ASB ALN0070WT Internally matched lna module Datasheet

plerowTM ALN0070WT
Internally Matched LNA Module
Features
Description
· S21 = 22.2 dB@60 MHz
= 21.8 dB@80 MHz
· NF of 0.9 dB over Frequency
· Unconditionally Stable
· Single 5 V Supply
· High OIP3 at Low Current
The plerowTM ALN-series is the compactly designed surface-mount
module for the use of the LNA with or without the following gain blocks in
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communication terminals, CATV and so on. It has an exceptional performance of
low noise figure, high gain, high OIP3, and low bias current. The stability
factor is always kept more than unity over the application band in order
to ensure its unconditionally stable implementation to the application
system environment. The surface-mount module package including the
completed matching circuit and other components necessary just in case
allows very simple and convenient implementation onto the system
board in mass production level.
Specifications (in Production)
Typ.@T = 25 °C, Vs = 5 V, Freq. = 70 MHz, Zo.sys = 50 ohms
Parameter
Unit
Frequency Range
Min
MHz
60
Gain
dB
21
Gain Flatness
dB
Noise Figure
dB
Output IP3 (1)
dBm
S11/S22 (2)
Typ
dBm
Switching Time (3)
msec
Max
80
22
± 0.2
± 0.3
0.9
0.95
25
27
16
17
dB
Output P1dB
1-stage Single Type
Specifications
More Information
Website: www.asb.co.kr
E-mail: [email protected]
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
-18/-10
Supply Current
mA
40
Supply Voltage
V
5
Impedance
W
50
60
Max. RF Input Power
dBm
C.W 23~25 (before fail)
Package Type & Size
mm
Surface Mount Type, 10Wx10Lx3.8H
Operating temperature is -40 °C to +85 °C.
1) OIP3 is measured with two tones at an output power of 4 dBm/tone separated by 1 MHz.
2) S11, S22(max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
Outline Drawing (Unit: mm)
Pin Number
Function
plerow
2
RF In
ALN0070WT
5
RF Out
6
Vs
Others
Ground
ASB Inc.
(Top View)
(Bottom View)
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
Solder Stencil Area
(Side View)
Ø0.4 plated thru holes to ground plane
(Recommended Footprint)
1/3
www.asb.co.kr
October 2009
plerowTM ALN0070WT
Internally Matched LNA Module
S-parameters
Typical Performance
(Measured)
60~80 MHz
+5 V
2/3
S-parameters & K Factor
Noise Figure
OIP3
P1dB
www.asb.co.kr
October 2009
plerowTM ALN0070WT
Internally Matched LNA Module
Application Circuit
VS
+
-
Tantal or MLC (Multi Layer Ceramic)
Capacitor
C1
C2
ALN
IN
OUT
1)
The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced
from the DC supply. The capacitance value may be determined by customer’s DC supply status. The capacitor should be placed as close as possible to Vs pin and be connected directly to the ground plane for
the best electrical performance.
2)
DC blocking capacitors are always necessarily placed at the input and output port for allowing only the
RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are included inside the ALN module. Therefore, C1 & C2 capacitors may not be necessary, but can be added just
in case that the customer wants. The value of C1 & C2 is determined by considering the application frequency.
Recommended Soldering Reflow Process
Evaluation Board Layout
Vs
20~40 sec
260 °C
Ramp-up
(3 °C/sec)
200 °C
Ramp-down
(6 °C/sec)
IN
OUT
150 °C
60~180 sec
3/3
Size 25x25 mm
(for ALN-AT, BT, WT, T Series – 10x10 mm)
www.asb.co.kr
October 2009
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