NXP ADC0808S250 Single 8-bit adc, up to 125 mhz or 250 mhz Datasheet

ADC0808S125/250
Single 8-bit ADC, up to 125 MHz or 250 MHz
Rev. 03 — 24 February 2009
Product data sheet
1. General description
The ADC0808S is a differential, high-speed, 8-bit Analog-to-Digital Converter (ADC)
optimized for telecommunication transmission control systems and tape drive
applications. It allows signal sampling frequencies up to 250 MHz.
The ADC0808S clock inputs are selectable between 1.8 V Complementary Metal Oxide
Semiconductor (CMOS) or Low-Voltage Differential Signals (LVDS). The data output
signal levels are 1.8 V CMOS.
All static digital inputs (CLKSEL, CCSSEL, CE_N, OTC, DEL0 and DEL1) are 1.8 V
CMOS compatible.
The ADC0808S offers the most flexible acquisition control system possible due to its
programmable Complete Conversion Signal (CCS) which allows the delay time of the
acquisition clock and acquisition clock frequency to be adjusted.
The ADC0808S is supplied in an HTQFP48 package.
2. Features
n
n
n
n
n
n
n
n
n
n
n
n
n
n
8-bit resolution
High-speed sampling rate up to 250 MHz
Maximum analog input frequency up to 560 MHz
Programmable acquisition output clock (complete conversion signal)
Differential analog input
Integrated voltage regulator or external control for analog input full-scale
Integrated voltage regulator for input common-mode reference
Selectable 1.8 V CMOS or LVDS clock input
1.8 V CMOS digital outputs
1.8 V CMOS compatible static digital inputs
Binary or 2’s complement CMOS outputs
Only 2 clock cycles latency
Industrial temperature range from −40 °C to +85 °C
HTQFP48 package
3. Applications
n 2.5G and 3G cellular base infrastructure radio transceivers
n Wireless access systems
n Fixed telecommunications
ADC0808S125/250
NXP Semiconductors
Single 8-bit ADC, up to 125 MHz or 250 MHz
n Optical networking
n Wireless Local Area Network (WLAN) infrastructure
n Tape drive applications
4. Ordering information
Table 1.
Ordering information
Type number
Sampling frequency Package
(MHz)
Name
ADC0808S125HW/C1
125
ADC0808S250HW/C1
250
Description
Version
HTQFP48 plastic thermal enhanced thin quad flat package; SOT545-2
48 leads; body 7 × 7 × 1 mm; exposed die pad
5. Block diagram
CLKSEL
CLK+ CLK−
36
38
37
39
40
CLOCK DRIVER
IN
INN
FSIN/
REFSEL
33
32
26
8
TRACK
AND
HOLD
RESISTOR
LADDERS
ADC
CORE
LATCH
INTERNAL
REFERENCE
LATCH
CMADC
REFERENCE
29
8
CCS
CCSSEL
D0 to D7
21
30
U/I
17
LATCH
ADC0808S
DEL0
DEL1
20
OTC
IR
OUTPUTS
ENABLE
19
001aai267
CMADC
Fig 1.
Block diagram
ADC0808S125_ADC0808S250_3
Product data sheet
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© NXP B.V. 2009. All rights reserved.
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ADC0808S125/250
NXP Semiconductors
Single 8-bit ADC, up to 125 MHz or 250 MHz
6. Pinning information
37 CLK+
38 CLK−
39 DEL0
40 DEL1
41 D0
42 i.c.
43 VCCO4(1V8)
44 D1
45 i.c.
46 OGND4
47 D2
48 i.c.
6.1 Pinning
OGND1
1
36 CLKSEL
D3
2
35 i.c.
i.c.
3
34 VCCA1(3V3)
VCCO1(1V8)
4
33 IN
D4
5
32 INN
i.c.
6
OGND2
7
D5
8
29 CMADC
i.c.
9
28 AGND1
31 AGND2
ADC0808S
VCCO2(1V8) 10
30 FSIN/REFSEL
27 NC1V8
DGND
D6 11
26 CCSSEL
i.c. 12
Fig 2.
n.c. 24
VCCD1(1V8) 23
DGND1 22
OTC 21
IR 20
CE_N 19
i.c. 18
CCS 17
OGND3 16
i.c. 15
D7 14
VCCO3(1V8) 13
25 n.c.
001aai268
Pin configuration
6.2 Pin description
Table 2.
Pin description
Symbol
Pin
Type[1]
Description
OGND1
1
G
data output ground 1
D3
2
O
data output bit 3
i.c.
3
-
internally connected; leave open
VCCO1(1V8)
4
P
data output supply voltage 1 (1.8 V)
D4
5
O
data output bit 4
i.c.
6
-
internally connected; leave open
OGND2
7
G
data output ground 2
D5
8
O
data output bit 5
i.c.
9
-
internally connected; leave open
VCCO2(1V8)
10
P
data output supply voltage 2 (1.8 V)
D6
11
O
data output bit 6
i.c.
12
-
internally connected; leave open
VCCO3(1V8)
13
P
data output supply voltage 3 (1.8 V)
D7
14
O
data output bit 7
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Rev. 03 — 24 February 2009
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ADC0808S125/250
NXP Semiconductors
Single 8-bit ADC, up to 125 MHz or 250 MHz
Table 2.
Pin description …continued
Symbol
Pin
Type[1]
Description
i.c.
15
-
internally connected; leave open
OGND3
16
G
data output ground 3
CCS
17
O
complete conversion signal output
i.c.
18
-
internally connected; leave open
CE_N
19
I(CMOS)
chip enable input (active LOW)
IR
20
O(CMOS)
in-range output
OTC
21
I(CMOS)
control input for 2’s complement output
DGND1
22
G
digital ground 1
VCCD1(1V8)
23
P
digital supply voltage 1 (1.8 V)
n.c.
24
-
not connected
n.c.
25
-
not connected
CCSSEL
26
I(CMOS)
control input for CCS frequency selection
NC1V8
27
I
not connected or connected to VCCD1(1V8)
AGND1
28
G
analog ground 1
CMADC
29
O
regulator common-mode ADC output
FSIN/REFSEL
30
I
full-scale reference voltage input/internal or external
reference selection
AGND2
31
G
analog ground 2
INN
32
I
complementary analog input
IN
33
I
analog input
VCCA1(3V3)
34
P
analog supply voltage 1 (3.3 V)
i.c.
35
-
internally connected; leave open
CLKSEL
36
I(CMOS)
control input for clock input selection
CLK+
37
I
clock input
CLK−
38
I
complementary clock input
DEL0
39
I(CMOS)
complete conversion signal delay input 0
DEL1
40
I(CMOS)
complete conversion signal delay input 1
D0
41
O
data output bit 0
i.c.
42
-
internally connected; leave open
VCCO4(1V8)
43
P
data output supply voltage 4 (1.8 V)
D1
44
O
data output bit 1
i.c.
45
-
internally connected; leave open
OGND4
46
G
data output ground 4
D2
47
O
data output bit 2
i.c.
48
-
internally connected; leave open
DGND
-
G
digital ground; exposed die pad
[1]
See Table 3.
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Product data sheet
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Rev. 03 — 24 February 2009
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ADC0808S125/250
NXP Semiconductors
Single 8-bit ADC, up to 125 MHz or 250 MHz
Table 3.
Pin type description
Type
Description
I
input
O
output
I(CMOS)
1.8 V CMOS level input
O(CMOS)
1.8 V CMOS level output
P
power supply
G
ground
7. Functional description
7.1 CMOS/LVDS clock input
The circuit has two clock inputs CLK+ and CLK−, with two modes of operation:
• LVDS mode: CLK+ and CLK− inputs are at differential LVDS levels. An external
resistor of between 80 Ω and 120 Ω is required; see Figure 3.
maximum Vidth
VO(dif)
undefined state
minimum Vidth
RECEIVER
LVDS
DRIVER
CLK+
CLK−
Vgpd
001aah720
Fig 3. LVDS clock input
• 1.8 V CMOS mode: CLK+ input is at 1.8 V CMOS level and sampling is done on the
rising edge of the clock input signal. In this case pin CLK− must be grounded;
see Figure 4.
CMOS
DRIVER
CLK+
CLK−
001aai272
Fig 4. CMOS clock input
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Product data sheet
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Rev. 03 — 24 February 2009
5 of 23
ADC0808S125/250
NXP Semiconductors
Single 8-bit ADC, up to 125 MHz or 250 MHz
Table 4.
Clock input format selection
Pin CLKSEL
Clock input signal
Pins CLK+ and CLK−
HIGH or not connected
LVDS
LOW
1.8 V CMOS
7.2 Digital output coding
The digital outputs are 1.8 V CMOS compatible.
The data output format can be either binary or 2’s complement.
Table 5.
Output coding with differential inputs
Vi(p-p) = 2.0 V; Vref(fs) = 1.25 V; typical values to AGND.
Code
Inputs (V)
Output
Outputs D7 to D0
Vi(IN)
Vi(INN)
Pin IR
Binary
2’s complement
Underflow
< 0.45
> 1.45
LOW
0000 0000
1000 0000
0
0.45
1.45
HIGH
0000 0000
1000 0000
1
-
-
HIGH
0000 0001
1000 0001
:
:
:
:
:
:
127
0.95
0.95
HIGH
0111 1111
1111 1111
:
:
:
:
:
:
254
-
-
HIGH
1111 1110
0111 1110
255
1.45
0.45
HIGH
1111 1111
0111 1111
Overflow
> 1.45
< 0.45
LOW
1111 1111
0111 1111
The in-range CMOS output pin IR will be HIGH during normal operation. When the ADC
input reaches either positive or negative full-scale, the IR output will be LOW.
Selection between output coding is controlled by pins OTC and CE_N.
Table 6.
Output format selection
2’s complement outputs
Chip enable
Output data
Pin OTC
Pin CE_N
Pins D0 to D7, CCS and IR
LOW
LOW
active; binary
HIGH
LOW
active; 2’s complement
X [1]
HIGH
high-impedance
[1]
X = don’t care.
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Product data sheet
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Rev. 03 — 24 February 2009
6 of 23
ADC0808S125/250
NXP Semiconductors
Single 8-bit ADC, up to 125 MHz or 250 MHz
7.3 Timing output
sample
n
sample
n+1
sample
n+2
sample
n+3
sample
n+4
IN, INN
td(s)
n
CLK+, CLK−
50 %
td(o)
data
n−2
D0 to D7
data
n−1
data
n
th(o)
Fig 5.
data
n+1
001aab892
Output timing diagram (CCS not selected)
7.4 Timing complete conversion signal
The ADC0808S generates an adjustable clock output signal on pin CCS called Complete
Conversion Signal, which can be used to control the acquisition of converted output data
to the digital circuit connected to the ADC0808S output data bus.
Two logic input pins DEL0 and DEL1 control the delay of the edge of the CCS signal to
achieve an optimal position in the stable, usable zone of the data as shown in Figure 6.
Table 7.
Complete conversion signal selection
Pin DEL0
Pin DEL1
Pin CCS
LOW
LOW
high-impedance
HIGH
LOW
active; see Table 13
LOW
HIGH
HIGH
HIGH
Pin CCSSEL selects the CCS frequency; see Table 8.
Table 8.
Complete conversion signal frequency selection
Pin CCSSEL
CCS frequency (fCCS)
HIGH or not connected
fclk
LOW
fclk / 2
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Rev. 03 — 24 February 2009
7 of 23
ADC0808S125/250
NXP Semiconductors
Single 8-bit ADC, up to 125 MHz or 250 MHz
data
n−2
D0 to D7
data
n−1
data
n
data
n+1
td(CCS)
CCS (fclk)
50 %
CCS (fclk / 2)
50 %
001aab893
Fig 6.
Complete conversion signal timing diagram using CCS
7.5 Full-scale input selection
The ADC0808S has an internal reference circuit which can be overruled by an external
reference voltage. This can be done with the full-scale reference voltage (Vref(fs))
according to Table 9.
The ADC provides the required common-mode voltage on pin CMADC. In case of internal
regulation, the regulator output voltage on pin CMADC is 0.95 V.
Table 9.
Full-scale input selection
Full-scale reference voltage
Vref(fs)
Common-mode output
voltage VO(cm)
Maximum peak-to-peak input
voltage Vi(p-p)(max)
1.15 V
0.8 V
1.825 V
1.20 V
0.86 V
1.91 V
1.25 V
0.94 V
1.99 V
1.30 V
1.01 V
2.08 V
1.35 V
1.09 V
2.16 V
The internal reference circuit is enabled by connecting pin FSIN to ground. The
common-mode output voltage VO(cm) on pin CMADC will then be 0.95 V, and the
maximum peak-to-peak input voltage Vi(p-p)(max) will be 2.0 V; see Figure 7 and Figure 8.
The ADC full-scale input selection principle is shown in Figure 9.
ADC0808S125_ADC0808S250_3
Product data sheet
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Rev. 03 — 24 February 2009
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ADC0808S125/250
NXP Semiconductors
Single 8-bit ADC, up to 125 MHz or 250 MHz
001aai270
1.1
VO(cm)
(V)
1.0
0.9
0.8
0.7
0
1.1
1.2
1.3
1.4
VFSIN (V)
Fig 7.
ADC common-mode output voltage VO(cm) as a function of VFSIN
001aai269
2.2
Vi(p-p)(max)
(V)
2.1
2.0
1.9
1.8
1.0
1.1
1.2
1.3
1.4
VFSIN (V)
Fig 8.
ADC maximum peak-to-peak input voltage Vi(p-p)(max) as a function of VFSIN
IN
analog
input
INN
FSIN/REFSEL
CMADC
IN
analog
input
INN
1.15 V to 1.35 V
0.8 V to 1.1 V
FSIN/REFSEL
CMADC
0.95 V
001aai273
a. External reference voltage applied
b. Internal reference circuit enabled
Fig 9. ADC full-scale input selection
ADC0808S125_ADC0808S250_3
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Rev. 03 — 24 February 2009
9 of 23
ADC0808S125/250
NXP Semiconductors
Single 8-bit ADC, up to 125 MHz or 250 MHz
8. Limiting values
Table 10. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VCCA
Conditions
Min
Max
Unit
analog supply voltage
−0.5
+4.6
V
VCCD
digital supply voltage
−0.5
+2.5
V
VCCO
output supply voltage
−0.5
+2.5
V
Vi(IN)
input voltage on pin IN
referenced to AGND
−0.5
VCCA + 1
V
Vi(INN)
input voltage on pin INN
referenced to AGND
−0.5
VCCA + 1
V
Vi(CLK)
input voltage on pin CLK
referenced to DGND
−0.5
VCCD + 0.55 V
Tstg
storage temperature
−55
+150
°C
Tamb
ambient temperature
−40
+85
°C
Tj
junction temperature
-
150
°C
9. Thermal characteristics
Table 11.
Thermal characteristics
Symbol
Parameter
Typ
Unit
Rth(j-a)
thermal resistance from junction to ambient
[1]
36.2
K/W
thermal resistance from junction to case
[1]
14.3
K/W
Rth(j-c)
[1]
Conditions
In compliance with JEDEC test board, in free air.
10. Static characteristics
Table 12. Static characteristics
VCCA = 3.0 V to 3.6 V; VCCD = 1.65 V to 1.95 V; VCCO = 1.65 V to 1.95 V; pins AGND1, AGND2 and DGND1 shorted together;
Tamb = −40 °C to +85 °C; Vi(IN) − Vi(INN) = 2.0 V − 0.5 dB; VI(cm) = 0.95 V; VFSIN = 0 V; typical values are measured at
VCCA = 3.3 V, VCCD = VCCO = 1.8 V, Tamb = 25 °C and CL = 10 pF; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supplies
VCCA
analog supply voltage
3.0
3.3
3.6
V
VCCD
digital supply voltage
1.65
1.80
1.95
V
VCCO
output supply voltage
1.65
1.80
1.95
V
ICCA
analog supply current
fclk = 125 MHz; fi = 1.25 MHz
-
60
-
mA
ICCD
digital supply current
fclk = 125 MHz; fi = 1.25 MHz
-
12
-
mA
ICCO
output supply current
fclk = 125 MHz; fi = 1.25 MHz
-
11
-
mA
Ptot
total power dissipation
fclk = 125 MHz; fi = 1.25 MHz
-
240
-
mW
Clock inputs: pins CLK+ and CLK−
Ri
Ci
input resistance
[1]
-
10
-
kΩ
input capacitance
[1]
-
1
-
pF
[2]
825
-
1575
mV
LVDS clock input; see Figure 3
∆VI
input voltage range
VI on pin CLK+ or CLK−;
|Vgpd| < 50 mV
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Rev. 03 — 24 February 2009
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ADC0808S125/250
NXP Semiconductors
Single 8-bit ADC, up to 125 MHz or 250 MHz
Table 12. Static characteristics …continued
VCCA = 3.0 V to 3.6 V; VCCD = 1.65 V to 1.95 V; VCCO = 1.65 V to 1.95 V; pins AGND1, AGND2 and DGND1 shorted together;
Tamb = −40 °C to +85 °C; Vi(IN) − Vi(INN) = 2.0 V − 0.5 dB; VI(cm) = 0.95 V; VFSIN = 0 V; typical values are measured at
VCCA = 3.3 V, VCCD = VCCO = 1.8 V, Tamb = 25 °C and CL = 10 pF; unless otherwise specified.
Symbol
Parameter
Conditions
Vidth
input differential threshold voltage |Vgpd| < 50 mV
II
input current
[2]
825 mV < VI < 1575 mV
Min
Typ
Max
Unit
−100
-
+100
mV
-
-
50
µA
DGND
-
0.2VCCD
V
1.8 V CMOS clock input; see Figure 4
VIL
LOW-level input voltage
VIH
HIGH-level input voltage
0.8VCCD
-
VCCD
V
IIL
LOW-level input current
VIL = 0.2VCCD
-
-
50
µA
IIH
HIGH-level input current
VIH = 0.8VCCD
-
-
50
µA
Analog inputs: pins IN and INN
Ri
input resistance
[1]
-
1.0
-
MΩ
Ci
input capacitance
[1]
-
1.0
-
pF
VI(cm)
common-mode input voltage
0.7
0.95
1.0
V
Vi(IN) = Vi(INN);
output code = 127
Digital input pins: OTC, CE_N, DEL0, DEL1, CLKSEL and CCSSEL
VIL
LOW-level input voltage
DGND
-
0.2VCCD
V
VIH
HIGH-level input voltage
0.8VCCD
-
VCCD
V
IIL
LOW-level input current
VIL = 0.3VCCD
-
-
50
µA
IIH
HIGH-level input current
VIH = 0.7VCCD
-
-
50
µA
0.85
0.95
1.1
V
internal reference
-
0
0.6
V
external reference
1.15
1.25
1.35
V
-
12
-
µA
1.92
2
2.03
V
VFSIN = 1.15 V
1.80
1.825
1.85
V
VFSIN = 1.25 V
1.98
1.99
2.03
V
VFSIN = 1.35 V
2.11
2.16
2.18
V
-
0.2
V
VCCO
V
Voltage controlled regulator output: pin CMADC
VO(cm)
common-mode output voltage
Reference voltage input: pin
VFSIN
Ii(FSIN)
FSIN[3]
voltage on pin FSIN
input current on pin FSIN
Vi(p-p)(max) maximum peak-to-peak input
voltage
internal reference
external reference
Digital outputs: pins D0 to D7, CCS and IR
VOL
LOW-level output voltage
OGND
VOH
HIGH-level output voltage
VCCO − 0.2 -
[1]
Guaranteed by design.
[2]
|Vgpd| is the voltage of ground potential difference across or between boards.
[3]
The ADC input range can be adjusted with an external reference voltage applied to pin FSIN. This voltage must be referenced to AGND.
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Rev. 03 — 24 February 2009
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ADC0808S125/250
NXP Semiconductors
Single 8-bit ADC, up to 125 MHz or 250 MHz
11. Dynamic characteristics
Table 13. Dynamic characteristics
VCCA = 3.0 V to 3.6 V; VCCD = 1.65 V to 1.95 V; VCCO = 1.65 V to 1.95 V; pins AGND1, AGND2 and DGND1 shorted together;
Tamb = −40 °C to +85 °C; Vi(IN) − Vi(INN) = 2.0 V − 0.5 dB; VI(cm) = 0.95 V; VFSIN = 0 V; typical values are measured at
VCCA = 3.3 V, VCCD = VCCO = 1.8 V, Tamb = 25 °C and CL = 10 pF; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Clock timing input: pins CLK+ and CLK−
fclk(min)
minimum clock frequency
-
-
1
MHz
fclk(max)
maximum clock frequency
250
-
-
MHz
tw(clk)
clock pulse width
1.8
-
-
ns
1.8 V CMOS clock
-
1.3
-
ns
LVDS clock
-
1.65
-
ns
fclk = 125 MHz
Timing output: pins D0 to D7 and IR[1]; see Figure 5
td(s)
th(o)
td(o)
sampling delay time
output hold time
output delay time
1.8 V CMOS clock
3.3
4.4
-
ns
LVDS clock
4.2
4.8
-
ns
1.8 V CMOS clock
-
5.4
6.9
ns
LVDS clock
-
5.8
7.3
ns
125
-
-
MHz
DEL0 = HIGH; DEL1 = LOW
-
0.3
-
ns
DEL0 = LOW; DEL1 = HIGH
-
0.8
-
ns
DEL0 = HIGH; DEL1 = HIGH
-
1.9
-
ns
Timing complete conversion signal: pin CCS; see Figure 6
fCCS(max)
maximum CCS frequency
td(CCS)
CCS delay time
3-state output delay time: pins CCS, IR and D7 to D0
tdZH
float to active HIGH delay time
-
2.1
-
ns
tdZL
float to active LOW delay time
-
2.2
-
ns
tdHZ
active HIGH to float delay time
-
3.3
-
ns
tdLZ
active LOW to float delay time
-
2.9
-
ns
Analog signal processing (50 % clock duty factor); see Section 12
INL
integral non-linearity
fclk = 20 MHz; fi = 21.4 MHz
-
±0.82
-
LSB
DNL
differential non-linearity
fclk = 20 MHz; fi = 21.4 MHz; no
missing code guaranteed
-
±0.4
-
LSB
EO
offset error
VCCA = 3.3 V; VCCD = 1.8 V;
Tamb = 25 °C; output code = 127
-
2.5
-
mV
EG
gain error
spread from device to device;
VCCA = 3.3 V; VCCD = 1.8 V;
Tamb = 25 °C
-
1.85
-
%
B
bandwidth
fclk = 125 MHz; −3 dB; full-scale
input
[2]
-
560
-
MHz
THD
total harmonic distortion
fclk = 125 MHz; fi = 78 MHz
[3]
-
−53
-
dB
-
−53
-
dB
-
0.5
-
LSB
-
48
-
dBc
-
47
-
dBc
fclk = 250 MHz; fi = 125 MHz
Nth(RMS)
S/N
RMS thermal noise
signal-to-noise ratio
shorted input; fclk = 125 MHz
fclk = 125 MHz; fi = 78 MHz
fclk = 250 MHz; fi = 125 MHz
ADC0808S125_ADC0808S250_3
Product data sheet
[4]
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 24 February 2009
12 of 23
ADC0808S125/250
NXP Semiconductors
Single 8-bit ADC, up to 125 MHz or 250 MHz
Table 13. Dynamic characteristics …continued
VCCA = 3.0 V to 3.6 V; VCCD = 1.65 V to 1.95 V; VCCO = 1.65 V to 1.95 V; pins AGND1, AGND2 and DGND1 shorted together;
Tamb = −40 °C to +85 °C; Vi(IN) − Vi(INN) = 2.0 V − 0.5 dB; VI(cm) = 0.95 V; VFSIN = 0 V; typical values are measured at
VCCA = 3.3 V, VCCD = VCCO = 1.8 V, Tamb = 25 °C and CL = 10 pF; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
SFDR
spurious free dynamic range
fclk = 125 MHz; fi = 78 MHz
-
55
-
dBc
fclk = 250 MHz; fi = 125 MHz
-
55
-
dBc
-
−55
-
dB
-
−60
-
dB
IMD2
second-order intermodulation
distortion
f1 = 124 MHz; f2 = 126 MHz;
fclk = 250 MHz
[5]
IMD3
third-order intermodulation
distortion
f1 = 124 MHz; f2 = 126 MHz;
fclk = 250 MHz
[5]
[1]
Output data acquisition: the output data is available after the maximum delay of td(o).
[2]
The −3 dB analog bandwidth is determined by the 3 dB reduction in the reconstructed output, the input being a full-scale sine wave.
[3]
The total harmonic distortion is obtained with the addition of the first five harmonics.
[4]
The signal-to-noise ratio takes into account all harmonics above five and noise up to Nyquist frequency.
[5]
Intermodulation measured relative to either tone with analog input frequencies f1 and f2. The two input signals have the same amplitude
and the total amplitude of both signals provides full-scale to the converter (−6 dB below full-scale for each input signal). IMD3 is the ratio
of the RMS value of either input tone to the RMS value of the worst case third-order intermodulation product.
12. Definitions
12.1 Static parameters
12.1.1 Integral non-linearity
Integral non-linearity (INL) is defined as the deviation of the transfer function from a
best-fit straight line (linear regression computation). The INL of the code is obtained from
the equation:
V in ( i ) – V in ( ideal )
INL ( i ) = ----------------------------------------------S
(1)
where: S corresponds to the slope of the ideal straight line (code width), i corresponds to
the code value, Vin is the input voltage.
12.1.2 Differential non-linearity
Differential non-linearity (DNL) is the deviation in code width from the value of 1 LSB.
V in ( i + 1 ) – V in ( i )
DNL ( i ) = -------------------------------------------S
(2)
where: Vin is the input voltage; i is a code value from 0 to (2n − 2).
12.2 Dynamic parameters
Figure 10 shows the spectrum of a single tone full-scale input sine wave of frequency ft,
conforming to coherent sampling and which is digitized by the ADC under test. Coherent
sampling: (ft / fs = M / N, where M = number of cycles and N = number of samples,
M and N values being relatively prime).
ADC0808S125_ADC0808S250_3
Product data sheet
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ADC0808S125/250
NXP Semiconductors
Single 8-bit ADC, up to 125 MHz or 250 MHz
magnitude
a1
SFDR
s
a2
a3
ak
frequency
001aag627
a = harmonic.
s = single tone.
Fig 10. Single tone spectrum of full-scale input sine wave of frequency ft
Remark: Pnoise in the equations in the following sections, is the sum of noise sources
which include random noise, non-linearities, sampling time errors, and quantization noise.
12.2.1 Signal-to-Noise And Distortion (SINAD)
SINAD is the ratio of the output signal power to the noise plus distortion power for a given
sample rate and input frequency, excluding the DC component:
P signal
SINAD [ dB ] = 10log 10  ----------------------------------------
 P noise + distortion
(3)
12.2.2 Effective Number Of Bits (ENOB)
ENOB is derived from SINAD and gives the theoretical resolution required by an ideal
ADC to obtain the same SINAD measured on the real ADC. A good approximation gives:
SINAD – 1.76
ENOB = ---------------------------------6.02
(4)
12.2.3 Total Harmonic Distortion (THD)
THD is the ratio of the power of the harmonics to the power of the fundamental. For k − 1
harmonics the THD is:
P harmonics
THD [ dB ] = 10log 10  -------------------------
 P signal 
(5)
where:
ADC0808S125_ADC0808S250_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 24 February 2009
14 of 23
ADC0808S125/250
NXP Semiconductors
Single 8-bit ADC, up to 125 MHz or 250 MHz
2
2
2
P harmonics = a 2 + a 3 + … + a k
(6)
2
(7)
P signal = a 1
The value of k is usually 6 (THD is calculated based on the first 5 harmonics).
12.2.4 Signal-to-Noise ratio (S/N)
S/N is the ratio of the output signal power to the noise power, excluding the harmonics and
the DC component:
P signal
S ⁄ N = 10log 10  ----------------
 P noise 
(8)
12.2.5 Spurious Free Dynamic Range (SFDR)
The SFDR value specifies the available signal range as the spectral distance between the
amplitude of the fundamental (a1) and the amplitude of the largest spurious harmonic and
non-harmonic (max (s)), excluding the DC component:
a1
SFDR [ dB ] = 20log 10  ------------------
 max ( s )
(9)
12.2.6 InterModulation Distortion (IMD)
magnitude
f2
2f2 − f1
f1 − f2
f1
2f1 − f2
f1 + 2f2
f1 + f2
2f2 2f1
2f1 + f2
3f2
3f1
frequency
001aag628
Fig 11. Spectrum of dual tone input sine wave of frequencies f1 and f2
The second-order and third-order intermodulation distortion products IMD2 and IMD3 are
defined using a dual tone input sinusoid, where f1 and f2 are chosen according to the
coherence criterion.
IMD is the ratio of the RMS value of either tone to the RMS value of the worst, second or
third-order intermodulation products.
ADC0808S125_ADC0808S250_3
Product data sheet
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Rev. 03 — 24 February 2009
15 of 23
ADC0808S125/250
NXP Semiconductors
Single 8-bit ADC, up to 125 MHz or 250 MHz
The total intermodulation distortion is given by:
P intermod
IMD [ dB ] = 10log 10  ----------------------
 P signal 
(10)
where:
2
P intermod = a im ( f
1
– f 2)
2
– a im ( f
2
… + a im ( 2 f
2
where a im ( f
n)
2
1
+ f 2)
1 – f 2)
2
+ a im ( f
2
1
+ a im ( 2 f
– 2 f 2)
+ 2 f 2)
+…
(11)
1 + f 2)
2
(12)
2
ADC0808S125_ADC0808S250_3
Product data sheet
1
is the power in the intermodulation component at fn.
P signal = a f + a f
1
2
+ a im ( f
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 24 February 2009
16 of 23
ADC0808S125/250
NXP Semiconductors
Single 8-bit ADC, up to 125 MHz or 250 MHz
13. Package outline
HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads;
body 7 x 7 x 1 mm; exposed die pad
SOT545-2
c
y
exposed die pad side
X
Dh
36
25
A
24
37
ZE
e
E HE
Eh
(A 3)
A A2 A1
w M
θ
bp
Lp
L
pin 1 index
13
48
detail X
1
12
ZD
w M
bp
v M A
e
D
B
HD
v M B
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT max.
mm
1.2
A1
A2
A3
bp
c
D(1)
Dh
E(1)
Eh
e
HD
HE
L
Lp
v
w
y
0.15
0.05
1.05
0.95
0.25
0.27
0.17
0.20
0.09
7.1
6.9
4.6
4.4
7.1
6.9
4.6
4.4
0.5
9.1
8.9
9.1
8.9
1
0.75
0.45
0.2
0.08
0.08
ZD(1) ZE(1)
0.9
0.6
0.9
0.6
θ
7°
0°
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT545-2
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
03-04-07
04-01-29
MS-026
Fig 12. Package outline SOT545-2 (HTQFP48)
ADC0808S125_ADC0808S250_3
Product data sheet
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Rev. 03 — 24 February 2009
17 of 23
ADC0808S125/250
NXP Semiconductors
Single 8-bit ADC, up to 125 MHz or 250 MHz
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
ADC0808S125_ADC0808S250_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 24 February 2009
18 of 23
ADC0808S125/250
NXP Semiconductors
Single 8-bit ADC, up to 125 MHz or 250 MHz
14.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 13) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 14 and 15
Table 14.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
220
Table 15.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 13.
ADC0808S125_ADC0808S250_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 24 February 2009
19 of 23
ADC0808S125/250
NXP Semiconductors
Single 8-bit ADC, up to 125 MHz or 250 MHz
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 13. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
ADC0808S125_ADC0808S250_3
Product data sheet
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Rev. 03 — 24 February 2009
20 of 23
ADC0808S125/250
NXP Semiconductors
Single 8-bit ADC, up to 125 MHz or 250 MHz
15. Revision history
Table 16.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
ADC0808S125_ADC0808S250_3
20090224
Product data sheet
-
ADC0808S125_
ADC0808S250_2
Modifications:
•
Table 13 updated.
ADC0808S125_ADC0808S250_2
20081007
Product data sheet
-
TDA9917_1
TDA9917_1
20060609
Objective data sheet
-
-
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Product data sheet
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Rev. 03 — 24 February 2009
21 of 23
ADC0808S125/250
NXP Semiconductors
Single 8-bit ADC, up to 125 MHz or 250 MHz
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
ADC0808S125_ADC0808S250_3
Product data sheet
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Rev. 03 — 24 February 2009
22 of 23
ADC0808S125/250
NXP Semiconductors
Single 8-bit ADC, up to 125 MHz or 250 MHz
18. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
7.5
8
9
10
11
12
12.1
12.1.1
12.1.2
12.2
12.2.1
12.2.2
12.2.3
12.2.4
12.2.5
12.2.6
13
14
14.1
14.2
14.3
14.4
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 5
CMOS/LVDS clock input . . . . . . . . . . . . . . . . . . 5
Digital output coding . . . . . . . . . . . . . . . . . . . . . 6
Timing output . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Timing complete conversion signal. . . . . . . . . . 7
Full-scale input selection . . . . . . . . . . . . . . . . . 8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10
Thermal characteristics. . . . . . . . . . . . . . . . . . 10
Static characteristics. . . . . . . . . . . . . . . . . . . . 10
Dynamic characteristics . . . . . . . . . . . . . . . . . 12
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Static parameters . . . . . . . . . . . . . . . . . . . . . . 13
Integral non-linearity . . . . . . . . . . . . . . . . . . . . 13
Differential non-linearity . . . . . . . . . . . . . . . . . 13
Dynamic parameters. . . . . . . . . . . . . . . . . . . . 13
Signal-to-Noise And Distortion (SINAD) . . . . . 14
Effective Number Of Bits (ENOB) . . . . . . . . . . 14
Total Harmonic Distortion (THD). . . . . . . . . . . 14
Signal-to-Noise ratio (S/N) . . . . . . . . . . . . . . . 15
Spurious Free Dynamic Range (SFDR) . . . . . 15
InterModulation Distortion (IMD). . . . . . . . . . . 15
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17
Soldering of SMD packages . . . . . . . . . . . . . . 18
Introduction to soldering . . . . . . . . . . . . . . . . . 18
Wave and reflow soldering . . . . . . . . . . . . . . . 18
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 18
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 19
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 21
Legal information. . . . . . . . . . . . . . . . . . . . . . . 22
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 22
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Contact information. . . . . . . . . . . . . . . . . . . . . 22
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 24 February 2009
Document identifier: ADC0808S125_ADC0808S250_3
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