DIODES 1N4448HLP-7B

1N4448HLP
SURFACE MOUNT FAST SWITCHING DIODE
Features
Mechanical Data
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Fast Switching Speed
Ultra-Small Surface Mount Package
Low Reverse Leakage Current
Ideal for Battery Powered Portable Applications
Lead Free by Design/RoHS Compliant (Note 1)
Halogen and Antimony Free "Green" Device (Notes 2 & 3)
Qualified to AEC-Q101 Standards for High Reliability
Case: X1-DFN1006-2
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Marking Information
Terminals: Finish - NiPdAu over Copper leadframe. Solderable
per MIL-STD-202, Method 208
Weight: 0.001 grams (approximate)
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X1-DFN1006-2
Bottom View
Ordering Information (Note 4)
Part Number
1N4448HLP-7
1N4448HLP-7B
Notes:
Case
X1-DFN1006-2
X1-DFN1006-2
Packaging
3,000/Tape & Reel
10,000/Tape & Reel
1. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. No purposely added lead.
2. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com.
4. For packaging details, go to our website at http://www.diodes.com.
Marking Information
1N4448HLP-7
1N4448HLP-7B
T8
T8
Top View
Dot Denotes
Cathode Side
Top View
Bar Denotes
Cathode Side
1N4448HLP
Document number: DS30590 Rev. 12 - 2
T8 = Product Type Marking Code
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1N4448HLP
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Non-Repetitive Peak Reverse Voltage
Symbol
VRM
VRRM
VRWM
VR
VR(RMS)
IFM
IO
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current
Average Rectified Output Current
Non-Repetitive Peak Forward Surge Current
Value
100
Unit
V
80
V
V
mA
mA
IFSM
57
300
95
2.0
1.0
Symbol
PD
RθJA
TJ , TSTG
Value
250
500
-65 to +150
Unit
mW
°C/W
°C
@ t = 1.0μs
@ t = 1.0s
A
Thermal Characteristics
Characteristic
Power Dissipation (Note 5)
Thermal Resistance Junction to Ambient (Note 5)
Operating and Storage Temperature Range
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 6)
Forward Voltage
Symbol
V(BR)R
VF
Min
80
0.62
⎯
⎯
⎯
Max
⎯
Unit
V
0.72
0.855
1.0
1.25
V
nA
μA
μA
nA
Peak Reverse Current (Note 6)
IR
⎯
100
50
30
25
Total Capacitance
CT
⎯
3.0
pF
Reverse Recovery Time
trr
⎯
4.0
ns
Notes:
Test Conditions
IR = 100μA
IF = 5.0mA
IF = 10mA
IF = 100mA
IF = 150mA
VR = 80V
VR = 75V, TJ = 150°C
VR = 25V, TJ = 150°C
VR = 20V
VR = 0.5V, f = 1.0MHz
IF = IR = 10mA,
Irr = 0.1 x IR, RL = 100Ω
5. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
1N4448HLP
Document number: DS30590 Rev. 12 - 2
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IF, INSTANTANEOUS FORWARD CURRENT (mA)
1N4448HLP
300
PD, POWER DISSIPATION (mW)
250
200
150
100
50
0
25
50
75
100
125
TA, AMBIENT TEMPERATURE (°C)
Fig. 1 Power Derating Curve
100,000
T A = 150°C
10,000
TA = 125°C
T A = 100°C
1,000
T A = 85°C
100
TA = 50°C
10
T A = 25°C
T A = 0°C
1
TA = -55°C
0.1
0.01
0
0
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics
150
IR, INSTANTANEOUS REVERSE CURRENT (nA)
IR, INSTANTANEOUS REVERSE CURRENT (nA)
0
100,000
10,000
TA = 125°C
1,000
TA = 100°C
TA = 85°C
100
TA = 50°C
10
T A = 25°C
1
T A = 0°C
0.1
0.01
10 20 30 40 50 60 70 80 90 100
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
Fig. 3 Typical Reverse Characteristics
0.5
TA = -55°C
0
1
2
3
4
5
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
Fig. 4 Typical Reverse Characteristics - Low Bias
2.5
trr, REVERSE RECOVERY TIME (nS)
CT, TOTAL CAPACITANCE (pF)
TA = 150°C
0.4
0.3
0.2
0.1
f = 1MHz
0
2.0
1.5
1.0
0.5
0
1
10
100
VR, DC REVERSE VOLTAGE (V)
Fig. 5 Typical Total Capacitance vs. Reverse Voltage
1N4448HLP
Document number: DS30590 Rev. 12 - 2
2
4
6
8
10
IF, FORWARD CURRENT (mA)
Fig. 6 Typical Reverse Recovery Time vs. Forward Current
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1N4448HLP
Package Outline Dimensions
A
X1-DFN1006-2
Dim
Min
Max
Typ
A
0.47
0.53
0.50
A1
0
0.05
0.03
b
0.45
0.55
0.50
D
0.95
1.075
1.00
E
0.55
0.675
0.60
e
0.40
L
0.20
0.30
0.25
R
0.05
0.15
0.10
All Dimensions in mm
A1
D
R
E
b
L
e
Suggested Pad Layout
C
Dimensions
Z
G
X
Y
C
X
Y
Value (in mm)
1.1
0.3
0.7
0.4
0.7
G
Z
1N4448HLP
Document number: DS30590 Rev. 12 - 2
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1N4448HLP
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
www.diodes.com
1N4448HLP
Document number: DS30590 Rev. 12 - 2
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March 2012
© Diodes Incorporated