AVAGO HLMP-LB11-HJCXX 4 mm precision optical performance ingan standard oval led lamp Datasheet

HLMP-LB11/HLMP-LM11
4 mm Precision Optical Performance
InGaN Standard Oval LED Lamps
Data Sheet
Description
Features
These Precision Optical Performance Oval LEDs are
specifically designed for full color/video and
passenger information signs. The oval shaped
radiation pattern and high luminous intensity ensure
that this device is excellent for wide field of view
outdoor applications where a wide viewing angle and
readability in sunlight are essential. This lamp has
very smooth, matched radiation patterns ensuring
consistent color mixing in full color applications,
message uniformity across the viewing angle of the
sign. High efficiency LED material is used in this
lamp: Indium Gallium Nitride for Blue and Green.
Each lamp is made with an advanced optical grade
epoxy offering superior high temperature and high
moisture resistance in outdoor applications. The
package epoxy contains both UV-a and UV-b
inhibitors to reduce the effects of long term exposure
to direct sunlight.
• Well defined spatial radiation pattern
• High brightness material
– Blue InGaN 470 nm
– Green InGaN 525 nm
Applications
• Full color signs
• Commercial outdoor advertising
Benefits
• Viewing angle designed for wide field of view
applications
• Superior performance for outdoor environments
CAUTION: Devises are Class I ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to
Application Note AN-1142 for additional details.
Package Dimensions
21.00 MIN.
(0.827)
9.80 ± 0.18
(0.386 ± 0.007)
∅ 3.70 ± 0.20
(0.146 ± 0.008)
6.30 ± 0.20
(0.248 ± 0.008)
1.00 MIN.
(0.039)
1.25 ± 0.20
(0.049 ± 0.008)
CATHODE
LEAD
2.54 ± 0.30
(0.100 ± 0.012)
0.80 MAX. EPOXY MENISCUS
(0.016)
+0.10
0.45 –0.04
+0.10
0.40 –0
+0.004
(0.018 –0.002)
+0.004
(0.016 –0.000)
NOTES:
1. DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE ± 0.1 mm UNLESS OTHERWISE NOTED.
Device Selection Guide
Part Number
Color and Dominant
Wavelength λd (nm) Typ.
Luminous Intensity Iv
(mcd) at 20 mA Min.
Luminous Intensity Iv
(mcd) at 20 mA Max.
Tinting
Type
HLMP-LB11-FJ0xx
Blue 470
110
310
Blue
HLMP-LB11-HJCxx
Blue 470
180
310
Blue
HLMP-LB11-HL0xx
Blue 470
180
520
Blue
HLMP-LB11-JKCxx
Blue 470
240
400
Blue
HLMP-LB11-KN0xx
Blue 470
310
880
Blue
HLMP-LM11-LP0xx
Green 525
400
1150
Green
HLMP-LM11-MNCxx
Green 525
520
880
Green
HLMP-LM11-NR0xx
Green 525
680
1900
Green
HLMP-LM11-PQCxx
Green 525
880
1500
Green
HLMP-LM11-QRCxx
Green 525
1150
1900
Green
HLMP-LM11-QT0xx
Green 525
1150
3200
Green
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λd, is derived from the Chromaticity Diagram and represents the color of the lamp.
4. Tolerance for intensity limit is ±15%.
2
Part Numbering System
HLMP-X X 11 – X X X XX
Mechanical Options
00: Bulk Packaging
DD: Ammo Pack
ZZ: Flexi-bin, Ammo Pack
Color Bin Selections
0: No color bin limitation
Maximum Intensity Bin
0: No Iv bin limitation
Minimum Intensity Bin
Refer to Device Selection Guide
Color
B: 470 nm Blue
M: 525 nm Green
Package
L: 4 mm Standard Oval
Absolute Maximum Ratings at TA = 25°C
Parameter
Value
DC Forward Current[1]
30 mA
Peak Pulsed Forward Current[2]
100 mA
Power Dissipation
130 mW
Reverse Voltage
5 V (IR = 10 µA)
LED Junction Temperature
130°C
Operating Temperature Range
–40°C to +80°C
Storage Temperature Range
–40°C to +100°C
Notes:
1. Derate linearly as shown in Figure 3.
2. Duty Factor 10%, Frequency 1 kHz.
3
Electrical /Optical Characteristics Table
TA = 25°C
Parameter
Symbol
Forward Voltage
Blue (λd = 470 nm)
Green (λd = 525 nm)
VF
Reverse Voltage
VR
Capacitance
Blue (λd = 470 nm)
Green (λd = 525 nm)
C
Thermal Resistance
Min.
Typ.
Max.
Units
Test Conditions
3.8
3.8
4.0
4.0
V
IF = 20 mA
V
IR = 10 µA
43
43
pF
VF = 0, f = 1 MHz
RθJ-PIN
240
°C/W
LED Junction-to-Cathode Lead
Peak Wavelength
Blue (λd = 470 nm)
Green (λd = 525 nm)
λP
467
520
nm
Peak of Wavelength of Spectral
Distribution at IF = 20 mA
Spectral Halfwidth
Blue (λd = 470 nm)
Green (λd = 525 nm)
∆λ1/2
24
35
nm
Wavelength Width at Spectral
Distribution Power Point at IF = 20 mA
Luminous Efficacy
Blue (λd = 470 nm)
Green (λd = 525 nm)
ηv
75
520
lm/W
Emitted luminous power/Emitted
radiant power
5
Notes:
1. 2θ1/2 is the off-axis angle where the luminous intensity is 1/2 the on axis intensity.
2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = Iv/ηv where Iv is the luminous intensity in candelas and ηv is
the luminous efficacy in lumens/watt.
RELATIVE LUMINOUS INTENSITY
1.0
BLUE
GREEN
0.8
0.6
0.4
0.2
0
400
450
500
550
WAVELENGTH – nm
Figure 1. Relative intensity vs. wavelength.
4
600
650
700
MAXIMUM FORWARD CURRENT – mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
5
10
15
20
25
30
35
30
RθJA =
585°C/W
25
RθJA = 780°C/W
20
15
10
5
0
10 20 30 40 50 60 70 80 90
0
FORWARD CURRENT – mA
AMBIENT TEMPERATURE – °C
Figure 2. Relative luminous intensity vs.
forward current.
Figure 3. Forward current vs. ambient temperature.
RELATIVE DOMINANT WAVELENGTH
FORWARD CURRENT – mA
30
25
20
15
10
5
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
1.035
1.030
1.025
GREEN
1.020
1.015
1.010
1.005
BLUE
1.000
0.995
0.990
0.985
0
FORWARD VOLTAGE – V
5
Figure 4. Forward current vs. forward voltage.
RELATIVE INTENSITY
0.5
-70
-50
-30
-10
10
ANGLE – DEGREES
Figure 6. Spatial radiation pattern – minor axis.
5
15
20
25
Figure 5. Relative dominant wavelength vs.
forward current.
1.0
0
-90
10
FORWARD CURRENT – mA
30
50
70
90
30
RELATIVE INTENSITY
1.0
0.5
0
-90
-70
-50
-30
-10
10
30
50
70
90
ANGLE – DEGREES
Figure 7. Spatial radiation pattern – major axis.
Intensity Bin Limits
(mcd @ 20 mA)
Color Bin Limits (nm at 20 mA)
Blue
Color Range (nm)
Bin Name
Min.
Max.
Bin
Min.
Max.
F
110
140
1
460.0
464.0
G
140
180
2
464.0
468.0
H
180
240
3
468.0
472.0
J
240
310
4
472.0
476.0
K
310
400
5
476.0
480.0
L
400
520
Tolerance for each bin limit is ± 0.5 nm.
M
520
680
N
680
880
P
880
1150
Q
1150
1500
R
1500
1900
Tolerance for each intensity bin limit is ±15%.
6
Green
Color Range (nm)
Bin
Min.
Max.
1
520.0
524.0
2
524.0
528.0
3
528.0
532.0
4
532.0
536.0
5
536.0
540.0
Tolerance for each bin limit is ± 0.5 nm.
Note:
1. Bin categories are established for classification of products. Products may not be available in all
bin categories.
Precautions:
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of
LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
• It is recommended that tooling made to precisely
form and cut the leads to length rather than rely upon
hand operation.
Soldering Conditions
• Care must be taken during PCB assembly and
soldering process to prevent damage to LED
component.
• Wave soldering parameter must be set and
maintained according to recommended temperature
and dwell time in the solder wave. Customer is
advised to periodically check on the soldering profile
to ensure the soldering profile used is always
conforming to recommended soldering condition.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25°C, before handling.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
• Recommended PC board plated through hole sizes for
LED component leads:
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
• Recommended soldering conditions:
Wave Soldering
Manual Solder
Dipping
Pre-heat Temperature
Pre-heat Time
105 °C Max.
30 sec Max.
–
–
Peak Temperature
Dwell Time
250 °C Max.
3 sec Max.
260 °C Max.
5 sec Max.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
TEMPERATURE – °C
250
Diagonal
0.646 mm
(0.025 inch)
Plated Through
Hole Diameter
0.976 to 1.078 mm
(0.038 to 0.042 inch)
0.508 x 0.508 mm
(0.020 x 0.020 inch)
0.718 mm
(0.028 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more
information on soldering LED components.
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
200
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
150
FLUXING
100
50
30
0
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
PREHEAT
10
20
30
40
50
60
70
80
TIME – SECONDS
Figure 8. Recommended wave soldering profile.
7
LED Component
Lead Size
0.457 x 0.457 mm
(0.018 x 0.018 inch)
90
100
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-2807EN
5989-4144EN May 31, 2006
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