Mechanical Dimensions BZT52C2V4~C39 Description SOD-123 * * * * Dimensions in mm Features: Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose Medium Current Ideally Suited for Automated Assembly Process Characteristic Forward Voltage @ If=10mA Power Dissipation Thermal Resistance, Junction to Ambient air Operating and Storage Temperature Range Symbol VF Pd Rthja Tj/Tstg Value 0.9 500 305 -65 ~ +150 Unit V mW C/W C Electrical Characteristics Ta=25C unless otherwise specified 500 mW Nominal Test Maximum Maximum Forward Zener Voltage Current Zener ImpedanceVzt @ Reverse Current Voltage FCI @ Izt Izt (mA) Izt;Vzk@ Izk=1.0mA Ir(uA) @ Vr(V) VF (V) Part # Vz (V) Vzt / Vzk(ohm) Marking IF (mA) BZT52C2V4 2.4 5 85/600 100/1.0 0.9 / 10 WX BZT52C2V7 2.7 5 83/600 75/1.0 0.9 / 10 W1 BZT52C3V0 3.0 5 95/500 50/1.0 0.9 / 10 W2 BZT52C3V3 3.3 5 95/500 25/1.0 0.9 / 10 W3 BZT52C3V6 3.6 5 95/500 15/1.0 0.9 / 10 W4 BZT52C3V9 3.9 5 95/500 10/1.0 0.9 / 10 W5 5 95/500 5/1.0 0.9 / 10 W6 5 78/500 5/1.0 0.9 / 10 W7 W8 BZT52C4V3 BZT52C4V7 4.3 4.7 BZT52C5V1 5.1 5 60/480 0.1/0.8 0.9 / 10 BZT52C5V6 5.6 5 40/400 0.1/1.0 0.9 / 10 W9 BZT52C6V2 6.2 5 10/200 0.1/2.0 0.9 / 10 WA BZT52C6V8 6.8 5 8/150 0.1/3.0 0.9 / 10 WB BZT52C7V5 7.5 5 7/50 0.1/5.0 0.9 / 10 WC BZT52C8V2 8.2 5 7/50 0.1/6.0 0.9 / 10 WD BZT52C9V1 9.1 5 10/50 0.1/7.0 0.9 / 10 WE 0.1/7.5 0.9 / 10 WF BZT52C10 10 5 15/70 BZT52C11 11 5 20/70 0.1/8.5 0.9 / 10 WG 5 20/90 0.1/9.0 0.9 / 10 WH WI BZT52C12 12 BZT52C13 13 5 25/110 0.1/10 0.9 / 10 BZT52C15 15 5 30/110 0.1/11 0.9 / 10 WJ BZT52C16 16 5 40/170 0.1/12 0.9 / 10 WK BZT52C18 18 5 50/170 0.1/14 0.9 / 10 WL BZT52C20 20 5 50/220 0.1/15 0.9 / 10 WM BZT52C22 22 5 55/220 0.1/17 0.9 / 10 WN BZT52C24 24 5 80/220 0.1/18 0.9 / 10 WO 5 80/250 0.1/20 0.9 / 10 WP 5 80/250 0.1/22.5 0.9 / 10 WQ 5 80/250 0.1/25 0.9 / 10 WR 0.1/27 0.9 / 10 WS 0.1/29 0.9 / 10 WT BZT52C27 BZT52C30 BZT52C33 27 30 33 BZT52C36 36 5 90/250 BZT52C39 39 5 90/300 Package SOD-123