ON MC14106BDR2 Hex schmitt trigger Datasheet

MC14106B
Hex Schmitt Trigger
The MC14106B hex Schmitt Trigger is constructed with MOS
P–channel and N–channel enhancement mode devices in a single
monolithic structure. These devices find primary use where low power
dissipation and/or high noise immunity is desired. The MC14106B
may be used in place of the MC14069UB hex inverter for enhanced
noise immunity or to “square up” slowly changing waveforms.
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• Increased Hysteresis Voltage Over the MC14584B
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
• Capable of Driving Two Low–power TTL Loads or One Low–power
•
•
MARKING
DIAGRAMS
14
PDIP–14
P SUFFIX
CASE 646
Schottky TTL Load Over the Rated Temperature Range
Pin–for–Pin Replacement for CD40106B and MM74C14
Can Be Used to Replace the MC14584B or MC14069UB
MC14106BCP
AWLYYWW
1
14
SOIC–14
D SUFFIX
CASE 751A
MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 1.)
Symbol
Value
Unit
– 0.5 to +18.0
V
– 0.5 to VDD + 0.5
V
Input or Output Current
(DC or Transient) per Pin
± 10
mA
PD
Power Dissipation,
per Package (Note 2.)
500
mW
TA
Ambient Temperature Range
– 55 to +125
°C
Tstg
Storage Temperature Range
– 65 to +150
°C
TL
Lead Temperature
(8–Second Soldering)
260
°C
VDD
Vin, Vout
Iin, Iout
Parameter
DC Supply Voltage Range
Input or Output Voltage Range
(DC or Transient)
1. Maximum Ratings are those values beyond which damage to the device
may occur.
2. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high–impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS
(Vin or Vout)
VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g.,
either VSS or VDD). Unused outputs must be left open.
v
v
 Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 3
1
14106B
AWLYWW
1
14
TSSOP–14
DT SUFFIX
CASE 948G
14
106B
ALYW
1
A
= Assembly Location
WL or L = Wafer Lot
YY or Y = Year
WW or W = Work Week
ORDERING INFORMATION
Device
Package
Shipping
MC14106BCP
PDIP–14
2000/Box
MC14106BD
SOIC–14
55/Rail
MC14106BDR2
SOIC–14
2500/Tape & Reel
MC14106BDT
TSSOP–14
96/Rail
MC14106BDTR2
TSSOP–14 2500/Tape & Reel
Publication Order Number:
MC14106B/D
MC14106B
LOGIC DIAGRAM
1
2
3
4
5
6
9
8
11
10
13
12
VDD = PIN 14
VSS = PIN 7
EQUIVALENT CIRCUIT SCHEMATIC
(1/6 OF CIRCUIT SHOWN)
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2
MC14106B
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
Output Voltage
Vin = VDD
Symbol
– 55_C
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ (3.)
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
—
—
—
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
—
—
—
Vdc
Hysteresis Voltage
VH (6.)
5.0
10
15
0.3
1.2
1.6
2.0
3.4
5.0
0.3
1.2
1.6
1.1
1.7
2.1
2.0
3.4
5.0
0.3
1.2
1.6
2.0
3.4
5.0
Vdc
Threshold Voltage
Positive–Going
VT+
5.0
10
15
2.2
4.6
6.8
3.6
7.1
10.8
2.2
4.6
6.8
2.9
5.9
8.8
3.6
7.1
10.8
2.2
4.6
6.8
3.6
7.1
10.8
Vdc
VT–
5.0
10
15
0.9
2.5
4.0
2.8
5.2
7.4
0.9
2.5
4.0
1.9
3.9
5.8
2.8
5.2
7.4
0.9
2.5
4.0
2.8
5.2
7.4
Vdc
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
—
—
—
—
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
—
—
—
—
– 1.7
– 0.36
– 0.9
– 2.4
—
—
—
—
IOL
5.0
10
15
0.64
1.6
4.2
—
—
—
0.51
1.3
3.4
0.88
2.25
8.8
—
—
—
0.36
0.9
2.4
—
—
—
mAdc
Input Current
Iin
15
—
± 0.1
—
± 0.00001
± 0.1
—
± 1.0
µAdc
Input Capacitance
(Vin = 0)
Cin
—
—
—
—
5.0
7.5
—
—
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
—
—
—
0.25
0.5
1.0
—
—
—
0.0005
0.0010
0.0015
0.25
0.5
1.0
—
—
—
7.5
15
30
µAdc
IT
5.0
10
15
Vin = 0
Negative–Going
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
IOH
Source
Sink
Total Supply Current (4.) (5.)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
mAdc
IT = (1.8 µA/kHz) f + IDD
IT = (3.6 µA/kHz) f + IDD
IT = (5.4 µA/kHz) f + IDD
3. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
4. The formulas given are for the typical characteristics only at 25_C.
5. To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.001.
6. VH = VT+ – VT– (But maximum variation of VH is specified as less that VT+ max – VT– min).
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3
µAdc
MC14106B
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SWITCHING CHARACTERISTICS (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
VDD
Vdc
Min
Typ (7.)
Max
Unit
Output Rise Time
tTLH
5.0
10
15
—
—
—
100
50
40
200
100
80
ns
Output Fall Time
tTHL
5.0
10
15
—
—
—
100
50
40
200
100
80
ns
tPLH, tPHL
5.0
10
15
—
—
—
125
50
40
250
100
80
ns
Propagation Delay Time
7. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
INPUT
INPUT
7
VSS
20 ns
tPHL
CL
tPLH
90%
50%
10%
OUTPUT
tf
Figure 1. Switching Time Test Circuit and Waveforms
VDD
0
0
VDD
90%
50%
10%
Vout , OUTPUT VOLTAGE (Vdc)
PULSE
GENERATOR
20 ns
VDD
14
OUTPUT
VT+
VT–
VH
Vin, INPUT VOLTAGE (Vdc)
Figure 2. Typical Transfer Characteristics
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4
VDD
tr
VSS
VOH
VOL
MC14106B
APPLICATIONS
Vout
Vin
VDD
VH
Vin
VDD
VH
Vin
VSS
VSS
VDD
VDD
Vout
Vout
VSS
VSS
(a) Schmitt Triggers will square up
inputs with slow rise and fall times.
(b) A Schmitt trigger offers maximum
noise immunity in gate applications.
Figure 3.
VDD
VDD
R
C
tw
Rs
tw
Rs
Vout
Vout
C
R
tw = RC IN
Useful as Pushbutton/Keyboard Debounce Circuit.
Figure 4. Monostable Multivibrator
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5
VDD
VT+
MC14106B
1
f
t1
R
R
Vin
A
Vout
C
t2
C
* t1
[ RC ln VTT)
* t2
[ RC ln VVDDDD – VTT)
VDD
Vin VT+
VSS
V
–
1
f
A
ƪǒ Ǔǒ Ǔƫ
– V
[ RC ln
*t1 + t2
–
VDD – VT –
VDD – VT )
VDD
VT+
VSS
VT )
VDD
Vout VT+
VSS
VT –
& tPHL + tPLH
Useful in discriminating against short pulse durations.
Figure 5. Astable Multivibrator
Figure 6. Integrator
C
Vin
Vin
R
+ EDGE
– EDGE
– EDGE
C
C
C
+ EDGE
Vin
VDD
R
tw
R
R
VDD
tw = RC ln
VT+
Useful as an edge detector circuit.
Figure 7. Differentiator
Figure 8. Positive Edge Time Delay Circuit
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6
MC14106B
PACKAGE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE M
14
8
1
7
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
B
A
F
DIM
A
B
C
D
F
G
H
J
K
L
M
N
L
N
C
–T–
SEATING
PLANE
J
K
H
D 14 PL
G
M
0.13 (0.005)
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.290
0.310
–––
10_
0.015
0.039
MILLIMETERS
MIN
MAX
18.16
18.80
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.37
7.87
–––
10_
0.38
1.01
M
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
14
8
–B–
1
P 7 PL
0.25 (0.010)
7
G
B
M
M
R X 45 _
C
F
–T–
SEATING
PLANE
0.25 (0.010)
M
K
D 14 PL
M
T B
S
A
S
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7
J
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337
0.344
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.228
0.244
0.010
0.019
MC14106B
PACKAGE DIMENSIONS
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
–U–
L
PIN 1
IDENT.
F
7
1
0.15 (0.006) T U
N
S
DETAIL E
K
A
–V–
ÇÇÇ
ÉÉ
ÇÇÇ
ÉÉ
K1
J J1
SECTION N–N
–W–
C
0.10 (0.004)
–T– SEATING
PLANE
D
G
H
DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT
EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE –W–.
MILLIMETERS
INCHES
DIM MIN
MAX
MIN
MAX
A
4.90
5.10
0.193
0.200
B
4.30
4.50
0.169
0.177
C
–––
1.20
–––
0.047
D
0.05
0.15
0.002
0.006
F
0.50
0.75
0.020
0.030
G
0.65 BSC
0.026 BSC
H
0.50
0.60
0.020
0.024
J
0.09
0.20
0.004
0.008
J1
0.09
0.16
0.004
0.006
K
0.19
0.30
0.007
0.012
K1
0.19
0.25
0.007
0.010
L
6.40 BSC
0.252 BSC
M
0_
8_
0_
8_
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