AD AD7988-1BRMZ 16-bit lower power Datasheet

16-Bit Lower Power
PulSAR ADCs in MSOP/LFCSP (QFN)
AD7988-1/AD7988-5
Data Sheet
FEATURES
GENERAL DESCRIPTION
Low power dissipation
AD7988-5: 3.5 mW @ 500 kSPS
AD7988-1: 700 µW @ 100 kSPS
16-bit resolution with no missing codes
Throughput: 100 kSPS/500 kSPS options
INL: ±0.6 LSB typical, ±1.25 LSB maximum
SINAD: 91.5 dB @ 10 kHz
THD: −114 dB @ 10 kHz
Pseudo differential analog input range
0 V to VREF with VREF from 2.5 V to 5.5 V
Any input range and easy to drive with the ADA4841-1
No pipeline delay
Single-supply 2.5 V operation with 1.8 V/2.5 V/3 V/5 V
logic interface
SPI-/QSPI-/MICROWIRE™-/DSP-compatible serial interface
Daisy-chain multiple ADCs
10-lead MSOP and 10-lead, 3 mm × 3 mm LFCSP (QFN),
same space as SOT-23
Wide operating temperature range: −40°C to +125°C
The AD7988-1/AD7988-5 are 16-bit, successive approximation,
analog-to-digital converters (ADC) that operate from a single
power supply, VDD. The AD7988-1 offers a 100 kSPS throughput,
and the AD7988-5 offers a 500 kSPS throughput. They are low
power, 16-bit sampling ADCs with a versatile serial interface
port. On the CNV rising edge, they sample an analog input,
IN+, between 0 V to VREF with respect to a ground sense, IN−.
The reference voltage, REF, is applied externally and can be set
independent of the supply voltage, VDD.
The SPI-compatible serial interface also features the ability to
daisy-chain several ADCs on a single 3-wire bus using the SDI
input. It is compatible with 1.8 V, 2.5 V, 3 V, or 5 V logic using
the separate supply, VIO.
The AD7988-1/AD7988-5 generics are housed in a 10-lead
MSOP or a 10-lead LFCSP (QFN) with operation specified
from −40°C to +125°C.
Table 1. MSOP, LFCSP (QFN) 14-/16-/18-Bit PulSAR® ADCs
APPLICATIONS
Battery-powered equipment
Low power data acquisition systems
Portable medical instruments
ATE equipment
Data acquisitions
Communications
400 kSPS to
500 kSPS
AD76902
Bits
18 1
100 kSPS
250 kSPS
AD7691 2
161
AD7684
AD76872
16 3
AD7680
AD7683
AD7988-12
AD7940
AD76852
AD7694
AD76882
AD76932
AD76862
AD7988-52
AD79422
AD79462
143
≥1000
kSPS
AD79822
AD79842
AD79802
ADC Driver
ADA4941-1
ADA4841-1
ADA4941-1
ADA4841-1
ADA4841-1
ADA4841-1
ADA4841-1
ADA4841-1
True differential.
Pin-for-pin compatible.
3
Pseudo differential.
1
2
TYPICAL APPLICATION DIAGRAM
2.5V TO 5V
REF
2.5V
VDD VIO
0V TO VREF
IN–
AD7988-1/
AD7988-5 SCK
SDO
GND
CNV
3- OR 4-WIRE INTERFACE
(SPI, DAISY CHAIN, CS)
10231-001
IN+
1.8V TO 5.5V
SDI
Figure 1.
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2012 Analog Devices, Inc. All rights reserved.
AD7988-1/AD7988-5
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Analog Inputs ............................................................................. 16
Applications ....................................................................................... 1
Driver Amplifier Choice ........................................................... 16
General Description ......................................................................... 1
Voltage Reference Input ............................................................ 17
Typical Application Diagram .......................................................... 1
Power Supply............................................................................... 17
Revision History ............................................................................... 2
Digital Interface .......................................................................... 17
Specifications..................................................................................... 3
CS Mode, 3-Wire ........................................................................ 18
Timing Specifications .................................................................. 5
CS Mode 4-Wire ......................................................................... 19
Absolute Maximum Ratings............................................................ 7
Chain Mode ................................................................................ 20
ESD Caution .................................................................................. 7
Applications Information .............................................................. 21
Pin Configurations and Function Descriptions ........................... 8
Interfacing to Blackfin® DSP ..................................................... 21
Terminology ...................................................................................... 9
Layout .......................................................................................... 21
Typical Performance Characteristics ........................................... 10
Evaluating the Performance of the AD7988-x ........................ 21
Theory of Operation ...................................................................... 14
Outline Dimensions ....................................................................... 22
Circuit Information .................................................................... 14
Ordering Guide .......................................................................... 23
Converter Operation .................................................................. 14
Typical Connection Diagram ................................................... 15
REVISION HISTORY
5/12—Rev. A to Rev. B
Changes to Table 3 ............................................................................. 4
Updated Outline Dimensions ........................................................22
2/12—Rev. 0 to Rev. A
Added LFCSP Thermal Impedance Values ................................... 7
Updated Outline Dimensions ....................................................... 23
Changes to Ordering Guide .......................................................... 23
2/12—Revision 0: Initial Version
Rev. B | Page 2 of 24
Data Sheet
AD7988-1/AD7988-5
SPECIFICATIONS
VDD = 2.5 V, VIO = 2.3 V to 5.5 V, VREF = 5 V, TA = –40°C to +125°C, unless otherwise noted.
Table 2.
Parameter
RESOLUTION
ANALOG INPUT
Voltage Range
Absolute Input Voltage
Analog Input CMRR
Leakage Current at 25°C
Input Impedance
ACCURACY
No Missing Codes
Differential Linearity Error
Integral Linearity Error
Transition Noise
Gain Error, TMIN to TMAX 2
Gain Error Temperature Drift
Zero Error, TMIN to TMAX2
Zero Temperature Drift
Power Supply Sensitivity
THROUGHPUT
AD7988-1
Conversion Rate
Transient Response
AD7988-5
Conversion Rate
Transient Response
AC ACCURACY
Dynamic Range
Oversampled Dynamic Range
Signal-to-Noise Ratio, SNR
Spurious-Free Dynamic Range, SFDR
Total Harmonic Distortion, THD
Signal-to-(Noise + Distortion), SINAD
Test Conditions/Comments
Min
16
IN+ − IN−
IN+
IN−
fIN = 1 kHz
Acquisition phase
0
−0.1
−0.1
Typ
Max
Unit
Bits
VREF
VREF + 0.1
+0.1
V
V
V
dB
nA
60
1
See the Analog Inputs section
16
−0.9
VREF = 5 V
VREF = 2.5 V
VREF = 5 V
VREF = 2.5 V
VREF = 5 V
VREF = 2.5 V
−1.25
−0.5
VDD = 2.5 V ± 5%
VIO ≥ 2.3 V up to 85°C, VIO ≥ 3.3 V above 85°C up to
125°C
Full-scale step
0
VIO ≥ 2.3 V up to 85°C, VIO ≥ 3.3 V above 85°C up to
125°C
Full-scale step
0
VREF = 5 V
VREF = 2.5 V
fO = 10 kSPS
fIN = 10 kHz, VREF = 5 V
fIN = 10 kHz, VREF = 2.5 V
fIN = 10 kHz
fIN = 10 kHz
fIN = 10 kHz, VREF = 5 V
fIN = 10 kHz, VREF = 2.5 V
90
±0.4
±0.55
±0.6
±0.65
0.6
1.0
±2
±0.35
±0.08
0.54
±0.1
+0.9
+1.25
+0.5
100
kSPS
500
ns
500
kSPS
400
ns
92
87
111
91
86.5
−110
−114
91.5
87.0
LSB means least significant bit. With the 5 V input range, 1 LSB is 76.3 µV.
See the Terminology section. These specifications include full temperature range variation, but not the error contribution from the external reference.
3
All specifications in dB are referred to a full-scale input FSR. Tested with an input signal at 0.5 dB below full scale, unless otherwise specified.
1
2
Rev. B | Page 3 of 24
Bits
LSB 1
LSB1
LSB1
LSB1
LSB1
LSB1
LSB1
ppm/°C
mV
ppm/°C
LSB1
dB 3
dB3
dB3
dB3
dB3
dB3
dB3
dB3
dB3
AD7988-1/AD7988-5
Data Sheet
VDD = 2.5 V, VIO = 2.3 V to 5.5 V, VREF = 5 V, TA = –40°C to +125°C, unless otherwise noted.
Table 3.
Parameter
REFERENCE
Voltage Range
Load Current
SAMPLING DYNAMICS
−3 dB Input Bandwidth
Aperture Delay
DIGITAL INPUTS
Logic Levels
VIL
VIH
VIL
VIH
IIL
IIH
DIGITAL OUTPUTS
Data Format
Pipeline Delay
Test Conditions/Comments
Min
Typ
2.4
5.1
250
V
µA
VDD = 2.5 V
10
2.0
MHz
ns
VIO > 3 V
VIO > 3 V
VIO ≤ 3 V
VIO ≤ 3 V
–0.3
0.7 × VIO
–0.3
0.9 × VIO
−1
−1
0.3 × VIO
VIO + 0.3
0.1 × VIO
VIO + 0.3
+1
+1
Serial 16 bits straight binary
Conversion results available immediately
after completed conversion
0.4
VIO − 0.3
ISINK = 500 µA
ISOURCE = −500 µA
VDD and VIO = 2.5 V, 25°C
10 kSPS throughput
100 kSPS throughput
0.35
70
700
AD7988-5 Power Dissipation
Energy per Conversion
TEMPERATURE RANGE
Specified Performance
500 kSPS throughput
3.5
7.0
2
Unit
VREF = 5 V
VOL
VOH
POWER SUPPLIES
VDD
VIO
VIO Range
Standby Current 1, 2
AD7988-1 Power Dissipation
1
Max
Specified performance
TMIN to TMAX
2.375
2.3
1.8
−40
With all digital inputs forced to VIO or GND as required.
During the acquisition phase.
Rev. B | Page 4 of 24
2.5
2.625
5.5
5.5
1
5
+125
V
V
V
V
µA
µA
V
V
V
V
V
nA
µW
µW
mW
mW
nJ/sample
°C
Data Sheet
AD7988-1/AD7988-5
TIMING SPECIFICATIONS
VDD = 2.37 V to 2.63 V, VIO = 3.3 V to 5.5 V, −40°C to +125°C unless otherwise stated. See Figure 2 and Figure 3 for load conditions.
Table 4.
Parameter
AD7988-1
Throughput Rate
Conversion Time: CNV Rising Edge to Data Available
Acquisition Time
Time Between Conversions
AD7988-5
Throughput Rate
Conversion Time: CNV Rising Edge to Data Available
Acquisition Time
Time Between Conversions
CNV Pulse Width (CS Mode)
SCK Period (CS Mode)
VIO Above 4.5 V
VIO Above 3 V
VIO Above 2.7 V
VIO Above 2.3 V
SCK Period (Chain Mode)
VIO Above 4.5 V
VIO Above 3 V
VIO Above 2.7 V
VIO Above 2.3 V
SCK Low Time
SCK High Time
SCK Falling Edge to Data Remains Valid
SCK Falling Edge to Data Valid Delay
VIO Above 4.5 V
VIO Above 3 V
VIO Above 2.7 V
VIO Above 2.3 V
CNV or SDI Low to SDO D15 MSB Valid (CS Mode)
VIO Above 3 V
VIO Above 2.3V
CNV or SDI High or Last SCK Falling Edge to SDO High Impedance (CS Mode)
SDI Valid Setup Time from CNV Rising Edge
SDI Valid Hold Time from CNV Rising Edge (CS Mode)
SDI Valid Hold Time from CNV Rising Edge (Chain Mode)
SCK Valid Setup Time from CNV Rising Edge (Chain Mode)
SCK Valid Hold Time from CNV Rising Edge (Chain Mode)
SDI Valid Setup Time from SCK Falling Edge (Chain Mode)
SDI Valid Hold Time from SCK Falling Edge (Chain Mode)
Rev. B | Page 5 of 24
Symbol
tCONV
tACQ
tCYC
tCONV
tACQ
tCYC
tCNVH
tSCK
Min
Typ
Max
Unit
100
9.5
kHz
μs
ns
μs
500
1.6
400
2
500
kHz
μs
ns
μs
ns
10.5
12
13
15
ns
ns
ns
ns
11.5
13
14
16
4.5
4.5
3
ns
ns
ns
ns
ns
ns
ns
500
10
tSCK
tSCKL
tSCKH
tHSDO
tDSDO
9.5
11
12
14
ns
ns
ns
ns
10
15
20
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tEN
tDIS
tSSDICNV
tHSDICNV
tHSDICNV
tSSCKCNV
tHSCKCNV
tSSDISCK
tHSDISCK
5
2
0
5
5
2
3
AD7988-1/AD7988-5
Data Sheet
500µA
IOL
1.4V
TO SDO
500µA
10231-002
CL
20pF
IOH
Figure 2. Load Circuit for Digital Interface Timing
Y% VIO1
X% VIO1
tDELAY
VIH2
VIL2
VIH2
VIL2
1FOR VIO ≤ 3.0V, X = 90 AND Y = 10; FOR VIO > 3.0V X = 70, AND Y = 30.
2MINIMUM V AND MAXIMUM V USED. SEE DIGITAL INPUTS
IH
IL
SPECIFICATIONS IN TABLE 3.
Figure 3. Voltage Levels for Timing
Rev. B | Page 6 of 24
10231-003
tDELAY
Data Sheet
AD7988-1/AD7988-5
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Analog Inputs
IN+, 1 IN−1 to GND
Supply Voltage
REF, VIO to GND
VDD to GND
VDD to VIO
Digital Inputs to GND
Digital Outputs to GND
Storage Temperature Range
Junction Temperature
θJA Thermal Impedance
10-Lead MSOP
10-Lead LFCSP
θJC Thermal Impedance
10-Lead MSOP
10-Lead LFCSP
Reflow Soldering
1
Rating
−0.3 V to VREF + 0.3 V or ±130 mA
−0.3 V to +6 V
−0.3 V to +3 V
+3 V to −6 V
−0.3 V to VIO + 0.3 V
−0.3 V to VIO + 0.3 V
−65°C to +125°C
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
200°C/W
80°C/W
44°C/W
15°C/W
JEDEC Standard (J-STD-020)
See the Analog Inputs section.
Rev. B | Page 7 of 24
AD7988-1/AD7988-5
Data Sheet
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
REF 1
10
VIO
9
SDI
IN+ 3
AD7988-1/
AD7988-5
8
SCK
IN– 4
TOP VIEW
(Not to Scale)
7
SDO
6
CNV
VDD 2
GND 5
IN– 4
GND 5
10231-004
REF 1
IN+ 3
10 VIO
AD7988-1/
AD7988-5
9
SDI
TOP VIEW
(Not to Scale)
8
SCK
7
SDO
6
CNV
NOTES
1. THE EXPOSED PAD CAN BE CONNECTED TO GND.
Figure 4. 10-Lead MSOP Pin Configuration
10231-005
VDD 2
Figure 5. 10-Lead LFCSP (QFN) Pin Configuration
Table 6. Pin Function Descriptions
Pin No.
1
Mnemonic
REF
Type 1
AI
2
3
VDD
IN+
P
AI
4
5
6
IN−
GND
CNV
AI
P
DI
7
8
9
SDO
SCK
SDI
DO
DI
DI
10
VIO
P
EP
Description
Reference Input Voltage. The VREF range is from 2.4 V to 5.1 V. It is referred to the GND pin. The GND pin
should be decoupled closely to the REF pin with a 10 µF capacitor.
Power Supply.
Analog Input. It is referred to IN−. The voltage range, for example, the difference between IN+ and IN−, is
0 V to VREF.
Analog Input Ground Sense. Connect to the analog ground plane or to a remote sense ground.
Power Supply Ground.
Convert Input. This input has multiple functions. On its leading edge, it initiates the conversions and
selects the interface mode of the part: chain mode or CS mode. In CS mode, the SDO pin is enabled when
CNV is low. In chain mode, the data should be read when CNV is high.
Serial Data Output. The conversion result is output on this pin. It is synchronized to SCK.
Serial Data Clock Input. When the part is selected, the conversion result is shifted out by this clock.
Serial Data Input. This input provides multiple features. It selects the interface mode of the ADC as
follows:
Chain mode is selected if this pin is low during the CNV rising edge. In this mode, SDI is used as a data
input to daisy-chain the conversion results of two or more ADCs onto a single SDO line. The digital data
level on SDI is output on SDO with a delay of 16 SCK cycles.
CS mode is selected if SDI is high during the CNV rising edge. In this mode, either SDI or CNV can enable
the serial output signals when low.
Input/Output Interface Digital Power. Nominally at the same supply as the host interface (1.8 V, 2.5 V, 3 V,
or 5 V).
Exposed Pad. The exposed pad can be connected to GND.
AI = analog input, DI = digital input, DO = digital output, and P = power.
1
Rev. B | Page 8 of 24
Data Sheet
AD7988-1/AD7988-5
TERMINOLOGY
Integral Nonlinearity Error (INL)
INL refers to the deviation of each individual code from a line
drawn from negative full scale through positive full scale. The
point used as negative full scale occurs ½ LSB before the first
code transition. Positive full scale is defined as a level 1½ LSB
beyond the last code transition. The deviation is measured from
the middle of each code to the true straight line (see Figure 30).
Differential Nonlinearity Error (DNL)
In an ideal ADC, code transitions are 1 LSB apart. DNL is the
maximum deviation from this ideal value. It is often specified in
terms of resolution for which no missing codes are guaranteed.
Offset Error
The first transition should occur at a level ½ LSB above analog
ground (38.1 µV for the 0 V to 5 V range). The offset error is
the deviation of the actual transition from that point.
Gain Error
The last transition (from 111 … 10 to 111 … 11) should
occur for an analog voltage 1½ LSB below the nominal full
scale (4.999886 V for the 0 V to 5 V range). The gain error is
the deviation of the actual level of the last transition from the
ideal level after the offset is adjusted out.
Spurious-Free Dynamic Range (SFDR)
SFDR is the difference, in decibels (dB), between the rms
amplitude of the input signal and the peak spurious signal.
Effective Resolution
Effective resolution is calculated as
Effective Resolution = log2(2N/RMS Input Noise)
and is expressed in bits.
Total Harmonic Distortion (THD)
THD is the ratio of the rms sum of the first five harmonic
components to the rms value of a full-scale input signal and is
expressed in dB.
Dynamic Range
Dynamic range is the ratio of the rms value of the full scale to
the total rms noise measured with the inputs shorted together.
The value for dynamic range is expressed in dB. It is measured
with a signal at −60 dBFS to include all noise sources and DNL
artifacts.
Signal-to-Noise Ratio (SNR)
SNR is the ratio of the rms value of the actual input signal to the
rms sum of all other spectral components below the Nyquist
frequency, excluding harmonics and dc. The value for SNR is
expressed in dB.
Signal-to-(Noise + Distortion) Ratio (SINAD)
SINAD is the ratio of the rms value of the actual input signal to
the rms sum of all other spectral components below the Nyquist
frequency, including harmonics but excluding dc. The value for
SINAD is expressed in dB.
Aperture Delay
Aperture delay is the measure of the acquisition performance. It
is the time between the rising edge of the CNV input and when
the input signal is held for a conversion.
Effective Number of Bits (ENOB)
ENOB is a measurement of the resolution with a sine wave
input. It is related to SINAD by the following formula:
ENOB = (SINADdB − 1.76)/6.02
and is expressed in bits.
Noise-Free Code Resolution
Noise-free code resolution is the number of bits beyond which
it is impossible to distinctly resolve individual codes. It is
calculated as
Transient Response
Transient response is the time required for the ADC to
accurately acquire its input after a full-scale step function is
applied.
Noise-Free Code Resolution = log2(2N/Peak-to-Peak Noise)
and is expressed in bits.
Rev. B | Page 9 of 24
AD7988-1/AD7988-5
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
VDD = 2.5 V, VREF = 5.0 V, VIO = 3.3 V, unless otherwise noted.
0
0
fS = 500kSPS
fIN = 10kHz
SNR = 91.17dB
THD = –113.63dB
SFDR = 110.30dB
SINAD = 91.15dB
–40
–60
–80
–100
–120
–140
–160
–60
–80
–100
–120
–140
100
150
200
250
FREQUENCY (kHz)
–180
0
10
20
30
Figure 6. AD7988-5 FFT Plot, VREF = 5 V
1.25
fS = 500kSPS
fIN = 10kHz
0.75
0.50
INL (LSB)
–60
POSITIVE INL: +0.40 LSB
NEGATIVE INL: –0.35 LSB
1.00
SNR = 86.8dB
THD = –111.4dB
SFDR = 105.9dB
SINAD = 86.8dB
–40
50
Figure 9. AD7988-1 FFT Plot, VREF = 2.5 V
0
–20
40
FREQUENCY (kHz)
10231-049
50
10231-046
0
–80
–100
–120
0.25
0
–0.25
–0.75
–160
–1.00
–180
0
50
100
150
200
250
FREQUENCY (kHz)
–1.25
0
16384
32768
1.25
0
fS = 100kSPS
fIN = 10kHz
0.75
0.50
INL (LSB)
–60
POSITIVE INL: +0.45 LSB
NEGATIVE INL: –0.29 LSB
1.00
SNR = 91.09dB
THD = –113.12dB
SFDR = 110.30dB
SINAD = 91.05dB
–40
65536
Figure 10. Integral Nonlinearity vs. Code, VREF = 5 V
Figure 7. AD7988-5 FFT Plot, VREF = 2.5 V
–20
49152
CODE
10231-010
–0.50
–140
10231-047
–80
–100
–120
0.25
0
–0.25
–0.50
–140
–0.75
–160
–1.00
0
10
20
30
FREQUENCY (kHz)
40
50
10231-048
–1.25
–180
0
16384
32768
49152
CODE
Figure 11. Integral Nonlinearity vs. Code, VREF = 2.5 V
Figure 8. AD7988-1 FFT Plot, VREF = 5 V
Rev. B | Page 10 of 24
65536
10231-011
AMPLITUDE (dB of FULL SCALE)
SNR = 86.7dB
THD = –110.4dB
SFDR = 103.9dB
SINAD = 86.6dB
–40
–160
–180
AMPLITUDE (dB of FULL SCALE)
fS = 100kSPS
fIN = 10kHz
–20
AMPLITUDE (dB of FULL SCALE)
AMPLITUDE (dB of FULL SCALE)
–20
Data Sheet
AD7988-1/AD7988-5
1.00
60k
POSITIVE INL: +0.18 LSB
NEGATIVE INL: –0.21 LSB
0.75
50970
50k
45198
0.50
40k
COUNTS
DNL (LSB)
0.25
0
30k
–0.25
18848
20k
–0.50
12424
10k
–0.75
32768
49152
65536
CODE
1217
2290
30
0
0
Figure 15. Histogram of a DC Input at the Code Transition, VREF = 2.5 V
16
100
SNR
SINAD
ENOB
SNR, SINAD (dB)
0.50
0.25
DNL (LSB)
94
CODE IN HEX
POSITIVE INL: +0.25 LSB
NEGATIVE INL: –0.22 LSB
0.75
1
7FFA 7FFB 7FFC 7FFD 7FFE 7FFF 8000 8001 8002 8003 8004 8005 8006
Figure 12. Differential Nonlinearity vs. Code, VREF = 5 V
1.00
0
0
–0.25
–0.50
95
15
90
14
85
13
ENOB (Bits)
16384
10231-012
0
0
10231-015
0
–1.00
–0.75
16384
32768
49152
65536
80
2.25
CODE
2.75
3.25
3.75
4.25
12
5.25
4.75
10231-016
0
10231-013
–1.00
REFERENCE VOLTAGE (V)
Figure 13. Differential Nonlinearity vs. Code, VREF = 2.5 V
Figure 16. SNR, SINAD, and ENOB vs. Reference Voltage
180k
60k
162595
53412
160k
50k
140k
40k
COUNTS
100k
80k
60k
37417
31540
30k
20k
52720
42731
40k
10k
7285
20k
5807
0
0
22 1291
852 29
2
0
0
0
8003 8004 8005 8006 8007 8008 8009 800A 800B 800C 800D 800E 800F
CODE IN HEX
Figure 14. Histogram of a DC Input at the Code Center, VREF = 5 V
0
0
0
19 590
512 11
0
0
7FFA 7FFB 7FFC 7FFD 7FFE 7FFF 8000 8001 8002 8003 8004 8005 8006
CODE IN HEX
10231-051
0
10231-050
COUNTS
120k
Figure 17. Histogram of a DC Input at the Code Center, VREF = 2.5 V
Rev. B | Page 11 of 24
AD7988-1/AD7988-5
Data Sheet
95
95
94
93
93
92
SNR (dB)
SNR (dB)
91
90
89
91
89
88
87
87
–8
–7
–6
–5
–4
–3
–2
–1
0
INPUT LEVEL (dB OF FULL SCALE)
85
–55
–35
–15
5
25
45
65
85
105
125
10231-053
–9
10231-018
85
–10
2.625
10231-023
86
TEMPERATURE (°C)
Figure 21. SNR vs. Temperature
Figure 18. SNR vs. Input Level
–95
115
0.7
IVDD
–100
0.6
110
SFDR
100
THD
–115
CURRENT (mA)
–110
SFDR (dB)
105
95
0.4
0.3
IREF
0.2
IVIO
90
–125
2.25
2.75
3.25
3.75
4.25
4.75
0.1
85
5.25
0
2.375
10231-019
–120
REFERENCE VOLTAGE (V)
2.425
2.475
2.525
2.575
VDD VOLTAGE (V)
Figure 22. Operating Currents vs. Supply (AD7988-5)
Figure 19. THD, SFDR vs. Reference Voltage
0.14
100
IVDD
0.12
95
CURRENT (mA)
0.10
90
0.08
0.06
IREF
0.04
85
IVIO
80
10
100
FREQUENCY (kHz)
1k
Figure 20. SINAD vs. Frequency
0
2.375
2.425
2.475
2.525
2.575
VDD VOLTAGE (V)
Figure 23. Operating Currents vs. Supply (AD7988-1)
Rev. B | Page 12 of 24
2.625
10231-024
0.02
10231-052
SINAD (dB)
THD (dB)
0.5
–105
Data Sheet
AD7988-1/AD7988-5
–85
0.14
–90
0.12
IVDD
–95
CURRENT (mA)
0.10
THD (dB)
–100
–105
–110
008
0.06
IREF
0.04
–115
IVIO
1k
100
FREQUENCY (kHz)
0
–55
10231-054
–125
10
–35
–15
5
25
45
65
85
105
10231-028
0.02
–120
125
TEMPERATURE (°C)
Figure 24. THD vs. Frequency
Figure 27. Operating Currents vs. Temperature (AD7988-1)
8
–110
7
–112
CURRENT (µA)
THD (dB)
6
–114
–116
5
4
3
IVDD + IVIO
2
–118
–35
–15
5
25
45
65
85
105
125
TEMPERATURE (°C)
Figure 25. THD vs. Temperature
IVDD
0.6
0.4
0.3
IREF
0.2
IVIO
0.1
–15
5
25
45
65
85
105
125
TEMPERATURE (°C)
10231-027
CURRENT (mA)
0.5
–35
–35
–15
5
25
45
65
85
105
TEMPERATURE (°C)
Figure 28. Power-Down Currents vs. Temperature
0.7
0
–55
0
–55
Figure 26. Operating Currents vs. Temperature (AD7988-5)
Rev. B | Page 13 of 24
125
10231-029
–120
–55
10231-026
1
AD7988-1/AD7988-5
Data Sheet
THEORY OF OPERATION
IN+
MSB
LSB
32,768C
16,384C
4C
2C
C
SWITCHES CONTROL
SW+
C
BUSY
REF
COMP
GND
32,768C
16,384C
4C
2C
C
CONTROL
LOGIC
OUTPUT CODE
C
LSB
MSB
SW–
10231-030
CNV
IN–
Figure 29. ADC Simplified Schematic
CIRCUIT INFORMATION
The AD7988-1/AD7988-5 devices are fast, low power, singlesupply, precise 16-bit ADCs that use a successive approximation
architecture.
The AD7988-1 is capable of converting 100,000 samples per
second (100 kSPS), whereas the AD7988-5 is capable of a
throughput of 500 kSPS, and they power down between
conversions. When operating at 10 kSPS, for example, the
ADC consumes 70 µW typically, ideal for battery-powered
applications.
The AD7988-x provides the user with on-chip track-and-hold
and does not exhibit any pipeline delay or latency, making it
ideal for multiple multiplexed channel applications.
The AD7988-x can be interfaced to any 1.8 V to 5 V digital logic
family. It is housed in a 10-lead MSOP or a tiny 10-lead LFCSP
(QFN) that combines space savings and allows flexible
configurations.
CONVERTER OPERATION
The AD7988-x is a successive approximation ADC based on a
charge redistribution DAC. Figure 29 shows the simplified
schematic of the ADC. The capacitive DAC consists of two
identical arrays of 16 binary weighted capacitors, which are
connected to the two comparator inputs.
During the acquisition phase, terminals of the array tied to the
comparator’s input are connected to GND via SW+ and SW−.
All independent switches are connected to the analog inputs.
Therefore, the capacitor arrays are used as sampling capacitors
and acquire the analog signal on the IN+ and IN− inputs. When
the acquisition phase is completed and the CNV input goes high, a
conversion phase is initiated. When the conversion phase begins,
SW+ and SW− are opened first. The two capacitor arrays are then
disconnected from the inputs and connected to the GND input.
Therefore, the differential voltage between the IN+ and IN−
inputs captured at the end of the acquisition phase are applied
to the comparator inputs, causing the comparator to become
unbalanced. By switching each element of the capacitor array
between GND and REF, the comparator input varies by binary
weighted voltage steps (VREF/2, VREF/4 … VREF/65,536). The
control logic toggles these switches, starting with the MSB, to
bring the comparator back into a balanced condition. After the
completion of this process, the part returns to the acquisition phase
and the control logic generates the ADC output code.
Because the AD7988-x has an on-board conversion clock, the
serial clock, SCK, is not required for the conversion process.
Rev. B | Page 14 of 24
Data Sheet
AD7988-1/AD7988-5
Transfer Functions
Table 7. Output Codes and Ideal Input Voltages
The ideal transfer characteristic for the AD7988-x is shown in
Figure 30 and Table 7.
Description
FSR – 1 LSB
Midscale + 1 LSB
Midscale
Midscale – 1 LSB
–FSR + 1 LSB
–FSR
111 ... 101
1
2
Analog Input
Digital Output Code (Hex)
FFFF1
8001
8000
7FFF
0001
00002
This is also the code for an overranged analog input (VIN+ − VIN− above VREF − VGND).
This is also the code for an underranged analog input (VIN+ − VIN− below VGND).
TYPICAL CONNECTION DIAGRAM
Figure 31 shows an example of the recommended connection
diagram for the AD7988-x when multiple supplies are available.
000 ... 010
000 ... 001
000 ... 000
–FSR
–FSR + 1LSB
–FSR + 0.5LSB
+FSR – 1 LSB
+FSR – 1.5 LSB
ANALOG INPUT
10231-031
Figure 30. ADC Ideal Transfer Function
REF1
V+
2.5V
10µF2
100nF
V+
1.8V TO 5.5V
100nF
20Ω
REF
0V TO VREF
3
2.7nF
VDD
VIO
IN+
SDI
AD7988-1/
AD7988-5
V–
4
SCK
3- OR 4-WIRE INTERFACE5
SDO
CNV
IN–
GND
1 SEE THE VOLTAGE REFERENCE INPUT SECTION FOR REFERENCE SELECTION.
2C
REF IS USUALLY A 10µF CERAMIC CAPACITOR (X5R).
3 SEE THE DRIVER AMPLIFIER CHOICE SECTION.
4 OPTIONAL FILTER. SEE THE ANALOG INPUTS SECTION.
5 SEE THE DIGITAL INTERFACE SECTION FOR THE MOST CONVENIENT INTERFACE MODE.
Figure 31. Typical Application Diagram with Multiple Supplies
Rev. B | Page 15 of 24
10231-032
ADC CODE (STRAIGHT BINARY)
111 ... 111
111 ... 110
VREF = 5 V
4.999924 V
2.500076 V
2.5 V
2.499924 V
76.3 µV
0V
AD7988-1/AD7988-5
Data Sheet
ANALOG INPUTS
DRIVER AMPLIFIER CHOICE
Figure 32 shows an equivalent circuit of the input structure of
the AD7988-x.
Although the AD7988-x is easy to drive, the driver amplifier
needs to meet the following requirements:
The two diodes, D1 and D2, provide ESD protection for the
analog inputs, IN+ and IN−. Care must be taken to ensure that
the analog input signal never exceeds the supply rails by more
than 0.3 V, because this causes these diodes to become forwardbiased and start conducting current. These diodes can handle a
forward-biased current of 130 mA maximum. For instance,
these conditions may eventually occur when the input buffer’s
supplies are different from VDD. In such a case (for example, an
input buffer with a short circuit), the current limitation can be
used to protect the part.
•
SNRLOSS
REF
RIN
CIN
D2
GND
10231-033
D1
IN+
OR IN–
CPIN
The noise generated by the driver amplifier must be kept as
low as possible to preserve the SNR and transition noise
performance of the AD7988-x. The noise coming from the
driver is filtered by the AD7988-x analog input circuit’s
one-pole, low-pass filter made by RIN and CIN or by the
external filter, if one is used. Because the typical noise of
the AD7988-x is 47.3 µV rms, the SNR degradation due to
the amplifier is
Figure 32. Equivalent Analog Input Circuit
The analog input structure allows the sampling of the true
differential signal between IN+ and IN−. By using these
differential inputs, signals common to both inputs are rejected.


47.3
= 20 log 

π
2
2
 47.3 + f −3dB (Ne N )
2

where:
f–3dB is the input bandwidth in MHz of the AD7988-x
(10 MHz) or the cutoff frequency of the input filter, if
one is used.
N is the noise gain of the amplifier (for example, 1 in buffer
configuration).
eN is the equivalent input noise voltage of the op amp,
in nV/√Hz.
For ac applications, the driver should have a THD
performance commensurate with the AD7988-x.
For multichannel multiplexed applications, the driver amplifier and the AD7988-x analog input circuit must settle for
a full-scale step onto the capacitor array at a 16-bit level
(0.0015%, 15 ppm). In the amplifier data sheet, settling at
0.1% to 0.01% is more commonly specified. This may
differ significantly from the settling time at a 16-bit level
and should be verified prior to driver selection.
During the acquisition phase, the impedance of the analog
inputs (IN+ and IN−) can be modeled as a parallel combination of
Capacitor CPIN and the network formed by the series connection of
RIN and CIN. CPIN is primarily the pin capacitance. RIN is typically
400 Ω and is a lumped component made up of serial resistors
and the on resistance of the switches. CIN is typically 30 pF and
is mainly the ADC sampling capacitor. During the conversion
phase, when the switches are opened, the input impedance is
limited to CPIN. RIN and CIN make a one-pole, low-pass filter that
reduces undesirable aliasing effects and limits the noise.
•
When the source impedance of the driving circuit is low, the
AD7988-x can be driven directly. Large source impedances
significantly affect the ac performance, especially THD. The dc
performances are less sensitive to the input impedance. The
maximum source impedance depends on the amount of THD
that can be tolerated. The THD degrades as a function of the
source impedance and the maximum input frequency.
Table 8. Recommended Driver Amplifiers
•
Amplifier
ADA4841-1
AD8021
AD8022
OP184
AD8655
AD8605, AD8615
Rev. B | Page 16 of 24






Typical Application
Very low noise, small size, and low power
Very low noise and high frequency
Low noise and high frequency
Low power, low noise, and low frequency
5 V single-supply, low noise
5 V single-supply, low power
Data Sheet
AD7988-1/AD7988-5
VOLTAGE REFERENCE INPUT
The AD7988-x voltage reference input, REF, has a dynamic
input impedance and should therefore be driven by a low
impedance source with efficient decoupling between the REF
and GND pins, as explained in the Layout section.
When REF is driven by a very low impedance source, for example,
a reference buffer using the AD8031 or the AD8605, a ceramic
chip capacitor is appropriate for optimum performance.
If an unbuffered reference voltage is used, the decoupling value
depends on the reference used. For example, a 22 µF (X5R,
1206 size) ceramic chip capacitor is appropriate for optimum
performance using a low temperature drift ADR43x reference.
If desired, a reference-decoupling capacitor value as small as
2.2 µF can be used with a minimal impact on performance,
especially DNL.
Regardless, there is no need for an additional lower value ceramic
decoupling capacitor (for example, 100 nF) between the REF
and GND pins.
POWER SUPPLY
The AD7988-x uses two power supply pins: a core supply, VDD,
and a digital input/output interface supply, VIO. VIO allows
direct interface with any logic between 1.8 V and 5.0 V. To
reduce the number of supplies needed, VIO and VDD can be
tied together. The AD7988-x is independent of power supply
sequencing between VIO and VDD. Additionally, it is very
insensitive to power supply variations over a wide frequency
range, as shown in Figure 33.
80
To ensure optimum performance, VDD should be roughly half
of REF, the voltage reference input. For example, if REF is 5.0 V,
VDD should be set to 2.5 V (±5%). If REF = 2.5V, and VDD =
2.5 V, performance is degraded as can be seen in Table 2.
The AD7988-x powers down automatically at the end of each
conversion phase.
DIGITAL INTERFACE
Although the AD7988-x has a reduced number of pins, it offers
flexibility in its serial interface modes.
The AD7988-x, when in CS mode, is compatible with SPI, QSPI™,
and digital hosts. This interface can use either a 3-wire or 4-wire
interface. A 3-wire interface using the CNV, SCK, and SDO
signals minimizes wiring connections and is useful, for
instance, in isolated applications. A 4-wire interface using the
SDI, CNV, SCK, and SDO signals allows CNV, which initiates
the conversions, to be independent of the readback timing
(SDI). This is useful in low jitter sampling or simultaneous
sampling applications.
The AD7988-x, when in chain mode, provides a daisy-chain
feature using the SDI input for cascading multiple ADCs on a
single data line, similar to a shift register.
The mode in which the part operates depends on the SDI level
when the CNV rising edge occurs. CS mode is selected if SDI is
high, and chain mode is selected if SDI is low. The SDI hold
time is such that when SDI and CNV are connected together,
the chain mode is selected.
The user must time out the maximum conversion time prior to
readback.
70
65
60
55
1
10
100
FREQUENCY (kHz)
1k
10231-034
PSRR (dB)
75
Figure 33. PSRR vs. Frequency
Rev. B | Page 17 of 24
AD7988-1/AD7988-5
Data Sheet
CS MODE, 3-WIRE
When CNV goes low, the MSB is output onto SDO. The remaining
data bits are then clocked by subsequent SCK falling edges. The
data is valid on both SCK edges. Although the rising edge can
be used to capture the data, a digital host using the SCK falling
edge allows a faster reading rate, provided that it has an acceptable
hold time. After the 16th SCK falling edge or when CNV goes
high, whichever is earlier, SDO returns to high impedance.
This mode is typically used when a single AD7988-x is
connected to an SPI-compatible digital host. The connection
diagram is shown in Figure 34, and the corresponding timing is
given in Figure 35.
With SDI tied to VIO, a rising edge on CNV initiates a conversion, selects the CS mode, and forces SDO to high impedance.
When the conversion is complete, the AD7988-x enters the
acquisition phase and powers down.
CONVERT
DIGITAL HOST
CNV
VIO
SDI
AD7988-1/
AD7988-5
DATA IN
SDO
10231-035
SCK
CLK
Figure 34. 3-Wire CS Mode Connection Diagram
SDI = 1
tCYC
tCNVH
CNV
ACQUISITION
tCONV
tACQ
CONVERSION
ACQUISITION
tSCK
tSCKL
2
3
14
tHSDO
16
tSCKH
tEN
SDO
15
tDIS
tDSDO
D15
D14
D13
D1
Figure 35. 3-Wire CS Mode Serial Interface Timing (SDI High)
Rev. B | Page 18 of 24
D0
10231-036
1
SCK
Data Sheet
AD7988-1/AD7988-5
When the conversion is complete, the AD7988-x enters the
acquisition phase and powers down. Each ADC result can
be read by bringing its SDI input low, which consequently
outputs the MSB onto SDO. The remaining data bits are then
clocked by subsequent SCK falling edges. The data is valid on
both SCK edges. Although the rising edge can be used to capture
the data, a digital host using the SCK falling edge allows a faster
reading rate, provided that it has an acceptable hold time. After
the 16th SCK falling edge or when SDI goes high, whichever is
earlier, SDO returns to high impedance and another AD7988-x
can be read.
CS MODE 4-WIRE
This mode is typically used when multiple AD7988-x devices
are connected to an SPI-compatible digital host.
A connection diagram example using two AD7988-x devices is
shown in Figure 36, and the corresponding timing is given in
Figure 37.
With SDI high, a rising edge on CNV initiates a conversion,
selects the CS mode, and forces SDO to high impedance. In this
mode, CNV must be held high during the conversion phase and
the subsequent data readback (if SDI and CNV are low, SDO is
driven low). Prior to the minimum conversion time, SDI can be
used to select other SPI devices, such as analog multiplexers,
but SDI must be returned high before the minimum conversion
time elapses and then held high for the maximum conversion time.
CS2
CS1
CONVERT
CNV
AD7988-1/
AD7988-5
SDO
SDI
SCK
DIGITAL HOST
SDO
SCK
10231-037
SDI
CNV
AD7988-1/
AD7988-5
DATA IN
CLK
Figure 36. 4-Wire CS Mode Connection Diagram
tCYC
CNV
ACQUISITION
tCONV
tACQ
CONVERSION
ACQUISITION
tSSDICNV
SDI (CS1)
tHSDICNV
SDI (CS2)
tSCK
tSCKL
1
2
3
14
tHSDO
16
17
18
30
31
32
tSCKH
tEN
SDO
15
tDIS
tDSDO
D15
D14
D13
D1
D0
D15
Figure 37. 4-Wire CS Mode Serial Interface Timing
Rev. B | Page 19 of 24
D14
D1
D0
10231-038
SCK
AD7988-1/AD7988-5
Data Sheet
phase and the subsequent data readback. When the conversion
is complete, the MSB is output onto SDO and the AD7988-x
enters the acquisition phase and powers down. The remaining
data bits stored in the internal shift register are clocked by
subsequent SCK falling edges. For each ADC, SDI feeds the
input of the internal shift register and is clocked by the SCK
falling edge. Each ADC in the chain outputs its data MSB first,
and 16 × N clocks are required to read back the N ADCs. The
data is valid on both SCK edges. Although the rising edge can
be used to capture the data, a digital host using the SCK falling
edge allows a faster reading rate and, consequently, more
AD7988-x devices in the chain, provided that the digital host
has an acceptable hold time. The maximum conversion rate
may be reduced due to the total readback time.
CHAIN MODE
This mode can be used to daisy-chain multiple AD7988-x
devices on a 3-wire serial interface. This feature is useful for
reducing component count and wiring connections, for example,
in isolated multiconverter applications or for systems with a
limited interfacing capacity. Data readback is analogous to
clocking a shift register.
A connection diagram example using two AD7988-x devices is
shown in Figure 38, and the corresponding timing is given in
Figure 39.
When SDI and CNV are low, SDO is driven low. With SCK low,
a rising edge on CNV initiates a conversion and selects the chain
mode. In this mode, CNV is held high during the conversion
CONVERT
CNV
CNV
AD7988-1/
AD7988-5
SDO
SDI
AD7988-1/
AD7988-5
SDO
DATA IN
B
SCK
A
SCK
10231-039
SDI
DIGITAL HOST
CLK
Figure 38. Chain Mode Connection Diagram
SDIA = 0
tCYC
CNV
ACQUISITION
tCONV
tACQ
CONVERSION
ACQUISITION
tSCK
tSCKL
tSSCKCNV
SCK
1
2
3
15
16
17
18
30
31
32
D A1
DA0
tSCKH
tHSDISCK
tEN
SDOA = SDIB
14
tSSDISCK
tHSCKCNV
DA15
DA14
DA13
D A1
DA0
DB 1
DB0
tHSDO
SDOB
DB15
DB14
DB13
DA15
Figure 39. Chain Mode Serial Interface Timing
Rev. B | Page 20 of 24
DA14
10231-040
tDSDO
Data Sheet
AD7988-1/AD7988-5
APPLICATIONS INFORMATION
INTERFACING TO BLACKFIN® DSP
The AD7988-x can easily connect to a DSP SPI or SPORT. The
SPI configuration is straightforward, using the standard SPI
interface as shown in Figure 40.
SPI_CLK
SCK
SPI_MISO
SDO
SPI_MOSI
CNV
AD7988-1/
AD7988-5
10231-041
BLACKFIN
DSP
Figure 40. Typical Connection to Blackfin SPI Interface
Similarly, the SPORT interface can be used to interface to this
ADC. The SPORT interface has some benefits in that it can use
direct memory access (DMA) and provides a lower jitter CNV
signal generated from a hardware counter.
Some glue logic may be required between SPORT and the
AD7988-x interface. The evaluation board for the AD7988-x
interfaces directly to the SPORT of the Blackfin-based (ADSPBF-527) SDP board. The configuration used for the SPORT
interface requires the addition of some glue logic as shown in
Figure 41. The SCK input to the ADC was gated off when CNV
was high to keep the SCK line static while converting the data,
thereby ensuring the best integrity of the result. This approach
uses an AND gate and a NOT gate for the SCK path. The other
logic gates used on the RSCLK and RFS paths are for delay
matching purposes and may not be necessary where path
lengths are short.
Using at least one ground plane is recommended. It can be
common or split between the digital and analog section. In the
latter case, join the planes underneath the AD7988-x devices.
The AD7988-x voltage reference input, REF, has a dynamic input
impedance. Decouple REF with minimal parasitic inductances
by placing the reference decoupling ceramic capacitor close to,
but ideally right up against, the REF and GND pins and connecting them with wide, low impedance traces.
Finally, decouple the power supplies of the AD7988-x, VDD and
VIO, with ceramic capacitors, typically 100 nF, placed close to
the AD7988-x and connected using short and wide traces to
provide low impedance paths and to reduce the effect of glitches
on the power supply lines.
An example of a layout following these rules is shown in Figure 42
and Figure 43.
EVALUATING THE PERFORMANCE OF THE
AD7988-x
The evaluation board package for the AD7988-x (EVAL-AD79885SDZ) includes a fully assembled and tested evaluation board,
documentation, and software for controlling the board from a
PC via the EVAL-SDP-CB1Z.
AD7988-1/
AD7988-5
This is one approach to using the SPORT interface for this ADC;
there may be other solutions equal to this approach.
VDRIVE
DR
SDO
RSCLK
SCK
RFS
AD7988-1/
AD7988-5
TFS
CNV
10231-043
TSCLK
10231-045
BLACKFIN
DSP
Figure 42. Example Layout of the AD7988-x (Top Layer)
Figure 41. Evaluation Board Connection to Blackfin Sport Interface
LAYOUT
Design the printed circuit board (PCB) that houses the AD7988-x
so that the analog and digital sections are separated and confined
to certain areas of the board. The pinout of the AD7988-x, with all
the analog signals on the left side and all the digital signals on
the right side, eases this task.
10231-044
Avoid running digital lines under the device because these couple
noise onto the die, unless a ground plane under the AD7988-x is
used as a shield. Fast switching signals, such as CNV or clocks,
should never run near analog signal paths. Avoid crossover of
digital and analog signals.
Figure 43. Example Layout of the AD7988-x (Bottom Layer)
Rev. B | Page 21 of 24
AD7988-1/AD7988-5
Data Sheet
OUTLINE DIMENSIONS
3.10
3.00
2.90
10
3.10
3.00
2.90
1
5.15
4.90
4.65
6
5
PIN 1
IDENTIFIER
0.50 BSC
0.95
0.85
0.75
15° MAX
1.10 MAX
0.30
0.15
0.70
0.55
0.40
0.23
0.13
6°
0°
091709-A
0.15
0.05
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-BA
Figure 44.10-Lead Mini Small Outline Package [MSOP]
(RM-10)
Dimensions shown in millimeters
2.48
2.38
2.23
3.10
3.00 SQ
2.90
0.50 BSC
6
10
0.50
0.40
0.30
5
TOP VIEW
0.80
0.75
0.70
SEATING
PLANE
1.74
1.64
1.49
EXPOSED
PAD
0.30
0.25
0.20
1
BOTTOM VIEW
0.05 MAX
0.02 NOM
COPLANARITY
0.08
PIN 1
INDICATOR
(R 0.15)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.20 REF
Figure 45. 10-Lead Lead Frame Chip Scale Package [QFN (LFCSP_WD)]
3 mm × 3 mm Body, Very Very Thin, Dual Lead
(CP-10-9)
Dimensions shown in millimeters
Rev. B | Page 22 of 24
02-27-2012-B
PIN 1 INDEX
AREA
Data Sheet
AD7988-1/AD7988-5
ORDERING GUIDE
Model 1
AD7988-1BRMZ
AD7988-1BRMZ-RL7
AD7988-1BCPZ-RL
AD7988-1BCPZ-RL7
AD7988-5BRMZ
AD7988-5BRMZ-RL7
AD7988-5BCPZ-RL
AD7988-5BCPZ-RL7
EVAL-AD7988-5SDZ
Notes
EVAL-SDP-CB1Z
3
Integral
Nonlinearity
±1.25 LSB max
±1.25 LSB max
±1.25 LSB max
±1.25 LSB max
±1.25 LSB max
±1.25 LSB max
±1.25 LSB max
±1.25 LSB max
Temperature
Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Ordering
Quantity
Tube, 50
Reel, 1,000
Reel, 5,000
Reel, 1,500
Tube, 50
Reel, 1,000
Reel, 5,000
Reel, 1,500
2
Package Description
10-Lead MSOP
10-Lead MSOP
10-Lead QFN (LFCSP_WD)
10-Lead QFN (LFCSP_WD)
10-Lead MSOP
10-Lead MSOP
10-Lead QFN (LFCSP_WD)
10-Lead QFN (LFCSP_WD)
Evaluation Board with AD7988-5
Populated; Use for Evaluation of Both
AD7988-1 and AD7988-5.
System Demonstration Board, Used as a
Controller Board for Data Transfer via
USB Interface to PC.
Package
Option
RM-10
RM-10
CP-10-9
CP-10-9
RM-10
RM-10
CP-10-9
CP-10-9
Z = RoHS Compliant Part.
This board can be used as a standalone evaluation board or in conjunction with the EVAL-SDZ-CB1Z for evaluation/demonstration purposes.
3
This board allows a PC to control and communicate with all Analog Devices evaluation boards ending in the SD designator.
1
2
Rev. B | Page 23 of 24
Branding
C7E
C7E
C7X
C7X
C7Q
C7Q
C7Y
C7Y
AD7988-1/AD7988-5
Data Sheet
NOTES
©2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D10231-0-5/12(B)
Rev. B | Page 24 of 24