HLMP-LB11/HLMP-LM11 4 mm Precision Optical Performance InGaN Standard Oval LED Lamps Data Sheet Description Features These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern and high luminous intensity ensure that this device is excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. This lamp has very smooth, matched radiation patterns ensuring consistent color mixing in full color applications, message uniformity across the viewing angle of the sign. High efficiency LED material is used in this lamp: Indium Gallium Nitride for Blue and Green. Each lamp is made with an advanced optical grade epoxy offering superior high temperature and high moisture resistance in outdoor applications. The package epoxy contains both UV-a and UV-b inhibitors to reduce the effects of long term exposure to direct sunlight. • Well defined spatial radiation pattern • High brightness material – Blue InGaN 470 nm – Green InGaN 525 nm Applications • Full color signs • Commercial outdoor advertising Benefits • Viewing angle designed for wide field of view applications • Superior performance for outdoor environments CAUTION: Devises are Class I ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Package Dimensions 21.00 MIN. (0.827) 9.80 ± 0.18 (0.386 ± 0.007) ∅ 3.70 ± 0.20 (0.146 ± 0.008) 6.30 ± 0.20 (0.248 ± 0.008) 1.00 MIN. (0.039) 1.25 ± 0.20 (0.049 ± 0.008) CATHODE LEAD 2.54 ± 0.30 (0.100 ± 0.012) 0.80 MAX. EPOXY MENISCUS (0.016) +0.10 0.45 –0.04 +0.10 0.40 –0 +0.004 (0.018 –0.002) +0.004 (0.016 –0.000) NOTES: 1. DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE ± 0.1 mm UNLESS OTHERWISE NOTED. Device Selection Guide Part Number Color and Dominant Wavelength λd (nm) Typ. Luminous Intensity Iv (mcd) at 20 mA Min. Luminous Intensity Iv (mcd) at 20 mA Max. Tinting Type HLMP-LB11-FJ0xx Blue 470 110 310 Blue HLMP-LB11-HJCxx Blue 470 180 310 Blue HLMP-LB11-HL0xx Blue 470 180 520 Blue HLMP-LB11-JKCxx Blue 470 240 400 Blue HLMP-LB11-KN0xx Blue 470 310 880 Blue HLMP-LM11-LP0xx Green 525 400 1150 Green HLMP-LM11-MNCxx Green 525 520 880 Green HLMP-LM11-NR0xx Green 525 680 1900 Green HLMP-LM11-PQCxx Green 525 880 1500 Green HLMP-LM11-QRCxx Green 525 1150 1900 Green HLMP-LM11-QT0xx Green 525 1150 3200 Green Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package. 2. The optical axis is closely aligned with the package mechanical axis. 3. The dominant wavelength, λd, is derived from the Chromaticity Diagram and represents the color of the lamp. 4. Tolerance for intensity limit is ±15%. 2 Part Numbering System HLMP-X X 11 – X X X XX Mechanical Options 00: Bulk Packaging DD: Ammo Pack ZZ: Flexi-bin, Ammo Pack Color Bin Selections 0: No color bin limitation Maximum Intensity Bin 0: No Iv bin limitation Minimum Intensity Bin Refer to Device Selection Guide Color B: 470 nm Blue M: 525 nm Green Package L: 4 mm Standard Oval Absolute Maximum Ratings at TA = 25°C Parameter Value DC Forward Current[1] 30 mA Peak Pulsed Forward Current[2] 100 mA Power Dissipation 130 mW Reverse Voltage 5 V (IR = 10 µA) LED Junction Temperature 130°C Operating Temperature Range –40°C to +80°C Storage Temperature Range –40°C to +100°C Notes: 1. Derate linearly as shown in Figure 3. 2. Duty Factor 10%, Frequency 1 kHz. 3 Electrical /Optical Characteristics Table TA = 25°C Parameter Symbol Forward Voltage Blue (λd = 470 nm) Green (λd = 525 nm) VF Reverse Voltage VR Capacitance Blue (λd = 470 nm) Green (λd = 525 nm) C Thermal Resistance Min. Typ. Max. Units Test Conditions 3.8 3.8 4.0 4.0 V IF = 20 mA V IR = 10 µA 43 43 pF VF = 0, f = 1 MHz RθJ-PIN 240 °C/W LED Junction-to-Cathode Lead Peak Wavelength Blue (λd = 470 nm) Green (λd = 525 nm) λP 467 520 nm Peak of Wavelength of Spectral Distribution at IF = 20 mA Spectral Halfwidth Blue (λd = 470 nm) Green (λd = 525 nm) ∆λ1/2 24 35 nm Wavelength Width at Spectral Distribution Power Point at IF = 20 mA Luminous Efficacy Blue (λd = 470 nm) Green (λd = 525 nm) ηv 75 520 lm/W Emitted luminous power/Emitted radiant power 5 Notes: 1. 2θ1/2 is the off-axis angle where the luminous intensity is 1/2 the on axis intensity. 2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = Iv/ηv where Iv is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt. RELATIVE LUMINOUS INTENSITY 1.0 BLUE GREEN 0.8 0.6 0.4 0.2 0 400 450 500 550 WAVELENGTH – nm Figure 1. Relative intensity vs. wavelength. 4 600 650 700 MAXIMUM FORWARD CURRENT – mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 30 35 30 RθJA = 585°C/W 25 RθJA = 780°C/W 20 15 10 5 0 10 20 30 40 50 60 70 80 90 0 FORWARD CURRENT – mA AMBIENT TEMPERATURE – °C Figure 2. Relative luminous intensity vs. forward current. Figure 3. Forward current vs. ambient temperature. RELATIVE DOMINANT WAVELENGTH FORWARD CURRENT – mA 30 25 20 15 10 5 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 1.035 1.030 1.025 GREEN 1.020 1.015 1.010 1.005 BLUE 1.000 0.995 0.990 0.985 0 FORWARD VOLTAGE – V 5 Figure 4. Forward current vs. forward voltage. RELATIVE INTENSITY 0.5 -70 -50 -30 -10 10 ANGLE – DEGREES Figure 6. Spatial radiation pattern – minor axis. 5 15 20 25 Figure 5. Relative dominant wavelength vs. forward current. 1.0 0 -90 10 FORWARD CURRENT – mA 30 50 70 90 30 RELATIVE INTENSITY 1.0 0.5 0 -90 -70 -50 -30 -10 10 30 50 70 90 ANGLE – DEGREES Figure 7. Spatial radiation pattern – major axis. Intensity Bin Limits (mcd @ 20 mA) Color Bin Limits (nm at 20 mA) Blue Color Range (nm) Bin Name Min. Max. Bin Min. Max. F 110 140 1 460.0 464.0 G 140 180 2 464.0 468.0 H 180 240 3 468.0 472.0 J 240 310 4 472.0 476.0 K 310 400 5 476.0 480.0 L 400 520 Tolerance for each bin limit is ± 0.5 nm. M 520 680 N 680 880 P 880 1150 Q 1150 1500 R 1500 1900 Tolerance for each intensity bin limit is ±15%. 6 Green Color Range (nm) Bin Min. Max. 1 520.0 524.0 2 524.0 528.0 3 528.0 532.0 4 532.0 536.0 5 536.0 540.0 Tolerance for each bin limit is ± 0.5 nm. Note: 1. Bin categories are established for classification of products. Products may not be available in all bin categories. Precautions: Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Recommended PC board plated through hole sizes for LED component leads: • The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. • Recommended soldering conditions: Wave Soldering Manual Solder Dipping Pre-heat Temperature Pre-heat Time 105 °C Max. 30 sec Max. – – Peak Temperature Dwell Time 250 °C Max. 3 sec Max. 260 °C Max. 5 sec Max. LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE TEMPERATURE – °C 250 Diagonal 0.646 mm (0.025 inch) Plated Through Hole Diameter 0.976 to 1.078 mm (0.038 to 0.042 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) 0.718 mm (0.028 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) Note: Refer to application note AN1027 for more information on soldering LED components. BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD 200 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150°C (100°C PCB) SOLDER WAVE TEMPERATURE = 245°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40° SOLDER: SN63; FLUX: RMA 150 FLUXING 100 50 30 0 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 10 20 30 40 50 60 70 80 TIME – SECONDS Figure 8. Recommended wave soldering profile. 7 LED Component Lead Size 0.457 x 0.457 mm (0.018 x 0.018 inch) 90 100 For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-2807EN 5989-4144EN May 31, 2006