MURA130T3G, SURA8130T3G, MURA140T3G, SURA8140T3G Preferred Devices Surface Mount Ultrafast Power Rectifiers Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. http://onsemi.com ULTRAFAST RECTIFIERS 1 AMPERE, 300−400 VOLTS Features Small Compact Surface Mountable Package with J−Bend Leads Rectangular Package for Automated Handling High Temperature Glass Passivated Junction Low Forward Voltage Drop (0.8 V Max @ 1.0 A, TJ = 150C) AEC−Q101 Qualified and PPAP Capable SURA8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements All Packages are Pb−Free* SMA CASE 403D PLASTIC MARKING DIAGRAM U4x AYWW G Mechanical Characteristics: Case: Epoxy, Molded Weight: 70 mg (Approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds Polarity: Polarity Band Indicates Cathode Lead ESD Protection: Human Body Model > 4000 V (Class 3) Machine Model > 400 V (Class C) U4x = Device Code x = F for MURA130T3 = G for MURA140T3 A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package ORDERING INFORMATION Package Shipping† MURA130T3G SMA (Pb−Free) 5,000/Tape & Reel SURA8130T3G SMA (Pb−Free) 5,000/Tape & Reel MURA140T3G SMA (Pb−Free) 5,000/Tape & Reel SURA8140T3G SMA (Pb−Free) 5,000/Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2012 January, 2012 − Rev. 5 1 Publication Order Number: MURA130T3/D MURA130T3G, SURA8130T3G, MURA140T3G, SURA8140T3G MAXIMUM RATINGS Rating Symbol Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage MURA130T3G/SURA8130T3G MURA140T3G/SURA8140T3G VRRM VRWM VR Average Rectified Forward Current @ TL = 150C @ TL = 125C IF(AV) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Condtions Halfwave, Single Phase, 60 Hz) IFSM Operating Junction Temperature Range TJ Value Unit V 300 400 1.0 2.0 35 −65 to +175 A A C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction−to−Lead (TL = 25C) (Note 1) Thermal Resistance, Junction−to−Ambient (Note 1) Symbol Max Unit PsiJL (Note 2) RJA 24 C/W 216 1. Rating applies when surface mounted on the minimum pad size recommended, PC Board FR−4. 2. In compliance with JEDEC 51, these values (historically represented by RJL) are now referenced as PsiJL. ELECTRICAL CHARACTERISTICS Characteristic Symbol Maximum Instantaneous Forward Voltage (Note 3) (iF = 1.0 A, TJ = 25C) (iF = 1.0 A, TJ = 150C) vF Maximum Instantaneous Reverse Current (Note 3) (Rated DC Voltage, TJ = 25C) (Rated DC Voltage, TJ = 150C) iR Maximum Reverse Recovery Time (iF = 1.0 A, di/dt = 50 A/s) trr 3. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%. http://onsemi.com 2 Max 1.1 0.8 5.0 150 65 Unit V A ns MURA130T3G, SURA8130T3G, MURA140T3G, SURA8140T3G IR, REVERSE CURRENT (mA) TJ = 175C 10 TJ = 100C 1 0.1 TJ = 25C 0.01 IF, INSTANTANEOUS FORWARD CURRENT (A) 1000 50 100 150 200 300 250 350 100 TJ = 100C 10 TJ = 25C 50 100 150 200 250 300 350 VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 1. Typical Reverse Current Figure 2. Maximum Reverse Current 10 100C TC = 175C 25C 1 0.1 0.01 TJ = 175C 1 400 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 IF, INSTANTANEOUS FORWARD CURRENT (A) IR, REVERSE CURRENT (mA) 100 10 100C TC = 175C 25C 1 0.1 0.01 0.5 0.6 VF, INSTANTANEOUS VOLTAGE (VOLTS) 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 VF, INSTANTANEOUS VOLTAGE (VOLTS) Figure 4. Maximum Forward Voltage Figure 3. Typical Forward Voltage http://onsemi.com 3 400 1.5 MURA130T3G, SURA8130T3G, MURA140T3G, SURA8140T3G 30 30 NOTE: TYPICAL CAPACITANCE AT 0 V = 26 pF 20 15 10 8 12 16 20 24 28 32 36 15 10 0 4 8 12 16 20 24 28 32 VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 5. Typical Capacitance Figure 6. Maximum Capacitance 4 dc 3 2 SQUARE WAVE 1 80 90 0 40 100 110 120 130 140 150 160 170 180 IF(AV), AVERAGE FORWARD CURRENT (A) 4 0.25 0 20 0 40 60 100 120 140 Figure 8. Current Derating, Ambient (FR−4 Board with Minimum Pad) dc SQUARE WAVE 1.5 1 0.5 0.5 80 TA, AMBIENT TEMPERATURE (C) 3 0 180 SQUARE WAVE 0.5 3.5 0 160 0.75 4 2 40 dc Figure 7. Current Derating, Lead 2.5 36 1 TL, LEAD TEMPERATURE (C) PF, AVERAGE POWER DISSIPATION (W) IF(AV), AVERAGE FORWARD CURRENT (A) 0 5 0 20 5 5 0 NOTE: MAXIMUM CAPACITANCE AT 0 V = 29 pF 25 C, CAPACITANCE (pF) C, CAPACITANCE (pF) 25 1 1.5 2 2.5 3 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 9. Power Dissipation http://onsemi.com 4 3.5 MURA130T3G, SURA8130T3G, MURA140T3G, SURA8140T3G PACKAGE DIMENSIONS SMA CASE 403D−02 ISSUE F HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 403D−01 OBSOLETE, NEW STANDARD IS 403D−02. E b DIM A A1 b c D E HE L D POLARITY INDICATOR OPTIONAL AS NEEDED (SEE STYLES) MIN 1.97 0.05 1.27 0.15 2.29 4.06 4.83 0.76 MILLIMETERS NOM MAX 2.10 2.20 0.10 0.15 1.45 1.63 0.28 0.41 2.60 2.92 4.32 4.57 5.21 5.59 1.14 1.52 MIN 0.078 0.002 0.050 0.006 0.090 0.160 0.190 0.030 INCHES NOM 0.083 0.004 0.057 0.011 0.103 0.170 0.205 0.045 MAX 0.087 0.006 0.064 0.016 0.115 0.180 0.220 0.060 STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE A L A1 c SOLDERING FOOTPRINT* 4.0 0.157 2.0 0.0787 2.0 0.0787 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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