k TA = -5°C to +55°C, SEL = Hi 80 90 100 mA PROG2 = Low, SEL = Low, (Note 2) TA = -5°C to +55°C 400 450 500 mA PROG2 = High, SEL = Low, (Note 2) TA = -5°C to +55°C 80 90 100 mA PROG2 = Low, SEL = Low TA = -5°C to +55°C 400 450 500 mA PROG2 = High, SEL = Low TA = -5°C to +55°C 1500 1650 1800 mA SEL = High, TA = -5°C to +55°C Current Regulation (Fast Charge Constant Current Mode) AC-Adapter Fast Charge Current IREG USB Fast Charge Current IREG Input Current Limit Control (ICLC) USB-Port Supply Current Limit AC-DC Adapter Current Limit ILIMIT_USB ILIMIT_AC Voltage Proportional Charge Control (VPCC - Input Voltage Regulation) VPCC Input Threshold VVPCC — 1.23 — V IOUT = 10 mA TA = -5°C to +55°C VPCC Input Threshold Tolerance VRTOL -3 — +3 % Input Leakage Current ILK — 0.01 1 μA VVPCC = VDD Precondition Current Regulation (Trickle Charge Constant Current Mode) Precondition Current Ratio IPREG/IREG 7.5 10 12.5 % PROG1 = 1.0 k to 10 k TA = -5°C to +55°C Precondition Current Threshold Ratio VPTH/VREG 69 72 75 % VBAT Low-to-High VPHYS — 105 — mV VBAT High-to-Low 75 100 125 mA PROG3 = 10 k TA = -5°C to +55°C 7.5 10 12.5 mA PROG3 = 100 k TA = -5°C to +55°C V VBAT High-to-Low Precondition Hysteresis Automatic Charge Termination Set Point Charge Termination Current Ratio ITERM Automatic Recharge Recharge Voltage Threshold Ratio VRTH VREG – 0.21V VREG – 0.15V VREG – 0.09V IN-to-OUT Pass Transistor ON-Resistance ON-Resistance Note 1: 2: RDS_ON — 200 — m VDD = 4.5V, TJ = 105°C The value is ensured by design and not production tested. The maximum available charge current is also limited by the value set at PROG1 input. DS20002090C-page 6 2008-2013 Microchip Technology Inc. MCP73871 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all limits apply for VIN = VREG + 0.3V to 6V, TA = -40°C to +85°C. Typical values are at +25°C, VIN = [VREG (typical) + 1.0V] Parameters Sym Min Typ Max Units Conditions — 200 — m VDD = 4.5V, TJ = 105°C RDS_ON — 200 — m VDD = 4.5V, TJ = 105°C IDISCHARGE — 30 40 μA Shutdown (VBAT < VDD < VUVLO) — 30 40 μA Shutdown (0 < VDD < VBAT) — 30 40 μA VBAT = Power Out, No Load — -6 -13 μA Charge Complete Charge Transistor ON-Resistance ON-Resistance RDSON_ BAT-to-OUT Pass Transistor ON-Resistance ON-Resistance Battery Discharge Current Output Reverse Leakage Current Status Indicators - STAT1 (LBO), STAT2, PG Sink Current ISINK — 16 35 mA Low Output Voltage VOL — 0.4 1 V ISINK = 4 mA Input Leakage Current ILK — 0.01 1 μA High Impedance, VDD on pin VLBO — Disable — 2.85 3.0 3.15 V 2.95 3.1 3.25 V 3.05 3.2 3.35 V VLBO_HYS — 150 — mV RPROG 1 — 20 k RPROG 5 — 100 k Input High Voltage Level VIH 1.8 — — V Input Low Voltage Level VIL — — 0.8 V Input Leakage Current ILK — 0.01 1 μA VPROG2 = VDD Input High Voltage Level VIH 1.8 — — V Note 1 Input Low Voltage Level VIL — — 0.8 V Note 1 Input Leakage Current ILK — 0.01 1 μA VTE = VDD Low Battery Indicator (LBO) Low Battery Detection Threshold Low Battery Detection Hysteresis VBAT > VIN, PG = Hi-Z TA = -5°C to +55°C VBAT Low-to-High PROG1 Input (PROG1) Charge Impedance Range PROG3 Input (PROG3) Termination Impedance Range PROG2 Input (PROG2) Timer Enable (TE) Note 1: 2: The value is ensured by design and not production tested. The maximum available charge current is also limited by the value set at PROG1 input. 2008-2013 Microchip Technology Inc. DS20002090C-page 7 MCP73871 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all limits apply for VIN = VREG + 0.3V to 6V, TA = -40°C to +85°C. Typical values are at +25°C, VIN = [VREG (typical) + 1.0V] Parameters Sym Min Typ Max Units Conditions Input High Voltage Level VIH 1.8 — — V Input Low Voltage Level VIL — — 0.8 V Input Leakage Current ILK — 0.01 1 μA Input High Voltage Level VIH 1.8 — — V Input Low Voltage Level VIL — — 0.8 V Input Leakage Current ILK — 0.01 1 μA VSEL = VDD ITHERM 47 50 53 μA 2 k < RTHERM < 50 k VT1 1.20 1.24 1.26 V VT1 Low-to-High VT1HYS — -40 — mV VT2 0.23 0.25 0.27 V VT2HYS — 40 — mV Die Temperature TSD — 150 — C Die Temperature Hysteresis TSDHYS — 10 — C Chip Enable (CE) VCE = VDD Input Source Selection (SEL) Thermistor Bias Thermistor Current Source Thermistor Comparator Upper Trip Threshold Upper Trip Point Hysteresis Lower Trip Threshold Lower Trip Point Hysteresis VT2 High-to-Low Thermal Shutdown Note 1: 2: The value is ensured by design and not production tested. The maximum available charge current is also limited by the value set at PROG1 input. DS20002090C-page 8 2008-2013 Microchip Technology Inc. MCP73871 AC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, all limits apply for VIN = 4.6V to 6V. Typical values are at +25°C, VDD = [VREG (typical) + 1.0V] Parameters Sym Min Typ Max Units tSTART — — 5 ms VDD Low-to-High tDELAY — — 10 ms VBAT < VPTH to VBAT > VPTH tRISE — — 10 ms IOUT Rising to 90% of IREG Precondition Comparator Filter Time tPRECON 0.4 1.3 3.2 ms Average VBAT Rise/Fall Termination Comparator Filter Time tTERM 0.4 1.3 3.2 ms Average IOUT Falling Charge Comparator Filter Time tCHARGE 0.4 1.3 3.2 ms Average VBAT Falling Thermistor Comparator Filter Time tTHERM 0.4 1.3 3.2 ms Average THERM Rise/Fall tELAPSED — 0 — Hours 3.6 4.0 4.4 Hours 5.4 6.0 6.6 Hours 7.2 8.0 8.8 Hours UVLO Start Delay Conditions Current Regulation Transition Time Out of Precondition Current Rise Time Out of Precondition Elapsed Timer Elapsed Timer Period Status Indicators Status Output Turn-off tOFF — — 500 μs ISINK = 1 mA to 0 mA Status Output Turn-on tON — — 500 μs ISINK = 0 mA to 1 mA Note 1: Internal safety timer is tested based on internal oscillator frequency measurement. TEMPERATURE SPECIFICATIONS Electrical Specifications: Unless otherwise indicated, all limits apply for VIN = 4.6V to 6V. Typical values are at +25°C, VDD = [VREG (typical) + 1.0V] Parameters Sym Min Typ Max Units TA -40 — +85 °C Operating Temperature Range TJ -40 — +125 °C Storage Temperature Range TA -65 — +150 °C JA — 50 — °C/W JC — 8 — Conditions Temperature Ranges Specified Temperature Range Thermal Package Resistances Thermal Resistance, 20LD-QFN, 4x4 2008-2013 Microchip Technology Inc. 4-Layer JC51-7 Standard Board, Natural Convection — DS20002090C-page 9 MCP73871 NOTES: DS20002090C-page 10 2008-2013 Microchip Technology Inc. MCP73871 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, VIN = [VREG(typical) + 1V], IOUT = 10 mA and TA = +25°C, Constant Voltage mode. FIGURE 2-1: Battery Regulation Voltage (VBAT) vs. Supply Voltage (VDD). FIGURE 2-4: Charge Current (IOUT) vs. Battery Regulation Voltage (VBAT). FIGURE 2-2: Battery Regulation Voltage (VBAT) vs. Ambient Temperature (TA). FIGURE 2-5: Output Leakage Current (IDISCHARGE) vs. Ambient Temperature (TA). FIGURE 2-3: Charge Current (IOUT) vs. Programming Resistor (RPROG). FIGURE 2-6: Output Leakage Current (IDISCHARGE) vs. Battery Regulation Voltage (VBAT). 2008-2013 Microchip Technology Inc. DS20002090C-page 11 MCP73871 Note: Unless otherwise indicated, VIN = [VREG(typical) + 1V], IOUT = 10 mA and TA = +25°C, Constant Voltage mode. FIGURE 2-7: Output Leakage Current (IDISCHARGE) vs. Battery Voltage (VBAT). FIGURE 2-10: Charge Current (IOUT) vs. Supply Voltage (VDD). FIGURE 2-8: Charge Current (IOUT) vs. Supply Voltage (VDD). FIGURE 2-11: Charge Current (IOUT) vs. Ambient Temperature (TA). FIGURE 2-9: Charge Current (IOUT) vs. Supply Voltage (VDD). FIGURE 2-12: Charge Current (IOUT) vs. Ambient Temperature (TA). DS20002090C-page 12 2008-2013 Microchip Technology Inc. MCP73871 Note: Unless otherwise indicated, VIN = [VREG(typical) + 1V], IOUT = 10 mA and TA = +25°C, Constant Voltage mode. FIGURE 2-13: Charge Current (IOUT) vs. Ambient Temperature (TA). FIGURE 2-16: Charge Current (IOUT) vs. Junction Temperature (TJ). FIGURE 2-14: Charge Current (IOUT) vs. Junction Temperature (TJ). FIGURE 2-17: Thermistor Current (ITHERM) vs. Supply Voltage (VDD). FIGURE 2-15: Charge Current (IOUT) vs. Junction Temperature (TJ). FIGURE 2-18: Thermistor Current (ITHERM) vs. Ambient Temperature (TA). 2008-2013 Microchip Technology Inc. DS20002090C-page 13 MCP73871 Note: Unless otherwise indicated, VIN = [VREG(typical) + 1V], IOUT = 10 mA and TA = +25°C, Constant Voltage mode. FIGURE 2-19: Power Supply Ripple Rejection (PSRR). FIGURE 2-22: IOUT = 100 mA. Load Transient Response. FIGURE 2-20: IOUT = 100 mA. Line Transient Response. FIGURE 2-23: IOUT = 500 mA. Load Transient Response. FIGURE 2-21: IOUT = 500 mA. Line Transient Response. FIGURE 2-24: Undervoltage Lockout. DS20002090C-page 14 2008-2013 Microchip Technology Inc. MCP73871 Note: Unless otherwise indicated, VIN = [VREG(typical) + 1V], IOUT = 10 mA and TA = +25°C, Constant Voltage mode. FIGURE 2-25: Startup Delay. FIGURE 2-26: Complete Charge Cycle (130 mAh Li-Ion Battery). 2008-2013 Microchip Technology Inc. FIGURE 2-27: Complete Charge Cycle (1000 mAh Li-Ion Battery). FIGURE 2-28: Typical Charge Profile in Preconditioning (1000 mAh Battery). DS20002090C-page 15 MCP73871 NOTES: DS20002090C-page 16 2008-2013 Microchip Technology Inc. MCP73871 3.0 PIN DESCRIPTION The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Number Symbol I/O 1, 20 OUT O System Output Terminal 2 VPCC I Voltage proportional charge control 3 SEL I Input type selection (Low for USB port, High for AC-DC adapter) 4 PROG2 I USB port input current limit selection when SEL = Low (Low = 100 mA, High = 500 mA) 5 THERM I/O Thermistor monitoring input and bias current 6 PG O Power-Good Status Output (Open-Drain) 7 STAT2 O Charge Status Output 2 (Open-Drain) 8 STAT1/LBO O Charge Status Output 1 (Open-Drain). Low battery output indicator when VBAT > VIN Timer Enable; Enables Safety Timer when active Low Function 9 TE I 10, 11, EP VSS — Battery Management 0V Reference. EP (Exposed Thermal Pad). There is an internal electrical connection between the exposed thermal pad and VSS. The EP must be connected to the same potential as the VSS pin on the Printed Circuit Board (PCB) 12 PROG3 I/O Termination set point for both AC-DC adapter and USB port 13 PROG1 I/O Fast charge current regulation setting with SEL = High. Preconditioning set point for both USB port and AC-DC adapter 14, 15 VBAT I/O Battery Positive Input and Output connection 16 VBAT_SENSE I/O Battery Voltage Sense 17 CE I Device Charge Enable; Enabled when CE = High 18, 19 IN I Power Supply Input Legend: I = Input, O = Output, I/O = Input/Output Note: 3.1 To ensure proper operation, the input pins must not allow floating and should always tie to either High or Low. Power Supply Input (IN) A supply voltage of VREG + 0.3V to 6V is recommended. Bypass to VSS with a minimum of 4.7 μF. 3.2 System Output Terminal (OUT) The MCP73871 device powers the system via output terminals while independently charging the battery. This feature reduces the charge and discharge cycles on the battery, allowing proper charge termination and the system to run with an absent or defective battery pack. It also gives the system priority on input power, allowing the system to power up with deeply depleted battery packs. Bypass to VSS with a minimum of 4.7 μF is recommended. 2008-2013 Microchip Technology Inc. 3.3 Voltage Proportional Charge Control (VPCC) If the voltage on the IN pin drops to a preset value, determined by the threshold established at the VPCC input, due to a limited amount of input current or input source impedance, the battery charging current is reduced. If possible, further demand from the system is supported by the battery. To enable this feature, simply supply 1.23V or greater to the VPCC pin. This feature can be disabled by connecting the VPCC pin to IN. For example, a system is designed with a 5.5V rated DC power supply with ±0.5V tolerance. The worst condition of 5V is selected, which is used to calculate the VPCC supply voltage with divider. DS20002090C-page 17 MCP73871 The voltage divider equation is shown below: EQUATION 3-1: V VPCC R2 = ------------------ V IN = 1.23V R + R 1 2 110k - 5V 1.23V = ---------------------------- 110k + R 1 R 1 = 337.2k The calculated R1 equals 337.2 k when 110 k is selected for R2. The 330 k resistor is selected for R1 to build the voltage divider for VPCC. VIN 3.7 Connect to positive terminal of battery. A precision internal voltage sense regulates the final voltage on this pin to VREG. 3.8 330 k 110 k FIGURE 3-1: 3.4 Voltage Divider Example. Input Source Type Selection (SEL) The input source type selection (SEL) pin is used to select input power source for input current limit control feature. With the SEL input High, the MCP73871 device is capable of providing 1.65 (typical) total amperes to be shared by the system load and Li-Ion battery charging. The MCP73871 device limits the input current up to 1.8A. When SEL active Low, the input source is designed to provide system power and Li-Ion battery charging from a USB Port input while adhering to the current limits governed by the USB specification. 3.5 Battery Management 0V Reference (VSS) Connect to negative terminal of the battery, system load and input supply. 3.6 Battery Charge Control Output (VBAT) Connect to positive terminal of the Li-Ion/Li-Polymer battery. Bypass to VSS with a minimum of 4.7 μF to ensure loop stability when the battery is disconnected. DS20002090C-page 18 Charge Current Regulation Set (PROG1) The maximum constant charge current is set by placing a resistor from PROG1 to VSS. PROG1 sets the maximum constant charge current for both AC-DC adapter and USB port. However, the actual charge current is based on the input source type and the system load requirement. 3.9 VPCC Battery Voltage Sense (VBAT_SENSE) USB-Port Current Regulation Set (PROG2) The MCP73871 device USB-Port current regulation set input (PROG2) is a digital input selection. A logic Low selects a one unit load input current from the USB port (100 mA) while a logic High selects a five unit load input current from the USB port (500 mA). 3.10 Charge Status Output 1 (STAT1) STAT1 is an open-drain logic output for connection to an LED for charge status indication. Alternatively, a pull-up resistor can be applied for interfacing to a host microcontroller. Refer to Table 5-1 for a summary of the status output during a charge cycle. 3.11 Charge Status Output 2 (STAT2) STAT2 is an open-drain logic output for connection to an LED for charge status indication. Alternatively, a pull-up resistor can be applied for interfacing to a host microcontroller. Refer to Table 5-1 for a summary of the status output during a charge cycle. 3.12 Power-Good (PG) The power-good (PG) is an open-drain logic output for input power supply indication. The PG output is low whenever the input to the MCP73871 device is above the UVLO threshold and greater than the battery voltage. The PG output may be used with an LED or as an interface to a host microcontroller to signal when an input power source is supplying power to the system and the battery. Refer to Table 5-1 for a summary of the status output during a charge cycle. 2008-2013 Microchip Technology Inc. MCP73871 3.13 Low Battery Output (LBO) STAT1 also serves as low battery output (LBO) if the selected MCP73871 is equipped with this feature. It provides an indication to the system or end user when the Li-Ion battery voltage level is low. The LBO feature is enabled when the system is running from the Li-Ion battery. The LBO output may be used with an LED or as an interface to a host microcontroller to signal when the system is operating from the battery and the battery is running low on charge. Refer to Table 5-1 for a summary of the status output during a charge cycle. 3.14 Timer Enable (TE) The timer enable (TE) feature is used to enable or disable the internal timer. A low signal enables and a high signal disables the internal timer on this pin. The TE input can be used to disable the timer when the system load is substantially limiting the available supply current to charge the battery. The TE input is compatible with 1.8V logic. Note: 3.15 3.16 Charge Enable (CE) With the CE input Low, the Li-Ion battery charger feature of the MCP73871 is disabled. The charger feature is enabled when CE is active High. Allowing the CE pin to float during the charge cycle may cause system instability. The CE input is compatible with 1.8V logic. Refer to Section 6.0 “Applications” for various applications in designing with CE features. 3.17 Exposed Thermal Pad (EP) An internal electrical connection exists between the Exposed Thermal Pad (EP) and the VSS pin. They must be connected to the same potential on the Printed Circuit Board (PCB). The built-in safety timer is available for the following options: 4 HR, 6 HR and 8 HR. Battery Temperature Monitor (THERM) The MCP73871 device continuously monitors battery temperature during a charge cycle by measuring the voltage between the THERM and VSS pins. An internal 50 μA current source provides the bias for most common 10 k Negative Temperature Coefficient (NTC) thermistors. The MCP73871 device compares the voltage at the THERM pin to factory set thresholds of 1.24V and 0.25V, typically. Once a voltage outside the thresholds is detected during a charge cycle, the MCP73871 device immediately suspends the charge cycle. The charge cycle resumes when the voltage at the THERM pin returns to the normal range. The charge temperature window can be set by placing fixed value resistors in series-parallel with a thermistor. Refer to Section 6.0 “Applications” for calculations of resistance values. 2008-2013 Microchip Technology Inc. DS20002090C-page 19 MCP73871 NOTES: DS20002090C-page 20 2008-2013 Microchip Technology Inc. MCP73871 4.0 DEVICE OVERVIEW The MCP73871 device is a simple but fully integrated linear charge management controller with system load sharing feature. Figure 4-1 depicts the operational flow algorithm. SHUTDOWN MODE * VDD < VUVLO VDD < VBAT STAT1 = Hi-Z STAT2 = Hi-Z PG = Hi-Z * Continuously Monitored STANDBY MODE * VBAT > (VREG + 100 mV) CE = LOW STAT1 = Hi-Z STAT2 = Hi-Z PG = LOW LBO * VIN < VBAT STAT1 = LOW STAT2 = Hi-Z PG = Hi-Z VBAT < VPTH PRECONDITIONING MODE Charge Current = IPREG STAT1 = LOW STAT2 = Hi-Z PG = LOW Timer Reset VBAT > VPTH TEMPERATURE FAULT No Charge Current STAT1 = LOW STAT2 = LOW PG = LOW Timer Suspended FAST CHARGE MODE Charge Current = IREG STAT1 = LOW STAT2 = Hi-Z PG = LOW Timer Enabled VBAT > VPTH Timer Expired TIMER FAULT No Charge Current STAT1 = LOW STAT2 = LOW PG = LOW Timer Reset CONSTANT VOLTAGE MODE Charge Voltage = VREG STAT1 = LOW STAT2 = Hi-Z PG = LOW IBAT < ITERM Timer Expired CHARGE COMPLETE MODE No Charge Current STAT1 = Hi-Z STAT2 = LOW PG = LOW Timer Reset FIGURE 4-1: MCP73871 Device Flow Chart. 2008-2013 Microchip Technology Inc. DS20002090C-page 21 MCP73871 Table 4-1 shows the chip behavior based upon the operating conditions. 0 0 X 0 Shutdown OFF — Battery powered system ON — Shutdown 3 4 5 0 7 1 — Battery powered system VBAT < VOUT Standby OFF VBAT > VOUT IN + BAT powered system ON VBAT < VOUT IN powered, Charge possible VBAT > VOUT IN + BAT powered system 1 8 1 1 9 4.1 OFF Shutdown 0 VIN > VBAT UnderVoltage Lockout (UVLO) An internal undervoltage lockout (UVLO) circuit monitors the input voltage and keeps the charger in shutdown mode until the input supply rises above the UVLO threshold. In the event a battery is present when the input power is applied, the input supply must rise approximately 100 mV above the battery voltage before the MCP73871 device becomes operational. OFF ON ON ON The UVLO circuit is always active. At any time the input supply is below the UVLO threshold or falls within approximately 100 mV of the voltage at the VBAT pin, the MCP73871 device is placed in Shutdown mode. During any UVLO condition, the battery reverse discharge current is less than 2 μA. System Load Sharing The system load sharing feature gives the system output pin (OUT) priority, allowing the system to power up with deeply depleted battery packs. With the SEL input active Low, the MCP73871 device is designed to provide system power and Li-Ion battery charging from a USB input while adhering to the current limits governed by the USB specification. DS20002090C-page 22 OFF OFF ON OFF ON ON/OFF OFF With the SEL input active High, the MCP73871 device limits the total supply current to 1.8A (system power and charge current combined). IN System Power FET Direction Control Current Limit The UVLO circuit places the device in Shutdown mode if the input supply falls to within approximately 100 mV of the battery voltage. 4.2 OFF 0 6 Charge VIN > VBAT 1 2 IOUT 0 State Synchronous Diode 0 VBAT ? VOUT Thermal Block VBAT > VIN 1 VIN > 2V CE VIN ? VBAT Bias + VREF CHIP BEHAVIOR REFERENCE TABLE VIN > UVLO TABLE 4-1: 0.2 0.2 OUT Ideal Diode, Synchronous Switch Charge Control VBAT Charge FET FIGURE 4-2: Diagram. 4.3 Direction Control System Load Sharing Charge Qualification For a charge cycle to begin, all UVLO conditions must be met and a battery or output load must be present. A charge current programming resistor must be connected from PROG1 to VSS when SEL = High. When SEL = Low, PROG2 needs to be tied High or Low for proper operation. 2008-2013 Microchip Technology Inc. MCP73871 4.4 Preconditioning If the voltage at the VBAT pin is less than the preconditioning threshold, the MCP73871 device enters a preconditioning mode. The preconditioning threshold is factory set. Refer to Section 1.0 “Electrical Characteristics” for preconditioning threshold options. In this mode, the MCP73871 device supplies 10% of the fast charge current (established with the value of the resistor connected to the PROG1 pin) to the battery. When the voltage at the VBAT pin rises above the preconditioning threshold, the MCP73871 device enters the Constant Current (fast charge) mode. 4.5 Constant Current Mode – Fast Charge During the Constant Current mode, the programmed charge current is supplied to the battery or load. The charge current is established using a single resistor from PROG1 to VSS. The program resistor and the charge current are calculated using the following equation: EQUATION 4-1: 1000V I REG = ------------------R PROG1 Where: RPROG = kilo-ohms (k IREG = milliampere (mA) Constant Current mode is maintained until the voltage at the VBAT pin reaches the regulation voltage, VREG. When Constant Current mode is invoked, the internal timer is reset. 4.5.1 TIMER EXPIRED DURING CONSTANT CURRENT - FAST CHARGE MODE If the internal timer expires before the recharge voltage threshold is reached, a timer fault is indicated and the charge cycle terminates. The MCP73871 device remains in this condition until the battery is removed. If the battery is removed, the MCP73871 device enters the Standby mode where it remains until a battery is reinserted. 4.6 4.7 Charge Termination The Constant Voltage mode charge cycle terminates either when the average charge current diminishes below a threshold established by the value of the resistor connected from PROG3 to VSS or when the internal charge timer expires. When the charge cycle terminates due to a fully charged battery, the charge current is latched off and the MCP73871 device enters the Charge Complete mode. A 1 ms filter time on the termination comparator ensures that transient load conditions do not result in premature charge cycle termination. The timer period is factory set and can be disabled. Refer to Section 1.0 “Electrical Characteristics” for timer period options. The program resistor and the charge current are calculated using the following equation: EQUATION 4-2: 1000V I TERMINATION = ------------------R PROG3 Where: RPROG = kilo-ohms (k IREG = milliampere (mA) The recommended PROG3 resistor values are between 5 k and 100 k. 4.8 Automatic Recharge The MCP73871 device continuously monitors the voltage at the VBAT pin in the charge complete mode. If the voltage drops below the recharge threshold, another charge cycle begins and current is supplied again to the battery or load. The recharge threshold is factory set. Refer to Section 1.0 “Electrical Characteristics” for recharge threshold options. Note: Charge termination and automatic recharge features avoid constantly charging Li-Ion batteries, resulting in prolonged battery life while maintaining full cell capacity. Constant Voltage Mode When the voltage at the VBAT pin reaches the regulation voltage, VREG, constant voltage regulation begins. The regulation voltage is factory set to 4.10V or 4.20V with a tolerance of ±0.5%. 2008-2013 Microchip Technology Inc. DS20002090C-page 23 MCP73871 4.9 Thermal Regulation The MCP73871 device limits the charge current based on the die temperature. The thermal regulation optimizes the charge cycle time while maintaining device reliability. Figure 4-3 depicts the thermal regulation for the MCP73871 device. Refer to Section 1.0 “Electrical Characteristics” for thermal package resistances and Section 6.1.1.2 “Thermal Considerations” for calculating power dissipation. . 4.12 Voltage Proportional Charge Control (VPCC) If the voltage on the IN pin drops to a preset value, determined by the threshold established at the VPCC input, due to a limited amount of input current or input source impedance, the battery charging current is reduced. The VPCC control tries to reach a steady state condition where the system load has priority and the battery is charged with the remaining current. Therefore, if the system demands more current than the input can provide, the ideal diode becomes forward-biased and the battery may supplement the input current to the system load. The VPCC sustains the system load as its highest priority. It does this by reducing the noncritical charge current while maintaining the maximum power output of the adapter. Further demand from the system is supported by the battery, if possible. The VPCC feature functions identically for USB port or AC-DC adapter inputs. This feature can be disabled by connecting the VPCC to IN pin. FIGURE 4-3: 4.10 Thermal Regulation. Thermal Shutdown The MCP73871 device suspends charge if the die temperature exceeds 150°C. Charging resumes when the die temperature has cooled by approximately 10°C. The thermal shutdown is a secondary safety feature in the event that there is a failure within the thermal regulation circuitry. 4.11 Temperature Qualification The MCP73871 device continuously monitors battery temperature during a charge cycle by measuring the voltage between the THERM and VSS pins. An internal 50 μA current source provides the bias for most common 10 k NTC thermistors. The MCP73871 device compares the voltage at the THERM pin to factory set thresholds of 1.24V and 0.25V, typically. Once a voltage outside the thresholds is detected during a charge cycle, the MCP73871 device immediately suspends the charge cycle. The MCP73871 device suspends charging by turning off the charge pass transistor and holding the timer value. The charge cycle resumes when the voltage at the THERM pin returns to the normal range. 4.13 Input Current Limit Control (ICLC) If the input current threshold is reached, then the battery charging current is reduced. The ICLC tries to reach a steady state condition where the system load has priority and the battery is charged with the remaining current. No active control limits the current to the system. Therefore, if the system demands more current than the input can provide or the ICLC is reached, the ideal diode becomes forward biased and the battery may supplement the input current to the system load. The ICLC sustains the system load as its highest priority. This is done by reducing the non-critical charge current while adhering to the current limits governed by the USB specification or the maximum AC-DC adapter current supported. Further demand from the system is supported by the battery, if possible. FIGURE 4-4: USB Port. DS20002090C-page 24 Input Current Limit Control - 2008-2013 Microchip Technology Inc. MCP73871 5.0 DETAILED DESCRIPTION 5.1.4 5.1 Analog Circuitry The MCP73871 device continuously monitors battery temperature during a charge cycle by measuring the voltage between the THERM and VSS pins. An internal 50 μA current source provides the bias for most common 10 k NTC or Positive Temperature Coefficient (PTC) thermistors.The current source is controlled, avoiding measurement sensitivity to fluctuations in the supply voltage (VDD). The MCP73871 device compares the voltage at the THERM pin to factory set thresholds of 1.24V and 0.25V, typically. Once a voltage outside the thresholds is detected during a charge cycle, the MCP73871 device immediately suspends the charge cycle. 5.1.1 LOAD SHARING AND LI-ION BATTERY MANAGEMENT INPUT SUPPLY (VIN) The VIN input is the input supply to the MCP73871 device. The MCP73871 device can be supplied by either AC Adapter (VAC) or USB Port (VUSB) with SEL pin. The MCP73871 device automatically powers the system with the Li-Ion battery when the VIN input is not present. 5.1.2 FAST CHARGE CURRENT REGULATION SET (PROG1) For the MCP73871 device, the charge current regulation can be scaled by placing a programming resistor (RPROG1) from the PROG1 pin to VSS. The program resistor and the charge current are calculated using the following equation: I REG 1000V = ------------------R PROG1 Where: RPROG = kilo-ohms (k IREG = milliampere (mA) The fast charge current is set for maximum charge current from AC-DC adapter and USB port. The preconditioning current is 10% (0.1C) of the fast charge current. 5.1.3 The MCP73871 device suspends charge by turning off the pass transistor and holding the timer value. The charge cycle resumes when the voltage at the THERM pin returns to the normal range. If temperature monitoring is not required, place a standard 10 k resistor from THERM to VSS. 5.2 EQUATION 5-1: BATTERY CHARGE CONTROL OUTPUT (VBAT) The battery charge control output is the drain terminal of an internal P-channel MOSFET. The MCP73871 device provides constant current and voltage regulation to the battery pack by controlling this MOSFET in the linear region. The battery charge control output should be connected to the positive terminal of the battery pack. 2008-2013 Microchip Technology Inc. TEMPERATURE QUALIFICATION (THERM) Digital Circuitry 5.2.1 STATUS INDICATORS AND POWER-GOOD (PG) The charge status outputs have two different states: Low-Impedance (L) and High-Impedance (Hi-Z). The charge status outputs can be used to illuminate LEDs. Optionally, the charge status outputs can be used as an interface to a host microcontroller. Table 5-1 summarizes the state of the status outputs during a charge cycle. TABLE 5-1: STATUS OUTPUTS CHARGE CYCLE STATE STAT1 STAT2 PG Hi-Z Shutdown (VDD = VBAT) Hi-Z Hi-Z Shutdown (VDD = IN) Hi-Z Hi-Z L Shutdown (CE = L) Hi-Z Hi-Z L Preconditioning L Hi-Z L Constant Current L Hi-Z L Constant Voltage L Hi-Z L Hi-Z L L Temperature Fault L L L Timer Fault L L L Low Battery Output L Hi-Z Hi-Z No Battery Present Hi-Z Hi-Z L No Input Power Present Hi-Z Hi-Z Hi-Z Charge Complete - Standby DS20002090C-page 25 MCP73871 5.2.2 AC-DC ADAPTER AND USB PORT POWER SOURCE REGULATION SELECT (SEL) With the SEL input Low, the MCP73871 device is designed to provide system power and Li-Ion battery charging from a USB input while adhering to the current limits governed by the USB specification. The host microcontroller has the option to select either a 100 mA (L) or a 500 mA (H) current limit based on the PROG2 input. With the SEL input High, the MCP73871 device limits the input current to 1.8A. The programmed charge current is established using a single resistor from PROG1 to VSS when driving SEL High. 5.2.3 USB PORT CURRENT REGULATION SELECT (PROG2) Driving the PROG2 input to a logic Low selects the low USB port source current setting (maximum 100 mA). Driving the PROG2 input to a logic High selects the high USB port source current setting (maximum 500 mA). 5.2.4 POWER-GOOD (PG) The power-good (PG) option is a pseudo open-drain output. The PG output can sink current, but not source current. The PG output must not be pulled up higher than VIN because there is a diode path back to VIN. The PG output is low whenever the input to the MCP73871 device is above the UVLO threshold and greater than the battery voltage. The PG output can be used as an indication to the system that an input source other than the battery is supplying power. 5.2.5 TIMER ENABLE (TE) OPTION The timer enable (TE) input option is used to enable or disable the internal timer. A low signal on this pin enables the internal timer and a high signal disables the internal timer. The TE input can be used to disable the timer when the charger is supplying current to charge the battery and power the system load. The TE input is compatible with 1.8V logic. DS20002090C-page 26 2008-2013 Microchip Technology Inc. MCP73871 6.0 APPLICATIONS The MCP73871 device is designed to operate in conjunction with a host microcontroller or in stand-alone applications. The MCP73871 device provides the preferred charge algorithm for Lithium-Ion and Lithium-Polymer cells. The algorithm uses Constant Current mode followed by Constant Voltage mode. Figure 6-1 depicts a typical stand-alone MCP73871 application circuit, while Figure 6-2 and Figure 6-3 depict the accompanying charge profile. MCP73871 Device Typical Application 5V AC-DC Adapter or USB Port 18, 19 10 μF 470 6 PG 4.7 μF VBAT 14, 15, 16 7 STAT2 470 8 STAT1 LBO THERM 5 2 PROG1 13 RPROG1 3 Low Hi Low Hi Low Hi Low Hi FIGURE 6-1: System Load OUT 470 330 k 110 k 1, 20 IN 4 VPCC 4.7 μF NTC 10 k Single-Cell Li-Ion Battery SEL PROG2 R PROG3 12 PROG3 9 TE 17 CE VSS 10, 11, EP MCP73871Typical Stand-Alone Application Circuit with VPCC. FIGURE 6-2: Typical Charge Profile (1000 mAh Battery). 2008-2013 Microchip Technology Inc. FIGURE 6-3: Typical Charge Profile in Preconditioning (1000 mAh Battery). DS20002090C-page 27 MCP73871 6.1 Application Circuit Design Due to the low efficiency of linear charging, the most important factors are thermal design and cost, which are a direct function of the input voltage, output current and thermal impedance between the battery charger and the ambient cooling air. The worst-case situation is when the device has transitioned from the Preconditioning mode to the Constant Current mode. In this situation, the battery charger has to dissipate the maximum power. A trade-off must be made between the charge current, cost and thermal requirements of the charger. 6.1.1 COMPONENT SELECTION Selection of the external components in Figure 6-1 is crucial to the integrity and reliability of the charging system. The following discussion is intended as a guide for the component selection process. 6.1.1.1 Charge Current The preferred fast charge current for Lithium-Ion cells should always follow references and guidances from battery manufacturers. For example, a 1000 mAh battery pack has a preferred fast charge current of 0.7C. Charging at 700 mA provides the shortest charge cycle times without degradation to the battery pack performance or life. 6.1.1.2 Thermal Considerations The worst-case power dissipation in the battery charger occurs when the input voltage is at the maximum and the device has transitioned from the Preconditioning mode to the Constant Current mode. In this case, the power dissipation is: EQUATION 6-1: PowerDissipation = V DDMAX – V PTHMIN I REGMAX Where: VDDMAX = the maximum input voltage IREGMAX = the maximum fast charge current VPTHMIN = the minimum transition threshold voltage This power dissipation with the battery charger in the QFN-20 package causes thermal regulation to enter as depicted. Alternatively, the 4 mm x 4 mm DFN package could be utilized to reduce heat by adding vias on the exposed pad. 6.1.1.3 The MCP73871 device is stable with or without a battery load. To maintain good AC stability in the Constant Voltage mode, a minimum capacitance of 4.7 μF is recommended to bypass the VBAT pin to VSS. This capacitance provides compensation when there is no battery load. In addition, the battery and interconnections appear inductive at high frequencies. These elements are in the control feedback loop during Constant Voltage mode. Therefore, the bypass capacitance may be necessary to compensate for the inductive nature of the battery pack. Virtually any good quality output filter capacitor can be used, regardless of the capacitor’s minimum Effective Series Resistance (ESR) value. The actual value of the capacitor (and its associated ESR) depends on the output load current. A 4.7 μF ceramic, tantalum or aluminum electrolytic capacitor at the output is usually sufficient to ensure stability for charge currents up to 1000 mA. 6.1.1.4 6.1.1.5 DS20002090C-page 28 Temperature Monitoring The charge temperature window can be set by placing fixed value resistors in series-parallel with a thermistor. The resistance values of RT1 and RT2 can be calculated with the following equations to set the temperature window of interest. For NTC thermistors: EQUATION 6-2: R T 2 R COLD 24k = R T 1 + --------------------------------R T 2 + R COLD Where: PowerDissipation = 5.5V – 2.7V 550 mA = 1.54W Reverse-Blocking Protection The MCP73871 device provides protection from a faulted or shorted input. Without the protection, a faulted or shorted input would discharge the battery pack through the body diode of the internal pass transistor. For example, power dissipation with a 5V, ±10% input voltage source and 500 mA, ±10% fast charge current is: EXAMPLE 6-1: External Capacitors R T 2 R HOT 5k = R T 1 + -----------------------------R T 2 + R HOT RT1 = the fixed series resistance RT2 = the fixed parallel resistance RCOLD = the thermistor resistance at the lower temperature of interest RHOT = the thermistor resistance at the upper temperature of interest 2008-2013 Microchip Technology Inc. MCP73871 For example, by utilizing a 10 k at 25°C NTC thermistor with a sensitivity index, , of 3892, the charge temperature range can be set to 0-50°C by placing a 1.54 k resistor in series (RT1), and a 69.8 k resistor in parallel (RT2) with the thermistor. 6.1.1.6 Charge Status Interface A status output provides information on the state of charge. The output can be used to illuminate external LEDs or interface to a host microcontroller. Refer to Table 5-1 for a summary of the state of the status output during a charge cycle. 6.1.1.7 6.2 PCB Layout Issues For optimum voltage regulation, it is recommended to place the battery pack closest to the device’s VBAT and VSS pins to minimize voltage drops along the high current-carrying PCB traces. If the PCB layout is used as a heatsink, adding many vias in the heatsink pad can help conduct more heat to the PCB backplane, thus reducing the maximum junction temperature. System Load Current The preferred discharge current for Lithium-Ion cells should always follow references and guidance from battery manufacturers. The recommended system load should be the lesser of 1.0 amperes or the maximum discharge rate of the selected Lithium-Ion cell. This limits the safety concerns of power dissipation and exceeding the manufacturer’s maximum discharge rate of the cell. The ideal diode between VBAT and OUT is designed to drive a maximum current up to 2A. The built-in thermal shutdown protection may turn the MCP73871 device off with high current. 2008-2013 Microchip Technology Inc. DS20002090C-page 29 MCP73871 NOTES: DS20002090C-page 30 2008-2013 Microchip Technology Inc. MCP73871 7.0 PACKAGING INFORMATION 7.1 Package Marking Information 20-Lead QFN (4x4x0.9 mm) PIN 1 Example PIN 1 Part Number * Marking Code (Second Row) Part Number * 73871 1AA e3 I/ML^^ 314256 Marking Code (Second Row) MCP73871-1AAI/ML 1AA MCP73871T-1AAI/ML MCP73871-1CAI/ML 1CA MCP73871T-1CAI/ML MCP73871-1CCI/ML 1CC MCP73871T-1CCI/ML MCP73871-2AAI/ML 2AA MCP73871T-2AAI/ML MCP73871-2CAI/ML 2CA MCP73871T-2CAI/ML MCP73871-2CCI/ML 2CC MCP73871T-2CCI/ML MCP73871-3CAI/ML 3CA MCP73871T-3CAI/ML MCP73871-3CCI/ML 3CC MCP73871T-3CCI/ML MCP73871-4CAI/ML 4CA MCP73871T-4CAI/ML MCP73871-4CCI/ML 4CC MCP73871T-4CCI/ML * Consult Factory for Alternative Device Options. Legend: XX...X Y YY WW NNN e3 * Note: 1AA 1CA 1CC 2AA 2CA 2CC 3CA 3CC 4CA 4CC Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2008-2013 Microchip Technology Inc. DS20002090C-page 31 MCP73871 /HDG3ODVWLF4XDG)ODW1R/HDG3DFNDJH 0/ ±[[PP%RG\>4)1@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D D2 EXPOSED PAD e E2 2 E b 2 1 1 K N N NOTE 1 TOP VIEW L BOTTOM VIEW A A1 A3 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV 0,//,0(7(56 0,1 1 120 0$; 3LWFK H 2YHUDOO+HLJKW $ 6WDQGRII $ &RQWDFW7KLFNQHVV $ 2YHUDOO:LGWK ( ([SRVHG3DG:LGWK ( 2YHUDOO/HQJWK ' ([SRVHG3DG/HQJWK %6& 5() %6& %6& ' &RQWDFW:LGWK E &RQWDFW/HQJWK / &RQWDFWWR([SRVHG3DG . ± ± 1RWHV 3LQYLVXDOLQGH[IHDWXUHPD\YDU\EXWPXVWEHORFDWHGZLWKLQWKHKDWFKHGDUHD 3DFNDJHLVVDZVLQJXODWHG 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 5() 5HIHUHQFH'LPHQVLRQXVXDOO\ZLWKRXWWROHUDQFHIRULQIRUPDWLRQSXUSRVHVRQO\ 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% DS20002090C-page 32 2008-2013 Microchip Technology Inc. MCP73871 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ 2008-2013 Microchip Technology Inc. DS20002090C-page 33 MCP73871 NOTES: DS20002090C-page 34 2008-2013 Microchip Technology Inc. MCP73871 APPENDIX A: REVISION HISTORY Revision C (September 2013) The following is the list of modifications: 1. 2. 3. 4. Updated Functional Block Diagram. Added Table 4-1 in Section 4.0 “Device Overview”. Updated Section 7.0 “Packaging Information”. Minor grammatical and editorial corrections. Revision B (May 2009) The following is the list of modifications: 1. 2. 3. 4. Updated the QFN-20 package drawing. Updated Equation 4-1. Updated Section 4.7 “Charge Termination” and Equation 4-2. Updated Equation 5-1. Revision A (July 2008) • Original Release of this Document. 2008-2013 Microchip Technology Inc. DS20002090C-page 35 MCP73871 NOTES: DS20002090C-page 36 2008-2013 Microchip Technology Inc. MCP73871 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device XX X/ Examples: * * XX Output Temp. Package Options* Device: MCP73871: USB/AC Battery Charger with PPM MCP73871T: USB/AC Battery Charger with PPM (Tape and Reel) Output Options * * * Refer to table below for different operational options. a) MCP73871-1AAI/ML: b) MCP73871-1CAI/ML: c) MCP73871-1CCI/ML: d) MCP73871-2AAI/ML: e) MCP73871-2CAI/ML: f) MCP73871-2CCI/ML: g) MCP73871-3CAI/ML: h) MCP73871-3CCI/ML: * * Consult Factory for Alternative Device Options. Temperature: I = -40C to +85C Package Type: ML = Plastic Quad Flat No Lead (QFN) (4x4x0.9 mm Body), 20-lead 4.10V PPM Battery Charger, 20LD QFN pkg. 4.10V, PPM Battery Charger, 20LD QFN pkg. 4.10V, PPM Battery Charger, 20LD QFN pkg. 4.20V, PPM Battery Charger, 20LD QFN pkg. 4.20V PPM Battery Charger, 20LD QFN pkg. 4.20V PPM Battery Charger, 20LD QFN pkg. 4.35V PPM Battery Charger, 20LD QFN pkg. 4.35V PPM Battery Charger, 20LD QFN pkg. * * Consult Factory for Alternative Device Options * Operational Output Options Output Options VREG Safety Timer Duration (Hours) LBO Voltage Threshold (V) 1AA 4.10V Disabled Disabled 1CA 4.10V 6 Disabled 1CC 4.10V 6 3.1 2AA 4.20V Disabled Disabled 2CA 4.20V 6 Disabled 2CC 4.20V 6 3.1 3CA 4.35V 6 Disabled 3CC 4.35V 6 3.1 4CA 4.40V 6 Disabled 4CC 4.40V 6 3.1 * * Consult Factory for Alternative Device Options. 2008-2013 Microchip Technology Inc. DS20002090C-page 37 MCP73871 NOTES: DS20002090C-page 38 2008-2013 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. 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Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2008-2013, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-62077-428-1 Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2008-2013 Microchip Technology Inc. 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