D a t a s h e et , R e v . 1 . 0 , F e b . 2 00 4 HYB25D256161CE-5 HYB25D256161CE-4 1 6 M x 1 6 D o u b l e D a t a R a t e G r a p h ic s D R A M D D R SG R A M Green Product M e m or y P r o du c t s N e v e r s t o p t h i n k i n g . Edition 2004-02 Published by Infineon Technologies AG, St.-Martin-Strasse 53, 81669 München, Germany © Infineon Technologies AG 2004. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. D a t a s h e et , R e v . 1 . 0 , F e b . 2 00 4 HYB25D256161CE-5 HYB25D256161CE-4 1 6 M x 1 6 D o u b l e D a t a R a t e G r a p h ic s D R A M D D R SG R A M Green Product M e m or y P r o du c t s N e v e r s t o p t h i n k i n g . HYB25D256161CE-5 HYB25D256161CE-4 Revision History: Rev.1.0 Previous Version: V0.92 Page Subjects (major changes since last revision) all Editorial changes 2004-02 2003-12-22 We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: [email protected] Template: mp_a4_v2.0_2003-06-06.fm HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Table of Contents 1 1.1 1.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3 3.1 3.2 3.2.1 3.2.2 3.2.3 3.2.4 3.3 3.3.1 3.3.2 3.4 3.5 3.5.1 3.5.2 3.5.3 3.5.4 3.5.5 3.6 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Mode Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Burst Length . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Burst Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Read Latency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Extended Mode Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DLL Enable/Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output Drive Strength . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bank/Row Activation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Writes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power-Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Simplified State Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 13 14 14 15 15 16 17 17 17 18 21 21 22 27 41 42 47 4 4.1 4.2 4.3 4.4 4.4.1 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Normal Strength Pull-down and Pull-up Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Weak Strength Pull-down and Pull-up Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDD Current Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 48 50 52 54 58 5 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 6 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 Datasheet 5 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM List of Tables Table 1 Table 2 Table 3 Table 4 Table 5 Table 6 Table 7 Table 8 Table 9 Table 10 Table 11 Table 12 Table 13 Table 14 Table 15 Table 16 Table 17 Table 18 Table 19 Table 20 Datasheet Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Input/Output Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Burst Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Truth Table 1a: Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Truth Table 1b: DM Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Truth Table 2: Clock Enable (CKE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Truth Table 3: Current State Bank n - Command to Bank n (same bank) . . . . . . . . . . . . . . . . . . . 43 Truth Table 4: Current State Bank n - Command to Bank m (different bank). . . . . . . . . . . . . . . . . 45 Truth Table 5: Concurrent Auto Precharge. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Input and Output Capacitances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Electrical Characteristics and DC Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 Normal Strength Pull-down and Pull-up Currents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Evaluation Conditions for I/O Driver Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Weak Strength Driver Pull-down and Pull-up Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 AC Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Electrical Characteristics and AC Timing - Absolute Specifications –4/–5 . . . . . . . . . . . . . . . . . . 55 IDD Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 IDD Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 6 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM List of Figures Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Figure 9 Figure 10 Figure 11 Figure 12 Figure 13 Figure 14 Figure 15 Figure 16 Figure 17 Figure 18 Figure 19 Figure 20 Figure 21 Figure 22 Figure 23 Figure 24 Figure 25 Figure 26 Figure 27 Figure 28 Figure 29 Figure 30 Figure 31 Figure 32 Figure 33 Figure 34 Figure 35 Figure 36 Figure 37 Figure 38 Figure 39 Figure 40 Figure 41 Figure 42 Figure 43 Figure 44 Figure 45 Figure 46 Figure 47 Datasheet Pin Configuration P-TSOPII-66-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Block Diagram (16 Mbit × 16) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Required CAS Latency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Activating a Specific Row in a Specific Bank . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . tRCD and tRRD Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Read Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Consecutive Read Bursts (Burst Length = 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Non-Consecutive Read Bursts (Burst Length = 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Random Read Accesses (Burst Length = 2, 4 or 8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Terminating a Read Burst (Burst Length = 8). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Read to Write (Burst Length = 4 or 8). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Read to Precharge (Burst Length = 4 or 8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Write Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Write Burst (Burst Length = 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Write to Write (Burst Length = 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Write to Write: Max. DQSS, Non-Consecutive (Burst Length = 4) . . . . . . . . . . . . . . . . . . . . . . . . . Random Write Cycles (Burst Length = 2, 4 or 8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Write to Read: Non-Interrupting (CAS Latency = 3; Burst Length = 4). . . . . . . . . . . . . . . . . . . . . . Write to Read: Interrupting (CAS Latency = 3; Burst Length = 8). . . . . . . . . . . . . . . . . . . . . . . . . . Write to Read: Min. DQSS, Odd Number of Data (3-bit Write), Interrupting (CL3; BL8) . . . . . . . . Write to Read: Nominal DQSS, Interrupting (CAS Latency = 3; Burst Length = 8) . . . . . . . . . . . . Write to Precharge: Non-Interrupting (Burst Length = 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Write to Precharge: Interrupting (Burst Length = 4 or 8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Write to Precharge: Minimum DQSS, Odd Number of Data (1-bit Write), Interrupting (BL 4 or 8). Write to Precharge: Nominal DQSS (2-bit Write), Interrupting (Burst Length = 4 or 8) . . . . . . . . . Precharge Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Simplified State Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Normal Strength Pull-down Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Normal Strength Pull-up Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Weak Strength Pull-down Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Weak Strength Pull-up Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AC Output Load Circuit Diagram / Timing Reference Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Data Input (Write), Timing Burst Length = 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Data Output (Read), Timing Burst Length = 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Initialize and Mode Register Sets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Auto Refresh Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Self Refresh Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Read without Auto Precharge (Burst Length = 4). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Read with Auto Precharge (Burst Length = 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bank Read Access (Burst Length = 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Write without Auto Precharge (Burst Length = 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Write with Auto Precharge (Burst Length = 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bank Write Access (Burst Length = 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Write DM Operation (Burst Length = 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P-TSOPII-66-1 (Plastic Thin Small Outline Package Type II). . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 12 16 21 21 22 23 23 24 25 26 26 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 47 50 50 52 52 54 59 59 60 61 62 63 64 65 66 67 68 69 70 71 Rev.1.0, 2004-02 16M x 16 Double Data Rate Graphics DRAM DDR SGRAM 1 Overview 1.1 Features • • • • • • • • • • • • • • • • • • HYB25D256161CE-5 HYB25D256161CE-4 Double data rate architecture: two data transfers per clock cycle Bidirectional data strobe (DQS) is transmitted and received with data, to be used in capturing data at the receiver DQS is edge-aligned with data for reads and is center-aligned with data for writes Differential clock inputs (CK and CK) Four internal banks for concurrent operation Data mask (DM) for write data DLL aligns DQ and DQS transitions with CK transitions Commands entered on each positive CK edge; data and data mask referenced to both edges of DQS Burst Lengths: 2, 4, or 8 CAS Latency: 3 Auto Precharge option for each burst access Auto Refresh and Self Refresh Modes 7.8 µs Maximum Average Periodic Refresh Interval 2.5 V (SSTL_2 compatible) I/O VDDQ = 2.6 V ± 0.1 V VDD = 2.6 V ± 0.1 V P-TSOPII-66-1 package Lead- and halogene-free = green product Table 1 Performance Part Number Speed Code max. Clock Frequency 1.2 @CL3 fCK3 –4 –5 Unit 250 200 MHz Description The 16M x 16 Double Data Rate Graphics DRAM is a high-speed CMOS, dynamic random-access memory containing 268,435,456 bits. It is internally configured as a quad-bank DRAM. The 16M x 16 Double Data Rate Graphics DRAM uses a double-data-rate architecture to achieve high-speed operation. The double data rate architecture is essentially a 2n prefetch architecture with an interface designed to transfer two data words per clock cycle at the I/O pins. A single read or write access for the 16M x 16 Double Data Rate Graphics DRAM effectively consists of a single 2n-bit wide, one clock cycle data transfer at the internal DRAM core and two corresponding n-bit wide, one-half-clock-cycle data transfers at the I/O pins. A bidirectional data strobe (DQS) is transmitted externally, along with data, for use in data capture at the receiver. DQS is a strobe transmitted by the DDR SGRAM during Reads and by the memory controller during Writes. DQS is edge-aligned with data for Reads and center-aligned with data for Writes. The 16M x 16 Double Data Rate Graphics DRAM operates from a differential clock (CK and CK; the crossing of CK going HIGH and CK going LOW is referred to as the positive edge of CK). Commands (address and control signals) are registered at every positive edge of CK. Input data is registered on both edges of DQS, and output data is referenced to both edges of DQS, as well as to both edges of CK. Datasheet 8 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Overview Read and write accesses to the DDR SGRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an Active command, which is then followed by a Read or Write command. The address bits registered coincident with the Active command are used to select the bank and row to be accessed. The address bits registered coincident with the Read or Write command are used to select the bank and the starting column location for the burst access. The DDR SGRAM provides for programmable Read or Write burst lengths of 2, 4 or 8 locations. An Auto Precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst access. As with standard SDRAMs, the pipelined, multibank architecture of DDR SGRAMs allows for concurrent operation, thereby providing high effective bandwidth by hiding row precharge and activation time. An auto refresh mode is provided along with a power-saving power-down mode. All inputs are compatible with the JEDEC Standard for SSTL_2. All outputs are SSTL_2, Class II compatible. Note: The functionality described and the timing specifications included in this data sheet are for the DLL Enabled mode of operation. Table 2 Ordering Information Part Number1) Organisation Clock (MHz) Package HYB25D256161CE–4 ×16 250 P-TSOPII-66-1 HYB25D256161CE–5 200 1) HYB: designator for memory components 25D: DDR SGRAMs at VDDQ = 2.5 V / 2.6 V 256: 256-Mbit density C: Die revision C Datasheet 9 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Pin Configuration 2 Pin Configuration VDD 1 66 VSS DQ0 VDDQ DQ1 2 3 4 65 64 63 DQ15 VSSQ DQ14 DQ2 5 62 DQ13 VSSQ DQ3 DQ4 VDDQ DQ5 6 7 8 9 10 61 60 59 58 57 VDDQ DQ12 DQ11 VSSQ DQ10 DQ6 11 56 DQ9 VSSQ 12 55 VDDQ DQ7 NC 13 14 15 16 17 18 19 20 54 53 52 51 DQ8 NC VSSQ UDQS NC VREF VSS RAS 21 22 23 46 45 44 CK CK CKE CS NC 24 25 43 42 NC A12 BA0 BA1 A10/AP 26 27 28 29 41 40 39 38 A11 A9 A8 A7 30 31 37 36 A6 A5 32 33 35 34 A4 VSS VDDQ LDQS NC VDD NC LDM WE CAS A0 A1 A2 A3 VDD 50 49 48 47 UDM 16Mb x 16 Figure 1 Datasheet Pin Configuration P-TSOPII-66-1 10 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Pin Configuration Table 3 Input/Output Functional Description Symbol Type Function CK, CK Input Clock: CK and CK are differential clock inputs. All address and control input signals are sampled on the crossing of the positive edge of CK and negative edge of CK. Output (read) data is referenced to the crossings of CK and CK (both directions of crossing). CKE Input Clock Enable: CKE HIGH activates, and CKE Low deactivates, internal clock signals and device input buffers and output drivers. Taking CKE Low provides Precharge Power-Down and Self Refresh operation (all banks idle), or Active Power-Down (row Active in any bank). CKE is synchronous for power down entry and exit, and for self refresh entry. CKE is asynchronous for self refresh exit. CKE must be maintained high throughout read and write accesses. Input buffers, excluding CK, CK and CKE are disabled during power-down. Input buffers, excluding CKE, are disabled during self refresh. CS Input Chip Select: All commands are masked when CS is registered HIGH. CS provides for external bank selection on systems with multiple banks. CS is considered part of the command code. The standard pinout includes one CS pin. RAS, CAS, WE Input Command Inputs: RAS, CAS and WE (along with CS) define the command being entered. DM Input Input Data Mask: DM is an input mask signal for write data. Input data is masked when DM is sampled HIGH coincident with that input data during a Write access. DM is sampled on both edges of DQS. Although DM pins are input only, the DM loading matches the DQ and DQS loading. BA0, BA1 Input Bank Address Inputs: BA0 and BA1 define to which bank an Active, Read, Write or Precharge command is being applied. BA0 and BA1 also determines if the mode register or extended mode register is to be accessed during a MRS or EMRS cycle. A0 - A12 Input Address Inputs: Provide the row address for Active commands, and the column address and Auto Precharge bit for Read/Write commands, to select one location out of the memory array in the respective bank. A10 is sampled during a Precharge command to determine whether the Precharge applies to one bank (A10 LOW) or all banks (A10 HIGH). If only one bank is to be precharged, the bank is selected by BA0, BA1. The address inputs also provide the op-code during a Mode Register Set command. DQ Input/Output Data Input/Output: Data bus. DQS Input/Output Data Strobe: Output with read data, input with write data. Edge-aligned with read data, centered in write data. Used to capture data. NC – No Connect: No internal electrical connection is present. VDDQ VSSQ VDD VSS VREF Supply DQ Power Supply: 2.6 V ± 0.1 V. Supply DQ Ground Supply Power Supply: 2.6 V ± 0.1 V. Supply Ground Supply SSTL_2 Reference Voltage: VDDQ/2 Datasheet 11 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM 2 Bank0 Memory Array (8192 x 512x 32) 32 2 16 16 16384 Sense Amplifiers COL0 I/O Gating DM Mask Logic 32 32 512 (x32) Column Decoder Column-Address Counter/Latch 1 Figure 2 CK, CK COL0 16 1 DQS Generator Input Register Write Mask 1 FIFO 1 & 2 Drivers 16 32 16 clk clk out in Data 8 9 Drivers Data DQS 1 1 16 16 DQ0-DQ15, DM LDQS, UDQS 1 Receivers 8192 Bank Control Logic Refresh Counter 15 Address Register A0-A12, BA0, BA1 CK, CK DLL 13 13 Bank3 MUX 15 13 Bank2 Read Latch Mode Registers Bank0 Row-Address Latch & Decoder Bank1 Row-Address MUX Command Decode CKE CK CK CS WE CAS RAS Control Logic Pin Configuration 16 COL0 2 Block Diagram (16 Mbit × 16) Notes 1. This Functional Block Diagram is intended to facilitate user understanding of the operation of the device; it does not represent an actual circuit implementation. 2. UDM and LDM are unidirectional signals (input only), but is internally loaded to match the load of the bidirectional DQ, UDQS and LDQS signals. Datasheet 12 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description 3 Functional Description The 16M x 16 Double Data Rate Graphics DRAM is a high-speed CMOS, dynamic random-access memory containing 268,435,456 bits. The 16M x 16 Double Data Rate Graphics DRAM is internally configured as a quadbank DRAM. The 16M x 16 Double Data Rate Graphics DRAM uses a double-data-rate architecture to achieve high-speed operation. The double-data-rate architecture is essentially a 2n prefetch architecture, with an interface designed to transfer two data words per clock cycle at the I/O pins. A single read or write access for the 16M x 16 Double Data Rate Graphics DRAM consists of a single 2n-bit wide, one clock cycle data transfer at the internal DRAM core and two corresponding n-bit wide, one-half clock cycle data transfers at the I/O pins. Read and write accesses to the DDR SGRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an Active command, which is then followed by a Read or Write command. The address bits registered coincident with the Active command are used to select the bank and row to be accessed (BA0, BA1 select the bank; A0-A12 select the row). The address bits registered coincident with the Read or Write command are used to select the starting column location for the burst access. Prior to normal operation, the DDR SGRAM must be initialized. The following sections provide detailed information covering device initialization, register definition, command descriptions and device operation. 3.1 Initialization DDR SGRAMs must be powered up and initialized in a predefined manner. Operational procedures other than those specified may result in undefined operation. The following criteria must be met: No power sequencing is specified during power up or power down given the following criteria: • • • VDD and VDDQ are driven from a single power converter output VTT meets the specification A minimum resistance of 42 Ω limits the input current from the VTT supply into any pin and VREF tracks VDDQ/2 or the following relationship must be followed: • • • VDDQ is driven after or with VDD such that VDDQ < VDD + 0.3 V VTT is driven after or with VDDQ such that VTT < VDDQ + 0.3 V VREF is driven after or with VDDQ such that VREF < VDDQ + 0.3 V The DQ and DQS outputs are in the High-Z state, where they remain until driven in normal operation (by a read access). After all power supply and reference voltages are stable, and the clock is stable, the DDR SGRAM requires a 200 µs delay prior to applying an executable command. Once the 200 µs delay has been satisfied, a Deselect or NOP command should be applied, and CKE should be brought HIGH. Following the NOP command, a Precharge ALL command should be applied. Next a Mode Register Set command should be issued for the Extended Mode Register, to enable the DLL, then a Mode Register Set command should be issued for the Mode Register, to reset the DLL, and to program the operating parameters. 200 clock cycles are required between the DLL reset and any executable command. During the 200 cycles of clock for DLL locking, a Deselect or NOP command must be applied. After the 200 clock cycles, a Precharge ALL command should be applied, placing the device in the “all banks idle” state. Once in the idle state, two AUTO REFRESH cycles must be performed. Additionally, a Mode Register Set command for the Mode Register, with the reset DLL bit deactivated (i.e. to program operating parameters without resetting the DLL) must be performed. Following these cycles, the DDR SGRAM is ready for normal operation. Datasheet 13 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description 3.2 Mode Register Definition The Mode Register is used to define the specific mode of operation of the DDR SGRAM. This definition includes the selection of a burst length, a burst type, a CAS latency, and an operating mode. The Mode Register is programmed via the Mode Register Set command (with BA0 = 0 and BA1 = 0) and retains the stored information until it is programmed again or the device loses power (except for bit A8, which is self-clearing). Mode Register bits A0-A2 specify the burst length, A3 specifies the type of burst (sequential or interleaved), A4A6 specify the CAS latency, and A7-A12 specify the operating mode. The Mode Register must be loaded when all banks are idle, and the controller must wait the specified time before initiating the subsequent operation. Violating either of these requirements results in unspecified operation. MR Mode Register Definition BA1 BA0 0 0 A12 A11 (BA[1:0] = 00B) A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 MODE CL BT BL w w w w reg. addr A0 Field Bits Type Description BL [2:0] w Burst Length Number of sequential bits per DQ related to one read/write command; see Chapter 3.2.1. Note: All other bit combinations are RESERVED. 001 2 010 4 011 8 BT 3 w Burst Type See Table 4 for internal address sequence of low order address bits; see Chapter 3.2.2. 0 Sequential 1 Interleaved CL [6:4] w CAS Latency Number of full clocks from read command to first data valid window; see Chapter 3.2.3. Note: All other bit combinations are RESERVED. 011 3 MODE [12:7] w Operating Mode See Chapter 3.2.4. Note: All other bit combinations are RESERVED. 000000 000010 3.2.1 Normal Operation without DLL Reset Normal Operation with DLL Reset Burst Length Read and write accesses to the DDR SGRAM are burst oriented, with the burst length being programmable. The burst length determines the maximum number of column locations that can be accessed for a given Read or Write command. Burst lengths of 2, 4, or 8 locations are available for both the sequential and the interleaved burst types. Reserved states should not be used, as unknown operation or incompatibility with future versions may result. When a Read or Write command is issued, a block of columns equal to the burst length is effectively selected. All accesses for that burst take place within this block, meaning that the burst wraps within the block if a boundary is reached. The block is uniquely selected by A1-Ai when the burst length is set to two, by A2-Ai when the burst length is set to four and by A3-Ai when the burst length is set to eight (where Ai is the most significant column address bit Datasheet 14 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description for a given configuration). The remaining (least significant) address bit(s) is (are) used to select the starting location within the block. The programmed burst length applies to both Read and Write bursts. 3.2.2 Burst Type Accesses within a given burst may be programmed to be either sequential or interleaved; this is referred to as the burst type and is selected via bit A3. The ordering of accesses within a burst is determined by the burst length, the burst type and the starting column address, as shown in Table 4. Table 4 Burst Length Burst Definition Starting Column Address A2 A1 A0 Type = Sequential Type = Interleaved 0 0-1 0-1 1 1-0 1-0 0 0 0-1-2-3 0-1-2-3 0 1 1-2-3-0 1-0-3-2 1 0 2-3-0-1 2-3-0-1 1 1 3-0-1-2 3-2-1-0 0 0 0 0-1-2-3-4-5-6-7 0-1-2-3-4-5-6-7 0 0 1 1-2-3-4-5-6-7-0 1-0-3-2-5-4-7-6 0 1 0 2-3-4-5-6-7-0-1 2-3-0-1-6-7-4-5 0 1 1 3-4-5-6-7-0-1-2 3-2-1-0-7-6-5-4 1 0 0 4-5-6-7-0-1-2-3 4-5-6-7-0-1-2-3 1 0 1 5-6-7-0-1-2-3-4 5-4-7-6-1-0-3-2 1 1 0 6-7-0-1-2-3-4-5 6-7-4-5-2-3-0-1 1 1 1 7-0-1-2-3-4-5-6 7-6-5-4-3-2-1-0 2 4 8 Order of Accesses Within a Burst Notes 1. For a burst length of two, A1-Ai selects the two-data-element block; A0 selects the first access within the block. 2. For a burst length of four, A2-Ai selects the four-data-element block; A0-A1 selects the first access within the block. 3. For a burst length of eight, A3-Ai selects the eight-data- element block; A0-A2 selects the first access within the block. 4. Whenever a boundary of the block is reached within a given sequence above, the following access wraps within the block. 3.2.3 Read Latency The Read latency, or CAS latency, is the delay, in clock cycles, between the registration of a Read command and the availability of the first burst of output data. The latency can be programmed 2, 2.5 and 3 clocks. CAS latency of 1.5 is supported for DDR200 components only. If a Read command is registered at clock edge n, and the latency is m clocks, the data is available nominally coincident with clock edge n + m (see Figure 3) Reserved states should not be used as unknown operation or incompatibility with future versions may result. Datasheet 15 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description 3.2.4 Operating Mode The normal operating mode is selected by issuing a Mode Register Set Command with bits A7-A12 set to zero, and bits A0-A6 set to the desired values. A DLL reset is initiated by issuing a Mode Register Set command with bits A7 and A9-A12 each set to zero, bit A8 set to one, and bits A0-A6 set to the desired values. A Mode Register Set command issued to reset the DLL should always be followed by a Mode Register Set command to select normal operating mode. All other combinations of values for A7-A12 are reserved for future use and/or test modes. Test modes and reserved states should not be used as unknown operation or incompatibility with future versions may result. CAS Latency = 3, BL = 4 CK CK Command Read NOP NOP NOP NOP NOP CL=3 DQS DQ Don’t Care Shown with nominal tAC, tDQSCK, and tDQSQ. Figure 3 Datasheet Required CAS Latency 16 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description 3.3 Extended Mode Register The Extended Mode Register controls functions beyond those controlled by the Mode Register; these additional functions include DLL enable/disable, and output drive strength selection (optional). These functions are controlled via the bits shown in the Extended Mode Register Definition. The Extended Mode Register is programmed via the Mode Register Set command (with BA0 = 1 and BA1 = 0) and retains the stored information until it is programmed again or the device loses power. The Extended Mode Register must be loaded when all banks are idle, and the controller must wait the specified time before initiating any subsequent operation. Violating either of these requirements result in unspecified operation. 3.3.1 DLL Enable/Disable The DLL must be enabled for normal operation. DLL enable is required during power up initialization, and upon returning to normal operation after having disabled the DLL for the purpose of debug or evaluation. The DLL is automatically disabled when entering self refresh operation and is automatically re-enabled upon exit of self refresh operation. Any time the DLL is enabled, 200 clock cycles must occur before a Read command can be issued. This is the reason 200 clock cycles must occur before issuing a Read or Write command upon exit of self refresh operation. 3.3.2 Output Drive Strength The normal drive strength for all outputs is specified to be SSTL_2, Class II. In addition this design version supports a weak driver mode for lighter load and/or point-to-point environments which can be activated during mode register set. I-V curves for the normal and weak drive strength are included in this document. EMR Extended Mode Register Definition BA1 BA0 0 1 A12 A11 A10 (BA[1:0] = 01B) A9 A8 A7 A1 A0 MODE DS DLL w w w reg. addr A6 A5 A4 Field Bits Type Description DLL 0 w DLL Status See Chapter 3.3.1. 0 Enabled 1 Disabled DS 1 w Drive Strength See Chapter 3.3.2, Chapter 4.2 and Chapter 4.3. 0 Normal 1 Weak MODE [12:2] w Operating Mode A3 A2 Note: All other bit combinations are RESERVED. 0 Datasheet Normal Operation 17 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description 3.4 Commands Deselect The Deselect function prevents new commands from being executed by the DDR SGRAM. The DDR SGRAM is effectively deselected. Operations already in progress are not affected. No Operation (NOP) The No Operation (NOP) command is used to perform a NOP to a DDR SGRAM. This prevents unwanted commands from being registered during idle or wait states. Operations already in progress are not affected. Mode Register Set The mode registers are loaded via inputs A0-A12, BA0 and BA1. See mode register descriptions in Chapter 3.2. The Mode Register Set command can only be issued when all banks are idle and no bursts are in progress. A subsequent executable command cannot be issued until tMRD is met. Active The Active command is used to open (or activate) a row in a particular bank for a subsequent access. The value on the BA0, BA1 inputs selects the bank, and the address provided on inputs A0-A12 selects the row. This row remains active (or open) for accesses until a Precharge (or Read or Write with Auto Precharge) is issued to that bank. A Precharge (or Read or Write with Auto Precharge) command must be issued and completed before opening a different row in the same bank. Read The Read command is used to initiate a burst read access to an active (open) row. The value on the BA0, BA1 inputs selects the bank, and the address provided on inputs A0-A8 selects the starting column location. The value on input A10 determines whether or not Auto Precharge is used. If Auto Precharge is selected, the row being accessed is precharged at the end of the Read burst; if Auto Precharge is not selected, the row remains open for subsequent accesses. Write The Write command is used to initiate a burst write access to an active (open) row. The value on the BA0, BA1 inputs selects the bank, and the address provided on inputs A0-A8 selects the starting column location. The value on input A10 determines whether or not Auto Precharge is used. If Auto Precharge is selected, the row being accessed is precharged at the end of the Write burst; if Auto Precharge is not selected, the row remains open for subsequent accesses. Input data appearing on the DQs is written to the memory array subject to the DM input logic level appearing coincident with the data. If a given DM signal is registered low, the corresponding data is written to memory; if the DM signal is registered high, the corresponding data inputs are ignored, and a Write is not executed to that byte/column location. Precharge The Precharge command is used to deactivate (close) the open row in a particular bank or the open row(s) in all banks. The bank(s) will be available for a subsequent row access a specified time (tRP) after the Precharge command is issued. Input A10 determines whether one or all banks are to be precharged, and in the case where only one bank is to be precharged, inputs BA0, BA1 select the bank. Otherwise BA0, BA1 are treated as “Don’t Care”. Once a bank has been precharged, it is in the idle state and must be activated prior to any Read or Write commands being issued to that bank. A precharge command is treated as a NOP if there is no open row in that bank, or if the previously open row is already in the process of precharging. Datasheet 18 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description Auto Precharge Auto Precharge is a feature which performs the same individual-bank precharge functions described above, but without requiring an explicit command. This is accomplished by using A10 to enable Auto Precharge in conjunction with a specific Read or Write command. A precharge of the bank/row that is addressed with the Read or Write command is automatically performed upon completion of the Read or Write burst. Auto Precharge is nonpersistent in that it is either enabled or disabled for each individual Read or Write command. Auto Precharge ensures that the precharge is initiated at the earliest valid stage within a burst. The user must not issue another command to the same bank until the precharge (tRP) is completed. This is determined as if an explicit Precharge command was issued at the earliest possible time, as described for each burst type in Chapter 3.5. Burst Terminate The Burst Terminate command is used to truncate read bursts (with Auto Precharge disabled). The most recently registered Read command prior to the Burst Terminate command is truncated, as shown in Chapter 3.5. Auto Refresh Auto Refresh is used during normal operation of the DDR SGRAM and is analogous to CAS Before RAS (CBR) Refresh in previous DRAM types. This command is nonpersistent, so it must be issued each time a refresh is required. The refresh addressing is generated by the internal refresh controller. This makes the address bits “Don’t Care” during an Auto Refresh command. The 16M x 16 Double Data Rate Graphics DRAM requires Auto Refresh cycles at an average periodic interval of 7.8 µs (maximum). To allow for improved efficiency in scheduling and switching between tasks, some flexibility in the absolute refresh interval is provided. A maximum of eight Auto Refresh commands can be posted in the system, meaning that the maximum absolute interval between any Auto Refresh command and the next Auto Refresh command is 9 × 7.8 µs (70.2 µs). This maximum absolute interval is short enough to allow for DLL updates internal to the DDR SGRAM to be restricted to Auto Refresh cycles, without allowing too much drift in tAC between updates. Self Refresh The Self Refresh command can be used to retain data in the DDR SGRAM, even if the rest of the system is powered down. When in the self refresh mode, the DDR SGRAM retains data without external clocking. The Self Refresh command is initiated as an Auto Refresh command coincident with CKE transitioning low. The DLL is automatically disabled upon entering Self Refresh, and is automatically enabled upon exiting Self Refresh (200 clock cycles must then occur before a Read command can be issued). Input signals except CKE (low) are “Don’t Care” during Self Refresh operation. The procedure for exiting self refresh requires a sequence of commands. CK (and CK) must be stable prior to CKE returning high. Once CKE is high, the SDRAM must have NOP commands issued for tXSNR because time is required for the completion of any internal refresh in progress. A simple algorithm for meeting both refresh and DLL requirements is to apply NOPs for 200 clock cycles before applying any other command. Datasheet 19 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description Table 5 Truth Table 1a: Commands Name (Function) CS RAS CAS WE Address MNE Notes Deselect (NOP) H X X X X NOP 1)2) No Operation (NOP) L H H H X NOP 1)2) Active (Select Bank And Activate Row) L L H H Bank/Row ACT 1)3) Read (Select Bank And Column, And Start Read Burst) L H L H Bank/Col Read 1)4) Write (Select Bank And Column, And Start Write Burst) L H L L Bank/Col Write 1)4) Burst Terminate L H H L X BST 1)5) Precharge (Deactivate Row In Bank Or Banks) L L H L Code PRE 1)6) Auto Refresh Or Self Refresh (Enter Self Refresh Mode) L L L H X AR/SR 1)7)8) Mode Register Set L L L L Op-Code MRS 1)9) 1) CKE is HIGH for all commands shown except Self Refresh. 2) Deselect and NOP are functionally interchangeable. 3) BA0-BA1 provide bank address and A0-A12 provide row address. 4) BA0, BA1 provide bank address; A0-A8 provide column address; A10 HIGH enables the Auto Precharge feature (nonpersistent), A10 LOW disables the Auto Precharge feature. 5) Applies only to read bursts with Auto Precharge disabled; this command is undefined (and should not be used) for read bursts with Auto Precharge enabled or for write bursts. 6) A10 LOW: BA0, BA1 determine which bank is precharged. A10 HIGH: all banks are precharged and BA0, BA1 are “Don’t Care”. 7) This command is Auto Refresh if CKE is HIGH; Self Refresh if CKE is LOW. 8) Internal refresh counter controls row and bank addressing; all inputs and I/Os are “Don’t Care” except for CKE. 9) BA0, BA1 select either the Base or the Extended Mode Register (BA0 = 0, BA1 = 0 selects Mode Register; BA0 = 1, BA1 = 0 selects Extended Mode Register; other combinations of BA0-BA1 are reserved; A0-A12 provide the op-code to be written to the selected Mode Register). Table 6 Truth Table 1b: DM Operation Name (Function) DM DQs Notes Write Enable L Valid 1) Write Inhibit H X 1) 1) Used to mask write data; provided coincident with the corresponding data. Datasheet 20 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description 3.5 Operations 3.5.1 Bank/Row Activation Before any Read or Write commands can be issued to a bank within the DDR SGRAM, a row in that bank must be “opened” (activated). This is accomplished via the Active command and addresses A0-A12, BA0 and BA1 (see Figure 4), which decode and select both the bank and the row to be activated. After opening a row (issuing an Active command), a Read or Write command may be issued to that row, subject to the tRCD specification. A subsequent Active command to a different row in the same bank can only be issued after the previous active row has been “closed” (precharged). The minimum time interval between successive Active commands to the same bank is defined by tRC. A subsequent Active command to another bank can be issued while the first bank is being accessed, which results in a reduction of total row-access overhead. The minimum time interval between successive Active commands to different banks is defined by tRRD. CK CK HIGH CKE CS RAS CAS WE Figure 4 A0-A12 RA BA0, BA1 BA RA = row address. BA = bank address. Don’t Care Activating a Specific Row in a Specific Bank CK CK ACT Command NOP ACT NOP NOP RD/WR A0-A12 ROW ROW COL BA0, BA1 BA x BA y BA y tRRD NOP NOP tRCD Don’t Care Figure 5 Datasheet tRCD and tRRD Definition 21 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description 3.5.2 Reads Subsequent to programming the mode register with CAS latency, burst type, and burst length, Read bursts are initiated with a Read command, as shown on Figure 6. The starting column and bank addresses are provided with the Read command and Auto Precharge is either enabled or disabled for that burst access. If Auto Precharge is enabled, the row that is accessed starts precharge at the completion of the burst, provided tRAS has been satisfied. For the generic Read commands used in the following illustrations, Auto Precharge is disabled. During Read bursts, the valid data-out element from the starting column address is available following the CAS latency after the Read command. Each subsequent data-out element is valid nominally at the next positive or negative clock edge (i.e. at the next crossing of CK and CK). (Figure 10) shows general timing for each supported CAS latency setting. DQS is driven by the DDR SGRAM along with output data. The initial low state on DQS is known as the read preamble; the low state coincident with the last data-out element is known as the read postamble. Upon completion of a burst, assuming no other commands have been initiated, the DQs goes High-Z. Data from any Read burst may be concatenated with or truncated with data from a subsequent Read command. In either case, a continuous flow of data can be maintained. The first data element from the new burst follows either the last element of a completed burst or the last desired data element of a longer burst which is being truncated. The new Read command should be issued x cycles after the first Read command, where x equals the number of desired data element pairs (pairs are required by the 2n prefetch architecture). This is shown on Figure 7. A Read command can be initiated on any clock cycle following a previous Read command. Nonconsecutive Read data is illustrated on Figure 8. Full-speed Random Read Accesses: CAS Latencies (Burst Length = 2, 4 or 8) within a page (or pages) can be performed as shown on Figure 9. CK CK CKE HIGH CS RAS CAS WE A0-A8 CA EN AP A10 DIS AP BA0, BA1 CA = column address BA = bank address EN AP = enable Auto Precharge DIS AP = disable Auto Precharge BA Don’t Care Figure 6 Datasheet Read Command 22 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description CAS Latency = 3 CK CK Command Address Read NOP Read BAa, COL n NOP NOP NOP BAa, COL b CL=3 DQS DQ DOa-b DOa-n DO a-n (or a-b) = data out from bank a, column n (or bank a, column b). When burst length = 4, the bursts are concatenated. When burst length = 8, the second burst interrupts the first. 3 subsequent elements of data out appear in the programmed order following DO a-n. 3 (or 7) subsequent elements of data out appear in the programmed order following DO a-b. Shown with nominal tAC, tDQSCK, and tDQSQ. Figure 7 Don’t Care Consecutive Read Bursts (Burst Length = 4) CAS Latency = 3 CK CK Command Address Read Read BAa, COL n NOP NOP NOP BAa, COL b CL=3 DQS DO a-n DQ DO a-n (or a-b) = data out from bank a, column n (or bank a, column b). 3 subsequent elements of data out appear in the programmed order following DO a-n (and following DO a-b). Shown with nominal tAC, tDQSCK, and tDQSQ. Figure 8 Datasheet DOa- b Don’t Care Non-Consecutive Read Bursts (Burst Length = 4) 23 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description CAS Latency = 3 CK CK Command Address Read Read Read Read NOP BAa, COL n BAa, COL x BAa, COL b BAa, COL g NOP CL=3 DQS DQ DOa-n DO a-n, etc. = data out from bank a, column n etc. n' etc. = odd or even complement of n, etc. (i.e., column address LSB inverted). Reads are to active rows in any banks. Shown with nominal tAC, tDQSCK, and tDQSQ. Figure 9 Datasheet DOa-n’ DOa-x DOa-x’ DOa-b Don’t Care Random Read Accesses (Burst Length = 2, 4 or 8) 24 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description Data from any Read burst may be truncated with a Burst Terminate command, as shown on Figure 10. The Burst Terminate latency is equal to the read (CAS) latency, i.e. the Burst Terminate command should be issued x cycles after the Read command, where x equals the number of desired data element pairs. Data from any Read burst must be completed or truncated before a subsequent Write command can be issued. If truncation is necessary, the Burst Terminate command must be used, as shown on Figure 11. The example is shown for tDQSS(min). The tDQSS(max) case, not shown here, has a longer bus idle time. tDQSS(min) and tDQSS(max) are defined in Chapter 3.5.3. A Read burst may be followed by, or truncated with, a Precharge command to the same bank (provided that Auto Precharge was not activated). The Precharge command should be issued x cycles after the Read command, where x equals the number of desired data element pairs (pairs are required by the 2n prefetch architecture). This is shown on Figure 12 for Read latencies of 2 and 2.5. Following the Precharge command, a subsequent command to the same bank cannot be issued until tRP is met. Note that part of the row precharge time is hidden during the access of the last data elements. In the case of a Read being executed to completion, a Precharge command issued at the optimum time (as described above) provides the same operation that would result from the same Read burst with Auto Precharge enabled. The disadvantage of the Precharge command is that it requires that the command and address busses be available at the appropriate time to issue the command. The advantage of the Precharge command is that it can be used to truncate bursts. CAS Latency = 3 CK CK Command Address Read NOP BST NOP NOP NOP BAa, COL n CL=3 DQS DQ DOa-n No further output data after this point. DQS tristated. DO a-n = data out from bank a, column n. Cases shown are bursts of 8 terminated after 4 data elements. 3 subsequent elements of data out appear in the programmed order following DO a-n. Shown with nominal tAC, tDQSCK, and tDQSQ. Figure 10 Datasheet Don’t Care Terminating a Read Burst (Burst Length = 8) 25 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description CAS Latency = 3 CK CK Command Address Read BST NOP BAa, COL n NOP Write NOP BAa, COL b CL=3 tDQSS (min) DQS DQ DI a-b DOa-n DM Don’t Care DO a-n = data out from bank a, column n .DI a-b = data in to bank a, column b 1 subsequent elements of data out appear in the programmed order following DO a-n. Data In elements are applied following Dl a-b in the programmed order, according to burst length. Shown with nominal tAC, tDQSCK, and tDQSQ. Figure 11 Read to Write (Burst Length = 4 or 8) CAS Latency = 3 CK CK Command Read NOP PRE NOP NOP ACT tRP Address BA a, COL n BA a or all BA a, ROW CL=3 DQS DQ DOa-n DO a-n = data out from bank a, column n. Cases shown are either uninterrupted bursts of 4 or interrupted bursts of 8. 3 subsequent elements of data out appear in the programmed order following DO a-n. Shown with nominal tAC, tDQSCK, and tDQSQ. Figure 12 Read to Precharge (Burst Length = 4 or 8) Datasheet 26 Don’t Care Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description 3.5.3 Writes Write bursts are initiated with a Write command, as shown in Figure 13. The starting column and bank addresses are provided with the Write command, and Auto Precharge is either enabled or disabled for that access. If Auto Precharge is enabled, the row being accessed is precharged at the completion of the burst. For the generic Write commands used in the following illustrations, Auto Precharge is disabled. During Write bursts, the first valid data-in element is registered on the first rising edge of DQS following the write command, and subsequent data elements are registered on successive edges of DQS. The Low state on DQS between the Write command and the first rising edge is known as the write preamble; the Low state on DQS following the last data-in element is known as the write postamble. The time between the Write command and the first corresponding rising edge of DQS (tDQSS) is specified with a relatively wide range (from 75% to 125% of one clock cycle), so most of the Write diagrams that follow are drawn for the two extreme cases (i.e. tDQSS(min) and tDQSS(max)). Figure 14 shows the two extremes of tDQSS for a burst of four. Upon completion of a burst, assuming no other commands have been initiated, the DQs and DQS enters High-Z and any additional input data is ignored. Data for any Write burst may be concatenated with or truncated with a subsequent Write command. In either case, a continuous flow of input data can be maintained. The new Write command can be issued on any positive edge of clock following the previous Write command. The first data element from the new burst is applied after either the last element of a completed burst or the last desired data element of a longer burst which is being truncated. The new Write command should be issued x cycles after the first Write command, where x equals the number of desired data element pairs (pairs are required by the 2n prefetch architecture). Figure 15 shows concatenated bursts of 4. An example of non-consecutive Writes is shown in Figure 16. Full-speed random write accesses within a page or pages can be performed as shown in Figure 17. Data for any Write burst may be followed by a subsequent Read command. To follow a Write without truncating the write burst, tWTR (Write to Read) should be met as shown in Figure 18. Data for any Write burst may be truncated by a subsequent Read command, as shown in Figure 19 to Figure 21. Note that only the data-in pairs that are registered prior to the tWTR period are written to the internal array, and any subsequent data-in must be masked with DM, as shown in the diagrams noted previously. Data for any Write burst may be followed by a subsequent Precharge command. To follow a Write without truncating the write burst, tWR should be met as shown in Figure 22. Data for any Write burst may be truncated by a subsequent Precharge command, as shown in Figure 23 to Figure 25. Note that only the data-in pairs that are registered prior to the tWR period are written to the internal array, and any subsequent data in should be masked with DM. Following the Precharge command, a subsequent command to the same bank cannot be issued until tRP is met. In the case of a Write burst being executed to completion, a Precharge command issued at the optimum time (as described above) provides the same operation that would result from the same burst with Auto Precharge. The disadvantage of the Precharge command is that it requires that the command and address busses be available at the appropriate time to issue the command. The advantage of the Precharge command is that it can be used to truncate bursts. Datasheet 27 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description CK CK CKE HIGH CS RAS CAS WE A0-A8 CA EN AP A10 DIS AP BA0, BA1 CA = column address BA = bank address EN AP = enable Auto Precharge DIS AP = disable Auto Precharge BA Don’t Care Figure 13 Datasheet Write Command 28 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description Maximum DQSS T1 T2 T3 T4 CK CK Write Command NOP NOP NOP BA a, COL b Address tDQSS (max) DQS DQ Dla-b DM Minimum DQSS T1 T2 T3 T4 CK CK Command Address Write NOP NOP NOP BA a, COL b tDQSS (min) DQS Dla-b DQ DM DI a-b = data in for bank a, column b. 3 subsequent elements of data in are applied in the programmed order following DI a-b. A non-interrupted burst is shown. A10 is Low with the Write command (Auto Precharge is disabled). Don’t Care Figure 14 Datasheet Write Burst (Burst Length = 4) 29 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description Maximum DQSS T1 T2 T3 T4 T5 T6 CK CK Write Command Address NOP Write BAa, COL b NOP NOP NOP BAa, COL n tDQSS (max) DQS DQ DI a-b DI a-n DM Minimum DQSS T1 T2 T3 T4 T5 T6 CK CK Write Command Address NOP BA, COL b Write NOP NOP NOP BA, COL n tDQSS (min) DQS DQ DI a-b DI a-n DM DI a-b = data in for bank a, column b, etc. 3 subsequent elements of data in are applied in the programmed order following DI a-b. 3 subsequent elements of data in are applied in the programmed order following DI a-n. A non-interrupted burst is shown. Each Write command may be to any bank. Figure 15 Datasheet Don’t Care Write to Write (Burst Length = 4) 30 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description T1 T2 T3 T4 T5 CK CK Write Command Address NOP NOP BAa, COL b Write NOP BAa, COL n tDQSS (max) DQS DQ DI a-b DI a-n DM DI a-b, etc. = data in for bank a, column b, etc. 3 subsequent elements of data in are applied in the programmed order following DI a-b. 3 subsequent elements of data in are applied in the programmed order following DI a-n. A non-interrupted burst is shown. Each Write command may be to any bank. Figure 16 Datasheet Don’t Care Write to Write: Max. DQSS, Non-Consecutive (Burst Length = 4) 31 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description Maximum DQSS T1 T2 T3 T4 T5 CK CK Write Command Address Write BAa, COL b Write BAa, COL x BAa, COL n Write Write BAa, COL a BAa, COL g tDQSS (max) DQS DQ DI a-b DI a-b’ DI a-x DI a-x’ DI a-n DI a-n’ DI a-a DI a-a’ DM Minimum DQSS T1 T2 T3 T4 T5 CK CK Write Command Address Write BAa, COL b Write BAa, COL x BAa, COL n Write Write BAa, COL a BAa, COL g tDQSS (min) DQS DQ DI a-b DI a-b’ DI a-x DI a-x’ DI a-n DI a-n’ DI a-a DI a-a’ DI a-g DM DI a-b, etc. = data in for bank a, column b, etc. b', etc. = odd or even complement of b, etc. (i.e., column address LSB inverted). Each Write command may be to any bank. Figure 17 Datasheet Don’t Care Random Write Cycles (Burst Length = 2, 4 or 8) 32 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description Maximum DQSS T1 T2 T3 T4 T5 T6 CK CK Write Command NOP NOP NOP Read NOP tWTR Address BAa, COL b BAa, COL n CL = 3 tDQSS (max) DQS DQ DI a-b DM Minimum DQSS T1 T2 T3 T4 T5 T6 CK CK Write Command NOP NOP NOP Read NOP tWTR Address BAa, COL n BAa, COL b CL = 3 tDQSS (min) DQS DQ DI a-b DM DI a-b = data in for bank a, column b. 3 subsequent elements of data in are applied in the programmed order following DI a-b. A non-interrupted burst is shown. tWTR is referenced from the first positive CK edge after the last data in pair. A10 is Low with the Write command (Auto Precharge is disabled). The Read and Write commands may be to any bank. Figure 18 Datasheet Don’t Care Write to Read: Non-Interrupting (CAS Latency = 3; Burst Length = 4) 33 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description Maximum DQSS T1 T2 T3 T4 T5 T6 CK CK Command Write NOP NOP NOP Read NOP tWTR Address BAa, COL n BAa, COL b CL = 3 tDQSS (max) DQS DQ DIa- b 1 DM 1 Minimum DQSS T1 T2 T3 T4 T5 T6 CK CK Command Write NOP NOP NOP Read NOP tWTR Address BAa, COL n BAa, COL b CL = 3 tDQSS (min) DQS DQ DI a-b 1 DM 1 DI a-b = data in for bank a, column b. An interrupted burst is shown, 4 data elements are written. 3 subsequent elements of data in are applied in the programmed order following DI a-b. tWTR is referenced from the first positive CK edge after the last data in pair. The Read command masks the last 2 data elements in the burst. A10 is Low with the Write command (Auto Precharge is disabled). The Read and Write commands are not necessarily to the same bank. 1 = These bits are incorrectly written into the memory array if DM is low. Figure 19 Datasheet Don’t Care Write to Read: Interrupting (CAS Latency = 3; Burst Length = 8) 34 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description T1 T2 T3 T4 T5 T6 CK CK Command Write NOP NOP NOP Read NOP tWTR Address BAa, COL n BAa, COL b CL = 3 tDQSS (min) DQS DQ DI a-b DM 1 2 2 DI a-b = data in for bank a, column b. An interrupted burst is shown, 3 data elements are written. 2 subsequent elements of data in are applied in the programmed order following DI a-b. tWTR is referenced from the first positive CK edge after the last desired data in pair (not the last desired data in element) The Read command masks the last 2 data elements in the burst. A10 is Low with the Write command (Auto Precharge is disabled). The Read and Write commands are not necessarily to the same bank. 1 = This bit is correctly written into the memory array if DM is low. 2 = These bits are incorrectly written into the memory array if DM is low. Figure 20 Datasheet Don’t Care Write to Read: Min. DQSS, Odd Number of Data (3-bit Write), Interrupting (CL3; BL8) 35 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description T1 T2 T3 T4 T5 T6 CK CK Write Command NOP NOP NOP Read NOP tWTR Address BAa, COL n BAa, COL b CL = 3 tDQSS (nom) DQS DQ DI a-b DM 1 1 DI a-b = data in for bank a, column b. An interrupted burst is shown, 4 data elements are written. 3 subsequent elements of data in are applied in the programmed order following DI a-b. tWTR is referenced from the first positive CK edge after the last desired data in pair. The Read command masks the last 2 data elements in the burst. A10 is Low with the Write command (Auto Precharge is disabled). The Read and Write commands are not necessarily to the same bank. 1 = These bits are incorrectly written into the memory array if DM is low. Figure 21 Datasheet Don’t Care Write to Read: Nominal DQSS, Interrupting (CAS Latency = 3; Burst Length = 8) 36 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description Maximum DQSS T1 T2 T3 T4 T5 T6 CK CK Write Command NOP NOP NOP NOP PRE tWR Address BA (a or all) BA a, COL b tRP tDQSS (max) DQS DQ DI a-b DM Minimum DQSS T1 T2 T3 T4 T5 T6 CK CK Command Write NOP NOP NOP NOP PRE tWR Address BA (a or all) BA a, COL b tRP tDQSS (min) DQS DQ DI a-b DM DI a-b = data in for bank a, column b. 3 subsequent elements of data in are applied in the programmed order following DI a-b. A non-interrupted burst is shown. tWR is referenced from the first positive CK edge after the last data in pair. A10 is Low with the Write command (Auto Precharge is disabled). Figure 22 Datasheet Don’t Care Write to Precharge: Non-Interrupting (Burst Length = 4) 37 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description Maximum DQSS T1 T2 T3 T4 T5 T6 CK CK Write Command NOP NOP NOP PRE NOP tWR Address BA (a or all) BA a, COL b tDQSS (max) tRP 2 DQS DQ DI a-b 3 DM 1 3 1 Minimum DQSS T1 T2 T3 T4 T5 T6 CK CK Write Command NOP NOP NOP PRE NOP tWR BA a, COL b Address BA (a or all) tDQSS (min) tRP 2 DQS DQ DM DI a-b 3 3 1 1 DI a-b = data in for bank a, column b. An interrupted burst is shown, 2 data elements are written. 1 subsequent element of data in is applied in the programmed order following DI a-b. tWR is referenced from the first positive CK edge after the last desired data in pair. The Precharge command masks the last 2 data elements in the burst, for burst length = 8. A10 is Low with the Write command (Auto Precharge is disabled). 1 = Can be don't care for programmed burst length of 4. 2 = For programmed burst length of 4, DQS becomes don't care at this point. 3 = These bits are incorrectly written into the memory array if DM is low. Figure 23 Datasheet Don’t Care Write to Precharge: Interrupting (Burst Length = 4 or 8) 38 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description T1 T2 T3 T4 T5 T6 CK CK Write Command NOP NOP NOP PRE NOP tWR Address BA (a or all) BA a, COL b tDQSS (min) tRP 2 DQS DQ DM DI a-b 3 4 4 1 DI a-b = data in for bank a, column b. An interrupted burst is shown, 1 data element is written. tWR is referenced from the first positive CK edge after the last desired data in pair. The Precharge command masks the last 2 data elements in the burst. A10 is Low with the Write command (Auto Precharge is disabled). 1 = Can be don't care for programmed burst length of 4. 2 = For programmed burst length of 4, DQS becomes don't care at this point. 3 = This bit is correctly written into the memory array if DM is low. 4 = These bits are incorrectly written into the memory array if DM is low. Figure 24 Datasheet 1 Don’t Care Write to Precharge: Minimum DQSS, Odd Number of Data (1-bit Write), Interrupting (BL 4 or 8) 39 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description T1 T2 T3 T4 T5 T6 CK CK Write Command NOP NOP NOP PRE NOP tWR BA a, COL b Address BA (a or all) tDQSS (nom) tRP 2 DQS DQ DM DI a-b 3 3 1 DI a-b = Data In for bank a, column b. An interrupted burst is shown, 2 data elements are written. 1 subsequent element of data in is applied in the programmed order following DI a-b. tWR is referenced from the first positive CK edge after the last desired data in pair. The Precharge command masks the last 2 data elements in the burst. A10 is Low with the Write command (Auto Precharge is disabled). 1 = Can be don't care for programmed burst length of 4. 2 = For programmed burst length of 4, DQS becomes don't care at this point. 3 = These bits are incorrectly written into the memory array if DM is low. Figure 25 Datasheet 1 Don’t Care Write to Precharge: Nominal DQSS (2-bit Write), Interrupting (Burst Length = 4 or 8) 40 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description 3.5.4 Precharge The Precharge command is used to deactivate the open row in a particular bank or the open row in all banks. The bank(s) will be available for a subsequent row access some specified time (tRP) after the Precharge command is issued. Input A10 determines whether one or all banks are to be precharged, and in the case where only one bank is to be precharged, inputs BA0, BA1 select the bank. When all banks are to be precharged, inputs BA0, BA1 are treated as “Don’t Care”. Once a bank has been precharged, it is in the idle state and must be activated prior to any Read or Write commands being issued to that bank. CK CK CKE HIGH CS RAS CAS WE A0-A9, A11, A12 All Banks A10 BA0, BA1 One Bank BA BA = bank address (if A10 is Low, otherwise Don’t Care). Don’t Care Figure 26 Datasheet Precharge Command 41 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description 3.5.5 Power-Down Power-down is entered when CKE is registered LOW (no accesses can be in progress). If power-down occurs when all banks are idle, this mode is referred to as precharge power-down; if power-down occurs when there is a row active in any bank, this mode is referred to as active power-down. Entering power-down deactivates the input and output buffers, excluding CK, CK and CKE. The DLL is still running in Power Down mode, so for maximum power savings, the user has the option of disabling the DLL prior to entering Power-down. In that case, the DLL must be enabled after exiting power-down, and 200 clock cycles must occur before a Read command can be issued. In power-down mode, CKE Low and a stable clock signal must be maintained at the inputs of the DDR SGRAM, and all other input signals are “Don’t Care”. However, power-down duration is limited by the refresh requirements of the device, so in most applications, the self refresh mode is preferred over the DLL-disabled power-down mode. The power-down state is synchronously exited when CKE is registered HIGH (along with a NOP or Deselect command). A valid, executable command may be applied one clock cycle later. CK CK tIS CKE Command VALID tIS NOP NOP No column access in progress Exit power down mode Don’t Care Enter Power Down mode (Burst Read or Write operation must not be in progress) Figure 27 Datasheet VALID Power Down 42 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description Table 7 Truth Table 2: Clock Enable (CKE) Current State CKE n-1 CKEn Command n Action n Notes Previous Cycle Current Cycle Self Refresh L L X Maintain Self-Refresh – Self Refresh L H Deselect or NOP Exit Self-Refresh 1) Power Down L L X Maintain Power-Down – Power Down L H Deselect or NOP Exit Power-Down – All Banks Idle H L Deselect or NOP Precharge Power-Down Entry – All Banks Idle H L AUTO REFRESH Self Refresh Entry – Bank(s) Active H L Deselect or NOP Active Power-Down Entry – H H See Table 8 – – 1) Deselect or NOP commands should be issued on any clock edges occurring during the Self Refresh Exit (tXSNR) period. A minimum of 200 clock cycles are needed before applying a read command to allow the DLL to lock to the input clock. 1. 2. 3. 4. CKEn is the logic state of CKE at clock edge n: CKE n-1 was the state of CKE at the previous clock edge. Current state is the state of the DDR SGRAM immediately prior to clock edge n. COMMAND n is the command registered at clock edge n, and ACTION n is a result of COMMAND n. All states and sequences not shown are illegal or reserved. Table 8 Truth Table 3: Current State Bank n - Command to Bank n (same bank) Current State CS Any Idle Row Active Read (Auto Precharge Disabled) Write (Auto Precharge Disabled) RAS CAS WE Command Action Notes H X X X Deselect NOP. Continue previous operation. 1)2)3)4)5)6) L H H H No Operation NOP. Continue previous operation. 1) to 6) L L H H Active Select and activate row 1) to 6) L L L H AUTO REFRESH – 1) to 7) L L L L MODE REGISTER SET – 1) to 7) L H L H Read Select column and start Read burst 1) to 6), 8) L H L L Write Select column and start Write burst 1) to 6), 8) L L H L Precharge Deactivate row in bank(s) 1) to 6), 9) L H L H Read Select column and start new Read burst 1) to 6), 8) L L H L Precharge Truncate Read burst, start Precharge 1) to 6), 9) L H H L BURST TERMINATE BURST TERMINATE 1) to 6), 10) L H L H Read Select column and start Read burst 1) to 6), 8), 11) L H L L Write Select column and start Write burst 1) to 6), 8) L L H L Precharge Truncate Write burst, start Precharge 1) to 6), 9), 11) 1) This table applies when CKE n-1 was HIGH and CKE n is HIGH (see Table 7 and after tXSNR/tXSRD has been met (if the previous state was self refresh). 2) This table is bank-specific, except where noted, i.e., the current state is for a specific bank and the commands shown are those allowed to be issued to that bank when in that state. Exceptions are covered in the notes below. Datasheet 43 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description 3) Current state definitions: Idle: The bank has been precharged, and tRP has been met. Row Active: A row in the bank has been activated, and tRCD has been met. No data bursts/accesses and no register accesses are in progress. Read: A Read burst has been initiated, with Auto Precharge disabled, and has not yet terminated or been terminated. Write: A Write burst has been initiated, with Auto Precharge disabled, and has not yet terminated or been terminated. 4) The following states must not be interrupted by a command issued to the same bank. Precharging: Starts with registration of a Precharge command and ends when tRP is met. Once tRP is met, the bank is in the idle state. Row Activating: Starts with registration of an Active command and ends when tRCD is met. Once tRCD is met, the bank is in the “row active” state. Read w/Auto Precharge Enabled: Starts with registration of a Read command with Auto Precharge enabled and ends when tRP has been met. Once tRP is met, the bank is in the idle state. Write w/Auto Precharge Enabled: Starts with registration of a Write command with Auto Precharge enabled and ends when tRP has been met. Once tRP is met, the bank is in the idle state. Deselect or NOP commands, or allowable commands to the other bank should be issued on any clock edge occurring during these states. Allowable commands to the other bank are determined by its current state and according to Table 9. 5) The following states must not be interrupted by any executable command; Deselect or NOP commands must be applied on each positive clock edge during these states. Refreshing: Starts with registration of an Auto Refresh command and ends when tRFC is met. Once tRFC is met, the DDR SGRAM is in the “all banks idle” state. Accessing Mode Register: Starts with registration of a Mode Register Set command and ends when tMRD has been met. Once tMRD is met, the DDR SGRAM is in the “all banks idle” state. Precharging All: Starts with registration of a Precharge All command and ends when tRP is met. Once tRP is met, all banks is in the idle state. 6) All states and sequences not shown are illegal or reserved. 7) Not bank-specific; requires that all banks are idle. 8) Reads or Writes listed in the Command/Action column include Reads or Writes with Auto Precharge enabled and Reads or Writes with Auto Precharge disabled. 9) May or may not be bank-specific; if all/any banks are to be precharged, all/any must be in a valid state for precharging. 10) Not bank-specific; BURST TERMINATE affects the most recent Read burst, regardless of bank. 11) Requires appropriate DM masking. Datasheet 44 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description Table 9 Truth Table 4: Current State Bank n - Command to Bank m (different bank) Current State CS RAS CAS WE Command Action Notes H X X X Deselect NOP. Continue previous operation. 1)2)3)4)5)6) L H H H No Operation NOP. Continue previous operation. 1) to 6) Idle X X X X Any Command Otherwise Allowed to Bank m – 1) to 6) Row Activating, Active, or Precharging L L H H Active Select and activate row 1) to 6) L H L H Read Select column and start Read burst 1) to 7) L H L L Write Select column and start Write burst 1) to 7) L L H L Precharge – 1) to 6) L L H H Active Select and activate row 1) to 6) L H L H Read Select column and start new Read burst 1) to 7) L L H L Precharge – 1) to 6) L L H H Active Select and activate row 1) to 6) L H L H Read Select column and start Read burst 1) to 8) L H L L Write Select column and start new Write burst 1) to 7) L L H L Precharge – 1) to 6) Read (With Auto L Precharge) L L H H Active Select and activate row 1) to 6) H L H Read Select column and start new Read burst 1) to 7), 9) L H L L Write Select column and start Write burst 1) to 7), 9), 10) L L H L Precharge – 1) to 6) Write (With Auto L Precharge) L L H H Active Select and activate row 1) to 6) H L H Read Select column and start Read burst 1) to 7), 9) L H L L Write Select column and start new Write burst 1) to 7), 9) L L H L Precharge – 1) to 6) Any Read (Auto Precharge Disabled) Write (Auto Precharge Disabled) 1) This table applies when CKE n-1 was HIGH and CKE n is HIGH (see Table 7: Clock Enable (CKE) and after tXSNR/tXSRD has been met (if the previous state was self refresh). 2) This table describes alternate bank operation, except where noted, i.e., the current state is for bank n and the commands shown are those allowed to be issued to bank m (assuming that bank m is in such a state that the given command is allowable). Exceptions are covered in the notes below. 3) Current state definitions: Idle: The bank has been precharged, and tRP has been met. Row Active: A row in the bank has been activated, and tRCD has been met. No data bursts/accesses and no register accesses are in progress. Read: A Read burst has been initiated, with Auto Precharge disabled, and has not yet terminated or been terminated. Write: A Write burst has been initiated, with Auto Precharge disabled, and has not yet terminated or been terminated. Read with Auto Precharge Enabled: See 10). Write with Auto Precharge Enabled: See 10). 4) AUTO REFRESH and Mode Register Set commands may only be issued when all banks are idle. 5) A BURST TERMINATE command cannot be issued to another bank; it applies to the bank represented by the current state only. 6) All states and sequences not shown are illegal or reserved. Datasheet 45 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description 7) Reads or Writes listed in the Command/Action column include Reads or Writes with Auto Precharge enabled and Reads or Writes with Auto Precharge disabled. 8) Requires appropriate DM masking. 9) Concurrent Auto Precharge: This device supports “Concurrent Auto Precharge”. When a read with auto precharge or a write with auto precharge is enabled any command may follow to the other banks as long as that command does not interrupt the read or write data transfer and all other limitations apply (e.g. contention between READ data and WRITE data must be avoided). The minimum delay from a read or write command with auto precharge enable, to a command to a different banks is summarized in Table 10. 10) A Write command may be applied after the completion of data output. Table 10 Truth Table 5: Concurrent Auto Precharge From Command To Command (different bank) Minimum Delay with Concurrent Auto Precharge Support Unit WRITE w/AP Read or Read w/AP 1 + (BL/2) + tWTR Write to Write w/AP BL/2 Precharge or Activate 1 Read or Read w/AP BL/2 Write or Write w/AP CL (rounded up) + BL/2 Precharge or Activate 1 tCK tCK tCK tCK tCK tCK Read w/AP Datasheet 46 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Functional Description 3.6 Simplified State Diagram Power Applied Power On Self Refresh Precharge PREALL REFS REFSX MRS EMRS MRS CKEH Active Power Down Auto Refresh REFA Idle CKEL ACT Precharge Power Down CKEH CKEL Burst Stop Row Active Write Write A Read Read A Write Read Read Read A Write A PRE Write A PRE PRE PRE Read A Read A Precharge PREALL Automatic Sequence Command Sequence PREALL = Precharge All Banks MRS = Mode Register Set EMRS = Extended Mode Register Set REFS = Enter Self Refresh REFSX = Exit Self Refresh REFA = Auto Refresh Figure 28 Datasheet CKEL = Enter Power Down CKEH = Exit Power Down ACT = Active Write A = Write with Autoprecharge Read A = Read with Autoprecharge PRE = Precharge Simplified State Diagram 47 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Electrical Characteristics 4 Electrical Characteristics 4.1 Operating Conditions Table 11 Absolute Maximum Ratings Parameter Symbol Voltage on I/O pins relative to VSS VIN, VOUT VIN VDD VDDQ TA TSTG PD IOUT Voltage on Inputs relative to VSS Voltage on VDD supply relative to VSS Voltage on VDDQ supply relative to VSS Operating Temperature (Ambient) Storage Temperature (Plastic) Power Dissipation Short Circuit Output Current Values Unit Note/ Test Condition Min. Typ. Max. –0.5 — VDDQ + 0.5 V — –0.5 — +3.6 V — –0.5 — +3.6 V — –0.5 — +3.6 V — 0 — +70 °C — –55 — +150 °C — — 1.5 — W — — 50 — mA — Attention: Stresses above those listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. Table 12 Input and Output Capacitances Parameter Input Capacitance: CK, CK Delta Input Capacitance Input Capacitance: All other input-only pins Delta Input Capacitance: All other input-only pins Symbol Values Unit Note/ Test Condition Min. Typ. Max. CI1 CdI1 CI2 2.0 — 3.0 pF P-TSOPII-66-11) — — 0.25 pF 1) 2.0 — 3.0 pF P-TSOPII-66-1 1) CdIO — — 0.5 pF 1) 4.0 — 5.0 pF P-TSOPII-66-1 Input/Output Capacitance: DQ, DQS, DM CIO 2)1)2) Delta Input/Output Capacitance: DQ, DQS, DM CdIO — — 0.5 pF 1) 1) These values are guaranteed by design and are tested on a sample base only. VDDQ = VDD = 2.5 V ± 0.2 V, f = 100 MHz, TA = 25 °C, VOUT(DC) = VDDQ/2, VOUT (Peak to Peak) 0.2 V. Unused pins are tied to ground. 2) DM inputs are grouped with I/O pins reflecting the fact that they are matched in loading to DQ and DQS to facilitate trace matching at the board level. Datasheet 48 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Electrical Characteristics Table 13 Electrical Characteristics and DC Operating Conditions 1) Parameter Symbol VDD I/O Supply Voltage VDDQ Supply Voltage, I/O Supply VSS, Voltage VSSQ I/O Reference Voltage VREF I/O Termination Voltage (System) VTT Input High (Logic1) Voltage VIH(DC) Input Low (Logic0) Voltage VIL(DC) Input Voltage Level, VIN(DC) Supply Voltage Values Unit Note/Test Condition 2) Min. Max. 2.5 2.7 V DDR400 2) 2.5 2.7 V DDR400 2) 0 0 V — 0.49 × VDDQ 0.51 × VDDQ V 2)3) VREF – 0.04 VREF + 0.04 VREF + 0.15 VDDQ + 0.3 –0.3 VREF – 0.15 –0.3 VDDQ + 0.3 V 2)4) V 2) V 2) V 2) CK and CK Inputs Input Differential Voltage, CK and CK Inputs VID(DC) 0.36 VDDQ + 0.6 V 2)5) VI-Matching Pull-up Current to Pull-down Current VIRatio 0.71 1.4 — 6) Input Leakage Current II –2 2 µA Any input 0 V ≤ VIN ≤ VDD; 2) All other pins not under test = 0 V Output Leakage Current IOZ –5 5 µA DQs are disabled; 0 V ≤ VOUT ≤ VDDQ 2) Output High Current, Normal Strength Driver IOH — –16.2 mA VOUT = 1.95 V 2) Output Low Current, Normal Strength Driver IOL 16.2 — mA VOUT = 0.35 V 2) 1) 0 °C ≤ TA ≤ 70 °C 2) VREF is expected to be equal to 0.5 x VDDQ of the transmitting device, and to track variations in the DC level of the same. Peak-to-peak noise on VREF may not exceed ± 2% of the DC value. 3) VREF is expected to be equal to 0.5 x VDDQ of the transmitting device, and to track variations in the DC level of the same. Peak-to-peak noise on VREF may not exceed ± 2% of the DC value. 4) VTT is not applied directly to the device. VTT is a system supply for signal termination resistors, is expected to be set equal to VREF, and must track variations in the DC level of VREF. 5) VID is the magnitude of the difference between the input level on CK and the input level on CK. 6) The ration of the pull-up current to the pull-down current is specified for the same temperature and voltage, over the entire temperature and voltage range, for device drain to source voltage from 0.25 to 1.0 V. For a given output, it represents the maximum difference between pull-up and pull-down drivers due to process variation. Datasheet 49 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Electrical Characteristics 4.2 Normal Strength Pull-down and Pull-up Characteristics 1. The nominal pull-down V-I curve for DDR SDRAM devices is expected, but not guaranteed, to lie within the inner bounding lines of the V-I curve. 2. The full variation in driver pull-down current from minimum to maximum process, temperature, and voltage lie within the outer bounding lines of the V-I curve. 3. The nominal pull-up V-I curve for DDR SDRAM devices is expected, but not guaranteed, to lie within the inner bounding lines of the V-I curve. 4. The full variation in driver pull-up current from minimum to maximum process, temperature, and voltage lie within the outer bounding lines of the V-I curve. 5. The full variation in the ratio of the maximum to minimum pull-up and pull-down current does not exceed 1.7, for device drain to source voltages from 0.1 to 1.0. 6. The full variation in the ratio of the nominal pull-up to pull-down current should be unity ±10%, for device drain to source voltages from 0.1 to 1.0 V. 140 Maximum IOUT (mA) 120 100 Nominal High 80 60 Nominal Low 40 Minimum 20 0 0 0.5 1 1.5 2 2.5 VDDQ - VOUT (V) Figure 29 Normal Strength Pull-down Characteristics 0 -20 Minimum IOUT (mA) -40 Nominal Low -60 -80 -100 -120 -140 Nominal High -160 Maximum 0 Figure 30 Datasheet 0.5 1 1.5 VDDQ - VOUT (V) 2 2.5 Normal Strength Pull-up Characteristics 50 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Electrical Characteristics Table 14 Normal Strength Pull-down and Pull-up Currents Voltage (V) Pulldown Current (mA) Pullup Current (mA) Nominal Low Nominal High Min. Max. Nominal Low Nominal High Min. Max. 0.1 6.0 6.8 4.6 9.6 -6.1 -7.6 -4.6 -10.0 0.2 12.2 13.5 9.2 18.2 -12.2 -14.5 -9.2 -20.0 0.3 18.1 20.1 13.8 26.0 -18.1 -21.2 -13.8 -29.8 0.4 24.1 26.6 18.4 33.9 -24.0 -27.7 -18.4 -38.8 0.5 29.8 33.0 23.0 41.8 -29.8 -34.1 -23.0 -46.8 0.6 34.6 39.1 27.7 49.4 -34.3 -40.5 -27.7 -54.4 0.7 39.4 44.2 32.2 56.8 -38.1 -46.9 -32.2 -61.8 0.8 43.7 49.8 36.8 63.2 -41.1 -53.1 -36.0 -69.5 0.9 47.5 55.2 39.6 69.9 -43.8 -59.4 -38.2 -77.3 1.0 51.3 60.3 42.6 76.3 -46.0 -65.5 -38.7 -85.2 1.1 54.1 65.2 44.8 82.5 -47.8 -71.6 -39.0 -93.0 1.2 56.2 69.9 46.2 88.3 -49.2 -77.6 -39.2 -100.6 1.3 57.9 74.2 47.1 93.8 -50.0 -83.6 -39.4 -108.1 1.4 59.3 78.4 47.4 99.1 -50.5 -89.7 -39.6 -115.5 1.5 60.1 82.3 47.7 103.8 -50.7 -95.5 -39.9 -123.0 1.6 60.5 85.9 48.0 108.4 -51.0 -101.3 -40.1 -130.4 1.7 61.0 89.1 48.4 112.1 -51.1 -107.1 -40.2 -136.7 1.8 61.5 92.2 48.9 115.9 -51.3 -112.4 -40.3 -144.2 1.9 62.0 95.3 49.1 119.6 -51.5 -118.7 -40.4 -150.5 2.0 62.5 97.2 49.4 123.3 -51.6 -124.0 -40.5 -156.9 2.1 62.9 99.1 49.6 126.5 -51.8 -129.3 -40.6 -163.2 2.2 63.3 100.9 49.8 129.5 -52.0 -134.6 -40.7 -169.6 2.3 63.8 101.9 49.9 132.4 -52.2 -139.9 -40.8 -176.0 2.4 64.1 102.8 50.0 135.0 -52.3 -145.2 -40.9 -181.3 2.5 64.6 103.8 50.2 137.3 -52.5 -150.5 -41.0 -187.6 2.6 64.8 104.6 50.4 139.2 -52.7 -155.3 -41.1 -192.9 2.7 65.0 105.4 50.5 140.8 -52.8 -160.1 -41.2 -198.2 Table 15 Evaluation Conditions for I/O Driver Characteristics Parameter Nominal Minimum Maximum Operating Temperature 25 °C 0 °C 70 °C VDD/VDDQ 2.5 V 2.3 V 2.7 V Process Corner typical slow-slow fast-fast Datasheet 51 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Electrical Characteristics 4.3 Weak Strength Pull-down and Pull-up Characteristics 1. The weak pull-down V-I curve for DDR SDRAM devices is expected, but not guaranteed, to lie within the inner bounding lines of the V-I curve. 2. The weak pull-up V-I curve for DDR SDRAM devices is expected, but not guaranteed, to lie within the inner bounding lines of the V-I curve. 3. The full variation in driver pull-up current from minimum to maximum process, temperature, and voltage lie within the outer bounding lines of the V-I curve. 4. The full variation in the ratio of the maximum to minimum pull-up and pull-down current does not exceed 1.7, for device drain to source voltages from 0.1 to 1.0. 5. The full variation in the ratio of the nominal pull-up to pull-down current should be unity ±10%, for device drain to source voltages from 0.1 to 1.0 V. 80 Maximum 70 Iout [mA] 60 Typical high 50 Typical low 40 30 Minimum 20 10 0 0,0 0,5 1,0 1,5 2,0 2,5 Vout [V] Figure 31 Weak Strength Pull-down Characteristics 0,0 0,0 0,5 1,0 1,5 2,0 2,5 -10,0 Minimum -20,0 Iout [V] -30,0 Typical low -40,0 -50,0 Typical high -60,0 -70,0 Maximum -80,0 Vout [V] Figure 32 Datasheet Weak Strength Pull-up Characteristics 52 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Electrical Characteristics Table 16 Weak Strength Driver Pull-down and Pull-up Characteristics Voltage (V) Pulldown Current (mA) Pullup Current (mA) Nominal Low Nominal High Min. Max. Nominal Low Nominal High Min. Max. 0.1 3.4 3.8 2.6 5.0 -3.5 -4.3 -2.6 -5.0 0.2 6.9 7.6 5.2 9.9 -6.9 -8.2 -5.2 -9.9 0.3 10.3 11.4 7.8 14.6 -10.3 -12.0 -7.8 -14.6 0.4 13.6 15.1 10.4 19.2 -13.6 -15.7 -10.4 -19.2 0.5 16.9 18.7 13.0 23.6 -16.9 -19.3 -13.0 -23.6 0.6 19.6 22.1 15.7 28.0 -19.4 -22.9 -15.7 -28.0 0.7 22.3 25.0 18.2 32.2 -21.5 -26.5 -18.2 -32.2 0.8 24.7 28.2 20.8 35.8 -23.3 -30.1 -20.4 -35.8 0.9 26.9 31.3 22.4 39.5 -24.8 -33.6 -21.6 -39.5 1.0 29.0 34.1 24.1 43.2 -26.0 -37.1 -21.9 -43.2 1.1 30.6 36.9 25.4 46.7 -27.1 -40.3 -22.1 -46.7 1.2 31.8 39.5 26.2 50.0 -27.8 -43.1 -22.2 -50.0 1.3 32.8 42.0 26.6 53.1 -28.3 -45.8 -22.3 -53.1 1.4 33.5 44.4 26.8 56.1 -28.6 -48.4 -22.4 -56.1 1.5 34.0 46.6 27.0 58.7 -28.7 -50.7 -22.6 -58.7 1.6 34.3 48.6 27.2 61.4 -28.9 -52.9 -22.7 -61.4 1.7 34.5 50.5 27.4 63.5 -28.9 -55.0 -22.7 -63.5 1.8 34.8 52.2 27.7 65.6 -29.0 -56.8 -22.8 -65.6 1.9 35.1 53.9 27.8 67.7 -29.2 -58.7 -22.9 -67.7 2.0 35.4 55.0 28.0 69.8 -29.2 -60.0 -22.9 -69.8 2.1 35.6 56.1 28.1 71.6 -29.3 -61.2 -23.0 -71.6 2.2 35.8 57.1 28.2 73.3 -29.5 -62.4 -23.0 -73.3 2.3 36.1 57.7 28.3 74.9 -29.5 -63.1 -23.1 -74.9 2.4 36.3 58.2 28.3 76.4 -29.6 -63.8 -23.2 -76.4 2.5 36.5 58.7 28.4 77.7 -29.7 -64.4 -23.2 -77.7 2.6 36.7 59.2 28.5 78.8 -29.8 -65.1 -23.3 -78.8 2.7 36.8 59.6 28.6 79.7 -29.9 -65.8 -23.3 -79.7 Datasheet 53 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Electrical Characteristics 4.4 AC Characteristics (Notes 1-5 apply to the following Tables; Electrical Characteristics and DC Operating Conditions, AC Operating Conditions, IDD Specifications and Conditions, and Electrical Characteristics and AC Timing.) Notes 1. All voltages referenced to VSS. 2. Tests for AC timing, IDD, and electrical, AC and DC characteristics, may be conducted at nominal reference/supply voltage levels, but the related specifications and device operation are guaranteed for the full voltage range specified. 3. Figure 33 represents the timing reference load used in defining the relevant timing parameters of the part. It is not intended to be either a precise representation of the typical system environment nor a depiction of the actual load presented by a production tester. System designers will use IBIS or other simulation tools to correlate the timing reference load to a system environment. Manufacturers will correlate to their production test conditions (generally a coaxial transmission line terminated at the tester electronics). 4. AC timing and IDD tests may use a VIL to VIH swing of up to 1.5 V in the test environment, but input timing is still referenced to VREF (or to the crossing point for CK, CK), and parameter specifications are guaranteed for the specified AC input levels under normal use conditions. The minimum slew rate for the input signals is 1 V/ns in the range between VIL(AC) and VIH(AC). 5. The AC and DC input level specifications are as defined in the SSTL_2 Standard (i.e. the receiver effectively switches as a result of the signal crossing the AC input level, and remains in that state as long as the signal does not ring back above (below) the DC input LOW (HIGH) level). 6. For System Characteristics like Setup & Holdtime Derating for Slew Rate, I/O Delta Rise/Fall Derating, DDR SDRAM Slew Rate Standards, Overshoot & Undershoot specification and Clamp V-I characteristics see the latest JEDEC specification for DDR components. VTT 50 Ω Output (VOUT) Timing Reference Point 30 pF Figure 33 Datasheet AC Output Load Circuit Diagram / Timing Reference Load 54 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Electrical Characteristics Table 17 AC Operating Conditions1) Parameter Symbol Values Min. VIH(AC) VIL(AC) VID(AC) VIX(AC) Input High (Logic 1) Voltage, DQ, DQS and DM Signals Input Low (Logic 0) Voltage, DQ, DQS and DM Signals Input Differential Voltage, CK and CK Inputs Input Closing Point Voltage, CK and CK Inputs Unit Note/ Test Condition Max. VREF + 0.31 — — VREF – 0.31 0.7 VDDQ + 0.6 0.5 × VDDQ 0.5 × VDDQ – 0.2 V 2)3) V 2)3) V 2)3)4) V 2)3)5) + 0.2 1) VDDQ = 2.6 V ± 0.1 V, VDD = +2.6 V ± 0.1 V ; 0 °C ≤ TA ≤ 70 °C 2) Input slew rate = 1 V/ns. 3) Inputs are not recognized as valid until VREF stabilizes. 4) VID is the magnitude of the difference between the input level on CK and the input level on CK. 5) The value of VIX is expected to equal 0.5 × VDDQ of the transmitting device and must track variations in the DC level of the same. Table 18 Electrical Characteristics and AC Timing - Absolute Specifications –4/–5 1) Parameter Symbol –4 –5 Unit Note/Test Condition Min. Max. Min. Max. tAC tDQSCK tCH tCL tHP tCK tDH tDS tIPW –0.6 +0.6 –0.65 +0.65 ns 2)3)4)5) –0.65 +0.65 –0.65 +0.65 ns 2)3)4)5) 0.45 0.55 0.45 0.55 2)3)4)5) 0.45 0.55 0.45 0.55 tCK tCK min. (tCL, tCH) ns 2)3)4)5) DQ and DM input pulse width (each input) DQ output access time from CK/CK DQS output access time from CK/CK CK high-level width CK low-level width Clock Half Period min. (tCL, tCH) 2)3)4)5) 4 12 5 12 ns CL = 3.02)3)4)5) 0.4 — 0.4 — ns 2)3)4)5) 0.4 — 0.4 — ns 2)3)4)5) 2.2 — 2.2 — ns 2)3)4)5)6) tDIPW 1.75 — 1.75 — ns 2)3)4)5)6) Data-out high-impedance time from CK/CK tHZ –0.7 0.7 –0.7 +0.7 ns 2)3)4)5)7) Data-out low-impedance time from CK/CK tLZ –0.7 0.7 –0.7 +0.7 ns 2)3)4)5)7) Write command to 1st DQS latching transition tDQSS 0.85 1.15 0.75 1.25 tCK 2)3)4)5) DQS-DQ skew (DQS and associated DQ signals) tDQSQ — 0.5 — 0.5 ns P-TSOPII-66-1 Data hold skew factor tQHS — DQ/DQS output hold time tQH tHP – tQHS — tHP – tQHS — ns 2)3)4)5) DQS input low (high) pulse width (write cycle) tDQSL,H 0.35 — 0.35 — tCK 2)3)4)5) Clock cycle time DQ and DM input hold time DQ and DM input setup time Control and Addr. input pulse width (each input) Datasheet 2)3)4)5) 0.4 — 0.5 ns P-TSOPII-66-1 2)3)4)5) 55 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Electrical Characteristics Table 18 Electrical Characteristics and AC Timing - Absolute Specifications –4/–5 1) (cont’d) Parameter Symbol –4 –5 Unit Note/Test Condition Min. Max. Min. Max. DQS falling edge to CK setup time (write tDSS cycle) 0.2 — 0.2 — tCK 2)3)4)5) tDSH 0.2 — 0.2 — tCK 2)3)4)5) 2 — 2 — tCK 2)3)4)5) 0 — 0 — ns 2)3)4)5)8) 0.40 0.60 0.40 0.60 2)3)4)5)9) 0.25 — 0.25 — tCK tCK 0.6 — 0.6 — ns 2)4)5)6)10) 0.6 — 0.6 — ns 2)4)5)6)10) 0.9 1.1 0.9 1.1 2)3)4)5) 0.4 0.6 0.4 0.6 tCK tCK 36 70E+3 40 70E+3 ns 2)3)4)5) 52 — 55 — ns 2)3)4)5) DQS falling edge hold time from CK (write cycle) tMRD Write preamble setup time tWPRES Write postamble tWPST Write preamble tWPRE Address and control input setup time tIS Address and control input hold time tIH Read preamble tRPRE Read postamble tRPST Active to Precharge command tRAS Active to Active/Auto-refresh command tRC Mode register set command cycle time 2)3)4)5) 2)3)4)5) period Auto-refresh to Active/Auto-refresh command period tRFC 60 — 65 — ns 2)3)4)5) Active to Read delay tRCDRD tRCDWR tRP tRAP tRRD 16 — 20 — ns 2)3)4)5) 12 — 15 — 16 — 20 — ns 2)3)4)5) 16 — 20 — ns 2)3)4)5) 8 — 10 — ns 2)3)4)5) tWR tDAL 15 — 15 — ns 2)3)4)5) 28 — 35 — tCK 2)3)4)5)10) tWTR tXSNR tXSRD tREFI 1 — 1 — tCK 2)3)4)5) Active to Write delay Precharge command period Active to Autoprecharge delay Active bank A to Active bank B command Write recovery time Auto precharge write recovery + precharge time Internal write to read command delay Exit self-refresh to non-read command Exit self-refresh to read command Average Periodic Refresh Interval 75 — 75 — ns 2)3)4)5) 200 — 200 — tCK 2)3)4)5) — 7.8 — 7.8 µs 2)3)4)5)11) 1) 0 °C ≤ TA ≤ 70 °C; VDDQ = 2.6 V ± 0.1 V, VDD = +2.6 V ± 0.1 V 2) Input slew rate ≥ 1 V/ns 3) The CK/CK input reference level (for timing reference to CK/CK) is the point at which CK and CK cross: the input reference level for signals other than CK/CK, is VREF. CK/CK slew rate are ≥ 1.0 V/ns. 4) Inputs are not recognized as valid until VREF stabilizes. 5) The Output timing reference level, as measured at the timing reference point indicated in AC Characteristics (note 3) is VTT. 6) These parameters guarantee device timing, but they are not necessarily tested on each device. 7) tHZ and tLZ transitions occur in the same access time windows as valid data transitions. These parameters are not referred to a specific voltage level, but specify when the device is no longer driving (HZ), or begins driving (LZ). 8) The specific requirement is that DQS be valid (HIGH, LOW, or some point on a valid transition) on or before this CK edge. A valid transition is defined as monotonic and meeting the input slew rate specifications of the device. When no writes were previously in progress on the bus, DQS will be transitioning from Hi-Z to logic LOW. If a previous write was in progress, DQS could be HIGH, LOW, or transitioning from HIGH to LOW at this time, depending on tDQSS. Datasheet 56 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Electrical Characteristics 9) The maximum limit for this parameter is not a device limit. The device operates with a greater value for this parameter, but system performance (bus turnaround) degrades accordingly. 10) For each of the terms, if not already an integer, round to the next highest integer. tCK is equal to the actual system clock cycle time. 11) A maximum of eight Autorefresh commands can be posted to any given DDR SDRAM device. Table 19 IDD Conditions Parameter Symbol IDD0 Operating Current 0 one bank; active/ precharge; tRC = tRC,MIN; DQ, DM, and DQS inputs changing once per clock cycle; address and control inputs changing once every two clock cycles. Operating Current 1 IDD1 one bank; active/read/precharge; Burst Length = 4; Refer to Chapter 4.4.1 for detailed test conditions. Precharge Power-Down Standby Current all banks idle; power-down mode; CKE £ VIL,MAX IDD2P Precharge Floating Standby Current CS Š VIH,,MIN, all banks idle; CKE Š VIH,MIN; address and other control inputs changing once per clock cycle; VIN = VREF for DQ, DQS and DM. IDD2F Precharge Quiet Standby Current IDD2Q CS Š VIHMIN, all banks idle; CKE Š VIH,MIN; address and other control inputs stable at Š VIH,MIN or £ VIL,MAX; VIN = VREF for DQ, DQS and DM. Active Power-Down Standby Current one bank active; power-down mode; CKE £ VILMAX; VIN = VREF for DQ, DQS and DM. IDD3P Active Standby Current one bank active; CS Š VIH,MIN; CKE Š VIH,MIN; tRC = tRAS,MAX; DQ, DM and DQS inputs changing twice per clock cycle; address and control inputs changing once per clock cycle. IDD3N Operating Current Read one bank active; Burst Length = 2; reads; continuous burst; address and control inputs changing once per clock cycle; 50% of data outputs changing on every clock edge; CL = 3 ; IOUT = 0 mA IDD4R Operating Current Write one bank active; Burst Length = 2; writes; continuous burst; address and control inputs changing once per clock cycle; 50% of data outputs changing on every clock edge; CL = 3 IDD4W Auto-Refresh Current tRC = tRFCMIN, distributed refresh IDD5 Self-Refresh Current CKE £ 0.2 V; external clock on IDD6 Operating Current 7 four bank interleaving with Burst Length = 4; Refer to Chapter 4.4.1 for detailed test conditions. IDD7 Datasheet 57 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Electrical Characteristics Table 20 IDD Specification Parameter Symbol –4 –5 Unit Note/ Test Condition 1) Typ. Max. Typ. Max. IDD0 Operating Current 1 IDD1 Precharge Power-Down Standby Current IDD2P Precharge Floating Standby Current IDD2F Precharge Quiet Standby Current IDD2Q Active Power-Down Standby Current IDD3P Active Standby Current IDD3N Operating Current Read IDD4R Operating Current Write IDD4W Auto-Refresh Current IDD5 Self-Refresh Current IDD6 Operating Current 7 IDD7 Operating Current 0 – 115 75 90 mA 2)3)3) – 135 95 110 mA 3)3) – 6 4 5 mA 3)3) – 45 30 36 mA 3)3) – 35 20 28 mA 3)3) – 23 13 18 mA 3)3) – 65 43 54 mA 3)3) – 150 100 120 mA – 160 100 130 mA 3)3) – 240 140 190 mA 3)3) – 2.8 1.4 2.8 mA 3)4) – 315 210 250 mA 3) 3)3) 1) Test conditions for typical values: VDD = 2.6 V , TA = 25 °C, test conditions for maximum values: VDD = 2.7 V, TA = 10 °C 2) IDD specifications are tested after the device is properly initialized and measured at 200 MHz. 3) Input slew rate = 1 V/ns. 4) Enables on-chip refresh and address counters. 4.4.1 IDD Current Measurement Conditions Legend: A = Activate, R = Read, RA = Read with Autoprecharge, P = Precharge, N = NOP or DESELECT IDD1: Operating Current: One Bank Operation 1. General test condition a) Only one bank is accessed with tRC,MIN. b) Burst Mode, Address and Control inputs are changing once per NOP and DESELECT cycle. c) 50% of data changing at every transfer d) IOUT = 0 mA. 2. Timing patterns a) (200 MHz, CL = 3): tCK = 5 ns, BL = 4, tRCD = 3 × tCK, tRC = 11 × tCK, tRAS = 8 × tCK Setup:A0 N N R0 N N N N P0 N N Read: A0 N N R0 N N N N P0 N N -repeat the same timing with random address changing IDD7: Operating Current: Four Bank Operation 1. General test condition a) Four banks are being interleaved with tRCMIN. b) Burst Mode, Address and Control inputs on NOP edge are not changing. c) 50% of data changing at every transfer d) IOUT = 0 mA. 2. Timing patterns a) (200 MHz, CL = 3): tCK = 5 ns, BL = 4, tRRD = 2 × tCK, tRCD = 3 *× tCK, tRAS = 8 × tCK Setup: A0 N A1 RA0 A2 RA1 A3 RA2 N RA3 N Read: A0 N A1 RA0 A2 RA1 A3 RA2 N RA3 N - repeat the same timing with random address Datasheet 58 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Timing Diagrams 5 Timing Diagrams All Timing diagrams are based on DDR400 Time settings. For Time settings based on DDR500 see Table 18. W '64/ W '46+ '46 W '+ W '6 '4 ',Q '0 PSWG Figure 34 Data Input (Write), Timing Burst Length = 4 Note: 1. DI n = Data In for column n. 2. 3 subsequent elements of data in are applied in programmed order following DI n. '46 W 4+ W'464B0$; '4 PSWG Figure 35 Data Output (Read), Timing Burst Length = 4 Note: 1. tQH (Data output hold time from DQS) 2. tDQSQ and tQH are only shown once and are shown referenced to different edges of DQS, only for clarify of illustration. 3. tDQSQ and tQH both apply to each of the four relevant edges of DQS. 4. tDQSQ max. is used to determine the worst case setup time for controller data capture. 5. tQH is used to determine the worst case hold time for controller data capture. Datasheet 59 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM PSWG /RDG 0RGH 5HJLVWHU ZLWK$ %$ 5$ &2'( $5 W5)& /RDG0RGH 5HJLVWHU 5HVWHW'// $//%$1.6 ([WHQGHG 0RGH 5HJLVWHU 6HW &2'( &2'( $ $//%$1.6 &2'( $$>@ 3RZHUXS 9''DQG &.VWDEOH +LJK= '4 '46 +LJK= %$>@ '0 &RPPDQG &.( &. &. 95() 977 6\VWHP 9'' Figure 36 9''4 W97' /9&026/2:/(9(/ V W,6 123 W,+ W&+ W&. W&/ W,6 35( W,+ W,6 (056 W,+ W05' 056 &2'( W05' W,6 35( W,+ W53 $5 W5)& F\FOHVRI&. 056 &2'( W05' 5$ $&7 Timing Diagrams Initialize and Mode Register Sets Note: 1. * VTT is not applied directly to the device, however tVTD must be greater than or equal to zero to avoid device latchup. 2. ** tMRD is required before any command can be applied and 200 cycles of CK are required before a Read command can be applied. 3. The two Autorefresh commands may be moved to follow the first MRS, but precede the second Precharge All command. 4. The Timing reference is shown with respect to Vref-Crossing. Datasheet 60 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM ([LW3RZHU 'RZQ0RGH 9$/,' Figure 37 '0 '4 '46 9$/,' $''5 &RPPDQG &.( &. &. W,6 9$/,' W,+ W&. W,6 123 W&+ (QWHU3RZHU 'RZQ0RGH W&/ W,6 123 9$/,' PSWG Timing Diagrams Power Down Mode Note: 1. No column accesses are allowed to be in progress at the time power down is entered. 2. * = If this command is a Precharge (or if the device is already in the idle state) then the power down mode shown is Precharge power down. If this command is an Active (or if at least one row is already active), then the power down mode shown is Active power down. 3. The Timing reference is shown with respect to Vref-Crossing. Datasheet 61 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM PSWG %$ 5$ 5$ 123 9$/,' 123 &.( &RPPDQG Figure 38 %$ 21(%$1. $//%$1.6 '0 '4 '46 %$>@ $ $>@$>@ &. &. W,6 123 W,+ W,6 35( W,+ W&. W&+ W&/ W53 123 123 $5 W5)& 123 $5 9$/,' W5)& 123 $&7 Timing Diagrams Auto Refresh Mode Note: 1. 2. 3. 4. PRE = Precharge; ACT = Active; RA = Row address; BA = Bank address; AR = Autorefresh. NOP commands are shown for ease of illustration; other valid commands may be possible at these times. DM, DQ, and DQS signals are all don't care/high-Z for operations shown. The Timing reference is shown with respect to Vref-Crossing. Datasheet 62 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM PSWG )LUVW5HDG DIWHU6HOI 5HIUHVK([LW SRVVLEOH 9$/,' W,+ W,6 Figure 39 1RQ5' ([LW6HOI 5HIUHVK0RGH 123 (QWHU6HOI 5HIUHVK0RGH '0 '4 '46 $''5 123 &RPPDQG &.( &. &. W,6 W53 W,+ W&+ W&. W&/ W,6 $5 W,6 123 W;615 W;65' F\FOHV 1RQ5' 9$/,' Timing Diagrams Self Refresh Mode Note: 1. * = Device must be in the all banks idle state before entering Self Refresh Mode. 2. ** = tXSNR is required before any non-read command can be applied, and tXSRD (200 cycles of CK) are required before a Read command can be applied. 3. The Timing reference is shown with respect to Vref-Crossing. Datasheet 63 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM W$&PD[ 4 W/=0$; 4 4 W5367 W'46&.PD[ 4 W$&0,1 W5367 4 4 W535( &/ %$ W/=0$; 4 W/=0,1 Figure 40 %$ ',6$3 &$ 5($' '4 '46 '4 '46 '0 %$>@ $ $$$>@ &RPPDQG &.( &. &. W,6 123 W,+ W,6 W,+ W&. 123 21(%$1. $//%$1.6 123 35( W&/ W&+ 4 W'46&.0,1 W535( W53 123 W/=0,1 123 W,+ W+=0,1 W+=PD[ %$ 5$ 5$ $&7 123 9$/,' 123 9$/,' 123 9$/,' PSWG Timing Diagrams Read without Auto Precharge (Burst Length = 4) Note: 1. 2. 3. 4. 5. DIS AP = Disable Auto Precharge. Don't care if A10 is High at this point. PRE = Precharge; ACT = Active; RA = Row address; BA = Bank address. NOP commands are shown for ease of illustration; other commands may be valid at these times. The Timing reference is shown with respect to Vref-Crossing. Datasheet 64 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM PSWG 123 W$&PD[ 4 4 W5367 W'46&.PD[ 4 W$&0,1 W5367 W/=0$; 4 4 Figure 41 W535( %$ (1$3 &$ '4 '46 '4 '46 '0 %$>@ $ $$$>@ &. &. W,6 123 W,+ W,6 5($' W,+ W&. 123 W&+ W&/ 123 W/=0$; 4 123 W/=0,1 4 4 W'46&.0,1 W535( W53 123 W/=0,1 123 W,+ W+=0,1 W+=PD[ %$ 5$ 5$ 123 123 &RPPDQG $&7 9$/,' &.( 9$/,' 9$/,' Timing Diagrams Read with Auto Precharge (Burst Length = 4) Note: 1. 2. 3. 4. EN AP = enable Auto Precharge. ACT = active; RA = row address. NOP commands are shown for ease of illustration; other commands may be valid at these times. The Timing reference is shown with respect to Vref-Crossing. Datasheet 65 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM PSWG %$ 5$ 5$ 123 W+=PD[ W$&PD[ 4 4 W5367 W'46&.PD[ W+=0,1 4 W$&0,1 Figure 42 W535( %$ ',6$3 &$ 5$ 5$ %$ $$$$ $ %$%$ '4 '46 '4 '46 '0 &RPPDQG &.( &. &. W,6 123 W,+ W,6 $&7 W,+ W&. 123 W&+ W5&'5' W&/ 123 W,6 5HDG W,+ W5$6 &/ W/=0$; W/=0,1 123 W535( W/=0$; 4 4 W/=0,1 123 W5& 4 4 4 W5367 W'46&.0,1 %$ 21(%$1. $//%$1.6 123 35( W53 123 $&7 9$/,' Timing Diagrams Bank Read Access (Burst Length = 4) Note: 1. 2. 3. 4. 5. DIS AP = disable Auto Precharge. Don't care if A10 is High at this point. PRE = Precharge; ACT = Active; RA = Row address; BA = Bank address. NOP commands are shown for ease of illustration; other commands may be valid at these times. The Timing reference is shown with respect to Vref-Crossing. Datasheet 66 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM PSWG %$ 5$ 5$ Figure 43 W:367 ',Q W:35(6 W'46+ %$ ',6$3 &$ '0 '4 '46 %$>@ $ $$$>@ &. &. W,6 123 W,+ W,6 :ULWH W,+ W'466 W&. W:35( 123 W&+ W'46/ W&/ 123 W'6+ 123 W,+ 123 W:5 123 %$ 21(%$1. $//%$1.6 123 &RPPDQG 35( 9$/,' &.( W53 123 $&7 Timing Diagrams Write without Auto Precharge (Burst Length = 4) Note: 1. 2. 3. 4. 5. DIS AP = Disable Auto Precharge. Don't care if A10 is High at this point. PRE = Precharge; ACT = Active; RA = Row address; BA = Bank address. NOP commands are shown for ease of illustration; other valid commands may be possible at these times. The Timing reference is shown with respect to Vref-Crossing. Datasheet 67 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM %$ %$[ PSWG 5$ (1$3 5$ 123 123 123 9$/,' 123 &RPPDQG Figure 44 &$ W:367 ',Q W:35(6 W'46+ '0 '4 '46 %$>@ $ $$$>@ &. &. W,6 123 W,+ W,6 :ULWH W,+ W'466 W&. W:35( 123 W&+ W'46/ W&/ 123 W'6+ 123 9$/,' &.( W:5 9$/,' W'$/ 9$/,' W53 123 $&7 Timing Diagrams Write with Auto Precharge (Burst Length = 4) Note: 1. 2. 3. 4. EN AP = Enable Auto Precharge. ACT = Active; RA = Row address; BA = Bank address. NOP commands are shown for ease of illustration; other valid commands may be possible at these times. The Timing reference is shown with respect to Vref-Crossing. Datasheet 68 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM PSWG W:367 ',Q W'46/ W'466 W:35(6 W:35( %$ Figure 45 5$ 5$ %$ $$$>@ $ %$>@ '0 '4 '46 &. &. W,6 123 W,+ W,6 $&7 W,+ W&. 123 W&+ W5&':5 W&/ 123 &$ :ULWH W,+ W,6 ',6$3 W5$6 123 W'46+ 123 W'6+ 123 123 W:5 %$ 21(%$1. $//%$1.6 123 &RPPDQG 35( 9$/,' &.( Timing Diagrams Bank Write Access (Burst Length = 4) Note: 1. 2. 3. 4. 5. DIS AP = Disable Auto Precharge. Don't care if A10 is High at this point. PRE = Precharge; ACT = Active; RA = Row address. NOP commands are shown for ease of illustration; other valid commands may be possible at these times. The Timing reference is shown with respect to Vref-Crossing. Datasheet 69 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM PSWG %$ 5$ 5$ %$ 21(%$1. $//%$1.6 123 Figure 46 W:367 W'46+ W'466 ',Q W:35(6 %$ ',6$3 &$ '0 '4 '46 %$>@ $ $$$>@ 123 &200$1' &.( &. &. W,6 W,+ :ULWH W,6 W,+ W&. 123 W&+ W'46/ W&/ 123 W'6+ 123 123 W:5 123 35( 9$/,' W53 123 123 $&7 Timing Diagrams Write DM Operation (Burst Length = 4) Note: 1. 2. 3. 4. DIS AP = Disable Auto Precharge. Don't care if A10 is High at this point. PRE = Precharge; ACT = Active; RA = Row address; BA = Bank address. NOP commands are shown for ease of illustration; other valid commands may be possible at these times. tDQSS = min. 5. The Timing reference is shown with respect to Vref-Crossing. Datasheet 70 Rev.1.0, 2004-02 HYB25D256161CE-[4/5] 256-Mbit Double Data Rate SGRAM Package Outlines Gage Plane 0.65 Basic 0.35 +0.1 -0.05 0.805 REF 10.16 ±0.13 0.25 Basic 1.20 MAX. Package Outlines 0.05 MIN. 6 0.1 Seating Plane 0.5 ±0.1 11.76 ±0.2 22.22 ±0.13 Lead 1 GPX09261 Figure 47 P-TSOPII-66-1 (Plastic Thin Small Outline Package Type II) You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. SMD = Surface Mounted Device Datasheet Dimensions in mm 71 Rev.1.0, 2004-02 www.infineon.com Published by Infineon Technologies AG