[ /Title (CD74 HC139 , CD74 HCT13 9) /Subject (High Speed CMOS Logic Dual 2-to-4 Line Decod CD54HC139, CD74HC139, CD54HCT139, CD74HCT139 Data sheet acquired from Harris Semiconductor SCHS148D September 1997 - Revised October 2003 High-Speed CMOS Logic Dual 2- to 4-Line Decoder/Demultiplexer Features Description • Multifunction Capability - Binary to 1 of 4 Decoders or 1 to 4 Line Demultiplexer The ’HC139 and ’HCT139 devices contain two independent binary to one of four decoders each with a single active low enable input (1E or 2E). Data on the select inputs (1A0 and 1A1 or 2A0 and 2A1) cause one of the four normally high outputs to go low. • Active Low Mutually Exclusive Outputs • Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads If the enable input is high all four outputs remain high. For demultiplexer operation the enable input is the data input. The enable input also functions as a chip select when these devices are cascaded. This device is functionally the same as the CD4556B and is pin compatible with it. • Wide Operating Temperature Range . . . -55oC to 125oC • Balanced Propagation Delay and Transition Times The outputs of these devices can drive 10 low power Schottky TTL equivalent loads. The HCT logic family is functionally as well as pin equivalent to the LS logic family. • Significant Power Reduction Compared to LSTTL Logic ICs • HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30%of VCC at VCC = 5V Ordering Information • HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH • Memory Decoding, Data Routing, Code Conversion Pinout CD54HC139, CD54HCT139 (CERDIP) CD74HC139, CD74HCT139 (PDIP, SOIC) TOP VIEW 1E 1 TEMP. RANGE (oC) PACKAGE CD54HC139F3A -55 to 125 16 Ld CERDIP CD54HCT139F3A -55 to 125 16 Ld CERDIP CD74HC139E -55 to 125 16 Ld PDIP CD74HC139M -55 to 125 16 Ld SOIC CD74HC139MT -55 to 125 16 Ld SOIC CD74HC139M96 -55 to 125 16 Ld SOIC CD74HCT139E -55 to 125 16 Ld PDIP CD74HCT139M -55 to 125 16 Ld SOIC CD74HCT139MT -55 to 125 16 Ld SOIC CD74HCT139M96 -55 to 125 16 Ld SOIC PART NUMBER NOTE: When ordering, use the entire part number. The suffix 96 denotes tape and reel. The suffix T denotes a small-quantity reel of 250. 16 VCC 1A0 2 15 2E 1A1 3 14 2A0 1Y0 4 13 2A1 1Y1 5 12 2Y0 1Y2 6 11 2Y1 1Y3 7 10 2Y2 GND 8 9 2Y3 CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © 2003, Texas Instruments Incorporated 1 CD54HC139, CD74HC139, CD54HCT139, CD74HCT139 Functional Diagram 4 (12) 2 (14) Y0 5 (11) A0 Y1 6 (10) 3 (13) Y2 A1 7 (9) Y3 1 (15) E TRUTH TABLE INPUTS ENABLE SELECT OUTPUTS E A1 A0 Y3 Y2 Y1 Y0 0 0 0 1 1 1 0 0 0 1 1 1 0 1 0 1 0 1 0 1 1 0 1 1 0 1 1 1 1 X X 1 1 1 1 X = Don’t Care, Logic 1 = High, Logic 0 = Low Logic Diagram 4 (12) Y0 2 (14) A0 5 (11) Y1 3 (13) A1 6 (10) Y2 7 (9) Y3 1 (15) E 2 CD54HC139, CD74HC139, CD54HCT139, CD74HCT139 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA Thermal Resistance (Typical, Note 1) θJA (oC/W) E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . 67 M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . 73 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications TEST CONDITIONS PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) VIH - - 2 1.5 - - 1.5 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V MIN TYP MAX MIN MAX MIN MAX UNITS - 1.5 - V HC TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads VIL VOH - VIH or VIL High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current - 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V -0.02 2 1.9 - - 1.9 - 1.9 - V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -0.02 6 5.9 - - 5.9 - 5.9 - V - - - - - - - - - V -4 4.5 3.98 - - 3.84 - 3.7 - V -5.2 6 5.48 - - 5.34 - 5.2 - V 0.02 2 - - 0.1 - 0.1 - 0.1 V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 0.02 6 - - 0.1 - 0.1 - 0.1 V - - - - - - - - - V 4 4.5 - - 0.26 - 0.33 - 0.4 V 5.2 6 - - 0.26 - 0.33 - 0.4 V II VCC or GND - 6 - - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 6 - - 8 - 80 - 160 µA 3 CD54HC139, CD74HC139, CD54HCT139, CD74HCT139 DC Electrical Specifications (Continued) TEST CONDITIONS SYMBOL VI (V) IO (mA) High Level Input Voltage VIH - - Low Level Input Voltage VIL - High Level Output Voltage CMOS Loads VOH VIH or VIL PARAMETER 25oC VCC (V) -40oC TO 85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 4.5 to 5.5 2 - - 2 - 2 - V - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -4 4.5 3.98 - - 3.84 - 3.7 - V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V ±0.1 - ±1 - ±1 µA HCT TYPES High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load II VCC and GND 0 5.5 - ICC VCC or GND 0 5.5 - - 8 - 80 - 160 µA ∆ICC (Note 2) VCC -2.1 - 4.5 to 5.5 - 100 360 - 450 - 490 µA NOTE: 2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. HCT Input Loading Table INPUT UNIT LOADS All 0.7 NOTE: Unit Load is ∆ICC limit specified in DC Electrical Table, e.g., 360µA max at 25oC. Switching Specifications Input tr, tf = 6ns PARAMETER -40oC TO 85oC 25oC -55oC TO 125oC SYMBOL TEST CONDITIONS VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS tPLH, tPHL CL = 50pF 2 - - 145 - 180 - 220 ns 4.5 - - 29 - 36 - 44 ns 6 - - 25 - 31 - 38 ns 2 - - 135 - 170 - 205 ns 4.5 - - 27 - 34 - 41 ns 6 - - 23 - 29 - 35 ns HC TYPES Propagation Delay A0, A1 to Outputs E to Outputs tPLH, tPHL CL = 50pF Select to Output tPLH, tPHL CL = 15pF 5 - 12 - - - - - ns Enable to Output tPLH, tPHL CL = 15pF 5 - 11 - - - - - ns 4 CD54HC139, CD74HC139, CD54HCT139, CD74HCT139 Switching Specifications Input tr, tf = 6ns PARAMETER SYMBOL Output Transition Time (Figure 1) tTLH, tTHL (Continued) -40oC TO 85oC 25oC -55oC TO 125oC TEST CONDITIONS VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS CL = 50pF 2 - - 75 - 95 - 110 ns 4.5 - - 15 - 19 - 22 ns 6 - - 13 - 16 - 19 ns Power Dissipation Capacitance, (Notes 3, 4) CPD - 5 - 55 - - - - - pF Input Capacitance CIN - - - - 10 - 10 - 10 pF A0, A1 to Outputs tPLH, tPHL CL = 50pF 4.5 - - 34 - 43 - 51 ns E to Outputs tPLH, tPHL CL = 50pF 4.5 - - 34 - 43 - 51 ns Select to Output tPLH, tPHL CL = 15pF 5 - 14 - - - - - ns Enable to Output tPLH, tPHL CL = 15pF 5 - 14 - - - - - ns Output Transition Time (Figure 2) tTLH, tTHL CL = 50pF 4.5 - - 15 - 19 - 22 ns Power Dissipation Capacitance, (Notes 3, 4) CPD - 5 - 59 - - - - - pF Input Capacitance CIN - - - - 10 - 10 - 10 pF HCT TYPES Propagation Delay NOTES: 3. CPD is used to determine the dynamic power consumption, per decoder/demux. 4. PD = VCC2 fi (CPD + CL) where: fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage. Test Circuits and Waveforms tr = 6ns tf = 6ns INPUT GND tTLH GND tTHL 90% 50% 10% INVERTING OUTPUT 3V 2.7V 1.3V 0.3V INPUT tTHL tPHL tf = 6ns tr = 6ns VCC 90% 50% 10% tTLH 90% 1.3V 10% INVERTING OUTPUT tPLH tPHL FIGURE 1. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC tPLH FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC 5 PACKAGE OPTION ADDENDUM www.ti.com 17-Oct-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) CD54HC139F ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC CD54HC139F3A ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC CD54HCT139F ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC CD54HCT139F3A ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC CD74HC139E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD74HC139EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD74HC139M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC139M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC139M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC139ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC139MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC139MTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT139E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD74HCT139EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD74HCT139M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT139M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT139M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT139ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT139MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT139MTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 17-Oct-2005 Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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