NCP2809 Series NOCAPt 135 mW Stereo Headphone Power Amplifier The NCP2809 is a cost−effective stereo audio power amplifier capable of delivering 135 mW of continuous average power per channel into 16 loads. The NCP2809 audio power amplifier is specifically designed to provide high quality output power from low supply voltage, requiring very few external components. Since NCP2809 does not require bootstrap capacitors or snubber networks, it is optimally suited for low−power portable systems. NCP2809A has an internal gain of 0 dB while specific external gain can externally be set with NCP2809B. If the application allows it, the virtual ground provided by the device can be connected to the middle point of the headset (Figure 1). In such case, the two external heavy coupling capacitors typically used can be removed. Otherwise, you can also use both outputs in single ended mode with external coupling capacitors (Figure 43). Due to its excellent Power Supply Rejection Ratio (PSRR), it can be directly connected to the battery, saving the use of an LDO. Features • • • • • • • • • 135 mW to a 16 Load from a 5.0 V Power Supply Excellent PSRR (85 dB Typical): Direct Connection to the Battery “Pop and Click” Noise Protection Circuit Ultra Low Current Shutdown Mode 2.2 V–5.5 V Operation Outstanding Total Harmonics Distortion + Noise (THD+N): Less than 0.01% External Turn−on and Turn−off Configuration Capability Thermal Overload Protection Circuitry Pb−Free Packages are Available January, 2006 − Rev. 8 Micro10 DM SUFFIX CASE 846B 10 1 MAx AYWG G x = E for NCP2809A C for NCP2809B A = Assembly Location Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) PIN CONNECTIONS IN_R 1 10 SD BYP 2 3 9 8 REF_I 4 7 VP IN_L 5 6 OUT_L OUT_R VM OUT_I See detailed ordering and shipping information in the package dimensions section on page 20 of this data sheet. Cellular Phone Portable Stereo MP3 Player Personal and Notebook Computers © Semiconductor Components Industries, LLC, 2006 MARKING DIAGRAM ORDERING INFORMATION Typical Applications • • • • http://onsemi.com 1 Publication Order Number: NCP2809/D NCP2809 Series VP 1 F CS VP CI AUDIO INPUT 20 k 20 k IN_L 390 nF VP BYPASS − + OUT_L + − OUT_I HEADPHONE JACK LEFT BYPASS VMC BRIDGE SLEEVE 1 F Cbypass REF_I CI AUDIO INPUT RIGHT + − IN_R OUT_R 20 k 390 nF 20 k SHUTDOWN VIH VM VIL SHUTDOWN CONTROL Figure 1. NCP2809A Typical Application Schematic without Output Coupling Capacitor (NOCAP Configuration) VP 1 F CS VP AUDIO INPUT CI 20 k IN_L 390 nF VP BYPASS VMC BRIDGE 1 F AUDIO INPUT CI BYPASS 20 k − + OUT_L + − OUT_I Cout REF_I + − IN_R OUT_R HEADPHONE JACK LEFT NC NC 220 F + SLEEVE RIGHT Cout 20 k 390 nF 220 F + 20 k SHUTDOWN VIH VIL SHUTDOWN CONTROL VM Figure 2. NCP2809A Typical Application Schematic with Output Coupling Capacitor TIP (LEFT) RING SLEEVE (RIGHT) Figure 3. Typical 3−Wire Headphone Plug http://onsemi.com 2 NCP2809 Series 20 k VP 1 F AUDIO INPUT CI 20 k CS VP IN_L 390 nF VP BYPASS − + OUT_L + − OUT_I HEADPHONE JACK LEFT BYPASS VMC BRIDGE SLEEVE 1 F Cbypass REF_I RIGHT AUDIO INPUT CI 20 k + − IN_R OUT_R 390 nF SHUTDOWN SHUTDOWN CONTROL VM VIH VIL 20 k Figure 4. NCP2809B Typical Application Schematic without Output Coupling Capacitor (NOCAP Configuration) 20 k VP 1 F CS VP AUDIO INPUT CI 20 k IN_L VP 390 nF BYPASS BYPASS 1 F Cbypass AUDIO INPUT CI 20 k VMC BRIDGE − + OUT_L + − OUT_I IN_R 390 nF SHUTDOWN OUT_R HEADPHONE JACK LEFT NC SLEEVE NC 220 F + RIGHT Cout SHUTDOWN CONTROL VIH VIL Cout REF_I + − 220 F + VM 20 k Figure 5. NCP2809B Typical Application Schematic with Output Coupling Capacitor http://onsemi.com 3 NCP2809 Series PIN FUNCTION DESCRIPTION Pin Type Symbol 1 I IN_R 2 I SHUTDOWN 3 I BYPASS 4 O REF_I 5 I IN_L 6 O OUT_L 7 I VP 8 O OUT_I 9 I VM 10 O OUT_R Description Negative input of the second amplifier. It receives the audio input signal. Connected to the input capicator Cin (NCP2809A) or the external Rin (NCP2809B). The device enters in shutdown mode when a a low level is applied on this pin. Bypass capacitor pin which provides the common mode voltage (VP/2). Virtual ground amplifier feed back. This pin sets the stereo headset ground. In order to improve crosstalk, this pin must be connected as close as possible to the ground connection of the headset (ideally at the ground pin of the headset connector). When one uses bypassing capacitors, this pin must be left unconnected. Negative input of the first amplifier. It receives the audio input signal. Connected to the input capacitor Cin (NCP2809A) or the external Rin (NCP2809B). Stereo headset amplifier analog output left. This pin will output the amplified analog signal and, depending on the application, must be coupled with a capacitor or directly connected to the left loudspeaker of the headset. This output is able to drive a 16 load in a single−ended configuration. Positive analog supply of the cell. Range: 2.2 V – 5.5 V Virtual ground for stereo Headset common connection. This pin is directly connected to the common connection of the headset when use of bypassing capacitor is not required. When one uses bypassing capacitors, this pin must be left unconnected. Analog Ground Stereo headset amplifier analog output right. This pin will output the amplified analog signal and, depending on the application, must be coupled with a capacitor or directly connected to the right loudspeaker of the headset. This output is able to drive a 16 load in a single−ended configuration. MAXIMUM RATINGS (TA = +25°C) Rating Symbol Value Unit Vp 6.0 V Op Vp 2.2 to 5.5 V Input Voltage Vin −0.3 to VCC + 0.3 V Max Output Current Iout 250 mA Power Dissipation Pd Internally Limited − Operating Ambient Temperature TA −40 to +85 °C Max Junction Temperature TJ 150 °C Storage Temperature Range Tstg −65 to +150 °C Thermal Resistance, Junction−to−Air RJA 200 °C/W − 8000 200 V ±100 mA Supply Voltage Operating Supply Voltage ESD Protection Human Body Model (HBM) (Note 1) Machine Model (MM) (Note 2) Latch up current at Ta = 85_C (Note 3) Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If stress limits are exceeded device functional operation is not implied, damage may occur and reliability may be affected. Functional operation should be restricted to the Recommended Operating Conditions. 1. Human Body Model, 100 pF discharged through a 1.5 k resistor following specification JESD22/A114 8.0 kV can be applied on OUT_L, OUT_R, REF_I and OUT_I outputs. For other pins, 2.0 kV is the specified voltage. 2. Machine Model, 200 pF discharged through all pins following specification JESD22/A115. 3. Maximum ratings per JEDEC standard JESD78. *This device contains 752 active transistors and 1740 MOS gates. http://onsemi.com 4 NCP2809 Series ELECTRICAL CHARACTERISTICS All the parameters are given in the capless configuration (typical application). The following parameters are given for the NCP2809A and NCP2809B mounted externally with 0 dB gain, unless otherwise noted. (For typical values TA = 25°C, for min and max values TA = −40°C to 85°C, TJmax = 125°C, unless otherwise noted.) Characteristic Supply Quiescent Current Symbol Conditions IDD Vin = 0 V, RL = 16 Vp = 2.4 V Vp = 5.0 V Min (Note 4) Typ Max (Note 4) 1.54 1.84 2.8 3.6 1.0 +25 mV 10 600 nA Unit mA Output Offset Voltage Voff Vp = 2.4 V Vp = 5.0 V Shutdown Current ISD Vp = 5.0 V Shutdown Voltage High (Note 5) VSDIH − Shutdown Voltage Low VSDIL − Turning On Time (Note 6) TWU Cby = 1.0 F 285 ms Turning Off Time (Note 6) TSD Cby = 1.0 F and Vp = 5.0 V 385 ms Vloadpeak Vp = 2.4 V, RL = 16 Vp = 5.0 V, RL = 16 0.9 2.05 V Max Output Swing Max Rms Output Power Voltage Gain Crosstalk Signal to Noise Ratio POrms −25 1.2 V 0.4 0.82 1.94 Vp = 2.4 V, RL = 32 Vp = 5.0 V, RL = 32 1.04 2.26 Vp = 2.4 V, RL = 16 , THD+N<0.1% Vp = 5.0 V, RL = 16 , THD+N<0.1% 24 131 Vp = 2.4 V, RL = 32 , THD+N<0.1% Vp = 5.0 V, RL = 32 , THD+N<0.1% 17 80 G NCP2809A only CS f = 1.0 kHz Vp = 2.4 V, RL = 16 , Pout = 20 mW Vp = 2.4 V, RL = 32 , Pout = 10 mW −63.5 −72.5 Vp = 3.0 V, RL = 16 , Pout = 30 mW Vp = 3.0 V, RL = 32 , Pout = 20 mW −64 −73 Vp = 5.0 V, RL = 16 , Pout = 75 mW Vp = 5.0 V, RL = 32 , Pout = 50 mW −64 −73 f = 1.0 kHz Vp = 2.4 V, RL = 16 , Pout = 20 mW Vp = 2.4 V, RL = 32 , Pout = 10 mW 88.3 89 Vp = 3.0 V, RL = 16 , Pout = 30 mW Vp = 3.0 V, RL = 32 , Pout = 20 mW 90.5 92 Vp = 5.0 V, RL = 16 , Pout = 75 mW Vp = 5.0 V, RL = 32 , Pout = 50 mW 95.1 96.1 SNR 4. Min/Max limits are guaranteed by production test. 5. At TA = −40°C, the minimum value is set to 1.5 V. 6. See page 10 for a theoretical approach to these parameters. http://onsemi.com 5 −0.5 0 V mW +0.5 dB dB dB NCP2809 Series ELECTRICAL CHARACTERISTICS All the parameters are given in the capless configuration (typical application). The following parameters are given for the NCP2809A and NCP2809B mounted externally with 0 dB gain, unless otherwise noted. (For typical values TA = 25°C, for min and max values TA = −40°C to 85°C, TJmax = 125°C, unless otherwise noted.) Characteristic Positive Supply Rejection Ratio Min (Note 7) Symbol Conditions Typ PSRR V+ RL = 16 Vpripple_pp = 200 mV Cby = 1.0 F Input Terminated with 10 NCP2809A F = 217 Hz Vp = 5.0 V Vp = 2.4 V −73 −82 F = 1.0 kHz Vp = 5.0 V Vp = 2.4 V −73 −85 Max (Note 7) Unit dB RL = 16 Vpripple_pp = 200 mV Cby = 1.0 F Input Terminated with 10 NCP2809B with 0 dB External Gain F = 217 Hz Vp = 5.0 V Vp = 2.4 V −80 −82 F = 1.0 kHz Vp = 5.0 V Vp = 2.4 V −81 −81 VP = 5.0 V, RL = 16 = 135 mW 63 % Thermal Shutdown Temperature (Note 8) Tsd − 160 °C Total Harmonic Distortion + Noise (Note 9) THD+N VP = 2.4 V, f = 1.0 kHz RL = 16 , Pout = 20 mW RL = 32 , Pout = 15 mW 0.006 0.004 VP = 5.0 V, f = 1.0 kHz RL = 16 , Pout = 120 mW RL = 32 , Pout = 70 mW 0.005 0.003 Positive Supply Rejection Ratio Efficiency PSRR V+ dB % 7. Min/Max limits are guaranteed by production test. 8. This thermal shutdown is made with an hysteresis function. Typically, the device turns off at 160°C and turns on again when the junction temperature is less than 140°C. 9. The outputs of the device are sensitive to a coupling capacitor to Ground. To ensure THD+N at very low level for any sort of headset (16 or 32 , outputs (OUT_R, OUT_L, OUT_I and REF_I) must not be grounded with more than 500 pF. http://onsemi.com 6 NCP2809 Series 10 10 1 1 THD+N (%) THD+N (%) TYPICAL CHARACTERISTICS 0.1 0.01 0.001 10 0.1 0.01 100 1000 10000 FREQUENCY (Hz) 0.001 10 100000 10 10 1 1 0.1 0.01 0.001 10 0.01 100 1000 10000 FREQUENCY (Hz) 0.001 10 100000 100 1000 10000 FREQUENCY (Hz) 100000 Figure 9. THD+N vs. Frequency Vp = 3.0 V, RL = 32 , Pout = 20 mW 10 10 1 1 THD+N (%) THD+N (%) 100000 0.1 Figure 8. THD+N vs. Frequency Vp = 3.0 V, RL = 16 , Pout = 30 mW 0.1 0.01 0.001 10 1000 10000 FREQUENCY (Hz) Figure 7. THD+N vs. Frequency Vp = 5.0 V, RL = 32 , Pout = 50 mW THD+N (%) THD+N (%) Figure 6. THD+N vs. Frequency Vp = 5.0 V, RL = 16 , Pout = 75 mW 100 0.1 0.01 100 1000 10000 FREQUENCY (Hz) 100000 0.001 10 Figure 10. THD+N vs. Frequency Vp = 2.4 V, RL = 16 , Pout = 20 mW 100 1000 10000 FREQUENCY (Hz) Figure 11. THD+N vs. Frequency Vp = 2.4 V, RL = 32 , Pout = 10 mW http://onsemi.com 7 100000 NCP2809 Series 10 10 1 1 THD+N (%) THD+N (%) TYPICAL CHARACTERISTICS 0.1 0.01 0.001 0 0.1 0.01 20 40 60 80 100 120 140 0.001 0 160 10 20 30 OUTPUT POWER (mW) 1 1 THD+N (%) THD+N (%) 10 0.1 0.01 70 80 90 0.1 0.01 10 20 30 40 50 0.001 0 60 10 OUTPUT POWER (mW) 20 30 40 OUTPUT POWER (mW) Figure 14. THD+N vs. Power Out Vp = 3.3 V, RL = 16 , 1.0 kHz Figure 15. THD+N vs. Power Out Vp = 3.3 V, RL = 32 , 1.0 kHz 10 10 1 1 THD+N (%) THD+N (%) 60 Figure 13. THD+N vs. Power Out Vp = 5.0 V, RL = 32 , 1.0 kHz 10 0.1 0.01 0.001 0 50 OUTPUT POWER (mW) Figure 12. THD+N vs. Power Out Vp = 5.0 V, RL = 16 , 1.0 kHz 0.001 0 40 0.1 0.01 10 20 30 40 0.001 0 50 OUTPUT POWER (mW) 5 10 15 20 25 30 OUTPUT POWER (mW) Figure 17. THD+N vs. Power Out Vp = 3.0 V, RL = 32 , 1.0 kHz Figure 16. THD+N vs. Power Out Vp = 3.0 V, RL = 16 , 1.0 kHz http://onsemi.com 8 35 NCP2809 Series 10 10 1 1 THD+N (%) THD+N (%) TYPICAL CHARACTERISTICS 0.1 0.01 0.001 0.1 0.01 0 5 10 15 20 25 0.001 30 0 5 OUTPUT POWER (mW) −50 −50 CROSSTALK (dB) CROSSTALK (dB) −40 −60 −70 −60 −70 100 1000 10000 100000 −80 10 100 FREQUENCY (Hz) 1000 10000 100000 FREQUENCY (Hz) Figure 21. Crosstalk Vp = 5.0 V, RL = 32 , Pout = 50 mW Figure 20. Crosstalk Vp = 5.0 V, RL = 16 , Pout = 75 mW −40 −40 −50 −50 CROSSTALK (dB) CROSSTALK (dB) 20 Figure 19. THD+N vs. Power Out Vp = 2.4 V, RL = 3.2 , 1.0 kHz −40 −60 −70 −80 10 15 OUTPUT POWER (mW) Figure 18. THD+N vs. Power Out Vp = 2.4 V, RL = 16 , 1.0 kHz −80 10 10 −60 −70 100 1000 10000 100000 −80 10 FREQUENCY (Hz) 100 1000 10000 FREQUENCY (Hz) Figure 23. Crosstalk Vp = 3.0 V, RL = 32 , Pout = 20 mW Figure 22. Crosstalk Vp = 3.0 V, RL = 16 , Pout = 30 mW http://onsemi.com 9 100000 NCP2809 Series −40 −40 −50 −50 CROSSTALK (dB) CROSSTALK (dB) TYPICAL CHARACTERISTICS −60 −70 −80 10 −60 −70 100 1000 10000 −80 10 100000 100 FREQUENCY (Hz) −10 −10 −20 NCP2809A −30 −30 −40 −40 PSRR (dB) PSRR (dB) −20 −50 −60 −70 −60 −70 −80 −90 −90 −100 −100 100 1000 10000 NCP2809A −50 −80 −110 10 100000 100 FREQUENCY (Hz) 10000 100000 Figure 27. PSRR − Input Grounded with 10 Vp = 2.4 V, Vripple = 200 mV pk−pk, RL = 32 −10 −10 −20 −20 NCP2809A −30 −30 −40 −40 PSRR (dB) PSRR (dB) 1000 FREQUENCY (Hz) Figure 26. PSRR − Input Grounded with 10 Vp = 2.4 V, Vripple = 200 mV pk−pk, RL =16 −50 −60 −70 −60 −70 −80 −90 −90 −100 −100 100 1000 10000 100000 NCP2809A −50 −80 −110 10 100000 Figure 25. Crosstalk Vp = 2.4 V, RL = 32 , Pout = 10 mW Figure 24. Crosstalk Vp = 2.4 V, RL = 16 , Pout = 20 mW −110 10 1000 10000 FREQUENCY (Hz) −110 10 100 FREQUENCY (Hz) 1000 10000 100000 FREQUENCY (Hz) Figure 29. PSRR − Input Grounded with 10 Vp =3.0 V, Vripple = 200 mV pk−pk, RL = 32 Figure 28. PSRR − Input Grounded with 10 Vp = 3.0 V, Vripple = 200 mV pk−pk, RL =16 http://onsemi.com 10 NCP2809 Series TYPICAL CHARACTERISTICS −10 −10 −20 NCP2809A −30 −30 −40 −40 PSRR (dB) PSRR (dB) −20 −50 −60 −70 −80 −50 −60 −70 −80 −90 −90 −100 −100 −110 10 NCP2809A 100 1000 10000 −110 10 100000 100 FREQUENCY (Hz) −10 100000 −10 −20 −20 NCP2809A −30 −30 −40 −40 PSRR (dB) PSRR (dB) 10000 Figure 31. PSRR − Input Grounded with 10 Vp = 3.3 V, Vripple = 200 mV pk−pk, RL = 32 Figure 30. PSRR − Input Grounded with 10 Vp = 3.3 V, Vripple = 200 mV pk−pk, RL =16 −50 −60 −70 −60 −70 −80 −90 −90 −100 −100 100 1000 10000 100000 NCP2809A −50 −80 −110 10 1000 FREQUENCY (Hz) −110 10 100 FREQUENCY (Hz) 1000 10000 100000 FREQUENCY (Hz) Figure 32. PSRR − Input Grounded with 10 Vp = 5.0 V, Vripple = 200 mV pk−pk, RL =16 Figure 33. PSRR − Input Grounded with 10 Vp = 5.0 V, Vripple = 200 mV pk−pk, RL = 32 http://onsemi.com 11 NCP2809 Series TYPICAL CHARACTERISTICS −10 −10 −20 NCP2809B −30 −30 −40 −40 PSRR (dB) PSRR (dB) −20 −50 −60 −70 −80 NCP2809B −50 −60 −70 −80 −90 −90 −100 −100 −110 −110 10 100 1000 10000 100000 10 100 FREQUENCY (Hz) 10000 100000 FREQUENCY (Hz) Figure 34. PSRR − Input Grounded with 10 Vp = 2.4 V, Vripple = 200 mV pk−pk, RL =16 , G = 1 (0 dB) Figure 35. PSRR − Input Grounded with 10 Vp = 5.0 V, Vripple = 200 mV pk−pk, RL = 16 , G = 1 (0 dB) −10 −10 −20 −20 NCP2809B −30 NCP2809B −30 −40 PSRR (dB) −40 PSRR (dB) 1000 G=4 −50 −60 G=1 −70 −80 G=4 −50 −60 G=1 −70 −80 −90 −90 −100 −100 −110 −110 10 100 1000 10000 100000 10 100 FREQUENCY (Hz) 1000 10000 100000 FREQUENCY (Hz) Figure 37. PSRR − Input Grounded with 10 Vp = 5.0 V, Vripple = 200 mV pk−pk, RL = 16 , G = 1 (0 dB) and G = 4 (12 dB) Figure 36. PSRR − Input Grounded with 10 Vp = 2.4 V, Vripple = 200 mV pk−pk, RL =16 , G = 1 (0 dB) and G = 4 (12 dB) http://onsemi.com 12 NCP2809 Series TYPICAL CHARACTERISTICS Figure 38. Turning–On Time/Vp = 5.0 V and F = 100 Hz Ch1 = OUT_R, Ch2 = VMC and Ch3 = Shutdown Figure 39. Turning–On Time Zoom/Vp = 5.0 V and F = 400 Hz Ch1 = OUT_R, Ch2 = VMC and Ch3 = Shutdown Figure 40. Turning–Off Time/Vp = 5.0 V and F = 100 Hz Ch1 = OUT_R, Ch2 = VMC and Ch3 = Shutdown Figure 41. TurningOff Time Zoom/Vp = 5.0 V and F = 400 Hz Ch1 = OUT_R, Ch2 = VMC and Ch3 = Shutdown http://onsemi.com 13 NCP2809 Series APPLICATION INFORMATION Current Limit Protection Circuitry The maximum output power of the circuit (POrms = 135 mW, VP = 5.0 V, RL = 16 ) requires a peak current in the load of 130 mA. In order to limit excessive power dissipation in the load when a short−circuit occurs, the current limit in the load is fixed to 250 mA. The current in the output MOS transistors is real−time monitored, and when exceeding 250 mA, the gate voltage of the corresponding MOS transistor is clipped and no more current can be delivered. Detailed Description The NCP2809 power audio amplifier can operate from 2.6 V to 5.0 V power supply. It delivers 24 mWrms output power to a 16 load (VP = 2.4 V) and 131 mWrms output power to a 16 load (VP = 5.0 V). The structure of NCP2809 is basically composed of two identical internal power amplifiers; NCP2809A has a fixed internal gain of 0 dB and the gain can be set externally with the NCP2809B. Internal Power Amplifier The output Pmos and Nmos transistors of the amplifier are designed to deliver the specified output power without clipping. The channel resistance (Ron) of the Nmos and Pmos transistors does not exceed 3.0 when driving current. The structure of the internal power amplifier is composed of three symmetrical gain stages, first and medium gain stages are transconductance gain stages in order to maximize bandwidth and DC gain. Thermal Overload Protection Circuitry Internal amplifiers are switched off when temperature exceeds 160°C, and will be switched back on only when the temperature goes below 140°C. NCP2809 is a stereo power audio amplifier. If the application requires a Single Ended topology with output coupling capacitors, then the current provided by the battery for one output is as following: • VO(t) is the AC voltage seen by the load. Here we consider a sine wave signal with a period T and a peak voltage VO. • RL is the load. Turn−On and Turn−Off Transitions A Turn−on/off transition is shown in the following plot corresponding to curves in Figures 38 to 41. In order to eliminate “pop and click” noises during transitions, output power in the load must be slowly established or cut. When logic high is applied to the shutdown pin, the bypass voltage begins to rise exponentially and once the output DC level is around the common mode voltage, the gain is established slowly (50 ms). This way to turn−on the device is optimized in terms of rejection of “pop and click” noises. The device has the same behavior when turned−off by a logic low on the shutdown pin. During the shutdown mode, amplifier outputs are connected to the ground. A theoretical value of turn−on and off times at 25°C is given by the following formula. Cby: Bypass Capacitor R: Internal 300 k resistor with a 25% accuracy Ton = 0.95 * R * Cby Toff = R * Cby * Ln(Vp/1.4) Ip(t) VO/RL T/2 T TIME So, the total power delivered by the battery to the device is: PTOT + Vp Ipavg Ipavg + 1 2 ŕ 0 RVoL sin(t)dt + .RVoL Vp.Vo PTOT + .RL The power in the load is POUT. Shutdown Function The device enters shutdown mode when shutdown signal is low. During the shutdown mode, the DC quiescent current of the circuit does not exceed 600 nA. V 2 POUT + O 2RL http://onsemi.com 14 NCP2809 Series The dissipated power by the device is The power in the load is POUT PD + PTOT * POUT V 2 POUT + O 2RL ƪVP * V2Oƫ V PD + o RL The dissipated power by the device is PD + PTOT * POUT At a given power supply voltage, the maximum power dissipated is: V PD + o RL VP2 PDmax + 22.RL At a given power supply voltage, the maximum power dissipated is: Of course, if the device is used in a typical stereo application, each load with the same output power will give the same dissipated power. Thus the total lost power for the device is: V PD + o RL 2VP2 PDmax + 2.RL Of course, if the device is used in a typical stereo application, each load with the same output power will give the same dissipated power. Thus the total lost power for the device is: ƪ2VP * VOƫ And in this case, the maximum power dissipated will be: V 2 PDmax + P 2.RL V PD + o RL .VO 2VP 4VP2 PDmax + 2.RL If the application requires a NOCAP scheme without output coupling capacitors, then the current provided by the battery for one output is as following: • Vo(t) is the AC voltage seen by the load. Here we consider a sine wave signal with a period T and a peak voltage VO. • RL is the load. In NOCAP operation, the efficiency is: + VO/RL T TIME So, the total power delivered by the battery to the device is: PTOT + Vp Ipavg + 1 .VO 4VP Gain−Setting Selection With NCP2809 Audio Amplifier family, you can select a closed−loop gain of 0db for the NCP2809A and an external gain setting with the NCP2809B. In order to optimize device and system performance, NCP2809 needs to be used in low gain configurations. It minimizes THD+N values and maximizes the signal−to−noise ratio, and the amplifier can still be used without running into the bandwidth limitations. NCP2809A can be used when a 0 dB gain is required. Adjustable gain is available on NCP2809B. Ip(t) T/2 ƪ4VP * VOƫ And in this case, the maximum power dissipated will be: In single ended operation, the efficiency is: + ƪ2VP * V2Oƫ Ipavg 2Vo ŕ 0 RVoL sin(t)dt + .R L 2Vp.Vo PTOT + .RL http://onsemi.com 15 NCP2809 Series With Output Coupling Capacitor NCP2809 Amplifier External Components However, when using a low cost jack connector (with third connection to ground), the headset amplifier requires very few external components as described in Figure 43. Only two external coupling capacitors are needed. The main concern is in output coupling capacitors, because of the value and consequently the size of the components required. Purpose of these capacitors is biasing DC voltage and very low frequency elimination. Both, coupling capacitor and output load form a high pass filter. Audible frequency ranges from 20 Hz to 20 kHz, but headset used in portable appliance has poor ability to reproduce signals below 75 or 100 Hz. Input coupling capacitor and input resistance also form a high pass filter. These two first order filters form a second order high pass filter with the same −3 dB cut off frequency. Consequently, the following formula must be respected: Input Capacitor Selection (Cin) The input coupling capacitor blocks the DC voltage at the amplifier input terminal. This capacitor creates a high−pass filter with the internal Rinternal resistor of 50 k, the cut−off frequency of which is given by: 1 fc + 2 * * Rin * Cin (eq. 1) The size of the capacitor must be large enough to couple in low frequencies without severe attenuation. However a large input coupling capacitor requires more time to reach its quiescent DC voltage (VP/2) and can increase the turn−on pops. An input capacitor value of 100 nF performs well in many applications (With Rinternal =50 k). Bypass Capacitor Selection (Cbypass) The bypass capacitor Cby provides half−supply filtering and determines how fast the NCP2809 turns on. A proper supply bypassing is critical for low noise performance and high power supply rejection ratio. Moreover, this capacitor is a critical component to minimize the turn−on pop noise. A 1.0 F bypass capacitor value should produce clickless and popless shutdown transitions. The amplifier is still functional with a 0.1 F capacitor value but is more sensitive to “pop and click” noises. Thus, for optimized performances, a 1.0 F ceramic bypassing capacitor is recommended. 2 1 50 k Cin [ 2 1 RL Cout (eq. 2) Like for loudspeaker amplifier, the input impedance value for calculating filters cut off frequency is the minimum input impedance value at maximum output volume. To obtain a frequency equal to when frequency is 5 times the cut off frequency, attenuation is 0.5 dB. So if we want a ±0.5 dB at 150 Hz, we need to have a –3 dB cut off frequency of 30 Hz: f−3dB w 2 Cout w 2 Without Output Coupling Capacitor As described in Figure 42, the internal circuitry of the NCP2809 device eliminates need of heavy bypassing capacitors when connecting a stereo headset with 3 connecting points. This circuitry produces a virtual ground and does not affect either output power or PSRR. Additionally, eliminating these capacitors reduces cost and PCB place. However, user must take care to the connection between pin REF_I and ground of the headset: this pin is the ground reference for the headset. So, in order to improve crosstalk performances, this pin must be plugged directly to the ground pin of the headset connector. 1 RL 1 RL Cout f−3dB (eq. 3) (eq. 4) With RL = 16 , and f−3dB = 30 Hz formula (4) shows that Cout ≥ 330 F. With Cout = 220 F, ±0.5 dB attenuation frequency will be 225 Hz with a –3.0 dB cut off frequency of 45 Hz. Following this, the input coupling capacitor choice is straightforward. Using formula (2) input coupling capacitor value would be 68 nF for a 220 F output coupling capacitor and 100 nF for a 330 F output coupling capacitor. When using the NCP2809 with this configuration, pins REF_I and OUT_I must be left unconnected (see Figure 43). http://onsemi.com 16 NCP2809 Series VP 1 F CS VP 20 k CI AUDIO INPUT 20 k IN_L 390 nF VP BYPASS Cbypass OUT_L + 16 + − VMC BRIDGE 1 F CI AUDIO INPUT BYPASS − + − OUT_I − REF_I + − IN_R 16 + OUT_R 20 k 390 nF 20 k SHUTDOWN SHUTDOWN CONTROL VIH VM VIL Figure 42. Typical Application Schematic Without Output Coupling Capacitor VP 1 F CS VP 20 k CI AUDIO INPUT 20 k IN_L 390 nF VP BYPASS Cbypass OUT_L Cout + − VMC BRIDGE OUT_I + + − IN_R 20 k − NC − REF_I 390 nF 220 F + 16 1 F CI AUDIO INPUT BYPASS − + OUT_R NC 220 F + 16 + Cout 20 k SHUTDOWN SHUTDOWN CONTROL VIH VIL VM Figure 43. Typical Application Schematic With Output Coupling Capacitor http://onsemi.com 17 NCP2809 Series DEMONSTRATION BOARD AND LAYOUT GUIDELINES VP VP J4 1 F C1 VM1 VM1 VP C2 20 k 1 IN_R 390 nF VP U1 7 2 − 3 + BYPASS + 20 k 16 1 OUT_R 1 OUT_I 8 REF_I 4 OUT_L 6 − 10 J3 & U2 J2 3 BYPASS VM1 VMC BRIDGE 1 F C3 3 + 2 − VM1 C4 3 + 2 − 5 IN_L − 20 k 390 nF VP R1 1 16 20 k + 100 k 2 SHUTDOWN SHUTDOWN CONTROL J1 VM 9 VM1 VM1 VP VP J10 1 F C5 VM2 VM2 VP C6 20 k 1 IN_R 390 nF VP U3 7 BYPASS + 20 k 2 − 3 + 1 16 OUT_R 10 + C9 − 220 F J9 & U4 J8 3 BYPASS 1 F C7 VM2 3 + 2 − VMC BRIDGE 1 OUT_I 8 REF_I 4 OUT_L 6 VM2 C8 5 IN_L 1 20 k 390 nF VP R2 3 + 2 − NC NC VM2 C10 + 220 F 20 k 100 k 2 SHUTDOWN SHUTDOWN CONTROL J7 VM VM2 9 VM2 Figure 44. Schematic of the Demonstration Board for Micro10 Device http://onsemi.com 18 VM2 − 16 + NCP2809 Series TOP LAYER BOTTOM LAYER Figure 45. Demonstration Board for Micro10 Device – PCB Layers http://onsemi.com 19 NCP2809 Series Table 1. Bill of Material Item Part Description Ref. PCB Footprint Manufacturer Manufacturer Reference 1 NCP2809 Audio Amplifier U1,U3 Micro10 ON Semiconductor NCP2809 2 SMD Resistor 100 K R1,R2 0805 Vishay−Draloric D12CRCW Series 3 Ceramic Capacitor 390 nF 50 V Z5U C2,C4, C6,C8 1812 Kemet C1812C394M5UAC 4 Ceramic Capacitor 1.0 F 16 V X7R Optimized Performance C1,C3, C5,C7 1206 Murata GRM42−6X7R105K16 5 Tantalum Capacitor 220 F 10 V C9,C10 − Kemet T495X227010AS 6 I/O Connector. It can be plugged by BLZ5.08/2 (Weidmüller Reference) J4,J10 − Weidmüller SL5.08/2/90B 7 I/O Connector. It can be plugged by BLZ5.08/3 (Weidmüller Reference) J2,J3, J8,J9 − Weidmüller SL5.08/3/90B 8 3.5 mm PCB Jack Connector U2,U4 − Decelect−Forgos IES 101−3 9 Jumper Header Vertical Mount 2*1, 2.54 mm J1,J7 − − − PCB LAYOUT GUIDELINES How to Optimize the Accuracy of VMC How to Optimize THD+N Performances The main innovation of the NCP2809 stereo NOCAP audio amplifier is the use of a virtual ground that allows connecting directly the headset on the outputs of the device saving DC−blocking output capacitors. In order to have the best performances in terms of crosstalk, noise and supply current, the feedback connection on the virtual ground amplifier is not closed internally. To reach this goal of excellence, one must connect OUT_I and REF_I as close as possible from the middle point of the output jack connector. The most suitable place for this connection is directly on the pad of this middle point. To get the best THD+N level on the headset speakers, the traces of the power supply, ground, OUT_R, OUT_L and OUT_I need the lowest resistance. Thus, the PCB traces for these nets should be as wide and short as possible. You need to avoid ground loops, run digital and analog traces parallel to each other. Due to its internal structure, the amplifier can be sensitive to coupling capacitors between Ground and each output (OUT_R, OUT_L and OUT_I). Avoid running the output traces between two ground layers or if traces must cross over on different layers, do it at 90 degrees. ORDERING INFORMATION Device Marking Package Shipping† NCP2809ADMR2 MAE Micro10 4000 Tape & Reel NCP2809ADMR2G MAE Micro10 (Pb−Free) 4000 Tape & Reel NCP2809BDMR2 MAC Micro10 4000 Tape & Reel NCP2809BDMR2G MAC Micro10 (Pb−Free) 4000 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 20 NCP2809 Series PACKAGE DIMENSIONS Micro10 CASE 846B−03 ISSUE D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION “A” DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION “B” DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. 846B−01 OBSOLETE. NEW STANDARD 846B−02 −A− −B− K D 8 PL 0.08 (0.003) PIN 1 ID G 0.038 (0.0015) −T− SEATING PLANE M T B S A DIM A B C D G H J K L S C H MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.95 1.10 0.20 0.30 0.50 BSC 0.05 0.15 0.10 0.21 4.75 5.05 0.40 0.70 L J SOLDERING FOOTPRINT* 10X 1.04 0.041 0.32 0.0126 3.20 0.126 8X 0.50 0.0196 10X 4.24 0.167 5.28 0.208 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 21 INCHES MIN MAX 0.114 0.122 0.114 0.122 0.037 0.043 0.008 0.012 0.020 BSC 0.002 0.006 0.004 0.008 0.187 0.199 0.016 0.028 NCP2809 Series NOCAP is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Phone: 81−3−5773−3850 Email: [email protected] http://onsemi.com 22 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. NCP2809/D