Diodes BZX84C20 350mw surface mount zener diode Datasheet

BZX84C2V4 - BZX84C51
350mW SURFACE MOUNT ZENER DIODE
Features
Mechanical Data
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

Planar Die Construction
350mW Power Dissipation
Zener Voltages from 2.4V - 51V
Ideally Suited for Automated Assembly Processes
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability


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Case: SOT23
Case Material: Molded Plastic.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Polarity: See Diagram
Weight: 0.008 grams (Approximate)
SOT23
Top View
Device Schematic
Ordering Information (Note 5)
Part Number
(Type Number)-7-F
(Type Number)Q-7-F
(Type Number)-13-F
(Type Number)Q-13-F
Compliance
Standard
Automotive
Standard
Automotive
Case
SOT23
SOT23
SOT23
SOT23
Packaging
3,000/Tape & Reel
3,000/Tape & Reel
10,000/Tape & Reel
10,000/Tape & Reel
*For (Type Number), please see the Electrical Characteristics Table. Example: 6.2V Zener = BZX84C6V2-7-F.
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3).compliant.
2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and
Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. BZX84C2V4-BZX84C39 products manufactured with Date Code OW (week 42, 2009) and newer are built with Green Molding Compound. BZX84C2V4BZX84C39 products manufactured prior to Date Code OW are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire
Retardants. BZX84C43-BZX84C51 products manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound.
BZX84C43-BZX84C51 products manufactured prior to Date Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3
Fire Retardants.
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Date Code Key
Year
1998
Code
J
Month
Code
Jan
1
…
…
xx = Product Type Marking Code
(See Electrical Characteristics Table)
YM = Date Code Marking for Shanghai
Assembly / Test site
Y = Year (ex: Z = 2012)
M = Month (ex: 9 = September)
2008
V
2009
W
Feb
2
BZX84C2V4 - BZX84C51
Document number: DS18001 Rev. 33 - 2
Mar
3
2010
X
2011
Y
Apr
4
2012
Z
2013
A
May
5
Kxx
2014
B
2015
C
Jun
6
1 of 5
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Jul
7
2016
D
YM
Kxx
YM
Marking Information
2017
E
Aug
8
xx = Product Type Marking Code
(See Electrical Characteristics Table)
YM = Date Code Marking for Chengdu
Assembly / Test site
Y = Year (ex: Z = 2012)
M = Month (ex: 9 = September)
2018
F
Sep
9
2019
G
2020
H
Oct
O
2021
I
Nov
N
2022
J
Dec
D
February 2018
© Diodes Incorporated
BZX84C2V4 - BZX84C51
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Forward Voltage
Symbol
@ IF = 10mA
VF
Value
0.9
Unit
V
Value
300
Unit
mW
350
417
mW
°C/W
357
°C/W
-65 to +150
°C
Thermal Characteristics
Characteristic
Power Dissipation (Note 6)
Symbol
PD
Power Dissipation (Note 7)
Thermal Resistance, Junction to Ambient Air (Note 6)
PD
RθJA
RθJA
Thermal Resistance, Junction to Ambient Air (Note 7)
Operating and Storage Temperature Range
Electrical Characteristics
Type
Number
BZX84C2V4
BZX84C2V7
BZX84C3V0
BZX84C3V3
BZX84C3V6
BZX84C3V9
BZX84C4V3
BZX84C4V7
BZX84C5V1
BZX84C5V6
BZX84C6V2
BZX84C6V8
BZX84C7V5
BZX84C8V2
BZX84C9V1
BZX84C10
BZX84C11
BZX84C12
BZX84C13
BZX84C15
BZX84C16
BZX84C18
BZX84C20
BZX84C22
BZX84C24
BZX84C27
BZX84C30
BZX84C33
BZX84C36
BZX84C39
BZX84C43
BZX84C47
BZX84C51
Notes:
(@TA = +25°C, unless otherwise specified.)
Maximum Zener
Impedance
f = 1KHz
Zener Voltage
Range
(Note 8)
Marking
Code
ZB
ZC
ZD
ZE
ZF
ZG
ZH
Z1
Z2
Z3
Z4
Z5
Z6
Z7
Z8
Z9
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
Y9
YA
YB
YC
YD
YE
YF
YG
YH
TJ, TSTG
VZ @ IZT
Maximum Reverse
Current
(Note 8)
IZT
ZZT @ IZT
IR
VR
Nom (V)
Min (V)
Max (V)
(mA)
()
()
ZZK @ IZK
(mA)
(µA)
(V)
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
2.2
2.5
2.8
3.1
3.4
3.7
4.0
4.4
4.8
5.2
5.8
6.4
7.0
7.7
8.5
9.4
10.4
11.4
12.4
13.8
15.3
16.8
18.8
20.8
22.8
25.1
28.0
31.0
34.0
37.0
40.0
44.0
48.0
2.6
2.9
3.2
3.5
3.8
4.1
4.6
5.0
5.4
6.0
6.6
7.2
7.9
8.7
9.6
10.6
11.6
12.7
14.1
15.6
17.1
19.1
21.2
23.3
25.6
28.9
32.0
35.0
38.0
41.0
46.0
50.0
54.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
100
100
95
95
90
90
90
80
60
40
10
15
15
15
15
20
20
25
30
30
40
45
55
55
70
80
80
80
90
130
150
170
180
600
600
600
600
600
600
600
500
480
400
150
80
80
80
100
150
150
150
170
200
200
225
225
250
250
300
300
325
350
350
375
375
400
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
50
20
10
5.0
5.0
3.0
3.0
3.0
2.0
1.0
3.0
2.0
1.0
0.7
0.5
0.2
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
1.0
1.0
1.0
1.0
1.0
1.0
1.0
2.0
2.0
2.0
4.0
4.0
5.0
5.0
6.0
7.0
8.0
8.0
8.0
10.5
11.2
12.6
14.0
15.4
16.8
18.9
21.0
23.1
25.2
27.3
30.1
32.9
35.7
Temperature
Coefficient
@ IZT mV/C
Min
Max
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-2.7
-2.0
0.4
1.2
2.5
3.2
3.8
4.5
5.4
6.0
7.0
9.2
10.4
12.4
14.4
16.4
18.4
21.4
24.4
27.4
30.4
33.4
37.6
42.0
46.6
0
0
0
0
0
0
0
0.2
1.2
2.5
3.7
4.5
5.3
6.2
7.0
8.0
9.0
10.0
11.0
13.0
14.0
16.0
18.0
-
6. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com.
7. Valid provided the terminals are kept at ambient temperature.
8. Short duration pulse test used to minimize self-heating effect.
BZX84C2V4 - BZX84C51
Document number: DS18001 Rev. 33 - 2
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500
50
400
40
IZ, ZENER CURRENT (mA)
PD, POWER DISSIPATION (mW)
BZX84C2V4 - BZX84C51
300
Note 6
Note 7
200
30
20
10
100
0
100
TA, Ambient Temperature, (°C)
Fig. 1 Power Derating Curve
0
30
Tj = 25°C
0
200
0
1
2
3
4
5
6
8
9 10
7
VZ, ZENER VOLTAGE (V)
Fig. 2 Typical Zener Breakdown Characteristics
10
C10
TJ = 25°C
C47
C43
C51
IZ, ZENER CURRENT (mA)
IZ, ZENER CURRENT (mA)
C12
C15
20
C18
Test current IZ
2mA
C22
10
C27
Test current IZ
5mA
C33
C36
8
6
4
Test Current IZ
2mA
2
C39
0
0
0
10
20
30
40
V Z, ZENER VOLTAGE (V)
Fig. 3 Typical Zener Breakdown Characteristics
0
20
30
40
50
70
60
VZ, ZENER VOLTAGE (V)
Fig. 4 Typical Zener Breakdown Characteristics
10
100
1,000
CT, TOTAL CAPACITANCE (pF)
CT, TOTAL CAPACITANCE (pF)
TJ = 25°C
VR = 1V
VR = 2V
100
VR = 1V
VR = 2V
10
1
100
10
VZ, NOMINAL ZENER VOLTAGE (V)
Fig. 5 Typical Total Capacitance vs. Nominal Zener Voltage
BZX84C2V4 - BZX84C51
Document number: DS18001 Rev. 33 - 2
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10
1
100
VZ, NOMINAL ZENER VOLTAGE (V)
Fig. 6 Typical Total Capacitance vs. Nominal Zener Voltage
10
February 2018
© Diodes Incorporated
BZX84C2V4 - BZX84C51
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
All 7°
H
GAUGE PLANE
0.25
J
K1
K
a
M
A
L
C
L1
B
D
G
F
SOT23
Dim
Min
Max
Typ
A
0.37
0.51
0.40
B
1.20
1.40
1.30
C
2.30
2.50
2.40
D
0.89
1.03 0.915
F
0.45
0.60 0.535
G
1.78
2.05
1.83
H
2.80
3.00
2.90
J
0.013 0.10
0.05
K
0.890 1.00 0.975
K1
0.903 1.10 1.025
L
0.45
0.61
0.55
L1
0.25
0.55
0.40
M
0.085 0.150 0.110
a
0°
8°
-All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
Y
Dimensions
C
X
X1
Y
Y1
C
Y1
X
BZX84C2V4 - BZX84C51
Document number: DS18001 Rev. 33 - 2
Value (in mm)
2.0
0.8
1.35
0.9
2.9
X1
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IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
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website, harmless against all damages.
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2018, Diodes Incorporated
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Document number: DS18001 Rev. 33 - 2
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