ESD8V0L... Low Capacitance TVS Diode • ESD / transient protection of high-speed data lines in 3.3 / 5 / 12 V applications according to: IEC61000-4-2 (ESD): up to ± 25 KV (contact) IEC61000-4-4 (EFT): 40 A (5/50 ns) IEC61000-4-5 (surge): up to 2.5 A (8/20 µs) • Smallest form factor down to 1.0 x 0.6 x 0.4 mm • Max. working voltage: -8 / +14 V or +8 / -14 V • Ultra low dynamic resistance down to 0.3 Ω • Very low capacitance down to 2 pF • Very low reverse current < 1 nA typ. • Very low series inductance down to 0.4 nH • Pb-free (RoHS compliant) package Applications • USB 2.0, 10/100 Ethernet, Firewire, DVI • Mobile communication • Consumer products (STB, MP3, DVD, DSC...) • LCD displays, camera • Notebooks and destop computers, peripherals ESD8V0L1B-02EL ESD8V0L1B-02LRH ESD8V0L2B-03L D1 1 1 2 3 2 D2 Type ESD8V0L1B-02EL ESD8V0L1B-02LRH ESD8V0L2B-03L Package TSLP-2-18 TSLP-2-17 TSLP-3-1 Configuration 1 channel, bi-directional 1 channel, bi-directional 2 channels, bi-directional 1 Marking E7 B3 B3 2013-02-06 ESD8V0L... Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Symbol ESD contact discharge1) VESD Value kV ESD8V0L1B... 25 ESD8V0L2B..., between all pins 15 Peak pulse current (tp = 8 / 20 µs)2) Unit A Ipp ESD8V0L1B... 2.5 ESD8V0L2B... 1 Operating temperature range Top -55...125 Storage temperature Tstg -65...150 °C 1V ESD according to IEC61000-4-2 2I pp according to IEC61000-4-5 2 2013-02-06 ESD8V0L... Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. -8 - 14 I(BR) = 1 mA, from pin 2 to 1, ESD8V0L1B... 14.5 - - I(BR) = 1 mA, from pin 1 to 2, ESD8V0L1B... 8.5 - - I(BR) = 1 mA, from pin 1/2 to 3, ESD8V0L2B... 14.5 - - I(BR) = 1 mA, from pin 3 to 1/2, ESD8V0L2B... 8.5 - - I(BR) = 1 mA, from pin 1 to 2, ESD8V0L2B... 23 - - - <1 50 Characteristics Reverse working voltage VRWM Breakdown voltage V(BR) Reverse current IR V nA VR = 3 V, between all pins Clamping voltage (contact)1) V VCL VESD = +15 kV , from pin 1 to 2, ESD8V0L1B... - 21 - VESD = -15 kV, from pin 1 to 2, ESD8V0L1B... - 16 - VESD = +15 kV , from pin 1/2 to 3, ESD8V0L2B... - 26 - VESD = -15 kV , from pin 1/2 to 3, ESD8V0L2B... - 20 - Line capacitance2) pF CT VR = 0 V, f = 1 MHz, ESD8V0L1B... - 8.5 13 from pin 1/2 to 3 - 4 7 from pin 1 to 2, pin 3 is not connected - 2 4 VR = 0 V, f = 1 MHz, ESD8V0L2B..., Dynamic resistance ( tp=30ns ) Ω RD ESD8V0L1B... - 0.3 - ESD8V0L2B... - 0.6 - 1V ESD according to IEC61000-4-2 2Total capacitance line to ground 3 2013-02-06 ESD8V0L... Reverse current IR = ƒ(VR ) TA = Parameter Diode capacitance CT = ƒ (VR) f = 1MHz 10 1 10 pF nA 8 TA = 85°C 7 IR CT 10 0 TA = 25°C ESD8V0L1B... ESD8V0L2B..., pins 1/2 to 3 ESD8V0L2B..., pins 1 to 2 6 5 4 10 -1 3 2 1 10 -2 0 2 4 6 8 10 V 0 0 14 VR 5 V 15 VR 4 2013-02-06 ESD8V0L... Connector Application example ESD8V0L2B... 2 channels, bi-directional 2 protected signal lines, level up to -8V/+14V I/O I/O 1 ESD sensitive device 2 3 The protection diode should be placed very close to the location where the ESD or other transients can occur to keep loops and inductances as small as possible. Pin 3 should be connected directly to a ground plane on the board. Connector Application example ESD8V0L2B... 1 high-speed channel, bi-directional Protected high-speed signal line, level up to ±22V (bi-directional) I/O ESD sensitive device 2 3 1 Pin 1 (or pin 2) should be connected directly to a ground plane on the board. Pin 3 is not connected. Connector Application example ESD8V0L1B... 1 channel, bi-directional Protected signal line, level up to -8/+14V or +8/-14 V I/O ESD sensitive device 2 Pin 1 (or Pin 2) should be connected directly to a ground plane on the board. 1 5 2013-02-06 TSLP-2-17 (mm) ESD8V0L... Package Outline Top view Bottom view 0.39 +0.01 -0.03 0.6 ±0.05 0.05 MAX. 1 1 0.25 ±0.035 1) 2 1±0.05 0.65 ±0.05 2 0.5 ±0.035 1) Cathode marking 1) Dimension applies to plated terminal Foot Print 0.45 Copper Solder mask 0.375 0.35 0.275 1 0.925 0.3 0.35 0.6 0.275 For board assembly information please refer to Infineon website "Packages" Stencil apertures Marking Layout (Example) BAR90-02LRH Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 15.000 Pieces/Reel Reel ø330 mm = 50.000 Pieces/Reel (optional) 0.5 Cathode marking 8 1.16 4 0.76 6 2013-02-06 TSLP-2-18 (mm) 7 ESD8V0L... 2013-02-06 TSLP-3-1 (mm) ESD8V0L... Package Outline Bottom view 0.4 +0.1 0.6 ±0.05 0.5 ±0.035 2 1 ±0.05 3 0.65 ±0.05 3 1) 2 1 1) 0.05 MAX. 0.35 ±0.05 Pin 1 marking 2 x 0.15 ±0.035 2 x 0.25 ±0.035 1 0.25 ±0.035 1) Top view 1) 1) Dimension applies to plated terminal Foot Print R0.1 0.2 0.225 0.2 0.225 0.315 0.35 1 0.3 0.945 0.35 0.45 0.275 0.6 0.355 For board assembly information please refer to Infineon website "Packages" 0.17 0.15 Copper Solder mask Stencil apertures Marking Layout (Example) BFR193L3 Type code Pin 1 marking Laser marking Standard Packing Reel ø180 mm = 15.000 Pieces/Reel 0.5 1.16 Pin 1 marking 8 4 0.76 8 2013-02-06 ESD8V0L... Edition 2009-11-16 Published by Infineon Technologies AG 81726 Munich, Germany 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (<www.infineon.com>). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 9 2013-02-06