ETHERNET / CHEAPERNET LAN COUPLING TRANSFORMERS FEATURES Ê Designed to meet IEEE 802.3 (10 Base 2, 10 Base 5) Ë Low Profile DIP or SMD Package Ì Low Leakage Inductance and Winding Capacitance Í Fast Rise Times Î 500 or 2000Vrms Minimum Isolation Ï Triple Core Package ELECTRICAL SPECIFICATIONS AT 25OC PER CORE TURNS RATIO (± 5%) PART NUMBER A8DB101150 D8DB101150 D8CB101150 A8DB101170 D8DB101170 D8CB101170 A8DB101190 D8DB101190 D8CB101190 A8DB101240 D8DB101240 D8CB101240 A8DB101270 D8DB101270 D8CB101270 A8DB101330 D8DB101330 D8CB101330 D8DB101350 D8CB101350 D8DB101370 D8CB101370 PRIMARY OCL µH ± 20%) (µ 1:1 1:1 1:1 1:1 1:1 1:1 1:1 1:1 1:1 1:1 1:1 1:1 1:1 1:1 1:1 1:1 1:1 1:1 1:1 1:1 1:1 1:1 RISE TIME (ns Max.) PRIMARY ET CONSTANT µsec Min.) (V-µ 32 32 32 40 40 40 50 50 50 75 75 75 100 100 100 150 150 150 200 200 250 250 1.5 1.5 1.5 1.7 1.7 1.7 1.9 1.9 1.9 2.4 2.4 2.4 2.7 2.7 2.7 3.3 3.3 3.3 3.5 3.5 3.7 3.7 2.8 2.8 2.8 3.0 3.0 3.0 3.0 3.0 3.0 3.2 3.2 3.2 3.4 3.4 3.4 3.5 3.5 3.5 3.5 3.5 3.6 3.6 PRI-SEC Cw/w (pf Max.) PRI / SEC LL µH Max.) (µ 7.0 7.0 7.0 8.0 8.0 8.0 8.0 8.0 8.0 9.0 9.0 9.0 10.0 10.0 10.0 12.0 12.0 12.0 14.0 14.0 16.0 16.0 .15 .15 .15 .15 .15 .15 .20 .20 .20 .20 .20 .20 .25 .25 .25 .25 .25 .25 .30 .30 .35 .35 DCR (Ohms Max.) HIPOT Vrms Min. .20 .20 .20 .25 .25 .25 .25 .25 .25 .30 .30 .30 .30 .30 .30 .30 .30 .30 .30 .30 .30 .30 2000 2000 500 2000 2000 500 2000 2000 500 2000 2000 500 2000 2000 500 2000 2000 500 2000 500 2000 500 PHYSICAL DIMENSIONS .... DIMENSIONS IN INCHES (mm) NOTE: For Gull Wing Package Change "D8" to "G8" SCHEMATIC DIAGRAM "B" 15 16 14 13 SEC. 11 3 4 PIN#1 DOT .200 (5.08) MAX .120 .020 (.51) (3.05) .010 (.25) MIN PRI. 5 6 7 .020 (0.51) TYP 8 .050 (1.27) TYP "A8" PACKAGE PIN#1 DOT .900 (22.86) MAX .120 (3.05) MIN .100 (2.54) .100 (2.54) TYP .008R (0.20) .010 (0.25) .300 (7.62) .340 (8.64) "G8" PACKAGE .400 (12.70) MAX .880 (22.35) MAX PIN#1 DOT .250 (6.35) MAX .700 (17.78) .280 (7.11) MAX SEC. PRI. 2 9 10 SEC. PRI. 1 12 "D8" PACKAGE .880 (22.35) MAX .280 (7.11) MAX .200 (5.08) MAX .020 DIA (0.51) .020 (0.51) TYP .300 (7.62) .050 (1.27) TYP .100 (2.54) TYP .020 (.51) .010 (.25) .008R (0.20) .030 (0.76) FLAT .020 (0.51) .425 (10.80) .390 (9.90) .010 (0.25) TYP Specifications subject to change without notice. P Premier M Magnetics Inc. 14 27111 Aliso Creek Road, Suite 175 Aliso Viejo, California 92656 Phone: (714) 362-4211 Fax: (714) 362-4212 ETHERNET / CHEAPERNET LAN COUPLING TRANSFORMERS FEATURES Ê Designed to meet IEEE 802.3 (10 Base 2, 10 Base 5) Ë Low Profile soic Type SMD Package Ì Low Leakage Inductance and Winding Capacitance Í Fast Rise Times Î 2000Vrms Minimum Isolation Ï Triple Core Package ELECTRICAL SPECIFICATIONS AT 25OC PER CORE TURNS RATIO (± 5%) PART NUMBER TSD-470 TSD-471 TSD-472 TSD-473 TSD-474 TSD-475 TSD-842 PRIMARY OCL µH Min) (µ 1:1 1:1 1:1 1:1 1:1 1:1 1:1 RISE TIME (ns Max.) PRIMARY ET CONSTANT µsec Min) (V-µ 35 50 75 100 150 250 90 2.1 2.2 2.4 2.5 3.0 3.5 3.0 PRI / SEC Cw/w (pf Max) 1.6 1.7 1.8 1.8 2.5 3.0 1.8 5.0 5.0 7.0 8.0 10.0 15.0 10.0 PRI LL µH Max) (µ .10 .10 .10 .10 .20 .25 .20 DCR (Ω Ω Max) PRI / SEC .15 / .15 .15 / .15 .17 / .17 .20 / .20 .30 / .30 .30 / .30 .30 / .30 HIPOT SCHEVrms Min MATIC 2000 2000 2000 2000 2000 2000 2000 B B B B B B B VARIATIONS AVAILABLE. FOR INTERMEDIATE VALUES AND/ OR CUSTOM DESIGNS PLEASE CONSULT THE FACTORY. SCHEMATIC DIAGRAM "B" 15 16 1 14 13 12 11 9 10 SEC. SEC. SEC. PRI. PRI. PRI. 2 3 4 5 PHYSICAL DIMENSIONS .... IN INCHES (mm) 6 7 8 FIGURE 3: RECOMMENDED PCB LAYOUT DIMENSION IN INCHES, (mm) "G1" PACKAGE 16 15 14 13 12 11 10 9 16x.075 (1.91) P TSD-XXX M YYWW PIN#1 WHITE DOT 1 2 3 4 5 6 7 .270 (6.86) 1 16 8 9 16x.025 (.64) 7x.050 (1.27) 8 .460 (11.68) MAX .280 (7.11) MAX .210 (5.33) MAX .050 .019 (1.27) (0.48) TYP TYP .010 (.25) .004 (.10) .020 (0.51) MIN .010 (0.25) TYP .370 (9.40) Specifications subject to change without notice. P Premier M Magnetics Inc. 15 27111 Aliso Creek Road, Suite 175 Aliso Viejo, California 92656 Phone: (714) 362-4211 Fax: (714) 362-4212