HT9200A/HT9200B DTMF Generators Features · Operating voltage: 2.5V~5.5V · Low total harmonic distortion · Serial mode for the HT9200A · 3.58MHz crystal or ceramic resonator · Serial/parallel mode for the HT9200B · HT9200A: 8-pin DIP/SOP package HT9200B: 14-pin SOP package · Low standby current General Description The HT9200A/B tone generators are designed for MCU interfaces. They can be instructed by a MCU to generate 16 dual tones and 8 single tones from the DTMF pin. The HT9200A provides a serial mode whereas the HT9200B contains a selectable serial/parallel mode interface for various applications such as security systems, home automation, remote control through telephone lines, communication systems, etc. Selection Table Function Operating Voltage OSC Frequency HT9200A 2.5V~5.5V HT9200B 2.5V~5.5V Part No. Interface Package 3.58MHz Serial 8 DIP/SOP 3.58MHz Serial/Parallel 14 SOP Block Diagram 3 .5 8 M H z C r y s ta l/R e s o n a to r O s c illa to r X 1 X 2 D A T A S e r ia l D a ta In p u t C ir c u it C L K D T M F G e n e ra to r C o n tro l C ir c u it C E S /P D T M F P a r a l l e lD a t a I n p u tC ir c u it D 3 D 2 D 1 D 0 C E X 2 1 1 4 2 1 3 D T M F X 1 3 1 2 D A T A Pin Assignment C E X 2 1 8 V D D V S S 4 1 1 C L K 2 7 D T M F N C 5 1 0 X 1 3 6 D A T A D 0 6 9 S /P D 3 V S S 4 5 C L K D 1 7 8 D 2 H T 9 2 0 0 A 8 D IP -A /S O P -A Rev. 1.40 V D D H T 9 2 0 0 B 1 4 S O P -A 1 August 30, 2004 HT9200A/HT9200B Pad Coordinates Pad Assignment X 2 1 C E V D D 1 3 1 2 1 1 (0 ,0 ) X 1 1 0 2 Pad No. X Y Pad No. X 1 -553.30 430.40 8 553.30 -523.50 2 -553.30 -133.50 9 553.30 -190.30 3 -553.30 -328.50 10 553.30 4.70 4 -553.30 -523.50 11 553.30 340.30 5 -220.10 -523.50 12 374.90 523.50 6 -25.10 -523.50 13 -279.30 523.50 7 308.10 -523.50 D T M F D A T A C L K 9 3 V S S D 0 4 5 6 7 8 D 1 D 2 D 3 S /P Unit: mm Y Chip size: 1460 ´ 1470 (mm)2 * The IC substrate should be connected to VSS in the PCB layout artwork. Pin Description I/O Internal Connection CE I CMOS IN Chip enable, active low. No internal pull-high resistor. X2 O Oscillator X1 I The system oscillator consists of an inverter, a bias resistor, and the required load capacitor on chip. The oscillator function can be implemented by Connect a standard 3.579545MHz crystal to the X1 and X2 terminals. Pin Name Description VSS ¾ ¾ Negative power suppl, ground NC ¾ ¾ No connection D0~D3 I CMOS IN Pull-high or Floating Data inputs for the parallel mode When the IC is operating in the serial mode, the data input terminals (D0~D3) are included with a pull-high resistor. When the IC is operating in the parallel mode, these pins become floating. S/P I CMOS IN Operation mode selection input S/P=²H²: Parallel mode S/P=²L²: Serial mode CLK I CMOS IN Pull-high or Floating Data synchronous clock input for the serial mode When the IC is operating in the parallel mode, the input terminal (CLK) is included with a pull-high resistor. When the IC is operating in the serial mode, this pin becomes floating. DATA I CMOS IN Pull-high or Floating Data input terminal for the serial mode When the IC is operating in the parallel mode, the input terminal (DATA) is included with a pull-high resistor. When the IC is operating in the serial mode, this pin becomes floating. DTMF O CMOS OUT VDD ¾ ¾ Rev. 1.40 Output terminal of the DTMF signal Positive power supply, 2.5V~5.5V for normal operation 2 August 30, 2004 HT9200A/HT9200B Approximate Internal Connection Circuits C M O S IN P u ll- h ig h V C M O S O U T V D D C M O S IN (F o r D 0 ~ D 3 , C L K , D A T A ) V D D C M O S IN D D O S C IL L A T O R X 1 2 0 p F X 2 1 0 M 1 0 p F E N Absolute Maximum Ratings Supply Voltage ..............................VSS-0.3V to VSS+6V Storage Temperature ............................-50°C to 125°C Input Voltage ................................VSS-0.3 to VDD+0.3V Operating Temperature...........................-20°C to 75°C Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. Electrical Characteristics Symbol Parameter VDD Operating Voltage IDD Operating Current Ta=25°C Test Conditions VDD Conditions ¾ ¾ 2.5V 5.0V S/P=VDD,D0~D3=VSS, CE=VSS, No load Min. Typ. Max. Unit 2.5 ¾ 5.5 V ¾ 240 2500 ¾ 950 3000 mA VIL ²Low² Input Voltage ¾ ¾ VSS ¾ 0.2VDD V VIH ²High² Input Voltage ¾ ¾ 0.8VDD ¾ VDD V Standby Current ¾ ¾ 1 ISTB ¾ ¾ 2 120 180 270 45 68 100 ¾ tUP+6 tUP+8 ms 0.45VDD ¾ 0.75VDD V 2.5V S/P=VDD,CE=VDD, no load 5.0V RP 2.5V Pull-high Resistance 5.0V VOL=0V mA kW tDE DTMF Output Delay Time (Parallel Mode) VTDC DTMF Output DC Level 2.5V~ DTMF Output 5.5V ITOL DTMF Sink Current 2.5V VDTMF=0.5V -0.1 ¾ ¾ mA VTAC DTMF Output AC Level 2.5V Row group, RL=5kW 0.12 0.15 0.18 Vrms ACR Column Pre-emphasis 2.5V Row group=0dB 1 2 3 dB RL DTMF Output Load 2.5V tHD £-23dB 5 ¾ ¾ kW Rev. 1.40 ¾ 5V 3 August 30, 2004 HT9200A/HT9200B Symbol Parameter tHD Tone Signal Distortion fCLK Clock Input Rate (Serial Mode) tUP Oscillator Starting Time (When CE is low) fOSC System Frequency Rev. 1.40 Test Conditions VDD 2.5V Conditions RL=5kW Min. Typ. Max. Unit ¾ -30 -23 dB ¾ ¾ ¾ 100 500 kHz 5.0V The time from CE falling edge to normal oscillator operation ¾ ¾ 10 ms 3.5759 3.5795 3.5831 MHz ¾ Crystal=3.5795MHz 4 August 30, 2004 HT9200A/HT9200B Functional Description bits, the D0(LSB) is the first received bit. The HT9200A/B will latch data on the falling edge of the clock (CLK pin). The relationship between the digital codes and the tone output frequency is shown in Table 1. As for the control timing diagram, refer to Figure 1. The HT9200A/B are DTMF generators for MCU interfaces. They are controlled by a MCU in the serial mode or the parallel mode (for the HT9200B only). Serial Mode (HT9200A/B) The HT9200A/B employ a data input, a 5-bit code, and a synchronous clock to transmit a DTMF signal. Every digit of a phone number to be transmitted is selected by a series of inputs which consist of 5-bit data. Of the 5 When the system is operating in the serial mode a pull-high resistor is attached to D0~D3 (for parallel mode) on the input terminal. Table 1: Digits vs. Input Data vs. Tone Output Frequency (Serial Mode) Digit D4 D3 D2 D1 D0 Tone Output Frequency (Hz) 697+1209 1 0 0 0 0 1 2 0 0 0 1 0 697+1336 3 0 0 0 1 1 697+1477 4 0 0 1 0 0 770+1209 5 0 0 1 0 1 770+1336 6 0 0 1 1 0 770+1477 7 0 0 1 1 1 852+1209 8 0 1 0 0 0 852+1336 9 0 1 0 0 1 852+1477 0 0 1 0 1 0 941+1336 * 0 1 0 1 1 941+1209 # A 0 1 1 0 0 941+1477 0 1 1 0 1 697+1633 B 0 1 1 1 0 770+1633 C 0 1 1 1 1 852+1633 D 0 0 0 0 0 941+1633 ¾ 1 0 0 0 0 697 ¾ 1 0 0 0 1 770 ¾ 1 0 0 1 0 852 ¾ 1 0 0 1 1 941 ¾ 1 0 1 0 0 1209 ¾ 1 0 1 0 1 1336 ¾ 1 0 1 1 0 1477 ¾ 1 0 1 1 1 1633 DTMF OFF 1 1 1 1 1 ¾ Note: The codes not listed in Table 1 are not used D4 is MSB Rev. 1.40 5 August 30, 2004 HT9200A/HT9200B The TDE time (about 6ms) will be delayed from the CE falling edge to the DTMF signal output. For the HT9200B, the S/P pin has to be connected low for serial mode operation. The relationship between the digital codes and the tone output frequency is illustrated in Table 2. As for the control timing diagram, see Figure 2. Parallel Mode (HT9200B) The HT9200B provides four data inputs D0~D3 to generate their corresponding DTMF signals. The S/P has to be connected high to select the parallel operation mode. Then the input data codes should be determined. Finally, the CE is connected low to transmit the DTMF signal from the DTMF pin. When the system is operating in the parallel mode, D0~D3 are all in the floating state. Thus, these data input pins should not float. S /P X 2 ( O s c illa to r ) tU P C E C L K L S B M S B L S B M S B L S B D A T A 1 D ig it 1 D ig it 2 M S B 1 1 1 1 S to p c o d e D T M F D ig it 1 D T M F s ig n a l D ig it 2 D T M F s ig n a l Figure 1 Table 2: Digits vs. Input Data vs. Tone Output Frequency (Parallel Mode) Digit D3 D2 D1 D0 Tone Output Frequency (Hz) 1 0 0 0 1 697+1209 2 0 0 1 0 697+1336 3 0 0 1 1 697+1477 4 0 1 0 0 770+1209 5 0 1 0 1 770+1336 6 0 1 1 0 770+1477 7 0 1 1 1 852+1209 8 1 0 0 0 852+1336 9 1 0 0 1 852+1477 0 1 0 1 0 941+1336 * 1 0 1 1 941+1209 # 1 1 0 0 941+1477 A 1 1 0 1 697+1633 B 1 1 1 0 770+1633 C 1 1 1 1 852+1633 D 0 0 0 0 941+1633 Rev. 1.40 6 August 30, 2004 HT9200A/HT9200B S /P X 2 ( O s c illa to r ) C E D 0 ~ D 3 D T M F tD tD E N o te : T h e d a ta ( D 0 ~ D 3 ) s h o u ld b e r e a d y b e fo r e th e C E E b e c o m e s lo w . Figure 2 Tone Frequency Output Frequency (Hz) %Error Specified Actual 697 699 +0.29% 770 766 –0.52% 852 847 –0.59% 941 948 +0.74% 1209 1215 +0.50% 1336 1332 –0.30% 1477 1472 –0.34% % Error does not contain the crystal frequency drift Rev. 1.40 7 August 30, 2004 HT9200A/HT9200B Application Circuits Serial Mode V V D D V D D C E 3 .5 7 9 5 4 5 M H z 1 2 C L K V S S D A T A 2 0 p F 3 4 2 0 p F M C U C E X 2 X 1 V S S V D D T M D A T C L D D 8 D 7 T o n e O u tp u t F A K 6 5 H T 9 2 0 0 A Serial/Parallel Mode V V D D V D D V S S V S S C E D 0 D 1 D 2 D 3 S /P C L K D A T A 3 .5 7 9 5 4 5 M H z 1 2 0 p F 2 3 4 2 0 p F Rev. 1.40 V D D X 2 D T M F X 1 D A T A V S S 5 6 7 M C U C E 1 4 1 3 1 2 N C D 0 D 3 D 1 D 2 T o n e O u tp u t 1 1 C L K S /P D D 1 0 9 8 H T 9 2 0 0 B 8 August 30, 2004 HT9200A/HT9200B Package Information 8-pin DIP (300mil) Outline Dimensions A 8 B 5 4 1 H C D = G E I F Symbol A Rev. 1.40 Dimensions in mil Min. Nom. Max. 355 ¾ 375 B 240 ¾ 260 C 125 ¾ 135 D 125 ¾ 145 E 16 ¾ 20 F 50 ¾ 70 G ¾ 100 ¾ H 295 ¾ 315 I 335 ¾ 375 a 0° ¾ 15° 9 August 30, 2004 HT9200A/HT9200B 8-pin SOP (150mil) Outline Dimensions 5 8 A B 4 1 C C ' G H D E Symbol Rev. 1.40 = F Dimensions in mil Min. Nom. Max. A 228 ¾ 244 B 149 ¾ 157 C 14 ¾ 20 C¢ 189 ¾ 197 D 53 ¾ 69 E ¾ 50 ¾ F 4 ¾ 10 G 22 ¾ 28 H 4 ¾ 12 a 0° ¾ 10° 10 August 30, 2004 HT9200A/HT9200B 14-pin SOP (150mil) Outline Dimensions 8 1 4 A B 7 1 C C ' G H D E Symbol Rev. 1.40 = F Dimensions in mil Min. Nom. Max. A 228 ¾ 244 B 149 ¾ 157 C 14 ¾ 20 C¢ 336 ¾ 344 D 53 ¾ 69 E ¾ 50 ¾ F 4 ¾ 10 G 22 ¾ 28 H 4 ¾ 12 a 0° ¾ 10° 11 August 30, 2004 HT9200A/HT9200B Product Tape and Reel Specifications Reel Dimensions D T 2 A C B T 1 SOP 8N Symbol Description Dimensions in mm A Reel Outer Diameter 330±1.0 B Reel Inner Diameter 62±1.5 C Spindle Hole Diameter 13.0+0.5 -0.2 D Key Slit Width 2.0±0.15 T1 Space Between Flange 12.8+0.3 -0.2 T2 Reel Thickness 18.2±0.2 SOP 14N Symbol Description Dimensions in mm A Reel Outer Diameter 330±1.0 B Reel Inner Diameter 62±1.5 C Spindle Hole Diameter 13.0+0.5 -0.2 D Key Slit Width 2.0±0.5 T1 Space Between Flange 16.8+0.3 -0.2 T2 Reel Thickness 22.2±0.2 Rev. 1.40 12 August 30, 2004 HT9200A/HT9200B Carrier Tape Dimensions P 0 D P 1 t E F W C D 1 B 0 P K 0 A 0 SOP 8N Symbol Description Dimensions in mm W Carrier Tape Width 12.0+0.3 -0.1 P Cavity Pitch 8.0±0.1 E Perforation Position 1.75±0.1 F Cavity to Perforation (Width Direction) 5.5±0.1 D Perforation Diameter 1.55±0.1 D1 Cavity Hole Diameter 1.5+0.25 P0 Perforation Pitch 4.0±0.1 P1 Cavity to Perforation (Length Direction) 2.0±0.1 A0 Cavity Length 6.4±0.1 B0 Cavity Width 5.20±0.1 K0 Cavity Depth 2.1±0.1 t Carrier Tape Thickness 0.3±0.05 C Cover Tape Width 9.3 SOP 14N Symbol Description Dimensions in mm 16.0+0.3 -0.1 W Carrier Tape Width P Cavity Pitch 8.0±0.1 E Perforation Position 1.75±0.1 F Cavity to Perforation (Width Direction) 7.5±0.1 D Perforation Diameter 1.5+0.1 D1 Cavity Hole Diameter 1.5+0.25 P0 Perforation Pitch 4.0±0.1 P1 Cavity to Perforation (Length Direction) 2.0±0.1 A0 Cavity Length 6.5±0.1 B0 Cavity Width 9.5±0.1 K0 Cavity Depth 2.1±0.1 t Carrier Tape Thickness 0.3±0.05 C Cover Tape Width Rev. 1.40 13.3 13 August 30, 2004 HT9200A/HT9200B Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shanghai Sales Office) 7th Floor, Building 2, No.889, Yi Shan Rd., Shanghai, China 200233 Tel: 021-6485-5560 Fax: 021-6485-0313 http://www.holtek.com.cn Holtek Semiconductor Inc. (Shenzhen Sales Office) 5/F, Unit A, Productivity Building, Cross of Science M 3rd Road and Gaoxin M 2nd Road, Science Park, Nanshan District, Shenzhen, China 518057 Tel: 0755-8616-9908, 8616-9308 Fax: 0755-8616-9533 Holtek Semiconductor Inc. (Beijing Sales Office) Suite 1721, Jinyu Tower, A129 West Xuan Wu Men Street, Xicheng District, Beijing, China 100031 Tel: 010-6641-0030, 6641-7751, 6641-7752 Fax: 010-6641-0125 Holtek Semiconductor Inc. (Chengdu Sales Office) 709, Building 3, Champagne Plaza, No.97 Dongda Street, Chengdu, Sichuan, China 610016 Tel: 028-6653-6590 Fax: 028-6653-6591 Holmate Semiconductor, Inc. (North America Sales Office) 46729 Fremont Blvd., Fremont, CA 94538 Tel: 510-252-9880 Fax: 510-252-9885 http://www.holmate.com Copyright Ó 2004 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw. Rev. 1.40 14 August 30, 2004