Document Number: MC146010 Rev. 1.0, 5/2007 Freescale Semiconductor Technical Data Low Power CMOS Photoelectric Smoke Detector IC The MC146010 is an advanced smoke detector component containing sophisticated very-low power analog and digital circuitry. The IC, when used with an infrared photoelectric chamber and a small number of external components, will detect smoke by sensing scattered light from smoke particles. When detection occurs, a pulsating alarm is sounded via on-chip push-pull drivers and an external piezoelectric transducer. The MC146010 provides both audible and visual alarms. Upon sensing a normal smoke level, both alarms will be activated. It is possible to mute the audible alarm for approximately eight minutes through the Integrated Mute Function (IMF), although the LED will continue to flash at a high rate. This feature is resettable through a pushbutton test. The IMF feature will be overridden by remote smoke, high smoke level, timeout or reset. The Alarm memory feature will allow for identification of an alarming detector. Through a pushbutton test, the LED will flash rapidly if there was a previous alarm condition detected at the unit. The variable-gain photo amplifier allows direct interface to IR detector (photodiode). The gain settings are determined by external capacitors and compensation resistors. A two stage speed-up is incorporated into the smoke monitor to minimize time and help reduce false triggering. Further reduction of false triggering is also addressed with the double sample chamber sensitivity and double I/O sample. MC146010 LOW POWER CMOS PHOTOELECTRIC SMOKE DETECTOR IC 16 1 ED SUFFIX PLASTIC DIP 98ASB42431B 16 Features • • • • • • • • • • • Integrated Mute Function (IMF) to Temporarily Disable Horn Alarm Memory to Help Identify Alarming Unit Speed-Up Sampling Rate After First Detection of Smoke Double Sample for Degraded Chamber Sensitivity Monitor Digital Noise Filter on the I/O Pin Power-Up and Power-Down RESET Low-Battery Trip Point Set Externally Temporal Horn Pattern Operating Temperature: -10 to 75°C Operating Voltage Range: 6.0 to 12 V Average Supply Current: 6.5 µA ORDERING INFORMATION Device Temp. Range MC146010ED Package Plastic Dip -10 to 75°C MCZ146010EG/R2 SOIC Package © Freescale Semiconductor, Inc., 2007. All rights reserved. 1 EG SUFFIX SOIC PACKAGE 98ASB42567B C1 C2 2 1 OSC 12 13 R1 16 TEST STROBE - GAIN AMP SMOKE COMP VDD - 3.5 V VDD - 4.0 V REF + GATE ON/OFF OSC TIMING LOGIC ALARM, MUTE, & RESET LOGIC LOW SUPPLY 3 ZERO DETECT GATE ON/OFF 7 8 HORN MODULATOR AND DRIVER 9 10 6 VDD - 5.0 V REF 11 4 I/O BRASS SILVER FEEDBACK IRED LED COMP + LOW-SUPPLY 15 TRIP PIN 5 = VDD PIN 14 = VSS Figure 1. Block Diagram C1 1 16 TEST/MUTE C2 2 15 LOW-SUPPLY TRIP DETECT 3 14 VSS STROBE 4 13 R1 VDD 5 12 OSC IRED 6 11 LED I/O 7 10 FEEDBACK BRASS 8 9 SILVER Figure 2. Pin Assignment (16-Pin DIP) MC146010 2 Sensors Freescale Semiconductor Table 1. Maximum Ratings(1) (Voltages Referenced to VSS) Symbol Parameter VDD DC Supply Voltage VIN DC Input Voltage IIN Value Unit -0.5 to +12 V -0.25 to VDD +0.25 -0.25 to VDD +0.25 -0.25 to VDD +10 -15 to +25 -1.0 to VDD +0.25 V DC Input Current, per Pin ±10 mA IOUT DC Output Current, per Pin ±25 mA IDD DC Supply Current, VDD/VSS pins (15 Seconds in Reverse Dir.) +25 Forward -150 Reverse mA PD Power Dissipation 1200(2) 350(3) mW Tstg Storage Temperature -55 to +125 °C TA Operating Temperature -25 to +75 °C TL Lead Temperature, 1 mm from case for 10 seconds 260 °C C1, C2, Detect Osc, Low-Supply Trip I/O Feedback Test † in Stil Air, 5 sec. †† Continuous 1. Maximum ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the limits in the electrical characteristics tables. 2. Derating: -12 mW/°C from 25°C to 60°C. 3. Derating: -3.5 mW/°C from 25°C to 60°C. This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of voltages any higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to a range of VSS ≤ (VIN or VOUT) ≤ VDD except for I/O pin which can exceed VDD, and the Test/Mute input, which can go below VSS. Unused inputs must always be tied to an appropriate logic voltage level (e.g. either VSS or VDD). Unused outputs and/or an unused I/O must be left open. Table 2. Electrical Characteristics (Voltages Referenced to VSS, TA = -10 to 60°C unless otherwise indicated.) Symbol Parameter Test Condition Test Pin VDD Min — — Low Supply Trip: VIN = VDD/3 15 — Max Unit 6.0 12 V 7.2 7.8 V VDD Power Supply Voltage Range VTH Supply Threshold Voltage, Low Supply Alarm IDD Average Operating Supply Current (per Package) (Does not include Current through D3-IR Emitter) Standby Configured per Figure 5 — — 12 9.0 — — 9.0 7.0 µA IDD Peak Supply Current (per Package) (Does not include IRED Current into base of Q1) During Strobe On, IRED Off Configured per Figure 5 During Strobe On, IRED On Configured per Figure 5 — 12 — 1.25 mA — 12 — 2.5 VIL Low Level Input Voltage I/O Feedback Test 7.0 10 16 9.0 9.0 9.0 — — — 1.5 2.7 0.5 V VIM Mid Level Input Voltage Test 16 9.0 2.0 VDD-2.0 V VIH High Level Input Voltage I/O Feedback Test 7.0 10 16 9.0 9.0 9.0 3.2 6.3 8.5 — — — V IIN Input Current VIN = VSS or VDD VIN = VSS or VDD VIN = VSS or VDD VIN = VSS or VDD 3.12 15 10 16 12 12 12 12 -100 -100 -100 -100 +100 +100 +100 +100 nA IIL Test Mode Input Current VIN = VSS or VDD 16 12 -100 -1.0 µA OSC, Detect Low-Supply Trip Feedback Test MC146010 Sensors Freescale Semiconductor 3 Table 2. Electrical Characteristics (Voltages Referenced to VSS, TA = -10 to 60°C unless otherwise indicated.) (continued) Symbol IIH Parameter Test Pin Test Condition Pull-Down Current Test I/O VIN = VDD I/O VIN = VDD I/O VIN = 17 V 16 7.0 VDD Min Max Unit 12 9.0 9.0 12 — 0.5 25 — -1.0 1.0 100 140 µA µA VOL Low-Level Output Voltage LED Silver, Brass IOUT = 10 mA IOUT = 16 mA 11 8.9 6.5 6.5 — — 0.6 1.0 V VOH High-Level Output Voltage Silver, Brass IOUT = -16 mA 8.9 6.5 5.5 — V VOUT Output Voltage Strobe (For Line Regulation, See Pin Descriptions) Inactive, IOUT = 1.0 µA Active, IOUT = 100 to 500 µA (Load Regulation) 4.0 9.0 — 9.0 VDD-0.1 VDD-5.4 — VDD-4.6 V IOH High-Level Output Current Local Smoke, VOUT = 4.5 V Local Smoke, VOUT = VSS (Short Circuit Current) 7.0 — 6.5 12 -4.0 — — -16 mA IOZ Off-State Output Leakage Current VOUT = VSS or VDD 11 12 — ±100 nA VOL Active 1.0 mA — 6.5 — 0.5 V VIC Common Mode Voltage Range C1, C2, Detect Local Smoke, Pushbutton, or Chamber Sensitivity Test — — VDD-4.0 VDD-2.0 V Internal Local Smoke, Pushbutton, or Chamber Sensitivity Test — — VDD-3.9 VDD -3.1 V Internal Local Smoke, Pushbutton, or Chamber Sensitivity Test — — VREF0.52 VREF-0.48 V VREF Smoke Comparator Reference Voltage VREF-HI High Smoke Comparator Reference Voltage I/O LED * TA = 25°C Only Table 3. AC Electrical Characteristics (Refer to Timing Diagram Figure 3 and Figure 4. TA = 25°C, VDD = 9.0 V, Component Values from Figure 5.) Test Condition Clocks Min(1) Typ(2) Max(1) Unit Free-running Saw tooth Measured at Pin 12 1.0 9.5 10.5 11.5 ms No Local Smoke, and No Remote Smoke 4096 38.9 43 47.1 s 3 Remote Smoke, but No Local Smoke — — — — 4 Local Smoke 64 0.6 0.67 0.74 5 Pushbutton Test 64 0.6 0.67 0.74 ? Pushbutton Test with Alarm Memory 4.0 38 42 46 ms Remote Smoke but No Local Smoke 1.0 9.5 10.5 11.5 ms Smoke Test 1024 9.67 10.8 11.83 s 8 Chamber Sensitivity Test, Without Local Smoke 4096 38.9 43 47.1 9 Local Smoke, in Speed-Up 128 1.2 1.3 1.5 Pushbutton Test 128 1.2 1.3 1.5 No. Symbol 1 1/fOSC 2 tLED 6 tw(LED), tw(stb) 7 tIRED Parameter Oscillator period LED Pulse Period LED Pulse Width and Strobe Pulse Width IRED Pulse Period 10 tw(IRED) IRED Pulse Width Tf* 94 — 116 µs 11 tMOD Silver and Brass Modulation Period Local or Remote Smoke 32 304 336 368 ms 12 tON/tMOD Silver and Brass Duty Cycle Local or Remote Smoke — 73 75 77 % MC146010 4 Sensors Freescale Semiconductor Table 3. AC Electrical Characteristics (Refer to Timing Diagram Figure 3 and Figure 4. TA = 25°C, VDD = 9.0 V, Component Values from Figure 5.) (continued) No. Symbol Parameter Test Condition Clocks Min(1) Typ(2) Max(1) Unit 13 tCH Silver and Brass Chirp Pulse Period Low Supply or Degraded Chamber Sensitivity 4096 38.9 43 47.1 s 14 tW(CH) Silver and Brass Chirp Pulse Width Low Supply or Degraded Chamber Sensitivity 1.0 9.5 10.5 11.5 ms 15 tRR Rising Edge on IO to Smoke Alarm Response Time Remote Smoke, No local smoke — — 2 sec(3) — 16 tstb Strobe Out Pulse Period Smoke Test 1024 9.67 10.8 11.83 s 17 Chamber Sensitivity Test Without Local Smoke 4096 38.9 43 47.1 s 18 Low Supply Test Without Local Smoke 4096 38.9 43 47.1 s 19 Pushbutton Test/Speed-Up 128 1.2 1.3 1.5 s Local smoke — 7.0 10 14 min 20 tMUTE Mute time 1. Oscillator period T (T = Tr + Tf) is determined by the external components R1, R2 and C3 where Tr = (0.6931)R2*C3 and Tf = (0.6931)R1*C3. The other timing characteristics are some multiple of the oscillator timing shown in the table. The timing shown should accommodate the NFPA72, ANSI S3.41, and ISO8201 audible emergency evacuation signals. 2. Typicals are not guaranteed. 3. Time is typical-depends on what point in cycle the signal is applied. MC146010 Sensors Freescale Semiconductor 5 Figure 3. Typical Standby Timing Diagram MC146010 Device MC146010 6 Sensors Freescale Semiconductor 16 6 2 Power-on Reset 1 17 No Low Supply Chamber Sensitivity OK 6 7 Notes: Numbers refer to the AC Electrical Characteristics Table Illustration is not to scale. Silver, Brass Enable (Internal) LED (Pin 11) Strobe (Pin 4) IRED (Pin 6) Smoke Test (Internal) Chamber Test (Internal) Low Supply Test (Internal) OSC (Pin 12) 9 5 Chirps Indicate Low Supply 13 18 14 Chirps Indicate Degraded Chamber Sensitivity 13 IRED STROBE_ENA LED HORN IO SMOKE HI_SMOKE CHMFAULT LB1 HUSH TEST_IN CH1 600u 650u Time (Seconds) 700u 750u Figure 4. Typical Local Smoke Timing MC146010 Device MC146010 Sensors Freescale Semiconductor 7 Silence Feature (Option) C1 R8 8.2 kΩ C2 D2 IR Detector Reverse Polarity Protect. SW1 Circuit D1 Pushbutton Test VSS DETECT VDD Q1 Silence Button LOWBATT C3 = 1500 pF MC146010 D3 IR Current 4.7 to 22 Ω TEST & SILENCE C2 R6 100 kΩ SW2 R16 = 3.0 MΩ C1 STROBE IR Emitter To other MC146010(s) Escape light(s) Auxiliary Alarm(s) Remote(s) And/Or Dialer 9.0 V B1 R14 R11 R10 4.7 kΩ C5 100 µF + 1 MΩ R9 5.0 kΩ R12 1.0 kΩ R15 C4 22 µF R1 R1 = 100 kΩ R7 47 kΩ R2 = 10 MΩ OSC IRED R3 = 470 Ω D4 LED I/O BRASS FEEDBACK SILVER Visible LED R4 = 2.2 MΩ C6 0.01 µF HORN X1 R5 = 100 kΩ Figure 5. Typical Battery Powered Application # * † ** Values for R4, R5 and C6 may differ depending on type of horn used. C2 and R13 are used for coarse sensitivity adjustment. Typical values are shown. R9 is for fine sensitivity adjustment (optional). If fixed resistors are used, R8 = 12k, R10 is 5.6k to 10k and R9 is eliminated. Components necessary to utilize IMF feature. MC146010 8 Sensors Freescale Semiconductor PIN DESCRIPTIONS C1 (PIN 1) A capacitor connected to this pin as shown in Figure 5 determines the gain of the on-chip photo amplifier during pushbutton test and chamber sensitivity test (high gain). The capacitor value is chosen such that the alarm tripped from background reflections in the chamber during pushbutton test. AV = 1+(C1/10) where C1 is in pF. CAUTION: The value of the closed-loop gain should not exceed 10,000. Resistor R15 should be installed in series with C1 for lower gains. R15 =[1/(12√C1]-680 where R15 is in ohms and C1 is in farads. C2 (PIN 2) A capacitor connected to this pin as shown in Figure 5 determines the gain of the on-chip photo amplifier during pushbutton test and chamber sensitivity tests. AV = 1+(C2/10) where C1 is in pF. This gain increases about 10% during IRED pulse, after two consecutive local smoke detections. For proper compensation, resistor R14 must be installed in series with C2. R14 =[1/(12√C2]-680 where R14 is in ohms and C1 is in farads. DETECT (PIN 3) This input to the high-gain pulse amplifier is tied to the cathode of an external photodiode. The photodiode should have low capacitance and low dark leakage current. The diode must be shunted by a load resistor and is operated at zero bias. The Detect input must be ac/dc decoupled from all other signals, VDD and VSS. Lead length and/or foil traces to this pin must be minimized also. See Figure 3. The device has a sampling speed-up mode after the first smoke sample is detected. The speed-up frequency is one smoke sample about every 2 seconds for the duration of a smoke condition. It will take no-smoke samples to return to a standby mode. Once out of a smoke condition, the IC will continue to sample for smoke about every 8 seconds. STROBE (PIN 4) This output provides the strobed, regulated voltage referenced to VDD. The temperature coefficient of this voltage is ±0.2%/°C maximum from -10 to 60°C. The supply-voltage coefficient (line regulation) is ±0.2%/V maximum from 6.0 to 12 V. Strobe is tied to external resistor string R8, R9 and R10. VDD (PIN 5) This pin is connected to the positive supply potential and may range from +6.0 to +12 V with respect to VSS. CAUTION: In battery-powered applications, reversepolarity protection must be provided externally. IRED (PIN 6) This output provides pulsed base current for external NPN transistor Q1 used as the infrared emitter driver. Q1 must have a β ≥ 100. At 10 mA, the temperature coefficient of the output voltage is typically +0.5%/°C from -10 to 60°C. The supply-voltage coefficient (line regulation) is ±0.2%/V maximum from 6.0 to 12 V. The IRED pulse width (activehigh) is determined by external components R1 and C3. With a 100 kΩ/1500 pF combination, the nominal width is 105 µs. To minimize noise impact, IRED is active near the end of strobe pulses for smoke tests, chamber sensitivity test, and pushbutton test. For the above mentioned width, IRED will be active for the last 105 µs of strobe pulse. I/O (PIN 7) This pin can be used to connect up to 40 units together in a wired-OR configuration for common signaling. VSS is used as the return. An on-chip current sink minimizes noise pickup during non-smoke conditions and eliminates the need for an external pull-down resistor to complete the wired-OR. Remote units at lower supply voltages do not draw excessive current from a sending unit at higher supply voltage. I/O can also be used to activate escape lights, auxiliary alarms, remote alarms and/or auto-dialers. As an input, this pin feeds a positive-edge-triggered flipflop whose output is sampled nominally every 1 second during standby (using typical component values). Once the first I/O remote smoke sample is detected, a second sample approximately 10 ms later will happen to confirm a remote smoke condition. If both samples are found to be high, the unit will start sounding an alarm. I/O is disabled by the on-chip power-on reset to eliminate nuisance signaling during battery changes or system powerup. If unused, I/O must be left unconnected. BRASS (PIN 8) This half of the push-pull driver output is connected to the metal support electrode of the piezoelectric audio transducer and to the horn-starting resistor. A continuous modulated tone from the transducer is a smoke alarm indicating either local or remote smoke. A short beep or chirp is a trouble alarm indicating a low supply or degraded chamber sensitivity. A series of short beeps or chirps during a pushbutton test indicate a previous alarm for detected smoke (Alarm memory feature). SILVER (PIN 9) This half of the push-pull driver output is connected to the ceramic electrode of a piezoelectric transducer and to the horn-starting capacitor. FEEDBACK (PIN 10) This input is connected to both the feedback electrode of a self-resonating piezoelectric transducer and the hornstarting resistor and capacitor through current limiting resistor R4. If unused, the pin must be tied to VSS or VDD. LED (PIN11) This active-low open drain output directly drives an external visible LED at the pulse rate indicated below. The pulse width is equal to the OSC period. MC146010 Sensors Freescale Semiconductor 9 The load for the low-supply test is non-coincident with the smoke tests, chamber sensitivity test, pushbutton test, or any alarm signals. The LED also provides a visual indication of the detector status as follows, assuming the component values shown in Figure 4: Standby (includes low-supply and chamber sensitivity tests) — Pulses every 32.4 seconds. Local Smoke — Pulses every 2.0 seconds (typical) Mute — Pulses every 2.0 seconds (typical) Remote Smoke — No Pulses Pushbutton test — Pulses every 2.0 seconds OSC (PIN 12) This pin is used in conjunction with external resistor R2 (7.5 MΩ) to VDD and external capacitor C3 (1500 pF) to VDD to form an oscillator with a nominal period of 7.9 msec (typical). R1 (PIN 13) This pin is use din conjunction with resistor R1(100 kΩ) to pin 12 and C3 (1500 pF, see pin 12 description) to determine the IRED pulse width. With this RC combination, the nominal pulse width is 105 µs. VSS (PIN 14) This pin is the negative supply potential and the return for the I/O pin. Pin 14 is usually tied to Ground. LOW-SUPPLY TRIP (PIN 15) This pin is connected to an external voltage which determines the low-supply alarm threshold. The trip voltage is obtained through a resistor divider connected between the VDD and LED pins. The low-supply alarm threshold voltage (in volts) = (5R7/R6)+5 where R6 and R7 are in the same units. TEST/MUTE (PIN 16) This input has an on-chip pull-down device and is used to manually invoke a test mode, a mute mode, or a calibration mode. The Pushbutton Test mode is initiated by a high level at Pin 16 (usually a depression of a S.P.S.T. normally-open pushbutton switch to VDD). After one oscillator cycle, the IRED pulses approximately every 1.0 second, regardless of the presence of smoke. Additionally, the amplifier gain is increased by automatic selection of C1. Therefore the background reflections in the smoke chamber may be interpreted as smoke, generating a simulated smoke condition. After the second IRED pulse, a successful test activates the horn-driver and I/O circuits. The active I/O allows remote signaling for a system testing. When the Pushbutton Test switch is released, the Test input returns to VSS due to the on-chip pull-down device. After one oscillator cycle, the amplifier gain returns to normal, thereby removing the simulated smoke condition. After two additional IRED pulses, less than three seconds, the IC exits the alarm mode and returns to standby timing. The Pushbutton Test will also activate the Alarm Memory feature. If there was a previous alarm detected by the unit, the horn will chirp every ¼ second as long as the Test Button is pressed. Upon releasing of the Test Button, Alarm memory will be reset. Subsequent pressing of the Test Button will result in a Pushbutton Test for simulated smoke. Pressing the Test Button while in the MUTE mode will result in resetting of MUTE (and additionally a normal Pushbutton Test). The MUTE mode (IMF) is initiated by a mid level voltage (around ½ VDD) at pin 16. A parallel Mute Button to an existing Test Button needs to be installed at the test pin. A smoke condition must be present for the MUTE mode to be activated. If a no smoke condition gets detected while in the MUTE mode, the IMF 8 minute window gets reset. The unit will return to Standby mode. Once in the MUTE mode, the audible smoke alarm (horn) is temporarily disabled for approximately 8 minutes while smoke condition is being detected. A visual smoke alarm will remain (LED flashing) during MUTE mode. A high smoke voltage reference will also be activated at this time. Simultaneous smoke and high smoke sampling will allow the unit to enable the horn driver in case a high smoke condition occurs during MUTE where the high smoke threshold is crossed. The MUTE mode can be overridden by the following conditions: 1) a no smoke condition is detected, 2) high smoke level detected, 3) remote smoke detected through I/O, 4) reset through test Button, 5) timeout of 8 minute window. To help prevent a jammed Mute Button condition, the divider string on the Mute Button should include a resistor to VDD, R15 (around 10 MΩ) and a resistor R16 (4.7 MΩ) and capacitor, C7 (0.047 mF) in series to VSS. CALIBRATION To facilitate checking the sensitivity and calibrating smoke detectors, the MC146010 can be placed in Calibration mode. In this mode, certain device pins are controlled/reconfigured as shown in Table 4. To place the part in Calibration mode, Pin 16 (Test/ Mute) must be pulled below VSS pin with 100 µA continuously drawn out of the pin for at least one cycle of the OSC pin. To exit this mode, the Test/ Mute pin is floated for at least one OSC cycle. In the Calibration mode, the IRED pulse rate is increased. An IRED pulse occurs every clock cycle. Also, Strobe is always Active Low. It is recommended to short R12 (Figure 5) in this mode. This will allow for a similar recovery of the emitter circuitry as in normal operation. Pin 1, pin 2, and pin 12 should be buffered with a unity gain amplifier to measure their outputs. MC146010 10 Sensors Freescale Semiconductor Table 4. MC146010 Test Mode Logic Table Pin Function Type Logic Description Pin 16, TEST Test Mode 1 Trigger Input None Set a –Ve voltage to the pin and source 100 µA from the pin to start Test Mode 1. Pin 12, OSC CAP Clock Input Input 0 Internal clock low 1 Internal clock high Pin 5, VDD Chip Power Pin 14, VSS Chip Ground Pin 11, LED Built-in-Test for HUSH Timer Output Output pulse active low for 8 Clocks every 128 Clocks. Pin 4, STROBE Analog Ground Output Output low when pin 12 is low. Pin 6, IRED IRED Output Pin 3, DETECT Smoke Sensing Input Input 0 Output low when pin 12 is low. 1 Output high (3.0 V) when pin 12 is high. NO SMK: VDD-2.5 V – (1/Hi Gain) SMK: VDD-2.5 V –(1/Low Gain) HI SMK: VDD-2.5 V – (2/Low Gain) Pin 8, BRASS Pin 9, SILVER Pin 7, I/O Smoke Latch Indicator Photo-Comparator Indicator Photo-Amp Routing Enable Output Output Input 0 Output low when smoke latch not set. 1 Output high when smoke latch set. 0 Output low when photo comparator not set. 1 Output high when photo comparator set. 0 Disable the function of Pin 1, 2, 10 and 15 in Test Mode 1. 1 Enable photoamplifier output routed to the pins and enable pins 1, 2, 10 and 15 in test Mode 1. Pin 15, LOW_BATT Low Battery Trip Point Input Control photo amp. Gain and output routing Pin 10, FEEDBACK Feedback Input Control hysteresis MC146010 Sensors Freescale Semiconductor 11 Figure 6. Recommended PCB layout MC146010 12 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 1 OF 3 98ASB42431B ISSUE T PLASTIC DIP MC146010 Sensors Freescale Semiconductor 13 PACKAGE DIMENSIONS PAGE 2 OF 3 98ASB42431B ISSUE T PLASTIC DIP MC146010 14 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 3 OF 3 98ASB42431B ISSUE T PLASTIC DIP MC146010 Sensors Freescale Semiconductor 15 PACKAGE DIMENSIONS PAGE 1 OF 2 98ASB42567B ISSUE F SOIC PACKAGE MC146010 16 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 2 OF 2 98ASB42567B ISSUE F SOIC PACKAGE MC146010 Sensors Freescale Semiconductor 17 How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 [email protected] Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) [email protected] Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 [email protected] Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 [email protected] For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. 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