Cypress CY7C1399B-12VXC 256k(32k x 8) static ram Datasheet

CY7C1399B
256K(32K x 8) Static RAM
Features
active LOW Output Enable (OE) and three-state drivers. The
device has an automatic power-down feature, reducing the
power consumption by more than 95% when deselected.
• Single 3.3V power supply
• Ideal for low-voltage cache memory applications
• High speed
— 10/12/15 ns
• Low active power
— 216 mW (max.)
• Low-power alpha immune 6T cell
• Plastic SOJ and TSOP packaging
Functional Description[1]
The CY7C1399B is a high-performance 3.3V CMOS Static
RAM organized as 32,768 words by 8 bits. Easy memory
expansion is provided by an active LOW Chip Enable (CE) and
An active LOW Write Enable signal (WE) controls the
writing/reading operation of the memory. When CE and WE
inputs are both LOW, data on the eight data input/output pins
(I/O0 through I/O7) is written into the memory location
addressed by the address present on the address pins (A0
through A14). Reading the device is accomplished by selecting
the device and enabling the outputs, CE and OE active LOW,
while WE remains inactive or HIGH. Under these conditions,
the contents of the location addressed by the information on
address pins is present on the eight data input/output pins.
The input/output pins remain in a high-impedance state unless
the chip is selected, outputs are enabled, and Write Enable
(WE) is HIGH. The CY7C1399B is available in 28-pin standard
300-mil-wide SOJ and TSOP Type I packages.
Logic Block Diagram
Pin Configurations
SOJ
Top View
I/O0
INPUT BUFFER
I/O1
ROW DECODER
I/O 0
I/O2
SENSE AMPS
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
32K x 8
ARRAY
I/O1
I/O2
GND
I/O3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VCC
WE
A4
A3
A2
A1
OE
A0
CE
I/O7
I/O6
I/O5
I/O4
I/O3
I/O4
I/O5
CE
WE
I/O6
POWER
DOWN
COLUMN
DECODER
I/O7
A 14
A 12
A 13
A 11
A 10
OE
Selection Guide
Maximum Access Time
1399B-10
1399B-12
1399B-15
1399B-20
Unit
10
12
15
20
ns
Maximum Operating Current
60
55
50
45
mA
Maximum CMOS Standby Current
500
500
500
500
µA
50
50
50
50
µA
L
Note:
1. For guidelines on SRAM system design, please refer to the ‘System Design Guidelines’ Cypress application note, available on the internet at www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05071 Rev. *D
• 3901 North First Street
• San Jose, CA 95134
• 408-943-2600
Revised July 11, 2005
CY7C1399B
Pin Configuration
TSOP
Top View
OE
A1
A2
A3
A4
WE
VCC
A5
A6
A7
A8
A9
A10
A11
A0
CE
I/O7
I/O6
I/O5
I/O4
I/O3
GND
I/O2
I/O1
I/O0
A14
A13
A12
21
22
23
20
19
18
17
16
15
14
13
12
11
10
9
8
24
25
26
27
28
1
2
3
4
5
6
7
Maximum Ratings
Output Current into Outputs (LOW)............................. 20 mA
(Above which the useful life may be impaired. For user guidelines, not tested.)
Storage Temperature ................................. –65°C to +150°C
Ambient Temperature with
Power Applied............................................. –55°C to +125°C
Static Discharge Voltage........................................... >2001V
(per MIL-STD-883, Method 3015)
Latch-Up Current .................................................... >200 mA
Operating Range
Supply Voltage on VCC to Relative GND[2] .... –0.5V to +4.6V
Range
DC Voltage Applied to Outputs
in High Z State[2] ....................................–0.5V to VCC + 0.5V
Commercial
DC Input Voltage[2] .................................–0.5V to VCC + 0.5V
Industrial
Ambient
Temperature
VCC
0°C to +70°C
3.3V ±300 mV
–40°C to +85°C
3.3V ±300 mV
Electrical Characteristics Over the Operating Range[1]
Parameter
Description
Test Conditions
VOH
Output HIGH Voltage
VCC = Min., IOH = –2.0 mA
VOL
Output LOW Voltage
VCC = Min., IOL = 4.0 mA
VIH
Input HIGH Voltage
VIL
Input LOW Voltage[2]
7C1399B-10
7C1399B-12
Min.
Min.
Max.
2.4
Max.
2.4
0.4
Unit
V
0.4
V
2.2
VCC
+0.3V
2.2
VCC
+0.3V
V
–0.3
0.8
–0.3
0.8
V
–1
+1
–1
+1
µA
–5
+5
–5
+5
µA
IIX
Input Load Current
IOZ
Output Leakage
Current
GND ≤ VI ≤ VCC,
Output Disabled
IOS
Output Short
Circuit Current[3]
VCC = Max., VOUT = GND
–300
–300
mA
ICC
VCC Operating
Supply Current
VCC = Max., IOUT = 0 mA,
f = fMAX = 1/tRC
60
55
mA
ISB1
Automatic CE Power-Down
Current — TTL Inputs
Max. VCC, CE ≥ VIH,
VIN ≥ VIH, or VIN ≤ VIL,f = fMAX
5
5
mA
4
4
mA
Automatic CE Power-Down
Current — CMOS Inputs[4]
Max. VCC, CE ≥ VCC – 0.3V, VIN ≥
VCC – 0.3V, or VIN ≤ 0.3V,
L
WE ≥VCC – 0.3V or WE ≤0.3V,
f = fMAX
500
500
µA
50
50
µA
ISB2
L
Notes:
2. Minimum voltage is equal to – 2.0V for pulse durations of less than 20 ns.
3. Not more than one output should be shorted at one time. Duration of the short circuit should not exceed 30 seconds.
4. Device draws low standby current regardless of switching on the addresses.
Document #: 38-05071 Rev. *D
Page 2 of 10
CY7C1399B
Electrical Characteristics Over the Operating Range (continued)
1399B-15
Parameter
Description
Test Conditions
Min.
2.4
VOH
Output HIGH Voltage
VCC = Min., IOH = –2.0 mA
VOL
Output LOW Voltage
VCC = Min., IOL = 4.0 mA
VIH
Input HIGH Voltage
2.2
VCC
+0.3V
VIL
Input LOW Voltage
–0.3
IIX
Input Load Current
IOZ
Output Leakage Current
GND ≤ VI ≤ VCC,
Output Disabled
IOS
Output Short Circuit
Current[3]
VCC = Max., VOUT = GND
ICC
VCC Operating
Supply Current
ISB1
ISB2
1399B-20
Max.
Min.
Max.
Unit
2.4
V
0.4
0.4
V
2.2
VCC
+0.3V
V
0.8
–0.3
0.8
V
–1
+1
–1
+1
µA
–5
+5
–5
+5
µA
–300
–300
mA
VCC = Max., IOUT = 0 mA,
f = fMAX = 1/tRC
50
45
mA
Automatic CE Power-Down
Current — TTL Inputs
Max. VCC, CE ≥ VIH,
VIN ≥ VIH, or VIN ≤ VIL,
f = fMAX
5
5
mA
4
4
mA
Automatic CE Power-Down
Current — CMOS Inputs[4]
Max. VCC, CE ≥ VCC–0.3V, VIN
≥ VCC – 0.3V, or VIN ≤ 0.3V,
WE≥VCC–0.3V or WE≤ 0.3V,
f=fMAX
500
500
µA
50
50
µA
L
L
Capacitance[5]
Parameter
Description
CIN: Addresses
Input Capacitance
Test Conditions
Max.
Unit
TA = 25°C, f = 1 MHz, VCC = 3.3V
5
pF
6
pF
6
pF
CIN: Controls
COUT
Output Capacitance
AC Test Loads and Waveforms
R1 317Ω
3.3V
ALL INPUT PULSES
OUTPUT
3.0V
R2
351Ω
CL
INCLUDING
JIG AND
SCOPE
Equivalent to:
10%
GND
≤ 3 ns
90%
90%
10%
≤ 3 ns
THÉVENIN EQUIVALENT
167Ω
OUTPUT
1.73V
Note:
5. Tested initially and after any design or process changes that may affect these parameters.
Document #: 38-05071 Rev. *D
Page 3 of 10
CY7C1399B
Switching Characteristics Over the Operating Range[6]
1399B-10
Parameter
Description
Min.
Max.
1399B-12
Min.
Max.
Unit
Read Cycle
tRC
Read Cycle Time
10
tAA
Address to Data Valid
tOHA
Data Hold from Address Change
tACE
CE LOW to Data Valid
10
12
ns
tDOE
OE LOW to Data Valid
5
5
ns
[7]
tLZOE
OE LOW to Low Z
tHZOE
OE HIGH to High Z
tLZCE
CE LOW to Low Z
tHZCE
CE HIGH to High Z[7, 8]
tPU
CE LOW to Power-Up
tPD
Write
10
3
12
3
ns
5
3
5
0
ns
ns
6
0
10
ns
ns
0
5
CE HIGH to Power-Down
ns
3
0
[7, 8]
[7]
12
ns
ns
12
ns
Cycle[9, 10]
tWC
Write Cycle Time
10
12
ns
tSCE
CE LOW to Write End
8
8
ns
tAW
Address Set-Up to Write End
7
8
ns
tHA
Address Hold from Write End
0
0
ns
tSA
Address Set-Up to Write Start
0
0
ns
tPWE
WE Pulse Width
7
8
ns
tSD
Data Set-Up to Write End
5
7
ns
tHD
Data Hold from Write End
0
tHZWE
WE LOW to High Z[9]
tLZWE
Z[7]
WE HIGH to Low
0
7
3
ns
7
3
ns
ns
Notes:
6. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified
IOL/IOH and capacitance CL = 30 pF.
7. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device.
8. tHZOE, tHZCE, tHZWE are specified with CL = 5 pF as in AC Test Loads. Transition is measured ±500 mV from steady state voltage.
9. The internal write time of the memory is defined by the overlap of CE LOW and WE LOW. Both signals must be LOW to initiate a write and either signal can
terminate a write by going HIGH. The data input set-up and hold timing should be referenced to the rising edge of the signal that terminates the write.
10. The minimum write cycle time for write cycle #3 (WE controlled, OE LOW) is the sum of tHZWE and tSD.
Document #: 38-05071 Rev. *D
Page 4 of 10
CY7C1399B
Switching Characteristics Over the Operating Range[6] (continued)
1399B-15
Parameter
Description
Min.
1399B-20
Max.
Min.
Max.
Unit
Read Cycle
tRC
Read Cycle Time
15
tAA
Address to Data Valid
tOHA
Data Hold from Address Change
tACE
CE LOW to Data Valid
15
20
ns
tDOE
OE LOW to Data Valid
6
7
ns
OE LOW to Low Z
tHZOE
OE HIGH to High Z[7, 8]
tLZCE
CE LOW to Low
tPU
CE LOW to Power-Up
tPD
CE HIGH to Power-Down
3
0
ns
6
3
3
ns
ns
7
7
0
ns
ns
6
Z[7, 8]
CE HIGH to High
20
3
0
Z[7]
tHZCE
ns
15
[7]
tLZOE
20
0
ns
ns
15
20
ns
Cycle[9, 10]
Write
tWC
Write Cycle Time
15
20
ns
tSCE
CE LOW to Write End
10
12
ns
tAW
Address Set-Up to Write End
10
12
ns
tHA
Address Hold from Write End
0
0
ns
tSA
Address Set-Up to Write Start
0
0
ns
tPWE
WE Pulse Width
10
12
ns
tSD
Data Set-Up to Write End
8
10
ns
tHD
Data Hold from Write End
0
0
ns
tHZWE
tLZWE
WE LOW to High
Z[9]
WE HIGH to Low
Z[7]
7
7
3
3
ns
ns
Data Retention Characteristics (Over the Operating Range - L version only)
Parameter
Description
VDR
VCC for Data Retention
ICCDR
Data Retention Current
tCDR
Chip Deselect to Data
Retention Time
tR
Operation Recovery Time
Document #: 38-05071 Rev. *D
Conditions
Min.
Max.
2.0
Com’l
VCC = VDR = 2.0V,
CE > VCC – 0.3V,
VIN > VCC – 0.3V or
VIN < 0.3V
0
Unit
V
20
µA
0
ns
tRC
ns
Page 5 of 10
CY7C1399B
Data Retention Waveform
DATA RETENTION MODE
VDR > 2V
3.0V
VCC
3.0V
tR
tCDR
CE
Switching Waveforms
Read Cycle No. 1[11, 12]
tRC
ADDRESS
tOHA
DATA OUT
tAA
PREVIOUS DATA VALID
DATA VALID
Read Cycle No. 2[12, 13]
tRC
CE
tACE
OE
tHZOE
tHZCE
tDOE
DATA OUT
tLZOE
HIGH IMPEDANCE
HIGH
IMPEDANCE
DATA VALID
tLZCE
VCC
SUPPLY
CURRENT
tPD
tPU
ICC
50%
50%
ISB
Notes:
11. Device is continuously selected. OE, CE = VIL.
12. WE is HIGH for read cycle.
13. Address valid prior to or coincident with CE transition LOW.
Document #: 38-05071 Rev. *D
Page 6 of 10
CY7C1399B
Switching Waveforms (continued)
Write Cycle No. 1 (WE Controlled)[9, 14, 15]
tWC
ADDRESS
CE
tAW
tHA
tSA
WE
tPWE
OE
tSD
DATA I/O
NOTE 16
tHD
DATAINVALID
tHZOE
Write Cycle No. 2 (CE Controlled)[9, 14, 15]
tWC
ADDRESS
tSCE
CE
tSA
tAW
tHA
WE
tSD
DATA I/O
tHD
DATAINVALID
Write Cycle No. 3 (WE Controlled, OE LOW)[10, 15]
tWC
ADDRESS
CE
tAW
WE
tHA
tSA
tSD
DATA I/O
tHD
DATA IN VALID
NOTE 16
tHZWE
tLZWE
Notes:
14. Data I/O is high impedance if OE = VIH.
15. If CE goes HIGH simultaneously with WE HIGH, the output remains in a high-impedance state.
16. During this period, the I/Os are in the output state and input signals should not be applied.
Document #: 38-05071 Rev. *D
Page 7 of 10
CY7C1399B
Truth Table
CE
WE
OE
Input/Output
Mode
Power
H
X
X
High Z
Deselect/Power-Down
Standby (ISB)
L
H
L
Data Out
Read
Active (ICC)
L
L
X
Data In
Write
Active (ICC)
L
H
H
High Z
Deselect, Output Disabled
Active (ICC)
Ordering Information
Speed
(ns)
12
15
20
Ordering Code
Package
Name
Package Type
CY7C1399B-12VC
V21
28-Lead Molded SOJ
CY7C1399B-12VXC
V21
28-Lead Molded SOJ (Pb-Free)
CY7C1399B-12ZC
Z28
28-Lead Thin Small Outline Package
CY7C1399B-12ZXC
Z28
28-Lead Thin Small Outline Package (Pb-Free)
Operating
Range
Commercial
CY7C1399BL-12ZC
Z28
28-Lead Thin Small Outline Package
CY7C1399BL-12ZXC
Z28
28-Lead Thin Small Outline Package (Pb-Free)
CY7C1399B-12VXI
V21
28-Lead Molded SOJ (Pb-Free)
Industrial
CY7C1399B-15VC
V21
28-Lead Molded SOJ
Commercial
CY7C1399B-15VXC
V21
28-Lead Molded SOJ (Pb-Free)
CY7C1399B-15ZC
Z28
28-Lead Thin Small Outline Package
CY7C1399B-15ZXC
Z28
28-Lead Thin Small Outline Package (Pb-Free)
CY7C1399BL-15VC
V21
28-Lead Molded SOJ
CY7C1399BL-15VXC
V21
28-Lead Molded SOJ (Pb-Free)
CY7C1399BL-15ZXC
Z28
28-Lead Thin Small Outline Package (Pb-Free)
CY7C1399B-15VI
V21
28-Lead Molded SOJ
CY7C1399B-15VXI
V21
28-Lead Molded SOJ (Pb-Free)
CY7C1399B-15ZI
Z28
28-Lead Thin Small Outline Package
CY7C1399B-15ZXI
Z28
28-Lead Thin Small Outline Package (Pb-Free)
CY7C1399B-20ZC
Z28
28-Lead Thin Small Outline Package
CY7C1399B-20ZXC
Z28
28-Lead Thin Small Outline Package (Pb-Free)
Document #: 38-05071 Rev. *D
Industrial
Commercial
Page 8 of 10
CY7C1399B
Package Diagrams
28-Lead (300-Mil) Molded SOJ V21
MIN.
MAX.
DIMENSIONS IN INCHES
PIN 1 ID
14
DETAIL
A
EXTERNAL LEAD DESIGN
1
0.291
0.300
15
0.330
0.350
OPTION 1
0.697
0.713
0.014
0.020
OPTION 2
SEATING PLANE
0.120
0.140
A
0.050
TYP.
0.026
0.032
0.013
0.019
28
0.007
0.013
0.004
0.025 MIN.
0.262
0.272
51-85031-*B
28-Lead Thin Small Outline Package Type 1 (8x13.4 mm) Z28
51-85071-*G
All products and company names mentioned in this document may be the trademarks of their respective holders.
Document #: 38-05071 Rev. *D
Page 9 of 10
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
CY7C1399B
Document History Page
Document Title: CY7C1399B 256K(32K x 8) Static RAM
Document Number: 38-05071
REV.
ECN NO.
ISSUE
DATE
ORIG. OF
CHANGE
**
107264
05/25/01
SZV
Change from Spec #: 38-01102 to 38-05071
*A
107533
06/28/01
MAX
Add Low Power
*B
116472
09/17/02
CEA
Add applications foot note to data sheet, page 1.
*C
224340
See ECN
RKF
Option 1 of the Orientation ID on TSOP-I Package Diagram [Page #9]
removed
*D
386100
See ECN
SYT
Converted the Datasheet from “Preliminary” to “Final”
Added Pb-Free offerings in the Ordering Information
Edited the title to “256K (32K x 8) Static RAM” from “32K x 8 3.3V Static RAM”
Document #: 38-05071 Rev. *D
DESCRIPTION OF CHANGE
Page 10 of 10
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