Maxim DS1393U-18+ Low-voltage spi/3-wire rtcs with trickle charger Datasheet

Rev 1; 1/07
Low-Voltage SPI/3-Wire RTCs with
Trickle Charger
Features
The low-voltage serial-peripheral interface (SPI™)
DS1390/DS1391 and the low-voltage 3-wire DS1392/
DS1393 real-time clocks (RTCs) are clocks/calendars
that provide hundredths of a second, seconds, minutes, hours, day, date, month, and year information.
The date at the end of the month is automatically
adjusted for months with fewer than 31 days, including
corrections for leap year. The clock operates in either
the 24-hour or 12-hour format with an AM/PM indicator.
One programmable time-of-day alarm is provided. A
temperature-compensated voltage reference monitors
the status of VCC and automatically disables the bus
interface and switches to the backup supply if a power
failure is detected. On the DS1390, a single open-drain
output provides a CPU interrupt or a square wave at
one of four selectable frequencies. The DS1391
replaces the SQW/INT pin with a RST output/
debounced input.
The DS1390 and DS1391 are programmed serially
through an SPI-compatible, bidirectional bus. The
DS1392 and DS1393 communicate over a 3-wire serial
bus, and the extra pin is used for either a separate
interrupt pin or a RST output/debounced input.
All four devices are available in a 10-pin µSOP package,
and are rated over the industrial temperature range.
♦ Real-Time Clock Counts Hundredths of Seconds,
Seconds, Minutes, Hours, Day, Date, Month, and
Year with Leap-Year Compensation Valid Up to
2100
♦ Output Pin Configurable as Interrupt or Square
Wave with Programmable Frequency of
32.768kHz, 8.192kHz, 4.096kHz, or 1Hz
(DS1390/DS1393 Only)
♦ One Time-of-Day Alarm
♦ Power-Fail Detect and Switch Circuitry
♦ Reset Output/Debounced Input (DS1391/DS1393)
♦ Separate SQW and INT Output (DS1392)
♦ Trickle-Charge Capability
♦ SPI Supports Modes 1 and 3 (DS1390/DS1391)
♦ 3-Wire Interface (DS1392/DS1393)
♦ 4MHz at 3.0V and 3.3V
♦ 1MHz at 1.8V
♦ Three Operating Voltages: 1.8V ±5%, 3.0V ±10%,
and 2.97 to 5.5V
♦ Industrial Temperature Range: -40°C to +85°C
♦ Underwriters Laboratory (UL) Recognized
Applications
Ordering Information
Hand-Held Devices
PART
GPS/Telematics Devices
Embedded Time Stamping
Medical Devices
Typical Operating Circuits and Pin Configurations appear at
end of the data sheet.
SPI is a trademark of Motorola, Inc.
DS1390U-18+
DS1390U-3+
DS1390U-33+
DS1391U-18+
DS1391U-3+
DS1391U-33+
DS1392U-18+
DS1392U-3+
DS1392U-33+
DS1393U-18+
DS1393U-3+
DS1393U-33+
TYP
OPERATING
VOLTAGE (V)
1.8
3.0
3.3
1.8
3.0
3.3
1.8
3.0
3.3
1.8
3.0
3.3
PINPACKAGE
TOP MARK†
10
10
10
10
10
10
10
10
10
10
10
10
1390 rr-18
1390 rr-3
1390 rr-33
1391 rr-18
1391 rr-3
1391 rr-33
1393 rr-18
1392 rr-3
1392 rr-33
1393 rr-18
1393 rr-3
1393 rr-33
μSOP
μSOP
μSOP
μSOP
μSOP
μSOP
μSOP
μSOP
μSOP
μSOP
μSOP
μSOP
Note: All devices are rated for the -40°C to +85°C operating
temperature range.
+Denotes lead-free package.
†A “+” anywhere on the top mark denotes a lead-free/RoHScompliant package.
rr = Revision code on second line of top mark.
______________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
1
DS1390/DS1391/DS1392/DS1393
General Description
DS1390/DS1391/DS1392/DS1393
Low-Voltage SPI/3-Wire RTCs with
Trickle Charger
ABSOLUTE MAXIMUM RATINGS
Voltage Range on VCC Pin Relative to Ground .....-0.3V to +6.0V
Voltage Range on Inputs Relative
to Ground ...............................................-0.3V to (VCC + 0.3V)
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-55°C to +125°C
Soldering Temperature .......................................See IPC/JEDEC
J-STD-020A Specification
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
RECOMMENDED DC OPERATING CONDITIONS
(VCC = VCC(MIN) to VCC(MAX), TA = -40°C to +85°C, unless otherwise noted. Typical values are at nominal supply voltage and TA = +25°C,
unless otherwise noted.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
DS139x-33
Supply Voltage (Note 2)
VCC
MIN
2.97
TYP
3.3
MAX
5.50
UNITS
V
DS139x-3
2.7
3.0
3.3
DS139x-18
1.71
1.8
1.89
Logic 1
VIH
(Note 2)
0.7 x
VCC
VCC +
0.5
V
Logic 0
VIL
(Note 2)
-0.3
+0.3 x
VCC
V
Supply Voltage, Pullup
SQW/INT, SQW, INT, VCC = 0V
VPU
(Note 2)
5.5
V
VBACKUP Voltage (Note 2)
Power-Fail Voltage (Note 2)
VBACKUP
VPF
-33
1.3
3.0 VCC(MAX)
-3
1.3
3.0
3.7
-18
1.3
3.0
3.7
-33
2.70
2.88
2.97
-3
2.45
2.6
2.70
-18
1.51
1.6
1.71
V
V
R1
(Notes 3, 4)
250
R2
(Notes 3, 5)
2000
R3
(Notes 3, 6)
4000
Input Leakage
ILI
(Note 7)
-1
+1
I/O Leakage
ILO
(Note 8)
-1
+1
µA
RST Pin I/O Leakage
ILORST
(Note 9)
-200
+10
µA
DOUT Logic 1 Output
IOHDOUT
DOUT Logic 0 Output
IOHDOUT
Trickle-Charge Current-Limiting
Resistors
Logic 0 Output
(DS1390/DS1393 SQW/INT;
DS1392 SQW, INT;
DS1391/DS1393 RST)
IOLSIR
VCC Active Supply Current
(Note 10)
ICCA
2
-33, -3 (VOH = 0.85 x VCC)
-18 (VOH = 0.80 x VCC)
Ω
-1
0.750
-33, -3 (VOL = 0.15 x VCC)
3
-18 (VOL = 0.20 x VCC)
2
µA
mA
mA
VCC > 1.71V; VOL = 0.4V
3.0
mA
1.3V < VCC < 1.71V; VOL = 0.4V
250
µA
-33
2
-3
2
-18
500
_____________________________________________________________________
mA
µA
Low-Voltage SPI/3-Wire RTCs with
Trickle Charger
(VCC = VCC(MIN) to VCC(MAX), TA = -40°C to +85°C, unless otherwise noted. Typical values are at nominal supply voltage and TA = +25°C,
unless otherwise noted.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
-33
VCC Standby Current
(Note 11)
VBACKUP Leakage Current
(VBACKUP = 3.7V,
VCC = VCC(MAX))
ICCS
TYP
115
MAX
175
UNITS
µA
-3
80
125
-18
60
100
15
100
nA
TYP
MAX
UNITS
IBACKUPLKG
DC ELECTRICAL CHARACTERISTICS
(VCC = 0V, VBACKUP = 3.7V, TA = -40°C to +85°C, unless otherwise noted.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
VBACKUP Current OSC On,
SQW Off
IBACKUP1
(Note 12)
500
1000
nA
VBACKUP Current OSC On,
SQW On (32kHz)
IBACKUP2
(Note 12)
600
1150
nA
VBACKUP Current OSC On,
SQW On, VBACKUP = 3.0V,
TA = +25°C
IBACKUP3
(Note 12)
600
1000
nA
IBACKUPDR (Note 12)
25
100
nA
TYP
MAX
UNITS
VBACKUP Current, OSC Off
(Data Retention)
AC ELECTRICAL CHARACTERISTICS—SPI INTERFACE
(VCC = VCC(MIN) to VCC(MAX), TA = -40°C to +85°C, unless otherwise noted.) (Note 1)
PARAMETER
SCLK Frequency (Note 13)
SYMBOL
f SCLK
CONDITION
MIN
2.7V VCC 5.5V
0
4
1.71V VCC 1.89V
0
1
MHz
Data to SCLK Setup
tDC
(Notes 13, 14)
30
ns
SCLK to Data Hold
tCDH
(Notes 13, 14)
30
ns
SCLK to Data Valid
(Notes 13, 14, 15)
tCDD
SCLK Low Time (Note 13)
tCL
SCLK High Time (Note 13)
tCH
SCLK Rise and Fall
2.7V VCC 5.5V
80
1.71V VCC 1.89V
160
2.7V VCC 5.5V
110
1.71V VCC 1.89V
400
2.7V VCC 5.5V
110
1.71V VCC 1.89V
400
tR, tF
ns
ns
ns
200
ns
CS to SCLK Setup (Note 13)
tCC
400
ns
SCLK to CS Hold (Note 13)
tCCH
100
ns
CS Inactive Time (Note 13)
tCWH
CS to Output High Impedance
tCDZ
2.7V VCC 5.5V
400
1.71V VCC 1.89V
500
(Notes 13, 14)
ns
40
ns
_____________________________________________________________________
3
DS1390/DS1391/DS1392/DS1393
RECOMMENDED DC OPERATING CONDITIONS (continued)
DS1390/DS1391/DS1392/DS1393
Low-Voltage SPI/3-Wire RTCs with
Trickle Charger
CS
tCC
tR
tF
SCLK
tCL
DIN
tCDZ
tCH
tCDH
tCDD
tDC
A6
W/R
DOUT
A0
HIGH IMPEDANCE
D7
WRITE ADDRESS BYTE
D0
READ DATA BYTE
NOTE: SCLK CAN BE EITHER POLARITY, SHOWN FOR CPOL = 1.
Figure 1. Timing Diagram—SPI Read Transfer
tCWH
CS
tCC
SCLK
DIN
tCDH
tDC
W/R
tCCH
tF
tR
tCL
tCH
A6
A0
WRITE ADDRESS BYTE
DOUT
D7
D0
WRITE DATA BYTE
HIGH IMPEDANCE
Figure 2. Timing Diagram—SPI Write Transfer
4
_____________________________________________________________________
Low-Voltage SPI/3-Wire RTCs with
Trickle Charger
(VCC = VCC(MIN) to VCC(MAX), TA = -40°C to +85°C.) (Note 1) (Figures 3, 4)
PARAMETER
SCLK Frequency (Note 13)
SYMBOL
f SCLK
CONDITION
MIN
TYP
MAX
2.7V VCC 5.5V
0
4
1.71V VCC 1.89V
0
1
UNITS
MHz
Data to SCLK Setup
tDC
(Notes 13, 14)
30
ns
SCLK to Data Hold
tCDH
(Notes 13, 14)
30
ns
SCLK to Data Valid (Notes 13,
14, 15)
tCDD
SCLK Low Time (Note 13)
tCL
SCLK High Time (Note 13)
tCH
SCLK Rise and Fall
2.7V VCC 5.5V
80
1.71V VCC 1.89V
160
2.7V VCC 5.5V
110
1.71V VCC 1.89V
400
2.7V VCC 5.5V
110
1.71V VCC 1.89V
400
ns
ns
ns
tR, tF
200
ns
CS to SCLK Setup
tCC
(Note 13)
400
ns
SCLK to CS Hold
tCCH
(Note 13)
100
ns
CS Inactive Time (Note 13)
tCWH
CS to Output High Impedance
tCDZ
2.7V VCC 5.5V
400
1.71V VCC 1.89V
500
ns
(Note 13, 14)
40
ns
TYP
MAX
UNITS
AC ELECTRICAL CHARACTERISTICS
(VCC = VCC(MIN) to VCC(MAX), TA = -40°C to +85°C, unless otherwise noted.) (Note 1)
PARAMETER
Pushbutton Debounce
SYMBOL
CONDITIONS
MIN
PBDB
160
200
ms
Reset Active Time
tRST
160
200
ms
Oscillator Stop Flag (OSF) Delay
tOSF
(Note 16)
100
ms
_____________________________________________________________________
5
DS1390/DS1391/DS1392/DS1393
AC ELECTRICAL CHARACTERISTICS—3-WIRE INTERFACE
DS1390/DS1391/DS1392/DS1393
Low-Voltage SPI/3-Wire RTCs with
Trickle Charger
CE
tCC
tR
tF
SCLK
tCL
tCDZ
tCH
tCDH
tCDD
tDC
I/O
A0
A1
R/W
D0
D7
READ DATA BYTE
WRITE ADDRESS BYTE
Figure 3. Timing Diagram—3-Wire Read Transfer
tCWH
CE
tCC
tR
tCCH
tF
SCLK
tCL
tCH
tCDH
tDC
I/O
A0
A1
WRITE ADDRESS BYTE
R/W
D0
D7
WRITE DATA BYTE
Figure 4. Timing Diagram—3-Wire Write Transfer
6
_____________________________________________________________________
Low-Voltage SPI/3-Wire RTCs with
Trickle Charger
(TA = -40°C to +85°C) (Figures 5, 6)
PARAMETER
SYMBOL
VCC Detect to Recognize Inputs
(VCC Rising)
tRST
CONDITIONS
MIN
(Note 17)
TYP
MAX
UNITS
160
200
ms
VCC Fall Time; VPF(MAX) to
VPF(MIN)
tF
300
µs
VCC Rise Time; VPF(MIN) to
VPF(MAX)
tR
0
µs
VCC
VPF(MAX)
VPF
VPF
VPF(MIN)
tF
tR
tRPU
tRST
RST
RECOGNIZED
INPUTS
DON'T CARE
RECOGNIZED
HIGH IMPEDANCE
OUTPUTS
VALID
VALID
Figure 5. Power-Up/Down Timing
RST
PBDB
tRST
Figure 6. Pushbutton Reset Timing
_____________________________________________________________________
7
DS1390/DS1391/DS1392/DS1393
POWER-UP/POWER-DOWN CHARACTERISTICS
DS1390/DS1391/DS1392/DS1393
Low-Voltage SPI/3-Wire RTCs with
Trickle Charger
CAPACITANCE
(TA = +25°C)
MAX
UNITS
Capacitance on All Input Pins
PARAMETER
CIN
10
pF
Capacitance on All Output Pins
(High Impedance)
CIO
10
pF
WARNING:
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
Note 6:
Note 7:
Note 8:
Note 9:
Note 10:
Note 11:
Note 12:
Note 13:
Note 14:
Note 15:
Note 16:
Note 17:
8
SYMBOL
CONDITIONS
MIN
TYP
Under no circumstances are negative undershoots, of any amplitude, allowed when the device
is in write protection.
Limits at -40°C are guaranteed by design and not production tested.
All voltages are referenced to ground.
The use of the 250Ω trickle-charge resistor is not allowed at VCC > 3.63V and should not be enabled. Use of the diode is
not recommended for VCC < 3.0V.
Measured at VCC = typ, VBACKUP = 0V, register 0Fh = A5h.
Measured at VCC = typ, VBACKUP = 0V, register 0Fh = A6h.
Measured at VCC = typ, VBACKUP = 0V, register 0Fh = A7h.
SCLK, DIN, CS on DS1390/DS1391; SCLK, and CE on DS1392/DS1393.
DOUT, SQW/INT (DS1390/DS1393), SQW, and INT (DS1392).
The RST pin has an internal 50kΩ (typ) pullup resistor to VCC.
ICCA—SCLK clocking at max frequency = 4MHz for 3V and 3.3V versions; 1MHz for 1.8V version; RST (DS1391/DS1393)
inactive. Outputs are open.
Specified with bus inactive.
Measured with a 32.768kHz crystal attached to X1 and X2. Typical values measured at +25°C and 3.0VBACKUP.
With 50pF load.
Measured at VIH = 0.7 x VDD or VIL = 0.2 x VDD, 10ns rise/fall times.
Measured at VOH = 0.7 x VDD or VOL = 0.2 x VDD. Measured from the 50% point of SCLK to the VOH minimum of SDO.
The parameter tOSF is the time that the oscillator must be stopped for the OSF flag to be set over the voltage range of
0 ≥ VCC ≥ VCC(MAX) and 1.3V ≥
≤ VBACKUP ≤
≥ 5.5V.
This delay applies only if the oscillator is enabled and running. If the EOSC bit is 1, the startup time of the oscillator is
added to this delay.
_____________________________________________________________________
Low-Voltage SPI/3-Wire RTCs with
Trickle Charger
IBACKUP vs. VBACKUP, BBSQ1 = 1
DS1390 TOC01
VCC= 0
SUPPLY CURRENT (nA)
500
450
400
350
300
1.3 1.7 2.1 2.5 2.9 3.3 3.7 4.1 4.5 4.9 5.3
1.3 1.7 2.1 2.5 2.9 3.3 3.7 4.1 4.5 4.9 5.3
VBACKUP (V)
VBACKUP (V)
IBACKUP vs. TEMPERATURE
VBACKUP = 3.0V
OSCILLATOR FREQUENCY
vs. SUPPLY VOLTAGE
32768.00
DS1390 toc03
600
VCC = 0V
550
32767.95
500
FREQUENCY (Hz)
SUPPLY CURRENT (nA)
VCC = 0V
DS1390 toc04
SUPPLY CURRENT (nA)
550
1000
950
900
850
800
750
700
650
600
550
500
450
400
350
300
DS1390 toc02
IBACKUP vs. VBACKUP, BBSQ1 = 0
600
450
400
350
32767.90
32767.85
300
250
32767.80
-40
-20
0
20
40
TEMPERATURE (°C)
60
80
1.3
1.8
2.3
2.8
3.3 3.8
4.3
4.8
5.3
SUPPLY (V)
_____________________________________________________________________
9
DS1390/DS1391/DS1392/DS1393
Typical Operating Characteristics
(VCC = +3.3V, TA = +25°C, unless otherwise noted.)
DS1390/DS1391/DS1392/DS1393
Low-Voltage SPI/3-Wire RTCs with
Trickle Charger
Pin Description
PIN
DS1390 DS1391 DS1392 DS1393
1
1
1
1
X1
2
2
2
2
X2
3
3
3
3
VBACKUP
FUNCTION
Connections for Standard 32.768kHz Quartz Crystal. The internal oscillator
circuitry is designed for operation with a crystal having a 6pF specified load
capacitance (CL). Pin X1 is the input to the oscillator and can optionally be
connected to an external 32.768kHz oscillator. The output of the internal
oscillator, pin X2, is floated if an external oscillator is connected to pin X1.
DC Backup Power Input for Primary Cell. This pin is a rechargeable
battery/super cap or a secondary supply. UL recognized to ensure against
reverse charging current when used with a lithium battery (www.maximic.com/qa/info/w/). This pin must be grounded if not used. Diodes in series
between the battery and the VBACKUP pin may prevent proper operation.
4
4
—
—
CS
SPI Chip-Select Input. This pin is used to select or deselect the part.
—
—
4
4
CE
Chip Enable for 3-Wire Interface
5
5
5
5
GND
Ground
6
6
—
—
DIN
SPI Data Input. This pin is used to shift address and data into the part.
INT
Interrupt Output. This pin is used to output the interrupt signal, if enabled by
the control register. The maximum voltage on this pin is 5.5V, independent of
VCC or VBACKUP. If enabled, INT functions when the device is powered
by either VCC or VBACKUP.
Reset. This active-low, open-drain output indicates the status of VCC relative
to the V PF specification. As Vcc falls below V PF, the RST pin is driven low.
When Vcc exceeds VPF, for tRST, the RST pin is driven high impedance.
This pin is combined with a debounced pushbutton input function. This pin
can be activated by a pushbutton reset request. This pin has an internal,
50k (typ) pullup resistor to VCC. No external pullup resistors should be
connected. If the crystal oscillator is disabled, the startup time of the
oscillator is added to the tRST delay.
—
—
6
—
—
9
—
6
RST
7
7
—
—
DOUT
—
—
7
7
I/O
8
8
8
8
SCLK
9
10
NAME
—
—
9
SQW/INT
SPI Data Output. Data is output on this pin when the part is in read mode.
CMOS push-pull driver.
Input/Output for 3-Wire Interface. CMOS push-pull driver.
Serial Clock Input. This pin is used to control the timing of data into and out
of the part.
Square-Wave/Interrupt Output. This pin is used to output the programmable
square wave or interrupt signal. When enabled by setting the ESQW bit to
logic 1, the SQW/INT pin outputs one of four frequencies: 32.768kHz,
8.192kHz, 4.096kHz, or 1Hz. This pin is open drain and requires an external
pullup resistor. The maximum voltage on this pin is 5.5V, independent of VCC
or VBACKUP. If enabled, SQW/INT functions when the device is powered by
either VCC or VBACKUP.
—
—
9
—
SQW
Square-Wave Output. This pin is open drain and requires an external pullup
resistor. The maximum voltage on this pin is 5.5V, independent of VCC or
VBACKUP. If enabled, SQW functions when the device is powered by either
VCC or VBACKUP.
10
10
10
10
VCC
DC Power Pin for Primary Power Supply
____________________________________________________________________
Low-Voltage SPI/3-Wire RTCs with
Trickle Charger
X1
X2
VCC
GND
VBACKUP
32,768Hz
CRYSTAL
OSCILLATOR
HUNDREDTHS-OFSECONDS
GENERATOR
SQUARE-WAVE RATE
SELECTOR, INT, MUX,
RST OUTPUT
VCC LEVEL DETECT,
POWER SWITCH,
WRITE PROTECT,
TRICKLE CHARGER
SQW/INT (DS1390/93)
RST (DS1391/93)
SQW (DS1392)
REAL-TIME CLOCK
WITH HUNDREDTHS
OF SECONDS
(DS1390/91) CS
(DS1392/93) (CE)
SCLK
(DS1390/91) DIN
ALARM REGISTERS
BUS
INTERFACE
(DS1390/91) DOUT
CONTROL/STATUS
REGISTERS
(DS1392/93) I/O
TRICKLE REGISTER
DS1390/DS1391/
DS1392/DS1393
Detailed Description
The DS1390/DS1391/DS1392/DS1393 RTCs are lowpower clocks/calendars with alarms. Address and data
are transferred serially through a 4-wire SPI interface for
the DS1390 and DS1391 and through a 3-wire interface
for the DS1392 and DS1393. The DS1390/DS1391 operate as a slave device on the SPI serial bus. The
DS1392/DS1393 operate using a 3-wire synchronous
serial bus. Access is obtained by selecting the part by
the CS pin (CE on DS1392/DS1393) and clocking data
into/out of the part using the SCLK and DIN/DOUT pins
(I/O on DS1392/DS1393). Multiple-byte transfers are
supported within one CS low period (see the SPI SerialData Bus section). The clocks/calendars provide hundredths of seconds, seconds, minutes, hours, day, date,
month, and year information. The alarm functions are
performed off all timekeeping registers, allowing the user
to set high resolution alarms. The date at the end of the
month is automatically adjusted for months with fewer
than 31 days, including corrections for leap year. The
clocks operate in either the 24-hour or 12-hour format
with an AM/PM indicator. All four devices have a built-in
temperature-compensated voltage reference that
detects power failures and automatically switches to the
battery supply. Additionally, the devices can provide
trickle charging of the backup voltage source, with
selectable charging resistance and diode voltage drops.
____________________________________________________________________
11
DS1390/DS1391/DS1392/DS1393
Functional Diagram
DS1390/DS1391/DS1392/DS1393
Low-Voltage SPI/3-Wire RTCs with
Trickle Charger
Power Control
The power-control function is provided by a precise,
temperature-compensated voltage reference and a
comparator circuit that monitors the V CC level. The
device is fully accessible and data can be written and
read when VCC is greater than VPF. However, when
VCC falls below VPF, the internal clock registers are
blocked from any access. If VPF is less than VBACKUP,
the device power is switched from VCC to VBACKUP
when V CC drops below V PF . If V PF is greater than
VBACKUP, the device power is switched from VCC to
V BACKUP when V CC drops below V BACKUP .
Timekeeping operation and register data are maintained from the VBACKUP source until VCC is returned to
nominal levels (Table 1). After VCC returns above VPF,
read and write access is allowed after RST goes high
(Figure 5).
Table 1. Power Control
SUPPLY
CONDITION
READ/WRITE
ACCESS)
POWERED BY
VCC < V PF,
VCC < VBACKUP
No
VBACKUP
VCC < V PF,
VCC > VBACKUP
No
VCC
VCC > V PF,
VCC < VBACKUP
Yes
VCC
VCC > V PF,
VCC > VBACKUP
Yes
VCC
Oscillator Circuit
All four devices use an external 32.768kHz crystal. The
oscillator circuit does not require any external resistors
or capacitors to operate. Table 2 specifies several crystal parameters for the external crystal, and Figure 7
shows a functional schematic of the oscillator circuit. If
a crystal is used with the specified characteristics, the
startup time is usually less than one second.
Table 2. Crystal Specifications*
PARAMETER
SYMBOL
Nominal Frequency
fO
Series Resistance
ESR
Load Capacitance
CL
MIN
TYP
Clock Accuracy
X1
X2
RTC REGISTERS
DS139x
X2
NOTE: AVOID ROUTING SIGNAL LINES
IN THE CROSSHATCHED AREA
(UPPER LEFT QUADRANT) OF
THE PACKAGE UNLESS THERE IS
A GROUND PLANE BETWEEN THE
SIGNAL LINE AND THE DEVICE PACKAGE.
CRYSTAL
Figure 7. Oscillator Circuit Showing Internal Bias Network
12
pF
The accuracy of the clock is dependent upon the accuracy of the crystal and the accuracy of the match
between the capacitive load of the oscillator circuit and
the capacitive load for which the crystal was trimmed.
Additional error is added by crystal frequency drift
caused by temperature shifts. External circuit noise
coupled into the oscillator circuit can result in the clock
running fast. Figure 8 shows a typical PC board layout
for isolation of the crystal and oscillator from noise.
Refer to Application Note 58: Crystal Considerations
with Dallas Real-Time Clocks for detailed information.
CRYSTAL
X1
kΩ
*The crystal, traces, and crystal input pins should be isolated
from RF generating signals. Refer to Application Note 58:
Crystal Considerations for Dallas Real-Time Clocks for additional specifications.
COUNTDOWN
CHAIN
C L2
UNITS
kHz
55
6
LOCAL GROUND PLANE (LAYER 2)
C L1
MAX
32.768
Figure 8. Layout Example
____________________________________________________________________
GND
Low-Voltage SPI/3-Wire RTCs with
Trickle Charger
(DS1392/DS1393), the current time is transferred to a
second set of registers. The time information is read
from these secondary registers, while the clock may
continue to run. This eliminates the need to re-read the
registers if the main registers update during a read. To
avoid rollover issues when writing to the time and date
registers, all registers should be written before the hundredths-of-seconds registers reaches 99 (BCD).
Table 3 shows the address map for the DS1390–
DS1393 RTC and RAM registers. The RTC registers are
located in address locations 00h to 0Fh in read mode,
and 80h to 8Fh in write mode. During a multibyte
access, when the address pointer reaches 0Fh, it
wraps around to location 00h. On the falling edge of the
CS pin (DS1390/DS1391) or the rising edge of CE
Table 3. Address Map
WRITE
READ
ADDRESS ADDRESS
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
Tenths of Seconds
BIT 2
BIT 1
BIT 0
FUNCTION
RANGE
Hundredths of Seconds
Hundredths
of Seconds
0–99 BCD
80h
00h
81h
01h
0
10 Seconds
Seconds
Seconds
00–59 BCD
82h
02h
0
10 Minutes
Minutes
Minutes
00–59 BCD
83h
03h
0
12/24
Hour
Hours
1–12 +AM/PM
00–23 BCD
84h
04h
0
0
Day
1–7 BCD
85h
05h
0
0
Date
Date
01–31 BCD
86h
06h
Century
0
Month
Month/
Century
01–12 +
Century BCD
87h
07h
10 Year
Year
Year
00–99 BCD
88h
08h
Tenths of Seconds
Hundredths of Seconds
Alarm
Hundredths
of Seconds
0–99 BCD
89h
09h
Seconds
Alarm
00–59 BCD
Minutes
Alarm
00–59 BCD
Hour
Alarm Hours
1–12 +
AM/PM
00–23 BCD
Day
Alarm Day
1–7 BCD
0Ah
AM2
8Bh
0Bh
AM3
10
Hour
0
0
0
Day
10 Date
0
AM1
8Ah
AM/PM
10 Hour
10
Month
10 Seconds
10 Minutes
12/24
AM/PM
10
Hour
10 Hour
8Ch
0Ch
AM4
DY/DT
10 Date
Date
Alarm Date
0
BBSQI
RS2
RS1
INTCN
0
AIE
0
X
X
X
X
0
X
1–31 BCD
DS1390/93
8Dh
0Dh
EOSC
0
BBSQI
RS2
RS1
ESQW
0
AIE
8Eh
0Eh
OSF
0
0
0
0
0
0
AF
Status
—
8Fh
0Fh
TCS3
TCS2
TCS1
TCS0
DS1
DS0
ROUT1
ROUT0
Trickle
Charger
—
Control
DS1391
DS1392
Note: Unless otherwise specified, the state of the registers is not defined when power (VCC and VBACKUP) is first applied.
X = General-purpose read/write bit.
0 = Always reads as zero.
____________________________________________________________________
13
DS1390/DS1391/DS1392/DS1393
Address Map
DS1390/DS1391/DS1392/DS1393
Low-Voltage SPI/3-Wire RTCs with
Trickle Charger
Hundredths-of-Seconds
Generator
The hundredths-of-seconds generator circuit shown in
the functional diagram is a state machine that divides
the incoming frequency (4096Hz) by 41 for 24 cycles
and 40 for one cycle. This produces a 100Hz output
that is slightly off during the short term, and is exactly
correct every 250ms. The divide ratio is given by:
Ratio = [41 x 24 + 40 x 1] / 25 = 40.96
Thus, the long-term average frequency output is
exactly the desired 100Hz.
Clock and Calendar
The time and calendar information is obtained by reading the appropriate register bytes. See Table 3 for the
RTC registers. The time and calendar are set or initialized by writing the appropriate register bytes. The contents of the time and calendar registers are in the
binary-coded decimal (BCD) format. The day-of-week
register increments at midnight. Values that correspond
to the day-of-week are user-defined but must be
sequential (i.e., if 1 equals Sunday, then 2 equals
Monday, and so on). Illogical time and date entries
result in undefined operation. The DS1390–DS1393 can
run in either 12-hour or 24-hour mode. Bit 6 of the hours
register is defined as the 12- or 24-hour mode-select
bit. When high, the 12-hour mode is selected. In the 12hour mode, bit 5 is the AM/PM bit with logic high being
PM. In the 24-hour mode, bit 5 is the second 10-hour
bit (20 to 23 hours). Changing the 12/24-hour modeselect bit requires that the hours data be re-entered,
including the alarm register (if used). The century bit
(bit 7 of the month register) is toggled when the years
register overflows from 99 to 00.
Alarms
All four devices contain one time-of-day/date alarm.
Writing to registers 88h through 8Ch sets the alarm.
The alarm can be programmed (by the alarm enable
and INTCN bits of the control register) to activate the
SQW/INT or INT output on an alarm-match condition.
The alarm can activate the SQW/INT or INT output while
the device is running from V BACKUP if BBSQI is
enabled. Bit 7 of each of the time-of-day/date alarm
registers are mask bits (Table 4). When all the mask
bits for each alarm are logic 0, an alarm only occurs
when the values in the timekeeping registers 00h to 06h
match the values stored in the time-of-day/date alarm
registers. The alarms can also be programmed to
repeat every second, minute, hour, day, or date. Table
4 shows the possible settings. Configurations not listed
in the table result in illogical operation.
Table 4. Alarm Mask Bits
REGISTER
DY/DT
08H
ALARM REGISTER MASK BITS (BIT 7)
AM4
AM3
AM2
ALARM RATE
AM1
FFh
X
1
1
1
1
Alarm every 1/100th of a second
F[0–9]h
X
1
1
1
1
Alarm when hundredths of seconds match
[0–9][0–9]
X
1
1
1
1
Alarm when tenths, hundredths of seconds match
[0–9][0–9]
X
1
1
1
0
Alarm when seconds, tenths, and hundredths of seconds
match
[0–9][0–9]
X
1
1
0
0
Alarm when minutes, seconds, tenths, and hundredths of
seconds match
[0–9][0–9]
X
1
0
0
0
Alarm when hours, minutes, seconds, tenths, and hundredths
of seconds match
[0–9][0–9]
0
0
0
0
0
Alarm when date, hours, minutes, seconds, tenths, and
hundredths of seconds match
[0–9][0–9]
1
0
0
0
0
Alarm when day, hours, minutes, seconds, tenths, and
hundredths of seconds match
14
____________________________________________________________________
Low-Voltage SPI/3-Wire RTCs with
Trickle Charger
When the RTC register values match alarm register settings, the alarm-flag (AF) bit is set to logic 1. If the
alarm-interrupt enable (AIE) is also set to logic 1 and
the INTCN bit is set to logic 1, the alarm condition activates the SQW/INT signal.
Since the contents of register 08h are expected to normally contain a match value of 00–99 decimal, the
codes F[0–9], and FF have been used to tell the part to
mask the tenths or hundredths of seconds accordingly.
Power-Up/Down, Reset, and
Pushbutton Reset Functions
A precision temperature-compensated reference and
comparator circuit monitors the status of VCC. When an
out-of-tolerance condition occurs, an internal power-fail
signal is generated that blocks read/write access to the
device and forces the RST pin (DS1391/DS1393 only)
low. When VCC returns to an in-tolerance condition, the
internal power-fail signal is held active for tRST to allow
the power supply to stabilize, and the RST (DS1391/
DS1393 only) pin is held low. If the EOSC bit is set to
logic 1 (to disable the oscillator in battery-backup
mode), the internal power-fail signal and the RST pin is
kept active for tRST plus the startup time of the oscillator.
The DS1391/DS1393 provide for a pushbutton switch to
be connected to the RST output pin. When the
DS1391/DS1393 are not in a reset cycle, it continuously
monitors the RST signal for a low-going edge. If an
edge is detected, the part debounces the switch by
pulling the RST pin low and inhibits read/write access.
After PBDB has expired, the part continues to monitor
the RST line. If the line is still low, it continues to monitor
the line looking for a rising edge. Upon detecting
release, the part forces the RST pin low and holds it low
for an additional PBDB.
____________________________________________________________________
15
DS1390/DS1391/DS1392/DS1393
The DY/DT bits (bit 6 of the alarm day/date registers)
control whether the alarm value stored in bits 0 to 5 of
that register reflects the day of the week or the date of
the month. If DY/DT is written to logic 0, the alarm is the
result of a match with date of the month. If DY/DT is
written to a logic 1, the alarm is the result of a match
with day of the week.
DS1390/DS1391/DS1392/DS1393
Low-Voltage SPI/3-Wire RTCs with
Trickle Charger
Special-Purpose Registers
The DS1390–DS1393 have three additional registers
(control, status, and trickle charger) that control the
RTC, alarms, square-wave output, and trickle charger.
Control Register (0D/8Dh) (DS1390/DS1393 Only)
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
EOSC
0
BBSQI
RS2
RS1
INTCN
0
AIE
Bit 7: Enable Oscillator (EOSC). When set to logic 0,
this bit starts the oscillator. When this bit is set to logic
1, the oscillator is stopped whenever the device is powered by V BACKUP. The oscillator is always enabled
when VCC is valid. This bit is enabled (logic 0) when
VCC is first applied.
Bit 5: Battery-Backed Square-Wave and Interrupt
Enable (BBSQI). This bit when set to logic 1 enables
the square wave or interrupt output when VCC is absent
and the DS1390/DS1392/DS1393 are being powered
by the V BACKUP pin. When BBSQI is logic 0, the
SQW/INT pin (or SQW and INT pins) goes high impedance when VCC falls below the power-fail trip point.
This bit is disabled (logic 0) when power is first applied.
Bits 4 and 3: Rate Select (RS2 and RS1). These bits
control the frequency of the square-wave output when
the square wave has been enabled. The table below
shows the square-wave frequencies that can be selected with the RS bits. These bits are both set to logic 1
(32kHz) when power is first applied.
RS2
RS1
Bit 2: Interrupt Control (INTCN). This bit controls the
SQW/INT signal. When the INTCN bit is set to logic 0, a
square wave is output on the SQW/INT pin. The oscillator must also be enabled for the square wave to be output. When the INTCN bit is set to logic 1, a match
between the timekeeping registers and either of the
alarm registers then activates the SQW/INT (provided
the alarm is also enabled). The corresponding alarm
flag is always set, regardless of the state of the INTCN
bit. The INTCN bit is set to logic 0 when power is first
applied.
Bit 0: Alarm Interrupt Enable (AIE). When set to logic
1, this bit permits the alarm flag (AF) bit in the status
register to assert SQW/INT (when INTCN = 1). When
the AIE bit is set to logic 0 or INTCN is set to logic 0,
the AF bit does not initiate the SQW/INT signal. The AIE
bit is disabled (logic 0) when power is first applied.
SQUARE-WAVE OUTPUT FREQUENCY
0
0
1Hz
0
1
4.096kHz
1
0
8.192kHz
1
1
32.768kHz
Control Register (0D/8Dh) (DS1391 Only)
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
EOSC
0
X
X
X
X
0
X
Control bits used in the DS1390 become general-purpose, battery-backed, nonvolatile SRAM bits in the
DS1391.
16
____________________________________________________________________
Low-Voltage SPI/3-Wire RTCs with
Trickle Charger
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
EOSC
0
BBSQI
RS2
RS1
ESQW
0
AIE
The INTCN bit used in the DS1390/DS1393 becomes
the SQW pin-enable bit in the DS1392. This bit powers
up a zero, making SQW active.
Status Register (0E/8Eh)
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
OSF
0
0
0
0
0
0
AF
Bit 7: Oscillator Stop Flag (OSF). A logic 1 in this bit
indicates that the oscillator has stopped or was
stopped for some time and may be used to judge the
validity of the clock and calendar data. This bit is
edge-triggered and is set to logic 1 when the internal
circuitry senses the oscillator has transitioned from a
normal run state to a STOP condition. The following are
examples of conditions that can cause the OSF bit to
be set:
1) The first time power is applied.
2) The voltage present on VCC and VBACKUP is
insufficient to support oscillation.
3) The EOSC bit is turned off.
4) External influences on the crystal (i.e., noise,
leakage, etc.).
This bit remains at logic 1 until written to logic 0. This
bit can only be written to logic 0. Attempting to write
OSF to logic 1 leaves the value unchanged.
Bit 6: Alarm Flag (AF). A logic 1 in the AF bit indicates
that the time matched the alarm registers. If the AIE bit
is logic 1 and the INTCN bit is set to logic 1, the
SQW/INT pin is also asserted. AF is cleared when written to logic 0. This bit can only be written to logic 0.
Attempting to write to logic 1 leaves the value
unchanged.
Trickle-Charge Register (0F/8Fh)
The simplified schematic in Figure 9 shows the basic
components of the trickle charger. The trickle-charge
select (TCS) bits (bits 4 to 7) control the selection of
the trickle charger. To prevent accidental enabling,
only a pattern on 1010 enables the trickle charger. All
other patterns disable the trickle charger. The trickle
charger is disabled when power is first applied. The
diode-select (DS) bits (bits 2 and 3) select whether or
not a diode is connected between VCC and VBACKUP.
If DS is 01, no diode is selected or if DS is 10, a diode
is selected. The ROUT bits (bits 0 and 1) select the
value of the resistor connected between V CC and
VBACKUP. Table 5 shows the resistor selected by the
resistor-select (ROUT) bits and the diode selected by
the diode-select (DS) bits.
Table 5. Trickle-Charge Register
TCS3
TCS2
TCS1
TCS0
DS1
DS0
ROUT1
ROUT0
FUNCTION
X
X
X
X
0
0
X
X
X
X
X
X
1
1
X
X
Disabled
X
X
X
X
X
X
0
0
Disabled
1
0
1
0
0
1
0
1
No diode, 250Ω resistor
1
0
1
0
1
0
0
1
One diode, 250Ω resistor
1
0
1
0
0
1
1
0
No diode, 2kΩ resistor
1
0
1
0
1
0
1
0
One diode, 2kΩ resistor
1
0
1
0
0
1
1
1
No diode, 4kΩ resistor
1
0
1
0
1
0
1
1
One diode, 4kΩ resistor
0
0
0
0
0
0
0
0
Initial default value—disabled
Disabled
____________________________________________________________________
17
DS1390/DS1391/DS1392/DS1393
Control Register (0D/8Dh) (DS1392 Only)
DS1390/DS1391/DS1392/DS1393
Low-Voltage SPI/3-Wire RTCs with
Trickle Charger
TRICKLE-CHARGE REGISTER (8Fh WRITE, 0Fh READ)
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
TCS3
TCS2
TCS1
TCS0
DS1
DS0
1 0F 16 SELECT
NOTE: ONLY 1010b ENABLES CHARGER
BIT 1
BIT 0
ROUT1
ROUT0
1 OF 2
SELECT
TCS0-3 = TRICKLE-CHARGE SELECT
DS0-1 = DIODE SELECT
ROUT0-1 = RESISTOR SELECT
1 OF 3
SELECT
R1
250Ω
R2
2kΩ
VCC
VBACKUP
R3
4kΩ
Figure 9. DS1390/DS1391 Programmable Trickle Charger
Table 6. SPI Pin Function
CS
MODE
CSZ
SCLK
SDI
SDO
Disable
H
Input
Disabled
Input
Disabled
High
Impedance
Data Bit
Latch
High
Impedance
CPOL* = 1,
SCLK Rising
Write
L
CPOL = 0,
SCLK Falling
L
SCLK WHEN CPOL = 1
X
CPOL = 0,
SCLK Rising
SCLK WHEN CPOL = 0
DATA LATCH (WRITE/INTERNAL STROBE)
SHIFT DATA OUT (READ)
CPOL = 1,
SCLK Falling
Read
DATA LATCH (WRITE/INTERNAL STROBE)
SHIFT DATA OUT (READ)
Next Data
Bit Shift**
*CPOL is the clock-polarity bit set in the control register of the
host microprocessor.
NOTE 1: CPHA BIT POLARITY (IF APPLICABLE) MAY NEED TO BE SET ACCORDINGLY.
NOTE 2: CPOL IS A BIT SET IN THE MICROCONTROLLER'S CONTROL REGISTER.
NOTE 3: SDO REMAINS AT HIGH IMPEDANCE UNTIL 8 BITS OF DATA ARE READY TO BE
SHIFTED OUT DURING A READ.
**SDO remains at high impedance until 8 bits of data are ready to
be shifted out during a read.
Figure 10. Serial Clock as a Function of Microcontroller ClockPolarity Bit
The user determines diode and resistor selection
according to the maximum current desired for battery
or super cap charging. The maximum charging current
can be calculated as illustrated in the following example. Assume that a system power supply of 3.3V is
applied to V CC and a super cap is connected to
VBACKUP. Also, assume that the trickle charger has
been enabled with a diode and resistor R2 between
VCC and VBACKUP. The maximum current IMAX would
therefore be calculated as follows:
IMAX = (3.3V - diode drop) / R2 ≈ (3.3V - 0.7V) /
2kΩ ≈ 1.3mA
As the super cap changes, the voltage drop between
VCC and VBACKUP decreases and therefore the charge
current decreases.
18
____________________________________________________________________
Low-Voltage SPI/3-Wire RTCs with
Trickle Charger
SCLK
DIN
W/R
DOUT
A6
A5
A4
A3
A2
A1
A0
D7
D6
D5
D4
D6
D5
D4
D3
D2
D1
D0
HIGH IMPEDANCE
Figure 11. SPI Single-Byte Write
CS
SCLK
DIN
W/R
DOUT
A6
A5
A4
A3
A2
A1
A0
HIGH IMPEDANCE
D7
D3
D2
D1
D0
Figure 12. SPI Single-Byte Read
SPI Serial-Data Bus
The DS1390/DS1391 provide a 4-wire SPI serial-data
bus to communicate in systems with an SPI host controller. Both devices support single-byte and multiplebyte data transfers for maximum flexibility. The DIN and
DOUT pins are the serial-data input and output pins,
respectively. The CS input initiates and terminates a
data transfer. The SCLK pin synchronizes data movement between the master (microcontroller) and the
slave (DS1390/DS1391) devices. The shift clock
(SCLK), which is generated by the microcontroller, is
active only during address and data transfer to any
device on the SPI bus. Input data (DIN) is latched on
the internal strobe edge and output data (DOUT) is
shifted out on the shift edge (Figure 10). There is one
clock for each bit transferred. Address and data bits
are transferred in groups of eight.
Address and data bytes are shifted MSB first into the
serial-data input (DIN) and out of the serial-data output
(DOUT). Any transfer requires the address of the byte
to specify a write or read, followed by one or more
bytes of data. Data is transferred out of the DOUT pin
for a read operation and into the DIN for a write operation (Figures 11 and 12).
The address byte is always the first byte entered after
CS is driven low. The most significant bit (W/R) of this
byte determines if a read or write takes place. If W/R is
0, one or more read cycles occur. If W/R is 1, one or
more write cycles occur.
Data transfers can occur one byte at a time or in multiple-byte burst mode. After CS is driven low, an address
is written to the DS1390/DS1391. After the address, one
or more data bytes can be written or read. For a singlebyte transfer, one byte is read or written and then CS is
driven high. For a multiple-byte transfer, however, multiple bytes can be read or written after the address has
been written. Each read or write cycle causes the RTC
register address to automatically increment.
Incrementing continues until the device is disabled.
The address wraps to 00h after incrementing to 0Fh
(during a read) and wraps to 80h after incrementing to
8Fh (during a write). Note, however, that an updated
copy of the time is only loaded into the user-accessible
copy upon the falling edge of CS. Reading the RTC
registers in a continuous loop does not show the time
advancing.
____________________________________________________________________
19
DS1390/DS1391/DS1392/DS1393
CS
DS1390/DS1391/DS1392/DS1393
Low-Voltage SPI/3-Wire RTCs with
Trickle Charger
CS
SCLK
DIN
WRITE
ADDRESS
BYTE
DATA BYTE 0
DATA BYTE 1
DATA BYTE N
DIN
ADDRESS
BYTE
READ
DOUT
HIGH-IMPEDANCE
DATA
BYTE 0
DATA
BYTE 1
DATA
BYTE N
Figure 13. SPI Multiple-Byte Burst Transfer
CE
SCLK
I/O
A0
A1
A2
A3
A4
A5
A6
W/R
D0
D1
D2
D3
D4
D5
D6
D7
Figure 14. 3-Wire Single-Byte Read
CE
SCLK
I/O
A0
A1
A2
A3
A4
A5
A6
W/R
D0
D1
D2
D3
D4
Figure 15. 3-Wire Single-Byte Write
20
____________________________________________________________________
D5
D6
D7
Low-Voltage SPI/3-Wire RTCs with
Trickle Charger
The DS1392/DS1393 provide a 3-wire serial-data bus,
and support both single-byte and multiple-byte data
transfers for maximum flexibility. The I/O pin is the serial-data input/output pin. The CE input is used to initiate
and terminate a data transfer. The SCLK pin is used to
synchronize data movement between the master
(microcontroller) and the slave (DS1392/DS1393)
devices. Input data is latched on the SCLK rising edge
and output data is shifted out on the SCLK falling edge.
There is one clock for each bit transferred. Address
and data bits are transferred in groups of eight.
Address and data bytes are shifted LSB first into the
I/O pin. Data is transferred out LSB first on the I/O pin
for a read operation.
The address byte is always the first byte entered after
CE is driven high. The MSB (W/R) of this byte determines if a read or write takes place. If W/R is 0, one or
more read cycles occur. If W/R is 1, one or more write
cycles occur.
Data transfers can be one byte at a time or in multiplebyte burst mode. After CE is driven high, an address is
written to the DS1392/DS1393. After the address, one
or more data bytes can be written or read. For a singlebyte transfer, one byte is read or written and then CE is
driven low (Figure 14 and 15). For a multiple-byte transfer, however, multiple bytes can be read or written after
the address has been written (Figure 16). Each read or
write cycle causes the RTC register address to automatically increment. Incrementing continues until the
device is disabled. The address wraps to 00h after
CE
SCLK
I/O
ADDRESS DATA
BYTE
BYTE 0
DATA
BYTE 1
DATA
BYTE N
Figure 16. 3-Wire Multiple-Byte Burst Transfer
incrementing to 0Fh (during a read) and wraps to 80h
after incrementing to 8Fh (during a write). Note, however, that an updated copy of the time is only loaded into
the user-accessible copy upon the rising edge of CE.
Reading the RTC registers in a continuous loop does
not show the time advancing.
Chip Information
TRANSISTOR COUNT: 11,525
PROCESS: CMOS
SUBSTRATE CONNECTED TO GROUND
Thermal Information
Theta-JA: 180°C/W
Theta-JC: 41.9°C/W
____________________________________________________________________
21
DS1390/DS1391/DS1392/DS1393
3-Wire Serial-Data Bus
Low-Voltage SPI/3-Wire RTCs with
Trickle Charger
DS1390/DS1391/DS1392/DS1393
Pin Configurations
TOP VIEW
X1 1
10 VCC
X2 2
VBACKUP 3
DS1390
CS 4
GND 5
9 SQW/INT
X1
1
X2
2
1
X2
2
VBACKUP
3
CE
4
GND
5
3
7 DOUT
CS
4
7 DOUT
GND
5
6 DIN
8 SCLK
μSOP
10 VCC
9 SQW
X1
1
X2
2
10 VCC
DS1393
9 SQW/INT
VBACKUP
3
7 I/O
CE
4
7 I/O
6 INT
GND
5
6 RST
8 SCLK
μSOP
22
9 RST
VBACKUP
6 DIN
DS1392
DS1391
8 SCLK
μSOP
X1
10 VCC
____________________________________________________________________
μSOP
8 SCLK
Low-Voltage SPI/3-Wire RTCs with
Trickle Charger
CRYSTAL
CRYSTAL
VCC
VCC
VCC
VCC
X1
X2
VCC
X1
SQW/INT
SCLK
DOUT
VCC
CS
CS
CPU
X2
SCLK
CPU
DOUT
DS1390
VBACKUP
DS1391
VBACKUP
DIN
DIN
RST
RST
GND
GND
CRYSTAL
VCC
CRYSTAL
VCC
VCC
VCC
X1
X2
VCC
X1
CE
X2
CE
SQW
CPU
SCLK
I/O
VCC
SQW/INT
SCLK
CPU
DS1392
I/O
INT
VBACKUP
VBACKUP
RST
GND
DS1393
RST
GND
____________________________________________________________________
23
DS1390/DS1391/DS1392/DS1393
Typical Operating Circuits
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/DallasPackInfo).
e
10LUMAX.EPS
DS1390/DS1391/DS1392/DS1393
Low-Voltage SPI/3-Wire RTCs with
Trickle Charger
4X S
10
10
INCHES
H
Ø0.50±0.1
0.6±0.1
1
1
0.6±0.1
BOTTOM VIEW
TOP VIEW
D2
MILLIMETERS
MAX
DIM MIN
0.043
A
0.006
A1
0.002
A2
0.030
0.037
D1
0.116
0.120
D2
0.114
0.118
E1
0.116
0.120
0.114
0.118
E2
0.187
0.199
H
0.0157 0.0275
L
L1
0.037 REF
b
0.007
0.0106
e
0.0197 BSC
c
0.0035 0.0078
0.0196 REF
S
α
0°
6°
MAX
MIN
1.10
0.05
0.15
0.75
0.95
2.95
3.05
2.89
3.00
2.95
3.05
2.89
3.00
4.75
5.05
0.40
0.70
0.940 REF
0.270
0.177
0.500 BSC
0.200
0.090
0.498 REF
0°
6°
E2
GAGE PLANE
A2
c
A
b
A1
α
E1
D1
FRONT VIEW
L
L1
SIDE VIEW
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE, 10L uMAX/uSOP
APPROVAL
DOCUMENT CONTROL NO.
21-0061
24
____________________________________________________________________
REV.
1
1
Low-Voltage SPI/3-Wire RTCs with
Trickle Charger
Rev 0;
Rev 1;
7/04:
1/07:
Original data sheet release.
Added text to the General Description section to indicate that the bus interface is disabled when
the part switches to VBACKUP (page 1).
Replaced Ordering Information table with lead-free packages (page 1).
Added 0MHz (min) spec for SCLK frequency for SPI, 3-wire AC timing (pages 3 and 5).
Added the “High Impedance” label for DOUT to Figure 1 and added DOUT trace to Figure 2 (page 4).
Changed all references of VBAT to VBACKUP (pages 8 and 10).
Replaced the Operation section with the Power Control section and added new Table 1 (pages 11
and 12).
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 25
© 2007 Maxim Integrated Products
is a registered trademark of Dallas Semiconductor Corporation.
is a registered trademark of Maxim Integrated Products.
DS1390/DS1391/DS1392/DS1393
Revision History