DIODES SDM10K45

SDM10K45
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
Mechanical Data
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Fast Switching Speed
Ultra-Small Surface Mount Package
For General Purpose Switching Applications
High Conductance
Lead, Halogen and Antimony Free, RoHS Compliant "Green"
Device (Notes 3 and 4)
Qualified to AEC-Q101 Standards for High Reliability
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Case: SOD-323
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating).Solderable per MIL-STD-202, Method 208
Polarity: Cathode Band
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.006 grams (approximate)
Top View
Maximum Ratings
@TA = 25°C unless otherwise specified
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 1)
Forward Surge Current
@ t < 8.3ms
Symbol
VRRM
VRWM
VR
VR(RMS)
IFM
IFSM
Value
Unit
45
V
40
100
1.0
V
mA
A
Symbol
PD
RθJA
TJ, TSTG
Value
200
500
-40 to +150
Unit
mW
°C/W
°C
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Thermal Resistance Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range (Note 5)
Electrical Characteristics
Characteristic
Reverse Breakdown Voltage (Note 2)
Forward Voltage
Reverse Leakage Current (Note 2)
Total Capacitance
Notes:
@TA = 25°C unless otherwise specified
Symbol
V(BR)R
VF
IR
CT
Min
45
⎯
⎯
⎯
Typ
⎯
370
0.07
6.0
Max
⎯
450
1.0
⎯
Unit
⎯
mV
μA
pF
Test Condition
IR = 100μA
IF = 10mA
VR = 10V
VR = 10V, f = 1.0MHz
1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our
website at http://www.diodes.com/datasheets/ap02001.pdf
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code
V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
5. The heat generated must be less than the thermal conductivity from Junction-to-Ambient: dPD/dTJ < 1/RθJA
SDM10K45
Document number: DS30256 Rev. 15 - 2
1 of 4
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June 2010
© Diodes Incorporated
SDM10K45
IF, INSTANTANEOUS FORWARD CURRENT (mA)
IO, AVERAGE RECTIFIED CURRENT (mA)
100
80
60
40
20
TJ = 150° C
0
0
25
50
75
100
125
100
TA = 125ºC
TA = 75ºC
10
TA = 25ºC
TA = -25ºC
1.0
0.1
0
150
TA, AMBIENT TEMPERATURE (° C)
Fig. 1 Forward Current Derating Curve
200
400
600
1.0
800
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics
100
CT, TOTAL CAPACITANCE (pF)
1000
100
10
1.0
0.1
0.01
0
10
20
1.0
40
30
10
5.0
0
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
Fig. 3 Typical Reverse Characteristics
10
15
20
25
30
40
35
VR, REVERSE VOLTAGE (V)
Fig. 4 Total Capacitance vs. Reverse Voltage
Ordering Information (Note 6)
Part Number
SDM10K45-7-F
Notes:
Case
SOD-323
Packaging
3000/Tape & Reel
6. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
LG
SDM10K45
Document number: DS30256 Rev. 15 - 2
LG = Product Type Marking Code
Cathode band denotes polarity
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June 2010
© Diodes Incorporated
SDM10K45
Package Outline Dimensions
C
H
A
B
M
K
L
J
SOD-323
Dim
Min
Max
A
0.25
0.35
B
1.20
1.40
C
2.30
2.70
H
1.60
1.80
J
0.00
0.10
K
1.0
1.1
L
0.20
0.40
M
0.10
0.15
0°
8°
α
All Dimensions in mm
Suggested Pad Layout
C
Dimensions Value (in mm)
Z
3.75
G
1.05
X
0.65
Y
1.35
C
2.40
X
Y
G
Z
SDM10K45
Document number: DS30256 Rev. 15 - 2
3 of 4
www.diodes.com
June 2010
© Diodes Incorporated
SDM10K45
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
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acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2010, Diodes Incorporated
www.diodes.com
SDM10K45
Document number: DS30256 Rev. 15 - 2
4 of 4
www.diodes.com
June 2010
© Diodes Incorporated