TI LM336BLPRE3-2-5 2.5v integrated reference circuit Datasheet

SLVS063E − NOVEMBER 1988 − REVISED OCTOBER 2003
D Low Temperature Coefficient
D Wide Operating Current . . . 400 µA
D
D
D
D
D
D PACKAGE
(TOP VIEW)
to 10 mA
0.27-Ω Dynamic Impedance
±1% Tolerance Available
Specified Temperature Stability
Easily Trimmed for Minimum Temperature
Drift
Fast Turnon
NC
NC
NC
ANODE
1
8
2
7
3
6
4
5
CATHODE
NC
NC
ADJ
NC − No internal connection
LM336-2.5, LM336B-2.5 . . . LP PACKAGE
(TOP VIEW)
description/ordering information
ANODE
The LM236-2.5, LM336-2.5, and LM336B-2.5
integrated circuits are precision 2.5-V shunt
regulator diodes. These
reference circuits
operate as low-temperature-coefficient 2.5-V
Zener diodes with a 0.2-Ω dynamic impedance. A
third terminal provided on the circuit allows the
reference voltage and temperature coefficient to
be trimmed easily.
CATHODE
ADJ
The series is useful as precision 2.5-V low-voltage references (VZ) for digital voltmeters, power supplies, or
operational-amplifier circuitry. The 2.5-V voltage reference makes it convenient to obtain a stable reference from
5-V logic supplies. Devices in this series operate as shunt regulators, and can be used as either positive or
negative voltage references.
The LM236-2.5 is characterized for operation from −25°C to 85°C. The LM336-2.5 and LM336B-2.5 are
characterized for operation from 0°C to 70°C.
ORDERING INFORMATION
SOIC (D)
0°C to 70°C
TO-226 / TO-92 (LP)
−25°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SOIC (D)
Tube of 75
LM336D-2-5
Reel of 2500
LM336DR-2-5
Tube of 75
LM336BD-2-5
Reel of 2500
LM336BDR−2-5
Bulk of 1000
LM336LP-2-5
Reel of 2000
LM336LPR-2-5
Bulk of 1000
LM336BLP-2-5
Reel of 2000
LM336BLPR-2-5
Tube of 75
LM236D-2-5
Reel of 2500
LM236DR-2-5
TOP-SIDE
MARKING
336-25
336B25
336-25
336B25
236-25
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
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1
SLVS063E − NOVEMBER 1988 − REVISED OCTOBER 2003
symbol
ANODE
CATHODE
ADJ
schematic diagram
CATHODE
Q14
Q11
24
kΩ
24
kΩ
6.6 kΩ
Q8
Q7
20 pF
10 kΩ
Q2
30 pF
Q10
Q1
Q4
500 Ω
Q9
Q3
30 kΩ
Q6
ADJ
6.6 kΩ
Q12
Q5
Q13
720 Ω
ANODE
NOTE A: All component values are nominal.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Reverse current, IR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
Forward current, IF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 mA
Package thermal impedance, θJA (see Notes 1 and 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W
LP package . . . . . . . . . . . . . . . . . . . . . . . . . . 140°C/W
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can impact reliability.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions
TA
2
LM236-2.5
Operating free-air temperature
LM336-2.5, LM336B-2.5
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MIN
MAX
−25
85
0
70
UNIT
°C
SLVS063E − NOVEMBER 1988 − REVISED OCTOBER 2003
electrical characteristics at specified free-air temperature (unless otherwise noted)
PARAMETER
TA†
TEST CONDITIONS
LM236, LM336
VZ
Reference voltage
IZ = 1 mA
∆VZ(∆T)
Change in reference
voltage with
temperature
VZ adjusted to 2.490 V,
IZ = 1 mA
∆VZ(∆I)
Z( I)
Change in reference
voltage with current
IZ = 400 µA
A to 10 mA
∆VZ(∆t)
Long-term change
in reference voltage
IZ = 1 mA
zz
Reference
impedance
IZ = 1 mA,
LM336-2.5
MIN
TYP
MAX
MIN
TYP
MAX
2.44
2.49
2.54
2.39
2.49
2.59
2.44
2.49
2.54
9
1.8
6
25°C
LM336B
f = 1 kHz
LM236-2.5
Full range
3.5
25°C
2.6
6
2.6
10
Full range
3
10
3
12
25°C
20
25°C
0.2
0.6
0.2
1
Full range
0.4
1
0.4
1.4
20
UNIT
V
mV
mV
ppm/khr
W
† Full range is −25°C to 85°C for the LM236-2.5 and 0°C to 70°C for the LM336-2.5 and LM336B-2.5.
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SLVS063E − NOVEMBER 1988 − REVISED OCTOBER 2003
TYPICAL CHARACTERISTICS
CHANGE IN REFERENCE VOLTAGE
vs
REFERENCE CURRENT
NOISE VOLTAGE
vs
FREQUENCY
250
IZ = 1 mA
TA = 25°C
TA = 25°C
2
Vn − Noise Voltage − nV/ Hz
∆V Z − Change in Reference Voltage − mV
2.5
1.5
1
0.5
0
200
150
100
50
0
2
8
4
6
IZ − Reference Current − mA
10
10
100
Figure 1
Figure 2
REFERENCE IMPEDANCE
vs
FREQUENCY
100
z z − Reference Impedance − Ω
IZ = 1 mA
TA = −55°C to 125°C
10
1
0.1
0.01
0.1
1
10
f − Frequency − kHz
Figure 3
4
1k
f − Frequency − Hz
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100
10 k
100 k
SLVS063E − NOVEMBER 1988 − REVISED OCTOBER 2003
APPLICATION INFORMATION
5V
2.49 kΩ
2.5 V
IN457 †
LM236-2.5
LM336-2.5
LM336B-2.5
5V
2.49 kΩ
10 kه
IN457 †
2.5 V
LM236-2.5
LM336-2.5
LM336B-2.5
NC
† Any silicon signal diode
‡ Adjust to 2.49 V
Figure 5. 2.5-V Reference
With Minimum Temperature Coefficient
Figure 4. 2.5-V Reference
3.5 V to 40 V
V+
R
LM334
V−
68.1 Ω
VO = 2.5 V
LM336-2.5
LM336-2.5
LM336B-2.5
NC
Figure 6. Wide-Input-Range Reference
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PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
LM236D-2-5
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LM236DE4-2-5
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LM236DR-2-5
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LM236DRE4-2-5
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LM236LP-2-5
OBSOLETE
TO-92
LP
3
LM336BD-2-5
ACTIVE
SOIC
D
8
LM336BDE4-2-5
ACTIVE
SOIC
D
8
LM336BDR-2-5
ACTIVE
SOIC
D
LM336BDRE4-2-5
ACTIVE
SOIC
LM336BLP-2-5
ACTIVE
LM336BLPE3-2-5
Lead/Ball Finish
MSL Peak Temp (3)
TBD
Call TI
Call TI
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TO-92
LP
3
1000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
ACTIVE
TO-92
LP
3
1000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
LM336BLPR-2-5
ACTIVE
TO-92
LP
3
2000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
LM336BLPRE3-2-5
ACTIVE
TO-92
LP
3
2000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
LM336D-2-5
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LM336DE4-2-5
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LM336DR-2-5
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LM336DRE4-2-5
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LM336LP-2-5
ACTIVE
TO-92
LP
3
1000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
LM336LPE3-2-5
ACTIVE
TO-92
LP
3
1000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
LM336LPR-2-5
ACTIVE
TO-92
LP
3
2000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
LM336LPRE3-2-5
ACTIVE
TO-92
LP
3
2000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MSOT002A – OCTOBER 1994 – REVISED NOVEMBER 2001
LP (O-PBCY-W3)
PLASTIC CYLINDRICAL PACKAGE
0.205 (5,21)
0.175 (4,44)
0.165 (4,19)
0.125 (3,17)
DIA
0.210 (5,34)
0.170 (4,32)
Seating
Plane
0.157 (4,00) MAX
0.050 (1,27)
C
0.500 (12,70) MIN
0.104 (2,65)
FORMED LEAD OPTION
0.022 (0,56)
0.016 (0,41)
0.016 (0,41)
0.014 (0,35)
STRAIGHT LEAD OPTION
D
0.135 (3,43) MIN
0.105 (2,67)
0.095 (2,41)
0.055 (1,40)
0.045 (1,14)
1
2
3
0.105 (2,67)
0.080 (2,03)
0.105 (2,67)
0.080 (2,03)
4040001-2 /C 10/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Lead dimensions are not controlled within this area
D. FAlls within JEDEC TO -226 Variation AA (TO-226 replaces TO-92)
E. Shipping Method:
Straight lead option available in bulk pack only.
Formed lead option available in tape & reel or ammo pack.
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MECHANICAL DATA
MSOT002A – OCTOBER 1994 – REVISED NOVEMBER 2001
LP (O-PBCY-W3)
PLASTIC CYLINDRICAL PACKAGE
0.539 (13,70)
0.460 (11,70)
1.260 (32,00)
0.905 (23,00)
0.650 (16,50)
0.610 (15,50)
0.020 (0,50) MIN
0.098 (2,50)
0.384 (9,75)
0.335 (8,50)
0.748 (19,00)
0.217 (5,50)
0.433 (11,00)
0.335 (8,50)
0.748 (19,00)
0.689 (17,50)
0.114 (2,90)
0.094 (2,40)
0.114 (2,90)
0.094 (2,40)
0.169 (4,30)
0.146 (3,70)
DIA
0.266 (6,75)
0.234 (5,95)
0.512 (13,00)
0.488 (12,40)
TAPE & REEL
4040001-3 /C 10/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Tape and Reel information for the Format Lead Option package.
2
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