ACMD-7409 Miniature PCS Band Duplexer Data Sheet Description Features The Avago ACMD-7409 is a miniature duplexer designed for US PCS handsets. • Miniature size – 3.8 x 3.8 mm footprint size – 1.3 mm max height The ACMD-7409 is designed with Avago Technologies’ Film Bulk Acoustic Resonator (FBAR) technology, which makes possible ultra-small, high-Q filters at a fraction of their usual size. The ACMD-7409 also utilizes Avago’s innovative Microcap bonded-wafer, chip scale packaging technology. This process allows the filters to be assembled in a molded chip-on-board module that is less than 1.3 mm high with a footprint of only 3.8 x 3.8 mm. • High power rating size – +33 dBm max Tx power • Environmental – RoHS Compliant – Halogen Free – TBBPA Free Specifications The ACMD-7409 enhances the sensitivity and dynamic range of PCS receivers by providing more than 54 dB attenuation of the transmitted signal at the receiver input and more than 45 dB rejection of transmit-generated noise in the receive band. • Performance guaranteed –30 to +85°C Maximum Insertion Loss in the Tx channel is only 3.5 dB, which minimizes current drain from the power amplifier. Insertion Loss in the Rx channel is 3.8 dB max, improving receiver sensitivity. • Tx band performance (1850.5 – 1909.5 mHz) size – Insertion loss: 3.5 dB max size – Interferer blocking: 52 dB min The excellent power handling capability of the FBAR bulkmode resonators supports the high output power levels needed in PCS handsets while adding virtually no distortion. The ACMD-7409 is an environmentally green version of the ACMD-7402 duplexer. Functional Block Diagram ANT PORT 3 Tx Rx PORT 1 PORT 2 • Rx band performance (1930.5 – 1989.5 mHz) size – Insertion loss: 3.8 dB max size – Noise blocking: 43 dB min Applications • Handsets or data terminals operating in the US PCS frequency band ACMD-7409 Electrical Specifications, Z0 = 50 Ω, TC [1,2] as indicated – 30°C[2] Symbol Parameter Units Min +25°C[2] Typ[3] Max Min +85°C[2] Typ[3] Max Min Typ[3] Max Antenna Port to Receive Port S23 Insertion Loss in Receive Band (1930.5 – 1989.5 MHz) dB 3.8 1.5 3.5 3.5 ΔS23 Ripple (p-p) in Receive Band dB 3.0 1.5 2.6 2.6 S22 Return Loss of Receive Port in Receive Band dB 9.5 9.5 17 9.5 S23 Attenuation in Transmit Band (1850.5 – 1909.5 MHz) dB 52 52 56 52 S23 Attenuation 0 – 1600 MHz dB 20 31 S23 Attenuation in Receive 2nd Harmonic Band (3861 – 3979 MHz) dB 18 19 Transmit Port to Antenna Port S31 Insertion Loss in Transmit Band (1850.5 – 1909.5 MHz) dB 3.0 1.1 3.0 3.5[4] ΔS31 Ripple (p-p) in Transmit Band dB 2.3 0.9 2.3 2.8 S11 Return Loss of Transmit Port in Transmit Band dB 9.5 9.5 20 9.5 S31 Attenuation in Receive Band (1930.5 – 1989.5 MHz) dB 43 43 48 43 S31 Attenuation 0 – 1600 MHz dB 22 34 S31 Attenuation in Transmit 2nd Harmonic Band (3701 – 3819 MHz) dB 8 13 Antenna Port S33 Return Loss of Antenna Port in Receive Band (1930.5 – 1989.5 MHz) dB 9 9 16 9 S33 Return Loss of Antenna Port in Transmit Band (1850.5 – 1909.5 MHz) dB 9 9 19 9 Isolation Transmit Port to Receive Port S21 Tx-Rx Isolation in Receive Band (1930.5 – 1989.5 MHz) dB 45 45 48 45 S21 Tx-Rx Isolation in Transmit Band (1850.5 – 1909.5 MHz) dB 54 54 58 54 Notes: 1. TC is the case temperature and is defined as the temperature of the underside of the Duplexer where it makes contact with the circuit board. 2. Min/Max specifications are guaranteed at the indicated temperature with the input power to the Tx ports equal to or less than +29 dBm over all Tx frequencies unless otherwise noted. 3. Typical data is the average value of the parameter over the indicated band at the specified temperature. Typical values may vary over time. Refer to “Characterization” section for measurement details. 4. At Tx input power between +26 dBm and +29 dBm, the Insertion Loss at the upper edge of the Tx band (1907– 1909.5 MHz) will be slightly degraded. From 1907 to 1909.5 MHz, the maximum Insertion Loss specification at Tc = +85°C is guaranteed to +26 dBm input power. Absolute Maximum Ratings[1] Parameter Unit Value Storage Temperature °C –65 to +125 Maximum RF Input Power to Tx Ports dBm +33 Maximum Recommended Operating Conditions[2] Parameter Unit Value Operating Temperature, Tc[3], °C –40 to +100 Operating temperature, Tc[3], Tx Power 30 dBm °C –40 to +85 Tx Power 29 dBm Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. The device will function over the recommended range without degradation in reliability or permanent change in performance, but is not guaranteed to meet electrical specifications. 3. TC is defined as case temperature, the temperature of the underside of the Duplexer where it makes contact with the circuit board. Characterization A test circuit similar to that shown in Figure 1 was used to measure typical device performance. This circuit is designed to interface with Air Coplanar (ACP), GroundSignal-Ground (GSG) RF probes of the type commonly used to test semiconductor wafers. The test circuit is a 7 x 7 mm PCB with a well-grounded pad to which the device under test (DUT) is solder-mounted. A test circuit with a ACMD-7409 mounted in place is shown in Figure 2. S-parameters are then measured using a network analyzer and calibrated ACP probe set. Phase data for s-parameters measured with ACP probe circuits are adjusted to place the reference plane at the edge of the Duplexer Short lengths of 50-ohm microstripline connect the DUT to the ACP probe patterns on the board. Figure 1. ACP probe test circuit Figure 2. Test circuit with ACMD-7409 duplexer 0.0 0.0 -1.0 -1.0 Insertion Loss [dB] Insertion Loss [dB] Typical Performance at Tc = 25°C -2.0 -3.0 -4.0 1850 1860 1870 1880 1890 Frequency [MHz] 1900 0 0 -5 -10 -10 -15 -20 -25 1750 1940 1950 1960 1970 Frequency [MHz] 1980 1990 Figure 4. Ant–Rx insertion loss Insertion Loss [dB] Return Loss [dB] -3.0 -4.0 1930 1910 Figure 3. Tx–Ant insertion loss -2.0 -20 -30 -40 -50 1800 1850 1900 1950 Frequency [MHz] 2000 2050 -60 1750 2100 Figure 5. Tx and Rx port return loss 1800 1850 1900 1950 2000 Frequency [MHz] 2050 2100 2050 2100 Figure 6. Tx rejection in Rx band and Rx rejection in Tx band -35 0 -5 -45 -50 Return Loss [dB] Insertion Loss [dB] -40 -55 -60 -65 -70 -10 -15 -20 -75 -80 1750 1800 1850 Figure 7. Tx–Rx isolation 1900 1950 Frequency [MHz] 2000 2050 2100 -25 1750 1800 1850 1900 1950 2000 Frequency [MHz] Figure 8. Antenna port return loss 0 0 Insertion Loss [dB] Insertion Loss [dB] -10 -10 -20 -30 -40 3700 3720 3740 3760 3780 Frequency [MHz] 3800 -40 -60 0.0 3820 -10 -10 -20 -20 -30 -40 2.0 3.0 4.0 Frequency [GHz] 5.0 6.0 -30 -40 -50 -50 -60 0.0 1.0 Figure 10. Tx–Ant and Ant–Rx wideband insertion loss Insertion Loss [dB] Insertion Loss [dB] -30 -50 Figure 9. Tx–Ant rejection at Tx second harmonic 0.2 0.4 0.6 0.8 1.0 Frequency [GHz] Figure 11. Tx–Ant low frequency rejection -20 1.2 1.4 1.6 -60 0.0 0.2 0.4 0.6 0.8 1.0 Frequency [GHz] Figure 12. Ant–Rx low frequency rejection 1.2 1.4 1.6 0.8 0.5 1.8 0.1 1.4 Tx Ant 3.8 1.2 Rx Ant 1.4 1.9 2.4 Notes: 1. Dimensions in millimeters 2. Dimensions nominal unless otherwise noted 3. Tolerance: X.X = ± 0.1 X.XX = ±0.05 4. I/O pads (3 ea), 0.40 x 0.40 5. Contact areas are gold plated 6. Internal vias (2 ea) shown for reference only; covered with Ø 0.50 mm solder mask Figure 13. Package outline drawing PACKAGE ORIENTATION RX TX ANT Figure 14. Package marking H = ACMD-7409 FI = Mfg Information Y = Year WW = Work Week DC = Date Code NNNN = Assembly Lot 1 .9 Tx 1 .1 [PRODUCT MARKING] 2 .8 Rx 3 .8 0 .4 SOLDER MASK OVER VIAS (2 PLS) 1.0 1.8 1.0 1.2 1.2 0.8 1.0 1.8 0.2 0.4 T 1.4 W 0.3 0.3 0.6 1.2 1.2 0.3 0.5 NOTES: DIMENSIONS IN MILLIMETERS (mm) ALL VIAS ∆ 0.40 ANGLES 45 RF PORTS ARE CPW T AND W SELECTED FOR 50 OHMS PATTERN CENTERED ON DUPLEXER 0.2 0.4 0.3 Figure 15. Recommended PCB land print Figure 16. Duplexer superposed on PCB land print 1.4 0.2 0.4 0.3 1.2 0.3 0.5 1.2 1.00 1.63 3.40 1.25 2.70 1.00 0.40 3.25 NOTES: 1. DIMENSIONS IN MILLIMETERS (mm). 2. SOLDER STRIPES (14 PLS) ARE 0.20 WIDE, PITCH. 3. SOLDER PADS FOR I/O ARE 0.35 x 0.35. 4. STENCIL PATTERN IS CENTERED ON DUPLEXER. Figure 17. Recommended solder stencil Figure 18. Duplexer superposed on solder stencil Package Moisture Sensitivity Feature Test Method Performance Moisture Sensitivity Level (MSL) at 260°C J-STD-020C Level 3 300 TEMPERATURE C 250 200 150 100 50 0 0 50 100 150 200 TIME, SECONDS Figure 19. Verified SMT solder profile 250 300 4.00 0.10 SEE NOTE 2 ø 1.55 0.05 2.00 0.05 B 1.75 0.10 5.50 0.05 5° MAX. 12.00 0.10 Bo A A Ko 8.00 0.10 B ø 1.50 (MIN.) SECTION B-B Ao 0.30 0.05 Ao Bo Ko PITCH WIDTH = = = = = 5° MAX. 4.10 4.10 1.45 8.00 12.00 NOTES: 1. Ao and Bo MEASURED AT 0.3 mm ABOVE BASE OF POCKET. 2. 10 PITCHES CUMULATIVE TOLERANCE 0.2 mm. SECTION A-A Figure 20. SMD tape packing PACKAGE PIN 1 ORIENTATION SPROCKET HOLES TAPE WIDTH POCKET CAVITY Figure 21. Unit orientation In tape Ordering Information Part Number No. of Devices Container ACMD-7409-BLK 25 Anti-static Bag ACMD-7409-TR1 1000 7-inch Reel For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved. AV02-1824EN - March 24, 2009