2DD1621T NPN SURFACE MOUNT TRANSISTOR Please click here to visit our online spice models database. NEW PRODUCT Features • • • • • Epitaxial Planar Die Construction Ideally Suited for Automated Assembly Processes Ideal for Medium Power Switching or Amplification Applications Lead Free By Design/RoHS Compliant (Note 1) "Green" Device (Note 2) Mechanical Data • • • • • • • SOT89-3L Case: SOT89-3L Case Material: Molded Plastic, "Green” Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020D Terminals: Finish — Matte Tin annealed over Copper leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 Marking Information: See Page 3 Ordering Information: See Page 3 Weight: 0.072 grams (approximate) Maximum Ratings COLLECTOR 2,4 3 E C 4 2 C 1 BASE 1 B 3 EMITTER Schematic and Pin Configuration TOP VIEW @TA = 25°C unless otherwise specified Characteristic Symbol VCBO VCEO VEBO IC Value 30 25 6.0 2.0 Unit V V V A Characteristic Power Dissipation (Note 3) @ TA = 25°C Thermal Resistance, Junction to Ambient Air (Note 3) @TA = 25°C Symbol PD RθJA Value 1 125 Unit W °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Thermal Characteristics Electrical Characteristics Characteristic OFF CHARACTERISTICS (Note 4) Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage Emitter-Base Breakdown Voltage Collector-Base Cutoff Current Emitter-Base Cutoff Current ON CHARACTERISTICS (Note 4) DC Current Gain Collector-Emitter Saturation Voltage Base-Emitter Saturation Voltage SMALL SIGNAL CHARACTERISTICS Current Gain-Bandwidth Product Output Capacitance SWITCHING CHARACTERISTICS Turn On Time Storage Time Fall Time Notes: 1. 2. 3. 4. @TA = 25°C unless otherwise specified Symbol Min Typ Max Unit V(BR)CBO V(BR)CEO V(BR)EBO ICBO IEBO 30 25 6.0 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 100 100 V V V nA nA IC = 10μA, IE = 0 IC = 1mA, IB = 0 IC = 10μA, IC = 0 VCB = 20V, IE = 0 VEB = 4.0V, IC = 0 hFE 200 65 ⎯ ⎯ 400 ⎯ 0.4 1.2 ⎯ VCE(SAT) VBE(SAT) ⎯ ⎯ 0.12 0.9 VCE = 2.0V, IC = 0.1A VCE = 2.0V, IC = 1.5A IC = 1.5A, IB = 75mA IC = 1.5A, IB = 75mA fT ⎯ 300 ⎯ MHz Cobo ⎯ 16 ⎯ pF ton tstg tf ⎯ ⎯ ⎯ 70 170 25 ⎯ ⎯ ⎯ ns ns ns V V Test Conditions VCE = 10V, IC = 50mA, f = 100MHz VCB = 10V, IE = 0, f = 1MHz VCE = 12V, VBE = 5V, IB1 = IB2 = 25mA, IC = 500mA No purposefully added lead. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php. Device mounted on FR-4 PCB; pad layout as shown on page 4 or in Diodes Inc. suggested pad layout document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. Measured under pulsed conditions. Pulse width = 300μs. Duty cycle ≤2%. DS31240 Rev. 2 - 2 1 of 4 www.diodes.com 2DD1621T © Diodes Incorporated 3.0 PD, POWER DISSIPATION (W) NEW PRODUCT 1.0 2.5 0.8 2.0 0.6 1.5 0.4 1.0 0.2 RθJA = 125°C/W 0.5 0 0 0 25 50 100 125 75 TA, AMBIENT TEMPERATURE (°C) Fig. 1 Power Dissipation vs. Ambient Temperature (Note 3) 150 0.3 600 500 VCE = 2V IC/IB = 20 0.25 TA = 150°C 0.2 400 T A = 85°C 300 0.15 TA = 25°C 100 TA = 150°C 0.1 200 TA = 25°C 0.05 TA = -55°C 0 0.001 TA = 85°C T A = -55°C 0.01 0.1 1 10 0 0.001 0.01 0.1 1 10 VCE = 2V T A = -55°C TA = -55°C TA = 25°C T A = 25°C TA = 85°C TA = 85°C TA = 150°C TA = 150°C 0.001 DS31240 Rev. 2 - 2 IC/IB = 20 0.01 0.1 1 10 2 of 4 www.diodes.com 0.001 0.01 0.1 1 10 2DD1621T © Diodes Incorporated 400 NEW PRODUCT 300 Cibo 200 VCE = 10V f = 100MHz 100 Cobo 0 0.1 1 10 100 0 10 20 30 40 50 60 70 80 90 100 IC, COLLECTOR CURRENT (mA) Fig. 8 Typical Gain-Bandwidth Product vs. Collector Current Ordering Information (Note 5) Device 2DD1621T-13 Notes: 5. Packaging SOT89-3L Shipping 2500/Tape & Reel For packaging details, go to our website at http://www.diodes.com/ap02007.pdf. Marking Information (Top View) N22T = Product Type Marking Code YWW = Date Code Marking Y = Last digit of year ex: 7 = 2007 WW = Week code 01 - 52 YWW N22T Package Outline Dimensions 0 20 0. R D1 SOT89-3L C E H L B B1 8° e (4X ) A Min Max Typ A 1.40 1.60 1.50 0.50 B 0.45 0.55 B1 0.37 0.47 0.42 C 0.35 0.43 0.38 D 4.40 4.60 4.50 D1 1.50 1.70 1.60 E 2.40 2.60 2.50 e — — 1.50 H 3.95 4.25 4.10 L 0.90 1.20 1.05 All Dimensions in mm D DS31240 Rev. 2 - 2 Dim 3 of 4 www.diodes.com 2DD1621T © Diodes Incorporated Suggested Pad Layout NEW PRODUCT 1.7 2.7 0.4 1.9 1.3 0.9 3.0 Unit: mm IMPORTANT NOTICE Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages. LIFE SUPPORT Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated. DS31240 Rev. 2 - 2 4 of 4 www.diodes.com 2DD1621T © Diodes Incorporated