Datasheet Voltage Detector IC Series for Automotive Counter Timer Built-in CMOS Voltage Detector IC BD45Exxxx-M series BD46Exxxx-M series ●Key Specifications Detection voltage: ●General Description ROHM’s BD45Exxxx-M and BD46Exxxx-M series are highly accurate, low current consumption Voltage Detector IC series. Because the counter timer delay circuit is built into those series, an external capacitor for the delay time setting is unnecessary. The lineup was established with two output types (Nch open drain and CMOS output) and detection voltages range from 2.3V to 4.8V in increments of 0.1V, so that the series may be selected according to application. ●Features Counter Timer Built-in No delay time setting capacitor required Ultra-low current consumption Two output types (Nch open drain and CMOS output) Package SSOP5 is similar to SOT-23-5 (JEDEC) AEC-Q100 Qualified 2.3V to 4.8V (Typ.) 0.1V steps High accuracy detection voltage: ±1.0% Ultra-low current consumption: 0.85µA (Typ.) Operating temperature range: -40°C to +105°C 50ms Three internal, fixed delay time: 100ms 200ms ●Package SSOP5 2.90mm x 2.80mm x 1.25mm ●Applications Circuits using microcontrollers or logic circuits that require a reset for automotive applications (car navigation, car audio, meter panel, exterior lamp etc.) ●Typical Application Circuit VDD1 VDD1 VDD2 RL BD45Exxxx-M RST BD46Exxxx-M Micro controller RST CL CL （Noise-filtering Capacitor） （Noise-filtering Capacitor） Micro controller GND GND （CMOS Output Type） BD46Exxxx-M series （Open Drain Output Type） BD45Exxxx-M series ●Pin Descriptions ●Connection Diagram SSOP5 VDD VOUT TOP VIEW Lot. No Marking ER SUB GND PIN No. Symbol Function 1 ER 2 SUB Substrate * 3 GND GND 4 VOUT Reset Output 5 VDD Power Supply Voltage Manual Reset *Connect the substrate to GND. ○Product structure：Silicon monolithic integrated circuit .www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed for protection against radioactive rays 1/14 TSZ02201-0R7R0G300110-1-2 27.Aug.2013 Rev.004 BD45Exxxx-M series BD46Exxxx-M series ●Ordering Information B Part Number D x x E Output Type 45 : Open Drain 46 : CMOS x x Reset Voltage Value 23 : 2.3V 0.1V step 48 : 4.8V x x - Counter Timer Package Delay Time Settings G : SSOP5 5 : 50ms 1 : 100ms 2 : 200ms M Product Category M : Automotive Category T R Packaging and forming specification TR : Embossed tape and reel ●Lineup Table 1. Open Drain Output Type Counter Timer Delay Time Settings 50ms Detection Voltage Marking 4.8V 4.7V 4.6V 4.5V 4.4V 4.3V 4.2V 4.1V 4.0V 3.9V 3.8V 3.7V 3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V 2.5V 2.4V 2.3V a2 a1 Yy Yr Yp Yn Ym Yk Yh Yg Yf Ye Yd Yc Yb Ya Uy Ur Up Un Um Uk Uh Ug Uf Ue www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Part Number BD45E485 BD45E475 BD45E465 BD45E455 BD45E445 BD45E435 BD45E425 BD45E415 BD45E405 BD45E395 BD45E385 BD45E375 BD45E365 BD45E355 BD45E345 BD45E335 BD45E325 BD45E315 BD45E305 BD45E295 BD45E285 BD45E275 BD45E265 BD45E255 BD45E245 BD45E235 100ms 200ms Marking Part Number Marking Part Number d1 c9 c8 c7 c6 c5 c4 c3 c2 c1 b9 b8 b7 b6 b5 b4 b3 b2 b1 a9 a8 a7 a6 a5 a4 a3 BD45E481 BD45E471 BD45E461 BD45E451 BD45E441 BD45E431 BD45E421 BD45E411 BD45E401 BD45E391 BD45E381 BD45E371 BD45E361 BD45E351 BD45E341 BD45E331 BD45E321 BD45E311 BD45E301 BD45E291 BD45E281 BD45E271 BD45E261 BD45E251 BD45E241 BD45E231 f9 f8 f7 f6 f5 f4 f3 f2 f1 e9 e8 e7 e6 e5 e4 e3 e2 e1 d9 d8 d7 d6 d5 d4 d3 d2 BD45E482 BD45E472 BD45E462 BD45E452 BD45E442 BD45E432 BD45E422 BD45E412 BD45E402 BD45E392 BD45E382 BD45E372 BD45E362 BD45E352 BD45E342 BD45E332 BD45E322 BD45E312 BD45E302 BD45E292 BD45E282 BD45E272 BD45E262 BD45E252 BD45E242 BD45E232 2/14 TSZ02201-0R7R0G300110-1-2 27.Aug.2013 Rev.004 BD45Exxxx-M series BD46Exxxx-M series ●Lineup - continued Table 2. CMOS Output Type Counter Timer Delay Time Settings 50ms Detection Voltage Marking 4.8V 4.7V 4.6V 4.5V 4.4V 4.3V 4.2V 4.1V 4.0V 3.9V 3.8V 3.7V 3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V 2.5V 2.4V 2.3V k8 k7 k6 k5 k4 k3 k2 k1 h9 h8 h7 h6 h5 h4 h3 h2 h1 g9 g8 g7 g6 g5 g4 g3 g2 g1 100ms 200ms Part Number Marking Part Number Marking Part Number BD46E485 BD46E475 BD46E465 BD46E455 BD46E445 BD46E435 BD46E425 BD46E415 BD46E405 BD46E395 BD46E385 BD46E375 BD46E365 BD46E355 BD46E345 BD46E335 BD46E325 BD46E315 BD46E305 BD46E295 BD46E285 BD46E275 BD46E265 BD46E255 BD46E245 BD46E235 p7 p6 p5 p4 p3 p2 p1 n9 n8 n7 n6 n5 n4 n3 n2 n1 m9 m8 m7 m6 m5 m4 m3 m2 m1 k9 BD46E481 BD46E471 BD46E461 BD46E451 BD46E441 BD46E431 BD46E421 BD46E411 BD46E401 BD46E391 BD46E381 BD46E371 BD46E361 BD46E351 BD46E341 BD46E331 BD46E321 BD46E311 BD46E301 BD46E291 BD46E281 BD46E271 BD46E261 BD46E251 BD46E241 BD46E231 1f 1e 1d 1c 1b 1a y9 y8 y7 y6 y5 y4 y3 y2 y1 r9 r8 r7 r6 r5 r4 r3 r2 r1 p9 p8 BD46E482 BD46E472 BD46E462 BD46E452 BD46E442 BD46E432 BD46E422 BD46E412 BD46E402 BD46E392 BD46E382 BD46E372 BD46E362 BD46E352 BD46E342 BD46E332 BD46E322 BD46E312 BD46E302 BD46E292 BD46E282 BD46E272 BD46E262 BD46E252 BD46E242 BD46E232 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/14 TSZ02201-0R7R0G300110-1-2 27.Aug.2013 Rev.004 BD45Exxxx-M series BD46Exxxx-M series Absolute maximum ratings Parameter Power Supply Voltage Nch Open Drain Output Output Voltage CMOS Output Output Current ER pin Voltage Power Dissipation *1,*2 Operating Temperature Ambient Storage Temperature Symbol VDD-GND VOUT IO VCT Pd Topr Tstg Limits -0.3 to +10 GND-0.3 to +10 GND-0.3 to VDD+0.3 60 GND-0.3 to VDD+0.3 540 -40 to +105 -55 to +125 Unit V V mA V mW °C °C *1 Reduced by 5.4mW/°C when used over 25°C. *2 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board). ●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C) Parameter Symbol Condition VDD=HL, RL=470kΩ Ta=+25°C VDET=2.5V Ta=-40°C to 85°C Ta=85°C to 105°C Ta=+25°C VDET=3.0V Ta=-40°C to 85°C Ta=85°C to 105°C Detection Voltage VDET Ta=+25°C VDET=3.3V Ta=-40°C to 85°C Ta=85°C to 105°C Ta=+25°C VDET=4.2V Ta=-40°C to 85°C Ta=85°C to 105°C Ta=+25°C VDET=4.8V Ta=-40°C to 85°C Ta=85°C to 105°C Detection Voltage Temperature coefficient VDET/ ∆T -40°C to +105°C Hysteresis Voltage ∆VDET VDD＝LHL, RL=470kΩ ‘High’ Output Delay time tPLH CL=100pF, RL=100kΩ *1,*2,*3 Limit Min. Typ. Max. VDET(T) VDET(T) VDET(T) *1 ×0.99 ×1.01 2.475 2.5 2.525 2.418 2.584 2.404 2.597 2.970 3.0 3.030 2.901 3.100 2.885 3.117 3.267 3.3 3.333 3.191 3.410 3.173 3.428 4.158 4.2 4.242 4.061 4.341 4.039 4.364 4.752 4.8 4.848 4.641 4.961 4.616 4.987 - BD45EXX5, BD46EXX5 BD45EXX1, BD46EXX1 BD45EXX2, BD46EXX2 VDD=VDET-0.2V, VER=0V VDET=2.3V to 3.1V *1 VDD=VDET-0.2V, VER=0V VDET=2.3V to 3.1V Circuit Current when ON IDD1 VDD=VDET-0.2V, VER=0V VDET=3.2V to 4.2V *1 VDD=VDET-0.2V, VER=0V VDET=3.2V to 4.2V VDD=VDET-0.2V, VER=0V VDET=4.3V to 4.8V *1 VDD=VDET-0.2V, VER=0V VDET=4.3V to 4.8V VDD=VDET+0.2V, VER=0V VDET=2.3V to 3.1V *1 VDD=VDET+0.2V, VER=0V VDET=2.3V to 3.1V Circuit Current when OFF IDD2 VDD=VDET+0.2V, VER=0V VDET=3.2V to 4.2V *1 VDD=VDET+0.2V, VER=0V VDET=3.2V to 4.2V VDD=VDET+0.2V, VER=0V VDET=4.3V to 4.8V VDD=VDET+0.2V, VER=0V VDET=4.3V to 4.8V *1 ±100 VDET(T) VDET(T) ×0.03 ×0.05 45 50 90 100 180 200 0.70 0.70 0.75 0.75 0.80 0.80 0.75 0.75 0.80 0.80 0.85 0.85 ±360 VDET(T) ×0.08 55 110 220 2.10 2.85 2.25 3.00 2.40 3.15 2.25 4.28 2.40 4.50 2.55 4.73 Unit V ppm/°C V ms µA µA VDET(T):Standard Detection Voltage (2.3V to 4.8V, 0.1V step) RL :Pull-up resistor to be connected between VOUT and power supply. CL :Capacitor to be connected between VOUT and GND. *1 Guarantee is Ta=25°C. *2 tPLH:VDD=(VDET(T)-0.5V)(VDET(T)+0.5V) *3 tPLH:VDD=Please set up the rise up time between VDD=0VDET more than 100µs. Attention: Please connect ‘ER’ to the GND when not in use. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/14 TSZ02201-0R7R0G300110-1-2 27.Aug.2013 Rev.004 BD45Exxxx-M series BD46Exxxx-M series ●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C) – continued Parameter Symbol Operating Voltage Range VOPL ‘High’ Output Voltage (Pch) VOH ‘Low’Output Voltage (Nch) VOL Leak Current when OFF ER Pin ‘H’ Voltage ER Pin ‘L’ Voltage ER Pin Input Current Ileak VEH VEL IEL Condition Min. VOL≤0.4V, RL=470kΩ, Ta=25 to 105°C 0.95 1.20 VOL≤0.4V, RL=470kΩ, Ta=-40 to 25°C VDD-0.5 VDD=4.8V, ISOURCE= 1.0 mA, VDET(2.3V to 4.2V) VDD-0.5 VDD=6.0V, ISOURCE= 1.2 mA, VDET(4.3V to 4.8V) VDD=1.2V, ISINK = 0.45 mA VDD=2.4V, ISINK = 1.3 mA, VDET(2.7V to 4.8V) VDD=VDS=10V *1 2.0 *1 *1 - Limit Typ. 1 Max. 0.3 0.3 0.1 0.8 10 Unit V V V µA V V µA VDET(T):Standard Detection Voltage (2.3V to 4.8V, 0.1V step) RL :Pull-up resistor to be connected between VOUT and power supply. CL :Capacitor to be connected between VOUT and GND. *1 Guarantee is Ta=25°C. Attention: Please connect ‘ER’ to the GND when not in use. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/14 TSZ02201-0R7R0G300110-1-2 27.Aug.2013 Rev.004 BD45Exxxx-M series BD46Exxxx-M series ●Block Diagrams VDD Oscillation VOUT Circuit Counter Timer Vref GND ER Fig.1 BD45Exxxx-M Series VDD Oscillation Circuit Counter Timer Vref GND VOUT ER Fig.2 BD46Exxxx-M Series www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/14 TSZ02201-0R7R0G300110-1-2 27.Aug.2013 Rev.004 BD45Exxxx-M series BD46Exxxx-M series ●Typical Performance Curves "LOW" OUTPUT CURRENT ： IOL[mA] CIRCUIT CURRENT ： IDD [μA] 2.0 【BD45281G】 【BD45E281-M】 【BD46E281-M】 1.5 1.0 0.5 0.0 1 2 3 4 5 6 7 8 9 10 【BD45E281-M】 【BD45281G】 【BD46E281-M】 15 VDD =2.4V 10 5 VDD =1.2V 0 0.0 0.5 1.0 1.5 2.0 2.5 VDD SUPPLY VOLTAGE ：VDD [V] DRAIN-SOURCE VOLTAGE ： VDS[V] Fig.3 Circuit Current Fig.4 “Low” Output Current 7 20 【BD46281G】 【BD46E281-M】 15 VDD =6.0V 10 VDD =4.8V OUTPUT VOLTAGE： VOUT[V] "HIGH" OUTPUT CURRENT ： IOH [mA] 0 20 5 0 【BD45E281-M】 【BD45421G】 6 【BD46E281-M】 5 4 3 Ta=25℃ 2 1 Ta=25℃ 0 0 1 2 3 4 5 6 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 DRAIN-SOURCE VOLTAGE ： VDS[V] VDD SUPPLY VOLTAGE ：VDD [V] Fig.5 “High” Output Current Fig.6 I/O Characteristics www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/14 TSZ02201-0R7R0G300110-1-2 27.Aug.2013 Rev.004 BD45Exxxx-M series BD46Exxxx-M series ●Typical Performance Curves – continued 20 【BD45421G】 【BD45E421-M】 【BD45E281-M】 【BD46281G】 ER BIAS CURRENT ： IE R[μA] OUTPUT VOLTAGE： VOUT[V] 20 【BD46E281-M】 15 10 5 【BD46E421-M】 15 10 5 0 0 0 1 2 3 4 5 6 7 8 0 9 10 1 2 Fig.7 ER Terminal Threshold Voltage CIRCU IT C URR ENT WH EN ON ： IDD1 [μA ] DETECTION VOLT AGE： VDE T[V] 【BD45E421-M】 【BD46E421-M】 【BD45421G】 Low to high(VDET+ΔVDET) 4.6 4.2 3.8 High to low(VDET) 3.4 ～ 3.0 -40 0 40 80 6 7 8 9 10 1.6 1.4 【BD45421G】 【BD45E421-M】 1.2 【BD46E421-M】 1.0 0.8 0.6 0.4 0.2 0.0 -40 -20 0 20 40 60 80 100 TEMPERATURE ： Ta[℃] TEMPERATURE ： Ta[℃] Fig.10 Circuit Current when ON (VDET-0.2V) Fig.9 Detection Voltage Release Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5 Fig.8 ER Terminal Input Current 5.8 5.0 4 ER VOLTAGE ： VER [V] ER VOLTAGE ： VER[V] 5.4 3 8/14 TSZ02201-0R7R0G300110-1-2 27.Aug.2013 Rev.004 BD45Exxxx-M series BD46Exxxx-M series 3.0 2.8 2.6 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -40 -20 1.5 MINIMUM OPERATING VOLTAGE: VOPL[V] CIRCUIT CURRENT WHEN OFF ： I DD2 [μA] ●Typical Performance Curves – continued 【BD45E421-M】 【BD45421G】 【BD46E421-M】 【BD45E421-M】 【BD46E421-M】 1.0 0.5 0.0 0 20 40 60 80 -40 100 0 20 40 60 80 100 TEMPERATURE ： Ta[℃] TEMPERATURE ： Ta[℃] Fig.11 Circuit Current when OFF Fig.12 Operating Limit Voltage 50 250 【BD4528□G】 【BD45E282-M】 【BD46E282-M】 200 DELAY TIME：: ttPLH P HL[µs] "LOW"“LOW” DELAY TIME [μsec] “HIGH” DELAY TIME : tPLH ： tP[ms] LH[msec] "HIGH" DELAY TIME -20 BD45282G 150 【BD45E281-M】 【BD46E281-M】 BD45281G 100 50 BD45285G 【BD45E285-M】 【BD46E285-M】 BD45281G tPHL 】 【 【BD45E281-M】 40 【BD46E281-M】 30 20 10 0 0 -60 -40 -20 0 20 40 60 -60 -40 -20 80 100 120 0 20 40 60 80 100 120 TEMPERATURE ： Ta[℃] TEMPERATURE ： Ta[℃] Fig.13 Output Delay Time “Low””High” Fig.14 Output Delay Time “High””Low” www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/14 TSZ02201-0R7R0G300110-1-2 27.Aug.2013 Rev.004 BD45Exxxx-M series BD46Exxxx-M series ●Application Information Explanation of Operation For both the open drain type (Fig.15) and the CMOS output type (Fig.16), the detection and release voltages are used as threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BD45Exxxx-M series uses an open drain output type, it is necessary to connect a pull-up resistor to VDD or another power supply if needed [The output “High” voltage (VOUT) in this case becomes VDD or the voltage of the other power supply]. VDD VDD VDD R1 R1 Q2 Vref Vref Reset VOUT Oscillation R2 Oscillation Circuit Counter Timer R2 Reset Circuit Counter Timer Q1 VOUT Q1 R3 R3 GND GND ER ER Fig.15 (BD45Exxxx-M Type Internal Block Diagram) Fig.16 (BD46Exxxx-M Type Internal Block Diagram) Reference Data Examples of Leading (tPLH) and Falling (tPHL) Output Part Number BD45E275G-M BD46E275G-M tPLH[ms] 50 50 VDD=2.2V3.2V tPHL[µs] 18 18 VDD=3.2V2.2V *This data is for reference only. The figures will vary with the application, so please confirm actual operating conditions before use. Timing Waveform Example: The following shows the relationship between the input voltages VDD, the output voltage VOUT and ER terminal when the input power supply voltage VDD is made to sweep up and sweep down (the circuits are those in Fig. 15 and 16). 1 When the power supply is turned on, the output is unstable from after over the operating limit voltage (VOPL) until tPHL. Therefore it is possible that the reset signal is not outputted when VDD ⑦ the rise time of VDD is faster than tPHL. VOPL 2 0V When VDD is greater than VOPL but less than the reset release voltage (VDET + ∆VDET), the output voltages will switch to Low. VOH 3 If VDD exceeds the reset release voltage (VDET + ∆VDET), the tPLH tPLH tPLH VOUT counter timer start and VOUT switches from L to H. tPHL VOL 4 When more than the high level voltage is supplied ER terminal, tPHL VOUT comes to “L” after tPLH delay time. Therefore, a time when ER VEH terminal is “H” is necessary for 100µsec or more. ER 5 tPHL When the ER terminal switches to Low, the counter timer starts to operate, a delay of tPLH occurs, and VOUT switches from “L” to “H”. ① ② ③ ④⑤ ⑥ 6 If VDD drops below the detection voltage (VDET) when the power supply is powered down or when there is a power supply Fig.17 Timing Waveform fluctuation, VOUT switches to L (with a delay of tPHL). 7 The potential difference between the detection voltage and the release voltage is known as the hysteresis width (∆VDET). The system is designed such that the output does not toggle with power supply fluctuations within this hysteresis width, thus, preventing malfunctions due to noise. Timing may change depending on application and use. Please verify and confirm using practical applications. VDD VDET+ΔVDET VDET www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/14 TSZ02201-0R7R0G300110-1-2 27.Aug.2013 Rev.004 BD45Exxxx-M series BD46Exxxx-M series ●Circuit Applications 1) Examples of a common power supply detection reset circuit. VDD1 Application examples of BD45Exxxx-M series (Open Drain output type) and BD46Exxxx-M series (CMOS output type) are shown below. VDD2 RL BD45Exxxx-M RST Micro controller CASE1: Power supply of microcontroller (VDD2) differs from the power supply of the reset detection (VDD1). Use an open drain output Type (BD45xx series) device with a load resistance RL as shown Fig.18. CL （Noise-filtering Capacitor） GND CASE2: Power supply of the microcontroller (VDD1) is same as the power supply of the reset detection (VDD1). Use a CMOS output type (BD46Exxxx-M) device or an open drain output type (BD45Exxxx-M) with a pull up resistor between the output and VDD1. Fig.18 Open Drain Output Type VDD1 BD46Exxxx-M RST Micro controller When a capacitance CL for noise filtering is connected to the VOUT pin (the reset signal input terminal of the microcontroller), please take into account the waveform of the rise and fall of the output voltage (VOUT). CL （Noise-filtering Capacitor） GND Fig.19 CMOS Output Type 2) The following is an example of a circuit application in which an OR connection between two types of detection voltage resets the microcontroller. VDD1 VDD2 VDD3 RL BD45Exxxx-M BD45Exxxx-M RST Micro controller GND Fig. 20 To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain output type (BD45Exxxx-M series) to the microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller (VDD3) as shown in Fig. 20. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is possible. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/14 TSZ02201-0R7R0G300110-1-2 27.Aug.2013 Rev.004 BD45Exxxx-M series BD46Exxxx-M series 3) Examples of the power supply with resistor dividers. In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow into the circuit when the output level switches from “High” to “Low” or vice versa. In-rush current is a sudden surge of current that flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow may cause malfunction in the systems operation such as output oscillations, etc. V1 R2 I1 VDD BD45Exxxx-M BD46Exxxx-M R1 CIN VOUT CL GND Fig. 21 When an in-rush current (I1) flows into the circuit (Refer to Fig. 21) at the time when output switches from “Low” to “High”, a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the VDD voltage drops below the detection voltage, the output will switch from “High” to “Low”. While the output voltage is at “Low” condition, in-rush current will stop flowing and the voltage drop will be reduced. As a result, the output voltage will switches again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will result to oscillation. IDD In-rush Current 0 VDD VDET Fig. 22 Current Consumption vs. Power Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/14 TSZ02201-0R7R0G300110-1-2 27.Aug.2013 Rev.004 BD45Exxxx-M series BD46Exxxx-M series ●Operational Notes 1) Absolute maximum ratings Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. 2) Ground Voltage The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 3) Recommended operating conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 4) Bypass Capacitor for Noise Rejection To help reject noise, put a 1uF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND. Be careful when using extremely big capacitor as transient response will be affected. 5) Short between pins and mounting errors Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins. 6) Operation under strong electromagnetic field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 7) The VDD line impedance might cause oscillation because of the detection current. 8) A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition. 9) Lower than the mininum input voltage puts condition. the VOUT in high impedance state, and it must be VDD in pull up (VDD) 10) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause unexpected operations. Application values in these conditions should be selected carefully. If the leakage of about 1MΩ is assumed between the ER terminal and the GND terminal, 100kΩ connection between the ER terminal and the VDD terminal would be recommended. If the leakage is assumed between the V OUT terminal and the GND terminal, the pull-up resistor should be less than 1/10 of the assumed leak resistance. 11) External parameters The recommended parameter range for RL is 50kΩ to 1MΩ. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using practical applications. 12) Power on reset operation Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual operation. 13) Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 14) Rush current When the power supply, is turned on because of in certain cases, momentary Rash-current flow into the IC at the logic unsettled, the couple capacitance, GND pattern of width and leading line must be considered. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/14 TSZ02201-0R7R0G300110-1-2 27.Aug.2013 Rev.004 BD45Exxxx-M series BD46Exxxx-M series ●Revision History Date Revision Changes 20.Nov.2012 001 18.Dec.2012 002 23.May.2013 27.Aug.2013 003 004 New Release Change the value of “Counter Timer Delay” from 5ms to 50ms in Table1 and Table2. Change unit of Operating Limit Voltage graph from uA to V in Typical Performance Curve. Change limits for VDET at VDET=2.5V,3.0V,3.3V,4.2V,4.8V Update the applications and features on page 1 and ordering information on page 2 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/14 TSZ02201-0R7R0G300110-1-2 27.Aug.2013 Rev.004 Datasheet Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - SS © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - SS © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BD46E231G-M - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BD46E231G-M SSOP5 3000 3000 Taping inquiry Yes