05210 ESD4-LFC Only One Name Means ProTek’Tion™ LOW CAPACITANCE flip chip tvs array Description The ESD4-LFC is a low capacitance flip chip transient voltage suppressor array, designed to protect portable devices from the effects of Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). This series meets the IEC 610004-2 and 61000-4-4 requirements. This device is ideally suited for portable devices, PCMCIA and SMART phones. The ESD4-LFC features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low inductance virtually eliminates overshoot voltage due to package inductance. 5 Bump package Features applications • • • • • • • • • • • • • Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns ESD Protection > 25 kilovolts Unidirectional Configuration Low Capacitance: 15pF Protection for 4 Data Lines RoHS Compliant REACH Compliant SMART Phones I/O Port Interfaces Portable Devices Ground Positioning Systems (GPS) SMART Cards Mechanical characteristics • • • • • • • 5 Bump Flip Chip Package Approximate Weight: 0.73 milligrams Lead-Free Plating Solder Reflow Temperature: Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C Flammability Rating UL 94V-0 8mm Tape per EIA Standard 481 circuit diagram G1 05210.R4 1/11 Page 1 www.protekdevices.com 05210 ESD4-LFC Only One Name Means ProTek’Tion™ typical device characteristics MAXIMUM RATINGS @ 25°C Unless Otherwise Specified PARAMETER DC Power Rating Operating Temperature Storage Temperature SYMBOL VALUE UNITS P 200 mW TA -40 to 85 °C TSTG -55 to 150 °C ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified PART NUMBER ESD4-LFC marking code RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM CLAMPING VOLTAGE TYPICAL FORWARD VOLTAGE MAXIMUM LEAKAGE CURRENT V WM VOLTS @ 1mA V(BR) VOLTS @ I P = 10mA VC VOLTS @ 10mA Vf VOLTS @ 3.3v ID µA TYPICAL CAPACITANCE PER LINE (Note 1) @2.5V, 1MHz C pF 5.0 6.0 8 0.8 0.1 15 4L notes 1. ±20% tolerance. figure 1 capacitance vs reverse voltage (Normalized to Capactiance at 2.5v dc & 25°c) Cj - Capacitance (Normalized) 1.6 1.2 0.8 0.4 0 0 1 2 3 4 5 6 VR - Reverse Voltage - Volts 05210.R4 1/11 Page 2 www.protekdevices.com 05210 ESD4-LFC Only One Name Means ProTek’Tion™ SOLDER REFLOW INFORMATION printed circuit board recommendations parameter value Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask Defined Pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.150mm Solder Stencil Aperture Opening (Laser cut, 5% tapered walls) 0.330mm Round Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance - Edge To Corner Ball ±50µm Solder Ball Side Coplanarity ±20µm Maximum Dwell Time Above Liquidous (183°C) 60 seconds Soldering Maximum Temperature 270°C Requirements recommended non-solder mask defined pad illustration Temperature: TP for Lead-Free (Sn/Ag/Cu): 260-270°C TP for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area and plating. Non-Solder Mask Defined Pad 0.275mm DIA. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA. Maximum Solder Reflow (35-53°C Above Maximum Solder Melt Temp) TP Solder Melt (Maximum Temp) Temperature - °C Ramp-Up Ramp-Down Preheat (Stay Below Flux Activation Temp) 30-60 seconds 05210.R4 1/11 Ramp-Up 15 seconds (Minimize) Page 3 Solder-Time 15-20 seconds Ramp-Down www.protekdevices.com 05210 ESD4-LFC Only One Name Means ProTek’Tion™ 5 BUMP package information BOTTOM VIEW A outline dimensions dim millimeters inches min max min max A 0.914 1.016 0.036 0.040 B 1.285 1.375 0.0506 0.0541 C 0.495 0.505 0.0195 0.0199 D 0.245 0.255 0.0096 0.0100 E 0.430 0.440 0.0169 0.0173 F 0.430 0.440 0.0169 0.0173 G 0.180 0.280 0.0071 0.0110 H 0.180 0.280 0.0071 0.0110 I 0.432 0.559 0.017 0.022 J 0.330 0.457 0.013 0.018 G C SIDE VIEW E O F G B H I 1 2 I SOLDER BUMPS D Notes J 1. Controlling dimensions in millimeters. 2. Solder bumps (63/67 Sn/Pb) 0.30 dia. layout dimensions dim millimeters A inches min max min max A 0.25 0.25 0.010 0.010 B 0.50 0.50 0.020 0.020 C 0.86 0.86 0.034 0.034 Non solder mask defined pad 0.275mm C Notes Solder mask opening 0.325mm Solder stencil opening 0.330mm 1. Controlling dimensions in millimeters B 05210.R4 1/11 Page 4 www.protekdevices.com 05210 ESD4-LFC Only One Name Means ProTek’Tion™ TAPE AND REEL information D t P2 Top Cover Tape 10 Pitches Cumulative Tolerance on tape ± 0.2 E P0 A0 F K0 W B0 Orientation Dot P User Direction of Feed specifications Reel Dia. Tape Width A0 178(7”) 8 1.08±0.05 B0 K0 D E F W P0 P2 P tmax 1.60±0.05 0.72 ± 0.05 1.50 ± 0.10 1.75 ± 0.10 3.50 ± 0.05 8.00 ± 0.30 4.00 ± 0.10 2.00 ± 0.05 4.00 ± 0.10 0.20±0.025 Notes 1. 2. 3. 4. Dimensions in millimeters. Top view of tape. Solder bumps are face down in tape package. Surface mount product is taped and reeled in accordance with EIA 481. 8mm plastic tape: 7” Reels - 3,000 pieces per reel. Package outline, pad layout and tape specifications per document number 06055.R2 9/09. ORDERING INFORMATION base PART NUMBER LEADFREE SUFFIX TAPE SUFFIX QTY/REEL REEL SIZE TUBE qty ESD4-LFC -LF -T73 3,000 7” n/a 05210.R4 1/11 Page 5 www.protekdevices.com 05210 ESD4-LFC Only One Name Means ProTek’Tion™ company information COMPANY PROFILE ProTek Devices, based in Tempe, Arizona USA, is a manufacturer of Transient Voltage Suppression (TVS) products designed specifically for the protection of electronic systems from the effects of lightning, Electrostatic Discharge (ESD), Nuclear Electromagnetic Pulse (NEMP), inductive switching and EMI/RFI. With over 25 years of engineering and manufacturing experience, ProTek designs TVS devices that provide application specific protection solutions for all electronic equipment/systems. ProTek Devices Analog Products Division, also manufactures analog interface, control, RF and power management products. CONTACT US Corporate Headquarters 2929 South Fair Lane Tempe, Arizona 85282 USA By Telephone General: 602-431-8101 Sales: 602-414-5109 Customer Service: 602-414-5114 By Fax General: 602-431-2288 By E-mail: Sales: [email protected] Customer Service: [email protected] Technical Support: [email protected] Web www.protekdevices.com www.protekanalog.com COPYRIGHT © ProTek Devices 2007 - This literature is subject to all applicable copyright laws and is not for resale in any manner. SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice. DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance. ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ProTek assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability without limitation special, consequential or incidental damages. LIFE SUPPORT POLICY: ProTek Devices products are not authorized for use in life support systems without written consent from the factory. PATENT INFORMATION: This device is patented under U.S. Patent No. Des. “D456,367S”. 05210.R4 1/11 Page 6 www.protekdevices.com