Spec. No. : C081J3 Issued Date : 2016.02.25 Revised Date : Page No. : 1/11 CYStech Electronics Corp. N-Channel Enhancement Mode Power MOSFET MTN4N60CJ3 BVDSS ID @ VGS=10V, TC=25°C 600V RDSON(TYP) @ VGS=10V, ID=2A 4.0A 1.8Ω Features • Simple Drive Requirement • Low Gate Charge • Fast Switching Characteristic • Pb-free lead plating and halogen-free package Applications • Open Framed Power Supply • Adapter • STB Symbol Outline TO-252(DPAK) MTN4N60CJ3 G G：Gate D：Drain D S S：Source Ordering Information Device MTN4N60CJ3-0-T3-G Package TO-252 (Pb-free lead plating and halogen-free package) Shipping 2500 pcs / Tape & Reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T3 : 2500 pcs / tape & reel, 13” reel Product rank, zero for no rank products Product name MTN4N60CJ3 CYStek Product Specification Spec. No. : C081J3 Issued Date : 2016.02.25 Revised Date : Page No. : 2/11 CYStech Electronics Corp. Absolute Maximum Ratings (TC=25°C) Parameter Symbol Limits Drain-Source Voltage Gate-Source Voltage Continuous Drain Current @ VGS=10V, TC=25°C Continuous Drain Current @ VGS=10V, TC=100°C Pulsed Drain Current @ VGS=10V (Note 1) Avalanche Current (Note 1) Single Pulse Avalanche Energy @ L=1mH, IAS=4A, VDD=50V VDS VGS IDM IAS 600 ±30 4* 2.5* 16* 4 EAS 8 EAR 5 TL 300 °C PD 50 0.4 -55~+150 W W/°C °C (Note 2) Repetitive Avalanche Energy (Note 1) Maximum Temperature for Soldering @ Lead at 0.125 in(0.318mm) from case for 10 seconds Total Power Dissipation (TC=25℃) Linear Derating Factor Operating Junction and Storage Temperature ID Tj, Tstg Unit V A mJ *Drain current limited by maximum junction temperature Note : 1.Pulse width limited by maximum junction temperature. 2. 100% tested by conditions of IAS=2A, VDD=50V, L=1mH, VG=10V, starting TJ=+25℃. Thermal Data Parameter Thermal Resistance, Junction-to-case, max Thermal Resistance, Junction-to-ambient, max MTN4N60CJ3 Symbol RθJC RθJA Value 2.5 110 Unit °C/W CYStek Product Specification CYStech Electronics Corp. Spec. No. : C081J3 Issued Date : 2016.02.25 Revised Date : Page No. : 3/11 Characteristics (TC=25°C, unless otherwise specified) Symbol Min. Typ. Max. Unit Test Conditions 600 2.0 - 0.7 5 1.8 4.0 ±100 1 10 2.4 V V/°C V S nA Ω VGS=0V, ID=250μA, Tj=25℃ Reference to 25°C, ID=250μA VDS = VGS, ID=250μA VDS =15V, ID=2A VGS=±30V VDS =600V, VGS =0V VDS =480V, VGS =0V, Tj=125°C VGS =10V, ID=2A 14.1 3.2 4.9 9.6 8.6 26.8 10 539 59 16 - nC ID=4A, VDD=480V, VGS=10V ns VDD=300V, ID=4A, VGS=10V, RG=10Ω pF VGS=0V, VDS=25V, f=1MHz 0.84 342 1.4 4 16 1.5 - Static BVDSS ∆BVDSS/∆Tj VGS(th) *GFS IGSS IDSS *RDS(ON) Dynamic *Qg *Qgs *Qgd *td(ON) *tr *td(OFF) *tf Ciss Coss Crss Source-Drain Diode *IS *ISM *VSD *trr *Qrr - μA A V ns μC IS=4A, VGS=0V VGS=0V, IF=4A, dIF/dt=100A/μs *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% Recommended soldering footprint MTN4N60CJ3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C081J3 Issued Date : 2016.02.25 Revised Date : Page No. : 4/11 Typical Characteristics Static Drain-Source On-resistance vs Ambient Temperature Typical Output Characteristics 3.0 10V 9V 8V 7V 6V 9 ID, Drain Current(A) 8 7 6 RDS(ON), Normalized Static Drain-Source On-state Resistance 10 5.5 V 5 5V 4 3 2 4.5V 1 VGS=4V 0 2.5 2.0 1.5 1.0 ID=2A, VGS=10V 0.5 0.0 0 10 20 30 VDS, Drain-Source Voltage(V) 40 -75 50 -50 10 5.0 9 VGS=10V 4.0 Ta=25°C VDS=30V 8 ID, Drain Current(A) R DS(ON) , Static Drain-Source OnState Resistance(Ω) 0 25 50 75 100 125 150 175 TA, Ambient Temperature(°C) Drain Current vs Gate-Source Voltage Static Drain-Source On-State resistance vs Drain Current 3.0 2.0 7 6 5 4 VDS=10V 3 2 1.0 1 0 0.0 0.01 0.1 1 ID, Drain Current(A) 0 10 100 5 10 IF, Forward Current(A) 6 4 3 2 4 6 8 VGS, Gate-Source Voltage(V) 10 VGS=0V 1 Ta=150°C Ta=25°C 0.1 0.01 ID=2A 1 2 Forward Drain Current vs Source-Drain Voltage Static Drain-Source On-State Resistance vs Gate-Source Voltage RDS(ON), Static Drain-Source On-State Resistance(Ω) -25 Ta=25°C 0.001 0 0 2 4 6 VGS, Gate-Source Voltage(V) MTN4N60CJ3 8 10 0 0.2 0.4 0.6 0.8 1 1.2 1.4 VSD, Source Drain Voltage(V) CYStek Product Specification Spec. No. : C081J3 Issued Date : 2016.02.25 Revised Date : Page No. : 5/11 CYStech Electronics Corp. Typical Characteristics(Cont.) Brekdown Voltage vs Ambient Temperature Capacitance vs Reverse Voltage 10000 Ciss 1000 Capacitance(pF) BVDSS, Normalized Drain-Source Breakdown Voltage 1.4 Coss 100 10 Crss 1.2 1.0 0.8 ID=250μA, VGS=0V f=1MHz 1 0.6 0 5 10 15 20 25 VDS, Drain-to-Source Voltage(V) 30 -75 100 0 25 50 75 100 125 150 175 TA, Ambient Temperature(°C) 10 100μs VDS=120V 10 μs RDS(ON) Limited 10 VGS, Gate-Source Voltage(V) ID, Drain Current(A) -25 Gate Charge Characteristics Maximum Safe Operating Area 1ms 10ms 1 100ms TC=25°C, Tj(max)=150°C VGS=10V, RθJC=2.5°C/W Single pulse 0.1 DC 8 VDS=300V 6 VDS=480V 4 2 ID=4A 0 0.01 1 10 100 0 1000 4 8 12 VDS, Drain-Source Voltage(V) Qg, Total Gate Charge(nC) Maximum Drain Current vs Case Temperature Threshold Voltage vs Junction Tempearture VGS(th), Normalized Threshold Voltage 5 4.5 ID, Maximum Drain Current(A) -50 4 3.5 3 2.5 2 1.5 1 VGS=10V, RθJC=2.5°C/W 0.5 16 1.4 1.2 ID=1mA 1 0.8 0.6 ID=250μA 0.4 0.2 0 25 50 75 100 125 TC, Case Temperature(°C) MTN4N60CJ3 150 175 -75 -50 -25 0 25 50 75 100 125 150 175 Tj, Junction Temperature(°C) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C081J3 Issued Date : 2016.02.25 Revised Date : Page No. : 6/11 Typical Characteristics(Cont.) Forward Transfer Admittance vs Drain Current Single Pulse Power Rating, Junction to Case 10 GFS , Forward Transfer Admittance(S) 2000 1800 TJ(MAX) =150°C TC=25°C RθJC=2.5°C/W 1600 Power (W) 1400 1200 1000 800 600 400 200 0 0.0001 0.001 0.01 0.1 Pulse Width(s) 1 10 1 0.1 VDS=15V Ta=25°C Pulsed 0.01 0.001 0.01 0.1 1 ID, Drain Current(A) 10 Transient Thermal Response Curves 1 r(t), Normalized Effective Transient Thermal Resistance D=0.5 0.2 1.RθJC(t)=r(t)*RθJC 2.Duty Factor, D=t1/t2 3.TJM-TC=PDM*RθJC(t) 4.RθJC=2.5 ° C/W 0.1 0.1 0.05 0.02 0.01 Single Pulse 0.01 1.E-04 MTN4N60CJ3 1.E-03 1.E-02 1.E-01 t1, Square Wave Pulse Duration(s) 1.E+00 1.E+01 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C081J3 Issued Date : 2016.02.25 Revised Date : Page No. : 7/11 Test Circuits and Waveforms MTN4N60CJ3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C081J3 Issued Date : 2016.02.25 Revised Date : Page No. : 8/11 Test Circuits and Waveforms(Cont.) MTN4N60CJ3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C081J3 Issued Date : 2016.02.25 Revised Date : Page No. : 9/11 Reel Dimension Carrier Tape Dimension MTN4N60CJ3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C081J3 Issued Date : 2016.02.25 Revised Date : Page No. : 10/11 Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Pb-free Assembly Profile feature Sn-Pb eutectic Assembly Average ramp-up rate 3°C/second max. 3°C/second max. (Tsmax to Tp) Preheat 100°C 150°C −Temperature Min(TS min) −Temperature Max(TS max) 150°C 200°C −Time(ts min to ts max) 60-120 seconds 60-180 seconds Time maintained above: −Temperature (TL) 183°C 217°C − Time (tL) 60-150 seconds 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak 10-30 seconds 20-40 seconds temperature(tp) Ramp down rate 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Time 25 °C to peak temperature Note : All temperatures refer to topside of the package, measured on the package body surface. MTN4N60CJ3 CYStek Product Specification Spec. No. : C081J3 Issued Date : 2016.02.25 Revised Date : Page No. : 11/11 CYStech Electronics Corp. TO-252 Dimension Marking: 4 Device Name CYS 4N60C Date Code □□□□ 1 3-Lead TO-252 Plastic Surface Mount Package CYStek Package Code: J3 Inches Min. Max. 0.087 0.094 0.000 0.005 0.039 0.048 0.026 0.034 0.026 0.034 0.018 0.023 0.018 0.023 0.256 0.264 0.201 0.215 0.236 0.244 DIM A A1 B b b1 C C1 D D1 E Millimeters Min. Max. 2.200 2.400 0.000 0.127 0.990 1.210 0.660 0.860 0.660 0.860 0.460 0.580 0.460 0.580 6.500 6.700 5.100 5.460 6.000 6.200 2 3 Style: Pin 1.Gate 2.Drain 3.Source 4.Drain DIM e e1 H K L L1 L2 L3 P V Inches Min. Max. 0.086 0.094 0.172 0.188 0.163 REF 0.190 REF 0.386 0.409 0.114 REF 0.055 0.067 0.024 0.039 0.026 REF 0.211 REF Millimeters Min. Max. 2.186 2.386 4.372 4.772 4.140 REF 4.830 REF 9.800 10.400 2.900 REF 1.400 1.700 0.600 1.000 0.650 REF 5.350 REF Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead : Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MTN4N60CJ3 CYStek Product Specification