Zarlink MF228FC 850 nm, 50 mhz high performance led Datasheet

MF228
850 nm, 50 MHz High Performance LED
Data Sheet
October 2004
Ordering Information
MF228
MF228
MF228
MF228
MF228
ST
SC
SMA
FC
TO-46 Package
ST Housing
SC Housing
SMA Housing
FC Housing
-40 °C to +85 °C
Note: Rated Fiber coupled power apply only on the TO-46
package, for housing options fiber coupled power is
typically 10% less
Features
Description
•
•
•
•
This device is capable of providing high power into
large-core fiber over a wide temperature range. Thanks
to its very uniform phase distribution of the optical
power, it is ideal for Electronic Distance Measurement
equipment.
850 nm Surface-Emitting LED
70 MHz Bandwidth
Uniform phase distribution
Designed for 200/280 µm fiber
Applications
•
•
•
Electronic Distance Measurement (EDM)
Sensors
Avionics
CASE
CATHODE
ANODE
CATHODE
ANODE
Bottom View
Anode in electrical contact with the case
Figure 1 - Pin Diagram
Figure 2 - Functional Schematic
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2001-2004, Zarlink Semiconductor Inc. All Rights Reserved.
MF228
Data Sheet
Optical and Electrical Characteristics - Case Temperature 25°C
Parameter
Symbol
Min.
Typ.
Fiber-Coupled Power
(Figures 3, 4, and 5) (Table 1)
Pfiber
1000
1200
Rise and Fall Time (10-90%)
tr,tf
7
Bandwidth (3dBel)
fc
50
Peak Wavelength
λp
Spectral Width (FWHM)
∆λ
50
Forward Voltage (Figure 7)
VF
1.8
Reverse Current
IR
Capacitance
C
Note 1:
830
Max.
Unit
µW
IF = 100 mA
(Note 1)
ns
IF = 100 mA
(no bias)
MHz
IF = 100 mA
nm
IF = 100 mA
nm
IF = 100 mA
2.2
V
IF = 100 mA
20
µA
VR = 1 V
pF
VR-0 V, f = 1 MHz
10
850
Test Condition
870
250
Fiber:
200/280 µm
Step
Index
NA = 0.24
Measured at the exit of 100 meters of fiber.
Absolute Maximum Ratings
Parameter
Symbol
Limit
Storage Temperature
Tstg
-55 to +125°C
Operating Temperature (derating: Figure 6)
Top
-40 to +85°C
Electrical Power Dissipation (derating: Figure 6)
Ptot
250 mW
IF
110 mA
IFRM
180 mA
Reverse Voltage
VR
1.5 V
Soldering Temperature (2mm from the case for 10 sec.)
Tsld
260°C
Continuous Forward Current (f<10 kHz)
Peak Forward Current (duty cycle<50%,f>1 MHz
Thermal Characteristics
Parameter
Symbol
Min.
Typ.
Max.
Unit
Thermal Resistance - Infinite Heat Sink
Rthjc
100
°
Thermal Resistance - No Heat Sink
Rthja
400
°C/W
C/W
Temperature Coefficient - Optical Power
dP/dTj
-0.4
%/°C
Temperature Coefficient - Wavelength
dλ/dTj
0.3
nm/°C
Typical Fiber-Coupled Power
Core Diameter/Cladding Diameter Numerical Aperture
50/125 µm
0.20
62.5/125 µm
0.275
100/140 µm
0.29
200/230 µm
0.37
200/280 µm
0.24
60 µW
150 µW
450µW
1300 µW
1200 µW
2
Zarlink Semiconductor Inc.
MF228
Data Sheet
r
Relative Fiber-Coupled Power (%)
100
90
z
80
r - optimal
ØC = 200 µm
70
60
50
40
30
20
10
0
0.5
0.75
1
1.25
1.5
1.75
2
2.25
2.5
2.75
3
z - Axial Displacem ent of Fiber (µm)
(m )
Figure 3 - Relative Fiber-coupled Power vs. z - Axial Displacement of Fiber
r
%
100
Relative Fiber-Coupled Power (%)
z
z - optimal
ØC = 200 µm
80
60
40
20
0
0
20
40
60
80
100
120
140
160
180
200
r - Radial Displacem ent of Fiber ( µ m )
Figure 4 - Felative Fiber-coupled Power vs. r - Radial Displacement of Fiber
3
Zarlink Semiconductor Inc.
MF228
Data Sheet
100
Relative Fiber-Coupled Power (%)
90
80
50% Duty Cycle
70
60
50
DC
40
30
20
Heat Sinked
10
0
0
20
40
60
80
100
120
140
160
180
200
Forward Current (mA)
Figure 5 - Relative Fiber-coupled Power vs. Forward Current
300
Max. Electrical Power Dissipation (mV)
Note: Maximum junction temperature can be increased to 150° C after additional burn-in and screening.
250
200
150
Infinite Heat Sink
No Heat Sink
100
50
0
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
Operating Tem perature ( oC)
Figure 6 - Max. Electrical Power Disapation vs. Operating Temperature
4
Zarlink Semiconductor Inc.
150
MF228
Data Sheet
200
Forward Current (mA)
150
100
50
0
0
0.5
1
1.5
2
2.5
3
Forw ard Voltage (V)
Figure 7 - Forward Current vs. Forward Voltage
200
Peak Forward Current (mA)
160
a
Note: Dashed line indicate that the pow er
dissipation may exceed the maximum ratings.
b
Heat Sinked
c
120
d
80
a)
b)
c)
d)
40
0
-60
-40
-20
0
20
40
60
P fiber
P fiber
P fiber
P fiber
80
= const.1450 µ W peak
= const.1200 µ W peak
= const.950 µ W peak
= const.700 µ W peak
100
O
Operating Tem perature ( C)
Figure 8 - Peak Forward Current vs. Operating Temperature
5
Zarlink Semiconductor Inc.
120
140
For more information about all Zarlink products
visit our Web Site at
www.zarlink.com
Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively “Zarlink”) is believed to be reliable.
However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such
information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or
use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual
property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in
certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink.
This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part
of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other
information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the
capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute
any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to fully determine the performance and
suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does
not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in
significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink’s conditions of sale which are available on request.
Purchase of Zarlink’s I2C components conveys a licence under the Philips I2C Patent rights to use these components in and I2C System, provided that the system
conforms to the I2C Standard Specification as defined by Philips.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright Zarlink Semiconductor Inc. All Rights Reserved.
TECHNICAL DOCUMENTATION - NOT FOR RESALE
Similar pages