Sony CXA1511L Preamplifier for remote control signal reception Datasheet

CXA1511L/M
Preamplifier for Remote Control Signal Reception
Description
The CXA1511L/M is a bipolar IC used for
preamplifiers that receive signals in infrared remote
control systems. These ICs consist of a first-stage
amplifier, limiter amplifier, band-pass filter, band
elimination filter, signal waveform detection circuit
and waveform shaping circuit.
8 pin SIP (Plastic)
Features
• Low power consumption (VCC = 5V, 9mW typ.)
• Low supply voltage (VCC = 5V)
• Filters (center frequency can be varied through
external resistor: fo = 30kHz to 60kHz, 40kHz typ.)
• Elimination of inductors prevents magnetic field
inductance interference.
• Optical reception diode can be coupled directly.
• Collector output (pull-up resistor, TTL and CMOS
can be connected directly)
8 pin SOP (Plastic)
Absolute Maximum Ratings
7
V
• Supply voltage
VCC
• Operating temperature Topr –20 to +75
°C
• Storage temperature
Tstg –65 to +150
°C
• Allowable power dissipation
PD
600 mW (SIP)
• Allowable power dissipation
PD
300 mW (SOP)
Operating Conditions
• Supply voltage
Applications
TVs, VCRs, audio equipment
4.7 to 5.3
V
Structure
Bipolar silicon monolithic IC
Block Diagram and Pin Configuration
Head
Amp
IN
Limiter
Amp
BPF Delector &
Hysteresis
BEF Comparator Integralor Comparator
1
ABLC
Photo
Diode
3 4 5 6
C2 GND fo N.C.
2
C1
7 8
OUT VCC
470, 680
0.01µ
0.01µ
200k
(fo = 40kHz)
VCC = 5V
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E94301A8X
CXA1511L/M
Pin Description
Pin
No.
1
Symbol
IN
Pin voltage depends on the DC Characteristics Measurement Circuit.
Pin
voltage
Equivalent circuit
Description
Input pin.
Connect optical reception
diode to GND.
2.8V
47k
160k
VCC
1
2
C1
2.8V
8k
VCC
40µA↓
↓40µA
2
8k
VCC
330k
3
C2
1.9V
30nA↓
↓30µA
8k
3
4
GND
fo
Connect a detection capacitor
to GND.
When the capacitor is large,
sensitivity decreases in relation
to the mean value detection
and transient response.
When the capacitor is small,
fluctuation of the peak detection
and output pulse width
increases.
The capacitor in usage is
0.01µF (typ.). Set output pulse
width fluctuation and noise
elimination characteristics to be
optimum.
GND pin.
Adopt a pattern design that will
allow external parts to be
located as closely as possible
to this pin. Ground them all at
the same point. The transport
distance and noise elimination
characteristics are greatly
influenced by the pattern design
surrounding the GND.
VCC
5
5
Connect a resistor and
capacitor in series to GND,
and set the frequency
response and gain of "Head
Amp".
When the resistor is large
and the capacitor small, the
gain is small.
When the capacitor is large,
sensitivity decreases in
relation to the transient
response.
VCC
1.4V
4p
8k
–2–
Connect a resistor to the
power supply.
Set the center frequency of
the built-in BPF.
See "External resistor at
Pin 5 vs. Center frequency
response" on Page 6.
CXA1511L/M
Pin
No.
6
Symbol
Pin
voltage
Equivalent circuit
Description
No connected pin.
Connect to GND.
N.C.
VCC
24k
5.0V
(High)
7
30k
OUT
Output pin.
7
0.6V
(Low)
14k
30k
8
VCC
5.0V
Supply voltage pin.
DC Characteristics Measurement Circuit
(CXA1511L)
(CXA1511M)
CXA1511L
1
2
3
4
5
200k
5V
6
7
8
8
470
7
6
5
200k
CXA1511M
0.01µ
0.01µ
2
1
5V
3
470
0.01µ 0.01µ
–3–
4
L level output voltage
Voltage gain
BPF characteristics (1)
BPF characteristics (2)
Input impedance
Detecting ability
3
4
5
6
7
8
–4–
S2, 5, 6, 9
S2, 5, 6, 9
S2, 5, 6, 9
S3, 7, 8
S1, 2, 3, 4, 7
S1, 3, 7
ON-SW
D
C
Note 3) rin=
47kΩ
[kΩ]
(Vi/Vx) –1)
A2=20log
S3, 7
S2, 5, 6, 7
A
B
B
B
C
A
A
Measurement
point
Note 2) The level ratio between AC level at 40kHz and that at 48kHz is taken A2 [dB].
60µVp-p
200mVp-p S1, 2, 6, 7
40µVp-p
40µVp-p
30µVp-p
Level
A1=20log
Icc
burst wave
40kHz CW
rin
Det
40kHz, 48kHz CW
30kHz, 37kHz CW
40kHz CW
Signal
Measurement condition
AVQ2
AVQ1
AV
VOL
VIN2
VIN1
Symbol
Note 1) The level ratio between AC level at 37kHz and that at 30kHz is taken A1 [dB].
Current consumption
Input pin voltage (2)
2
9
Input pin voltage (1)
Item
1
No.
Electrical Characteristics
0.6
—
1.8
2.8 mA
Remarks
Burst wave signal with a
1.2ms, 40kHz cycle is input.
Note 3)
Input level is taken Vi and
measuring value is taken Vx.
Note 2)
Note 1)
100µA is flown out from Pin 1.
measuring value (f = 40kHz)
measuring value (f = 48kHz)
measuring value (f = 37kHz)
measuring value (f = 30kHz)
1.0
µs
440 550 770
dB
dB
dB
V
V
V
kΩ
—
—
85
1.3
1.8
3.3
64
40
19
5
31
10
5
81
1.2
0.6
75
2.8
2.3
Min. Typ. Max. Unit
(VCC = 5V, Ta = 25°C)
CXA1511L/M
CXA1511L/M
Electrical Characteristics Measurement Circuit
2
1
3
4
6
5
D
8
7
470
0.01µ
S1 S2 S3
C
0.47µ
A
S7 S8 S9
R6 47k
S4
330k
S6
0.47µ
I1
100µA
E2
5.0V
200k
S5
0.01µ
B
SG
50
E1
1.0V
Application Circuit
(CXA1511L)
(CXA1511M)
47
+5V
47µ
200k
1%
(fo = 40kHz)
CXA1511L
1
2
4
3
470,
680
5
6
7
OUT
8
8
200k OUT
1%
(fo = 40kHz)
Photo
Diode
0.01µ
5
CXA1511M
47
PH302B
6
7
0.01µ
47µ
1
+5V
Photo
Diode
2
3
4
470,
680
PH302B
0.01µ
0.01µ
Description of Operation (See the Block Diagram.)
Receives infrared signals transmitted from the infrared remote control commander with a photodiode to output
them as rectangular waves.
I/O pin
Pin 1
Input waveform
Waveform
40µVp-p
to 2.5Vp-p
Hysteresis
comparator
input waveform
Pin 7
Output
waveform
Converts the signal current of a photodiode into
voltage and amplifies it.
AAA
AA
AAA
AA
AAAAA
600µs
Pin 3
BPF output
waveform
Operation
typ.
40kHz (typ.)
Suppresses the noise component with BPF and
BEF.
Detects the signal component and performs
wave detection.
5V
0.6V
(typ.)
–5–
Integrates the signal component and outputs it
as rectangular wave from the hysteresis
comparator.
CXA1511L/M
Example of Representative Characteristics
External resistor at Pin 2 vs.
AV1 characteristics
VCC vs. ICC characteristics
VIN = 50µVp-p
(Pin 1)
f = 40kHz
Ta = 25°C
VCC = 5V
–5
Ta = 25°C
2.0
ICC [mA]
BPF relative voltage gain [dB] (Pin 3)
0
–10
1.5
–15
–20
100
1.0
1k
10k
External resistor at Pin 2 [Ω]
4.0
5.0
6.0
VCC [V]
I1 vs. VIN2 characteristics
Ta = 25°C
VCC = 5V
Input voltage at Pin 1 vs.
Output voltage at Pin 3 characteristics
VIN2 [V]
1
3
2
0.5
1
0
0.1
10µ
100µ
VIN
1m
[Vp-p] (Pin 1 input)
10m
10
I1 [µA]
1
100m
100
80
Ta = 25°C
VCC = 5V
Center frequency [kHz]
70
60
50
Ta = 25°C
VCC = 5V
VIN = 50µVp-p
(Pin 1)
80
60
40
20
40
30
100
External resistor at Pin 5 vs.
Center frequency response
f vs. AV1 characteristics
Av1 [dB]
BPF output (Pin 3)
5
4
f = 40kHz
Ta = 25°C
VCC = 5V
10
20
30 40
0
100
0
100
200
300
400
External resistor at Pin 5 [kΩ]
f [kHz]
–6–
CXA1511L/M
Package Outline
Unit: mm
CXA1511L
8PIN SIP (PLASTIC)
+ 0.5
19.0 – 0.2
8
2.54
8.3 MAX
3.0
1
1.2 MIN
+ 0.5
6.4 – 0.2
2.8 ± 0.2
+ 0.1
0.25 – 0.05
0.5 ± 0.1
1.2 ± 0.1
+ 0.3
1.2 – 0.1
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
SONY CODE
SIP-8P-02
LEAD TREATMENT
SOLDER PLATING
EIAJ CODE
SIP008-P-0340
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
0.7g
JEDEC CODE
CXA1511M
8PIN SOP (PLASTIC)
+ 0.4
1.25 – 0.15
+ 0.4
5.0 – 0.1
8
0.10
5
6.4 ± 0.4
+ 0.3
4.4 – 0.1
A
4
1
1.27
b
0.24
M
+ 0.15
0.1 – 0.1
0.5 ± 0.2
B
DETAIL B : SOLDER
b = 0.4 ± 0.03
+ 0.03
0.15 – 0.01
(0.4)
(0.15)
+ 0.1
0.15 – 0.05
0° to 10°
+ 0.1
b = 0.4 – 0.05
DETAILA
DETAIL B : PALLADIUM
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
SONY CODE
SOP-8P-L03
LEAD TREATMENT
SOLDER/PALLADIUM
PLATING
EIAJ CODE
SOP008-P-0225
LEAD MATERIAL
42/COPPER ALLOY
PACKAGE MASS
0.1g
JEDEC CODE
NOTE : PALLADIUM PLATING
This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).
–7–
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