Material Content Data Sheet Sales Product Name TLE7274-2G MA# MA000671748 Package PG-TO263-3-2 Issued 28. August 2013 Weight* 1461.80 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 1.671 0.11 0.853 0.06 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.11 1143 1143 583 0.256 0.02 851.691 58.27 58.35 582631 175 583389 0.168 0.01 0.01 115 115 8.916 0.61 6099 98.072 6.71 487.389 33.34 40.66 333416 406605 9.657 0.66 0.66 6606 6606 0.228 0.02 0.001 0.00 0.073 0.00 0.058 0.00 2.772 0.19 67090 156 0.02 2. 3. Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 156 40 0.19 Important Remarks: 1. 0 50 1896 1986 1000000