LM111-N, LM211-N, LM311-N www.ti.com SNOSBJ1E – MAY 1999 – REVISED MARCH 2013 LM111-N/LM211-N/LM311-N Voltage Comparator Check for Samples: LM111-N, LM211-N, LM311-N FEATURES 1 • • • • • 2 Operates From Single 5V Supply Input Current: 150 nA Max. Over Temperature Offset Current: 20 nA Max. Over Temperature Differential Input Voltage Range: ±30V Power Consumption: 135 mW at ±15V DESCRIPTION The LM111-N, LM211-N and LM311-N are voltage comparators that have input currents nearly a thousand times lower than devices like the LM106 or LM710. They are also designed to operate over a wider range of supply voltages: from standard ±15V op amp supplies down to the single 5V supply used for IC logic. Their output is compatible with RTL, DTL and TTL as well as MOS circuits. Further, they can drive lamps or relays, switching voltages up to 50V at currents as high as 50 mA. Both the inputs and the outputs of the LM111-N, LM211-N or the LM311-N can be isolated from system ground, and the output can drive loads referred to ground, the positive supply or the negative supply. Offset balancing and strobe capability are provided and outputs can be wire OR'ed. Although slower than the LM106 and LM710 (200 ns response time vs 40 ns) the devices are also much less prone to spurious oscillations. The LM111-N has the same pin configuration as the LM106 and LM710. The LM211-N is identical to the LM111-N, except that its performance is specified over a −25°C to +85°C temperature range instead of −55°C to +125°C. The LM311-N has a temperature range of 0°C to +70°C. Typical Applications NOTE Pin connections shown in Schematic Diagram and Typical Applications are for the LMC TO-99 package. Do Not Ground Strobe Pin. Output is turned off when current is pulled from Strobe Pin. Figure 1. Offset Balancing Figure 2. Strobing 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2013, Texas Instruments Incorporated LM111-N, LM211-N, LM311-N SNOSBJ1E – MAY 1999 – REVISED MARCH 2013 www.ti.com Increases typical common mode slew from 7.0V/μs to 18V/μs. Figure 3. Increasing Input Stage Current Figure 4. Detector for Magnetic Transducer *Absorbs inductive kickback of relay and protects IC from severe voltage transients on V++ line. Do Not Ground Strobe Pin. Figure 5. Digital Transmission Isolator Do Not Ground Strobe Pin. Typical input current is 50 pA with inputs strobed off. Pin connections shown in Schematic Diagram and Typical Applications are for the LMC TO-99 package. Figure 7. Strobing off Both Input and Output Stages 2 Submit Documentation Feedback Figure 6. Relay Driver with Strobe *Solid tantalum Figure 8. Positive Peak Detector Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM111-N LM211-N LM311-N LM111-N, LM211-N, LM311-N www.ti.com SNOSBJ1E – MAY 1999 – REVISED MARCH 2013 Figure 9. Zero Crossing Detector Driving MOS Logic These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM111-N LM211-N LM311-N Submit Documentation Feedback 3 LM111-N, LM211-N, LM311-N SNOSBJ1E – MAY 1999 – REVISED MARCH 2013 www.ti.com Absolute Maximum Ratings for the LM111-N/LM211-N (1) (2) Total Supply Voltage (V84) 36V Output to Negative Supply Voltage (V74) 50V Ground to Negative Supply Voltage (V14) 30V Differential Input Voltage ±30V Input Voltage (3) ±15V Output Short Circuit Duration 10 sec Operating Temperature Range LM111-N −55°C to 125°C LM211-N −25°C to 85°C Lead Temperature (Soldering, 10 sec) 260°C Voltage at Strobe Pin V+−5V Soldering Information Dual-In-Line Package Soldering (10 seconds) 260°C Small Outline Package Vapor Phase (60 seconds) 215°C Infrared (15 seconds) 220°C ESD Rating (4) (1) (2) (3) (4) 300V Refer to RETS111X for the LM111H, LM111J and LM111J-8 military specifications. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. This rating applies for ±15 supplies. The positive input voltage limit is 30V above the negative supply. The negative input voltage limit is equal to the negative supply voltage or 30V below the positive supply, whichever is less. Human body model, 1.5 kΩ in series with 100 pF. Electrical Characteristics (1) for the LM111-N and LM211-N Typ Max Units Input Offset Voltage (2) Parameter TA=25°C, RS≤50k 0.7 3.0 mV Input Offset Current TA=25°C 4.0 10 nA Input Bias Current TA=25°C 60 100 Voltage Gain TA=25°C Response Time (3) Saturation Voltage Strobe ON Current (4) Output Leakage Current Input Offset Voltage (2) Conditions Min 40 nA 200 V/mV TA=25°C 200 ns VIN≤−5 mV, IOUT=50 mA TA=25°C 0.75 1.5 V TA=25°C 2.0 5.0 mA VIN≥5 mV, VOUT=35V, TA=25°C, ISTROBE=3 mA 0.2 10 nA 4.0 mV 20 nA 150 nA 13.8-14.7 13.0 V V RS≤50 k Input Offset Current (2) Input Bias Current Input Voltage Range V+=15V, V−=−15V, Pin 7 Pull-Up May Go To 5V Saturation Voltage V+≥4.5V, V−=0, VIN≤−6 mV, IOUT≤8 mA 0.23 0.4 Output Leakage Current VIN≥5 mV, VOUT=35V 0.1 0.5 μA Positive Supply Current TA=25°C 5.1 6.0 mA Negative Supply Current TA=25°C 4.1 5.0 mA (1) (2) (3) (4) 4 −14.5 These specifications apply for VS=±15V and Ground pin at ground, and −55°C≤TA≤+125°C, unless otherwise stated. With the LM211-N, however, all temperature specifications are limited to −25°C≤TA≤+85°C. The offset voltage, offset current and bias current specifications apply for any supply voltage from a single 5V supply up to ±15V supplies. The offset voltages and offset currents given are the maximum values required to drive the output within a volt of either supply with a 1 mA load. Thus, these parameters define an error band and take into account the worst-case effects of voltage gain and RS. The response time specified (see definitions) is for a 100 mV input step with 5 mV overdrive. This specification gives the range of current which must be drawn from the strobe pin to ensure the output is properly disabled. Do not short the strobe pin to ground; it should be current driven at 3 to 5 mA. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM111-N LM211-N LM311-N LM111-N, LM211-N, LM311-N www.ti.com SNOSBJ1E – MAY 1999 – REVISED MARCH 2013 Absolute Maximum Ratings for the LM311-N (1) (2) Total Supply Voltage (V84) 36V Output to Negative Supply Voltage (V74) 40V Ground to Negative Supply Voltage (V14) 30V Differential Input Voltage ±30V Input Voltage (3) ±15V Power Dissipation (4) 500 mW ESD Rating (5) 300V Output Short Circuit Duration 10 sec Operating Temperature Range 0° to 70°C −65°C to 150°C Storage Temperature Range Lead Temperature (soldering, 10 sec) 260°C Voltage at Strobe Pin V+−5V Soldering Information (1) (2) (3) (4) (5) Dual-In-Line Package Soldering (10 seconds) 260°C Small Outline Package Vapor Phase (60 seconds) 215°C Infrared (15 seconds) 220°C “Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits.” If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. This rating applies for ±15V supplies. The positive input voltage limit is 30V above the negative supply. The negative input voltage limit is equal to the negative supply voltage or 30V below the positive supply, whichever is less. The maximum junction temperature of the LM311-N is 110°C. For operating at elevated temperature, devices in the LMC package must be derated based on a thermal resistance of 165°C/W, junction to ambient, or 20°C/W, junction to case. The thermal resistance of the dual-in-line package is 100°C/W, junction to ambient. Human body model, 1.5 kΩ in series with 100 pF. Electrical Characteristics (1) for the LM311-N Parameter (2) Conditions Min Typ Max Units TA=25°C, RS≤50k 2.0 7.5 mV Input Offset Current (2) TA=25°C 6.0 50 nA Input Bias Current TA=25°C 100 250 Voltage Gain TA=25°C Response Time (3) Saturation Voltage Input Offset Voltage nA 200 V/mV TA=25°C 200 ns VIN≤−10 mV, IOUT=50 mA , TA=25°C 0.75 1.5 V Strobe ON Current (4) TA=25°C 2.0 5.0 mA Output Leakage Current VIN≥10 mV, VOUT=35V TA=25°C, ISTROBE=3 mA V− = Pin 1 = −5V 0.2 50 nA Input Offset Voltage (2) RS≤50K 10 mV Input Offset Current 40 (2) 70 nA 300 nA 13.8,−14.7 13.0 V Input Bias Current −14.5 Input Voltage Range − + Saturation Voltage V ≥4.5V, V =0, VIN≤−10 mV, IOUT≤8 mA 0.23 0.4 V Positive Supply Current TA=25°C 5.1 7.5 mA Negative Supply Current TA=25°C 4.1 5.0 mA (1) (2) (3) (4) These specifications apply for VS=±15V and Pin 1 at ground, and 0°C < TA < +70°C, unless otherwise specified. The offset voltage, offset current and bias current specifications apply for any supply voltage from a single 5V supply up to ±15V supplies. The offset voltages and offset currents given are the maximum values required to drive the output within a volt of either supply with 1 mA load. Thus, these parameters define an error band and take into account the worst-case effects of voltage gain and RS. The response time specified (see definitions) is for a 100 mV input step with 5 mV overdrive. This specification gives the range of current which must be drawn from the strobe pin to ensure the output is properly disabled. Do not short the strobe pin to ground; it should be current driven at 3 to 5 mA. Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM111-N LM211-N LM311-N Submit Documentation Feedback 5 LM111-N, LM211-N, LM311-N SNOSBJ1E – MAY 1999 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics LM111-N/LM211-N 6 Input Bias Current Input Bias Current Figure 10. Figure 11. Input Bias Current Input Bias Current Figure 12. Figure 13. Input Bias Current Input Bias Current Figure 14. Figure 15. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM111-N LM211-N LM311-N LM111-N, LM211-N, LM311-N www.ti.com SNOSBJ1E – MAY 1999 – REVISED MARCH 2013 Typical Performance Characteristics LM111-N/LM211-N (continued) Input Bias Current Input Overdrives Input Bias Current Input Overdrives Figure 16. Figure 17. Input Bias Current Response Time for Various Input Overdrives Figure 18. Figure 19. Response Time for Various Input Overdrives Output Limiting Characteristics Figure 20. Figure 21. Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM111-N LM211-N LM311-N Submit Documentation Feedback 7 LM111-N, LM211-N, LM311-N SNOSBJ1E – MAY 1999 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics LM111-N/LM211-N (continued) Supply Current Supply Current Figure 22. Figure 23. Leakage Currents Figure 24. 8 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM111-N LM211-N LM311-N LM111-N, LM211-N, LM311-N www.ti.com SNOSBJ1E – MAY 1999 – REVISED MARCH 2013 Typical Performance Characteristics LM311-N Input Bias Current Input Offset Current Figure 25. Figure 26. Offset Error Input Characteristics Figure 27. Figure 28. Common Mode Limits Transfer Function Figure 29. Figure 30. Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM111-N LM211-N LM311-N Submit Documentation Feedback 9 LM111-N, LM211-N, LM311-N SNOSBJ1E – MAY 1999 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics LM311-N (continued) 10 Response Time for Various Input Overdrives Response Time for Various Input Overdrives Figure 31. Figure 32. Output Saturation Voltage Response Time for Various Input Overdrives Figure 33. Figure 34. Response Time for Various Input Overdrives Output Limiting Characteristics Figure 35. Figure 36. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM111-N LM211-N LM311-N LM111-N, LM211-N, LM311-N www.ti.com SNOSBJ1E – MAY 1999 – REVISED MARCH 2013 Typical Performance Characteristics LM311-N (continued) Supply Current Supply Current Figure 37. Figure 38. Leakage Currents Figure 39. Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM111-N LM211-N LM311-N Submit Documentation Feedback 11 LM111-N, LM211-N, LM311-N SNOSBJ1E – MAY 1999 – REVISED MARCH 2013 www.ti.com APPLICATION HINTS CIRCUIT TECHNIQUES FOR AVOIDING OSCILLATIONS IN COMPARATOR APPLICATIONS When a high-speed comparator such as the LM111-N is used with fast input signals and low source impedances, the output response will normally be fast and stable, assuming that the power supplies have been bypassed (with 0.1 μF disc capacitors), and that the output signal is routed well away from the inputs (pins 2 and 3) and also away from pins 5 and 6. However, when the input signal is a voltage ramp or a slow sine wave, or if the signal source impedance is high (1 kΩ to 100 kΩ), the comparator may burst into oscillation near the crossing-point. This is due to the high gain and wide bandwidth of comparators like the LM111-N. To avoid oscillation or instability in such a usage, several precautions are recommended, as shown in Figure 40 below. 1. The trim pins (pins 5 and 6) act as unwanted auxiliary inputs. If these pins are not connected to a trim-pot, they should be shorted together. If they are connected to a trim-pot, a 0.01 μF capacitor C1 between pins 5 and 6 will minimize the susceptibility to AC coupling. A smaller capacitor is used if pin 5 is used for positive feedback as in Figure 40. 2. Certain sources will produce a cleaner comparator output waveform if a 100 pF to 1000 pF capacitor C2 is connected directly across the input pins. 3. When the signal source is applied through a resistive network, RS, it is usually advantageous to choose an RS′ of substantially the same value, both for DC and for dynamic (AC) considerations. Carbon, tin-oxide, and metal-film resistors have all been used successfully in comparator input circuitry. Inductive wirewound resistors are not suitable. 4. When comparator circuits use input resistors (eg. summing resistors), their value and placement are particularly important. In all cases the body of the resistor should be close to the device or socket. In other words there should be very little lead length or printed-circuit foil run between comparator and resistor to radiate or pick up signals. The same applies to capacitors, pots, etc. For example, if RS=10 kΩ, as little as 5 inches of lead between the resistors and the input pins can result in oscillations that are very hard to damp. Twisting these input leads tightly is the only (second best) alternative to placing resistors close to the comparator. 5. Since feedback to almost any pin of a comparator can result in oscillation, the printed-circuit layout should be engineered thoughtfully. Preferably there should be a groundplane under the LM111-N circuitry, for example, one side of a double-layer circuit card. Ground foil (or, positive supply or negative supply foil) should extend between the output and the inputs, to act as a guard. The foil connections for the inputs should be as small and compact as possible, and should be essentially surrounded by ground foil on all sides, to guard against capacitive coupling from any high-level signals (such as the output). If pins 5 and 6 are not used, they should be shorted together. If they are connected to a trim-pot, the trim-pot should be located, at most, a few inches away from the LM111-N, and the 0.01 μF capacitor should be installed. If this capacitor cannot be used, a shielding printed-circuit foil may be advisable between pins 6 and 7. The power supply bypass capacitors should be located within a couple inches of the LM111-N. (Some other comparators require the power-supply bypass to be located immediately adjacent to the comparator.) 6. It is a standard procedure to use hysteresis (positive feedback) around a comparator, to prevent oscillation, and to avoid excessive noise on the output because the comparator is a good amplifier for its own noise. In the circuit of Figure 41, the feedback from the output to the positive input will cause about 3 mV of hysteresis. However, if RS is larger than 100Ω, such as 50 kΩ, it would not be reasonable to simply increase the value of the positive feedback resistor above 510 kΩ. The circuit of Figure 42 could be used, but it is rather awkward. See the notes in paragraph 7 below. 7. When both inputs of the LM111-N are connected to active signals, or if a high-impedance signal is driving the positive input of the LM111-N so that positive feedback would be disruptive, the circuit of Figure 40 is ideal. The positive feedback is to pin 5 (one of the offset adjustment pins). It is sufficient to cause 1 to 2 mV hysteresis and sharp transitions with input triangle waves from a few Hz to hundreds of kHz. The positivefeedback signal across the 82Ω resistor swings 240 mV below the positive supply. This signal is centered around the nominal voltage at pin 5, so this feedback does not add to the VOS of the comparator. As much as 8 mV of VOS can be trimmed out, using the 5 kΩ pot and 3 kΩ resistor as shown. 8. These application notes apply specifically to the LM111-N, LM211-N, LM311-N, and LF111 families of comparators, and are applicable to all high-speed comparators in general, (with the exception that not all comparators have trim pins). 12 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM111-N LM211-N LM311-N LM111-N, LM211-N, LM311-N www.ti.com SNOSBJ1E – MAY 1999 – REVISED MARCH 2013 Pin connections shown are for LM111H in the LMC hermetic package. Figure 40. Improved Positive Feedback Pin connections shown are for LM111H in the LMC hermetic package. Figure 41. Conventional Positive Feedback Figure 42. Positive Feedback with High Source Resistance Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM111-N LM211-N LM311-N Submit Documentation Feedback 13 LM111-N, LM211-N, LM311-N SNOSBJ1E – MAY 1999 – REVISED MARCH 2013 www.ti.com Typical Applications (Pin numbers refer to LMC package) Figure 43. Zero Crossing Detector Driving MOS Switch *TTL or DTL fanout of two Figure 44. 100 kHz Free Running Multivibrator *Adjust for symmetrical square wave time when VIN = 5 mV †Minimum capacitance 20 pF Maximum frequency 50 kHz Figure 45. 10 Hz to 10 kHz Voltage Controlled Oscillator 14 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM111-N LM211-N LM311-N LM111-N, LM211-N, LM311-N www.ti.com SNOSBJ1E – MAY 1999 – REVISED MARCH 2013 *Input polarity is reversed when using pin 1 as output. Figure 46. Driving Ground-Referred Load Figure 47. Using Clamp Diodes to Improve Response *Values shown are for a 0 to 30V logic swing and a 15V threshold. †May be added to control speed and reduce susceptibility to noise spikes. Figure 48. TTL Interface with High Level Logic Figure 49. Crystal Oscillator Figure 50. Comparator and Solenoid Driver Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM111-N LM211-N LM311-N Submit Documentation Feedback 15 LM111-N, LM211-N, LM311-N SNOSBJ1E – MAY 1999 – REVISED MARCH 2013 www.ti.com *Solid tantalum †Adjust to set clamp level Figure 51. Precision Squarer *Solid tantalum Figure 52. Low-Voltage Adjustable Reference Supply *Solid tantalum Figure 53. Positive Peak Detector 16 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM111-N LM211-N LM311-N LM111-N, LM211-N, LM311-N www.ti.com SNOSBJ1E – MAY 1999 – REVISED MARCH 2013 Figure 54. Zero Crossing Detector Driving MOS Logic *Solid tantalum Figure 55. Negative Peak Detector *R2 sets the comparison level. At comparison, the photodiode has less than 5 mV across it, decreasing leakages by an order of magnitude. Figure 56. Precision Photodiode Comparator Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM111-N LM211-N LM311-N Submit Documentation Feedback 17 LM111-N, LM211-N, LM311-N SNOSBJ1E – MAY 1999 – REVISED MARCH 2013 www.ti.com Figure 57. Switching Power Amplifier Figure 58. Switching Power Amplifier 18 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM111-N LM211-N LM311-N LM111-N, LM211-N, LM311-N www.ti.com SNOSBJ1E – MAY 1999 – REVISED MARCH 2013 Schematic Diagram NOTE Pin connections shown in the schematic diagram are for the LMC package. Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM111-N LM211-N LM311-N Submit Documentation Feedback 19 LM111-N, LM211-N, LM311-N SNOSBJ1E – MAY 1999 – REVISED MARCH 2013 www.ti.com Pin Diagrams Top View Figure 59. 8-Pin TO-99 See LMC Package Top View Top View Figure 60. 8-Pin CDIP (See NAB Package) 8-Pin SOIC (See D Package) 8-Pin PDIP (See P Package) Figure 61. 14-Pin CDIP (See J Package) 14-Pin PDIP (See NFF Package) Top View Figure 62. LM111W/883, LM111WG/883 10-Pin CLGA (See NAD Package) 10-Pin CLGA (See NAC Package) 20 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM111-N LM211-N LM311-N LM111-N, LM211-N, LM311-N www.ti.com SNOSBJ1E – MAY 1999 – REVISED MARCH 2013 REVISION HISTORY Changes from Revision D (March 2013) to Revision E • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 20 Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM111-N LM211-N LM311-N Submit Documentation Feedback 21 PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) LM111H ACTIVE TO-99 LMC 8 500 TBD Call TI Call TI -55 to 125 LM111H LM111H/NOPB ACTIVE TO-99 LMC 8 500 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 125 LM111H LM111J-8 ACTIVE CDIP NAB 8 40 TBD Call TI Call TI -55 to 125 LM111J-8 LM311H ACTIVE TO-99 LMC 8 500 TBD Call TI Call TI 0 to 70 LM311H LM311H/NOPB ACTIVE TO-99 LMC 8 500 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM 0 to 70 LM311H LM311M ACTIVE SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM 311M LM311M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM 311M LM311MX ACTIVE SOIC D 8 2500 TBD Call TI Call TI 0 to 70 LM 311M LM311MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM 311M LM311N ACTIVE PDIP P 8 40 TBD Call TI Call TI 0 to 70 LM 311N LM311N/NOPB ACTIVE PDIP P 8 40 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 70 LM 311N MLM311P ACTIVE PDIP P 8 40 TBD Call TI Call TI 0 to 70 LM 311N (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM311MX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM311MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM311MX SOIC D 8 2500 367.0 367.0 35.0 LM311MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA NAB0008A J08A (Rev M) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: LM311H LM311H/NOPB LM311M LM311M/NOPB LM311MX LM311MX/NOPB LM311N LM311N/NOPB LM111H LM111H/NOPB LM111J-8 MLM311P