HSMC HSD471 Npn epitaxial planar transistor Datasheet

HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6518
Issued Date : 1993.02.24
Revised Date : 2002.02.20
Page No. : 1/4
HSD471A
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HSD471A is designed for use in drive and output stage of
frequency amplifier applications.
Absolute Maximum Ratings
TO-92
• Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150 °C
Junction Temperature ...................................................................................... 150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ................................................................................ 800 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ......................................................................................... 40 V
VCEO Collector to Emitter Voltage ...................................................................................... 30 V
VEBO Emitter to Base Voltage .............................................................................................. 5 V
IC Collector Current............................................................................................................... 1 A
Characteristics (Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
*VCE(sat)
*VBE(sat)
*hFE
fT
Cob
Min.
40
30
5
70
-
Typ.
130
16
Max.
100
0.5
1.2
400
-
Unit
V
V
V
nA
V
V
MHz
pF
Test Conditions
IC=100uA, IE=0
IC=10mA, IB=0
IE=100uA, IC=0
VCB=30V, IE=0
IC=1A, IB=100mA
IC=1A, IB=100mA
VCE=1V, IC=100mA
VCE=6V, IC=10mA
VCB=6V, f=1MHz, IE=0
*Pulse Test: Pulse Width ≤380us, Duty Cycle≤2%
Classification of hFE
Rank
Range
HSD471A
O
70-140
Y
120-240
GR
200-400
HSMC Product Specification
HI-SINCERITY
Spec. No. : HE6518
Issued Date : 1993.02.24
Revised Date : 2002.02.20
Page No. : 2/4
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
Saturation Voltage & Collector Current
1000
1000
Saturation Voltage (mV)
VCE(s at) @ IC=10IB
o
hFE
125 C
o
25 C
o
75 C
100
o
75 C
o
o
125 C
hFE @ VCE=1V
25 C
10
100
1
10
100
1
1000
10
Collector Current-IC (mA)
100
1000
Collector Current-IC (mA)
Capacitance & Reverse-Biased Voltage
Saturation Voltage & Collector Current
1000
100
o
Capacitance (pF)
Saturation Voltage (mV)
25 C
o
75 C
o
125 C
10
Cob
VBE(sat) @ IC=10IB
100
1
1
10
100
1000
0.1
1
Collector Current-IC (mA)
10
100
1000
Reverse Biased Voltage (V)
Cutoff Frequency & Ic
Safe Operating Area
10000
1000
Collector Current-IC (mA)
Cutoff Frequency (MHz)...
PT=1ms
VCE=6V
100
PT=100ms
1000
PT=1s
100
10
1
10
1
10
100
Collector Current (mA)
HSD471A
1000
1
10
100
Forward Biased Voltage-VCE (V)
HSMC Product Specification
HI-SINCERITY
Spec. No. : HE6518
Issued Date : 1993.02.24
Revised Date : 2002.02.20
Page No. : 3/4
MICROELECTRONICS CORP.
Temperature Profile for Dip Soldering
IR Reflow Profile
260
300
10+/-2 sec
240
10+/-2 sec
220
250
180
o
Temperature( C)
o
Temperature( C)
200
160
40+/-20 sec
140
120
100
80
200
150
100
150+/-30
60
120+/-20 sec
50
40
20
0
0
0
50
100
150
200
250
300
Time(sec)
0
50
100
150
200
250
300
350
Time(sec)
Power Temperature Derating
900
PD , Power Dissipation (mW)
800
700
600
500
400
300
200
100
0
0
20
40
60
80
100
120
140
160
o
Ta , Case Temperature ( C)
HSD471A
HSMC Product Specification
HI-SINCERITY
Spec. No. : HE6518
Issued Date : 1993.02.24
Revised Date : 2002.02.20
Page No. : 4/4
MICROELECTRONICS CORP.
TO-92 Dimension
α2
A
Marking:
H
SD
4 7 1 A
B
1
2
Rank
3
Date Code
Control Code
α3
Style: Pin 1.Emitter 2.Collector 3.Base
C
D
H
I
G
α1
E
F
3-Lead TO-92 Plastic Package
HSMC Package Code: A
*: Typical
Inches
Min.
Max.
0.1704 0.1902
0.1704 0.1902
0.5000
0.0142 0.0220
*0.0500
0.1323 0.1480
DIM
A
B
C
D
E
F
Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
0.36
0.56
*1.27
3.36
3.76
DIM
G
H
I
α1
α2
α3
Inches
Min.
Max.
0.0142 0.0220
*0.1000
*0.0500
*5°
*2°
*2°
Millimeters
Min.
Max.
0.36
0.56
*2.54
*1.27
*5°
*2°
*2°
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSD471A
HSMC Product Specification
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