14-Bit, 250MSPS/200MSPS/130MSPS ADC ISLA214P Features The ISLA214P is a series of low power, high performance 14-bit analog-to-digital converters. Designed with Intersil’s proprietary FemtoCharge™ technology on a standard CMOS process, the series supports sampling rates of up to 250MSPS. The ISLA214P is part of a pin-compatible family of 12 to 16-bit A/Ds with maximum sample rates ranging from 130MSPS to 500MSPS. • Single supply 1.8V operation A serial peripheral interface (SPI) port allows for extensive configurability, as well as fine control of various parameters, such as gain and offset. Digital output data is presented in selectable LVDS or CMOS formats, and can be configured as full-width, single data rate (SDR) or half-width, double data rate (DDR). The ISLA214P is available in a 72-contact QFN package with an exposed paddle. Operating from a 1.8V supply, performance is specified over the full industrial temperature range (-40°C to +85°C). DIGITAL ERROR CORRECTION SPI CONTROL 1 • Data output clock • SDR/DDR LVDS-compatible or LVCMOS outputs • Broadband communications • High-performance data acquisition • Communications test equipment MODEL RESOLUTION SPEED (MSPS) ISLA216P25 16 250 ISLA216P20 16 200 CLKOUTP ISLA216P13 16 130 CLKOUTN ISLA214P50 14 500 ISLA214P25 14 250 ISLA214P20 14 200 D[13:0]N ISLA214P13 14 130 ISLA212P50 12 500 ISLA212P25 12 250 ISLA212P20 12 200 ISLA212P13 12 130 OVSS RESETN NAPSLP AVSS December 5, 2012 FN7572.2 - SPI programmable fine gain and offset control - Support for multiple ADC synchronization - Optimized output timing • Nap and sleep modes - 200µs sleep wake-up time • Software defined radios D[13:0]P RLVDS + – VCM CSB SCLK SDIO SDO SHA VINN • Multi-ADC support • Radar array processing OVDD CLKDIVRSTN CLKDIVRSTP CLKDIV AVDD 14-BIT 250 MSPS ADC • Programmable built-in test patterns Pin-Compatible Family CLOCK MANAGEMENT VINP • 700MHz bandwidth Applications • SNR @ 250/200/130MSPS 73.0/73.8/74.9dBFS fIN = 30MHz 70.6/71.1/70.9dBFS fIN = 363MHz • SFDR @ 250/200/130MSPS 82/88/88dBc fIN = 30MHz 78/82/84dBc fIN = 363MHz • Total Power Consumption = 480mW @ 250MSPS CLKN • 75fs clock jitter • Selectable clock divider Key Specifications CLKP • Clock duty cycle stabilizer CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2011, 2012. All Rights Reserved Intersil (and design) and FemtoCharge are trademarks owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. ISLA214P Pin Configuration - LVDS MODE AVDD AVDD AVDD SDIO SCLK CSB SDO OVSS ORP ORN OVDD OVSS D0P D0N D1P D1N D2P D2N ISLA214P (72 LD QFN) TOP VIEW 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 DNC 1 54 D3P DNC 2 53 D3N NAPSLP 3 52 D4P VCM 4 51 D4N AVSS 5 50 D5P AVDD 6 49 D5N AVSS 7 48 CLKOUTP VINN 8 47 CLKOUTN VINN 9 46 RLVDS VINP 10 45 OVSS VINP 11 44 D6P AVSS 12 43 D6N AVDD 13 42 D7P AVSS 14 41 D7N CLKDIV 15 40 D8P IPTAT 16 39 D8N Thermal Pad Not Drawn to Scale, Consult Mechanical Drawing for Physical Dimensions DNC 17 Connect Thermal Pad to AVSS 38 D9P RESETN 18 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 AVDD CLKP CLKN CLKDIVRSTP CLKDIVRSTN OVSS OVDD D13N D13P D12N D12P OVDD D11N D11P D10N D10P AVDD 19 AVDD 37 D9N 2 FN7572.2 December 5, 2012 ISLA214P Pin Descriptions - 72 Ld QFN, LVDS Mode PIN NUMBER LVDS PIN NAME LVDS PIN FUNCTION 1, 2, 17 DNC Do Not Connect 6, 13, 19, 20, 21, 70, 71, 72 AVDD 1.8V Analog Supply 5, 7, 12, 14 AVSS Analog Ground 27, 32, 62 OVDD 1.8V Output Supply 26, 45, 61, 65 OVSS Output Ground 3 NAPSLP 4 VCM Common Mode Output 8, 9 VINN Analog Input Negative DDR MODE COMMENTS Tri-Level Power Control (Nap, Sleep modes) 10, 11 VINP 15 CLKDIV Analog Input Positive 16 IPTAT 18 RESETN 22, 23 CLKP, CLKN 24, 25 CLKDIVRSTP, CLKDIVRSTN 28 D13N LVDS Bit 13(MSB) Output Complement NC in DDR Mode 29 D13P LVDS Bit 13 (MSB) Output True NC in DDR Mode 30 D12N LVDS Bit 12 Output Complement DDR Logical Bits 12, 13 31 D12P LVDS Bit 12 Output True DDR Logical Bits 12, 13 33 D11N LVDS Bit 11 Output Complement NC in DDR Mode 34 D11P LVDS Bit 11 Output True NC in DDR Mode 35 D10N LVDS Bit 10 Output Complement DDR Logical Bits 10, 11 36 D10P LVDS Bit 10 Output True DDR Logical Bits 10, 11 Tri-Level Clock Divider Control Temperature Monitor (Output current proportional to absolute temperature) Power On Reset (Active Low) Clock Input True, Complement Synchronous Clock Divider Reset True, Complement 37 D9N LVDS Bit 9 Output Complement NC in DDR Mode 38 D9P LVDS Bit 9 Output True NC in DDR Mode 39 D8N LVDS Bit 8 Output Complement DDR Logical Bits 8, 9 40 D8P LVDS Bit 8 Output True DDR Logical Bits 8, 9 41 D7N LVDS Bit 7 Output Complement NC in DDR Mode 42 D7P LVDS Bit 7 Output True NC in DDR Mode 43 D6N LVDS Bit 6 Output Complement DDR Logical Bits 6, 7 44 D6P LVDS Bit 6 Output True DDR Logical Bits 6, 7 46 RLVDS 47, 48 CLKOUTN, CLKOUTP LVDS Bias Resistor (Connect to OVSS with 1% 10kΩ) 49 D5N LVDS Bit 5 Output Complement NC in DDR Mode 50 D5P LVDS Bit 5 Output True NC in DDR Mode LVDS Clock Output Complement, True 51 D4N LVDS Bit 4 Output Complement DDR Logical Bits 4, 5 52 D4P LVDS Bit 4 Output True DDR Logical Bits 4, 5 53 D3N LVDS Bit 3 Output Complement NC in DDR Mode 54 D3P LVDS Bit 3 Output True NC in DDR Mode 55 D2N LVDS Bit 2 Output Complement DDR Logical Bits 2, 3 56 D2P LVDS Bit 2 Output True DDR Logical Bits 2, 3 57 D1N LVDS Bit 1 Output Complement NC in DDR Mode 3 FN7572.2 December 5, 2012 ISLA214P Pin Descriptions - 72 Ld QFN, LVDS Mode PIN NUMBER LVDS PIN NAME (Continued) LVDS PIN FUNCTION DDR MODE COMMENTS 58 D1P LVDS Bit 1 True NC in DDR Mode 59 D0N LVDS Bit 0 (LSB) Output Complement DDR Logical Bits 0, 1 60 D0P LVDS Bit 0 (LSB) Output True DDR Logical Bits 0, 1 63, 64 ORN, ORP LVDS Over Range Complement, True DDR Over Range 66 SDO SPI Serial Data Output 67 CSB SPI Chip Select (active low) 68 SCLK SPI Clock 69 SDIO SPI Serial Data Input/Output Exposed Paddle AVSS Analog Ground Pin Configuration - CMOS MODE AVDD AVDD AVDD SDIO SCLK CSB SDO OVSS OR DNC OVDD OVSS D0 DNC D1 DNC D2 DNC ISLA214P (72 LD QFN) TOP VIEW 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 DNC 1 54 D3 DNC 2 53 DNC NAPSLP 3 52 D4 VCM 4 51 DNC AVSS 5 50 D5 AVDD 6 49 DNC AVSS 7 48 CLKOUT VINN 8 47 DNC VINN 9 46 RLVDS VINP 10 45 OVSS VINP 11 44 D6 AVSS 12 43 DNC AVDD 13 42 D7 AVSS 14 41 DNC CLKDIV 15 40 D8 IPTAT 16 39 DNC Thermal Pad Not Drawn to Scale, Consult Mechanical Drawing for Physical Dimensions DNC 17 Connect Thermal Pad to AVSS 38 D9 RESETN 18 4 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 AVDD CLKP CLKN CLKDIVRSTP CLKDIVRSTN OVSS OVDD DNC D13 DNC D12 OVDD DNC D11 DNC D10 AVDD 19 AVDD 37 DNC FN7572.2 December 5, 2012 ISLA214P Pin Descriptions - 72 Ld QFN, CMOS Mode PIN NUMBER CMOS PIN NAME CMOS PIN FUNCTION 1, 2, 17, 28, 30, 33, 35, 37, 39, 41, 43, 47, 49, 51, 53, 55, 57, 59, 63 DNC Do Not Connect 6, 13, 19, 20, 21, 70, 71, 72 AVDD 1.8V Analog Supply 5, 7, 12, 14 AVSS Analog Ground 27, 32, 62 OVDD 1.8V Output Supply 26, 45, 61, 65 OVSS 3 NAPSLP 4 VCM Common Mode Output 8, 9 VINN Analog Input Negative 10, 11 VINP Analog Input Positive 15 CLKDIV 16 IPTAT 18 RESETN 22, 23 24, 25 CLKP, CLKN DDR MODE COMMENTS Output Ground Tri-Level Power Control (Nap, Sleep modes) Tri-Level Clock Divider Control Temperature Monitor (Output current proportional to absolute temperature) Power On Reset (Active Low) Clock Input True, Complement CLKDIVRSTP, CLKDIVRSTN Synchronous Clock Divider Reset True, Complement 29 D13 CMOS Bit 13 (MSB) Output NC in DDR Mode 31 D12 CMOS Bit 12 Output DDR Logical Bits 12, 13 34 D11 CMOS Bit 11 Output NC in DDR Mode 36 D10 CMOS Bit 10 Output DDR Logical Bits 10, 11 38 D9 CMOS Bit 9 Output NC in DDR Mode 40 D8 CMOS Bit 8 Output DDR Logical Bits 8, 9 42 D7 CMOS Bit 7 Output NC in DDR Mode 44 D6 CMOS Bit 6 Output DDR Logical Bits 6, 7 46 RLVDS LVDS Bias Resistor (connect to OVSS with 1% 10kΩ) 48 CLKOUT CMOS Clock Output 50 D5 CMOS Bit 5 Output NC in DDR Mode 52 D4 CMOS Bit 4 Output DDR Logical Bits 4, 5 54 D3 CMOS Bit 3 Output NC in DDR Mode 56 D2 CMOS Bit 2 Output DDR Logical Bits 2, 3 58 D1 CMOS Bit 1 Output NC in DDR Mode 60 D0 CMOS Bit 0 (LSB) Output DDR Logical Bits 0, 1 64 OR CMOS Over Range DDR Over Range 66 SDO SPI Serial Data Output 67 CSB SPI Chip Select (active low) 68 SCLK SPI Clock 69 SDIO SPI Serial Data Input/Output Exposed Paddle AVSS Analog Ground 5 FN7572.2 December 5, 2012 ISLA214P Ordering Information PART NUMBER (Notes 1,2) PART MARKING TEMP. RANGE (°C) PACKAGE (Pb-free) PKG. DWG. # ISLA214P13IRZ ISLA214P13 IRZ -40°C to +85°C 72 Ld QFN L72.10x10E ISLA214P20IRZ ISLA214P20 IRZ -40°C to +85°C 72 Ld QFN L72.10x10E ISLA214P25IRZ ISLA214P25 IRZ -40°C to +85°C 72 Ld QFN L72.10x10E Coming Soon ISLA214P13IR1Z ISLA214P13 IR1Z -40°C to +85°C 48 Ld QFN TBD Coming Soon ISLA214P20IR1Z ISLA214P20 IR1Z -40°C to +85°C 48 Ld QFN TBD Coming Soon ISLA214P25IR1Z ISLA214P25 IR1Z -40°C to +85°C 48 Ld QFN TBD ISLA214IR72EV1Z Evaluation Board NOTES: 1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu plate-e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 2. For Moisture Sensitivity Level (MSL), please see respective device information page for ISLA214P. For more information on MSL please see techbrief TB363. 6 FN7572.2 December 5, 2012 ISLA214P Table of Contents Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Thermal Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Digital Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Switching Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Typical Performance Curves. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Theory of Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Power-On Calibration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 User Initiated Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Temperature Calibration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Analog Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Clock Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Jitter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Voltage Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Digital Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Nap/Sleep. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Clock Divider Synchronous Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Serial Peripheral Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 SPI Physical Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 SPI Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Device Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Device Configuration/Control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Global Device Configuration/Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Digital Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 SPI Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Equivalent Circuits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 A/D Evaluation Platform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Layout Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Split Ground and Power Planes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Clock Input Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Exposed Paddle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Bypass and Filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 LVDS Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 LVCMOS Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Unused Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 About Intersil . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Package Outline Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 7 FN7572.2 December 5, 2012 ISLA214P Absolute Maximum Ratings Thermal Information AVDD to AVSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.4V to 2.1V OVDD to OVSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.4V to 2.1V AVSS to OVSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 0.3V Analog Inputs to AVSS . . . . . . . . . . . . . . . . . . . . . . . . . -0.4V to AVDD + 0.3V Clock Inputs to AVSS . . . . . . . . . . . . . . . . . . . . . . . . . . -0.4V to AVDD + 0.3V Logic Input to AVSS . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.4V to OVDD + 0.3V Logic Inputs to OVSS . . . . . . . . . . . . . . . . . . . . . . . . . . -0.4V to OVDD + 0.3V Latchup (Tested per JESD-78C;Class 2,Level A) . . . . . . . . . . . . . . . . 100mA Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) 72 Ld QFN (Notes 3, 4) . . . . . . . . . . . . . . . . 23 0.9 48 Ld QFN (Notes 3, 4) . . . . . . . . . . . . . . . . 24 1.0 Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+150°C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 3. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 4. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. Electrical Specifications All specifications apply under the following conditions unless otherwise noted: AVDD = 1.8V, OVDD = 1.8V, TA = -40°C to +85°C (Typical specifications at +25°C), AIN = -1dBFS, fSAMPLE = Maximum Conversion Rate (per speed grade). Boldface limits apply over the operating temperature range, -40°C to +85°C. ISLA214P25 PARAMETER SYMBOL CONDITIONS ISLA214P20 MIN MAX MIN (Note 5) TYP (Note 5) (Note 5) TYP ISLA214P13 MAX MIN (Note 5) (Note 5) TYP MAX (Note 5) UNITS 2.1 VP-P DC SPECIFICATIONS (Note 6) Analog Input Full-Scale Analog Input Range VFS Differential 1.95 2.0 2.1 1.95 2.0 2.1 1.95 2.0 Input Resistance RIN Differential 600 600 600 Ω Input Capacitance CIN Differential 4.5 4.5 4.5 pF Full Temp 108 82 74 ppm/°C Full Scale Range Temp. Drift AVTC Input Offset Voltage VOS Common-Mode Output Voltage VCM 0.94 0.94 0.94 V Common-Mode Input Current (per pin) ICM 2.6 2.6 2.6 µA/MSPS Inputs Common Mode Voltage 0.9 0.9 0.9 V CLKP,CLKN Input Swing (Note 7) 1.8 1.8 1.8 V -5.0 -1.7 5.0 -5.0 -1.7 5.0 -5.0 -1.7 5.0 mV Clock Inputs Power Requirements 1.8V Analog Supply Voltage AVDD 1.7 1.8 1.9 1.7 1.8 1.9 1.7 1.8 1.9 V 1.8V Digital Supply Voltage OVDD 1.7 1.8 1.9 1.7 1.8 1.9 1.7 1.8 1.9 V 1.8V Analog Supply Current IAVDD 188 200 174 184 152 161 mA 1.8V Digital Supply Current (Note 6) I OVDD 3mA LVDS (SDR) 78.5 88 75 84 68.5 77 mA Power Supply Rejection Ratio PSRR 30MHz, 30mVP-P signal on AVDD 8 40 40 40 dB FN7572.2 December 5, 2012 ISLA214P Electrical Specifications All specifications apply under the following conditions unless otherwise noted: AVDD = 1.8V, OVDD = 1.8V, TA = -40°C to +85°C (Typical specifications at +25°C), AIN = -1dBFS, fSAMPLE = Maximum Conversion Rate (per speed grade). Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued) ISLA214P25 PARAMETER SYMBOL CONDITIONS ISLA214P20 MIN MAX MIN (Note 5) TYP (Note 5) (Note 5) TYP ISLA214P13 MAX MIN (Note 5) (Note 5) TYP MAX (Note 5) UNITS Total Power Dissipation Normal Mode PD Nap Mode PD Sleep Mode PD 2mA LVDS 454 3mA LVDS (SDR) 480 3mA LVDS (DDR) 450 410 360 mW CMOS (SDR) 432 392 313 mW CMOS (DDR) 420 375 310 mW CSB at logic high Nap/Sleep Mode Wakeup Time Sample Clock Running 422 518 448 369 482 397 mW 428 mW 55.8 60 52.2 57 48.6 53 mW 6 11 6 11 6 10 mW 200 400 630 µs AC SPECIFICATIONS Differential Nonlinearity DNL fIN = 105MHz No Missing Codes Integral Nonlinearity INL fIN = 105MHz Minimum Conversion Rate (Note 8) fS MIN Maximum Conversion Rate fS MAX Signal-to-Noise Ratio (Note 9) SNR Signal-to-Noise and Distortion (Note 9) Effective Number of Bits (Note 9) -0.99 ±0.3 2.0 -0.99 ±2.5 ±0.25 fIN = 30MHz fIN = 105MHz SINAD 9 ±2.5 130 73.7 73.0 LSB LSB 40 73.8 72.1 1.4 MSPS MSPS 74.9 dBFS 74.3 dBFS fIN = 190MHz 72.1 72.8 73.3 dBFS fIN = 363MHz 70.6 71.1 70.9 dBFS fIN = 461MHz 69.9 70.0 69.5 dBFS fIN = 605MHz 68.4 68.5 67.8 dBFS fIN = 30MHz 72.4 73.5 74.6 dBFS 73.6 dBFS fIN = 105MHz ENOB 200 73 ±0.25 40 73 70.1 -0.99 ±2.5 40 250 1.4 69.4 72.4 71.0 73.1 70.8 fIN = 190MHz 70.7 72.3 72.2 dBFS fIN = 363MHz 69.8 70.7 70.6 dBFS fIN = 461MHz 66.1 67.4 65.9 dBFS fIN = 605MHz 60.5 61.1 61.1 dBFS fIN = 30MHz 11.73 11.92 12.10 Bits fIN = 105MHz 11.29 11.73 11.50 11.83 11.47 11.93 Bits fIN = 190MHz 11.45 11.72 11.70 Bits fIN = 363MHz 11.30 11.45 11.44 Bits fIN = 461MHz 10.69 10.90 10.65 Bits fIN = 605MHz 9.76 9.86 9.86 Bits FN7572.2 December 5, 2012 ISLA214P Electrical Specifications All specifications apply under the following conditions unless otherwise noted: AVDD = 1.8V, OVDD = 1.8V, TA = -40°C to +85°C (Typical specifications at +25°C), AIN = -1dBFS, fSAMPLE = Maximum Conversion Rate (per speed grade). Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued) ISLA214P25 PARAMETER SYMBOL Spurious-Free Dynamic Range (Note 9) SFDR CONDITIONS MIN MAX MIN (Note 5) TYP (Note 5) (Note 5) TYP fIN = 30MHz fIN = 105MHz ISLA214P20 82 72 83 ISLA214P13 MAX MIN (Note 5) (Note 5) TYP 88 72 84 70 MAX (Note 5) UNITS 88 dBc 83 dBc fIN = 190MHz 78 84 78 dBc fIN = 363MHz 78 82 84 dBc fIN = 461MHz 68 71 68 dBc fIN = 605MHz 61 62 61 dBc Spurious-Free Dynamic SFDRX23 fIN = 30MHz Range Excluding H2, H3 fIN = 105MHz 89 93 99 dBc 91 90 95 dBc fIN = 190MHz 88 89 91 dBc fIN = 363MHz 87 90 95 dBc fIN = 461MHz 88 93 94 dBc fIN = 605MHz 88 88 87 dBc fIN = 70MHz 87 86 87 dBFS fIN = 170MHz 97 104 101 dBFS Intermodulation Distortion IMD Word Error Rate WER 10-12 10-12 10-12 Full Power Bandwidth FPBW 700 700 700 MHz NOTES: 5. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design. 6. Digital Supply Current is dependent upon the capacitive loading of the digital outputs. IOVDD specifications apply for 10pF load on each digital output 7. See “Clock Input” on page 20. 8. The DLL Range setting must be changed for low-speed operation. 9. Minimum specification guaranteed when calibrated at +85°C. Digital Specifications Boldface limits apply over the operating temperature range, -40°C to +85°C. PARAMETER SYMBOL CONDITIONS MIN (Note 5) TYP MAX (Note 5) UNITS 0 1 10 µA -25 -12 -8 µA 4 12 µA -600 -415 -300 µA 40 58 75 5 10 INPUTS (Note 10) Input Current High (RESETN) IIH VIN = 1.8V Input Current Low (RESETN) IIL VIN = 0V Input Current High (SDIO) IIH VIN = 1.8V Input Current Low (SDIO) IIL VIN = 0V Input Current High (CSB) IIH VIN = 1.8V Input Current Low (CSB) IIL VIN = 0V Input Current High (CLKDIV) IIH 16 25 34 µA Input Current Low (CLKDIV) IIL -34 -25 -16 µA Input Voltage High (SDIO, RESETN) VIH 1.17 Input Voltage Low (SDIO, RESETN) VIL Input Capacitance CDI 10 V 0.63 4 V pF FN7572.2 December 5, 2012 ISLA214P Digital Specifications Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued) PARAMETER SYMBOL CONDITIONS MIN (Note 5) MAX (Note 5) UNITS TYP LVDS INPUTS (CLKDIVRSTP, CLKDIVRSTN) Input Common Mode Range VICM 825 1575 mV Input Differential Swing (peak to peak, single-ended) VID 250 450 mV CLKDIVRSTP Input Pull-down Resistance RIpd 100 kΩ CLKDIVRSTN Input Pull-up Resistance RIpu 100 kΩ 612 mVP-P LVDS OUTPUTS Differential Output Voltage (Note 11) Output Offset Voltage VT 3mA Mode VOS 3mA Mode 1120 1150 1200 mV Output Rise Time tR 240 ps Output Fall Time tF 240 ps OVDD - 0.1 V CMOS OUTPUTS Voltage Output High VOH IOH = -500µA Voltage Output Low VOL IOL = 1mA OVDD - 0.3 0.1 0.3 V Output Rise Time tR 1.8 ns Output Fall Time tF 1.4 ns NOTES: 10. The Tri-Level Inputs internal switching thresholds are approximately. 0.43V and 1.34V. It is advised to float the inputs, tie to ground or AVDD depending on desired function. 11. The voltage is expressed in peak-to-peak differential swing. The peak-to-peak singled-ended swing is 1/2 of the differential swing. Timing Diagrams INP INN tA CLKN CLKP LATENCY = L CYCLES tCPD CLKOUTN CLKOUTP tDC tPD D[12/10/8/6/4/2/0]N D[12/10/8/6/4/2/0]P ODD N-L EVEN N-L ODD N-L+1 EVEN N-L+1 EVEN N-1 ODD N EVEN N FIGURE 1A. LVDS DDR 11 FN7572.2 December 5, 2012 ISLA214P Timing Diagrams (Continued) INP INN tA CLKN CLKP LATENCY = L CYCLES tCPD CLKOUTN CLKOUTP tDC tPD D[13:0]N DATA N-L D[13:0]P DATA N DATA N-L+1 FIGURE 1B. LVDS SDR FIGURE 1. LVDS TIMING DIAGRAMS INP INN tA CLKN CLKP LATENCY = L CYCLES tCPD CLKOUT tDC tPD D[12/10/8/6/4/2/0] ODD N-L EVEN N-L ODD N-L+1 EVEN N-L+1 EVEN N-1 ODD N EVEN N FIGURE 2A. CMOS DDR 12 FN7572.2 December 5, 2012 ISLA214P Timing Diagrams (Continued) INP INN tA CLKN CLKP LATENCY = L CYCLES tCPD CLKOUT tDC tPD DATA N-L D[13:0] DATA N DATA N-L+1 FIGURE 2B. CMOS SDR FIGURE 2. CMOS TIMING DIAGRAMS Switching Specifications PARAMETER Boldface limits apply over the operating temperature range, -40°C to +85°C. SYMBOL CONDITION MIN (Note 5) TYP MAX (Note 5) UNITS ADC OUTPUT Aperture Delay tA 114 ps RMS Aperture Jitter jA 75 fs Input Clock to Output Clock Propagation Delay Relative Input Clock to Output Clock Propagation Delay (Note 12) tCPD AVDD, OVDD = 1.7V to 1.9V, TA = -40°C to +85°C 1.65 2.4 3 ns tCPD AVDD, OVDD = 1.8V, TA = +25°C 1.9 2.3 2.75 ns dtCPD AVDD, OVDD = 1.7V to 1.9V, TA = -40°C to +85°C -450 450 ps Input Clock to Data Propagation Delay tPD Output Clock to Data Propagation Delay, LVDS Mode tDC Output Clock to Data Propagation Delay, CMOS Mode tDC Synchronous Clock Divider Reset Setup Time (with respect to the positive edge of CLKP) tRSTS Synchronous Clock Divider Reset Hold Time (with respect to the positive edge of CLKP) tRSTH Synchronous Clock Divider Reset Recovery Time tRSTRT Latency (Pipeline Delay) Overvoltage Recovery 13 1.65 2.4 3.5 ns Rising/Falling Edge -0.1 0.16 0.5 ns Rising/Falling Edge -0.1 0.2 0.65 ns 0.4 0.06 0.02 DLL recovery time after Synchronous Reset ns 0.35 ns 52 µs L 10 cycles tOVR 1 cycles FN7572.2 December 5, 2012 ISLA214P Switching Specifications PARAMETER Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued) SYMBOL MIN (Note 5) CONDITION TYP MAX (Note 5) UNITS SPI INTERFACE (Notes 13, 14) t SCLK Period CLK Write Operation 16 cycles tCLK Read Operation 16 cycles CSB↓ to SCLK↑ Setup Time tS Read or Write 28 cycles CSB↑ after SCLK↑ Hold Time tH Write 5 cycles CSB↑ after SCLK↓ Hold Time tHR Read 16 cycles Data Valid to SCLK↑ Setup Time tDS Write 6 cycles Data Valid after SCLK↑ Hold Time tDH Read or Write 4 cycles Data Valid after SCLK↓ Time tDVR Read 5 cycles NOTES: 12. The relative propagation delay is the difference in propagation time between any two devices that are matched in temperature and voltage, and is specified over the full operating temperature and voltage range. 13. SPI Interface timing is directly proportional to the ADC sample period (tS). Values above reflect multiples of a 4ns sample period, and must be scaled proportionally for lower sample rates. ADC sample clock must be running for SPI communication. 14. The SPI may operate asynchronously with respect to the ADC sample clock. Typical Performance Curves All Typical Performance Characteristics apply under the following conditions unless otherwise noted: AVDD = OVDD = 1.8V, TA = +25°C, AIN = -1dBFS, fIN = 105MHz, fSAMPLE = 250MSPS. -60 90 SFDR @ 130MSPS 85 SFDR @ 250MSPS 80 75 70 65 60 SNR @ 250MSPS 0 100 SNR @ 130MSPS 200 300 400 INPUT FREQUENCY (MHz) FIGURE 3. SNR AND SFDR vs fIN 14 500 600 HD2 AND HD3 MAGNITUDE (dBc) SNR (dBFS) AND SFDR (dBc) 95 HD3 @ 250MSPS -65 HD2 @ 250MSPS -70 -75 -80 -85 -90 HD3 @ 130MSPS -95 HD2 @ 130MSPS -100 -105 0 100 200 300 400 500 600 INPUT FREQUENCY (MHz) FIGURE 4. HD2 AND HD3 vs fIN FN7572.2 December 5, 2012 ISLA214P Typical Performance Curves All Typical Performance Characteristics apply under the following conditions unless otherwise noted: AVDD = OVDD = 1.8V, TA = +25°C, AIN = -1dBFS, fIN = 105MHz, fSAMPLE = 250MSPS. (Continued) -30 100 90 -40 HD2 AND HD3 MAGNITUDE SFDR (dBfs) SNR AND SFDR 80 70 SNR (dBfs) 60 SFDR (dBc) 50 SNR (dBc) 40 30 HD2 (dBc) -50 -60 HD3 (dBc) -70 HD2 (dBfs) -80 HD3 (dBfs) -90 -100 20 10 -60 -50 -40 -30 -20 -10 -110 0 -60 -50 INPUT AMPLITUDE (dBFS) FIGURE 5. SNR AND SFDR vs AIN -20 -10 0 -75 HD2 AND HD3 MAGNITUDE (dBc) SNR (dBFS) AND SFDR (dBc) -30 FIGURE 6. HD2 AND HD3 vs AIN 90 85 SFDR 80 SNR 75 70 90 110 130 150 170 190 210 230 -80 HD3 -85 -90 HD2 -95 -100 -105 70 70 250 90 110 130 150 170 190 210 230 250 SAMPLE RATE (MSPS) SAMPLE RATE (MSPS) FIGURE 7. SNR AND SFDR vs fSAMPLE FIGURE 8. HD2 AND HD3 vs fSAMPLE 500 1.0 475 0.8 0.6 450 0.4 DNL (LSBs) TOTAL POWER (mW) -40 INPUT AMPLITUDE (dBFS) 425 LVDS 400 375 CMOS 0.2 0 -0.2 -0.4 350 -0.6 325 300 -0.8 40 60 80 100 120 140 160 180 SAMPLE RATE (MSPS) 200 220 240 FIGURE 9. POWER vs fSAMPLE IN 3mA LVDS MODE (SDR) AND CMOS MODE (DDR) 15 -1.0 0 2000 4000 6000 8000 10000 12000 14000 16000 CODES FIGURE 10. DIFFERENTIAL NONLINEARITY FN7572.2 December 5, 2012 ISLA214P Typical Performance Curves All Typical Performance Characteristics apply under the following conditions unless otherwise noted: AVDD = OVDD = 1.8V, TA = +25°C, AIN = -1dBFS, fIN = 105MHz, fSAMPLE = 250MSPS. (Continued) 4 85 SNR (dBFS) AND SFDR (dBc) 3 INL (LSBs) 2 1 0 -1 -2 -3 -4 0 2000 4000 6000 80 75 70 SFDR AIN = -2dBFS 65 60 0.75 8000 10000 12000 14000 16000 CODES FIGURE 11. INTEGRAL NONLINEARITY 70000 AMPLITUDE (dBFS) NUMBER OF HITS 35036 30000 23400 20000 10120 10000 -40 -60 -80 -100 590 43 1 0 0 8180 8182 8184 -120 FIGURE 13. NOISE HISTOGRAM 0 20 40 60 80 FREQUENCY (MHz) 100 120 FIGURE 14. SINGLE-TONE SPECTRUM @ 105MHz 0 0 AIN = -1.0 dBFS SNR = 72.6 dBFS -20 SFDR = 78.1 dBc SINAD = 71.2 dBFS AIN = -1.0 dBFS SNR = 70.9 dBFS SFDR = 78.4 dBc SINAD = 70.1 dBFS -20 AMPLITUDE (dBFS) AMPLITUDE (dBFS) AIN = -1.0 dBFS SNR = 73.4 dBFS SFDR = 80.7 dBc SINAD = 72.5 dBFS -20 50000 -40 -60 -80 -100 -120 1.15 0 60000 4668 0 0 0 23 581 0 8170 8172 8174 8176 8178 CODE 0.85 0.95 1.05 INPUT COMMON MODE (V) FIGURE 12. SNR AND SFDR vs VCM 64687 60851 40000 SNR AIN = -1dBFS SFDR AIN = -1dBFS -40 -60 -80 -100 0 20 40 60 80 100 FREQUENCY (MHz) FIGURE 15. SINGLE-TONE SPECTRUM @ 190MHz 16 120 -120 0 20 40 60 80 100 120 FREQUENCY (MHz) FIGURE 16. SINGLE-TONE SPECTRUM @ 363MHz FN7572.2 December 5, 2012 ISLA214P Typical Performance Curves All Typical Performance Characteristics apply under the following conditions unless otherwise noted: AVDD = OVDD = 1.8V, TA = +25°C, AIN = -1dBFS, fIN = 105MHz, fSAMPLE = 250MSPS. (Continued) 0 0 IMD2 IMD3 2ND HARMONICS 3RD HARMONICS IMD2 IMD3 2ND HARMONICS 3RD HARMONICS -20 AMPLITUDE (dBFS) AMPLITUDE (dBFS) -20 -40 -60 IMD3 = -87 dBFS -80 -40 -60 IMD3 = -97 dBFS -80 -100 -100 -120 -120 0 20 40 60 80 FREQUENCY (MHz) 100 120 FIGURE 17. TWO-TONE SPECTRUM (F1 = 70MHz, F2 = 71MHz AT -7dBFS) Theory of Operation Functional Description The ISLA214P is based on a 14-bit, 250MSPS A/D converter core that utilizes a pipelined successive approximation architecture (see Figure 19). The input voltage is captured by a Sample-Hold Amplifier (SHA) and converted to a unit of charge. Proprietary charge-domain techniques are used to successively compare the input to a series of reference charges. Decisions made during the successive approximation operations determine the digital code for each input value. Digital error correction is also applied, resulting in a total latency of 10 clock cycles. This is evident to the user as a latency between the start of a conversion and the data being available on the digital outputs. Power-On Calibration As mentioned previously, the cores perform a self-calibration at start-up. An internal power-on-reset (POR) circuit detects the supply voltage ramps and initiates the calibration when the analog and digital supply voltages are above a threshold. The following conditions must be adhered to for the power-on calibration to execute successfully. • A frequency-stable conversion clock must be applied to the CLKP/CLKN pins 0 Filename Core fs (MHz) 20 40 60 80 FREQUENCY (MHz) 100 120 FIGURE 18. TWO-TONE SPECTRUM (F1 = 170MHz, F2 = 171MHz AT -7dBFS) A user-initiated reset can subsequently be invoked in the event that the above conditions cannot be met at power-up. After the power supply has stabilized the internal POR releases RESETN and an internal pull-up pulls it high, which starts the calibration sequence. If a subsequent user-initiated reset is desired, the RESETN pin should be connected to an open-drain driver with an off-state/high impedance state leakage of less than 0.5mA to assure exit from the reset state so calibration can start. The calibration sequence is initiated on the rising edge of RESETN, as shown in Figure 20. Calibration status can be determined by reading the cal_status bit (LSB) at 0xB6. This bit is ‘0’ during calibration and goes to a logic ‘1’ when calibration is complete. The data outputs produce 0xCCCC during calibration; this can also be used to determine calibration status. If the selectable clock divider is set to 1 (default), the output clock (CLKOUTP/CLKOUTN) will not be affected by the assertion of RESETN. If the selectable clock divider is set to 2 or 4, the output clock is set low while RESETN is asserted (low). Normal operation of the output clock resumes at the next input clock edge (CLKP/CLKN) after RESETN is de-asserted. At 250MSPS, the nominal calibration time is 200ms, while the maximum calibration time is 550ms. • DNC pins must not be connected • SDO has an internal pull-up and should not be driven externally • RESETN is pulled low by the ADC internally during POR. External driving of RESETN is optional. • SPI communications must not be attempted 17 FN7572.2 December 5, 2012 ISLA214P CLOCK GENERATION INP 2.5-BIT 2.5-BIT FLASH SHA FLASH INN 1.25V + – 6- STAGE 1.5-BIT/ STAGE 3- STAGE 1- BIT/ STAGE 3-BIT FLASH DIGITAL ERROR CORRECTION LVDS/ LVCMOS OUTPUTS FIGURE 19. A/D CORE BLOCK DIAGRAM CLKN CLKP CALIBRATION TIME RESETN CAL_STATUS BIT CALIBRATION BEGINS A supply voltage variation of <100mV will generally result in an SNR change of <0.5dBFS and SFDR change of <3dBc. CALIBRATION COMPLETE CLKOUTP FIGURE 20. CALIBRATION TIMING User Initiated Reset Recalibration of the A/D can be initiated at any time by driving the RESETN pin low for a minimum of one clock cycle. An open-drain driver with a drive strength in its high impedance state of less than 0.5mA is recommended, as RESETN has an internal high impedance pull-up to OVDD. As is the case during power-on reset, RESETN and DNC pins must be in the proper state for the calibration to successfully execute. 18 The performance of the ISLA214P changes with variations in temperature, supply voltage or sample rate. The extent of these changes may necessitate recalibration, depending on system performance requirements. Best performance will be achieved by recalibrating the A/D under the environmental conditions at which it will operate. In situations where the sample rate is not constant, best results will be obtained if the device is calibrated at the highest sample rate. Reducing the sample rate by less than 80MSPS will typically result in an SNR change of <0.5dBFS and an SFDR change of <3dBc. Figures 21 through 26 show the effect of temperature on SNR and SFDR performance with power on calibration performed at -40°C, +25°C, and +85°C. Each plot shows the variation of SNR/SFDR across temperature after a single power on calibration at -40°C, +25°C and +85°C. Best performance is typically achieved by a user-initiated power on calibration at the operating conditions, as stated earlier. However, it can be seen that performance drift with temperature is not a very strong function of the temperature at which the power on calibration is performed. FN7572.2 December 5, 2012 ISLA214P Temperature Calibration 95 76 130MSPS 250MSPS 200MSPS SFDR (dBc) SNR (dBFS) 75 250MSPS 74 90 130MSPS 85 73 -2dBFS ANALOG INPUT -1dBFS ANALOG INPUT 72 -40 -35 -30 200MSPS -25 80 -40 -20 -35 TEMPERATURE (°C) -2dBFS ANALOG INPUT -1dBFS ANALOG INPUT -30 TEMPERATURE (°C) -25 -20 FIGURE 22. TYPICAL SFDR PERFORMANCE vs TEMPERATURE, DEVICE CALIBRATED AT -40°C, fIN = 105MHz FIGURE 21. TYPICAL SNR PERFORMANCE vs TEMPERATURE, DEVICE CALIBRATED AT -40°C, fIN = 105MHz 76 95 130MSP 90 SFDR (dBc) SNR (dBFS) 75 74 200MSPS 250MSPS 130MSPS 85 200MSPS 73 80 250MSPS 72 5 -2dBFS ANALOG INPUT -1dBFS ANALOG INPUT 10 15 20 25 30 TEMPERATURE (°C) -2dBFS ANALOG INPUT -1dBFS ANALOG INPUT 35 40 75 45 FIGURE 23. TYPICAL SNR PERFORMANCE vs TEMPERATURE, DEVICE CALIBRATED AT +25°C, fIN = 105MHz 5 10 15 20 25 30 TEMPERATURE (°C) 35 40 45 FIGURE 24. TYPICAL SFDR PERFORMANCE vs TEMPERATURE, DEVICE CALIBRATED AT +25°C, fIN = 105MHz 76 90 -2dBFS ANALOG INPUT -1dBFS ANALOG INPUT 250MSPS 130MSPS SFDR (dBc) SNR (dBFS) 75 130MSPS 74 200MSPS 85 200MSPS 80 -2dBFS ANALOG INPUT -1dBFS ANALOG INPUT 73 250MSPS 72 65 67 69 71 73 75 77 79 TEMPERATURE (°C) 81 83 FIGURE 25. TYPICAL SNR PERFORMANCE vs TEMPERATURE, DEVICE CALIBRATED AT +85°C, fIN = 105MHz 19 85 75 65 70 75 TEMPERATURE (°C) 80 85 FIGURE 26. TYPICAL SFDR PERFORMANCE vs TEMPERATURE, DEVICE CALIBRATED AT +85°C, fIN = 105MHz FN7572.2 December 5, 2012 ISLA214P Analog Input A single fully differential input (VINP/VINN) connects to the sample and hold amplifier (SHA) of each unit A/D. The ideal full-scale input voltage is 2.0V, centered at the VCM voltage of 0.94V as shown in Figure 27. transformer and low shunt resistance are recommended for optimal performance. A/D VINN 1.8 VINP 1.4 VCM 0.94V 1.0V 1.0 0.6 FIGURE 30. DIFFERENTIAL AMPLIFIER INPUT 0.2 FIGURE 27. ANALOG INPUT RANGE Best performance is obtained when the analog inputs are driven differentially. The common-mode output voltage, VCM, should be used to properly bias the inputs as shown in Figures 28 through 30. An RF transformer will give the best noise and distortion performance for wideband and/or high intermediate frequency (IF) inputs. Two different transformer input schemes are shown in Figures 28 and 29. ADT1-1WT ADT1-1WT 1000pF A/D VCM 0.1µF FIGURE 28. TRANSFORMER INPUT FOR GENERAL PURPOSE APPLICATIONS ADTL1-12 TX-2-5-1 A differential amplifier, as shown in the simplified block diagram in Figure 30, can be used in applications that require DC-coupling. In this configuration, the amplifier will typically dominate the achievable SNR and distortion performance. Intersil’s new ISL552xx differential amplifier family can also be used in certain AC applications with minimal performance degradation. Contact the factory for more information. Clock Input The clock input circuit is a differential pair (see Figure 44). Driving these inputs with a high level (up to 1.8VP-P on each input) sine or square wave will provide the lowest jitter performance. A transformer with 4:1 impedance ratio will provide increased drive levels. The clock input is functional with AC-coupled LVDS, LVPECL, and CML drive levels. To maintain the lowest possible aperture jitter, it is recommended to have high slew rate at the zero crossing of the differential clock input signal. The recommended drive circuit is shown in Figure 31. A duty range of 40% to 60% is acceptable. The clock can be driven single-ended, but this will reduce the edge rate and may impact SNR performance. The clock inputs are internally self-biased to AVDD/2 to facilitate AC coupling. TC4-19G2+ 1000pF 1000pF CLKP A/D VCM 200 0.01µF 1000pF FIGURE 29. TRANSMISSION-LINE TRANSFORMER INPUT FOR HIGH IF APPLICATIONS This dual transformer scheme is used to improve common-mode rejection, which keeps the common-mode level of the input matched to VCM. The value of the shunt resistor should be determined based on the desired load impedance. The differential input resistance of the ISLA214P is 600Ω. The SHA design uses a switched capacitor input stage (see Figure 43), which creates current spikes when the sampling capacitance is reconnected to the input voltage. This causes a disturbance at the input which must settle before the next sampling point. Lower source impedance will result in faster settling and improved performance. Therefore a 2:1 or 1:1 20 CLKN 1000pF 1000pF FIGURE 31. RECOMMENDED CLOCK DRIVE A selectable 2x or 4x frequency divider is provided in series with the clock input. The divider can be used in the 2x mode with a sample clock equal to twice the desired sample rate or in 4x mode with a sample clock equal to four times the desired sample rate. This allows the use of the Phase Slip feature, which enables synchronization of multiple ADCs. The Phase Slip feature can be used as an alternative to using the CLKDIVRST pins to synchronize ADCs in a multiple ADC system. FN7572.2 December 5, 2012 ISLA214P Digital Outputs TABLE 1. CLKDIV PIN SETTINGS CLKDIV PIN DIVIDE RATIO AVSS 2 Float 1 AVDD 4 Output data is available as a parallel bus in LVDS-compatible(default) or CMOS modes. In either case, the data is presented in either double data rate (DDR) or single data rate (default) format. Figures 1A and 1B show the timing relationships for LVDS and CMOS modes, respectively. The clock divider can also be controlled through the SPI port, which overrides the CLKDIV pin setting. See “SPI Physical Interface” on page 25. A delay-locked loop (DLL) generates internal clock signals for various stages within the charge pipeline. If the frequency of the input clock changes, the DLL may take up to 52μs to regain lock at 250MSPS. The lock time is inversely proportional to the sample rate. The DLL has two ranges of operation, slow and fast. The slow range can be used for sample rates between 40MSPS and 100MSPS, while the default fast range can be used from 80MSPS to the maximum specified sample rate. Jitter In a sampled data system, clock jitter directly impacts the achievable SNR performance. The theoretical relationship between clock jitter (tJ) and SNR is shown in Equation 1 and is illustrated in Figure 32. 1 SNR = 20 log 10 ⎛ -------------------⎞ ⎝ 2πf t ⎠ IN J (EQ. 1) 100 95 SNR (dB) tj = 1ps 75 12 BITS 70 tj = 10ps 65 60 10 BITS tj = 100ps 55 50 1M 10M 100M INPUT FREQUENCY (Hz) 1G FIGURE 32. SNR vs CLOCK JITTER This relationship shows the SNR that would be achieved if clock jitter were the only non-ideal factor. In reality, achievable SNR is limited by internal factors such as linearity, aperture jitter and thermal noise. Internal aperture jitter is the uncertainty in the sampling instant shown in Figure1A. The internal aperture jitter combines with the input clock jitter in a root-sum-square fashion, since they are not statistically correlated, and this determines the total jitter in the system. The total jitter, combined with other noise sources, then determines the achievable SNR. Voltage Reference A temperature compensated internal voltage reference provides the reference charges used in the successive approximation operations. The full-scale range of each A/D is proportional to the reference voltage. The nominal value of the voltage reference is 1.25V. 21 An external resistor creates the bias for the LVDS drivers. A 10kΩ, 1% resistor must be connected from the RLVDS pin to OVSS. Power Dissipation The power dissipated by the ISLA214P is primarily dependent on the sample rate and the output modes: LVDS vs CMOS and DDR vs SDR. There is a static bias in the analog supply, while the remaining power dissipation is linearly related to the sample rate. The output supply dissipation changes to a lesser degree in LVDS mode, but is more strongly related to the clock frequency in CMOS mode. Portions of the device may be shut down to save power during times when operation of the A/D is not required. Two power saving modes are available: Nap, and Sleep. Nap mode reduces power dissipation to < 60mW while Sleep mode reduces power dissipation to 9mW typically. 14 BITS 85 80 The output mode can be controlled through the SPI port, by writing to address 0x73, see “Serial Peripheral Interface” on page 25. Nap/Sleep tj = 0.1ps 90 Additionally, the drive current for LVDS mode can be set to a nominal 3mA(default) or a power-saving 2mA. The lower current setting can be used in designs where the receiver is in close physical proximity to the A/D. The applicability of this setting is dependent upon the PCB layout, therefore the user should experiment to determine if performance degradation is observed. All digital outputs (Data, CLKOUT and OR) are placed in a high impedance state during Nap or Sleep. The input clock should remain running and at a fixed frequency during Nap or Sleep, and CSB should be high. Recovery time from Nap mode will increase if the clock is stopped, since the internal DLL can take up to 52µs to regain lock at 250MSPS. By default after the device is powered on, the operational state is controlled by the NAPSLP pin as shown in Table 2. TABLE 2. NAPSLP PIN SETTINGS NAPSLP PIN MODE AVSS Normal Float Sleep AVDD Nap The power-down mode can also be controlled through the SPI port, which overrides the NAPSLP pin setting. Details on this are contained in “Serial Peripheral Interface” on page 25. FN7572.2 December 5, 2012 ISLA214P Data Format Output data can be presented in three formats: two’s complement (default), Gray code and offset binary. The data format can be controlled through the SPI port, by writing to address 0x73. Details on this are contained in “Serial Peripheral Interface” on page 25. Offset binary coding maps the most negative input voltage to code 0x000 (all zeros) and the most positive input to 0xFFF (all ones). Two’s complement coding simply complements the MSB of the offset binary representation. When calculating Gray code the MSB is unchanged. The remaining bits are computed as the XOR of the current bit position and the next most significant bit. Figure 33 shows this operation. BINARY 13 12 11 •••• 1 13 12 •••• 11 1 0 FIGURE 33. BINARY TO GRAY CODE CONVERSION Converting back to offset binary from Gray code must be done recursively, using the result of each bit for the next lower bit as shown in Figure 34. GRAY CODE 13 12 11 •••• 1 TABLE 3. INPUT VOLTAGE TO OUTPUT CODE MAPPING INPUT VOLTAGE OFFSET BINARY TWO’S COMPLEMENT GRAY CODE –Full Scale 00 0000 0000 0000 10 0000 0000 0000 00 0000 0000 0000 –Full Scale 00 0000 0000 0001 10 0000 0000 0001 00 0000 0000 0001 + 1LSB Mid–Scale 10 0000 0000 0000 00 0000 0000 0000 11 0000 0000 0000 +Full Scale 11 1111 1111 1110 01 1111 1111 1110 10 0000 0000 0001 – 1LSB +Full Scale 11 1111 1111 1111 01 1111 1111 1111 10 0000 0000 0000 Clock Divider Synchronous Reset 0 •••• GRAY CODE Mapping of the input voltage to the various data formats is shown in Table 3. 0 If the selectable clock divider is used, the ADC's internal sample clock will be at half the frequency (DIV = 2) or one quarter the frequency (DIV = 4) of the device clock. The phase relationship between the sample clock and the device clock is initially indeterminate. An output clock (CLKOUTP, CLKOUTN) is provided to facilitate latching of the sampled data and estimation of the internal sample clock's phase. The output clock has a fixed phase relationship to the sample clock. When the selectable clock divider is set to 2 or 4, the output clock's phase relationship to the sample clock remains fixed but is initially indeterminate with respect to the device clock. When the selectable clock divider is set to 2 or 4, the synchronous clock divider reset feature allows the phase of the internal sample clock and the output clock to be synchronized (refer to Figure 35) with respect to the device clock. This simplifies data capture in systems employing multiple A/Ds where sampling of the inputs is desired to be synchronous. The reset signal must be well-timed with respect to the sample clock (See “Switching Specifications” on page 13). A 100Ω differential termination resistor must be supplied between CLKDIVRSTP and CLKDIVRSTN, external to the ADC, (on the PCB) and should be located as close to the CLKDIVRSTP/N pins as possible. •••• •••• BINARY 13 12 11 •••• 1 0 FIGURE 34. GRAY CODE TO BINARY CONVERSION 22 FN7572.2 December 5, 2012 ISLA214P DEVICE CLOCK INPUT L+td (Note 15) ANALOG INPUT s1 tRSTH (Note 16) CLKDIVRSTP tRSTS tRSTRT ADC1 OUTPUT DATA s0 ODD s0 EVEN s1 ODD s1 EVEN s0 ODD s0 EVEN s1 ODD s1 EVEN ADC1 CLKOUTP ADC2 OUTPUT DATA (NoteADC2 17) CLKOUTP (PHASE 1) ADC2 CLKOUTP (PHASE 2) (Note 17) NOTES: 15. Delay equals fixed pipeline latency (L cycles of sample clock) plus fixed analog propagation delay, td. 16. CLKDIVRSTP setup and hold times are with respect to input sample clock rising edge. CLKDIVRSTN is not shown, but must be driven, and is the compliment of CLKDIVRSTP. 17. Either Output Clock Phase (phase 1 or phase 2 ) equally likely prior to synchronization. FIGURE 35. SYNCHRONOUS RESET OPERATION, CLOCK DIVIDE = 2, DDR-MODE CSB SCLK SDIO R/W W1 W0 A12 A11 A10 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 D2 D3 D4 D5 D6 D7 FIGURE 36. MSB-FIRST ADDRESSING CSB SCLK SDIO A0 A1 A2 A11 A12 W0 W1 R/W D0 D1 FIGURE 37. LSB-FIRST ADDRESSING 23 FN7572.2 December 5, 2012 ISLA214P tDSW CSB tCLK tHI tDHW tS tH tLO SCLK SDIO R/W W1 W0 A12 A11 A10 A9 A8 A7 D5 D4 D3 D2 D1 D0 SPI WRITE FIGURE 38. SPI WRITE tDSW CSB tCLK tHI tHR tDVR tS tDHW tLO SCLK WRITING A READ COMMAND READING DATA ( 3 WIRE MODE ) SDIO R/W W1 W0 A12 A11 A10 A9 A2 A1 A0 D7 SDO D6 D3 D2 D1 D0 ( 4 WIRE MODE) D7 D3 D2 D1 D0 SPI READ FIGURE 39. SPI READ CSB STALLING CSB SCLK SDIO INSTRUCTION/ADDRESS DATA WORD 1 DATA WORD 2 FIGURE 40. 2-BYTE TRANSFER LAST LEGAL CSB STALLING CSB SCLK SDIO INSTRUCTION/ADDRESS DATA WORD 1 DATA WORD N FIGURE 41. N-BYTE TRANSFER 24 FN7572.2 December 5, 2012 ISLA214P Serial Peripheral Interface A serial peripheral interface (SPI) bus is used to facilitate configuration of the device and to optimize performance. The SPI bus consists of chip select (CSB), serial clock (SCLK) serial data output (SDO), and serial data input/output (SDIO). The maximum SCLK rate is equal to the A/D sample rate (fSAMPLE) divided by 16 for both write operations and read operations. At fSAMPLE = 250MHz, maximum SCLK is 15.63MHz for writing and read operations. There is no minimum SCLK rate. The following sections describe various registers that are used to configure the SPI or adjust performance or functional parameters. Many registers in the available address space (0x00 to 0xFF) are not defined in this document. Additionally, within a defined register there may be certain bits or bit combinations that are reserved. Undefined registers and undefined values within defined registers are reserved and should not be selected. Setting any reserved register or value may produce indeterminate results. SPI Physical Interface The serial clock pin (SCLK) provides synchronization for the data transfer. By default, all data is presented on the serial data input/output (SDIO) pin in three-wire mode. The state of the SDIO pin is set automatically in the communication protocol (described in the following). A dedicated serial data output pin (SDO) can be activated by setting 0x00[7] high to allow operation in four-wire mode. The SPI port operates in a half duplex master/slave configuration, with the ISLA214P functioning as a slave. Multiple slave devices can interface to a single master in three-wire mode only, since the SDO output of an unaddressed device is asserted in four wire mode. The chip-select bar (CSB) pin determines when a slave device is being addressed. Multiple slave devices can be written to concurrently, but only one slave device can be read from at a given time (again, only in three-wire mode). If multiple slave devices are selected for reading at the same time, the results will be indeterminate. The communication protocol begins with an instruction/address phase. The first rising SCLK edge following a high-to-low transition on CSB determines the beginning of the two-byte instruction/address command; SCLK must be static low before the CSB transition. Data can be presented in MSB-first order or LSB-first order. The default is MSB-first, but this can be changed by setting 0x00[6] high. Figures 36 and 37 show the appropriate bit ordering for the MSB-first and LSB-first modes, respectively. In MSB-first mode, the address is incremented for multi-byte transfers, while in LSB-first mode it’s decremented. In the default mode, the MSB is R/W, which determines if the data is to be read (active high) or written. The next two bits, W1 and W0, determine the number of data bytes to be read or written (see Table 4). The lower 13 bits contain the first address for the data transfer. This relationship is illustrated in Figure 38, and timing values are given in “Switching Specifications” on page 13. A/D (based on the R/W bit status). The data transfer will continue as long as CSB remains low and SCLK is active. Stalling of the CSB pin is allowed at any byte boundary (instruction/address or data) if the number of bytes being transferred is three or less. For transfers of four bytes or more, CSB is allowed to stall in the middle of the instruction/address bytes or before the first data byte. If CSB transitions to a high state after that point the state machine will reset and terminate the data transfer. TABLE 4. BYTE TRANSFER SELECTION [W1:W0] BYTES TRANSFERRED 00 1 01 2 10 3 11 4 or more Figures 40 and 41 on page 24 illustrate the timing relationships for 2-byte and N-byte transfers, respectively. The operation for a 3-byte transfer can be inferred from these diagrams. SPI Configuration ADDRESS 0X00: CHIP_PORT_CONFIG Bit ordering and SPI reset are controlled by this register. Bit order can be selected as MSB to LSB (MSB first) or LSB to MSB (LSB first) to accommodate various micro controllers. Bit 7 SDO Active Bit 6 LSB First Setting this bit high configures the SPI to interpret serial data as arriving in LSB to MSB order. Bit 5 Soft Reset Setting this bit high resets all SPI registers to default values. Bit 4 Reserved This bit should always be set high. Bits 3:0 These bits should always mirror bits 4:7 to avoid ambiguity in bit ordering. ADDRESS 0X02: BURST_END If a series of sequential registers are to be set, burst mode can improve throughput by eliminating redundant addressing. The burst is ended by pulling the CSB pin high. Setting the burst_end address determines the end of the transfer; during a write operation, the user must be cautious to transmit the correct number of bytes based on the starting and ending addresses. Bits 7:0 Burst End Address This register value determines the ending address of the burst data. After the instruction/address bytes have been read, the appropriate number of data bytes are written to or read from the 25 FN7572.2 December 5, 2012 ISLA214P Device Information TABLE 6. COARSE GAIN ADJUSTMENT 0x22[3:0] core 0 0x26[3:0] core 1 ADDRESS 0X08: CHIP_ID NOMINAL COARSE GAIN ADJUST (%) ADDRESS 0X09: CHIP_VERSION Bit3 +2.8 The generic die identifier and a revision number, respectively, can be read from these two registers. Bit2 +1.4 Bit1 -2.8 Device Configuration/Control Bit0 -1.4 A common SPI map, which can accommodate single-channel or multi-channel devices, is used for all Intersil A/D products. ADDRESS 0X20: OFFSET_COARSE_ADC0 ADDRESS 0X21: OFFSET_FINE_ADC0 The input offset of the A/D core can be adjusted in fine and coarse steps. Both adjustments are made via an 8-bit word as detailed in Table 5. The data format is twos complement. The default value of each register will be the result of the self-calibration after initial power-up. If a register is to be incremented or decremented, the user should first read the register value then write the incremented or decremented value back to the same register. Bit 0 in register 0xFE must be set high to enable updates written to 0x20 and 0x21 to be used by the ADC (see description for 0xFE). TABLE 5. OFFSET ADJUSTMENTS TABLE 7. MEDIUM AND FINE GAIN ADJUSTMENTS PARAMETER 0x23[7:0] MEDIUM GAIN 0x24[7:0] FINE GAIN Steps 256 256 –Full Scale (0x00) -2% -0.20% Mid–Scale (0x80) 0.00% 0.00% +Full Scale (0xFF) +2% +0.2% Nominal Step Size 0.016% 0.0016% ADDRESS 0X25: MODES Two distinct reduced power modes can be selected. By default, the tri-level NAPSLP pin can select normal operation, nap or sleep modes (refer to“Nap/Sleep” on page 21). This functionality can be overridden and controlled through the SPI. This is an indexed function when controlled from the SPI, but a global function when driven from the pin. This register is not changed by a Soft Reset. PARAMETER 0x20[7:0] COARSE OFFSET 0x21[7:0] FINE OFFSET Steps 255 255 –Full Scale (0x00) -133LSB (-47mV) -5LSB (-1.75mV) VALUE 0x25[2:0] POWER DOWN MODE Mid–Scale (0x80) 0.0LSB (0.0mV) 0.0LSB 000 Pin Control +Full Scale (0xFF) +133LSB (+47mV) +5LSB (+1.75mV) 001 Normal Operation Nominal Step Size 1.04LSB (0.37mV) 0.04LSB (0.014mV) 010 Nap Mode 100 Sleep Mode ADDRESS 0X22: GAIN_COARSE_ADC0 ADDRESS 0X23: GAIN_MEDIUM_ADC0 ADDRESS 0X24: GAIN_FINE_ADC0 Gain of the A/D core can be adjusted in coarse, medium and fine steps. Coarse gain is a 4-bit adjustment while medium and fine are 8-bit. Multiple Coarse Gain Bits can be set for a total adjustment range of ±4.2%. (‘0011’ ≅ -4.2% and ‘1100’ ≅ +4.2%) It is recommended to use one of the coarse gain settings (-4.2%, -2.8%, -1.4%, 0, 1.4%, 2.8%, 4.2%) and fine-tune the gain using the registers at 0x0023 and 0x24. The default value of each register will be the result of the self-calibration after initial power-up. If a register is to be incremented or decremented, the user should first read the register value then write the incremented or decremented value back to the same register. Bit 0 in register 0xFE must be set high to enable updates written to 0x23 and 0x24 to be used by the ADC (see description for 0xFE). 26 TABLE 8. POWER-DOWN CONTROL ADDRESS 0X26: OFFSET_COARSE_ADC1 ADDRESS 0X27: OFFSET_FINE_ADC1 The input offset of A/D core#1 can be adjusted in fine and coarse steps in the same way that offset for core#0 can be adjusted. Both adjustments are made via an 8-bit word as detailed in Table 5. The data format is two’s complement. The default value of each register will be the result of the selfcalibration after initial power-up. If a register is to be incremented or decremented, the user should first read the register value then write the incremented or decremented value back to the same register. Bit 0 in register 0xFE must be set high to enable updates written to 0x26 and 0x27 to be used by the ADC (see description for 0xFE). FN7572.2 December 5, 2012 ISLA214P ADDRESS 0X28: GAIN_COARSE_ADC1 present output data in two physical formats: LVDS (default) or LVCMOS. Additionally, the drive strength in LVDS mode can be set high (default,3mA or low (2mA). ADDRESS 0X29: GAIN_MEDIUM_ADC1 ADDRESS 0X2A: GAIN_FINE_ADC1 Gain of A/D core #1 can be adjusted in coarse, medium and fine steps in the same way that core #0 can be adjusted. Coarse gain is a 4-bit adjustment while medium and fine are 8-bit. Multiple Coarse Gain Bits can be set for a total adjustment range of ±4.2. Bit 0 in register 0xFE must be set high to enable updates written to 0x29 and 0x2A to be used by the ADC (see description for 0xFE). Data can be coded in three possible formats: two’s complement (default), Gray code or offset binary. See Table 11. This register is not changed by a Soft Reset. TABLE 10. OUTPUT MODE CONTROL VALUE 0x73[7:5] OUTPUT MODE 000 LVDS 3mA (Default) 001 LVDS 2mA 100 LVCMOS Global Device Configuration/Control ADDRESS 0X71: PHASE_SLIP The output data clock is generated by dividing down the A/D input sample clock. Some systems with multiple A/Ds can more easily latch the data from each A/D by controlling the phase of the output data clock. This control is accomplished through the use of the phase_slip SPI feature, which allows the rising edge of the output data clock to be advanced by one input clock period, as shown in the Figure 42. Execution of a phase_slip command is accomplished by first writing a '0' to bit 0 at address 0x71, followed by writing a '1' to bit 0 at address 0x71. ADC Input Clock (500MHz) VALUE 0x73[2:0] OUTPUT FORMAT 000 Two’s Complement (Default) 010 Gray Code 100 Offset Binary ADDRESS 0X74: OUTPUT_MODE_B Bit 6 DLL Range 2ns Output Data Clock (250MHz) No clock_slip TABLE 11. OUTPUT FORMAT CONTROL 4ns This bit sets the DLL operating range to fast (default) or slow. Internal clock signals are generated by a delay-locked loop (DLL), which has a finite operating range. Table 12 shows the allowable sample rate ranges for the slow and fast settings. 2ns Output Data Clock (250MHz) 1 clock_slip Bit 4 DDR Enable Set to a ‘1’ to enable DDR. Output Data Clock (250MHz) 2 clock_slip TABLE 12. DLL RANGES FIGURE 42. PHASE SLIP ADDRESS 0X72: CLOCK_DIVIDE The ISLA214P has a selectable clock divider that can be set to divide by four, two or one (no division). By default, the tri-level CLKDIV pin selects the divisor. This functionality can be overridden and controlled through the SPI, as shown in Table 9. This register is not changed by a Soft Reset. TABLE 9. CLOCK DIVIDER SELECTION VALUE 0x72[2:0] CLOCK DIVIDER 000 Pin Control 001 Divide by 1 010 Divide by 2 100 Divide by 4 other Not Allowed ADDRESS 0X73: OUTPUT_MODE_A The output_mode_A register controls the physical output format of the data, as well as the logical coding. The ISLA214P can 27 DLL RANGE MIN MAX UNIT Slow 40 100 MSPS Fast 80 250 MSPS ADDRESS 0XB6: CALIBRATION STATUS The LSB at address 0xB6 can be read to determine calibration status. The bit is ‘0’ during calibration and goes to a logic ‘1’ when calibration is complete.This register is unique in that it can be read after POR at calibration, unlike the other registers on chip, which can’t be read until calibration is complete. DEVICE TEST The ISLA214P can produce preset or user defined patterns on the digital outputs to facilitate in-situ testing. A user can pick from preset built-in patterns by writing to the output test mode field [7:4] at 0xC0 or user defined patterns by writing to the user test mode field [2:0] at 0xC0. The user defined patterns should be loaded at address space 0xC1 through 0xD0, see the “SPI Memory Map” on page 30 for more detail.The predefined patterns are shown in Table 13. The test mode is enabled asynchronously to the sample clock, therefore several sample clock cycles may elapse before the data is present on the output bus. FN7572.2 December 5, 2012 ISLA214P ADDRESS 0XC0: TEST_IO ADDRESS 0XCD: USER_PATT7_LSB Bits 7:4 Output Test Mode These bits set the test mode according to Table 13. Other values are reserved.User test patterns loaded at 0xC1 through 0xD0 are also available by writing ‘1000’ to [7:4] at 0xC0 and a pattern depth value to [2:0] at 0xC0. See the memory map. ADDRESS 0XCE: USER_PATT7_MSB Bits 2:0 User Test Mode The three LSBs in this register determine the test pattern in combination with registers 0xC1 through 0xD0. Refer to the SPI Memory Map on page 30. ADDRESS 0XD0: USER_PATT8_MSB TABLE 13. OUTPUT TEST MODES VALUE 0xC0[7:4] OUTPUT TEST MODE 0000 Off 0001 Midscale WORD 1 WORD 2 0x8000 N/A 0010 Positive Full-Scale 0xFFFF N/A 0011 Negative Full-Scale 0x0000 N/A 0100 SDR/DDR Dependent N/A N/A 0101 Reserved N/A N/A 0110 Reserved N/A N/A 0111 SDR/DDR Dependent N/A N/A 1000 User Pattern user_patt1 user_patt2 1001 Reserved N/A N/A 1010 Ramp N/A N/A ADDRESS 0XC1: USER_PATT1_LSB These registers define the lower and upper eight bits, respectively, of the user-defined pattern 7. ADDRESS 0XCF: USER_PATT8_LSB These registers define the lower and upper eight bits, respectively, of the user-defined pattern 8. ADDRESS 0XFE: OFFSET/GAIN_ADJUST_ENABLE Bit 0 at this register must be set high to enable adjustment of offset coarse and fine adjustments (0x20 and 0x21), and gain medium and fine adjustments (0x23 and 0x24). It is recommended that new data be written to the offset and gain adjustment registers and while Bit 0 is a '0'. Subsequently, Bit 0 should be set to '1' to allow the values written to the aforementioned registers to be used by the ADC. Bit 0 should be set to a '0' upon completion. Digital Temperature Sensor ADDRESS 0X4B: TEMP_COUNTER_HIGH Bits [2:0] of this register hold the 3 MSBs of the 11-bit temperature code. Bit [7] of this register indicates a valid temperature_counter read was performed. A logic ‘1’ indicates a valid read. ADDRESS 0X4C: TEMP_COUNTER_LOW ADDRESS 0XC2: USER_PATT1_MSB Bits [7:0] of this register hold the lower 8 LSBs of the 11-bit temperature code. These registers define the lower and upper eight bits, respectively, of the user-defined pattern 1. ADDRESS 0X4D: TEMP_COUNTER_CONTROL ADDRESS 0XC3: USER_PATT2_LSB ADDRESS 0XC4: USER_PATT2_MSB These registers define the lower and upper eight bits, respectively, of the user-defined pattern 2 Bit [7] Measurement mode select bit, set to ‘1’ for recommended PTAT mode. ‘0’ (default) is IPTAT mode and is less accurate and not recommended. Bit [6] Temperature counter enable bit. Set to ‘1’ to enable. ADDRESS 0XC5: USER_PATT3_LSB Bit [5] Temperature counter power down bit. Set to ‘1’ to power-down temperature counter. ADDRESS 0XC6: USER_PATT3_MSB Bit [4] Temperature counter reset bit. Set to ‘1’ to reset count. These registers define the lower and upper eight bits, respectively, of the user-defined pattern 3 Bit [3:1] Three bit frequency divider field. Sets temperature counter update rate. Update rate is proportional to ADC sample clock rate and divide ratio. A ‘101’ updates the temp counter every ~ 66µs (for 250MSPS). Faster updates rates result in lower precision. ADDRESS 0XC7: USER_PATT4_LSB ADDRESS 0XC8: USER_PATT4_MSB These registers define the lower and upper eight bits, respectively, of the user-defined pattern 4. ADDRESS 0XC9: USER_PATT5_LSB ADDRESS 0XCA: USER_PATT5_MSB These registers define the lower and upper eight bits, respectively, of the user-defined pattern 5. ADDRESS 0XCB: USER_PATT6_LSB ADDRESS 0XCC: USER_PATT6_MSB Bit [0] Select sampler bit. Set to ‘0’. This set of registers provides digital access to an PTAT or IPTAT-based temperature sensor, allowing the system to estimate the temperature of the die, allowing easy access to information that can be used to decide when to recalibrate the A/D as needed. The nominal transfer function of the temperature monitor should be estimated for each device by reading the temperature sensor at two temperatures and extrapolating a line through these two points. These registers define the lower and upper eight bits, respectively, of the user-defined pattern 6. 28 FN7572.2 December 5, 2012 ISLA214P A typical temperature measurement can occur as follows: 1. Write ‘0xCA’ to address 0x4D - enable temp counter, divide=’101’ 2. Wait ≥ 132µs (at 250Msps) - longer wait time ensures the sensor completes one valid cycle. 3. Write ‘0x20’ to address 0x4D - power down, disable temp counter-recommended between measurements. This ensures that the output does not change between MSB and LSB reads. 4. Read address 0x4B (MSBs) 5. Read address 0x4C (LSBs) 6. Record temp code value 7. Write ‘0x20’ to address 0x4D - power-down, disable temp counter. Contact the factory for more information if needed. 29 FN7572.2 December 5, 2012 ISLA214P Device Config/Control Device Config/Control DUT Info SPI Config/Control SPI Memory Map ADDR. (Hex) PARAMETER NAME BIT 7 (MSB) BIT 6 BIT 5 00 Port_config SDO Active LSB First Soft Reset BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 (LSB) Mirror (bit5) Mirror (bit6) Mirror (bit7) DEF. VALUE (HEX) 00h 01 Reserved Reserved 02 Burst_end Burst end address [7:0] 03-07 Reserved Reserved 08 Chip_id Chip ID # Read only Read only 09 Chip_version Chip Version # 0A-0F Reserved Reserved 10-1F Reserved Reserved 20 Offset_coarse_adc0 Coarse Offset 21 Offset_fine_adc0 Fine Offset 22 Gain_coarse_adc0 23 Gain_medium_adc0 Reserved Gain_fine_adc0 Modes_adc0 26 Offset_coarse_adc1 Coarse Offset 27 Offset_fine_adc1 Fine Offset 28 Gain_coarse_adc1 29 Gain_medium_adc1 Modes_adc1 cal. value cal. value Fine Gain Reserved Gain_fine_adc1 cal. value Medium Gain 24 2A cal. value Coarse Gain 25 2B 00h cal. value Power Down Mode ADC0 [2:0] 000 = Pin Control 001 = Normal Operation 010 = Nap 100 = Sleep Other codes = Reserved Reserved 00h NOT reset by Soft Reset cal. value cal. value Coarse Gain cal. value Medium Gain cal. value Fine Gain Reserved cal. value 00h NOT reset by Soft Reset Power Down Mode ADC1 [2:0] 000 = Pin Control 001 = Normal Operation 010 = Nap 100 = Sleep Other codes = Reserved 2C-2F Reserved Reserved 30-4A Reserved Reserved 4B Temp_counter_high 4C Temp_counter_low Temp Counter [10:8] Read only Temp Counter [7:0] 4D Temp_counter_control 4E-6F Reserved Enable PD Reset Reserved 70 Skew_diff Differential Skew 71 Phase_slip 72 Clock_divide 73 Output_mode_A Output Mode [7:5] 000 = LVDS 3mA (Default) 001 = LVDS 2mA 100 = LVCMOS Other codes = Reserved 74 Output_mode_B DLL Range 0 = Fast 1 = Slow Default=’0’ 75-B5 Reserved Reserved DDR Enable Read only Divider [2:0] Select 00h 80h Next Clock Edge 00h Clock Divide [2:0] 000 = Pin Control 001 = divide by 1 010 = divide by 2 100 = divide by 4 Other codes = Reserved 00h NOT reset by Soft Reset Output Format [2:0] 000 = Two’s Complement (Default) 010 = Gray Code 100 = Offset Binary Other codes = Reserved 00h NOT reset by Soft Reset 00h NOT reset by Soft Reset Reserved 30 FN7572.2 December 5, 2012 ISLA214P Device Test SPI Memory Map ADDR. (Hex) PARAMETER NAME B6 Cal_status B7-BF Reserved C0 Test_io (Continued) BIT 7 (MSB) BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 (LSB) Calibration Done Output Test Mode [7:4] User Test Mode [2:0] Part in SDR Mode 0 = Off (Note 18) 1 = Midscale Short 2 = +FS Short 3 = -FS Short 4 = Checkerboard Output (0xAAAA, 0x5555) (Note19 7 = 0xFFFF, 0x0000 all on pattern (Note20) 8 = User Pattern (1 to 8 deep, MSB Justified) 10 = Ramp 5, 6, 9, 11-15 = Reserved Part in SDR Mode 0 = User pattern 1 only 1 = Cycle pattern 1 through 2 2 = Cycle pattern 1 through 3 3 = Cycle pattern 1 through 4 4 = Cycle pattern 1 through 5 5= Cycle pattern 1 through 6 6 = Cycle pattern 1 through7 7 = Cycle pattern 1 through 8 Part in DDR Mode 0 = Off (Note 18) 1 = Midscale Short 2 = +FS Short 3 = -FS Short 4 = Reserved (Note19) 7 = Reserved (Note20) 8 = User Pattern (1 to 4 deep,MSB Justified) 10 = Ramp 5, 6, 9, 11-15 = Reserved Part in DDR Mode 0 = User pattern 1 only 1 = Cycle pattern 1,3 2 = Cycle pattern 1,3,5 3 = Cycle pattern 1,3,5,7 DEF. VALUE (HEX) Read Only 00h 4-7 = NA C1 User_patt1_lsb B7 B6 B5 B4 B3 B2 B1 B0 0x00 C2 User_patt1_msb B15 B14 B13 B12 B11 B10 B9 B8 00h C3 User_patt2_lsb B7 B6 B5 B4 B3 B2 B1 B0 00h C4 User_patt2_msb B15 B14 B13 B12 B11 B10 B9 B8 00h C5 User_patt3_lsb B7 B6 B5 B4 B3 B2 B1 B0 00h C6 User_patt3_msb B15 B14 B13 B12 B11 B10 B9 B8 00h C7 User_patt4_lsb B7 B6 B5 B4 B3 B2 B1 B0 00h C8 User_patt4_msb B15 B14 B13 B12 B11 B10 B9 B8 00h C9 User_patt5_lsb B7 B6 B5 B4 B3 B2 B1 B0 00h CA User_patt5_msb B15 B14 B13 B12 B11 B10 B9 B8 00h CB User_patt6_lsb B7 B6 B5 B4 B3 B2 B1 B0 00h CC User_patt6_msb B15 B14 B13 B12 B11 B10 B9 B8 00h CD User_patt7_lsb B7 B6 B5 B4 B3 B2 B1 B0 00h CE User_patt7_msb B15 B14 B13 B12 B11 B10 B9 B8 00h CF User_patt8_lsb B7 B6 B5 B4 B3 B2 B1 B0 00h B15 B14 B13 B12 B11 B10 B9 B8 00h Enable “1” = Enable 00h D0 User_patt8_msb D1-FD Reserved FE Offset/Gain_Adjust_Enable FF Reserved Reserved Reserved Reserved NOTES: 18. During Calibration xCCCC (MSB justified) is presented at the output data bus, toggling on the LSB (and higher) data bits occurs at completion of calibration. This behavior can be used as an option to determine calibration state. 19. Use test_io = 0x80 and User Pattern 1 = 0x9999 for Checkerboard outputs in DDR mode. In SDR mode, write ‘0x41’ to test_io for Checkerboard outputs. 20. Use test_io = 0x80 and User Pattern 1 = 0xAAAA for all ones/zeroes outputs in DDR mode. In SDR mode, write ‘0x71’ to test_io for all ones/zeroes outputs 31 FN7572.2 December 5, 2012 ISLA214P Equivalent Circuits AVDD TO CLOCK-PHASE GENERATION AVDD CLKP AVDD AVDD CSAMP 4pF TO CHARGE PIPELINE INP E2 E1 600 AVDD TO CHARGE PIPELINE INN E2 E1 18k E3 CSAMP 4pF AVDD 11k CLKN E3 FIGURE 43. ANALOG INPUTS AVDD 18k 11k FIGURE 44. CLOCK INPUTS AVDD (20k PULL-UP ON RESETN ONLY) AVDD 75k AVDD OVDD TO SENSE LOGIC 75k 280 INPUT OVDD OVDD 20k INPUT 75k TO LOGIC 280 75k FIGURE 46. DIGITAL INPUTS FIGURE 45. TRI-LEVEL DIGITAL INPUTS OVDD 2mA OR 3mA OVDD DATA DATA OVDD OVDD D[13:0]P OVDD DATA D[13:0] D[13:0]N DATA DATA 2mA OR 3mA FIGURE 47. LVDS OUTPUTS 32 FIGURE 48. CMOS OUTPUTS FN7572.2 December 5, 2012 ISLA214P Equivalent Circuits (Continued) AVDD VCM 0.94V + – FIGURE 49. VCM_OUT OUTPUT A/D Evaluation Platform LVDS Outputs Intersil offers an A/D Evaluation platform which can be used to evaluate any of Intersil’s high speed A/D products. The platform consists of a FPGA based data capture motherboard and a family of A/D daughtercards. This USB based platform allows a user to quickly evaluate the A/D’s performance at a user’s specific application frequency requirements. More information is available at http://www.intersil.com/converters/adc_eval_platform/ Output traces and connections must be designed for 50Ω (100Ω differential) characteristic impedance. Keep traces direct and minimize bends where possible. Avoid crossing ground and power-plane breaks with signal traces. Layout Considerations Split Ground and Power Planes Data converters operating at high sampling frequencies require extra care in PC board layout. Many complex board designs benefit from isolating the analog and digital sections. Analog supply and ground planes should be laid out under signal and clock inputs. Locate the digital planes under outputs and logic pins. Grounds should be joined under the chip. Clock Input Considerations Use matched transmission lines to the transformer inputs for the analog input and clock signals. Locate transformers and terminations as close to the chip as possible. Exposed Paddle The exposed paddle must be electrically connected to analog ground (AVSS) and should be connected to a large copper plane using numerous vias for optimal thermal performance. Bypass and Filtering Bulk capacitors should have low equivalent series resistance. Tantalum is a good choice. For best performance, keep ceramic bypass capacitors very close to device pins. Longer traces will increase inductance, resulting in diminished dynamic performance and accuracy. Make sure that connections to ground are direct and low impedance. Avoid forming ground loops. 33 LVCMOS Outputs Output traces and connections must be designed for 50Ω characteristic impedance. Unused Inputs Standard logic inputs (RESETN, CSB, SCLK, SDIO, SDO) which will not be operated do not require connection to ensure optimal A/D performance. These inputs can be left floating if they are not used. Tri-level inputs (NAPSLP) accept a floating input as a valid state, and therefore should be biased according to the desired functionality. Definitions Analog Input Bandwidth is the analog input frequency at which the spectral output power at the fundamental frequency (as determined by FFT analysis) is reduced by 3dB from its full-scale low-frequency value. This is also referred to as Full Power Bandwidth. Aperture Delay or Sampling Delay is the time required after the rise of the clock input for the sampling switch to open, at which time the signal is held for conversion. Aperture Jitter is the RMS variation in aperture delay for a set of samples. Clock Duty Cycle is the ratio of the time the clock wave is at logic high to the total time of one clock period. Differential Non-Linearity (DNL) is the deviation of any code width from an ideal 1 LSB step. FN7572.2 December 5, 2012 ISLA214P Effective Number of Bits (ENOB) is an alternate method of specifying Signal to Noise-and-Distortion Ratio (SINAD). In dB, it is calculated as: ENOB = (SINAD - 1.76)/6.02 Pipeline Delay is the number of clock cycles between the initiation of a conversion and the appearance at the output pins of the data. Gain Error is the ratio of the difference between the voltages that cause the lowest and highest code transitions to the full-scale voltage less than 2 LSB. It is typically expressed in percent. Power Supply Rejection Ratio (PSRR) is the ratio of the observed magnitude of a spur in the A/D FFT, caused by an AC signal superimposed on the power supply voltage. I2E The Intersil Interleave Engine. This highly configurable circuitry performs estimates of offset, gain, and sample time skew mismatches between the core converters, and updates analog adjustments for each to minimize interleave spurs. Signal to Noise-and-Distortion (SINAD) is the ratio of the RMS signal amplitude to the RMS sum of all other spectral components below one half the clock frequency, including harmonics but excluding DC. Integral Non-Linearity (INL) is the maximum deviation of the A/D’s transfer function from a best fit line determined by a least squares curve fit of that transfer function, measured in units of LSBs. Signal-to-Noise Ratio (without Harmonics) is the ratio of the RMS signal amplitude to the RMS sum of all other spectral components below one-half the sampling frequency, excluding harmonics and DC. Least Significant Bit (LSB) is the bit that has the smallest value or weight in a digital word. Its value in terms of input voltage is VFS/(2N-1) where N is the resolution in bits. SNR and SINAD are either given in units of dB when the power of the fundamental is used as the reference, or dBFS (dB to full scale) when the converter’s full-scale input power is used as the reference. Missing Codes are output codes that are skipped and will never appear at the A/D output. These codes cannot be reached with any input value. Most Significant Bit (MSB) is the bit that has the largest value or weight. Spurious-Free-Dynamic Range (SFDR) is the ratio of the RMS signal amplitude to the RMS value of the largest spurious spectral component. The largest spurious spectral component may or may not be a harmonic. Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that you have the latest revision. DATE REVISION CHANGE November 27, 2012 FN7572.2 Improved the accuracy and clarity of the datasheet. May 11, 2011 FN7572.1 Initial Release About Intersil Intersil Corporation is a leader in the design and manufacture of high-performance analog, mixed-signal and power management semiconductors. The company's products address some of the fastest growing markets within the industrial and infrastructure, personal computing and high-end consumer markets. For more information about Intersil or to find out how to become a member of our winning team, visit our website and career page at www.intersil.com. For a complete listing of Applications, Related Documentation and Related Parts, please see the respective product information page. Also, please check the product information page to ensure that you have the most updated datasheet: ISLA214P To report errors or suggestions for this datasheet, please go to: www.intersil.com/askourstaff Reliability reports are available from our website at: http://rel.intersil.com/reports/search.php For additional products, see www.intersil.com/product_tree Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 34 FN7572.2 December 5, 2012 ISLA214P Package Outline Drawing L72.10x10E 72 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 0, 11/09 A X 10.00 9.75 72 Z EXPOSED PAD AREA B 6 PIN #1 INDEX AREA 72 1 1 6 PIN 1 INDEX AREA 8.500 REF. (4X) 9.75 3.000 REF. 6.000 REF. 10.00 0.100 M C A B (4X) 0.15 4.150 REF. TOP VIEW 7.150 REF. 0.100 M C A B BOTTOM VIEW 11° ALL AROUND 9.75 ±0.10 Y C0.400X45° (4X) 10.00 ±0.10 (0.350) 0.450 R0.200 SIDE VIEW 25 .1 (0 (4X 9.70) LL A A O R D N ) 1 C0.190X45° (4.15 REF) U (1.500) (7.15) 0.500 ±0.100 72 R0.115 TYP. (3.00 ) (4X 8.50) (6.00) DETAIL "Z" R0.200 MAX. ALL AROUND TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ANSI Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.10 Angular ±2.50° 4. Dimension applies to the metallized terminal and is measured between 0.015mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 indentifier may be 7. Package outline compliant to JESD-M0220. 0.190~0.245 SEATING PLANE 0.080 C 0.50 0.025 ±0.020 0.23 ±0.050 0.85 ±0.050 0.100 C ( 72X 0 .70) 0.650 ±0.050 ( 72X 0 .23) DETAIL "X" C 0.100 M C A B 0.050 M C DETAIL "Y" either a mold or mark feature. 35 FN7572.2 December 5, 2012