Freescale Semiconductor Data Sheet MC33596 Rev. 3, 06/2007 MC33596 PLL Tuned UHF Receiver for Data Transfer Applications Overview The MC33596 is a highly integrated receiver designed for low-voltage applications. It includes a programmable PLL for multi-channel applications, an RSSI circuit, a strobe oscillator that periodically wakes up the receiver while a data manager checks the content of incoming messages. A configuration switching feature allows automatic changing of the configuration between two programmable settings without the need of an MCU. © Freescale Semiconductor, Inc., 2006, 2007. All rights reserved. GND SWITCH VCC2IN GNDSUBD STROBE NC VCCIN GNDIO 31 30 29 28 27 26 25 24 SEB VCC2RF 2 23 SCLK 6 19 DATACLK NC 7 18 RSSIC GND 8 17 GNDDIG 16 GND GND CONFB 15 20 RBGAP 5 14 VCC2VCO VCCDIG2 MISO 13 21 VCCDIG MOSI 12 22 4 VCC2OUT 3 11 RFIN GNDLNA VCCINOUT • • • 20 kbps maximum data rate using Manchester coding 2.1 V to 3.6 V or 5 V supply voltage Programmable via SPI 6 kHz PLL frequency step 1 10 • RSSIOUT XTAL0UT General: • 304 MHz, 315 MHz, 426 MHz, 434 MHz, 868 MHz, and 915 MHz ISM bands • Choice of temperature ranges: — –40°C to +85°C — –20°C to +85°C • OOK and FSK reception 32 Features QFN32 9 2 LQFP32 XTALIN 1 Features • • Current consumption: — 10.3 mA in RX mode — Less then 1 mA in RX mode with strobe ratio = 1/10 — 260 nA standby and 24 μA off currents Configuration switching — allows fast switching of two register banks Receiver: • –106.5 dBm sensitivity, up to –108 dBm in FSK 2.4 kbps • Digital and analog RSSI (received signal strength indicator) • Automatic wakeup function (strobe oscillator) • Embedded data processor with programmable word recognition • Image cancelling mixer • • 380 kHz IF filter bandwidth Fast wakeup time Ordering information Temperature Range QFN Package LQFP Package –40°C to +85°C MC33596FCE/R2 MC33596FJE/R2 –20°C to +85°C MC33596FCAE/R2 MC33596FJAE/R2 MC33596 Data Sheet, Rev. 3 2 Freescale Semiconductor VCC2VC0 GNDLNA RFIN VCC2RF ACCLNA /2 or Buffer BAND GAIN_SET LIN +I/Q Mixers SWITCH_TESTOUT RSSIOUT_TESTIN /2 AGC_CONTROL PMA + I/Q Image Reject TEST_CONTROL Analog Test VCO 1.5 MHz, BW 400 kHz ANALOG_SIGNALS BAND Freescale Semiconductor BAND Fractional Divider FM-to-AM Converter AGC IF Amplifier Logarithmic Amplifier Analog Data Filter and Slicer Strobe Oscillator PFD XCO SWITCH_TESTOUT DATA_RATE AGC_CONTROL FM_AM Detector RSSI 4 Bits A/D RSSI_8BITS Clock Generator BAND State Machine Rx Data Manager V&I Reference Voltage Regulator DIG_CLOCK IF_REF_CLOCK SPI Voltage Regulator Pre Regulator VCCDIG2 XTALOUT XTALIN VCCDIG DATACLK CONFB GND GND GNDDIG GNDIO GNDSUBD GNDSUBA RSSIC SEB MOSI MISO SCLK STROBE RBGAP VCC2OUT VCC2IN VCCINOUT VCCIN Features Figure 1. Block Diagram MC33596 Data Sheet, Rev. 3 3 Pin Functions 3 Pin Functions Table 1. Pin Functions Pin Name Description 1 RSSIOUT RSSI analog output 2 VCC2RF 2.1 V to 2.7 V internal supply for LNA 3 RFIN 4 GNDLNA Ground for LNA (low noise amplifier) 5 VCC2VCO 2.1 V to 2.7 V internal supply for VCO 6 GND 7 NC 8 GND 9 XTALIN 10 XTALOUT 11 VCCINOUT 2.1 V to 3.6 V power supply/regulator output 12 VCC2OUT 2.1 V to 2.7 V voltage regulator output for analog and RF modules 13 VCCDIG 2.1 V to 3.6 V power supply for voltage limiter 14 VCCDIG2 1.5 V voltage limiter output for digital module 15 RBGAP 16 GND 17 GNDDIG 18 RSSIC 19 DATACLK Data clock output to microcontroller 20 CONFB Configuration mode selection input 21 MISO Digital interface I/O 22 MOSI Digital interface I/O 23 SCLK Digital interface clock I/O 24 SEB 25 GNDIO Digital I/O ground 26 VCCIN 2.1 V to 3.6 V or 5.5 V input 27 NC 28 STROBE 29 GNDSUBD 30 VCC2IN 2.1 V to 2.7 V power supply for analog modules for decoupling capacitor 31 SWITCH RF switch control output 32 GND RF input Ground Not connected Ground Crystal oscillator input Crystal oscillator output Reference voltage load resistance General ground Digital module ground RSSI control input Digital interface enable input No connection Strobe oscillator capacitor or external control input Ground General ground MC33596 Data Sheet, Rev. 3 4 Freescale Semiconductor Silicon Version 4 Silicon Version This data sheet describes the functional features of silicon version ES4.1. 5 Maximum Ratings Table 2. Maximum Ratings Parameter Symbol Value Unit VCCIN VGND–0.3 to 5.5 V Supply voltage on pins: VCCINOUT, VCCDIG VCC VGND–0.3 to 3.6 V Supply voltage on pins: VCC2IN, VCC2RF, VCC2VCO VCC2 VGND–0.3 to 2.7 V — VGND–0.3 to VCC2 V VCCIO VGND–0.3 to VCCIN+0.3 V — ±2000 V — ±200 V Solder heat resistance test (10 s) — 260 °C Storage temperature TS –65 to +150 °C Junction temperature TJ 150 °C Supply voltage on pin: VCCIN Voltage allowed on each pin (except digital pins) Voltage allowed on digital pins: SEB, SCLK, MISO, MOSI, CONFB, DATACLK, RSSIC, STROBE ESD HBM voltage capability on each pin1 ESD MM voltage capability on each pin2 NOTES: 1 Human body model, AEC-Q100-002 rev. C. 2 Machine model, AEC-Q100-003 rev. C. MC33596 Data Sheet, Rev. 3 Freescale Semiconductor 5 Power Supply 6 Power Supply Table 3. Supply Voltage Range Versus Ambient Temperature Temperature Range1 Parameter Unit Symbol –40°C to +85°C –20°C to +85°C Supply voltage on VCCIN, VCCINOUT, VCCDIG for 3 V operation VCC3V 2.7 to 3.6 2.1 to 3.6 V Supply voltage on VCCIN for 5 V operation VCC5V 4.5 to 5.5 4.5 to 5.5 V NOTES: 1 –40°C to +85°C: MC33596FCE/FJE. –20°C to +85°C: MC33596FCAE/FJAE. The circuit can be supplied from a 3 V voltage regulator or battery cell by connecting VCCIN and VCCINOUT. It is also possible to use a 5 V power supply connected to VCCIN; in this case VCCINOUT should not be connected to VCCIN. An on-chip low drop-out voltage regulator supplies the RF and analog modules (except the strobe oscillator and the low voltage detector, which are directly supplied from VCCINOUT). This voltage regulator is supplied from pin VCCINOUT and its output is connected to VCC2OUT. An external capacitor must be inserted between VCC2OUT and GND for stabilization and decoupling. The analog and RF modules must be supplied by VCC2 by externally wiring VCC2OUT to VCC2IN, VCC2RF and VCC2VCO. 3V 25 GNDIO 26 VCCIN 27 NC 28 STROBE 29 GNDSUBD 30 VCC2IN 31 24 23 22 21 CONFB 20 DATACLK 19 RSSIC 18 17 GND GNDDIG 16 9 VCC2 10 GND XTALIN GND RBGAP NC 15 8 VCCDIG2 7 17 GND 14 18 VCC2VCO VCCDIG RSSIC MISO U14 MC33596 13 6 GNDLNA VCC2OUT 19 5 MOSI 12 DATACLK VCC2 RFIN VCCINOUT 4 SCLK 11 21 SEB VCC2RF XTAL0UT 3 SWITCH 32 GND 2 RSSIOUT 16 RBGAP VCC2 20 GNDDIG 15 10 9 22 1 CONFB NC GND 24 23 5V VCC2 25 GNDIO 26 VCCIN 27 NC 28 STROBE 29 GNDSUBD 30 VCC2IN 31 GND XTALIN 8 VCC2VCO VCCDIG2 7 MISO U15 MC33596 14 6 GNDLNA VCCDIG 5 MOSI 13 VCC2 RFIN VCC2OUT 4 SCLK 12 3 SEB VCC2RF VCCNOUT 2 11 VCC2 RSSIOUT XTAL0UT 1 SWITCH GND 32 VCC2 VCC2 3-V Operation 5-V Operation Figure 2. Wiring Diagrams A second voltage regulator supplies the digital part. This regulator is powered from pin VCCDIG and its output is connected to VCCDIG2. An external capacitor must be inserted between VCCDIG2 and MC33596 Data Sheet, Rev. 3 6 Freescale Semiconductor Supply Voltage Monitoring and Reset GNDDIG, for decoupling. The supply voltage VCCDIG2 is equal to 1.6 V. In standby mode, this voltage regulator goes into an ultra-low-power mode, but VCCDIG2 = 0.7 x VCCDIG. This enables the internal registers to be supplied, allowing configuration data to be saved. 7 Supply Voltage Monitoring and Reset At power-on, an internal reset signal is generated. All registers are reset. When the LVDE bit is set, the low-voltage detection module is enabled. This block compares the supply voltage on VCCINOUT with a reference level of about 1.8 V. If the voltage on VCCINOUT drops below 1.8 V, status bit LVDS is set. The information in status bit LVDS is latched and reset after a read access. NOTE If LVDE = 1, the LVD module remains enabled. The circuit cannot be put in standby mode, but remains in LVD mode with a higher quiescent current, due to the monitoring circuitry. LVD function is not accurate in standby mode. 8 Receiver Functional Description The receiver is based on a superheterodyne architecture with an intermediate frequency (IF) of 1.5 MHz (see Figure 1). Its input is connected to the RFIN pin. Frequency down conversion is done by a high-side injection I/Q mixer driven by the frequency synthesizer. An integrated poly-phase filter performs rejection of the image frequency. The low intermediate frequency allows integration of the IF filter providing the selectivity. The center frequency is tuned by automatic frequency control (AFC) referenced to the crystal oscillator frequency. Sensitivity is met by an overall amplification of approximately 96 dB, distributed over the reception chain, comprising low-noise amplifier (LNA), mixer, post-mixer amplifier, and IF amplifier. Automatic gain control (AGC), on the LNA and the IF amplifier, maintains linearity and prevents internal saturation. Sensitivity can be reduced using four programmable steps on the LNA gain. Amplitude demodulation is achieved by peak detection and comparison with a fixed or adaptive voltage reference selected during configuration. Frequency demodulation is achieved in two steps: the IF amplifier AGC is disabled and acts as an amplitude limiter; a filter performs a frequency-to-voltage conversion. The resulting signal is then amplitude demodulated in the same way as in the case of amplitude modulation with an adaptive voltage reference. A low-pass filter improves the signal-to-noise ratio. Shaped data are available if the integrated data manager is not used. If used, the data manager performs clock recovery and decoding of Manchester coded data. Data and clock are then available on the serial peripheral interface (SPI). The configuration sets the data rate range managed by the data manager and the bandwidth of the low-pass filter. An internal low-frequency oscillator can be used as a strobe oscillator to perform an automatic wakeup sequence. MC33596 Data Sheet, Rev. 3 Freescale Semiconductor 7 Frequency Planning It is also possible to define two different configurations for the receiver (frequency, data rate, data manager, modulation, etc.) that are automatically loaded during wakeup or under MCU control. If the PLL goes out of lock, received data are ignored. 9 Frequency Planning 9.1 Clock Generator All clocks running in the circuit are derived from the reference frequency provided by the crystal oscillator (frequency fref, period tref). The crystal frequency is chosen in relation to the band in which the MC33596 has to operate. Table 4 shows the value of the CF bits. Table 4. Crystal Frequency and CF Values Versus Frequency Band RF Frequency (MHz) CF1 CF0 LOF1 LOF0 FREF (Crystal Frequency) (MHz) FIF (IF Frequency) (MHz) Dataclk Divider Fdataclk (kHz) Digclk Divider Fdigclk (kHz) Tdigclk (µs) 304 0 0 0 0 16.96745 1.414 60 282.791 30 565.582 1.77 315 0 0 1 0 17.58140 1.465 60 293.023 30 586.047 1.71 426 0 1 0 1 23.74913 1.484 80 296.864 40 593.728 1.68 433.92 0 1 0 1 24.19066 1.512 80 302.383 40 604.767 1.65 868.3 1 1 0 1 24.16139 1.510 80 302.017 40 604.035 1.66 916.5 1 1 1 1 25.50261 1.594 80 318.783 40 637.565 1.57 9.2 Intermediate Frequency The IF filter is controlled by the crystal oscillator to guarantee the frequency over temperature and voltage range. The IF filter center frequency, FIF, can be computed using the crystal frequency fref and the value of the CF bits: • If CF[0] = 0 : FIF = fref/9*1.5/2 • If CF[0] = 1 : FIF = fref/12*1.5/2 The cut-off frequency given in the parametric section can be computed by scaling to the FIF. Example 1. Cut-off Frequency Computation Compute the low cut-off frequency of the IF filter for a 16.9683 MHz crystal oscillator. For this reference frequency, FIF = 1.414 MHz. So, the 1.3751 MHz low cut-off frequency specified for a 1.5 MHz IF frequency becomes 1.3751*1.414/1.5 = 1.296 MHz 1. Refer to parameter 3.3 found in Section 18.1, “General Parameters.” MC33596 Data Sheet, Rev. 3 8 Freescale Semiconductor Register Access through SPI 9.3 Frequency Synthesizer Description The frequency synthesizer consists of a local oscillator (LO) driven by a fractional N phase locked loop (PLL). The LO is an integrated LC voltage controlled oscillator (VCO) operating at twice the RF frequency (for the 868 MHz frequency band) or four times the RF frequency (for the 434 MHz and 315 MHz frequency bands). This allows the I/Q signals driving the mixer to be generated by division. The fractional divider offers high flexibility in the frequency generation for: • Switching between transmit and receive modes. • Achieving frequency modulation in FSK modulation transmission. • Performing multi-channel links. • Trimming the RF carrier. Frequencies are controlled by means of registers. To allow for user preference, two programming access methods are offered (see Section 16.3, “Frequency Register”). • In friendly access, all frequencies are computed internally from the contents of the carrier frequency and deviation frequency registers. • In direct access, the user programs direct all three frequency registers. 10 Register Access through SPI 10.1 SPI Interface the MC33596 and the MCU communicate via a bidirectional serial digital interface. According to the selected mode, the MC33596 or the MCU manages the data transfer. The MC33596’s digital interface can be used as a standard SPI (master/slave) or as a simple interface (SPI deselected). In the latter case, the interface’s pins are used as standard I/O pins. However, the MCU has the highest priority, as it can control the MC33596 by setting CONFB pin to the low level. The interface is operated by four I/O pins. • SEB — Serial interface Enable When SEB is set high, pins SCLK, MOSI, and MISO are set to high impedance. This allows individual selection in a multiple device system, where all devices are connected via the same bus. The rest of the circuit remains in the current state, enabling fast recovery times, but the power amplifier is disabled to prevent any uncontrolled RF transmission. • SCLK — Serial Clock Synchronizes data movement in and out of the device through its MOSI and MISO lines. The master and slave devices can exchange a byte of information during a sequence of eight clock cycles. Since SCLK is generated by the master device, this line is an input on a slave device. • MOSI — Master Output Slave Input Transmits bytes when master, and receives bytes when slave, with the most significant bit first. When no data are output, SCLK and MOSI force a low level. MC33596 Data Sheet, Rev. 3 Freescale Semiconductor 9 Register Access through SPI • MISO — (Master Input) Slave Output Transmits data when slave, with the MSB first. There is no master function. Data are valid on falling edges of SCLK. This means that the clock phase and polarity control bits of the microcontroller SPI have to be CPOL = 0 and CPHA = 1 (using Freescale acronyms). Table 5 summarizes the serial digital interface feature versus the selected mode. Table 5. Serial Digital Interface Feature versus Selected Mode (SEB = 1) Selected Mode MC33596 Digital Interface Use Configuration SPI slave, data received on MOSI, SCLK from MCU, MISO is output Transmit SPI deselected, MOSI receives encoded data from MCU Receive DME = 1 SPI master, data sent on MOSI with clock on SCLK DME = 0 SPI deselected, received data are directly sent to MOSI Standby / LVD SPI deselected, all I/O are high impedance The data transfer protocol for each mode is described in the following sections. 10.2 Configuration Mode This mode is used to write or read the internal registers of the MC33596. As long as a low level is applied to CONFB (see Figure 27), the MCU is the master node driving the SCLK input, the MOSI line input, and the MISO line output. Whatever the direction, SPI transfers are 8-bit based and always begin with a command byte, which is supplied by the MCU on MOSI. To be considered as a command byte, this byte must come after a falling edge on CONFB. Figure 3 shows the content of the command byte. Bit Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 N1 N0 A4 A3 A2 A1 A0 R/W Figure 3. Command Byte Bits N[1:0] specify the number of accessed registers, as defined in Table 6. Table 6. Number N of Accessed Registers N[1:0] Number N of Accessed Registers 00 1 01 2 10 4 11 8 Bits A[4:0] specify the address of the first register to access. This address is then incremented internally by N after each data byte transfer. MC33596 Data Sheet, Rev. 3 10 Freescale Semiconductor Register Access through SPI R/W specifies the type of operation: 0 = Read 1 = Write Thus, this bit is associated with the presence of information on MOSI (when writing) or MISO (when reading). Figure 4 and Figure 5 show write and read operations in a typical SPI transfer. In both cases, the SPI is a slave. A received byte is considered internally on the eighth falling edge of SCLK. Consequently, the last received bits, which do not form a complete byte, are lost. NOTE A low level applied to CONFB does not affect the configuration register contents. SEB CONFB SCLK (Input) MOSI (Input) N1 N0 A4 A3 A2 A1 A0 R/W D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 MISO (Output) Figure 4. Write Operation in Configuration Mode (N[1:0] = 01) SEB CONFB SCLK (Input) MOSI (Input) N1 N0 A4 A3 A2 A1 A0 R/W MISO (Output) D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 Figure 5. Read Operation in Configuration Mode (N[1:0] = 01) 10.3 Configuration Switching This feature allows for defining two different configurations using two different banks, and for switching them automatically during wakeup when using a strobe oscillator, or by means of the strobe pin actuation by the MCU. MC33596 Data Sheet, Rev. 3 Freescale Semiconductor 11 Register Access through SPI 10.3.1 Bit Definition Two sets of configuration registers are available. They are grouped in two different banks: Bank A and Bank B. Two bits are used to define which bank represents the state of the component. Bit Name BANKA BANKB BANKA X 0 1 Direction R/W R/W Location Bank A Bank B BANKB Actions 0 Bank A is active 1 Bank B is active 1 Bank A and Bank B are active and will be used one after the other At any time, it is possible to know what is the active bank by reading the status bit BANKS. Bit Name BANKS Direction R Location Comment A&B Bank status: indicates which register bank is active. This bit, available in Bank A and Bank B, returns the same value. 10.3.2 Bank Access and Register Mapping Registers are physically mapped following a byte organization. The possible address space is 32 bytes. The base address is specified in the command byte. This is then incremented internally to address each register, up to the number of registers specified by N[1:0], also specified by this command byte. All registers can then be scanned, whatever the type of transmission (read or write); however, writing to read-only bits or registers has no effect. When the last implemented address is reached, the internal address counter automatically loops back to the first mapped address ($00). At any time, it is possible to write or read the content of any register of Bank A and Bank B. Register access is defined as follows: R/W Bit can be read and written. R Bit can be read. Write has no effect on bit value. RR Bit can be read. Read or write resets the value. R [A] Bit can be read, this returns the same value as Bank A. RR [A] Bit can be read, this returns the same value as Bank A. Read or write resets the value. Table 7. Access to Specific Bits Bit Bank Byte Access Comment RESET A CONFIG1 R/W OLS A, B CONFIG3 R-R[A] Available in BANKA. Bit value is the real time status of the PLL, BANKA, and BANKB access reflect the same value. LDVS A, B CONFIG3 RR-RR[A} Bit value is the latched value of the low-voltage detector. Read or write from any bank resets value. SOE A, B CONFIG2 R/W-R[A} SOE can be modified in BANKA. Access from BANKB reflects BANKA value. RSSIx A, B RSSI R-R[A} RSSI value is directly read from RSSI converter. Reflected value is the same whatever the active byte. MC33596 Data Sheet, Rev. 3 12 Freescale Semiconductor Freescale Semiconductor MC33596 Data Sheet, Rev. 3 91 h Bit 6 Bit 5 LOF0 CF1 0 0 R/W R/W 304–315 315–434 434–916 868 10 h Bit 6 Bit 5 FRM MODU 0 0 R/W R/W Friendly OOK Direct FSK 30 h Bit 6 Bit 5 AFF0 OLS 0 1 R/W R 0.5–2 kHz RAS 1–4 kHz Unlocked 9h Bit 6 Bit 5 IFLA MODE 0 0 R/W R/W No RX –20 dB TX 48 h Bit 6 Bit 5 FSK2 FSK1 1 0 R/W R/W 0h Bit 6 Bit 5 F6 F5 0 0 R/W R/W Bit 4 CF0 1 R/W 314 434–868 Bit 3 RESET 0 R/W No Yes Bit 2 SL 0 R/W T/R R/T Bit 1 LVDE 0 R/W No Yes Bit 4 DR1 1 R/W 2.4–4.8 9.6–19.2 Bit 3 DR0 0 R/W 2.4–9.6 4.8–19.2 Bit 2 TRXE 0 R/W Standby Enable Bit 1 DME 0 R/W No Yes Bit 4 LVDS 1 RR RAS Low V Bit 3 ILA1 0 R/W 0–8 dB 14–24 dB Bit 2 ILA0 0 R/W 0–14 dB 8–24 dB Bit 1 OLA1 0 R/W 0–8 dB 14–24 dB Bit 4 RSSIE 0 R/W No Yes Bit 3 EDD 1 R/W Slow dec. Fast dec. Bit 2 RAGC 0 R/W No Yes Bit 1 FAGC 0 R/W No Yes Bit 4 FSK0 0 R/W Bit 3 F11 1 R/W Bit 2 F10 0 R/W Bit 1 F9 0 R/W Bit 4 F4 0 R/W Bit 3 F3 0 R/W Bit 2 F1 0 R/W Bit 1 F1 0 R/W 0Dh CONFIG1-B Bit 7 Bit Name LOF1 Reset Value 1 R/W 0 = 304–434 1 = 315–916 0Eh CONFIG2-B Bit 0 Bit 7 SOE Bit Name DSREF 0 Reset Value 0 R/W R/W No 0 = Fixed Yes 1 = Adaptive 0Fh CONFIG3-B Bit 0 Bit 7 OLA0 Bit Name AFF1 0 Reset Value 0 R/W R/W 0–14 dB 0 = 0.5–1 kHz 8–24 dB 1 = 2–4 kHz 10h COMMAND-B Bit 0 Bit 7 BANKS Bit Name AFFC 1 Reset Value 0 R R/W B Bank 0 = AFFx OFF A Bank 1 = AFFx ON 11h F1-B Bit 0 Bit 7 F8 Bit Name FSK3 0 Reset Value 0 R/W R/W 12h F2-B Bit 0 Bit 7 F0 Bit Name F7 0 Reset Value 0 R/W R/W Bit 0 CLKE 1 R/W No Yes Bank A Registers 91 h Bit 6 Bit 5 LOF0 CF1 0 0 R/W R/W 304–315 315–434 434–916 868 10 h Bit 6 Bit 5 FRM MODU 0 0 R/W R/W Friendly OOK Direct FSK 30 h Bit 6 Bit 5 AFF0 OLS 0 1 R/W R[A] 0.5–2 kHz RAS 1–4 kHz Unlocked 9h Bit 6 Bit 5 IFLA MODE 0 0 R/W R/W No RX –20 dB TX 4800 h Bit 6 Bit 5 FSK2 FSK1 1 0 R/W R/W 0h Bit 6 Bit 5 F6 F5 0 0 R/W R/W Bit 4 CF0 1 R/W 314 434–868 Bit 3 — 0 R — — Bit 2 SL 0 R/W T/R R/T Bit 1 LVDE 0 R/W No Yes Bit 0 CLKE 1 R/W No Yes Bit 4 DR1 1 R/W 2.4–4.8 9.6–19.2 Bit 3 DR0 0 R/W 2.4–9.6 4.8–19.2 Bit 2 TRXE 0 R/W Standby Enable Bit 1 DME 0 R/W No Yes Bit 0 SOE 0 R[A] No Yes Bit 4 LVDS 1 RR[A] RAS Low V Bit 3 ILA1 0 R/W 0–8 dB 14–24 dB Bit 2 ILA0 0 R/W 0–14 dB 8–24 dB Bit 1 OLA1 0 R/W 0–8 dB 14–24 dB Bit 0 OLA0 0 R/W 0–14 dB 8–24 dB Bit 4 RSSIE 0 R/W No Yes Bit 3 EDD 1 R/W Slow dec. Fast dec. Bit 2 RAGC 0 R/W No Yes Bit 1 FAGC 0 R/W No Yes Bit 0 BANKS 1 R[A] B Bank A Bank Bit 4 FSK0 0 R/W Bit 3 F11 1 R/W Bit 2 F10 0 R/W Bit 1 F9 0 R/W Bit 0 F8 0 R/W Bit 4 F4 0 R/W Bit 3 F3 0 R/W Bit 2 F1 0 R/W Bit 1 F1 0 R/W Bit 0 F0 0 R/W Bank B Registers Figure 6. Bank Registers 13 Register Access through SPI 00h CONFIG1-A Bit 7 Bit Name LOF1 1 Reset Value R/W 0 = 304–434 1 = 315–916 01h CONFIG2-A Bit 7 Bit Name DSREF 0 Reset Value R/W 0 = Fixed 1 = Adaptive 02h CONFIG3-A Bit 7 Bit Name AFF1 0 Reset Value R/W 0 = 0.5–1 kHz 1 = 2–4 kHz 03h COMMAND-A Bit 7 Bit Name AFFC 0 Reset Value R/W 0 = AFFx OFF 1 = AFFx ON 04h F1-A Bit 7 Bit Name FSK3 0 Reset Value R/W 05h F2-A Bit 7 Bit Name F7 0 Reset Value R/W Bit Name Reset Value Bit 7 FTA11 0 R/W 07h FT2-A Bit Name Reset Value Bit 7 FTA3 0 R/W 08h FT3-A MC33596 Data Sheet, Rev. 3 Freescale Semiconductor Bit 7 Bit Name FTB7 0 Reset Value R/W 09h RXONOFF-A Bit 7 Bit Name BANKA 0 Reset Value R/W 0Ah ID-A Bit 7 Bit Name IDL1 1 Reset Value R/W 0Bh HEADER-A Bit 7 Bit Name HDL1 1 Reset Value R/W 0Ch RSSI-A Bit 7 Bit Name RSSI7 0 Reset Value R 700701 h Bit 6 FTA10 1 R/W 7h Bit 6 FTA2 0 R/W 1h Bit 6 FTB6 0 R/W 75 h Bit 6 RON3 1 R/W C0 h Bit 6 IDL0 1 R/W 80 h Bit 6 HDL0 0 R/W 80 h Bit 6 RSSI6 0 R 13h FT1-B Bit 5 FTA9 1 R/W Bit 4 FTA8 1 R/W Bit 3 FTA7 0 R/W Bit 2 FTA6 0 R/W Bit 1 FTA5 0 R/W Bit 0 FTA4 0 R/W Bit 5 FTA1 0 R/W Bit 4 FTA0 0 R/W Bit 3 FTB11 0 R/W Bit 2 FTB10 1 R/W Bit 1 FTB9 1 R/W Bit 0 FTB8 1 R/W Bit 5 FTB5 0 R/W Bit 4 FTB4 0 R/W Bit 3 FTB3 0 R/W Bit 2 FTB2 0 R/W Bit 1 FTB1 0 R/W Bit 0 FTB0 1 R/W Bit 5 RON2 1 R/W Bit 4 RON1 1 R/W Bit 3 RON0 1 R/W Bit 2 ROFF2 1 R/W Bit 1 ROFF1 1 R/W Bit 0 ROFF0 1 R/W Bit 5 ID5 0 R/W Bit 4 ID4 0 R/W Bit 3 ID3 0 R/W Bit 2 ID2 0 R/W Bit 1 ID1 0 R/W Bit 0 ID0 0 R/W Bit 5 HD5 0 R/W Bit 4 HD4 0 R/W Bit 3 HD3 0 R/W Bit 2 HD2 0 R/W Bit 1 HD1 0 R/W Bit 0 HD0 0 R/W Bit 5 RSSI5 0 R Bit 4 RSSI4 0 R Bit 3 RSSI3 0 R Bit 2 RSSI2 0 R Bit 1 RSSI1 0 R Bit 0 RSSI0 0 R Bit Name Reset Value Bit 7 FTA11 0 R/W 14h FT2-B Bit Name Reset Value Bit 7 FTA3 0 R/W 15h FT3-B Bit 7 FTB7 0 R/W 16h RXONOFF-B Bit 7 Bit Name BANKB Reset Value 0 R/W 17h ID-B Bit 7 Bit Name IDL1 Reset Value 1 R/W 18h HEADER-B Bit 7 Bit Name HDL1 Reset Value 1 R/W 19h RSSI-B Bit 7 Bit Name RSSI7 Reset Value 0 R[A] Bit Name Reset Value 700701 h Bit 6 FTA10 1 R/W 7h Bit 6 FTA2 0 R/W 1h Bit 6 FTB6 0 R/W 75 h Bit 6 RON3 1 R/W C0 h Bit 6 IDL0 1 R/W 80 h Bit 6 HDL0 0 R/W 80 h Bit 6 RSSI6 0 R[A] Bank A Registers Bit 5 FTA9 1 R/W Bit 4 FTA8 1 R/W Bit 3 FTA7 0 R/W Bit 2 FTA6 0 R/W Bit 1 FTA5 0 R/W Bit 0 FTA4 0 R/W Bit 5 FTA1 0 R/W Bit 4 FTA0 0 R/W Bit 3 FTB11 0 R/W Bit 2 FTB10 1 R/W Bit 1 FTB9 1 R/W Bit 0 FTB8 1 R/W Bit 5 FTB5 0 R/W Bit 4 FTB4 0 R/W Bit 3 FTB3 0 R/W Bit 2 FTB2 0 R/W Bit 1 FTB1 0 R/W Bit 0 FTB0 1 R/W Bit 5 RON2 1 R/W Bit 4 RON1 1 R/W Bit 3 RON0 1 R/W Bit 2 ROFF2 1 R/W Bit 1 ROFF1 1 R/W Bit 0 ROFF0 1 R/W Bit 5 ID5 0 R/W Bit 4 ID4 0 R/W Bit 3 ID3 0 R/W Bit 2 ID2 0 R/W Bit 1 ID1 0 R/W Bit 0 ID0 0 R/W Bit 5 HD5 0 R/W Bit 4 HD4 0 R/W Bit 3 HD3 0 R/W Bit 2 HD2 0 R/W Bit 1 HD1 0 R/W Bit 0 HD0 0 R/W Bit 5 RSSI5 0 R[A] Bit 4 RSSI4 0 R[A] Bit 3 RSSI3 0 R[A] Bit 2 RSSI2 0 R[A] Bit 1 RSSI1 0 R[A] Bit 0 RSSI0 0 R[A] Bank B Registers Figure 6. Bank Registers (continued) Register Access through SPI 14 06h FT1-A Register Access through SPI 10.3.3 Direct Switch Control The conditions to enter direct switch control are: • Strobe pin = VCC • SOE bit = 0 By simply writing BANKA and BANKB, the active bank will be defined: BANKA X 0 1 BANKB 0 Bank A is active 1 Bank B is active 1 Not allowed in direct switch control Defined bank is active after exiting the configuration mode, i.e., CONFB line goes high. The direct switch control should be used when: • When the strobe oscillator cannot be used to define the switch timing (for example, not periodic) • When strobe pin use is not possible (no sleep mode between the two configurations) • No automatic switching is required and MCU SPI access is possible 10.3.4 Strobe Pin Switch Control The conditions to enter strobe pin switch control are: • Strobe pin: controlled by MCU I/O port • SOE bit = 0 By simply writing BANKA and BANKB, the active banks will be defined. BANKA X 0 1 BANKB 0 Bank A is active 1 Bank B is active 1 Bank A and Bank B are both active, configuration will toggle at each wakeup The strobe pin will control the OFF/ON state of the MC33596. The various available sequences are described in the following subsections. 10.3.4.1 BANKA = X, BANKB = 0 State A OFF State A OFF Strobe Pin If strobe pin is 1, configuration is defined by Bank A, BANKS = 1 If strobe pin is 0, MC33596 configuration is OFF. If a message is received during State A, current state remains State A up to end of message. MC33596 Data Sheet, Rev. 3 Freescale Semiconductor 15 Register Access through SPI 10.3.4.2 BANKA = 0, BANKB = 1 State B OFF State B OFF Strobe Pin If strobe pin is 1, configuration is defined by Bank B, BANKS = 0. If strobe pin is 0, MC33596 configuration is OFF. If a message is received during State B, current state remains State B up to end of message. 10.3.4.3 BANKA = 1, BANK B = 1 State A OFF State B OFF State A Strobe Pin Banks Bit If strobe pin is 1, configuration is defined by BANKS. BANKS is toggled at each falling edge of the strobe pin. If strobe pin is 0, MC33596 configuration is OFF. If a message is received during state A or state B, current state remains the same up to end of message. If a read or write access is done using SPI, the next sequence will begin with state A whatever was the active state before SPI access by MCU. 10.3.5 Strobe Oscillator Switch Control The conditions to enter strobe oscillator switch control are: • Strobe pin connected to an external capacitor to define timing (see Section 13, “Receiver On/Off Control”) • Strobe pin can also be connected to the MCU I/O port • SOE bit = 1 By simply writing BANKA and BANKB, the active banks will be defined. BANKA X 0 1 BANKB 0 Bank A is active 1 Bank B is active 1 Bank A and Bank B are both active, configuration will toggle at each wakeup MCU can override strobe oscillator control by controlling strobe pin level. If MCU I/O port is in high impedance, strobe oscillator will control the OFF/ON state of the MC33596. The various available sequences are described in the following subsections. MC33596 Data Sheet, Rev. 3 16 Freescale Semiconductor Register Access through SPI 10.3.5.1 BANKA = X, BANKB = 0 State A OFF State A OFF State A If strobe pin is 1, configuration is defined by Bank A, BANKS = 1. If strobe pin is 0, MC33596 configuration is OFF. If a message is received during State A, current state remains State A up to end of message. 10.3.5.2 BANKA = 0, BANKB = 1 State B OFF State B OFF State B If strobe pin is 1, configuration is defined by Bank B, BANKS = 0. If strobe pin is 0, MC33596 configuration is OFF. If a message is received during State B, current state remains State B up to end of message. 10.3.5.3 BANKA = 1, BANK B = 1 State A State B OFF StateA StateB OFF Banks Bit BANKS toggles at the end of each state A or state B. If strobe is forced to 1, configuration is frozen according to BANKS value. If a read or write access is done using SPI, the next sequence will begin with state A in whatever was the active state before SPI access by MCU. A Strobe B OFF A B OFF A B OFF A B 1 Z Banks For all available sequences: • State A and State B are defined by Bank A and Bank B. • State A duration, TonA is defined by Bank A RON[3–0]. • State B duration, TonB is defined by Bank B RON[3–0]. • OFF duration, TonB is defined by Bank A ROFF[2–0]. • If strobe pin is 1, the state is ON and defined by BANKS at that time and remains this state up to the release of strobe and end of message if a message is being received. • If a message is being received during State A or B, current state remains State A or B up to end of message. MC33596 Data Sheet, Rev. 3 Freescale Semiconductor 17 Communication Protocol • • • If strobe pin is 0 the state is OFF. If strobe pin is released from 0 while state is OFF, the initial OFF period is completed. Whenever is the change of duration of one state due to STROBE pin level or a message being received, this has no influence on the timing of the following states (A, B, or OFF). 10.4 Standby: LVD Mode The SPI is deselected. Nothing is sent and all incoming data are ignored until CONFB and SEB go low to switch back to configuration mode. 11 Communication Protocol 11.1 Manchester Coding Description The MC33596 data manager is able to decode Manchester coded messages. For other codings, the data manager should be disabled (DME=0) for RAW data to be available on MOSI. Manchester coding is defined as follows: data is sent during the first half-bit; and the complement of the data is sent during the second half-bit. 0 1 0 0 1 1 0 ORIGINAL DATA MANCHESTER CODED DATA Figure 7. Example of Manchester Coding The signal average value is constant. This allows clock recovery from the data stream itself. To achieve correct clock recovery, Manchester coded data must have a duty cycle between 47% and 53%. 11.2 Preamble, Identifier, Header, and Message The following description applies if the data manager is enabled (DME = 1). A complete telegram includes the following sequences: a preamble, an identifier (ID), the preamble again, a header, the message, and an end-of-message (EOM). These bit sequences are described below. • Preamble: A preamble is required before the ID and before the header. It enables: — In the case of OOK modulation, the AGC to settle, and the data slicer reference voltage to settle if DSREF = 1 — In the case of FSK modulation, the data slicer reference voltage to settle — Clock recovery The preamble content must be defined carefully, to ensure that it will not be decoded as the ID or the header. Figure 8 defines the preamble in OOK and FSK modulation. MC33596 Data Sheet, Rev. 3 18 Freescale Semiconductor Communication Protocol • • • • • ID: The ID allows selection of the correct device in an RF transmission, as the content has been loaded previously in the ID register. Its length is variable, defined by the IDL[1:0] bits. The complement of the ID is also recognized as the identifier. Header: The header specifies the beginning of the message, as it is compared with the HEADER register. Its length is variable, defined by the HDL[1:0] bits. The complement of the header is also recognized as the header, in this case, output data are complemented. The ID and the header are sent at the same data rate as data. Message: Data must follow the header, with no delay. EOM: The message is completed with an end-of-message, consisting of two consecutive NRZ ones or zeroes (i.e., a Manchester code violation). Even in the case of FSK modulation, data must conclude with an EOM, and not simply by stopping the RF telegram. Figure 9 shows a complete message comprising a 6-bit ID and a 4-bit header, followed by two data bits. OOK MODULATION (DSREF = 0) AGC Settling Time Clock Recovery ID 1 NRZ > 200 μs (1) 1 Manchester ‘0’ Symbol at Data Rate OOK MODULATION (DSREF = 1) AGC Settling Time Data Slicer Reference Settling Time Clock Recovery ID 1 NRZ > 200 μs (1) 1 Manchester 0 Symbol at Data Rate (3) At Least 3 Manchester 0 Symbols at Data Rate (2 and 3) FSK MODULATION (DSREF = 1) Data Slicer Reference Settling Time Clock Recovery ID At Least 3 Manchester 0 Symbols at Data Rate (2 and 3) 1 Manchester 0 Symbol at Data Rate (3) NOTES: 1. The AGC settling time pulse can be split over different pulses as long as the overall duration is at least 200 μs. 2. Table 14 defines the minimum number of Manchester symbols required for the data slicer operation versus the data and average filters cut-off frequencies. 3. The Manchester 0 symbol can be replaced by a 1. Figure 8. Preamble Definition 1 Preamble 1 0 0 1 ID 1 0 1 Preamble 1 Header 0 1 0 Data EOM Figure 9. Complete Message Example MC33596 Data Sheet, Rev. 3 Freescale Semiconductor 19 Communication Protocol NOTE It is possible to build a tone to form the detection sequence by programming the ID register with a full sequence of ones or zeroes. In this case, the header (or its complement) must not be found in this tone (i.e., it must not be a full sequence of ones or zeroes). 11.3 Message Protocol When the strobe oscillator is enabled (SOE = 1), the receiver is continuously on/off cycling. The ID must be recognized for the receiver to stay on. Consequently, the transmitted ID burst must be long enough to include two consecutive receiver On cycles. When the strobe oscillator is not enabled (SOE = 0), these timing constraints must be respected by the external control applied to pin STROBE. P+ID RF Signal Receiver Status P+ID = Preamble P+ID ID P+ID On Off On Time Off Time P+Header P+ID P+ID P+ID = Preamble P+Header Header Data EOM On Off ID Detected SPI Output Data Figure 10. Complete Telegram with ID Detection RF Signal Receiver Status SPI Output Tone On Off On Time Off Time Header Data On ID Detected EOM Off Data Figure 11. Complete Telegram with Tone Detection MC33596 Data Sheet, Rev. 3 20 Freescale Semiconductor Data Manager 11.4 Receiver Startup Delay As shown in Figure 12, a settling time is required when entering the on state. Receiver Status Off On Off On Settling Time RF Signal ID ID ID ID ID ID ID ID ID Detected Figure 12. Receiver Usable Window 12 Data Manager In receive mode, Manchester coded data can be processed internally by the data manager. After decoding, the data are output on the digital interface, in SPI format. This minimizes the load on the MCU. The data manager, when enabled (DME = 1), has five purposes: • ID detection: The received identifier is compared with the identifier stored in the ID register. • Header recognition: The received header is compared with the one stored in the HEADER register. • Clock recovery: The clock is recovered during reception of the preamble and is computed from the shortest received pulse. During the reception of the telegram, the recovered clock is constantly updated to the data rate of the incoming signal. • Output data and recovered clock on digital interface: See Section 14.1, “Receive Mode.” • End-of-message detection: An EOM consists of two consecutive NRZ ones or zeroes. Table 8 details some MC33596 features versus DME values. Table 8. the MC33596 Features versus DME 13 DME Digital Interface Use Data Format Output 0 SPI deselected Bit stream No clock MOSI — 1 SPI master when CONFB = 1 Data bytes Recovered clock MOSI SCLK Receiver On/Off Control In receive mode, on/off sequencing can be controlled internally, or managed externally by the MCU through the input pin STROBE. If the internal timer is selected (SOE = 1), MC33596 Data Sheet, Rev. 3 Freescale Semiconductor 21 Receiver On/Off Control • • Off time is clocked by the strobe oscillator, On time is clocked by the crystal oscillator, enabling accurate control of the on time and, therefore, the current consumption of the whole system. Each time is defined with the associated value found in the RXONOFF register. • On time = RON[3:0] x 512 x Tdigclk (see Table 17; begins after the crystal oscillator has started), • Off time = receiver OFF time = N x TStrobe + MIN (TStrobe / 2, receiver On time), with N decoded from ROFF[2:0] (see Table 18). The strobe oscillator is a relaxation oscillator in which an external capacitor C3 is charged by an internal current source (see Figure 43). When the threshold is reached, C3 is discharged and the cycle restarts. The strobe frequency is FStrobe = 1/TStrobe with TStrobe = 106 x C3. In receive mode, setting the STROBE pin to VCCIO at any time forces the circuit on. As VCCIO is above the oscillator threshold voltage, the condition on which the STROBE pin is set to VCCIO is detected internally, and the oscillator pulldown circuitry is disabled. This limits the current consumption. After a strobe forced at “1”, the external driver should pass via a “0” state to discharge the capacitor before going to high impedance state (otherwise, the ON time would last a long time after the driver release). When the strobe oscillator is running (i.e., during an off time), forcing the STROBE pin to VGND stops the strobe clock and, therefore, maintains the circuit off. Figure 13 shows the associated timings. STROBE Threshold STROBE Clock Off Counter STROBE SET TO VCCIO tStrobe 0 0 ROFF-1ROFF Digital Clock On Counter 0 0 RON Receiver Status RON Off On RON Off On Cycling Period Crystal Oscillator Startup Figure 13. Receiver On/Off Sequence MC33596 Data Sheet, Rev. 3 22 Freescale Semiconductor Communication in Receive Mode 14 Communication in Receive Mode 14.1 Receive Mode The MC33596 is master and drives the digital interface in one of two ways, depending on the selection of the data manager. 1. DME = 1: The data manager is enabled. The SPI is master. The MC33596 sends the recovered clock on SCLK and the received data on the MOSI line. Data are valid on falling edges of SCLK. If an entire number of bytes is received, the data manager may add an extra byte. The content of this extra byte is random. If the data received do not fill an entire number of bytes, the data manager will fill the last byte randomly. Figure 14 shows a typical transfer. SEB SCLK (Output) Recovered Clock Updated to Incoming Signal Data Rate MOSI (Output) D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 Figure 14. Typical Transfer in Receive Mode with Data Manager 2. DME = 0: The data manager is disabled. The SPI is deselected. Raw data are sent directly on the MOSI line, while SCLK remains at the low level. 15 Received Signal Strength Indicator (RSSI) 15.1 Module Description In receive mode, a received signal strength indicator can be activated by setting bit RSSIE. The input signal is measured at two different points in the receiver chain by two different means, as follows. • At the IF filter output, a progressive compression logarithmic amplifier measures the input signal, ranging from the sensitivity level up to –50 dBm. • At the LNA output, the LNA AGC control voltage is used to monitor input signals in the range –50 dBm to –20 dBm. Therefore, the logarithmic amplifier provides information relative to the in-band signal, whereas the LNA AGC voltage senses the input signal over a wider band. The RSSI information given by the logarithmic amplifier is available in: • Analog form on pin RSSIOUT • Digital form in the four least significant bits of the status register RSSI MC33596 Data Sheet, Rev. 3 Freescale Semiconductor 23 Received Signal Strength Indicator (RSSI) The information from the LNA AGC is available in digital form in the four most significant bits of status register RSSI. The whole content of status register RSSI provides 2 x 4 bits of RSSI information about the incoming signal (see Section 16.6, “RSSI Register”). Figure 15 shows a simplified block diagram of the RSSI function. The quasi peak detector (D1, R1, C1) has a charge time of about 20 μs to avoid sensitivity to spikes. R2 controls the decay time constant of about 5 ms to allow efficient smoothing of the OOK modulated signal at low data rates. This time constant is useful in continuous mode when S2 is permanently closed. To allow high-speed RSSI updating in peak pulse measurement, a discharge circuit (S1) is required to reset the measured voltage and to allow new peak detection. RSSI Register LNA AGC Out IF Filter Output ADC MSB LSB S2 Σ D1 R1 RSSIOUT C1 R2 S1 C2 Figure 15. RSSI Simplified Block Diagram S2 is used to sample the RSSI voltage to allow peak pulse measurement (S2 used as sample and hold), or to allow continuous transparent measurement (S2 continuously closed). The 4-bit analog-to-digital convertor (ADC) is based on a flash architecture. The conversion time is 16 x Tdiglck. As a single convertor is used for the two analog signals, the RSSI register content is updated on a 32 x Tdigclk timebase. If RSSIE is reset, the whole RSSI module is switched off, reducing the current consumption. The output buffer connected to RSSIOUT is set to high impedance. 15.2 Operation Two modes of operation are available: sample mode and continuous mode. 15.2.1 Sample Mode Sample mode allows the peak power of a specific pulse in an incoming frame to be measured. The quasi peak detector is reset by closing S1. After 7 x Tdigclk, S1 is released. S2 is closed when RSSIC is set high. On the falling edge of RSSIC, S2 is opened. The voltage on RSSIOUT is sampled and held. The last RSSI conversion results are stored in the RSSI register and no further conversion is done. MC33596 Data Sheet, Rev. 3 24 Freescale Semiconductor Received Signal Strength Indicator (RSSI) The RSSI register is updated every 32 x Tdigclk. Therefore, the minimum duration of the high pulse on RSSIC is 32 x Tdigclk. RSSIC 7 x tdigclk S1 Closed Open Closed S2 Open Closed Open RSSI Register Frozen Updated Frozen Sampled and Hold RSSI Voltage RSSIOUT Peak Detector Reset Sampling CONFB MOSI CMD RSSI Value MISO Figure 16. RSSI Operation in Sample Mode MC33596 Data Sheet, Rev. 3 Freescale Semiconductor 25 Configuration, Command, and Status Registers 15.2.2 Continuous Mode Continuous mode is used to make a peak measurement on an incoming frame, without having to select a specific pulse to be measured. The quasi peak detector is reset by closing S1. After 7 x Tdigclk, S1 is opened. S2 is closed when RSSIC is set high. As long as RSSIC is kept high, S2 is closed, and RSSIOUT follows the peak value with a decay time constant of 5 ms. The ADC runs continuously, and continually updates the RSSI register. Thus, reading this register gives the most recent conversion value, prior to the register being read. The minimum duration of the high pulse on CONFB is 32 x Tdigclk. RSSIC 5 x tdigclk S1 S2 RSSI Register Closed Open Open Closed Frozen Updated Frozen Updated Frozen RSSIOUT Peak Detector Test CONFB MOSI MISO CMD CMD RSSI RSSI Figure 17. RSSI Operation in Continuous Mode 16 Configuration, Command, and Status Registers This section discusses the internal registers, which are composed of two classes of bits. • Configuration and command bits allow the MC33596 to operate in a suitable configuration. • Status bits report the current state of the system. All registers can be accessed by the SPI; these registers are described below. At power-on, the POR resets all registers to a known value (in the shaded rows in the following tables). This defines the MC33596’s default configuration. After POR, CONFB forces a low level. Therefore, an external pullup resistor is required to avoid entering configuration mode. MC33596 Data Sheet, Rev. 3 26 Freescale Semiconductor Configuration, Command, and Status Registers 16.1 Configuration Registers Figure 18 describes configuration register 1, CONFIG1. Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Addr Bit Name LOF1 LOF0 CF1 CF0 RESET SL LVDE CLKE $00 Reset Value 1 0 0 1 0 0 0 1 Figure 18. CONFIG1 Register Table 9. LOF[1:0] and CF[1:0] Setting Versus Carrier Frequency Carrier Frequency LOF1 LOF0 CF1 CF0 304 MHz 0 0 0 0 315 MHz 1 0 0 0 426 MHz 0 1 0 1 434 MHz 0 1 0 1 868 MHz 0 1 1 1 915 MHz 1 1 1 1 RESET is a global reset. The bit is cleared internally, after use. 0 = no action 1 = reset all registers and counters SL (Switch Level) selects the active level of the SWITCH output pin. Table 10. Active Level of SWITCH Output Pin SL Receiver Function Level on SWITCH 0 Receiving Low Other High Other Low Receiving High 1 LVDE (Low Voltage Detection Enable) enables the low voltage detection function. 0 = disabled 1 = enabled NOTE This bit is cleared by POR. In the event of a complete loss of the supply voltage, LVD is disabled at power-up, but the information is not lost as the status bit LVDS is set by POR. CLKE (Clock Enable) controls the DATACLK output buffer. 0 = DATACLK remains low 1 = DATACLK outputs Fdataclk MC33596 Data Sheet, Rev. 3 Freescale Semiconductor 27 Configuration, Command, and Status Registers Figure 19 describes configuration register 2, CONFIG2. Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Addr Bit Name DSREF FRM MODU DR1 DR0 TRXE DME SOE $01 Reset Value 0 0 0 1 0 0 0 0 Figure 19. CONFIG2 Register DSREF (Data Slicer Reference) selects the data slicer reference. 0 = Fixed reference (cannot be used in FSK) 1 = Adaptive reference (recommended for maximum sensitivity in OOK and FSK) In the case of FSK modulation (MODU = 1), DSREF must be set. FRM (Frequency Register Manager) enables either a user friendly access to one frequency register or a direct access to the two frequency registers. 0 = The carrier frequency and the FSK deviation are defined by the F register 1 = The local oscillator frequency and the two carrier frequencies are defined by two frequency registers, F and FT. MODU (Modulation) sets the data modulation type. 0 = On/Off Keying (OOK) modulation 1 = Frequency Shift Keying (FSK) modulation DR[1:0] (Data Rate) configure the receiver blocks operating in base band. • Low-pass data filter • Low-pass average filter generating the data slicer reference, if DSREF is set • Data manager Table 11. Base Band Parameter Configuration Data Filter Cut-off Frequency Average Filter Cut-off Frequency 0 6 kHz 0.5 kHz 2–2.8 kBd 1 12 kHz 1 kHz 4–5.6 kBd 1 0 24 kHz 2 kHz 8–10.6 kBd 1 1 48 kHz 4 kHz 16–22.4 kBd DR1 DR0 0 0 Data Manager Data Rate Range If the data manager is disabled, the incoming signal data rate must be lower than or equal to the data manager maximum data rate. TRXE (Receiver Enable) enables the whole receiver. 0 = standby mode 1 = other modes can be activated DME (Data Manager Enable) enables the data manager. 0 = disabled 1 = enabled MC33596 Data Sheet, Rev. 3 28 Freescale Semiconductor Configuration, Command, and Status Registers SOE (Strobe Oscillator Enable) enables the strobe oscillator. 0 = disabled 1 = enabled Figure 20 describes configuration register 3, CONFIG3. Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Addr Bit Name AFF1 AFF0 OLS LVDS ILA1 ILA0 - - $02 Reset Value 0 0 1 1 0 0 0 0 Figure 20. CONFIG3 Register OLS (Out of Lock Status) indicates the current status of the PLL. 0 = The PLL is in lock-in range 1 = The PLL is out of lock-in range LVDS (Low Voltage Detection Status) indicates that a low voltage event has occurred when LVDE = 1. This bit is read-only and is cleared after a read access. 0 = No low voltage detected 1 = Low voltage detected ILA[1:0] (Input Level Attenuation) define the RF input level attenuation. Table 12. RF Input Level Attenuation ILA1 ILA0 RF Input Level Attenuation See Parameter Number 0 0 0 dB 2.5 0 1 8 dB 2.6 1 0 16 dB 2.7 1 1 30 dB 2.8 Values in Table 12 assume the LNA gain is not reduced by the AGC. AFF[1:0] (Average Filter Frequency) define the average filter cut-off frequency if the AFFC bit is set. Table 13. Average Filter Cut-off Frequency AFF1 AFF0 Average Filter Cut-off Frequency 0 0 0.5 kHz 0 1 1 kHz 1 0 2 kHz 1 1 4 kHz If AFFC is reset, the average filter frequency is directly defined by bits DR[1:0], as shown in Table 11. MC33596 Data Sheet, Rev. 3 Freescale Semiconductor 29 Configuration, Command, and Status Registers If AFFC is set, AFF[1:0] allow the overall receiver sensitivity to be improved by reducing the average filter cut-off frequency. The typical preamble duration of three Manchester zeroes or ones at the data rate must then be increased, as shown in Table 14. Table 14. Minimum Number of Manchester Symbols in Preamble versus DR[1:0] and AFF[1:0] DR[1:0] 00 01 10 11 00 3 6 12 24 01 — 3 6 12 10 — — 3 6 11 — — — 3 AFF[1:0] 16.2 Command Register Figure 21 describes the Command register, COMMAND. Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Addr Bit Name AFFC IFLA — RSSIE EDD RAGC FAGC — $03 Reset Value 0 0 0 0 1 0 0 1 Figure 21. COMMAND Register AFFC (Average Filter Frequency Control) enables direct control of the average filter cut-off frequency. 0 = Average filter cut-off frequency is defined by DR[1:0] 1 = Average filter cut-off frequency is defined by AFF[1:0] IFLA (IF Level Attenuation) controls the maximum gain of the IF amplifier in OOK modulation. 0 = No effect 1 = Decreases by 20 dB (typical) the maximum gain of the IF amplifier, in OOK modulation only The reduction in gain can be observed if the IF amplifier AGC system is disabled (by setting RAGC = 1). RSSIE (RSSI Enable) enables the RSSI function. 0 = Disabled 1 = Enabled EDD (Envelop Detector Decay) controls the envelop detector decay. 0 = Slow decay for minimum ripple 1 = Fast decay RAGC (Reset Automatic Gain Control) resets both receiver internal AGCs. 0 = No action 1 = Sets the gain to its maximum value MC33596 Data Sheet, Rev. 3 30 Freescale Semiconductor Configuration, Command, and Status Registers A first SPI access allows RAGC to be set; a second SPI access is required to reset it. FAGC (Freeze Automatic Gain Control) freezes both receiver AGC levels. 0 = No action 1 = Holds the gain at its current value 16.3 Frequency Register Figure 22 defines the Frequency register, F. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Addr Bit Name — — — — F11 F10 F9 F8 $04 Reset Value 0 1 0 0 1 0 0 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bit Name F7 F6 F5 F4 F3 F2 F1 F0 Reset Value 0 0 0 0 0 0 0 0 $05 Figure 22. F Register How this register is used is determined by the FRM bit, which is described below. FRM = 0 (User Friendly Access) Bits F[11:0] define the carrier frequency Fcarrier. The local oscillator frequency FLO is then set automatically to Fcarrier + FIF (with FIF = intermediate frequency). FRM = 1 (Direct Access) F[11:0] defines the receiver local oscillator frequency FLO Table 15 defines the value to be binary coded in the frequency registers F[11;0], versus the desired frequency value F (in Hz). Table 15. Frequency Register Value versus Frequency Value F CF[1:0] Frequency Register Value 00, 01 (2 x F/Fref-35) x 2048 11 (F/Fref-35) x 2048 Conversely, Table 16 gives the desired frequency F and the frequency resolution versus the value of the frequency registers F[11;0]. Table 16. Frequency Value F versus Frequency Register Value CF[1:0] Frequency (Hz) Frequency Resolution (Hz) 00, 01 (35 + F[11;0]/2048)xFref/2 Fref/4096 11 (35 + F[11;0]/2048)xFref Fref/2048 MC33596 Data Sheet, Rev. 3 Freescale Semiconductor 31 Configuration, Command, and Status Registers 16.4 Receiver On/Off Duration Register Figure 23 describes the receiver on/off duration register, RXONOFF. Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Addr Bit Name — RON3 RON2 RON1 RON0 ROFF2 ROFF1 ROFF0 $09 Reset Value 0 1 1 1 1 1 1 1 Figure 23. RXONOFF Register RON[3:0] (Receiver On) define the receiver on time (after crystal oscillator startup) as described in Section 13, “Receiver On/Off Control.” Table 17. Receiver On Time Definition RON[3:0] Receiver On Time: N x 512 x Tdigclk 0000 Forbidden value 0001 1 0010 2 ... ... 1111 15 ROFF[2:0] (Receiver Off) define the receiver off time as described in Section 13, “Receiver On/Off Control.” Table 18. Receiver Off Time Definition ROFF[2:0] Receiver Off Time: N x TStrobe 000 1 001 2 010 4 011 8 100 12 101 16 110 32 111 63 16.5 ID and Header Registers Figure 24 defines the ID register, ID. Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Addr Bit Name IDL1 IDL0 ID5 ID4 ID3 ID2 ID1 ID0 $0A Reset Value 1 1 0 0 0 0 0 0 Figure 24. ID Register IDL[1:0] (Identifier Length) sets the length of the identifier, as shown on Table 19. MC33596 Data Sheet, Rev. 3 32 Freescale Semiconductor Configuration, Command, and Status Registers Table 19. ID Length Selection IDL1 IDL0 ID Length 0 0 2 bits 0 1 4 bits 1 0 5 bits 1 1 6 bits ID[5:0] (Identifier) sets the identifier. The ID is Manchester coded. Its LSB corresponds to the register’s LSB, whatever the specified length. Figure 25 defines the Header register, HEADER. Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Addr Bit Name HDL1 HDL0 HD5 HD4 HD3 HD2 HD1 HD0 $0B Reset Value 1 0 0 0 0 0 0 0 Figure 25. HEADER Register HDL[1:0] (Header Length) sets the length of the header, as shown on Table 20. Table 20. Header Length Selection HDL1 HDL0 HD Length 0 0 1 bits 0 1 2 bits 1 0 4 bits 1 1 6 bits HD[5:0] (Header) sets the header. The header is Manchester coded. Its LSB corresponds to the register’s LSB, whatever the specified length. 16.6 RSSI Register Figure 26 describes the RSSI Result register, RSSI. Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Addr Bit Name RSSI7 RSSI6 RSSI5 RSSI4 RSSI3 RSSI2 RSSI1 RSSI0 $0C Reset Value 0 0 0 0 0 0 0 0 Figure 26. RSSI Register Bits RSSI[7:4] contain the result of the analog-to-digital conversion of the signal measured at the LNA output. Bits RSSI[3:0] contain the result of the analog-to-digital conversion of the signal measured at the IF filter output. MC33596 Data Sheet, Rev. 3 Freescale Semiconductor 33 Controller 17 Controller This section describes how the MC33596 controller executes sequences of operations, relative to the selected mode. The controller is a finite state machine, clocked at Tdigclk. An overview is presented in Figure 27 (note that some branches refer to other diagrams that provide more detailed information). There are three different modes: configuration, receive, and standby/LVD. Each mode is exclusive and can be entered in different ways, as follows. • External signal: CONFB for configuration mode, • External signal and configuration bits: CONFB and TRXE for all other modes, • External signal and internal conditions: see Figure 31 and Figure 33 for information on how to enter standby/LVD mode. After a POR, the circuit is in state 60 (see Figure 27) and configuration registers’ content is set to the reset value. At any time, a low level applied to CONFB forces the finite state machine into state 1, whatever the current state. This is not always shown in state diagrams, but must always be considered. Active Bank Change (A to B or B to A) CONFB = 0 SPI Deselected SPI Slave Configuration Mode Mode Configuration Standby/LVD Mode State 60 SPI Master CONFB = 1, TRXE = 0, and STROBE = 0 Power-on Reset State 1 CONFB = 1, TRXE = 1, and STROBE = 0 …and SOE = 1 See Figure 30 Receive Mode …and DME = 1 …and DME = 0 …and SOE = 0 See Figure 31 …and SOE = 1 See Figure 32 …and SOE = 0 See Figure 33 Figure 27. State Machine Overview 17.1 Configuration Mode The configuration mode is selected by the microcontroller unit (MCU) to write to the internal registers (to configure the system) or to read them. In this mode, the SPI is a slave. The analog parts (receiver) remain in the state (on, off) they were in prior to entering configuration mode, until a new configuration changes them. In configuration mode, data can be neither sent nor received. As long as a low level is applied to CONFB, the circuit stays in State 1, the only state in this mode. Figure 28 and Figure 29 describe the two valid sequences for enabling a correct transition from Standby/LVD mode to configuration mode. MC33596 Data Sheet, Rev. 3 34 Freescale Semiconductor Controller STROBE CONFB SPI Startup Time SEB Figure 28. First Valid Sequence from Standby/LVD Mode to Configuration Mode STROBE CONFB SPI Startup Time 10 μs (Maximum) SEB Figure 29. Second Valid Sequence from Standby/LVD Mode to Configuration Mode 17.2 Receive Mode The receiver is either waiting for an RF telegram, or is receiving one. Four different processes are possible, as determined by the values of the DME and SOE bits. A state diagram describes the sequence of operations in each case. NOTE If the STROBE pin is tied to a high level before switching to receive mode, the receiver does not go through an off or standby state. 17.2.1 Data Manager Disabled and Strobe Oscillator Enabled Raw received data are sent directly on the MOSI line. Figure 30 shows the state diagram. SPI Deselected STROBE = 0 STROBE = 0 STROBE = 1 State 0 Off Off Counter = ROFF[2:0] or STROBE = 1 On Counter = RON[3:0] and STROBE ≠ 1 State 0b On Raw Data on MOSI Figure 30. Receive Mode, DME = 0, SOIE = 1 State 0: The receiver is off, but the strobe oscillator and the off counter are running. Forcing the STROBE pin low maintains the system in this state. MC33596 Data Sheet, Rev. 3 Freescale Semiconductor 35 Controller State 0b: The receiver is kept on by the STROBE pin or the on counter. Raw data are output on the MOSI line. For all states: At any time, a low level applied to CONFB forces the state machine to state 1. 17.2.2 Data Manager Disabled and Strobe Pin Control Raw received data are sent directly on the MOSI line. Figure 31 shows the state diagram. SPI Deselected STROBE = 0 STROBE = 1 State 5 Standby/LVD STROBE = 1 STROBE = 0 State 5b On Raw Data on MOSI Figure 31. Receive Mode, DME = 0, SOE = 0 State 5: The receiver is in standby/LVD mode. For further information, see Section 17.3, “Standby/LVD Mode.” A high level applied to STROBE forces the circuit to state 5b. State 5b: The receiver is kept on by the STROBE pin. Raw data are output on the MOSI line. For all states: At any time, a low level applied to CONFB forces the state machine to state 1. 17.2.3 Data Manager Enabled and Strobe Oscillator Enabled Figure 32 shows the state diagram when the data manager and the strobe oscillator are enabled. in this configuration, the receiver is controlled internally by the strobe oscillator. However, external control via the STROBE pin is still possible, and overrides the strobe oscillator command. State 10: The receiver is off, but the strobe oscillator and the off counter are running. Forcing STROBE pin to the low level maintains the system in this state. State 11: The receiver is waiting for a valid ID. If an ID, or its complement, is detected, the state machine advances to state 12; otherwise, the circuit goes back to state 10 at the end of the RON time, if STROBE≠1. State 12: An ID or its complement has been detected. The data manager is now waiting for a header or its complement. If neither a header, nor its complement, has been received before a time-out of 256 bits at data rate, the system returns to state 10. State 13: A header, or its complement, has been received. Data and clock signals are output on the SPI port until EOM indicates the end of the data sequence. If the complement of the header has been received, output data are complemented also. MC33596 Data Sheet, Rev. 3 36 Freescale Semiconductor Controller When an EOM occurs before the current byte is fully shifted out, dummy bits are inserted until the number of shifted bits is a multiple of 8. For all states: At any time, a low level applied to STROBE forces the circuit to state 10, and a low level applied on CONFB forces the state machine to state 1. SPI Master STROBE = 0 STROBE = 0 State 10 Off STROBE = 1 Off Counter = ROFF[2:0] or STROBE = 1 On Counter = RON[3:0] and STROBE ≠ 1 State 11 On Waiting For a Valid ID ID Detected Time Out State 12 On Waiting for a Valid Header EOM Received and STROBE = 1 Header Received State 13 On Output Data and Clock Waiting for End of Message EOM Received and STROBE ≠ 1 Figure 32. Receive Mode, DME = 1, SOE = 1 MC33596 Data Sheet, Rev. 3 Freescale Semiconductor 37 Controller 17.2.4 Data Manager Enabled and Strobe Pin Control Figure 33 shows the state diagram when the data manager is enabled and the strobe oscillator is disabled. In this configuration, the receiver is controlled only externally by the MCU. SPI Master STROBE = 0 SPI Deselected State 20 Standby/LVD STROBE = 1 STROBE = 1 STROBE = 0 State 21 On Waiting For a Valid ID ID Detected STROBE = 0 State 22 On Waiting for a Valid Header EOM Received and STROBE = 1 Header Received State 23 On Output Data and Clock Waiting for End of Message EOM Received and STROBE = 0 Figure 33. Receive Mode, DME = 1, SOE = 0 State 20: The receiver is in standby/LVD mode. For further information, see Section 17.3, “Standby/LVD Mode.” A high level applied to STROBE forces the circuit to state 21. State 21: The circuit is waiting for a valid ID. If an ID, or its complement, is detected, the state machine advances to state 22; if not, the state machine will remain in state 21, as long as STROBE is high. State 22: If a header, or its complement, is detected, the state machine advances to state 23. If not, the state machine will remain in state 22, as long as STROBE is high. State 23: A header or its complement has been received; data and clock signals are output on the SPI port until an EOM indicates the end of the data sequence. If the complement of the header has been received, MC33596 Data Sheet, Rev. 3 38 Freescale Semiconductor Controller output data are complemented also. When an EOM occurs before the current byte is fully shifted out, dummy bits are inserted until the number of shifted bits is a multiple of 8. For all states: At any time, a low level applied to STROBE puts the circuit into state 20, and a low level applied to CONFB forces the state machine to state 1. 17.3 Standby/LVD Mode Standby/LVD mode allows minimum current consumption to be achieved. Depending upon the value of the LVDE bit, the circuit is in standby mode (state 60) or LVD mode (state 5 and 20). LVDE = 0: The receiver is in standby; consumption is reduced to leakage current (current state after POR). LVDE = 1: The LVD function is enabled; consumption is in the range of tens of microamperes. The only way to exit this mode is to go back to configuration mode by applying a low level to CONFB. 17.4 Transition Time Table 21 details the different times that must be considered for a given transition in the state machine, once the logic conditions for that transition are met. Table 21. Transition Time Definition Transition State x -> y Crystal Oscillator Startup Time, Parameter 5.10 Standby to SPI running, state 60 -> 1 Standby to receiver running, states 5 -> 5b, 20 -> 21 √ √ Off to receiver running, states 0 -> 0b, 10 -> 11 √ Configuration to receiver running, states 1 -> (0b, 5b, 11, 21) PLL Timing Lock time parameter 5.9 Lock time parameter 5.9 0 or lock time parameter 5.1 or lock time parameter 5.9 2 Receiver running to configuration mode, state (0b, 5b, 11, 12, 13, 21, 22, 23) -> 1, Receiver running to standby mode, state 5b -> 5, (21, 22, 23) -> 20 Receiver running to off mode, state 0b -> 0, (11, 12, 13) -> 10 Receiver Receiver Preamble On-to-Off Time, Parameter 1.12 Time1 √ √ √ √ √ NOTES: 1 See Section 11.2, “Preamble, Identifier, Header, and Message.” 2 Depending on the PLL status before entering configuration mode. For example, the transition time from standby to receiver running (FSK modulation, 19.2 kBd, AFFC = 0, data manager enabled) is: 0.6 ms + 50 µs + (3 + 1)/19.2k = 970 µs. MC33596 Data Sheet, Rev. 3 Freescale Semiconductor 39 Electrical Characteristics 18 Electrical Characteristics 18.1 General Parameters Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application schematic (see Figure 43), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25°C. Parameter Limits Test Conditions Comments Unit Min Typ Max 1.2 Supply current in receive mode Receiver on — 10.3 13 mA 1.3 Strobe oscillator only — 24 50 μA 1.6 Supply current in standby mode –40°C ≤ TA ≤ 25°C — 260 700 nA 1.8 TA = 85°C — 800 1200 nA 1.9 Supply current in LVD mode LVDE = 1 — 35 50 μA 1.12 Receiver on-to-off time Supply current reduced to 10% — 100 — μs 1.13 VCC2 voltage regulator output 2.7 V < VCC 2.4 2.6 2.8 V 1.14 2.1 V ≤ VCC ≤ 2.7 V — VCC–0.1 — V 1.15 VCCDIG2 voltage regulator output Circuit in standby mode (VCCDIG = 3 V) — 0.7 x VCCDIG — V 1.16 Circuit in all other modes 1.4 1.6 1.8 V 1.19 Voltage on VCC (Preregulator output) Receive mode with VCCIN=5V 2.4 — — V 18.2 Receiver: RF Parameters RF parameters assume a matching network between test equipment and the D.U.T, and apply to all bands unless otherwise specified. Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application schematic (see Figure 43), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25°C. Limits Test Conditions, Comments Typ Max (FCE, FJE) Max (FCAE, FJAE) Unit Min 2.2 OOK sensitivity at 315 MHz DME = 1, DSREF = 1, DR = 4.8 kbps, PER = 0.1 — –104 –99 –97 dBm 2.40 OOK sensitivity at 434 MHz DME = 1, DSREF = 1, DR = 4.8 kbps, PER = 0.1 — –103.5 –98 –96 dBm 2.41 OOK sensitivity at 868 MHz DME = 1, DSREF = 1, DR = 4.8 kbps, PER = 0.1 — –103 –98 –96 dBm 2.42 OOK sensitivity at 916 MHz DME = 1, DSREF = 1, DR = 4.8 kbps, PER = 0.1 — –103 –98 –96 dBm Parameter MC33596 Data Sheet, Rev. 3 40 Freescale Semiconductor Electrical Characteristics Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application schematic (see Figure 43), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25°C. Limits Parameter Test Conditions, Comments Typ Max (FCE, FJE) Max (FCAE, FJAE) Unit Min 2.24 FSK sensitivity at 315 MHz DME = 1, DSREF = 1, DR = 4.8 kbps, DFcarrier = ±64 kHz, PER = 0.1 — –106.5 –102 –100 dBm 2.50 FSK sensitivity at 434 MHz DME = 1, DSREF = 1, DR = 4.8 kbps, DFcarrier = ±64 kHz, PER = 0.1 — –105.5 –101 –99 dBm 2.51 FSK sensitivity at 868 MHz DME = 1, DSREF = 1, DR = 4.8 kbps, DFcarrier = ±64 kHz, PER = 0.1 — –104.5 –100 –98 dBm 2.52 FSK sensitivity at 916 MHz DME = 1, DSREF = 1, DR = 4.8 kbps, DFcarrier = ±64 kHz, PER = 0.1 — –105.4 –102 –100 dBm 2.35 Sensitivity improvement in RAW mode DME = 0 — 0.6 — — dB 2.5 Sensitivity reduction ILA[1:0] = 00 — 0 — — dB 2.6 ILA[1:0] = 01 — 8 — — dB 2.7 ILA[1:0] = 10 — 16 — — dB 2.8 ILA[1:0] = 11 — 30 — — dB 2.9 In-band jammer desensitization Sensitivity reduced by 3 dB CW jammer at Fcarrier ± 50 kHz/OOK — –4 — — dBc 2.60 Sensitivity reduced by 3 dB CW jammer at Fcarrier ± 50 kHz/FSK — –6 — — dBc 2.11 Out-of-band jammer desensitization Sensitivity reduced by 3dB CW jammer at Fcarrier ±1 MHz — 37 — — dBc 2.12 Sensitivity reduced by 3dB CW jammer at Fcarrier ± 2 MHz — 40 — — dBc 2.13 RFIN parallel resistance Receive mode — 300 — — Ω 2.14 RFIN parallel resistance Standby mode 1300 — — — Ω 2.15 RFIN parallel capacitance Receive mode — 1.2 — — pF 2.17 Maximum detectable signal, Modulation depth: 99%, OOK level measured on a NRZ ‘1’ –25 — — — dBm 2.25 Maximum detectable signal, ΔFcarrier = ±64kHz FSK -10 — — — dBm 2.18 Image frequency rejection 304–434 MHz 20 36 — — dB 2.19 868–915 MHz 15 20 — — dB MC33596 Data Sheet, Rev. 3 Freescale Semiconductor 41 Electrical Characteristics OOK Sensitivity Variation vs Temperature (Ref : 3V, 25°C, 4800bps) 1.4 Sensitivity Variation (dB) 1.2 1 315 MHz 434 MHz 0.8 868 MHz 0.6 916 MHz 0.4 0.2 0 -0.2 -0.4 -40°C 25°C Temperature (°C) 85°C Figure 34. OOK Sensitivity Variation Versus Temperature OOK Sensitivity Variation vs Voltage (Ref : 3V, 25°C, 4800bps) 0.2 Sensitivity Variation (dB) 0.1 0 -0.1 -0.2 315 MHz -0.3 434 MHz 868 MHz -0.4 -0.5 2.1 V 916 MHz 2.4 V Voltage (V) 3V 3.6 V Figure 35. OOK Sensitivity Variation Versus Voltage MC33596 Data Sheet, Rev. 3 42 Freescale Semiconductor Electrical Characteristics FSK Sensitivity Variation vs Temperature (Ref : 3V, 25°C, +/-64kHz, 4800 bps ) 1.4 Sensitivity Variation (dB) 1.2 1 315 MHz 0.8 434 MHz 868 MHz 0.6 916 MHz 0.4 0.2 0 -0.2 -0.4 -0.6 -40°C 25°C Temperature (°C) 85°C Figure 36. FSK Sensitivity Variation Versus Temperature FSK Sensitivity Variation vs Voltage (Ref : 3V, 25°C, +/-64kHz, 4800bps ) 0.5 0.4 Sensitivity Variaition (dB) 315 MHz 434 MHz 0.3 868 MHz 916 MHz 0.2 0.1 0 -0.1 -0.2 2.1 V 2.4 V Voltage (V) 3V 3.6 V Figure 37. FSK Sensitivity Variation Versus Voltage MC33596 Data Sheet, Rev. 3 Freescale Semiconductor 43 Electrical Characteristics Sensitivity Variation Versus Data Rate (Ref : 25°C, 3V, 434MHz , OOK, 4800bps) 5 Sensitivity Variation (dB) 4 3 2 1 0 -1 -2 -3 2400 4800 9600 19200 Data Rate (bps) Figure 38. OOK Sensitivity Variation Versus Data Rate Sensitivity Variation vs Data Rate (Ref : 25°C, 3V, 434MHz , FSK +/-64kHz, 4800bps) 5 Sensitivity Variation (dB) 4 3 2 1 0 -1 -2 -3 2400 4800 9600 19200 Data Rate (bps) Figure 39. FSK Sensitivity Variation Versus Data Rate MC33596 Data Sheet, Rev. 3 44 Freescale Semiconductor Electrical Characteristics Sensitivity Variation vs Frequency Deviation (Ref : 25°C, 3V, 434MHz, FSK +/-64kHz, 4800bps) 6 Sensitivity Variation (dB) 5 4 3 2 1 0 -1 20 32 40 50 65 70 80 90 100 110 120 130 140 150 Frequency Deviation (kHz) 160 170 Figure 40. FSK Sensitivity Variation Versus Frequency Deviation 18.3 Receiver Parameters Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application schematic (see Figure 43), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25°C. Parameter Test Conditions Comments Limits Unit Min Typ Max Receiver: IF filter, IF Amplifier, FM-to-AM Converter and Envelope Detector 3.1 IF center frequency — 1.5 — MHz 3.2 IF bandwidth at –3dB — 380 — kHz 3.3 IF cut-off low frequency at –3 dB Refer to Section 9, “Frequency Planning”. 3.4 IF cut-off high frequency at –3 dB — — 1.387 MHz 1.635 — — MHz — 15 — ms 3.12 Recovery time from strong signal OOK modulation, 2.4 kbps, FAGC = 0, input signal from –50 dBm to –100 dBm MC33596 Data Sheet, Rev. 3 Freescale Semiconductor 45 Electrical Characteristics Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application schematic (see Figure 43), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25°C. Parameter Test Conditions Comments Limits Unit Min Typ Max 380 — 650 mV 3.52 Analog RSSI output signal for Input signal @–100 dBm 420 — 700 mV 3.53 Analog RSSI output signal for Input signal @–70 dBm 850 — 1200 mV 3.54 Analog RSSI output signal for Input signal @–28 dBm 1000 — 1300 mV 0 — 2 3.56 Digital RSSI Registers for Input signal @–100 dBm 0 — 3 3.57 Digital RSSI Registers for Input signal @–70 dBm 9 — 13 3.58 Digital RSSI Registers for Input signal @–28 dBm 13 — 16 0 — 2 3.6 Digital RSSI Registers for Input signal @–50 dBm 4 — 8 3.61 Digital RSSI Registers for Input signal @–24 dBm 13 — 15 Receiver: Analog and Digital RSSI 3.51 Analog RSSI output signal for Input signal @–108 dBm 3.55 Digital RSSI Registers for Input signal @–108 dBm 3.59 Digital RSSI Registers for Input signal @–70 dBm Measured on RSSIOUT RSSI [0:3] RSSI [4:7] 18.4 PLL & Crystal Oscillator Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application schematic (see Figure 43), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25°C. Parameter Test Conditions Comments Limits Unit Min Typ Max 5.9 PLL lock time RF frequency ±25kHz — 50 100 μs 5.1 Toggle time between 2 frequencies RF frequency step <1.5MHz, RF frequency ±25kHz — 30 — μs 5.10 Crystal oscillator startup time — 0.6 1.2 ms 5.8 Crystal series resistance — — 120 Ω MC33596 Data Sheet, Rev. 3 46 Freescale Semiconductor Electrical Characteristics 18.5 Strobe Oscillator (SOE = 1) Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application schematic (see Figure 43), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25°C. Limits Test Conditions Comments Parameter Unit Min Typ Max 0.1 — — ms 0.1 — 10 nF — 1 — μA 6.4 High threshold voltage — 1 — V 6.5 Low threshold voltage — 0.5 — V –14.2 — 15.8 % 6.1 Period range TStrobe = 106.C3 6.2 External capacitor C3 6.3 Sourced/sink current 6.6 Overall timing accuracy With 1% resistor R13 With 1% resistor R13 & 5% capacitor C3, ±3 sigma variations 18.6 Digital Input: CONFB, MOSI, SCLK, SEB, STROBE, RSSIC Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application schematic (see Figure 43), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25°C. Parameter Limits Test Conditions Comments Unit Min Typ Max — — 0.4 x VCC2 V 0.8 x VCC2 — — V 0.1 x VCC2 — — V — — 0.4 x VCCDIG2 V 7.11 Input high voltage 0.8 x VCCDIG2 — — V 7.12 Input hysteresis 0.1 x VCCDIG2 — — V 1 — 100 nA 0.5 — 10 nA 7.7 Input low voltage MOSI, SCLK, SEB, RSSIC(1) 7.8 Input high voltage 7.9 Input hysteresis 7.10 Input low voltage CONFB, STROBE2 7.5 Sink current Configuration, receive, modes 7.6 standby or LVD modes NOTES: 1 Input levels of those pins are referenced to V CC2 which depends upon VCC (see Section 6, “Power Supply”). 2 Input levels of those pins are referenced to V CCDIG2 which depends upon the circuit state (see Section 6, “Power Supply”). MC33596 Data Sheet, Rev. 3 Freescale Semiconductor 47 Electrical Characteristics 18.7 Digital Output Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application schematic (see Figure 43), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25°C. Parameter Limits Test Conditions Comments Unit Min Typ Max Digital Output: DATACLK, LVD, MISO, MOSI, SCLK 8.1 Output low voltage |ILOAD| = 50 μA 8.2 Output high voltage 8.3 Fall and rise time — — 0.2 x VCCIO V 0.8 x VCCIO — — V — 80 150 ns — — 0.2 x VCC V 0.8 x VCC — — V From 10% to 90% of the output swing, CLOAD = 10pF Digital Output: SWITCH (VCC = 3V) 8.4 Output low voltage |ILOAD| = 50 μA 8.5 Output high voltage 18.8 Digital Interface Timing Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application schematic (see Figure 43), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25°C. Parameter Limits Test Conditions Comments Unit Min Typ Max 9.2 SCLK period 1 — — μs 9.8 Configuration enable time 20 — — s 3 x Tdigclk — — ns 100 — — ns 100 — — 1 ns 3 x Tdigclk — — s — — 100 ns 9.3 Enable lead time If crystal oscillator is running, if not see page 15 for entering into configuration 9.4 Enable lag time 9.5 Sequential transfer delay 9.6 Data hold time Receive mode, DME = 1, from SCLK to MOSI 9.7 Data setup time Configuration mode, from SCLK to MISO 9.9 Configuration mode, from SCLK to MOSI 120 — — ns 9.10 Data setup time Configuration mode, from SCLK to MOSI 100 — — ns NOTES: 1 The digital interface can be used in SPI burst protocol, i.e., with a continuous clock on SCLK port. For example, one (or more) read access followed by one (or more) write access and so on. In this case and for a practical use, the pulse required on CONFB between accesses must be less than one digital clock period Tdigclk. MC33596 Data Sheet, Rev. 3 48 Freescale Semiconductor Electrical Characteristics SEB 9.8 CONFB 9.3 9.5 9.4 SCLK (input) 9.2 9.10 9.9 MOSI (input) 9.7 MISO (output) Figure 41. Digital Interface Timing Diagram in Configuration Mode SEB CONFB 9.3 SCLK (input) 9.6 MOSI (output) Figure 42. Digital Interface Timing Diagram in Receive Mode (DME = 1) Examples of crystal characteristics are given in Table 22. Table 22. Typical Crystal Reference and Characteristics Reference & Type 315 MHz 434 MHz 868 MHz LN-G102-1183 NX5032GA LN-G102-1182 NX5032GA EXS00A-01654 NX5032GA Unit 17.5814 24.19066 24.16139 MHz Load capacitance 8 8 8 pF ESR 25 15 <70 Ω Parameter Frequency MC33596 Data Sheet, Rev. 3 Freescale Semiconductor 49 Application Schematics 19 Application Schematics RSSIOUT C3 1 nF STROBE VCC2 C7 SWITCH 5V C8 25 GNDIO 26 VCCIN 27 NC 28 STROBE 29 GNDSUBD 30 VCC2IN 31 VCC2VCO GND C35 C29 VCC2 C30 23 22 21 CONFB DATACLK 19 RSSIC 18 GNDDIG 17 SEB SCLK MOSI MISO CONFB DATACLK GND RSSIC 16 10 9 C24 X1 RBGAP GND 24 20 NC XTALIN 8 MISO U14 MC33596 VCCDIG2 7 GNDLNA 15 6 MOSI 14 5 RFIN VCCDIG 4 SCLK 13 C22 VCC2 SEB VCC2RF VCC2OUT C40 3 12 C6 VCCINOUT C39 2 RSSIOUT 11 L7 1 XTAL0UT VCC2 C20 J1 SNA Vert SWITCH GND 32 GND R13 C31 Figure 43. MC33596 Application Schematic (5 V) 19.1 PCB Design Recommendations Pay attention to the following points and recommendations when designing the layout of the PCB. • Ground Plane — If you can afford a multilayer PCB, use an internal layer for the ground plane, route power supply and digital signals on the last layer, RF components being located on the first layer. — Use at least a double-sided PCB. — Use a large ground plane on the opposite layer. — If the ground plane must be cut on the opposite layer for routing some signals, maintain continuity with another ground plane on the opposite layer and a lot of via to minimize MC33596 Data Sheet, Rev. 3 50 Freescale Semiconductor Application Schematics • • parasitic inductance. Power Supply, Ground Connection and Decoupling — Connect each ground pin to the ground plane using a separate via for each signal; do not use common vias. — Place each decoupling capacitor as close to the corresponding VCC pin as possible (no more than 2–3 mm away). — Locate the VCCDIG2 decoupling capacitor (C13) directly between VCCDIG2 (pin 14) and GND (pin 16). RF Tracks, Matching Network and Other Components — Minimize any tracks used for routing RF signals. — Locate crystal X1 and associated capacitors C15 and C11 close to the MC33596. Avoid loops occurring due to component size and tracks. Avoid routing digital signals in this area. — Use high frequency coils with high Q values for the frequency of operation (minimum of 15). Validate any change of coil source. NOTE The values indicated for the matching network have been computed and tuned for the the MC33596 RF Modules available for MC33596 evaluation. Matching networks should be retuned if any change is made to the PCB (track width, length or place, or PCB thickness, or component value). Never use, as is, a matching network designed for another PCB. MC33596 Data Sheet, Rev. 3 Freescale Semiconductor 51 Case Outline Dimensions 20 Case Outline Dimensions 20.1 LQFP32 Case MC33596 Data Sheet, Rev. 3 52 Freescale Semiconductor Case Outline Dimensions MC33596 Data Sheet, Rev. 3 Freescale Semiconductor 53 Case Outline Dimensions MC33596 Data Sheet, Rev. 3 54 Freescale Semiconductor Case Outline Dimensions 20.2 QFN32 Case MC33596 Data Sheet, Rev. 3 Freescale Semiconductor 55 Case Outline Dimensions MC33596 Data Sheet, Rev. 3 56 Freescale Semiconductor Case Outline Dimensions MC33596 Data Sheet, Rev. 3 Freescale Semiconductor 57 How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 [email protected] Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) [email protected] Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 [email protected] Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 [email protected] For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 [email protected] Document Number: MC33596 Rev. 3 06/2007 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. 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