SPANSION AM29PL320DB60RWPI 32 megabit (2 m x 16-bit/1 m x 32-bit) cmos 3.0 volt-only high performance page mode flash memory Datasheet

Am29PL320D
Data Sheet
July 2003
The following document specifies Spansion memory products that are now offered by both Advanced
Micro Devices and Fujitsu. Although the document is marked with the name of the company that originally developed the specification, these products will be offered to customers of both AMD and
Fujitsu.
Continuity of Specifications
There is no change to this datasheet as a result of offering the device as a Spansion product. Any
changes that have been made are the result of normal datasheet improvement and are noted in the
document revision summary, where supported. Future routine revisions will occur when appropriate,
and changes will be noted in a revision summary.
Continuity of Ordering Part Numbers
AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM”. To order
these products, please use only the Ordering Part Numbers listed in this document.
For More Information
Please contact your local AMD or Fujitsu sales office for additional information about Spansion
memory solutions.
Publication Number 20475 Revision C
Amendment 2 Issue Date October 2, 2003
THIS PAGE LEFT INTENTIONALLY BLANK.
Am29PL320D
32 Megabit (2 M x 16-Bit/1 M x 32-Bit)
CMOS 3.0 Volt-only High Performance Page Mode Flash Memory
DISTINCTIVE CHARACTERISTICS
ARCHITECTURAL ADVANTAGES
SOFTWARE FEATURES
■ 32 Mbit Page Mode device
■ Software command-set compatible with JEDEC
standard
— Word (16-bit) or double word (32-bit) mode
selectable via WORD# input
— Page size of 8 words/4 double words: Fast page
read access from random locations within the
page
■ Single power supply operation
— Full voltage range: 2.7 to 3.6 volt read and write
operations for battery-powered applications
— Regulated voltage range: 3.0 to 3.6 volt read and
write operations and for compatibility with high
performance 3.3 volt microprocessors
■ Flexible sector architecture
— Sector sizes (x16 configuration): One 16 Kword,
two 8 Kword, one 96 Kword and fifteen 128
Kword sectors
— Supports full chip erase
■ SecSi™ (Secured Silicon) Sector region
— Current version of device has 512 words (256
double words); future versions will have 128
words (64 double words)
■ Top or bottom boot block configuration
■ Manufactured on 0.23 µm process technology
■ 20-year data retention at 125°C
■ Minimum 1 million erase cycles guarantee
per sector
PERFORMANCE CHARACTERISTICS
■ High performance read access times
— Backward compatible with Am29F and Am29LV
families
■ CFI (Common Flash Interface) compliant
— Provides device-specific information to the
system, allowing host software to easily
reconfigure for different Flash devices
■ Unlock Bypass Program Command
— Reduces overall programming time when
issuing multiple program command sequences
■ Erase Suspend/Erase Resume
— Suspends an erase operation to read data from,
or program data to, a sector that is not being
erased, then resumes the erase operation
HARDWARE FEATURES
■ Sector Protection
— A hardware method of locking a sector to prevent
any program or erase operations within that
sector
— Sectors can be locked via programming
equipment
— Temporary Sector Unprotect command
sequence allows code changes in previously
locked sectors
■ ACC (Acceleration) input provides faster
programming times
■ WP# (Write Protect) input
— Page access times as fast as 20 ns
— At VIL, protects the first or last 32 Kword sector,
regardless of sector protect/unprotect status
— Random access times as fast as 60 ns
— At VIH, allows removal of sector protection
■ Power consumption (typical values)
— Initial page read current: 4 mA (1 MHz),
40 mA (10 MHz)
— Intra-page read current: 15 mA (10 MHz),
50 mA (33 MHz)
— An internal pull up to VCC is provided
■ Package Options
— 84-ball FBGA
— Program/erase current: 25 mA
— Standby mode current: 2 µA
Publication# 24075 Rev: C Amendment/+2
Issue Date: October 2, 2003
Refer to AMD’s Website (www.amd.com/flash) for the latest information.
GENERAL DESCRIPTION
The Am29PL320D is a 32 Mbit, 3.0 Volt-only page
mode Flash memory device organized as 2,097,152
words or 1,048,576 double words. The device is offered in an 84-ball FBGA package. The word-wide
data (x16) appears on DQ15–DQ0; the double wordwide (x32) data appears on DQ31–DQ0. The device is
available in both top and bottom boot versions. This
device can be programmed in-system or with in standard EPROM programmers. A 12.0 V VPP or 5.0 VCC
are not required for write or erase operations.
The device offers fast page access times of 20, 25,
and 35 ns, with corresponding random access times of
60, 70, 90 ns, respectively, allowing high speed microprocessors to operate without wait states. To eliminate
bus contention the device has separate chip enable
(CE#), write enable (WE#), and output enable (OE#)
controls.
Page Mode Features
The device is AC timing, input, output, and package
compatible with 16 Mbit x 16 page mode Mask
ROM. The page size is 8 words or 4 double words.
After initial page access is accomplished, the page
mode operation provides fast read access speed of
random locations within that page.
Standard Flash Memory Features
The device requires only a single 3.0 volt power supply for both read and write functions. Inter nally
generated and regulated voltages are provided for the
program and erase operations.
The device is entirely command set compatible with
the JEDEC single-power-supply Flash standard.
Commands are written to the command register using
standard microprocessor write timings. Register contents serve as input to an internal state-machine that
controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed
for the programming and erase operations. Reading
data out of the device is similar to reading from other
Flash or EPROM devices.
Device programming occurs by executing the program
command sequence. This initiates the Embedded
Program algor ithm—an inter nal algorithm that
automatically times the program pulse widths and
verifies proper cell margin. The Unlock Bypass mode
facilitates faster programming times by requiring only
two write cycles to program data instead of four.
Device erasure occurs by executing the erase command sequence. This initiates the Embedded Erase
algorithm—an internal algorithm that automatically
preprograms the array (if it is not already programmed)
2
before executing the erase operation. During erase,
the device automatically times the erase pulse widths
and verifies proper cell margin.
The host system can detect whether a program or
erase operation is complete by reading the DQ7
(Data# Polling) and DQ6 (toggle) status bits. After a
program or erase cycle has been completed, the device
is ready to read array data or accept another command.
The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting
the data contents of other sectors. The device is fully
erased when shipped from the factory.
Hardware data protection measures include a low
VCC detector that automatically inhibits write operations during power transitions. The hardware sector
protection feature disables both program and erase
operations in any combination of the sectors of memo r y. T h i s c a n b e a c h i ev e d i n - s y s t e m o r v i a
programming equipment.
The Erase Suspend/Erase Resume feature enables
the user to put erase on hold for any period of time to
read data from, or program data to, any sector that is
not selected for erasure. True background erase can
thus be achieved.
The device offers two power-saving features. When
addresses have been stable for a specified amount of
time, the device enters the automatic sleep mode.
The system can also place the device into the standby
mode. Power consumption is greatly reduced in both
these modes.
The SecSi™ Sector (Secured Silicon) is an extra sector capable of being permanently locked by AMD or
customers. The SecSi Indicator Bit (DQ7) is permanently set to a 1 if the part is factory locked, and set
to a 0 if customer lockable. This way, customer lockable parts can never be used to replace a factory
locked par t. Current version of device has 512
words (256 double words); future versions will
have only 128 words (64 double words). This
should be considered during system design. Factory locked parts can store a secure, random 16 byte
ESN (Electronic Serial Number), customer code (programmed through AMD’s ExpressFlash service), or
both. Customer Lockable parts may be programmed
after being shipped from AMD.
AMD’s Flash technology combines years of Flash
memory manufacturing experience to produce the
highest levels of quality, reliability and cost effectiveness. The device electrically erases all bits within a
sector simultaneously via Fowler-Nordheim tunneling.
The data is programmed using hot electron injection.
Am29PL320D
October 2, 2003
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Input Configuration . . . . . . . . . . . . . . . . . . . . . . . . 7
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8
Standard Products .................................................................... 8
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 9
Table 1. Am29PL320D Device Bus Operations ................................9
Word/Double Word Configuration ............................................. 9
Requirements for Reading Array Data ..................................... 9
Read Mode ............................................................................... 9
Random Read (Non-Page Mode Read) ............................................9
Page Mode Read .................................................................... 10
Table 2. Double Word Mode ...........................................................10
Table 3. Word Mode ........................................................................10
Writing Commands/Command Sequences ............................ 11
Figure 3. Erase Operation.............................................................. 23
Temporary Sector Unprotect Enable/Disable
Command Sequence .............................................................. 24
Figure 4. Temporary Sector Unprotect Algorithm .......................... 24
Command Definitions ............................................................. 25
Table 13. Command Definitions (Double Word Mode) .................. 25
Table 14. Command Definitions (Word Mode) ............................... 26
Write Operation Status . . . . . . . . . . . . . . . . . . . . . 27
DQ7: Data# Polling ................................................................. 27
Figure 5. Data# Polling Algorithm .................................................. 27
DQ6: Toggle Bit ...................................................................... 28
DQ2: Toggle Bit ...................................................................... 28
Reading Toggle Bits DQ6/DQ2 ............................................... 28
DQ5: Exceeded Timing Limits ................................................ 28
Figure 6. Toggle Bit Algorithm........................................................ 29
DQ3: Sector Erase Timer ....................................................... 29
Accelerated Program Operation ......................................................11
Table 15. Write Operation Status ................................................... 30
Program and Erase Operation Status .................................... 11
Standby Mode ........................................................................ 11
Automatic Sleep Mode ........................................................... 11
Output Disable Mode .............................................................. 11
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 31
Table 4. Sector Address Table, Top Boot (Am29PL320DT) ...........12
Table 5. SecSi™ Sector Addresses for Top Boot Devices .............12
Table 6. Sector Address Table, Bottom Boot (Am29PL320DB) ......13
Table 7. SecSi™ Sector Addresses for
Bottom Boot Devices .......................................................................13
Autoselect Mode ..................................................................... 14
Table 8. Am29PL320D Autoselect Codes (High Voltage Method) ..14
Sector Protection/Unprotection ............................................... 14
Common Flash Memory Interface (CFI) . . . . . . . 15
Table 9. CFI Query Identification String ..........................................15
Table 10. System Interface String ...................................................16
Table 11. Device Geometry Definition ............................................16
Table 12. Primary Vendor-Specific Extended Query ......................17
Figure 7. Maximum Negative Overshoot Waveform ...................... 31
Figure 8. Maximum Positive Overshoot Waveform........................ 31
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 31
Commercial (C) Devices ......................................................... 31
Industrial (I) Devices ............................................................... 31
VCC Supply Voltages .............................................................. 31
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 32
CMOS Compatible .................................................................. 32
Zero Power Flash ................................................................... 33
Figure 9. ICC1 Current vs. Time (Showing Active and Automatic Sleep
Currents) ........................................................................................ 33
Figure 10. Typical ICC1 vs. Frequency ........................................... 33
Figure 11. Test Setup..................................................................... 34
Table 16. Test Specifications ......................................................... 34
Key to Switching Waveforms. . . . . . . . . . . . . . . . 34
Figure 12. Input Waveforms and Measurement Levels ................. 34
SecSi™ (Secured Silicon) Sector Flash Memory Region ....... 18
Read Operations .................................................................... 35
Factory Locked: SecSi Sector Programmed and
Protected At the Factory .................................................................18
Customer Lockable: SecSi Sector NOT Programmed or Locked
At the Factory .................................................................................18
Figure 1. SecSi Sector Protect Verify.............................................. 19
Figure 13. Conventional Read Operations Timings ....................... 36
Figure 14. Page Read Timings ...................................................... 36
Write Protect (WP#) ................................................................ 19
Hardware Data Protection ...................................................... 19
Low VCC Write Inhibit ......................................................................19
Write Pulse “Glitch” Protection ........................................................19
Logical Inhibit ..................................................................................19
Power-Up Write Inhibit ....................................................................19
Command Definitions . . . . . . . . . . . . . . . . . . . . . . 19
Reading Array Data ................................................................ 19
Reset Command ..................................................................... 20
Autoselect Command Sequence ............................................ 20
Enter SecSi™ Sector/Exit SecSi Sector
Command Sequence .............................................................. 20
Word/Double Word Program Command Sequence ............... 20
Double Word/Word Configuration (WORD#) ........................ 37
Figure 15. WORD# Timings for Read Operations.......................... 37
Figure 16. WORD# Timings for Write Operations.......................... 37
Program/Erase Operations .................................................... 38
Figure 17. Program Operation Timings..........................................
Figure 18. AC Waveforms for Chip/Sector Erase Operations........
Figure 19. Data# Polling Timings (During Embedded Algorithms).
Figure 20. Toggle Bit Timings (During Embedded Algorithms)......
Figure 21. DQ2 vs. DQ6 for Erase and
Erase Suspend Operations ............................................................
39
40
40
41
41
Alternate CE# Controlled
Erase/Program Operations ..................................................... 42
Figure 22. Alternate CE# Controlled Write Operation Timings ...... 43
Unlock Bypass Command Sequence ..............................................21
Figure 2. Program Operation .......................................................... 21
Erase and Programming Performance . . . . . . . 44
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
BGA Package Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 46
Chip Erase Command Sequence ........................................... 22
Sector Erase Command Sequence ........................................ 22
Erase Suspend/Erase Resume Commands ........................... 22
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 47
Revision A (March 7, 2001) .................................................... 47
October 2, 2003
FBF084—84-Ball Fine Pitch Ball Grid Array (FBGA) 11 x 12 mm ..... 46
Am29PL320D
3
Revision B (June 12, 2001) .................................................... 47
Revision B+1 (August 30, 2001) ............................................. 47
Revision C (October 22, 2002) ............................................... 47
4
Revision C+1 (July 21, 2003) ................................................. 47
Revision C+2 (October 2, 2003) ............................................. 47
Am29PL320D
October 2, 2003
PRODUCT SELECTOR GUIDE
Family Part Number
Speed Option
Am29PL320D
Regulated Voltage Range: VCC =3.0–3.6 V
60R
70R
Full Voltage Range: VCC = 2.7–3.6 V
70
90
Max access time, ns (tACC)
60
70
90
Max CE# access time, ns (tCE)
60
70
90
Max page access time, ns (tPACC)
20
25
30
Max OE# access time, ns (tOE)
20
25
30
Note: See “AC Characteristics” for full specifications.
BLOCK DIAGRAM
DQ31–DQ0
VCC
VSS
Erase Voltage
Generator
WE#
WORD#
ACC
Input/Output
Buffers
State
Control
Command
Register
WP#
PGM Voltage
Generator
Chip Enable
Output Enable
Logic
CE#
OE#
VCC Detector
Address Latch
STB
Timer
A19–A0
STB
Data
Latch
Y-Decoder
Y-Gating
X-Decoder
Cell Matrix
A1, A0,
A-1
October 2, 2003
Am29PL320D
5
CONNECTION DIAGRAMS
84-Ball FBGA
Top View, Balls Facing Down
B9
C9
D9
E9
F9
G9
H9
J9
DQ30
VCC
DQ13
DQ12
DQ27
DQ26
VCC
DQ9
A8
B8
C8
D8
E8
F8
G8
H8
J8
K8
CE#
VSS
DQ15
DQ29
DQ28
DQ11
VSS
DQ24
VCC
A19
A7
B7
C7
D7
E7
F7
G7
H7
J7
K7
NC
WORD#
OE#
DQ14
VSS
DQ10
DQ25
A18
A17
A16
A6
B6
C6
D6
E6
F6
G6
H6
J6
K6
WE#
NC
NC
DQ31/A-1
NC
NC
DQ8
A15
A14
A13
A5
B5
C5
D5
E5
F5
G5
H5
J5
K5
NC
ACC
WP#
NC
NC
NC
NC
NC
NC
NC
A4
B4
C4
D4
E4
F4
G4
H4
J4
K4
A1
A2
A3
A0
DQ2
NC
A12
A11
A9
A10
A3
B3
C3
D3
E3
F3
G3
H3
J3
K3
A4
A5
DQ0
DQ16
DQ18
DQ5
DQ21
A8
A6
A7
B2
C2
D2
E2
F2
G2
H2
J2
K2
VCC
DQ1
VSS
DQ19
DQ4
DQ6
DQ7
DQ23
VSS
C1
D1
E1
F1
G1
J1
DQ17
VCC
DQ3
DQ20
VSS
H1
VCC
Special Handling Instructions for FBGA
Package
Special handling is required for Flash Memory products
in FBGA packages.
6
DQ22
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
The package and/or data integrity may be compromised
if the package body is exposed to temperatures above
150°C for prolonged periods of time.
Am29PL320D
October 2, 2003
INPUT CONFIGURATION
A19–A0
LOGIC SYMBOL
= 20 address inputs
20
DQ30–DQ0 = 31 data inputs/outputs
A19–A0
DQ31/A-1
= In double word mode, functions as
DQ31. In word mode, functions
as A-1 (LSB address input)
WORD#
= Word enable input
When low, enables word mode
When high, enables double word mode
WP#
= Hardware Write Protect input
ACC
= Acceleration input
CE#
= Chip Enable input
OE#
= Output Enable input
WE#
= Write Enable input
VCC
= 3.0 volt-only single power supply
(see Product Selector Guide for speed
options and voltage supply tolerances)
VSS
= Device ground
NC
= input not connected internally
October 2, 2003
16 or 32
DQ31–DQ0
(A-1)
CE#
OE#
WE#
WORD#
WP#
ACC
Am29PL320D
7
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed by a combination of the elements below.
Am29PL320D
B
60R
WP
I
TEMPERATURE RANGE
I
= Industrial (–40°C to +85°C)
PACKAGE TYPE
WP
= 84-Ball Fine Pitch Ball Grid Array (FBGA) 0.8 mm pitch (FBF084)
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T
= Top Boot Sector
B
=
Bottom Boot Sector
DEVICE NUMBER/DESCRIPTION
Am29PL320D
32 Megabit (2 M x 16-Bit/1 M x 32-Bit)
CMOS 3.0 Volt-only High Performance Page Mode Flash Memory
Valid Combinations
Package Marking
AM29PL320DT60R,
AM29PL320DB60R
P320DT60RI,
P320DB60RI
AM29PL320DT70R,
AM29PL320DB70R
P320DT70RI,
P320DB70RI
Voltage Range
VCC = 3.0–3.6 V
WPI
AM29PL320DT70,
AM29PL320DB70
P320DT70VI,
P320DB70VI
AM29PL320DT90,
AM29PL320DB90
P320DT90VI,
P320DB90VI
VCC = 2.7–3.6 V
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult the local AMD sales office to
confirm availability of specific valid combinations and to check on newly released combinations.
8
Am29PL320D
October 2, 2003
DEVICE BUS OPERATIONS
This section describes the requirements and use of the
device bus operations, which are initiated through the
internal command register. The command register itself does not occupy any addressable memor y
location. The register is composed of latches that store
the commands, along with the address and data information needed to execute the command. The contents
Table 1.
of the register serve as inputs to the internal state machine. The state machine outputs dictate the function
of the device. Table 1 lists the device bus operations,
the inputs and control levels they require, and the resulting output. The following subsections describe
each of these operations in further detail.
Am29PL320D Device Bus Operations
DQ31–DQ8
DQ7–
DQ0
WORD#
= VIH
WORD#
= VIL
CE#
OE#
WE#
WP#
Addresses
(Note 1)
Read
L
L
H
X
AIN
DOUT
DOUT
Write
L
H
L
X
AIN
DIN
DIN
DQ30–DQ16 = High-Z,
DQ31 = A-1
VCC ±
0.3 V
X
X
X
X
High-Z
High-Z
High-Z
L
H
H
X
X
High-Z
High-Z
High-Z
Operation
Standby
Output Disable
Legend:
L = Logic Low = VIL, H = Logic High = VIH, VID = 12.0 ± 0.5 V, X = Don’t Care, AIN = Address In, DIN = Data In, DOUT = Data Out
Notes:
1. Addresses are A19–A0 in double word mode (WORD# = VIH), A19–A-1 in word mode (WORD# = VIL).
2. The sector protect and sector unprotect functions must be implemented via programming equipment. See the “Sector
Protection/Unprotection” section.
Word/Double Word Configuration
The WORD# input controls whether the device data
I/Os DQ31–DQ0 operate in the word or double word
configuration. If the WORD# input is set at VIH, the device is in double word configuration; DQ31–DQ0 are
active and controlled by CE# and OE#.
If the WORD# input is set at logic ‘0’, the device is in
word configuration, and only data I/Os DQ15–DQ0 are
active and controlled by CE# and OE#. The data I/Os
DQ30–DQ16 are tri-stated, and the DQ31 input is
used as an input for the LSB (A-1) address function.
Requirements for Reading Array Data
To read array data from the outputs, the system must
drive the CE# and OE# inputs to VIL. CE# is the power
control and selects the device. OE# is the output control
and gates array data to the output inputs. WE# should
remain at VIH. The WORD# input determines whether
the device outputs array data in words or bytes.
The internal state machine is set for reading array data
upon device power-up. This ensures that no spurious
alteration of the memory content occurs during the
power transition. No command is necessary in this
mode to obtain array data. Standard microprocessor
read cycles that assert valid addresses on the device
October 2, 2003
address inputs produce valid data on the device data
outputs. The device remains enabled for read access
until the command register contents are altered.
See “Reading Array Data” for more information. Refer
to the AC Read Operations table for timing specifications and to Figure 13 for the timing diagram. ICC1 in
the DC Characteristics table represents the active current specification for reading array data.
Read Mode
Random Read (Non-Page Mode Read)
The device has two control functions which must be
satisfied in order to obtain data at the outputs. CE# is
the power control and should be used for device selection. OE# is the output control and should be used to
gate data to the output inputs if the device is selected.
Address access time (tACC) is equal to the delay from
stable addresses to valid output data. The chip enable
access time (t CE ) is the delay from the stable addresses and stable CE# to valid data at the output
inputs. The output enable access time is the delay
from the falling edge of OE# to valid data at the output
inputs (assuming the addresses have been stable for
at least tACC–tOE time).
Am29PL320D
9
Page Mode Read
The Am29PL320D is capable of fast page mode read
and is compatible with the page mode Mask ROM read
operation. This mode provides faster read access
speed for random locations within a page. The page
size of the Am29PL320D device is 8 words, or 4 double words, with the appropriate page being selected by
the higher address bits A19–A2 and the LSB bits A1–
A0 (in the double word mode) and A1 to A-1 (in the
word mode) determining the specific word/double word
within that page. This is an asynchronous operation
with the microprocessor supplying the specific word or
double word location.
The following tables determine the specific word and
double word within the selected page:
The random or initial page access is equal to tACC or
tCE and subsequent page read accesses (as long as
the locations specified by the microprocessor falls
within that page) is equivalent to tPACC. When CE# is
deasserted and reasserted for a subsequent access,
the access time is tACC or tCE. Here again, CE# selects
the device and OE# is the output control and should be
used to gate data to the output inputs if the device is
selected. Fast page mode accesses are obtained by
keeping A19–A2 constant and changing A1 to A0 to
select the specific double word, or changing A1 to A-1
to select the specific word, within that page.
10
Am29PL320D
Table 2.
Double Word Mode
Word
A1
A0
Double Word 0
0
0
Double Word 1
0
1
Double Word 2
1
0
Double Word 3
1
1
Table 3.
Word Mode
Word
A1
A0
A-1
Word 0
0
0
0
Word 1
0
0
1
Word 2
0
1
0
Word 3
0
1
1
Word 4
1
0
0
Word 5
1
0
1
Word 6
1
1
0
Word 7
1
1
1
October 2, 2003
Writing Commands/Command Sequences
To write a command or command sequence (which includes programming data to the device and erasing
sectors of memory), the system must drive WE# and
CE# to VIL, and OE# to VIH.
For program operations, the WORD# input determines
whether the device accepts program data in double
words or words. Refer to “Word/Double Word Configuration” for more information.
The device features an Unlock Bypass mode to facilitate faster programming. Once the device enters the
Unlock Bypass mode, only two write cycles are required
to program a word or double word, instead of four. The
“Word/Double Word Program Command Sequence”
section has details on programming data to the device
using both standard and Unlock Bypass command
sequences.
An erase operation can erase one sector, multiple sectors, or the entire device. Table 4 indicates the address
space that each sector occupies. A “sector address”
consists of the address bits required to uniquely select
a sector. The “Command Definitions” section has details on eras ing a sector or the entire chip, or
suspending/resuming the erase operation.
After the system writes the autoselect command sequence, the device enters the autoselect mode. The
system can then read autoselect codes from the internal register (which is separate from the memory array)
on DQ7–DQ0. Standard read cycle timings apply in this
mode. Refer to the “Autoselect Mode” and “Autoselect
Command Sequence” sections for more information.
ICC2 in the DC Characteristics table represents the active current specification for the write mode. The “AC
Characteristics” section contains timing specification
tables and timing diagrams for write operations.
Accelerated Program Operation
The device offers accelerated program operations
through the ACC function. This function is primarily intended to allow faster manufacturing throughput during system production.
If the system asserts VHH (11.5 to 12.5 V) on this input, the device automatically enters the aforementioned Unlock Bypass mode, temporarily unprotects
any protected sectors, and uses the higher voltage on
the pin to reduce the time required for program operations. The system would use a two-cycle program
command sequence as required by the Unlock Bypass
mode. Removing V HH from the ACC pin returns the
October 2, 2003
device to normal operation. Note that the ACC pin
must not be at VHH for operations other than accelerated programming, or device damage may result. In
addition, the ACC pin must not be left floating or unconnected; inconsistent behavior of the device may result.
Program and Erase Operation Status
During an erase or program operation, the system may
check the status of the operation by reading the status
bits on DQ7–DQ0. Standard read cycle timings and
ICC read specifications apply. Refer to “Write Operation
Status” for more information, and to “AC Characteristics” for timing diagrams.
Standby Mode
When the system is not reading or writing to the device, it can place the device in the standby mode. In
this mode, current consumption is greatly reduced,
and the outputs are placed in the high impedance
state, independent of the OE# input.
The device enters the CMOS standby mode when the
CE# input is both held at VCC ± 0.3 V. (Note that this is
a more restricted voltage range than VIH .) If CE# is
held at VIH, but not within VCC ± 0.3 V, the device will
be in the standby mode, but the standby current will be
greater. The device requires standard access time
(tCE) for read access when the device is in either of
these standby modes, before it is ready to read data.
If the device is deselected during erasure or programming, the device draws active current until the
operation is completed.
Automatic Sleep Mode
The automatic sleep mode minimizes Flash device energy consumption. The device automatically enables this
mode when addresses remain stable for tACC + 30 ns.
The automatic sleep mode is independent of the CE#,
WE#, and OE# control signals. Standard address access
timings provide new data when addresses are changed.
While in sleep mode, output data is latched and always
available to the system. Note that during Automatic Sleep
mode, OE# must be at VIH before the device reduces current to the stated sleep mode specification.
Output Disable Mode
When the OE# input is at VIH, output from the device is
disabled. The output inputs are placed in the high impedance state.
Am29PL320D
11
Table 4.
Sector
A19 A18
Sector Address Table, Top Boot (Am29PL320DT)
A17
A16
A15
A14
A13
A12
Sector Size
(Kwords/
Kdouble
words)
Address Range (in hexadecimal)
Word Mode
(x16)
Double Word Mode
(x32)
SA0
0
0
0
0
X
X
X
X
128/64
000000–01FFFF
00000–0FFFF
SA1
0
0
0
1
X
X
X
X
128/64
020000–03FFFF
10000–1FFFF
SA2
0
0
1
0
X
X
X
X
128/64
040000–05FFFF
20000–2FFFF
SA3
0
0
1
1
X
X
X
X
128/64
060000–07FFFF
30000–3FFFF
SA4
0
1
0
0
X
X
X
X
128/64
080000–09FFFF
40000–4FFFF
SA5
0
1
0
1
X
X
X
X
128/64
0A0000–0BFFFF
50000–5FFFF
SA6
0
1
1
0
X
X
X
X
128/64
0C0000–0DFFFF
60000–6FFFF
SA7
0
1
1
1
X
X
X
X
128/64
0E0000–0FFFFF
70000–7FFFF
SA8
1
0
0
0
X
X
X
X
128/64
100000–11FFFF
80000–8FFFF
SA9
1
0
0
1
X
X
X
X
128/64
120000–13FFFF
90000–9FFFF
SA10
1
0
1
0
X
X
X
X
128/64
140000–15FFFF
A0000–AFFFF
SA11
1
0
1
1
X
X
X
X
128/64
160000–17FFFF
B0000–BFFFF
SA12
1
1
0
0
X
X
X
X
128/64
180000–19FFFF
C0000–CFFFF
SA13
1
1
0
1
X
X
X
X
128/64
1A0000–1BFFFF
D0000–DFFFF
SA14
1
1
1
0
X
X
X
X
128/64
1C0000–1DFFFF
E0000–EFFFF
SA15
1
1
1
1
96/48
1E0000–1F7FFF
F0000–FBFFF
SA16
1
1
1
1
1
1
0
0
8/4
1F8000–1F9FFF
FC000–FCFFF
SA17
1
1
1
1
1
1
0
1
8/4
1FA000–1FBFFF
FD000–FDFFF
SA18
1
1
1
1
1
1
1
X
16/8
1FC000–1FFFFF
FE000–FFFFF
0000–1011
Note: Address range is A19–A-1 if device is in word mode (WORD# = VIL). Address range is A19–A0 if device is in double word
mode (WORD# = VIH).
Table 5.
12
SecSi™ Sector Addresses for Top Boot Devices
Device
Sector Address
A7–A0
Sector Size
(x16)
Address Range
(x32)
Address Range
Am29PL320DT
00000000
512 words/256 double words
000000h–0001FFh
00000h–000FFh
Am29PL320D
October 2, 2003
Table 6.
Sector Address Table, Bottom Boot (Am29PL320DB)
Address Range (in hexadecimal)
Sector
A19
A18
A17
A16
A15
A14
A13
A12
Sector Size
(Kwords/
Kdouble
words)
SA0
0
0
0
0
0
0
0
X
16/8
000000–003FFF
00000–001FF
SA1
0
0
0
0
0
0
1
0
8/4
004000–005FFF
02000–02FFF
SA2
0
0
0
0
0
0
1
1
8/4
006000–007FFF
03000–03FFF
SA3
0
0
0
0
96/48
008000–01FFFF
04000–0FFFF
SA4
0
0
0
1
X
X
X
X
128/64
020000–03FFFF
10000–1FFFF
SA5
0
0
1
0
X
X
X
X
128/64
040000–05FFFF
20000–2FFFF
SA6
0
0
1
1
X
X
X
X
128/64
060000–07FFFF
30000–3FFFF
SA7
0
1
0
0
X
X
X
X
128/64
080000–09FFFF
40000–4FFFF
SA8
0
1
0
1
X
X
X
X
128/64
0A0000–0BFFFF
50000–5FFFF
SA9
0
1
1
0
X
X
X
X
128/64
0C0000–0DFFFF
60000–6FFFF
SA10
0
1
1
1
X
X
X
X
128/64
0E0000–0FFFFF
70000–7FFFF
SA11
1
0
0
0
X
X
X
X
128/64
100000–11FFFF
80000–8FFFF
SA12
1
0
0
1
X
X
X
X
128/64
120000–13FFFF
90000–9FFFF
SA13
1
0
1
0
X
X
X
X
128/64
140000–15FFFF
A0000–AFFFF
SA14
1
0
1
1
X
X
X
X
128/64
160000–17FFFF
B0000–BFFFF
SA15
1
1
0
0
X
X
X
X
128/64
180000–19FFFF
C0000–CFFFF
SA16
1
1
0
1
X
X
X
X
128/64
1A0000–1BFFFF
D0000–DFFFF
SA17
1
1
1
0
X
X
X
X
128/64
1C0000–1DFFFF
E0000–EFFFF
SA18
1
1
1
1
X
X
X
X
128/64
1E0000–1FFFFF
F0000–FFFFF
01000–11111
Word Mode
(x16)
Double Word Mode
(x32)
Note: Address range is A19–A-1 if device is in word mode (WORD# = VIL). Address range is A19–A0 if device is in double word
mode (WORD# = VIH).
Table 7.
SecSi™ Sector Addresses for
Bottom Boot Devices
Device
Sector Address
A7–A0
Sector Size
(x16)
Address Range
(x32)
Address Range
Am29PL320DB
00000000
512 words/256 double words
000000h–0001FFh
00000h–000FFh
October 2, 2003
Am29PL320D
13
Autoselect Mode
dition, when verifying sector protection, the sector
address must appear on the appropriate highest order
address bits (Table 4). Table 8 shows the remaining
address bits that are don’t care. When all necessary
bits have been set as required, the programming
equipment may then read the corresponding identifier
code on DQ7-DQ0.
The autoselect mode provides manufacturer and device identification, and sector protection verification,
through identifier codes output on DQ7–DQ0. This
mode is primarily intended for programming equipment
to automatically match a device to be programmed
with its corresponding programming algorithm. However, the autoselect codes can also be accessed insystem through the command register.
To access the autoselect codes in-system, the host
system can issue the autoselect command via the
command register, as shown in Table 13. This method
does not require VID. See “Command Definitions” for
details on using the autoselect mode.
When using programming equipment, the autoselect
mode requires VID (11.5 V to 12.5 V) on address input
A9. Address inputs must be as shown in Table 8. In ad-
A8–A7
A6
A5–A4
A3
A2
A1
A0
Read
Cycle 3
A9
Read
Cycle 2
Word
A11–A10
Device ID
Read
Cycle 1
A19–12
Manufacturer ID: AMD
WE#
Mode
DQ31–
DQ8
H
X
X
VID
X
L
X
X
X
L
L
X
X
X
VID
X
L
X
L
L
L
H
VID
X
VID
X
OE#
Description
Am29PL320D Autoselect Codes (High Voltage Method)
CE#
Table 8.
L
L
L
L
H
Dbl. Word
L
L
H
Word
L
L
H
L
L
H
Word
L
L
H
7Eh
222222h
22h
X
Dbl. Word
01h
22h
X
Dbl. Word
DQ7–DQ0
X
X
L
X
H
H
H
L
03h
222222h
L
X
H
H
H
22h
00h (bottom boot)
222222h
01h (top boot)
80h (factory locked)
00h (not factory locked)
H
L
L
H
SecSi™ Sector Indicator
Bit
L
L
H
X
X
VID
X
L
X
L
L
H
H
X
Sector Protection
Verification
L
L
H
SA
X
VID
X
L
X
L
L
H
L
X
01h (protected)
00h (unprotected)
L = Logic Low = VIL, H = Logic High = VIH, SA = Sector Address, X = Don’t care.
Note: The autoselect codes may also be accessed in-system via command sequences. See Table 13.
Sector Protection/Unprotection
The hardware sector protection feature disables both
p r o g ra m a n d e r a se o p e r a ti o n s i n a ny s e c t o r.
The hardware sector unprotection feature re-enables
both program and erase operations in previously
protected sectors.
The device is shipped with all sectors unprotected.
AMD offers the option of programming and protecting
sectors at its factory prior to shipping the device
through AMD’s ExpressFlash™ Service. Contact an
AMD representative for details.
It is possible to determine whether a sector is protected
or unprotected. See “Autoselect Mode” for details.
14
Sector protection and unprotection must be implemented via programming equipment. The procedure
requires high voltage (VID ) to be placed on address
input A9 and control input OE#. This method is compatible with programmer routines written for earlier
AMD 3.0 volt devices. Publication number 24136 contains further details; contact an AMD representative to
request a copy. For sector unprotect, all unprotected
sectors must first be protected prior to the first sector
unprotect write cycle. Note that after the sector unprotect operation, all previously protected sectors must be
re-protected using the sector protect algorithm.
The device features a temporary unprotect command
sequence to allow changing array data in-system. See
“ Tem p o rar y S e cto r U n p r ote ct E n able /D i s a bl e
Command Sequence” for more information.
Am29PL320D
October 2, 2003
COMMON FLASH MEMORY INTERFACE
(CFI)
The Common Flash Interface (CFI) specification outlines device and host system software interrogation
handshake, which allows specific vendor-specified
software algorithms to be used for entire families of dev i c e s . S o f tw a r e s u p p o r t ca n t h e n b e d ev i c e independent, JEDEC ID-independent, and forwardand backward-compatible for the specified flash device
families. Flash vendors can standardize their existing
interfaces for long-term compatibility.
This device enters the CFI Query mode when the system writes the CFI Query command, 98h, to address
55h in double word mode (or address AAh in word
mode), any time the device is ready to read array data.
Table 9.
The system can read CFI information at the addresses
given in Tables 9–12. To terminate reading CFI data,
the system must write the reset command.
The system can also write the CFI query command
when the device is in the autoselect mode. The device
enters the CFI query mode, and the system can read
CFI data at the addresses given in Tables 9–12. The
system must write the reset command to return the device to the autoselect mode.
For further information, please refer to the CFI Specification and CFI Publication 100, available via the World
Wide Web at http://www.amd.com/flash/cfi. Alternatively, contact an AMD representative for copies of
these documents.
CFI Query Identification String
Addresses
(Double
Word Mode)
Addresses
(Word Mode)
Data
10h
11h
12h
20h
22h
24h
0051h
0052h
0059h
Query Unique ASCII string “QRY”
13h
14h
26h
28h
0002h
0000h
Primary OEM Command Set
15h
16h
2Ah
2Ch
0040h
0000h
Address for Primary Extended Table
17h
18h
2Eh
30h
0000h
0000h
Alternate OEM Command Set (00h = none exists)
19h
1Ah
32h
34h
0000h
0000h
Address for Alternate OEM Extended Table (00h = none exists)
October 2, 2003
Description
Am29PL320D
15
Table 10.
System Interface String
Addresses
(Double Word
Mode)
Addresses
(Word Mode)
Data
1Bh
36h
0027h
VCC Min. (write/erase)
D7–D4: volt, D3–D0: 100 millivolt
1Ch
38h
0036h
VCC Max. (write/erase), D7–D4: volt, D3–D0: 100 millivolt
1Dh
3Ah
0000h
VPP Min. voltage (00h = no VPP input present)
1Eh
3Ch
0000h
VPP Max. voltage (00h = no VPP input present)
1Fh
3Eh
0004h
Typical timeout per single word/double word write 2N µs
20h
40h
0000h
Typical timeout for Min. size buffer write 2N µs (00h = not supported)
21h
42h
000Ah
Typical timeout per individual block erase 2N ms
22h
44h
0000h
Typical timeout for full chip erase 2N ms (00h = not supported)
23h
46h
0005h
Max. timeout for word/ double word write 2N times typical
24h
48h
0000h
Max. timeout for buffer write 2N times typical
25h
4Ah
0006h
Max. timeout per individual block erase 2N times typical
26h
4Ch
0000h
Max. timeout for full chip erase 2N times typical (00h = not supported)
Table 11.
Description
Device Geometry Definition
Addresses
(Double Word
Mode)
Addresses
(Word Mode)
Data
27h
4Eh
0016h
Device Size = 2N byte
28h
29h
50h
52h
0005h
0000h
Flash Device Interface description (refer to CFI publication 100)
2Ah
2Bh
54h
56h
0000h
0000h
Max. number of bytes in multi-byte write = 2N
(00h = not supported)
2Ch
58h
0004h
Number of Erase Block Regions within device
2Dh
2Eh
2Fh
30h
5Ah
5Ch
5Eh
60h
0000h
0000h
0080h
0000h
Erase Block Region 1 Information
(refer to the CFI specification or CFI publication 100)
31h
32h
33h
34h
62h
64h
66h
68h
0001h
0000h
0040h
0000h
Erase Block Region 2 Information
35h
36h
37h
38h
6Ah
6Ch
6Eh
70h
0000h
0000h
0000h
0003h
Erase Block Region 3 Information
39h
3Ah
3Bh
3Ch
72h
74h
76h
78h
000Eh
0000h
0000h
0004h
Erase Block Region 4 Information
16
Description
Am29PL320D
October 2, 2003
Table 12.
Primary Vendor-Specific Extended Query
Addresses
(Double Word
Mode)
Addresses
(Word Mode)
Data
40h
41h
42h
80h
82h
84h
0050h
0052h
0049h
Query-unique ASCII string “PRI”
43h
86h
0031h
Major version number, ASCII
44h
88h
0032h
Minor version number, ASCII
45h
8Ah
0000h
Address Sensitive Unlock
0 = Required, 1 = Not Required
46h
8Ch
0002h
Erase Suspend
0 = Not Supported, 1 = To Read Only, 2 = To Read & Write
47h
8Eh
0001h
Sector Protect
0 = Not Supported, X = Number of sectors in per group
48h
90h
0001h
Sector Temporary Unprotect
00 = Not Supported, 01 = Supported
49h
92h
0001h
Sector Protect/Unprotect scheme
01 = 29F040 mode, 02 = 29F016 mode,
03 = 29F400 mode, 04 = 29LV800A mode
4Ah
94h
0000h
Simultaneous Operation
00 = Not Supported, 01 = Supported
4Bh
96h
0000h
Burst Mode Type
00 = Not Supported, 01 = 4 Word Linear Burst, 02 = 8 Word Linear Burst,
03 = 32 Linear Burst, 04 = 4 Word Interleave Burst
4Ch
98h
0002h
Page Mode Type
00 = Not Supported, 01 = 4 Word Page, 02 = 8 Word Page
4Dh
9Ah
00B5h
ACC (Acceleration) Supply
Minimum 00h = not supported,
D7–D4: volt; D3–D0: 100 millivolt.
4Eh
9Ch
00C5h
ACC (Acceleration) Supply
Maximum 00h = not supported,
D7–D4: volt; D3–D0: 100 millivolt.
50h
A0h
0000h
Program Suspend
00h = not supported, 01h = supported
October 2, 2003
Description
Am29PL320D
17
SecSi™ (Secured Silicon) Sector Flash
Memory Region
The SecSi (Secured Silicon) Sector feature provides a
Flash memory region that enables permanent part
identification through an Electronic Serial Number
(ESN). The SecSi Sector is a minimum of 128 words
(64 double words) in length, and uses a SecSi Sector
Indicator Bit (DQ7) to indicate whether or not the
SecSi Sector is locked when shipped from the factory.
This bit is permanently set at the factory and cannot
be changed, which prevents cloning of a factory locked
part. This ensures the security of the ESN once the
product is shipped to the field. Current version of device has 512 words; future versions will have only
128 words. This should be considered during system design.
AMD offers the device with the SecSi Sector either
factory locked or customer lockable. The factorylocked version is always protected when shipped from
the factory, and has the SecSi (Secured Silicon) Sector Indicator Bit permanently set to a “1.” The customer-lockable version is shipped with the SecSi
Sector unprotected, allowing customers to utilize the
that sector in any manner they choose. The customerlockable version has the SecSi (Secured Silicon) Sector Indicator Bit permanently set to a “0.” Thus, the
SecSi Sector Indicator Bit prevents customer-lockable
devices from being used to replace devices that are
factory locked.
The system accesses the SecSi Sector through a
command sequence (see “Enter SecSi™ Sector/Exit
SecSi Sector Command Sequence”). After the system
has written the Enter SecSi Sector command sequence, it may read the SecSi Sector by using the addresses normally occupied by the boot sectors. This
mode of operation continues until the system issues
the Exit SecSi Sector command sequence, or until
power is removed from the device. On power-up the
device reverts to sending commands to the boot sectors.
Factory Locked: SecSi Sector Programmed and
Protected At the Factory
In a factory locked device, the SecSi Sector is protected when the device is shipped from the factory.
The SecSi Sector cannot be modified in any way. The
device is available preprogrammed with one of the following:
■ A random, secure ESN only
■ Customer code through the ExpressFlash service
In devices that have an ESN, a Bottom Boot device will
have the 8-word (4-double word) ESN in the lowest addressable memor y area at addresses 000000h–
000003h in double word mode (or 000000h–000007h
in word mode). In the Top Boot device the starting address of the ESN will be at the bottom of the lowest 8
Kbyte boot sector at addresses 1F8000h–1F8003h in
double word mode (or addresses FC0000h–FC0007h
in word mode).
Customers may opt to have their code programmed by
AMD through the AMD ExpressFlash service. AMD
programs the customer’s code, with or without the random ESN. The devices are then shipped from AMD’s
factory with the SecSi Sector permanently locked.
Contact an AMD representative for details on using
AMD’s ExpressFlash service.
Customer Lockable: SecSi Sector NOT
Programmed or Locked At the Factory
If the security feature is not required, the SecSi Sector
can be treated as an additional Flash memory space,
expanding the size of the available Flash array. Current version of device has 512 words; future versions will have only 128 words. This should be
considered during system design. The SecSi Sector can be read, programmed, and erased as often as
required. (In upcoming versions of this device, the
SecSi Sector erase function will not be available.) Note
that the accelerated programming (ACC) and unlock
bypass functions are not available when programming
the SecSi Sector.
The SecSi Sector can be locked in-system by performing the following steps:
■ Write the three-cycle Enter SecSi Sector Region
command sequence.
■ Write 60h to any address (protect command).
■ Wait 150 µs, and then write 40h to address 01h (verify command).
■ Read from address 02h. The data should be 01h.
■ Write the reset command (F0h to any address).
■ Write the four-cycle Exit SecSi Sector command sequence to return to reading from the array.
To verify the protect/unprotect status of the SecSi
Sector, follow the algorithm shown in Figure 1.
The SecSi Sector lock must be used with caution
since, once locked, there is no procedure available for
unlocking the SecSi Sector area and none of the bits
in the SecSi Sector memory space can be modified in
any way.
■ Both a random, secure ESN and customer code
through the ExpressFlash service.
18
Am29PL320D
October 2, 2003
were last protected or unprotected using the method
described in “Sector Protection/Unprotection”.
START
RESET# =
VIH or VID
Wait 1 µs
Write 60h to
any address
Write 40h to SecSi
Sector address
with A6 = 0,
A1 = 1, A0 = 0
Read from SecSi
Sector address
with A6 = 0,
A1 = 1, A0 = 0
Figure 1.
Note that the WP# input must not be left floating or unconnected; inconsistent behavior of the device may result.
If data = 00h,
SecSi Sector is
unprotected.
If data = 01h,
SecSi Sector is
protected.
Hardware Data Protection
The command sequence requirement of unlock cycles
for programming or erasing provides data protection
against inadvertent writes (refer to Table 13 for command definitions). In addition, the following hardware
data protection measures prevent accidental erasure
or programming, which might otherwise be caused by
spurious system level signals during VCC power-up
and power-down transitions, or from system noise.
Remove VIH or VID
from RESET#
Write reset
command
SecSi Sector
Protect Verify
complete
Low VCC Write Inhibit
When VCC is less than VLKO, the device does not accept any write cycles. This protects data during VCC
power-up and power-down. The command register
and all internal program/erase circuits are disabled,
and the device resets. Subsequent writes are ignored
until VCC is greater than VLKO. The system must provide the proper signals to the control inputs to prevent
unintentional writes when VCC is greater than VLKO.
SecSi Sector Protect Verify
Write Protect (WP#)
The Write Protect function provides a hardware
method of protecting certain boot sectors without
using VID.
If the system asserts VIL on the WP# input, the device
disables program and erase functions in Sector 0 (for
bottom boot) or Sector 18 (for top boot) independently
of whether those sectors were protected or unprotected using the method described in “Sector Protection/Unprotection”.
If the system asserts VIH on the WP# input, the device
reverts to whether Sector 0 or 18 was last set to be
protected or unprotected. That is, sector protection or
unprotection for that sector depends on whether they
Write Pulse “Glitch” Protection
Noise pulses of less than 5 ns (typical) on OE#, CE# or
WE# do not initiate a write cycle.
Logical Inhibit
Write cycles are inhibited by holding any one of OE# =
VIL, CE# = VIH or WE# = VIH. To initiate a write cycle,
CE# and WE# must be a logical zero while OE# is a
logical one.
Power-Up Write Inhibit
If WE# = CE# = VIL and OE# = VIH during power up,
the device does not accept commands on the rising
edge of WE#. The internal state machine is automatically reset to reading array data on power-up.
COMMAND DEFINITIONS
Writing specific address and data commands or sequences into the command register initiates device
operations. Table 13 defines the valid register command sequences. Note that writing incorrect address
and data values or writing them in the improper sequence may place the device in an unknown state. A
reset command is required to return the device to normal operation.
All addresses are latched on the falling edge of WE# or
CE#, whichever happens later. All data is latched on
the rising edge of WE# or CE#, whichever happens
first. Refer to the appropriate timing diagrams in the
“AC Characteristics” section.
October 2, 2003
Reading Array Data
The device is automatically set to reading array data
after device power-up. No commands are required to
retrieve data. The device is also ready to read array
data after completing an Embedded Program or Embedded Erase algorithm.
After the device accepts an Erase Suspend command,
the device enters the Erase Suspend mode. The system can read array data using the standard read
timings, except that if it reads at an address within
erase-suspended sectors, the device outputs status
data. After completing a programming operation in the
Am29PL320D
19
Erase Suspend mode, the system may once again
read array data with the same exception. See “Erase
Suspend/Erase Resume Commands” for more information on this mode.
The system must issue the reset command to re-enable the device for reading array data if DQ5 goes
high, or while in the autoselect mode. See the “Reset
Command” section, next.
See also “Requirements for Reading Array Data” in the
“Device Bus Operations” section for more information.
The Read Operations table provides the read parameters, and Figure 13 shows the timing diagram.
Reset Command
Writing the reset command to the device resets the device to reading array data. Address bits are don’t care
for this command.
The reset command may be written between the sequence cycles in an erase command sequence before
erasing begins. This resets the device to reading array
data. Once erasure begins, however, the device ignores reset commands until the operation is complete.
The reset command may be written between the sequence cycles in a program command sequence
before programming begins. This resets the device to
reading array data (also applies to programming in
Erase Suspend mode). Once programming begins,
however, the device ignores reset commands until the
operation is complete.
The reset command may be written between the sequence cycles in an autoselect command sequence.
Once in the autoselect mode, the reset command must
be written to return to reading array data (also applies
to autoselect during Erase Suspend).
If DQ5 goes high during a program or erase operation,
writing the reset command returns the device to reading array data (also applies during Erase Suspend).
Autoselect Command Sequence
The autoselect command sequence allows the host
system to access the manufacturer and devices codes,
and determine whether or not a sector is protected.
Table 13 shows the address and data requirements.
The autoselect command sequence is initiated by writing two unlock cycles, followed by the autoselect
command. The device then enters the autoselect mode,
and the system may read any number of autoselect
codes without reinitiating the command sequence.
Tables 13 and 14 show the address and data requirements for the command sequence. To determine sector protection information, the system must write to the
20
appropriate sector address (SA). Tables 4 and 6 show
the address range associated with each sector.
The system must write the reset command to exit the
autoselect mode and return to reading array data.
Enter SecSi™ Sector/Exit SecSi Sector
Command Sequence
The SecSi Sector region provides a secured data area
containing a random, eight-word (or four double word)
electronic serial number (ESN). The system can access the SecSi Sector region by issuing the threecycle Enter SecSi Sector command sequence. The
device continues to access the SecSi Sector region
until the system issues the four-cycle Exit SecSi Sector command sequence. The Exit SecSi Sector comm an d se q u en ce r e tu r ns t h e d ev ic e t o n o r m a l
operation. Table 13 shows the address and data requirements for both command sequences. See also
“SecSi™ (Secured Silicon) Sector Flash
Memory Region” for further information.
Word/Double Word Program
Command Sequence
The system may program the device by word or double
word, depending on the state of the WORD# input.
Programming is a four-bus-cycle operation. The program command sequence is initiated by writing two
unlock write cycles, followed by the program set-up
command. The program address and data are written
next, which in turn initiate the Embedded Program algorithm. The system is not required to provide further
controls or timings. The device automatically generates the program pulses and verifies the programmed
cell margin. Table 13 shows the address and data requirements for the program command sequence.
When the Embedded Program algorithm is complete,
the device then returns to reading array data and addresses are no longer latched. The system can
determine the status of the program operation by using
DQ7 or DQ6. See “Write Operation Status” for information on these status bits.
Any commands written to the device during the Embedded Program Algorithm are ignored. The Program
command sequence should be reinitiated once the device has reset to reading array data, to ensure data
integrity.
Programming is allowed in any sequence and across
sector boundaries. A bit cannot be programmed
from a “0” back to a “1”. Attempting to do so may
halt the operation and set DQ5 to “1,” or cause the
Data# Polling algorithm to indicate the operation was
successful. However, a succeeding read will show that
the data is still “0”. Only erase operations can convert
a “0” to a “1”.
Am29PL320D
October 2, 2003
Unlock Bypass Command Sequence
The unlock bypass feature allows the system to program bytes or words to the device faster than using the
standard program command sequence. The unlock bypass command sequence is initiated by first writing
two unlock cycles. This is followed by a third write cycle
containing the unlock bypass command, 20h. The device then enters the unlock bypass mode. A two-cycle
unlock bypass program command sequence is all that
is required to program in this mode. The first cycle in
this sequence contains the unlock bypass program
command, A0h; the second cycle contains the program address and data. Additional data is
programmed in the same manner. This mode dispenses with the initial two unlock cycles required in the
standard program command sequence, resulting in
faster total programming time. Table 13 shows the requirements for the command sequence.
During the unlock bypass mode, only the Unlock Bypass Program and Unlock Bypass Reset commands
are valid. To exit the unlock bypass mode, the system
must issue the two-cycle unlock bypass reset command sequence. The first cycle must contain the data
90h; the second cycle the data 00h. Addresses are
don’t care for both cycles. The device then returns to
reading array data.
Figure 2 illustrates the algorithm for the program operation. See the Program/Erase Operations table in “AC
Characteristics” for parameters, and to Figure 17 for
timing diagrams.
October 2, 2003
START
Write Program
Command Sequence
Data Poll
from System
Embedded
Program
algorithm
in progress
Verify Data?
No
Yes
Increment Address
No
Last Address?
Yes
Programming
Completed
Note: See Table 13 for program command sequence.
Am29PL320D
Figure 2.
Program Operation
21
Chip Erase Command Sequence
Chip erase is a six bus cycle operation. The chip erase
command sequence is initiated by writing two unlock
cycles, followed by a set-up command. Two additional
unlock write cycles are then followed by the chip erase
command, which in turn invokes the Embedded Erase
algorithm. The device does not require the system to
preprogram prior to erase. The Embedded Erase algorithm automatically preprograms and verifies the entire
memory for an all zero data pattern prior to electrical
erase. The system is not required to provide any controls or timings during these operations. Table 13
shows the address and data requirements for the chip
erase command sequence.
this time to ensure all commands are accepted. The interrupts can be re-enabled after the last Sector Erase
command is written. If the time between additional
sector erase commands can be assumed to be less
than 50 µs, the system need not monitor DQ3. Any
command other than Sector Erase or Erase Suspend during the time-out period resets the device
to reading array data. The system must rewrite the
command sequence and any additional sector addresses and commands.
The system can monitor DQ3 to determine if the sector
erase timer has timed out. (See the “DQ3: Sector Erase
Timer” section.) The time-out begins from the rising
edge of the final WE# pulse in the command sequence.
Any commands written to the chip during the Embedded Erase algorithm are ignored. The Chip Erase
command sequence should be reinitiated once the
device has returned to reading array data, to ensure
data integrity.
Once the sector erase operation has begun, only the
Erase Suspend command is valid. All other commands
are ignored. The Sector Erase command sequence
should be reinitiated once the device has returned to
reading array data, to ensure data integrity.
The system can determine the status of the erase operation by using DQ7, DQ6, or DQ2. See “Write
Operation Status” for information on these status bits.
When the Embedded Erase algorithm is complete, the
device returns to reading array data and addresses are
no longer latched.
When the Embedded Erase algorithm is complete, the
device returns to reading array data and addresses are
no longer latched. The system can determine the status of the erase operation by using DQ7, DQ6, or DQ2.
(Refer to “Write Operation Status” for information on
these status bits.)
Figure 3 illustrates the algorithm for the erase operation. See the Program/Erase Operations tables in “AC
Characteristics” for parameters, and to Figure 18 for
timing diagrams.
Figure 3 illustrates the algorithm for the erase operation. Refer to the Program/Erase Operations tables in
the “AC Characteristics” section for parameters, and to
Figure 18 for timing diagrams.
Sector Erase Command Sequence
Erase Suspend/Erase Resume Commands
Sector erase is a six bus cycle operation. The sector
erase command sequence is initiated by writing two
unlock cycles, followed by a set-up command. Two additional unlock write cycles are then followed by the
address of the sector to be erased, and the sector
erase command. Table 13 shows the address and data
requirements for the sector erase command sequence.
The Erase Suspend command allows the system to interrupt a sector erase operation and then read data
from, or program data to, any sector not selected for
erasure. This command is valid only during the sector
erase operation, including the 50 µs time-out period
during the sector erase command sequence. The
Erase Suspend command is ignored if written during
the chip erase operation or Embedded Program algorithm. Writing the Erase Suspend command during the
Sector Erase time-out immediately terminates the
time-out period and suspends the erase operation. Addresses are “don’t-cares” when writing the Erase
Suspend command.
The device does not require the system to preprogram
the memory prior to erase. The Embedded Erase algorithm automatically programs and verifies the sector
for an all zero data pattern prior to electrical erase. The
system is not required to provide any controls or timings during these operations.
After the command sequence is written, a sector erase
time-out of 50 µs begins. During the time-out period,
additional sector addresses and sector erase commands may be written. Loading the sector erase buffer
may be done in any sequence, and the number of sectors may be from one sector to all sectors. The time
between these additional cycles must be less than 50
µs, otherwise the last address and command might not
be accepted, and erasure may begin. It is recommended that processor interrupts be disabled during
22
When the Erase Suspend command is written during a
sector erase operation, the device requires a maximum of 20 µs to suspend the erase operation.
However, when the Erase Suspend command is written during the sector erase time-out, the device
immediately terminates the time-out period and suspends the erase operation.
After the erase operation has been suspended, the
system can read array data from or program data to
any sector not selected for erasure. (The device “erase
Am29PL320D
October 2, 2003
suspends” all sectors selected for erasure.) Note that
unlock bypass programming is not allowed when the
device is erase-suspended.
Another Erase Suspend command can be written after
the device has resumed erasing.
Reading at any address within erase-suspended sectors produces status data on DQ7–DQ0. The system
can use DQ7, or DQ6 and DQ2 together, to determine
if a sector is actively erasing or is erase-suspended.
See “Write Operation Status” for information on these
status bits.
START
Write Erase
Command Sequence
After an erase-suspended program operation is complete, the system can once again read array data
within non-suspended sectors. The system can determine the status of the program operation using the
DQ7 or DQ6 status bits, just as in the standard
program operation. See “Write Operation Status” for
more information.
Data Poll
from System
The system may also write the autoselect command
sequence when the device is in the Erase Suspend
mode. The device allows reading autoselect codes
even at addresses within erasing sectors, since the
codes are not stored in the memory array. When the
device exits the autoselect mode, the device reverts to
the Erase Suspend mode, and is ready for another
valid operation. See “Autoselect Command Sequence”
for more information.
The system must write the Erase Resume command
(address bits are “don’t care”) to exit the erase suspend mode and continue the sector erase operation.
Further writes of the Resume command are ignored.
No
Data = FFh?
Yes
Erasure Completed
Notes:
1. See Table 13 for erase command sequence.
2. See “DQ3: Sector Erase Timer” for more information.
Figure 3.
October 2, 2003
Embedded
Erase
algorithm
in progress
Am29PL320D
Erase Operation
23
Temporary Sector Unprotect Enable/Disable Command Sequence
The temporary unprotect command sequence is a
four-bus-cycle operation. The sequence is initiated by
writing two unlock write cycles. A third write cycle sets
up the command. The fourth and final write cycle enables or disables the temporary unprotect feature. If
the temporary unprotect feature is enabled, all sectors
are temporarily unprotected. The system may program
or erase data as needed. When the system writes the
temporary unprotect disable command sequence, all
sectors return to their previous protected or unprotected settings. See Table 13 and Figure 4 for more
information.
START
Write Temporary Sector
Unprotect Enable
Command Sequence
(Note 1)
Perform Erase or
Program Operations
Write Temporary Sector
Unprotect Disable
Command Sequence
Procedure Complete
(Note 2)
Notes:
1. All protected sectors are unprotected. If WP# = VIL, the
first or last 64 KByte sector will remain protected.
2. All previously protected sectors are protected once again.
Figure 4.
24
Am29PL320D
Temporary Sector Unprotect Algorithm
October 2, 2003
Command Definitions
Command
Sequence
(Note 1)
Cycles
Table 13.
Command Definitions (Double Word Mode)
First
Addr Data
Second
Addr Data
Bus Cycles (Notes 2–5)
Third
Fourth
Addr Data Addr
Data
1
RA
Reset (Note 7)
1
XXX
F0
Manufacturer ID
4
555
AA
2AA
55
555
90
00
01
Device ID (Note 9)
6
555
AA
2AA
55
555
90
01
227E
90
(BA)
X03
(Note 10)
90
(SA)
X02
(Note 11)
Autoselect (Note 8)
Read (Note 6)
Fifth
Addr Data
Addr
Sixth
Data
RD
0E
2203
0F
2200 2201
AA
2AA
55
555
10
AA
2AA
55
SA
30
SecSi™ Sector Factory
Protect (Note 10)
4
555
AA
2AA
55
(BA)
555
Sector Protect Verify
(Note 11)
4
555
AA
2AA
55
555
Enter SecSi Sector Region
3
555
AA
2AA
55
555
88
Exit SecSi Sector Region
4
555
AA
2AA
55
555
90
XXX
00
CFI Query (Note 12)
1
55
98
Program
4
555
AA
2AA
55
555
A0
PA
PD
Unlock Bypass
3
555
AA
2AA
55
555
20
Unlock Bypass Program
(Note 13)
2
XXX
A0
PA
PD
Unlock Bypass Reset (Note 14)
2
XXX
90
XXX
00
Chip Erase
6
555
AA
2AA
55
555
80
555
Sector Erase
6
555
AA
2AA
55
555
80
555
Erase Suspend (Note 15)
1
XXX
B0
Erase Resume (Note 16)
1
XXX
30
Temporary Sector Unprotect
Enable
4
555
AA
2AA
55
555
E0
XXX
01
Temporary Sector Unprotect
Disable
4
555
AA
2AA
55
555
E0
XXX
00
Legend:
X = Don’t care
RA = Address of the memory location to be read.
RD = Data read from location RA during read operation.
PA = Address of the memory location to be programmed. Addresses latch
on the falling edge of the WE# or CE# pulse, whichever happens later.
PD = Data to be programmed at location PA. Data latches on the rising
edge of WE# or CE# pulse, whichever happens first.
SA = Address of the sector to be verified (in autoselect mode) or erased.
Address bits A19–A12 uniquely select any sector.
Notes:
11. The data is 00h for an unprotected sector and 01h for a protected
sector. See “Autoselect Command Sequence” for more information.
12. Command is valid when device is ready to read array data or when
device is in autoselect mode.
13. The Unlock Bypass command is required prior to the Unlock Bypass
Program command.
14. The Unlock Bypass Reset command is required to return to reading
array data when the device is in the unlock bypass mode.
15. The system may read and program in non-erasing sectors, or enter
the autoselect mode, when in the Erase Suspend mode. The Erase
Suspend command is valid only during a sector erase operation.
16. The Erase Resume command is valid only during the Erase Suspend
mode.
1.
2.
3.
See Table 1 for description of bus operations.
All values are in hexadecimal.
Except for the read cycle and the fourth cycle of the autoselect
command sequence, all bus cycles are write cycles.
4. Data bits DQ31–DQ8 are don’t cares for unlock and command
cycles.
5. Address bits A19–A11 are don’t cares for unlock and command
cycles, unless SA or PA required.
6. No unlock or command cycles required when reading array data.
7. The Reset command is required to return to reading array data when
device is in the autoselect mode, or if DQ5 goes high (while the
device is providing status data).
8. The fourth cycle of the autoselect command sequence is a read
cycle.
9. DQ31–DQ16 output 2222h for device ID reads. The device ID must
be read across the fourth, fifth, and sixth cycles. The sixth cycle
specifies 22222200h for bottom boot devices and 22222201h for top
boot devices.
10. The data is 80h for factory locked and 00h for not factory locked.
October 2, 2003
Am29PL320D
25
Command
Sequence
(Note 1)
Cycles
Table 14.
Command Definitions (Word Mode)
Bus Cycles (Notes 2–5)
First
Addr Data
Second
Addr Data
Third
Fourth
Addr Data Addr
Data
1
RA
Reset (Note 7)
1
XXX
F0
Manufacturer ID
4
AAA
AA
555
55
AAA
90
00
01
Device ID (Note 9)
6
AAA
AA
555
55
AAA
90
02
227E
90
(BA)
X06
(Note 10)
90
(SA)
X04
(Note 11)
Autoselect (Note 8)
Read (Note 6)
Fifth
Sixth
Addr Data Addr
Data
RD
SecSi™ Sector Factory
Protect (Note 10)
4
AAA
AA
555
55
(BA)
AAA
Sector Protect Verify
(Note 11)
4
AAA
AA
555
55
AAA
Enter SecSi Sector Region
3
AAA
AA
555
55
AAA
88
Exit SecSi Sector Region
4
AAA
AA
555
55
AAA
90
XXX
00
CFI Query (Note 12)
1
55
98
PA
PD
1C
2203
1E
2200 2201
Program
4
AAA
AA
555
55
AAA
A0
Unlock Bypass
3
AAA
AA
555
55
AAA
20
Unlock Bypass Program (Note 13)
2
XXX
A0
PA
PD
Unlock Bypass Reset (Note 14)
2
XXX
90
XXX
00
Chip Erase
6
AAA
AA
555
55
AAA
80
AAA
AA
555
55
AAA
10
Sector Erase
6
AAA
AA
555
55
AAA
80
AAA
AA
555
55
SA
30
Erase Suspend (Note 15)
1
XXX
B0
Erase Resume (Note 16)
1
XXX
30
Temporary Sector Unprotect
Enable
4
AAA
AA
555
55
AAA
E0
XXX
01
Temporary Sector Unprotect
Disable
4
AAA
AA
555
55
AAA
E0
XXX
00
Legend:
X = Don’t care
RA = Address of the memory location to be read.
RD = Data read from location RA during read operation.
PA = Address of the memory location to be programmed. Addresses latch
on the falling edge of the WE# or CE# pulse, whichever happens later.
PD = Data to be programmed at location PA. Data latches on the rising
edge of WE# or CE# pulse, whichever happens first.
SA = Address of the sector to be verified (in autoselect mode) or erased.
Address bits A19–A12 uniquely select any sector.
Notes:
10. The data is 80h for factory locked and 00h for not factory locked.
11. The data is 00h for an unprotected sector and 01h for a protected
sector. See “Autoselect Command Sequence” for more information.
12. Command is valid when device is ready to read array data or when
device is in autoselect mode.
13. The Unlock Bypass command is required prior to the Unlock Bypass
Program command.
14. The Unlock Bypass Reset command is required to return to reading
array data when the device is in the unlock bypass mode.
15. The system may read and program in non-erasing sectors, or enter
the autoselect mode, when in the Erase Suspend mode. The Erase
Suspend command is valid only during a sector erase operation.
16. The Erase Resume command is valid only during the Erase Suspend
mode.
1.
2.
3.
4.
5.
6.
7.
8.
9.
26
See Table 1 for description of bus operations.
All values are in hexadecimal.
Except for the read cycle and the fourth cycle of the autoselect
command sequence, all bus cycles are write cycles.
Data bits DQ31–DQ8 are don’t cares for unlock and command
cycles.
Address bits A19–A11 are don’t cares for unlock and command
cycles, unless SA or PA required.
No unlock or command cycles required when reading array data.
The Reset command is required to return to reading array data when
device is in the autoselect mode, or if DQ5 goes high (while the
device is providing status data).
The fourth cycle of the autoselect command sequence is a read
cycle.
The device ID must be read across the fourth, fifth, and sixth cycles.
The sixth cycle specifies 2200h for bottom boot devices and 2201h
for top boot devices.
Am29PL320D
October 2, 2003
WRITE OPERATION STATUS
The device provides several bits to determine the status of a write operation: DQ2, DQ3, DQ5, DQ6, and
DQ7. Table 15 and the following subsections describe
the functions of these bits. DQ7 and DQ6 each offer a
method for determining whether a program or erase
operation is complete or in progress. These three bits
are discussed first.
DQ6 while Output Enable (OE#) is asserted low. See
Figure 18 in the “AC Characteristics” section.
Table 15 shows the outputs for Data# Polling on DQ7.
Figure 5 shows the Data# Polling algorithm.
START
DQ7: Data# Polling
The Data# Polling bit, DQ7, indicates to the host
system whether an Embedded Algorithm is in progress
or completed, or whether the device is in Erase
Suspend. Data# Polling is valid after the rising edge
of the final WE# pulse in the program or erase command sequence.
During the Embedded Program algorithm, the device
outputs on DQ7 the complement of the datum programmed to DQ7. This DQ7 status also applies to
programming during Erase Suspend. When the Embedded Program algorithm is complete, the device
outputs the datum programmed to DQ7. The system
must provide the program address to read valid status
information on DQ7. If a program address falls within a
protected sector, Data# Polling on DQ7 is active for approximately 1 µs, then the device returns to reading
array data.
Read DQ7–DQ0
Addr = VA
DQ7 = Data?
No
No
When the system detects DQ7 has changed from the
complement to true data, it can read valid data at
DQ7–DQ0 on the following read cycles. This is because DQ7 may change asynchronously with DQ0–
DQ5 = 1?
Yes
During the Embedded Erase algorithm, Data# Polling
produces a “0” on DQ7. When the Embedded Erase
algorithm is complete, or if the device enters the Erase
Suspend mode, Data# Polling produces a “1” on DQ7.
This is analogous to the complement/true datum output described for the Embedded Program algorithm:
the erase function changes all the bits in a sector to
“1”; prior to this, the device outputs the “complement,”
or “0.” The system must provide an address within any
of the sectors selected for erasure to read valid status
information on DQ7.
After an erase command sequence is written, if all sectors selected for erasing are protected, Data# Polling
on DQ7 is active for approximately 100 µs, then the device returns to reading array data. If not all selected
sectors are protected, the Embedded Erase algorithm
erases the unprotected sectors, and ignores the selected sectors that are protected.
Read DQ7–DQ0
Addr = VA
DQ7 = Data?
Yes
No
FAIL
PASS
Notes:
1. VA = Valid address for programming. During a sector
erase operation, a valid address is an address within any
sector selected for erasure. During chip erase, a valid
address is any non-protected sector address.
2. DQ7 should be rechecked even if DQ5 = “1” because
DQ7 may change simultaneously with DQ5
Figure 5.
October 2, 2003
Yes
Am29PL320D
Data# Polling Algorithm
27
DQ6: Toggle Bit
Toggle Bit I on DQ6 indicates whether an Embedded
Program or Erase algorithm is in progress or complete,
or whether the device has entered the Erase Suspend
mode. Toggle Bit I may be read at any address, and is
valid after the rising edge of the final WE# pulse in the
command sequence (prior to the program or erase operation), and during the sector erase time-out.
During an Embedded Program or Erase algorithm operation, successive read cycles to any address cause
DQ6 to toggle. (The system may use either OE# or
CE# to control the read cycles.) When the operation is
complete, DQ6 stops toggling.
After an erase command sequence is written, if all
sectors selected for erasing are protected, DQ6 toggles for approximately 100 µs, then returns to reading
array data. If not all selected sectors are protected,
the Embedded Erase algorithm erases the unprotected sectors, and ignores the selected sectors that
are protected.
The system can use DQ6 and DQ2 together to determine whether a sector is actively erasing or is erasesuspended. When the device is actively erasing (that
is, the Embedded Erase algorithm is in progress), DQ6
toggles. When the device enters the Erase Suspend
mode, DQ6 stops toggling. However, the system must
also use DQ2 to determine which sectors are erasing
or erase-suspended. Alternatively, the system can use
DQ7 (see the subsection on “DQ7: Data# Polling”).
If a program address falls within a protected sector,
DQ6 toggles for approximately 1 µs after the program
command sequence is written, then returns to reading
array data.
DQ6 also toggles during the erase-suspend-program
mode, and stops toggling once the Embedded Program algorithm is complete.
Table 15 shows the outputs for Toggle Bit I on DQ6.
Figure 6 shows the toggle bit algorithm in flowchart
form, and the section “Reading Toggle Bits DQ6/DQ2”
explains the algorithm. Figure 20 in the “AC Characteristics” section shows the toggle bit timing diagrams.
Figure 21 shows the differences between DQ2 and
DQ6 in graphical form. See also the subsection on
“DQ2: Toggle Bit”.
DQ2: Toggle Bit
The “Toggle Bit II” on DQ2, when used with DQ6, indicates whether a particular sector is actively erasing
(that is, the Embedded Erase algorithm is in progress),
or whether that sector is erase-suspended. Toggle Bit
II is valid after the rising edge of the final WE# pulse in
the command sequence.
28
DQ2 toggles when the system reads at addresses
within those sectors that have been selected for
erasure. (The system may use either OE# or CE# to
control the read cycles.) But DQ2 cannot distinguish
whether the sector is actively erasing or is erase-suspended. DQ6, by comparison, indicates whether the
device is actively erasing, or is in Erase Suspend, but
cannot distinguish which sectors are selected for erasure. Thus, both status bits are required for sector and
mode information. Refer to Table 15 to compare outputs
for DQ2 and DQ6.
Figure 6 shows the toggle bit algorithm in flowchart
form, and the section “Reading Toggle Bits DQ6/DQ2”
explains the algorithm. See also the DQ6: Toggle Bit
subsection. Figure 20 shows the toggle bit timing diagram. Figure 21 shows the differences between DQ2
and DQ6 in graphical form.
Reading Toggle Bits DQ6/DQ2
Refer to Figure 6 for the following discussion. Whenever the system initially begins reading toggle bit
status, it must read DQ7–DQ0 at least twice in a row to
determine whether a toggle bit is toggling. Typically,
the system would note and store the value of the toggle bit after the first read. After the second read, the
system would compare the new value of the toggle bit
with the first. If the toggle bit is not toggling, the device
has completed the program or erase operation. The
system can read array data on DQ7–DQ0 on the following read cycle.
However, if after the initial two read cycles, the system
determines that the toggle bit is still toggling, the system also should note whether the value of DQ5 is high
(see the section on DQ5). If it is, the system should
then determine again whether the toggle bit is toggling,
since the toggle bit may have stopped toggling just as
DQ5 went high. If the toggle bit is no longer toggling,
the device has successfully completed the program or
erase operation. If it is still toggling, the device did not
complete the operation successfully, and the system
must write the reset command to return to reading
array data.
The remaining scenario is that the system initially determines that the toggle bit is toggling and DQ5 has
not gone high. The system may continue to monitor the
toggle bit and DQ5 through successive read cycles,
determining the status as described in the previous
paragraph. Alternatively, it may choose to perform
other system tasks. In this case, the system must start
at the beginning of the algorithm when it returns to determine the status of the operation (top of Figure 6).
DQ5: Exceeded Timing Limits
DQ5 indicates whether the program or erase time has
exceeded a specified internal pulse count limit. Under
these conditions DQ5 produces a “1.” This is a failure
Am29PL320D
October 2, 2003
condition that indicates the program or erase cycle
was not successfully completed.
The DQ5 failure condition may appear if the system
tries to program a “1” to a location that is previously
programmed to “0.” Only an erase operation can
change a “0” back to a “1.” Under this condition, the
device halts the operation, and when the operation has
exceeded the timing limits, DQ5 produces a “1.”
START
Read DQ7–DQ0
Read DQ7–DQ0
Under both these conditions, the system must issue
the reset command to return the device to reading
array data.
(Note 1)
DQ3: Sector Erase Timer
Toggle Bit
= Toggle?
After writing a sector erase command sequence, the
system may read DQ3 to determine whether or not an
erase operation has begun. (The sector erase timer
does not apply to the chip erase command.) If additional sectors are selected for erasure, the entire timeout also applies after each additional sector erase
command. When the time-out is complete, DQ3
switches from “0” to “1.” The system may ignore DQ3 if
the system can guarantee that the time between additional sector erase commands will always be less than
50 µs. See also the “Write Operation Status” section.
No
Yes
No
DQ5 = 1?
Yes
Read DQ7–DQ0
Twice
Toggle Bit
= Toggle?
(Notes
1, 2)
No
Yes
Program/Erase
Operation Not
Complete, Write
Reset Command
Program/Erase
Operation Complete
After the sector erase command sequence is written,
the system should read the status on DQ7 (Data# Polling) or DQ6 (Toggle Bit I) to ensure the device has
accepted the command sequence, and then read
DQ3. If DQ3 is “1”, the internally controlled erase cycle
has begun; all further commands (other than Erase
Suspend) are ignored until the erase operation is complete. If DQ3 is “0”, the device will accept additional
sector erase commands. To ensure the command has
been accepted, the system software should check the
status of DQ3 prior to and following each subsequent
sector erase command. If DQ3 is high on the second
status check, the last command might not have been
accepted. Table 15 shows the outputs for DQ3.
Notes:
1. Read toggle bit twice to determine whether or not it is
toggling. See text.
2. Recheck toggle bit because it may stop toggling as DQ5
changes to “1”. See text.
Figure 6.
October 2, 2003
Toggle Bit Algorithm
Am29PL320D
29
Table 15.
Operation
Standard
Mode
Erase
Suspend
Mode
Embedded Program Algorithm
Write Operation Status
DQ7
(Note 2)
DQ6
DQ5
(Note 1)
DQ3
DQ2
(Note 2)
DQ7#
Toggle
0
N/A
No toggle
Embedded Erase Algorithm
0
Toggle
0
1
Toggle
Reading within Erase
Suspended Sector
1
No toggle
0
N/A
Toggle
Reading within Non-Erase
Suspended Sector
Data
Data
Data
Data
Data
Erase-Suspend-Program
DQ7#
Toggle
0
N/A
N/A
Notes:
1. DQ5 switches to ‘1’ when an Embedded Program or Embedded Erase operation has exceeded the maximum timing limits.
See “DQ5: Exceeded Timing Limits” for more information.
2. DQ7 and DQ2 require a valid address when reading status information. Refer to the appropriate subsection for further details.
30
Am29PL320D
October 2, 2003
ABSOLUTE MAXIMUM RATINGS
Storage Temperature
Plastic Packages . . . . . . . . . . . . . . . -65°C to +150°C
Ambient Temperature
with Power Applied. . . . . . . . . . . . . . -65°C to +125°C
20 ns
20 ns
+0.8 V
–0.5 V
Voltage with Respect to Ground
VCC (Note 1) . . . . . . . . . . . . . . . . . .–0.5 V to +4.0 V
–2.0 V
A9, OE#, ACC (Note 2) . . . . . . . . –0.5 V to +13.0 V
20 ns
All other inputs (Note 1) . . . . . . . . . –0.5 V to +5.5 V
Output Short Circuit Current (Note 3) . . . . . . 200 mA
Notes:
1. Minimum DC voltage on input or I/Os is –0.5 V. During
voltage transitions, voltages on inputs or I/Os may
overshoot VSS to –2.0 V for periods of up to 20 ns.
Maximum DC voltage on output and I/Os is VCC + 0.5 V.
During voltage transitions I/Os may overshoot to VCC +
2.0 V for periods up to 20 ns.
2. Minimum DC input voltage on inputs A9, OE#, and ACC
is –0.5 V. During voltage transitions, A9 and OE# may
overshoot VSS to -2.0 V for periods of up to 20 ns.
Maximum DC input voltage on input A9, OE#, and ACC is
+13.0 V which may overshoot to 14.0 V for periods up to
20 ns.
3. No more than one output may be shorted to ground at a
time. Duration of the short circuit should not be greater
than one second.
Figure 7. Maximum Negative
Overshoot Waveform
20 ns
VCC
+2.0 V
VCC
+0.5 V
2.0 V
20 ns
Figure 8.
20 ns
Maximum Positive Overshoot Waveform
4. Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this data sheet is not
implied. Exposure of the device to absolute maximum rating conditions for extended periods may affect device reliability.
OPERATING RANGES
Commercial (C) Devices
Ambient Temperature (TA) . . . . . . . . . . . 0°C to +70°C
Industrial (I) Devices
Ambient Temperature (TA) . . . . . . . . . –40°C to +85°C
VCC Supply Voltages
VCC for regulated voltage range. . . . . . . 3.0 V to 3.6 V
VCC for full voltage range . . . . . . . . . . . . 2.7 V to 3.6 V
Operating ranges define those limits between which the functionality of the device is guaranteed.
October 2, 2003
Am29PL320D
31
DC CHARACTERISTICS
CMOS Compatible
Parameter
Symbol
Description
Test Conditions
ILI
Input Load Current
VIN = VSS to VCC,
VCC = VCC max
ILIT
A9 Input Load Current
VCC = VCC max; A9 = 12.5 V
ILO
Output Leakage Current
VOUT = VSS to VCC,
VCC = VCC max
ICC1
VCC Active Inter-Page Read
Current (Notes 1, 2)
CE# = VIL, OE# = VIH
ICC2
VCC Active Write Current
(Notes 2, 4)
ICC3
Min
Typ
Max
Unit
±1.0
µA
35
µA
±1.0
µA
1 MHz
4
50
mA
10 MHz
40
80
mA
CE# = VIL, OE# = VIH
25
80
mA
VCC Standby Current (Note 2)
CE# = VCC±0.3 V
2
5
µA
Automatic Sleep Mode
(Notes 2, 3, 6)
VIH = VCC ± 0.3 V;
VIL = VSS ± 0.3 V
OE# = VIH
1
5
ICC4
OE# = VIL
2
20
VCC Active Intra-Page Read
Current (Note 2)
10 MHz
15
50
mA
ICC5
CE# = VIL, OE# = VIH
33 MHz
50
80
mA
VIL
Input Low Voltage
–0.5
0.8
V
VIH
Input High Voltage
2.0
VCC + 0.3
V
VHH
Voltage for Accelerated
Programming on ACC
11.5
12.5
V
VID
Voltage for Autoselect and
Temporary Sector Unprotect
VCC = 3.0 ± 0.3 V
11.5
12.5
V
VOL
Output Low Voltage
IOL = 4.0 mA, VCC = VCC min
0.45
V
VOH1
Output High Voltage
VOH2
VLKO
µA
IOH = –2.0 mA, VCC = VCC min
0.85 x VCC
IOH = –100 µA, VCC = VCC min
VCC–0.4
Low VCC Lock-Out Voltage
(Note 6)
2.3
V
2.5
V
Notes:
1. The ICC current listed is typically less than 4 mA/MHz, with OE# at VIH. Typical VCC is 3.0 V.
2. Maximum ICC specifications are tested with VCC = VCCmax.
3. The Automatic Sleep Mode current is dependent on the state of OE#.
4. ICC active while Embedded Erase or Embedded Program is in progress.
5. Automatic sleep mode enables the low power mode when addresses remain stable for tACC + 30 ns.
6. Not 100% tested.
32
Am29PL320D
October 2, 2003
DC CHARACTERISTICS (Continued)
Zero Power Flash
Supply Current in mA
25
20
15
10
5
0
0
500
1000
1500
2000
2500
3000
3500
4000
Time in ns
Note: Addresses are switching at 1 MHz.
Figure 9.
ICC1 Current vs. Time (Showing Active and Automatic Sleep Currents)
20
3.6 V
Supply Current in mA
16
2.7 V
12
8
4
0
1
2
3
4
5
Frequency in MHz
Note: T = 25 °C
Figure 10.
October 2, 2003
Typical ICC1 vs. Frequency
Am29PL320D
33
TEST CONDITIONS
Table 16.
Test Specifications
3.3 V
Test Condition
2.7 kΩ
Device
Under
Test
CL
6.2 kΩ
All speeds
Output Load
1 TTL gate
Output Load Capacitance, CL
(including jig capacitance)
30
pF
Input Rise and Fall Times
5
ns
0.0–3.0
V
Input timing measurement
reference levels
1.5
V
Output timing measurement
reference levels
1.5
V
Input Pulse Levels
Note: Diodes are IN3064 or equivalent
Figure 11.
Unit
Test Setup
KEY TO SWITCHING WAVEFORMS
WAVEFORM
INPUTS
OUTPUTS
Steady
Changing from H to L
Changing from L to H
3.0 V
Input
Don’t Care, Any Change Permitted
Changing, State Unknown
Does Not Apply
Center Line is High Impedance State (High Z)
1.5 V
Measurement Level
1.5 V
Output
0.0 V
Figure 12.
34
Input Waveforms and Measurement Levels
Am29PL320D
October 2, 2003
AC CHARACTERISTICS
Read Operations
Parameter
Speed Options
JEDEC
Std
Description
tAVAV
tRC
Read Cycle Time
tAVQV
tACC
Address Access Time
tELQV
tCE
Chip Enable to Output Delay
tPACC
Test Setup
60R
70R, 70
90
Unit
Min
60
70
90
ns
CE#=VIL,
OE#=VIL
Max
60
70
90
ns
OE#=VIL
Max
60
70
90
ns
Page Access Time
Max
20
25
35
ns
20
25
35
ns
tGLQV
tOE
Output Enable to Output Valid
Max
tEHQZ
tDF
Chip Enable to Output High Z
Max
16
ns
tGHQZ
tDF
Output Enable to Output High Z
Max
16
ns
Read
0
ns
Toggle and
Data# Polling
10
ns
0
ns
tAXQX
tOEH
Output Enable
Hold Time (Note 1)
tOH
Output Hold Time From Addresses, OE#
or CE#, Whichever Occurs First (Note 1)
Min
Notes:
1. Not 100% tested.
2. See Figure 11 and Table 16 for test specifications.
October 2, 2003
Am29PL320D
35
AC CHARACTERISTICS
tRC
Addresses Stable
Addresses
tACC
CE#
tDF
tOE
OE#
tOEH
WE#
tCE
tOH
HIGH Z
HIGH Z
Output Valid
Outputs
0V
Figure 13.
Conventional Read Operations Timings
Same Page
A19-A3
A2-A-1
Aa
Ab
tPACC
tACC
Data Bus
Qa
Ad
Ac
tPACC
Qb
tPACC
Qc
Qd
CE#
Note: Double Word Configuration: Toggle A2, A1, A0. Word Configuration: Toggle A2, A1, A0, A-1.
Figure 14.
36
Page Read Timings
Am29PL320D
October 2, 2003
AC CHARACTERISTICS
Double Word/Word Configuration (WORD#)
Parameter
JEDEC
Std
Speed Options
Description
60R
70R, 70
90
Unit
tELFL/tELFH
CE# to WORD# Switching Low or High
Max
5
ns
tFLQZ
WORD# Switching Low to Output HIGH Z
Max
16
ns
tFHQV
WORD# Switching High to Output Active
Min
60
70
90
ns
CE#
OE#
WORD#
WORD#
Switching
from double
word to word
mode
tELFL
Data Output
(DQ30–DQ0)
DQ30–DQ0
Address
Input
DQ31
Output
DQ31/A-1
Data Output
(DQ15–DQ0)
tFLQZ
tELFH
WORD#
WORD#
Switching
from word to
double word
mode
Data Output
(DQ15–DQ0)
DQ30–DQ0
Address
Input
DQ31/A-1
Data Output
(DQ30–DQ0)
DQ15
Output
tFHQV
Figure 15.
WORD# Timings for Read Operations
CE#
The falling edge of the last WE# signal
WE#
WORD#
tSET
(tAS)
tHOLD (tAH)
Note: Refer to the Erase/Program Operations table for tAS and tAH specifications.
Figure 16.
October 2, 2003
WORD# Timings for Write Operations
Am29PL320D
37
AC CHARACTERISTICS
Program/Erase Operations
Parameter
Speed Options
Unit
JEDEC
Std
Description
60R
70R, 70
90
tAVAV
tWC
Write Cycle Time (Note 1)
Min
60
70
90
tAVWL
tAS
Address Setup Time
Min
tWLAX
tAH
Address Hold Time
Min
35
45
45
ns
tDVWH
tDS
Data Setup Time
Min
30
35
45
ns
tWHDX
tDH
Data Hold Time
Min
0
ns
tOES
Output Enable Setup Time
Min
0
ns
Read Recovery Time Before Write
(OE# High to WE# Low)
Min
0
ns
0
ns
ns
tGHWL
tGHWL
tELWL
tCS
CE# Setup Time
Min
0
ns
tWHEH
tCH
CE# Hold Time
Min
0
ns
tWLWH
tWP
Write Pulse Width
Min
35
35
35
ns
tWHWL
tWPH
Write Pulse Width High
Min
25
30
30
ns
tWHWH1
tWHWH1
Programming Operation (Note 2)
tWHWH2
tWHWH2
tVCS
Word
Typ
14.3
µs
Double
Word
Typ
18.3
Sector Erase Operation (Note 2)
Typ
5
sec
VCC Setup Time (Note 1)
Min
50
µs
Notes:
1. Not 100% tested.
2. See the “Erase and Programming Performance” section for more information.
38
Am29PL320D
October 2, 2003
AC CHARACTERISTICS
Program Command Sequence (last two cycles)
tAS
tWC
Addresses
555h
Read Status Data (last two cycles)
PA
PA
PA
tAH
CE#
tCH
tGHWL
OE#
tWHWH1
tWP
WE#
tWPH
tCS
tDS
tDH
A0h
Data
PD
Status
DOUT
tVCS
VCC
Notes:
1. PA = program address, PD = program data, DOUT is the true data at the program address.
2. Illustration shows device in word mode.
Figure 17.
October 2, 2003
Program Operation Timings
Am29PL320D
39
AC CHARACTERISTICS
Erase Command Sequence (last two cycles)
tAS
tWC
2AAh
Addresses
Read Status Data
VA
SA
VA
555h for chip erase
tAH
CE#
tGHWL
tCH
OE#
tWP
WE#
tWPH
tCS
tWHWH2
tDS
tDH
Data
55h
In
Progress
30h
Complete
10 for Chip Erase
tVCS
VCC
Notes:
1. SA = sector address (for Sector Erase), VA = Valid Address for reading status data (see “Write Operation Status”).
2. Illustration shows device in word mode.
Figure 18.
AC Waveforms for Chip/Sector Erase Operations
tRC
Addresses
VA
VA
VA
tACC
tCE
CE#
tCH
tOE
OE#
tOEH
tDF
WE#
tOH
High Z
DQ7
Complement
Complement
DQ6–DQ0
Status Data
Status Data
True
Valid Data
High Z
True
Valid Data
Note: VA = Valid address. Illustration shows first status cycle after command sequence, last status read cycle, and array data
read cycle
Figure 19.
40
Data# Polling Timings (During Embedded Algorithms)
Am29PL320D
October 2, 2003
AC CHARACTERISTICS
tRC
Addresses
VA
VA
VA
VA
tACC
tCE
CE#
tCH
tOE
OE#
tOEH
tDF
WE#
tOH
DQ6/DQ2
High Z
Valid Status
Valid Status
(first read)
(second read)
Valid Status
Valid Data
(stops toggling)
Note: VA = Valid address; not required for DQ6. Illustration shows first two status cycle after command sequence, last status read
cycle, and array data read cycle
Figure 20.
Enter
Embedded
Erasing
WE#
Erase
Suspend
Erase
Toggle Bit Timings (During Embedded Algorithms)
Enter Erase
Suspend Program
Erase Suspend
Read
Erase
Suspend
Program
Erase
Resume
Erase Suspend
Read
Erase
Erase
Complete
DQ6
DQ2
Note: The system may use CE# or OE# to toggle DQ2 and DQ6. DQ2 toggles only when read at an address within an
erase-suspended sector.
Figure 21. DQ2 vs. DQ6 for Erase and
Erase Suspend Operations
October 2, 2003
Am29PL320D
41
AC CHARACTERISTICS
Alternate CE# Controlled
Erase/Program Operations
Parameter
Speed Options
JEDEC
Std
Description
tAVAV
tWC
Write Cycle Time (Note 1)
Min
tAVEL
tAS
Address Setup Time
Min
tELAX
tAH
Address Hold Time
Min
35
45
45
ns
tDVEH
tDS
Data Setup Time
Min
30
35
45
ns
tEHDX
tDH
Data Hold Time
Min
0
ns
tOES
Output Enable Setup Time
Min
0
ns
tGHEL
tGHEL
Read Recovery Time Before Write
(OE# High to WE# Low)
Min
0
ns
tWLEL
tWS
WE# Setup Time
Min
0
ns
tEHWH
tWH
WE# Hold Time
Min
0
ns
tELEH
tCP
CE# Pulse Width
Min
tEHEL
tCPH
CE# Pulse Width High
Min
30
Word
Typ
14.3
Double
Word
Typ
18.3
Typ
5
tWHWH1
tWHWH1
Programming Operation
(Note 2)
tWHWH2
tWHWH2
Sector Erase Operation (Note 2)
60R
70R, 70
90
Unit
60
70
90
ns
0
25
30
ns
35
ns
ns
µs
sec
Notes:
1. Not 100% tested.
2. See the “Erase and Programming Performance” section for more information.
42
Am29PL320D
October 2, 2003
AC CHARACTERISTICS
PA for program
SA for sector erase
555 for chip erase
555 for program
2AA for erase
Data# Polling
Addresses
PA
tWC
tAS
tAH
tWH
WE#
tGHEL
OE#
tWHWH1 or 2
tCP
CE#
tWS
tCPH
tDS
tDH
DQ7#
Data
A0 for program
55 for erase
DOUT
PD for program
30 for sector erase
10 for chip erase
Notes:
1. PA = program address, PD = program data, DQ7# = complement of the data written to the device, DOUT = data written to the
device.
2. Figure indicates the last two bus cycles of the command sequence.
3. Word mode address used as an example.
Figure 22.
October 2, 2003
Alternate CE# Controlled Write Operation Timings
Am29PL320D
43
ERASE AND PROGRAMMING PERFORMANCE
Typ
(Note 1)
Max
(Note 2)
Unit
2
60
s
Sector Erase Time, 8 and 16 KByte sector
0.5
60
Chip Erase Time
33.5
Word Programming Time
14.3
300
µs
Double Word Programming Time
18.3
360
µs
Word Mode
28
84
s
Double Word
Mode
18
54
s
Parameter
Sector Erase Time, 96 and 128 KByte
sector
Chip Programming Time
(Note 3)
Comments
Excludes 00h programming
prior to erasure (Note 4)
s
Excludes system level
overhead (Note 5)
Notes:
1. Typical program and erase times assume the following conditions: 25°C, 3.0 V VCC, 1,000,000 cycles. Additionally,
programming typicals assume checkerboard pattern.
2. Under worst case conditions of 90°C, VCC = 2.7 V, 1,000,000 cycles.
3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most words
program faster than the maximum program times listed.
4. In the pre-programming step of the Embedded Erase algorithm, all words are programmed to 00h before erasure.
5. System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. See
Table 13 for further information on command definitions.
6. The device has a minimum erase and program cycle endurance of 1,000,000 cycles.
LATCHUP CHARACTERISTICS
Description
Min
Max
Input voltage with respect to VSS on all inputs except I/O inputs
(including A9 and OE#)
–1.0 V
12.5 V
Input voltage with respect to VSS on all I/O inputs
–1.0 V
VCC + 1.0 V
–100 mA
+100 mA
VCC Current
Includes all inputs except VCC. Test conditions: VCC = 3.0 V, one input at a time.
DATA RETENTION
Parameter
Test Conditions
Min
Unit
150°C
10
Years
125°C
20
Years
Minimum Pattern Data Retention Time
* For reference only. BSC is an ANSI standard for Basic Space Centering.
44
Am29PL320D
October 2, 2003
BGA PACKAGE CAPACITANCE
Parameter Symbol
Parameter Description
Test Setup
Typ
Max
Unit
CIN
Input Capacitance
VIN = 0
4.2
5.0
pF
COUT
Output Capacitance
VOUT = 0
5.4
6.5
pF
CIN2
Control Pin Capacitance
VIN = 0
3.9
4.7
pF
Notes:
1. Sampled, not 100% tested.
2. Test conditions TA = 25°C, f = 1.0 MHz.
October 2, 2003
Am29PL320D
45
PHYSICAL DIMENSIONS
FBF084—84-Ball Fine Pitch Ball Grid Array (FBGA) 11 x 12 mm
Dwg. Rev. AB-01; 7/00
46
Am29PL320D
October 2, 2003
REVISION SUMMARY
Revision A (March 7, 2001)
Revision C (October 22, 2002)
Initial release.
Global
Deleted preliminary status from data sheet.
Revision B (June 12, 2001)
Distinctive Characteristics
Global
Clarified endurance specification from “write cycles” to
“erase cycles.”
Added 70R speed option.
Changed data sheet status from Advance Information
to Preliminary.
Distinctive Characteristics
SecSi™ (Secured Silicon) Sector Flash
Memory Region
SecSi Sector: Added note to future compatibility.
Added text and figure on SecSi Sector Protect Verify
function.
Power Consumption: Replaced stated maximum values with typical values.
Command Definitions
General Description
Modified first paragraph to indicate device behavior
when incorrect data or commands are written.
Added section on SecSi Sector.
DC Characteristics
SecSi™ (Secured Silicon) Sector Flash
Memory Region
Changed VIL maximum specification. Changed V CC
test condition for VID parameter.
Added note to indicate sector size and erase functionality for future devices.
BGA Ball Capacitance
DC Characteristics
Added table.
Added typical values for ICC1–ICC5 to table. Corrected
VIN test condition specification to VCC.
Revision C+1 (July 21, 2003)
Figure 10, Typical ICC1 vs. Frequency
Changed URL for CFI publications.
Changed scale on Y-axis to 4 mA divisions.
Common Flash Interface (CFI)
Command Definitions
Added the phrase “in the improper sequence” to cautionary text in first paragraph.
Revision B+1 (August 30, 2001)
Autoselect Command Sequence
Modified section to point to appropriate tables for autoselect functions.
Accelerated Program Operation
Specified a voltage range for VHH.
Erase and Programming Performance
Changed typical sector erase time and typical chip
erase time. Added typical and maximum sector erase
times pertaining to 8 and 16 Kword sectors.
Revision C+2 (October 2, 2003)
Table 13, Command Definitions
Corrected the autoselect device ID command sequence. The device ID is read in cycles 4, 5, and 6 of a
single command sequence, not as three separate
command sequences as previously shown. Separated
the word and double word command sequences into
two tables for easier reference.
DC Characteristics
Erase Suspend/Erase Resume Commands
Modified text to “Note that unlock bypass programming
is not allowed when the device is erase-suspended” in
the third paragraph.
AC Characteristics - Double Word/Word
Configuration (WORD#) diagram
Modified all instances of DQ14 to DQ30, DQ7 to
DQ15, and DQ15 to DQ31.
Added VHH parameter to table.
Trademarks
Copyright © 2003 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
ExpressFlash is a trademark of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
October 2, 2003
Am29PL320D
47
Representatives in U.S. and Canada
Sales Offices and Representatives
North America
ALABAMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 2 5 6 ) 8 3 0 - 9 1 9 2
ARIZONA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 6 0 2 ) 24 2 - 4 4 0 0
CALIFORNIA,
Irvine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 4 9 ) 4 5 0 - 7 5 0 0
Sunnyvale . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 4 0 8 ) 7 3 2 - 24 0 0
COLORADO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 3 0 3 ) 74 1 - 2 9 0 0
CONNECTICUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 2 0 3 ) 2 6 4 - 7 8 0 0
FLORIDA,
Clearwater . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 2 7 ) 7 9 3 - 0 0 5 5
Miami (Lakes) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 3 0 5 ) 8 2 0 - 1 1 1 3
GEORGIA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 7 0 ) 8 1 4 - 0 2 2 4
ILLINOIS,
Chicago . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 6 3 0 ) 7 7 3 - 4 4 2 2
MASSACHUSETTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 8 1 ) 2 1 3 - 6 4 0 0
MICHIGAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 2 4 8 ) 4 7 1 - 6 2 9 4
MINNESOTA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 6 1 2 ) 74 5 - 0 0 0 5
NEW JERSEY,
Chatham . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 7 3 ) 7 0 1 - 1 7 7 7
NEW YORK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 1 6 ) 4 2 5 - 8 0 5 0
NORTH CAROLINA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 1 9 ) 8 4 0 - 8 0 8 0
OREGON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 5 0 3 ) 24 5 - 0 0 8 0
PENNSYLVANIA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 2 1 5 ) 3 4 0 - 1 1 8 7
SOUTH DAKOTA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 6 0 5 ) 69 2 - 5 7 7 7
TEXAS,
Austin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 5 1 2 ) 3 4 6 - 7 8 3 0
Dallas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 7 2 ) 9 8 5 - 1 3 4 4
Houston . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 2 8 1 ) 3 76 - 8 0 8 4
VIRGINIA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 0 3 ) 7 3 6 - 9 5 6 8
International
AUSTRALIA, North Ryde . . . . . . . . . . . . . . . . . . . . . . . T E L ( 6 1 ) 2 - 8 8 - 7 7 7 - 2 2 2
BELGIUM, Antwerpen . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 3 2 ) 3 - 2 4 8 - 4 3 - 0 0
BRAZIL, San Paulo . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 5 5 ) 1 1 - 5 5 0 1 - 2 1 0 5
CHINA,
Beijing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 6 ) 1 0 - 6 5 1 0 - 2 1 8 8
Shanghai . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 6 ) 2 1 - 6 3 5 - 0 0 8 3 8
Shenzhen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 6 ) 7 5 5 - 24 6 - 1 5 5 0
FINLAND, Helsinki . . . . . . . . . . . . . . . . . . . . . . T E L ( 3 5 8 ) 8 8 1 - 3 1 1 7
FRANCE, Paris . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 3 3 ) - 1 - 4 9 7 5 1 0 1 0
GERMANY,
Bad Homburg . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 4 9 ) - 6 1 7 2 - 9 2 6 7 0
Munich . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 4 9 ) - 8 9 - 4 5 0 5 3 0
HONG KONG, Causeway Bay . . . . . . . . . . . . . . . . . . . T E L ( 8 5 ) 2 - 2 9 5 6 - 0 3 8 8
ITALY, Milan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 3 9 ) - 0 2 - 3 8 1 9 6 1
INDIA, New Delhi . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 9 1 ) 1 1 - 6 2 3 - 8 6 2 0
JAPAN,
Osaka . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 1 ) 6 - 6 2 4 3 - 3 2 5 0
Tokyo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 1 ) 3 - 3 3 4 6 - 7 6 0 0
KOREA, Seoul . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 2 ) 2 - 3 4 6 8 - 2 6 0 0
RUSSIA, Moscow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(7)-095-795-06-22
SWEDEN, Stockholm . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 4 6 ) 8 - 5 62 - 5 4 0 - 0 0
TAIWAN,Taipei . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 8 6 ) 2 - 8 7 7 3 - 1 5 5 5
UNITED KINGDOM,
Frimley . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 4 4 ) 1 2 7 6 - 8 0 3 1 0 0
Haydock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 4 4 ) 1 9 4 2 - 2 7 2 8 8 8
Advanced Micro Devices reserves the right to make changes in its product without notice
in order to improve design or performance characteristics.The performance
characteristics listed in this document are guaranteed by specific tests, guard banding,
design and other practices common to the industry. For specific testing details, contact
your local AMD sales representative.The company assumes no responsibility for the use of
any circuits described herein.
© Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD Arrow logo and combination thereof, are trademarks of
Advanced Micro Devices, Inc. Other product names are for informational purposes only
and may be trademarks of their respective companies.
es
ARIZONA,
Tempe - Centaur . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 4 8 0 ) 8 3 9 - 2 3 2 0
CALIFORNIA,
Calabasas - Centaur . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 8 1 8 ) 8 7 8 - 5 8 0 0
Irvine - Centaur . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 4 9 ) 2 6 1 - 2 1 2 3
San Diego - Centaur. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 8 5 8 ) 2 7 8 - 4 9 5 0
Santa Clara - Fourfront. . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 4 0 8 ) 3 5 0 - 4 8 0 0
CANADA,
Burnaby, B.C. - Davetek Marketing. . . . . . . . . . . . . . . . . . . . ( 6 0 4 ) 4 3 0 - 3 6 8 0
Calgary, Alberta - Davetek Marketing. . . . . . . . . . . . . . . . . ( 4 0 3 ) 2 8 3 - 3 5 7 7
Kanata, Ontario - J-Squared Tech. . . . . . . . . . . . . . . . . . . . ( 6 1 3 ) 5 9 2 - 9 5 4 0
Mississauga, Ontario - J-Squared Tech. . . . . . . . . . . . . . . . . . ( 9 0 5 ) 6 7 2 - 2 0 3 0
St Laurent, Quebec - J-Squared Tech. . . . . . . . . . . . . . . . ( 5 1 4 ) 7 4 7 - 1 2 1 1
COLORADO,
Golden - Compass Marketing . . . . . . . . . . . . . . . . . . . . . . ( 3 0 3 ) 2 7 7 - 0 4 5 6
FLORIDA,
Melbourne - Marathon Technical Sales . . . . . . . . . . . . . . . . ( 3 2 1 ) 7 2 8 - 7 7 0 6
Ft. Lauderdale - Marathon Technical Sales . . . . . . . . . . . . . . ( 9 5 4 ) 5 2 7 - 4 9 4 9
Orlando - Marathon Technical Sales . . . . . . . . . . . . . . . . . . ( 4 0 7 ) 8 7 2 - 5 7 7 5
St. Petersburg - Marathon Technical Sales . . . . . . . . . . . . . . ( 7 2 7 ) 8 9 4 - 3 6 0 3
GEORGIA,
Duluth - Quantum Marketing . . . . . . . . . . . . . . . . . . . . . ( 6 7 8 ) 5 8 4 - 1 1 2 8
ILLINOIS,
Skokie - Industrial Reps, Inc. . . . . . . . . . . . . . . . . . . . . . . . . ( 8 4 7 ) 9 6 7 - 8 4 3 0
INDIANA,
Kokomo - SAI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 6 5 ) 4 5 7 - 7 2 4 1
IOWA,
Cedar Rapids - Lorenz Sales . . . . . . . . . . . . . . . . . . . . . . ( 3 1 9 ) 2 9 4 - 1 0 0 0
KANSAS,
Lenexa - Lorenz Sales . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 1 3 ) 4 6 9 - 1 3 1 2
MASSACHUSETTS,
Burlington - Synergy Associates . . . . . . . . . . . . . . . . . . . . . ( 7 8 1 ) 2 3 8 - 0 8 7 0
MICHIGAN,
Brighton - SAI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 8 1 0 ) 2 2 7 - 0 0 0 7
MINNESOTA,
St. Paul - Cahill, Schmitz & Cahill, Inc. . . . . . . . . . . . . . . . . . ( 6 5 1 ) 69 9 - 0 2 0 0
MISSOURI,
St. Louis - Lorenz Sales . . . . . . . . . . . . . . . . . . . . . . . . . . ( 3 1 4 ) 9 9 7 - 4 5 5 8
NEW JERSEY,
Mt. Laurel - SJ Associates . . . . . . . . . . . . . . . . . . . . . . . . . ( 8 5 6 ) 8 6 6 - 1 2 3 4
NEW YORK,
Buffalo - Nycom, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 1 6 ) 7 4 1 - 7 1 1 6
East Syracuse - Nycom, Inc. . . . . . . . . . . . . . . . . . . . . . . ( 3 1 5 ) 4 3 7 - 8 3 4 3
Pittsford - Nycom, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 1 6 ) 5 8 6 - 3 6 6 0
Rockville Centre - SJ Associates . . . . . . . . . . . . . . . . . . . . ( 5 1 6 ) 5 3 6 - 4 2 4 2
NORTH CAROLINA,
Raleigh - Quantum Marketing . . . . . . . . . . . . . . . . . . . . . . ( 9 1 9 ) 8 4 6 - 5 7 2 8
OHIO,
Middleburg Hts - Dolfuss Root & Co. . . . . . . . . . . . . . . . . ( 4 4 0 ) 8 1 6 - 1 6 6 0
Powell - Dolfuss Root & Co. . . . . . . . . . . . . . . . . . . . . . . ( 6 1 4 ) 7 8 1 - 0 7 2 5
Vandalia - Dolfuss Root & Co. . . . . . . . . . . . . . . . . . . . . . ( 9 3 7 ) 8 9 8 - 9 6 1 0
Westerville - Dolfuss Root & Co. . . . . . . . . . . . . . . . . . . ( 6 1 4 ) 5 2 3 - 1 9 9 0
OREGON,
Lake Oswego - I Squared, Inc. . . . . . . . . . . . . . . . . . . . . . . ( 5 0 3 ) 6 7 0 - 0 5 5 7
UTAH,
Murray - Front Range Marketing . . . . . . . . . . . . . . . . . . . . ( 8 0 1 ) 2 8 8 - 2 5 0 0
VIRGINIA,
Glen Burnie - Coherent Solution, Inc. . . . . . . . . . . . . . . . . ( 4 1 0 ) 7 6 1 - 2 2 5 5
WASHINGTON,
Kirkland - I Squared, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . ( 4 2 5 ) 8 2 2 - 9 2 2 0
WISCONSIN,
Pewaukee - Industrial Representatives . . . . . . . . . . . . . . . . ( 2 6 2 ) 5 74 - 9 3 9 3
Representatives in Latin America
ARGENTINA,
Capital Federal Argentina/WW Rep. . . . . . . . . . . . . . . . . . . .54-11)4373-0655
CHILE,
Santiago - LatinRep/WWRep. . . . . . . . . . . . . . . . . . . . . . . . . .(+562)264-0993
COLUMBIA,
Bogota - Dimser. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 5 7 1 ) 4 1 0 - 4 1 8 2
MEXICO,
Guadalajara - LatinRep/WW Rep. . . . . . . . . . . . . . . . . . . . ( 5 2 3 ) 8 1 7 - 3 9 0 0
Mexico City - LatinRep/WW Rep. . . . . . . . . . . . . . . . . . . . ( 5 2 5 ) 7 5 2 - 2 7 2 7
Monterrey - LatinRep/WW Rep. . . . . . . . . . . . . . . . . . . . . ( 5 2 8 ) 3 69 - 6 8 2 8
PUERTO RICO,
Boqueron - Infitronics. . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 8 7 ) 8 5 1 - 6 0 0 0
One AMD Place, P.O. Box 3453, Sunnyvale, CA 94088-3453 408-732-2400
TWX 910-339-9280 TELEX 34-6306 800-538-8450 http://www.amd.com
©2003 Advanced Micro Devices, Inc.
01/03
Printed in USA
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