Renesas HD64F3029TE25W Renesas 16-bit single-chip microcomputer h8 family/h8/300h sery Datasheet

REJ09B0043-0200H
The revision list can be viewed directly
by clicking the title page.
The revision list summarizes the locations
of revisions and additions.
Details should always be checked by referring
to the relevant text.
16
TM
H8/3029F-ZTAT
Hardware Manual
Renesas 16-Bit Single-Chip Microcomputer
H8 Family / H8/300H Series
H8/3029
Rev. 2.00
Revision date: Jun. 10, 2004
HD64F3029
www.renesas.com
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and
more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corp. product best suited to the customer's application; they do not convey any license
under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or
a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any thirdparty's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corp. without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or
an authorized Renesas Technology Corp. product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising
from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means,
including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data,
diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total
system before making a final decision on the applicability of the information and products. Renesas
Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or
system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when
considering the use of a product contained herein for any specific purposes, such as apparatus or
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6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must
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Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products
contained therein.
General Precautions on Handling of Product
1. Treatment of NC Pins
Note: Do not connect anything to the NC pins.
The NC (not connected) pins are either not connected to any of the internal circuitry or are
they are used as test pins or to reduce noise. If something is connected to the NC pins, the
operation of the LSI is not guaranteed.
2. Treatment of Unused Input Pins
Note: Fix all unused input pins to high or low level.
Generally, the input pins of CMOS products are high-impedance input pins. If unused
pins are in their open states, intermediate levels are induced by noise in the vicinity, a
pass-through current flows internally, and a malfunction may occur.
3. Processing before Initialization
Note: When power is first supplied, the product’s state is undefined.
The states of internal circuits are undefined until full power is supplied throughout the
chip and a low level is input on the reset pin. During the period where the states are
undefined, the register settings and the output state of each pin are also undefined. Design
your system so that it does not malfunction because of processing while it is in this
undefined state. For those products which have a reset function, reset the LSI
immediately after the power supply has been turned on.
4. Prohibition of Access to Undefined or Reserved Addresses
Note: Access to undefined or reserved addresses is prohibited.
The undefined or reserved addresses may be used to expand functions, or test registers
may have been be allocated to these addresses. Do not access these registers; the system’s
operation is not guaranteed if they are accessed.
Preface
This LSI is a high performance single-chip microcontroller that integrates peripheral functions
necessary for system configuration with an H8/300H CPU featuring a 32-bit internal architecture
as its core. In addition, this LSI has an on-chip debugging function using the on-chip debugging
emulator (E10T).
The E10T emulates a microcontroller and provides functions to support debugging of user
programs under the conditions of this LSI being mounted on the user system.
Note: * F-ZTAT™ is a trademark of Renesas Technology Corp., Ltd.
Intended Readership: This manual is intended for users undertaking the design of an application
TM
system using the H8/3029F-ZTAT . Readers using this manual require a
basic knowledge of electrical circuits, logic circuits, and microcomputers.
Purpose:
The purpose of this manual is to give users an understanding of the
TM
hardware functions and electrical characteristics of the H8/3029F-ZTAT .
Details of execution instructions can be found in the H8/300H Series
Programming Manual, which should be read in conjunction with the
present manual.
Using this Manual:
TM
•
For an overall understanding of the H8/3029F-ZTAT 's functions
Follow the Table of Contents. This manual is broadly divided into sections on the CPU,
system control functions, peripheral functions, and electrical characteristics.
•
For a detailed understanding of CPU functions
Refer to the separate publication, H8/300H Series Programming Manual.
In order to understand the details of a register when its name is known. The addresses, bits,
and initial values of the registers are summarized in Appendix B, Internal I/O Registers.
Related Material:
The latest information is available at our Web Site. Please make sure that
you have the most up-to-date information available.
(http:www.renesas.com)
Rev. 2.0, 06/04, page i of xxiv
TM
User's Manual on the H8/3029F-ZTAT :
Manual Title
H8/3029F-ZTAT
ADE No.
TM
Hardware Manual
H8/300H Series Programming Manual
This manual
ADE-602-053
Usr's Manuals for development tools:
Manual Title
ADE No.
C/C++ Compiler, Assembler, Optimizing Linkage Editor User's Manual
ADE-702-247
H8S, H8/300 Series Simulator/Debugger User's Manual
ADE-702-037
Renesas Technolgy Embedded Workshop User's Manual
ADE-702-201
H8S, H8/300 Series High-Performance Embedded Workshop, Renesas
Technolgy Debegging Interface User's Manual
ADE-702-231
Application Note:
Manual Title
ADE No.
H8/300H for CPU Application Note
ADE-502-033
H8/300H On-Chip Supporting Modules Application Note
ADE-502-035
H8/300H Technical Q&A
ADE-502-038
Rev. 2.0, 06/04, page ii of xxiv
Main Revisions for This Edition
Item
Page
All
Revision (See Manual for Details)
Product code changed
HD64F3029X25→HD64F3029TE25
HD64F3029X25W→HD64F3029TE25W
HD64F3029XBL25→HD64F3029TEBL25
1.1 Overview
6
Table amended
Table 1.1 Features
12.2.4 Notes on Register
Access
448
Product
Type
Product Code
(Catalog Product
Code)
Regular product
code
(Internal Product
Code)
H8/3029
HD64F3029F25
HD64F3029F25
HD64F3029F25W
HD64F3029F25W
HD64F3029FBL25
HD64F3029FBL25
HD64F3029TE25
HD64F3029X25
HD64F3029TE25W
HD64F3029X25W
HD64F3029TEBL25
HD64F3029XBL25
Description of RSTOE deleted
Writing to RSTCSR
Figure12.3 Format of Data
Written to RSTCSR
Rev. 2.0, 06/04, page iii of xxiv
Item
Page
Revision (See Manual for Details)
18.4.2 Programming/Erasing
Interface Register
596
Table amended
Bit 7
(6) Flash Transfer Destination
Address Register (FTDAR)
18.10.1 Serial Communication
Interface Specification for Boot
Mode
TDER
652
Description(Return Value after Download)
0
Setting of TDA6 to TDA0 is normal
1
Setting of TDER and TDA6 to TDA0 is H'04 to H'FF and download has been
aborted
(Initial value)
Description amended
— Size (1 byte) : Amount of device-code data
This is fixed to 4
• Inquiry and Selection States
(2) Device Selection
(11) New Bit-Rate Selection
657, 658
Description amended
—Number of multiplication ratios (1 byte) : The
number of multiplication ratios to which the device
can be set. Normally the value is two: main
operating frequency and peripheral module
operating frequency. (Should be set to H'01 for
this LSI.)
— Multiplication ratio 2 (1 byte) : The value of
multiplication or division ratios for the peripheral
frequency
— Multiplication ratio (1 byte) : The value of the
multiplication ratio (e.g. when the clock
frequency is multiplied by four, the
multiplication ratio will be H'04. Cannot be set
for this LSI.)
• Programming
663
Programming selection (H'42, H'43 )
Figure18.27 Programming
Sequence
(3) 128-byte Programming
Figure amended
664
Description amended
— Programming Address (4 bytes) : Start address
for programming
Multiple of the size specified in response to the
programming unit inquiry
(i.e. H'00, H'01, H'00, H'00 : H'00010000)
19.2.2 External Clock Input
External Clock
Table 19.3 Clock Timing
693
Table amended
Item
Clock low pulse width
Clock high pulse width
Rev. 2.0, 06/04, page iv of xxiv
Test Conditions
Figure 21.13
Item
Page
Revision (See Manual for Details)
21.1 Electrical Characteristics
of HD64F3029F25,
HD64F3029TE25
713
Title amended
21.1.2 DC Characteristics
715, 716
Table and note amended
Table 21.2 DC Characteristics
Item
Symbol
Current
2
dissipation*
Normal
operation
ICC*
3
Typ
Max
Unit
Test
Conditions
20(3.3V)
38
mA
f = 25 MHz
Sleep mode
—
17(3.3V)
35
mA
f = 25 MHz
Module
standby mode
—
16(3.3V)
34
mA
f = 25 MHz
Standby mode
—
15(3.3V)
70
µA
Ta ≤ 50˚C
—
—
100
µA
50˚C < Ta
—
30(3.3V)
48
mA
f = 25 MHz
(reference
values)
Flash memory
programming/
4
erasing*
Analog power During A/D
supply current conversion
AICC
—
0.6
1.5
mA
During A/D
and D/A
conversion
—
0.6
1.5
mA
Idle
—
0.02(3.3V) 5.0
µA
Ta ≤ 50˚C
at DASTE = 0
—
—
µA
50˚C < Ta
at DASTE = 0
Item
Symbol
Reference
current
Min
—
During A/D
conversion
AICC
During A/D
and D/A
conversion
Idle
Min
Typ
15
Max
Unit
—
0.25
0.8
mA
—
1.2
3.0
mA
—
0.02
5.0
µA
RAM standby voltage
VRAM
3.0
—
—
V
VCL output
VCL
1.5
1.9
2.3
V
VCC START
—
0
0.8
V
SVCC
0.05
—
—
V/ms
Voltage*
Normal
operation
5
VCC start
Voltage*
Test
Conditions
DASTE = 0
VCC = 3.3V
Ta = 25˚C
6
VCC rise rate*
6
*3 ICC max. (normal operation)= 11 (mA) + 0.13
(mA/(MHz × V)) × VCC × f
ICC max. (sleep mode)= 11 (mA) + 0.11
(mA/(MHz × V)) × VCC × f
ICC max. (sleep mode + module standby mode) =
11 (mA) + 0.10 (mA/(MHz × V)) × VCC × f
Rev. 2.0, 06/04, page v of xxiv
Item
Page
Revision (See Manual for Details)
21.1.4 A/D Conversion
Characteristics
725
Table amended
Table 21.8 A/D Conversion
Characteristics
Item
Max
Nonlinearity error
Conversion time: Offset error
134 states
Full-scale error
±3.5
Quantization error
±0.5
Absolute accuracy
±4.0
±3.5
±3.5
Item
Max
Nonlinearity error
Conversion time*: Offset error
70 states
Full-scale error
±7.5
Quantization error
±0.5
Absolute accuracy
±8.0
21.2 Electrical Characteristics
of HD64F3029F25W and
HD64F3029TE25W
728
Title amended
21.2.2 DC Characteristics
730
Table and note amended
±7.5
±7.5
Table 21.12 DC Characteristics
Min
Typ
Max
Unit
Test
Conditions
—
2.0(3.3V)
38
mA
f = 25 MHz
Sleep mode
—
17(3.3V)
35
mA
f = 25 MHz
Module
standby mode
—
16(3.3V)
34
mA
f = 25 MHz
Standby mode
—
15(3.3V)
70
µA
Ta ≤ 50˚C
—
—
100
µA
50˚C < Ta
—
30(3.3V)
48
mA
f = 25 MHz
(reference
values)
Item
Current
2
dissipation*
Symbol
Normal
operation
ICC*
3
Flash memory
programming/
4
erasing*
Analog power During A/D
supply current conversion
Rev. 2.0, 06/04, page vi of xxiv
AICC
—
0.6
1.5
mA
During A/D
and D/A
conversion
—
0.6
1.5
mA
Idle
—
0.02(3.3V) 5.0
µA
Ta ≤ 50˚C
at DASTE = 0
—
—
µA
50˚C < Ta
at DASTE = 0
15
Item
Page
Revision (See Manual for Details)
21.2.2 DC Characteristics
731
Table and note amended
Table 21.12 DC Characteristics
Item
Reference
current
During A/D
conversion
Symbol
Min
Typ
Max
Unit
AICC
—
0.25
0.8
mA
—
1.2
3.0
mA
During A/D
and D/A
conversion
—
0.02
5.0
µA
RAM standby voltage
Idle
VRAM
3.0
—
—
V
VCL output
VCL
1.5
1.9
2.3
V
VCC START
—
0
0.8
V
SVCC
0.05
—
—
V/ms
Voltage*5
Normal
operation
VCC start
Voltage*6
VCC rise rate*6
*3 ICC max. (normal operation)= 11 (mA) + 0.13
(mA/(MHz × V)) × VCC × f
ICC max. (sleep mode)= 11 (mA) + 0.11
(mA/(MHz × V)) × VCC × f
ICC max. (sleep mode + module standby mode) =
11 (mA) + 0.10 (mA/(MHz × V)) × VCC × f
21.2.4 A/D Conversion
Characteristics
740
Table 21.18 A/D Conversion
Characteristics
21.3 Electrical Characteristics
of HD64F3029FBL25 and
HD64F3029TEBL25
743
Table amended
Item
Max
Nonlinearity error
Conversion time: Offset error
134 states
Full-scale error
±3.5
Quantization error
±0.5
Absolute accuracy
±4.0
±3.5
±3.5
Item
Max
Nonlinearity error
Conversion time*: Offset error
70 states
Full-scale error
±7.5
Quantization error
±0.5
Absolute accuracy
±8.0
±7.5
±7.5
Title amended
Rev. 2.0, 06/04, page vii of xxiv
Item
Page
Revision (See Manual for Details)
21.3.2 DC Characteristics
745, 746
Table and note amended
Table 21.22 DC Characteristics
Min
Typ
Max
Unit
Test
Conditions
—
20(3.3V)
38
mA
f = 25 MHz
Sleep mode
—
17(3.3V)
35
mA
f = 25 MHz
Module
standby mode
—
16(3.3V)
34
mA
f = 25 MHz
Flash memory
programming/
4
erasing*
—
30(3.3V)
48
mA
f = 25 MHz
(reference
values)
Item
Current
2
dissipation*
Symbol
Normal
operation
ICC*
Analog power During A/D
supply current conversion
3
AICC
During A/D
and D/A
conversion
—
0.6
1.5
mA
—
0.6
1.5
mA
Item
Reference current
During A/D
conversion
Symbol
Min
Typ
Max
AICC
—
0.25
0.8
—
1.2
3.0
3.0
—
—
During A/D and
D/A conversion
RAM standby voltage
VRAM
*3 ICC max. (normal operation)= 11 (mA) + 0.13
(mA/(MHz × V)) × VCC × f
ICC max. (sleep mode)= 11 (mA) + 0.11
(mA/(MHz × V)) × VCC × f
ICC max. (sleep mode + module standby mode) =
11 (mA) + 0.10 (mA/(MHz × V)) × VCC × f
21.3.4 A/D Conversion
Characteristics
Table 21.28 A/D Conversion
Characteristics
Rev. 2.0, 06/04, page viii of xxiv
755
Table amended
Item
Max
Nonlinearity error
Conversion time: Offset error
134 states
Full-scale error
±3.5
Quantization error
±0.5
Absolute accuracy
±4.0
±3.5
±3.5
Item
Max
Nonlinearity error
Conversion time*: Offset error
70 states
Full-scale error
±7.5
Quantization error
±0.5
Absolute accuracy
±8.0
±7.5
±7.5
Item
Page
Revision (See Manual for Details)
B.1 Addresses (EMC=1)
807
Bit table amended
B.2 Addresses (EMC=0)
B.3 Functions
820
Address
(Low)
Register
Name
Data
Bus
Width
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
H'EE0B6
FTDAR
8
TDER
TDA6
TDA5
TDA4
TDA3
TDA2
TDA1
TDA0
Bit Names
Bit table amended
Address
(Low)
Register
Name
Data
Bus
Width
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
H'EE0B6
FTDAR
8
TDER
TDA6
TDA5
TDA4
TDA3
TDA2
TDA1
TDA0
856
Added
969
Table amended
Bit Names
FTDAR Flash Transfer
Destination Address Register
F.1 H8/3029F Product Code
Lineup
Product Type
Product Code
(Catalog Package
Code)
H8/3029 On-chip flash HD64F3029F25
memory
HD64F3029F25W
Regular product
code
(Internal Product
Code)
HD64F3029F25
HD64F3029F25W
HD64F3029FBL25
HD64F3029FBL25
HD64F3029TE25
HD64F3029X25
HD64F3029TE25W
HD64F3029X25W
HD64F3029TEBL25W HD64F3029XBL25
Rev. 2.0, 06/04, page ix of xxiv
Rev. 2.0, 06/04, page x of xxiv
Contents
Section 1 Overview............................................................................................1
1.1
1.2
1.3
Overview........................................................................................................................... 1
Block Diagram .................................................................................................................. 7
Pin Description.................................................................................................................. 8
1.3.1 Pin Arrangement .................................................................................................. 8
1.3.2 Pin Functions ....................................................................................................... 9
1.3.3 Pin Assignments in Each Mode ........................................................................... 14
Section 2 CPU....................................................................................................19
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
Overview........................................................................................................................... 19
2.1.1 Features................................................................................................................ 19
2.1.2 Differences from H8/300 CPU ............................................................................ 20
CPU Operating Modes ...................................................................................................... 21
Address Space................................................................................................................... 22
Register Configuration...................................................................................................... 23
2.4.1 Overview.............................................................................................................. 23
2.4.2 General Registers ................................................................................................. 24
2.4.3 Control Registers ................................................................................................. 25
2.4.4 Initial CPU Register Values ................................................................................. 26
Data Formats..................................................................................................................... 27
2.5.1 General Register Data Formats ............................................................................ 27
2.5.2 Memory Data Formats ......................................................................................... 29
Instruction Set ................................................................................................................... 30
2.6.1 Instruction Set Overview ..................................................................................... 30
2.6.2 Instructions and Addressing Modes..................................................................... 31
2.6.3 Tables of Instructions Classified by Function...................................................... 32
2.6.4 Basic Instruction Formats .................................................................................... 41
2.6.5 Notes on Use of Bit Manipulation Instructions.................................................... 42
Addressing Modes and Effective Address Calculation..................................................... 44
2.7.1 Addressing Modes ............................................................................................... 44
2.7.2 Effective Address Calculation ............................................................................. 46
Processing States............................................................................................................... 50
2.8.1 Overview.............................................................................................................. 50
2.8.2 Program Execution State...................................................................................... 51
2.8.3 Exception-Handling State .................................................................................... 51
2.8.4 Exception-Handling Sequences ........................................................................... 53
2.8.5 Bus-Released State............................................................................................... 54
2.8.6 Reset State............................................................................................................ 54
2.8.7 Power-Down State ............................................................................................... 54
Rev. 2.0, 06/04, page xi of xxiv
2.9
Basic Operational Timing ................................................................................................. 55
2.9.1 Overview.............................................................................................................. 55
2.9.2 On-Chip Memory Access Timing........................................................................ 55
2.9.3 On-Chip Supporting Module Access Timing ...................................................... 56
2.9.4 Access to External Address Space ....................................................................... 57
Section 3 MCU Operating Modes .....................................................................59
3.1
3.2
3.3
3.4
3.5
3.6
Overview........................................................................................................................... 59
3.1.1 Operating Mode Selection ................................................................................... 59
3.1.2 Register Configuration......................................................................................... 60
Mode Control Register (MDCR) ...................................................................................... 61
System Control Register (SYSCR) ................................................................................... 62
Operating Mode Descriptions ........................................................................................... 64
3.4.1 Mode 1 ................................................................................................................. 64
3.4.2 Mode 2 ................................................................................................................. 64
3.4.3 Mode 3 ................................................................................................................. 64
3.4.4 Mode 4 ................................................................................................................. 65
3.4.5 Mode 5 ................................................................................................................. 65
3.4.6 Mode 7 ................................................................................................................. 65
Pin Functions in Each Operating Mode ............................................................................ 66
Memory Map in Each Operating Mode ............................................................................ 67
3.6.1 Note on Reserved Areas....................................................................................... 67
Section 4 Exception Handling ...........................................................................73
4.1
4.2
4.3
4.4
4.5
4.6
Overview........................................................................................................................... 73
4.1.1 Exception Handling Types and Priority............................................................... 73
4.1.2 Exception Handling Operation ............................................................................ 73
4.1.3 Exception Vector Table ....................................................................................... 74
Reset.................................................................................................................................. 76
4.2.1 Overview.............................................................................................................. 76
4.2.2 Reset Sequence .................................................................................................... 76
4.2.3 Interrupts after Reset............................................................................................ 78
Interrupts........................................................................................................................... 79
Trap Instruction................................................................................................................. 80
Stack Status after Exception Handling.............................................................................. 81
Notes on Stack Usage ....................................................................................................... 82
Section 5 Interrupt Controller............................................................................85
5.1
Overview........................................................................................................................... 85
5.1.1 Features................................................................................................................ 85
5.1.2 Block Diagram ..................................................................................................... 86
5.1.3 Pin Configuration................................................................................................. 87
5.1.4 Register Configuration......................................................................................... 87
Rev. 2.0, 06/04, page xii of xxiv
5.2
5.3
5.4
5.5
Register Descriptions ........................................................................................................ 88
5.2.1 System Control Register (SYSCR) ...................................................................... 88
5.2.2 Interrupt Priority Registers A and B (IPRA, IPRB)............................................. 89
5.2.3 IRQ Status Register (ISR).................................................................................... 96
5.2.4 IRQ Enable Register (IER) .................................................................................. 97
5.2.5 IRQ Sense Control Register (ISCR) .................................................................... 98
Interrupt Sources............................................................................................................... 99
5.3.1 External Interrupts ............................................................................................... 99
5.3.2 Internal Interrupts ................................................................................................ 100
5.3.3 Interrupt Vector Table ......................................................................................... 100
Interrupt Operation............................................................................................................ 104
5.4.1 Interrupt Handling Process .................................................................................. 104
5.4.2 Interrupt Sequence ............................................................................................... 109
5.4.3 Interrupt Response Time...................................................................................... 110
Usage Notes ...................................................................................................................... 111
5.5.1 Contention between Interrupt and Interrupt-Disabling Instruction...................... 111
5.5.2 Instructions that Inhibit Interrupts ....................................................................... 112
5.5.3 Interrupts during EEPMOV Instruction Execution.............................................. 112
Section 6 Bus Controller....................................................................................113
6.1
6.2
6.3
Overview........................................................................................................................... 113
6.1.1 Features................................................................................................................ 113
6.1.2 Block Diagram ..................................................................................................... 115
6.1.3 Pin Configuration................................................................................................. 116
6.1.4 Register Configuration......................................................................................... 117
Register Descriptions ........................................................................................................ 118
6.2.1 Bus Width Control Register (ABWCR)............................................................... 118
6.2.2 Access State Control Register (ASTCR) ............................................................. 119
6.2.3 Wait Control Registers H and L (WCRH, WCRL).............................................. 119
6.2.4 Bus Release Control Register (BRCR) ................................................................ 123
6.2.5 Bus Control Register (BCR) ................................................................................ 124
6.2.6 Chip Select Control Register (CSCR).................................................................. 128
6.2.7 DRAM Control Register A (DRCRA) ................................................................. 129
6.2.8 DRAM Control Register B (DRCRB) ................................................................. 131
6.2.9 Refresh Timer Control/Status Register (RTMCSR) ............................................ 133
6.2.10 Refresh Timer Counter (RTCNT)........................................................................ 135
6.2.11 Refresh Time Constant Register (RTCOR) ......................................................... 135
6.2.12 Address Control Register (ADRCR).................................................................... 136
Operation .......................................................................................................................... 137
6.3.1 Area Division ....................................................................................................... 137
6.3.2 Bus Specifications................................................................................................ 139
6.3.3 Memory Interfaces............................................................................................... 140
6.3.4 Chip Select Signals .............................................................................................. 141
Rev. 2.0, 06/04, page xiii of xxiv
6.3.5 Address Output Method....................................................................................... 142
Basic Bus Interface ........................................................................................................... 144
6.4.1 Overview.............................................................................................................. 144
6.4.2 Data Size and Data Alignment............................................................................. 144
6.4.3 Valid Strobes....................................................................................................... 145
6.4.4 Memory Areas ..................................................................................................... 146
6.4.5 Basic Bus Control Signal Timing ........................................................................ 148
6.4.6 Wait Control ........................................................................................................ 155
6.5 DRAM Interface ............................................................................................................... 157
6.5.1 Overview.............................................................................................................. 157
6.5.2 DRAM Space and RAS Output Pin Settings ....................................................... 157
6.5.3 Address Multiplexing........................................................................................... 158
6.5.4 Data Bus............................................................................................................... 159
6.5.5 Pins Used for DRAM Interface............................................................................ 159
6.5.6 Basic Timing........................................................................................................ 160
6.5.7 Precharge State Control ....................................................................................... 161
6.5.8 Wait Control ........................................................................................................ 162
6.5.9 Byte Access Control and CAS Output Pin........................................................... 163
6.5.10 Burst Operation.................................................................................................... 165
6.5.11 Refresh Control.................................................................................................... 170
6.5.12 Examples of Use .................................................................................................. 174
6.5.13 Usage Notes ......................................................................................................... 178
6.6 Interval Timer ................................................................................................................... 181
6.6.1 Operation ............................................................................................................. 181
6.7 Interrupt Sources............................................................................................................... 186
6.8 Burst ROM Interface......................................................................................................... 186
6.8.1 Overview.............................................................................................................. 186
6.8.2 Basic Timing........................................................................................................ 186
6.8.3 Wait Control ........................................................................................................ 187
6.9 Idle Cycle .......................................................................................................................... 188
6.9.1 Operation ............................................................................................................. 188
6.9.2 Pin States in Idle Cycle ........................................................................................ 191
6.10 Bus Arbiter........................................................................................................................ 192
6.10.1 Operation ............................................................................................................. 192
6.11 Register and Pin Input Timing .......................................................................................... 195
6.11.1 Register Write Timing ......................................................................................... 195
6.11.2 BREQ Pin Input Timing ...................................................................................... 196
6.4
Section 7 DMA Controller ................................................................................197
7.1
Overview........................................................................................................................... 197
7.1.1 Features................................................................................................................ 197
7.1.2 Block Diagram ..................................................................................................... 198
7.1.3 Functional Overview............................................................................................ 199
Rev. 2.0, 06/04, page xiv of xxiv
7.2
7.3
7.4
7.5
7.6
7.1.4 Input/Output Pins................................................................................................. 200
7.1.5 Register Configuration......................................................................................... 200
Register Descriptions (1) (Short Address Mode) .............................................................. 202
7.2.1 Memory Address Registers (MAR) ..................................................................... 202
7.2.2 I/O Address Registers (IOAR) ............................................................................. 203
7.2.3 Execute Transfer Count Registers (ETCR).......................................................... 203
7.2.4 Data Transfer Control Registers (DTCR) ............................................................ 205
Register Descriptions (2) (Full Address Mode) ................................................................ 208
7.3.1 Memory Address Registers (MAR) ..................................................................... 208
7.3.2 I/O Address Registers (IOAR) ............................................................................. 208
7.3.3 Execute Transfer Count Registers (ETCR).......................................................... 209
7.3.4 Data Transfer Control Registers (DTCR) ............................................................ 211
Operation .......................................................................................................................... 217
7.4.1 Overview.............................................................................................................. 217
7.4.2 I/O Mode.............................................................................................................. 219
7.4.3 Idle Mode............................................................................................................. 221
7.4.4 Repeat Mode ........................................................................................................ 224
7.4.5 Normal Mode....................................................................................................... 227
7.4.6 Block Transfer Mode ........................................................................................... 230
7.4.7 DMAC Activation................................................................................................ 235
7.4.8 DMAC Bus Cycle ................................................................................................ 237
7.4.9 Multiple-Channel Operation ................................................................................ 243
7.4.10 External Bus Requests, DRAM Interface, and DMAC........................................ 244
7.4.11 NMI Interrupts and DMAC ................................................................................. 245
7.4.12 Aborting a DMAC Transfer................................................................................. 246
7.4.13 Exiting Full Address Mode.................................................................................. 247
7.4.14 DMAC States in Reset State, Standby Modes, and Sleep Mode.......................... 248
Interrupts........................................................................................................................... 249
Usage Notes ...................................................................................................................... 250
7.6.1 Note on Word Data Transfer................................................................................ 250
7.6.2 DMAC Self-Access.............................................................................................. 250
7.6.3 Longword Access to Memory Address Registers ................................................ 250
7.6.4 Note on Full Address Mode Setup....................................................................... 250
7.6.5 Note on Activating DMAC by Internal Interrupts ............................................... 251
7.6.6 NMI Interrupts and Block Transfer Mode ........................................................... 252
7.6.7 Memory and I/O Address Register Values .......................................................... 252
7.6.8 Bus Cycle when Transfer is Aborted ................................................................... 253
7.6.9 Transfer Requests by A/D Converter................................................................... 253
Section 8 I/O Ports .............................................................................................255
8.1
8.2
Overview........................................................................................................................... 255
Port 1................................................................................................................................. 258
8.2.1 Overview.............................................................................................................. 258
Rev. 2.0, 06/04, page xv of xxiv
8.2.2 Register Descriptions ........................................................................................... 259
Port 2................................................................................................................................. 261
8.3.1 Overview.............................................................................................................. 261
8.3.2 Register Descriptions ........................................................................................... 262
8.4 Port 3................................................................................................................................. 265
8.4.1 Overview.............................................................................................................. 265
8.4.2 Register Descriptions ........................................................................................... 265
8.5 Port 4................................................................................................................................. 267
8.5.1 Overview.............................................................................................................. 267
8.5.2 Register Descriptions ........................................................................................... 268
8.6 Port 5................................................................................................................................. 271
8.6.1 Overview.............................................................................................................. 271
8.6.2 Register Descriptions ........................................................................................... 271
8.7 Port 6................................................................................................................................. 275
8.7.1 Overview.............................................................................................................. 275
8.7.2 Register Descriptions ........................................................................................... 276
8.8 Port 7................................................................................................................................. 279
8.8.1 Overview.............................................................................................................. 279
8.8.2 Register Description............................................................................................. 280
8.9 Port 8................................................................................................................................. 281
8.9.1 Overview.............................................................................................................. 281
8.9.2 Register Descriptions ........................................................................................... 283
8.10 Port 9................................................................................................................................. 287
8.10.1 Overview.............................................................................................................. 287
8.10.2 Register Descriptions ........................................................................................... 288
8.11 Port A................................................................................................................................ 292
8.11.1 Overview.............................................................................................................. 292
8.11.2 Register Descriptions ........................................................................................... 294
8.12 Port B ................................................................................................................................ 303
8.12.1 Overview.............................................................................................................. 303
8.12.2 Register Descriptions ........................................................................................... 305
8.3
Section 9 16-Bit Timer ......................................................................................313
9.1
9.2
Overview........................................................................................................................... 313
9.1.1 Features................................................................................................................ 313
9.1.2 Block Diagrams ................................................................................................... 315
9.1.3 Pin Configuration................................................................................................. 318
9.1.4 Register Configuration......................................................................................... 319
Register Descriptions ........................................................................................................ 320
9.2.1 Timer Start Register (TSTR)................................................................................ 320
9.2.2 Timer Synchro Register (TSNC) ......................................................................... 321
9.2.3 Timer Mode Register (TMDR) ............................................................................ 322
9.2.4 Timer Interrupt Status Register A (TISRA)......................................................... 325
Rev. 2.0, 06/04, page xvi of xxiv
9.3
9.4
9.5
9.6
9.2.5 Timer Interrupt Status Register B (TISRB) ......................................................... 328
9.2.6 Timer Interrupt Status Register C (TISRC) ......................................................... 331
9.2.7 Timer Counters (16TCNT) .................................................................................. 333
9.2.8 General Registers (GRA, GRB) ........................................................................... 334
9.2.9 Timer Control Registers (16TCR) ....................................................................... 335
9.2.10 Timer I/O Control Register (TIOR) ..................................................................... 337
9.2.11 Timer Output Level Setting Register C (TOLR) ................................................. 339
CPU Interface.................................................................................................................... 341
9.3.1 16-Bit Accessible Registers ................................................................................. 341
9.3.2 8-Bit Accessible Registers ................................................................................... 343
Operation .......................................................................................................................... 344
9.4.1 Overview.............................................................................................................. 344
9.4.2 Basic Functions.................................................................................................... 344
9.4.3 Synchronization ................................................................................................... 352
9.4.4 PWM Mode.......................................................................................................... 354
9.4.5 Phase Counting Mode .......................................................................................... 358
9.4.6 16-Bit Timer Output Timing................................................................................ 360
Interrupts........................................................................................................................... 361
9.5.1 Setting of Status Flags ......................................................................................... 361
9.5.2 Timing of Clearing of Status Flags ...................................................................... 363
9.5.3 Interrupt Sources.................................................................................................. 364
Usage Notes ...................................................................................................................... 365
Section 10 8-Bit Timers .....................................................................................377
10.1 Overview........................................................................................................................... 377
10.1.1 Features................................................................................................................ 377
10.1.2 Block Diagram ..................................................................................................... 379
10.1.3 Pin Configuration................................................................................................. 380
10.1.4 Register Configuration......................................................................................... 381
10.2 Register Descriptions ........................................................................................................ 382
10.2.1 Timer Counters (8TCNT) .................................................................................... 382
10.2.2 Time Constant Registers A (TCORA) ................................................................. 383
10.2.3 Time Constant Registers B (TCORB).................................................................. 384
10.2.4 Timer Control Register (8TCR) ........................................................................... 385
10.2.5 Timer Control/Status Registers (8TCSR) ............................................................ 388
10.3 CPU Interface.................................................................................................................... 393
10.3.1 8-Bit Registers ..................................................................................................... 393
10.4 Operation .......................................................................................................................... 395
10.4.1 8TCNT Count Timing.......................................................................................... 395
10.4.2 Compare Match Timing....................................................................................... 396
10.4.3 Input Capture Signal Timing ............................................................................... 397
10.4.4 Timing of Status Flag Setting .............................................................................. 398
10.4.5 Operation with Cascaded Connection.................................................................. 399
Rev. 2.0, 06/04, page xvii of xxiv
10.4.6 Input Capture Setting ........................................................................................... 402
10.5 Interrupt ............................................................................................................................ 403
10.5.1 Interrupt Sources.................................................................................................. 403
10.5.2 A/D Converter Activation.................................................................................... 404
10.6 8-Bit Timer Application Example..................................................................................... 404
10.7 Usage Notes ...................................................................................................................... 405
10.7.1 Contention between 8TCNT Write and Clear...................................................... 405
10.7.2 Contention between 8TCNT Write and Increment .............................................. 406
10.7.3 Contention between TCOR Write and Compare Match ...................................... 407
10.7.4 Contention between TCOR Read and Input Capture ........................................... 408
10.7.5 Contention between Counter Clearing by Input Capture and
Counter Increment ............................................................................................... 409
10.7.6 Contention between TCOR Write and Input Capture .......................................... 410
10.7.7 Contention between 8TCNT Byte Write and Increment in 16-Bit Count Mode
(Cascaded Connection) ........................................................................................ 411
10.7.8 Contention between Compare Matches A and B ................................................. 412
10.7.9 8TCNT Operation and Internal Clock Source Switchover .................................. 412
Section 11 Programmable Timing Pattern Controller (TPC) ............................415
11.1 Overview........................................................................................................................... 415
11.1.1 Features................................................................................................................ 415
11.1.2 Block Diagram ..................................................................................................... 416
11.1.3 TPC Pins .............................................................................................................. 417
11.1.4 Registers............................................................................................................... 418
11.2 Register Descriptions ........................................................................................................ 419
11.2.1 Port A Data Direction Register (PADDR) ........................................................... 419
11.2.2 Port A Data Register (PADR) .............................................................................. 419
11.2.3 Port B Data Direction Register (PBDDR)............................................................ 420
11.2.4 Port B Data Register (PBDR) .............................................................................. 420
11.2.5 Next Data Register A (NDRA) ............................................................................ 421
11.2.6 Next Data Register B (NDRB)............................................................................. 423
11.2.7 Next Data Enable Register A (NDERA).............................................................. 425
11.2.8 Next Data Enable Register B (NDERB) .............................................................. 426
11.2.9 TPC Output Control Register (TPCR) ................................................................. 427
11.2.10 TPC Output Mode Register (TPMR) ................................................................... 430
11.3 Operation .......................................................................................................................... 432
11.3.1 Overview.............................................................................................................. 432
11.3.2 Output Timing...................................................................................................... 433
11.3.3 Normal TPC Output............................................................................................. 434
11.3.4 Non-Overlapping TPC Output............................................................................. 436
11.3.5 TPC Output Triggering by Input Capture ............................................................ 438
11.4 Usage Notes ...................................................................................................................... 439
11.4.1 Operation of TPC Output Pins ............................................................................. 439
Rev. 2.0, 06/04, page xviii of xxiv
11.4.2 Note on Non-Overlapping Output ....................................................................... 439
Section 12 Watchdog Timer ..............................................................................441
12.1 Overview........................................................................................................................... 441
12.1.1 Features................................................................................................................ 441
12.1.2 Block Diagram ..................................................................................................... 442
12.1.3 Register Configuration......................................................................................... 442
12.2 Register Descriptions ........................................................................................................ 443
12.2.1 Timer Counter (TCNT)........................................................................................ 443
12.2.2 Timer Control/Status Register (TCSR) ................................................................ 444
12.2.3 Reset Control/Status Register (RSTCSR) ............................................................ 446
12.2.4 Notes on Register Access..................................................................................... 447
12.3 Operation .......................................................................................................................... 449
12.3.1 Watchdog Timer Operation ................................................................................. 449
12.3.2 Interval Timer Operation ..................................................................................... 450
12.3.3 Timing of Setting of Overflow Flag (OVF)......................................................... 451
12.3.4 Timing of Setting of Watchdog Timer Reset Bit (WRST) .................................. 452
12.4 Interrupts........................................................................................................................... 453
12.5 Usage Notes ...................................................................................................................... 453
Section 13 Serial Communication Interface ......................................................455
13.1 Overview........................................................................................................................... 455
13.1.1 Features................................................................................................................ 455
13.1.2 Block Diagram ..................................................................................................... 457
13.1.3 Input/Output Pins................................................................................................. 458
13.1.4 Register Configuration......................................................................................... 459
13.2 Register Descriptions ........................................................................................................ 460
13.2.1 Receive Shift Register (RSR)............................................................................... 460
13.2.2 Receive Data Register (RDR) .............................................................................. 460
13.2.3 Transmit Shift Register (TSR) ............................................................................. 461
13.2.4 Transmit Data Register (TDR)............................................................................. 461
13.2.5 Serial Mode Register (SMR)................................................................................ 462
13.2.6 Serial Control Register (SCR).............................................................................. 466
13.2.7 Serial Status Register (SSR)................................................................................. 471
13.2.8 Bit Rate Register (BRR)....................................................................................... 476
13.3 Operation .......................................................................................................................... 483
13.3.1 Overview.............................................................................................................. 483
13.3.2 Operation in Asynchronous Mode ....................................................................... 485
13.3.3 Multiprocessor Communication........................................................................... 495
13.3.4 Synchronous Operation........................................................................................ 501
13.4 SCI Interrupts.................................................................................................................... 510
13.5 Usage Notes ...................................................................................................................... 510
13.5.1 Notes on Use of SCI ............................................................................................ 510
Rev. 2.0, 06/04, page xix of xxiv
Section 14 Smart Card Interface........................................................................517
14.1 Overview........................................................................................................................... 517
14.1.1 Features................................................................................................................ 517
14.1.2 Block Diagram ..................................................................................................... 518
14.1.3 Pin Configuration................................................................................................. 518
14.1.4 Register Configuration......................................................................................... 519
14.2 Register Descriptions ........................................................................................................ 520
14.2.1 Smart Card Mode Register (SCMR) .................................................................... 520
14.2.2 Serial Status Register (SSR)................................................................................. 521
14.2.3 Serial Mode Register (SMR)................................................................................ 523
14.2.4 Serial Control Register (SCR).............................................................................. 524
14.3 Operation .......................................................................................................................... 524
14.3.1 Overview.............................................................................................................. 524
14.3.2 Pin Connections ................................................................................................... 525
14.3.3 Data Format ......................................................................................................... 526
14.3.4 Register Settings .................................................................................................. 527
14.3.5 Clock.................................................................................................................... 529
14.3.6 Transmitting and Receiving Data ........................................................................ 531
14.4 Usage Notes ...................................................................................................................... 539
Section 15 A/D Converter .................................................................................543
15.1 Overview........................................................................................................................... 543
15.1.1 Features................................................................................................................ 543
15.1.2 Block Diagram ..................................................................................................... 544
15.1.3 Input Pins ............................................................................................................. 545
15.1.4 Register Configuration......................................................................................... 546
15.2 Register Descriptions ........................................................................................................ 547
15.2.1 A/D Data Registers A to D (ADDRA to ADDRD).............................................. 547
15.2.2 A/D Control/Status Register (ADCSR)................................................................ 548
15.2.3 A/D Control Register (ADCR)............................................................................. 551
15.3 CPU Interface.................................................................................................................... 552
15.4 Operation .......................................................................................................................... 553
15.4.1 Single Mode (SCAN = 0) .................................................................................... 553
15.4.2 Scan Mode (SCAN = 1)....................................................................................... 555
15.4.3 Input Sampling and A/D Conversion Time ......................................................... 557
15.4.4 External Trigger Input Timing............................................................................. 558
15.5 Interrupts........................................................................................................................... 559
15.6 Usage Notes ...................................................................................................................... 559
Section 16 D/A Converter .................................................................................565
16.1 Overview........................................................................................................................... 565
16.1.1 Features................................................................................................................ 565
16.1.2 Block Diagram ..................................................................................................... 565
Rev. 2.0, 06/04, page xx of xxiv
16.1.3 Input/Output Pins................................................................................................. 566
16.1.4 Register Configuration......................................................................................... 566
16.2 Register Descriptions ........................................................................................................ 567
16.2.1 D/A Data Registers 0 and 1 (DADR0/1).............................................................. 567
16.2.2 D/A Control Register (DACR)............................................................................. 567
16.2.3 D/A Standby Control Register (DASTCR).......................................................... 569
16.3 Operation .......................................................................................................................... 570
16.4 D/A Output Control .......................................................................................................... 571
Section 17 RAM ................................................................................................573
17.1 Overview........................................................................................................................... 573
17.1.1 Block Diagram ..................................................................................................... 573
17.1.2 Register Configuration......................................................................................... 574
17.2 System Control Register (SYSCR) ................................................................................... 574
17.3 Operation .......................................................................................................................... 575
Section 18 ROM ................................................................................................577
18.1 Features ............................................................................................................................. 577
18.2 Overview........................................................................................................................... 579
18.2.1 Block Diagram ..................................................................................................... 579
18.2.2 Operating Mode ................................................................................................... 580
18.2.3 Mode Comparison................................................................................................ 581
18.2.4 Flash MAT Configuration.................................................................................... 583
18.2.5 Block Division ..................................................................................................... 583
18.2.6 Programming/Erasing Interface ........................................................................... 584
18.3 Pin Configuration.............................................................................................................. 587
18.4 Register Configuration...................................................................................................... 588
18.4.1 Registers............................................................................................................... 588
18.4.2 Programming/Erasing Interface Register............................................................. 591
18.4.3 Programming/Erasing Interface Parameter .......................................................... 597
18.4.4 RAM Control Register (RAMCR) ....................................................................... 608
18.4.5 Flash Vector Address Control Register (FVACR)............................................... 609
18.4.6 Flash Vector Address Data Register (FVADR) ................................................... 611
18.5 On-Board Programming Mode ......................................................................................... 612
18.5.1 Boot Mode ........................................................................................................... 612
18.5.2 User Program Mode............................................................................................. 615
18.5.3 User Boot Mode................................................................................................... 626
18.6 Protection .......................................................................................................................... 630
18.6.1 Hardware Protection ............................................................................................ 630
18.6.2 Software Protection.............................................................................................. 631
18.6.3 Error Protection.................................................................................................... 632
18.7 Flash Memory Emulation in RAM ................................................................................... 634
18.8 Switching between User MAT and User Boot MAT ........................................................ 637
Rev. 2.0, 06/04, page xxi of xxiv
18.8.1 Usage Notes ......................................................................................................... 638
18.9 PROM Mode..................................................................................................................... 639
18.9.1 Pin Arrangement of the Socket Adapter .............................................................. 639
18.9.2 PROM Mode Operation ....................................................................................... 641
18.9.3 Memory-Read Mode............................................................................................ 642
18.9.4 Auto-Program Mode ............................................................................................ 643
18.9.5 Auto-Erase Mode................................................................................................. 643
18.9.6 Status-Read Mode................................................................................................ 644
18.9.7 Status Polling ....................................................................................................... 644
18.9.8 Time Taken in Transition to PROM Mode .......................................................... 645
18.9.9 Notes on Using PROM Mode .............................................................................. 645
18.10 Further Information........................................................................................................... 646
18.10.1 Serial Communication Interface Specification for Boot Mode............................ 646
18.10.2 AC Characteristics and Timing in Writer Mode .................................................. 672
18.10.3 Procedure Program and Storable Area for Programming Data.......................... 678
Section 19 Clock Pulse Generator .....................................................................689
19.1 Overview........................................................................................................................... 689
19.1.1 Block Diagram ..................................................................................................... 689
19.2 Oscillator Circuit............................................................................................................... 690
19.2.1 Connecting a Crystal Resonator........................................................................... 690
19.2.2 External Clock Input............................................................................................ 692
19.3 Duty Adjustment Circuit................................................................................................... 694
19.4 Prescalers .......................................................................................................................... 694
19.5 Frequency Divider ............................................................................................................ 694
19.5.1 Register Configuration......................................................................................... 695
19.5.2 Division Control Register (DIVCR) .................................................................... 695
19.5.3 Usage Notes ......................................................................................................... 696
Section 20 Power-Down State...........................................................................697
20.1 Overview........................................................................................................................... 697
20.2 Register Configuration...................................................................................................... 699
20.2.1 System Control Register (SYSCR) ...................................................................... 699
20.2.2 Module Standby Control Register H (MSTCRH)................................................ 701
20.2.3 Module Standby Control Register L (MSTCRL)................................................. 702
20.3 Sleep Mode ....................................................................................................................... 704
20.3.1 Transition to Sleep Mode..................................................................................... 704
20.3.2 Exit from Sleep Mode.......................................................................................... 704
20.4 Software Standby Mode.................................................................................................... 705
20.4.1 Transition to Software Standby Mode ................................................................. 705
20.4.2 Exit from Software Standby Mode ...................................................................... 705
20.4.3 Selection of Waiting Time for Exit from Software Standby Mode ..................... 706
20.4.4 Sample Application of Software Standby Mode.................................................. 707
Rev. 2.0, 06/04, page xxii of xxiv
20.4.5 Note...................................................................................................................... 707
20.5 Hardware Standby Mode .................................................................................................. 708
20.5.1 Transition to Hardware Standby Mode................................................................ 708
20.5.2 Exit from Hardware Standby Mode..................................................................... 708
20.5.3 Timing for Hardware Standby Mode................................................................... 708
20.5.4 Timing for Hardware Standby Mode at Power-On.............................................. 709
20.6 Module Standby Function................................................................................................. 710
20.6.1 Module Standby Timing ...................................................................................... 710
20.6.2 Read/Write in Module Standby............................................................................ 710
20.6.3 Usage Notes ......................................................................................................... 710
20.7 System Clock Output Disabling Function......................................................................... 711
Section 21 Electrical Characteristics..................................................................713
21.1 Electrical Characteristics of HD64F3029F25 and HD64F3029TE25............................... 713
21.1.1 Absolute Maximum Ratings ................................................................................ 713
21.1.2 DC Characteristics ............................................................................................... 714
21.1.3 AC Characteristics ............................................................................................... 719
21.1.4 A/D Conversion Characteristics........................................................................... 725
21.1.5 D/A Conversion Characteristics........................................................................... 726
21.1.6 Flash Memory Characteristics ............................................................................. 727
21.2 Electrical Characteristics of HD64F3029F25W and HD64F3029TE25W ....................... 728
21.2.1 Absolute Maximum Ratings ................................................................................ 728
21.2.2 DC Characteristics ............................................................................................... 729
21.2.3 AC Characteristics ............................................................................................... 734
21.2.4 A/D Conversion Characteristics........................................................................... 740
21.2.5 D/A Conversion Characteristics........................................................................... 741
21.2.6 Flash Memory Characteristics ............................................................................. 742
21.3 Electrical Characteristics of HD64F3029FBL25 and HD64F3029TEBL25..................... 743
21.3.1 Absolute Maximum Ratings ................................................................................ 743
21.3.2 DC Characteristics ............................................................................................... 744
21.3.3 AC Characteristics ............................................................................................... 749
21.3.4 A/D Conversion Characteristics........................................................................... 755
21.3.5 D/A Conversion Characteristics........................................................................... 756
21.3.6 Flash Memory Characteristics ............................................................................. 757
21.4 Operational Timing ........................................................................................................... 758
21.4.1 Clock Timing ....................................................................................................... 758
21.4.2 Control Signal Timing ......................................................................................... 759
21.4.3 Bus Timing .......................................................................................................... 760
21.4.4 DRAM Interface Bus Timing .............................................................................. 766
21.4.5 TPC and I/O Port Timing..................................................................................... 769
21.4.6 Timer Input/Output Timing ................................................................................. 770
21.4.7 SCI Input/Output Timing..................................................................................... 771
21.4.8 DMAC Timing..................................................................................................... 772
Rev. 2.0, 06/04, page xxiii of xxiv
21.4.9 Input Signal Timing ............................................................................................. 773
Appendix A Instruction Set ...............................................................................775
A.1
A.2
A.3
Instruction List .................................................................................................................. 775
Operation Code Maps ....................................................................................................... 790
Number of States Required for Execution ........................................................................ 793
Appendix B Internal I/O Registers ....................................................................802
B.1
B.2
B.3
Addresses (EMC = 1)........................................................................................................ 802
Addresses (EMC = 0)........................................................................................................ 815
Functions........................................................................................................................... 827
Appendix C I/O Port Block Diagrams...............................................................923
C.1
C.2
C.3
C.4
C.5
C.6
C.7
C.8
C.9
C.10
C.11
Port 1 Block Diagram ....................................................................................................... 923
Port 2 Block Diagram ....................................................................................................... 924
Port 3 Block Diagram ....................................................................................................... 925
Port 4 Block Diagram ....................................................................................................... 926
Port 5 Block Diagram ....................................................................................................... 927
Port 6 Block Diagrams...................................................................................................... 928
Port 7 Block Diagrams...................................................................................................... 935
Port 8 Block Diagrams...................................................................................................... 936
Port 9 Block Diagrams...................................................................................................... 941
Port A Block Diagrams ..................................................................................................... 947
Port B Block Diagrams ..................................................................................................... 950
Appendix D Pin States.......................................................................................958
D.1
D.2
Port States in Each Mode .................................................................................................. 958
Pin States at Reset ............................................................................................................. 965
Appendix E Timing of Transition to and Recovery from
Hardware Standby Mode ...............................................................968
Appendix F Product Code Lineup .....................................................................969
F.1
H8/3029 Product Code Lineup ......................................................................................... 969
Appendix G Package Dimensions .....................................................................970
Appendix H Comparison of H8/300H Series Product Specifications ...............972
H.1
H.2
Differences between H8/3029, H8/3069R, H8/3067 Group and H8/3062 Group,
H8/3048 Group, H8/3007 and H8/3006, and H8/3002..................................................... 972
Comparison of Pin Functions of 100-Pin Package Products (FP-100B, TFP-100B)....... 976
Rev. 2.0, 06/04, page xxiv of xxiv
Section 1 Overview
1.1
Overview
The H8/3029 is a series of microcontrollers (MCUs) that integrate system supporting functions
together with an H8/300H CPU core having an original Renesas Technology architecture.
The H8/3029 is a single-chip microcontroller (MCU) that integrates peripheral functions
necessary for system configuration with an H8/300H CPU featuring a 32-bit internal architecture
as its core. In addition, this LSI has an on-chip debugging function using the on-chip debugging
emulator (E10T).
The H8/300H CPU has a 32-bit internal architecture with sixteen 16-bit general registers, and a
concise, optimized instruction set designed for speed. It can address a 16-Mbyte linear address
space. Its instruction set is upward-compatible at the object-code level with the H8/300 CPU,
enabling easy porting of software from the H8/300 Series.
The on-chip system supporting functions include ROM, RAM, a 16-bit timer, an 8-bit timer, a
programmable timing pattern controller (TPC), a watchdog timer (WDT), a serial communication
interface (SCI), an A/D converter, a D/A converter, I/O ports, a direct memory access controller
(DMAC), and other facilities.
The H8/3029 has 512 kbytes of flash memory and 16 kbytes of RAM.
Six MCU operating modes offer a choice of bus width and address space size. The modes (modes
1 to 5, 7) include one single-chip mode and five expanded modes.
The H8/3029 includes an F-ZTAT™* version with on-chip flash memory that can be
programmed on-board. This version enables users to respond quickly and flexibly to changing
application specifications, growing production volumes, and other conditions.
The E10T emulates a microcontroller and provides functions to support debugging of user
programs under the conditions of this LSI being mounted on the user system.
Table 1.1 summarizes the features of the H8/3029.
Note: * F-ZTAT™ (Flexible ZTAT) is a trademark of Renesas Technology Corp.
Rev. 2.0, 06/04, page 1 of 980
Notes on using the on-chip debugging functions incorporated in the H8/3029
The following must be noted when developing and debugging H8/3029 programs using the onchip debugging function.
1. The on-chip emulator supports only the development and debugging of programs on the onchip flash memory. The on-chip emulator cannot emulate external memory or when the LSI is
in ROM-disabled modes.
2. Since the DRAM interface and DMAC does not operate, do not set the registers for these
modules.
3. In the break mode of on-chip emulation, the watchdog timer (WDT) stops counting.
Therefore, the WDT count will be different from the expected value after leaving break mode.
4. The FWE (BRK), P91, P93, and P95 pins are specifically used by the E10T and cannot be
used by the user.
5. In the 16-Mbyte address mode, address area from H'FF7000 to H'FF7FFF is used by the E10T
and cannot be used by the user.
6. Emulation of hardware standby mode can not be performed.
Rev. 2.0, 06/04, page 2 of 980
Table 1.1
Features
Feature
Description
CPU
Upward-compatible with the H8/300 CPU at the object-code level
General-register machine
•
Sixteen 16-bit general registers
(also usable as sixteen 8-bit registers, eight 16-bit registers, or eight 32-bit
registers)
High-speed operation
•
Maximum clock rate: 25 MHz
•
Add/subtract: 80 ns
•
Multiply/divide: 560 ns
16-Mbyte address space
Instruction features
Memory
•
8/16/32-bit data transfer, arithmetic, and logic instructions
•
Signed and unsigned multiply instructions (8 bits x 8 bits, 16 bits x 16 bits)
•
Signed and unsigned divide instructions (16 bits ÷ 8 bits, 32 bits ÷ 16 bits)
•
Bit accumulator function
•
Bit manipulation instructions with register-indirect specification of bit
positions
H8/3029
•
ROM: 512 kbytes
•
RAM: 16 kbytes
Interrupt
•
Seven external interrupt pins: NMI, IRQ0 to IRQ5
controller
•
36 internal interrupts
•
Three selectable interrupt priority levels
•
Address space can be partitioned into eight areas, with independent bus
specifications in each area
•
Chip select output available for areas 0 to 7
•
8-bit access or 16-bit access selectable for each area
•
Two-state or three-state access selectable for each area
•
Selection of two wait modes
•
Number of program wait states selectable for each area
•
Direct connection of burst ROM
•
Direct connection of up to 8-Mbyte DRAM (or DRAM interface can be used
as interval timer)
•
Bus arbitration function
Bus controller
Rev. 2.0, 06/04, page 3 of 980
Feature
Description
DMA controller
(DMAC)
Short address mode
•
Maximum four channels available
•
Selection of I/O mode, idle mode, or repeat mode
•
Can be activated by compare match/input capture A interrupts from 16-bit
timer channels 0 to 2, conversion-end interrupts from the A/D converter,
transmit-data-empty and receive-data-full interrupts from the SCI, or external
requests
Full address mode
•
Maximum two channels available
•
Selection of normal mode or block transfer mode
•
Can be activated by compare match/input capture A interrupts from 16-bit
timer channels 0 to 2, conversion-end interrupts from the A/D converter,
external requests, or auto-request
•
Three 16-bit timer channels, capable of processing up to six pulse outputs
or six pulse inputs
•
16-bit timer counter (channels 0 to 2)
•
Two multiplexed output compare/input capture pins (channels 0 to 2)
•
Operation can be synchronized (channels 0 to 2)
•
PWM mode available (channels 0 to 2)
•
Phase counting mode available (channel 2)
•
DMAC can be activated by compare match/input capture A interrupts
(channels 0 to 2)
•
8-bit up-counter (external event count capability)
•
Two time constant registers
•
Two channels can be connected
•
Maximum 16-bit pulse output, using 16-bit timer as time base
•
Up to four 4-bit pulse output groups (or one 16-bit group, or two 8-bit
groups)
•
Non-overlap mode available
•
Output data can be transferred by DMAC
Watchdog
timer (WDT),
1 channel
•
Reset signal can be generated by overflow
•
Usable as an interval timer
Serial
communication
interface (SCI),
3 channels
•
Selection of asynchronous or synchronous mode
•
Full duplex: can transmit and receive simultaneously
•
On-chip baud-rate generator
•
Smart card interface functions added
16-bit timer,
3 channels
8-bit timer,
4 channels
Programmable
timing pattern
controller (TPC)
Rev. 2.0, 06/04, page 4 of 980
Feature
Description
A/D converter
•
Resolution: 10 bits
•
Eight channels, with selection of single or scan mode
D/A converter
I/O ports
•
Variable analog conversion voltage range
•
Sample-and-hold function
•
A/D conversion can be started by an external trigger or 8-bit timer comparematch
•
DMAC can be activated by an A/D conversion end interrupt
•
Resolution: 8 bits
•
Two channels
•
D/A outputs can be sustained in software standby mode
•
70 input/output pins
•
9 input-only pins
Operating modes •
Power-down
state
Other features
Six MCU operating modes
Mode
Address Space
Address Pins
Initial Bus Width
Max. Bus Width
Mode 1
1 Mbyte
A19 to A0
8 bits
16 bits
Mode 2
1 Mbyte
A19 to A0
16 bits
16 bits
Mode 3
16 Mbytes
A23 to A0
8 bits
16 bits
Mode 4
16 Mbytes
A23 to A0
16 bits
16 bits
Mode 5
16 Mbytes
A23 to A0
8 bits
16 bits
Mode 7
1 Mbyte
—
—
—
•
On-chip ROM is disabled in modes 1 to 4
•
Sleep mode
•
Software standby mode
•
Hardware standby mode
•
Module standby function
•
Programmable system clock frequency division
•
On-chip clock pulse generator
Rev. 2.0, 06/04, page 5 of 980
Feature
Description
Product
lineup
Product
Type
Product Code
(Catalog Product
Code)
Regular product
code
(Internal Product
Code)
H8/3029
HD64F3029F25
HD64F3029F25
HD64F3029F25W
HD64F3029F25W
Wide-range
specifications with
on-chip flash memory
HD64F3029FBL25
HD64F3029FBL25
Standard
characteristic
specifications with
on-chip flash memory
HD64F3029TE25
HD64F3029X25
HD64F3029TE25W
HD64F3029X25W
Wide-range
specifications with
on-chip flash memory
HD64F3029TEBL25
HD64F3029XBL25
Standard
characteristic
specifications with
on-chip flash memory
Rev. 2.0, 06/04, page 6 of 980
Package
(Renesas
Package Code) Classification
100-pin QFP
(FP-100B)
100-pin TQFP
(TFP-100B)
Regular
specifications with
on-chip flash memory
Regular
specifications with
on-chip flash memory
1.2
Block Diagram
Port 3
P40 /D0
P41 /D1
P42 /D2
P43 /D3
P44 /D4
P45 /D5
P46 /D6
P47 /D7
P30 /D8
P31 /D9
P32 /D10
P33 /D11
P34 /D12
P35 /D13
P36 /D14
P37 /D15
VCL
VSS
VSS
VSS
VSS
VSS
VSS
VCC
VCC
Figure 1.1 shows an internal block diagram.
Port 4
Address bus
Data bus (upper)
MD1
Data bus (lower)
P53 /A 19
Port 5
MD2
MD0
P52 /A 18
P51 /A 17
P50 /A 16
EXTAL
P27 /A 15
Clock pulse
generator
RES
FWE
P26 /A 14
H8/300H CPU
P25 /A 13
Port 2
XTAL
STBY
NMI
LWR/P66
DMA controller
(DMAC)
RD/P64
AS/P63
Port 6
HWR/P65
P23 /A 11
P22 /A 10
Bus controller
Interrupt controller
φ/P67
P24 /A 12
P21 /A 9
P20 /A 8
P17 /A 7
ROM
(flash memory)
P16 /A 6
P15 /A 5
Port 1
BACK/P62
BREQ/P61
WAIT/P60
P14 /A 4
P13 /A 3
P12 /A 2
RAM
P11 /A 1
CS0/P84
P10 /A 0
16-bit timer unit
RFSH/IRQ0/P80
Serial communication
interface
(SCI) × 3 channels
8-bit timer unit
P95 /SCK 1 /IRQ 5
Programmable
timing pattern
controller (TPC)
P94 /SCK 0 /IRQ 4
Port 9
A/D converter
D/A converter
P93 /RxD1
P92 /RxD0
P91 /TxD 1
P90 /TxD 0
AN0/P70
AN1/P71
AN2/P72
AN3/P73
AN4/P74
AN5/P75
DA0/AN6/P76
DA1/AN7/P77
AVSS
AVCC
VREF
TEND0/TCLKA/TP0/PA0
TEND1/TCLKB/TP1/PA1
Port 7
TCLKC/TIOCA0/TP2/PA2
A23/TIOCA1/TP4/PA4
TCLKD/TIOCB0/TP3/PA3
A22/TIOCB1/TP5/PA5
A21/TIOCA2/TP6/PA6
CS6/DREQ0/TMIO1/TP9/PB1
Port A
CS5/TMO2/TP10/PB2
CS4/DREQ1/TMIO3/TP11/PB3
UCAS/TP12/PB4
SCK2/LCAS/TP13/PB5
TxD2/TP14/PB6
RxD2/TP15/PB7
Port B
A20/TIOCB2/TP7/PA7
CS3/IRQ1/P81
CS7/TMO0/TP8/PB0
CS2/IRQ2/P82
Port 8
ADTRG/CS1/IRQ3/P83
Watchdog timer
(WDT)
Figure 1.1 Block Diagram
Rev. 2.0, 06/04, page 7 of 980
1.3
Pin Description
1.3.1
Pin Arrangement
P52 /A 18
P51 /A 17
P50 /A 16
P27 /A 15
P26 /A 14
54
53
52
51
STBY
62
P53 /A 19
RES
63
55
NMI
64
VSS
VSS
65
56
EXTAL
66
P60 /WAIT
XTAL
67
57
VCC
68
P61 /BREQ
P63 /AS
69
58
P64 /RD
70
59
P65 /HWR
71
P67/φ
P66 /LWR
72
P62 /BACK
MD0
73
60
MD1
74
61
MD2
75
The pin arrangement of the H8/3029 FP-100B and TFP-100B packages is shown in figure 1.2.
AVCC
76
50
P25/A13
VREF
77
49
P24/A12
AN0/P70
78
48
P23/A11
AN1/P71
79
47
P22/A10
AN2/P72
80
46
P21/A9
AN3/P73
81
45
P20/A8
AN4/P74
82
44
VSS
AN5/P75
83
43
P17/A7
AN6/DA0/P76
84
42
P16/A6
AN7/DA1/P77
85
41
P15/A5
AVSS
86
40
P14/A4
IRQ0/RFSH/P80
87
39
P13/A3
IRQ1/CS3/P81
88
38
P12/A2
IRQ2/CS2/P82
89
37
P11/A1
IRQ3/CS1/ADTRG/P83
90
36
P10/A0
CS0/P84
91
35
VCC
VSS
92
34
P37/D15
TP0/TCLKA/TEND0/PA0
93
33
P36/D14
TP1/TCLKB/TEND1/PA1
94
32
P35/D13
TP2/TIOCA0/TCLKC/PA2
95
31
P34/D12
TP3/TIOCB0/TCLKD/PA3
96
30
P33/D11
TP4/TIOCA1/A23/PA4
97
29
P32/D10
TP5/TIOCB1/A22/PA5
98
28
P31/D9
TP6/TIOCA2/A21/PA6
99
27
P30/D8
TP7/TIOCB2/A20/PA7
100
26
P47/D7
Top view
14
15
16
17
18
19
20
21
22
23
24
25
RxD1 /P93
IRQ4 /SCK0 /P94
IRQ5 /SCK1 /P95
D0 /P40
D1 /P41
D2 /P42
D3 /P43
VSS
D4 /P44
D5 /P45
D6 /P46
9
RxD2/TP15/PB7
RxD0 /P92
8
TxD2/TP14/PB6
13
7
SCK2/LCAS/TP13/PB5
TxD1 /P91
6
UCAS/TP12/PB4
12
5
CS4/DREQ1/TMIO3/TP11/PB3
TxD0 /P90
4
CS5/TMO2/TP10/PB2
11
3
CS6/DREQ0/TMIO1/TP9/PB1
10
2
FWE
VSS
1
VCL*
CS7/TMO0/TP8/PB0
(FP-100B, TFP-100B)
Note: * When functioning as VCL pin, the connection of an external capacitor is required.
Figure 1.2 Pin Arrangement (FP-100B or TFP-100B, Top View)
Rev. 2.0, 06/04, page 8 of 980
1
0.1 µF
1.3.2
Pin Functions
Table 1.2 summarizes the pin functions.
Table 1.2
Pin Functions
Pin No.
Type
Symbol
FP-100B
TFP-100B I/O
Power
VCC
35, 68
Input
Power: For connection to the power supply. Connect
all VCC pins to the system power supply.
VSS
11, 22, 44, Input
57, 65, 92
Ground: For connection to ground (0 V).
Connect all VSS pins to the 0-V system power supply.
VCL
1
Internal
step-down
pin
Name and Function
Output Connect an external capacitor between this pin and
GND (0 V). Do not connect to VCC.
VCL
Clock
0.1 µF
XTAL
67
Input
For connection to a crystal resonator.
For examples of crystal resonator and external clock
input, see section 19, Clock Pulse Generator.
EXTAL
66
Input
For connection to a crystal resonator or input of an
external clock signal. For examples of crystal
resonator and external clock input, see section 19,
Clock Pulse Generator.
φ
61
Output System clock: Supplies the system clock to external
devices.
Rev. 2.0, 06/04, page 9 of 980
Pin No.
Type
Symbol
Operating
mode
control
MD2 to
MD0
System
control
Interrupts
Address
bus
FP-100B
TFP-100B I/O
75 to 73
Input
Name and Function
Mode 2 to mode 0: For setting the operating mode,
as follows. The H8/3029 can be used only in modes
1 to 5, 7. The inputs at the mode pins must select
one of these six modes. Inputs at these pins must
not be changed during operation.
MD2
MD1
MD0
Operating Mode
0
0
0
—
0
0
1
Mode 1
0
1
0
Mode 2
0
1
1
Mode 3
1
0
0
Mode 4
1
0
1
Mode 5
1
1
0
—
1
1
1
Mode 7
RES
63
Input
Reset input: When driven low, this pin resets the
chip
FWE
10
Input
Write enable signal: Flash memory write control
signal
STBY
62
Input
Standby: When driven low, this pin forces a
transition to hardware standby mode
BREQ
59
Input
Bus request: Used by an external bus master to
request the bus right
BACK
60
Output Bus request acknowledge: Indicates that the bus
has been granted to an external bus master
NMI
64
Input
Nonmaskable interrupt: Requests a
nonmaskable interrupt
IRQ5 to
IRQ0
17, 16,
90 to 87
Input
Interrupt request 5 to 0: Maskable interrupt request
pins
A23 to A0
97 to 100,
56 to 45,
43 to 36
Output Address bus: Outputs address signals
Rev. 2.0, 06/04, page 10 of 980
Pin No.
Type
Symbol
Data bus
D15 to D0
DMA
controller
(DMAC)
Name and Function
34 to 23,
21 to 18
Input/
output
2 to 5,
88 to 91
Output Chip select: Select signals for areas 7 to 0
AS
69
Output Address strobe: Goes low to indicate valid address
output on the address bus
RD
70
Output Read: Goes low to indicate reading from the external
address space
HWR
71
Output High write: Goes low to indicate writing to the
external address space; indicates valid data on the
upper data bus (D15 to D8).
LWR
72
Output Low write: Goes low to indicate writing to the
external address space; indicates valid data on the
lower data bus (D7 to D0).
WAIT
58
Input
RFSH
87
Output Refresh: Indicates a refresh cycle
CS2 to
CS5
89, 88,
5, 4
Output Row address strobe RAS:
RAS Row address strobe
signal for DRAM
RD
70
Output Write enable WE:
WE Write enable signal for DRAM
HWR
UCAS
71
6
Output Upper column address strobe UCAS:
UCAS Column
address strobe signal for DRAM
LWR
LCAS
72
7
Output Lower column address strobe LCAS:
LCAS Column
address strobe signal for DRAM
DREQ1,
DREQ0
5, 3
Input
TEND1,
TEND0
94, 93
Output Transfer end 1 and 0: These signals indicate that
the DMAC has ended a data transfer
Bus control CS7 to
CS0
DRAM
interface
FP-100B
TFP-100B I/O
Data bus: Bidirectional data bus
Wait: Requests insertion of wait states in bus cycles
during access to the external address space
DMA request 1 and 0: DMAC activation
requests
Rev. 2.0, 06/04, page 11 of 980
Pin No.
Type
Symbol
FP-100B
TFP-100B I/O
16-bit timer TCLKD to 96 to 93
TCLKA
8-bit timer
Name and Function
Input
Clock input D to A: External clock inputs
TIOCA2 to 99, 97, 95
TIOCA0
Input/
output
Input capture/output compare A2 to A0: GRA2 to
GRA0 output compare or input capture, or PWM
output
TIOCB2 to 100, 98,
96
TIOCB0
Input/
output
Input capture/output compare B2 to B0: GRB2 to
GRB0 output compare or input capture, or PWM
output
TMO0,
TMO2
2, 4
Output Compare match output: Compare match output
pins
TMIO1,
TMIO3
3, 5
Input/
output
Input capture input/compare match output: Input
capture input or compare match output pins
Input
Counter external clock input: These pins input an
external clock to the counters.
TCLKD to 96 to 93
TCLKA
Programmable
timing
pattern
controller
(TPC)
TP15 to
TP0
9 to 2,
100 to 93
Output TPC output 15 to 0: Pulse output
Serial communication
interface
(SCI)
TxD2 to
TxD0
8, 13, 12
Output Transmit data (channels 0, 1, 2): SCI data output
RxD2 to
RxD0
9, 15, 14
Input
Receive data (channels 0, 1, 2): SCI data input
SCK2 to
SCK0
7, 17, 16
Input/
output
Serial clock (channels 0, 1, 2): SCI clock
input/output
AN7 to
AN0
85 to 78
Input
Analog 7 to 0: Analog input pins
ADTRG
90
Input
A/D conversion external trigger input: External
trigger input for starting A/D conversion
DA1, DA0
85, 84
Output Analog output: Analog output from the
D/A converter
A/D
converter
D/A
converter
Rev. 2.0, 06/04, page 12 of 980
Pin No.
Type
Symbol
FP-100B
TFP-100B I/O
A/D and
D/A
converters
AVCC
76
Input
Power supply pin for the A/D and D/A converters.
Connect to the system power supply when not using
the A/D and D/A converters.
AVSS
86
Input
Ground pin for the A/D and D/A converters. Connect
to system ground (0 V).
VREF
77
Input
Reference voltage input pin for the A/D and D/A
converters. Connect to the system power supply
when not using the A/D and D/A converters.
P17 to P10 43 to 36
Input/
output
Port 1: Eight input/output pins. The direction of each
pin can be selected in the port 1 data direction
register (P1DDR).
P27 to P20 52 to 45
Input/
output
Port 2: Eight input/output pins. The direction of each
pin can be selected in the port 2 data direction
register (P2DDR).
P37 to P30 34 to 27
Input/
output
Port 3: Eight input/output pins. The direction of each
pin can be selected in the port 3 data direction
register (P3DDR).
P47 to P40 26 to 23,
21 to 18
Input/
output
Port 4: Eight input/output pins. The direction of each
pin can be selected in the port 4 data direction
register (P4DDR).
P53 to P50 56 to 53
Input/
output
Port 5: Four input/output pins. The direction of each
pin can be selected in the port 5 data direction
register (P5DDR).
P67 to P60 61,
72 to 69,
60 to 58
Input/
output
Port 6: Seven input/output pins and one input pin.
The direction of each pin can be selected in the port
6 data direction register (P6DDR).
P77 to P70 85 to 78
Input
Port 7: Eight input pins
P84 to P80 91 to 87
Input/
output
Port 8: Five input/output pins. The direction of each
pin can be selected in the port 8 data direction
register (P8DDR).
P95 to P90 17 to 12
Input/
output
Port 9: Six input/output pins. The direction of each
pin can be selected in the port 9 data direction
register (P9DDR).
PA7 to PA0 100 to 93
Input/
output
Port A: Eight input/output pins. The direction of each
pin can be selected in the port A data direction
register (PADDR).
PB7 to PB0 9 to 2
Input/
output
Port B: Eight input/output pins. The direction of each
pin can be selected in the port B data direction
register (PBDDR).
I/O ports
Name and Function
Rev. 2.0, 06/04, page 13 of 980
1.3.3
Pin Assignments in Each Mode
Table 1.3 lists the pin assignments in each mode.
Table 1.3
Pin Assignments in Each Mode (FP-100B or TFP-100B)
Pin No.
Pin Name
FP-100B
TFP-100B
Mode 1
Mode 2
Mode 3
Mode 4
Mode 5
Mode 7
1
VCL
VCL
VCL
VCL
VCL
VCL
2
PB0/TP8/
TMO0/CS7
PB0/TP8/
TMO0/CS7
PB0/TP8/
TMO0/CS7
PB0/TP8/
TMO0/CS7
PB0/TP8/
TMO0/CS7
PB0/TP8/
TMO0
3
PB1/TP9/
TMIO1/
DREQ0/
CS6
PB1/TP9/
TMIO1/
DREQ0/
CS6
PB1/TP9/
TMIO1/
DREQ0/
CS6
PB1/TP9/
TMIO1/
DREQ0/
CS6
PB1/TP9/
TMIO1/
DREQ0/
CS6
PB1/TP9/
TMIO1/
DREQ0
4
PB2/TP10/
TMO2/CS5
PB2/TP10/
TMO2/CS5
PB2/TP10/
TMO2/CS5
PB2/TP10/
TMO2/CS5
PB2/TP10/
TMO2/CS5
PB2/TP10/
TMO2
5
PB3/TP11/
TMIO3/
DREQ1/
CS4
PB3/TP11/
TMIO3/
DREQ1/
CS4
PB3/TP11/
TMIO3/
DREQ1/
CS4
PB3/TP11/
TMIO3/
DREQ1/
CS4
PB3/TP11/
TMIO3/
DREQ1/
CS4
PB3/TP11/
TMIO3/
DREQ1
6
PB4/TP12/
UCAS
PB4/TP12/
UCAS
PB4/TP12/
UCAS
PB4/TP12/
UCAS
PB4/TP12/
UCAS
PB4/TP12
7
PB5/TP13/
LCAS/
SCK2
PB5/TP13/
LCAS/
SCK2
PB5/TP13/
LCAS/
SCK2
PB5/TP13/
LCAS/
SCK2
PB5/TP13/
LCAS/
SCK2
PB5/TP13/
SCK2
8
PB6/TP14/
TxD2
PB6/TP14/
TxD2
PB6/TP14/
TxD2
PB6/TP14/
TxD2
PB6/TP14/
TxD2
PB6/TP14/
TxD2
9
PB7/TP15/
RxD2
PB7/TP15/
RxD2
PB7/TP15/
RxD2
PB7/TP15/
RxD2
PB7/TP15/
RxD2
PB7/TP15/
RxD2
10
FWE
FWE
FWE
FWE
FWE
FWE
11
VSS
VSS
VSS
VSS
VSS
VSS
12
P90/TxD0
P90/TxD0
P90/TxD0
P90/TxD0
P90/TxD0
P90/TxD0
13
P91/TxD1
P91/TxD1
P91/TxD1
P91/TxD1
P91/TxD1
P91/TxD1
14
P92/RxD0
P92/RxD0
P92/RxD0
P92/RxD0
P92/RxD0
P92/RxD0
15
P93/RxD1
P93/RxD1
P93/RxD1
P93/RxD1
P93/RxD1
P93/RxD1
16
P94/IRQ4/
SCK0
P94/IRQ4/
SCK0
P94/IRQ4/
SCK0
P94/IRQ4/
SCK0
P94/IRQ4/
SCK0
P94/IRQ4/
SCK0
17
P95/IRQ5/
SCK1
P95/IRQ5/
SCK1
P95/IRQ5/
SCK1
P95/IRQ5/
SCK1
P95/IRQ5/
SCK1
P95/IRQ5/
SCK1
18
P40/D0*1
P40/D0*2
P40/D0*1
P40/D0*2
P40/D0*1
P40
19
P41/D1*
1
2
1
2
1
P41
20
P42/D2*1
P42/D2*1
P42
P41/D1*
P42/D2*2
Rev. 2.0, 06/04, page 14 of 980
P41/D1*
P42/D2*1
P41/D1*
P42/D2*2
P41/D1*
Pin No.
Pin Name
FP-100B
TFP-100B
Mode 1
Mode 2
Mode 3
Mode 4
Mode 5
Mode 7
21
P43/D3*1
P43/D3*2
P43/D3*1
P43/D3*2
P43/D3*1
P43
VSS
22
VSS
VSS
VSS
VSS
VSS
23
P44/D4*1
P44/D4*2
P44/D4*1
P44/D4*2
P44/D4*1
P44
24
P45/D5*
1
2
1
2
1
P45
25
P46/D6*1
P46/D6*2
P46/D6*1
P46/D6*2
P46/D6*1
P46
26
P47/D7*
1
2
1
2
1
27
D8
28
29
P45/D5*
P47/D7*
P45/D5*
P47/D7*
P45/D5*
P47/D7*
D8
D8
D8
D9
D9
D9
D10
D10
D10
30
D11
D11
31
D12
D12
32
D13
33
34
35
36
P45/D5*
P47/D7*
P47
D8
P30
D9
D9
P31
D10
D10
P32
D11
D11
D11
P33
D12
D12
D12
P34
D13
D13
D13
D13
P35
D14
D14
D14
D14
D14
P36
D15
D15
D15
D15
D15
P37
VCC
VCC
VCC
VCC
VCC
VCC
A0
A0
A0
A0
P10/A0
P10
37
A1
A1
A1
A1
P11/A1
P11
38
A2
A2
A2
A2
P12/A2
P12
39
A3
A3
A3
A3
P13/A3
P13
40
A4
A4
A4
A4
P14/A4
P14
41
A5
A5
A5
A5
P15/A5
P15
42
A6
A6
A6
A6
P16/A6
P16
43
A7
A7
A7
A7
P17/A7
P17
44
VSS
VSS
VSS
VSS
VSS
VSS
45
A8
A8
A8
A8
P20/A8
P20
46
A9
A9
A9
A9
P21/A9
P21
47
A10
A10
A10
A10
P22/A10
P22
48
A11
A11
A11
A11
P23/A11
P23
49
A12
A12
A12
A12
P24/A12
P24
50
A13
A13
A13
A13
P25/A13
P25
51
A14
A14
A14
A14
P26/A14
P26
52
A15
A15
A15
A15
P27/A15
P27
53
A16
A16
A16
A16
P50/A16
P50
54
A17
A17
A17
A17
P51/A17
P51
Rev. 2.0, 06/04, page 15 of 980
Pin No.
Pin Name
FP-100B
TFP-100B
Mode 1
Mode 2
Mode 3
Mode 4
Mode 5
Mode 7
55
A18
A18
A18
A18
P52/A18
P52
56
A19
A19
A19
A19
P53/A19
P53
57
VSS
VSS
VSS
VSS
VSS
VSS
58
P60/WAIT
P60/WAIT
P60/WAIT
P60/WAIT
P60/WAIT
P60
59
P61/BREQ
P61/BREQ
P61/BREQ
P61/BREQ
P61/BREQ
P61
60
P62/BACK
P62/BACK
P62/BACK
P62/BACK
P62/BACK
P62
61
P67/φ*3
P67/φ*3
P67/φ*3
P67/φ*3
P67/φ*3
P67/φ*4
62
STBY
STBY
STBY
STBY
STBY
STBY
63
RES
RES
RES
RES
RES
RES
64
NMI
NMI
NMI
NMI
NMI
NMI
65
VSS
VSS
VSS
VSS
VSS
VSS
66
EXTAL
EXTAL
EXTAL
EXTAL
EXTAL
EXTAL
67
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
68
VCC
VCC
VCC
VCC
VCC
VCC
69
AS
AS
AS
AS
AS
P63
70
RD
RD
RD
RD
RD
P64
71
HWR
HWR
HWR
HWR
HWR
P65
72
LWR
LWR
LWR
LWR
LWR
P66
73
MD0
MD0
MD0
MD0
MD0
MD0
74
MD1
MD1
MD1
MD1
MD1
MD1
75
MD2
MD2
MD2
MD2
MD2
MD2
76
AVCC
AVCC
AVCC
AVCC
AVCC
AVCC
77
VREF
VREF
VREF
VREF
VREF
VREF
78
P70/AN0
P70/AN0
P70/AN0
P70/AN0
P70/AN0
P70/AN0
79
P71/AN1
P71/AN1
P71/AN1
P71/AN1
P71/AN1
P71/AN1
80
P72/AN2
P72/AN2
P72/AN2
P72/AN2
P72/AN2
P72/AN2
81
P73/AN3
P73/AN3
P73/AN3
P73/AN3
P73/AN3
P73/AN3
82
P74/AN4
P74/AN4
P74/AN4
P74/AN4
P74/AN4
P74/AN4
83
P75/AN5
P75/AN5
P75/AN5
P75/AN5
P75/AN5
P75/AN5
84
P76/AN6/
DA0
P76/AN6/
DA0
P76/AN6/
DA0
P76/AN6/
DA0
P76/AN6/
DA0
P76/AN6/
DA0
85
P77/AN7/
DA1
P77/AN7/
DA1
P77/AN7/
DA1
P77/AN7/
DA1
P77/AN7/
DA1
P77/AN7/
DA1
86
AVSS
AVSS
AVSS
AVSS
AVSS
AVSS
Rev. 2.0, 06/04, page 16 of 980
Pin No.
FP-100B
TFP-100B
Pin Name
Mode 1
Mode 2
Mode 3
Mode 4
Mode 5
Mode 7
87
P80/IRQ0/
RFSH
P80/IRQ0/
RFSH
P80/IRQ0/
RFSH
P80/IRQ0/
RFSH
P80/IRQ0/
RFSH
P80/IRQ0
88
P81/IRQ1/
CS3
P81/IRQ1/
CS3
P81/IRQ1/
CS3
P81/IRQ1/
CS3
P81/IRQ1/
CS3
P81/IRQ1
89
P82/IRQ2/
CS2
P82/IRQ2/
CS2
P82/IRQ2/
CS2
P82/IRQ2/
CS2
P82/IRQ2/
CS2
P82/IRQ2
90
P83/IRQ3/
CS1/ ADTRG
P83/IRQ3/
CS1/ ADTRG
P83/IRQ3/
CS1/ ADTRG
P83/IRQ3/
CS1/ ADTRG
P83/IRQ3/
CS1/ ADTRG
P83/IRQ3/
ADTRG
91
P84/CS0
P84/CS0
P84/CS0
P84/CS0
P84/CS0
P84
92
VSS
VSS
VSS
VSS
VSS
VSS
93
PA0/TP0/
TCLKA/
TEND0
PA0/TP0/
TCLKA/
TEND0
PA0/TP0/
TCLKA/
TEND0
PA0/TP0/
TCLKA/
TEND0
PA0/TP0/
TCLKA/
TEND0
PA0/TP0/
TCLKA/
TEND0
94
PA1/TP1/
TCLKB/
TEND1
PA1/TP1/
TCLKB/
TEND1
PA1/TP1
/TCLKB/
TEND1
PA1/TP1/
TCLKB/
TEND1
PA1/TP1/
TCLKB/
TEND1
PA1/TP1/
TCLKB/
TEND1
95
PA2/TP2/
TIOCA0/
TCLKC
PA2/TP2/
TIOCA0/
TCLKC
PA2/TP2/
TIOCA0/
TCLKC
PA2/TP2/
TIOCA0/
TCLKC
PA2/TP2/
TIOCA0/
TCLKC
PA2/TP2/
TIOCA0/
TCLKC
96
PA3/TP3/
TIOCB0/
TCLKD
PA3/TP3/
TIOCB0/
TCLKD
PA3/TP3/
TIOCB0/
TCLKD
PA3/TP3/
TIOCB0/
TCLKD
PA3/TP3/
TIOCB0/
TCLKD
PA3/TP3/
TIOCB0/
TCLKD
97
PA4/TP4/
TIOCA1
PA4/TP4/
TIOCA1
PA4/TP4/
TIOCA1/
A23
PA4/TP4/
TIOCA1/
A23
PA4/TP4/
TIOCA1/
A23
PA4/TP4/
TIOCA1
98
PA5/TP5/
TIOCB1
PA5/TP5/
TIOCB1
PA5/TP5/
TIOCB1/
A22
PA5/TP5/
TIOCB1/
A22
PA5/TP5/
TIOCB1/
A22
PA5/TP5/
TIOCB1
99
PA6/TP6/
TIOCA2
PA6/TP6/
TIOCA2
PA6/TP6/
TIOCA2/
A21
PA6/TP6/
TIOCA2/
A21
PA6/TP6/
TIOCA2/
A21
PA6/TP6/
TIOCA2
100
PA7/TP7/
TIOCB2
PA7/TP7/
TIOCB2
A20
A20
PA7/TP7/
TIOCB2/
A20
PA7/TP7/
TIOCB2
Notes: *1 In modes 1, 3, 5 the P40 to P47 functions of pins P40/D0 to P47/D7 are selected after a
reset, but they can be changed by software.
*2 In modes 2 and 4 the D0 to D7 functions of pins P40/D0 to P47/D7 are selected after a
reset, but they can be changed by software.
*3 In modes 1 to 5 the P67/φ pin is the φ pin after a reset, but it can be changed by
software.
*4 In mode 7 the P67/φ pin is set as the P67 pin after a reset, but it can be changed by
software.
Rev. 2.0, 06/04, page 17 of 980
Rev. 2.0, 06/04, page 18 of 980
Section 2 CPU
2.1
Overview
The H8/300H CPU is a high-speed central processing unit with an internal 32-bit architecture that
is upward-compatible with the H8/300 CPU. The H8/300H CPU has sixteen 16-bit general
registers, can address a 16-Mbyte linear address space, and is ideal for realtime control.
2.1.1
Features
The H8/300H CPU has the following features.
• Upward compatibility with H8/300 CPU
Can execute H8/300 Series object programs
• General-register architecture
Sixteen 16-bit general registers (also usable as sixteen 8-bit registers or eight 32-bit registers)
• Sixty-two basic instructions
 8/16/32-bit arithmetic and logic instructions
 Multiply and divide instructions
 Powerful bit-manipulation instructions
• Eight addressing modes
 Register direct [Rn]
 Register indirect [@ERn]
 Register indirect with displacement [@(d:16, ERn) or @(d:24, ERn)]
 Register indirect with post-increment or pre-decrement [@ERn+ or @–ERn]
 Absolute address [@aa:8, @aa:16, or @aa:24]
 Immediate [#xx:8, #xx:16, or #xx:32]
 Program-counter relative [@(d:8, PC) or @(d:16, PC)]
 Memory indirect [@@aa:8]
• 16-Mbyte linear address space
Rev. 2.0, 06/04, page 19 of 980
• High-speed operation
 All frequently-used instructions execute in two to four states
 Maximum clock frequency:
25 MHz
 8/16/32-bit register-register add/subtract: 80 ns
 8 × 8-bit register-register multiply:
560 ns
 16 ÷ 8-bit register-register divide:
560 ns
 16 × 16-bit register-register multiply:
880 ns
 32 ÷ 16-bit register-register divide:
880 ns
• Two CPU operating modes
 Normal mode
 Advanced mode
• Low-power mode
Transition to power-down state by SLEEP instruction
2.1.2
Differences from H8/300 CPU
In comparison to the H8/300 CPU, the H8/300H has the following enhancements.
• More general registers
Eight 16-bit registers have been added.
• Expanded address space
 Advanced mode supports a maximum 16-Mbyte address space.
 Normal mode supports the same 64-kbyte address space as the H8/300 CPU.
(Normal mode cannot be selected in the H8/3029.)
• Enhanced addressing
The addressing modes have been enhanced to make effective use of the 16-Mbyte address
space.
• Enhanced instructions
 Data transfer, arithmetic, and logic instructions can operate on 32-bit data.
 Signed multiply/divide instructions and other instructions have been added.
Rev. 2.0, 06/04, page 20 of 980
2.2
CPU Operating Modes
The H8/300H CPU has two operating modes: normal and advanced. Normal mode supports a
maximum 64-kbyte address space. Advanced mode supports up to 16 Mbytes.
Normal mode*
Maximum 64 kbytes, program
and data areas combined
Advanced mode
Maximum 16 Mbytes, program
and data areas combined
CPU operating modes
Note: * Cannot be selected in H8/3029
Figure 2.1 CPU Operating Modes
Rev. 2.0, 06/04, page 21 of 980
2.3
Address Space
Figure 2.2 shows a simple memory map for the H8/3029. The H8/300H CPU can address a linear
address space with a maximum size of 64 kbytes in normal mode, and 16 Mbytes in advanced
mode. For further details see section 3.6, Memory Map in Each Operating Mode.
The 1-Mbyte operating modes use 20-bit addressing. The upper 4 bits of effective addresses are
ignored.
H'0000
H'00000
H'000000
H'FFFF
H'FFFFF
H'FFFFFF
a. 1-Mbyte mode
Normal mode*
b. 16-Mbyte mode
Advanced mode
Note: * Cannot be selected in H8/3029
Figure 2.2 Memory Map
Rev. 2.0, 06/04, page 22 of 980
2.4
Register Configuration
2.4.1
Overview
The H8/300H CPU has the internal registers shown in figure 2.3. There are two types of registers:
general registers and control registers.
General Registers (ERn)
15
0 7
0 7
0
ER0
E0
R0H
R0L
ER1
E1
R1H
R1L
ER2
E2
R2H
R2L
ER3
E3
R3H
R3L
ER4
E4
R4H
R4L
ER5
E5
R5H
R5L
ER6
E6
R6H
R6L
ER7
E7
R7H
R7L
(SP)
Control Registers (CR)
23
0
PC
7 6 5 4 3 2 1 0
CCR I UI H U N Z V C
Legend
SP: Stack pointer
PC: Program counter
CCR: Condition code register
Interrupt mask bit
I:
User bit or interrupt mask bit
UI:
Half-carry flag
H:
User bit
U:
Negative flag
N:
Zero flag
Z:
Overflow flag
V:
Carry flag
C:
Figure 2.3 CPU Registers
Rev. 2.0, 06/04, page 23 of 980
2.4.2
General Registers
The H8/300H CPU has eight 32-bit general registers. These general registers are all functionally
alike and can be used without distinction between data registers and address registers. When a
general register is used as a data register, it can be accessed as a 32-bit, 16-bit, or 8-bit register.
When the general registers are used as 32-bit registers or as address registers, they are designated
by the letters ER (ER0 to ER7).
The ER registers divide into 16-bit general registers designated by the letters E (E0 to E7) and R
(R0 to R7). These registers are functionally equivalent, providing a maximum sixteen 16-bit
registers. The E registers (E0 to E7) are also referred to as extended registers.
The R registers divide into 8-bit general registers designated by the letters RH (R0H to R7H) and
RL (R0L to R7L). These registers are functionally equivalent, providing a maximum sixteen 8-bit
registers.
Figure 2.4 illustrates the usage of the general registers. The usage of each register can be selected
independently.
• Address registers
• 32-bit registers
• 16-bit registers
• 8-bit registers
E registers
(extended registers)
E0 to E7
RH registers
R0H to R7H
ER registers
ER0 to ER7
R registers
R0 to R7
RL registers
R0L to R7L
Figure 2.4 Usage of General Registers
Rev. 2.0, 06/04, page 24 of 980
General register ER7 has the function of stack pointer (SP) in addition to its general-register
function, and is used implicitly in exception handling and subroutine calls. Figure 2.5 shows the
stack.
Free area
SP (ER7)
Stack area
Figure 2.5 Stack
2.4.3
Control Registers
The control registers are the 24-bit program counter (PC) and the 8-bit condition code register
(CCR).
Program Counter (PC): This 24-bit counter indicates the address of the next instruction the CPU
will execute. The length of all CPU instructions is 2 bytes (one word), so the least significant PC
bit is ignored. When an instruction is fetched, the least significant PC bit is regarded as 0.
Condition Code Register (CCR): This 8-bit register contains internal CPU status information,
including the interrupt mask bit (I) and half-carry (H), negative (N), zero (Z), overflow (V), and
carry (C) flags.
Bit 7—Interrupt Mask Bit (I): Masks interrupts other than NMI when set to 1. NMI is accepted
regardless of the I bit setting. The I bit is set to 1 at the start of an exception-handling sequence.
Bit 6—User Bit or Interrupt Mask Bit (UI): Can be written and read by software using the
LDC, STC, ANDC, ORC, and XORC instructions. This bit can also be used as an interrupt mask
bit. For details see section 5, Interrupt Controller.
Bit 5—Half-Carry Flag (H): When the ADD.B, ADDX.B, SUB.B, SUBX.B, CMP.B, or NEG.B
instruction is executed, this flag is set to 1 if there is a carry or borrow at bit 3, and cleared to 0
otherwise. When the ADD.W, SUB.W, CMP.W, or NEG.W instruction is executed, the H flag is
set to 1 if there is a carry or borrow at bit 11, and cleared to 0 otherwise. When the ADD.L,
SUB.L, CMP.L, or NEG.L instruction is executed, the H flag is set to 1 if there is a carry or
borrow at bit 27, and cleared to 0 otherwise.
Rev. 2.0, 06/04, page 25 of 980
Bit 4—User Bit (U): Can be written and read by software using the LDC, STC, ANDC, ORC, and
XORC instructions.
Bit 3—Negative Flag (N): Stores the value of the most significant bit of data, regarded as the
sign bit.
Bit 2—Zero Flag (Z): Set to 1 to indicate zero data, and cleared to 0 to indicate non-zero data.
Bit 1—Overflow Flag (V): Set to 1 when an arithmetic overflow occurs, and cleared to 0 at other
times.
Bit 0—Carry Flag (C): Set to 1 when a carry is generated by execution of an operation, and
cleared to 0 otherwise. Used by:
• Add instructions, to indicate a carry
• Subtract instructions, to indicate a borrow
• Shift and rotate instructions
The carry flag is also used as a bit accumulator by bit manipulation instructions.
Some instructions leave flag bits unchanged. Operations can be performed on CCR by the LDC,
STC, ANDC, ORC, and XORC instructions. The N, Z, V, and C flags are used by conditional
branch (Bcc) instructions.
For the action of each instruction on the flag bits, see appendix A.1, Instruction List. For the I and
UI bits, see section 5, Interrupt Controller.
2.4.4
Initial CPU Register Values
In reset exception handling, PC is initialized to a value loaded from the vector table, and the I bit
in CCR is set to 1. The other CCR bits and the general registers are not initialized. In particular,
the initial value of the stack pointer (ER7) is also undefined. The stack pointer (ER7) must
therefore be initialized by an MOV.L instruction executed immediately after a reset.
Rev. 2.0, 06/04, page 26 of 980
2.5
Data Formats
The H8/300H CPU can process 1-bit, 4-bit (BCD), 8-bit (byte), 16-bit (word), and 32-bit
(longword) data. Bit-manipulation instructions operate on 1-bit data by accessing bit n (n = 0, 1,
2, …, 7) of byte operand data. The DAA and DAS decimal-adjust instructions treat byte data as
two digits of 4-bit BCD data.
2.5.1
General Register Data Formats
Figures 2.6 and 2.7 show the data formats in general registers.
Data Type
General
Register
1-bit data
RnH
7 6 5 4 3 2 1 0
1-bit data
RnL
Don’t care
4-bit BCD data
RnH
Upper digit Lower digit
4-bit BCD data
RnL
Don’t care
Byte data
RnH
Data Format
7
0
Don’t care
7
7
4 3
0
Don’t care
7
7
RnL
4 3
0
Upper digit Lower digit
0
Don’t care
MSB
Byte data
0
7 6 5 4 3 2 1 0
LSB
7
0
MSB
LSB
Don’t care
Legend
RnH: General register RH
RnL: General register RL
Figure 2.6 General Register Data Formats
Rev. 2.0, 06/04, page 27 of 980
Data Type
General
Register
Word data
Rn
Word data
Data Format
15
0
MSB
LSB
15
0
MSB
LSB
En
31
16 15
0
Longword data ERn
MSB
Legend
ERn: General register
En:
General register E
Rn:
General register R
MSB: Most significant bit
LSB: Least significant bit
Figure 2.7 General Register Data Formats
Rev. 2.0, 06/04, page 28 of 980
LSB
2.5.2
Memory Data Formats
Figure 2.8 shows the data formats on memory. The H8/300H CPU can access word data and
longword data on memory, but word or longword data must begin at an even address. If an
attempt is made to access word or longword data at an odd address, no address error occurs but
the least significant bit of the address is regarded as 0, so the access starts at the preceding address.
This also applies to instruction fetches.
Data Type
Address
Data Format
1-bit data
Address L
7
Byte data
Address L
MSB
Word data
Address 2M
MSB
7
0
6
5
4
Address 2N
2
1
0
LSB
Address 2M + 1
Longword data
3
LSB
MSB
Address 2N + 1
Address 2N + 2
Address 2N + 3
LSB
Figure 2.8 Memory Data Formats
When ER7 (SP) is used as an address register to access the stack, the operand size should be word
size or longword size.
Rev. 2.0, 06/04, page 29 of 980
2.6
Instruction Set
2.6.1
Instruction Set Overview
The H8/300H CPU has 62 types of instructions, which are classified in table 2.1.
Table 2.1
Instruction Classification
Function
Data transfer
Instruction
Types
1
1
2
MOV, PUSH* , POP* , MOVTPE* , MOVFPE*
2
3
Arithmetic operations ADD, SUB, ADDX, SUBX, INC, DEC, ADDS, SUBS, DAA, DAS, 18
MULXU, MULXS, DIVXU, DIVXS, CMP, NEG, EXTS, EXTU
Logic operations
AND, OR, XOR, NOT
4
Shift operations
SHAL, SHAR, SHLL, SHLR, ROTL, ROTR, ROTXL, ROTXR
8
Bit manipulation
BSET, BCLR, BNOT, BTST, BAND, BIAND, BOR, BIOR, BXOR, 14
BIXOR, BLD, BILD, BST, BIST
Branch
Bcc* , JMP, BSR, JSR, RTS
5
System control
TRAPA, RTE, SLEEP, LDC, STC, ANDC, ORC, XORC, NOP
9
Block data transfer
EEPMOV
1
3
Total 62 types
Notes: *1 POP.W Rn is identical to MOV.W @SP+, Rn.
PUSH.W Rn is identical to MOV.W Rn, @–SP.
POP.L ERn is identical to MOV.L @SP+, Rn.
PUSH.L ERn is identical to MOV.L Rn, @–SP.
*2 Not available in the H8/3029.
*3 Bcc is a generic branching instruction.
Rev. 2.0, 06/04, page 30 of 980
2.6.2
Instructions and Addressing Modes
Table 2.2 indicates the instructions available in the H8/300H CPU.
Table 2.2
Instructions and Addressing Modes
Addressing Modes
Function
Instruction
#xx
Rn
@ERn
@
(d:16,
ERn)
@
(d:24,
ERn)
@ERn+/
@–ERn
@
aa:8
@
aa:16
@
aa:24
@
(d:8,
PC)
@
(d:16,
PC)
@@
aa:8
Data
transfer
MOV
BWL
BWL
BWL
BWL
BWL
BWL
B
BWL
BWL
—
—
—
—
—
POP, PUSH
—
—
—
—
—
—
—
—
—
—
—
—
WL
MOVFPE,
—
—
—
—
—
—
—
—
—
—
—
—
—
ADD, CMP
BWL
BWL
—
—
—
—
—
—
—
—
—
—
—
SUB
WL
BWL
—
—
—
—
—
—
—
—
—
—
—
ADDX, SUBX
B
B
—
—
—
—
—
—
—
—
—
—
—
ADDS, SUBS
—
L
—
—
—
—
—
—
—
—
—
—
—
INC, DEC
—
BWL
—
—
—
—
—
—
—
—
—
—
—
DAA, DAS
—
B
—
—
—
—
—
—
—
—
—
—
—
MULXU,
—
BW
—
—
—
—
—
—
—
—
—
—
—
MOVTPE
Arithmetic
operations
MULXS,
DIVXU,
DIVXS
Logic
operations
NEG
—
BWL
—
—
—
—
—
—
—
—
—
—
—
EXTU, EXTS
—
WL
—
—
—
—
—
—
—
—
—
—
—
BWL
—
—
—
—
—
—
—
—
—
—
—
AND, OR, XOR —
—
BWL
—
—
—
—
—
—
—
—
—
—
—
Shift instructions
NOT
—
BWL
—
—
—
—
—
—
—
—
—
—
—
Bit manipulation
—
B
B
—
—
—
B
—
—
—
—
—
—
Branch
Bcc, BSR
—
—
—
—
—
—
—
—
—
—
—
—
—
JMP, JSR
—
—
—
—
—
—
—
—
—
—
RTS
—
—
—
—
—
—
—
—
TRAPA
—
—
—
—
—
—
—
—
System
control
—
—
—
—
—
—
—
RTE
—
—
—
—
—
—
—
—
—
—
—
—
SLEEP
—
—
—
—
—
—
—
—
—
—
—
—
LDC
B
B
W
W
W
W
—
W
W
—
—
—
STC
—
B
W
W
W
W
—
W
W
—
—
—
—
ANDC, ORC,
XORC
B
—
—
—
—
—
—
—
—
—
—
—
—
NOP
—
—
—
—
—
—
—
—
—
—
—
—
Block data transfer
—
—
—
—
—
—
—
—
—
—
—
—
BW
Rev. 2.0, 06/04, page 31 of 980
2.6.3
Tables of Instructions Classified by Function
Tables 2.3 to 2.10 summarize the instructions in each functional category. The operation notation
used in these tables is defined next.
Operation Notation
Rd
General register (destination)*
Rs
General register (source)*
Rn
General register*
ERn
General register (32-bit register or address register)
(EAd)
Destination operand
(EAs)
Source operand
CCR
Condition code register
N
N (negative) flag of CCR
Z
Z (zero) flag of CCR
V
V (overflow) flag of CCR
C
C (carry) flag of CCR
PC
Program counter
SP
Stack pointer
#IMM
Immediate data
disp
Displacement
+
Addition
–
Subtraction
×
Multiplication
÷
Division
∧
AND logical
∨
OR logical
⊕
Exclusive OR logical
→
Move
¬
NOT (logical complement)
:3/:8/:16/:24
3-, 8-, 16-, or 24-bit length
Note:
*
General registers include 8-bit registers (R0H to R7H, R0L to R7L), 16-bit registers (R0
to R7, E0 to E7), and 32-bit data or address registers (ER0 to ER7).
Rev. 2.0, 06/04, page 32 of 980
Table 2.3
Data Transfer Instructions
Instruction Size*
Function
MOV
(EAs) → Rd, Rs → (EAd)
B/W/L
Moves data between two general registers or between a general register and
memory, or moves immediate data to a general register.
MOVFPE
B
(EAs) → Rd
Cannot be used in this LSI.
MOVTPE
B
Rs → (EAs)
Cannot be used in this LSI.
POP
W/L
@SP+ → Rn
Pops a general register from the stack. POP.W Rn is identical to MOV.W
@SP+, Rn. Similarly, POP.L ERn is identical to MOV.L @SP+, ERn.
PUSH
W/L
Rn → @–SP
Pushes a general register onto the stack. PUSH.W Rn is identical to MOV.W
Rn, @–SP. Similarly, PUSH.L ERn is identical to MOV.L ERn, @–SP.
Note:
*
Size refers to the operand size.
B:
Byte
W:
Word
L:
Longword
Rev. 2.0, 06/04, page 33 of 980
Table 2.4
Arithmetic Operation Instructions
Instruction Size*
Function
ADD,SUB
Rd ± Rs → Rd, Rd ± #IMM → Rd
B/W/L
Performs addition or subtraction on data in two general registers, or on
immediate data and data in a general register. (Immediate byte data cannot
be subtracted from data in a general register. Use the SUBX or ADD
instruction.)
ADDX,
SUBX
B
INC,
DEC
B/W/L
ADDS,
SUBS
L
DAA,
DAS
B
MULXU
B/W
Rd ± Rs ± C → Rd, Rd ± #IMM ± C → Rd
Performs addition or subtraction with carry or borrow on data in two general
registers, or on immediate data and data in a general register.
Rd ± 1 → Rd, Rd ± 2 → Rd
Increments or decrements a general register by 1 or 2. (Byte operands can
be incremented or decremented by 1 only.)
Rd ± 1 → Rd, Rd ± 2 → Rd, Rd ± 4 → Rd
Adds or subtracts the value 1, 2, or 4 to or from data in a 32-bit register.
Rd decimal adjust → Rd
Decimal-adjusts an addition or subtraction result in a general register by
referring to CCR to produce 4-bit BCD data.
Rd × Rs → Rd
Performs unsigned multiplication on data in two general registers:
either 8 bits × 8 bits → 16 bits or 16 bits × 16 bits → 32 bits.
MULXS
B/W
Rd × Rs → Rd
Performs signed multiplication on data in two general registers:
either 8 bits × 8 bits → 16 bits or 16 bits × 16 bits → 32 bits.
DIVXU
B/W
Rd ÷ Rs → Rd
Performs unsigned division on data in two general registers: either 16 bits ÷
8 bits → 8-bit quotient and 8-bit remainder or 32 bits ÷ 16 bits → 16-bit
quotient and 16-bit remainder
DIVXS
B/W
Rd ÷ Rs → Rd
Performs signed division on data in two general registers: either 16 bits ÷ 8
bits → 8-bit quotient and 8-bit remainder, or 32 bits ÷ 16 bits → 16-bit
quotient and 16-bit remainder
CMP
B/W/L
Rd – Rs, Rd – #IMM
Compares data in a general register with data in another general register or
with immediate data, and sets CCR according to the result.
NEG
B/W/L
0 – Rd → Rd
Takes the two’s complement (arithmetic complement) of data in a general
register.
Rev. 2.0, 06/04, page 34 of 980
Instruction Size*
Function
EXTS
Rd (sign extension) → Rd
W/L
Extends byte data in the lower 8 bits of a 16-bit register to word data, or
extends word data in the lower 16 bits of a 32-bit register to longword data,
by extending the sign bit.
EXTU
W/L
Rd (zero extension) → Rd
Extends byte data in the lower 8 bits of a 16-bit register to word data, or
extends word data in the lower 16 bits of a 32-bit register to longword data,
by padding with zeros.
Note:
*
Table 2.5
Size refers to the operand size.
B:
Byte
W:
Word
L:
Longword
Logic Operation Instructions
Instruction Size*
Function
AND
Rd ∧ Rs → Rd, Rd ∧ #IMM → Rd
B/W/L
Performs a logical AND operation on a general register and another general
register or immediate data.
OR
B/W/L
Rd ∨ Rs → Rd, Rd ∨ #IMM → Rd
Performs a logical OR operation on a general register and another general
register or immediate data.
XOR
B/W/L
Rd ⊕ Rs → Rd, Rd ⊕ #IMM → Rd
Performs a logical exclusive OR operation on a general register and another
general register or immediate data.
NOT
B/W/L
¬ Rd → Rd
Takes the one's complement (logical complement) of general register
contents.
Note:
*
Size refers to the operand size.
B:
Byte
W:
Word
L:
Longword
Rev. 2.0, 06/04, page 35 of 980
Table 2.6
Shift Instructions
Instruction Size*
Function
SHAL,
SHAR
B/W/L
Rd (shift) → Rd
SHLL,
SHLR
B/W/L
ROTL,
ROTR
B/W/L
ROTXL,
ROTXR
B/W/L
Note:
Performs an arithmetic shift on general register contents.
Rd (shift) → Rd
Performs a logical shift on general register contents.
Rd (rotate) → Rd
Rotates general register contents.
*
Rd (rotate) → Rd
Rotates general register contents, including the carry bit.
Size refers to the operand size.
B:
Byte
W:
Word
L:
Longword
Rev. 2.0, 06/04, page 36 of 980
Table 2.7
Bit Manipulation Instructions
Instruction Size*
Function
BSET
1 → (<bit-No.> of <EAd>)
B
Sets a specified bit in a general register or memory operand to 1. The bit
number is specified by 3-bit immediate data or the lower 3 bits of a general
register.
BCLR
B
0 → (<bit-No.> of <EAd>)
Clears a specified bit in a general register or memory operand to 0. The bit
number is specified by 3-bit immediate data or the lower 3 bits of a general
register.
BNOT
B
¬ (<bit-No.> of <EAd>) → (<bit-No.> of <EAd>)
Inverts a specified bit in a general register or memory operand. The bit
number is specified by 3-bit immediate data or the lower 3 bits of a general
register.
BTST
B
¬ (<bit-No.> of <EAd>) → Z
Tests a specified bit in a general register or memory operand and sets or
clears the Z flag accordingly. The bit number is specified by 3-bit immediate
data or the lower 3 bits of a general register.
BAND
B
C ∧ (<bit-No.> of <EAd>) → C
ANDs the carry flag with a specified bit in a general register or memory
operand and stores the result in the carry flag.
BIAND
B
C ∧ [¬ (<bit-No.> of <EAd>)] → C
ANDs the carry flag with the inverse of a specified bit in a general register or
memory operand and stores the result in the carry flag.
The bit number is specified by 3-bit immediate data.
BOR
B
C ∨ (<bit-No.> of <EAd>) → C
ORs the carry flag with a specified bit in a general register or memory
operand and stores the result in the carry flag.
BIOR
B
C ∨ [¬ (<bit-No.> of <EAd>)] → C
ORs the carry flag with the inverse of a specified bit in a general register or
memory operand and stores the result in the carry flag.
The bit number is specified by 3-bit immediate data.
BXOR
B
C ⊕ (<bit-No.> of <EAd>) → C
Exclusive-ORs the carry flag with a specified bit in a general register or
memory operand and stores the result in the carry flag.
BIXOR
B
C ⊕ [¬ (<bit-No.> of <EAd>)] → C
Exclusive-ORs the carry flag with the inverse of a specified bit in a general
register or memory operand and stores the result in the carry flag.
The bit number is specified by 3-bit immediate data.
Rev. 2.0, 06/04, page 37 of 980
Instruction Size*
Function
BLD
(<bit-No.> of <EAd>) → C
B
Transfers a specified bit in a general register or memory operand to the carry
flag.
BILD
B
¬ (<bit-No.> of <EAd>) → C
Transfers the inverse of a specified bit in a general register or memory
operand to the carry flag.
The bit number is specified by 3-bit immediate data.
BST
B
C → (<bit-No.> of <EAd>)
Transfers the carry flag value to a specified bit in a general register or
memory operand.
BIST
B
C → ¬ (<bit-No.> of <EAd>)
Transfers the inverse of the carry flag value to a specified bit in a general
register or memory operand.
The bit number is specified by 3-bit immediate data.
Note:
*
Size refers to the operand size.
B:
Byte
Rev. 2.0, 06/04, page 38 of 980
Table 2.8
Branching Instructions
Instruction Size
Function
Bcc
Branches to a specified address if address specified condition is met. The
branching conditions are listed below.
—
Mnemonic
JMP
—
Description
Condition
BRA (BT)
Always (true)
Always
BRN (BF)
Never (false)
Never
BHI
High
C∨Z=0
BLS
Low or same
C∨Z=1
Bcc (BHS)
Carry clear (high or same) C = 0
BCS (BLO)
Carry set (low)
C=1
BNE
Not equal
Z=0
BEQ
Equal
Z=1
BVC
Overflow clear
V=0
BVS
Overflow set
V=1
BPL
Plus
N=0
BMI
Minus
N=1
BGE
Greater or equal
N⊕V=0
BLT
Less than
N⊕V=1
BGT
Greater than
Z ∨ (N ⊕ V) = 0
BLE
Less or equal
Z ∨ (N ⊕ V) = 1
Branches unconditionally to a specified address
BSR
—
Branches to a subroutine at a specified address
JSR
—
Branches to a subroutine at a specified address
RTS
—
Returns from a subroutine
Rev. 2.0, 06/04, page 39 of 980
Table 2.9
System Control Instructions
Instruction Size*
Function
TRAPA
—
Starts trap-instruction exception handling
RTE
—
Returns from an exception-handling routine
SLEEP
—
Causes a transition to the power-down state
LDC
B/W
(EAs) → CCR
Moves the source operand contents to the condition code register. The
condition code register size is one byte, but in transfer from memory, data is
read by word access.
STC
B/W
CCR → (EAd)
Transfers the CCR contents to a destination location. The condition code
register size is one byte, but in transfer to memory, data is written by word
access.
ANDC
B
CCR ∧ #IMM → CCR
Logically ANDs the condition code register with immediate data.
ORC
B
CCR ∨ #IMM → CCR
Logically ORs the condition code register with immediate data.
XORC
B
NOP
—
CCR ⊕ #IMM → CCR
Logically exclusive-ORs the condition code register with immediate data.
PC + 2 → PC
Only increments the program counter.
Note:
*
Size refers to the operand size.
B:
Byte
W:
Word
Rev. 2.0, 06/04, page 40 of 980
Table 2.10 Block Transfer Instruction
Instruction
Size
Function
EEPMOV.B
—
if R4L ≠ 0 then
repeat @ER5+ → @ER6+, R4L – 1 → R4L
until
R4L = 0
else next;
EEPMOV.W
—
if R4 ≠ 0 then
repeat @ER5+ → @ER6+, R4 – 1 → R4
until
R4 = 0
else next;
Block transfer instruction. This instruction transfers the number of data bytes
specified by R4L or R4, starting from the address indicated by ER5, to the
location starting at the address indicated by ER6. At the end of the transfer,
the next instruction is executed.
2.6.4
Basic Instruction Formats
The H8/300H instructions consist of 2-byte (1-word) units. An instruction consists of an operation
field (OP field), a register field (r field), an effective address extension (EA field), and a condition
field (cc field).
Operation Field: Indicates the function of the instruction, the addressing mode, and the operation
to be carried out on the operand. The operation field always includes the first 4 bits of the
instruction. Some instructions have two operation fields.
Register Field: Specifies a general register. Address registers are specified by 3 bits, data
registers by 3 bits or 4 bits. Some instructions have two register fields. Some have no register
field.
Effective Address Extension: 8, 16, or 32 bits specifying immediate data, an absolute address, or
a displacement. A 24-bit address or displacement is treated as 32-bit data in which the first 8 bits
are 0 (H'00).
Condition Field: Specifies the branching condition of Bcc instructions.
Figure 2.9 shows examples of instruction formats.
Rev. 2.0, 06/04, page 41 of 980
Operation field only
op
NOP, RTS, etc.
Operation field and register fields
op
rn
rm
ADD.B Rn, Rm, etc.
Operation field, register fields, and effective address extension
op
rn
rm
MOV.B @(d:16, Rn), Rm
EA (disp)
Operation field, effective address extension, and condition field
op
cc
EA (disp)
BRA d:8
Figure 2.9 Instruction Formats
2.6.5
Notes on Use of Bit Manipulation Instructions
The BSET, BCLR, BNOT, BST, and BIST instructions read a byte of data, modify a bit in the
byte, then write the byte back. Care is required when these instructions are used to access registers
with write-only bits, or to access ports.
Step
1
Description
Read
Read one data byte at the specified address
2
Modify
Modify one bit in the data byte
3
Write
Write the modified data byte back to the specified address
Example 1: BCLR is executed to clear bit 0 in the port 4 data direction register (P4DDR) under
the following conditions.
P47, P46: Input pins
P45 – P40: Output pins
The intended purpose of this BCLR instruction is to switch P40 from output to input.
Before Execution of BCLR Instruction
P47
P46
P45
P44
P43
P42
P41
P40
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
DDR
0
0
1
1
1
1
1
1
Rev. 2.0, 06/04, page 42 of 980
Execution of BCLR Instruction
BCLR
;Clear bit 0 in data direction register
#0, @P4DDR
After Execution of BCLR Instruction
P47
P46
P45
P44
P43
P42
P41
P40
Input/output
Output
Output
Output
Output
Output
Output
Output
Input
DDR
1
1
1
1
1
1
1
0
Explanation: To execute the BCLR instruction, the CPU begins by reading P4DDR. Since
P4DDR is a write-only register, it is read as H'FF, even though its true value is H'3F.
Next the CPU clears bit 0 of the read data, changing the value to H'FE.
Finally, the CPU writes this value (H'FE) back to P4DDR to complete the BCLR instruction.
As a result, P40DDR is cleared to 0, making P40 an input pin. In addition, P47DDR and P46DDR
are set to 1, making P47 and P46 output pins.
The BCLR instruction can be used to clear flags in the on-chip registers to 0. In an interrupthandling routine, for example, if it is known that the flag is set to 1, it is not necessary to read the
flag ahead of time.
Rev. 2.0, 06/04, page 43 of 980
2.7
Addressing Modes and Effective Address Calculation
2.7.1
Addressing Modes
The H8/300H CPU supports the eight addressing modes listed in table 2.11. Each instruction uses
a subset of these addressing modes. Arithmetic and logic instructions can use the register direct
and immediate modes. Data transfer instructions can use all addressing modes except programcounter relative and memory indirect. Bit manipulation instructions use register direct, register
indirect, or absolute (@aa:8) addressing mode to specify an operand, and register direct (BSET,
BCLR, BNOT, and BTST instructions) or immediate (3-bit) addressing mode to specify a bit
number in the operand.
Table 2.11 Addressing Modes
No.
Addressing Mode
Symbol
1
Register direct
Rn
2
Register indirect
@ERn
3
Register indirect with displacement
@(d:16, ERn)/@(d:24, ERn)
4
Register indirect with post-increment
Register indirect with pre-decrement
@ERn+
@–ERn
5
Absolute address
@aa:8/@aa:16/@aa:24
6
Immediate
#xx:8/#xx:16/#xx:32
7
Program-counter relative
@(d:8, PC)/@(d:16, PC)
8
Memory indirect
@@aa:8
1 Register Direct—Rn: The register field of the instruction code specifies an 8-, 16-, or 32-bit
register containing the operand. R0H to R7H and R0L to R7L can be specified as 8-bit registers.
R0 to R7 and E0 to E7 can be specified as 16-bit registers. ER0 to ER7 can be specified as 32-bit
registers.
2 Register Indirect—@ERn: The register field of the instruction code specifies an address
register (ERn), the lower 24 bits of which contain the address of the operand.
3 Register Indirect with Displacement—@(d:16, ERn) or @(d:24, ERn): A 16-bit or 24-bit
displacement contained in the instruction code is added to the contents of an address register
(ERn) specified by the register field of the instruction, and the lower 24 bits of the sum specify the
address of a memory operand. A 16-bit displacement is sign-extended when added.
Rev. 2.0, 06/04, page 44 of 980
4 Register Indirect with Post-Increment or Pre-Decrement—@ERn+ or @–ERn:
• Register indirect with post-increment—@ERn+
The register field of the instruction code specifies an address register (ERn) the lower 24 bits
of which contain the address of a memory operand. After the operand is accessed, 1, 2, or 4 is
added to the address register contents (32 bits) and the sum is stored in the address register.
The value added is 1 for byte access, 2 for word access, or 4 for longword access. For word or
longword access, the register value should be even.
• Register indirect with pre-decrement—@–ERn
The value 1, 2, or 4 is subtracted from an address register (ERn) specified by the register field
in the instruction code, and the lower 24 bits of the result become the address of a memory
operand. The result is also stored in the address register. The value subtracted is 1 for byte
access, 2 for word access, or 4 for longword access. For word or longword access, the
resulting register value should be even.
5 Absolute Address—@aa:8, @aa:16, or @aa:24: The instruction code contains the absolute
address of a memory operand. The absolute address may be 8 bits long (@aa:8), 16 bits long
(@aa:16), or 24 bits long (@aa:24). For an 8-bit absolute address, the upper 16 bits are all
assumed to be 1 (H'FFFF). For a 16-bit absolute address the upper 8 bits are a sign extension. A
24-bit absolute address can access the entire address space. Table 2.12 indicates the accessible
address ranges.
Table 2.12 Absolute Address Access Ranges
Absolute
Address
1-Mbyte Modes
16-Mbyte Modes
8 bits (@aa:8)
H'FFF00 to H'FFFFF
(1048320 to 1048575)
H'FFFF00 to H'FFFFFF
(16776960 to 16777215)
16 bits (@aa:16)
H'00000 to H'07FFF,
H'F8000 to H'FFFFF
(0 to 32767, 1015808 to 1048575)
H'000000 to H'007FFF,
H'FF8000 to H'FFFFFF
(0 to 32767, 16744448 to 16777215)
24 bits (@aa:24)
H'00000 to H'FFFFF
(0 to 1048575)
H'000000 to H'FFFFFF
(0 to 16777215)
6 Immediate—#xx:8, #xx:16, or #xx:32: The instruction code contains 8-bit (#xx:8), 16-bit
(#xx:16), or 32-bit (#xx:32) immediate data as an operand.
The instruction codes of the ADDS, SUBS, INC, and DEC instructions contain immediate data
implicitly. The instruction codes of some bit manipulation instructions contain 3-bit immediate
data specifying a bit number. The TRAPA instruction code contains 2-bit immediate data
specifying a vector address.
Rev. 2.0, 06/04, page 45 of 980
7 Program-Counter Relative—@(d:8, PC) or @(d:16, PC): This mode is used in the Bcc and
BSR instructions. An 8-bit or 16-bit displacement contained in the instruction code is signextended to 24 bits and added to the 24-bit PC contents to generate a 24-bit branch address. The
PC value to which the displacement is added is the address of the first byte of the next instruction,
so the possible branching range is –126 to +128 bytes (–63 to +64 words) or –32766 to
+32768 bytes (–16383 to +16384 words) from the branch instruction. The resulting value should
be an even number.
8 Memory Indirect—@@aa:8: This mode can be used by the JMP and JSR instructions. The
instruction code contains an 8-bit absolute address specifying a memory operand. This memory
operand contains a branch address. The memory operand is accessed by longword access. The
first byte of the memory operand is ignored, generating a 24-bit branch address. See figure 2.10.
The upper bits of the 8-bit absolute address are assumed to be 0 (H'0000), so the address range is
0 to 255 (H'000000 to H'0000FF). Note that the first part of this range is also the exception vector
area. For further details see section 5, Interrupt Controller.
Specified by @aa:8
Reserved
Branch address
Figure 2.10 Memory-Indirect Branch Address Specification
When a word-size or longword-size memory operand is specified, or when a branch address is
specified, if the specified memory address is odd, the least significant bit is regarded as 0. The
accessed data or instruction code therefore begins at the preceding address. See section 2.5.2,
Memory Data Formats.
2.7.2
Effective Address Calculation
Table 2.13 explains how an effective address is calculated in each addressing mode. In the
1-Mbyte operating modes the upper 4 bits of the calculated address are ignored in order to
generate a 20-bit effective address.
Rev. 2.0, 06/04, page 46 of 980
Rev. 2.0, 06/04, page 47 of 980
4
3
2
r
r
r
op
r
Register indirect with pre-decrement
@–ERn
op
Register indirect with post-increment
@ERn+
Register indirect with post-increment
or pre-decrement
op
Register indirect with displacement
@(d:16, ERn)/@(d:24, ERn)
op
Register indirect (@ERn)
rm rn
Register direct (Rn)
1
op
Addressing Mode and
Instruction Format
No.
Table 2.13 Effective Address Calculation
31
31
1 for a byte operand,
2 for a word operand,
4 for a longword operand
1, 2, or 4
General register contents
1, 2, or 4
General register contents
disp
General register contents
General register contents
Sign extension
31
31
Effective Address Calculation
0
0
0
0
23
23
23
23
Operand is general
register contents
Effective Address
0
0
0
0
Rev. 2.0, 06/04, page 48 of 980
7
6
5
No.
abs
abs
abs
IMM
op
disp
Program-counter relative
@(d:8, PC) or @(d:16, PC)
op
Immediate
#xx:8, #xx:16, or #xx:32
op
@aa:24
op
@aa:16
op
Absolute address
@aa:8
Addressing Mode and
Instruction Format
disp
PC contents
Sign
extension
23
Effective Address Calculation
0
16 15
H'FFFF
8 7
23
Operand is immediate data
23
Sign
extension
23
23
Effective Address
0
0
0
0
Rev. 2.0, 06/04, page 49 of 980
Memory indirect @@aa:8
8
abs
Legend
r, rm, rn:
op:
disp:
IMM:
abs:
abs
Register field
Operation field
Displacement
Immediate data
Absolute address
op
Advanced mode
op
Normal mode
Addressing Mode and
Instruction Format
No.
31
8 7
abs
0
H'0000
8 7
abs
0
0
15
0
Memory contents
H'0000
Memory contents
23
23
Effective Address Calculation
23
23 16 15
H'00
Effective Address
0
0
2.8
Processing States
2.8.1
Overview
The H8/300H CPU has five processing states: the program execution state, exception-handling
state, power-down state, reset state, and bus-released state. The power-down state includes sleep
mode, software standby mode, and hardware standby mode. Figure 2.11 classifies the processing
states. Figure 2.13 indicates the state transitions.
Processing states
Program execution state
The CPU executes program instructions in sequence
Exception-handling state
A transient state in which the CPU executes a hardware sequence
(saving PC and CCR, fetching a vector, etc.) in response to a reset,
interrupt, or other exception
Bus-released state
The external bus has been released in response to a bus request
signal from a bus master other than the CPU
Reset state
The CPU and all on-chip supporting modules are initialized and halted
Power-down state
Sleep mode
The CPU is halted to conserve power
Software standby mode
Hardware standby mode
Figure 2.11 Processing States
Rev. 2.0, 06/04, page 50 of 980
2.8.2
Program Execution State
In this state the CPU executes program instructions in normal sequence.
2.8.3
Exception-Handling State
The exception-handling state is a transient state that occurs when the CPU alters the normal
program flow due to a reset, interrupt, or trap instruction. The CPU fetches a starting address from
the exception vector table and branches to that address. In interrupt and trap exception handling
the CPU references the stack pointer (ER7) and saves the program counter and condition code
register.
Types of Exception Handling and Their Priority: Exception handling is performed for resets,
interrupts, and trap instructions. Table 2.14 indicates the types of exception handling and their
priority. Trap instruction exceptions are accepted at all times in the program execution state.
Table 2.14 Exception Handling Types and Priority
Priority
Type of Exception Detection Timing
Start of Exception Handling
High
Reset
Synchronized with clock
Exception handling starts immediately
when RES changes from low to high
Interrupt
End of instruction
execution or end of
exception handling*
When an interrupt is requested,
exception handling starts at the end of
the current instruction or current
exception-handling sequence
Trap instruction
When TRAPA instruction Exception handling starts when a trap
is executed
(TRAPA) instruction is executed
Low
Note: * Interrupts are not detected at the end of the ANDC, ORC, XORC, and LDC instructions,
or immediately after reset exception handling.
Figure 2.12 classifies the exception sources. For further details about exception sources, vector
numbers, and vector addresses, see section 4, Exception Handling, and section 5, Interrupt
Controller.
Reset
External interrupts
Exception
sources
Interrupt
Internal interrupts (from on-chip supporting modules)
Trap instruction
Figure 2.12 Classification of Exception Sources
Rev. 2.0, 06/04, page 51 of 980
Bus request
End of bus release
Program execution state
End of bus
release
Bus
request
Exception
handling source
Bus-released state
End of
exception
handling
Interrupt source
Exception-handling state
NMI, IRQ 0 , IRQ 1,
or IRQ 2 interrupt
SLEEP
instruction
with SSBY = 0
Sleep mode
SLEEP instruction
with SSBY = 1
Software standby mode
RES = "High"
Reset state
*1
STBY="High", RES ="Low"
Hardware standby mode
*2
Power-down state
Notes: *1 From any state except hardware standby mode, a transition to the reset state occurs
whenever RES goes low.
*2 From any state, a transition to hardware standby mode occurs when STBY goes low.
Figure 2.13 State Transitions
Rev. 2.0, 06/04, page 52 of 980
2.8.4
Exception-Handling Sequences
Reset Exception Handling: Reset exception handling has the highest priority. The reset state is
entered when the RES signal goes low. Reset exception handling starts after that, when RES
changes from low to high. When reset exception handling starts the CPU fetches a start address
from the exception vector table and starts program execution from that address. All interrupts,
including NMI, are disabled during the reset exception-handling sequence and immediately after it
ends.
Interrupt Exception Handling and Trap Instruction Exception Handling: When these
exception-handling sequences begin, the CPU references the stack pointer (ER7) and pushes the
program counter and condition code register on the stack. Next, if the UE bit in the system control
register (SYSCR) is set to 1, the CPU sets the I bit in the condition code register to 1. If the UE bit
is cleared to 0, the CPU sets both the I bit and the UI bit in the condition code register to 1. Then
the CPU fetches a start address from the exception vector table and execution branches to that
address.
Figure 2.14 shows the stack after the exception-handling sequence.
SP–4
SP (ER7)
SP–3
SP+1
SP–2
SP+2
SP–1
SP+3
SP (ER7)
Stack area
Before exception
handling starts
CCR
PC
SP+4
Pushed on stack
Even
address
After exception
handling ends
Legend
CCR: Condition code register
SP:
Stack pointer
Notes: 1. PC is the address of the first instruction executed after the return from the
exception-handling routine.
2. Registers must be saved and restored by word access or longword access,
starting at an even address.
Figure 2.14 Stack Structure after Exception Handling
Rev. 2.0, 06/04, page 53 of 980
2.8.5
Bus-Released State
In this state the bus is released to a bus master other than the CPU, in response to a bus request.
The bus masters other than the CPU are the DMA controller, the DRAM interface, and an external
bus master. While the bus is released, the CPU halts except for internal operations. Interrupt
requests are not accepted. For details see section 6.10, Bus Arbiter.
2.8.6
Reset State
When the RES input goes low all current processing stops and the CPU enters the reset state. The
I bit in the condition code register is set to 1 by a reset. All interrupts are masked in the reset state.
Reset exception handling starts when the RES signal changes from low to high.
The reset state can also be entered by a watchdog timer overflow. For details see section 12,
Watchdog Timer.
2.8.7
Power-Down State
In the power-down state the CPU stops operating to conserve power. There are three modes: sleep
mode, software standby mode, and hardware standby mode.
Sleep Mode: A transition to sleep mode is made if the SLEEP instruction is executed while the
SSBY bit is cleared to 0 in the system control register (SYSCR). CPU operations stop
immediately after execution of the SLEEP instruction, but the contents of CPU registers are
retained.
Software Standby Mode: A transition to software standby mode is made if the SLEEP
instruction is executed while the SSBY bit is set to 1 in SYSCR. The CPU and clock halt and all
on-chip supporting modules stop operating. The on-chip supporting modules are reset, but as long
as a specified voltage is supplied the contents of CPU registers and on-chip RAM are retained.
The I/O ports also remain in their existing states.
Hardware Standby Mode: A transition to hardware standby mode is made when the STBY input
goes low. As in software standby mode, the CPU and all clocks halt and the on-chip supporting
modules are reset, but as long as a specified voltage is supplied, on-chip RAM contents are
retained.
For further information see section 20, Power-Down State.
Rev. 2.0, 06/04, page 54 of 980
2.9
Basic Operational Timing
2.9.1
Overview
The H8/300H CPU operates according to the system clock (ø). The interval from one rise of the
system clock to the next rise is referred to as a “state.” A memory cycle or bus cycle consists of
two or three states. The CPU uses different methods to access on-chip memory, the on-chip
supporting modules, and the external address space. Access to the external address space can be
controlled by the bus controller.
2.9.2
On-Chip Memory Access Timing
On-chip memory is accessed in two states. The data bus is 16 bits wide, permitting both byte and
word access. Figure 2.15 shows the on-chip memory access cycle. Figure 2.16 indicates the pin
states.
Bus cycle
T1 state
T2 state
φ
Internal address bus
Address
Internal read signal
Internal data bus
(read access)
Read data
Internal write signal
Internal data bus
(write access)
Write data
Figure 2.15 On-Chip Memory Access Cycle
Rev. 2.0, 06/04, page 55 of 980
T1
T2
φ
Address bus
AS , RD, HWR , LWR
Address
High
High impedance
D15 to D0
Figure 2.16 Pin States during On-Chip Memory Access
2.9.3
On-Chip Supporting Module Access Timing
The on-chip supporting modules are accessed in three states. The data bus is 8 or 16 bits wide,
depending on the internal I/O register being accessed. Figure 2.17 shows the on-chip supporting
module access timing. Figure 2.18 indicates the pin states.
Bus cycle
T1 state
T2 state
T3 state
φ
Address bus
Read
access
Address
Internal read signal
Internal data bus
Read data
Internal write signal
Write
access
Internal data bus
Write data
Figure 2.17 Access Cycle for On-Chip Supporting Modules
Rev. 2.0, 06/04, page 56 of 980
T1
T3
T2
φ
Address bus
AS , RD, HWR , LWR
Address
High
High impedance
D15 to D0
Figure 2.18 Pin States during Access to On-Chip Supporting Modules
2.9.4
Access to External Address Space
The external address space is divided into eight areas (areas 0 to 7). Bus-controller settings
determine whether each area is accessed via an 8-bit or 16-bit bus, and whether it is accessed in
two or three states. For details see section 6, Bus Controller.
Rev. 2.0, 06/04, page 57 of 980
Rev. 2.0, 06/04, page 58 of 980
Section 3 MCU Operating Modes
3.1
Overview
3.1.1
Operating Mode Selection
The H8/3029 has six operating modes (modes 1 to 5, 7) that are selected by the mode pins (MD2
to MD0) as indicated in table 3.1. The input at these pins determines the size of the address space
and the initial bus mode.
Table 3.1
Operating Mode Selection
Description
Mode Pins
Operating
Mode
MD2 MD1 MD0
Address Space
Initial Bus On-Chip
1
Mode*
ROM
On-Chip
RAM
—
0
0
0
—
—
—
—
Mode 1
0
0
1
Expanded mode
8 bits
Disabled
Enabled*
2
Mode 2
0
1
0
Expanded mode
16 bits
Disabled
Enabled*
2
Mode 3
0
1
1
Expanded mode
8 bits
Disabled
Enabled*
2
Mode 4
1
0
0
Expanded mode
16 bits
Disabled
Enabled*
2
Mode 5
1
0
1
Expanded mode
8 bits
Enabled
Enabled*
2
—
1
1
0
—
—
—
—
Mode 7
1
1
1
Single-chip advanced
mode
—
Enabled
Enabled
Notes: *1 In modes 1 to 5, an 8-bit or 16-bit data bus can be selected on a per-area basis by
settings made in the area bus width control register (ABWCR). For details see
section 6, Bus Controller.
*2 If the RAME bit in SYSCR is cleared to 0, these addresses become external
addresses.
For the address space size there are two choices: 1 Mbyte or 16 Mbyte.The external data bus is
either 8 or 16 bits wide depending on ABWCR settings. If 8-bit access is selected for all areas, 8bit bus mode is used. For details see section 6, Bus Controller.
Modes 1 to 4 are externally expanded modes that enable access to external memory and peripheral
devices and disable access to the on-chip ROM. Modes 1 and 2 support a maximum address space
of 1 Mbyte. Modes 3 and 4 support a maximum address space of 16 Mbytes.
Rev. 2.0, 06/04, page 59 of 980
Mode 5 is an externally expanded mode that enables access to external memory and peripheral
devices and also enables access to the on-chip ROM. Mode 5 supports a maximum address space
of 16 Mbytes.
Mode 7 are single-chip modes that operate using the on-chip ROM, RAM, and registers, and
makes all I/O ports available. Mode 7 supports a maximum address space of 1 Mbyte.
The H8/3029 can be used only in modes 1 to 5, 7. The inputs at the mode pins must select one of
these six modes. The inputs at the mode pins must not be changed during operation.
3.1.2
Register Configuration
The H8/3029 has a mode control register (MDCR) that indicates the inputs at the mode pins (MD2
to MD0), and a system control register (SYSCR). Table 3.2 summarizes these registers.
Table 3.2
Registers
Address*
Name
Abbreviation
R/W
Initial Value
H'EE011
Mode control register
MDCR
R
Undetermined
System control register
SYSCR
R/W
H'09
H'EE012
Note:
*
Lower 20 bits of the address in advanced mode.
Rev. 2.0, 06/04, page 60 of 980
3.2
Mode Control Register (MDCR)
MDCR is an 8-bit read-only register that indicates the current operating mode of the
H8/3029.
Bit
7
6
5
4
3
2
1
0
—
—
—
—
—
MDS2
MDS1
MDS0
Initial value
1
1
0
0
0
—*
—*
—*
Read/Write
—
—
—
—
—
R
R
R
Reserved bits
Reserved bits
Mode select 2 to 0
Bits indicating the current
operating mode
Note: * Determined by pins MD 2 to MD 0 .
Bits 7 and 6—Reserved: These bits can not be modified and are always read as 1.
Bits 5 to 3—Reserved: These bits can not be modified and are always read as 0.
Bits 2 to 0—Mode Select 2 to 0 (MDS2 to MDS0): These bits indicate the logic levels at pins
MD2 to MD0 (the current operating mode). MDS2 to MDS0 correspond to MD2 to MD0. MDS2 to
MDS0 are read-only bits. The mode pin (MD2 to MD0) levels are latched into these bits when
MDCR is read.
Note: A product with on-chip flash memory can operate in boot mode in which flash memory
can be programmed. In boot mode, the MDS2 bit indicates the logic level at pin MD2.
Rev. 2.0, 06/04, page 61 of 980
3.3
System Control Register (SYSCR)
SYSCR is an 8-bit register that controls the operation of the H8/3029.
Bit
7
6
5
4
3
2
1
0
SSBY
STS2
STS1
STS0
UE
NMIEG
SSOE
RAME
Initial value
0
0
0
0
1
0
0
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
RAM enable
Enables or
disables
on-chip RAM
Software standby output
port enable
Selects the output state
of the address bus
and bus control signals
in software standby mode
NMI edge select
Selects the valid edge
of the NMI input
User bit enable
Selects whether to use the UI bit in CCR
as a user bit or an interrupt mask bit
Standby timer select 2 to 0
These bits select the waiting time at
recovery from software standby mode
Software standby
Enables transition to software standby mode
Bit 7—Software Standby (SSBY): Enables transition to software standby mode. (For further
information about software standby mode see section 20, Power-Down State.)
When software standby mode is exited by an external interrupt, this bit remains set to 1. To clear
this bit, write 0.
Bit 7
SSBY
Description
0
SLEEP instruction causes transition to sleep mode
1
SLEEP instruction causes transition to software standby mode
Rev. 2.0, 06/04, page 62 of 980
(Initial value)
Bits 6 to 4—Standby Timer Select 2 to 0 (STS2 to STS0): These bits select the length of time
the CPU and on-chip supporting modules wait for the internal clock oscillator to settle when
software standby mode is exited by an external interrupt.
When using a crystal oscillator, set these bits so that the waiting time will be at least 7 ms at the
system clock rate.
For further information about waiting time selection, see section 20.4.3, Selection of Waiting
Time for Exit from Software Standby Mode.
Bit 6
STS2
Bit 5
STS1
Bit 4
STS0
Description
0
0
0
Waiting time = 8,192 states
0
0
1
Waiting time = 16,384 states
0
1
0
Waiting time = 32,768 states
0
1
1
Waiting time = 65,536 states
1
0
0
Waiting time = 131,072 states
1
0
1
Waiting time = 262,144 states
1
1
0
Waiting time = 1,024 states
1
1
1
Illegal setting
(Initial value)
Bit 3—User Bit Enable (UE): Selects whether to use the UI bit in the condition code register as a
user bit or an interrupt mask bit.
Bit 3
UE
Description
0
UI bit in CCR is used as an interrupt mask bit
1
UI bit in CCR is used as a user bit
(Initial value)
Bit 2—NMI Edge Select (NMIEG): Selects the valid edge of the NMI input.
Bit 2
NMIEG
Description
0
An interrupt is requested at the falling edge of NMI
1
An interrupt is requested at the rising edge of NMI
(Initial value)
Rev. 2.0, 06/04, page 63 of 980
Bit 1—Software Standby Output Port Enable (SSOE): Specifies whether the address bus and
bus control signals (CS0 to CS7, AS, RD, HWR, LWR, UCAS, LCAS, and RFSH) are kept as
outputs or fixed high, or placed in the high-impedance state in software standby mode.
Bit 1
SSOE
Description
0
In software standby mode, the address bus and bus control signals are all highimpedance
(Initial value)
1
In software standby mode, the address bus retains its output state and bus control
signals are fixed high
Bit 0—RAM Enable (RAME): Enables or disables the on-chip RAM. The RAME bit is
initialized by the rising edge of the RES signal. It is not initialized in software standby mode.
Bit 0
RAME
Description
0
On-chip RAM is disabled
1
On-chip RAM is enabled
3.4
Operating Mode Descriptions
3.4.1
Mode 1
(Initial value)
Ports 1, 2, and 5 function as address pins A19 to A0, permitting access to a maximum 1-Mbyte
address space. The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. If at least
one area is designated for 16-bit access in ABWCR, the bus mode switches to 16 bits.
3.4.2
Mode 2
Ports 1, 2, and 5 function as address pins A19 to A0, permitting access to a maximum 1-Mbyte
address space. The initial bus mode after a reset is 16 bits, with 16-bit access to all areas. If all
areas are designated for 8-bit access in ABWCR, the bus mode switches to 8 bits.
3.4.3
Mode 3
Ports 1, 2, 5, and part of port A function as address pins A23 to A0, permitting access to a
maximum 16-Mbyte address space. The initial bus mode after a reset is 8 bits, with 8-bit access to
all areas. If at least one area is designated for 16-bit access in ABWCR, the bus mode switches to
16 bits. A23 to A21 are valid when 0 is written in bits 7 to 5 of the bus release control register
(BRCR). (In this mode A20 is always used for address output.)
Rev. 2.0, 06/04, page 64 of 980
3.4.4
Mode 4
Ports 1, 2, 5, and part of port A function as address pins A23 to A0, permitting access to a
maximum 16-Mbyte address space. The initial bus mode after a reset is 16 bits, with 16-bit access
to all areas. If all areas are designated for 8-bit access in ABWCR, the bus mode switches to
8 bits. A23 to A21 are valid when 0 is written in bits 7 to 5 of BRCR. (In this mode A20 is always
used for address output.)
3.4.5
Mode 5
Ports 1, 2, 5, and part of port A can function as address pins A23 to A0, permitting access to a
maximum 16-Mbyte address space, but following a reset they are input ports. To use ports 1, 2,
and 5 as an address bus, the corresponding bits in their data direction registers (P1DDR, P2DDR,
and P5DDR) must be set to 1. For A23 to A20 output, write 0 in bits 7 to 4 of BRCR. Products with
on-chip flash memory support on-board programming which enables programming of the flash
memory. The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. If at least one
area is designated for 16-bit access in ABWCR, the bus mode switches to 16 bits.
3.4.6
Mode 7
This mode operates using the on-chip ROM, RAM, and registers. All I/O ports are available.
Mode 7 supports a 1-Mbyte address space.
Products with on-chip flash memory support on-board programming which enables programming
of the flash memory.
Rev. 2.0, 06/04, page 65 of 980
3.5
Pin Functions in Each Operating Mode
The pin functions of ports 1 to 5, A and port 67 vary depending on the operating mode. Table 3.3
indicates their functions in each operating mode.
Table 3.3
Port
Pin Functions in Each Mode
Mode 1
Mode 2
Mode 3
Mode 4
Mode 5
Mode 7
2
P17 to P10
P27 to P20
Port 1
A7 to A0
A7 to A0
A7 to A0
A7 to A0
P17 to P10*
Port 2
A15 to A8
A15 to A8
A15 to A8
A15 to A8
P27 to P20*2
Port 3
D15 to D8
D15 to D8
D15 to D8
D15 to D8
D15 to D8
P37 to P30
Port 4
P47 to P40*1
D7 to D0*1
P47 to P40*1
D7 to D0*1
P47 to P40*1
P47 to P40
Port 5
A19 to A16
A19 to A16
A19 to A16
A19 to A16
P53 to P50*2
P53 to P50
Port 67
φ*
φ*
φ*
φ*
φ*
P67 *5
Port A
5
PA7 to PA4
5
PA7 to PA4
5
PA6 to PA4,
A20*3
5
PA6 to PA4,
A20*3
5
PA7 to PA4*
4
PA7 to PA4
Notes: *1 Initial state. The bus mode can be switched by settings in ABWCR. These pins function
as P47 to P40 in 8-bit bus mode, and as D7 to D0 in 16-bit bus mode.
*2 Initial state. These pins become address output pins when the corresponding bits in the
data direction registers (P1DDR, P2DDR, P5DDR) are set to 1.
*3 Initial state. A20 is always an address output pin. PA6 to PA4 are switched over to A23 to
A21 output by writing 0 in bits 7 to 5 of BRCR.
*4 Initial state. PA7 to PA4 are switched over to A23 to A20 output by writing 0 in bits 7 to 4 of
BRCR.
*5 Initial state. In modes 1 to 5 φ12 can be set as P67 by writing 1 to bit 7 in MSTCRH. In
mode 7 P67 can be set to φ output by writing 0 to bit 7 in MSTCRH.
Rev. 2.0, 06/04, page 66 of 980
3.6
Memory Map in Each Operating Mode
Figures 3.1 and 3.2 show memory maps of the H8/3029. The address space is divided into eight
areas.
The EMC bit in BCR can be read and written to select either of the two memory maps. For details,
see section 6.2.5, Bus Control Register (BCR).
The initial bus mode differs between modes 1 and 2, and also between modes 3 and 4.
The address locations of the on-chip RAM and on-chip registers differ between the 1-Mbyte
modes (modes 1, 2, and 7), and the 16-Mbyte modes (modes 3, 4, and 5). The address range
specifiable by the CPU in the 8- and 16-bit absolute addressing modes (@aa:8 and @aa:16) also
differs.
3.6.1
Note on Reserved Areas
The H8/3029 memory map includes reserved areas to which read/write access is prohibited. Note
that normal operation is not guaranteed if the following reserved areas are accessed.
• The reserved area in the internal I/O register space.
The H8/3029 internal I/O register space includes a reserved area to which access is prohibited.
For details see appendix B, Internal I/O Registers.
Rev. 2.0, 06/04, page 67 of 980
H'1FFFF
H'20000
H'3FFFF
H'40000
H'5FFFF
H'60000 External address
space
H'7FFFF
H'80000
H'9FFFF
H'A0000
H'BFFFF
H'C0000
H'DFFFF
H'E0000
H'EE0FF
H'F8000
H'FBF1F
H'FBF20
H'FFF1F
H'FFF20
H'FFFE9
H'FFFEA
H'FFFFF
H'1FFFFF
H'200000
Area 1
Area 1
Area 2
H'3FFFFF
H'400000
Area 3
Area 2
Area 4
H'5FFFFF
H'600000
Area 5
Area 6
H'7FFFFF
H'800000
Area 7
Internal I/O
registers (2)
External
address
space
External
address
space
Area 3
Area 4
H'9FFFFF
H'A00000
External address
space
On-chip RAM*
16-bit absolute
addresses
Area 0
Area 0
Internal I/O
registers (1)
H'FFF00
H'0000FF
H'007FFF
Area 5
16-bit absolute addresses
H'EE000
Vector area
H'BFFFFF
H'C00000
Area 6
H'DFFFFF
H'E00000
H'FEE000
Area 7
Internal I/O
registers (1)
H'FEE0FF
H'FF8000
External address
space
On-chip RAM*
H'FFFF00
H'FFFF1F
H'FFFF20
H'FFFFE9
H'FFFFEA
H'FFFFFF
Internal I/O
registers (2)
External
address
space
8-bit absolute addresses
H'FFBF1F
H'FFBF20
16-bit absolute addresses
H'07FFF
H'000000
16-bit absolute
addresses
H'000FF
Memory-indirect
branch addresses
Vector area
8-bit absolute addresses
H'00000
Memory-indirect
branch addresses
Modes 3 and 4
(16-Mbyte expanded modes with
on-chip ROM disabled)
Modes 1 and 2
(1-Mbyte expanded modes with
on-chip ROM disabled)
Note: * External addresses can be accessed by disabling on-chip RAM.
Figure 3.1(1) H8/3029 Memory Map in Each Operating Mode (EMC = 1)
Rev. 2.0, 06/04, page 68 of 980
On-chip ROM
H'007FFF
H'07FFFF
H'080000
H'1FFFFF
H'200000
H'3FFFFF
H'400000
H'5FFFFF
H'600000 External address
space
H'7FFFFF
H'800000
H'9FFFFF
H'A00000
H'BFFFFF
H'C00000
H'DFFFFF
H'E00000
H'00000
Vector area
H'000FF
On-chip ROM
H'07FFF
Area 0
16-bit absolute
addresses
H'0000FF
Mode 7
(single-chip advanced mode)
Memory-indirect
branch addresses
Vector area
16-bit absolute
addresses
H'000000
Memory-indirect
branch addresses
Mode 5
(16-Mbyte expanded mode with
on-chip ROM enabled)
H'7FFFF
Area 1
Area 2
Area 3
Area 4
Area 5
H'EE000
Area 6
Area 7
Internal I/O
registers (1)
H'EE0FF
H'FEE0FF
H'FFFFE9
H'FFFFEA
H'FFFFFF
Internal I/O
registers (2)
External
address
space
On-chip RAM
H'FFF00
16-bit absolute addresses
H'FFBF1F
H'FFBF20 On-chip RAM*1
H'FFFF00
H'FFFF1F
H'FFFF20
H'FBF20
External address
space*2
8-bit absolute addresses
H'FF8000
H'FFF1F
H'FFF20
H'FFFE9
H'FFFFF
Internal I/O
registers(2)
16-bit absolute addresses
H'F8000
Internal I/O
registers (1)
8-bit absolute addresses
H'FEE000
Note: *1 External addresses can be accessed by disabling on-chip RAM.
*2 User cannot use the address area from H'FF7000 to H'FF7FFF in 16-Mbyte address
mode because this address area (H'FF7000 to H'FF7FFF ) is used by the E10T.
Figure 3.1(2) H8/3029 Memory Map in Each Operating Mode (EMC = 1)
Rev. 2.0, 06/04, page 69 of 980
H'07FFF
H'0000FF
H'007FFF
Area 0
Area 0
H'1FFFFF
H'200000
Area 1
Area 2
External address
space
Area 1
H'3FFFFF
H'400000
Area 3
Area 4
Area 2
H'5FFFFF
H'600000
Area 5
External address Area 3
space
Area 6
Area 7
H'7FFFFF
H'800000
H'EE000
Area 4
Internal I/O
registers (1)
H'9FFFFF
H'A00000
External address
space
Area 5
H'F8000
H'FBEDF
H'FBEE0
On-chip RAM*
Internal I/O
registers (2)
H'FFEFF
H'FFF00 External address
space
H'FFF7F
H'FFF80
On-chip RAM*
H'FFFDF
H'FFFE0
Internal I/O
registers (3)
H'FFFFF
8-bit absolute
addresses
H'FFE7F
H'FFE80
16-bit absolute addresses
H'BFFFFF
H'C00000
Area 6
H'DFFFFF
H'E00000
Area 7
H'FEE000
H'FEE0FF
H'FF8000
Internal I/O
registers (1)
External address
space
H'FFBEDF
H'FFBEE0
On-chip RAM*
H'FFFE7F
H'FFFE80
Internal I/O
registers (2)
H'FFFEFF
H'FFFF00 External address
space
H'FFFF7F
H'FFFF80 On-chip RAM*
H'FFFFDF
Internal I/O
H'FFFFE0
registers (3)
H'FFFFFF
16-bit absolute addresses
H'EE0FF
Vector area
8-bit absolute addresses
H'1FFFF
H'20000
H'3FFFF
H'40000
H'5FFFF
H'60000
H'7FFFF
H'80000
H'9FFFF
H'A0000
H'BFFFF
H'C0000
H'DFFFF
H'E0000
H'000000
16-bit absolute
addresses
H'000FF
16-bit absolute
addresses
Vector area
Memory-indirect
branch addresses
H'00000
Memory-indirect
branch addresses
Modes 3 and 4
(16-Mbyte expanded modes with
on-chip ROM disabled)
Modes 1 and 2
(1-Mbyte expanded modes with
on-chip ROM disabled)
Note: * This area becomes external address space when on-chip RAM is disabled.
Figure 3.2(1) H8/3029 Memory Map in Each Operating Mode (EMC = 0)
Rev. 2.0, 06/04, page 70 of 980
On-chip ROM
H'007FFF
Vector area
H'000FF
On-chip ROM
H'07FFF
16-bit absolute
addresses
H'0000FF
H'00000
Memory-indirect
branch addresses
Vector area
Mode 7
(single-chip advanced mode)
16-bit absolute
addresses
H'000000
Memory-indirect
branch addresses
Mode 5
(16-Mbyte expanded mode with
on-chip ROM enabled)
H'07FFFF
H'080000
H'7FFFF
Area 0
H'1FFFFF
H'200000
Area 1
H'3FFFFF
H'400000
External address Area 2
space
H'5FFFFF
H'600000
Area 3
H'7FFFFF
H'800000
H'EE000
Area 4
H'9FFFFF
H'A00000
H'EE0FF
Area 5
H'FBEE0
Area 6
On-chip RAM*1
H'DFFFFF
H'E00000
H'FFE7F
H'FFE80
Area 7
H'FFF80
On-chip RAM*1
External address
space*2
H'FFFDF
H'FFFE0
H'FFBEDF
H'FFBEE0
H'FFFFF
H'FFFE7F
H'FFFE80
Internal I/O
registers (2)
H'FFFEFF
H'FFFF00 External address
space
H'FFFF7F
H'FFFF80
On-chip RAM*1
H'FFFFDF
H'FFFFE0
Internal I/O
registers (3)
H'FFFFFF
8-bit absolute addresses
On-chip RAM*1
Internal I/O
registers (3)
8-bit absolute
addresses
H'FF8000
H'FFEFF
Internal I/O
registers (1)
16-bit absolute addresses
H'FEE0FF
Internal I/O
registers (2)
16-bit absolute addresses
H'F8000
H'BFFFFF
H'C00000
H'FEE000
Internal I/O
registers (1)
Note: *1 This area becomes external address space when on-chip RAM is disabled.
*2 User cannot use the address area from H'FF7000 to H'FF7FFF in 16-Mbyte address
mode because this address area (H'FF7000 to H'FF7FFF ) is used by the E10T.
Figure 3.2(2) H8/3029 Memory Map in Each Operating Mode (EMC = 0)
Rev. 2.0, 06/04, page 71 of 980
Rev. 2.0, 06/04, page 72 of 980
Section 4 Exception Handling
4.1
Overview
4.1.1
Exception Handling Types and Priority
As table 4.1 indicates, exception handling may be caused by a reset, trap instruction, or interrupt.
Exception handling is prioritized as shown in table 4.1. If two or more exceptions occur
simultaneously, they are accepted and processed in priority order. Trap instruction exceptions are
accepted at all times in the program execution state.
Table 4.1
Exception Types and Priority
Priority Exception Type
Start of Exception Handling
High
Reset
Starts immediately after a low-to-high transition at the RES pin
Interrupt
Interrupt requests are handled when execution of the current
instruction or handling of the current exception is completed
Low
4.1.2
Trap instruction (TRAPA) Started by execution of a trap instruction (TRAPA)
Exception Handling Operation
Exceptions originate from various sources. Trap instructions and interrupts are handled as follows.
1. The program counter (PC) and condition code register (CCR) are pushed onto the stack.
2. The CCR interrupt mask bit is set to 1.
3.
A vector address corresponding to the exception source is generated, and program execution
starts from that address.
Note: For a reset exception, steps 2 and 3 above are carried out.
Rev. 2.0, 06/04, page 73 of 980
4.1.3
Exception Vector Table
The exception sources are classified as shown in figure 4.1. Different vectors are assigned to
different exception sources. Table 4.2 lists the exception sources and their vector addresses.
• Reset
External interrupts: NMI, IRQ 0 to IRQ5
Exception
sources
• Interrupts
• Trap instruction
Internal interrupts: 36 interrupts from on-chip
supporting modules
Figure 4.1 Exception Sources
Rev. 2.0, 06/04, page 74 of 980
Table 4.2
Exception Vector Table
Vector Address*1
Exception Source
Vector Number
Advanced Mode
Normal Mode*3
Reset
0
H'0000 to H'0003
H'0000 to H'0001
Reserved for system use
1
H'0004 to H'0007
H'0002 to H'0003
2
H'0008 to H'000B
H'0004 to H'0005
3
H'000C to H'000F
H'0006 to H'0007
4
H'0010 to H'0013
H'0008 to H'0009
5
H'0014 to H'0017
H'000A to H'000B
6
H'0018 to H'001B
H'000C to H'000D
External interrupt (NMI)
7
H'001C to H'001F
H'000E to H'000F
Trap instruction (4 sources)
8
H'0020 to H'0023
H'0010 to H'0011
9
H'0024 to H'0027
H'0012 to H'0013
10
H'0028 to H'002B
H'0014 to H'0015
11
H'002C to H'002F
H'0016 to H'0017
External interrupt IRQ0
12
H'0030 to H'0033
H'0018 to H'0019
External interrupt IRQ1
13
H'0034 to H'0037
H'001A to H'001B
External interrupt IRQ2
14
H'0038 to H'003B
H'001C to H'001D
External interrupt IRQ3
15
H'003C to H'003F
H'001E to H'001F
External interrupt IRQ4
16
H'0040 to H'0043
H'0020 to H'0021
External interrupt IRQ5
17
H'0044 to H'0047
H'0022 to H'0023
Reserved for system use
18
H'0048 to H'004B
H'0024 to H'0025
19
H'004C to H'004F
H'0026 to H'0027
20
to
63
H'0050 to H'0053
to
H'00FC to H'00FF
H'0028 to H'0029
to
H'007E to H'007F
Internal interrupts*2
Notes: *1 Lower 16 bits of the address.
*2 For the internal interrupt vectors, see section 5.3.3, Interrupt Vector Table.
*3 Cannot be selected in H8/3029.
Rev. 2.0, 06/04, page 75 of 980
4.2
Reset
4.2.1
Overview
A reset is the highest-priority exception. When the RES pin goes low, all processing halts and the
chip enters the reset state. A reset initializes the internal state of the CPU and the registers of the
on-chip supporting modules. Reset exception handling begins when the RES pin changes from
low to high.
The chip can also be reset by overflow of the watchdog timer. For details see section 12,
Watchdog Timer.
4.2.2
Reset Sequence
The chip enters the reset state when the RES pin goes low.
To ensure that the chip is reset, hold the RES pin low for at least 20 ms at power-up. To reset the
chip during operation, hold the RES pin low for at least 20 system clock (φ) cycles. See appendix
D.2, Pin States at Reset, for the states of the pins in the reset state.
When the RES pin goes high after being held low for the necessary time, the chip starts reset
exception handling as follows.
• The internal state of the CPU and the registers of the on-chip supporting modules are
initialized, and the I bit is set to 1 in CCR.
• The contents of the reset vector address (H'0000 to H'0003 in advanced mode, H'0000 to
H'0001 in normal mode) are read, and program execution starts from the address indicated in
the vector address.
Note : The normal mode cannot be selected in the H8/3029
Figure 4.2 shows the reset sequence in modes 1 and 3. Figure 4.3 shows the reset sequence in
modes 2 and 4.
• After power is turned on, hold the RES pin low and the STBY pin high.
Rev. 2.0, 06/04, page 76 of 980
Figure 4.2 Reset Sequence (Modes 1 and 3)
Rev. 2.0, 06/04, page 77 of 980
(2)
(4)
(3)
(6)
(5)
(8)
(7)
Internal
processing
Address of reset vector: (1) = H'000000, (3) = H'000001, (5) = H'000002, (7) = H'000003
Start address (contents of reset exception handling vector address)
Start address
First instruction of program
High
(1)
Note: After a reset, the wait-state controller inserts three wait states in every bus cycle.
(1), (3), (5), (7)
(2), (4), (6), (8)
(9)
(10)
D15 to D8
HWR , LWR
RD
Address
bus
RES
φ
Vector fetch
(10)
(9)
Prefetch of
first program
instruction
Internal
processing
Vector fetch
Prefetch of first
program instruction
φ
RES
Address bus
(1)
(3)
(5)
RD
HWR , LWR
High
(2)
D15 to D0
(1), (3)
(2), (4)
(5)
(6)
(4)
(6)
Address of reset vector: (1) = H'000000, (3) = H'000002
Start address (contents of reset exception handling vector address)
Start address
First instruction of program
Note: After a reset, the wait-state controller inserts three wait states in every bus cycle.
Figure 4.3 Reset Sequence (Modes 2 and 4)
4.2.3
Interrupts after Reset
If an interrupt is accepted after a reset but before the stack pointer (SP) is initialized, PC and CCR
will not be saved correctly, leading to a program crash. To prevent this, all interrupt requests,
including NMI, are disabled immediately after a reset. The first instruction of the program is
always executed immediately after the reset state ends. This instruction should initialize the stack
pointer (example: MOV.L #xx:32, SP).
Rev. 2.0, 06/04, page 78 of 980
4.3
Interrupts
Interrupt exception handling can be requested by seven external sources (NMI, IRQ0 to IRQ5), and
36 internal sources in the on-chip supporting modules. Figure 4.4 classifies the interrupt sources
and indicates the number of interrupts of each type.
The on-chip supporting modules that can request interrupts are the watchdog timer (WDT),
DRAM interface, 16-bit timer, 8-bit timer, DMA controller (DMAC), serial communication
interface (SCI), and A/D converter. Each interrupt source has a separate vector address.
NMI is the highest-priority interrupt and is always accepted*. Interrupts are controlled by the
interrupt controller. The interrupt controller can assign interrupts other than NMI to two priority
levels, and arbitrate between simultaneous interrupts. Interrupt priorities are assigned in interrupt
priority registers A and B (IPRA and IPRB) in the interrupt controller.
Note: * NMI input is sometimes disabled when flash memory is being programmed or erased. For
details see section 18.4.5 Flash Vector Address Control Register (FVACR).
For details on interrupts see section 5, Interrupt Controller.
External interrupts
NMI (1)
IRQ 0 to IRQ 5 (6)
Internal interrupts
WDT*1 (1)
DRAM interface*2 (1)
16-bit timer (9)
8-bit timer (8)
DMAC (4)
SCI (12)
A/D converter (1)
Interrupts
Notes: Numbers in parentheses are the number of interrupt sources.
*1 When the watchdog timer is used as an interval timer, it generates an interrupt request
at every counter overflow.
*2 When the DRAM interface is used as an interval timer, it generates an interrupt request
at compare match.
Figure 4.4 Interrupt Sources and Number of Interrupts
Rev. 2.0, 06/04, page 79 of 980
4.4
Trap Instruction
Trap instruction exception handling starts when a TRAPA instruction is executed. If the UE bit is
set to 1 in the system control register (SYSCR), the exception handling sequence sets the I bit to 1
in CCR. If the UE bit is 0, the I and UI bits are both set to 1. The TRAPA instruction fetches a
start address from a vector table entry corresponding to a vector number from 0 to 3, which is
specified in the instruction code.
Rev. 2.0, 06/04, page 80 of 980
4.5
Stack Status after Exception Handling
Figure 4.5 shows the stack after completion of trap instruction exception handling and interrupt
exception handling.
SP–4
SP–3
SP–2
SP–1
SP (ER7) →
SP (ER7) →
SP+1
SP+2
SP+3
SP+4
Stack area
Before exception handling
CCR
CCR*2
PC H
PC L
Even address
After exception handling
Pushed on stack
a. Normal mode*1
SP–4
SP–3
SP–2
SP–1
SP (ER7) →
SP (ER7) →
SP+1
SP+2
SP+3
SP+4
Stack area
Before exception handling
CCR
PC E
PC H
PC L
Even address
After exception handling
Pushed on stack
b. Advanced mode
Legend
PCE: Bits 23 to 16 of program counter (PC)
PCH: Bits 15 to 8 of program counter (PC)
PCL: Bits 7 to 0 of program counter (PC)
CCR: Condition code register
SP: Stack pointer
Notes: *1 Cannot be selected in H8/3029
*2 Ignored at return.
1. PC indicates the address of the first instruction that will be executed after return.
2. Registers must be saved in word or longword size at even addresses.
Figure 4.5 Stack after Completion of Exception Handling
Rev. 2.0, 06/04, page 81 of 980
4.6
Notes on Stack Usage
When accessing word data or longword data, the H8/3029 regards the lowest address bit as 0. The
stack should always be accessed by word access or longword access, and the value of the stack
pointer (SP, ER7) should always be kept even.
Use the following instructions to save registers:
PUSH.W Rn
(or MOV.W Rn, @–SP)
PUSH.L ERn
(or MOV.L ERn, @–SP)
Use the following instructions to restore registers:
POP.W Rn
(or MOV.W @SP+, Rn)
POP.L ERn
(or MOV.L @SP+, ERn)
Setting SP to an odd value may lead to a malfunction. Figure 4.6 shows an example of what
happens when the SP value is odd.
Rev. 2.0, 06/04, page 82 of 980
SP
CCR
R1L
SP
H'FFFEFA
H'FFFEFB
PC
PC
H'FFFEFC
H'FFFEFD
H'FFFEFF
SP
TRAPA instruction executed
SP set to H'FFFEFF
MOV. B R1L, @-ER7
Data saved above SP
CCR contents lost
Legend
CCR: Condition code register
PC: Program counter
R1L: General register R1L
SP: Stack pointer
Note: The diagram illustrates modes 3 and 4.
Figure 4.6 Operation when SP Value is Odd
Rev. 2.0, 06/04, page 83 of 980
Rev. 2.0, 06/04, page 84 of 980
Section 5 Interrupt Controller
5.1
Overview
5.1.1
Features
The interrupt controller has the following features:
• Interrupt priority registers (IPRs) for setting interrupt priorities
Interrupts other than NMI can be assigned to two priority levels on a module-by-module basis
in interrupt priority registers A and B (IPRA and IPRB).
• Three-level masking by the I and UI bits in the CPU condition code register (CCR)
• Seven external interrupt pins
NMI has the highest priority and is always accepted*; either the rising or falling edge can be
selected. For each of IRQ0 to IRQ5, sensing of the falling edge or level sensing can be selected
independently.
Note: * NMI input is sometimes disabled when flash memory is being programmed or erased. For
details see section 18.4.5 Flash Vector Address Control Register (FVACR).
Rev. 2.0, 06/04, page 85 of 980
5.1.2
Block Diagram
Figure 5.1 shows a block diagram of the interrupt controller.
CPU
ISCR
IER
IPRA, IPRB
NMI
input
IRQ input
section ISR
IRQ input
OVF
TME
.
.
.
.
.
.
.
TEI
TEIE
Priority
decision logic
Interrupt
request
Vector
number
.
.
.
I
UI
Interrupt controller
UE
SYSCR
Legend
ISCR:
IER:
ISR:
IPRA:
IPRB:
SYSCR:
IRQ sense control register
IRQ enable register
IRQ status register
Interrupt priority register A
Interrupt priority register B
System control register
Figure 5.1 Interrupt Controller Block Diagram
Rev. 2.0, 06/04, page 86 of 980
CCR
5.1.3
Pin Configuration
Table 5.1 lists the interrupt pins.
Table 5.1
Interrupt Pins
Name
Abbreviation I/O
Nonmaskable interrupt
NMI
Input Nonmaskable interrupt*, rising edge or
falling edge selectable
External interrupt request 5 to 0
IRQ5 to IRQ0
Input Maskable interrupts, falling edge or level
sensing selectable
Note:
NMI input is sometimes disabled when flash memory is being programmed or erased.
For details see section 18.4.5, Flash Vector Address Control Register (FVACR).
*
5.1.4
Function
Register Configuration
Table 5.2 lists the registers of the interrupt controller.
Table 5.2
Address*
Interrupt Controller Registers
1
Name
Abbreviation
R/W
Initial Value
H'EE012
System control register
SYSCR
R/W
H'09
H'EE014
IRQ sense control register
ISCR
R/W
H'00
H'EE015
IRQ enable register
IER
R/W
H'00
2
H'EE016
IRQ status register
ISR
R/(W)*
H'00
H'EE018
Interrupt priority register A
IPRA
R/W
H'00
H'EE019
Interrupt priority register B
IPRB
R/W
H'00
Notes: *1 Lower 20 bits of the address in advanced mode.
*2 Only 0 can be written, to clear flags.
Rev. 2.0, 06/04, page 87 of 980
5.2
Register Descriptions
5.2.1
System Control Register (SYSCR)
SYSCR is an 8-bit readable/writable register that controls software standby mode, selects the
action of the UI bit in CCR, selects the NMI edge, and enables or disables the on-chip RAM.
Only bits 3 and 2 are described here. For the other bits, see section 3.3, System Control Register
(SYSCR).
SYSCR is initialized to H'09 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bit
7
6
5
4
3
2
1
0
SSBY
STS2
STS1
STS0
UE
NMIEG
SSOE
RAME
Initial value
0
0
0
0
1
0
0
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
RAM enable
Software standby
output port enable
Standby timer
select 2 to 0
Software standby
Rev. 2.0, 06/04, page 88 of 980
NMI edge select
Selects the NMI input edge
User bit enable
Selects whether to use the UI bit in
CCR as a user bit or interrupt mask bit
Bit 3—User Bit Enable (UE): Selects whether to use the UI bit in CCR as a user bit or an
interrupt mask bit.
Bit 3
UE
Description
0
UI bit in CCR is used as interrupt mask bit
1
UI bit in CCR is used as user bit
(Initial value)
Bit 2—NMI Edge Select (NMIEG): Selects the NMI input edge.
Bit 2
NMIEG
Description
0
Interrupt is requested at falling edge of NMI input
1
Interrupt is requested at rising edge of NMI input
5.2.2
(Initial value)
Interrupt Priority Registers A and B (IPRA, IPRB)
IPRA and IPRB are 8-bit readable/writable registers that control interrupt priority.
Rev. 2.0, 06/04, page 89 of 980
Interrupt Priority Register A (IPRA): IPRA is an 8-bit readable/writable register in which
interrupt priority levels can be set.
Bit
7
6
5
4
3
2
1
0
IPRA7
IPRA6
IPRA5
IPRA4
IPRA3
IPRA2
IPRA1
IPRA0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Priority
level A0
Selects the
priority level
of 16-bit timer
channel 2
interrupt
requests
Priority level A1
Selects the priority level
of 16-bit timer channel 1
interrupt requests
Priority level A2
Selects the priority level of
16-bit timer channel 0 interrupt
requests
Priority level A3
Selects the priority level of WDT,
DRAM interface, and A/D converter
interrupt requests
Priority level A4
Selects the priority level of IRQ 4 and IRQ 5
interrupt requests
Priority level A5
Selects the priority level of IRQ 2 and IRQ 3 interrupt requests
Priority level A6
Selects the priority level of IRQ 1 interrupt requests
Priority level A7
Selects the priority level of IRQ 0 interrupt requests
IPRA is initialized to H'00 by a reset and in hardware standby mode.
Rev. 2.0, 06/04, page 90 of 980
Bit 7—Priority Level A7 (IPRA7): Selects the priority level of IRQ0 interrupt requests.
Bit 7
IPRA7
Description
0
IRQ0 interrupt requests have priority level 0 (low priority)
1
IRQ0 interrupt requests have priority level 1 (high priority)
(Initial value)
Bit 6—Priority Level A6 (IPRA6): Selects the priority level of IRQ1 interrupt requests.
Bit 6
IPRA6
Description
0
IRQ1 interrupt requests have priority level 0 (low priority)
1
IRQ1 interrupt requests have priority level 1 (high priority)
(Initial value)
Bit 5—Priority Level A5 (IPRA5): Selects the priority level of IRQ2 and IRQ3 interrupt requests.
Bit 5
IPRA5
Description
0
IRQ2 and IRQ3 interrupt requests have priority level 0 (low priority)
1
IRQ2 and IRQ3 interrupt requests have priority level 1 (high priority)
(Initial value)
Bit 4—Priority Level A4 (IPRA4): Selects the priority level of IRQ4 and IRQ5 interrupt requests.
Bit 4
IPRA4
Description
0
IRQ4 and IRQ5 interrupt requests have priority level 0 (low priority)
1
IRQ4 and IRQ5 interrupt requests have priority level 1 (high priority)
(Initial value)
Rev. 2.0, 06/04, page 91 of 980
Bit 3—Priority Level A3 (IPRA3): Selects the priority level of WDT, DRAM interface, and A/D
converter interrupt requests.
Bit 3
IPRA3
Description
0
WDT, DRAM interface, and A/D converter interrupt requests have priority level 0
(low priority)
(Initial value)
1
WDT, DRAM interface, and A/D converter interrupt requests have priority level 1
(high priority)
Bit 2—Priority Level A2 (IPRA2): Selects the priority level of 16-bit timer channel 0 interrupt
requests.
Bit 2
IPRA2
Description
0
16-bit timer channel 0 interrupt requests have priority level 0 (low priority) (Initial value)
1
16-bit timer channel 0 interrupt requests have priority level 1 (high priority)
Bit 1—Priority Level A1 (IPRA1): Selects the priority level of 16-bit timer channel 1 interrupt
requests.
Bit 1
IPRA1
Description
0
16-bit timer channel 1 interrupt requests have priority level 0 (low priority) (Initial value)
1
16-bit timer channel 1 interrupt requests have priority level 1 (high priority)
Bit 0—Priority Level A0 (IPRA0): Selects the priority level of 16-bit timer channel 2 interrupt
requests.
Bit 0
IPRA0
Description
0
16-bit timer channel 2 interrupt requests have priority level 0 (low priority) (Initial value)
1
16-bit timer channel 2 interrupt requests have priority level 1 (high priority)
Rev. 2.0, 06/04, page 92 of 980
Interrupt Priority Register B (IPRB): IPRB is an 8-bit readable/writable register in which
interrupt priority levels can be set.
Bit
7
6
5
4
3
2
1
0
IPRB7
IPRB6
IPRB5
—
IPRB3
IPRB2
IPRB1
—
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reserved bit
Priority level B1
Selects the priority level
of SCI channel 2 interrupt
requests
Priority level B2
Selects the priority level of
SCI channel 1 interrupt requests
Priority level B3
Selects the priority level of SCI
channel 0 interrupt requests
Reserved bit
Priority level B5
Selects the priority level of DMAC
interrupt requests (channels 0 and 1)
Priority level B6
Selects the priority level of 8-bit timer channel 2, 3 interrupt requests
Priority level B7
Selects the priority level of 8-bit timer channel 0, 1 interrupt requests
IPRB is initialized to H'00 by a reset and in hardware standby mode.
Rev. 2.0, 06/04, page 93 of 980
Bit 7—Priority Level B7 (IPRB7): Selects the priority level of 8-bit timer channel 0, 1 interrupt
requests.
Bit 7
IPRB7
Description
0
8-bit timer channel 0, 1 interrupt requests have priority level 0 (low priority)(Initial value)
1
8-bit timer channel 0, 1 interrupt requests have priority level 1 (high priority)
Bit 6—Priority Level B6 (IPRB6): Selects the priority level of 8-bit timer channel 2, 3 interrupt
requests.
Bit 6
IPRB6
Description
0
8-bit timer channel 2, 3 interrupt requests have priority level 0 (low priority)(Initial value)
1
8-bit timer channel 2, 3 interrupt requests have priority level 1 (high priority)
Bit 5—Priority Level B5 (IPRB5): Selects the priority level of DMAC interrupt requests
(channels 0 and 1).
Bit 5
IPRB5
Description
0
DMAC interrupt requests (channels 0 and 1) have priority level 0
(low priority)
(Initial value)
1
DMAC interrupt requests (channels 0 and 1) have priority level 1 (high priority)
Bit 4—Reserved: This bit can be written and read, but it does not affect interrupt priority.
Rev. 2.0, 06/04, page 94 of 980
Bit 3—Priority Level B3 (IPRB3): Selects the priority level of SCI channel 0 interrupt requests.
Bit 3
IPRB3
Description
0
SCI channel 0 interrupt requests have priority level 0 (low priority)
1
SCI channel 0 interrupt requests have priority level 1 (high priority)
(Initial value)
Bit 2—Priority Level B2 (IPRB2): Selects the priority level of SCI channel 1 interrupt requests.
Bit 2
IPRB2
Description
0
SCI channel 1 interrupt requests have priority level 0 (low priority)
1
SCI channel 1 interrupt requests have priority level 1 (high priority)
(Initial value)
Bit 1—Priority Level B1 (IPRB1): Selects the priority level of SCI channel 2 interrupt requests.
Bit 1
IPRB1
Description
0
SCI channel 2 interrupt requests have priority level 0 (low priority)
1
SCI channel 2 interrupt requests have priority level 1 (high priority)
(Initial value)
Bit 0—Reserved: This bit can be written and read, but it does not affect interrupt priority.
Rev. 2.0, 06/04, page 95 of 980
5.2.3
IRQ Status Register (ISR)
ISR is an 8-bit readable/writable register that indicates the status of IRQ0 to IRQ5 interrupt
requests.
7
6
5
4
3
2
1
0
—
—
IRQ5F
IRQ4F
IRQ3F
IRQ2F
IRQ1F
IRQ0F
Initial value
0
0
0
0
0
0
0
0
Read/Write
—
—
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
Bit
Reserved bits
IRQ 5 to IRQ0 flags
These bits indicate IRQ 5 to IRQ 0
interrupt request status
Note: * Only 0 can be written, to clear flags.
ISR is initialized to H'00 by a reset and in hardware standby mode.
Bits 7 and 6—Reserved: These bits can not be modified and are always read as 0.
Bits 5 to 0—IRQ5 to IRQ0 Flags (IRQ5F to IRQ0F): These bits indicate the status of IRQ5 to
IRQ0 interrupt requests.
Bits 5 to 0
IRQ5F to IRQ0F Description
0
[Clearing conditions]
(Initial value)
0 is written in IRQnF after reading the IRQnF flag when IRQnF = 1.
IRQnSC = 0, IRQn input is high, and interrupt exception handling is carried out.
IRQnSC = 1 and IRQn interrupt exception handling is carried out.
1
[Setting conditions]
IRQnSC = 0 and IRQn input is low.
IRQnSC = 1 and IRQn input changes from high to low.
Note: n = 5 to 0
Rev. 2.0, 06/04, page 96 of 980
5.2.4
IRQ Enable Register (IER)
IER is an 8-bit readable/writable register that enables or disables IRQ5 to IRQ0 interrupt requests.
Bit
7
6
5
4
3
2
1
0
—
—
IRQ5E
IRQ4E
IRQ3E
IRQ2E
IRQ1E
IRQ0E
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reserved bits
IRQ 5 to IRQ0 enable
These bits enable or disable IRQ 5 to IRQ 0 interrupts
IER is initialized to H'00 by a reset and in hardware standby mode.
Bits 7 and 6—Reserved: These bits can be written and read, but they do not enable or disable
interrupts.
Bits 5 to 0—IRQ5 to IRQ0 Enable (IRQ5E to IRQ0E): These bits enable or disable
IRQ5 to IRQ0 interrupts.
Bits 5 to 0
IRQ5E to IRQ0E Description
0
IRQ5 to IRQ0 interrupts are disabled
1
IRQ5 to IRQ0 interrupts are enabled
(Initial value)
Rev. 2.0, 06/04, page 97 of 980
5.2.5
IRQ Sense Control Register (ISCR)
ISCR is an 8-bit readable/writable register that selects level sensing or falling-edge sensing of the
inputs at pins IRQ5 to IRQ0.
Bit
7
6
—
—
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reserved bits
5
4
3
2
1
0
IRQ5SC IRQ4SC IRQ3SC IRQ2SC IRQ1SC IRQ0SC
IRQ 5 to IRQ0 sense control
These bits select level sensing or falling-edge
sensing for IRQ 5 to IRQ 0 interrupts
ISCR is initialized to H'00 by a reset and in hardware standby mode.
Bits 7 and 6—Reserved: These bits can be written and read, but they do not select level or
falling-edge sensing.
Bits 5 to 0—IRQ5 to IRQ0 Sense Control (IRQ5SC to IRQ0SC): These bits select whether
interrupts IRQ5 to IRQ0 are requested by level sensing of pins IRQ5 to IRQ0, or by falling-edge
sensing.
Bits 5 to 0
IRQ5SC to IRQ0SC Description
0
Interrupts are requested when IRQ5 to IRQ0 inputs are low
1
Interrupts are requested by falling-edge input at IRQ5 to IRQ0
Rev. 2.0, 06/04, page 98 of 980
(Initial value)
5.3
Interrupt Sources
The interrupt sources include external interrupts (NMI, IRQ0 to IRQ5) and 36 internal interrupts.
5.3.1
External Interrupts
There are seven external interrupts: NMI and IRQ0 to IRQ5. Of these, NMI, IRQ0, IRQ1, and IRQ2
can be used to exit software standby mode.
NMI: NMI is the highest-priority interrupt and is always accepted, regardless of the states of the I
and UI bits in CCR*. The NMIEG bit in SYSCR selects whether an interrupt is requested by the
rising or falling edge of the input at the NMI pin. NMI interrupt exception handling has vector
number 7.
Note: * NMI input is sometimes disabled when flash memory is being programmed or erased. For
details see section 18.4.5, Flash Vector Address Control Register (FVACR).
IRQ0 to IRQ5 Interrupts: These interrupts are requested by input signals at pins IRQ0 to IRQ5.
The IRQ0 to IRQ5 interrupts have the following features.
• ISCR settings can select whether an interrupt is requested by the low level of the input at pins
IRQ0 to IRQ5, or by the falling edge.
• IER settings can enable or disable the IRQ0 to IRQ5 interrupts. Interrupt priority levels can be
assigned by four bits in IPRA (IPRA7 to IPRA4).
• The status of IRQ0 to IRQ5 interrupt requests is indicated in ISR. The ISR flags can be cleared
to 0 by software.
Figure 5.2 shows a block diagram of interrupts IRQ0 to IRQ5.
IRQnSC
IRQnE
IRQnF
Edge/level
sense circuit
IRQn
input
S
Q
IRQn interrupt
request
R
Clear signal
Note: n = 5 to 0
Figure 5.2 Block Diagram of Interrupts IRQ0 to IRQ5
Rev. 2.0, 06/04, page 99 of 980
Figure 5.3 shows the timing of the setting of the interrupt flags (IRQnF).
φ
IRQn
input pin
IRQnF
Note: n = 5 to 0
Figure 5.3 Timing of Setting of IRQnF
Interrupts IRQ0 to IRQ5 have vector numbers 12 to 17. These interrupts are detected regardless of
whether the corresponding pin is set for input or output. When using a pin for external interrupt
input, clear its DDR bit to 0 and do not use the pin for chip select output, refresh output, SCI
input/output, or A/D external trigger input.
5.3.2
Internal Interrupts
Thirty-Six internal interrupts are requested from the on-chip supporting modules.
• Each on-chip supporting module has status flags for indicating interrupt status, and enable bits
for enabling or disabling interrupts.
• Interrupt priority levels can be assigned in IPRA and IPRB.
• 16-bit timer, SCI, and A/D converter interrupt requests can activate the DMAC, in which case
no interrupt request is sent to the interrupt controller, and the I and UI bits are disregarded.
5.3.3
Interrupt Vector Table
Table 5.3 lists the interrupt sources, their vector addresses, and their default priority order. In the
default priority order, smaller vector numbers have higher priority. The priority of interrupts other
than NMI can be changed in IPRA and IPRB. The priority order after a reset is the default order
shown in table 5.3.
Rev. 2.0, 06/04, page 100 of 980
Table 5.3
Interrupt Sources, Vector Addresses, and Priority
Interrupt Source
Origin
NMI
External
pins
Vector Address*1
Vector
Number Advanced Mode Normal Mode*2
IPR
7
H'001C to H'001F H'000E to H'000F —
12
H'0030 to H'0033
H'0018 to H'0019
IRQ1
13
H'0034 to H0037
H'001A to H'001B IPRA6
IRQ2
IRQ3
14
15
H'0038 to H'003B H'001C to H'001D IPRA5
H'003C to H'003F H'001E to H'001F
IRQ4
IRQ5
16
17
H'0040 to H'0043
H'0044 to H'0047
18
19
H'0048 to H'004B H'0024 to H'0025
H'004C to H'004F H'0026 to H'0027
IRQ0
Reserved
—
H'0020 to H'0021
H'0022 to H'0023
WOVI
(interval timer)
Watchdog
timer
20
H'0050 to H'0053
H'0028 to H'0029
CMI
(compare match)
DRAM
interface
21
H'0054 to H'0057
H'002A to H'002B
Reserved
—
22
H'0058 to H'005B H'002C to H'002D
ADI (A/D end)
A/D
23
H'005C to H'005F H'002E to H'002F
IMIA0
(compare match/
input capture A0)
IMIB0
(compare match/
input capture B0)
OVI0 (overflow 0)
16-bit timer 24
channel 0
H'0060 to H'0063
H'0030 to H'0031
25
H'0064 to H'0067
H'0032 to H'0033
26
H'0068 to H'006B H'0034 to H'0035
Reserved
—
27
H'006C to H'006F H'0036 to H'0037
IMIA1
(compare match/
inputcapture A1)
IMIB1
(compare match/
input capture B1)
OVI1 (overflow 1)
16-bit timer 28
channel 1
H'0070 to H'0073
H'0038 to H'0039
29
H'0074 to H'0077
H'003A to H'003B
30
H'0078 to H'007B H'003C to H'003D
Reserved
—
31
H'007C to H'007F H'003E to H'003F
Priority
High
IPRA7
IPRA4
IPRA3
IPRA2
IPRA1
Low
Notes: *1 Lower 16 bits of the address.
*2 Cannot be selected in H8/3029.
Rev. 2.0, 06/04, page 101 of 980
Vector Address*1
Vector
Number Advanced Mode Normal Mode*2
Interrupt Source
Origin
IMIA2
(compare match/
input capture A2)
IMIB2
(compare match/
input capture B2)
OVI2 (overflow 2)
16-bit timer 32
channel 2
H'0080 to H'0083
H'0040 to H'0041
33
H'0084 to H'0087
H'0042 to H'0043
34
H'0088 to H'008B H'0044 to H'0045
Reserved
—
35
H'008C to H'008F H'0046 to H'0047
CMIA0
(compare match
A0)
CMIB0
(compare match
B0)
CMIA1/CMIB1
(compare match
A1/B1)
TOVI0/TOVI1
(overflow 0/1)
8-bit timer 36
channel 0/1
H'0090 to H'0093
H'0048 to H'0049
37
H'0094 to H'0097
H'004A to H'004B
38
H'0098 to H'009B H'004C to H'004D
39
H'009C to H'009F H'004E to H'004F
CMIA2
(compare match
A2)
CMIB2
(compare match
B2)
CMIA3/CMIB3
(compare match
A3/B3)
TOVI2/TOVI3
(overflow 2/3)
8-bit timer 40
channel 2/3
H'00A0 to H'00A3 H'0050 to H'0051
41
H'00A4 to H'00A7 H'0052 to H'0053
42
H'00A8 to H'00AB H'0054 to H'0055
43
H'00AC to H'00AF H'0056 to H'0057
DEND0A
DEND0B
DEND1A
DEND1B
DMAC
44
45
46
47
H'00B0 to H'00B3
H'00B4 to H'00B7
H'00B8 to H'00BB
H'00BC to H'00BF
H'0058 to H'0059 IPRB5
H'005A to H'005B
H'005C to H'005D
H'005E to H'005F
Reserved
—
48
49
50
51
H'00C0 to H'00C3
H'00C4 to H'00C7
H'00C8 to H'00CB
H'00CC to H'00CF
H'0060 to H'0061 —
H'0062 to H'0063
H'0064 to H'0065
H'0066 to H'0067
Notes: *1 Lower 16 bits of the address.
*2 Cannot be selected in H8/3029.
Rev. 2.0, 06/04, page 102 of 980
IPR
Priority
IPRA0
High
IPRB7
IPRB6
Low
Interrupt Source
Origin
ERI0
(receive error 0)
RXI0 (receive
data full 0)
TXI0 (transmit
data empty 0)
TEI0
(transmit end 0)
SCI
channel 0
ERI1
(receive error 1)
RXI1 (receive
data full 1)
TXI1 (transmit
data empty 1)
TEI1 (transmit
end 1)
SCI
channel 1
ERI2
(receive error 2)
RXI2 (receive
data full 2)
TXI2 (transmit
data empty 2)
TEI2 (transmit
end 2)
SCI
channel 2
Vector Address*1
Vector
Number Advanced Mode Normal Mode*2
IPR
Priority
52
H'00D0 to H'00D3 H'0068 to H'0069
IPRB3
High
53
H'00D4 to H'00D7 H'006A to H'006B
54
H'00D8 to H'00DB H'006C to H'006D
55
H'00DC to H'00DF H'006E to H'006F
56
H'00E0 to H'00E3 H'0070 to H'0071
57
H'00E4 to H'00E7 H'0072 to H'0073
58
H'00E8 to H'00EB H'0074 to H'0075
59
H'00EC to H'00EF H'0076 to H'0077
60
H'00F0 to H'00F3 H'0078 to H'0079
61
H'00F4 to H'00F7 H'007A to H'007B
62
H'00F8 to H'00FB H'007C to H'007D
63
H'00FC to H'00FF H'007E to H'007F
IPRB2
IPRB1
Low
Notes: *1 Lower 16 bits of the address.
*2 Cannot be selected in H8/3029.
Rev. 2.0, 06/04, page 103 of 980
5.4
Interrupt Operation
5.4.1
Interrupt Handling Process
The H8/3029 handles interrupts differently depending on the setting of the UE bit. When UE = 1,
interrupts are controlled by the I bit. When UE = 0, interrupts are controlled by the I and UI bits.
Table 5.4 indicates how interrupts are handled for all setting combinations of the UE, I, and UI
bits.
NMI interrupts are always accepted except in the reset and hardware standby states*. IRQ
interrupts and interrupts from the on-chip supporting modules have their own enable bits.
Interrupt requests are ignored when the enable bits are cleared to 0.
Note: * NMI input is sometimes disabled. For details see section 18.4.5, Flash Vector Address
Control Register (FVACR).
Table 5.4
UE, I, and UI Bit Settings and Interrupt Handling
SYSCR
CCR
UE
I
UI
Description
1
0
—
All interrupts are accepted. Interrupts with priority level 1 have higher
priority.
1
—
No interrupts are accepted except NMI.
0
—
All interrupts are accepted. Interrupts with priority level 1 have higher
priority.
1
0
NMI and interrupts with priority level 1 are accepted.
1
No interrupts are accepted except NMI.
0
UE = 1: Interrupts IRQ0 to IRQ5 and interrupts from the on-chip supporting modules can all be
masked by the I bit in the CPU’s CCR. Interrupts are masked when the I bit is set to 1, and
unmasked when the I bit is cleared to 0. Interrupts with priority level 1 have higher priority.
Figure 5.4 is a flowchart showing how interrupts are accepted when UE = 1.
Rev. 2.0, 06/04, page 104 of 980
Program execution state
No
Interrupt requested?
Yes
Yes
NMI
No
No
Pending
Priority level 1?
Yes
IRQ 0
No
Yes
IRQ 1
IRQ 0
No
Yes
No
IRQ 1
Yes
No
Yes
TEI2
TEI2
Yes
Yes
No
I=0
Yes
Save PC and CCR
I ←1
Read vector address
Branch to interrupt
service routine
Figure 5.4 Process Up to Interrupt Acceptance when UE = 1
Rev. 2.0, 06/04, page 105 of 980
• If an interrupt condition occurs and the corresponding interrupt enable bit is set to 1, an
interrupt request is sent to the interrupt controller.
• When the interrupt controller receives one or more interrupt requests, it selects the highestpriority request, following the IPR interrupt priority settings, and holds other requests pending.
If two or more interrupts with the same IPR setting are requested simultaneously, the interrupt
controller follows the priority order shown in table 5.3.
• The interrupt controller checks the I bit. If the I bit is cleared to 0, the selected interrupt
request is accepted. If the I bit is set to 1, only NMI is accepted; other interrupt requests are
held pending.
• When an interrupt request is accepted, interrupt exception handling starts after execution of the
current instruction has been completed.
• In interrupt exception handling, PC and CCR are saved to the stack area. The PC value that is
saved indicates the address of the first instruction that will be executed after the return from
the interrupt service routine.
• Next the I bit is set to 1 in CCR, masking all interrupts except NMI.
• The vector address of the accepted interrupt is generated, and the interrupt service routine
starts executing from the address indicated by the contents of the vector address.
UE = 0: The I and UI bits in the CPU’s CCR and the IPR bits enable three-level masking of
IRQ0 to IRQ5 interrupts and interrupts from the on-chip supporting modules.
• Interrupt requests with priority level 0 are masked when the I bit is set to 1, and are unmasked
when the I bit is cleared to 0.
• Interrupt requests with priority level 1 are masked when the I and UI bits are both set to 1, and
are unmasked when either the I bit or the UI bit is cleared to 0.
For example, if the interrupt enable bits of all interrupt requests are set to 1, IPRA is set to
H'20, and IPRB is set to H'00 (giving IRQ2 and IRQ3 interrupt requests priority over other
interrupts), interrupts are masked as follows:
a. If I = 0, all interrupts are unmasked (priority order: NMI > IRQ2 > IRQ3 >IRQ0 …).
b. If I = 1 and UI = 0, only NMI, IRQ2, and IRQ3 are unmasked.
c. If I = 1 and UI = 1, all interrupts are masked except NMI.
Rev. 2.0, 06/04, page 106 of 980
Figure 5.5 shows the transitions among the above states.
I←0
a. All interrupts are
unmasked
I←0
b. Only NMI, IRQ 2 , and
IRQ 3 are unmasked
I ← 1, UI ← 0
Exception handling,
or I ← 1, UI ← 1
UI ← 0
Exception handling,
or UI ← 1
c. All interrupts are
masked except NMI
Figure 5.5 Interrupt Masking State Transitions (Example)
Figure 5.6 is a flowchart showing how interrupts are accepted when UE = 0.
• If an interrupt condition occurs and the corresponding interrupt enable bit is set to 1, an
interrupt request is sent to the interrupt controller.
• When the interrupt controller receives one or more interrupt requests, it selects the highestpriority request, following the IPR interrupt priority settings, and holds other requests pending.
If two or more interrupts with the same IPR setting are requested simultaneously, the interrupt
controller follows the priority order shown in table 5.3.
• The interrupt controller checks the I bit. If the I bit is cleared to 0, the selected interrupt
request is accepted regardless of its IPR setting, and regardless of the UI bit. If the I bit is set to
1 and the UI bit is cleared to 0, only NMI and interrupts with priority level 1 are accepted;
interrupt requests with priority level 0 are held pending. If the I bit and UI bit are both set to 1,
only NMI is accepted; all other interrupt requests are held pending.
• When an interrupt request is accepted, interrupt exception handling starts after execution of the
current instruction has been completed.
• In interrupt exception handling, PC and CCR are saved to the stack area. The PC value that is
saved indicates the address of the first instruction that will be executed after the return from
the interrupt service routine.
• The I and UI bits are set to 1 in CCR, masking all interrupts except NMI.
• The vector address of the accepted interrupt is generated, and the interrupt service routine
starts executing from the address indicated by the contents of the vector address.
Rev. 2.0, 06/04, page 107 of 980
Program execution state
No
Interrupt requested?
Yes
Yes
NMI
No
No
Pending
Priority level 1?
Yes
IRQ 0
No
IRQ 0
Yes
IRQ 1
No
Yes
No
IRQ 1
Yes
No
Yes
TEI2
TEI2
Yes
Yes
No
No
I=0
I=0
Yes
Yes
No
UI = 0
Yes
Save PC and CCR
I ← 1, UI ← 1
Read vector address
Branch to interrupt
service routine
Figure 5.6 Process Up to Interrupt Acceptance when UE = 0
Rev. 2.0, 06/04, page 108 of 980
(2)
(1)
(4)
High
(3)
Instruction Internal
prefetch
processing
(8)
(7)
(10)
(9)
(12)
(11)
Vector fetch
(14)
(13)
(6), (8)
PC and CCR saved to stack
(9), (11) Vector address
(10), (12) Starting address of interrupt service routine (contents of
vector address)
(13)
Starting address of interrupt service routine; (13) = (10), (12)
(14)
First instruction of interrupt service routine
(6)
(5)
Stack
Prefetch of
interrupt
Internal
service routine
processing instruction
Note: Mode 2, with program code and stack in external memory area accessed in two states via 16-bit bus.
Instruction prefetch address (not executed;
return address, same as PC contents)
(2), (4) Instruction code (not executed)
Instruction prefetch address (not executed)
(3)
SP – 2
(5)
SP – 4
(7)
(1)
D15 to D0
HWR , LWR
RD
Address
bus
Interrupt
request
signal
φ
Interrupt level
decision and wait
for end of instruction
Interrupt accepted
5.4.2
Interrupt Sequence
Figure 5.7 shows the interrupt sequence in mode 2 when the program code and stack are in an
external memory area accessed in two states via a 16-bit bus.
Figure 5.7 Interrupt Sequence
Rev. 2.0, 06/04, page 109 of 980
5.4.3
Interrupt Response Time
Table 5.5 indicates the interrupt response time from the occurrence of an interrupt request until
the first instruction of the interrupt service routine is executed.
Table 5.5
Interrupt Response Time
External Memory
No.
On-Chip
Memory
Item
1
8-Bit Bus
2 States
3 States
1
3 States
2
Maximum number
of states until end of
current instruction
1 to 23*
3
Saving PC and CCR
to stack
4
8
12*
4
4
6*
4
4
Vector fetch
4
8
12*
4
4
6*
4
4
4
6*
4
5,
6
4,
1 to 41* *
6
1 to 23*
2*
1
2*
1 to 27* *
2*
1
Interrupt priority
decision
5
2*
2 States
1
1
5
4,
1 to 25* *
2
4
8
12*
3
4
4
4
4
4
19 to 41
31 to 57
43 to 83
19 to 41
25 to 49
5
Instruction prefetch*
6
Internal processing*
Total
2*
16-Bit Bus
5
Notes: *1 1 state for internal interrupts.
*2 Prefetch after the interrupt is accepted and prefetch of the first instruction in the
interrupt service routine.
*3 Internal processing after the interrupt is accepted and internal processing after vector
fetch.
*4 The number of states increases if wait states are inserted in external memory access.
*5 The examples of DIVXS.W Rs,ERd, MULXS.W Rs,ERd.
*6 The examples of MOV.L @(d:24,ERs), ERd, MOV.L ERs,@(d:24,ERd).
Rev. 2.0, 06/04, page 110 of 980
5.5
Usage Notes
5.5.1
Contention between Interrupt and Interrupt-Disabling Instruction
When an instruction clears an interrupt enable bit to 0 to disable the interrupt, the interrupt is not
disabled until after execution of the instruction is completed. If an interrupt occurs while a BCLR,
MOV, or other instruction is being executed to clear its interrupt enable bit to 0, at the instant
when execution of the instruction ends the interrupt is still enabled, so its interrupt exception
handling is carried out. If a higher-priority interrupt is also requested, however, interrupt
exception handling for the higher-priority interrupt is carried out, and the lower-priority interrupt
is ignored. This also applies to the clearing of an interrupt flag to 0.
Figure 5.8 shows an example in which an IMIEA bit is cleared to 0 in the 16-bit timer's TISRA
register.
TISRA write cycle by CPU
IMIA exception handling
φ
Internal
address bus
TISRA address
Internal
write signal
IMIEA
IMIA
IMFA interrupt
signal
Figure 5.8 Contention between Interrupt and Interrupt-Disabling Instruction
This type of contention will not occur if the interrupt is masked when the interrupt enable bit or
flag is cleared to 0.
Rev. 2.0, 06/04, page 111 of 980
5.5.2
Instructions that Inhibit Interrupts
The LDC, ANDC, ORC, and XORC instructions inhibit interrupts. When an interrupt occurs, after
determining the interrupt priority, the interrupt controller requests a CPU interrupt. If the CPU is
currently executing one of these interrupt-inhibiting instructions, however, when the instruction is
completed the CPU always continues by executing the next instruction.
5.5.3
Interrupts during EEPMOV Instruction Execution
The EEPMOV.B and EEPMOV.W instructions differ in their reaction to interrupt requests.
When the EEPMOV.B instruction is executing a transfer, no interrupts are accepted until the
transfer is completed, not even NMI.
When the EEPMOV.W instruction is executing a transfer, interrupt requests other than NMI are
not accepted until the transfer is completed. If NMI is requested, NMI exception handling starts at
a transfer cycle boundary. The PC value saved on the stack is the address of the next instruction.
Programs should be coded as follows to allow for NMI interrupts during EEPMOV.W execution:
L1: EEPMOV.W
MOV.W R4,R4
BNE
L1
Rev. 2.0, 06/04, page 112 of 980
Section 6 Bus Controller
6.1
Overview
The H8/3029 has an on-chip bus controller (BSC) that manages the external address space divided
into eight areas. The bus specifications, such as bus width and number of access states, can be set
independently for each area, enabling multiple memories to be connected easily.
The bus controller also has a bus arbitration function that controls the operation of the internal bus
masters-the CPU, DMA controller (DMAC), and DRAM interface and can release the bus to an
external device.
6.1.1
Features
The features of the bus controller are listed below.
• Manages external address space in area units
 Manages the external space as eight areas (0 to 7) of 128 kbytes in 1-Mbyte modes, or 2
Mbytes in 16-Mbyte modes
 Bus specifications can be set independently for each area
 DRAM/burst ROM interfaces can be set
• Basic bus interface
 Chip select (CS0 to CS7) can be output for areas 0 to 7
 8-bit access or 16-bit access can be selected for each area
 Two-state access or three-state access can be selected for each area
 Program wait states can be inserted for each area
 Pin wait insertion capability is provided
• DRAM interface
 DRAM interface can be set for areas 2 to 5
 Row address/column address multiplexed output (8/9/10 bits)
 2-CAS byte access mode
 Burst operation (fast page mode)
 TP cycle insertion to secure RAS precharging time
 Choice of CAS-before-RAS refreshing or self-refreshing
• Burst ROM interface
 Burst ROM interface can be set for area 0
 Selection of two- or three-state burst access
Rev. 2.0, 06/04, page 113 of 980
• Idle cycle insertion
 An idle cycle can be inserted in case of an external read cycle between different areas
 An idle cycle can be inserted when an external read cycle is immediately followed by an
external write cycle
• Bus arbitration function
 A built-in bus arbiter grants the bus right to the CPU, DMAC, DRAM interface, or an
external bus master
• Other features
 Refresh counter (refresh timer) can be used as interval timer
 Choice of two address update modes
Rev. 2.0, 06/04, page 114 of 980
6.1.2
Block Diagram
Figure 6.1 shows a block diagram of the bus controller.
CS0 to CS7
ABWCR
ASTCR
BCR
Internal address bus
Area
decoder
Chip select
control signals
CSCR
Internal signals
ADRCR
Bus mode control signal
Bus size control signal
Bus control
circuit
Internal data bus
Access state control signal
Wait state
controller
WAIT
Wait request signal
WCRH
WCRL
Internal signals
CPU bus request signal
DMAC bus request signal
DRAM interface bus request signal
CPU bus acknowledge signal
DMAC bus acknowledge signal
DRAM interface bus acknowledge signal
BRCR
Bus arbiter
BACK
BREQ
DRAM interface
DRAM control
DRCRA
DRCRB
RTMCSR
RTCNT
Legend
ABWCR
ASTCR
WCRH
WCRL
BRCR
CSCR
DRCRA
DRCRB
RTMCSR
RTCNT
RTCOR
ADRCR
BCR
RTCOR
: Bus width control register
: Access state control register
: Wait control register H
: Wait control register L
: Bus release control register
: Chip select control register
: DRAM control register A
: DRAM control register B
: Refresh timer control/status register
: Refresh timer counter
: Refresh time constant register
: Address control register
: Bus control register
Figure 6.1 Block Diagram of Bus Controller
Rev. 2.0, 06/04, page 115 of 980
6.1.3
Pin Configuration
Table 6.1 summarizes the input/output pins of the bus controller.
Table 6.1
Bus Controller Pins
Name
Abbreviation
I/O
Function
Chip select 0 to 7
CS0 to CS7
Output
Strobe signals selecting areas 0 to 7
Address strobe
AS
Output
Strobe signal indicating valid address output
on the address bus
Read
RD
Output
Strobe signal indicating reading from the
external address space
High write
HWR
Output
Strobe signal indicating writing to the
external address space, with valid data on
the upper data bus (D15 to D8)
Low write
LWR
Output
Strobe signal indicating writing to the
external address space, with valid data on
the lower data bus (D7 to D0)
Wait
WAIT
Input
Wait request signal for access to external
three-state access areas
Bus request
BREQ
Input
Request signal for releasing the bus to an
external device
Bus acknowledge
BACK
Output
Acknowledge signal indicating release of the
bus to an external device
Rev. 2.0, 06/04, page 116 of 980
6.1.4
Register Configuration
Table 6.2 summarizes the bus controller's registers.
Table 6.2
Address*
Bus Controller Registers
1
Name
Abbreviation
R/W
Initial Value
H'EE020
Bus width control register
ABWCR
R/W
H'FF*
H'EE021
Access state control register
ASTCR
R/W
H'FF
H'EE022
Wait control register H
WCRH
R/W
H'FF
H'EE023
Wait control register L
WCRL
R/W
H'FF
H'EE013
Bus release control register
BRCR
R/W
H'FE*
H'EE01F
Chip select control register
CSCR
R/W
H'0F
H'EE01E
Address control register
ADRCR
R/W
H'FF
H'EE024
Bus control register
BCR
R/W
H'C6
H'EE026
DRAM control register A
DRCRA
R/W
H'10
H'EE027
DRAM control register B
DRCRB
R/W
R(W)*
3
H'08
4
H'EE028
Refresh timer control/status register
H'EE029
Refresh timer counter
RTCNT
R/W
H'00
H'EE02A
Refresh time constant register
RTCOR
R/W
H'FF
Notes: *1
*2
*3
*4
RTMCSR
2
H'07
Lower 20 bits of the address in advanced mode.
In modes 2 and 4, the initial value is H'00.
In modes 3 and 4, the initial value is H'EE.
For Bit 7, only 0 can be written to clear the flag.
Rev. 2.0, 06/04, page 117 of 980
6.2
Register Descriptions
6.2.1
Bus Width Control Register (ABWCR)
ABWCR is an 8-bit readable/writable register that selects 8-bit or 16-bit access for each area.
Bit
Modes
1, 3, 5,
and 7
Modes
2 and 4
Initial value
7
6
5
4
3
2
1
0
ABW7
ABW6
ABW5
ABW4
ABW3
ABW2
ABW1
ABW0
1
Read/Write R/W
Initial value
1
1
1
1
1
1
1
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
Read/Write R/W
When ABWCR contains H'FF (selecting 8-bit access for all areas), the chip operates in 8-bit bus
mode: the upper data bus (D15 to D8) is valid, and port 4 is an input/output port. When at least one
bit is cleared to 0 in ABWCR, the chip operates in 16-bit bus mode with a 16-bit data bus (D15 to
D0). In modes 1, 3, 5, and 7, ABWCR is initialized to H'FF by a reset and in hardware standby
mode. In modes 2 and 4, ABWCR is initialized to H'00 by a reset and in hardware standby mode.
It is not initialized in software standby mode.
Bits 7 to 0—Area 7 to 0 Bus Width Control (ABW7 to ABW0): These bits select 8-bit access
or 16-bit access for the corresponding areas.
Bits 7 to 0
ABW7 to ABW0
Description
0
Areas 7 to 0 are 16-bit access areas
1
Areas 7 to 0 are 8-bit access areas
ABWCR specifies the data bus width of external memory areas. The data bus width of on-chip
memory and registers is fixed, and does not depend on ABWCR settings. These settings are
therefore meaningless in the single-chip modes (mode 7).
Rev. 2.0, 06/04, page 118 of 980
6.2.2
Access State Control Register (ASTCR)
ASTCR is an 8-bit readable/writable register that selects whether each area is accessed in two
states or three states.
7
6
5
4
3
2
1
0
AST7
AST6
AST5
AST4
AST3
AST2
AST1
AST0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
Bit
R/W
R/W
Bits selecting number of states for access to each area
ASTCR is initialized to H'FF by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bits 7 to 0—Area 7 to 0 Access State Control (AST7 to AST0): These bits select whether the
corresponding area is accessed in two or three states.
Bits 7 to 0
AST7 to AST0
Description
0
Areas 7 to 0 are accessed in two states
1
Areas 7 to 0 are accessed in three states
(Initial value)
ASTCR specifies the number of states in which external areas are accessed. On-chip memory and
registers are accessed in a fixed number of states that does not depend on ASTCR settings. These
settings are therefore meaningless in the single-chip modes (mode 7).
When the corresponding area is designated as DRAM space by bits DRAS2 to DRAS0 in DRAM
control register A (DRCRA), the number of access states does not depend on the AST bit setting.
When an AST bit is cleared to 0, programmable wait insertion is not performed.
6.2.3
Wait Control Registers H and L (WCRH, WCRL)
WCRH and WCRL are 8-bit readable/writable registers that select the number of program wait
states for each area.
On-chip memory and registers are accessed in a fixed number of states that does not depend on
WCRH/WCRL settings.
WCRH and WCRL are initialized to H'FF by a reset and in hardware standby mode. They are not
initialized in software standby mode.
Rev. 2.0, 06/04, page 119 of 980
WCRH
7
6
5
4
3
2
1
0
W71
W70
W61
W60
W51
W50
W41
W40
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
Bit
R/W
R/W
Bits 7 and 6—Area 7 Wait Control 1 and 0 (W71, W70): These bits select the number of
program wait states when area 7 in external space is accessed while the AST7 bit in ASTCR is set
to 1.
Bit 7
W71
Bit 6
W70
Description
0
0
Program wait not inserted when external space area 7 is accessed
1
1 program wait state inserted when external space area 7 is accessed
0
2 program wait states inserted when external space area 7 is accessed
1
3 program wait states inserted when external space area 7 is accessed
(Initial value)
1
Bits 5 and 4—Area 6 Wait Control 1 and 0 (W61, W60): These bits select the number of
program wait states when area 6 in external space is accessed while the AST6 bit in ASTCR is set
to 1.
Bit 5
W61
Bit 4
W60
Description
0
0
Program wait not inserted when external space area 6 is accessed
1
1 program wait state inserted when external space area 6 is accessed
0
2 program wait states inserted when external space area 6 is accessed
1
3 program wait states inserted when external space area 6 is accessed
(Initial value)
1
Bits 3 and 2—Area 5 Wait Control 1 and 0 (W51, W50): These bits select the number of
program wait states when area 5 in external space is accessed while the AST5 bit in ASTCR is set
to 1.
Rev. 2.0, 06/04, page 120 of 980
Bit 3
W51
Bit 2
W50
Description
0
0
Program wait not inserted when external space area 5 is accessed
1
1 program wait state inserted when external space area 5 is accessed
0
2 program wait states inserted when external space area 5 is accessed
1
3 program wait states inserted when external space area 5 is accessed
(Initial value)
1
Bits 1 and 0—Area 4 Wait Control 1 and 0 (W41, W40): These bits select the number of
program wait states when area 4 in external space is accessed while the AST4 bit in ASTCR is set
to 1.
Bit 1
W41
Bit 0
W40
Description
0
0
Program wait not inserted when external space area 4 is accessed
1
1 program wait state inserted when external space area 4 is accessed
0
2 program wait states inserted when external space area 4 is accessed
1
3 program wait states inserted when external space area 4 is accessed
(Initial value)
1
WCRL
7
6
5
4
3
2
1
0
W31
W30
W21
W20
W11
W10
W01
W00
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
Bit
R/W
R/W
Bits 7 and 6—Area 3 Wait Control 1 and 0 (W31, W30): These bits select the number of
program wait states when area 3 in external space is accessed while the AST3 bit in ASTCR is set
to 1.
Bit 7
W31
Bit 6
W30
Description
0
0
Program wait not inserted when external space area 3 is accessed
1
1 program wait state inserted when external space area 3 is accessed
0
2 program wait states inserted when external space area 3 is accessed
1
3 program wait states inserted when external space area 3 is accessed
(Initial value)
1
Rev. 2.0, 06/04, page 121 of 980
Bits 5 and 4—Area 2 Wait Control 1 and 0 (W21, W20): These bits select the number of
program wait states when area 2 in external space is accessed while the AST2 bit in ASTCR is set
to 1.
Bit 5
W21
Bit 4
W20
Description
0
0
Program wait not inserted when external space area 2 is accessed
1
1 program wait state inserted when external space area 2 is accessed
1
0
2 program wait states inserted when external space area 2 is accessed
1
3 program wait states inserted when external space area 2 is accessed
(Initial value)
Bits 3 and 2—Area 1 Wait Control 1 and 0 (W11, W10): These bits select the number of
program wait states when area 1 in external space is accessed while the AST1 bit in ASTCR is set
to 1.
Bit 3
W11
Bit 2
W10
0
0
Program wait not inserted when external space area 1 is accessed
1
1 program wait state inserted when external space area 1 is accessed
0
2 program wait states inserted when external space area 1 is accessed
1
3 program wait states inserted when external space area 1 is accessed
(Initial value)
1
Description
Bits 1 and 0—Area 0 Wait Control 1 and 0 (W01, W00): These bits select the number of
program wait states when area 0 in external space is accessed while the AST0 bit in ASTCR is set
to 1.
Bit 1
W01
Bit 0
W00
Description
0
0
Program wait not inserted when external space area 0 is accessed
1
1 program wait state inserted when external space area 0 is accessed
0
2 program wait states inserted when external space area 0 is accessed
1
3 program wait states inserted when external space area 0 is accessed
(Initial value)
1
Rev. 2.0, 06/04, page 122 of 980
6.2.4
Bus Release Control Register (BRCR)
BRCR is an 8-bit readable/writable register that enables address output on bus lines A23 to A20 and
enables or disables release of the bus to an external device.
Bit
Modes
1, 2,
and 7
7
6
5
4
3
2
1
0
A23E
A22E
A21E
A20E
—
—
—
BRLE
1
1
1
1
1
1
1
0
Read/Write —
—
—
—
—
—
—
R/W
1
1
0
1
1
1
0
R/W
R/W
—
—
—
—
R/W
1
1
1
1
1
1
0
R/W
R/W
R/W
—
—
—
R/W
Initial value
Modes Initial value 1
3 and 4 Read/Write R/W
Mode 5
Initial value
1
Read/Write R/W
Reserved bits
Address 23 to 20 enable
These bits enable PA7 to PA4 to be
used for A23 to A20 address output
Bus release enable
Enables or disables
release of the bus
to an external device
BRCR is initialized to H'FE in modes 1, 2, 5, and 7, and to H'EE in modes 3 and 4, by a reset and
in hardware standby mode. It is not initialized in software standby mode.
Bit 7—Address 23 Enable (A23E): Enables PA4 to be used as the A23 address output pin.
Writing 0 in this bit enables A23 output from PA4. In modes other than 3, 4, and 5, this bit cannot
be modified and PA4 has its ordinary port functions.
Bit 7
A23E
Description
0
PA4 is the A23 address output pin
1
PA4 is an input/output pin
(Initial value)
Bit 6—Address 22 Enable (A22E): Enables PA5 to be used as the A22 address output pin.
Writing 0 in this bit enables A22 output from PA5. In modes other than 3, 4, and 5, this bit cannot
be modified and PA5 has its ordinary port functions.
Bit 6
A22E
Description
0
PA5 is the A22 address output pin
1
PA5 is an input/output pin
(Initial value)
Rev. 2.0, 06/04, page 123 of 980
Bit 5—Address 21 Enable (A21E): Enables PA6 to be used as the A21 address output pin.
Writing 0 in this bit enables A21 output from PA6. In modes other than 3, 4, and 5, this bit cannot
be modified and PA6 has its ordinary port functions.
Bit 5
A21E
Description
0
PA6 is the A21 address output pin
1
PA6 is an input/output pin
(Initial value)
Bit 4—Address 20 Enable (A20E): Enables PA7 to be used as the A20 address output pin.
Writing 0 in this bit enables A20 output from PA7. This bit can only be modified in mode 5.
Bit 4
A20E
Description
0
PA7 is the A20 address output pin (Initial value when in mode 3 or 4)
1
PA7 is an input/output pin (Initial value when in mode 1, 2, 5, or 7)
Bits 3 to 1—Reserved: These bits cannot be modified and are always read as 1.
Bit 0—Bus Release Enable (BRLE): Enables or disables release of the bus to an external device.
Bit 0
BRLE
Description
0
The bus cannot be released to an external device
BREQ and BACK can be used as input/output pins
1
6.2.5
(Initial value)
The bus can be released to an external device
Bus Control Register (BCR)
7
6
ICIS1
ICIS0
Initial value
1
1
0
Read/Write
R/W
R/W
R/W
Bit
5
4
3
2
1
0
EMC
RDEA
WAITE
0
1
1
0
R/W
R/W
R/W
BROME BRSTS1 BRSTS0
0
R/W
R/W
BCR is an 8-bit readable/writable register that enables or disables idle cycle insertion, selects the
address map, selects the area division unit, and enables or disables WAIT pin input.
BCR is initialized to H'C6 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Rev. 2.0, 06/04, page 124 of 980
Bit 7—Idle Cycle Insertion 1 (ICIS1): Selects whether one idle cycle state is to be inserted
between bus cycles in case of consecutive external read cycles for different areas.
Bit 7
ICIS1
Description
0
No idle cycle inserted in case of consecutive external read cycles for different
areas
1
Idle cycle inserted in case of consecutive external read cycles for different
areas
(Initial value)
Bit 6—Idle Cycle Insertion 0 (ICIS0): Selects whether one idle cycle state is to be inserted
between bus cycles in case of consecutive external read and write cycles.
Bit 6
ICIS0
Description
0
No idle cycle inserted in case of consecutive external read and write cycles
1
Idle cycle inserted in case of consecutive external read and write cycles
(Initial value)
Bit 5—Burst ROM Enable (BROME): Selects whether area 0 is a burst ROM interface area.
Bit 5
BROME
Description
0
Area 0 is a basic bus interface area
1
Area 0 is a burst ROM interface area
(Initial value)
Bit 4—Burst Cycle Select 1 (BRSTS1): Selects the number of burst cycle states for the burst
ROM interface.
Bit 4
BRSTS1
Description
0
Burst access cycle comprises 2 states
1
Burst access cycle comprises 3 states
(Initial value)
Rev. 2.0, 06/04, page 125 of 980
Bit 3—Burst Cycle Select 0 (BRSTS0): Selects the number of words that can be accessed in a
burst ROM interface burst access.
Bit 3
BRSTS0
Description
0
Max. 4 words in burst access (burst access on match of address bits above
A3)
(Initial value)
1
Max. 8 words in burst access (burst access on match of address bits above
A4)
Bit 2—Expansion Memory Map Control (EMC): Selects either of the two memory maps.
Bit 2
EMC
Description
0
Selects the memory map shown in figure 3.2: see section 3.6, Memory Map* in
Each Operating Mode
1
Selects the memory map shown in figure 3.1: see section 3.6, Memory Map* in
Each Operating Mode
(Initial value)
Note: * When the memory map is switched using EMC, the following area combinations in the
on-chip RAM area cannot be used.
(EMC bit = 1)
Mode 1 or 2
Mode 3 or 4
Mode 5
Mode 7
(EMC bit = 0)
(1)
H'FDEE0 to H'FDF1F
↔
H'FBEE0 to H'FBF1F
(2)
H'FFE80 to H'FFEDF
↔
H'FFF80 to H'FFFDF
(3)
H'FFEE0 to H'FFF1F
↔
H'FDEE0 to H'FDF1F
(1)
H'FFDEE0 to H'FFDF1F
↔
H'FFBEE0 to H'FFBF1F
(2)
H'FFFE80 to H'FFFEDF
↔
H'FFFF80 to H'FFFFDF
(3)
H'FFFEE0 to H'FFFF1F
↔
H'FFDEE0 to H'FFDF1F
(1)
H'FFDEE0 to H'FFDF1F
↔
H'FFBEE0 to H'FFBF1F
(2)
H'FFFE80 to H'FFFEDF
↔
H'FFFF80 to H'FFFFDF
(3)
H'FFFEE0 to H'FFFF1F
↔
H'FFDEE0 to H'FFDF1F
(1)
H'FDEE0 to H'FDF1F
↔
H'FBEE0 to H'FBF1F
(2)
H'FFE80 to H'FFEDF
↔
H'FFF80 to H'FFFDF
(3)
H'FFEE0 to H'FFF1F
↔
H'FDEE0 to H'FDF1F
Rev. 2.0, 06/04, page 126 of 980
When EMC is cleared to 0, addresses of some internal I/O registers are moved. For details, refer
to appendix B.2, Addresses (EMC = 0).
When the RDEA bit is 0, EMC must not be cleared to 0.
Bit 1—Area Division Unit Select (RDEA): Selects the memory map area division units. This bit
is valid in modes 3, 4, and 5, and is invalid in modes 1, 2, and 7.
When the EMC bit is 0, RDEA must not be cleared to 0.
Bit 1
RDEA
Description
0
Area divisions are as follows:
1
Area 0: 2 Mbytes
Area 4: 1.93 Mbytes
Area 1: 2 Mbytes
Area 5: 4 kbytes
Area 2: 8 Mbytes
Area 6: 23.75 kbytes
Area 3: 2 Mbytes
Area 7: 22 bytes
Areas 0 to 7 are the same size (2 Mbytes)
(Initial value)
Bit 0—WAIT Pin Enable (WAITE): Enables or disables wait insertion by means of the WAIT
pin.
Bit 0
WAITE
Description
0
WAIT pin wait input is disabled, and the WAIT pin can be used as an
input/output port
(Initial value)
1
WAIT pin wait input is enabled
Rev. 2.0, 06/04, page 127 of 980
6.2.6
Chip Select Control Register (CSCR)
CSCR is an 8-bit readable/writable register that enables or disables output of chip select signals
(CS7 to CS4).
If output of a chip select signal is enabled by a setting in this register, the corresponding pin
functions as a chip select signal (CS7 to CS4) output regardless of any other settings. CSCR cannot
be modified in single-chip mode.
Bit
7
6
5
4
3
2
1
0
CS7E
CS6E
CS5E
CS4E
—
—
—
—
Initial value
0
0
0
0
1
1
1
1
Read/Write
R/W
R/W
R/W
—
—
—
—
R/W
Chip select 7 to 4 enable
These bits enable or disable
chip select signal output
Reserved bits
CSCR is initialized to H'0F by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bits 7 to 4—Chip Select 7 to 4 Enable (CS7E to CS4E): These bits enable or disable output of
the corresponding chip select signal.
Bit n
CSnE
Description
0
Output of chip select signal CSn is disabled
1
Output of chip select signal CSn is enabled
Note: n = 7 to 4
Bits 3 to 0—Reserved: These bits cannot be modified and are always read as 1.
Rev. 2.0, 06/04, page 128 of 980
(Initial value)
6.2.7
DRAM Control Register A (DRCRA)
7
6
5
4
3
2
1
0
DRAS2
DRAS1
DRAS0
—
BE
RDM
SRFMD
RFSHE
Initial value
0
0
0
1
0
0
0
0
Read/Write
R/W
R/W
R/W
—
R/W
R/W
R/W
Bit
R/W
DRCRA is an 8-bit readable/writable register that selects the areas that have a DRAM interface
function, and the access mode, and enables or disables self-refreshing and refresh pin output.
DRCRA is initialized to H'10 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bits 7 to 5—DRAM Area Select (DRAS2 to DRAS0): These bits select which of areas 2 to 5 are
to function as DRAM interface areas (DRAM space) in expanded mode, and at the same time
select the RAS output pin corresponding to each DRAM space.
Description
Bit 7
Bit 6
Bit 5
DRAS2 DRAS1 DRAS0 Area 5
Area 4
Area 3
Area 2
0
0
1
1
0
1
Note:
*
0
Normal
Normal
Normal
Normal
1
Normal
Normal
Normal
DRAM space
(CS2)
0
Normal
Normal
DRAM space
(CS3)
DRAM space
(CS2)
1
Normal
Normal
DRAM space
(CS2)*
DRAM space
(CS2)*
0
Normal
DRAM space
(CS4)
DRAM space
(CS3)
DRAM space
(CS2)
1
DRAM space
(CS5)
DRAM space
(CS4)
DRAM space
(CS3)
DRAM space
(CS2)
0
DRAM space
(CS4)*
DRAM space
(CS4)*
DRAM space
(CS2)*
DRAM space
(CS2)*
1
DRAM space
(CS2)*
DRAM space
(CS2)*
DRAM space
(CS2)*
DRAM space
(CS2)*
A single CSn pin serves as a common RAS output pin for a number of areas. Unused
CSn pins can be used as input/output ports.
When any of bits DRAS2 to DRAS0 is set to 1 in expanded mode, it is not possible to write to
DRCRB, RTMCSR, RTCNT, or RTCOR. However, 0 can be written to the CMF flag in
RTMCSR to clear the flag.
Rev. 2.0, 06/04, page 129 of 980
When an arbitrary value has been set in DRAS2 to DRAS0, a write of a different value other than
000 must not be performed.
Bit 4—Reserved: This bit cannot be modified and is always read as 1.
Bit 3—Burst Access Enable (BE): Enables or disables burst access to DRAM space. DRAM
space burst access is performed in fast page mode.
Bit 3
BE
Description
0
Burst disabled (always full access)
1
DRAM space access performed in fast page mode
(Initial value)
Bit 2—RAS Down Mode (RDM): Selects whether to wait for the next DRAM access with the
RAS signal held low (RAS down mode), or to drive the RAS signal high again (RAS up mode),
when burst access is enabled for DRAM space (BE = 1), and access to DRAM is interrupted.
Caution is required when the HWR and LWR are used as the UCAS and LCAS output pins. For
details, see RAS Down Mode and RAS Up Mode in section 6.5.10, Burst Operation.
Bit 2
RDM
Description
0
DRAM interface: RAS up mode selected
1
DRAM interface: RAS down mode selected
(Initial value)
Bit 1—Self-Refresh Mode (SRFMD): Specifies DRAM self-refreshing in software standby
mode.
When any of areas 2 to 5 is designated as DRAM space, DRAM self-refreshing is possible when a
transition is made to software standby mode after the SRFMD bit has been set to 1.
The normal access state is restored when software standby mode is exited, regardless of the
SRFMD setting.
Bit 1
SRFMD
Description
0
DRAM self-refreshing disabled in software standby mode
1
DRAM self-refreshing enabled in software standby mode
Rev. 2.0, 06/04, page 130 of 980
(Initial value)
Bit 0—Refresh Pin Enable (RFSHE): Enables or disables RFSH pin refresh signal output. If
areas 2 to 5 are not designated as DRAM space, this bit should not be set to 1.
Bit 0
RFSHE
Description
0
RFSH pin refresh signal output disabled
(RFSH pin can be used as input/output port)
1
RFSH pin refresh signal output enabled
6.2.8
(Initial value)
DRAM Control Register B (DRCRB)
7
6
5
4
3
2
1
0
MXC1
MXC0
CSEL
RCYCE
—
TPC
RCW
RLW
Initial value
0
0
0
0
1
0
0
0
Read/Write
R/W
R/W
R/W
—
R/W
R/W
Bit
R/W
R/W
DRCRB is an 8-bit readable/writable register that selects the number of address multiplex column
address bits for the DRAM interface, the column address strobe output pin, enabling or disabling
of refresh cycle insertion, the number of precharge cycles, enabling or disabling of wait state
insertion between RAS and CAS, and enabling or disabling of wait state insertion in refresh
cycles.
DRCRB is initialized to H'08 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
The settings in this register are invalid when bits DRAS2 to DRAS0 in DRCRA are all 0.
Bits 7 and 6—Multiplex Control 1 and 0 (MXC1, MXC0): These bits select the row
address/column address multiplexing method used on the DRAM interface. In burst operation,
the row address used for comparison is determined by the setting of these bits and the bus width of
the relevant area set in ABWCR.
Rev. 2.0, 06/04, page 131 of 980
Bit 7
MXC1
Bit 6
MXC0
Description
0
0
Column address: 8 bits
Compared address:
Modes 1, 2
Modes 3, 4, 5
1
8-bit access space
A19 to A8
16-bit access space
A19 to A9
8-bit access space
A23 to A8
16-bit access space
A23 to A9
Column address: 9 bits
Compared address:
Modes 1, 2
Modes 3, 4, 5
1
0
8-bit access space
A19 to A9
16-bit access space
A19 to A10
8-bit access space
A23 to A9
16-bit access space
A23 to A10
8-bit access space
A19 to A10
16-bit access space
A19 to A11
8-bit access space
A23 to A10
16-bit access space
A23 to A11
Column address: 10 bits
Compared address:
Modes 1, 2
Modes 3, 4, 5
1
Illegal setting
CAS Output Pin Select (CSEL): Selects the UCAS and LCAS output pins when areas 2
Bit 5—CAS
to 5 are designated as DRAM space.
Bit 5
CSEL
Description
0
PB4 and PB5 selected as UCAS and LCAS output pins
1
HWR and LWR selected as UCAS and LCAS output pins
(Initial value)
Bit 4—Refresh Cycle Enable (RCYCE): Enables or disables CAS-before-RAS refresh cycle
insertion. When none of areas 2 to 5 has been designated as DRAM space, refresh cycles are not
inserted regardless of the setting of this bit.
Bit 4
RCYCE
Description
0
Refresh cycles disabled
1
DRAM refresh cycles enabled
Rev. 2.0, 06/04, page 132 of 980
(Initial value)
Bit 3—Reserved: This bit cannot be modified and is always read as 1.
Bit 2—TP Cycle Control (TPC): Selects whether a 1-state or two-state precharge cycle (TP) is to
be used for DRAM read/write cycles and CAS-before-RAS refresh cycles.
The setting of this bit does not affect the self-refresh function.
Bit 2
TPC
Description
0
1-state precharge cycle inserted
1
2-state precharge cycle inserted
(Initial value)
RAS-CAS
Bit 1—RAS
RAS CAS Wait (RCW): Controls wait state (Trw) insertion between Tr and Tc1 in DRAM
read/write cycles. The setting of this bit does not affect refresh cycles.
Bit 1
RCW
Description
0
Wait state (Trw) insertion disabled
1
One wait state (Trw) inserted
(Initial value)
Bit 0—Refresh Cycle Wait Control (RLW): Controls wait state (TRW) insertion for CAS-beforeRAS refresh cycles. The setting of this bit does not affect DRAM read/write cycles.
Bit 0
RLW
Description
0
Wait state (TRW) insertion disabled
1
One wait state (TRW) inserted
6.2.9
(Initial value)
Refresh Timer Control/Status Register (RTMCSR)
7
6
5
4
3
2
1
0
CMF
CMIE
CKS2
CKS1
CKS0
—
—
—
Initial value
0
0
0
0
0
1
1
1
Read/Write
R(W)*
R/W
R/W
R/W
—
—
—
Bit
R/W
RTMCSR is an 8-bit readable/writable register that selects the refresh timer counter clock. When
the refresh timer is used as an interval timer, RTMCSR also enables or disables interrupt requests.
Bits 7 and 6 of RTMCSR are initialized to 0 by a reset and in the standby modes. Bits 5 to 3 are
initialized to 0 by a reset and in hardware standby mode; they are not initialized in software
standby mode.
Rev. 2.0, 06/04, page 133 of 980
Note: * Only 0 can be written to clear the flag.
Bit 7—Compare Match Flag (CMF): Status flag that indicates a match between the values of
RTCNT and RTCOR.
Bit 7
CMF
Description
0
[Clearing conditions]
When the chip is reset and in standby mode
Read CMF when CMF = 1, then write 0 in CMF
1
(Initial value)
[Setting condition]
When RTCNT = RTCOR
Bit 6—Compare Match Interrupt Enable (CMIE): Enables or disables the CMI interrupt
requested when the CMF flag is set to 1 in RTMCSR. The CMIE bit is always cleared to 0 when
any of areas 2 to 5 is designated as DRAM space.
Bit 6
CMIE
Description
0
The CMI interrupt requested by CMF is disabled
1
The CMI interrupt requested by CMF is enabled
(Initial value)
Bits 5 to 3—Refresh Counter Clock Select (CKS2 to CKS0): These bits select the clock to be
input to RTCNT from among 7 clocks obtained by dividing the system clock (φ). When the input
clock is selected with bits CKS2 to CKS0, RTCNT begins counting up.
Bit 5 Bit 4 Bit 3
CKS2 CKS1 CKS0 Description
0
0
1
1
0
1
0
Count operation halted
1
φ/2 used as counter clock
0
φ/8 used as counter clock
1
φ/32 used as counter clock
0
φ/128 used as counter clock
1
φ/512 used as counter clock
0
φ/2048 used as counter clock
1
φ/4096 used as counter clock
Bits 2 to 0—Reserved: These bits cannot be modified and are always read as 1.
Rev. 2.0, 06/04, page 134 of 980
(Initial value)
6.2.10
Refresh Timer Counter (RTCNT)
Bit
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
RTCNT is an 8-bit readable/writable up-counter.
RTCNT is incremented by an internal clock selected by bits CKS2 to CKS0 in RTMCSR. When
RTCNT matches RTCOR (compare match), the CMF flag in RTMCSR is set to 1 and RTCNT is
cleared to H'00. If the RCYCE bit in DRCRB is set to 1 at this time, a refresh cycle is started.
Also, if the CMIE bit in RTMCSR is set to 1, a compare match interrupt (CMI) is generated.
RTCNT is initialized to H'00 by a reset and in standby mode.
6.2.11
Refresh Time Constant Register (RTCOR)
Bit
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
RTCOR is an 8-bit readable/writable register that determines the interval at which RTCNT is
cleared.
RTCOR and RTCNT are constantly compared. When their values match, the CMF flag is set to 1
in RTMCSR, and RTCNT is simultaneously cleared to H'00.
RTCOR is initialized to H'FF by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Note: Only byte access can be used on this register.
Rev. 2.0, 06/04, page 135 of 980
6.2.12
Address Control Register (ADRCR)
ADRCR is an 8-bit readable/writable register that selects either address update mode 1 or address
update mode 2 as the address output method.
7
6
5
4
3
2
1
0
—
—
—
—
—
—
—
ADRCTL
Initial value
1
1
1
1
1
1
1
1
R/W
—
—
—
—
—
—
—
R/W
Bit
Reserved bits
Address control
Selects address update
mode 1 or address
update mode 2
ADRCR is initialized to H'FF by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bits 7 to 1—Reserved: Read-only bits, always read as 1.
Bit 0—Address Control (ADRCTL): Selects the address output method.
Bit 0
ADRCTL
Description
0
Address update mode 2 is selected
1
Address update mode 1 is selected
Rev. 2.0, 06/04, page 136 of 980
(Initial value)
6.3
Operation
6.3.1
Area Division
The external address space is divided into areas 0 to 7. Each area has a size of 128 kbytes in the
1-Mbyte modes, or 2-Mbytes in the 16-Mbyte modes. Figure 6.2 shows a general view of the
memory map.
H'00000
H'000000
Area 0 (128 kbytes)
H'1FFFF
Area 0 (2 Mbytes)
H'1FFFFF
H'20000
H'200000
Area 1 (128 kbytes)
H'3FFFF
Area 1 (2 Mbytes)
H'3FFFFF
H'40000
H'400000
Area 2 (128 kbytes)
H'5FFFF
Area 2 (2 Mbytes)
H'5FFFFF
H'60000
H'600000
Area 3 (128 kbytes)
H'7FFFF
Area 3 (2 Mbytes)
H'7FFFFF
H'80000
H'800000
Area 4 (128 kbytes)
H'9FFFF
Area 4 (2 Mbytes)
H'9FFFFF
H'A0000
H'A00000
Area 5 (128 kbytes)
H'BFFFF
H'C0000
H'DFFFF
Area 5 (2 Mbytes)
H'BFFFFF
H'C00000
Area 6 (128 kbytes)
H'E0000
H'DFFFFF
Area 6 (2 Mbytes)
H'E00000
Area 7 (128 kbytes)
Area 7 (2 Mbytes)
H'FFFFF
H'FFFFFF
(a) 1-Mbyte modes (modes 1 and 2)
(b) 16-Mbyte modes (modes 3, 4, and 5)
Figure 6.2 Access Area Map for Each Operating Mode
Chip select signals (CS0 to CS7) can be output for areas 0 to 7. The bus specifications for each
area are selected in ABWCR, ASTCR, WCRH, and WCRL.
In 16-Mbyte mode, the area division units can be selected with the RDEA bit in BCR.
Rev. 2.0, 06/04, page 137 of 980
Area 0
2 Mbytes
Area 0
2 Mbytes
Area 1
2 Mbytes
Area 1
2 Mbytes
2 Mbytes
H'000000
H'1FFFFF
2 Mbytes
H'200000
H'3FFFFF
Area 2
8 Mbytes
2 Mbytes
Area 2
2 Mbytes
H'5FFFFF
H'600000
2 Mbytes
H'400000
Area 3
2 Mbytes
2 Mbytes
H'7FFFFF
H'800000
Area 4
2 Mbytes
2 Mbytes
H'9FFFFF
H'A00000
Area 5
2 Mbytes
Area 6
2 Mbytes
Area 3
2 Mbytes
Area 7
1.93 Mbytes
Area 4
1.93 Mbytes
On-chip registers (1)
On-chip registers (1)
2 Mbytes
H'BFFFFF
H'C00000
H'DFFFFF
H'E00000
H'FEE000
H'FEE0FF
H'FEE100
Reserved 39.75 kbytes
H'FF7FFF
H'FF8000
Area 6
23.75 kbytes
On-chip RAM
4 kbytes
On-chip RAM
4 kbytes*
On-chip registers (2)
On-chip registers (2)
Area 7
22 bytes
Area 7
22 bytes
(A) Memory map when RDEA = 1
(b) Memory map when RDEA = 0
H'FFEF1F
H'FFEF20
H'FFFF1F
H'FFFF20
H'FFFFE9
H'FFFFEA
H'FFFFFF
Note: * Area 6 when the RAME bit is cleared.
Figure 6.3 Memory Map in 16-Mbyte Mode
Rev. 2.0, 06/04, page 138 of 980
Absolute
address 8 bits
H'FFFEFF
H'FFFF00
2 Mbytes
Area 7
67.5 kbytes
Absolute
address 16 bits
Area 5
4 kbytes
H'FF8FFF
H'FF9000
6.3.2
Bus Specifications
The external space bus specifications consist of three elements: (1) bus width, (2) number of
access states, and (3) number of program wait states.
The bus width and number of access states for on-chip memory and registers are fixed, and are not
affected by the bus controller.
Bus Width: A bus width of 8 or 16 bits can be selected with ABWCR. An area for which an 8-bit
bus is selected functions as an 8-bit access space, and an area for which a 16-bit bus is selected
functions as a16-bit access space.
If all areas are designated for 8-bit access, 8-bit bus mode is set; if any area is designated for 16bit access, 16-bit bus mode is set.
Number of Access States: Two or three access states can be selected with ASTCR. An area for
which two-state access is selected functions as a two-state access space, and an area for which
three-state access is selected functions as a three-state access space.
DRAM space is accessed in four states regardless of the ASTCR settings.
When two-state access space is designated, wait insertion is disabled.
Number of Program Wait States: When three-state access space is designated in ASTCR, the
number of program wait states to be inserted automatically is selected with WCRH and WCRL.
From 0 to 3 program wait states can be selected.
When ASTCR is cleared to 0 for DRAM space, a program wait (Tc1-Tc2 wait) is not inserted. Also,
no program wait is inserted in burst ROM space burst cycles.
Table 6.3 shows the bus specifications for each basic bus interface area.
Rev. 2.0, 06/04, page 139 of 980
Table 6.3
Bus Specifications for Each Area (Basic Bus Interface)
ABWCR ASTCR WCRH/WCRL
Bus Specifications (Basic Bus Interface)
ABWn
ASTn
Wn1
Wn0
Bus Width
Access States
Program Wait States
0
0
—
—
16
2
0
1
0
0
3
0
1
1
1
1
0
2
1
3
0
—
—
1
0
0
1
8
2
0
3
0
1
1
0
2
1
3
Note: n = 7 to 0
6.3.3
Memory Interfaces
The H8/3029 memory interfaces comprise a basic bus interface that allows direct connection of
ROM, SRAM, and so on; a DRAM interface that allows direct connection of DRAM; and a burst
ROM interface that allows direct connection of burst ROM. The interface can be selected
independently for each area.
An area for which the basic bus interface is designated functions as normal space, an area for
which the DRAM interface is designated functions as DRAM space, and area 0 for which the
burst ROM interface is designated functions as burst ROM space.
Rev. 2.0, 06/04, page 140 of 980
6.3.4
Chip Select Signals
For each of areas 0 to 7, the H8/3029 can output a chip select signal (CS0 to CS7) that goes low
when the corresponding area is selected in expanded mode. Figure 6.4 shows the output timing of
a CSn signal.
Output of CS0 to CS3: Output of CS0 to CS3 is enabled or disabled in the data direction register
(DDR) of the corresponding port.
In the expanded modes with on-chip ROM disabled, a reset leaves pin CS0 in the output state and
pins CS1 to CS3 in the input state. To output chip select signals CS1 to CS3, the corresponding
DDR bits must be set to 1. In the expanded modes with on-chip ROM enabled, a reset leaves pins
CS0 to CS3 in the input state. To output chip select signals CS0 to CS3, the corresponding DDR bits
must be set to 1. For details, see section 8, I/O Ports.
Output of CS4 to CS7: Output of CS4 to CS7 is enabled or disabled in the chip select control
register (CSCR). A reset leaves pins CS4 to CS7 in the input state. To output chip select signals
CS4 to CS7, the corresponding CSCR bits must be set to 1. For details, see section 8, I/O Ports.
φ
Address
External address in area n
CSn
Figure 6.4 CSn
CS Signal Output Timing (n = 0 to 7)
When the on-chip ROM, on-chip RAM, and on-chip registers are accessed, CS0 to CS7 remain
high. The CSn signals are decoded from the address signals. They can be used as chip select
signals for SRAM and other devices.
Rev. 2.0, 06/04, page 141 of 980
6.3.5
Address Output Method
The H8/3029 provides a choice of two address update methods: either the same method as in the
previous H8/300H Series (address update mode 1), or a method in which address update is
restricted to external space accesses or self-refresh cycles (address update mode 2).
Figure 6.5 shows examples of address output in these two update modes.
On-chip
memory cycle
External
read cycle
On-chip
memory cycle
External
read cycle
On-chip
memory cycle
Address update
mode 1
Address update
mode 2
RD
Figure 6.5 Sample Address Output in Each Address Update Mode
(Basic Bus Interface, 3-State Space)
Address Update Mode 1: Address update mode 1 is compatible with the previous H8/300H
Series. Addresses are always updated between bus cycles.
Address Update Mode 2: In address update mode 2, address updating is performed only in
external space accesses or self-refresh cycles. In this mode, the address can be retained between
an external space read cycle and an instruction fetch cycle (on-chip memory) by placing the
program in on-chip memory. Address update mode 2 is therefore useful when connecting a
device that requires address hold time with respect to the rise of the RD strobe.
Switching between address update modes 1 and 2 is performed by means of the ADRCTL bit in
ADRCR. The initial value of ADRCR is the address update mode 1 setting, providing
compatibility with the previous H8/300H Series.
Rev. 2.0, 06/04, page 142 of 980
Cautions: When using address update modes, the following points should be noted.
• When address update mode 2 is selected, the address in an internal space (on-chip memory or
internal I/O) access cycle is not output externally.
• In order to secure address holding with respect to the rise of RD, when address update mode 2
is used an external space read access must be completed within a single access cycle. For
example, in a word access to 8-bit access space, the bus cycle is split into two as shown in
figure 6.6, and so there is not a single access cycle. In this case, address holding is not
guaranteed at the rise of RD between the first (even address) and second (odd address) access
cycles (area inside the ellipse in the figure).
On-chip
memory cycle
Address update
mode 2
External read cycle
(8-bit space word access)
Even address
On-chip
memory cycle
Odd address
RD
Figure 6.6 Example of Consecutive External Space Accesses in Address Update Mode 2
• When address update mode 2 is selected, in a DRAM space CAS-before-RAS (CBR) refresh
cycle the previous address is retained (the area 2 start address is not output).
Rev. 2.0, 06/04, page 143 of 980
6.4
Basic Bus Interface
6.4.1
Overview
The basic bus interface enables direct connection of ROM, SRAM, and so on.
The bus specifications can be selected with ABWCR, ASTCR, WCRH, and WCRL
(see table 6.3).
6.4.2
Data Size and Data Alignment
Data sizes for the CPU and other internal bus masters are byte, word, and longword. The bus
controller has a data alignment function, and when accessing external space, controls whether the
upper data bus (D15 to D8) or lower data bus (D7 to D0) is used according to the bus specifications
for the area being accessed (8-bit access area or 16-bit access area) and the data size.
8-Bit Access Areas: Figure 6.7 illustrates data alignment control for 8-bit access space. With 8bit access space, the upper data bus (D15 to D8) is always used for accesses. The amount of data
that can be accessed at one time is one byte: a word access is performed as two byte accesses, and
a longword access, as four byte accesses.
Upper data bus
Lower data bus
D15
D 8 D7
D0
Byte size
Word size
1st bus cycle
2nd bus cycle
1st bus cycle
Longword size
2nd bus cycle
3rd bus cycle
4th bus cycle
Figure 6.7 Access Sizes and Data Alignment Control (8-Bit Access Area)
16-Bit Access Areas: Figure 6.8 illustrates data alignment control for 16-bit access areas. With
16-bit access areas, the upper data bus (D15 to D8) and lower data bus (D7 to D0) are used for
accesses. The amount of data that can be accessed at one time is one byte or one word, and a
longword access is executed as two word accesses.
Rev. 2.0, 06/04, page 144 of 980
In byte access, whether the upper or lower data bus is used is determined by whether the address
is even or odd. The upper data bus is used for an even address, and the lower data bus for an odd
address.
Upper data bus
Lower data bus
D15
D8 D7
D0
Byte size
· Even address
Byte size
· Odd address
Word size
Longword size
1st bus cycle
2nd bus cycle
Figure 6.8 Access Sizes and Data Alignment Control (16-Bit Access Area)
6.4.3
Valid Strobes
Table 6.4 shows the data buses used, and the valid strobes, for the access spaces.
In a read, the RD signal is valid for both the upper and the lower half of the data bus.
In a write, the HWR signal is valid for the upper half of the data bus, and the LWR signal for the
lower half.
Rev. 2.0, 06/04, page 145 of 980
Table 6.4
Data Buses Used and Valid Strobes
Access
Size
Read/Write
Address
Valid Strobe
Upper Data Bus Lower Data Bus
(D7 to D0)
(D15 to D8)
8-bit
access
area
Byte
Read
—
RD
Valid
Write
—
HWR
16-bit
access
Byte
Read
Even
RD
Area
Odd
area
Undetermined
data
Valid
Invalid
Invalid
Valid
Even
HWR
Valid
Undetermined
data
Odd
LWR
Undetermined
data
Valid
Read
—
RD
Valid
Valid
Write
—
HWR, LWR
Valid
Valid
Write
Word
Invalid
Notes: 1. Undetermined data means that unpredictable data is output.
2. Invalid means that the bus is in the input state and the input is ignored.
6.4.4
Memory Areas
The initial state of each area is basic bus interface, three-state access space. The initial bus width
is selected according to the operating mode. The bus specifications described here cover basic
items only, and the following sections should be referred to for further details: Sections 6.4, Basic
Bus Interface, 6.5, DRAM Interface, and 6.8, Burst ROM Interface.
Area 0: Area 0 includes on-chip ROM, and in ROM-disabled expansion mode, all of area 0 is
external space. In ROM-enabled expansion mode, the space excluding on-chip ROM is external
space.
When area 0 external space is accessed, the CS0 signal can be output.
Either basic bus interface or burst ROM interface can be selected for area 0.
The size of area 0 is 128 kbytes in modes 1 and 2, and 2 Mbytes in modes 3, 4, and 5.
Areas 1 and 6: In external expansion mode, areas 1 and 6 are entirely external space.
When area 1 and 6 external space is accessed, the CS1 and CS6 pin signals respectively can be
output.
Only the basic bus interface can be used for areas 1 and 6.
The size of areas 1 and 6 is 128 kbytes in modes 1 and 2, and 2 Mbytes in modes 3, 4, and 5.
Rev. 2.0, 06/04, page 146 of 980
Areas 2 to 5: In external expansion mode, areas 2 to 5 are entirely external space.
When area 2 to 5 external space is accessed, signals CS2 to CS5 can be output.
Basic bus interface or DRAM interface can be selected for areas 2 to 5. With the DRAM
interface, signals CS2 to CS5 are used as RAS signals.
The size of areas 2 to 5 is 128 kbytes in modes 1 and 2, and 2 Mbytes in modes 3, 4, and 5.
Area 7: Area 7 includes the on-chip RAM and registers. In external expansion mode, the space
excluding the on-chip RAM and registers is external space. The on-chip RAM is enabled when
the RAME bit in the system control register (SYSCR) is set to 1; when the RAME bit is cleared to
0, the on-chip RAM is disabled and the corresponding space becomes external space .
When area 7 external space is accessed, the CS7 signal can be output.
Only the basic bus interface can be used for the area 7 memory interface.
The size of area 7 is 128 kbytes in modes 1 and 2, and 2 Mbytes in modes 3, 4, and 5.
Rev. 2.0, 06/04, page 147 of 980
6.4.5
Basic Bus Control Signal Timing
8-Bit, Three-State-Access Areas
Figure 6.9 shows the timing of bus control signals for an 8-bit, three-state-access area. The upper
data bus (D15 to D8) is used in accesses to these areas. The LWR pin is always high. Wait states
can be inserted.
Bus cycle
T1
T2
T3
φ
Address bus
External address in area n
CSn
AS
RD
Read access
D15 to D8
Valid
D7 to D0
Invalid
HWR
LWR
High
Write access
D15 to D8
D7 to D0
Valid
Undetermined data
Note: n = 7 to 0
Figure 6.9 Bus Control Signal Timing for 8-Bit, Three-State-Access Area
Rev. 2.0, 06/04, page 148 of 980
8-Bit, Two-State-Access Areas
Figure 6.10 shows the timing of bus control signals for an 8-bit, two-state-access area. The upper
data bus (D15 to D8) is used in accesses to these areas. The LWR pin is always high. Wait states
cannot be inserted.
Bus cycle
T2
T1
φ
Address bus
External address in area n
CSn
AS
RD
Read access
D15 to D8
Valid
D7 to D0
Invalid
HWR
LWR
High
Write access
D15 to D8
Valid
D7 to D0
Undetermined data
Note: n = 7 to 0
Figure 6.10 Bus Control Signal Timing for 8-Bit, Two-State-Access Area
Rev. 2.0, 06/04, page 149 of 980
16-Bit, Three-State-Access Areas
Figures 6.11 to 6.13 show the timing of bus control signals for a 16-bit, three-state-access area. In
these areas, the upper data bus (D15 to D8) is used in accesses to even addresses and the lower data
bus (D7 to D0) in accesses to odd addresses. Wait states can be inserted.
Bus cycle
T1
T2
T3
φ
Address bus
Even external address in area n
CSn
AS
RD
Read access
D15 to D8
Valid
D7 to D0
Invalid
HWR
LWR
High
Write access
D15 to D8
Valid
D7 to D0
Undetermined data
Note: n = 7 to 0
Figure 6.11 Bus Control Signal Timing for 16-Bit, Three-State-Access Area (1)
(Byte Access to Even Address)
Rev. 2.0, 06/04, page 150 of 980
Bus cycle
T1
T2
T3
φ
Address bus
Odd external address in area n
CSn
AS
RD
Read access
D15 to D8
Invalid
D7 to D0
Valid
HWR
High
LWR
Write access
D15 to D8
Undetermined data
D7 to D0
Valid
Note: n = 7 to 0
Figure 6.12 Bus Control Signal Timing for 16-Bit, Three-State-Access Area (2)
(Byte Access to Odd Address)
Rev. 2.0, 06/04, page 151 of 980
Bus cycle
T1
T2
T3
φ
Address bus
External address in area n
CSn
AS
RD
Read access
D15 to D8
Valid
D7 to D0
Valid
HWR
LWR
Write access
D15 to D8
Valid
D7 to D0
Valid
Note: n = 7 to 0
Figure 6.13 Bus Control Signal Timing for 16-Bit, Three-State-Access Area (3)
(Word Access)
Rev. 2.0, 06/04, page 152 of 980
16-Bit, Two-State-Access Areas: Figures 6.14 to 6.16 show the timing of bus control signals for
a 16-bit, two-state-access area. In these areas, the upper data bus (D15 to D8) is used in accesses to
even addresses and the lower data bus (D7 to D0) in accesses to odd addresses. Wait states cannot
be inserted.
Bus cycle
T1
T2
φ
Address bus
Even external address in area n
CSn
AS
RD
Read access
D15 to D8
Valid
D7 to D0
Invalid
HWR
LWR
High
Write access
D15 to D8
Valid
D7 to D0
Undetermined data
Note: n = 7 to 0
Figure 6.14 Bus Control Signal Timing for 16-Bit, Two-State-Access Area (1)
(Byte Access to Even Address)
Rev. 2.0, 06/04, page 153 of 980
Bus cycle
T1
T2
φ
Address bus
Odd external address in area n
CSn
AS
RD
Read access
D15 to D8
Invalid
D7 to D0
Valid
HWR
High
LWR
Write access
D15 to D8
Undetermined data
D7 to D0
Valid
Note: n = 7 to 0
Figure 6.15 Bus Control Signal Timing for 16-Bit, Two-State-Access Area (2)
(Byte Access to Odd Address)
Rev. 2.0, 06/04, page 154 of 980
Bus cycle
T1
T2
φ
Address bus
External address in area n
CSn
AS
RD
Read access
D15 to D8
Valid
D7 to D0
Valid
HWR
LWR
Write access
D15 to D8
Valid
D7 to D0
Valid
Note: n = 7 to 0
Figure 6.16 Bus Control Signal Timing for 16-Bit, Two-State-Access Area (3)
(Word Access)
6.4.6
Wait Control
When accessing external space, the H8/3029 can extend the bus cycle by inserting one or more
wait states (Tw). There are two ways of inserting wait states: (1) program wait insertion and (2)
pin wait insertion using the WAIT pin.
Program Wait Insertion: From 0 to 3 wait states can be inserted automatically between the T2
state and T3 state on an individual area basis in three-state access space, according to the settings
of WCRH and WCRL.
Pin Wait Insertion: Setting the WAITE bit in BCR to 1 enables wait insertion by means of the
WAIT pin. When external space is accessed in this state, a program wait is first inserted. If the
WAIT pin is low at the falling edge of φ in the last T2 or TW state, another TW state is inserted. If
the WAIT pin is held low, TW states are inserted until it goes high.
Rev. 2.0, 06/04, page 155 of 980
This is useful when inserting four or more TW states, or when changing the number of TW states for
different external devices.
The WAITE bit setting applies to all areas. Pin waits cannot be inserted in DRAM space.
Figure 6.17 shows an example of the timing for insertion of one program wait state in 3-state
space.
T1
Inserted
by program wait Inserted by WAIT pin
T2
Tw
Tw
Tw
T3
φ
WAIT
Address bus
AS
RD
Read access
Data bus
Read data
HWR, LWR
Write access
Data bus
Note:
Write data
indicates the timing of WAIT pin sampling.
Figure 6.17 Example of Wait State Insertion Timing
Rev. 2.0, 06/04, page 156 of 980
6.5
DRAM Interface
6.5.1
Overview
The H8/3029 is provided with a DRAM interface with functions for DRAM control signal (RAS,
UCAS, LCAS, WE) output, address multiplexing, and refreshing, that direct connection of
DRAM. In the expanded modes, external address space areas 2 to 5 can be designated as DRAM
space accessed via the DRAM interface. A data bus width of 8 or 16 bits can be selected for
DRAM space by means of a setting in ABWCR. When a 16-bit data bus width is selected, CAS is
used for byte access control. In the case of × 16-bit organization DRAM, therefore, the 2-CAS
type can be connected. A fast page mode is supported in addition to the normal read and write
access modes.
6.5.2
DRAM Space and RAS Output Pin Settings
Designation of areas 2 to 5 as DRAM space, and selection of the RAS output pin for each area
designated as DRAM space, is performed by setting bits in DRCRA. Table 6.5 shows the
correspondence between the settings of bits DRAS2 to DRAS0 and the selected DRAM space and
RAS output pin.
When an arbitrary value has been set in DRAS2 to DRAS0, a write of a different value other than
000 must not be performed.
Rev. 2.0, 06/04, page 157 of 980
RAS
Settings of Bits DRAS2 to DRAS0 and Corresponding DRAM Space (RAS
Output Pin)
Table 6.5
DRAS2 DRAS1 DRAS0 Area 5
Area 4
Area 3
Area 2
0
0
1
1
0
1
Note:
6.5.3
*
0
Normal space
Normal space
Normal space
Normal space
1
Normal space
Normal space
Normal space
DRAM space
(CS2)
0
Normal space
Normal space
DRAM space
(CS3)
DRAM space
(CS2)
1
Normal space
Normal space
DRAM space
(CS2)*
DRAM space
(CS2)*
0
Normal space
DRAM space
(CS4)
DRAM space
(CS3)
DRAM space
(CS2)
1
DRAM space
(CS5)
DRAM space
(CS4)
DRAM space
(CS3)
DRAM space
(CS2)
0
DRAM space
(CS4)*
DRAM space
(CS4)*
DRAM space
(CS2)*
DRAM space
(CS2)*
1
DRAM space
(CS2)*
DRAM space
(CS2)*
DRAM space
(CS2)*
DRAM space
(CS2)*
A single CSn pin serves as a common RAS output pin for a number of areas. Unused
CSn pins can be used as input/output ports.
Address Multiplexing
When DRAM space is accessed, the row address and column address are multiplexed. The
address multiplexing method is selected with bits MXC1 and MXC0 in DRCRB according to the
number of bits in the DRAM column address. Table 6.6 shows the correspondence between the
settings of MXC1 and MXC0 and the address multiplexing method.
Rev. 2.0, 06/04, page 158 of 980
Table 6.6
Settings of Bits MXC1 and MXC0 and Address Multiplexing Method
DRCRB
Row
address
Note:
A23 to A13
A12 A11 A10 A9
A1
A0
0
A8
—
6.5.4
*
Address Pins
MXC1 MXC0 Bits
1
Column
address
Column
Address
A8
A7
A6
A5
A4
A3
A2
0
8 bits
A23 to A13
A20* A19 A18 A17 A16 A15 A14 A13 A12 A11 A10 A9
1
9 bits
A23 to A13
A12 A20* A19 A18 A17 A16 A15 A14 A13 A12 A11 A10 A9
0
10 bits
A23 to A13
A12 A11 A20* A19 A18 A17 A16 A15 A14 A13 A12 A11 A10
1
Illegal
setting
—
—
—
—
—
—
—
—
—
—
—
—
—
—
A23 to A13
A12 A11 A10 A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
—
—
Row address bit A20 is not multiplexed in 1-Mbyte mode.
Data Bus
If the bit in ABWCR corresponding to an area designated as DRAM space is set to 1, that area is
designated as 8-bit DRAM space; if the bit is cleared to 0, the area is designated as 16-bit DRAM
space. In 16-bit DRAM space, × 16-bit organization DRAM can be connected directly.
In 8-bit DRAM space the upper half of the data bus, D15 to D8, is enabled, while in 16-bit DRAM
space both the upper and lower halves of the data bus, D15 to D0, are enabled.
Access sizes and data alignment are the same as for the basic bus interface: see section 6.4.2, Data
Size and Data Alignment.
6.5.5
Pins Used for DRAM Interface
Table 6.7 shows the pins used for DRAM interfacing and their functions.
Rev. 2.0, 06/04, page 159 of 980
Table 6.7
DRAM Interface Pins
Pin
With DRAM
Designated Name
I/O
Function
PB4
UCAS
Upper column
address strobe
Output
Upper column address strobe for DRAM
space access (when CSEL = 0 in DRCRB)
PB5
LCAS
Lower column
address strobe
Output
Lower column address strobe for DRAM
space access (when CSEL = 0 in DRCRB)
HWR
UCAS
Upper column
address strobe
Output
Upper column address strobe for DRAM
space access (when CSEL = 1 in DRCRB)
LWR
LCAS
Lower column
address strobe
Output
Lower column address strobe for DRAM
space access (when CSEL = 1 in DRCRB)
CS2
RAS2
Row address
strobe 2
Output
Row address strobe for DRAM space
access
CS3
RAS3
Row address
strobe 3
Output
Row address strobe for DRAM space
access
CS4
RAS4
Row address
strobe 4
Output
Row address strobe for DRAM space
access
CS5
RAS5
Row address
strobe 5
Output
Row address strobe for DRAM space
access
RD
WE
Write enable
Output
Write enable for DRAM space write
access*
P80
RFSH
Refresh
Output
Goes low in refresh cycle
A12 to A0 A12 to A0
Address
Output
Row address/column address multiplexed
output
D15 to D0 D15 to D0
Data
I/O
Data input/output pins
Note:
6.5.6
*
Fixed high in a read access.
Basic Timing
Figure 6.18 shows the basic access timing for DRAM space. The basic DRAM access timing is
four states: one precharge cycle (Tp) state, one row address output cycle (Tr) state, and two column
address output cycle (Tc1, Tc2) states. Unlike the basic bus interface, the corresponding bits in
ASTCR control only enabling or disabling of wait insertion between Tc1 and Tc2, and do not affect
the number of access states. When the corresponding bit in ASTCR is cleared to 0, wait states
cannot be inserted between Tc1 and Tc2 in the DRAM access cycle.
If a DRAM read/write cycle is followed by an access cycle for an external area other than DRAM
space when HWR and LWR are selected as the UCAS and LCAS output pins, an idle cycle (Ti) is
inserted unconditionally immediately after the DRAM access cycle. See section 6.9, Idle Cycle,
for details.
Rev. 2.0, 06/04, page 160 of 980
Tp
Tr
Tc1
Tc2
φ
A23 to A0
AS
Row
Column
High level
CSn (RAS)
PB4 /PB5
/ LCAS)
(UCAS
Read access
RD(WE)
High level
D15 to D0
PB4 /PB5
(UCAS / LCAS)
Write access
RD(WE)
D15 to D0
Note: n = 2 to 5
Figure 6.18 Basic Access Timing (CSEL = 0 in DRCRB)
6.5.7
Precharge State Control
In the H8/3029, provision is made for the DRAM RAS precharge time by always inserting one
RAS precharge state (Tp) when DRAM space is accessed. This can be changed to two Tp states by
setting the TPC bit to 1 in DRCRB. The optimum number of Tp cycles should be set according to
the DRAM connected and the operating frequency of the H8/3029 chip. Figure 6.19 shows the
timing when two Tp states are inserted.
When the TCP bit is set to 1, two Tp states are also used for CAS-before-RAS refresh cycles.
Rev. 2.0, 06/04, page 161 of 980
Tp1
Tp2
Tr
Tc1
Tc2
φ
A23 to A0
AS
Row
Column
High level
CSn (RAS)
PB4 /PB5
(UCAS /LCAS)
RD(WE)
Read access
High level
D15 to D0
PB4 /PB5
(UCAS /LCAS)
RD(WE)
Write access
D15 to D0
Note: n = 2 to 5
Figure 6.19 Timing with Two Precharge States (CSEL = 0 in DRCRB)
6.5.8
Wait Control
In a DRAM access cycle, wait states can be inserted (1) between the Tr state and Tc1 state, and (2)
between the Tc1 state and Tc2 state.
Insertion of Trw Wait State between Tr and Tc1: One Trw state can be inserted between Tr and Tc1
by setting the RCW bit to 1 in DRCRB.
Insertion of Tw Wait State(s) between Tc1 and Tc2: When the bit in ASTCR corresponding to an
area designated as DRAM space is set to 1, from 0 to 3 wait states can be inserted between the Tc1
state and Tc2 state by means of settings in WCRH and WCRL.
Figure 6.20 shows an example of the timing for wait state insertion.
Rev. 2.0, 06/04, page 162 of 980
The settings of the RCW bit in DRCRB and of ASTCR, WCRH, and WCRL do not affect refresh
cycles. Wait states cannot be inserted in a DRAM space access cycle by means of the WAIT pin.
Tp
Tr
Trw
Tc1
Tw
Tw
Tc2
φ
A23 to A0
AS
Row
Column
High level
CSn(RAS)
Read access
PB4/PB5
(UCAS /LCAS)
RD(WE)
D15 to D0
High level
Read data
PB4/PB5
(UCAS /LCAS)
Write access
RD(WE)
D15 to D0
Write data
Note: n = 2 to 5
Figure 6.20 Example of Wait State Insertion Timing (CSEL = 0)
6.5.9
Byte Access Control and CAS Output Pin
When an access is made to DRAM space designated as a 16-bit-access area in ABWCR, column
address strobes (UCAS and LCAS) corresponding to the upper and lower halves of the external
data bus are output. In the case of × 16-bit organization DRAM, the 2-CAS type can be
connected.
Either PB4 and PB5, or HWR and LWR, can be used as the UCAS and LCAS output pins, the
selection being made with the CSEL bit in DRCRB. Table 6.8 shows the CSEL bit settings and
corresponding output pin selections.
Rev. 2.0, 06/04, page 163 of 980
When an access is made to DRAM space designated as an 8-bit-access area in ABWCR, only
UCAS is output. When the entire DRAM space is designated as 8-bit-access space and CSEL = 0,
PB5 can be used as an input/output port.
Note that RAS down mode cannot be used when a device other than DRAM is connected to
external space and HWR and LWR are used as write strobes. In this case, also, an idle cycle (Ti)
is always inserted when an external access to other than DRAM space occurs after a DRAM space
access. For details, see section 6.9, Idle Cycle.
CSEL Settings and UCAS and LCAS Output Pins
Table 6.8
CSEL
UCAS
LCAS
0
PB4
PB5
1
HWR
LWR
Figure 6.21 shows the control timing.
Tp
Tr
Tc1
Row
Column
Tc2
φ
A23 to A0
CSn (RAS)
PB4(UCAS)
Byte control
PB5(LCAS)
RD(WE)
Note: n = 2 to 5
Figure 6.21 Control Timing (Upper-Byte Write Access When CSEL = 0)
Rev. 2.0, 06/04, page 164 of 980
6.5.10
Burst Operation
With DRAM, in addition to full access (normal access) in which data is accessed by outputting a
row address for each access, a fast page mode is also provided which can be used when making a
number of consecutive accesses to the same row address. This mode enables fast (burst) access of
data by simply changing the column address after the row address has been output. Burst access
can be selected by setting the BE bit to 1 in DRCRA.
Burst Access (Fast Page Mode) Operation Timing: Figure 6.22 shows the operation timing for
burst access. When there are consecutive access cycles for DRAM space, the column address and
CAS signal output cycles (two states) continue as long as the row address is the same for
consecutive access cycles. In burst access, too, the bus cycle can be extended by inserting wait
states between Tc1 and Tc2. The wait state insertion method and timing are the same as for full
access: see section 6.5.8, Wait Control, for details.
The row address used for the comparison is determined by the bus width of the relevant area set in
bits MXC1 and MXC0 in DRCRB, and in ABWCR. Table 6.9 shows the compared row addresses
corresponding to the various settings of bits MXC1 and MXC0, and ABWCR.
Tp
Tr
Tc1
Tc2
Tc1
Tc2
φ
A23 to A0
AS
Row
Column 1
Column 2
High level
CSn(RAS)
PB4/PB5
(UCAS /LCAS)
Read access
RD(WE)
D15 to D0
PB4/PB5
(UCAS/LCAS)
Write access
RD(WE)
D15 to D0
Note: n = 2 to 5
Figure 6.22 Operation Timing in Fast Page Mode
Rev. 2.0, 06/04, page 165 of 980
Table 6.9
Correspondence between Settings of MXC1 and MXC0 Bits and ABWCR, and
Row Address Compared in Burst Access
DRCRB
ABWCR
Operating Mode
MXC1
MXC0
ABWn
Bus Width
Compared Row Address
Modes 1 and 2
(1-Mbyte)
0
0
0
16 bits
A19 to A9
1
8 bits
A19 to A8
0
16 bits
A19 to A10
1
8 bits
A19 to A9
0
16 bits
A19 to A11
1
8 bits
A19 to A10
1
—
—
Illegal setting
0
0
16 bits
A23 to A9
1
8 bits
A23 to A8
0
16 bits
A23 to A10
1
8 bits
A23 to A9
0
16 bits
A23 to A11
1
8 bits
A23 to A10
—
—
Illegal setting
1
1
Modes 3, 4, and 5
(16-Mbyte)
0
0
1
1
0
1
Note: n = 2 to 5
RAS Down Mode and RAS Up Mode: With DRAM provided with fast page mode, as long as
accesses are to the same row address, burst operation can be continued without interruption even
if accesses are not consecutive by holding the RAS signal low.
• RAS Down Mode
To select RAS down mode, set the BE and RDM bits to 1 in DRCRA. If access to DRAM
space is interrupted and another space is accessed, the RAS signal is held low during the
access to the other space, and burst access is performed if the row address of the next DRAM
space access is the same as the row address of the previous DRAM space access. Figure 6.23
shows an example of the timing in RAS down mode.
Rev. 2.0, 06/04, page 166 of 980
External space
access
DRAM access
Tp
Tr
Tc1
Tc2
T1
T2
DRAM access
Tc1
Tc2
φ
A23 to A0
AS
CSn (RAS)
PB4/PB5
(UCAS/LCAS)
D15 to D0
Note: n = 2 to 5
Figure 6.23 Example of Operation Timing in RAS Down Mode (CSEL = 0)
When RAS down mode is selected, the conditions for an asserted RASn signal to return to the
high level are as shown below. The timing in these cases is shown in figure 6.24.
 When DRAM space with a different row address is accessed
 Immediately before a CAS-before-RAS refresh cycle
 When the BE bit or RDM bit is cleared to 0 in DRCRA
 Immediately before release of the external bus
Rev. 2.0, 06/04, page 167 of 980
DRAM access cycle
φ
RASn
(a) Access to DRAM space with a different row address
CBR refresh cycle
φ
RASn
(b) CAS-before-RAS refresh cycle
DRCRA write cycle
φ
RASn
(c) BE bit or RDM bit cleared to 0 in DRCRA
External bus released
φ
High-impedance
RASn
(d) External bus released
Note: n = 2 to 5
Figure 6.24 RASn
RAS Negation Timing when RAS Down Mode is Selected
Rev. 2.0, 06/04, page 168 of 980
When RAS down mode is selected, the CAS-before-RAS refresh function provided with this
DRAM interface must always be used as the DRAM refreshing method. When a refresh
operation is performed, the RAS signal goes high immediately beforehand. The refresh
interval setting must be made so that the maximum DRAM RAS pulse width specification is
observed.
When the self-refresh function is used, the RDM bit must be cleared to 0, and RAS up mode
selected, before executing a SLEEP instruction in order to enter software standby mode.
Select RAS down mode again after exiting software standby mode.
Note that RAS down mode cannot be used when HWR and LWR are selected for UCAS and
LCAS, a device other than DRAM is connected to external space, and HWR and LWR are
used as write strobes.
• RAS Up Mode
To select RAS up mode, clear the RDM bit to 0 in DRCRA. Each time access to DRAM space
is interrupted and another space is accessed, the RAS signal returns to the high level. Burst
operation is only performed if DRAM space is continuous. Figure 6.25 shows an example of
the timing in RAS up mode.
DRAM access
Tp
Tr
Tc1
DRAM access
Tc2
Tc1
Tc2
External space
access
T1
T2
φ
A23 to A0
AS
CSn(RAS)
PB4/PB5
(UCAS/LCAS)
D15 to D0
Note: n = 2 to 5
Figure 6.25 Example of Operation Timing in RAS Up Mode
Rev. 2.0, 06/04, page 169 of 980
6.5.11
Refresh Control
The H8/3029 is provided with a CAS-before-RAS (CBR) function and self-refresh function as
DRAM refresh control functions.
CAS-Before-RAS (CBR) Refreshing: To select CBR refreshing, set the RCYCE bit to 1 in
DRCRB.
With CBR refreshing, RTCNT counts up using the input clock selected by bits CKS2 to CKS0 in
RTMCSR, and a refresh request is generated when the count matches the value set in RTCOR
(compare match). At the same time, RTCNT is reset and starts counting up again from H'00.
Refreshing is thus repeated at fixed intervals determined by RTCOR and bits CKS2 to CKS0. A
refresh cycle is executed after this refresh request has been accepted and the DRAM interface has
acquired the bus. Set a value in bits CKS2 to CKS0 in RTCOR that will meet the refresh interval
specification for the DRAM used. When RAS down mode is used, set the refresh interval so that
the maximum RAS pulse width specification is met.
RTCNT starts counting up when bits CKS2 to CKS0 are set. RTCNT and RTCOR settings should
therefore be completed before setting bits CKS2 to CKS0.
Also note that a repeat refresh request generated during a bus request, or a refresh request during
refresh cycle execution, will be ignored.
RTCNT operation is shown in figure 6.26, compare match timing in figure 6.27, and CBR refresh
timing in figures 6.28 and 6.29.
RTCNT
RTCOR
H'00
Refresh request
Figure 6.26 RTCNT Operation
Rev. 2.0, 06/04, page 170 of 980
φ
RTCNT
N
H'00
RTCOR
N
Refresh request signal
and CMF bit setting signal
Figure 6.27 Compare Match Timing
TRp
TR1
TR2
φ
Address bus*
Area 2 start address
CSn(RAS)
PB4/PB5
(UCAS/LCAS)
RD(WE)
High
RFSH
AS
High level
Note: * In address update mode 1, the area 2 start address is output.
In address update mode 2, the address in the preceding bus cycle is retained.
Figure 6.28 CBR Refresh Timing (CSEL = 0, TPC = 0, RLW = 0)
The basic CBS refresh cycle timing comprises three states: one RAS precharge cycle (TRP) state,
and two RAS output cycle (TR1, TR2) states. Either one or two states can be selected for the RAS
precharge cycle. When the TPC bit is set to 1 in DRCRB, RAS signal output is delayed by one
cycle. This does not affect the timing of UCAS and LCAS output.
Rev. 2.0, 06/04, page 171 of 980
Use the RLW bit in DRCRB to adjust the RAS signal width. A single refresh wait state (TRW) can
be inserted between the TR1 state and TR2 state by setting the RLW bit to 1.
The RLW bit setting is valid only for CBR refresh cycles, and does not affect DRAM read/write
cycles. The number of states in the CBR refresh cycle is not affected by the settings in ASTCR,
WCRH, or WCRL, or by the state of the WAIT pin.
Figure 6.29 shows the timing when the TPC bit and RLW bit are both set to 1.
TRp1
TRP2
TR1
TRW
TR2
φ
Address bus*
Area 2 start address
CSn(RAS)
PB4/PB5
(UCAS/LCAS)
RD(WE)
High
RFSH
AS
High level
Note: * In address update mode 1, the area 2 start address is output.
In address update mode 2, the address in the preceding bus cycle is retained.
Figure 6.29 CBR Refresh Timing (CSEL = 0, TPC = 1, RLW = 1)
DRAM must be refreshed immediately after powering on in order to stabilize its internal state.
When using the H8/3029 CAS-before-RAS refresh function, therefore, a DRAM stabilization
period should be provided by means of interrupts by another timer module, or by counting the
number of times bit 7 (CMF) of RTMCSR is set, for instance, immediately after bits DRAS2 to
DRAS0 have been set in DRCRA.
Self-Refreshing: A self-refresh mode (battery backup mode) is provided for DRAM as a kind of
standby mode. In this mode, refresh timing and refresh addresses are generated within the
DRAM. The H8/3029 has a function that places the DRAM in self-refresh mode when the chip
enters software standby mode.
Rev. 2.0, 06/04, page 172 of 980
To use the self-refresh function, set the SRFMD bit to 1 in DRCRA. When a SLEEP instruction is
subsequently executed in order to enter software standby mode, the CAS and RAS signals are
output and the DRAM enters self-refresh mode, as shown in figure 6.30.
When the chip exits software standby mode, CAS and RAS outputs go high.
The following conditions must be observed when the self-refresh function is used:
• When burst access is selected, RAS up mode must be selected before executing a SLEEP
instruction in order to enter software standby mode. Therefore, if RAS down mode has been
selected, the RDM bit in DRCRA must be cleared to 0 and RAS up mode selected before
executing the SLEEP instruction. Select RAS down mode again after exiting software standby
mode.
• The instruction immediately following a SLEEP instruction must not be located in an area
designated as DRAM space.
The self-refresh function will not work properly unless the above conditions are observed.
Software standby
mode
Oscillation stabilization
time
φ
Address bus
High-impedance
CSn(RAS)
PB4(UCAS)
PB5(LCAS)
RD(WE)
RFSH
Figure 6.30 Self-Refresh Timing (CSEL = 0)
RFSH):
Refresh Signal (RFSH
RFSH A refresh signal (RFSH) that transmits a refresh cycle off-chip can be
output by setting the RFSHE bit to 1 in DRCRA. RFSH output timing is shown in figures 6.28,
6.29, and 6.30.
Rev. 2.0, 06/04, page 173 of 980
6.5.12
Examples of Use
Examples of DRAM connection and program setup procedures are shown below. When the
DRAM interface is used, check the DRAM device characteristics and choose the most appropriate
method of use for that device.
Connection Examples
• Figure 6.31 shows typical interconnections when using two 2-CAS type 16-Mbit DRAMs
using a × 16-bit organization, and the corresponding address map. The DRAMs used in this
example are of the 10-bit row address × 10-bit column address type. Up to four DRAMs can
be connected by designating areas 2 to 5 as DRAM space.
Rev. 2.0, 06/04, page 174 of 980
2-CAS 16-Mbit DRAM
10-bit row address x 10-bit column address
x16-bit organization
H8/3029
CS2 (RAS2)
CS3 (RAS3)
PB4(UCAS)
PB5(LCAS)
RD (WE)
RAS
UCAS
LCAS
No.1
WE
A10-A1
A9-A0
D15-D0
D15-D0
OE
RAS
UCAS
LCAS
WE
No.2
A9-A0
D15-D0
OE
(a) Interconnections (example)
PB5
(LCAS)
PB4
(UCAS)
15
87
0
H'400000
Area 2
DRAM (No.1)
CS2(RAS2)
DRAM (No.2)
CS3(RAS3)
H'5FFFFE
H'600000
Area 3
H'7FFFFE
H'800000
Area 4
Normal
CS4
Normal
CS5
H'9FFFFE
H'A00000
Area 5
H'BFFFFE
(b) Address map
Figure 6.31 Interconnections and Address Map for 2-CAS 16-Mbit DRAMs with × 16-Bit
Organization
Rev. 2.0, 06/04, page 175 of 980
• Figure 6.32 shows typical interconnections when using two 16-Mbit DRAMs using a × 8-bit
organization, and the corresponding address map. The DRAMs used in this example are of the
11-bit row address × 10-bit column address type. The CS2 pin is used as the common RAS
output pin for areas 2 and 3. When the DRAM address space spans a number of contiguous
areas, as in this example, the appropriate setting of bits DRAS2 to DRAS0 enables a single CS
pin to be used as the common RAS output pin for a number of areas, and makes it possible to
directly connect large-capacity DRAM with address space that spans a maximum of four
areas. Any unused CS pins (in this example, the CS3 pin) can be used as input/output ports.
2-CAS 16-Mbit DRAM
11-bit row address x 10-bit column address
x8-bit organization
H8/3029
RAS
CS2 (RAS2)
PB4 (UCAS)
PB5 (LCAS)
RD (WE)
CAS
WE
A21, A10-A1
No.1
A10-A0
D7-D0
D15-D8
D7-D0
OE
RAS
CAS
WE
No.2
A10-A0
D7-D0
OE
(a) Interconnections (example)
PB5
PB4
(LCAS)
(UCAS)
15
87
0
H'400000
Area 2
H'5FFFFE
H'600000
DRAM
(No.1)
DRAM
(No.2)
CS2(RAS2)
Area 3
H'7FFFFE
H'800000
Area 4
Normal
CS4
Normal
CS5
H'9FFFFE
H'A00000
Area 5
H'BFFFFE
16-Mbyte mode
(b) Address map
Figure 6.32 Interconnections and Address Map for 16-Mbit DRAMs with × 8-Bit
Organization
Rev. 2.0, 06/04, page 176 of 980
• Figure 6.33 shows typical interconnections when using two 4-Mbit DRAMs, and the
corresponding address map. The DRAMs used in this example are of the 9-bit row address ×
9-bit column address type. In this example, upper address decoding allows multiple DRAMs
to be connected to a single area. The RFSH pin is used in this case, since both DRAMs must
be refreshed simultaneously. However, note that RAS down mode cannot be used in this
interconnection example.
2-CAS 4-Mbit DRAM
9-bit row address x 9-bit column address
x16-bit organization
H8/3029
CS2 (RAS2)
PB4 (UCAS)
RAS
UCAS
PB5 (LCAS)
RD (WE)
LCAS
WE
No.1
RFSH
A19
A9-A1
A8-A0
D15-D0
D15-D0
RAS
UCAS
LCAS
WE
OE
No.2
A8-A0
D15-D0
OE
(a) Interconnections (example)
PB4
(UCAS)
15
PB5
(LCAS)
87
0
H'400000
DRAM (No.1)
H'47FFFE
H'480000
DRAM (No.2)
Area 2
H'4FFFFE
H'500000
CS2 (RAS2)
Not used
H'5FFFFE
16-Mbyte mode
(b) Address map
Figure 6.33 Interconnections and Address Map for 2-CAS 4-Mbit DRAMs with × 16-Bit
Organization
Rev. 2.0, 06/04, page 177 of 980
Example of Program Setup Procedure: Figure 6.34 shows an example of the program setup
procedure.
Set ABWCR
Set RTCOR
Set bits CKS2 to CKS0 in RTMCSR
Set DRCRB
Set DRCRA
Wait for DRAM stabilization time
DRAM can be accessed
Figure 6.34 Example of Setup Procedure when Using DRAM Interface
6.5.13
Usage Notes
Note the following points when using the DRAM refresh function.
• Refresh cycles will not be executed when the external bus released state, software standby
mode, or a bus cycle is extended by means of wait state insertion. Refreshing must therefore
be performed by other means in these cases.
• If a refresh request is generated internally while the external bus is released, the first request is
retained and a single refresh cycle will be executed after the bus-released state is cleared.
Figure 6.35 shows the bus cycle in this case.
• When a bus cycle is extended by means of wait state insertion, the first request is retained in
the same way as when the external bus has been released.
• In the event of contention with a bus request from an external bus master when a transition is
made to software standby mode, the BACK and strobe states may be indeterminate after the
transition to software standby mode (see figure 6.36).
Rev. 2.0, 06/04, page 178 of 980
When software standby mode is used, the BRLE bit should be cleared to 0 in BRCR before
executing the SLEEP instruction.
Similar contention in a transition to self-refresh mode may prevent dependable strobe
waveform output. This can also be avoided by clearing the BRLE bit to 0 in BRCR.
• Immediately after self-refreshing is cleared, external bus release is possible during a given
period until the start of a CPU cycle. Attention must be paid to the RAS state to ensure that
the specification for the RAS precharge time immediately after self-refreshing is met.
External bus released
Refresh cycle
CPU cycle
Refresh cycle
φ
RFSH
Refresh
request
BACK
Figure 6.35
Bus-Released State and Refresh Cycles
Software standby mode
φ
BREQ
BACK
Address bus
Strobe
Figure 6.36 Bus-Released State and Software Standby Mode
Rev. 2.0, 06/04, page 179 of 980
Oscillation stabilization
CPU internal cycle
time on exit from software (period in which external
standby mode
bus can be released)
CPU cycle
φ
Address
@SP
RAS
CAS
Figure 6.37 Self-Refresh Clearing
Rev. 2.0, 06/04, page 180 of 980
6.6
Interval Timer
6.6.1
Operation
When DRAM is not connected to the H8/3029 chip, the refresh timer can be used as an interval
timer by clearing bits DRAS2 to DRAS0 in DRCRA to 0. After setting RTCOR, selection a clock
source with bits CKS2 to CKS0 in RTMCSR, and set the CMIE bit to 1.
Timing of Setting of Compare Match Flag and Clearing by Compare Match: The CMF flag
in RTMCSR is set to 1 by a compare match output when the RTCOR and RTCNT values match.
The compare match signal is generated in the last state in which the values match (when RTCNT
is updated from the matching value to a new value). Accordingly, when RTCNT and RTCOR
match, the compare match signal is not generated until the next counter clock pulse. Figure 6.38
shows the timing.
φ
RTCNT
RTCOR
N
H'00
N
Compare match
signal
CMF flag
Figure 6.38 Timing of CMF Flag Setting
Operation in Power-Down State: The interval timer operates in sleep mode. It does not operate
in hardware standby mode. In software standby mode, RTCNT and RTMCSR bits 7 and 6 are
initialized, but RTMCSR bits 5 to 3 and RTCOR retain their settings prior to the transition to
software standby mode.
Contention between RTCNT Write and Counter Clear: If a counter clear signal occurs in the
T3 state of an RTCNT write cycle, clearing of the counter takes priority and the write is not
performed. See figure 6.39.
Rev. 2.0, 06/04, page 181 of 980
T1
T2
T3
φ
RTCNT address
Address bus
Internal write signal
Counter clear signal
RTCNT
N
H'00
Figure 6.39 Contention between RTCNT Write and Clear
Contention between RTCNT Write and Increment: If an increment pulse occurs in the T3 state
of an RTCNT write cycle, writing takes priority and RTCNT is not incremented. See figure 6.40.
T1
T2
T3
φ
Address bus
RTCNT address
Internal write signal
RTCNT input clock
RTCNT
N
M
Counter write data
Figure 6.40 Contention between RTCNT Write and Increment
Rev. 2.0, 06/04, page 182 of 980
Contention between RTCOR Write and Compare Match: If a compare match occurs in the T3
state of an RTCOR write cycle, writing takes priority and the compare match signal is inhibited.
See figure 6.41.
T1
T2
T3
φ
Address bus
RTCOR address
Internal write signal
RTCNT
N
N+1
RTCOR
N
M
RTCOR write data
Compare match signal
Inhibited
Figure 6.41 Contention between RTCOR Write and Compare Match
RTCNT Operation at Internal Clock Source Switchover: Switching internal clock sources may
cause RTCNT to increment, depending on the switchover timing. Table 6.10 shows the relation
between the time of the switchover (by writing to bits CKS2 to CKS0) and the operation of
RTCNT.
The RTCNT input clock is generated from the internal clock source by detecting the falling edge
of the internal clock. If a switchover is made from a high clock source to a low clock source, as in
case No. 3 in table 6.10, the switchover will be regarded as a falling edge, an RTCNT clock pulse
will be generated, and RTCNT will be incremented.
Rev. 2.0, 06/04, page 183 of 980
Table 6.10 Internal Clock Switchover and RTCNT Operation
No.
1
CKS2 to CKS0
Write Timing
Low
Low
switchover*1
RTCNT Operation
Old clock source
New clock source
RTCNT clock
RTCNT
N
N+1
CKS bits rewritten
2
Low
High
switchover*2
Old clock source
New clock source
RTCNT clock
RTCNT
N
N+1
N+2
CKS bits rewritten
Rev. 2.0, 06/04, page 184 of 980
No.
3
CKS2 to CKS0
Write Timing
High
Low
switchover*3
RTCNT Operation
Old clock source
New clock source
*4
RTCNT clock
RTCNT
N
N+1
N+2
CKS bits rewritten
4
High
High
switchover*4
Old clock source
New clock source
RTCNT clock
RTCNT
N
N+1
N+2
CKS bits rewritten
Notes: *1
*2
*3
*4
Including switchovers from a low clock source to the halted state, and from the halted state to a low clock source.
Including switchover from the halted state to a high clock source.
Including switchover from a high clock source to the halted state.
The switchover is regarded as a falling edge, causing RTCNT to increment.
Rev. 2.0, 06/04, page 185 of 980
6.7
Interrupt Sources
Compare match interrupts (CMI) can be generated when the refresh timer is used as an interval
timer. Compare match interrupt requests are masked/unmasked with the CMIE bit in RTMCSR.
6.8
Burst ROM Interface
6.8.1
Overview
With the H8/3029, external space area 0 can be designated as burst ROM space, and burst ROM
space interfacing can be performed. The burst ROM space interface enables 16-bit organization
ROM with burst access capability to be accessed at high speed. Area 0 is designated as burst
ROM space by means of the BROME bit in BCR.
Continuous burst access of a maximum or four or eight words can be performed on external space
area 0. Two or three states can be selected for burst access.
6.8.2
Basic Timing
The number of states in the initial cycle (full access) and a burst cycle of the burst ROM interface
is determined by the setting of the AST0 bit in ASTCR. When the AST0 bit is set to 1, wait states
can also be inserted in the initial cycle. Wait states cannot be inserted in a burst cycle.
Burst access of up to four words is performed when the BRSTS0 bit is cleared to 0 in BCR, and
burst access of up to eight words when the BRSTS0 bit is set to 1. The number of burst access
states is two when the BRSTS1 bit is cleared to 0, and three when the BRSTS1 bit is set to 1.
The basic access timing for burst ROM space is shown in figure 6.42.
Rev. 2.0, 06/04, page 186 of 980
Full access
T1
T2
Burst access
T3
T1
T2
T1
T2
φ
Address bus
Only lower address changes
CS0
AS
RD
Data bus
Read data
Read data
Read data
Figure 6.42 Example of Burst ROM Access Timing
6.8.3
Wait Control
As with the basic bus interface, either program wait insertion or pin wait insertion using the WAIT
pin can be used in the initial cycle (full access) of the burst ROM interface.
Wait states cannot be inserted in a burst cycle.
Rev. 2.0, 06/04, page 187 of 980
6.9
Idle Cycle
6.9.1
Operation
When the H8/3029 chip accesses external space, it can insert a 1-state idle cycle (TI) between bus
cycles in the following cases: (1) when read accesses between different areas occur consecutively,
(2) when a write cycle occurs immediately after a read cycle, and (3) immediately after a DRAM
space access. By inserting an idle cycle it is possible, for example, to avoid data collisions
between ROM, which has a long output floating time, and high-speed memory, I/O interfaces, and
so on.
The ICIS1 and ICIS0 bits in BCR both have an initial value of 1, so that an idle cycle is inserted in
the initial state. If there are no data collisions, the ICIS bits can be cleared.
Consecutive Reads between Different Areas: If consecutive reads between different areas occur
while the ICIS1 bit is set to 1 in BCR, an idle cycle is inserted at the start of the second read cycle.
Figure 6.43 shows an example of the operation in this case. In this example, bus cycle A is a read
cycle from ROM with a long output floating time, and bus cycle B is a read cycle from SRAM,
each being located in a different area. In (a), an idle cycle is not inserted, and a collision occurs in
cycle B between the read data from ROM and that from SRAM. In (b), an idle cycle is inserted,
and a data collision is prevented.
Bus cycle A Bus cycle B
φ
T1
T2
T3
T1
T2
Bus cycle A Bus cycle B
φ
Address bus
Address bus
RD
RD
Data bus
Data bus
Long buffer-off
time
(a) Idle cycle not inserted
T1
T2
T3
Ti T1
T2
Data
collision
(b) Idle cycle inserted
Figure 6.43 Example of Idle Cycle Operation (1) (ICIS1 = 1)
Write after Read: If an external write occurs after an external read while the ICIS0 bit is set to 1
in BCR, an idle cycle is inserted at the start of the write cycle.
Figure 6.44 shows an example of the operation in this case. In this example, bus cycle A is a read
cycle from ROM with a long output floating time, and bus cycle B is a CPU write cycle.
Rev. 2.0, 06/04, page 188 of 980
In (a), an idle cycle is not inserted, and a collision occurs in cycle B between the read data from
ROM and the CPU write data. In (b), an idle cycle is inserted, and a data collision is prevented.
Bus cycle A Bus cycle B
φ
T1
T2
T3
T1
T2
Bus cycle A Bus cycle B
φ
Address bus
Address bus
RD
HWR
RD
HWR
Data bus
Data bus
Long buffer-off
time
(a) Idle cycle not inserted
T1
T2
T3
Ti T1
T2
Data
collision
(b) Idle cycle inserted
Figure 6.44 Example of Idle Cycle Operation (2) (ICIS0 = 1)
External Address Space Access Immediately after DRAM Space Access: If a DRAM space
access is followed by a non-DRAM external access when HWR and LWR have been selected as
the UCAS and LCAS output pins by means of the CSEL bit in DRCRB, a Ti cycle is inserted
regardless of the settings of bits ICIS0 and ICIS1 in BCR. Figure 6.45 shows an example of the
operation.
This is done to prevent simultaneous changing of the HWR and LWR signals used as UCAS and
LCAS in DRAM space and CSn for the space in the next cycle, and so avoid an erroneous write to
the external device in the next cycle.
A Ti cycle is not inserted when PB4 and PB5 have been selected as the UCAS and LCAS output
pins.
In the case of consecutive DRAM space access precharge cycles (Tp), the ICIS0 bit settings are
invalid. In the case of consecutive reads between different areas, for example, if the second
access is a DRAM access, only a Tp cycle is inserted, and a Ti cycle is not. The timing in this case
is shown in figure 6.46.
Rev. 2.0, 06/04, page 189 of 980
Bus cycle A
(DRAM access cycle) Bus cycle B
φ
Tp
Tr Tc1 Tc2 T1
Bus cycle A
(DRAM access cycle) Bus cycle B
T2
φ
Address bus
Address bus
HWR/LWR
(UCAS/LCAS)
HWR/LWR
(UCAS/LCAS)
CSn
CSn
Tp
Tr Tc1 Tc2 Ti
T1
T2
Simultaneous change of
HWR/LWR and CSn
(a) Idle cycle not inserted
(b) Idle cycle inserted
HWR/LWR
Figure 6.45 Example of Idle Cycle Operation (3) (HWR
HWR LWR Used as UCAS/LCAS
UCAS LCAS)
LCAS
External read
T1
T2
T3
DRAM space read
Tp
Tr
Tc1
Tc2
φ
Address bus
RD
UCAS/LCAS
Address bus
Figure 6.46 Example of Idle Cycle Operation (4) (Consecutive Precharge Cycles)
Usage Notes: When non-insertion of idle cycles is set, the rise (negation) of RD and the fall
(assertion) of CSn may occur simultaneously. An example of the operation is shown in figure
6.47.
If consecutive reads between different external areas occur while the ICIS1 bit is cleared to 0 in
BCR, or if a write cycle to a different external area occurs after an external read while the ICIS0
bit is cleared to 0, the RD negation in the first read cycle and the CSn assertion in the following
bus cycle will occur simultaneously. Therefore, depending on the output delay time of each signal,
it is possible that the low-level output of RD in the preceding read cycle and the low-level output
of CSn in the following bus cycle will overlap.
A setting whereby idle cycle insertion is not performed can be made only when RD and CSn do
not change simultaneously, or when it does not matter if they do.
Rev. 2.0, 06/04, page 190 of 980
Bus cycle A
φ
T1
T2
T3
Bus cycle B
T1
Bus cycle A
T2
φ
Address bus
Address bus
RD
RD
CSn
CSn
T1
T2
T3
Bus cycle B
Ti
T1
T2
Simultaneous change of RD and CSn
Possibility of mutual overlap
(a) Idle cycle not inserted
(b) Idle cycle inserted
Figure 6.47 Example of Idle Cycle Operation (5)
6.9.2
Pin States in Idle Cycle
Table 6.11 shows the pin states in an idle cycle.
Table 6.11 Pin States in Idle Cycle
Pins
Pin State
A23 to A0
Next cycle address value
D15 to D0
High impedance
CSn
High*
UCAS, LCAS
High
AS
High
RD
High
HWR
High
LWR
Note:
High
*
Remains low in DRAM space RAS down mode.
Rev. 2.0, 06/04, page 191 of 980
6.10
Bus Arbiter
The bus controller has a built-in bus arbiter that arbitrates between different bus masters. There
are four bus masters: the CPU, DMA controller (DMAC), DRAM interface, and an external bus
master. When a bus master has the bus right it can carry out read, write, or refresh access. Each
bus master uses a bus request signal to request the bus right. At fixed times the bus arbiter
determines priority and uses a bus acknowledge signal to grant the bus to a bus master, which can
the operate using the bus.
The bus arbiter checks whether the bus request signal from a bus master is active or inactive, and
returns an acknowledge signal to the bus master. When two or more bus masters request the bus,
the highest-priority bus master receives an acknowledge signal. The bus master that receives an
acknowledge signal can continue to use the bus until the acknowledge signal is deactivated.
The bus master priority order is:
(High)
External bus master > DRAM interface > DMAC > CPU
(Low)
The bus arbiter samples the bus request signals and determines priority at all times, but it does not
always grant the bus immediately, even when it receives a bus request from a bus master with
higher priority than the current bus master. Each bus master has certain times at which it can
release the bus to a higher-priority bus master.
6.10.1
Operation
CPU: The CPU is the lowest-priority bus master. If the DMAC, DRAM interface, or an external
bus master requests the bus while the CPU has the bus right, the bus arbiter transfers the bus right
to the bus master that requested it. The bus right is transferred at the following times:
• The bus right is transferred at the boundary of a bus cycle. If word data is accessed by two
consecutive byte accesses, however, the bus right is not transferred between the two byte
accesses.
• If another bus master requests the bus while the CPU is performing internal operations, such as
executing a multiply or divide instruction, the bus right is transferred immediately. The CPU
continues its internal operations.
• If another bus master requests the bus while the CPU is in sleep mode, the bus right is
transferred immediately.
DMAC: When the DMAC receives an activation request, it requests the bus right from the bus
arbiter. If the DMAC is bus master and the DRAM interface or an external bus master requests
the bus, the bus arbiter transfers the bus right from the DMAC to the bus master that requested the
bus. The bus right is transferred at the following times.
Rev. 2.0, 06/04, page 192 of 980
The bus right is transferred when the DMAC finishes transferring one byte or one word. A
DMAC transfer cycle consists of a read cycle and a write cycle. The bus right is not transferred
between the read cycle and the write cycle.
There is a priority order among the DMAC channels. For details see section 7.4.9, MultipleChannel Operation.
DRAM Interface: The DRAM interface requests the bus right from the bus arbiter when a refresh
cycle request is issued, and releases the bus at the end of the refresh cycle. For details see section
6.5, DRAM Interface.
External Bus Master: When the BRLE bit is set to 1 in BRCR, the bus can be released to an
external bus master. The external bus master has highest priority, and requests the bus right from
the bus arbiter driving the BREQ signal low. Once the external bus master acquires the bus, it
keeps the bus until the BREQ signal goes high. While the bus is released to an external bus
master, the H8/3029 chip holds the address bus, data bus, bus control signals (AS, RD, HWR, and
LWR), and chip select signals (CSn: n = 7 to 0) in the high-impedance state, and holds the BACK
pin in the low output state.
The bus arbiter samples the BREQ pin at the rise of the system clock (φ). If BREQ is low, the bus
is released to the external bus master at the appropriate opportunity. The BREQ signal should be
held low until the BACK signal goes low.
When the BREQ pin is high in two consecutive samples, the BACK pin is driven high to end the
bus-release cycle.
Figure 6.48 shows the timing when the bus right is requested by an external bus master during a
read cycle in a two-state access area. There is a minimum interval of three states from when the
BREQ signal goes low until the bus is released.
Rev. 2.0, 06/04, page 193 of 980
CPU cycles
T0
φ
T1
External bus released
High-impedance
Address
Address bus
CPU cycles
T2
High-impedance
Data bus
High-impedance
AS
RD
High-impedance
High
HWR, LWR
High-impedance
BREQ
BACK
Minimum 3 cycles
(1)
(2)
(3)
(4)
(5)
(6)
Figure 6.48 Example of External Bus Master Operation
In the event of contention with a bus request from an external bus master when a transition is
made to software standby mode, the BACK and strobe states may be indeterminate after the
transition to software standby mode (see figure 6.36).
When software standby mode is used, the BRLE bit should be cleared to 0 in BRCR before
executing the SLEEP instruction.
Rev. 2.0, 06/04, page 194 of 980
6.11
Register and Pin Input Timing
6.11.1
Register Write Timing
ABWCR, ASTCR, WCRH, and WCRL Write Timing: Data written to ABWCR, ASTCR,
WCRH, and WCRL takes effect starting from the next bus cycle. Figure 6.49 shows the timing
when an instruction fetched from area 0 changes area 0 from three-state access to two-state access.
T1
T2
T3
T1
T2
T3
T1
T2
φ
Address bus
ASTCR address
3-state access to area 0
2-state access to area 0
Figure 6.49 ASTCR Write Timing
DDR and CSCR Write Timing: Data written to DDR or CSCR for the port corresponding to the
CSn pin to switch between CSn output and generic input takes effect starting from the T3 state of
the DDR write cycle. Figure 6.50 shows the timing when the CS1 pin is changed from generic
input to CS1 output.
T1
T2
T3
φ
Address bus
CS1
P8DDR address
High-impedance
Figure 6.50 DDR Write Timing
Rev. 2.0, 06/04, page 195 of 980
BRCR Write Timing: Data written to BRCR to switch between A23, A22, A21, or A20 output and
generic input or output takes effect starting from the T3 state of the BRCR write cycle. Figure
6.51 shows the timing when a pin is changed from generic input to A23, A22, A21, or A20 output.
T1
T2
T3
φ
Address bus
BRCR address
PA7 to PA4
(A23 to A20)
High-impedance
Figure 6.51 BRCR Write Timing
6.11.2
BREQ Pin Input Timing
After driving the BREQ pin low, hold it low until BACK goes low. If BREQ returns to the high
level before BACK goes lows, the bus arbiter may operate incorrectly.
To terminate the external-bus-released state, hold the BREQ signal high for at least three states. If
BREQ is high for too short an interval, the bus arbiter may operate incorrectly.
Rev. 2.0, 06/04, page 196 of 980
Section 7 DMA Controller
7.1
Overview
The H8/3029 has an on-chip DMA controller (DMAC) that can transfer data on up to four
channels.
When the DMA controller is not used, it can be independently halted to conserve power. For
details see section 20.6, Module Standby Function.
7.1.1
Features
DMAC features are listed below.
• Selection of short address mode or full address mode
Short address mode
 8-bit source address and 24-bit destination address, or vice versa
 Maximum four channels available
 Selection of I/O mode, idle mode, or repeat mode
Full address mode
 24-bit source and destination addresses
 Maximum two channels available
 Selection of normal mode or block transfer mode
• Directly addressable 16-Mbyte address space
• Selection of byte or word transfer
• Activation by internal interrupts, external requests, or auto-request (depending on transfer
mode)
 16-bit timer compare match/input capture interrupts (×3)
 Serial communication interface (SCI channel 0) transmit-data-empty/receive-data-full
interrupts
 External requests
 Auto-request
 A/D converter conversion-end interrupt
Rev. 2.0, 06/04, page 197 of 980
7.1.2
Block Diagram
Figure 7.1 shows a DMAC block diagram.
Internal address bus
Address buffer
IMIA0
IMIA1
IMIA2
ADI
TXI0
RXI0
DREQ0
DREQ1
TEND0
TEND1
Arithmetic-logic unit
MAR0A
Channel
0A
Control logic
ETCR0A
Channel
0
MAR0B
Channel
0B
DTCR0A
Interrupt DEND0A
DEND0B
signals
DEND1A
DEND1B
ETCR0B
Channel
1A
DTCR1A
MAR1B
Internal data bus
Legend
DTCR: Data transfer control register
MAR: Memory address register
IOAR: I/O address register
ETCR: Execute transfer count register
Figure 7.1 Block Diagram of DMAC
Rev. 2.0, 06/04, page 198 of 980
IOAR1A
ETCR1A
Channel
1
Channel
1B
Data buffer
IOAR0B
MAR1A
DTCR0B
DTCR1B
IOAR0A
IOAR1B
ETCR1B
Module data bus
Internal
interrupts
7.1.3
Functional Overview
Table 7.1 gives an overview of the DMAC functions.
Table 7.1
DMAC Functional Overview
Address
Reg. Length
Transfer Mode
Activation
Short
address
mode
I/O mode
• Transfers one byte or one word
per request
• Increments or decrements the
memory address by 1 or 2
• Executes 1 to 65,536 transfers
•
Idle mode
• Transfers one byte or one word per
request
• Holds the memory address fixed
• Executes 1 to 65,536 transfers
Repeat mode
• Transfers one byte or one word per
request
• Increments or decrements the
memory address by 1 or 2
• Executes a specified number (1 to
255) of transfers, then returns to the
initial state and continues
•
Full
address
mode
Source
Destination
Compare match/input
24
capture A interrupts from
16-bit timer channels
0 to 2
Transmit-data-empty
interrupt from SCI channel 0
8
Conversion-end interrupt
from A/D converter
Receive-data-full interrupt
from SCI channel 0
8
24
•
External request
24
8
•
Normal mode
•
• Auto-request
 Retains the transfer request
internally
 Executes a specified number(1 to
65,536) of transfers continuously
 Selection of burst mode or cyclesteal mode
• External request
 Transfers one byte or one word
per request
 Executes 1 to 65,536 transfers
•
Block transfer
Auto-request
External request
24
24
Compare match/ input
24
capture A interrupts from
16-bit timer channels 0 to 2
External request
Conversion-end interrupt
from A/D converter
24
•
•
•
•
•
•
Transfers one block of a specified size
per request
•
Executes 1 to 65,536 transfers
Allows either the source or destination •
to be a fixed block area
Block size can be 1 to 255 bytes or
words
Rev. 2.0, 06/04, page 199 of 980
7.1.4
Input/Output Pins
Table 7.2 lists the DMAC pins.
Table 7.2
DMAC Pins
Channel
Name
Abbreviation
Input/
Output
Function
0
DMA request 0
DREQ0
Input
External request for DMAC channel 0
Transfer end 0
TEND0
Output
Transfer end on DMAC channel 0
DMA request 1
DREQ1
Input
External request for DMAC channel 1
Transfer end 1
TEND1
Output
Transfer end on DMAC channel 1
1
Note: External requests cannot be made to channel A in short address mode.
7.1.5
Register Configuration
Table 7.3 lists the DMAC registers.
Rev. 2.0, 06/04, page 200 of 980
Table 7.3
DMAC Registers
Channel Address* Name
Abbreviation R/W
Initial Value
0
1
Note:
*
H'FFF20
Memory address register 0AR
MAR0AR
R/W
Undetermined
H'FFF21
Memory address register 0AE
MAR0AE
R/W
Undetermined
H'FFF22
Memory address register 0AH
MAR0AH
R/W
Undetermined
H'FFF23
Memory address register 0AL
MAR0AL
R/W
Undetermined
H'FFF26
I/O address register 0A
IOAR0A
R/W
Undetermined
H'FFF24
Execute transfer count register 0AH ETCR0AH
R/W
Undetermined
H'FFF25
Execute transfer count register 0AL ETCR0AL
R/W
Undetermined
H'FFF27
Data transfer control register 0A
DTCR0A
R/W
H'00
H'FFF28
Memory address register 0BR
MAR0BR
R/W
Undetermined
H'FFF29
Memory address register 0BE
MAR0BE
R/W
Undetermined
H'FFF2A
Memory address register 0BH
MAR0BH
R/W
Undetermined
H'FFF2B
Memory address register 0BL
MAR0BL
R/W
Undetermined
H'FFF2E
I/O address register 0B
IOAR0B
R/W
Undetermined
H'FFF2C
Execute transfer count register 0BH ETCR0BH
R/W
Undetermined
H'FFF2D
Execute transfer count register 0BL ETCR0BL
R/W
Undetermined
H'FFF2F
Data transfer control register 0B
DTCR0B
R/W
H'00
H'FFF30
Memory address register 1AR
MAR1AR
R/W
Undetermined
H'FFF31
Memory address register 1AE
MAR1AE
R/W
Undetermined
H'FFF32
Memory address register 1AH
MAR1AH
R/W
Undetermined
H'FFF33
Memory address register 1AL
MAR1AL
R/W
Undetermined
H'FFF36
I/O address register 1A
IOAR1A
R/W
Undetermined
H'FFF34
Execute transfer count register 1AH ETCR1AH
R/W
Undetermined
H'FFF35
Execute transfer count register 1AL ETCR1AL
R/W
Undetermined
H'FFF37
Data transfer control register 1A
DTCR1A
R/W
H'00
H'FFF38
Memory address register 1BR
MAR1BR
R/W
Undetermined
H'FFF39
Memory address register 1BE
MAR1BE
R/W
Undetermined
H'FFF3A
Memory address register 1BH
MAR1BH
R/W
Undetermined
H'FFF3B
Memory address register 1BL
MAR1BL
R/W
Undetermined
H'FFF3E
I/O address register 1B
IOAR1B
R/W
Undetermined
H'FFF3C
Execute transfer count register 1BH ETCR1BH
R/W
Undetermined
H'FFF3D
Execute transfer count register 1BL ETCR1BL
R/W
Undetermined
H'FFF3F
Data transfer control register 1B
R/W
H'00
DTCR1B
The lower 20 bits of the address are indicated.
Rev. 2.0, 06/04, page 201 of 980
7.2
Register Descriptions (1) (Short Address Mode)
In short address mode, transfers can be carried out independently on channels A and B. Short
address mode is selected by bits DTS2A and DTS1A in data transfer control register A (DTCRA)
as indicated in table 7.4.
Table 7.4
Selection of Short and Full Address Modes
Bit 2
Channel DTS2A
Bit 1
DTS1A
Description
0
1
DMAC channel 0 operates as one channel in full address mode
1
1
Other than above
DMAC channels 0A and 0B operate as two independent channels
in short address mode
1
DMAC channel 1 operates as one channel in full address mode
1
Other than above
7.2.1
DMAC channels 1A and 1B operate as two independent channels
in short address mode
Memory Address Registers (MAR)
A memory address register (MAR) is a 32-bit readable/writable register that specifies a source or
destination address. The transfer direction is determined automatically from the activation source.
An MAR consists of four 8-bit registers designated MARR, MARE, MARH, and MARL. All bits
of MARR are reserved; they cannot be modified and are always read as 1.
Bit
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9
8
7
6
5
4
3
2
1
0
Initial value
Undetermined
Read/Write
— — — — — — — — R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MARR
MARE
MARH
MARL
Source or destination address
An MAR functions as a source or destination address register depending on how the DMAC is
activated: as a destination address register if activation is by a receive-data-full interrupt from
serial communication interface (SCI) channel 0 or by an A/D converter conversion-end interrupt,
and as a source address register otherwise.
The MAR value is incremented or decremented each time one byte or word is transferred,
automatically updating the source or destination memory address. For details, see section 7.3.4,
Data Transfer Control Registers (DTCR).
The MARs are not initialized by a reset or in standby mode.
Rev. 2.0, 06/04, page 202 of 980
7.2.2
I/O Address Registers (IOAR)
An I/O address register (IOAR) is an 8-bit readable/writable register that specifies a source or
destination address. The IOAR value is the lower 8 bits of the address. The upper 16 address bits
are all 1 (H'FFFF).
Bit
7
6
5
4
R/W
R/W
R/W
Initial value
Read/Write
3
2
1
0
R/W
R/W
R/W
Undetermined
R/W
R/W
Source or destination address
An IOAR functions as a source or destination address register depending on how the DMAC is
activated: as a destination address register if activation is by a receive-data-full interrupt from
serial communication interface (SCI) channel 0 or by an A/D converter conversion-end interrupt,
and as a source address register otherwise.
The IOAR value is held fixed. It is not incremented or decremented when a transfer is executed.
The IOARs are not initialized by a reset or in standby mode.
7.2.3
Execute Transfer Count Registers (ETCR)
An execute transfer count register (ETCR) is a 16-bit readable/writable register that specifies the
number of transfers to be executed. These registers function in one way in I/O mode and idle
mode, and another way in repeat mode.
• I/O mode and idle mode
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
Undetermined
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Transfer counter
In I/O mode and idle mode, ETCR functions as a 16-bit counter. The count is decremented by
1 each time one transfer is executed. The transfer ends when the count reaches H'0000.
Rev. 2.0, 06/04, page 203 of 980
• Repeat mode
Bit
7
6
5
Initial value
Read/Write
4
3
2
1
0
R/W
R/W
R/W
2
1
0
R/W
R/W
R/W
Undetermined
R/W
R/W
R/W
R/W
R/W
ETCRH
Transfer counter
Bit
7
6
5
R/W
R/W
R/W
Initial value
Read/Write
4
3
Undetermined
R/W
R/W
ETCRL
Initial count
In repeat mode, ETCRH functions as an 8-bit transfer counter and ETCRL holds the initial
transfer count. ETCRH is decremented by 1 each time one transfer is executed. When ETCRH
reaches H'00, the value in ETCRL is reloaded into ETCRH and the same operation is repeated.
The ETCRs are not initialized by a reset or in standby mode.
Rev. 2.0, 06/04, page 204 of 980
7.2.4
Data Transfer Control Registers (DTCR)
A data transfer control register (DTCR) is an 8-bit readable/writable register that controls the
operation of one DMAC channel.
Bit
7
6
5
4
3
2
1
0
DTE
DTSZ
DTID
RPE
DTIE
DTS2
DTS1
DTS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Data transfer enable
Enables or disables
data transfer
Data transfer select
These bits select the data
transfer activation source
Data transfer size
Selects byte or
word size
Data transfer interrupt enable
Enables or disables the CPU interrupt
at the end of the transfer
Data transfer
increment/decrement
Selects whether to
increment or decrement
the memory address
register
Repeat enable
Selects repeat
mode
The DTCRs are initialized to H'00 by a reset and in standby mode.
Bit 7—Data Transfer Enable (DTE): Enables or disables data transfer on a channel. When the
DTE bit is set to 1, the channel waits for a transfer to be requested, and executes the transfer when
activated as specified by bits DTS2 to DTS0. When DTE is 0, the channel is disabled and does not
accept transfer requests. DTE is set to 1 by reading the register when DTE is 0, then writing 1.
Bit 7
DTE
Description
0
Data transfer is disabled. In I/O mode or idle mode, DTE is cleared to 0
when the specified number of transfers have been completed
1
Data transfer is enabled
(Initial value)
If DTIE is set to 1, a CPU interrupt is requested when DTIE is cleared to 0.
Rev. 2.0, 06/04, page 205 of 980
Bit 6—Data Transfer Size (DTSZ): Selects the data size of each transfer.
Bit 6
DTSZ
Description
0
Byte-size transfer
1
Word-size transfer
(Initial value)
Bit 5—Data Transfer Increment/Decrement (DTID): Selects whether to increment or
decrement the memory address register (MAR) after a data transfer in I/O mode or repeat mode.
Bit 5
DTID
Description
0
MAR is incremented after each data transfer
1
•
If DTSZ = 0, MAR is incremented by 1 after each transfer
•
If DTSZ = 1, MAR is incremented by 2 after each transfer
(Initial value)
MAR is decremented after each data transfer
•
If DTSZ = 0, MAR is decremented by 1 after each transfer
•
If DTSZ = 1, MAR is decremented by 2 after each transfer
MAR is not incremented or decremented in idle mode.
Bit 4—Repeat Enable (RPE): Selects whether to transfer data in I/O mode, idle mode, or repeat
mode.
Bit 4
RPE
Bit 3
DTIE
Description
0
0
I/O mode
(Initial value)
1
1
0
Repeat mode
1
Idle mode
Operations in these modes are described in sections 7.4.2, I/O Mode, 7.4.3, Idle Mode, and 7.4.4,
Repeat Mode.
Rev. 2.0, 06/04, page 206 of 980
Bit 3—Data Transfer Interrupt Enable (DTIE): Enables or disables the CPU interrupt (DEND)
requested when the DTE bit is cleared to 0.
Bit 3
DTIE
Description
0
The DEND interrupt requested by DTE is disabled
1
The DEND interrupt requested by DTE is enabled
(Initial value)
Bits 2 to 0—Data Transfer Select (DTS2, DTS1, DTS0): These bits select the data transfer
activation source. Some of the selectable sources differ between channels A and B.
Bit 2
DTS2
Bit 1
DTS1
Bit 0
DTS0
0
0
0
Compare match/input capture A interrupt from 16-bit timer channel 0
(Initial value)
1
Compare match/input capture A interrupt from 16-bit timer channel 1
0
Compare match/input capture A interrupt from 16-bit timer channel 2
1
Conversion-end interrupt from A/D converter
0
0
Transmit-data-empty interrupt from SCI channel 0
1
Receive-data-full interrupt from SCI channel 0
1
0
Falling edge of DREQ input (channel B)
Transfer in full address mode (channel A)
1
Low level of DREQ input (channel B)
Transfer in full address mode (channel A)
1
1
Description
Note: See section 7.3.4, Data Transfer Control Registers (DTCR).
The same internal interrupt can be selected as an activation source for two or more channels at
once. In that case the channels are activated in a priority order, highest-priority channel first. For
the priority order, see section 7.4.9, Multiple-Channel Operation.
When a channel is enabled (DTE = 1), its selected DMAC activation source cannot generate a
CPU interrupt.
Rev. 2.0, 06/04, page 207 of 980
7.3
Register Descriptions (2) (Full Address Mode)
In full address mode the A and B channels operate together. Full address mode is selected as
indicated in table 7.4.
7.3.1
Memory Address Registers (MAR)
A memory address register (MAR) is a 32-bit readable/writable register. MARA functions as the
source address register of the transfer, and MARB as the destination address register.
An MAR consists of four 8-bit registers designated MARR, MARE, MARH, and MARL. All bits
of MARR are reserved; they cannot be modified and are always read as 1. (Write is invalid.)
Bit
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9
8
7
6
5
4
3
2
1
0
Initial value
Undetermined
Read/Write
— — — — — — — — R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MARR
MARE
MARH
MARL
Source or destination address
The MAR value is incremented or decremented each time one byte or word is transferred,
automatically updating the source or destination memory address. For details, see section 7.3.4,
Data Transfer Control Registers (DTCR).
The MARs are not initialized by a reset or in standby mode.
7.3.2
I/O Address Registers (IOAR)
The I/O address registers (IOARs) are not used in full address mode.
Rev. 2.0, 06/04, page 208 of 980
7.3.3
Execute Transfer Count Registers (ETCR)
An execute transfer count register (ETCR) is a 16-bit readable/writable register that specifies the
number of transfers to be executed. The functions of these registers differ between normal mode
and block transfer mode.
• Normal mode
ETCRA
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
Undetermined
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Transfer counter
ETCRB: Is not used in normal mode.
In normal mode ETCRA functions as a 16-bit transfer counter. The count is decremented by 1
each time one transfer is executed. The transfer ends when the count reaches H'0000. ETCRB is
not used.
Rev. 2.0, 06/04, page 209 of 980
• Block transfer mode
ETCRA
Bit
7
6
5
4
Initial value
Read/Write
3
2
1
0
R/W
R/W
R/W
2
1
0
R/W
R/W
R/W
Undetermined
R/W
R/W
R/W
R/W
R/W
ETCRAH
Block size counter
Bit
7
6
5
4
Initial value
Read/Write
3
Undetermined
R/W
R/W
R/W
R/W
R/W
ETCRAL
Initial block size
ETCRB
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
Undetermined
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Block transfer counter
In block transfer mode, ETCRAH functions as an 8-bit block size counter. ETCRAL holds the
initial block size. ETCRAH is decremented by 1 each time one byte or word is transferred. When
the count reaches H'00, ETCRAH is reloaded from ETCRAL. Blocks consisting of an arbitrary
number of bytes or words can be transferred repeatedly by setting the same initial block size value
in ETCRAH and ETCRAL.
In block transfer mode ETCRB functions as a 16-bit block transfer counter. ETCRB is
decremented by 1 each time one block is transferred. The transfer ends when the count reaches
H'0000.
The ETCRs are not initialized by a reset or in standby mode.
Rev. 2.0, 06/04, page 210 of 980
7.3.4
Data Transfer Control Registers (DTCR)
The data transfer control registers (DTCRs) are 8-bit readable/writable registers that control the
operation of the DMAC channels. A channel operates in full address mode when bits DTS2A and
DTS1A are both set to 1 in DTCRA. DTCRA and DTCRB have different functions in full address
mode.
DTCRA
Bit
7
6
5
4
3
2
1
0
DTE
DTSZ
SAID
SAIDE
DTIE
DTS2A
DTS1A
DTS0A
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Data transfer enable
Enables or disables
data transfer
Data transfer size
Selects byte or
word size
Data transfer
interrupt enable
Enables or disables the
CPU interrupt at the end
of the transfer
Source address
increment/decrement
Source address increment/
decrement enable
These bits select whether
the source address register
(MARA) is incremented,
decremented, or held fixed
during the data transfer
Data transfer
select 0A
Selects block
transfer mode
Data transfer select
2A and 1A
These bits must both be
set to 1
DTCRA is initialized to H'00 by a reset and in standby mode.
Rev. 2.0, 06/04, page 211 of 980
Bit 7—Data Transfer Enable (DTE): Together with the DTME bit in DTCRB, this bit enables
or disables data transfer on the channel. When the DTME and DTE bits are both set to 1, the
channel is enabled. If auto-request is specified, data transfer begins immediately. Otherwise, the
channel waits for transfers to be requested. When the specified number of transfers have been
completed, the DTE bit is automatically cleared to 0. When DTE is 0, the channel is disabled and
does not accept transfer requests. DTE is set to 1 by reading the register when DTE is 0, then
writing 1.
Bit 7
DTE
Description
0
Data transfer is disabled (DTE is cleared to 0 when the specified number (Initial value)
of transfers have been completed)
1
Data transfer is enabled
If DTIE is set to 1, a CPU interrupt is requested when DTE is cleared to 0.
Bit 6—Data Transfer Size (DTSZ): Selects the data size of each transfer.
Bit 6
DTSZ
Description
0
Byte-size transfer
1
Word-size transfer
(Initial value)
Bit 5—Source Address Increment/Decrement (SAID) and,
Bit 4—Source Address Increment/Decrement Enable (SAIDE): These bits select whether the
source address register (MARA) is incremented, decremented, or held fixed during the data
transfer.
Bit 5
SAID
Bit 4
SAIDE
Description
0
0
MARA is held fixed
1
MARA is incremented after each data transfer
1
•
If DTSZ = 0, MARA is incremented by 1 after each transfer
•
If DTSZ = 1, MARA is incremented by 2 after each transfer
0
MARA is held fixed
1
MARA is decremented after each data transfer
(Initial value)
•
If DTSZ = 0, MARA is decremented by 1 after each transfer
•
If DTSZ = 1, MARA is decremented by 2 after each transfer
Rev. 2.0, 06/04, page 212 of 980
Bit 3—Data Transfer Interrupt Enable (DTIE): Enables or disables the CPU interrupt (DEND)
requested when the DTE bit is cleared to 0.
Bit 3
DTIE
Description
0
The DEND interrupt requested by DTE is disabled
1
The DEND interrupt requested by DTE is enabled
(Initial value)
Bits 2 and 1—Data Transfer Select 2A and 1A (DTS2A, DTS1A): A channel operates in full
address mode when DTS2A and DTS1A are both set to 1.
Bit 0—Data Transfer Select 0A (DTS0A): Selects normal mode or block transfer mode.
Bit 0
DTS0A
Description
0
Normal mode
1
Block transfer mode
(Initial value)
Operations in these modes are described in sections 7.4.5, Normal Mode, and 7.4.6, Block
Transfer Mode.
Rev. 2.0, 06/04, page 213 of 980
DTCRB
Bit
7
6
5
4
3
2
1
0
DTME
—
DAID
DAIDE
TMS
DTS2B
DTS1B
DTS0B
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Data transfer master enable
Enables or disables data
transfer, together with
the DTE bit, and is cleared
to 0 by an interrupt
Reserved bit
Transfer mode select
Selects whether the
block area is the source
or destination in block
transfer mode
Destination address
increment/decrement
Destination address
increment/decrement enable
These bits select whether
the destination address
register (MARB) is incremented,
decremented, or held fixed
during the data transfer
Data transfer select
2B to 0B
These bits select the data
transfer activation source
DTCRB is initialized to H'00 by a reset and in standby mode.
Bit 7—Data Transfer Master Enable (DTME): Together with the DTE bit in DTCRA, this bit
enables or disables data transfer. When the DTME and DTE bits are both set to 1, the channel is
enabled. When an NMI interrupt occurs DTME is cleared to 0, suspending the transfer so that the
CPU can use the bus. The suspended transfer resumes when DTME is set to 1 again. For further
information on operation in block transfer mode, see section 7.6.6, NMI Interrupts and Block
Transfer Mode.
DTME is set to 1 by reading the register while DTME = 0, then writing 1.
Bit 7
DTME
Description
0
Data transfer is disabled (DTME is cleared to 0 when an NMI interrupt
occurs)
1
Data transfer is enabled
Rev. 2.0, 06/04, page 214 of 980
(Initial value)
Bit 6—Reserved: Although reserved, this bit can be written and read.
Bit 5—Destination Address Increment/Decrement (DAID) and,
Bit 4—Destination Address Increment/Decrement Enable (DAIDE): These bits select whether
the destination address register (MARB) is incremented, decremented, or held fixed during the
data transfer.
Bit 5
DAID
Bit 4
DAIDE
Description
0
0
MARB is held fixed
1
MARB is incremented after each data transfer
1
(Initial value)
•
If DTSZ = 0, MARB is incremented by 1 after each data transfer
•
If DTSZ = 1, MARB is incremented by 2 after each data transfer
0
MARB is held fixed
1
MARB is decremented after each data transfer
•
If DTSZ = 0, MARB is decremented by 1 after each data transfer
•
If DTSZ = 1, MARB is decremented by 2 after each data transfer
Bit 3—Transfer Mode Select (TMS): Selects whether the source or destination is the block area
in block transfer mode.
Bit 3
TMS
Description
0
Destination is the block area in block transfer mode
1
Source is the block area in block transfer mode
(Initial value)
Rev. 2.0, 06/04, page 215 of 980
Bits 2 to 0—Data Transfer Select 2B to 0B (DTS2B, DTS1B, DTS0B): These bits select the
data transfer activation source. The selectable activation sources differ between normal mode and
block transfer mode.
Normal mode
Bit 2
DTS2B
Bit 1
DTS1B
Bit 0
DTS0B
Description
0
0
0
Auto-request (burst mode)
1
Cannot be used
0
Auto-request (cycle-steal mode)
1
Cannot be used
0
0
Cannot be used
1
Cannot be used
1
0
Falling edge of DREQ
1
Low level input at DREQ
1
1
(Initial value)
Block transfer mode
Bit 2
Bit 1
Bit 0
DTS2B DTS1B DTS0B Description
0
0
1
1
0
1
0
Compare match/input capture A interrupt from 16-bit timer channel 0
(Initial value)
1
Compare match/input capture A interrupt from 16-bit timer channel 1
0
Compare match/input capture A interrupt from 16-bit timer channel 2
1
Conversion-end interrupt from A/D converter
0
Cannot be used
1
Cannot be used
0
Falling edge of DREQ
1
Cannot be used
The same internal interrupt can be selected to activate two or more channels. The channels are
activated in a priority order, highest priority first. For the priority order, see section 7.4.9,
Multiple-Channel Operation.
Rev. 2.0, 06/04, page 216 of 980
7.4
Operation
7.4.1
Overview
Table 7.5 summarizes the DMAC modes.
Table 7.5
DMAC Modes
Transfer Mode
Short address
mode
Activation
I/O mode
Idle mode
Repeat mode
Notes
Compare match/input
•
capture A interrupt from
16-bit timer channels 0 to 2
Transmit-data-empty
and receive-data-full
interrupts from SCI
channel 0
Up to four channels
can operate
independently
•
Only the B channels
support external requests
•
A and B channels are
paired; up to two
channels are available
Conversion-end interrupt
from A/D converter
External request
Full address
mode
Normal mode
Auto-request
External request
Block transfer mode
Compare match/input
•
capture A interrupt from
16-bit timer channels 0 to 2
Burst mode transfer or
cycle-steal mode transfer
can be selected for autorequests
Conversion-end interrupt
from A/D converter
External request
A summary of operations in these modes follows.
I/O Mode: One byte or word is transferred per request. A designated number of these transfers
are executed. A CPU interrupt can be requested at completion of the designated number of
transfers. One 24-bit address and one 8-bit address are specified. The transfer direction is
determined automatically from the activation source.
Idle Mode: One byte or word is transferred per request. A designated number of these transfers
are executed. A CPU interrupt can be requested at completion of the designated number of
transfers. One 24-bit address and one 8-bit address are specified. The addresses are held fixed.
The transfer direction is determined automatically from the activation source.
Rev. 2.0, 06/04, page 217 of 980
Repeat Mode: One byte or word is transferred per request. A designated number of these
transfers are executed. When the designated number of transfers are completed, the initial address
and counter value are restored and operation continues. No CPU interrupt is requested. One 24-bit
address and one 8-bit address are specified. The transfer direction is determined automatically
from the activation source.
Normal Mode
• Auto-request
The DMAC is activated by register setup alone, and continues executing transfers until the
designated number of transfers have been completed. A CPU interrupt can be requested at
completion of the transfers. Both addresses are 24-bit addresses.
 Cycle-steal mode
The bus is released to another bus master after each byte or word is transferred.
 Burst mode
Unless requested by a higher-priority bus master, the bus is not released until the
designated number of transfers have been completed.
• External request
One byte or word is transferred per request. A designated number of these transfers are
executed. A CPU interrupt can be requested at completion of the designated number of
transfers. Both addresses are 24-bit addresses.
Block Transfer Mode: One block of a specified size is transferred per request. A designated
number of block transfers are executed. At the end of each block transfer, one address is restored
to its initial value. When the designated number of blocks have been transferred, a CPU interrupt
can be requested. Both addresses are 24-bit addresses.
Rev. 2.0, 06/04, page 218 of 980
7.4.2
I/O Mode
I/O mode can be selected independently for each channel.
One byte or word is transferred at each transfer request in I/O mode. A designated number of
these transfers are executed. One address is specified in the memory address register (MAR), the
other in the I/O address register (IOAR). The direction of transfer is determined automatically
from the activation source. The transfer is from the address specified in IOAR to the address
specified in MAR if activated by an SCI channel 0 receive-data-full interrupt, and from the
address specified in MAR to the address specified in IOAR otherwise.
Table 7.6 indicates the register functions in I/O mode.
Table 7.6
Register Functions in I/O Mode
Function
Activated by
SCI 0 ReceiveData-Full
Other
Interrupt
Activation
Initial Setting
Operation
0
Destination
address
register
Source
address
register
Destination or
source start
address
Incremented or
decremented
once per
transfer
0
Source
address
register
Destination
address
register
Source or
destination
address
Held fixed
0
Transfer counter
Number of
transfers
Decremented
once per
transfer until
H'0000 is
reached and
transfer ends
Register
23
MAR
23
7
All 1s
IOAR
15
ETCR
Legend
MAR: Memory address register
IOAR: I/O address register
ETCR: Execute transfer count register
MAR and IOAR specify the source and destination addresses. MAR specifies a 24-bit source or
destination address, which is incremented or decremented as each byte or word is transferred.
IOAR specifies the lower 8 bits of a fixed address. The upper 16 bits are all 1s. IOAR is not
incremented or decremented.
Figure 7.2 illustrates how I/O mode operates.
Rev. 2.0, 06/04, page 219 of 980
Transfer
Address T
IOAR
1 byte or word is
transferred per request
Address B
Legend
L = initial setting of MAR
N = initial setting of ETCR
Address T = L
Address B = L + (–1) DTID • (2 DTSZ • N – 1)
Figure 7.2 Operation in I/O Mode
The transfer count is specified as a 16-bit value in ETCR. The ETCR value is decremented by 1 at
each transfer. When the ETCR value reaches H'0000, the DTE bit is cleared and the transfer ends.
If the DTIE bit is set to 1, a CPU interrupt is requested at this time. The maximum transfer count
is 65,536, obtained by setting ETCR to H'0000.
Transfers can be requested (activated) by compare match/input capture A interrupts from 16-bit
timer channels 0 to 2, transmit-data-empty and receive-data-full interrupts from SCI channel 0,
conversion-end interrupts from the A/D converter, and external request signals.
For the detailed settings see section 7.2.4, Data Transfer Control Registers (DTCR).
Rev. 2.0, 06/04, page 220 of 980
Figure 7.3 shows a sample setup procedure for I/O mode.
I/O mode setup
Set source and
destination addresses
1
Set transfer count
2
Read DTCR
3
Set DTCR
4
1. Set the source and destination addresses
in MAR and IOAR. The transfer direction is
determined automatically from the activation
source.
2. Set the transfer count in ETCR.
3. Read DTCR while the DTE bit is cleared to 0.
4. Set the DTCR bits as follows.
• Select the DMAC activation source with bits
DTS2 to DTS0.
• Set or clear the DTIE bit to enable or disable
the CPU interrupt at the end of the transfer.
• Clear the RPE bit to 0 to select I/O mode.
• Select MAR increment or decrement with the
DTID bit.
• Select byte size or word size with the DTSZ bit.
• Set the DTE bit to 1 to enable the transfer.
I/O mode
Figure 7.3 I/O Mode Setup Procedure (Example)
7.4.3
Idle Mode
Idle mode can be selected independently for each channel.
One byte or word is transferred at each transfer request in idle mode. A designated number of
these transfers are executed. One address is specified in the memory address register (MAR), the
other in the I/O address register (IOAR). The direction of transfer is determined automatically
from the activation source. The transfer is from the address specified in IOAR to the address
specified in MAR if activated by an SCI channel 0 receive-data-full interrupt, and from the
address specified in MAR to the address specified in IOAR otherwise.
Table 7.7 indicates the register functions in idle mode.
Rev. 2.0, 06/04, page 221 of 980
Table 7.7
Register Functions in Idle Mode
Function
Activated by
SCI 0 ReceiveData-Full
Other
Interrupt
Activation
Register
23
7
All 1s
Destination
address
register
Source
address
register
Destination or Held fixed
source address
0
Source
address
register
Destination
address
register
Source or
destination
address
Held fixed
0
Transfer counter
Number of
transfers
Decremented
once per
transfer until
H'0000 is
reached and
transfer ends
IOAR
15
Operation
0
MAR
23
Initial Setting
ETCR
Legend
MAR: Memory address register
IOAR: I/O address register
ETCR: Execute transfer count register
MAR and IOAR specify the source and destination addresses. MAR specifies a 24-bit source or
destination address. IOAR specifies the lower 8 bits of a fixed address. The upper 16 bits are all
1s. MAR and IOAR are not incremented or decremented.
Figure 7.4 illustrates how idle mode operates.
Transfer
MAR
1 byte or word is
transferred per request
Figure 7.4 Operation in Idle Mode
Rev. 2.0, 06/04, page 222 of 980
IOAR
The transfer count is specified as a 16-bit value in ETCR. The ETCR value is decremented by 1 at
each transfer. When the ETCR value reaches H'0000, the DTE bit is cleared, the transfer ends, and
a CPU interrupt is requested. The maximum transfer count is 65,536, obtained by setting ETCR to
H'0000.
Transfers can be requested (activated) by compare match/input capture A interrupts from 16-bit
timer channels 0 to 2, transmit-data-empty and receive-data-full interrupts from SCI channel 0,
conversion-end interrupts from the A/D converter, and external request signals.
For the detailed settings see section 7.3.4, Data Transfer Control Registers (DTCR).
Figure 7.5 shows a sample setup procedure for idle mode.
Idle mode setup
Set source and
destination addresses
1
Set transfer count
2
Read DTCR
3
Set DTCR
4
1. Set the source and destination addresses
in MAR and IOAR. The transfer direction is determined automatically from the activation source.
2. Set the transfer count in ETCR.
3. Read DTCR while the DTE bit is cleared to 0.
4. Set the DTCR bits as follows.
• Select the DMAC activation source with bits
DTS2 to DTS0.
• Set the DTIE and RPE bits to 1 to select idle mode.
• Select byte size or word size with the DTSZ bit.
• Set the DTE bit to 1 to enable the transfer.
Idle mode
Figure 7.5 Idle Mode Setup Procedure (Example)
Rev. 2.0, 06/04, page 223 of 980
7.4.4
Repeat Mode
Repeat mode is useful for cyclically transferring a bit pattern from a table to the programmable
timing pattern controller (TPC) in synchronization, for example, with 16-bit timer compare match.
Repeat mode can be selected for each channel independently.
One byte or word is transferred per request in repeat mode, as in I/O mode. A designated number
of these transfers are executed. One address is specified in the memory address register (MAR),
the other in the I/O address register (IOAR). At the end of the designated number of transfers,
MAR and ETCRH are restored to their original values and operation continues. The direction of
transfer is determined automatically from the activation source. The transfer is from the address
specified in IOAR to the address specified in MAR if activated by an SCI channel 0 receive-datafull interrupt, and from the address specified in MAR to the address specified in IOAR otherwise.
Table 7.8 indicates the register functions in repeat mode.
Table 7.8
Register Functions in Repeat Mode
Function
Register
Activated by
SCI 0 ReceiveData-Full
Other
Interrupt
Activation Initial Setting
23
Destination
address
register
Source
address
register
Source
address
register
Destination Source or
address
destination
register
address
0
Destination or
source start
address
MAR
7
23
All 1s
0
IOAR
7
0
Incremented or
decremented at
each transfer until
ETCRH reaches
H'0000, then restored
to initial value
Held fixed
Transfer counter
Number of
transfers
Decremented once
per transfer until
H'0000 is reached,
then reloaded from
ETCRL
Initial transfer count
Number of
transfers
Held fixed
0
ETCRH
7
Operation
ETCRL
Legend
MAR: Memory address register
IOAR: I/O address register
ETCR: Execute transfer count register
Rev. 2.0, 06/04, page 224 of 980
In repeat mode ETCRH is used as the transfer counter while ETCRL holds the initial transfer
count. ETCRH is decremented by 1 at each transfer until it reaches H'00, then is reloaded from
ETCRL. MAR is also restored to its initial value, which is calculated from the DTSZ and DTID
bits in DTCR. Specifically, MAR is restored as follows:
MAR ← MAR – (–1)
DTID
·2
DTSZ
· ETCRL
ETCRH and ETCRL should be initially set to the same value.
In repeat mode transfers continue until the CPU clears the DTE bit to 0. After DTE is cleared to 0,
if the CPU sets DTE to 1 again, transfers resume from the state at which DTE was cleared. No
CPU interrupt is requested.
As in I/O mode, MAR and IOAR specify the source and destination addresses. MAR specifies a
24-bit source or destination address. IOAR specifies the lower 8 bits of a fixed address. The upper
16 bits are all 1s. IOAR is not incremented or decremented.
Figure 7.6 illustrates how repeat mode operates.
Address T
Transfer
IOAR
1 byte or word is
transferred per request
Address B
Legend
L = initial setting of MAR
N = initial setting of ETCRH and ETCRL
Address T = L
Address B = L + (–1) DTID • (2 DTSZ • N – 1)
Figure 7.6 Operation in Repeat Mode
Rev. 2.0, 06/04, page 225 of 980
The transfer count is specified as an 8-bit value in ETCRH and ETCRL. The maximum transfer
count is 255, obtained by setting both ETCRH and ETCRL to H'FF.
Transfers can be requested (activated) by compare match/input capture A interrupts from 16-bit
timer channels 0 to 2, transmit-data-empty and receive-data-full interrupts from SCI channel 0,
conversion-end interrupts from the A/D converter, and external request signals.
For the detailed settings see section 7.2.4, Data Transfer Control Registers (DTCR).
Figure 7.7 shows a sample setup procedure for repeat mode.
Repeat mode
Set source and
destination addresses
1
Set transfer count
2
Read DTCR
3
Set DTCR
4
1. Set the source and destination addresses in MAR
and IOAR. The transfer direction is determined
automatically from the activation source.
2. Set the transfer count in both ETCRH and ETCRL.
3. Read DTCR while the DTE bit is cleared to 0.
4. Set the DTCR bits as follows.
• Select the DMAC activation source with bits
DTS2 to DTS0.
• Clear the DTIE bit to 0 and set the RPE bit to 1
to select repeat mode.
• Select MAR increment or decrement with the DTID bit.
• Select byte size or word size with the DTSZ bit.
• Set the DTE bit to 1 to enable the transfer.
Repeat mode
Figure 7.7 Repeat Mode Setup Procedure (Example)
Rev. 2.0, 06/04, page 226 of 980
7.4.5
Normal Mode
In normal mode the A and B channels are combined. One byte or word is transferred per request.
A designated number of these transfers are executed. Addresses are specified in MARA and
MARB. Table 7.9 indicates the register functions in I/O mode.
Table 7.9
Register Functions in Normal Mode
Register
Function
23
Initial Setting
Operation
MARA
0 Source address
register
Source start
address
Incremented or
decremented once per
transfer, or held fixed
MARB
0 Destination
address register
Destination start
address
Incremented or
decremented once per
transfer, or held fixed
0 Transfer counter
Number of
transfers
Decremented once per
transfer
23
15
ETCRA
Legend
MARA: Memory address register A
MARB: Memory address register B
ETCRA: Execute transfer count register A
The source and destination addresses are both 24-bit addresses. MARA specifies the source
address. MARB specifies the destination address. MARA and MARB can be independently
incremented, decremented, or held fixed as data is transferred.
The transfer count is specified as a 16-bit value in ETCRA. The ETCRA value is decremented by
1 at each transfer. When the ETCRA value reaches H'0000, the DTE bit is cleared and the transfer
ends. If the DTIE bit is set to 1, a CPU interrupt is requested at this time. The maximum transfer
count is 65,536, obtained by setting ETCRA to H'0000.
Rev. 2.0, 06/04, page 227 of 980
Figure 7.8 illustrates how normal mode operates.
Transfer
Address T A
Address BA
Address T B
Address B B
Legend
L A = initial setting of MARA
L B = initial setting of MARB
N = initial setting of ETCRA
TA = LA
BA = L A + SAIDE • (–1) SAID • (2 DTSZ • N – 1)
TB = LB
BB = L B + DAIDE • (–1) DAID • (2 DTSZ • N – 1)
Figure 7.8 Operation in Normal Mode
Transfers can be requested (activated) by an external request or auto-request. An auto-requested
transfer is activated by the register settings alone. The designated number of transfers are executed
automatically. Either cycle-steal or burst mode can be selected. In cycle-steal mode the DMAC
releases the bus temporarily after each transfer. In burst mode the DMAC keeps the bus until the
transfers are completed, unless there is a bus request from a higher-priority bus master.
For the detailed settings see section 7.3.4, Data Transfer Control Registers (DTCR).
Rev. 2.0, 06/04, page 228 of 980
Figure 7.9 shows a sample setup procedure for normal mode.
Normal mode
Set initial source address
1
Set initial destination address
2
1.
2.
3.
4.
5.
Set transfer count
3
Set DTCRB (1)
4
Set DTCRA (1)
5
Read DTCRB
6
Set DTCRB (2)
7
Read DTCRA
8
Set DTCRA (2)
9
6.
7.
8.
9.
Set the initial source address in MARA.
Set the initial destination address in MARB.
Set the transfer count in ETCRA.
Set the DTCRB bits as follows.
• Clear the DTME bit to 0.
• Set the DAID and DAIDE bits to select whether
MARB is incremented, decremented, or held fixed.
• Select the DMAC activation source with bits
DTS2B to DTS0B.
Set the DTCRA bits as follows.
• Clear the DTE bit to 0.
• Select byte or word size with the DTSZ bit.
• Set the SAID and SAIDE bits to select whether
MARA is incremented, decremented, or held fixed.
• Set or clear the DTIE bit to enable or disable the
CPU interrupt at the end of the transfer.
• Clear the DTS0A bit to 0 and set the DTS2A
and DTS1A bits to 1 to select normal mode.
Read DTCRB with DTME cleared to 0.
Set the DTME bit to 1 in DTCRB.
Read DTCRA with DTE cleared to 0.
Set the DTE bit to 1 in DTCRA to enable the transfer.
Normal mode
Note: Carry out settings 1 to 9 with the DEND interrupt masked in the CPU.
If an NMI interrupt occurs during the setup procedure, it may clear the DTME bit to 0, in
which case the transfer will not start.
Figure 7.9 Normal Mode Setup Procedure (Example)
Rev. 2.0, 06/04, page 229 of 980
7.4.6
Block Transfer Mode
In block transfer mode the A and B channels are combined. One block of a specified size is
transferred per request. A designated number of block transfers are executed. Addresses are
specified in MARA and MARB. The block area address can be either held fixed or cycled.
Table 7.10 indicates the register functions in block transfer mode.
Table 7.10 Register Functions in Block Transfer Mode
Register
23
Function
Initial Setting
Operation
0
Source address
register
Source start
address
Incremented or
decremented once per
transfer, or held fixed
0
Destination
address register
Destination start
address
Incremented or
decremented once per
transfer, or held fixed
0
Block size counter
Block size
Decremented once per
transfer until H'00 is
reached, then reloaded
from ETCRL
Initial block size
Block size
Held fixed
Block transfer
counter
Number of block
transfers
Decremented once per
block transfer until H'0000
is reached and the
transfer ends
MARA
23
MARB
7
ETCRAH
7
0
ETCRAL
15
0
ETCRB
Legend
MARA: Memory address register A
MARB: Memory address register B
ETCRA: Execute transfer count register A
ETCRB: Execute transfer count register B
The source and destination addresses are both 24-bit addresses. MARA specifies the source
address. MARB specifies the destination address. MARA and MARB can be independently
incremented, decremented, or held fixed as data is transferred. One of these registers operates as a
block area register: even if it is incremented or decremented, it is restored to its initial value at the
end of each block transfer. The TMS bit in DTCRB selects whether the block area is the source or
destination.
Rev. 2.0, 06/04, page 230 of 980
If M (1 to 255) is the size of the block transferred at each request and N (1 to 65,536) is the
number of blocks to be transferred, then ETCRAH and ETCRAL should initially be set to M and
ETCRB should initially be set to N.
Figure 7.10 illustrates how block transfer mode operates. In this figure, bit TMS is cleared to 0,
meaning the block area is the destination.
TA
Address T B
Transfer
Block 1
Block area
BA
Address B B
Block 2
M bytes or words are
transferred per request
Block N
Legend
L A = initial setting of MARA
L B = initial setting of MARB
M = initial setting of ETCRAH and ETCRAL
N = initial setting of ETCRB
T A = LA
B A = L A + SAIDE • (–1) SAID • (2 DTSZ • M – 1)
T B = LB
B B = L B + DAIDE • (–1) DAID • (2 DTSZ • M – 1)
Figure 7.10 Operation in Block Transfer Mode
Rev. 2.0, 06/04, page 231 of 980
When activated by a transfer request, the DMAC executes a burst transfer. During the transfer
MARA and MARB are updated according to the DTCR settings, and ETCRAH is decremented.
When ETCRAH reaches H'00, it is reloaded from ETCRAL to restore the initial value. The
memory address register of the block area is also restored to its initial value, and ETCRB is
decremented. If ETCRB is not H'0000, the DMAC then waits for the next transfer request.
ETCRAH and ETCRAL should be initially set to the same value.
The above operation is repeated until ETCRB reaches H'0000, at which point the DTE bit is
cleared to 0 and the transfer ends. If the DTIE bit is set to 1, a CPU interrupt is requested at this
time.
Figure 7.11 shows examples of a block transfer with byte data size when the block area is the
destination. In (a) the block area address is cycled. In (b) the block area address is held fixed.
Transfers can be requested (activated) by compare match/input capture A interrupts from ITU
channels 0 to 2, by an A/D converter conversion-end interrupt, and by external request signals.
For the detailed settings see section 7.3.4, Data Transfer Control Registers (DTCR).
Rev. 2.0, 06/04, page 232 of 980
Start
(DTE = DTME = 1)
Transfer requested?
Start
(DTE = DTME = 1)
No
Transfer requested?
Yes
No
Yes
Get bus
Get bus
Read from MARA address
Read from MARA address
MARA = MARA + 1
MARA = MARA + 1
Write to MARB address
Write to MARB address
MARB = MARB + 1
ETCRAH = ETCRAH –1
ETCRAH = ETCRAH –1
No
ETCRAH = H'00
No
ETCRAH = H'00
Yes
Yes
Release bus
Release bus
ETCRAH = ETCRAL
MARB = MARB – ETCRAL
ETCRAH = ETCRAL
ETCRB = ETCRB –1
ETCRB = ETCRB –1
ETCRB = H'0000
No
ETCRB = H'0000
Yes
No
Yes
Clear DTE to 0 and end transfer
Clear DTE to 0 and end transfer
a. DTSZ = TMS = 0
SAID = DAID = 0
SAIDE = DAIDE = 1
b. DTSZ = TMS = 0
SAID = 0
SAIDE = 1
DAIDE = 0
Figure 7.11 Block Transfer Mode Flowcharts (Examples)
Rev. 2.0, 06/04, page 233 of 980
Figure 7.12 shows a sample setup procedure for block transfer mode.
Block transfer mode
Set source address
1
Set destination address
2
Set block transfer count
3
Set block size
4
Set DTCRB (1)
5
Set DTCRA (1)
6
Read DTCRB
7
Set DTCRB (2)
8
Read DTCRA
9
Set DTCRA (2)
10
Set the source address in MARA.
Set the destination address in MARB.
Set the block transfer count in ETCRB.
Set the block size (number of bytes or words)
in both ETCRAH and ETCRAL.
5. Set the DTCRB bits as follows.
• Clear the DTME bit to 0.
• Set the DAID and DAIDE bits to select whether
MARB is incremented, decremented, or held fixed.
• Set or clear the TMS bit to make the block area
the source or destination.
• Select the DMAC activation source with bits
DTS2B to DTS0B.
6. Set the DTCRA bits as follows.
• Clear the DTE to 0.
• Select byte size or word size with the DTSZ bit.
• Set the SAID and SAIDE bits to select whether
MARA is incremented, decremented, or held fixed.
• Set or clear the DTIE bit to enable or disable the
CPU interrupt at the end of the transfer.
• Set bits DTS2A to DTS0A all to 1 to select
block transfer mode.
7. Read DTCRB with DTME cleared to 0.
8. Set the DTME bit to 1 in DTCRB.
9. Read DTCRA with DTE cleared to 0.
10. Set the DTE bit to 1 in DTCRA to enable
the transfer.
1.
2.
3.
4.
Block transfer mode
Note: Carry out settings 1 to 10 with the DEND interrupt masked in the CPU.
If an NMI interrupt occurs during the setup procedure, it may clear the DTME bit to 0, in
which case the transfer will not start.
Figure 7.12 Block Transfer Mode Setup Procedure (Example)
Rev. 2.0, 06/04, page 234 of 980
7.4.7
DMAC Activation
The DMAC can be activated by an internal interrupt, external request, or auto-request. The
available activation sources differ depending on the transfer mode and channel as indicated in
table 7.11.
Table 7.11 DMAC Activation Sources
Short Address Mode
Activation Source
Internal
interrupts
External
requests
Auto-request
Channels
Channels
0A and 1A
0B and 1B
Full Address Mode
Normal
IMIA0
×
IMIA1
×
Block
IMIA2
×
ADI
×
TXI0
×
×
RXI0
×
×
Falling edge
of DREQ
×
Low input at
DREQ
×
×
×
×
×
Activation by Internal Interrupts: When an interrupt request is selected as a DMAC activation
source and the DTE bit is set to 1, that interrupt request is not sent to the CPU. It is not possible
for an interrupt request to activate the DMAC and simultaneously generate a CPU interrupt.
When the DMAC is activated by an interrupt request, the interrupt request flag is cleared
automatically. If the same interrupt is selected to activate two or more channels, the interrupt
request flag is cleared when the highest-priority channel is activated, but the transfer request is
held pending on the other channels in the DMAC, which are activated in their priority order.
Rev. 2.0, 06/04, page 235 of 980
Activation by External Request: If an external request (DREQ pin) is selected as an activation
source, the DREQ pin becomes an input pin and the corresponding TEND pin becomes an output
pin, regardless of the port data direction register (DDR) settings. The DREQ input can be levelsensitive or edge-sensitive.
In short address mode and normal mode, an external request operates as follows. If edge sensing is
selected, one byte or word is transferred each time a high-to-low transition of the DREQ input is
detected. If the next edge is input before the transfer is completed, the next transfer may not be
executed. If level sensing is selected, the transfer continues while DREQ is low, until the transfer
is completed. The bus is released temporarily after each byte or word has been transferred,
however. If the DREQ input goes high during a transfer, the transfer is suspended after the current
byte or word has been transferred. When DREQ goes low, the request is held internally until one
byte or word has been transferred. The TEND signal goes low during the last write cycle.
In block transfer mode, an external request operates as follows. Only edge-sensitive transfer
requests are possible in block transfer mode. Each time a high-to-low transition of the DREQ
input is detected, a block of the specified size is transferred. The TEND signal goes low during the
last write cycle in each block.
Activation by Auto-Request: The transfer starts as soon as enabled by register setup, and
continues until completed. Cycle-steal mode or burst mode can be selected.
In cycle-steal mode the DMAC releases the bus temporarily after transferring each byte or word.
Normally, DMAC cycles alternate with CPU cycles.
In burst mode the DMAC keeps the bus until the transfer is completed, unless there is a higherpriority bus request. If there is a higher-priority bus request, the bus is released after the current
byte or word has been transferred.
Rev. 2.0, 06/04, page 236 of 980
7.4.8
DMAC Bus Cycle
Figure 7.13 shows an example of the timing of the basic DMAC bus cycle. This example shows a
word-size transfer from a 16-bit two-state access area to an 8-bit three-state access area. When the
DMAC gets the bus from the CPU, after one dead cycle (Td), it reads from the source address and
writes to the destination address. During these read and write operations the bus is not released
even if there is another bus request. DMAC cycles comply with bus controller settings in the same
way as CPU cycles.
CPU cycle
T1
T2
T1
DMAC cycle (1 word transfer)
T2
Td
T1
T2
T1
T2
T3
T1
T2
CPU cycle
T3
T1
T2
T1
T2
φ
Source
address
Destination address
Address
bus
RD
HWR
LWR
Figure 7.13 DMA Transfer Bus Timing (Example)
Rev. 2.0, 06/04, page 237 of 980
Figure 7.14 shows the timing when the DMAC is activated by low input at a DREQ pin. This
example shows a word-size transfer from a 16-bit two-state access area to another 16-bit two-state
access area. The DMAC continues the transfer while the DREQ pin is held low.
CPU cycle
T1
T2
T3
DMAC cycle
Td
T1
T2
T1
DMAC cycle
(last transfer cycle)
CPU cycle
T2
T1
T2
Td
T1
T2
T1
T2
CPU cycle
T1
φ
DREQ
Source Destination
address address
Source Destination
address address
Address
bus
RD
HWR , LWR
TEND
Figure 7.14 Bus Timing of DMA Transfer Requested by Low DREQ Input
Rev. 2.0, 06/04, page 238 of 980
T2
Figure 7.15 shows an auto-requested burst-mode transfer. This example shows a transfer of three
words from a 16-bit two-state access area to another 16-bit two-state access area.
CPU cycle
T1
T2
CPU cycle
DMAC cycle
Td
T1
T2
T1
T2
T1
T2
T1
T2
T1
T2
T1
T2
T1
T2
φ
Source
address
Destination
address
Address
bus
RD
HWR ,
LWR
Figure 7.15 Burst DMA Bus Timing
When the DMAC is activated from a DREQ pin there is a minimum interval of four states from
when the transfer is requested until the DMAC starts operating. The DREQ pin is not sampled
during the time between the transfer request and the start of the transfer. In short address mode
and normal mode, the pin is next sampled at the end of the read cycle. In block transfer mode, the
pin is next sampled at the end of one block transfer.
Rev. 2.0, 06/04, page 239 of 980
Figure 7.16 shows the timing when the DMAC is activated by the falling edge of DREQ in normal
mode.
CPU cycle
T2
T1
T2
T1
CPU
cycle
DMAC cycle
T2
Td
T1
T2
T1
T2
T1
T2
DMAC cycle
Td
T1
T2
φ
DREQ
Address
bus
RD
HWR , LWR
Minimum 4 states
Next sampling point
Figure 7.16 Timing of DMAC Activation by Falling Edge of DREQ in Normal Mode
Rev. 2.0, 06/04, page 240 of 980
Figure 7.17 shows the timing when the DMAC is activated by level-sensitive low DREQ input in
normal mode.
CPU cycle
T2
T1
T2
T1
DMAC cycle
T2
Td
T1
T2
T1
CPU cycle
T2
T1
T2
T1
T2
T1
φ
DREQ
Address
bus
RD
HWR , LWR
Minimum 4 states
Next sampling point
Figure 7.17 Timing of DMAC Activation by Low DREQ Level in Normal Mode
Rev. 2.0, 06/04, page 241 of 980
Figure 7.18 shows the timing when the DMAC is activated by the falling edge of DREQ in block
transfer mode.
End of 1 block transfer
DMAC cycle
T1
T2
T1
T2
T1
CPU cycle
T2
T1
T2
T1
T2
T1
T2
DMAC cycle
Td
T1
T2
φ
DREQ
Address
bus
RD
HWR , LWR
TEND
Next sampling
Minimum 4 states
Figure 7.18 Timing of DMAC Activation by Falling Edge of DREQ in Block Transfer Mode
Rev. 2.0, 06/04, page 242 of 980
7.4.9
Multiple-Channel Operation
The DMAC channel priority order is: channel 0 > channel 1 and channel A > channel B.
Table 7.12 shows the complete priority order.
Table 7.12 Channel Priority Order
Short Address Mode
Full Address Mode
Priority
Channel 0A
Channel 0
High
Channel 0B
Channel 1A
Channel 1B
Channel 1
Low
If transfers are requested on two or more channels simultaneously, or if a transfer on one channel
is requested during a transfer on another channel, the DMAC operates as follows.
• When a transfer is requested, the DMAC requests the bus right. When it gets the bus right, it
starts a transfer on the highest-priority channel at that time.
• Once a transfer starts on one channel, requests to other channels are held pending until that
channel releases the bus.
• After each transfer in short address mode, and each externally-requested or cycle-steal transfer
in normal mode, the DMAC releases the bus and returns to step 1. After releasing the bus, if
there is a transfer request for another channel, the DMAC requests the bus again.
• After completion of a burst-mode transfer, or after transfer of one block in block transfer
mode, the DMAC releases the bus and returns to step 1. If there is a transfer request for a
higher-priority channel or a bus request from a higher-priority bus master, however, the
DMAC releases the bus after completing the transfer of the current byte or word. After
releasing the bus, if there is a transfer request for another channel, the DMAC requests the bus
again.
Figure 7.19 shows the timing when channel 0A is set up for I/O mode and channel 1 for burst
mode, and a transfer request for channel 0A is received while channel 1 is active.
Rev. 2.0, 06/04, page 243 of 980
DMAC cycle
(channel 1)
T1
CPU
cycle
T2
T1
T2
DMAC cycle
(channel 0A)
Td
T1
T2
T1
CPU
cycle
T2
T1
T2
DMAC cycle
(channel 1)
Td
T1
T2
T1
T2
φ
Address
bus
RD
HWR ,
LWR
Figure 7.19 Timing of Multiple-Channel Operations
7.4.10
External Bus Requests, DRAM Interface, and DMAC
During a DMAC transfer, if the bus right is requested by an external bus request signal (BREQ) or
by the DRAM interface (refresh cycle), the DMAC releases the bus after completing the transfer
of the current byte or word. If there is a transfer request at this point, the DMAC requests the bus
right again. Figure 7.20 shows an example of the timing of insertion of a refresh cycle during a
burst transfer on channel 0.
Refresh
cycle
DMAC cycle (channel 0)
T1
T2
T1
T2
T1
T2
T1
T2
T1
T2
DMAC cycle (channel 0)
Td
T1
T2
T1
φ
Address
bus
RD
HWR , LWR
Figure 7.20 Bus Timing of DRAM Interface, and DMAC
Rev. 2.0, 06/04, page 244 of 980
T2
T1
T2
7.4.11
NMI Interrupts and DMAC
NMI interrupts do not affect DMAC operations in short address mode.
If an NMI interrupt occurs during a transfer in full address mode, the DMAC suspends operations.
In full address mode, a channel is enabled when its DTE and DTME bits are both set to 1. NMI
input clears the DTME bit to 0. After transferring the current byte or word, the DMAC releases
the bus to the CPU. In normal mode, the suspended transfer resumes when the CPU sets the
DTME bit to 1 again. Check that the DTE bit is set to 1 and the DTME bit is cleared to 0 before
setting the DTME bit to 1.
Figure 7.21 shows the procedure for resuming a DMAC transfer in normal mode on channel 0
after the transfer was halted by NMI input.
Resuming DMAC transfer
in normal mode
1. Check that DTE = 1 and DTME = 0.
2. Read DTCRB while DTME = 0,
then write 1 in the DTME bit.
1
DTE = 1
DTME = 0
No
Yes
Set DTME to 1
DMA transfer continues
2
End
Figure 7.21 Procedure for Resuming a DMAC Transfer Halted by NMI (Example)
For information about NMI interrupts in block transfer mode, see section 7.6.6, NMI Interrupts
and Block Transfer Mode.
Rev. 2.0, 06/04, page 245 of 980
7.4.12
Aborting a DMAC Transfer
When the DTE bit in an active channel is cleared to 0, the DMAC halts after transferring the
current byte or word. The DMAC starts again when the DTE bit is set to 1. In full address mode,
the DTME bit can be used for the same purpose. Figure 7.22 shows the procedure for aborting a
DMAC transfer by software.
DMAC transfer abort
Set DTCR
1. Clear the DTE bit to 0 in DTCR.
To avoid generating an interrupt when
aborting a DMAC transfer, clear the DTIE
bit to 0 simultaneously.
1
DMAC transfer aborted
Figure 7.22 Procedure for Aborting a DMAC Transfer
Rev. 2.0, 06/04, page 246 of 980
7.4.13
Exiting Full Address Mode
Figure 7.23 shows the procedure for exiting full address mode and initializing the pair of
channels. To set the channels up in another mode after exiting full address mode, follow the setup
procedure for the relevant mode.
Exiting full address mode
Halt the channel
1
Initialize DTCRB
2
Initialize DTCRA
3
1. Clear the DTE bit to 0 in DTCRA, or wait
for the transfer to end and the DTE bit
to be cleared to 0.
2. Clear all DTCRB bits to 0.
3. Clear all DTCRA bits to 0.
Initialized and halted
Figure 7.23 Procedure for Exiting Full Address Mode (Example)
Rev. 2.0, 06/04, page 247 of 980
7.4.14
DMAC States in Reset State, Standby Modes, and Sleep Mode
When the chip is reset or enters software standby mode, the DMAC is initialized and halts.
DMAC operations continue in sleep mode. Figure 7.24 shows the timing of a cycle-steal transfer
in sleep mode.
Sleep mode
CPU cycle
T2
DMAC cycle
Td
T1
T2
T1
DMAC cycle
T2
Td
T1
T2
T1
T2
φ
Address bus
RD
HWR , LWR
Figure 7.24 Timing of Cycle-Steal Transfer in Sleep Mode
Rev. 2.0, 06/04, page 248 of 980
Td
7.5
Interrupts
The DMAC generates only DMA-end interrupts. Table 7.13 lists the interrupts and their priority.
Table 7.13 DMAC Interrupts
Description
Interrupt
Short Address Mode
Full Address Mode
Interrupt Priority
DEND0A
End of transfer on channel 0A
End of transfer on channel 0
High
DEND0B
End of transfer on channel 0B
—
DEND1A
End of transfer on channel 1A
End of transfer on channel 1
DEND1B
End of transfer on channel 1B
—
Low
Each interrupt is enabled or disabled by the DTIE bit in the corresponding data transfer control
register (DTCR). Separate interrupt signals are sent to the interrupt controller.
The interrupt priority order among channels is channel 0 > channel 1 and channel A > channel B.
Figure 7.25 shows the DMA-end interrupt logic. An interrupt is requested whenever DTE = 0 and
DTIE = 1.
DTE
DMA-end interrupt
DTIE
Figure 7.25 DMA-End Interrupt Logic
The DMA-end interrupt for the B channels (DENDB) is unavailable in full address mode. The
DTME bit does not affect interrupt operations.
Rev. 2.0, 06/04, page 249 of 980
7.6
Usage Notes
7.6.1
Note on Word Data Transfer
Word data cannot be accessed starting at an odd address. When word-size transfer is selected, set
even values in the memory and I/O address registers (MAR and IOAR).
7.6.2
DMAC Self-Access
The DMAC itself cannot be accessed during a DMAC cycle. DMAC registers cannot be specified
as source or destination addresses.
7.6.3
Longword Access to Memory Address Registers
A memory address register can be accessed as longword data at the MARR address.
Example
MOV.L
#LBL, ER0
MOV.L ER0, @MARR
Four byte accesses are performed. Note that the CPU may release the bus between the second byte
(MARE) and third byte (MARH).
Memory address registers should be written and read only when the DMAC is halted.
7.6.4
Note on Full Address Mode Setup
Full address mode is controlled by two registers: DTCRA and DTCRB. Care must be taken to
prevent the B channel from operating in short address mode during the register setup. The enable
bits (DTE and DTME) should not be set to 1 until the end of the setup procedure.
Rev. 2.0, 06/04, page 250 of 980
7.6.5
Note on Activating DMAC by Internal Interrupts
When using an internal interrupt to activate the DMAC, make sure that the interrupt selected as
the activating source does not occur during the interval after it has been selected but before the
DMAC has been enabled. The on-chip supporting module that will generate the interrupt should
not be activated until the DMAC has been enabled. If the DMAC must be enabled while the onchip supporting module is active, follow the procedure in figure 7.26.
Enabling of DMAC
Yes
Interrupt handling by CPU
Selected interrupt
requested?
1
No
Clear selected interrupt's
enable bit to 0
2
Enable DMAC
3
Set selected interrupt's
enable bit to 1
4
1. While the DTE bit is cleared to 0,
interrupt requests are sent to the
CPU.
2. Clear the interrupt enable bit to 0
in the interrupt-generating on-chip
supporting module.
3. Enable the DMAC.
4. Enable the DMAC-activating
interrupt.
DMAC operates
Figure 7.26 Procedure for Enabling DMAC while On-Chip Supporting
Module is Operating (Example)
If the DTE bit is set to 1 but the DTME bit is cleared to 0, the DMAC is halted and the selected
activating source cannot generate a CPU interrupt. If the DMAC is halted by an NMI interrupt, for
example, the selected activating source cannot generate CPU interrupts. To terminate DMAC
operations in this state, clear the DTE bit to 0 to allow CPU interrupts to be requested. To
continue DMAC operations, carry out steps 2 and 4 in figure 7.26 before and after setting the
DTME bit
to 1.
Rev. 2.0, 06/04, page 251 of 980
When 16-bit timer interrupt activates the DMAC, make sure the next interrupt does not occur
before the DMA transfer ends. If one 16-bit timer interrupt activates two or more channels, make
sure the next interrupt does not occur before the DMA transfers end on all the activated channels.
If the next interrupt occurs before a transfer ends, the channel or channels for which that interrupt
was selected may fail to accept further activation requests.
7.6.6
NMI Interrupts and Block Transfer Mode
If an NMI interrupt occurs in block transfer mode, the DMAC operates as follows.
• When the NMI interrupt occurs, the DMAC finishes transferring the current byte or word, then
clears the DTME bit to 0 and halts. The halt may occur in the middle of a block.
It is possible to find whether a transfer was halted in the middle of a block by checking the
block size counter. If the block size counter does not have its initial value, the transfer was
halted in the middle of a block.
• If the transfer is halted in the middle of a block, the activating interrupt flag is cleared to 0.
The activation request is not held pending.
• While the DTE bit is set to 1 and the DTME bit is cleared to 0, the DMAC is halted and does
not accept activating interrupt requests. If an activating interrupt occurs in this state, the
DMAC does not operate and does not hold the transfer request pending internally. Neither is a
CPU interrupt requested.
For this reason, before setting the DTME bit to 1, first clear the enable bit of the activating
interrupt to 0. Then, after setting the DTME bit to 1, set the interrupt enable bit to 1 again. See
section 7.6.5, Note on Activating DMAC by Internal Interrupts.
• When the DTME bit is set to 1, the DMAC waits for the next transfer request. If it was halted
in the middle of a block transfer, the rest of the block is transferred when the next transfer
request occurs. Otherwise, the next block is transferred when the next transfer request occurs.
7.6.7
Memory and I/O Address Register Values
Table 7.14 indicates the address ranges that can be specified in the memory and I/O address
registers (MAR and IOAR).
Rev. 2.0, 06/04, page 252 of 980
Table 7.14 Address Ranges Specifiable in MAR and IOAR
1-Mbyte Mode
16-Mbyte Mode
MAR
H'00000 to H'FFFFF
(0 to 1048575)
H'000000 to H'FFFFFF
(0 to 16777215)
IOAR
H'FFF00 to H'FFFFF
(1048320 to 1048575)
H'FFFF00 to H'FFFFFF
(16776960 to 16777215)
MAR bits 23 to 20 are ignored in 1-Mbyte mode.
7.6.8
Bus Cycle when Transfer is Aborted
When a transfer is aborted by clearing the DTE bit or suspended by an NMI that clears the DTME
bit, if this halts a channel for which the DMAC has a transfer request pending internally, a dead
cycle may occur. This dead cycle does not update the halted channel’s address register or counter
value. Figure 7.27 shows an example in which an auto-requested transfer in cycle-steal mode on
channel 0 is aborted by clearing the DTE bit in channel 0.
CPU cycle
T1
T2
DMAC cycle
Td
T1
T2
T1
DMAC
cycle
CPU cycle
T2
T1
T2
T3
Td
Td
CPU cycle
T1
T2
φ
Address bus
RD
HWR, LWR
DTE bit is
cleared
Figure 7.27 Bus Timing at Abort of DMA Transfer in Cycle-Steal Mode
7.6.9
Transfer Requests by A/D Converter
When the A/D converter is set to scan mode and conversion is performed on more than one
channel, the A/D converter generates a transfer request when all conversions are completed. The
converted data is stored in the appropriate ADDR registers. Block transfer mode and full address
mode should therefore be used to transfer all the conversion results at one time.
Rev. 2.0, 06/04, page 253 of 980
Rev. 2.0, 06/04, page 254 of 980
Section 8 I/O Ports
8.1
Overview
This LSI has ten input/output ports (ports 1 to 6, 8, 9, A, and B) and one input port (port 7). Table
8.1 summarizes the port functions. The pins in each port are multiplexed as shown in table 8.1.
Each port has a data direction register (DDR) for selecting input or output, and a data register
(DR) for storing output data. In addition to these registers, ports 2, 4, and 5 have an input pull-up
control register (PCR) for switching input pull-up transistors on and off.
Ports 1 to 6 and port 8 can drive one TTL load and a 90-pF capacitive load. Ports 9, A, and B can
drive one TTL load and a 30-pF capacitive load. Ports 1 to 6 and 8 to B can drive a darlington
pair. Ports 1, 2, and 5 can drive LEDs (with 10-mA current sink). Pins P82 to P80, PA7 to PA0 have
Schmitt-trigger input circuits.
For block diagrams of the ports see appendix C, I/O Port Block Diagrams.
Rev. 2.0, 06/04, page 255 of 980
Table 8.1
Port Functions
Expanded Modes
Port
Description
Mode 1
Port 1 • 8-bit I/O port
Can drive
LEDs
P17 to P10/
A7 to A0
Address output pins (A7 to A0)
Address output (A7 to
A0) and generic input
DDR = 0:
generic input
DDR = 1:
address output
Generic input/output
Port 2 • 8-bit I/O port
Built-in input
pull-up
transistors
Can drive
LEDs
P27 to P20/
A15 to A8
Address output pins (A15 to A8)
Address output (A15 to
A8) and generic input
DDR = 0:
generic input
DDR = 1:
address output
Generic input/output
Port 3 • 8-bit I/O port
P37 to P30/
D15 to D8
Data input/output (D15 to D8)
Generic input/output
Port 4 • 8-bit I/O port
Data input/output (D7 to D0) and 8-bit generic input/output
8-bit bus mode: generic input/output
16-bit bus mode: data input/output
Generic input/output
Port 5 • 4-bit I/O port
Address output (A19 to A16)
P47 to P40/
• Built-in input pull- D7 to D0
up transistors
P53 to P50/
• Built-in input pull- A19 to A16
up transistors
Mode 2
Mode 3
Single-Chip Modes
Pins
Mode 4 Mode 5
• Can drive LEDs
Port 6 • 7-bit I/O port and P67/φ
1-bit input port
Port 7 • 8-bit input port
Port 8
• 5-bit I/O port
• P82 to P80 have
Schmitt inputs
Mode 7
Generic input/output
Address output (A19 to
A16) and 4-bit
generic input
DDR = 0: generic input
DDR = 1: address output
Clock output (φ) and generic input
P66/LWR
P65/HWR
P64/RD
P63/AS
Bus control signal output (LWR, HWR, RD, AS)
P62/BACK
P61/BREQ
P60/WAIT
Bus control signal input/output (BACK, BREQ, WAIT) and
3-bit generic input/output
P77/AN7/DA1
P76/AN6/DA0
Analog input (AN7, AN6) to A/D converter, analog output (DA1, DA0)
from D/A converter, and generic input
P75 to P70/
AN5 to AN0
Analog input (AN5 to AN0) to A/D converter, and generic input
P84/CS0
DDR = 0: generic input
DDR = 0 (reset value):
DDR = 1 (reset value): CS0 output
generic input
Generic input/output
Generic input/output
DDR = 1: CS0 output
P83/IRQ3/
IRQ3 input, CS1 output, external trigger input (ADTRG) to A/D converter,
IRQ3 input, external
CS1/ADTRG
and generic input
trigger input (ADTRG) to
DDR = 0 (after reset): generic input
A/D converter, and
DDR = 1: CS1 output
generic input/output
P82/IRQ2/CS2 IRQ2 and IRQ1 input, CS2 and CS3 output, and generic input*
IRQ2 and IRQ1 input and
P81/IRQ1/CS3 DDR = 0 (reset value): generic input
generic input/output
DDR = 1: CS2 and CS3 output
P80/IRQ0
IRQ0 input, RFSH output, and generic input/output
/RFSH
Note:
*
P81 can be used as an output port by making a setting in DRCRA.
Rev. 2.0, 06/04, page 256 of 980
IRQ0 input and generic
input/output
Expanded Modes
Port
Description
Mode 1
Port 9 • 6-bit I/O port
P95/IRQ5
/SCK1
P94/IRQ4
/SCK0
P93/RxD1
P92/RxD0
P91/TxD1
P90/TxD0
Input and output (SCK1, SCK0, RxD1, RxD0, TxD1, TxD0) for serial communication interfaces 1 and 0
(SCI1/0), IRQ5 and IRQ4 input, and 6-bit generic input/output
Port A • 8-bit I/O port
PA7/TP7/
Output (TP7) from programmable timing
pattern controller (TPC),
input or output (TIOCB2)
for 16-bit timer and
generic input/output
• Schmitt inputs
Port B • 8-bit I/O port
TIOCB2/A20
Mode 2
Mode 3
Mode 4
Single-Chip Modes
Pins
Address output
(A20)
Mode 5
Address output (A20),
TPC output (TP7),
input or output
(TIOCB2) for 16-bit
timer, and generic
input/output
Mode 7
TPC output (TP7), 16-bit
timer input or output
(TIOCB2), and generic
input/output
PA6/TP6/
TIOCA2/A21
PA5/TP5/
TIOCB1/A22
PA4/TP4/
TIOCA1/A23
TPC output (TP6 to TP4), TPC output (TP6 to TP4),16-bit timer input and
16-bit timer input and
output (TIOCA2, TIOCB1, TIOCA1), address
output (TIOCA2, TIOCB1, output (A23 to A21), and generic input/output
TIOCA1) , and generic
input/output
TPC output (TP6 to TP4),
16-bit timer input and
output (TIOCA2, TIOCB1,
TIOCA1) and generic
input/output
PA3/TP3/
TIOCB0/
TCLKD
PA2/TP2/
TIOCA0/
TCLKC
PA1/TP1/
TCLKB
/TEND1
PA0/TP0/
TCLKA
/TEND0
TPC output (TP3 to TP0), 16-bit timer input and output (TIOCB0, TIOCA0, TCLKD, TCLKC, TCLKB,
TCLKA), 8-bit timer input (TCLKD, TCLKC, TCLKB, TCLKA), output (TEND1, TEND0) from DMA
controller (DMAC), and generic input/output
PB7/TP15/
RXD2
PB6/TP14/
TXD2
PB5/TP13/
SCK2/LCAS
PB4/TP12/
UCAS
TPC output (TP15 to TP12), SCI2 input and output (SCK2 , RxD2, TxD2), DRAM TPC output (TP15 to
interface output (LCAS, UCAS), and generic input/output
TP12), SCI2 input and
output (SCK2, RxD2,
TxD2), and generic
input/output
PB3/TP11/
TMIO3/
DREQ1/CS4
PB2/TP10/
TMO2/CS5
PB1/TP9/
TMIO1/
DREQ0/CS6
PB0/TP8/
TMO0/CS7
TPC output (TP11 to TP8), 8-bit timer input and output (TMIO3, TMO2, TMIO1, TPC output (TP11 to TP8),
TMO0), DMAC input (DREQ1, DREQ0), CS7 to CS4 output, and generic
8-bit timer input and
input/output
output (TMIO3, TMO2,
TMIO1, TMO0), DMAC
input (DREQ1, DREQ0),
and generic input/output
Rev. 2.0, 06/04, page 257 of 980
8.2
Port 1
8.2.1
Overview
Port 1 is an 8-bit input/output port also used for address output, with the pin configuration shown
in figure 8.1. The pin functions differ between the expanded modes with on-chip ROM disabled,
expanded modes with on-chip ROM enabled, and single-chip mode. In modes 1 to 4 (expanded
modes with on-chip ROM disabled), they are address bus output pins (A7 to A0).
In mode 5 (expanded mode with on-chip ROM enabled), settings in the port 1 data direction
register (P1DDR) can designate pins for address bus output (A7 to A0) or generic input. In mode 7
(single-chip mode), port 1 is a generic input/output port.
When DRAM is connected to areas 2 to 5, A7 to A0 output row and column addresses in read and
write cycles. For details see section 6.5, DRAM Interface.
Pins in port 1 can drive one TTL load and a 90-pF capacitive load. They can also drive an LED or
a darlington transistor pair.
Port 1 pins
Port 1
Modes 1 to 4
Mode 5
Mode 7
P17 /A 7
A 7 (output)
P17 (input)/A 7 (output)
P17 (input/output)
P16 /A 6
A 6 (output)
P16 (input)/A 6 (output)
P16 (input/output)
P15 /A 5
A 5 (output)
P15 (input)/A 5 (output)
P15 (input/output)
P14 /A 4
A 4 (output)
P14 (input)/A 4 (output)
P14 (input/output)
P13 /A 3
A 3 (output)
P13 (input)/A 3 (output)
P13 (input/output)
P12 /A 2
A 2 (output)
P12 (input)/A 2 (output)
P12 (input/output)
P11 /A 1
A 1 (output)
P11 (input)/A 1 (output)
P11 (input/output)
P10 /A 0
A 0 (output)
P10 (input)/A 0 (output)
P10 (input/output)
Figure 8.1 Port 1 Pin Configuration
Rev. 2.0, 06/04, page 258 of 980
8.2.2
Register Descriptions
Table 8.2 summarizes the registers of port 1.
Table 8.2
Port 1 Registers
Initial Value
Address*
Name
H'EE000
Port 1 data direction register P1DDR
H'FFFD0
Port 1 data register
Note:
*
Abbreviation R/W
P1DR
Modes 1 to 4
Modes 5 and 7
W
H'FF
H'00
R/W
H'00
H'00
Lower 20 bits of the address in advanced mode.
Port 1 Data Direction Register (P1DDR): P1DDR is an 8-bit write-only register that can select
input or output for each pin in port 1.
Bit
7
6
5
4
3
2
1
0
P1 7 DDR P1 6 DDR P1 5 DDR P1 4 DDR P1 3 DDR P1 2 DDR P1 1 DDR P1 0 DDR
Modes Initial value
1 to 4 Read/Write
Modes Initial value
5 and 7 Read/Write
1
1
1
1
1
1
1
1
—
—
—
—
—
—
—
—
0
0
0
0
0
0
0
0
W
W
W
W
W
W
W
W
Port 1 data direction 7 to 0
These bits select input or
output for port 1 pins
Modes 1 to 4 (Expanded Modes with On-Chip ROM Disabled): P1DDR values are fixed at 1.
Port 1 functions as an address bus.
Mode 5 (Expanded Mode with On-Chip ROM Enabled): After a reset, port 1 functions as an
input port. A pin in port 1 becomes an address output pin if the corresponding P1DDR bit is set to
1, and a generic input pin if this bit is cleared to 0.
Mode 7 (Single-Chip Mode): Port 1 functions as an input/output port. A pin in port 1 becomes an
output port if the corresponding P1DDR bit is set to 1, and an input port if this bit is cleared to 0.
Rev. 2.0, 06/04, page 259 of 980
In modes 1 to 4, P1DDR bits are always read as 1, and cannot be modified.
In modes 5 and 7, P1DDR is a write-only register. Its value cannot be read. All bits return 1 when
read.
P1DDR is initialized to H'FF in modes 1 to 4, and to H'00 in modes 5 and 7, by a reset and in
hardware standby mode. In software standby mode it retains its previous setting. Therefore, if a
transition is made to software standby mode while port 1 is functioning as an input/output port
and a P1DDR bit is set to 1, the corresponding pin maintains its output state.
Port 1 Data Register (P1DR): P1DR is an 8-bit readable/writable register that stores port 1
output data. When port 1 functions as an output port, the value of this register is output. When
this register is read, the pin logic level is read for bits for which the P1DDR setting is 0, and the
P1DR value is read for bits for which the P1DDR setting is 1.
Bit
7
6
5
4
3
2
1
0
P1 7
P1 6
P1 5
P1 4
P1 3
P1 2
P1 1
P1 0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Port 1 data 7 to 0
These bits store data for port 1 pins
P1DR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it
retains its previous setting.
Rev. 2.0, 06/04, page 260 of 980
8.3
Port 2
8.3.1
Overview
Port 2 is an 8-bit input/output port also used for address output, with the pin configuration shown
in figure 8.2. The pin functions differ according to the operating mode.
In modes 1 to 4 (expanded modes with on-chip ROM disabled), port 2 consists of address bus
output pins (A15 to A8). In mode 5 (expanded mode with on-chip ROM enabled), settings in the
port 2 data direction register (P2DDR) can designate pins for address bus output (A15 to A8) or
generic input. In mode 7 (single-chip mode), port 2 is a generic input/output port.
When DRAM is connected to areas 2 to 5, A12 to A8 output row and column addresses in read and
write cycles. For details see section 6.5, DRAM Interface.
Port 2 has software-programmable built-in pull-up transistors.
Pins in port 2 can drive one TTL load and a 90-pF capacitive load. They can also drive an LED or
a darlington transistor pair.
Port 2
Port 2 pins
Modes 1 to 4
Mode 5
Mode 7
P27 /A 15
A15 (output)
P27 (input)/A15 (output)
P27 (input/output)
P26 /A 14
A14 (output)
P26 (input)/A14 (output)
P26 (input/output)
P25 /A 13
A13 (output)
P25 (input)/A13 (output)
P25 (input/output)
P24 /A 12
A12 (output)
P24 (input)/A12 (output)
P24 (input/output)
P23 /A 11
A11 (output)
P23 (input)/A11 (output)
P23 (input/output)
P22 /A 10
A10 (output)
P22 (input)/A10 (output)
P22 (input/output)
P21 /A 9
A9 (output)
P21 (input)/A9 (output)
P21 (input/output)
P20 /A 8
A8 (output)
P20 (input)/A8 (output)
P20 (input/output)
Figure 8.2 Port 2 Pin Configuration
Rev. 2.0, 06/04, page 261 of 980
8.3.2
Register Descriptions
Table 8.3 summarizes the registers of port 2.
Table 8.3
Port 2 Registers
Initial Value
Address*
Name
Abbreviation R/W Modes 1 to 4 Modes 5 and 7
H'EE001
Port 2 data direction register
P2DDR
W
H'FF
H'00
H'FFFD1
Port 2 data register
P2DR
R/W H'00
H'00
H'EE03C
Port 2 input pull-up MOS control
register
P2PCR
R/W H'00
H'00
Note: * Lower 20 bits of the address in advanced mode.
Port 2 Data Direction Register (P2DDR): P2DDR is an 8-bit write-only register that can select
input or output for each pin in port 2.
Bit
7
6
5
4
3
2
1
0
P2 7 DDR P2 6 DDR P2 5 DDR P2 4 DDR P2 3 DDR P2 2 DDR P2 1 DDR P2 0 DDR
Modes Initial value
1 to 4 Read/Write
1
1
1
1
1
1
1
1
—
—
—
—
—
—
—
—
Modes Initial value
5 and 7 Read/Write
0
0
0
0
0
0
0
0
W
W
W
W
W
W
W
W
Port 2 data direction 7 to 0
These bits select input or
output for port 2 pins
Modes 1 to 4 (Expanded Modes with On-Chip ROM Disabled): P2DDR values are fixed at 1.
Port 2 functions as an address bus.
Mode 5 (Expanded Mode with On-Chip ROM Enabled): Following a reset, port 2 is an input
port. A pin in port 2 becomes an address output pin if the corresponding P2DDR bit is set to 1,
and a generic input port if this bit is cleared to 0.
Mode 7 (Single-Chip Mode): Port 2 functions as an input/output port. A pin in port 2 becomes an
output port if the corresponding P2DDR bit is set to 1, and an input port if this bit is cleared to 0.
Rev. 2.0, 06/04, page 262 of 980
In modes 1 to 4, P2DDR bits are always read as 1, and cannot be modified.
In modes 5 and 7, P2DDR is a write-only register. Its value cannot be read. All bits return 1 when
read.
P2DDR is initialized to H'FF in modes 1 to 4, and to H'00 in modes 5 and 7, by a reset and in
hardware standby mode. In software standby mode it retains its previous setting. Therefore, if a
transition is made to software standby mode while port 2 is functioning as an input/output port
and a P2DDR bit is set to 1, the corresponding pin maintains its output state.
Port 2 Data Register (P2DR): P2DR is an 8-bit readable/writable register that stores output data
for port 2. When port 2 functions as an output port, the value of this register is output. When a bit
in P2DDR is set to 1, if port 2 is read the value of the corresponding P2DR bit is returned. When a
bit in P2DDR is cleared to 0, if port 2 is read the corresponding pin logic level is read.
Bit
7
6
5
4
3
2
1
0
P2
P2 6
P2 5
P2 4
P2 3
P2 2
P2 1
P2 0
7
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Port 2 data 7 to 0
These bits store data for port 2 pins
P2DR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it
retains its previous setting.
Port 2 Input Pull-Up MOS Control Register (P2PCR): P2PCR is an 8-bit readable/writable
register that controls the MOS input pull-up transistors in port 2.
Bit
7
6
5
4
3
2
1
0
P2 7 PCR P2 6 PCR P2 5 PCR P2 4 PCR P2 3 PCR P2 2 PCR P2 1 PCR P2 0 PCR
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Port 2 input pull-up MOS control 7 to 0
These bits control input pull-up
transistors built into port 2
In modes 5 and 7, when a P2DDR bit is cleared to 0 (selecting generic input), if the corresponding
bit in P2PCR is set to 1, the input pull-up transistor is turned on.
P2PCR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode
it retains its previous setting.
Rev. 2.0, 06/04, page 263 of 980
Table 8.4
Input Pull-Up Transistor States (Port 2)
Mode
Reset
Hardware
Standby Mode
Software
Standby Mode
Other Modes
1
2
3
4
Off
Off
Off
Off
5
7
Off
Off
On/off
On/off
Legend
Off:
The input pull-up transistor is always off.
On/off: The input pull-up transistor is on if P2PCR = 1 and P2DDR = 0. Otherwise, it is off.
Rev. 2.0, 06/04, page 264 of 980
8.4
Port 3
8.4.1
Overview
Port 3 is an 8-bit input/output port also used for data bus, with the pin configuration shown in
figure 8.3. Port 3 is a data bus in modes 1 to 5 (expanded modes) and a generic input/output port
in mode 7 (single-chip mode).
Pins in port 3 can drive one TTL load and a 90-pF capacitive load. They can also drive a
darlington transistor pair.
Port 3
Port 3 pins
Modes 1 to 5
Mode 7
P37 /D15
D15 (input/output)
P37 (input/output)
P36 /D14
D14 (input/output)
P36 (input/output)
P35 /D13
D13 (input/output)
P35 (input/output)
P34 /D12
D12 (input/output)
P34 (input/output)
P33 /D11
D11 (input/output)
P33 (input/output)
P32 /D10
D10 (input/output)
P32 (input/output)
P31 /D9
D9 (input/output)
P31 (input/output)
P30 /D8
D8 (input/output)
P30 (input/output)
Figure 8.3 Port 3 Pin Configuration
8.4.2
Register Descriptions
Table 8.5 summarizes the registers of port 3.
Table 8.5
Port 3 Registers
Address*
Name
Abbreviation
R/W
Initial Value
H'EE002
Port 3 data direction register
P3DDR
W
H'00
H'FFFD2
Port 3 data register
P3DR
R/W
H'00
Note: * Lower 20 bits of the address in advanced mode.
Rev. 2.0, 06/04, page 265 of 980
Port 3 Data Direction Register (P3DDR): P3DDR is an 8-bit write-only register that can select
input or output for each pin in port 3.
Bit
7
6
5
4
3
2
1
0
P3 7 DDR P3 6 DDR P3 5 DDR P3 4 DDR P3 3 DDR P3 2 DDR P3 1 DDR P3 0 DDR
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port 3 data direction 7 to 0
These bits select input or output for port 3 pins
Modes 1 to 5 (Expanded Modes): Port 3 functions as a data bus, regardless of the P3DDR
settings.
Mode 7 (Single-Chip Mode): Port 3 functions as an input/output port. A pin in port 3 becomes an
output port if the corresponding P3DDR bit is set to 1, and an input port if this bit is cleared to 0.
P3DDR is a write-only register. Its value cannot be read. All bits return 1 when read.
P3DDR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode
it retains its previous setting. Therefore, if a transition is made to software standby mode while
port 3 is functioning as an input/output port and a P3DDR bit is set to 1, the corresponding pin
maintains its output state.
Port 3 Data Register (P3DR): P3DR is an 8-bit readable/writable register that stores output data
for port 3. When port 3 functions as an output port, the value of this register is output. When a bit
in P3DDR is set to 1, if port 3 is read the value of the corresponding P3DR bit is returned. When a
bit in P3DDR is cleared to 0, if port 3 is read the corresponding pin logic level is read.
Bit
7
P3
6
7
P3
5
6
P3
4
5
P3
3
4
P3
2
3
P3
1
2
P3
0
1
P3
0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Port 3 data 7 to 0
These bits store data for port 3 pins
P3DR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it
retains its previous setting.
Rev. 2.0, 06/04, page 266 of 980
8.5
Port 4
8.5.1
Overview
Port 4 is an 8-bit input/output port also used for data bus, with the pin configuration shown in
figure 8.4. The pin functions differ depending on the operating mode.
In modes 1 to 5 (expanded modes), when the bus width control register (ABWCR) designates
areas 0 to 7 all as 8-bit-access areas, the chip operates in 8-bit bus mode and port 4 is a generic
input/output port. When at least one of areas 0 to 7 is designated as a 16-bit-access area, the chip
operates in 16-bit bus mode and port 4 becomes part of the data bus. In mode 7 (single-chip
mode), port 4 is a generic input/output port.
Port 4 has software-programmable built-in pull-up transistors.
Pins in port 4 can drive one TTL load and a 90-pF capacitive load. They can also drive a
darlington transistor pair.
Port 4
Port 4 pins
Modes 1 to 5
Mode 7
P47 /D7
P47 (input/output)/D7 (input/output)
P47 (input/output)
P46 /D6
P46 (input/output)/D6 (input/output)
P46 (input/output)
P45 /D5
P45 (input/output)/D5 (input/output)
P45 (input/output)
P44 /D4
P44 (input/output)/D4 (input/output)
P44 (input/output)
P43 /D3
P43 (input/output)/D3 (input/output)
P43 (input/output)
P42 /D2
P42 (input/output)/D2 (input/output)
P42 (input/output)
P41 /D1
P41 (input/output)/D1 (input/output)
P41 (input/output)
P40 /D0
P40 (input/output)/D0 (input/output)
P40 (input/output)
Figure 8.4 Port 4 Pin Configuration
Rev. 2.0, 06/04, page 267 of 980
8.5.2
Register Descriptions
Table 8.6 summarizes the registers of port 4.
Table 8.6
Port 4 Registers
Address*
Name
Abbreviation
R/W
Initial Value
H'EE003
Port 4 data direction register
P4DDR
W
H'00
H'FFFD3
Port 4 data register
P4DR
R/W
H'00
H'EE03E
Port 4 input pull-up control register
P4PCR
R/W
H'00
Note:
*
Lower 20 bits of the address in advanced mode.
Port 4 Data Direction Register (P4DDR): P4DDR is an 8-bit write-only register that can select
input or output for each pin in port 4.
Bit
7
6
5
4
3
2
1
0
P4 7 DDR P4 6 DDR P4 5 DDR P4 4 DDR P4 3 DDR P4 2 DDR P4 1 DDR P4 0 DDR
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port 4 data direction 7 to 0
These bits select input or output for port 4 pins
Modes 1 to 5 (Expanded Modes): When all areas are designated as 8-bit-access areas by the bus
controller’s bus width control register (ABWCR), selecting 8-bit bus mode, port 4 functions as an
input/output port. In this case, a pin in port 4 becomes an output port if the corresponding P4DDR
bit is set to 1, and an input port if this bit is cleared to 0.
When at least one area is designated as a 16-bit-access area, selecting 16-bit bus mode, port 4
functions as part of the data bus, regardless of the P4DDR settings.
Mode 7 (Single-Chip Mode): Port 4 functions as an input/output port. A pin in port 4 becomes an
output port if the corresponding P4DDR bit is set to 1, and an input port if this bit is cleared to 0.
P4DDR is a write-only register. Its value cannot be read. All bits return 1 when read.
P4DDR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode
it retains its previous setting.
Rev. 2.0, 06/04, page 268 of 980
ABWCR and P4DDR are not initialized in software standby mode. Therefore, if a transition is
made to software standby mode while port 4 is functioning as an input/output port and a P4DDR
bit is set to 1, the corresponding pin maintains its output state.
Port 4 Data Register (P4DR): P4DR is an 8-bit readable/writable register that stores output data
for port 4. When port 4 functions as an output port, the value of this register is output. When a bit
in P4DDR is set to 1, if port 4 is read the value of the corresponding P4DR bit is returned. When a
bit in P4DDR is cleared to 0, if port 4 is read the corresponding pin logic level is read.
Bit
7
6
5
4
3
2
1
0
P4 7
P4 6
P4 5
P4 4
P4 3
P4 2
P4 1
P4 0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Port 4 data 7 to 0
These bits store data for port 4 pins
P4DR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it
retains its previous setting.
Port 4 Input Pull-Up MOS Control Register (P4PCR): P4PCR is an 8-bit readable/writable
register that controls the MOS input pull-up transistors in port 4.
Bit
7
6
5
4
3
2
1
0
P4 7 PCR P4 6 PCR P4 5 PCR P4 4 PCR P4 3 PCR P4 2 PCR P4 1 PCR P4 0 PCR
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Port 4 input pull-up control 7 to 0
These bits control input pull-up transistors built into port 4
In mode 7 (single-chip mode), and in 8-bit bus mode in modes 1 to 5 (expanded modes), when a
P4DDR bit is cleared to 0 (selecting generic input), if the corresponding P4PCR bit is set to 1, the
input pull-up transistor is turned on.
P4PCR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode
it retains its previous setting.
Rev. 2.0, 06/04, page 269 of 980
Table 8.7 summarizes the states of the input pull-up transistors in each operating mode.
Table 8.7
Input Pull-Up Transistor States (Port 4)
Mode
1 to 5
8-bit bus mode
Reset
Hardware
Standby Mode
Off
Off
16-bit bus mode
7
Software
Standby Mode
Other Modes
On/off
On/off
Off
Off
On/off
On/off
Legend
Off:
The input pull-up transistor is always off.
On/off: The input pull-up transistor is on if P4PCR = 1 and P4DDR = 0. Otherwise, it is off.
Rev. 2.0, 06/04, page 270 of 980
8.6
Port 5
8.6.1
Overview
Port 5 is a 4-bit input/output port also used for address output, with the pin configuration shown in
figure 8.5. The pin functions differ depending on the operating mode.
In modes 1 to 4 (expanded modes with on-chip ROM disabled), port 5 consists of address output
pins (A19 to A16). In mode 5 (expanded mode with on-chip ROM enabled), settings in the port 5
data direction register (P5DDR) designate pins for address bus output (A19 to A16) or generic input.
In mode 7 (single-chip mode), port 5 is a generic input/output port.
Port 5 has software-programmable built-in pull-up transistors.
Pins in port 5 can drive one TTL load and a 90-pF capacitive load. They can also drive an LED or
a darlington transistor pair.
Port 5
Port 5
pins
Modes 1 to 4
Mode 5
Mode 7
P53 /A 19
A19 (output)
P5 3 (input)/A19 (output)
P5 3 (input/output)
P52 /A 18
A18 (output)
P5 2 (input)/A18 (output)
P5 2 (input/output)
P51 /A 17
A17 (output)
P5 1 (input)/A17 (output)
P5 1 (input/output)
P50 /A 16
A16 (output)
P5 0 (input)/A16 (output)
P5 0 (input/output)
Figure 8.5 Port 5 Pin Configuration
8.6.2
Register Descriptions
Table 8.8 summarizes the registers of port 5.
Table 8.8
Port 5 Registers
Initial Value
Address* Name
Abbreviation
R/W Modes 1 to 4 Modes 5 and
7
H'EE004
P5DDR
W
H'FF
H'F0
P5DR
R/W H'F0
H'F0
R/W H'F0
H'F0
Port 5 data direction register
H'FFFD4 Port 5 data register
H'EE03F Port 5 input pull-up control register P5PCR
Note:
*
Lower 20 bits of the address in advanced mode.
Rev. 2.0, 06/04, page 271 of 980
Port 5 Data Direction Register (P5DDR): P5DDR is an 8-bit write-only register that can select
input or output for each pin in port 5.
Bits 7 to 4 are reserved. They are fixed at 1, and cannot be modified.
Bit
7
6
5
4
—
—
—
—
3
2
1
0
P5 3 DDR P5 2 DDR P5 1 DDR P5 0 DDR
Modes Initial value
1 to 4 Read/Write
1
1
1
1
1
1
1
1
—
—
—
—
—
—
—
—
Modes Initial value
5 and 7 Read/Write
1
1
1
1
0
0
0
0
—
—
—
—
W
W
W
W
Reserved bits
Port 5 data direction 3 to 0
These bits select input or
output for port 5 pins
Modes 1 to 4 (Expanded Modes with On-Chip ROM Disabled): P5DDR values are fixed at 1.
Port 5 functions as an address bus.
Mode 5 (Expanded Mode with On-Chip ROM Enabled): Following a reset, port 5 is an input
port. A pin in port 5 becomes an address output pin if the corresponding P5DDR bit is set to 1,
and an input port if this bit is cleared to 0.
Mode 7 (Single-Chip Mode): Port 5 functions as an input/output port. A pin in port 5 becomes an
output port if the corresponding P5DDR bit is set to 1, and an input port if this bit is cleared to 0.
In modes 1 to 4, P5DDR bits are always read as 1, and cannot be modified.
In modes 5 and 7, P5DDR is a write-only register. Its value cannot be read. All bits return 1 when
read.
P5DDR is initialized to H'FF in modes 1 to 4, and to H'F0 in modes 5 and 7, by a reset and in
hardware standby mode. In software standby mode it retains its previous setting. Therefore, if a
transition is made to software standby mode while port 5 is functioning as an input/output port
and a P5DDR bit is set to 1, the corresponding pin maintains its output state.
Rev. 2.0, 06/04, page 272 of 980
Port 5 Data Register (P5DR): P5DR is an 8-bit readable/writable register that stores output data
for port 5. When port 5 functions as an output port, the value of this register is output. When a bit
in P5DDR is set to 1, if port 5 is read the value of the corresponding P5DR bit is returned. When a
bit in P5DDR is cleared to 0, if port 5 is read the corresponding pin logic level is read.
Bits 7 to 4 are reserved. They are fixed at 1, and cannot be modified.
Bit
7
6
5
4
3
—
—
—
—
P5
2
P5
3
1
2
P5
0
P5
1
0
Initial value
1
1
1
1
0
0
0
0
Read/Write
—
—
—
—
R/W
R/W
R/W
R/W
Reserved bits
Port 5 data 3 to 0
These bits store data
for port 5 pins
P5DR is initialized to H'F0 by a reset and in hardware standby mode. In software standby mode it
retains its previous setting.
Port 5 Input Pull-Up MOS Control Register (P5PCR): P5PCR is an 8-bit readable/writable
register that controls the MOS input pull-up transistors in port 5.
Bits 7 to 4 are reserved. They are fixed at 1, and cannot be modified.
Bit
7
6
5
4
—
—
—
—
2
3
1
0
P5 3 PCR P5 2 PCR P5 1 PCR P5 0 PCR
Initial value
1
1
1
1
0
0
0
0
Read/Write
—
—
—
—
R/W
R/W
R/W
R/W
Reserved bits
Port 5 input pull-up control 3 to 0
These bits control input pull-up
transistors built into port 5
In modes 5 and 7, when a P5DDR bit is cleared to 0 (selecting generic input), if the corresponding
bit in P5PCR is set to 1, the input pull-up transistor is turned on.
P5PCR is initialized to H'F0 by a reset and in hardware standby mode. In software standby mode
it retains its previous setting.
Table 8.9 summarizes the states of the input pull-ups in each mode.
Rev. 2.0, 06/04, page 273 of 980
Table 8.9
Input Pull-Up Transistor States (Port 5)
Mode
Reset
Hardware Standby Mode
Software Standby Mode
Other Modes
1
2
3
4
Off
Off
Off
Off
5
7
Off
Off
On/off
On/off
Legend
Off:
The input pull-up transistor is always off.
On/off: The input pull-up transistor is on if P5PCR = 1 and P5DDR = 0. Otherwise, it is off.
Rev. 2.0, 06/04, page 274 of 980
8.7
Port 6
8.7.1
Overview
Port 6 is an 8-bit input/output port that is also used for input and output of bus control signals
(LWR, HWR, RD, AS, BACK, BREQ, WAIT) and for clock (φ) output.
The pin configuration of port 6 is shown in figure 8.6.
In modes 1 to 5 (expanded modes), the pin functions are P67 (generic input)/φ, LWR, HWR, RD,
AS, P62/BACK, P61/BREQ, and P60/WAIT). See table 8.11 for the selection of the pin functions.
In mode 7 (single-chip mode), P67 functions as a generic input port or ø output, and P66 to P60
function as generic input/output ports.
When DRAM is connected to areas 2 to 5, LWR, HWR, and RD also function as LCAS, UCAS,
and WE, respectively. For details see section 6.5, DRAM Interface.
Pins in port 6 can drive one TTL load and a 90-pF capacitive load. They can also drive a
darlington transistor pair.
Port 6 pins
P6 7 / φ
Port 6
Mode 7
(single-chip mode)
Modes 1 to 5
(expanded modes)
P67 (input)/ φ
(output)
P6 7 (input) / φ(output)
P6 6 / LWR
LWR
(output)
P6 6 (input/output)
P6 5 / HWR
HWR
(output)
P6 5 (input/output)
P6 4 / RD
RD
(output)
P6 4 (input/output)
P6 3 / AS
AS
(output)
P6 3 (input/output)
P6 2 / BACK
P62 (input/output)/ BACK (output)
P6 2 (input/output)
P6 1 / BREQ
P61 (input/output)/ BREQ (input)
P6 1 (input/output)
P6 0 / WAIT
P60 (input/output)/ WAIT (input)
P6 0 (input/output)
Figure 8.6 Port 6 Pin Configuration
Rev. 2.0, 06/04, page 275 of 980
8.7.2
Register Descriptions
Table 8.10 summarizes the registers of port 6.
Table 8.10 Port 6 Registers
Address*
Name
Abbreviation
H'EE005
Port 6 data direction register
P6DDR
W
H'80
H'FFFD5
Port 6 data register
P6DR
R/W
H'80
Note:
*
R/W
Initial Value
Lower 20 bits of the address in advanced mode.
Port 6 Data Direction Register (P6DDR): P6DDR is an 8-bit write-only register that can select
input or output for each pin in port 6.
Bit 7 is reserved. It is fixed at 1, and cannot be modified.
Bit
7
—
6
5
4
3
2
1
0
P6 6 DDR P6 5 DDR P6 4 DDR P6 3 DDR P6 2 DDR P6 1 DDR P6 0 DDR
Initial value
1
0
0
0
0
0
0
0
Read/Write
—
W
W
W
W
W
W
W
Reserved bit
Port 6 data direction 6 to 0
These bits select input or output for port 6 pins
Modes 1 to 5 (Expanded Modes): P67 functions as the clock output pin (φ) or an input port. P67 is
the clock output pin (φ) if the PSTOP bit in MSTRCH is cleared to 0 (initial value), and an input
port if this bit is set to 1.
P66 to P63 function as bus control output pins (LWR, HWR, RD, and AS), regardless of the
settings of bits P66DDR to P63DDR.
P62 to P60 function as bus control input/output pins (BACK, BREQ, and WAIT) or input/output
ports. For the method of selecting the pin functions, see table 8.11.
When P62 to P60 function as input/output ports, the pin becomes an output port if the
corresponding P6DDR bit is set to 1, and an input port if this bit is cleared to 0.
Mode 7 (Single-Chip Mode): P67 functions as the clock output pin (φ) or an input port. P66 to
P60 function as generic input/output ports. P67 is the clock output pin (φ) if the PSTOP bit in
MSTCRH is cleared to 0, and an input port if this bit is set to 1 (initial value). A pin in port 6
becomes an output port if the corresponding bit of P66DDR to P60DDR is set to 1, and an input
port if this pin is cleared to 0.
Rev. 2.0, 06/04, page 276 of 980
P6DDR is a write-only register. Its value cannot be read. All bits return 1 when read.
P6DDR is initialized to H'80 by a reset and in hardware standby mode. In software standby mode
it retains its previous setting. Therefore, if a transition is made to software standby mode while
port 6 is functioning as an input/output port and a P6DDR bit is set to 1, the corresponding pin
maintains its output state.
Port 6 Data Register (P6DR): P6DR is an 8-bit readable/writable register that stores output data
for port 6. When port 6 functions as an output port, the value of this register is output. For bit 7, a
value of 1 is returned if the bit is read while the PSTOP bit in MSTCRH is cleared to 0, and the
P67 pin logic level is returned if the bit is read while the PSTOP bit is set to 1. Bit 7 cannot be
modified. For bits 6 to 0, the pin logic level is returned if the bit is read while the corresponding
bit in P6DDR is cleared to 0, and the P6DR value is returned if the bit is read while the
corresponding bit in P6DDR is set to 1.
Bit
7
6
5
4
3
2
1
0
P67
P6 6
P6 5
P6 4
P6 3
P6 2
P6 1
P6 0
Initial value
1
0
0
0
0
0
0
0
Read/Write
R
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Port 6 data 7 to 0
These bits store data for port 6 pins
P6DR is initialized to H'80 by a reset and in hardware standby mode. In software standby mode it
retains its previous setting.
Rev. 2.0, 06/04, page 277 of 980
Table 8.11 Port 6 Pin Functions in Modes 1 to 5
Pin
Pin Functions and Selection Method
P67/φ
Bit PSTOP in MSTCRH selects the pin function.
PSTOP
Pin function
LWR
0
1
φ output
P67 input
Functions as LWR regardless of the setting of bit P66DDR.
P66DDR
0
1
LWR output*
Pin function
Note: * If any of bits DRAS2 to DRAS0 in DRCRA is 1 and bit CSEL in DRCRB is 1, LWR
output functions as LCAS.
HWR
Functions as HWR regardless of the setting of bit P65DDR.
P65DDR
0
1
HWR output*
Pin function
Note: * If any of bits DRAS2 to DRAS0 in DRCRA is 1 and bit CSEL in DRCRB is 1, HWR
output functions as UCAS.
RD
Functions as RD regardless of the setting of bit P64DDR.
P64DDR
0
1
RD output*
Pin function
Note: * If any of bits DRAS2 to DRAS0 in DRCRA is 1, RD output functions as WE.
AS
Functions as AS regardless of the setting of bit P63DDR.
P63DDR
0
1
AS output
Pin function
P62/BACK
Bit BRLE in BRCR and bit P62DDR select the pin function as follows.
BRLE
P62DDR
Pin function
P61/BREQ
0
1
—
P62 input
P62 output
BACK output
Bit BRLE in BRCR and bit P61DDR select the pin function as follows.
BRLE
P61DDR
Pin function
P60/WAIT
1
0
0
1
0
1
—
P61 input
P61 output
BREQ input
Bit WAITE in BCR and bit P60DDR select the pin function as follows.
WAITE
P60DDR
Pin function
0
1
0*
P60 input
P60 output
WAIT input
Note: * Do not set bit P60DDR to 1.
Rev. 2.0, 06/04, page 278 of 980
1
0
8.8
Port 7
8.8.1
Overview
Port 7 is an 8-bit input port that is also used for analog input to the A/D converter and analog
output from the D/A converter. The pin functions are the same in all operating modes. Figure 8.7
shows the pin configuration of port 7.
See section 15, A/D Converter, for details of the A/D converter analog input pins, and section 16,
D/A Converter, for details of the D/A converter analog output pins.
Port 7 pins
P77 (input)/AN 7 (input)/DA 1 (output)
P76 (input)/AN 6 (input)/DA 0 (output)
P75 (input)/AN 5 (input)
Port 7
P74 (input)/AN 4 (input)
P73 (input)/AN 3 (input)
P72 (input)/AN 2 (input)
P71 (input)/AN 1 (input)
P70 (input)/AN 0 (input)
Figure 8.7 Port 7 Pin Configuration
Rev. 2.0, 06/04, page 279 of 980
8.8.2
Register Description
Table 8.12 summarizes the port 7 register. Port 7 is an input port, and port 7 has no data direction
register.
Table 8.12 Port 7 Data Register
Address*
Name
Abbreviation
R/W
Initial Value
H'FFFD6
Port 7 data register
P7DR
R
Undetermined
Note:
*
Lower 20 bits of the address in advanced mode.
Port 7 Data Register (P7DR)
Bit
7
6
5
4
3
2
1
0
P77
P76
P75
P74
P73
P72
P71
P70
Initial value
—*
—*
—*
—*
—*
—*
—*
—*
Read/Write
R
R
R
R
R
R
R
R
Note: * Determined by pins P7 7 to P70 .
When port 7 is read, the pin logic levels are always read. P7DR cannot be modified.
Rev. 2.0, 06/04, page 280 of 980
8.9
Port 8
8.9.1
Overview
Port 8 is a 5-bit input/output port that is also used for CS3 to CS0 output, RFSH output, IRQ3 to
IRQ0 input, and A/D converter ADTRG input. Figure 8.8 shows the pin configuration of port 8.
In modes 1 to 5 (expanded modes), port 8 can provide CS3 to CS0 output, RFSH output, IRQ3 to
IRQ0 input, and ADTRG input. See table 8.14 for the selection of pin functions in expanded
modes.
In mode 7 (single-chip mode), port 8 can provide IRQ3 to IRQ0 input and ADTRG input. See table
8.15 for the selection of pin functions in single-chip mode.
See section 15, A/D Converter, for a description of the A/D converter's ADTRG input pin.
The IRQ3 to IRQ0 functions are selected by IER settings, regardless of whether the pin is used for
input or output. Caution is therefore required. For details see section 5.3.1, External Interrupts.
When DRAM is connected to areas 2 to 5, the CS3 and CS2 output pins function as RAS output
pins for each area. For details see section 6.5, DRAM Interface.
Pins in port 8 can drive one TTL load and a 90-pF capacitive load. They can also drive a
darlington transistor pair.
Pins P82 to P80 have Schmitt-trigger inputs.
Rev. 2.0, 06/04, page 281 of 980
Port 8
Port 8 pins
Pin functions in modes 1 to 5
(expanded modes)
P84 / CS 0
P84 (input)/ CS 0 (output)
P83 / CS 1 / IRQ 3 / ADTRG
P83 (input)/ CS 1 (output)/ IRQ 3 (input) / ADTRG (input)
P82 / CS 2 / IRQ 2
P82 (input)/ CS 2 (output)/ IRQ 2 (input)
P81 / CS 3 / IRQ 1
P81 (input/output)/ CS3 (output)/IRQ1(input)
P80 / RFSH /IRQ 0
P80 (input/output)/ RFSH (output)/ IRQ 0 (input)
Pin functions in mode 7
(single-chip mode)
P84 /(input/output)
P83 /(input/output)/ IRQ 3 (input) / ADTRG (input)
P82 /(input/output)/ IRQ 2 (input)
P81 /(input/output)/ IRQ 1 (input)
P80 /(input/output)/ IRQ 0 (input)
Figure 8.8 Port 8 Pin Configuration
Rev. 2.0, 06/04, page 282 of 980
8.9.2
Register Descriptions
Table 8.13 summarizes the registers of port 8.
Table 8.13 Port 8 Registers
Initial Value
Address*
Name
Abbreviation
R/W
Modes 1 to 4
Modes 5 and 7
H'EE007
Port 8 data direction
register
P8DDR
W
H'F0
H'E0
H'FFFD7
Port 8 data register
P8DR
R/W
H'E0
H'E0
Note:
*
Lower 20 bits of the address in advanced mode.
Port 8 Data Direction Register (P8DDR): P8DDR is an 8-bit write-only register that can select
input or output for each pin in port 8.
Bits 7 to 5 are reserved. They are fixed at 1, and cannot be modified.
Bit
7
6
5
—
—
—
4
3
2
1
0
P8 4 DDR P8 3 DDR P8 2 DDR P8 1 DDR P8 0 DDR
Modes Initial value
1 to 4 Read/Write
1
1
1
1
0
0
0
0
—
—
—
W
W
W
W
W
Modes Initial value
5 and 7 Read/Write
1
1
1
0
0
0
0
0
—
—
—
W
W
W
W
W
Reserved bits
Port 8 data direction 4 to 0
These bits select input or
output for port 8 pins
Modes 1 to 5 (Expanded Modes): When bits in P8DDR bit are set to 1, P84 to P81 become CS0 to
CS3 output pins. When bits in P8DDR are cleared to 0, the corresponding pins become input ports.
However, P81 can also be used as an output port, depending on the setting of bits DRAS2 to
DRAS0 in DRAM control register A (DRCRA). For details see section 6.5.2, DRAM Space and
RAS Output Pin Settings.
In modes 1 to 4 (expanded modes with on-chip ROM disabled), following a reset P84 functions as
the CS0 output, while CS1 to CS3 are input ports. In mode 5 (expanded mode with on-chip ROM
enabled), following a reset CS0 to CS3 are all input ports.
When the refresh enable bit (RFSHE) in DRCRA is set to 1, P80 is used for RFSH output. When
RFSHE is cleared to 0, P80 becomes an input/output port according to the P8DDR setting. For
details see table 8.14.
Rev. 2.0, 06/04, page 283 of 980
Mode 7 (Single-Chip Mode): Port 8 is a generic input/output port. A pin in port 8 becomes an
output port if the corresponding P8DDR bit is set to 1, and an input port if this bit is cleared to 0.
P8DDR is a write-only register. Its value cannot be read. All bits return 1 when read.
P8DDR is initialized to H'F0 in modes 1 to 4, and to H'E0 in modes 5 and 7, by a reset and in
hardware standby mode. In software standby mode P8DDR retains its previous setting. Therefore,
if a transition is made to software standby mode while port 8 is functioning as an input/output port
and a P8DDR bit is set to 1, the corresponding pin maintains its output state.
Port 8 Data Register (P8DR): P8DR is an 8-bit readable/writable register that stores output data
for port 8. When port 8 functions as an output port, the value of this register is output. When a bit
in P8DDR is set to 1, if port 8 is read the value of the corresponding P8DR bit is returned. When
a bit in P8DDR is cleared to 0, if port 8 is read the corresponding pin logic level is read.
Bits 7 to 5 are reserved. They are fixed at 1, and cannot be modified.
Bit
7
6
5
4
—
—
—
P8
3
4
P8
2
3
P8
1
2
P8
0
1
P8
0
Initial value
1
1
1
0
0
0
0
0
Read/Write
—
—
—
R/W
R/W
R/W
R/W
R/W
Reserved bits
Port 8 data 4 to 0
These bits store data
for port 8 pins
P8DR is initialized to H'E0 by a reset and in hardware standby mode. In software standby mode it
retains its previous setting.
Rev. 2.0, 06/04, page 284 of 980
Table 8.14 Port 8 Pin Functions in Modes 1 to 5
Pin
Pin Functions and Selection Method
P84/CS0
Bit P84DDR selects the pin function as follows.
P84DDR
Pin function
P83/CS1/IRQ3/ADTRG
0
1
P84 input
CS0 output
Bit P83DDR selects the pin function as follows.
P83DDR
Pin function
0
1
P83 input
CS1 output
IRQ3 input
ADTRG input
P82/CS2/IRQ2
The DRAM interface settings by bits DRAS2 to DRAS0 in DRCRA, and bit P82DDR, select the
pin function as follows.
DRAM interface
settings
(1) in table below
P82DDR
Pin function
|(2) in table below
0
1
—
P82 input
CS2 output
CS2 output*
IRQ3 input
Note: * CS2 is output as RAS2.
DRAM interface
setting
(1)
(2)
DRAS2
0
DRAS1
DRAS0
P81/CS3/IRQ1
1
0
0
1
1
0
0
1
1
0
1
0
1
The DRAM interface settings by bits DRAS2 to DRAS0 in DRCRA, and bit P81DDR, select the
pin function as follows.
DRAM interface
settings
(1) in table below
P81DDR
Pin function
0
(2) in table below
1
0
P81 input CS3 output P81 input
pin
pin
pin
(3) in table below
1
—
P81 output
pin
CS3 output pin*
IRQ1 input pin
Note: * CS3 is output as RAS3.
DRAM interface
setting
(1)
(3)
DRAS2
DRAS1
DRAS0
P80/RFSH/IRQ0
(2)
(3)
(2)
0
1
0
0
1
1
0
0
1
1
0
1
0
1
Bit RFSHE in DRCRA and bit P80DDR select the pin function as follows.
RFSHE
P80DDR
Pin function
0
1*
0
1
—
P80 input
P80 output
RFSH output
IRQ0 input
Note: * If areas 2 to 5 are not designated as DRAM space, this bit should not be set to 1.
Rev. 2.0, 06/04, page 285 of 980
Table 8.15 Port 8 Pin Functions in Mode 7
Pin
Pin Functions and Selection Method
P84
Bit P84DDR selects the pin function as follows.
P84DDR
Pin function
P83/IRQ3/ADTRG
0
1
P84 input
P84 output
Bit P83DDR selects the pin function as follows.
P83DDR
Pin function
0
1
P83 input
P83 output
IRQ3 input
ADTRG input
P82/IRQ2
Bit P82DDR selects the pin function as follows.
P82DDR
Pin function
0
1
P82 input
P82 output
IRQ2 input
P81/IRQ1
Bit P81DDR selects the pin function as follows.
P81DDR
Pin function
0
1
P81 input
P81 output
IRQ1 input
P80/IRQ0
Bit P80DDR select the pin function as follows.
P80DDR
Pin function
0
1
P80 input
P80 output
IRQ0 input
Rev. 2.0, 06/04, page 286 of 980
8.10
Port 9
8.10.1
Overview
Port 9 is a 6-bit input/output port that is also used for input and output (TxD0, TxD1, RxD0, RxD1,
SCK0, SCK1) by serial communication interface channels 0 and 1 (SCI0 and SCI1), and for IRQ5
and IRQ4 input. See table 8.17 for the selection of pin functions.
The IRQ5 and IRQ4 functions are selected by IER settings, regardless of whether the pin is used
for input or output. Caution is therefore required. For details see section 5.3.1, External Interrupts.
Port 9 has the same set of pin functions in all operating modes. Figure 8.9 shows the pin
configuration of port 9.
Pins in port 9 can drive one TTL load and a 30-pF capacitive load. They can also drive a
darlington transistor pair.
Port 9 pins
P95 (input/output)/SCK 1 (input/output)/IRQ 5 (input)
P94 (input/output)/SCK 0 (input/output)/IRQ 4 (input)
Port 9
P93 (input/output)/RxD1 (input)
P92 (input/output)/RxD0 (input)
P91 (input/output)/TxD1 (output)
P90 (input/output)/TxD0 (output)
Figure 8.9 Port 9 Pin Configuration
Rev. 2.0, 06/04, page 287 of 980
8.10.2
Register Descriptions
Table 8.16 summarizes the registers of port 9.
Table 8.16 Port 9 Registers
Address*
Name
Abbreviation
R/W
Initial Value
H'EE008
Port 9 data direction register
P9DDR
W
H'C0
H'FFFD8
Port 9 data register
P9DR
R/W
H'C0
Note:
*
Lower 20 bits of the address in advanced mode.
Port 9 Data Direction Register (P9DDR): P9DDR is an 8-bit write-only register that can select
input or output for each pin in port 9.
Bits 7 and 6 are reserved. They are fixed at 1, and cannot be modified.
Bit
7
6
5
4
3
2
1
0
—
—
Initial value
1
1
0
0
0
0
0
0
Read/Write
—
—
W
W
W
W
W
W
Reserved bits
P9 5 DDR P9 4 DDR P9 3 DDR P9 2 DDR P9 1 DDR P9 0 DDR
Port 9 data direction 5 to 0
These bits select input or
output for port 9 pins
When port 9 functions as an input/output port, a pin in port 9 becomes an output port if the
corresponding P9DDR bit is set to 1, and an input port if this bit is cleared to 0. For the method of
selecting the pin functions, see table 8.17.
P9DDR is a write-only register. Its value cannot be read. All bits return 1 when read.
P9DDR is initialized to H'C0 by a reset and in hardware standby mode. In software standby mode
it retains its previous setting. Therefore, if a transition is made to software standby mode while
port 9 is functioning as an input/output port and a P9DDR bit is set to 1, the corresponding pin
maintains its output state.
Rev. 2.0, 06/04, page 288 of 980
Port 9 Data Register (P9DR): P9DR is an 8-bit readable/writable register that stores output data
for port 9. When port 9 functions as an output port, the value of this register is output. When a bit
in P9DDR is set to 1, if port 9 is read the value of the corresponding P9DR bit is returned. When a
bit in P9DDR is cleared to 0, if port 9 is read the corresponding pin logic level is read.
Bits 7 and 6 are reserved. They are fixed at 1, and cannot be modified.
Bit
7
6
5
4
3
2
1
0
—
—
P9 5
P9 4
P9 3
P9 2
P9 1
P9 0
Initial value
1
1
0
0
0
0
0
0
Read/Write
—
—
R/W
R/W
R/W
R/W
R/W
R/W
Reserved bits
Port 9 data 5 to 0
These bits store data
for port 9 pins
P9DR is initialized to H'C0 by a reset and in hardware standby mode. In software standby mode it
retains its previous setting.
Rev. 2.0, 06/04, page 289 of 980
Table 8.17 Port 9 Pin Functions
Pin
Pin Functions and Selection Method
P95/SCK1/IRQ5
Bit C/A in SMR of SCI1, bits CKE0 and CKE1 in SCR, and bit P95DDR select the pin function
as follows.
CKE1
0
C/A
0
CKE0
P95DDR
Pin function
1
0
1
—
1
—
—
0
1
—
—
—
P95
input
P95
output
SCK1 output
SCK1 output
SCK1 input
IRQ5 input
P94/SCK0/IRQ4
Bit C/A in SMR of SCI0, bits CKE0 and CKE1 in SCR, and bit P94DDR select the pin function
as follows.
CKE1
0
C/A
CKE0
P94DDR
Pin function
1
0
0
1
—
1
—
—
0
1
—
—
—
P94
input
P94
output
SCK0 output
SCK0 output
SCK0 input
IRQ4 input
P93/RxD1
Bit RE in SCR of SCI1, bit SMIF in SCMR, and bit P93DDR select the pin function as follows.
SMIF
0
RE
P93DDR
Pin function
P92/RxD0
0
1
1
—
0
1
—
—
P93 input
P93 output
RxD1 input
RxD1 input
Bit RE in SCR of SCI0, bit SMIF in SCMR, and bit P92DDR select the pin function as follows.
SMIF
0
RE
P92DDR
Pin function
Rev. 2.0, 06/04, page 290 of 980
0
1
1
—
0
1
—
—
P92 input
P92 output
RxD0 input
RxD0 input
Pin
Pin Functions and Selection Method
P91/TxD1
Bit TE in SCR of SCI1, bit SMIF in SCMR, and bit P91DDR select the pin function as follows.
SMIF
0
TE
P91 DDR
Pin function
0
1
1
—
0
1
—
—
P91 input
P91 output
TxD1 output
TxD1 output*
Note: * Functions as the TxD1 output pin, but there are two states: one in which the pin is
driven, and another in which the pin is at high-impedance.
P90/TxD0
Bit TE in SCR of SCI0, bit SMIF in SCMR, and bit P90DDR select the pin function as follows.
SMIF
0
TE
P90DDR
Pin function
0
1
1
—
0
1
—
—
P90 input
P90 output
TxD0 output
TxD0 output*
Note: * Functions as the TxD0 output pin, but there are two states: one in which the pin is
driven, and another in which the pin is at high-impedance.
Rev. 2.0, 06/04, page 291 of 980
8.11
Port A
8.11.1
Overview
Port A is an 8-bit input/output port that is also used for output (TP7 to TP0) from the
programmable timing pattern controller (TPC), input and output, (TIOCB2, TIOCA2, TIOCB1,
TIOCA1, TIOCB0, TIOCA0, TCLKD, TCLKC, TCLKB, TCLKA) by the 16-bit timer, input
(TCLKD, TCLKC, TCLKB, TCLKA) to the 8-bit timer, output (TEND1, TEND0) from the DMA
controller (DMAC), and address output (A23 to A20). A reset or hardware standby transition leaves
port A as an input port, except that in modes 3 and 4, one pin is always used for A20 output. See
table 8.19 to 8.21 for the selection of pin functions.
Usage of pins for TPC, 16-bit timer, 8-bit timer, and DMAC input and output is described in the
sections on those modules. For output of address bits A23 to A20 in modes 3, 4, and 5, see section
6.2.4, Bus Release Control Register (BRCR). Pins not assigned to any of these functions are
available for generic input/output. Figure 8.10 shows the pin configuration of port A.
Pins in port A can drive one TTL load and a 30-pF capacitive load. They can also drive a
darlington transistor pair. Port A has Schmitt-trigger inputs.
Rev. 2.0, 06/04, page 292 of 980
Port A pins
PA 7 /TP7 /TIOCB2 /A20
PA 6 /TP6 /TIOCA2 /A21
PA 5 /TP5 /TIOCB1 /A22
PA 4 /TP4 /TIOCA1 /A23
Port A
PA 3 /TP3 /TIOCB0 /TCLKD
PA 2 /TP2 /TIOCA0 /TCLKC
PA 1 /TP1 /TEND1 /TCLKB
PA 0 /TP0 /TEND0 /TCLKA
Pin functions in modes 1, 2, and 7
PA 7 (input/output)/TP 7 (output)/TIOCB 2 (input/output)
PA 6 (input/output)/TP 6 (output)/TIOCA 2 (input/output)
PA 5 (input/output)/TP 5 (output)/TIOCB 1 (input/output)
PA 4 (input/output)/TP 4 (output)/TIOCA 1 (input/output)
PA 3 (input/output)/TP 3 (output)/TIOCB 0 (input/output)/TCLKD (input)
PA 2 (input/output)/TP 2 (output)/TIOCA 0 (input/output)/TCLKC (input)
PA 1 (input/output)/TP 1 (output)/TEND 1 (output)/TCLKB (input)
PA 0 (input/output)/TP 0 (output)/TEND 0 (output)/TCLKA (input)
Pin functions in modes 3 and 4
A 20 (output)
PA 6 (input/output)/TP 6 (output)/TIOCA 2 (input/output)/A 21(output)
PA 5 (input/output)/TP 5 (output)/TIOCB 1 (input/output)/A 22(output)
PA 4 (input/output)/TP 4 (output)/TIOCA 1 (input/output)/A 23(output)
PA 3 (input/output)/TP 3 (output)/TIOCB 0 (input/output)/TCLKD (input)
PA 2 (input/output)/TP 2 (output)/TIOCA 0 (input/output)/TCLKC (input)
PA 1 (input/output)/TP 1 (output)/TEND 1 (output)/TCLKB (input)
PA 0 (input/output)/TP 0 (output)/TEND 0 (output)/TCLKA (input)
Pin functions in mode 5
PA 7 (input/output)/TP7 (output)/TIOCB2 (input/output)/A 20 (output)
PA 6 (input/output)/TP6 (output)/TIOCA2 (input/output)/A 21 (output)
PA 5 (input/output)/TP5 (output)/TIOCB1 (input/output)/A 22 (output)
PA 4 (input/output)/TP4 (output)/TIOCA1 (input/output)/A 23 (output)
PA 3 (input/output)/TP3 (output)/TIOCB0 (input/output)/TCLKD (input)
PA 2 (input/output)/TP2 (output)/TIOCA0 (input/output)/TCLKC (input)
PA 1 (input/output)/TP1 (output)/TEND1 (output)/TCLKB (input)
PA 0 (input/output)/TP0 (output)/TEND0 (output)/TCLKA (input)
Figure 8.10 Port A Pin Configuration
Rev. 2.0, 06/04, page 293 of 980
8.11.2
Register Descriptions
Table 8.18 summarizes the registers of port A.
Table 8.18 Port A Registers
Initial Value
Address*
Name
Abbreviati R/W
on
Modes 1, 2, 5, and 7
Modes 3, 4
H'EE009
Port A data direction
register
PADDR
W
H'00
H'80
H'FFFD9
Port A data register
PADR
R/W
H'00
H'00
Note:
*
Lower 20 bits of the address in advanced mode.
Port A Data Direction Register (PADDR): PADDR is an 8-bit write-only register that can select
input or output for each pin in port A. When pins are used for TPC output, the corresponding
PADDR bits must also be set.
Bit
7
6
5
4
3
2
1
0
PA 7 DDR PA 6 DDR PA 5 DDR PA 4 DDR PA 3 DDR PA 2 DDR PA 1 DDR PA 0 DDR
Modes Initial value 1
3, 4
Read/Write —
Modes Initial value 0
1, 2, 5,
and 7 Read/Write W
0
0
0
0
0
0
0
W
W
W
W
W
W
W
0
0
0
0
0
0
0
W
W
W
W
W
W
W
Port A data direction 7 to 0
These bits select input or output for port A pins
The pin functions that can be selected for pins PA7 to PA4 differ between modes 1, 2, and 7, and
modes 3 to 5. For the method of selecting the pin functions, see tables 8.19 and 8.20.
The pin functions that can be selected for pins PA3 to PA0 are the same in modes 1 to 5, 7. For the
method of selecting the pin functions, see table 8.21.
When port A functions as an input/output port, a pin in port A becomes an output port if the
corresponding PADDR bit is set to 1, and an input port if this bit is cleared to 0. In modes 3 and 4,
PA7DDR is fixed at 1 and PA7 functions as the A20 address output pin.
PADDR is a write-only register. Its value cannot be read. All bits return 1 when read.
PADDR is initialized to H'00 by a reset and in hardware standby mode in modes 1, 2, 5, and 7.
It is initialized to H'80 by a reset and in hardware standby mode in modes 3 and 4. In software
Rev. 2.0, 06/04, page 294 of 980
standby mode it retains its previous setting. Therefore, if a transition is made to software standby
mode while port A is functioning as an input/output port and a PADDR bit is set to 1, the
corresponding pin maintains its output state.
Port A Data Register (PADR): PADR is an 8-bit readable/writable register that stores output
data for port A. When port A functions as an output port, the value of this register is output. When
a bit in PADDR is set to 1, if port A is read the value of the corresponding PADR bit is returned.
When a bit in PADDR is cleared to 0, if port A is read the corresponding pin logic level is read.
Bit
7
6
5
4
3
2
1
0
PA
PA
PA
PA
PA
PA
PA
PA
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Port A data 7 to 0
These bits store data for port A pins
PADR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it
retains its previous setting.
Table 8.19 Port A Pin Functions (Modes 1, 2, 7)
Pin
Pin Functions and Selection Method
PA7/TP7/
TIOCB2
Bit PWM2 in TMDR, bits IOB2 to IOB0 in TIOR2, bit NDER7 in NDERA, and bit PA7DDR select the pin function
as follows.
16-bit timer channel 2
settings
(1) in table below
(2) in table below
PA7DDR
—
0
1
1
NDER7
—
—
0
1
TIOCB2 output
PA7 input
PA7 output
TP7 output
Pin function
TIOCB2 input*
Note: * TIOCB2 input when IOB2 = 1 and PWM2 = 0.
16-bit timer channel 2
settings
(2)
IOB2
(1)
(2)
0
1
IOB1
0
0
1
—
IOB0
0
1
—
—
Rev. 2.0, 06/04, page 295 of 980
Pin
Pin Functions and Selection Method
PA6/TP6/
TIOCA2
Bit PWM2 in TMDR, bits IOA2 to IOA0 in TIOR2, bit NDER6 in NDERA, and bit PA6DDR select the pin function
as follows.
16-bit timer channel 2
settings
(1) in table below
(2) in table below
PA6DDR
—
0
1
1
NDER6
—
—
0
1
TIOCA2 output
PA6 input
PA6 output
TP6 output
Pin function
TIOCA2 input*
Note: * TIOCA2 input when IOA2 = 1.
16-bit timer channel 2
settings
(2)
(1)
PWM2
IOA2
PA5/TP5/
TIOCB1
(2)
(1)
0
1
1
—
IOA1
0
0
0
1
—
—
IOA0
0
1
—
—
—
Bit PWM1 in TMDR, bits IOB2 to IOB0 in TIOR1, bit NDER5 in NDERA, and bit PA5DDR select the pin function
as follows.
16-bit timer channel 1
settings
(1) in table below
(2) in table below
PA5DDR
—
0
1
1
NDER5
—
—
0
1
TIOCB1 output
PA5 input
PA5 output
TP5 output
Pin function
TIOCB1 input*
Note: * TIOCB1 input when IOB2 = 1 and PWM1 = 0.
16-bit timer channel 1
settings
(2)
IOB2
(1)
(2)
0
1
IOB1
0
0
1
—
IOB0
0
1
—
—
Rev. 2.0, 06/04, page 296 of 980
Pin
Pin Functions and Selection Method
PA4/TP4/
TIOCA1
Bit PWM1 in TMDR, bits IOA2 to IOA0 in TIOR1, bit NDER4 in NDERA, and bit PA4DDR select the pin function
as follows.
16-bit timer channel 1
settings
(1) in table below
(2) in table below
PA4DDR
—
0
1
1
NDER4
—
—
0
1
TIOCA1 output
PA4 input
PA4 output
TP4 output
Pin function
TIOCA1 input*
Note: * TIOCA1 input when IOA2 = 1.
16-bit timer channel 1
settings
(2)
(1)
PWM1
(2)
0
IOA2
(1)
1
1
—
IOA1
0
0
0
1
—
—
IOA0
0
1
—
—
—
Rev. 2.0, 06/04, page 297 of 980
Table 8.20 Port A Pin Functions (Modes 3 to 5)
Pin
Pin Functions and Selection Method
PA7/TP7/
Modes 3 and 4: Always used as A20 output.
TIOCB2/ A20
Pin function
A20 output
Mode 5:
Bit PWM2 in TMDR, bits IOB2 to IOB0 in TIOR2, bit NDER7 in NDERA, bit A20E in BRCR, and bit PA7DDR
select the pin function as follows.
A20E
16-bit timer channel 2
settings
1
(1) in table below
PA7DDR
Pin function
(2) in table below
—
NDER7
0
0
1
—
1
—
—
—
0
1
—
TIOCB2 output
PA7 input
PA7 output
TP7 output
A20 output
TIOCB2 input*
Note: * TIOCB2 input when IOB2 = 1 and PWM2 = 0.
16-bit timer channel 2 settings
(2)
(1)
IOB2
PA6/TP6/
TIOCA2/A21
(2)
0
1
IOB1
0
0
1
—
IOB0
0
1
—
—
Bit PWM2 in TMDR, bits IOA2 to IOA0 in TIOR2, bit NDER6 in NDERA, bit A21E in BRCR, and bit PA6DDR
select the pin function as follows.
A21E
16-bit timer channel 2
settings
1
(1) in table below
0
(2) in table below
—
PA6DDR
—
0
1
1
—
NDER6
—
—
0
1
—
TIOCA2 output
PA6 input
PA6 output
TP6 output
A21 output
Pin function
TIOCA2 input*
Note: * TIOCA2 input when IOA2 = 1.
16-bit timer channel 2 settings
(2)
(1)
PWM2
(2)
0
IOA2
(1)
1
1
—
IOA1
0
0
1
—
—
IOA0
0
1
—
—
—
Rev. 2.0, 06/04, page 298 of 980
0
Pin
Pin Functions and Selection Method
PA5/TP5/
TIOCB1/A22
Bit PWM1 in TMDR, bits IOB2 to IOB0 in TIOR1, bit NDER5 in NDERA, bit A22E in BRCR, and bit PA5DDR
select the pin function as follows.
A22E
16-bit timer channel 1
settings
1
(1) in table below
PA5DDR
Pin function
(2) in table below
—
NDER5
0
0
1
—
1
—
—
—
0
1
—
TIOCB1 output
PA5 input
PA5 output
TP5 output
A22 output
TIOCB1 input*
Note: * TIOCB1 input when IOB2 = 1 and PWM1 = 0.
16-bit timer channel 1
settings
(2)
(1)
IOB2
PA4/TP4/
TIOCA1/A23
(2)
0
1
IOB1
0
0
1
—
IOB0
0
1
—
—
Bit PWM1 in TMDR, bits IOA2 to IOA0 in TIOR1, bit NDER4 in NDERA, bit A23E in BRCR, and bit PA4DDR
select the pin function as follows.
A23E
16-bit timer channel 1
settings
1
(1) in table below
0
(2) in table below
—
PA4DDR
—
0
1
1
—
NDER4
—
—
0
1
—
TIOCA1 output
PA4 input
PA4 output
TP4 output
A23 output
Pin function
TIOCA1 input*
Note: * TIOCA1 input when IOA2 = 1.
16-bit timer channel 1
settings
(2)
(1)
PWM1
(2)
(1)
1
—
0
IOA2
1
0
IOA1
0
0
1
—
—
IOA0
0
1
—
—
—
Rev. 2.0, 06/04, page 299 of 980
Table 8.21 Port A Pin Functions (Modes 1 to 5, 7)
Pin
Pin Functions and Selection Method
PA3/TP3/
TIOCB0/
TCLKD
Bit PWM0 in TMDR, bits IOB2 to IOB0 in TIOR0, bits TPSC2 to TPSC0 in 16TCR2 to 16TCR0 of the 16-bit
timer, bits CKS2 to CKS0 in 8TCR2 of the 8-bit timer, bit NDER3 in NDERA, and bit PA3DDR select the pin
function as follows.
16-bit timer channel 0
settings
(1) in table below
PA3DDR
(2) in table below
—
NDER3
Pin function
0
1
1
—
—
0
1
TIOCB0
output
PA3
input
PA3
output
TP3
output
TIOCB0 input*1
2
TCLKD input*
Notes:
*1 TIOCB0 input when IOB2 = 1 and PWM0 = 0.
*2 TCLKD input when TPSC2 = TPSC1 = TPSC0 = 1 in any of 16TCR2 to 16TCR0, or bits CKS2
to CKS0 in 8TCR2 are as shown in (3) in the table below.
16-bit timer channel 0
settings
(2)
(1)
IOB2
(2)
0
1
IOB1
0
0
1
—
IOB0
0
1
—
—
8-bit timer channel 2
settings
(4)
CKS2
0
CKS1
—
CKS0
—
Rev. 2.0, 06/04, page 300 of 980
(3)
1
0
0
1
1
—
Pin
Pin Functions and Selection Method
PA2/TP2/
TIOCA0/
TCLKC
Bit PWM0 in TMDR, bits IOA2 to IOA0 in TIOR0, bits TPSC2 to TPSC0 in 16TCR2 to 16TCR0 of the 16-bit
timer, bits CKS2 to CKS0 in 8TCR0 of the 8-bit timer, bit NDER2 in NDERA, and bit PA2DDR select the pin
function as follows.
16-bit timer channel 0
settings
(1) in table below
(2) in table below
PA2DDR
—
0
1
1
NDER2
—
—
0
1
TIOCA0 output
PA2
input
PA2 output
TP2 output
Pin function
TIOCA0 input*1
TCLKC input*
Notes:
2
*1 TIOCA0 input when IOA2 = 1.
*2 TCLKC input when TPSC2 = TPSC1 = 1 and TPSC0 = 0 in any of 16TCR2 to 16TCR0, or bits
CKS2 to CKS0 in 8TCR0 are as shown in (3) in the table below.
16-bit timer channel 0
settings
(2)
(1)
PWM0
(2)
(1)
1
—
0
IOA2
1
0
IOA1
0
0
1
—
—
IOA0
0
1
—
—
—
8-bit timer channel 0
settings
(4)
CKS2
0
CKS1
—
CKS0
—
(3)
1
0
0
1
1
—
Rev. 2.0, 06/04, page 301 of 980
Pin
Pin Functions and Selection Method
PA1/TP1/
TCLKB/
TEND1
Bit MDF in TMDR, bits TPSC2 to TPSC0 in 16TCR2 to 16TCR0 of the 16-bit timer, bits CKS2 to CKS0 in
8TCR3 of the 8-bit timer, bit NDER1 in NDERA, and bit PA1DDR select the pin function as follows.
PA1DDR
0
NDER1
Pin function
1
1
—
0
1
PA1 input
PA1 output
TP1 output
TCLKB output*1
TEND1 output*2
Notes:
*1 TCLKB input when MDF = 1 in TMDR, or TPSC2 = 1, TPSC1 = 0, and TPSC0 = 1 in any of
16TCR2 to 16TCR0, or bits CKS2 to CKS0 in 8TCR3 are as shown in (1) in the table below.
*2 When an external request is specified as a DMAC activation source, TEND1 output regardless of
bits PA1DDR and NDER1.
8-bit timer channel 3
settings
PA0/TP0/
TCLKA/
TEND0
(2)
CKS2
0
CKS1
—
CKS0
—
(1)
1
0
0
1
1
—
Bit MDF in TMDR, bits TPSC2 to TPSC0 in 16TCR2 to 16TCR0 of the 16-bit timer, bits CKS2 to CKS0 in
8TCR1 of the 8-bit timer, bit NDER0 in NDERA, and bit PA0DDR select the pin function as follows.
PA0DDR
0
NDER0
Pin function
1
—
0
1
PA0 input
PA0 output
TP0 output
TCLKA output*1
TEND0 output*2
Notes:
*1 TCLKA input when MDF = 1 in TMDR, or TPSC2 = 1, TPSC1 = 0 and TPSC0 = 0 in any of
16TCR2 to 16TCR0, or bits CKS2 to CKS0 in 8TCR0 are as shown in (1) in the table below.
*2 When an external request is specified as a DMAC activation source, TEND0 output regardless of
bits PA0DDR and NDER0.
8-bit timer channel 1
settings
(2)
CKS2
0
CKS1
—
CKS0
—
Rev. 2.0, 06/04, page 302 of 980
(1)
1
0
0
1
1
—
8.12
Port B
8.12.1
Overview
Port B is an 8-bit input/output port that is also used for output (TP15 to TP8) from the
programmable timing pattern controller (TPC), input/output (TMIO3, TMO2, TMIO1, TMO0) by
the 8-bit timer, CS7 to CS4 output, input (DREQ1, DREQ0) to the DMA controller (DMAC), input
and output (TxD2, RxD2, SCK2) by serial communication interface channel 2 (SCI2), and output
(UCAS, LCAS) by the DRAM interface. See table 8.23 to 8.24 for the selection of pin functions.
A reset or hardware standby transition leaves port B as an input port.
For output of CS7 to CS4 in modes 1 to 5, see section 6.3.4, Chip Select Signals. Pins not assigned
to any of these functions are available for generic input/output. Figure 8.11 shows the pin
configuration of port B.
When DRAM is connected to areas 2, 3, 4, and 5, the CS4 and CS5 output pins become RAS
output pins for these areas. For details see section 6.5, DRAM Interface.
Pins in port B can drive one TTL load and a 30-pF capacitive load. They can also drive darlington
transistor pair.
Rev. 2.0, 06/04, page 303 of 980
Port B pins
PB7/TP15 /RxD2
PB6/TP14 /TxD2
PB5/TP13 /SCK2/LCAS
PB4/TP12 /UCAS
Port B
PB3/TP11 /TMIO3/DREQ1/CS4
PB2/TP10 /TMO2/CS5
PB1/TP9 /TMIO1/DREQ0/CS6
PB0/TP8 /TMO0/CS7
Pin functions in modes 1 to 5
PB7 (input/output)/TP15 (output) /RxD2 (input)
PB6 (input/output)/TP14 (output) /TxD2 (output)
PB5 (input/output)/TP13 (output) /SCK2 (input/output) /LCAS (output)
PB4 (input/output)/TP12 (output) /UCAS (output)
PB3 (input/output)/TP11 (output) /TMIO3 (input/output) /DREQ1 (input) CS4 (output)
PB2 (input/output)/TP10 (output) /TMO2 (output) /CS5 (output)
PB1 (input/output)/TP9 (output) /TMIO1 (input/output) /DREQ0 (input) /CS6 (output)
PB0 (input/output)/TP8 (output) /TMO0 (output) /CS7 (output)
Pin functions in mode 7
PB7 (input/output)/TP15 (output) /RxD2 (input)
PB6 (input/output)/TP14 (output) /TxD2 (output)
PB5 (input/output)/TP13 (output) /SCK2 (input/output)
PB4 (input/output)/TP12 (output)
PB3 (input/output)/TP11 (output) /TMIO3 (input/output) /DREQ1 (input)
PB2 (input/output)/TP10 (output) /TMO2 (output)
PB1 (input/output)/TP9 (output) /TMIO1 (input/output) /DREQ0 (input)
PB0 (input/output)/TP8 (output) /TMO0 (output)
Figure 8.11 Port B Pin Configuration
Rev. 2.0, 06/04, page 304 of 980
8.12.2
Register Descriptions
Table 8.22 summarizes the registers of port B.
Table 8.22 Port B Registers
Address*
Name
Abbreviation
R/W
Initial Value
H'EE00A
Port B data direction register
PBDDR
W
H'00
H'FFFDA
Port B data register
PBDR
R/W
H'00
Note: * Lower 20 bits of the address in advanced mode.
Port B Data Direction Register (PBDDR): PBDDR is an 8-bit write-only register that can select
input or output for each pin in port B. When pins are used for TPC output, the corresponding
PBDDR bits must also be set.
Bit
7
6
5
4
3
2
1
0
PB7 DDR PB6 DDR PB5 DDR PB4 DDR PB3 DDR PB2 DDR PB1 DDR PB0 DDR
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port B data direction 7 to 0
These bits select input or output for port B pins
The pin functions that can be selected for port B differ between modes 1 to 5, and mode 7. For the
method of selecting the pin functions, see tables 8.23 and 8.24.
When port B functions as an input/output port, a pin in port B becomes an output port if the
corresponding PBDDR bit is set to 1, and an input port if this bit is cleared to 0.
PBDDR is a write-only register. Its value cannot be read. All bits return 1 when read.
PBDDR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode
it retains its previous setting. Therefore, if a transition is made to software standby mode while
port B is functioning as an input/output port and a PBDDR bit is set to 1, the corresponding pin
maintains its output state.
Rev. 2.0, 06/04, page 305 of 980
Port B Data Register (PBDR): PBDR is an 8-bit readable/writable register that stores output data
for pins port B. When port B functions as an output port, the value of this register is output. When
a bit in PBDDR is set to 1, if port B is read the value of the corresponding PBDR bit is returned.
When a bit in PBDDR is cleared to 0, if port B is read the corresponding pin logic level is read.
Bit
7
6
5
4
3
2
1
0
PB 7
PB 6
PB 5
PB 4
PB 3
PB 2
PB 1
PB 0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Port B data 7 to 0
These bits store data for port B pins
PBDR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it
retains its previous setting.
Rev. 2.0, 06/04, page 306 of 980
Table 8.23 Port B Pin Functions (Modes 1 to 5)
Pin
Pin Functions and Selection Method
PB7/TP15/
RxD2
Bit RE in SCR of SCI2, bit SMIF in SCMR, bit NDER15 in NDERB, and bit PB7DDR select the pin function as
follows.
SMIF
0
RE
0
PB7DDR
0
NDER15
Pin function
PB6/TP14/
TxD2
1
1
1
1
—
—
—
—
0
1
—
—
PB7 input
PB7 output
TP15 output
RxD2 input
RxD2 input
Bit TE in SCR of SCI2, bit SMIF in SCMR, bit NDER14 in NDERB, and bit PB6DDR select the pin function as
follows.
SMIF
0
TE
1
0
1
—
—
PB6DDR
0
1
1
—
NDER14
—
0
1
—
—
PB6 input
PB6 output
TP14 output
TxD2 output
TxD2 output*
Pin function
Note: * Functions as the TxD2 output pin, but there are two states: one in which the pin is driven, and another
in which the pin is at high-impedance.
PB5/TP13/
Bit C/A in SMR of SCI2, bits CKE0 and CKE1 in SCR, bit NDER13 in NDERB, and bit PB5DDR select the pin
SCK2/LCAS function as follows.
CKE1
0
C/A
1
0
CKE0
0
1
—
1
—
—
—
PB5DDR
0
1
1
—
—
NDER13
—
0
1
—
—
—
PB5 input
PB5 output
TP13 output
SCK2 output
SCK2 output
SCK2 input
Pin function
LCAS output*
Note: * LCAS output depending on bits DRAS2 to DRAS0 in DRCRA and bit CSEL in DRCRB, and
regardless of bits C/A, CKE0 and CKE1, NDER13, and PB5DDR. For details, see section 6, Bus
Controller.
PB4/TP12/
UCAS
Bit NDER12 in NDERB and bit PB4DDR select the pin function as follows.
PB4DDR
0
1
1
NDER12
—
0
1
PB4 output
TP12 output
Pin function
PB4 input
UCAS output*
Note: * UCAS output depending on bits DRAS2 to DRAS0 in DRCRA and bit CSEL in DRCRB, and
regardless of bits NDER12 and PB4DDR. For details, see section 6, Bus Controller.
Rev. 2.0, 06/04, page 307 of 980
Pin
Pin Functions and Selection Method
The DRAM interface settings by bits DRAS2 to DRAS0 in DRCRA, bits OIS3/2 and OS1/0 in 8TCSR3, bits
PB3/TP11/
CCLR1 and CCLR0 in 8TCR3, bit CS4E in CSCR, bit NDER11 in NDERB, and bit PB3DDR select the pin
TMIO3/
DREQ1/CS4 function as follows.
DRAM interface
settings
(1) in table below
OIS3/2 and OS1/0
(2) in table
below
All 0
CS4E
0
Not all 0
—
1
—
—
—
PB3DDR
0
1
1
—
—
NDER11
—
0
1
—
—
—
PB3
input
PB3
output
TP11
output
CS4
output
TMIO3 output
CS4
output*3
Pin function
TMIO3 input*1
DREQ1 input*2
Notes:
*1 TMIO3 input when CCLR1 = CCLR0 = 1.
*2 When an external request is specified as a DMAC activation source, DREQ1 input regardless of
bits OIS3 and OIS2, OS1 and OS0, CCLR1 and CCLR0, CS4E, NDER11, and PB3DDR.
*3 CS4 is output as RAS4.
DRAM interface
settings
(1)
DRAS2
0
DRAS1
DRAS0
PB2/TP10/
TMO2/CS5
(2)
1
0
0
1
1
(1)
0
0
1
0
1
1
0
1
The DRAM interface settings by bits DRAS2 to DRAS0 in DRCRA, bits OIS3/2 and OS1/0 in 8TCSR2, bit
CS5E in CSCR, bit NDER10 in NDERB, and bit PB2DDR select the pin function as follows.
DRAM interface
settings
(1) in table below
OIS3/2 and OS1/0
All 0
CS5E
0
PB2DDR
0
NDER10
Pin function
(2) in table
below
1
1
Not all 0
—
1
—
—
—
—
—
—
0
1
—
—
—
PB2
input
PB2
output
TP10
output
CS5
output
TMIO2 output
CS5
output*
Note: * CS5 is output as RAS5.
DRAM interface
settings
(1)
DRAS2
0
DRAS1
DRAS0
Rev. 2.0, 06/04, page 308 of 980
(2)
1
0
0
1
1
(1)
0
0
1
0
1
1
0
1
Pin
Pin Functions and Selection Method
Bits OIS3/2 and OS1/0 in 8TCSR1, bits CCLR1 and CCLR0 in TCR1, bit CS6E in CSCR, bit NDER9 in
PB1/TP9/
NDERB, and bit PB1DDR select the pin function as follows.
TMIO1/
DREQ0/CS6
OIS3/2 and OS1/0
All 0
CS6E
Not all 0
1
—
PB1DDR
0
1
0
1
—
—
NDER9
—
0
1
—
—
Pin function
PB1
input
PB1
output
TP9
output
CS6
output
TMIO1 output
TMIO1 input*1
DREQ0 input*2
Notes:
*1 TMIO1 input when CCLR1 = CCLR0 = 1.
*2 When an external request is specified as a DMAC activation source, DREQ0 input regardless of
bits OIS3/2 and OS1/0, bits CCLR1/0, bit CS6E, bit NDER9, and bit PB1DDR.
PB0/TP8/
TMO0/CS7
Bits OIS3/2 and OS1/0 in 8TCSR0, bit CS7E in CSCR, bit NDER8 in NDERB, and bit PB0DDR select the pin
function as follows.
OIS3/2 and OS1/0
All 0
CS7E
PB0DDR
NDER8
Pin function
Not all 0
0
0
1
1
1
—
—
—
—
0
1
—
—
PB0 input
PB0 output
TP8 output
CS7 output
TMO0 output
Rev. 2.0, 06/04, page 309 of 980
Table 8.24 Port B Pin Functions (Mode 7)
Pin
Pin Functions and Selection Method
PB7/TP15/
RxD2
Bit RE in SCR of SCI2, bit SMIF in SCMR, bit NDER15 in NDERB, and bit PB7DDR select the pin function as
follows.
SMIF
0
RE
0
PB7DDR
0
NDER15
Pin function
PB6/TP14/
TxD2
1
1
1
1
—
—
—
—
0
1
—
—
PB7 input
PB7 output
TP15 output
RxD2 input
RxD2 input
Bit TE in SCR of SCI2, bit SMIF in SCMR, bit NDER14 in NDERB, and bit PB6DDR select the pin function as
follows.
SMIF
0
TE
1
0
1
—
—
PB6DDR
0
1
1
—
NDER14
—
0
1
—
—
PB6 input
PB6 output
TP14 output
TxD2 output
TxD2 output*
Pin function
Note: * Functions as the TxD2 output pin, but there are two states: one in which the pin is driven, and another
in which the pin is at high-impedance.
PB5/TP13/
SCK2
Bit C/A in SMR of SCI2, bits CKE0 and CKE1 in SCR, bit NDER13 in NDERB, and bit PB5DDR select the pin
function as follows.
CKE1
0
C/A
CKE0
1
0
—
1
—
—
PB5DDR
0
1
1
—
—
—
NDER13
—
0
1
—
—
—
PB5 input
PB5 output
TP13 output
SCK2 output
SCK2 output
SCK2 input
Pin function
PB4/TP12
1
0
Bit NDER12 in NDERB and bit PB4DDR select the pin function as follows.
PB4DDR
0
1
1
NDER12
—
0
1
PB4 input
PB4 output
TP12 output
Pin function
Rev. 2.0, 06/04, page 310 of 980
Pin
Pin Functions and Selection Method
PB3/TP11/
TMIO3/
DREQ1
Bits OIS3/2 and OS1/0 in 8TCSR3, bits CCLR1 and CCLR0 in 8TCR3, bit NDER11 in NDERB, and bit
PB3DDR select the pin function as follows.
OIS3/2 and OS1/0
PB3DDR
All 0
0
NDER11
Pin function
Not all 0
1
1
—
—
0
1
—
PB3 input
PB3 output
TP11 output
TMIO3 output
TMIO3 input*1
DREQ1 input*2
Notes:
*1 TMIO3 input when CCLR1 = CCLR0 = 1.
*2 When an external request is specified as a DMAC activation source, DREQ1 input regardless of
bits OIS3/2 and OS1/0, bit NDER11, and bit PB3DDR.
PB2/TP10/
TMO2
Bits OIS3/2 and OS1/0 in 8TCSR2, bit NDER10 in NDERB, and bit PB2DDR select the pin function as follows.
OIS3/2 and OS1/0
PB2DDR
NDER10
Pin function
PB1/TP9/
TMIO1/
DREQ0
All 0
0
Not all 0
1
1
—
—
0
1
—
PB2 input
PB2 output
TP10 output
TMO2 output
Bits OIS3/2 and OS1/0 in 8TCSR1, bits CCLR1 and CCLR0 in 8TCR0, bit NDER9 in NDERB, and bit PB1DDR
select the pin function as follows.
OIS3/2 and OS1/0
All 0
Not all 0
PB1DDR
0
1
1
—
NDER9
—
0
1
—
PB1
input
PB1
output
TP9
output
TMIO1
output
Pin function
TMIO1 input*1
DREQ0 input*2
Notes:
*1 TMIO1 input when CCLR1 = CCLR0 = 1.
*2 When an external request is specified as a DMAC activation source, DREQ0 input regardless of
bits OIS3/2 and OS1/0, bit NDER9, and bit PB1DDR.
PB0/TP8/
TMO0
Bits OIS3/2 and OS1/0 in 8TCSR0, bit NDER8 in NDERB, and bit PB0DDR select the pin function as follows.
OIS3/2 and OS1/0
All 0
Not all 0
PB0DDR
0
1
1
—
NDER8
—
0
1
—
PB0
input
PB0
output
TP8
output
TMO0
output
Pin function
Rev. 2.0, 06/04, page 311 of 980
Rev. 2.0, 06/04, page 312 of 980
Section 9 16-Bit Timer
9.1
Overview
The H8/3029 has built-in 16-bit timer module with three 16-bit counter channels.
9.1.1
Features
16-bit timer features are listed below.
• Capability to process up to 6 pulse outputs or 6 pulse inputs
• Six general registers (GRs, two per channel) with independently-assignable output compare or
input capture functions
• Selection of eight counter clock sources for each channel:
Internal clocks: φ, φ/2, φ/4, φ/8
External clocks: TCLKA, TCLKB, TCLKC, TCLKD
• Five operating modes selectable in all channels:
 Waveform output by compare match
Selection of 0 output, 1 output, or toggle output (only 0 or 1 output in channel 2)
 Input capture function
Rising edge, falling edge, or both edges (selectable)
 Counter clearing function
Counters can be cleared by compare match or input capture.
 Synchronization
Two or more timer counters (16TCNTs) can be preset simultaneously, or cleared
simultaneously by compare match or input capture. Counter synchronization enables
synchronous register input and output.
 PWM mode
PWM output can be provided with an arbitrary duty cycle. With synchronization, up to
three-phase PWM output is possible.
• Phase counting mode selectable in channel 2
Two-phase encoder output can be counted automatically.
• High-speed access via internal 16-bit bus
The 16TCNTs and GRs can be accessed at high speed via a 16-bit bus.
• Any initial timer output value can be set
• Nine interrupt sources
Each channel has two compare match/input capture interrupts and an overflow interrupt. All
interrupts can be requested independently.
Rev. 2.0, 06/04, page 313 of 980
• Output triggering of programmable timing pattern controller (TPC)
Compare match/input capture signals from channels 0 to 2 can be used as TPC output triggers.
Table 9.1 summarizes the 16-bit timer functions.
Table 9.1
16-bit timer Functions
Item
Channel 0
Channel 1
Clock sources
Internal clocks: φ, φ/2, φ/4, φ/8
Channel 2
External clocks: TCLKA, TCLKB, TCLKC, TCLKD, selectable
independently
General registers (output
compare/input
capture registers)
GRA0, GRB0
GRA1, GRB1
GRA2, GRB2
Input/output pins
TIOCA0, TIOCB0
TIOCA1, TIOCB1
TIOCA2, TIOCB2
Counter clearing function
GRA0/GRB0 compare
match or input capture
GRA1/GRB1 compare
match or input capture
GRA2/GRB2 compare
match or input capture
Initial output value setting function Available
Compare
match output
Available
Available
0
Available
Available
Available
1
Available
Available
Available
Toggle
Available
Available
Not available
Input capture function
Available
Available
Available
Synchronization
Available
Available
Available
PWM mode
Available
Available
Available
Phase counting mode
Not available
Not available
Available
Three sources
Three sources
Three sources
Interrupt sources
•
•
•
Rev. 2.0, 06/04, page 314 of 980
•
Compare
match/input capture
A0
•
Compare
match/input capture
B0
•
Overflow
•
Compare
match/input capture
A1
•
Compare
match/input capture
B1
•
Overflow
Compare
match/input
capture A2
Compare
match/input
capture B2
Overflow
9.1.2
Block Diagrams
16-bit timer Block Diagram (Overall): Figure 9.1 is a block diagram of the 16-bit timer.
TCLKA to TCLKD
IMIA0 to IMIA2
IMIB0 to IMIB2
OVI0 to OVI2
Clock selector
φ, φ/2, φ/4, φ/8
Control logic
TIOCA0 to TIOCA2
TIOCB0 to TIOCB2
TMDR
TOLR
TISRA
TISRB
Internal data bus
TSNR
Bus interface
16-bit timer channel 0
16-bit timer channel 1
16-bit timer channel 2
TSTR
TISRC
Module data bus
Legend:
TSTR: Timer start register (8 bits)
TSNR: Timer synchro register (8 bits)
TMDR: Timer mode register (8 bits)
TOLR: Timer output level setting register (8 bits)
TISRA: Timer interrupt status register A (8 bits)
TISRB: Timer interrupt status register B (8 bits)
TISRC: Timer interrupt status register C (8 bits)
Figure 9.1 16-bit timer Block Diagram (Overall)
Rev. 2.0, 06/04, page 315 of 980
Block Diagram of Channels 0 and 1: 16-bit timer channels 0 and 1 are functionally identical.
Both have the structure shown in figure 9.2.
TCLKA to TCLKD
TIOCA0
TIOCB0
Clock selector
φ, φ/2, φ/4, φ/8
Control logic
IMIA0
IMIB0
OVI0
TIOR
16TCR
GRB
GRA
16TCNT
Comparator
Module data bus
Legend:
16TCNT:
GRA, GRB:
TCR:
TIOR:
Timer counter (16 bits)
General registers A and B (input capture/output compare registers) (16 bits × 2)
Timer control register (8 bits)
Timer I/O control register (8 bits)
Figure 9.2 Block Diagram of Channels 0 and 1
Rev. 2.0, 06/04, page 316 of 980
Block Diagram of Channel 2: Figure 9.3 is a block diagram of channel 2
TCLKA to TCLKD
φ, φ/2, φ/4, φ/8
TIOCA2
TIOCB2
Clock selector
Control logic
IMIA2
IMIB2
OVI2
TIOR2
16TCR2
GRB2
GRA2
16TCNT2
Comparator
Module data bus
Legend:
Timer counter 2 (16 bits)
16TCNT2:
GRA2, GRB2: General registers A2 and B2 (input capture/output compare registers)
(16 bits × 2)
Timer control register 2 (8 bits)
TCR2:
Timer I/O control register 2 (8 bits)
TIOR2:
Figure 9.3 Block Diagram of Channel 2
Rev. 2.0, 06/04, page 317 of 980
9.1.3
Pin Configuration
Table 9.2 summarizes the 16-bit timer pins.
Table 9.2
16-bit timer Pins
Channel Name
Abbreviation
Input/
Output
Common Clock input A
TCLKA
Input
External clock A input pin
(phase-A input pin in phase counting
mode)
Clock input B
TCLKB
Input
External clock B input pin
(phase-B input pin in phase counting
mode)
Clock input C
TCLKC
Input
External clock C input pin
Clock input D
TCLKD
Input
External clock D input pin
Input capture/output TIOCA0
compare A0
Input/
output
GRA0 output compare or input capture pin
PWM output pin in PWM mode
Input capture/output TIOCB0
compare B0
Input/
output
GRB0 output compare or input capture pin
Input capture/output TIOCA1
compare A1
Input/
output
GRA1 output compare or input capture pin
PWM output pin in PWM mode
Input capture/output TIOCB1
compare B1
Input/
output
GRB1 output compare or input capture pin
Input capture/output TIOCA2
compare A2
Input/
output
GRA2 output compare or input capture pin
PWM output pin in PWM mode
Input capture/output TIOCB2
compare B2
Input/
output
GRB2 output compare or input capture pin
0
1
2
Rev. 2.0, 06/04, page 318 of 980
Function
9.1.4
Register Configuration
Table 9.3 summarizes the 16-bit timer registers.
Table 9.3
16-bit timer Registers
Channel
Address*
Common
Name
Abbreviation
R/W
Initial
Value
H'FFF60
Timer start register
TSTR
R/W
H'F8
H'FFF61
Timer synchro register
TSNC
R/W
H'F8
H'FFF62
Timer mode register
TMDR
R/W
H'98
H'FFF63
Timer output level setting register
TOLR
W
H'FFF64
H'FFF65
H'FFF66
0
1
1
Timer interrupt status register A
Timer interrupt status register B
Timer interrupt status register C
TISRA
TISRB
TISRC
H'C0
R/(W)*
2
H'88
R/(W)*
2
H'88
R/(W)*
2
H'88
H'FFF68
Timer control register 0
16TCR0
R/W
H'80
H'FFF69
Timer I/O control register 0
TIOR0
R/W
H'88
H'FFF6A
Timer counter 0H
16TCNT0H R/W
H'00
H'FFF6B
Timer counter 0L
16TCNT0L R/W
H'00
H'FFF6C
General register A0H
GRA0H
H'FF
H'FFF6D
General register A0L
GRA0L
R/W
H'FF
H'FFF6E
General register B0H
GRB0H
R/W
H'FF
H'FFF6F
General register B0L
GRB0L
R/W
H'FF
H'FFF70
Timer control register 1
16TCR1
R/W
H'80
H'FFF71
Timer I/O control register 1
TIOR1
R/W
H'88
H'FFF72
Timer counter 1H
16TCNT1H R/W
H'00
H'FFF73
Timer counter 1L
16TCNT1L R/W
H'00
H'FFF74
General register A1H
GRA1H
R/W
H'FF
H'FFF75
General register A1L
GRA1L
R/W
H'FF
H'FFF76
General register B1H
GRB1H
R/W
H'FF
H'FFF77
General register B1L
GRB1L
R/W
H'FF
R/W
Rev. 2.0, 06/04, page 319 of 980
1
Abbreviation
Name
R/W
Initial
Value
Channel
Address*
2
H'FFF78
Timer control register 2
16TCR2
R/W
H'80
H'FFF79
Timer I/O control register 2
TIOR2
R/W
H'88
H'FFF7A
Timer counter 2H
16TCNT2H R/W
H'00
H'FFF7B
Timer counter 2L
16TCNT2L R/W
H'00
H'FFF7C
General register A2H
GRA2H
R/W
H'FF
H'FFF7D
General register A2L
GRA2L
R/W
H'FF
H'FFF7E
General register B2H
GRB2H
R/W
H'FF
H'FFF7F
General register B2L
GRB2L
R/W
H'FF
Notes: *1 The lower 20 bits of the address in advanced mode are indicated.
*2 Only 0 can be written in bits 3 to 0, to clear the flags.
9.2
Register Descriptions
9.2.1
Timer Start Register (TSTR)
TSTR is an 8-bit readable/writable register that starts and stops the timer counter (16TCNT) in
channels 0 to 2.
Bit
7
6
5
4
3
2
1
0
—
—
—
—
—
STR2
STR1
STR0
Initial value
1
1
1
1
1
0
0
0
Read/Write
—
—
—
—
—
R/W
R/W
R/W
Reserved bits
Counter start 2 to 0
These bits start and
stop 16TCNT2 to 16TCNT0
TSTR is initialized to H'F8 by a reset and in standby mode.
Bits 7 to 3—Reserved: These bits cannot be modified and are always read as 1.
Bit 2—Counter Start 2 (STR2): Starts and stops timer counter 2 (16TCNT2).
Bit 2
STR2
Description
0
16TCNT2 is halted
1
16TCNT2 is counting
Rev. 2.0, 06/04, page 320 of 980
(Initial value)
Bit 1—Counter Start 1 (STR1): Starts and stops timer counter 1 (16TCNT1).
Bit 1
STR1
Description
0
16TCNT1 is halted
1
16TCNT1 is counting
(Initial value)
Bit 0—Counter Start 0 (STR0): Starts and stops timer counter 0 (16TCNT0).
Bit 0
STR0
Description
0
16TCNT0 is halted
1
16TCNT0 is counting
9.2.2
(Initial value)
Timer Synchro Register (TSNC)
TSNC is an 8-bit readable/writable register that selects whether channels 0 to 2 operate
independently or synchronously. Channels are synchronized by setting the corresponding bits to 1.
Bit
7
6
5
4
3
2
1
0
—
—
—
—
—
SYNC2
SYNC1
SYNC0
Initial value
1
1
1
1
1
0
0
0
Read/Write
—
—
—
—
—
R/W
R/W
R/W
Reserved bits
Timer sync 2 to 0
These bits synchronize
channels 2 to 0
TSNC is initialized to H'F8 by a reset and in standby mode.
Bits 7 to 3—Reserved: These bits cannot be modified and are always read as 1.
Bit 2—Timer Sync 2 (SYNC2): Selects whether channel 2 operates independently or
synchronously.
Bit 2
SYNC2
Description
0
Channel 2’s timer counter (16TCNT2) operates independently
16TCNT2 is preset and cleared independently of other channels
1
Channel 2 operates synchronously
16TCNT2 can be synchronously preset and cleared
(Initial value)
Rev. 2.0, 06/04, page 321 of 980
Bit 1—Timer Sync 1 (SYNC1): Selects whether channel 1 operates independently or
synchronously.
Bit 1
SYNC1
Description
0
Channel 1’s timer counter (16TCNT1) operates independently
16TCNT1 is preset and cleared independently of other channels
1
Channel 1 operates synchronously
16TCNT1 can be synchronously preset and cleared
(Initial value)
Bit 0—Timer Sync 0 (SYNC0): Selects whether channel 0 operates independently or
synchronously.
Bit 0
SYNC0
Description
0
Channel 0’s timer counter (16TCNT0) operates independently
16TCNT0 is preset and cleared independently of other channels
1
Channel 0 operates synchronously
16TCNT0 can be synchronously preset and cleared
9.2.3
(Initial value)
Timer Mode Register (TMDR)
TMDR is an 8-bit readable/writable register that selects PWM mode for channels 0 to 2. It also
selects phase counting mode and the overflow flag (OVF) setting conditions for channel 2.
Bit
7
6
5
4
3
2
1
0
—
MDF
FDIR
—
—
PWM2
PWM1
PWM0
Initial value
1
0
0
1
1
0
0
0
Read/Write
—
R/W
R/W
—
—
R/W
R/W
R/W
Reserved bit
PWM mode 2 to 0
These bits select PWM
mode for channels 2 to 0
Flag direction
Selects the setting condition for the overflow
flag (OVF) in TISRC
Phase counting mode flag
Selects phase counting mode for channel 2
Reserved bit
TMDR is initialized to H'98 by a reset and in standby mode.
Rev. 2.0, 06/04, page 322 of 980
Bit 7—Reserved: This bit cannot be modified and is always read as 1.
Bit 6—Phase Counting Mode Flag (MDF): Selects whether channel 2 operates normally or in
phase counting mode.
Bit 6
MDF
Description
0
Channel 2 operates normally
1
Channel 2 operates in phase counting mode
(Initial value)
When MDF is set to 1 to select phase counting mode, 16TCNT2 operates as an up/down-counter
and pins TCLKA and TCLKB become counter clock input pins. 16TCNT2 counts both rising and
falling edges of TCLKA and TCLKB, and counts up or down as follows.
Counting
Direction
Down-Counting
High
TCLKA pin
TCLKB pin
Up-Counting
Low
Low
Low
High
High
High
Low
In phase counting mode, external clock edge selection by bits CKEG1 and CKEG0 in 16TCR2
and counter clock selection by bits TPSC2 to TPSC0 are invalid, and the above phase counting
mode operations take precedence.
The counter clearing condition selected by the CCLR1 and CCLR0 bits in 16TCR2 and the
compare match/input capture settings and interrupt functions of TIOR2, TISRA, TISRB, TISRC
remain effective in phase counting mode.
Bit 5—Flag Direction (FDIR): Designates the setting condition for the OVF flag in TISRC. The
FDIR designation is valid in all modes in channel 2.
Bit 5
FDIR
Description
0
OVF is set to 1 in TISRC when 16TCNT2 overflows or underflows
1
OVF is set to 1 in TISRC when 16TCNT2 overflows
(Initial value)
Bits 4 and 3—Reserved: These bits cannot be modified and are always read as 1.
Rev. 2.0, 06/04, page 323 of 980
Bit 2—PWM Mode 2 (PWM2): Selects whether channel 2 operates normally or in PWM mode.
Bit 2
PWM2
Description
0
Channel 2 operates normally
1
Channel 2 operates in PWM mode
(Initial value)
When bit PWM2 is set to 1 to select PWM mode, pin TIOCA2 becomes a PWM output pin. The
output goes to 1 at compare match with GRA2, and to 0 at compare match with GRB2.
Bit 1—PWM Mode 1 (PWM1): Selects whether channel 1 operates normally or in PWM mode.
Bit 1
PWM1
Description
0
Channel 1 operates normally
1
Channel 1 operates in PWM mode
(Initial value)
When bit PWM1 is set to 1 to select PWM mode, pin TIOCA1 becomes a PWM output pin. The
output goes to 1 at compare match with GRA1, and to 0 at compare match with GRB1.
Bit 0—PWM Mode 0 (PWM0): Selects whether channel 0 operates normally or in PWM mode.
Bit 0
PWM0
Description
0
Channel 0 operates normally
1
Channel 0 operates in PWM mode
(Initial value)
When bit PWM0 is set to 1 to select PWM mode, pin TIOCA0 becomes a PWM output pin. The
output goes to 1 at compare match with GRA0, and to 0 at compare match with GRB0.
Rev. 2.0, 06/04, page 324 of 980
9.2.4
Timer Interrupt Status Register A (TISRA)
TISRA is an 8-bit readable/writable register that indicates GRA compare match or input capture
and enables or disables GRA compare match and input capture interrupt requests.
Bit
7
—
6
5
4
IMIEA2 IMIEA1 IMIEA0
3
2
1
0
—
IMFA2
IMFA1
IMFA0
Initial value
1
0
0
0
1
0
0
0
Read/Write
—
R/W
R/W
R/W
—
R/(W)*
R/(W)*
R/(W)*
Input capture/compare match
flags A2 to A0
Status flags indicating GRA
compare match or input capture
Reserved bit
Input capture/compare match interrupt enable A2 to A0
These bits enable or disable interrupts by the IMFA flags
Reserved bit
Note: * Only 0 can be written, to clear the flag.
TISRA is initialized to H'88 by a reset and in standby mode.
Bit 7—Reserved: This bit cannot be modified and is always read as 1.
Bit 6—Input Capture/Compare Match Interrupt Enable A2 (IMIEA2): Enables or disables
the interrupt requested by the IMFA2 when IMFA2 flag is set to 1.
Bit 6
IMIEA2
Description
0
IMIA2 interrupt requested by IMFA2 flag is disabled
1
IMIA2 interrupt requested by IMFA2 flag is enabled
(Initial value)
Rev. 2.0, 06/04, page 325 of 980
Bit 5—Input Capture/Compare Match Interrupt Enable A1 (IMIEA1): Enables or disables
the interrupt requested by the IMFA1 flag when IMFA1 is set to 1.
Bit 5
IMIEA1
Description
0
IMIA1 interrupt requested by IMFA1 flag is disabled
1
IMIA1 interrupt requested by IMFA1 flag is enabled
(Initial value)
Bit 4—Input Capture/Compare Match Interrupt Enable A0 (IMIEA0): Enables or disables
the interrupt requested by the IMFA0 flag when IMFA0 is set to 1.
Bit 4
IMIEA0
Description
0
IMIA0 interrupt requested by IMFA0 flag is disabled
1
IMIA0 interrupt requested by IMFA0 flag is enabled
(Initial value)
Bit 3—Reserved: This bit cannot be modified and is always read as 1.
Bit 2—Input Capture/Compare Match Flag A2 (IMFA2): This status flag indicates GRA2
compare match or input capture events.
Bit 2
IMFA2
Description
0
[Clearing condition]
(Initial value)
Read IMFA2 flag when IMFA2 =1, then write 0 in IMFA2 flag
1
[Setting conditions]
•
16TCNT2 = GRA2 when GRA2 functions as an output compare register
•
16TCNT2 value is transferred to GRA2 by an input capture signal when GRA2
functions as an input capture register
Rev. 2.0, 06/04, page 326 of 980
Bit 1—Input Capture/Compare Match Flag A1 (IMFA1): This status flag indicates GRA1
compare match or input capture events.
Bit 1
IMFA1
Description
0
[Clearing condition]
(Initial value)
Read IMFA1 flag when IMFA1 =1, then write 0 in IMFA1 flag
1
[Setting conditions]
•
16TCNT1 = GRA1 when GRA1 functions as an output compare register
•
16TCNT1 value is transferred to GRA1 by an input capture signal when GRA1
functions as an input capture register
Bit 0—Input Capture/Compare Match Flag A0 (IMFA0): This status flag indicates GRA0
compare match or input capture events.
Bit 0
IMFA0
Description
0
[Clearing condition]
(Initial value)
Read IMFA0 flag when IMFA0 =1, then write 0 in IMFA0 flag
1
[Setting conditions]
•
16TCNT0 = GRA0 when GRA0 functions as an output compare register
•
16TCNT0 value is transferred to GRA0 by an input capture signal when GRA0
functions as an input capture register
Rev. 2.0, 06/04, page 327 of 980
9.2.5
Timer Interrupt Status Register B (TISRB)
TISRB is an 8-bit readable/writable register that indicates GRB compare match or input capture
and enables or disables GRB compare match and input capture interrupt requests.
Bit
7
—
6
5
4
IMIEB2 IMIEB1 IMIEB0
3
2
1
0
—
IMFB2
IMFB1
IMFB0
Initial value
1
0
0
0
1
0
0
0
Read/Write
—
R/W
R/W
R/W
—
R/(W)*
R/(W)*
R/(W)*
Input capture/compare match
flags B2 to B0
Status flags indicating GRB
compare match or input capture
Reserved bit
Input capture/compare match interrupt enable B2 to B0
These bits enable or disable interrupts by the IMFB flags
Reserved bit
Note: * Only 0 can be written, to clear the flag.
TISRB is initialized to H'88 by a reset and in standby mode.
Bit 7—Reserved: This bit cannot be modified and is always read as 1.
Bit 6—Input Capture/Compare Match Interrupt Enable B2 (IMIEB2): Enables or disables
the interrupt requested by the IMFB2 when IMFB2 flag is set to 1.
Bit 6
IMIEB2
Description
0
IMIB2 interrupt requested by IMFB2 flag is disabled
1
IMIB2 interrupt requested by IMFB2 flag is enabled
Rev. 2.0, 06/04, page 328 of 980
(Initial value)
Bit 5—Input Capture/Compare Match Interrupt Enable B1 (IMIEB1): Enables or disables
the interrupt requested by the IMFB1 when IMFB1 flag is set to 1.
Bit 5
IMIEB1
Description
0
IMIB1 interrupt requested by IMFB1 flag is disabled
1
IMIB1 interrupt requested by IMFB1 flag is enabled
(Initial value)
Bit 4—Input Capture/Compare Match Interrupt Enable B0 (IMIEB0): Enables or disables
the interrupt requested by the IMFB0 when IMFB0 flag is set to 1.
Bit 4
IMIEB0
Description
0
IMIB0 interrupt requested by IMFB0 flag is disabled
1
IMIB0 interrupt requested by IMFB0 flag is enabled
(Initial value)
Bit 3—Reserved: This bit cannot be modified and is always read as 1.
Bit 2—Input Capture/Compare Match Flag B2 (IMFB2): This status flag indicates GRB2
compare match or input capture events.
Bit 2
IMFB2
Description
0
[Clearing condition]
(Initial value)
Read IMFB2 flag when IMFB2 =1, then write 0 in IMFB2 flag
1
[Setting conditions]
•
16TCNT2 = GRB2 when GRB2 functions as an output compare register
•
16TCNT2 value is transferred to GRB2 by an input capture signal when GRB2
functions as an input capture register
Rev. 2.0, 06/04, page 329 of 980
Bit 1—Input Capture/Compare Match Flag B1 (IMFB1): This status flag indicates GRB1
compare match or input capture events.
Bit 1
IMFB1
Description
0
[Clearing condition]
(Initial value)
Read IMFB1 flag when IMFB1 =1, then write 0 in IMFB1 flag
1
[Setting conditions]
•
16TCNT1 = GRB1 when GRB1 functions as an output compare register
•
16TCNT1 value is transferred to GRB1 by an input capture signal when GRB1
functions as an input capture register
Bit 0—Input Capture/Compare Match Flag B0 (IMFB0): This status flag indicates GRB0
compare match or input capture events.
Bit 0
IMFB0
Description
0
[Clearing condition]
(Initial value)
Read IMFB0 flag when IMFB0 =1, then write 0 in IMFB0 flag
1
[Setting conditions]
•
16TCNT0 = GRB0 when GRB0 functions as an output compare register
•
16TCNT0 value is transferred to GRB0 by an input capture signal when GRB0
functions as an input capture register
Rev. 2.0, 06/04, page 330 of 980
9.2.6
Timer Interrupt Status Register C (TISRC)
TISRC is an 8-bit readable/writable register that indicates 16TCNT overflow or underflow and
enables or disables overflow interrupt requests.
7
6
5
4
3
2
1
0
—
OVIE2
OVIE1
OVIE0
—
OVF2
OVF1
OVF0
Initial value
1
0
0
0
1
0
0
0
Read/Write
—
R/W
R/W
R/W
—
R/(W)*
R/(W)*
R/(W)*
Bit
Overflow flags 2 to 0
Status flags indicating
interrupts by OVF flags
Reserved bit
Overflow interrupt enable 2 to 0
These bits enable or disable interrupts by the OVF flags
Reserved bit
Note: * Only 0 can be written, to clear the flag.
TISRC is initialized to H'88 by a reset and in standby mode.
Bit 7—Reserved: This bit cannot be modified and is always read as 1.
Bit 6—Overflow Interrupt Enable 2 (OVIE2): Enables or disables the interrupt requested by
the OVF2 when OVF2 flag is set to 1.
Bit 6
OVIE2
Description
0
OVI2 interrupt requested by OVF2 flag is disabled
1
OVI2 interrupt requested by OVF2 flag is enabled
(Initial value)
Bit 5—Overflow Interrupt Enable 1 (OVIE1): Enables or disables the interrupt requested by
the OVF1 when OVF1 flag is set to 1.
Bit 5
OVIE1
Description
0
OVI1 interrupt requested by OVF1 flag is disabled
1
OVI1 interrupt requested by OVF1 flag is enabled
(Initial value)
Rev. 2.0, 06/04, page 331 of 980
Bit 4—Overflow Interrupt Enable 0 (OVIE0): Enables or disables the interrupt requested by
the OVF0 when OVF0 flag is set to 1.
Bit 4
OVIE0
Description
0
OVI0 interrupt requested by OVF0 flag is disabled
1
OVI0 interrupt requested by OVF0 flag is enabled
(Initial value)
Bit 3—Reserved: This bit cannot be modified and is always read as 1.
Bit 2—Overflow Flag 2 (OVF2): This status flag indicates 16TCNT2 overflow.
Bit 2
OVF2
Description
0
[Clearing condition]
(Initial value)
Read OVF2 flag when OVF2 =1, then write 0 in OVF2 flag
1
[Setting condition]
16TCNT2 overflowed from H'FFFF to H'0000, or underflowed from H'0000 to H'FFFF
Note: 16TCNT underflow occurs when 16TCNT operates as an up/down-counter. Underflow
occurs only when channel 2 operates in phase counting mode (MDF = 1 in TMDR).
Bit 1—Overflow Flag 1 (OVF1): This status flag indicates 16TCNT1 overflow.
Bit 1
OVF1
Description
0
[Clearing condition]
(Initial value)
Read OVF1 flag when OVF1 =1, then write 0 in OVF1 flag
1
[Setting condition]
16TCNT1 overflowed from H'FFFF to H'0000
Bit 0—Overflow Flag 0 (OVF0): This status flag indicates 16TCNT0 overflow.
Bit 0
OVF0
Description
0
[Clearing condition]
Read OVF0 flag when OVF0 =1, then write 0 in OVF0 flag
1
[Setting condition]
16TCNT0 overflowed from H'FFFF to H'0000
Rev. 2.0, 06/04, page 332 of 980
(Initial value)
9.2.7
Timer Counters (16TCNT)
16TCNT is a 16-bit counter. The 16-bit timer has three 16TCNTs, one for each channel.
Channel
Abbreviation
Function
0
16TCNT0
Up-counter
1
16TCNT1
2
16TCNT2
Phase counting mode: up/down-counter
Other modes: up-counter
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Each 16TCNT is a 16-bit readable/writable register that counts pulse inputs from a clock source.
The clock source is selected by bits TPSC2 to TPSC0 in 16TCR.
16TCNT0 and 16TCNT1 are up-counters. 16TCNT2 is an up/down-counter in phase counting
mode and an up-counter in other modes.
16TCNT can be cleared to H'0000 by compare match with GRA or GRB or by input capture to
GRA or GRB (counter clearing function).
When 16TCNT overflows (changes from H'FFFF to H'0000), the OVF flag is set to 1 in TISRC of
the corresponding channel.
When 16TCNT underflows (changes from H'0000 to H'FFFF), the OVF flag is set to 1 in TISRC
of the corresponding channel.
The 16TCNTs are linked to the CPU by an internal 16-bit bus and can be written or read by either
word access or byte access.
Each 16TCNT is initialized to H'0000 by a reset and in standby mode.
Rev. 2.0, 06/04, page 333 of 980
9.2.8
General Registers (GRA, GRB)
The general registers are 16-bit registers. The 16-bit timer has 6 general registers, two in each
channel.
Channel
Abbreviation
Function
0
GRA0, GRB0
Output compare/input capture register
1
GRA1, GRB1
2
GRA2, GRB2
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
A general register is a 16-bit readable/writable register that can function as either an output
compare register or an input capture register. The function is selected by settings in TIOR.
When a general register is used as an output compare register, its value is constantly compared
with the 16TCNT value. When the two values match (compare match), the IMFA or IMFB flag is
set to 1 in TISRA/TISRB. Compare match output can be selected in TIOR.
When a general register is used as an input capture register, an external input capture signal are
detected and the current 16TCNT value is stored in the general register. The corresponding IMFA
or IMFB flag in TISRA/TISRB is set to 1 at the same time. The edges of the input capture signal
are selected in TIOR.
TIOR settings are ignored in PWM mode.
General registers are linked to the CPU by an internal 16-bit bus and can be written or read by
either word access or byte access.
General registers are set as output compare registers (with no pin output) and initialized to H'FFFF
by a reset and in standby mode.
Rev. 2.0, 06/04, page 334 of 980
9.2.9
Timer Control Registers (16TCR)
16TCR is an 8-bit register. The 16-bit timer has three 16TCRs, one in each channel.
Channel
Abbreviation
Function
0
16TCR0
1
16TCR1
2
16TCR2
16TCR controls the timer counter. The 16TCRs in all
channels are functionally identical. When phase counting
mode is selected in channel 2, the settings of bits CKEG1
and CKEG0 and TPSC2 to TPSC0 in 16TCR2 are ignored.
Bit
7
6
5
4
3
2
1
0
—
CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
Initial value
1
0
0
0
0
0
0
0
Read/Write
—
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Timer prescaler 2 to 0
These bits select the timer
counter clock
Clock edge 1/0
These bits select external clock edges
Counter clear 1/0
These bits select the counter clear source
Reserved bit
Each 16TCR is an 8-bit readable/writable register that selects the timer counter clock source,
selects the edge or edges of external clock sources, and selects how the counter is cleared.
16TCR is initialized to H'80 by a reset and in standby mode.
Bit 7—Reserved: This bit cannot be modified and is always read as 1.
Rev. 2.0, 06/04, page 335 of 980
Bits 6 and 5—Counter Clear 1 and 0 (CCLR1, CCLR0): These bits select how 16TCNT is
cleared.
Bit 6
CCLR1
Bit 5
CCLR0
Description
0
0
16TCNT is not cleared
1
16TCNT is cleared by GRA compare match or input capture*
1
0
16TCNT is cleared by GRB compare match or input capture*
1
1
Synchronous clear: 16TCNT is cleared in synchronization with other
2
synchronized timers*
1
(Initial value)
Notes: *1 16TCNT is cleared by compare match when the general register functions as an output
compare register, and by input capture when the general register functions as an input
capture register.
*2 Selected in TSNC.
Bits 4 and 3—Clock Edge 1 and 0 (CKEG1, CKEG0): These bits select external clock input
edges when an external clock source is used.
Bit 4
CKEG1
Bit 3
CKEG0
Description
0
0
Count rising edges
1
Count falling edges
—
Count both edges
1
(Initial value)
When channel 2 is set to phase counting mode, bits CKEG1 and CKEG0 in 16TCR2 are ignored.
Phase counting takes precedence.
Bits 2 to 0—Timer Prescaler 2 to 0 (TPSC2 to TPSC0): These bits select the counter clock of
16TCNT.
Bit 2
TPSC2
Bit 1
TPSC1
Bit 0
TPSC0
Function
0
0
0
Internal clock: φ
1
Internal clock: φ/2
1
0
Internal clock: φ/4
1
Internal clock: φ/8
0
0
External clock A: TCLKA input
1
External clock B: TCLKB input
0
External clock C: TCLKC input
1
External clock D: TCLKD input
1
1
Rev. 2.0, 06/04, page 336 of 980
(Initial value)
When bit TPSC2 is cleared to 0 an internal clock source is selected, and the timer counts only
falling edges. When bit TPSC2 is set to 1 an external clock source is selected, and the timer counts
the edges selected by bits CKEG1 and CKEG0.
When channel 2 is set to phase counting mode (MDF = 1 in TMDR), the settings of bits TPSC2 to
TPSC0 in 16TCR2 are ignored. Phase counting takes precedence.
9.2.10
Timer I/O Control Register (TIOR)
TIOR is an 8-bit register. The 16-bit timer has three TIORs, one in each channel.
Channel Abbreviation Function
0
TIOR0
1
TIOR1
2
TIOR2
Bit
TIOR controls the general registers. Some functions differ in PWM
mode.
7
6
5
4
3
2
1
0
—
IOB2
IOB1
IOB0
—
IOA2
IOA1
IOA0
Initial value
1
0
0
0
1
0
0
0
Read/Write
—
R/W
R/W
R/W
—
R/W
R/W
R/W
I/O control A2 to A0
These bits select GRA
functions
Reserved bit
I/O control B2 to B0
These bits select GRB functions
Reserved bit
Each TIOR is an 8-bit readable/writable register that selects the output compare or input capture
function for GRA and GRB, and specifies the functions of the TIORA and TIORB pins. If the
output compare function is selected, TIOR also selects the type of output. If input capture is
selected, TIOR also selects the edges of the input capture signal.
TIOR is initialized to H'88 by a reset and in standby mode.
Bit 7—Reserved: This bit cannot be modified and is always read as 1.
Rev. 2.0, 06/04, page 337 of 980
Bits 6 to 4—I/O Control B2 to B0 (IOB2 to IOB0): These bits select the GRB function.
Bit 6
IOB2
Bit 5
IOB1
Bit 4
IOB0
0
0
0
1
0
No output at compare match
(Initial value)
1
0
1 output at GRB compare match*
1
1
Output toggles at GRB compare match
1 2
(1 output in channel 2)* *
0
1
1
GRB is an output
compare register
0 output at GRB compare match*
1
1
Function
GRB is an input
compare register
0
GRB captures rising edge of input
GRB captures falling edge of input
GRB captures both edges of input
1
Notes: *1 After a reset, the output conforms to the TOLR setting until the first compare match.
*2 Channel 2 output cannot be toggled by compare match. When this setting is made, 1
output is selected automatically.
Bit 3—Reserved: This bit cannot be modified and is always read as 1.
Bits 2 to 0—I/O Control A2 to A0 (IOA2 to IOA0): These bits select the GRA function.
Bit 2
IOA2
Bit 1
IOA1
Bit 0
IOA0
0
0
0
1
0
No output at compare match
(Initial value)
1
0
1 output at GRA compare match*
1
1
Output toggles at GRA compare match
1 2
(1 output in channel 2)* *
0
1
1
GRA is an output
compare register
0 output at GRA compare match*
1
1
Function
0
GRA is an input
compare register
GRA captures rising edge of input
GRA captures falling edge of input
GRA captures both edges of input
1
Notes: *1 After a reset, the output conforms to the TOLR setting until the first compare match.
*2 Channel 2 output cannot be toggled by compare match. When this setting is made, 1
output is selected automatically.
Rev. 2.0, 06/04, page 338 of 980
9.2.11
Timer Output Level Setting Register C (TOLR)
TOLR is an 8-bit write-only register that selects the timer output level for channels 0 to 2.
7
6
5
4
3
2
1
0
—
—
TOB2
TOA2
TOB1
TOA1
TOB0
TOA0
Initial value
1
1
0
0
0
0
0
0
Read/Write
—
—
W
W
W
W
W
W
Bit
Output level setting A2 to A0, B2 to B0
These bits set the levels of the timer outputs
(TIOCA2 to TIOCA0, and TIOCB2 to TIOCB0)
Reserved bits
A TOLR setting can only be made when the corresponding bit in TSTR is 0.
TOLR is a write-only register, and cannot be read. If it is read, all bits will return a value of 1.
TOLR is initialized to H'C0 by a reset and in standby mode.
Bits 7 and 6—Reserved: These bits cannot be modified.
Bit 5—Output Level Setting B2 (TOB2): Sets the value of timer output TIOCB2.
Bit 5
TOB2
Description
0
TIOCB2 is 0
1
TIOCB2 is 1
(Initial value)
Bit 4—Output Level Setting A2 (TOA2): Sets the value of timer output TIOCA2.
Bit 4
TOA2
Description
0
TIOCA2 is 0
1
TIOCA2 is 1
(Initial value)
Rev. 2.0, 06/04, page 339 of 980
Bit 3—Output Level Setting B1 (TOB1): Sets the value of timer output TIOCB1.
Bit 3
TOB1
Description
0
TIOCB1 is 0
1
TIOCB1 is 1
(Initial value)
Bit 2—Output Level Setting A1 (TOA1): Sets the value of timer output TIOCA1.
Bit 2
TOA1
Description
0
TIOCA1 is 0
1
TIOCA1 is 1
(Initial value)
Bit 1—Output Level Setting B0 (TOB0): Sets the value of timer output TIOCB0.
Bit 0
TOB0
Description
0
TIOCB0 is 0
1
TIOCB0 is 1
(Initial value)
Bit 0—Output Level Setting A0 (TOA0): Sets the value of timer output TIOCA0.
Bit 0
TOA0
Description
0
TIOCA0 is 0
1
TIOCA0 is 1
Rev. 2.0, 06/04, page 340 of 980
(Initial value)
9.3
CPU Interface
9.3.1
16-Bit Accessible Registers
The timer counters (16TCNTs), general registers A and B (GRAs and GRBs) are 16-bit registers,
and are linked to the CPU by an internal 16-bit data bus. These registers can be written or read a
word at a time, or a byte at a time.
Figures 9.4 and 9.5 show examples of word read/write access to a timer counter (16TCNT).
Figures 9.6 to 9.9 show examples of byte read/write access to 16TCNTH and 16TCNTL.
On-chip data bus
H
CPU
H
L
Bus interface
L
16TCNTH
Module
data bus
16TCNTL
Figure 9.4 16TCNT Access Operation [CPU Writes to 16TCNT, Word]
On-chip data bus
H
CPU
L
H
Bus interface
L
16TCNTH
Module
data bus
16TCNTL
Figure 9.5 Access to Timer Counter (CPU Reads 16TCNT, Word)
Rev. 2.0, 06/04, page 341 of 980
On-chip data bus
H
CPU
L
H
Bus interface
L
16TCNTH
Module
data bus
16TCNTL
Figure 9.6 Access to Timer Counter H (CPU Writes to 16TCNTH, Upper Byte)
On-chip data bus
H
CPU
L
H
Bus interface
L
16TCNTH
Module
data bus
16TCNTL
Figure 9.7 Access to Timer Counter L (CPU Writes to 16TCNTL, Lower Byte)
On-chip data bus
H
CPU
L
H
Bus interface
L
16TCNTH
Module
data bus
16TCNTL
Figure 9.8 Access to Timer Counter H (CPU Reads 16TCNTH, Upper Byte)
Rev. 2.0, 06/04, page 342 of 980
On-chip data bus
H
CPU
H
L
Bus interface
L
16TCNTH
Module
data bus
16TCNTL
Figure 9.9 Access to Timer Counter L (CPU Reads 16TCNTL, Lower Byte)
9.3.2
8-Bit Accessible Registers
The registers other than the timer counters and general registers are 8-bit registers. These registers
are linked to the CPU by an internal 8-bit data bus.
Figures 9.10 and 9.11 show examples of byte read and write access to a 16TCR.
If a word-size data transfer instruction is executed, two byte transfers are performed.
On-chip data bus
H
CPU
H
L
Bus interface
L
Module
data bus
16TCR
Figure 9.10 16TCR Access (CPU Writes to 16TCR)
On-chip data bus
H
CPU
L
H
Bus interface
L
Module
data bus
16TCR
Figure 9.11 16TCR Access (CPU Reads 16TCR)
Rev. 2.0, 06/04, page 343 of 980
9.4
Operation
9.4.1
Overview
A summary of operations in the various modes is given below.
Normal Operation: Each channel has a timer counter and general registers. The timer counter
counts up, and can operate as a free-running counter, periodic counter, or external event counter.
GRA and GRB can be used for input capture or output compare.
Synchronous Operation: The timer counters in designated channels are preset synchronously.
Data written to the timer counter in any one of these channels is simultaneously written to the
timer counters in the other channels as well. The timer counters can also be cleared synchronously
if so designated by the CCLR1 and CCLR0 bits in the TCRs.
PWM Mode: A PWM waveform is output from the TIOCA pin. The output goes to 1 at compare
match A and to 0 at compare match B. The duty cycle can be varied from 0% to 100% depending
on the settings of GRA and GRB. When a channel is set to PWM mode, its GRA and GRB
automatically become output compare registers.
Phase Counting Mode: The phase relationship between two clock signals input at TCLKA and
TCLKB is detected and 16TCNT2 counts up or down accordingly. When phase counting mode is
selected TCLKA and TCLKB become clock input pins and 16TCNT2 operates as an up/downcounter.
9.4.2
Basic Functions
Counter Operation: When one of bits STR0 to STR2 is set to 1 in the timer start register
(TSTR), the timer counter (16TCNT) in the corresponding channel starts counting. The counting
can be free-running or periodic.
• Sample setup procedure for counter
Figure 9.12 shows a sample procedure for setting up a counter.
Rev. 2.0, 06/04, page 344 of 980
Counter setup
Select counter clock
Count operation
1
No
Yes
Free-running counting
Periodic counting
Select counter clear source
2
Select output compare
register function
3
Set period
4
Start counter
5
Periodic counter
Start counter
5
Free-running counter
Figure 9.12 Counter Setup Procedure (Example)
1. Set bits TPSC2 to TPSC0 in 16TCR to select the counter clock source. If an external clock
source is selected, set bits CKEG1 and CKEG0 in 16TCR to select the desired edge(s) of the
external clock signal.
2. For periodic counting, set CCLR1 and CCLR0 in 16TCR to have 16TCNT cleared at GRA
compare match or GRB compare match.
3. Set TIOR to select the output compare function of GRA or GRB, whichever was selected in
step 2.
4. Write the count period in GRA or GRB, whichever was selected in step 2.
5. Set the STR bit to 1 in TSTR to start the timer counter.
Rev. 2.0, 06/04, page 345 of 980
• Free-running and periodic counter operation
A reset leaves the counters (16TCNTs) in 16-bit timer channels 0 to 2 all set as free-running
counters. A free-running counter starts counting up when the corresponding bit in TSTR is set
to 1. When the count overflows from H'FFFF to H'0000, the OVF flag is set to 1 in TISRC.
After the overflow, the counter continues counting up from H'0000. Figure 9.13 illustrates
free-running counting.
16TCNT value
H'FFFF
H'0000
Time
STR0 to
STR2 bit
OVF
Figure 9.13 Free-Running Counter Operation
When a channel is set to have its counter cleared by compare match, in that channel 16TCNT
operates as a periodic counter. Select the output compare function of GRA or GRB, set bit
CCLR1 or CCLR0 in 16TCR to have the counter cleared by compare match, and set the count
period in GRA or GRB. After these settings, the counter starts counting up as a periodic
counter when the corresponding bit is set to 1 in TSTR. When the count matches GRA or
GRB, the IMFA or IMFB flag is set to 1 in TISRA/TISRB and the counter is cleared to
H'0000. If the corresponding IMIEA or IMIEB bit is set to 1 in TISRA/TISRB, a CPU
interrupt is requested at this time. After the compare match, 16TCNT continues counting up
from H'0000. Figure 9.14 illustrates periodic counting.
16TCNT value
Counter cleared by general
register compare match
GR
Time
H'0000
STR bit
IMF
Figure 9.14 Periodic Counter Operation
Rev. 2.0, 06/04, page 346 of 980
• 16TCNT count timing
 Internal clock source
Bits TPSC2 to TPSC0 in 16TCR select the system clock (φ) or one of three internal clock
sources obtained by prescaling the system clock (φ/2, φ/4, φ/8).
Figure 9.15 shows the timing.
φ
Internal
clock
16TCNT input
clock
16TCNT
N–1
N
N+1
Figure 9.15 Count Timing for Internal Clock Sources
 External clock source
The external clock pin (TCLKA to TCLKD) can be selected by bits TPSC2 to TPSC0 in
16TCR, and the detected edge by bits CKEG1 and CKEG0. The rising edge, falling edge,
or both edges can be selected.
The pulse width of the external clock signal must be at least 1.5 system clocks when a
single edge is selected, and at least 2.5 system clocks when both edges are selected. Shorter
pulses will not be counted correctly.
Figure 9.16 shows the timing when both edges are detected.
φ
External
clock input
16TCNT input
clock
16TCNT
N–1
N
N+1
Figure 9.16 Count Timing for External Clock Sources (when Both Edges are Detected)
Rev. 2.0, 06/04, page 347 of 980
Waveform Output by Compare Match: In 16-bit timer channels 0, 1 compare match A or B can
cause the output at the TIOCA or TIOCB pin to go to 0, go to 1, or toggle. In channel 2 the output
can only go to 0 or go to 1.
• Sample setup procedure for waveform output by compare match
Figure 9.17 shows an example of the setup procedure for waveform output by compare match.
Output setup
1. Select the compare match output mode (0, 1, or
toggle) in TIOR. When a waveform output mode
is selected, the pin switches from its generic input/
output function to the output compare function
(TIOCA or TIOCB). An output compare pin outputs
the value set in TOLR until the first compare match
occurs.
Select waveform
output mode
1
Set output timing
2
2. Set a value in GRA or GRB to designate the
compare match timing.
Start counter
3
3. Set the STR bit in TSTR to 1 to make 16TCNT
start counting.
Waveform output
Figure 9.17 Setup Procedure for Waveform Output by Compare Match (Example)
Rev. 2.0, 06/04, page 348 of 980
• Examples of waveform output
Figure 9.18 shows examples of 0 and 1 output. 16TCNT operates as a free-running counter, 0
output is selected for compare match A, and 1 output is selected for compare match B. When
the pin is already at the selected output level, the pin level does not change.
16TCNT value
H'FFFF
GRB
GRA
H'0000
TIOCB
TIOCA
Time
No change
No change
No change
No change
1 output
0 output
Figure 9.18 0 and 1 Output (TOA = 1, TOB = 0)
Figure 9.19 shows examples of toggle output. 16TCNT operates as a periodic counter, cleared
by compare match B. Toggle output is selected for both compare match A and B.
16TCNT value
Counter cleared by compare match with GRB
GRB
GRA
H'0000
Time
TIOCB
Toggle
output
TIOCA
Toggle
output
Figure 9.19 Toggle Output (TOA = 1, TOB = 0)
Rev. 2.0, 06/04, page 349 of 980
• Output compare output timing
The compare match signal is generated in the last state in which 16TCNT and the general
register match (when 16TCNT changes from the matching value to the next value). When the
compare match signal is generated, the output value selected in TIOR is output at the output
compare pin (TIOCA or TIOCB). When 16TCNT matches a general register, the compare
match signal is not generated until the next counter clock pulse.
Figure 9.20 shows the output compare timing.
φ
16TCNT input
clock
16TCNT
N
GR
N
N+1
Compare
match signal
TIOCA,
TIOCB
Figure 9.20 Output Compare Output Timing
Input Capture Function: The 16TCNT value can be transferred to a general register when an
input edge is detected at an input capture input/output compare pin (TIOCA or TIOCB). Risingedge, falling-edge, or both-edge detection can be selected. The input capture function can be used
to measure pulse width or period.
Rev. 2.0, 06/04, page 350 of 980
• Sample setup procedure for input capture
Figure 9.21 shows a sample procedure for setting up input capture.
1. Set TIOR to select the input capture function of a
general register and the rising edge, falling edge,
or both edges of the input capture signal. Clear the
DDR bit to 0 before making these TIOR settings.
Input selection
Select input-capture input
1
Start counter
2
2. Set the STR bit in TSTR to 1 to make 16TCNT
start counting.
Input capture
Figure 9.21 Setup Procedure for Input Capture (Example)
• Examples of input capture
Figure 9.22 illustrates input capture when the falling edge of TIOCB and both edges of
TIOCA are selected as capture edges. 16TCNT is cleared by input capture into GRB.
16TCNT value
H'0180
H'0160
H'0005
H'0000
TIOCB
TIOCA
GRA
H'0005
H'0160
GRB
H'0180
Figure 9.22 Input Capture (Example)
Rev. 2.0, 06/04, page 351 of 980
• Input capture signal timing
Input capture on the rising edge, falling edge, or both edges can be selected by settings in
TIOR. Figure 9.23 shows the timing when the rising edge is selected. The pulse width of the
input capture signal must be at least 1.5 system clocks for single-edge capture, and 2.5 system
clocks for capture of both edges.
φ
Input-capture input
Input capture signal
N
16TCNT
N
GRA, GRB
Figure 9.23 Input Capture Signal Timing
9.4.3
Synchronization
The synchronization function enables two or more timer counters to be synchronized by writing
the same data to them simultaneously (synchronous preset). With appropriate 16TCR settings, two
or more timer counters can also be cleared simultaneously (synchronous clear). Synchronization
enables additional general registers to be associated with a single time base. Synchronization can
be selected for all channels (0 to 2).
Sample Setup Procedure for Synchronization: Figure 9.24 shows a sample procedure for
setting up synchronization.
Rev. 2.0, 06/04, page 352 of 980
Setup for synchronization
Select synchronization
1
Synchronous preset
Write to 16TCNT
Synchronous clear
2
Clearing
synchronized to this
channel?
No
Yes
Synchronous preset
Select counter clear source
3
Select counter clear source
4
Start counter
5
Start counter
5
Counter clear
Synchronous clear
1. Set the SYNC bits to 1 in TSNC for the channels to be synchronized.
2. When a value is written in 16TCNT in one of the synchronized channels, the same value is
simultaneously written in 16TCNT in the other channels.
3. Set the CCLR1 or CCLR0 bit in 16TCR to have the counter cleared by compare match or input capture.
4. Set the CCLR1 and CCLR0 bits in 16TCR to have the counter cleared synchronously.
5. Set the STR bits in TSTR to 1 to start the synchronized counters.
Figure 9.24 Setup Procedure for Synchronization (Example)
Example of Synchronization: Figure 9.25 shows an example of synchronization. Channels 0, 1,
and 2 are synchronized, and are set to operate in PWM mode. Channel 0 is set for counter clearing
by compare match with GRB0. Channels 1 and 2 are set for synchronous counter clearing. The
timer counters in channels 0, 1, and 2 are synchronously preset, and are synchronously cleared by
compare match with GRB0. A three-phase PWM waveform is output from pins TIOCA0, TIOCA1,
and TIOCA2. For further information on PWM mode, see section 9.4.4, PWM Mode.
Rev. 2.0, 06/04, page 353 of 980
Value of 16TCNT0
to 16TCNT2
Cleared by compare match with GRB0
GRB0
GRB1
GRA0
GRB2
GRA1
GRA2
H'0000
TIOCA0
TIOCA1
TIOCA2
Figure 9.25 Synchronization (Example)
9.4.4
PWM Mode
In PWM mode GRA and GRB are paired and a PWM waveform is output from the TIOCA pin.
GRA specifies the time at which the PWM output changes to 1. GRB specifies the time at which
the PWM output changes to 0. If either GRA or GRB compare match is selected as the counter
clear source, a PWM waveform with a duty cycle from 0% to 100% is output at the TIOCA pin.
PWM mode can be selected in all channels (0 to 2).
Table 9.4 summarizes the PWM output pins and corresponding registers. If the same value is set
in GRA and GRB, the output does not change when compare match occurs.
Table 9.4
PWM Output Pins and Registers
Channel
Output Pin
1 Output
0 Output
0
TIOCA0
GRA0
GRB0
1
TIOCA1
GRA1
GRB1
2
TIOCA2
GRA2
GRB2
Rev. 2.0, 06/04, page 354 of 980
Sample Setup Procedure for PWM Mode: Figure 9.26 shows a sample procedure for setting up
PWM mode.
PWM mode
Select counter clock
Select counter clear source
1
2
1. Set bits TPSC2 to TPSC0 in 16TCR to
select the counter clock source. If an
external clock source is selected, set
bits CKEG1 and CKEG0 in 16TCR to
select the desired edge(s) of the
external clock signal.
2. Set bits CCLR1 and CCLR0 in 16TCR
to select the counter clear source.
3. Set the time at which the PWM
waveform should go to 1 in GRA.
Set GRA
3
Set GRB
4
Select PWM mode
5
Start counter
6
PWM mode
4. Set the time at which the PWM
waveform should go to 0 in GRB.
5. Set the PWM bit in TMDR to select
PWM mode. When PWM mode is
selected, regardless of the TIOR
contents, GRA and GRB become
output compare registers specifying
the times at which the PWM output
goes to 1 and 0. The TIOCA pin
automatically becomes the PWM
output pin. The TIOCB pin conforms
to the settings of bits IOB1 and IOB0
in TIOR. If TIOCB output is not
desired, clear both IOB1 and IOB0 to 0.
6. Set the STR bit to 1 in TSTR to start
the timer counter.
Figure 9.26 Setup Procedure for PWM Mode (Example)
Rev. 2.0, 06/04, page 355 of 980
Examples of PWM Mode: Figure 9.27 shows examples of operation in PWM mode. In PWM
mode TIOCA becomes an output pin. The output goes to 1 at compare match with GRA, and to 0
at compare match with GRB.
In the examples shown, 16TCNT is cleared by compare match with GRA or GRB. Synchronized
operation and free-running counting are also possible.
16TCNT value
Counter cleared by compare match A
GRA
GRB
Time
H'0000
TIOCA
a. Counter cleared by GRA (TOA = 1)
16TCNT value
Counter cleared by compare match B
GRB
GRA
Time
H'0000
TIOCA
b. Counter cleared by GRB (TOA = 0)
Figure 9.27 PWM Mode (Example 1)
Rev. 2.0, 06/04, page 356 of 980
Figure 9.28 shows examples of the output of PWM waveforms with duty cycles of 0% and 100%.
If the counter is cleared by compare match with GRB, and GRA is set to a higher value than GRB,
the duty cycle is 0%. If the counter is cleared by compare match with GRA, and GRB is set to a
higher value than GRA, the duty cycle is 100%.
16TCNT value
Counter cleared by compare match B
GRB
GRA
H'0000
Time
TIOCA
Write to GRA
Write to GRA
a. 0% duty cycle (TOA=0)
16TCNT value
Counter cleared by compare match A
GRA
GRB
H'0000
Time
TIOCA
Write to GRB
Write to GRB
b. 100% duty cycle (TOA=1)
Figure 9.28 PWM Mode (Example 2)
Rev. 2.0, 06/04, page 357 of 980
9.4.5
Phase Counting Mode
In phase counting mode the phase difference between two external clock inputs (at the TCLKA
and TCLKB pins) is detected, and 16TCNT2 counts up or down accordingly.
In phase counting mode, the TCLKA and TCLKB pins automatically function as external clock
input pins and 16TCNT2 becomes an up/down-counter, regardless of the settings of bits TPSC2 to
TPSC0, CKEG1, and CKEG0 in 16TCR2. Settings of bits CCLR1, CCLR0 in 16TCR2, and
settings in TIOR2, TISRA, TISRB, TISRC, setting of STR2 bit in TSTR, GRA2, and GRB2 are
valid. The input capture and output compare functions can be used, and interrupts can be
generated.
Phase counting is available only in channel 2.
Sample Setup Procedure for Phase Counting Mode: Figure 9.29 shows a sample procedure for
setting up phase counting mode.
Phase counting mode
Select phase counting mode
1
1. Set the MDF bit in TMDR to 1 to select
phase counting mode.
2. Select the flag setting condition with
the FDIR bit in TMDR.
Select flag setting condition
2
Start counter
3
3. Set the STR2 bit to 1 in TSTR to start
the timer counter.
Phase counting mode
Figure 9.29 Setup Procedure for Phase Counting Mode (Example)
Rev. 2.0, 06/04, page 358 of 980
Example of Phase Counting Mode: Figure 9.30 shows an example of operations in phase
counting mode. Table 9.5 lists the up-counting and down-counting conditions for 16TCNT2.
In phase counting mode both the rising and falling edges of TCLKA and TCLKB are counted.
The phase difference between TCLKA and TCLKB must be at least 1.5 states, the phase overlap
must also be at least 1.5 states, and the pulse width must be at least 2.5 states.
16TCNT2 value
Counting up
Counting down
TCLKB
TCLKA
Figure 9.30 Operation in Phase Counting Mode (Example)
Table 9.5
Counting
Direction
Up/Down Counting Conditions
Up-Counting
High
TCLKB pin
TCLKA pin
Down-Counting
Low
HIgh
High
Low
Phase
difference
Phase
difference
Low
Low
Pulse width
HIgh
Pulse width
TCLKA
TCLKB
Overlap
Overlap
Phase difference and overlap: at least 1.5 states
Pulse width:
at least 2.5 states
Figure 9.31 Phase Difference, Overlap, and Pulse Width in Phase Counting Mode
Rev. 2.0, 06/04, page 359 of 980
9.4.6
16-Bit Timer Output Timing
The initial value of 16-bit timer output when a timer count operation begins can be specified
arbitrarily by making a setting in TOLR.
Figure 9.32 shows the timing for setting the initial value with TOLR.
Only write to TOLR when the corresponding bit in TSTR is cleared to 0.
T1
T3
T2
φ
Address bus
TOLR
ITU output pin
TOLR address
N
N
Figure 9.32 Timing for Setting 16-Bit Timer Output Level by Writing to TOLR
Rev. 2.0, 06/04, page 360 of 980
9.5
Interrupts
The 16-bit timer has two types of interrupts: input capture/compare match interrupts, and
overflow interrupts.
9.5.1
Setting of Status Flags
Timing of Setting of IMFA and IMFB at Compare Match: IMFA and IMFB are set to 1 by a
compare match signal generated when 16TCNT matches a general register (GR). The compare
match signal is generated in the last state in which the values match (when 16TCNT is updated
from the matching count to the next count). Therefore, when 16TCNT matches a general register,
the compare match signal is not generated until the next 16TCNT clock input. Figure 9.33 shows
the timing of the setting of IMFA and IMFB.
φ
16TCNT input
clock
16TCNT
GR
N
N+1
N
Compare
match signal
IMF
IMI
Figure 9.33 Timing of Setting of IMFA and IMFB by Compare Match
Rev. 2.0, 06/04, page 361 of 980
Timing of Setting of IMFA and IMFB by Input Capture: IMFA and IMFB are set to 1 by an
input capture signal. The 16TCNT contents are simultaneously transferred to the corresponding
general register. Figure 9.34 shows the timing.
φ
Input capture
signal
IMF
N
16TCNT
GR
N
IMI
Figure 9.34 Timing of Setting of IMFA and IMFB by Input Capture
Rev. 2.0, 06/04, page 362 of 980
Timing of Setting of Overflow Flag (OVF): OVF is set to 1 when 16TCNT overflows from
H'FFFF to H'0000 or underflows from H'0000 to H'FFFF. Figure 9.35 shows the timing.
φ
16TCNT
Overflow
signal
OVF
OVI
Figure 9.35 Timing of Setting of OVF
9.5.2
Timing of Clearing of Status Flags
If the CPU reads a status flag while it is set to 1, then writes 0 in the status flag, the status flag is
cleared. Figure 9.36 shows the timing.
TISR write cycle
T1
T2
T3
φ
Address
TISR address
IMF, OVF
Figure 9.36 Timing of Clearing of Status Flags
Rev. 2.0, 06/04, page 363 of 980
9.5.3
Interrupt Sources
Each 16-bit timer channel can generate a compare match/input capture A interrupt, a compare
match/input capture B interrupt, and an overflow interrupt. In total there are nine interrupt sources
of three kinds, all independently vectored. An interrupt is requested when the interrupt request
flag are set to 1.
The priority order of the channels can be modified in interrupt priority registers A (IPRA). For
details see section 5, Interrupt Controller.
Table 9.6 lists the interrupt sources.
Table 9.6
16-bit timer Interrupt Sources
Interrupt
Source
Description
Priority*
0
IMIA0
IMIB0
OVI0
Compare match/input capture A0
Compare match/input capture B0
Overflow 0
High
1
IMIA1
IMIB1
OVI1
Compare match/input capture A1
Compare match/input capture B1
Overflow 1
2
IMIA2
IMIB2
OVI2
Compare match/input capture A2
Compare match/input capture B2
Overflow 2
Channel
Low
Note: * The priority immediately after a reset is indicated. Inter-channel priorities can be changed
by settings in IPRA.
Rev. 2.0, 06/04, page 364 of 980
9.6
Usage Notes
This section describes contention and other matters requiring special attention during 16-bit timer
operations.
Contention between 16TCNT Write and Clear: If a counter clear signal occurs in the T3 state of
a 16TCNT write cycle, clearing of the counter takes priority and the write is not performed. See
figure 9.37.
16TCNT write cycle
T2
T1
T3
φ
Address bus
16TCNT address
Internal write signal
Counter clear signal
16TCNT
N
H'0000
Figure 9.37 Contention between 16TCNT Write and Clear
Rev. 2.0, 06/04, page 365 of 980
Contention between 16TCNT Word Write and Increment: If an increment pulse occurs in the
T3 state of a 16TCNT word write cycle, writing takes priority and 16TCNT is not incremented.
Figure 9.38 shows the timing in this case.
16TCNT word write cycle
T2
T1
T3
φ
Address bus
16TCNT address
Internal write signal
16TCNT input clock
16TCNT
N
M
16TCNT write data
Figure 9.38 Contention between 16TCNT Word Write and Increment
Rev. 2.0, 06/04, page 366 of 980
Contention between 16TCNT Byte Write and Increment: If an increment pulse occurs in the T2
or T3 state of a 16TCNT byte write cycle, writing takes priority and 16TCNT is not incremented.
The byte data for which a write was not performed is not incremented, and retains its pre-write
value. See figure 9.39, which shows an increment pulse occurring in the T2 state of a byte write to
16TCNTH.
16TCNTH byte write cycle
T1
T2
T3
φ
16TCNTH address
Address bus
Internal write signal
16TCNT input clock
16TCNTH
N
M
16TCNT write data
16TCNTL
X
X+1
X
Figure 9.39 Contention between 16TCNT Byte Write and Increment
Rev. 2.0, 06/04, page 367 of 980
Contention between General Register Write and Compare Match: If a compare match occurs
in the T3 state of a general register write cycle, writing takes priority and the compare match signal
is inhibited. See figure 9.40.
General register write cycle
T2
T1
T3
φ
GR address
Address bus
Internal write signal
16TCNT
N
GR
N
N+1
M
General register write data
Compare match signal
Inhibited
Figure 9.40 Contention between General Register Write and Compare Match
Rev. 2.0, 06/04, page 368 of 980
Contention between 16TCNT Write and Overflow or Underflow: If an overflow occurs in the
T3 state of a 16TCNT write cycle, writing takes priority and the counter is not incremented. OVF
is set to 1. The same holds for underflow. See figure 9.41.
16TCNT write cycle
T1
T2
T3
φ
Address bus
16TCNT address
Internal write signal
16TCNT input clock
Overflow signal
16TCNT
H'FFFF
M
16TCNT write data
OVF
Figure 9.41 Contention between 16TCNT Write and Overflow
Rev. 2.0, 06/04, page 369 of 980
Contention between General Register Read and Input Capture: If an input capture signal
occurs during the T3 state of a general register read cycle, the value before input capture is read.
See figure 9.42.
General register read cycle
T1
T2
T3
φ
GR address
Address bus
Internal read signal
Input capture signal
GR
Internal data bus
X
M
X
Figure 9.42 Contention between General Register Read and Input Capture
Rev. 2.0, 06/04, page 370 of 980
Contention between Counter Clearing by Input Capture and Counter Increment: If an input
capture signal and counter increment signal occur simultaneously, the counter is cleared according
to the input capture signal. The counter is not incremented by the increment signal. The value
before the counter is cleared is transferred to the general register. See figure 9.43.
φ
Input capture signal
Counter clear signal
16TCNT input clock
16TCNT
GR
N
H'0000
N
Figure 9.43 Contention between Counter Clearing by Input Capture and Counter
Increment
Rev. 2.0, 06/04, page 371 of 980
Contention between General Register Write and Input Capture: If an input capture signal
occurs in the T3 state of a general register write cycle, input capture takes priority and the write to
the general register is not performed. See figure 9.44.
General register write cycle
T1
T2
T3
φ
Address bus
GR address
Internal write signal
Input capture signal
16TCNT
GR
M
M
Figure 9.44 Contention between General Register Write and Input Capture
Rev. 2.0, 06/04, page 372 of 980
Note on Waveform Period Setting: When a counter is cleared by compare match, the counter is
cleared in the last state at which the 16TCNT value matches the general register value, at the time
when this value would normally be updated to the next count. The actual counter frequency is
therefore given by the following formula:
f=
φ
(N+1)
(f: counter frequency. φ: system clock frequency. N: value set in general register.)
Note on Writes in Synchronized Operation: When channels are synchronized, if a 16TCNT
value is modified by byte write access, all 16 bits of all synchronized counters assume the same
value as the counter that was addressed.
(Example) When channels 1 and 2 are synchronized
• Byte write to channel 1 or byte write to channel 2
16TCNT1
W
X
16TCNT2
Y
Z
Upper byte Lower byte
Write A to upper byte
of channel 1
16TCNT1
A
X
16TCNT2
A
X
Upper byte Lower byte
Write A to lower byte
of channel 2
16TCNT1
Y
A
16TCNT2
Y
A
Upper byte Lower byte
• Word write to channel 1 or word write to channel 2
16TCNT1
W
X
16TCNT2
Y
Z
Upper byte Lower byte
Write AB word to
channel 1 or 2
16TCNT1
A
B
16TCNT2
A
B
Upper byte Lower byte
Rev. 2.0, 06/04, page 373 of 980
16-bit timer Operating Modes
Table 9.7 (a)16-bit timer Operating Modes (Channel 0)
Register Settings
TSNC
TMDR
Operating Mode
Synchronization
Synchronous preset
SYNC0 = 1 —
MDF
FDIR PWM
TIOR0
IOA
IOB
PWM0 = 1
—
*
PWM0 = 0
IOA2 = 0
Other bits
unrestricted
16TCR0
Clear
Select
Output compare A
—
—
—
—
—
Output compare B
—
—
Input capture A
—
—
PWM0 = 0
Input capture B
—
—
PWM0 = 0
Counter By compare
clearing match/input
capture A
—
—
CCLR1 = 0
CCLR0 = 1
By compare
match/input
capture B
—
—
CCLR1 = 1
CCLR0 = 0
SYNC0 = 1 —
—
CCLR1 = 1
CCLR0 = 1
PWM mode
Synchronous
clear
Legend:
Clock
Select
IOB2 = 0
Other bits
unrestricted
IOA2 = 1
Other bits
unrestricted
IOB2 = 1
Other bits
unrestricted
Setting available (valid). — Setting does not affect this mode.
Note: * The input capture function cannot be used in PWM mode. If compare match A and compare match B occur
simultaneously, the compare match signal is inhibited.
Rev. 2.0, 06/04, page 374 of 980
Table 9.7 (b)
16-bit timer Operating Modes (Channel 1)
Register Settings
TSNC
Operating Mode
Synchronization
Synchronous preset
TMDR
MDF
FDIR PWM
TIOR1
IOA
IOB
16TCR1
Clear
Select
SYNC1 = 1 —
—
PWM mode
—
—
PWM1 = 1
—
Output compare A
—
—
PWM1 = 0
IOA2 = 0
Other bits
unrestricted
Output compare B
—
—
Input capture A
—
—
PWM1 = 0
Input capture B
—
—
PWM1 = 0
Counter By compare
clearing match/input
capture A
—
—
CCLR1 = 0
CCLR0 = 1
By compare
match/input
capture B
—
—
CCLR1 = 1
CCLR0 = 0
SYNC1 = 1 —
—
CCLR1 = 1
CCLR0 = 1
Synchronous
clear
Clock
Select
*
IOB2 = 0
Other bits
unrestricted
IOA2 = 1
Other bits
unrestricted
IOB2 = 1
Other bits
unrestricted
Legend:
Setting available (valid). — Setting does not affect this mode.
Note: * The input capture function cannot be used in PWM mode. If compare match A and compare match B
occur simultaneously, the compare match signal is inhibited.
Rev. 2.0, 06/04, page 375 of 980
Table 9.7 (c) 16-bit timer Operating Modes (Channel 2)
Register Settings
TSNC
Operating Mode
Synchronization
Synchronous preset
SYNC2 = 1
TMDR
MDF
FDIR PWM
TIOR2
IOA
IOB
16TCR2
Clear
Select
—
PWM mode
—
PWM2 = 1
—
Output compare A
—
PWM2 = 0
IOA2 = 0
Other bits
unrestricted
Output compare B
—
Input capture A
—
PWM2 = 0
Input capture B
—
PWM2 = 0
Counter By compare
clearing match/input
capture A
—
CCLR1 = 0
CCLR0 = 1
By compare
match/input
capture B
—
CCLR1 = 1
CCLR0 = 0
—
CCLR1 = 1
CCLR0 = 1
Synchronous
clear
Phase counting
mode
Clock
Select
SYNC2 = 1
MDF = 1
*
IOB2 = 0
Other bits
unrestricted
IOA2 = 1
Other bits
unrestricted
IOB2 = 1
Other bits
unrestricted
—
Legend:
Setting available (valid). — Setting does not affect this mode.
Note: * The input capture function cannot be used in PWM mode. If compare match A and compare match B occur
simultaneously, the compare match signal is inhibited.
Rev. 2.0, 06/04, page 376 of 980
Section 10 8-Bit Timers
10.1
Overview
The H8/3029 has a built-in 8-bit timer module with four channels (TMR0, TMR1, TMR2, and
TMR3), based on 8-bit counters. Each channel has an 8-bit timer counter (8TCNT) and two 8-bit
time constant registers (TCORA and TCORB) that are constantly compared with the 8TCNT
value to detect compare match events. The timers can be used as multifunctional timers in a
variety of applications, including the generation of a rectangular-wave output with an arbitrary
duty cycle.
10.1.1
Features
The features of the 8-bit timer module are listed below.
• Selection of four clock sources
The counters can be driven by one of three internal clock signals (φ/8, φ/64, or φ/8192) or an
external clock input (enabling use as an external event counter).
• Selection of three ways to clear the counters
The counters can be cleared on compare match A or B, or input capture B.
• Timer output controlled by two compare match signals
The timer output signal in each channel is controlled by two independent compare match
signals, enabling the timer to generate output waveforms with an arbitrary duty cycle or PWM
output.
• A/D converter can be activated by a compare match
• Two channels can be cascaded
 Channels 0 and 1 can be operated as the upper and lower halves of a 16-bit timer (16-bit
count mode).
 Channels 2 and 3 can be operated as the upper and lower halves of a 16-bit timer (16-bit
count mode).
 Channel 1 can count channel 0 compare match events (compare match count mode).
 Channel 3 can count channel 2 compare match events (compare match count mode).
• Input capture function can be set
8-bit or 16-bit input capture operation is available.
Rev. 2.0, 06/04, page 377 of 980
• Twelve interrupt sources
There are twelve interrupt sources: four compare match sources, four compare match/input
capture sources, four overflow sources.
Two of the compare match sources and two of the combined compare match/input capture
sources each have an independent interrupt vector. The remaining compare match interrupts,
combined compare match/input capture interrupts, and overflow interrupts have one interrupt
vector for two sources.
Rev. 2.0, 06/04, page 378 of 980
10.1.2
Block Diagram
The 8-bit timers are divided into two groups of two channels each: group 0 comprising channels 0
and 1, and group 1 comprising channels 2 and 3. Figure 10.1 shows a block diagram of 8-bit
timer group 0.
External clock
sources
TCLKA
TCLKC
Internal clock
sources
φ/8
φ/64
φ/8192
Clock 1
Clock 0
Clock select
TCORA0
TCORA1
Compare match A1
Compare match A0 Comparator A0
Comparator A1
Overflow 1
TMO0
TMIO1
8TCNT0
8TCNT1
Internal bus
Overflow 0
Compare match B1
Control logic
Compare match B0 Comparator B0
Input capture B1
Legend:
TCORA:
TCORB:
8TCNT:
8TCSR:
8TCR:
Comparator B1
TCORB0
TCORB1
8TCSR0
8TCSR1
8TCR0
8TCR1
CMIA0
CMIB0
CMIA1/CMIB1
OVI0/OVI1
Interrupt signals
Time constant register A
Time constant register B
Timer counter
Timer control/status register
Timer control register
Figure 10.1 Block Diagram of 8-Bit Timer Unit (Two Channels: Group 0)
Rev. 2.0, 06/04, page 379 of 980
10.1.3
Pin Configuration
Table 10.1 summarizes the input/output pins of the 8-bit timer module.
Table 10.1 8-Bit Timer Pins
Group
Channel Name
Abbreviation I/O
0
0
Timer output
TMO0
Output Compare match output
Timer clock input
TCLKC
Input
Counter external clock input
Timer input/output TMIO1
I/O
Compare match output/input
capture input
Timer clock input
TCLKA
Input
Counter external clock input
Timer output
TMO2
Output Compare match output
Timer clock input
TCLKD
Input
Counter external clock input
Timer input/output TMIO3
I/O
Compare match output/input
capture input
Timer clock input
Input
Counter external clock input
1
1
2
3
Rev. 2.0, 06/04, page 380 of 980
TCLKB
Function
10.1.4
Register Configuration
Table 10.2 summarizes the registers of the 8-bit timer module.
Table 10.2 8-Bit Timer Registers
Channel Address*
0
1
2
3
H'FFF80
1
Name
Abbreviation R/W
Timer control register 0
8TCR0
Initial value
R/W
H'00
2
H'FFF82
Timer control/status register 0
8TCSR0
R/(W)* H'00
H'FFF84
Time constant register A0
TCORA0
R/W
H'FF
H'FFF86
Time constant register B0
TCORB0
R/W
H'FF
H'FFF88
Timer counter 0
8TCNT0
R/W
H'00
H'FFF81
Timer control register 1
8TCR1
R/W
H'00
2
H'FFF83
Timer control/status register 1
8TCSR1
R/(W)* H'00
H'FFF85
Time constant register A1
TCORA1
R/W
H'FF
H'FFF87
Time constant register B1
TCORB1
R/W
H'FF
H'FFF89
Timer counter 1
8TCNT1
R/W
H'00
H'FFF90
Timer control register 2
8TCR2
R/W
H'00
2
H'FFF92
Timer control/status register 2
8TCSR2
R/(W)* H'10
H'FFF94
Time constant register A2
TCORA2
R/W
H'FF
H'FFF96
Time constant register B2
TCORB2
R/W
H'FF
H'FFF98
Timer counter 2
8TCNT2
R/W
H'00
H'FFF91
Timer control register 3
8TCR3
R/W
H'00
2
H'FFF93
Timer control/status register 3
8TCSR3
R/(W)* H'00
H'FFF95
Time constant register A3
TCORA3
R/W
H'FF
H'FFF97
Time constant register B3
TCORB3
R/W
H'FF
H'FFF99
Timer counter 3
8TCNT3
R/W
H'00
Notes: *1 Indicates the lower 20 bits of the address in advanced mode.
*2 Only 0 can be written to bits 7 to 5, to clear these flags.
Each pair of registers for channel 0 and channel 1 comprises a 16-bit register with the channel 0
register as the upper 8 bits and the channel 1 register as the lower 8 bits, so they can be accessed
together by word access.
Similarly, each pair of registers for channel 2 and channel 3 comprises a 16-bit register with the
channel 2 register as the upper 8 bits and the channel 3 register as the lower 8 bits, so they can be
accessed together by word access.
Rev. 2.0, 06/04, page 381 of 980
10.2
Register Descriptions
10.2.1
Timer Counters (8TCNT)
8TCNT0
8TCNT1
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
8TCNT2
Bit
Initial value
Read/Write
8TCNT3
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
The timer counters (8TCNT) are 8-bit readable/writable up-counters that increment on pulses
generated from an internal or external clock source. The clock source is selected by clock select
bits 2 to 0 (CKS2 to CKS0) in the timer control register (8TCR). The CPU can always read or
write to the timer counters.
The 8TCNT0 and 8TCNT1 pair, and the 8TCNT2 and 8TCNT3 pair, can each be accessed as a
16-bit register by word access.
8TCNT can be cleared by an input capture signal or compare match signal. Counter clear bits 1
and 0 (CCLR1 and CCLR0) in 8TCR select the method of clearing.
When 8TCNT overflows from H'FF to H'00, the overflow flag (OVF) in the timer control/status
register (8TCSR) is set to 1.
Each 8TCNT is initialized to H'00 by a reset and in standby mode.
Rev. 2.0, 06/04, page 382 of 980
10.2.2
Time Constant Registers A (TCORA)
TCORA0 to TCORA3 are 8-bit readable/writable registers.
TCORA0
TCORA1
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
TCORA2
TCORA3
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
The TCORA0 and TCORA1 pair, and the TCORA2 and TCORA3 pair, can each be accessed as a
16-bit register by word access.
The TCORA value is constantly compared with the 8TCNT value. When a match is detected, the
corresponding compare match flag A (CMFA) is set to 1 in 8TCSR.
The timer output can be freely controlled by these compare match signals and the settings of
output select bits 1 and 0 (OS1, OS0) in 8TCSR.
Each TCORA register is initialized to H'FF by a reset and in standby mode.
Rev. 2.0, 06/04, page 383 of 980
10.2.3
Time Constant Registers B (TCORB)
TCORB0
TCORB1
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
TCORB2
TCORB3
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
TCORB0 to TCORB3 are 8-bit readable/writable registers. The TCORB0 and TCORB1 pair, and
the TCORB2 and TCORB3 pair, can each be accessed as a 16-bit register by word access.
The TCORB value is constantly compared with the 8TCNT value. When a match is detected, the
corresponding compare match flag B (CMFB) is set to 1 in 8TCSR*.
The timer output can be freely controlled by these compare match signals and the settings of
output/input capture edge select bits 3 and 2 (OIS3, OIS2) in 8TCSR.
When TCORB is used for input capture, it stores the 8TCNT value on detection of an external
input capture signal. At this time, the CMFB flag is set to 1 in the corresponding 8TCSR register.
The detected edge of the input capture signal is set in 8TCSR.
Each TCORB register is initialized to H'FF by a reset and in standby mode.
Note: * When channel 1 and channel 3 are designated for TCORB input capture, the CMFB flag is
not set by a channel 0 or channel 2 compare match B.
Rev. 2.0, 06/04, page 384 of 980
10.2.4
Timer Control Register (8TCR)
Bit
7
6
5
4
3
2
1
0
CMIEB
CMIEA
OVIE
CCLR1
CCLR0
CKS2
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
8TCR is an 8-bit readable/writable register that selects the 8TCNT input clock, gives the 8TCNT
clearing specification, and enables interrupt requests.
8TCR is initialized to H'00 by a reset and in standby mode.
For the timing, see section 10.4, Operation.
Bit 7—Compare Match Interrupt Enable B (CMIEB): Enables or disables the CMIB interrupt
request when the CMFB flag is set to 1 in 8TCSR.
Bit 7
CMIEB
Description
0
CMIB interrupt requested by CMFB is disabled
1
CMIB interrupt requested by CMFB is enabled
(Initial value)
Bit 6—Compare Match Interrupt Enable A (CMIEA): Enables or disables the CMIA interrupt
request when the CMFA flag is set to 1 in 8TCSR.
Bit 6
CMIEA
Description
0
CMIA interrupt requested by CMFA is disabled
1
CMIA interrupt requested by CMFA is enabled
(Initial value)
Bit 5—Timer Overflow Interrupt Enable (OVIE): Enables or disables the OVI interrupt
request when the OVF flag is set to 1 in 8TCSR.
Bit 5
OVIE
Description
0
OVI interrupt requested by OVF is disabled
1
OVI interrupt requested by OVF is enabled
(Initial value)
Rev. 2.0, 06/04, page 385 of 980
Bits 4 and 3—Counter Clear 1 and 0 (CCLR1, CCLR0): These bits specify the 8TCNT
clearing source. Compare match A or B, or input capture B, can be selected as the clearing source.
Bit 4
CCLR1
Bit 3
CCLR0
0
0
Clearing is disabled
1
Cleared by compare match A
0
Cleared by compare match B/input capture B
1
Cleared by input capture B
1
Description
(Initial value)
Note: When input capture B is set as the 8TCNT1 and 8TCNT3 counter clear source, 8TCNT0
and 8TCNT2 are not cleared by compare match B.
Bits 2 to 0—Clock Select 2 to 0 (CSK2 to CSK0): These bits select whether the clock input to
8TCNT is an internal or external clock.
Three internal clocks can be selected, all divided from the system clock (φ): φ/8, φ/64, and φ/8192.
The rising edge of the selected internal clock triggers the count.
When use of an external clock is selected, three types of count can be selected: at the rising edge,
the falling edge, and both rising and falling edges.
When CKS2, CKS1, CKS0 = 1, 0, 0, channels 0 and 1 and channels 2 and 3 are cascaded.
The incrementing clock source is different when 8TCR0 and 8TCR2 are set, and when 8TCR1
and 8TCR3 are set.
Rev. 2.0, 06/04, page 386 of 980
Bit 2
CSK2
Bit 1
CSK1
Bit 0
CSK0
Description
0
0
0
Clock input disabled
1
Internal clock, counted on falling edge of φ/8
0
Internal clock, counted on falling edge of φ/64
1
Internal clock, counted on falling edge of φ/8192
0
Channel 0 (16-bit count mode): Count on 8TCNT1 overflow
1
signal*
1
1
0
(Initial value)
Channel 1 (compare match count mode): Count on 8TCNT0
1
compare match A*
Channel 2 (16-bit count mode): Count on 8TCNT3 overflow
2
signal*
Channel 3 (compare match count mode): Count on 8TCNT2
2
compare match A*
1
1
External clock, counted on rising edge
0
External clock, counted on falling edge
1
External clock, counted on both rising and falling edges
Notes: *1 If the clock input of channel 0 is the 8TCNT1 overflow signal and that of channel 1 is
the 8TCNT0 compare match signal, no incrementing clock is generated. Do not use
this setting.
*2 If the clock input of channel 2 is the 8TCNT3 overflow signal and that of channel 3 is
the 8TCNT2 compare match signal, no incrementing clock is generated. Do not use
this setting.
Rev. 2.0, 06/04, page 387 of 980
10.2.5
Timer Control/Status Registers (8TCSR)
8TCSR0
Bit
7
6
5
4
3
2
1
0
CMFB
CMFA
OVF
ADTE
OIS3
OIS2
OS1
OS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/W
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
CMFB
CMFA
OVF
—
OIS3
OIS2
OS1
OS0
8TCSR2
Bit
Initial value
0
0
0
1
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
—
R/W
R/W
R/W
R/W
6
5
4
3
2
1
0
8TCSR1, 8TCSR3
7
Bit
CMFB
CMFA
OVF
ICE
OIS3
OIS2
OS1
OS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/W
R/W
R/W
R/W
R/W
Note: * Only 0 can be written to bits 7 to 5, to clear these flags.
The timer control/status registers 8TCSR are 8-bit registers that indicate compare match/input
capture and overflow statuses, and control compare match output/input capture edge selection.
8TCSR2 is initialized to H'10, and 8TCSR0, 8TCSR1, and 8TCSR3 to H'00, by a reset and in
standby mode.
Rev. 2.0, 06/04, page 388 of 980
Bit 7—Compare Match/Input Capture Flag B (CMFB): Status flag that indicates the
occurrence of a TCORB compare match or input capture.
Bit 7
CMFB
Description
0
[Clearing condition]
Read CMFB when CMFB = 1, then write 0 in CMFB
1
[Setting conditions]
• 8TCNT = TCORB*
•
Note:
*
(Initial value)
The 8TCNT value is transferred to TCORB by an input capture signal when
TCORB functions as an input capture register
When bit ICE is set to 1 in 8TCSR1 and 8TCSR3, the CMFB flag is not set when
8TCNT0 = TCORB0 or 8TCNT2 = TCORB2.
Bit 6—Compare Match Flag A (CMFA): Status flag that indicates the occurrence of a TCORA
compare match.
Bit 6
CMFA
Description
0
[Clearing condition]
Read CMFA when CMFA = 1, then write 0 in CMFA
1
[Setting condition]
8TCNT = TCORA
(Initial value)
Bit 5—Timer Overflow Flag (OVF): Status flag that indicates that the 8TCNT has overflowed
from H'FF to H'00.
Bit 5
OVF
Description
0
[Clearing condition]
Read OVF when OVF = 1, then write 0 in OVF
1
[Setting condition]
8TCNT overflows from H'FF to H'00
(Initial value)
Rev. 2.0, 06/04, page 389 of 980
Bit 4—A/D Trigger Enable (ADTE) (In 8TCSR0): In combination with TRGE in the A/D
control register (ADCR), enables or disables A/D converter start requests by compare match A or
an external trigger.
TRGE*
Bit 4
ADTE
0
0
A/D converter start requests by compare match A or external trigger pin
(ADTRG) input are disabled
(Initial value)
1
A/D converter start requests by compare match A or external trigger pin
(ADTRG) input are disabled
0
A/D converter start requests by external trigger pin (ADTRG) input are
enabled, and A/D converter start requests by compare match A are disabled
1
A/D converter start requests by compare match A are enabled, and A/D
converter start requests by external trigger pin (ADTRG) input are disabled
1
Note:
*
Description
TRGE is bit 7 of the A/D control register (ADCR).
Bit 4—Reserved (In 8TCSR1): This bit is a reserved bit, but can be read and written.
Bit 4—Input Capture Enable (ICE) (In 8TCSR1 and 8TCSR3): Selects the function of
TCORB1 and TCORB3.
Bit 4
ICE
Description
0
TCORB1 and TCORB3 are compare match registers
1
TCORB1 and TCORB3 are input capture registers
(Initial value)
When bit ICE is set to 1 in 8TCSR1 or 8TCSR3, the operation of the TCORA and TCORB
registers in channels 0 to 3 is as shown in the tables below.
Rev. 2.0, 06/04, page 390 of 980
Table 10.3 Operation of Channels 0 and 1 when Bit ICE is Set to 1 in 8TCSR1 Register
Register
Register Function
Status Flag Change
Timer Output
Capture Input
Interrupt Request
TCORA0 Compare match CMFA changed from 0 TMO0 output
controllable
operation
to 1 in 8TCSR0 by
compare match
CMIA0 interrupt request
generated by compare
match
TCORB0 Compare match CMFB not changed
No output from
operation
from 0 to 1 in 8TCSR0 TMO0
by compare match
CMIB0 interrupt request
not generated by compare
match
TCORA1 Compare match CMFA changed from 0 TMIO1 is dedicated CMIA1 interrupt request
operation
to 1 in 8TCSR1 by
input capture pin generated by compare
compare match
match
TCORB1 Input capture
operation
CMFB changed from 0 TMIO1 is dedicated CMIB1 interrupt request
to 1 in 8TCSR1 by
input capture pin generated by input
input capture
capture
Table 10.4 Operation of Channels 2 and 3 when Bit ICE is Set to 1 in 8TCSR3 Register
Register
Register Function
Status Flag Change
Timer Output
Capture Input
Interrupt Request
TCORA2 Compare match CMFA changed from 0 TMO2 output
controllable
operation
to 1 in 8TCSR2 by
compare match
CMIA2 interrupt request
generated by compare
match
TCORB2 Compare match CMFB not changed
No output from
operation
from 0 to 1 in 8TCSR2 TMO2
by compare match
CMIB2 interrupt request
not generated by compare
match
TCORA3 Compare match CMFA changed from 0 TMIO3 is dedicated CMIA3 interrupt request
operation
to 1 in 8TCSR3 by
input capture pin generated by compare
compare match
match
TCORB3 Input capture
operation
CMFB changed from 0 TMIO3 is dedicated CMIB3 interrupt request
to 1 in 8TCSR3 by
input capture pin generated by input
input capture
capture
Rev. 2.0, 06/04, page 391 of 980
Bits 3 and 2—Output/Input Capture Edge Select B3 and B2 (OIS3, OIS2): In combination
with the ICE bit in 8TCSR1 (8TCSR3), these bits select the compare match B output level or the
input capture input detected edge.
The function of TCORB1 (TCORB3) depends on the setting of bit 4 of 8TCSR1 (8TCSR3).
ICE Bit in
8TCSR1 Bit 3 Bit 2
(8TCSR3) OIS3 OIS2 Description
0
0
1
1
0
1
0
No change when compare match B occurs
(Initial value)
1
0 is output when compare match B occurs
0
1 is output when compare match B occurs
1
Output is inverted when compare match B occurs (toggle output)
0
TCORB input capture on rising edge
1
TCORB input capture on falling edge
0
TCORB input capture on both rising and falling edges
1
• When the compare match register function is used, the timer output priority order is: toggle
output > 1 output > 0 output.
• If compare match A and B occur simultaneously, the output changes in accordance with the
higher-priority compare match.
• When bits OIS3, OIS2, OS1, and OS0 are all cleared to 0, timer output is disabled.
Bits 1 and 0—Output Select A1 and A0 (OS1, OS0): These bits select the compare match A
output level.
Bit 1
OS1
Bit 0
OS0
Description
0
0
No change when compare match A occurs
1
0 is output when compare match A occurs
0
1 is output when compare match A occurs
1
Output is inverted when compare match A occurs (toggle output)
1
(Initial value)
• When the compare match register function is used, the timer output priority order is: toggle
output > 1 output > 0 output.
• If compare match A and B occur simultaneously, the output changes in accordance with the
higher-priority compare match.
• When bits OIS3, OIS2, OS1, and OS0 are all cleared to 0, timer output is disabled.
Rev. 2.0, 06/04, page 392 of 980
10.3
CPU Interface
10.3.1
8-Bit Registers
8TCNT, TCORA, TCORB, 8TCR, and 8TCSR are 8-bit registers. These registers are connected
to the CPU by an internal 16-bit data bus and can be read and written a word at a time or a byte at
a time.
Figures 10.2 and 10.3 show the operation in word read and write accesses to 8TCNT.
Figures 10.4 to 10.7 show the operation in byte read and write accesses to 8TCNT0 and 8TCNT1.
Internal data bus
H
C
P
U
H
Bus
interface
L
L
Module data bus
8TCNT0 8TCNT1
Figure 10.2 8TCNT Access Operation (CPU Writes to 8TCNT, Word)
Internal data bus
H
C
P
U
H
Bus
interface
L
L
Module data bus
8TCNT0 8TCNT1
Figure 10.3 8TCNT Access Operation (CPU Reads 8TCNT, Word)
Internal data bus
H
C
P
U
L
H
Bus
interface
L
Module data bus
8TCNTH0 8TCNTL1
Figure 10.4 8TCNT0 Access Operation (CPU Writes to 8TCNT0, Upper Byte)
Rev. 2.0, 06/04, page 393 of 980
Internal data bus
H
C
P
U
L
H
Bus
interface
L
Module data bus
8TCNTH0 8TCNTL1
Figure 10.5 8TCNT1 Access Operation (CPU Writes to 8TCNT1, Lower Byte)
Internal data bus
H
C
P
U
L
H
Bus
interface
L
Module data bus
8TCNT0 8TCNT1
Figure 10.6 8TCNT0 Access Operation (CPU Reads 8TCNT0, Upper Byte)
Internal data bus
H
C
P
U
L
H
Bus
interface
L
Module data bus
8TCNT0 8TCNT1
Figure 10.7 8TCNT1 Access Operation (CPU Reads 8TCNT1, Lower Byte)
Rev. 2.0, 06/04, page 394 of 980
10.4
Operation
10.4.1
8TCNT Count Timing
8TCNT is incremented by input clock pulses (either internal or external).
Internal Clock: Three different internal clock signals (φ/8, φ/64, or φ/8192) divided from the
system clock (φ) can be selected, by setting bits CKS2 to CKS0 in 8TCR. Figure 10.8 shows the
count timing.
φ
Internal clock
8TCNT input clock
8TCNT
N–1
N
N+1
Note: Even if the same internal clock is selected for the 16-bit timer and the 8-bit timer, the same operation
will not be performed since the incrementing edge is different in each case.
Figure 10.8 Count Timing for Internal Clock Input
External Clock: Three incrementation methods can be selected by setting bits CKS2 to CKS0 in
8TCR: on the rising edge, the falling edge, and both rising and falling edges.
The pulse width of the external clock signal must be at least 1.5 system clocks when a single edge
is selected, and at least 2.5 system clocks when both edges are selected. Shorter pulses will not be
counted correctly.
Figure 10.9 shows the timing for incrementation on both edges of the external clock signal.
Rev. 2.0, 06/04, page 395 of 980
φ
External clock input
8TCNT input clock
8TCNT
N–1
N
N+1
Figure 10.9 Count Timing for External Clock Input (Both-Edge Detection)
10.4.2
Compare Match Timing
Timer Output Timing: When compare match A or B occurs, the timer output is as specified by
the OIS3, OIS2, OS1, and OS0 bits in 8TCSR (unchanged, 0 output, 1 output, or toggle output).
Figure 10.10 shows the timing when the output is set to toggle on compare match A.
φ
Compare match A
signal
Timer output
Figure 10.10 Timing of Timer Output
Rev. 2.0, 06/04, page 396 of 980
Clear by Compare Match: Depending on the setting of the CCLR1 and CCLR0 bits in 8TCR,
8TCNT can be cleared when compare match A or B occurs, Figure 10.11 shows the timing of
this operation.
φ
Compare match signal
8TCNT
N
H'00
Figure 10.11 Timing of Clear by Compare Match
Clear by Input Capture: Depending on the setting of the CCLR1 and CCLR0 bits in 8TCR,
8TCNT can be cleared when input capture B occurs. Figure 10.12 shows the timing of this
operation.
φ
Input capture input
Input capture signal
8TCNT
N
H '00
Figure 10.12 Timing of Clear by Input Capture
10.4.3
Input Capture Signal Timing
Input capture on the rising edge, falling edge, or both edges can be selected by settings in 8TCSR.
Figure 10.13 shows the timing when the rising edge is selected.
The pulse width of the input capture input signal must be at least 1.5 system clocks when a single
edge is selected, and at least 2.5 system clocks when both edges are selected.
Rev. 2.0, 06/04, page 397 of 980
φ
Input capture input
Input capture signal
8TCNT
N
TCORB
N
Figure 10.13 Timing of Input Capture Input Signal
10.4.4
Timing of Status Flag Setting
Timing of CMFA/CMFB Flag Setting when Compare Match Occurs: The CMFA and CMFB
flags in 8TCSR are set to 1 by the compare match signal output when the TCORA or TCORB and
8TCNT values match. The compare match signal is generated in the last state of the match (when
the matched 8TCNT count value is updated). Therefore, after the 8TCNT and TCORA or
TCORB values match, the compare match signal is not generated until an incrementing clock
pulse signal is generated. Figure 10.14 shows the timing in this case.
φ
8TCNT
N
TCOR
N
N+1
Compare match signal
CMF
Figure 10.14 CMF Flag Setting Timing when Compare Match Occurs
Timing of CMFB Flag Setting when Input Capture Occurs: On generation of an input capture
signal, the CMFB flag is set to 1 and at the same time the 8TCNT value is transferred to TCORB.
Figure 10.15 shows the timing in this case.
Rev. 2.0, 06/04, page 398 of 980
φ
8TCNT
N
TCORB
N
Input capture signal
CMFB
Figure 10.15 CMFB Flag Setting Timing when Input Capture Occurs
Timing of Overflow Flag (OVF) Setting: The OVF flag in 8TCSR is set to 1 by the overflow
signal generated when 8TCNT overflows (from H'FF to H'00). Figure 10.16 shows the timing in
this case.
φ
8TCNT
H'FF
H'00
Overflow signal
OVF
Figure 10.16 Timing of OVF Setting
10.4.5
Operation with Cascaded Connection
If bits CKS2 to CKS0 are set to (100) in either 8TCR0 or 8TCR1, the 8-bit timers of channels 0
and 1 are cascaded. With this configuration, the two timers can be used as a single 16-bit timer
(16-bit timer mode), or channel 0 8-bit timer compare matches can be counted in channel 1
(compare match count mode). Similarly, if bits CKS2 to CKS0 are set to (100) in either 8TCR2
or 8TCR3, the 8-bit timers of channels 2 and 3 are cascaded. With this configuration, the two
timers can be used as a single 16-bit timer (16-bit timer mode),or channel 2 8-bit timer compare
matches can be counted in channel 3 (compare match count mode). In this case, the timer
operates as below.
Rev. 2.0, 06/04, page 399 of 980
16-Bit Count Mode
• Channels 0 and 1:
When bits CKS2 to CKS0 are set to (100) in 8TCR0, the timer functions as a single 16-bit
timer with channel 0 occupying the upper 8 bits and channel 1 occupying the lower 8 bits.
 Setting when Compare Match Occurs
• The CMFA or CMFB flag is set to 1 in 8TCSR0 when a 16-bit compare match occurs.
• The CMFA or CMFB flag is set to 1 in 8TCSR1 when a lower 8-bit compare match
occurs.
• TMO0 pin output control by bits OIS3, OIS2, OS1, and OS0 in 8TCSR0 is in
accordance with the 16-bit compare match conditions.
• TMIO1 pin output control by bits OIS3, OIS2, OS1, and OS0 in 8TCSR1 is in
accordance with the lower 8-bit compare match conditions.
 Setting when Input Capture Occurs
• The CMFB flag is set to 1 in 8TCSR0 and 8TCSR1 when the ICE bit is 1 in TCSR1
and input capture occurs.
• TMIO1 pin input capture input signal edge detection is selected by bits OIS3 and OIS2
in 8TCSR0.
 Counter Clear Specification
• If counter clear on compare match or input capture has been selected by the CCLR1
and CCLR0 bits in 8TCR0, the 16-bit counter (both 8TCNT0 and 8TCNT1) is cleared.
• The settings of the CCLR1 and CCLR0 bits in 8TCR1 are ignored. The lower 8 bits
cannot be cleared independently.
 OVF Flag Operation
• The OVF flag is set to 1 in 8TCSR0 when the 16-bit counter (8TCNT0 and 8TCNT1)
overflows (from H'FFFF to H'0000).
• The OVF flag is set to 1 in 8TCSR1 when the 8-bit counter (8TCNT1) overflows (from
H'FF to H'00).
• Channels 2 and 3:
When bits CKS2 to CKS0 are set to (100) in 8TCR2, the timer functions as a single 16-bit
timer with channel 2 occupying the upper 8 bits and channel 3 occupying the lower 8 bits.
 Setting when Compare Match Occurs
• The CMFA or CMFB flag is set to 1 in 8TCSR2 when a 16-bit compare match occurs.
• The CMFA or CMFB flag is set to 1 in 8TCSR3 when a lower 8-bit compare match
occurs.
• TMO2 pin output control by bits OIS3, OIS2, OS1, and OS0 in 8TCSR2 is in
accordance with the 16-bit compare match conditions.
• TMIO3 pin output control by bits OIS3, OIS2, OS1, and OS0 in 8TCSR3 is in
accordance with the lower 8-bit compare match conditions.
Rev. 2.0, 06/04, page 400 of 980
 Setting when Input Capture Occurs
• The CMFB flag is set to 1 in 8TCSR2 and 8TCSR3 when the ICE bit is 1 in TCSR3
and input capture occurs.
• TMIO3 pin input capture input signal edge detection is selected by bits OIS3 and OIS2
in 8TCSR2.
 Counter Clear Specification
• If counter clear on compare match has been selected by the CCLR1 and CCLR0 bits in
8TCR2, the 16-bit counter (both 8TCNT2 and 8TCNT3) is cleared.
• The settings of the CCLR1 and CCLR0 bits in 8TCR3 are ignored. The lower 8 bits
cannot be cleared independently.
 OVF Flag Operation
• The OVF flag is set to 1 in 8TCSR2 when the 16-bit counter (8TCNT2 and 8TCNT3)
overflows (from H'FFFF to H'0000).
• The OVF flag is set to 1 in 8TCSR3 when the 8-bit counter (8TCNT3) overflows (from
H'FF to H'00).
Compare Match Count Mode
• Channels 0 and 1:
When bits CKS2 to CKS0 are set to (100) in 8TCR1, 8TCNT1 counts channel 0 compare
match A events.
CMF flag setting, interrupt generation, TMO pin output, counter clearing, and so on, is in
accordance with the settings for each channel.
Note: When bit ICE = 1 in 8TCSR1, the compare match register function of TCORB0 in
channel 0 cannot be used.
• Channels 2 and 3:
When bits CKS2 to CKS0 are set to (100) in 8TCR3, 8TCNT3 counts channel 2 compare
match A events.
CMF flag setting, interrupt generation, TMO pin output, counter clearing, and so on, is in
accordance with the settings for each channel.
Caution
Do not set 16-bit counter mode and compare match count mode simultaneously within the same
group, as the 8TCNT input clock will not be generated and the counters will not operate.
Rev. 2.0, 06/04, page 401 of 980
10.4.6
Input Capture Setting
The 8TCNT value can be transferred to TCORB on detection of an input edge on the input
capture/output compare pin (TMIO1 or TMIO3). Rising edge, falling edge, or both edge detection
can be selected. In 16-bit count mode, 16-bit input capture can be used.
Setting Input Capture Operation in 8-Bit Timer Mode (Normal Operation)
• Channel 1:
 Set TCORB1 as an 8-bit input capture register with the ICE bit in 8TCSR1.
 Select rising edge, falling edge, or both edges as the input edge(s) for the input capture
signal (TMIO1) with bits OIS3 and OIS2 in 8TCSR1.
 Select the input clock with bits CKS2 to CKS0 in 8TCR1, and start the 8TCNT count.
• Channel 3:
 Set TCORB3 as an 8-bit input capture register with the ICE bit in 8TCSR3.
 Select rising edge, falling edge, or both edges as the input edge(s) for the input capture
signal (TMIO3) with bits OIS3 and OIS2 in 8TCSR3.
 Select the input clock with bits CKS2 to CKS0 in 8TCR3, and start the 8TCNT count.
Note: When TCORB1 in channel 1 is used for input capture, TCORB0 in channel 0 cannot be
used as a compare match register.
Similarly, when TCORB3 in channel 3 is used for input capture, TCORB2 in channel 2
cannot be used as a compare match register.
Setting Input Capture Operation in 16-Bit Count Mode
• Channels 0 and 1:
 In 16-bit count mode, TCORB0 and TCORB1 function as a 16-bit input capture register
when the ICE bit is set to 1 in 8TCSR1.
 Select rising edge, falling edge, or both edges as the input edge(s) for the input capture
signal (TMIO1) with bits OIS3 and OIS2 in 8TCSR0. (In 16-bit count mode, the settings of
bits OIS3 and OIS2 in 8TCSR1 are ignored.)
 Select the input clock with bits CKS2 to CKS0 in 8TCR1, and start the 8TCNT count.
• Channels 2 and 3:
 In 16-bit count mode, TCORB2 and TCORB3 function as a 16-bit input capture register
when the ICE bit is set to 1 in 8TCSR3.
 Select rising edge, falling edge, or both edges as the input edge(s) for the input capture
signal (TMIO3) with bits OIS3 and OIS2 in 8TCSR2. (In 16-bit count mode, the settings of
bits OIS3 and OIS2 in 8TCSR3 are ignored.)
 Select the input clock with bits CKS2 to CKS0 in 8TCR3, and start the 8TCNT count.
Rev. 2.0, 06/04, page 402 of 980
10.5
Interrupt
10.5.1
Interrupt Sources
The 8-bit timer unit can generate three types of interrupt: compare match A and B (CMIA and
CMIB) and overflow (TOVI). Table 10.5 shows the interrupt sources and their priority order.
Each interrupt source is enabled or disabled by the corresponding interrupt enable bit in 8TCR. A
separate interrupt request signal is sent to the interrupt controller by each interrupt source.
Table 10.5 Types of 8-Bit Timer Interrupt Sources and Priority Order
Interrupt Source
Description
Priority
CMIA
Interrupt by CMFA
High
CMIB
Interrupt by CMFB
TOVI
Interrupt by OVF
Low
For compare match interrupts (CMIA1/CMIB1 and CMIA3/CMIB3) and the overflow interrupts
(TOVI0/TOVI1 and TOVI2/TOVI3), one vector is shared by two interrupts.
Table 10.6 lists the interrupt sources.
Table 10.6 8-Bit Timer Interrupt Sources
Channel
Interrupt Source
Description
0
CMIA0
TCORA0 compare match
CMIB0
TCORB0 compare match/input capture
1
CMIA1/CMIB1
TCORA1 compare match, or TCORB1 compare match/input
capture
0, 1
TOVI0/TOVI1
Counter 0 or counter 1 overflow
2
CMIA2
TCORA2 compare match
CMIB2
TCORB2 compare match/input capture
3
CMIA3/CMIB3
TCORA3 compare match, or TCORB3 compare match/input
capture
2, 3
TOVI2/TOVI3
Counter 2 or counter 3 overflow
Rev. 2.0, 06/04, page 403 of 980
10.5.2
A/D Converter Activation
The A/D converter can only be activated by channel 0 compare match A.
If the ADTE bit setting is 1 when the CMFA flag in 8TCSR0 is set to 1 by generation of channel 0
compare match A, an A/D conversion start request will be issued to the A/D converter. If the
TRGE bit in ADCR is 1 at this time, the A/D converter will be started. If the ADTE bit in
8TCSR0 is 1, A/D converter external trigger pin (ADTRG) input is disabled.
10.6
8-Bit Timer Application Example
Figure 10.17 shows how the 8-bit timer module can be used to output pulses with any desired duty
cycle. The settings for this example are as follows:
• Clear the CCLR1 bit to 0 and set the CCLR0 bit to 1 in 8TCR so that 8TCNT is cleared by a
TCORA compare match.
• Set bits OIS3, OIS2, OS1, and OS0 to (0110) in 8TCSR so that 1 is output on a TCORA
compare match and 0 is output on a TCORB compare match.
The above settings enable a waveform with the cycle determined by TCORA and the pulse width
detected by TCORB to be output without software intervention.
8TCNT
H'FF
Counter clear
TCORA
TCORB
H'00
TMO
Figure 10.17 Example of Pulse Output
Rev. 2.0, 06/04, page 404 of 980
10.7
Usage Notes
Note that the following kinds of contention can occur in 8-bit timer operation.
10.7.1
Contention between 8TCNT Write and Clear
If a timer counter clear signal occurs in the T3 state of a 8TCNT write cycle, clearing of the
counter takes priority and the write is not performed. Figure 10.18 shows the timing in this case.
8TCNT write cycle
T1
T2
T3
φ
Address bus
8TCNT address
Internal write signal
Counter clear signal
8TCNT
N
H'00
Figure 10.18 Contention between 8TCNT Write and Clear
Rev. 2.0, 06/04, page 405 of 980
10.7.2
Contention between 8TCNT Write and Increment
If an increment pulse occurs in the T3 state of a 8TCNT write cycle, writing takes priority and
8TCNT is not incremented. Figure 10.19 shows the timing in this case.
8TCNT write cycle
T1
T2
T3
φ
Address bus
8 TCNT address
Internal write signal
8TCNT input clock
8TCNT
N
M
8TCNT write data
Figure 10.19 Contention between 8TCNT Write and Increment
Rev. 2.0, 06/04, page 406 of 980
10.7.3
Contention between TCOR Write and Compare Match
If a compare match occurs in the T3 state of a TCOR write cycle, writing takes priority and the
compare match signal is inhibited. Figure 10.20 shows the timing in this case.
TCOR write cycle
T1
T2
T3
φ
TCOR address
Address bus
Internal write signal
8TCNT
N
TCOR
N
N+1
M
TCOR write data
Inhibited
Compare match signal
Figure 10.20 Contention between TCOR Write and Compare Match
Rev. 2.0, 06/04, page 407 of 980
10.7.4
Contention between TCOR Read and Input Capture
If an input capture signal occurs in the T3 state of a TCOR read cycle, the value before input
capture is read. Figure 10.21 shows the timing in this case.
TCORB read cycle
T1
T2
T3
φ
Address bus
TCORB address
Internal read signal
Input capture signal
TCORB
Internal data bus
N
M
N
Figure 10.21 Contention between TCOR Read and Input Capture
Rev. 2.0, 06/04, page 408 of 980
10.7.5
Contention between Counter Clearing by Input Capture and Counter Increment
If an input capture signal and counter increment signal occur simultaneously, counter clearing by
the input capture signal takes priority and the counter is not incremented. The value before the
counter is cleared is transferred to TCORB. Figure 10.22 shows the timing in this case.
T1
T2
T3
φ
Input capture signal
Counter clear signal
8TCNT internal clock
8TCNT
N
TCORB
X
H'00
N
Figure 10.22 Contention between Counter Clearing by Input Capture and Counter
Increment
Rev. 2.0, 06/04, page 409 of 980
10.7.6
Contention between TCOR Write and Input Capture
If an input capture signal occurs in the T3 state of a TCOR write cycle, input capture takes priority
and the write to TCOR is not performed. Figure 10.23 shows the timing in this case.
TCOR write cycle
T1
T2
T3
φ
Address bus
TCOR address
Internal write signal
Input capture signal
8TCNT
TCOR
M
X
M
Figure 10.23 Contention between TCOR Write and Input Capture
Rev. 2.0, 06/04, page 410 of 980
10.7.7
Contention between 8TCNT Byte Write and Increment in 16-Bit Count Mode
(Cascaded Connection)
If an increment pulse occurs in the T3 state of an 8TCNT byte write cycle in 16-bit count mode,
the counter write takes priority and the byte data for which the write was performed is not
incremented. The byte data for which a write was not performed is incremented. Figure 10.24
shows the timing when an increment pulse occurs in the T2 state of a byte write to 8TCNT (upper
byte). If an increment pulse occurs in the T2 state, on the other hand, the increment takes priority.
8TCNT (upper byte) byte write cycle
T1
T2
T3
φ
8TCNTH address
Address bus
Internal write signal
8TCNT input clock
8TCNT (upper byte)
N
8TCNT (lower byte)
X
N+1
8TCNT write data
X+1
Figure 10.24 Contention between 8TCNT Byte Write and Increment in 16-Bit Count Mode
Rev. 2.0, 06/04, page 411 of 980
10.7.8
Contention between Compare Matches A and B
If compare matches A and B occur at the same time, the 8-bit timer operates according to the
relative priority of the output states set for compare match A and compare match B, as shown in
Table 10.7.
Table 10.7 Timer Output Priority Order
Output Setting
Priority
Toggle output
High
1 output
0 output
No change
10.7.9
Low
8TCNT Operation and Internal Clock Source Switchover
Switching internal clock sources may cause 8TCNT to increment, depending on the switchover
timing. Table 10.8 shows the relation between the time of the switchover (by writing to bits
CKS1 and CKS0) and the operation of 8TCNT.
The 8TCNT input clock is generated from the internal clock source by detecting the rising edge of
the internal clock. If a switchover is made from a low clock source to a high clock source, as in
case No. 3 in Table 10.8, the switchover will be regarded as a falling edge, a 8TCNT clock pulse
will be generated, and 8TCNT will be incremented.
8TCNT may also be incremented when switching between internal and external clocks.
Rev. 2.0, 06/04, page 412 of 980
Table 10.8 Internal Clock Switchover and 8TCNT Operation
No.
CKS1 and CKS0 Write
Timing
1
High → high switchover*
8TCNT Operation
1
Old clock
source
New clock
source
8TCNT clock
8TCNT
N
N+1
CKS bits rewritten
2
High → low switchover*
2
Old clock
source
New clock
source
8TCNT clock
8TCNT
N
N+1
N+2
CKS bits rewritten
3
Low → high switchover*
3
Old clock
source
New clock
source
*4
8TCNT clock
8TCNT
N
N+1
N+2
CKS bits rewritten
Rev. 2.0, 06/04, page 413 of 980
No.
CKS1 and CKS0 Write
Timing
4
Low → low switchover*
8TCNT Operation
4
Old clock
source
New clock
source
8TCNT clock
8TCNT
N
N+1
N+2
CKS bits rewritten
Notes: *1 Including switchovers from the high level to the halted state, and from the halted state
to the high level.
*2 Including switchover from the halted state to the low level.
*3 Including switchover from the low level to the halted state.
*4 The switchover is regarded as a rising edge, causing 8TCNT to increment.
Rev. 2.0, 06/04, page 414 of 980
Section 11 Programmable Timing Pattern Controller (TPC)
11.1
Overview
The H8/3029 has a built-in programmable timing pattern controller (TPC) that provides pulse
outputs by using the 16-bit timer as a time base. The TPC pulse outputs are divided into 4-bit
groups (group 3 to group 0) that can operate simultaneously and independently.
11.1.1
Features
TPC features are listed below.
• 16-bit output data
Maximum 16-bit data can be output. TPC output can be enabled on a bit-by-bit basis.
• Four output groups
Output trigger signals can be selected in 4-bit groups to provide up to four different 4-bit
outputs.
• Selectable output trigger signals
Output trigger signals can be selected for each group from the compare match signals of three
16-bit timer channels.
• Non-overlap mode
A non-overlap margin can be provided between pulse outputs.
• Can operate together with the DMA controller (DMAC)
The compare-match signals selected as trigger signals can activate the DMAC for sequential
output of data without CPU intervention.
Rev. 2.0, 06/04, page 415 of 980
11.1.2
Block Diagram
Figure 11.1 shows a block diagram of the TPC.
16-bit timer compare match signals
Control logic
TP15
TP14
TP13
TP12
TP11
TP10
TP 9
TP 8
TP 7
TP 6
TP 5
TP 4
TP 3
TP 2
TP 1
TP 0
Legend
TPMR:
TPCR:
NDERB:
NDERA:
PBDDR:
PADDR:
NDRB:
NDRA:
PBDR:
PADR:
PADDR
PBDDR
NDERA
NDERB
TPMR
TPCR
Internal
data bus
Pulse output
pins, group 3
PBDR
NDRB
PADR
NDRA
Pulse output
pins, group 2
Pulse output
pins, group 1
Pulse output
pins, group 0
TPC output mode register
TPC output control register
Next data enable register B
Next data enable register A
Port B data direction register
Port A data direction register
Next data register B
Next data register A
Port B data register
Port A data register
Figure 11.1 TPC Block Diagram
Rev. 2.0, 06/04, page 416 of 980
11.1.3
TPC Pins
Table 11.1 summarizes the TPC output pins.
Table 11.1 TPC Pins
Name
Symbol
I/O
Function
TPC output 0
TP0
Output
Group 0 pulse output
TPC output 1
TP1
Output
TPC output 2
TP2
Output
TPC output 3
TP3
Output
TPC output 4
TP4
Output
TPC output 5
TP5
Output
TPC output 6
TP6
Output
TPC output 7
TP7
Output
TPC output 8
TP8
Output
TPC output 9
TP9
Output
TPC output 10
TP10
Output
TPC output 11
TP11
Output
TPC output 12
TP12
Output
TPC output 13
TP13
Output
TPC output 14
TP14
Output
TPC output 15
TP15
Output
Group 1 pulse output
Group 2 pulse output
Group 3 pulse output
Rev. 2.0, 06/04, page 417 of 980
11.1.4
Registers
Table 11.2 summarizes the TPC registers.
Table 11.2 TPC Registers
Address*
1
Name
Abbreviation
R/W
H'EE009
Port A data direction register
PADDR
W
H'FFFD9
Port A data register
PADR
R/(W)*
H'EE00A
Port B data direction register
PBDDR
W
Function
H'00
2
H'00
H'00
2
H'FFFDA
Port B data register
PBDR
R/(W)*
H'00
H'FFFA0
TPC output mode register
TPMR
R/W
H'F0
H'FFFA1
TPC output control register
TPCR
R/W
H'FF
H'FFFA2
Next data enable register B
NDERB
R/W
H'00
H'FFFA3
Next data enable register A
NDERA
R/W
H'00
H'FFFA5/
3
H'FFFA7*
Next data register A
NDRA
R/W
H'00
H'FFFA4/
3
H'FFFA6*
Next data register B
NDRB
R/W
H'00
Notes: *1 Lower 20 bits of the address in advanced mode.
*2 Bits used for TPC output cannot be written.
*3 The NDRA address is H'FFFA5 when the same output trigger is selected for TPC
output groups 0 and 1 by settings in TPCR. When the output triggers are different, the
NDRA address is H'FFFA7 for group 0 and H'FFFA5 for group 1. Similarly, the address
of NDRB is H'FFFA4 when the same output trigger is selected for TPC output groups 2
and 3 by settings in TPCR. When the output triggers are different, the NDRB address is
H'FFFA6 for group 2 and H'FFFA4 for group 3.
Rev. 2.0, 06/04, page 418 of 980
11.2
Register Descriptions
11.2.1
Port A Data Direction Register (PADDR)
PADDR is an 8-bit write-only register that selects input or output for each pin in port A.
Bit
7
6
5
4
3
2
1
0
PA 7 DDR PA 6 DDR PA 5 DDR PA 4 DDR PA 3 DDR PA 2 DDR PA 1 DDR PA 0 DDR
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port A data direction 7 to 0
These bits select input or
output for port A pins
Port A is multiplexed with pins TP7 to TP0. Bits corresponding to pins used for TPC output must
be set to 1. For further information about PADDR, see section 8.11, Port A.
11.2.2
Port A Data Register (PADR)
PADR is an 8-bit readable/writable register that stores TPC output data for groups 0 and 1, when
these TPC output groups are used.
Bit
7
6
5
4
3
2
1
0
PA 7
PA 6
PA 5
PA 4
PA 3
PA 2
PA 1
PA 0
Initial value
0
0
0
0
0
Read/Write
R/(W) *
R/(W) *
R/(W) *
R/(W) *
R/(W) *
0
R/(W) *
0
R/(W) *
0
R/(W) *
Port A data 7 to 0
These bits store output data
for TPC output groups 0 and 1
Note: * Bits selected for TPC output by NDERA settings become read-only bits.
For further information about PADR, see section 8.11, Port A.
Rev. 2.0, 06/04, page 419 of 980
11.2.3
Port B Data Direction Register (PBDDR)
PBDDR is an 8-bit write-only register that selects input or output for each pin in port B.
Bit
7
6
5
4
3
2
1
0
PB7DDR PB6DDR PB5DDR PB4DDR PB3DDR PB2DDR PB1DDR PB0DDR
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port B direction 7 to 0
These bits select input or
output for port B pins
Port B is multiplexed with pins TP15 to TP8. Bits corresponding to pins used for TPC output must
be set to 1. For further information about PBDDR, see section 8.12, Port B.
11.2.4
Port B Data Register (PBDR)
PBDR is an 8-bit readable/writable register that stores TPC output data for groups 2 and 3, when
these TPC output groups are used.
Bit
7
6
5
4
3
2
1
0
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
Port B data 7 to 0
These bits store output data
for TPC output groups 2 and 3
Note: * Bits selected for TPC output by NDERB settings become read-only bits.
For further information about PBDR, see section 8.12, Port B.
Rev. 2.0, 06/04, page 420 of 980
11.2.5
Next Data Register A (NDRA)
NDRA is an 8-bit readable/writable register that stores the next output data for TPC output groups
1 and 0 (pins TP7 to TP0). During TPC output, when an 16-bit timer compare match event
specified in TPCR occurs, NDRA contents are transferred to the corresponding bits in PADR. The
address of NDRA differs depending on whether TPC output groups 0 and 1 have the same output
trigger or different output triggers.
NDRA is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Same Trigger for TPC Output Groups 0 and 1: If TPC output groups 0 and 1 are triggered by
the same compare match event, the NDRA address is H'FFFA5. The upper 4 bits belong to group
1 and the lower 4 bits to group 0. Address H'FFFA7 consists entirely of reserved bits that cannot
be modified and always read 1.
Address H'FFFA5
Bit
7
6
5
4
3
2
1
0
NDR7
NDR6
NDR5
NDR4
NDR3
NDR2
NDR1
NDR0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Next data 7 to 4
These bits store the next output
data for TPC output group 1
Next data 3 to 0
These bits store the next output
data for TPC output group 0
Address H'FFFA7
Bit
7
6
5
4
3
2
1
0
—
—
—
—
—
—
—
—
Initial value
1
1
1
1
1
1
1
1
Read/Write
—
—
—
—
—
—
—
—
Reserved bits
Rev. 2.0, 06/04, page 421 of 980
Different Triggers for TPC Output Groups 0 and 1: If TPC output groups 0 and 1 are triggered
by different compare match events, the address of the upper 4 bits of NDRA (group 1) is
H'FFFA5 and the address of the lower 4 bits (group 0) is H'FFFA7. Bits 3 to 0 of address
H'FFFA5 and bits 7 to 4 of address H'FFFA7 are reserved bits that cannot be modified and always
read 1.
Address H'FFFA5
Bit
7
6
5
4
3
2
1
0
NDR7
NDR6
NDR5
NDR4
—
—
—
—
Initial value
0
0
0
0
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
—
—
—
—
Next data 7 to 4
These bits store the next output
data for TPC output group 1
Reserved bits
Address H'FFFA7
Bit
7
6
5
4
3
2
1
0
—
—
—
—
NDR3
NDR2
NDR1
NDR0
Initial value
1
1
1
1
0
0
0
0
Read/Write
—
—
—
—
R/W
R/W
R/W
R/W
Reserved bits
Rev. 2.0, 06/04, page 422 of 980
Next data 3 to 0
These bits store the next output
data for TPC output group 0
11.2.6
Next Data Register B (NDRB)
NDRB is an 8-bit readable/writable register that stores the next output data for TPC output groups
3 and 2 (pins TP15 to TP8). During TPC output, when an 16-bit timer compare match event
specified in TPCR occurs, NDRB contents are transferred to the corresponding bits in PBDR. The
address of NDRB differs depending on whether TPC output groups 2 and 3 have the same output
trigger or different output triggers.
NDRB is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Same Trigger for TPC Output Groups 2 and 3: If TPC output groups 2 and 3 are triggered by
the same compare match event, the NDRB address is H'FFFA4. The upper 4 bits belong to group
3 and the lower 4 bits to group 2. Address H'FFFA6 consists entirely of reserved bits that cannot
be modified and always read 1.
Address H'FFFA4
Bit
7
6
5
4
3
2
1
0
NDR15
NDR14
NDR13
NDR12
NDR11
NDR10
NDR9
NDR8
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Next data 15 to 12
These bits store the next output
data for TPC output group 3
Next data 11 to 8
These bits store the next output
data for TPC output group 2
Address H'FFFA6
Bit
7
6
5
4
3
2
1
0
—
—
—
—
—
—
—
—
Initial value
1
1
1
1
1
1
1
1
Read/Write
—
—
—
—
—
—
—
—
Reserved bits
Rev. 2.0, 06/04, page 423 of 980
Different Triggers for TPC Output Groups 2 and 3: If TPC output groups 2 and 3 are triggered
by different compare match events, the address of the upper 4 bits of NDRB (group 3) is H'FFFA4
and the address of the lower 4 bits (group 2) is H'FFFA6. Bits 3 to 0 of address H'FFFA4 and bits
7 to 4 of address H'FFFA6 are reserved bits that cannot be modified and always read 1.
Address H'FFFA4
Bit
7
6
5
4
3
2
1
0
NDR15
NDR14
NDR13
NDR12
—
—
—
—
Initial value
0
0
0
0
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
—
—
—
—
Next data 15 to 12
These bits store the next output
data for TPC output group 3
Reserved bits
Address H'FFFA6
Bit
7
6
5
4
3
2
1
0
—
—
—
—
NDR11
NDR10
NDR9
NDR8
Initial value
1
1
1
1
0
0
0
0
Read/Write
—
—
—
—
R/W
R/W
R/W
R/W
Reserved bits
Rev. 2.0, 06/04, page 424 of 980
Next data 11 to 8
These bits store the next output
data for TPC output group 2
11.2.7
Next Data Enable Register A (NDERA)
NDERA is an 8-bit readable/writable register that enables or disables TPC output groups 1 and 0
(TP7 to TP0) on a bit-by-bit basis.
Bit
7
6
5
4
3
2
1
0
NDER7
NDER6
NDER5
NDER4
NDER3
NDER2
NDER1
NDER0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Next data enable 7 to 0
These bits enable or disable
TPC output groups 1 and 0
If a bit is enabled for TPC output by NDERA, then when the 16-bit timer compare match event
selected in the TPC output control register (TPCR) occurs, the NDRA value is automatically
transferred to the corresponding PADR bit, updating the output value. If TPC output is disabled,
the bit value is not transferred from NDRA to PADR and the output value does not change.
NDERA is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bits 7 to 0—Next Data Enable 7 to 0 (NDER7 to NDER0): These bits enable or disable TPC
output groups 1 and 0 (TP7 to TP0) on a bit-by-bit basis.
Bits 7 to 0
NDER7 to NDER0
Description
0
TPC outputs TP7 to TP0 are disabled
(NDR7 to NDR0 are not transferred to PA7 to PA0)
1
TPC outputs TP7 to TP0 are enabled
(NDR7 to NDR0 are transferred to PA7 to PA0)
(Initial value)
Rev. 2.0, 06/04, page 425 of 980
11.2.8
Next Data Enable Register B (NDERB)
NDERB is an 8-bit readable/writable register that enables or disables TPC output groups 3 and 2
(TP15 to TP8) on a bit-by-bit basis.
Bit
7
6
4
5
3
2
1
NDER15 NDER14 NDER13 NDER12 NDER11 NDER10 NDER9
0
NDER8
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Next data enable 15 to 8
These bits enable or disable
TPC output groups 3 and 2
If a bit is enabled for TPC output by NDERB, then when the 16-bit timer compare match event
selected in the TPC output control register (TPCR) occurs, the NDRB value is automatically
transferred to the corresponding PBDR bit, updating the output value. If TPC output is disabled,
the bit value is not transferred from NDRB to PBDR and the output value does not change.
NDERB is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bits 7 to 0—Next Data Enable 15 to 8 (NDER15 to NDER8): These bits enable or disable TPC
output groups 3 and 2 (TP15 to TP8) on a bit-by-bit basis.
Bits 7 to 0
NDER15 to NDER8
Description
0
TPC outputs TP15 to TP8 are disabled
(NDR15 to NDR8 are not transferred to PB7 to PB0)
1
TPC outputs TP15 to TP8 are enabled
(NDR15 to NDR8 are transferred to PB7 to PB0)
Rev. 2.0, 06/04, page 426 of 980
(Initial value)
11.2.9
TPC Output Control Register (TPCR)
TPCR is an 8-bit readable/writable register that selects output trigger signals for TPC outputs on a
group-by-group basis.
Bit
7
6
5
4
3
2
1
0
G3CMS1 G3CMS0 G2CMS1 G2CMS0 G1CMS1 G1CMS0 G0CMS1 G0CMS0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Group 3 compare
match select 1 and 0
These bits select
the compare match
Group 2 compare
event that triggers
match select 1 and 0
TPC output group 3
These bits select
(TP15 to TP12)
the compare match
Group 1 compare
event that triggers
TPC output group 2 match select 1 and 0
These bits select
(TP11 to TP8)
the compare match
Group 0 compare
event that triggers
match select 1 and 0
TPC output group 1
These bits select
(TP7 to TP4)
the compare match
event that triggers
TPC output group 0
(TP3 to TP0)
TPCR is initialized to H'FF by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Rev. 2.0, 06/04, page 427 of 980
Bits 7 and 6—Group 3 Compare Match Select 1 and 0 (G3CMS1, G3CMS0): These bits
select the compare match event that triggers TPC output group 3 (TP15 to TP12).
Bit 7
G3CMS1
Bit 6
G3CMS0
0
0
TPC output group 3 (TP15 to TP12) is triggered by compare match in 16-bit
timer channel 0
1
TPC output group 3 (TP15 to TP12) is triggered by compare match in 16-bit
timer channel 1
0
TPC output group 3 (TP15 to TP12) is triggered by compare match in 16-bit
timer channel 2
1
TPC output group 3 (TP15 to TP12) is triggered by
compare match in 16-bit timer channel 2
1
Description
(Initial value)
Bits 5 and 4—Group 2 Compare Match Select 1 and 0 (G2CMS1, G2CMS0): These bits
select the compare match event that triggers TPC output group 2 (TP11 to TP8).
Bit 5
G2CMS1
Bit 4
G2CMS0
0
0
TPC output group 2 (TP11 to TP8) is triggered by compare match in 16-bit
timer channel 0
1
TPC output group 2 (TP11 to TP8) is triggered by compare match in 16-bit
timer channel 1
0
TPC output group 2 (TP11 to TP8) is triggered by compare match in 16-bit
timer channel 2
1
TPC output group 2 (TP11 to TP8) is triggered by
compare match in 16-bit timer channel 2
1
Description
Rev. 2.0, 06/04, page 428 of 980
(Initial value)
Bits 3 and 2—Group 1 Compare Match Select 1 and 0 (G1CMS1, G1CMS0): These bits
select the compare match event that triggers TPC output group 1 (TP7 to TP4).
Bit 3
G1CMS1
Bit 2
G1CMS0
0
0
TPC output group 1 (TP7 to TP4) is triggered by compare match in 16-bit
timer channel 0
1
TPC output group 1 (TP7 to TP4) is triggered by compare match in 16-bit
timer channel 1
0
TPC output group 1 (TP7 to TP4) is triggered by compare match in 16-bit
timer channel 2
1
TPC output group 1 (TP7 to TP4) is triggered by
compare match in 16-bit timer channel 2
1
Description
(Initial value)
Bits 1 and 0—Group 0 Compare Match Select 1 and 0 (G0CMS1, G0CMS0): These bits
select the compare match event that triggers TPC output group 0 (TP3 to TP0).
Bit 1
G0CMS1
Bit 0
G0CMS0
0
0
TPC output group 0 (TP3 to TP0) is triggered by compare match in 16-bit
timer channel 0
1
TPC output group 0 (TP3 to TP0) is triggered by compare match in 16-bit
timer channel 1
0
TPC output group 0 (TP3 to TP0) is triggered by compare match in 16-bit
timer channel 2
1
TPC output group 0 (TP3 to TP0) is triggered by
compare match in 16-bit timer channel 2
1
Description
(Initial value)
Rev. 2.0, 06/04, page 429 of 980
11.2.10 TPC Output Mode Register (TPMR)
TPMR is an 8-bit readable/writable register that selects normal or non-overlapping TPC output for
each group.
Bit
7
6
5
4
—
—
—
—
Initial value
1
1
1
1
0
0
0
0
Read/Write
—
—
—
—
R/W
R/W
R/W
R/W
3
2
G3NOV G2NOV
1
0
G1NOV G0NOV
Reserved bits
Group 3 non-overlap
Selects non-overlapping TPC
output for group 3 (TP15 to TP12)
Group 2 non-overlap
Selects non-overlapping TPC
output for group 2 (TP11 to TP8 )
Group 1 non-overlap
Selects non-overlapping TPC
output for group 1 (TP7 to TP4 )
Group 0 non-overlap
Selects non-overlapping TPC
output for group 0 (TP3 to TP0 )
The output trigger period of a non-overlapping TPC output waveform is set in general register B
(GRB) in the 16-bit timer channel selected for output triggering. The non-overlap margin is set in
general register A (GRA). The output values change at compare match A and B. For details see
section 11.3.4, Non-Overlapping TPC Output.
TPMR is initialized to H'F0 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bits 7 to 4—Reserved: These bits cannot be modified and are always read as 1.
Rev. 2.0, 06/04, page 430 of 980
Bit 3—Group 3 Non-Overlap (G3NOV): Selects normal or non-overlapping TPC output for
group 3 (TP15 to TP12).
Bit 3
G3NOV
Description
0
Normal TPC output in group 3 (output values change at
compare match A in the selected 16-bit timer channel)
1
Non-overlapping TPC output in group 3 (independent 1 and 0 output at
compare match A and B in the selected 16-bit timer channel)
(Initial value)
Bit 2—Group 2 Non-Overlap (G2NOV): Selects normal or non-overlapping TPC output for
group 2 (TP11 to TP8).
Bit 2
G2NOV
Description
0
Normal TPC output in group 2 (output values change at
compare match A in the selected 16-bit timer channel)
1
Non-overlapping TPC output in group 2 (independent 1 and 0 output at
compare match A and B in the selected 16-bit timer channel)
(Initial value)
Bit 1—Group 1 Non-Overlap (G1NOV): Selects normal or non-overlapping TPC output for
group 1 (TP7 to TP4).
Bit 1
G1NOV
Description
0
Normal TPC output in group 1 (output values change at
compare match A in the selected 16-bit timer channel)
1
Non-overlapping TPC output in group 1 (independent 1 and 0 output at
compare match A and B in the selected 16-bit timer channel)
(Initial value)
Bit 0—Group 0 Non-Overlap (G0NOV): Selects normal or non-overlapping TPC output for
group 0 (TP3 to TP0).
Bit 0
G0NOV
Description
0
Normal TPC output in group 0 (output values change at
compare match A in the selected 16-bit timer channel)
1
Non-overlapping TPC output in group 0 (independent 1 and 0 output at
compare match A and B in the selected 16-bit timer channel)
(Initial value)
Rev. 2.0, 06/04, page 431 of 980
11.3
Operation
11.3.1
Overview
When corresponding bits in PADDR or PBDDR and NDERA or NDERB are set to 1, TPC output
is enabled. The TPC output initially consists of the corresponding PADR or PBDR contents.
When a compare-match event selected in TPCR occurs, the corresponding NDRA or NDRB bit
contents are transferred to PADR or PBDR to update the output values.
Figure 11.2 illustrates the TPC output operation. Table 11.3 summarizes the TPC operating
conditions.
DDR
NDER
Q
Q
Output trigger signal
C
Q
DR
D
Q NDR
D
Internal
data bus
TPC output pin
Figure 11.2 TPC Output Operation
Table 11.3 TPC Operating Conditions
NDER
DDR
Pin Function
0
0
Generic input port
1
Generic output port
1
0
Generic input port (but the DR bit is a read-only bit, and when compare
match occurs, the NDR bit value is transferred to the DR bit)
1
TPC pulse output
Sequential output of up to 16-bit patterns is possible by writing new output data to NDRA and
NDRB before the next compare match. For information on non-overlapping operation, see
section 11.3.4, Non-Overlapping TPC Output.
Rev. 2.0, 06/04, page 432 of 980
11.3.2
Output Timing
If TPC output is enabled, NDRA/NDRB contents are transferred to PADR/PBDR and output
when the selected compare match event occurs. Figure 11.3 shows the timing of these operations
for the case of normal output in groups 2 and 3, triggered by compare match A.
φ
TCNT
N
GRA
N+1
N
Compare
match A signal
NDRB
n
PBDR
m
n
TP8 to TP15
m
n
Figure 11.3 Timing of Transfer of Next Data Register Contents and Output (Example)
Rev. 2.0, 06/04, page 433 of 980
11.3.3
Normal TPC Output
Sample Setup Procedure for Normal TPC Output: Figure 11.4 shows a sample procedure for
setting up normal TPC output.
Normal TPC output
16-bit timer
setup
Port and
TPC setup
16-bit timer
setup
Select GR functions
1
Set GRA value
2
Select counting operation
3
Select interrupt request
4
Set initial output data
5
Select port output
6
Enable TPC output
7
Select TPC output trigger
8
Set next TPC output data
9
Start counter
10
Compare match?
1.
Set TIOR to make GRA an output compare
register (with output inhibited).
2. Set the TPC output trigger period.
3. Select the counter clock source with bits
TPSC2 to TPSC0 in TCR. Select the counter
clear source with bits CCLR1 and CCLR0.
4. Enable the IMFA interrupt in TISRA.
The DMAC can also be set up to transfer
data to the next data register.
5. Set the initial output values in the DR bits
of the input/output port pins to be used for
TPC output.
6. Set the DDR bits of the input/output port
pins to be used for TPC output to 1.
7. Set the NDER bits of the pins to be used for
TPC output to 1.
8. Select the 16-bit timer compare match event
to be used as the TPC output trigger in TPCR.
9. Set the next TPC output values in the NDR bits.
10. Set the STR bit to 1 in TSTR to start the
timer counter.
11. At each IMFA interrupt, set the next output
values in the NDR bits.
No
Yes
Set next TPC output data
11
Figure 11.4 Setup Procedure for Normal TPC Output (Example)
Rev. 2.0, 06/04, page 434 of 980
Example of Normal TPC Output (Example of Five-Phase Pulse Output): Figure 11.5 shows
an example in which the TPC is used for cyclic five-phase pulse output.
TCNT value
Compare match
TCNT
GRA
Time
H'0000
NDRB
80
PBDR
00
C0
80
40
C0
60
40
20
60
30
20
10
30
18
10
08
18
88
08
80
88
C0
80
40
C0
TP15
TP14
TP13
TP12
TP11
•
•
•
•
The 16-bit timer channel to be used as the output trigger channel is set up so that GRA is an output
compare register and the counter will be cleared by compare match A. The trigger period is set in GRA.
The IMIEA bit is set to 1 in TISRA to enable the compare match A interrupt.
H'F8 is written in PBDDR and NDERB, and bits G3CMS1, G3CMS0, G2CMS1, and G2CMS0 are set in
TPCR to select compare match in the 16-bit timer channel set up in step 1 as the output trigger.
Output data H'80 is written in NDRB.
The timer counter in this 16-bit timer channel is started. When compare match A occurs, the NDRB
contents are transferred to PBDR and output. The compare match/input capture A (IMFA) interrupt
service routine writes the next output data (H'C0) in NDRB.
Five-phase overlapping pulse output (one or two phases active at a time) can be obtained by writing
H'40, H'60, H'20, H'30, H'10, H'18, H'08, H'88… at successive IMFA interrupts. If the DMAC is set for
activation by this interrupt, pulse output can be obtained without loading the CPU.
Figure 11.5 Normal TPC Output Example (Five-Phase Pulse Output)
Rev. 2.0, 06/04, page 435 of 980
11.3.4
Non-Overlapping TPC Output
Sample Setup Procedure for Non-Overlapping TPC Output: Figure 11.6 shows a sample
procedure for setting up non-overlapping TPC output.
Non-overlapping
TPC output
16-bit timer
setup
Port and
TPC setup
16-bit timer
setup
Select GR functions
1
Set GR values
2
Select counting operation
3
Select interrupt requests
4
Set initial output data
5
Set up TPC output
6
Enable TPC transfer
7
Select TPC transfer trigger
8
Select non-overlapping groups
9
Set next TPC output data
10
Start counter
11
Compare match A?
1. Set TIOR to make GRA and GRB output
compare registers (with output inhibited).
2. Set the TPC output trigger period in GRB
and the non-overlap margin in GRA.
3. Select the counter clock source with bits
TPSC2 to TPSC0 in TCR. Select the counter
clear source with bits CCLR1 and CCLR0.
4. Enable the IMFA interrupt in TISRA.
The DMAC can also be set up to transfer
data to the next data register.
5. Set the initial output values in the DR bits
of the input/output port pins to be used for
TPC output.
6. Set the DDR bits of the input/output port pins
to be used for TPC output to 1.
7. Set the NDER bits of the pins to be used for
TPC output to 1.
8. In TPCR, select the 16-bit timer compare match
event to be used as the TPC output trigger.
9. In TPMR, select the groups that will operate
in non-overlap mode.
10. Set the next TPC output values in the NDR
bits.
11. Set the STR bit to 1 in TSTR to start the timer
counter.
12. At each IMFA interrupt, write the next output
value in the NDR bits.
No
Yes
Set next TPC output data
12
Figure 11.6 Setup Procedure for Non-Overlapping TPC Output (Example)
Rev. 2.0, 06/04, page 436 of 980
Example of Non-Overlapping TPC Output (Example of Four-Phase Complementary NonOverlapping Output): Figure 11.7 shows an example of the use of TPC output for four-phase
complementary non-overlapping pulse output.
TCNT value
GRB
TCNT
GRA
H'0000
Time
NDRB
95
PBDR
00
65
95
59
05
65
56
41
59
95
50
56
65
14
95
05
65
Non-overlap margin
TP15
TP14
TP13
TP12
TP11
TP10
TP9
TP8
• The 16-bit timer channel to be used as the output trigger channel is set up so that GRA and GRB are
output compare registers and the counter will be cleared by compare match B. The TPC output trigger
period is set in GRB. The non-overlap margin is set in GRA. The IMIEA bit is set to 1 in TISRA to enable
IMFA interrupts.
• H'FF is written in PBDDR and NDERB, and bits G3CMS1, G3CMS0, G2CMS1, and G2CMS0 are set in
TPCR to select compare match in the 16-bit timer channel set up in step 1 as the output trigger. Bits
G3NOV and G2NOV are set to 1 in TPMR to select non-overlapping output. Output data H'95 is written in
NDRB.
• The timer counter in this 16-bit timer channel is started. When compare match B occurs, outputs change
from 1 to 0. When compare match A occurs, outputs change from 0 to 1 (the change from 0 to 1 is delayed
by the value of GRA). The IMFA interrupt service routine writes the next output data (H'65) in NDRB.
• Four-phase complementary non-overlapping pulse output can be obtained by writing H'59, H'56, H'95…
at successive IMFA interrupts. If the DMAC is set for activation by this interrupt, pulse output can be
obtained without loading the CPU.
Figure 11.7 Non-Overlapping TPC Output Example (Four-Phase Complementary
Non-Overlapping Pulse Output)
Rev. 2.0, 06/04, page 437 of 980
11.3.5
TPC Output Triggering by Input Capture
TPC output can be triggered by 16-bit timer input capture as well as by compare match. If GRA
functions as an input capture register in the 16-bit timer channel selected in TPCR, TPC output
will be triggered by the input capture signal. Figure 11.8 shows the timing.
φ
TIOC pin
Input capture
signal
N
NDR
M
DR
N
Figure 11.8 TPC Output Triggering by Input Capture (Example)
Rev. 2.0, 06/04, page 438 of 980
11.4
Usage Notes
11.4.1
Operation of TPC Output Pins
TP0 to TP15 are multiplexed with 16-bit timer, DMAC, address bus, and other pin functions. When
16-bit timer, DMAC, or address output is enabled, the corresponding pins cannot be used for TPC
output. The data transfer from NDR bits to DR bits takes place, however, regardless of the usage
of the pin.
Pin functions should be changed only under conditions in which the output trigger event will not
occur.
11.4.2
Note on Non-Overlapping Output
During non-overlapping operation, the transfer of NDR bit values to DR bits takes place as
follows.
1. NDR bits are always transferred to DR bits at compare match A.
2.
At compare match B, NDR bits are transferred only if their value is 0. Bits are not transferred
if their value is 1.
Figure 11.9 illustrates the non-overlapping TPC output operation.
DDR
NDER
Q
Q
Compare match A
Compare match B
C
Q
DR
D
Q NDR
D
TPC output pin
Figure 11.9 Non-Overlapping TPC Output
Rev. 2.0, 06/04, page 439 of 980
Therefore, 0 data can be transferred ahead of 1 data by making compare match B occur before
compare match A. NDR contents should not be altered during the interval from compare match B
to compare match A (the non-overlap margin).
This can be accomplished by having the IMFA interrupt service routine write the next data in
NDR, or by having the IMFA interrupt activate the DMAC. The next data must be written before
the next compare match B occurs.
Figure 11.10 shows the timing relationships.
Compare
match A
Compare
match B
NDR write
NDR write
NDR
DR
0 output
0/1 output
0 output
Write to NDR
in this interval
Do not write
to NDR in this
interval
0/1 output
Write to NDR
in this interval
Do not write
to NDR in this
interval
Figure 11.10 Non-Overlapping Operation and NDR Write Timing
Rev. 2.0, 06/04, page 440 of 980
Section 12 Watchdog Timer
12.1
Overview
The H8/3029 has an on-chip watchdog timer (WDT). The WDT has two selectable functions: it
can operate as a watchdog timer to supervise system operation, or it can operate as an interval
timer. As a watchdog timer, it generates a reset signal for the H8/3029 chip if a system crash
allows the timer counter (TCNT) to overflow before being rewritten. In interval timer operation,
an interval timer interrupt is requested at each TCNT overflow.
12.1.1
Features
WDT features are listed below.
• Selection of eight counter clock sources
φ/2, φ /32, φ /64, φ /128, φ /256, φ /512, φ /2048, or φ /4096
• Interval timer option
• Timer counter overflow generates a reset signal or interrupt.
The reset signal is generated in watchdog timer operation. An interval timer interrupt is
generated in interval timer operation.
• Watchdog timer reset signal resets the entire H8/3029 internally.
The reset signal generated by timer counter overflow during watchdog timer operation resets
the entire H8/3029 internally.
Rev. 2.0, 06/04, page 441 of 980
12.1.2
Block Diagram
Figure 12.1 shows a block diagram of the WDT.
Overflow
TCNT
Interrupt signal
Interrupt
control
(interval timer)
TCSR
Reset control
Internal
data bus
Internal clock sources
φ/2
RSTCSR
Reset
(internal)
Read/
write
control
φ/32
φ/64
Clock
Clock
selector
φ/128
φ/256
φ/512
Legend
TCNT:
Timer counter
TCSR:
Timer control/status register
RSTCSR: Reset control/status register
φ/2048
φ/4096
Figure 12.1 WDT Block Diagram
12.1.3
Register Configuration
Table 12.1 summarizes the WDT registers.
Table 12.1 WDT Registers
Address*
Write*
2
1
Read
Name
H'FFF8C H'FFF8C Timer control/status register
H'FFF8D Timer counter
H'FFF8E H'FFF8F Reset control/status register
Abbreviation
R/W
TCSR
R/(W)*
TCNT
R/W
RSTCSR
Notes: *1 Lower 20 bits of the address in advanced mode.
*2 Write word data starting at this address.
*3 Only 0 can be written in bit 7, to clear the flag.
Rev. 2.0, 06/04, page 442 of 980
R/(W)*
Initial Value
3
H'18
H'00
3
H'3F
12.2
Register Descriptions
12.2.1
Timer Counter (TCNT)
TCNT is an 8-bit readable and writable up-counter.
Bit
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: TCNT is write-protected by a password. For details see section 12.2.4, Notes on Register
Access.
When the TME bit is set to 1 in TCSR, TCNT starts counting pulses generated from an internal
clock source selected by bits CKS2 to CKS0 in TCSR. When the count overflows (changes from
H'FF to H'00), the OVF bit is set to 1 in TCSR. TCNT is initialized to H'00 by a reset and when
the TME bit is cleared to 0.
Rev. 2.0, 06/04, page 443 of 980
12.2.2
Timer Control/Status Register (TCSR)
TCSR is an 8-bit readable and writable register. Its functions include selecting the timer mode
and clock source.
Bit
Initial value
Read/Write
7
6
5
4
3
2
1
0
OVF
WT/IT
TME
—
—
CKS2
CKS1
CKS0
0
0
1
1
0
0
0
R/W
R/W
—
—
R/W
R/W
R/W
0
R/(W)
*
Clock select
These bits select the
TCNT clock source
Reserved bits
Timer enable
Selects whether TCNT runs or halts
Timer mode select
Selects the mode
Overflow flag
Status flag indicating overflow
Notes: TCSR is write-protected by a password. For details see section 12.2.4, Notes on Register
Access.
* Only 0 can be written, to clear the flag.
Bits 7 to 5 are initialized to 0 by a reset and in standby mode. Bits 2 to 0 are initialized to 0 by a
reset. In software standby mode bits 2 to 0 are not initialized, but retain their previous values.
Rev. 2.0, 06/04, page 444 of 980
Bit 7—Overflow Flag (OVF): This status flag indicates that the timer counter has overflowed
from H'FF to H'00.
Bit 7
OVF
0
1
Description
[Clearing condition]
Cleared by reading OVF when OVF = 1, then writing 0 in OVF
(Initial value)
[Setting condition]
Set when TCNT changes from H'FF to H'00
IT):
Bit 6—Timer Mode Select (WT/IT
IT Selects whether to use the WDT as a watchdog timer or
interval timer. If used as an interval timer, the WDT generates an interval timer interrupt request
when TCNT overflows. If used as a watchdog timer, the WDT generates a reset signal when
TCNT overflows.
Bit 6
WT/IT
IT
Description
0
Interval timer: requests interval timer interrupts
1
Watchdog timer: generates a reset signal
(Initial value)
Bit 5—Timer Enable (TME): Selects whether TCNT runs or is halted. When WT/IT = 1, clear
the software standby bit (SSBY) to 0 in SYSCR before setting TME. When setting SSBY to 1,
TME should be cleared to 0.
Bit 5
TME
Description
0
TCNT is initialized to H'00 and halted
1
TCNT is counting
(Initial value)
Bits 4 and 3—Reserved: These bits cannot be modified and are always read as 1.
Rev. 2.0, 06/04, page 445 of 980
Bits 2 to 0—Clock Select 2 to 0 (CKS2/1/0): These bits select one of eight internal clock
sources, obtained by prescaling the system clock (φ), for input to TCNT.
Bit 2
CKS2
Bit 1
CKS1
Bit 0
CKS0
Description
0
0
0
φ/2
1
φ /32
0
φ /64
1
φ /128
0
φ /256
1
φ /512
0
φ /2048
1
φ /4096
1
1
0
1
12.2.3
(Initial value)
Reset Control/Status Register (RSTCSR)
RSTCSR is an 8-bit readable and writable register that indicates when a reset signal has been
generated by watchdog timer overflow, and controls external output of the reset signal.
Bit
7
6
5
4
3
2
1
0
WRST
—
—
—
—
—
—
—
Initial value
0
0
1
1
1
1
1
1
Read/Write
R/(W)*
R/W
—
—
—
—
—
—
Reserved bits
Watchdog timer reset
Indicates that a reset signal has been generated
Notes: RSTCSR is write-protected by a password. For details see section 12.2.4, Notes on
Register Access.
* Only 0 can be written in bit 7, to clear the flag.
Bits 7 and 6 are initialized by input of a reset signal at the RES pin. They are not initialized by
reset signals generated by watchdog timer overflow.
Rev. 2.0, 06/04, page 446 of 980
Bit 7—Watchdog Timer Reset (WRST): During watchdog timer operation, this bit indicates that
TCNT has overflowed and generated a reset signal. This reset signal resets the entire H8/3029
chip internally.
Bit 7
WRST
0
1
Description
[Clearing condition]
Reset signal at RES pin.
Read WRST when WRST =1, then write 0 in WRST.
(Initial value)
[Setting condition]
Set when TCNT overflow generates a reset signal during watchdog timer operation
Bit 6—Reserved: The write value should always be 0.
Bits 5 to 0—Reserved: These bits are always read as 1. The write value should always be 1.
12.2.4
Notes on Register Access
The watchdog timer’s TCNT, TCSR, and RSTCSR registers differ from other registers in being
more difficult to write. The procedures for writing and reading these registers are given below.
Writing to TCNT and TCSR: These registers must be written by a word transfer instruction.
They cannot be written by byte instructions. Figure 12.2 shows the format of data written to
TCNT and TCSR. TCNT and TCSR both have the same write address. The write data must be
contained in the lower byte of the written word. The upper byte must contain H'5A (password for
TCNT) or H'A5 (password for TCSR). This transfers the write data from the lower byte to TCNT
or TCSR.
15
TCNT write
Address
H'FFF8C *
8 7
H'5A
15
TCSR write
Address
H'FFF8C *
0
Write data
8 7
H'A5
0
Write data
Note: * Lower 20 bits of the address in advanced mode.
Figure 12.2 Format of Data Written to TCNT and TCSR
Rev. 2.0, 06/04, page 447 of 980
Writing to RSTCSR: RSTCSR must be written by a word transfer instruction. It cannot be
written by byte transfer instructions. Figure 12.3 shows the format of data written to RSTCSR. To
write 0 in the WRST bit, the write data must have H'A5 in the upper byte and H'00 in the lower
byte. The data (H'00) in the lower byte is written to RSTCSR, clearing the WRST bit to 0.
Writing 0 in WRST bit
Address
H'FFF8E*
15
8 7
H'A5
0
H'00
Note: * Lower 20 bits of the address in advanced mode.
Figure 12.3 Format of Data Written to RSTCSR
Reading TCNT, TCSR, and RSTCSR: These registers are read like other registers. Reading
TCNT, TCSR, and RSTCSR: These registers are read like other registers. Byte transfer
instructions can be used. The read addresses are H'FFF8C for TCSR, H'FFF8D for TCNT, and
H'FFF8F for RSTCSR, as listed in table 12.2.
Table 12.2 Read Addresses of TCNT, TCSR, and RSTCSR
Address*
Register
H'FFF8C
TCSR
H'FFF8D
TCNT
H'FFF8F
RSTCSR
Note:
*
Lower 20 bits of the address in advanced mode.
Rev. 2.0, 06/04, page 448 of 980
12.3
Operation
Operations when the WDT is used as a watchdog timer and as an interval timer are described
below.
12.3.1
Watchdog Timer Operation
Figure 12.4 illustrates watchdog timer operation. To use the WDT as a watchdog timer, set the
WT/IT and TME bits to 1 in TCSR. Software must prevent TCNT overflow by rewriting the
TCNT value (normally by writing H'00) before overflow occurs. If TCNT fails to be rewritten and
overflows due to a system crash etc., the H8/3029 is internally reset for a duration of 518 states.
A watchdog reset has the same vector as a reset generated by input at the RES pin. Software can
distinguish a RES reset from a watchdog reset by checking the WRST bit in RSTCSR.
If a RES reset and a watchdog reset occur simultaneously, the RES reset takes priority.
WDT overflow
H'FF
TME set to 1
TCNT count
value
H'00
OVF = 1
Start
Internal
reset signal
H'00 written
in TCNT
Reset
H'00 written
in TCNT
518 states
Figure 12.4 Operation in Watchdog Timer Mode
Rev. 2.0, 06/04, page 449 of 980
12.3.2
Interval Timer Operation
Figure 12.5 illustrates interval timer operation. To use the WDT as an interval timer, clear bit
WT/IT to 0 and set bit TME to 1 in TCSR. An interval timer interrupt request is generated at each
TCNT overflow. This function can be used to generate interval timer interrupts at regular
intervals.
H'FF
TCNT
count value
Time t
H'00
WT/ IT = 0
TME = 1
Interval
timer
interrupt
Interval
timer
interrupt
Interval
timer
interrupt
Interval
timer
interrupt
Figure 12.5 Interval Timer Operation
Rev. 2.0, 06/04, page 450 of 980
12.3.3
Timing of Setting of Overflow Flag (OVF)
Figure 12.6 shows the timing of setting of the OVF flag. The OVF flag is set to 1 when TCNT
overflows. At the same time, a reset signal is generated in watchdog timer operation, or an interval
timer interrupt is generated in interval timer operation.
φ
TCNT
H'FF
H'00
Overflow signal
OVF
Figure 12.6 Timing of Setting of OVF
Rev. 2.0, 06/04, page 451 of 980
12.3.4
Timing of Setting of Watchdog Timer Reset Bit (WRST)
The WRST bit in RSTCSR is valid when bits WT/IT and TME are both set to 1 in TCSR.
Figure 12.7 shows the timing of setting of WRST and the internal reset timing. The WRST bit is
set to 1 when TCNT overflows and OVF is set to 1. At the same time an internal reset signal is
generated for the entire H8/3029 chip. This internal reset signal clears OVF to 0, but the WRST
bit remains set to 1. The reset routine must therefore clear the WRST bit.
φ
H'FF
TCNT
H'00
Overflow signal
OVF
WDT internal
reset
WRST
Figure 12.7 Timing of Setting of WRST Bit and Internal Reset
Rev. 2.0, 06/04, page 452 of 980
12.4
Interrupts
During interval timer operation, an overflow generates an interval timer interrupt (WOVI). The
interval timer interrupt is requested whenever the OVF bit is set to 1 in TCSR.
12.5
Usage Notes
Contention between TCNT Write and Increment: If a timer counter clock pulse is generated
during the T3 state of a write cycle to TCNT, the write takes priority and the timer count is not
incremented. See figure 12.8.
CPU: TCNT write cycle
T1
T2
T3
φ
TCNT
Internal write
signal
TCNT input
clock
TCNT
N
M
Counter write data
Figure 12.8 Contention between TCNT Write and Count up
Changing CKS2 to CKS0 Bit: Halt TCNT by clearing the TME bit to 0 in TCSR before
changing the values of bits CKS2 to CKS0.
Rev. 2.0, 06/04, page 453 of 980
Rev. 2.0, 06/04, page 454 of 980
Section 13 Serial Communication Interface
13.1
Overview
The H8/3029 has a serial communication interface (SCI) with three independent channels. All
three channels have identical functions. The SCI can communicate in both asynchronous and
synchronous mode. It also has a multiprocessor communication function for serial
communication among two or more processors.
When the SCI is not used, it can be halted to conserve power. Each SCI channel can be halted
independently. For details, see section 20.6, Module Standby Function.
The SCI also has a smart card interface function conforming to the ISO/IEC 7816-3 (Identification
Card) standard. This function supports serial communication with a smart card. Switching
between the normal serial communication interface and the smart card interface is carried out by
means of a register setting.
13.1.1
Features
SCI features are listed below.
• Selection of synchronous or asynchronous mode for serial communication
Asynchronous mode
Serial data communication is synchronized one channel at a time. The SCI can communicate
with a universal asynchronous receiver/transmitter (UART), asynchronous communication
interface adapter (ACIA), or other chip that employs standard asynchronous communication.
It can also communicate with two or more other processors using the multiprocessor
communication function. There are 12 selectable serial data transfer formats.
 Data length:
7 or 8 bits
 Stop bit length:
1 or 2 bits
 Parity:
even/odd/none
 Multiprocessor bit:
1 or 0
 Receive error detection:
parity, overrun, and framing errors
 Break detection:
by reading the RxD level directly when a framing error occurs
Synchronous mode
Serial data communication is synchronized with a clock signal. The SCI can communicate
with other chips having a synchronous communication function.
There is a single serial data communication format.
 Data length:
8 bits
 Receive error detection:
overrun errors
Rev. 2.0, 06/04, page 455 of 980
• Full-duplex communication
The transmitting and receiving sections are independent, so the SCI can transmit and receive
simultaneously. The transmitting and receiving sections are both double-buffered, so serial
data can be transmitted and received continuously.
• The following settings can be made for the serial data to be transferred:
 LSB-first or MSB-first transfer
 Inversion of data logic level
• Built-in baud rate generator with selectable bit rates
• Selectable transmit/receive clock sources: internal clock from baud rate generator, or external
clock from the SCK pin
• Four types of interrupts
Transmit-data-empty, transmit-end, receive-data-full, and receive-error interrupts are
requested independently. The transmit-data-empty and receive-data-full interrupts from SCI0
can activate the DMA controller (DMAC) to transfer data.
Features of the smart card interface are listed below.
• Asynchronous communication
 Data length: 8 bits
 Parity bits generated and checked
 Error signal output in receive mode (parity error)
 Error signal detect and automatic data retransmit in transmit mode
 Supports both direct convention and inverse convention
• Built-in baud rate generator with selectable bit rates
• Three types of interrupts
Transmit-data-empty, receive-data-full, and transmit/receive-error interrupts are requested
independently. The transmit-data-empty and receive-data-full interrupts can activate the DMA
controller (DMAC) to transfer data.
Rev. 2.0, 06/04, page 456 of 980
13.1.2
Block Diagram
Bus interface
Figure 13.1 shows a block diagram of the SCI.
Module data bus
RDR
TDR
SSR
BRR
SCR
RxD
TxD
RSR
TSR
φ
SMR
Baud rate
generator
SCMR
Transmit/receive
control
Parity generate
Parity check
SCK
Internal data bus
φ/ 4
φ/16
φ/64
Clock
External clock
TEI
TXI
RXI
ERI
Legend
RSR : Receive shift register
RDR : Receive data register
TSR : Transmit shift register
TDR : Transmit data register
SMR : Serial mode register
SCR : Serial control register
SSR : Serial status register
BRR : Bit rate register
SCMR : Smart card mode register
Figure 13.1 SCI Block Diagram
Rev. 2.0, 06/04, page 457 of 980
13.1.3
Input/Output Pins
The SCI has serial pins for each channel as listed in table 13.1.
Table 13.1 SCI Pins
Channel Name
Abbreviation
I/O
Function
0
Serial clock pin
SCK0
Input/output
SCI0 clock input/output
Receive data pin
RxD0
Input
SCI0 receive data input
Transmit data pin
TxD0
Output
SCI0 transmit data output
Serial clock pin
SCK1
Input/output
SCI1 clock input/output
Receive data pin
RxD1
Input
SCI1 receive data input
1
2
Transmit data pin
TxD1
Output
SCI1 transmit data output
Serial clock pin
SCK2
Input/output
SCI2 clock input/output
Receive data pin
RxD2
Input
SCI2 receive data input
Transmit data pin
TxD2
Output
SCI2 transmit data output
Rev. 2.0, 06/04, page 458 of 980
13.1.4
Register Configuration
The SCI has internal registers as listed in table 13.2. These registers select asynchronous or
synchronous mode, specify the data format and bit rate, control the transmitter and receiver
sections, and specify switching between the serial communication interface and smart card
interface.
Table 13.2 SCI Registers
Channel
Address*
0
1
2
1
Name
Abbreviation
R/W
Initial Value
H'FFFB0
Serial mode register
SMR
R/W
H'00
H'FFFB1
Bit rate register
BRR
R/W
H'FF
H'FFFB2
Serial control register
SCR
R/W
H'00
H'FFFB3
Transmit data register
TDR
R/W
H'FF
2
H'FFFB4
Serial status register
SSR
R/(W)* H'84
H'FFFB5
Receive data register
RDR
R
H'00
H'FFFB6
Smart card mode register
SCMR
R/W
H'F2
H'FFFB8
Serial mode register
SMR
R/W
H'00
H'FFFB9
Bit rate register
BRR
R/W
H'FF
H'FFFBA
Serial control register
SCR
R/W
H'00
H'FFFBB
Transmit data register
TDR
R/W
H'FF
2
H'FFFBC
Serial status register
SSR
R/(W)* H'84
H'FFFBD
Receive data register
RDR
R
H'00
H'FFFBE
Smart card mode register
SCMR
R/W
H'F2
H'FFFC0
Serial mode register
SMR
R/W
H'00
H'FFFC1
Bit rate register
BRR
R/W
H'FF
H'FFFC2
Serial control register
SCR
R/W
H'00
H'FFFC3
Transmit data register
TDR
R/W
H'FF
2
H'FFFC4
Serial status register
SSR
R/(W)* H'84
H'FFFC5
Receive data register
RDR
R
H'00
H'FFFC6
Smart card mode register
SCMR
R/W
H'F2
Notes: *1 Indicates the lower 20 bits of the address in advanced mode.
*2 Only 0 can be written, to clear flags.
Rev. 2.0, 06/04, page 459 of 980
13.2
Register Descriptions
13.2.1
Receive Shift Register (RSR)
RSR is the register that receives serial data.
7
Bit
5
6
4
3
2
1
0
Read/Write
The SCI loads serial data input at the RxD pin into RSR in the order received, LSB (bit 0) first,
thereby converting the data to parallel data. When one byte of data has been received, it is
automatically transferred to RDR. The CPU cannot read or write RSR directly.
13.2.2
Receive Data Register (RDR)
RDR is the register that stores received serial data.
Bit
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
When the SCI has received one byte of serial data, it transfers the received data from RSR into
RDR for storage, completing the receive operation. RSR is then ready to receive the next data.
This double-buffering allows data to be received continuously.
RDR is a read-only register. Its contents cannot be modified by the CPU. RDR is initialized to
H'00 by a reset and in standby mode.
Rev. 2.0, 06/04, page 460 of 980
13.2.3
Transmit Shift Register (TSR)
TSR is the register that transmits serial data.
Bit
7
6
5
4
3
2
1
0
Read/Write
The SCI loads transmit data from TDR to TSR, then transmits the data serially from the TxD pin,
LSB (bit 0) first. After transmitting one data byte, the SCI automatically loads the next transmit
data from TDR into TSR and starts transmitting it. If the TDRE flag is set to 1 in SSR, however,
the SCI does not load the TDR contents into TSR. The CPU cannot read or write RSR directly.
13.2.4
Transmit Data Register (TDR)
TDR is an 8-bit register that stores data for serial transmission.
Bit
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
When the SCI detects that TSR is empty, it moves transmit data written in TDR from TDR into
TSR and starts serial transmission. Continuous serial transmission is possible by writing the next
transmit data in TDR during serial transmission from TSR.
The CPU can always read and write TDR. TDR is initialized to H'FF by a reset and in standby
mode.
Rev. 2.0, 06/04, page 461 of 980
13.2.5
Serial Mode Register (SMR)
SMR is an 8-bit register that specifies the SCI's serial communication format and selects the clock
source for the baud rate generator.
7
6
5
4
3
2
1
0
C/A
CHR
PE
O/E
STOP
MP
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
Clock select 1/0
These bits select the
baud rate generator's
clock source
Multiprocessor mode
Selects the multiprocessor
function
Stop bit length
Selects the stop bit length
Parity mode
Selects even or odd parity
Parity enable
Enables or disables the addition of a parity bit
Character length
Selects character length in asynchronous mode
Communication mode
Selects asynchronous or synchronous mode
The CPU can always read and write SMR. SMR is initialized to H'00 by a reset and in standby
mode.
A)/GSM Mode (GM): The function of this bit differs for the
Bit 7—Communication Mode (C/A
normal serial communication interface and for the smart card interface. Its function is switched
with the SMIF bit in SCMR.
Rev. 2.0, 06/04, page 462 of 980
For serial communication interface (SMIF bit in SCMR cleared to 0): Selects whether the SCI
operates in asynchronous or synchronous mode.
Bit 7
C/A
A
Description
0
Asynchronous mode
1
Synchronous mode
(Initial value)
For smart card interface (SMIF bit in SCMR set to 1): Selects GSM mode for the smart card
interface.
Bit 7
GM
Description
0
The TEND flag is set 12.5 etu after the start bit
1
The TEND flag is set 11.0 etu after the start bit
(Initial value)
Note: etu: Elementary time unit (time required to transmit one bit)
Bit 6—Character Length (CHR): Selects 7-bit or 8-bits data length in asynchronous mode. In
synchronous mode, the data length is 8 bits regardless of the CHR setting.
Bit 6
CHR
Description
0
8-bit data
1
7-bit data*
Note:
*
(Initial value)
When 7-bit data is selected, the MSB (bit 7) of TDR is not transmitted.
Bit 5—Parity Enable (PE): In asynchronous mode, this bit enables or disables the addition of a
parity bit to transmit data, and the checking of the parity bit in receive data. In synchronous
mode, the parity bit is neither added nor checked, regardless of the PE bit setting.
Bit 5
PE
Description
0
Parity bit not added or checked
1
Note:
(Initial value)
Parity bit added and checked*
*
When PE bit is set to 1, an even or odd parity bit is added to transmit data according to
the even or odd parity mode selection by the O/E bit, and the parity bit in receive data
is checked to see that it matches the even or odd mode selected by the O/E bit.
Rev. 2.0, 06/04, page 463 of 980
E): Selects even or odd parity. The O/E bit setting is only valid when the
Bit 4—Parity Mode (O/E
PE bit is set to 1, enabling parity bit addition and checking, in asynchronous mode. The O/E bit
setting is ignored in synchronous mode, or when parity addition and checking is disabled in
asynchronous mode.
Bit 4
O/E
E
Description
0
Even parity*
1
2
Odd parity*
1
(Initial value)
Notes: *1 When even parity is selected, the parity bit added to transmit data makes an even
number of 1s in the transmitted character and parity bit combined. Receive data must
have an even number of 1s in the received character and parity bit combined.
*2 When odd parity is selected, the parity bit added to transmit data makes an odd
number of 1s in the transmitted character and parity bit combined. Receive data must
have an odd number of 1s in the received character and parity bit combined.
Bit 3—Stop Bit Length (STOP): Selects one or two stop bits in asynchronous mode. This
setting is used only in asynchronous mode. In synchronous mode no stop bit is added, so the
STOP bit setting is ignored.
Bit 3
STOP
Description
0
1 stop bit*
1
1
2 stop bits*
(Initial value)
2
Notes: *1 One stop bit (with value 1) is added to the end of each transmitted character.
*2 Two stop bits (with value 1) are added to the end of each transmitted character.
In receiving, only the first stop bit is checked, regardless of the STOP bit setting. If the second
stop bit is 1, it is treated as a stop bit. If the second stop bit is 0, it is treated as the start bit of the
next incoming character.
Bit 2—Multiprocessor Mode (MP): Selects a multiprocessor format. When a multiprocessor
format is selected, parity settings made by the PE and O/E bits are ignored. The MP bit setting is
valid only in asynchronous mode. It is ignored in synchronous mode.
For further information on the multiprocessor communication function, see section 13.3.3,
Multiprocessor Communication.
Bit 2
MP
Description
0
Multiprocessor function disabled
1
Multiprocessor format selected
Rev. 2.0, 06/04, page 464 of 980
(Initial value)
Bits 1 and 0—Clock Select 1 and 0 (CKS1/0): These bits select the clock source for the on-chip
baud rate generator. Four clock sources are available: φ, φ/4, φ/16, and φ/64.
For the relationship between the clock source, bit rate register setting, and baud rate, see section
13.2.8, Bit Rate Register (BRR).
Bit 1
CKS1
Bit 0
CKS0
Description
0
0
φ
0
1
φ/4
1
0
φ/16
1
1
φ/64
(Initial value)
Rev. 2.0, 06/04, page 465 of 980
13.2.6
Serial Control Register (SCR)
SCR register enables or disables the SCI transmitter and receiver, enables or disables serial clock
output in asynchronous mode, enables or disables interrupts, and selects the transmit/receive clock
source.
Bit
7
6
5
4
3
2
1
0
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
0
0
0
0
R/W
R/W
R/W
R/W
Initial value
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
Clock enable 1/0
These bits select the
SCI clock source
Transmit-end interrupt enable
Enables or disables transmit-end
interrupts (TEI)
Multiprocessor interrupt enable
Enables or disables multiprocessor
interrupts
Receive enable
Enables or disables the receiver
Transmit enable
Enables or disables the transmitter
Receive interrupt enable
Enables or disables receive-data-full interrupts (RXI) and
receive-error interrupts (ERI)
Transmit interrupt enable
Enables or disables transmit-data-empty interrupts (TXI)
The CPU can always read and write SCR. SCR is initialized to H'00 by a reset and in standby
mode.
Rev. 2.0, 06/04, page 466 of 980
Bit 7—Transmit Interrupt Enable (TIE): Enables or disables the transmit-data-empty interrupt
(TXI) requested when the TDRE flag in SSR is set to 1 due to transfer of serial transmit data from
TDR to TSR.
Bit 7
TIE
Description
0
Transmit-data-empty interrupt request (TXI) is disabled*
1
Note:
(Initial value)
Transmit-data-empty interrupt request (TXI) is enabled
*
TXI interrupt requests can be cleared by reading the value 1 from the TDRE flag, then
clearing it to 0; or by clearing the TIE bit to 0.
Bit 6—Receive Interrupt Enable (RIE): Enables or disables the receive-data-full interrupt (RXI)
requested when the RDRF flag in SSR is set to 1 due to transfer of serial receive data from RSR to
RDR; also enables or disables the receive-error interrupt (ERI).
Bit 6
RIE
Description
0
Receive-data-full (RXI) and receive-error (ERI) interrupt requests are disabled*
(Initial value)
1
Receive-data-full (RXI) and receive-error (ERI) interrupt requests are enabled
Note:
*
RXI and ERI interrupt requests can be cleared by reading the value 1 from the RDRF,
FER, PER, or ORER flag, then clearing the flag to 0; or by clearing the RIE bit to 0.
Bit 5—Transmit Enable (TE): Enables or disables the start of SCI serial transmitting operations.
Bit 5
TE
Description
0
Transmitting disabled*
1
2
Transmitting enabled*
1
(Initial value)
Notes: *1 The TDRE flag is fixed at 1 in SSR.
*2 In the enabled state, serial transmission starts when the TDRE flag in SSR is cleared to
0 after writing of transmit data into TDR. Select the transmit format in SMR before
setting the TE bit to 1.
Rev. 2.0, 06/04, page 467 of 980
Bit 4—Receive Enable (RE): Enables or disables the start of SCI serial receiving operations.
Bit 4
RE
Description
0
Receiving disabled*
1
2
Receiving enabled*
1
(Initial value)
Notes: *1 Clearing the RE bit to 0 does not affect the RDRF, FER, PER, and ORER flags. These
flags retain their previous values.
*2 In the enabled state, serial receiving starts when a start bit is detected in asynchronous
mode, or serial clock input is detected in synchronous mode. Select the receive format
in SMR before setting the RE bit to 1.
Bit 3—Multiprocessor Interrupt Enable (MPIE): Enables or disables multiprocessor interrupts.
The MPIE bit setting is valid only in asynchronous mode, and only if the MP bit is set to 1 in
SMR. The MPIE bit setting is ignored in synchronous mode or when the MP bit is cleared to 0.
Bit 3
MPIE
Description
0
Multiprocessor interrupts are disabled (normal receive operation) (Initial value)
Clearing conditions
(1) The MPIE bit is cleared to 0
(2) MPB = 1 in received data
1
Multiprocessor interrupts are enabled*
Receive-data-full interrupts (RXI), receive-error interrupts (ERI), and setting of
the RDRF, FER, and ORER status flags in SSR are disabled until data with the
multiprocessor bit set to 1 is received.
Note:
*
The SCI does not transfer receive data from RSR to RDR, does not detect receive
errors, and does not set the RDRF, FER, and ORER flags in SSR. When it receives
data in which MPB = 1, the SCI sets the MPB bit to 1 in SSR, automatically clears the
MPIE bit to 0, enables RXI and ERI interrupts (if the TIE and RIE bits in SCR are set to
1), and allows the FER and ORER flags to be set.
Bit 2—Transmit-End interrupt Enable (TEIE): Enables or disables the transmit-end interrupt
(TEI) requested if TDR does not contain valid transmit data when the MSB is transmitted.
Bit 2
TEIE
Description
0
Transmit-end interrupt requests (TEI) are disabled*
1
Transmit-end interrupt requests (TEI) are enabled*
Note:
*
(Initial value)
TEI interrupt requests can be cleared by reading the value 1 from the TDRE flag in
SSR, then clearing the TDRE flag to 0, thereby also clearing the TEND flag to 0; or by
clearing the TEIE bit to 0.
Rev. 2.0, 06/04, page 468 of 980
Bits 1 and 0—Clock Enable 1 and 0 (CKE1/0): The function of these bits differs for the normal
serial communication interface and for the smart card interface. Their function is switched with
the SMIF bit in SCMR.
For serial communication interface (SMIF bit in SCMR cleared to 0): These bits select the
SCI clock source and enable or disable clock output from the SCK pin. Depending on the settings
of CKE1 and CKE0, the SCK pin can be used for generic input/output, serial clock output, or
serial clock input.
The CKE0 setting is valid only in asynchronous mode, and only when the SCI is internally
clocked (CKE1 = 0). The CKE0 setting is ignored in synchronous mode, or when an external
clock source is selected (CKE1 = 1). Select the SCI operating mode in SMR before setting the
CKE1 and CKE0 bits . For further details on selection of the SCI clock source, see table 13.9 in
section 13.3, Operation.
Bit 1 Bit 0
CKE1 CKE0 Description
0
0
1
1
0
1
0
1
Asynchronous mode
Internal clock, SCK pin available for generic input/output*
Synchronous mode
Internal clock, SCK pin used for serial clock output*
1
1
2
Asynchronous mode
Internal clock, SCK pin used for clock output*
Synchronous mode
Internal clock, SCK pin used for serial clock output
Asynchronous mode
External clock, SCK pin used for clock input*
Synchronous mode
External clock, SCK pin used for serial clock input
Asynchronous mode
External clock, SCK pin used for clock input*
Synchronous mode
External clock, SCK pin used for serial clock input
3
3
Notes: *1 Initial value
*2 The output clock frequency is the same as the bit rate.
*3 The input clock frequency is 16 times the bit rate.
Rev. 2.0, 06/04, page 469 of 980
For smart card interface (SMIF bit in SCMR set to 1): These bits, together with the GM bit in
SMR, determine whether the SCK pin is used for generic input/output or as the serial clock output
pin.
SMR
GM
Bit 1 Bit 0
CKE1 CKE0 Description
0
0
0
SCK pin available for generic input/output
0
0
1
SCK pin used for clock output
1
0
0
SCK pin output fixed low
1
0
1
SCK pin used for clock output
1
1
0
SCK pin output fixed high
1
1
1
SCK pin used for clock output
Rev. 2.0, 06/04, page 470 of 980
(Initial value)
13.2.7
Serial Status Register (SSR)
SSR is an 8-bit register containing multiprocessor bit values, and status flags that indicate the
operating status of the SCI.
Bit
Initial value
Read/Write
5
7
6
TDRE
RDRF
1
ORER FER/ERS
0
1
R/(W)*
4
0
1
R/(W)*
0
1
R/(W)*
3
2
1
0
PER
TEND
MPB
MPBT
1
0
0
R
R
R/W
0
1
R/(W)*
1
R/(W)*
Multiprocessor bit
transfer
Value of multiprocessor
bit to be transmitted
Multiprocessor bit
Stores the received
multiprocessor bit value
Transmit end*2
Status flag indicating end of
transmission
Parity error
Status flag indicating detection
of a receive parity error
Framing error (FER)/Error signal status (ERS)*2
Status flag indicating detection of a receive framing
error, or flag indicating detection of an error signal
Overrun error
Status flag indicating detection
of a receive overrun error
Receive data register full
Status flag indicating that data has been received
and stored in RDR
Transmit data register empty
Status flag indicating that transmit data has been transferred from
TDR into TSR and new data can be written in TDR
Notes: *1 Only 0 can be written, to clear the flag.
*2 Function differs between the normal serial communication interface and the smart card interface.
The CPU can always read and write SSR, but cannot write 1 in the TDRE, RDRF, ORER, PER,
and FER flags. These flags can be cleared to 0 only if they have first been read while set to 1.
The TEND and MPB flags are read-only bits that cannot be written.
SSR is initialized to H'84 by a reset and in standby mode.
Rev. 2.0, 06/04, page 471 of 980
Bit 7—Transmit Data Register Empty (TDRE): Indicates that the SCI has loaded transmit data
from TDR into TSR and the next serial data can be written in TDR.
Bit 7
TDRE
Description
0
TDR contains valid transmit data
[Clearing conditions]
Read TDRE when TDRE = 1, then write 0 in TDRE
The DMAC writes data in TDR
1
TDR does not contain valid transmit data
(Initial value)
[Setting conditions]
The chip is reset or enters standby mode
The TE bit in SCR is cleared to 0
TDR contents are loaded into TSR, so new data can be written in TDR
Bit 6—Receive Data Register Full (RDRF): Indicates that RDR contains new receive data.
Bit 6
RDRF
Description
0
RDR does not contain new receive data
[Clearing conditions]
The chip is reset or enters standby mode
Read RDRF when RDRF = 1, then write 0 in RDRF
The DMAC reads data from RDR
(Initial value)
1
RDR contains new receive data
[Setting condition]
Serial data is received normally and transferred from RSR to RDR
Note: The RDR contents and the RDRF flag are not affected by detection of receive errors or by
clearing of the RE bit to 0 in SCR. They retain their previous values. If the RDRF flag is
still set to 1 when reception of the next data ends, an overrun error will occur and the
receive data will be lost.
Rev. 2.0, 06/04, page 472 of 980
Bit 5—Overrun Error (ORER): Indicates that data reception ended abnormally due to an
overrun error.
Bit 5
ORER
Description
1
0
Receiving is in progress or has ended normally*
[Clearing conditions]
The chip is reset or enters standby mode
Read ORER when ORER = 1, then write 0 in ORER
1
A receive overrun error occurred*
[Setting condition]
Reception of the next serial data ends when RDRF = 1
(Initial value)
2
Notes: *1 Clearing the RE bit to 0 in SCR does not affect the ORER flag, which retains its
previous value.
*2 RDR continues to hold the receive data prior to the overrun error, so subsequent
receive data is lost. Serial receiving cannot continue while the ORER flag is set to 1.
In synchronous mode, serial transmitting is also disabled.
Bit 4—Framing Error (FER)/Error Signal Status (ERS): The function of this bit differs for the
normal serial communication interface and for the smart card interface. Its function is switched
with the SMIF bit in SCMR.
For serial communication interface (SMIF bit in SCMR cleared to 0): Indicates that data
reception ended abnormally due to a framing error in asynchronous mode.
Bit 4
FER
Description
1
0
Receiving is in progress or has ended normally*
[Clearing conditions]
The chip is reset or enters standby mode
Read FER when FER = 1, then write 0 in FER
(Initial value)
1
A receive framing error occurred*
[Setting condition]
The stop bit at the end of the receive data is checked and found to be 0
2
Notes: *1 Clearing the RE bit to 0 in SCR does not affect the FER flag, which retains its previous
value.
*2 When the stop bit length is 2 bits, only the first bit is checked. The second stop bit is
not checked. When a framing error occurs the SCI transfers the receive data into RDR
but does not set the RDRF flag. Serial receiving cannot continue while the FER flag is
set to 1. In synchronous mode, serial transmitting is also disabled.
Rev. 2.0, 06/04, page 473 of 980
For smart card interface (SMIF bit in SCMR set to 1): Indicates the status of the error signal
sent back from the receiving side during transmission. Framing errors are not detected in smart
card interface mode.
Bit 4
ERS
Description
0
Normal reception, no error signal*
[Clearing conditions]
The chip is reset or enters standby mode
Read ERS when ERS = 1, then write 0 in ERS
1
An error signal has been sent from the receiving side indicating detection of a
parity error
[Setting condition]
The error signal is low when sampled
Note:
*
(Initial value)
Clearing the TE bit to 0 in SCR does not affect the ERS flag, which retains its previous
value.
Bit 3—Parity Error (PER): Indicates that data reception ended abnormally due to a parity error
in asynchronous mode.
Bit 3
PER
Description
1
0
Receiving is in progress or has ended normally*
[Clearing conditions]
The chip is reset or enters standby mode
Read PER when PER = 1, then write 0 in PER
(Initial value)
1
A receive parity error occurred*
[Setting condition]
The number of 1s in receive data, including the parity bit, does not match the
even or odd parity setting of O/E in SMR
2
Notes: *1 Clearing the RE bit to 0 in SCR does not affect the PER flag, which retains its previous
value.
*2 When a parity error occurs the SCI transfers the receive data into RDR but does not
set the RDRF flag. Serial receiving cannot continue while the PER flag is set to 1. In
synchronous mode, serial transmitting is also disabled.
Bit 2—Transmit End (TEND): The function of this bit differs for the normal serial
communication interface and for the smart card interface. Its function is switched with the SMIF
bit in SCMR.
For serial communication interface (SMIF bit in SCMR cleared to 0): Indicates that when the
last bit of a serial character was transmitted TDR did not contain valid transmit data, so
transmission has ended. The TEND flag is a read-only bit and cannot be written.
Rev. 2.0, 06/04, page 474 of 980
Bit 2
TEND
Description
0
Transmission is in progress
[Clearing conditions]
Read TDRE when TDRE = 1, then write 0 in TDRE
The DMAC writes data in TDR
1
End of transmission
(Initial value)
[Setting conditions]
The chip is reset or enters standby mode
The TE bit in SCR is cleared to 0
TDRE is 1 when the last bit of a 1-byte serial transmit character is transmitted
For smart card interface (SMIF bit in SCMR set to 1): Indicates that when the last bit of a
serial character was transmitted TDR did not contain valid transmit data, so transmission has
ended. The TEND flag is a read-only bit and cannot be written.
Bit 2
TEND
Description
0
Transmission is in progress
[Clearing conditions]
Read TDRE when TDRE = 1, then write 0 in TDRE
The DMAC writes data in TDR
1
End of transmission
(Initial value)
[Setting conditions]
The chip is reset or enters standby mode
The TE bit is cleared to 0 in SCR and the FER/ERS bit is also cleared to 0
TDRE is 1 and FER/ERS is 0 (normal transmission) 2.5 etu (when GM = 0) or
1.0 etu (when GM = 1) after a 1-byte serial character is transmitted
Note: etu: Elementary time unit (time required to transmit one bit)
Bit 1—Multiprocessor bit (MPB): Stores the value of the multiprocessor bit in the receive data
when a multiprocessor format is used in asynchronous mode. MPB is a read-only bit, and cannot
be written.
Bit 1
MPB
Description
0
Multiprocessor bit value in receive data is 0*
1
Multiprocessor bit value in receive data is 1
Note:
*
(Initial value)
If the RE bit in SCR is cleared to 0 when a multiprocessor format is selected, MPB
retains its previous value.
Rev. 2.0, 06/04, page 475 of 980
Bit 0—Multiprocessor Bit Transfer (MPBT): Stores the value of the multiprocessor bit added to
transmit data when a multiprocessor format in selected for transmitting in asynchronous mode.
The MPBT bit setting is ignored in synchronous mode, when a multiprocessor format is not
selected, or when the SCI cannot transmit.
Bit 1
MPBT
Description
0
Multiprocessor bit value in transmit data is 0
1
Multiprocessor bit value in transmit data is 1
13.2.8
(Initial value)
Bit Rate Register (BRR)
BRR is an 8-bit register that, together with the CKS1 and CKS0 bits in SMR that select the baud
rate generator clock source, determines the serial communication bit rate.
Bit
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
The CPU can always read and write BRR. BRR is initialized to H'FF by a reset and in standby
mode. Each SCI channel has independent baud rate generator control, so different values can be
set in the three channels.
Table 13.3 shows examples of BRR settings in asynchronous mode. Table 13.4 shows examples
of BRR settings in synchronous mode.
Rev. 2.0, 06/04, page 476 of 980
Table 13.3 Examples of Bit Rates and BRR Settings in Asynchronous Mode
φ (MHz)
Bit
Rate
(bit/s)
10
n N
Error
(%)
12
n N
Error
(%)
12.288
n N
Error
(%)
13
14
n N
Error
(%)
n N
Error
(%)
110
2 177 –0.25
2 212 0.03
2 217 0.08
2 230
–0.08
2 248
–0.17
150
2 129 0.16
2 155 0.16
2 159 0.00
2 168
0.16
2 181
0.16
300
2 64
2 77
2 79
2 84
–0.43
2 90
0.16
600
1 129 0.16
1 155 0.16
1 159 0.00
1 168
0.16
1 181
0.16
1200
1 64
1 77
1 79
1 84
–0.43
1 90
0.16
2400
0 129 0.16
0 168
0.16
0 181
0.16
4800
0 64
0.16
0 77
0.16
0 79
0.00
0 84
–0.43
0 90
0.16
9600
0 32
–1.36
0 38
0.16
0 39
0.00
0 41
0.76
0 45
–0.93
19200
0 15
1.73
0 19
–2.34
0 19
0.00
0 20
0.76
0 22
–0.93
31250
0 9
0.00
0 11
0.00
0 11
2.40
0 12
0.00
0 13
0.00
38400
0 7
1.73
0 9
–2.34
0 9
0.00
0 10
–3.82
0 10
3.57
0.16
0.16
0.16
0.16
0 155 0.16
0.00
0.00
0 159 0.00
Rev. 2.0, 06/04, page 477 of 980
φ (MHz)
14.7456
16
18
20
25
Bit
Rate
(bit/s)
n N
Error
(%)
n N
Error
(%)
n N
Error
(%)
n N
Error
(%)
n N
Error (%)
110
3 64
0.70
3 70
0.03
3 79
–0.12
3 88
–0.25
3 110
–0.02
150
2 191 0.00
2 207 0.16
2 233 0.16
3 64
0.16
3 80
0.47
300
2 95
0.00
2 103 0.16
2 116 0.16
2 129
0.16
2 162
–0.15
600
1 191 0.00
1 207 0.16
1 233 0.16
2 64
0.16
2 80
0.47
1200
1 95
0.00
1 103 0.16
1 116 0.16
1 129
0.16
1 162
–0.15
2400
0 191 0.00
0 207 0.16
0 233 0.16
1 64
0.16
1 80
0.47
4800
0 95
0.00
0 103 0.16
0 116 0.16
0 129
0.16
0 162
–0.15
9600
0 47
0.00
0 51
0.16
0 58
–0.69
0 64
0.16
0 80
0.47
19200
0 23
0.00
0 25
0.16
0 28
1.02
0 32
–1.36
0 40
–0.76
31250
0 14
–1.70
0 15
0.00
0 17
0.00
0 19
0.00
0 24
0.00
38400
0 11
0.00
0 12
0.16
0 14
–2.34
0 15
1.73
0 19
1.73
Rev. 2.0, 06/04, page 478 of 980
Table 13.4 Examples of Bit Rates and BRR Settings in Synchronous Mode
φ (MHz)
Bit
Rate
10
13
16
18
20
25
(bit/s)
n
N
n
N
n
N
n
N
n
N
n
N
110
—
—
—
—
—
—
—
—
—
—
—
—
250
—
—
3
202
3
249
—
—
—
—
—
—
500
—
—
3
101
3
124
3
140
3
155
—
—
1k
—
—
2
202
2
249
3
69
3
77
3
97
2.5k
1
249
2
80
2
99
2
112
2
124
2
155
5k
1
124
1
162
1
199
1
224
1
249
2
77
10k
0
249
1
80
1
99
1
112
1
124
1
155
25k
0
99
0
129
0
159
0
179
0
199
0
249
50k
0
49
0
64
0
79
0
89
0
99
0
124
100k
0
24
—
—
0
39
0
44
0
49
0
62
250k
0
9
0
12
0
15
0
17
0
19
0
24
500k
0
4
—
—
0
7
0
8
0
9
—
—
1M
—
—
—
—
0
3
0
4
0
4
—
—
2M
—
—
—
—
0
1
—
—
—
—
—
—
2.5M
0
0*
—
—
—
—
—
—
—
—
—
—
0
0*
—
—
—
—
—
—
4M
Note: Settings with an error of 1% or less are recommended.
Legend
Blank : No setting available
—:
Setting possible, but error occurs
*:
Continuous transmission/reception not possible
Rev. 2.0, 06/04, page 479 of 980
The BRR setting is calculated as follows:
Asynchronous mode:
N=
φ
64 × 22n–1 × B
× 106 – 1
Synchronous mode:
N=
B:
N:
φ:
n:
φ
8 × 22n–1 × B
× 106 – 1
Bit rate (bit/s)
BRR setting for baud rate generator (0 ≤ N ≤ 255)
System clock frequency (MHz)
Baud rate generator clock source (n = 0, 1, 2, 3)
(For the clock sources and values of n, see the following table.)
SMR Settings
n
Clock Source
CKS1
CKS0
0
φ
0
0
1
φ/4
0
1
2
φ/16
1
0
3
φ/64
1
1
The bit rate error in asynchronous mode is calculated as follows:
Error (%) =
Rev. 2.0, 06/04, page 480 of 980
φ × 106
(N + 1) × B × 64 × 22n–1
–1
× 100
Table 13.5 shows the maximum bit rates in asynchronous mode for various system clock
frequencies. Table 13.6 and 13.7 shows the maximum bit rates with external clock input.
Table 13.5 Maximum Bit Rates for Various Frequencies (Asynchronous Mode)
Settings
φ (MHz)
Maximum Bit Rate (bit/s)
n
N
10
312500
0
0
12
375000
0
0
12.288
384000
0
0
14
437500
0
0
14.7456
460800
0
0
16
500000
0
0
17.2032
537600
0
0
18
562500
0
0
20
625000
0
0
25
781250
0
0
Table 13.6 Maximum Bit Rates with External Clock Input (Asynchronous Mode)
φ (MHz)
External Input Clock (MHz)
Maximum Bit Rate (bit/s)
10
2.5000
156250
12
3.0000
187500
12.288
3.0720
192000
14
3.5000
218750
14.7456
3.6864
230400
16
4.0000
250000
17.2032
4.3008
268800
18
4.5000
281250
20
5.0000
312500
25
6.2500
390625
Rev. 2.0, 06/04, page 481 of 980
Table 13.7 Maximum Bit Rates with External Clock Input (Synchronous Mode)
φ (MHz)
External Input Clock (MHz)
Maximum Bit Rate (bit/s)
10
1.6667
1666666.7
12
2.0000
2000000.0
14
2.3333
2333333.3
16
2.6667
2666666.7
18
3.0000
3000000.0
20
3.3333
3333333.3
25
4.1667
4166666.7
Rev. 2.0, 06/04, page 482 of 980
13.3
Operation
13.3.1
Overview
The SCI can carry out serial communication in two modes: asynchronous mode in which
synchronization is achieved character by character, and synchronous mode in which
synchronization is achieved with clock pulses. A smart card interface is also supported as a serial
communication function for an IC card interface.
Selection of asynchronous or synchronous mode and the transmission format for the normal serial
communication interface is made in SMR, as shown in table 13.8. The SCI clock source is
selected by the C/A bit in SMR and the CKE1 and CKE0 bits in SCR, as shown in table 13.9.
For details of the procedures for switching between LSB-first and MSB-first mode and inverting
the data logic level, see section 14.2.1, Smart Card Mode Register (SCMR).
For selection of the smart card interface format, see section 14.3.3, Data Format.
Asynchronous Mode
• Data length is selectable: 7 or 8 bits
• Parity and multiprocessor bits are selectable, and so is the stop bit length (1 or 2 bits). These
selections determine the communication format and character length.
• In receiving, it is possible to detect framing errors, parity errors, overrun errors, and the break
state.
• An internal or external clock can be selected as the SCI clock source.
 When an internal clock is selected, the SCI operates using the on-chip baud rate generator,
and can output a serial clock signal with a frequency matching the bit rate.
 When an external clock is selected, the external clock input must have a frequency 16
times the bit rate. (The on-chip baud rate generator is not used.)
Synchronous Mode
• The communication format has a fixed 8-bit data length.
• In receiving, it is possible to detect overrun errors.
• An internal or external clock can be selected as the SCI clock source.
 When an internal clock is selected, the SCI operates using the on-chip baud rate generator,
and can output a serial clock signal to external devices.
 When an external clock is selected, the SCI operates on the input serial clock. The on-chip
baud rate generator is not used.
Rev. 2.0, 06/04, page 483 of 980
Smart Card Interface
• One frame consists of 8-bit data and a parity bit.
• In transmitting, a guard time of at least two elementary time units (2 etu) is provided between
the end of the parity bit and the start of he next frame. (An elementary time unit is the time
required to transmit one bit.)
• In receiving, if a parity error is detected, a low error signal level is output for 1 etu, beginning
10.5 etu after the start bit.
• In transmitting, if an error signal is received, the same data is automatically transmitted again
after at least 2 etu.
• Only asynchronous communication is supported. There is no synchronous communication
function.
For details of smart card interface operation, see section 14, Smart Card Interface.
Table 13.8 SMR Settings and Serial Communication Formats
SMR Settings
SCI Communication Format
Bit 7
C/A
A
Bit 6
CHR
Bit 2
MP
Bit 5
PE
Bit 3
STOP
0
0
0
0
0
1
1
Mode
AsynChronous
mode
Data
Length
Multiprocessor
Bit
Parity
Bit
Stop Bit
Length
8-bit data
Absent
Absent
1 bit
2 bits
0
Present
1
1
0
2 bits
0
7-bit data
Absent
1
1
1
0
1
1
—
—
—
0
—
1
—
0
—
1
—
—
Rev. 2.0, 06/04, page 484 of 980
1 bit
2 bits
Present
1
0
1 bit
1 bit
2 bits
Asyn8-bit data
chronous
Mode (multi7-bit data
processor
format)
Present
Synchronous
mode
Absent
8-bit data
Absent
1 bit
2 bits
1 bit
2 bits
None
Table 13.9 SMR and SCR Settings and SCI Clock Source Selection
SMR
SCR Setting
SCI Transmit/Receive clock
Bit 7
C/A
A
Bit 1 Bit 0
CKE1 CKE0 Mode
Clock Source SCK Pin Function
0
0
Internal
0
1
1
Asynchronous
mode
0
Outputs clock with frequency matching the
bit rate
External
Inputs clock with frequency 16 times the bit
rate
Internal
Outputs the serial clock
External
Inputs the serial clock
1
1
0
0
1
0
1
Synchronous
mode
SCI does not use the SCK pin
1
13.3.2
Operation in Asynchronous Mode
In asynchronous mode, each transmitted or received character begins with a start bit and ends with
one or two stop bits. Serial communication is synchronized one character at a time.
The transmitting and receiving sections of the SCI are independent, so full-duplex communication
is possible. The transmitter and the receiver are both double-buffered, so data can be written and
read while transmitting and receiving are in progress, enabling continuous transmitting and
receiving.
Figure 13.2 shows the general format of asynchronous serial communication. In asynchronous
serial communication the communication line is normally held in the mark (high) state. The SCI
monitors the line and starts serial communication when the line goes to the space (low) state,
indicating a start bit. One serial character consists of a start bit (low), data (LSB first), parity bit
(high or low), and one or two stop bits (high), in that order.
When receiving in asynchronous mode, the SCI synchronizes at the falling edge of the start bit.
The SCI samples each data bit on the eighth pulse of a clock with a frequency 16 times the bit
rate. Receive data is latched at the center of each bit.
Rev. 2.0, 06/04, page 485 of 980
Idle (mark) state
(LSB)
1
Serial
data
0
Start
bit
D0
1
(MSB)
D1
D2
D3
D4
D5
D6
Transmit or receive data
7 or 8 bits
1 bit
One unit of data (character or frame)
D7
0/1
Parity
bit
1 bit,
or
none
1
1
Stop bit(s)
1 or 2 bits
Figure 13.2 Data Format in Asynchronous Communication
(Example: 8-Bit Data with Parity and 2 Stop Bits)
Communication Formats: Table 13.10 shows the 12 communication formats that can be selected
in asynchronous mode. The format is selected by settings in SMR.
Rev. 2.0, 06/04, page 486 of 980
Table 13.10 Serial Communication Formats (Asynchronous Mode)
SMR Settings
Serial Communication Format and Frame Length
CHR
PE
MP
STOP
1
2
3
4
5
6
7
8
9
10
11
12
0
0
0
0
S
8-bit data
STOP
0
0
0
1
S
8-bit data
STOP STOP
0
1
0
0
S
8-bit data
P STOP
0
1
0
1
S
8-bit data
P STOP STOP
1
0
0
0
S
7-bit data
1
0
0
1
S
7-bit data
STOP STOP
1
1
0
0
S
7-bit data
P STOP
1
1
0
1
S
7-bit data
P STOP STOP
0
—
1
0
S
8-bit data
MPB STOP
0
—
1
1
S
8-bit data
MPB STOP STOP
1
—
1
0
S
7-bit data
MPB STOP
1
—
1
1
S
7-bit data
MPB STOP STOP
STOP
Legend
S:
Start bit
STOP: Stop bit
P:
Parity bit
MPB: Multiprocessor bit
Rev. 2.0, 06/04, page 487 of 980
Clock: An internal clock generated by the on-chip baud rate generator or an external clock input
from the SCK pin can be selected as the SCI transmit/receive clock. The clock source is selected
by the C/A bit in SMR and bits CKE1 and CKE0 in SCR. For details of SCI clock source
selection, see table 13.9.
When an external clock is input at the SCK pin, it must have a frequency 16 times the desired bit
rate.
When the SCI is operated on an internal clock, it can output a clock signal at the SCK pin. The
frequency of this output clock is equal to the bit rate. The phase is aligned as shown in figure 13.3
so that the rising edge of the clock occurs at the center of each transmit data bit.
0
D0
D1
D2
D3
D4
D5
D6
D7
0/1
1
1
1frame
Figure 13.3 Phase Relationship between Output Clock and Serial Data
(Asynchronous Mode)
Transmitting and Receiving Data:
• SCI Initialization (Asynchronous Mode): Before transmitting or receiving data, clear the TE
and RE bits to 0 in SCR, then initialize the SCI as follows.
When changing the communication mode or format, always clear the TE and RE bits to 0
before following the procedure given below. Clearing TE to 0 sets the TDRE flag to 1 and
initializes TSR. Clearing RE to 0, however, does not initialize the RDRF, PER, FER, and
ORER flags, or RDR, which retain their previous contents.
When an external clock is used the clock should not be stopped during initialization or
subsequent operation, since operation will be unreliable in this case.
Rev. 2.0, 06/04, page 488 of 980
Figure 13.4 shows a sample flowchart for initializing the SCI.
Start of initialization
Clear TE and RE bits
to 0 in SCR
Set CKE1 and CKE0 bits in SCR
(leaving TE and RE bits
cleared to 0)
(1)
Select communication format
in SMR
(2)
Set value in BRR
(3)
Wait
(1)
Set the clock source in SCR. Clear the
RIE, TIE, TEIE, MPIE, TE, and RE bits to
0. If clock output is selected in asynchronous mode, clock output starts immediately after the setting is made in SCR.
(2)
Select the communication format in SMR.
(3)
Write the value corresponding to the bit
rate in BRR.
This step is not necessary when an
external clock is used.
(4)
Wait for at least the interval required to
transmit or receive one bit, then set the
TE or RE bit to 1 in SCR. Set the RIE,
TIE, TEIE, and MPIE bits as necessary.
Setting the TE or RE bit enables the SCI
to use the TxD or RxD pin.
No
1-bit interval elapsed?
Yes
Set TE or RE bit to 1 in SCR
Set the RIE, TIE, TEIE, and
MPIE bits
(4)
<End of initialization>
Note: In simultaneous transmitting and receiving, the TE and RE bits should be cleared to
0 or set to 1 simultaneously.
Figure 13.4 Sample Flowchart for SCI Initialization
Rev. 2.0, 06/04, page 489 of 980
• Transmitting Serial Data (Asynchronous Mode): Figure 13.5 shows a sample flowchart for
transmitting serial data and indicates the procedure to follow.
Initialize
(1)
(1) SCI initialization:
the transmit data output function of the TxD pin is
selected automatically.
Transmission is possible after the TE bit is set to 1
and 1 is output for one frame.
(2)
(2) SCI status check and transmit data write:
read SSR and check that the TDRE flag is set to 1,
then write transmit data in TDR and clear the TDRE
flag to 0.
Start transmitting
Read TDRE flag in SSR
No
TDRE = 1
(3) To continue transmitting serial data:
after checking that the TDRE flag is 1, indicating that
data can be written, write data in TDR, then clear the
TDRE flag to 0. When the DMAC is activated by a
transmit-data-empty interrupt request (TXI) to write
data in TDR, the TDRE flag is checked and cleared
automatically.
Yes
Write transmit data in TDR
and clear TDRE flag to 0 in SSR
All data transmitted?
No
Yes
(3)
Read TEND flag in SSR
TEND = 1
(4) To output a break signal at the end of serial
transmission:
set the DDR bit to 1 and clear the DR bit to 0, then
clear the TE bit to 0 in SCR.
No
Yes
Output break signal?
No
(4)
Yes
Clear DR bit to 0 and set
DDR bit to 1
Clear TE bit to 0 in SCR
<End>
Figure 13.5 Sample Flowchart for Transmitting Serial Data
Rev. 2.0, 06/04, page 490 of 980
In transmitting serial data, the SCI operates as follows:
• The SCI monitors the TDRE flag in SSR. When the TDRE flag is cleared to 0, the SCI
recognizes that TDR contains new data, and loads this data from TDR into TSR.
• After loading the data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts
transmitting. If the TIE bit is set to 1 in SCR, the SCI requests a transmit-data-empty interrupt
(TXI) at this time.
Serial transmit data is transmitted in the following order from the TxD pin:
 Start bit: One 0 bit is output.
 Transmit data: 7 or 8 bits are output, LSB first.
 Parity bit or multiprocessor bit: One parity bit (even or odd parity),or one multiprocessor
bit is output. Formats in which neither a parity bit nor a multiprocessor bit is output can
also be selected.
 Stop bit(s): One or two 1 bits (stop bits) are output.
 Mark state: Output of 1 bits continues until the start bit of the next transmit data.
• The SCI checks the TDRE flag when it outputs the stop bit. If the TDRE flag is 0, the SCI
loads new data from TDR into TSR, outputs the stop bit, then begins serial transmission of the
next frame. If the TDRE flag is 1, the SCI sets the TEND flag to 1 in SSR, outputs the stop
bit, then continues output of 1 bits in the mark state. If the TEIE bit is set to 1 in SCR, a
transmit-end interrupt (TEI) is requested at this time.
Figure 13.6 shows an example of SCI transmit operation in asynchronous mode.
1
0
Parity Stop Start
bit
bit
bit
Data
Start bit
D0
D1
D7
0/1
1
0
Parity Stop
bit
bit
Data
D0
D1
D7
0/1
1
1
Idle state
(mark state)
TDRE
TEND
1 frame
TXI interrupt
request
TXI interrupt handler
writes data in TDR and
clears TDRE flag to 0
TXI interrupt
request
TEI interrupt
request
Figure 13.6 Example of SCI Transmit Operation in Asynchronous Mode
(8-Bit Data with Parity and One Stop Bit)
Rev. 2.0, 06/04, page 491 of 980
• Receiving Serial Data (Asynchronous Mode): Figure 13.7 shows a sample flowchart for
receiving serial data and indicates the procedure to follow.
(1)
Initialize
(1)
SCI initialization:
the receive data input function of the RxD
pin is selected automatically.
(2)(3)
Receive error handling and break detection:
if a receive error occurs, read the ORER,
PER, and FER flags in SSR to identify the
error. After executing the necessary error
handling, clear the ORER, PER, and FER
flags all to 0. Receiving cannot resume if
any of these flags remains set to 1. When a
framing error occurs, the RxD pin can be
read to detect the break state.
Start receiving
Read ORER, PER, and FER
flags in SSR
(2)
Yes
PER∨FER∨OPER = 1
(3)
Error handling
No
(continued on next page)
Read RDRF flag in SSR
No
(4)
(4)
SCI status check and receive data read:
read SSR, check that the RDRF flag is set
to 1, then read receive data from RDR and
clear the RDRF flag to 0. Notification that
the RDRF flag has changed from 0 to 1 can
also be given by the RXI interrupt.
(5)
To continue receiving serial data:
check the RDRF flag, read RDR, and clear
the RDRF flag to 0 before the stop bit of the
current frame is received. When the DMAC
is activated by a receive-data-full interrupt
request (RXI) to read RDR, the RDRF flag
is cleared automatically.
RDRF = 1
Yes
Read receive data from RDR, and
clear RDRF flag to 0 in SSR
No
All data received?
(5)
Yes
Clear RE bit to 0 in SCR
<End>
Figure 13.7 Sample Flowchart for Receiving Serial Data (1)
Rev. 2.0, 06/04, page 492 of 980
(3)
Error handling
No
ORER = 1
Yes
Overrun error handling
No
FER = 1
Yes
Break?
Yes
No
Framing error handling
No
Clear RE bit to 0 in SCR
PER = 1
Yes
Parity error handling
Clear ORER, PER, and FER flags
to 0 in SSR
<End>
Figure 13.7 Sample Flowchart for Receiving Serial Data (2)
Rev. 2.0, 06/04, page 493 of 980
In receiving, the SCI operates as follows:
• The SCI monitors the communication line. When it detects a start bit (0 bit), the SCI
synchronizes internally and starts receiving.
• Receive data is stored in RSR in order from LSB to MSB.
• The parity bit and stop bit are received.
After receiving these bits, the SCI carries out the following checks:
 Parity check: The number of 1s in the receive data must match the even or odd parity
setting of in the O/E bit in SMR.
 Stop bit check: The stop bit value must be 1. If there are two stop bits, only the first is
checked.
 Status check: The RDRF flag must be 0, indicating that the receive data can be transferred
from RSR into RDR.
If these all checks pass, the RDRF flag is set to 1 and the received data is stored in RDR. If
one of the checks fails (receive error*), the SCI operates as shown in table 13.11.
Note: * When a receive error occurs, further receiving is disabled. In receiving, the RDRF flag
is not set to 1. Be sure to clear the error flags to 0.
• When the RDRF flag is set to 1, if the RIE bit is set to 1 in SCR, a receive-data-full interrupt
(RXI) is requested. If the ORER, PER, or FER flag is set to 1 and the RIE bit in SCR is also
set to 1, a receive-error interrupt (ERI) is requested.
Table 13.11 Receive Error Conditions
Receive Error Abbreviation Condition
Data Transfer
Overrun error ORER
Receiving of next data ends while Receive data is not transferred
RDRF flag is still set to 1 in SSR from RSR to RDR
Framing error FER
Stop bit is 0
Parity error
Parity of received data differs from Receive data is transferred from
even/odd parity setting in SMR
RSR to RDR
PER
Rev. 2.0, 06/04, page 494 of 980
Receive data is transferred from
RSR to RDR
Figure 13.8 shows an example of SCI receive operation in asynchronous mode.
1
Start
bit
0
Parity Stop
bit
bit
Data
D0
D1
D7
0/1
1
Start
bit
0
Data
D0
D1
Stop Parity Stop
bit
bit
bit
D7
0/1
1
1
Idle (mark) state
RDRF
FER
RXI request
1 frame
RXI interrupt handler
reads data in RDR and
clears RDRF flag to 0
Framing error,
ERI request
Figure 13.8 Example of SCI Receive Operation
(8-Bit Data with Parity and One Stop Bit)
13.3.3
Multiprocessor Communication
The multiprocessor communication function enables several processors to share a single serial
communication line. The processors communicate in asynchronous mode using a format with an
additional multiprocessor bit (multiprocessor format).
In multiprocessor communication, each receiving processor is addressed by an ID. A serial
communication cycle consists of an ID-sending cycle that identifies the receiving processor, and a
data-sending cycle. The multiprocessor bit distinguishes ID-sending cycles from data-sending
cycles.
The transmitting processor stars by sending the ID of the receiving processor with which it wants
to communicate as data with the multiprocessor bit set to 1. Next the transmitting processor sends
transmit data with the multiprocessor bit cleared to 0.
Receiving processors skip incoming data until they receive data with the multiprocessor bit set to
1. When they receive data with the multiprocessor bit set to 1, receiving processors compare the
data with their IDs. Processors with IDs not matching the received data skip further incoming
data until they again receive data with the multiprocessor bit set to 1. Multiple processors can
send and receive data in this way.
Figure 13.9 shows an example of communication among different processors using a
multiprocessor format.
Rev. 2.0, 06/04, page 495 of 980
Communication Formats: Four formats are available. Parity bit settings are ignored when a
multiprocessor format is selected. For details see table 13.10.
Clock: See the description of asynchronous mode.
Transmitting
processor
Serial communication line
Serial data
Receiving
processor A
Receiving
processor B
Receiving
processor C
Receiving
processor D
(ID=01)
(ID=02)
(ID=03)
(ID=04)
H'01
H'AA
(MPB=1)
ID-sending cycle:
receiving processor address
(MPB=0)
Data-sending cycle:
data sent to receiving processor
specified by ID
Legend
MPB : Multiprocessor bit
Figure 13.9 Example of Communication among Processors using Multiprocessor Format
(Sending Data H'AA to Receiving Processor A)
Transmitting and Receiving Data:
• Transmitting Multiprocessor Serial Data: Figure 13.10 shows a sample flowchart for
transmitting multiprocessor serial data and indicates the procedure to follow.
Rev. 2.0, 06/04, page 496 of 980
(1)
Initialize
(1)
SCI initialization:
the transmit data output function of the TxD pin
is selected automatically.
(2)
SCI status check and transmit data write:
read SSR, check that the TDRE flag is 1, then
write transmit data in TDR. Also set the MPBT
flag to 0 or 1 in SSR. Finally, clear the TDRE
flag to 0.
(3)
To continue transmitting serial data:
after checking that the TDRE flag is 1,
indicating that data can be written, write data
in TDR, then clear the TDRE flag to 0. When
the DMAC is activated by a transmit-dataempty interrupt request (TXI) to write data in
TDR, the TDRE flag is checked and cleared
automatically.
(4)
To output a break signal at the end of serial
transmission:
set the DDR bit to 1 and clear the DR bit to 0,
then clear the TE bit to 0 in SCR.
Start transmitting
Read TDRE flag in SSR
TDRE = 1
(2)
No
Yes
Write transmit data in TDR
and set MPBT bit in SSR
Clear TDRE flag to 0
All data transmitted?
No
(3)
Yes
Read TEND flag in SSR
TEND = 1
No
Yes
Output break signal?
No
(4)
Yes
Clear DR bit to 0 and set DDR to 1
Clear TE bit to 0 in SCR
<End>
Figure 13.10 Sample Flowchart for Transmitting Multiprocessor Serial Data
Rev. 2.0, 06/04, page 497 of 980
In transmitting serial data, the SCI operates as follows:
• The SCI monitors the TDRE flag in SSR. When the TDRE flag is cleared to 0, the SCI
recognizes that TDR contains new data, and loads this data from TDR into TSR.
• After loading the data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts
transmitting. If the TIE bit is set to 1 in SCR, the SCI requests a transmit-data-empty interrupt
(TXI) at this time.
Serial transmit data is transmitted in the following order from the TxD pin:
 Start bit: One 0 bit is output.
 Transmit data: 7 or 8 bits are output, LSB first.
 Multiprocessor bit: One multiprocessor bit (MPBT value) is output.
 Stop bit(s): One or two 1 bits (stop bits) are output.
 Mark state: Output of 1 bits continues until the start bit of the next transmit data.
• The SCI checks the TDRE flag when it outputs the stop bit. If the TDRE flag is 0, the SCI
loads new data from TDR into TSR, outputs the stop bit, then begins serial transmission of the
next frame. If the TDRE flag is 1, the SCI sets the TEND flag to 1 in SSR, outputs the stop
bit, then continues output of 1 bits in the mark state. If the TEIE bit is set to 1 in SCR, a
transmit-end interrupt (TEI) is requested at this time.
Figure 13.11 shows an example of SCI transmit operation using a multiprocessor format.
1
Start
bit
0
Data
D0
D1
Multiprocessor Stop Start
bit
bit
bit
D7
0/1
1
0
Data
D0
D1
Multiprocessor Stop
bit
bit
D7
0/1
1
Idle (mark)
state
TDRE
TEND
TXI interrupt TXI interrupt handler
writes data in TDR and
request
clears TDRE flag to 0
TXI interrupt
request
TEI interrupt
request
1 frame
Figure 13.11 Example of SCI Transmit Operation
(8-Bit Data with Multiprocessor Bit and One Stop Bit)
• Receiving Multiprocessor Serial Data: Figure 13.12 shows a sample flowchart for receiving
multiprocessor serial data and indicates the procedure to follow.
Rev. 2.0, 06/04, page 498 of 980
(1)
Initialize
(1)
SCI initialization:
the receive data input function of the
RxD pin is selected automatically.
(2)
ID receive cycle:
set the MPIE bit to 1 in SCR.
(3)
SCI status check and ID check:
read SSR, check that the RDRF flag
is set to 1, then read data from RDR
and compare it with the processor's
own ID. If the ID does not match, set
the MPIE bit to 1 again and clear the
RDRF flag to 0. If the ID matches,
clear the RDRF flag to 0.
(4)
SCI status check and data receiving:
read SSR, check that the RDRF flag
is set to 1, then read data from RDR.
(5)
Receive error handling and break
detection:
if a receive error occurs, read the
ORER and FER flags in SSR to
identify the error. After executing the
necessary error handling, clear the
ORER and FER flags both to 0.
Receiving cannot resume while either
the ORER or FER flag remains set to
1. When a framing error occurs, the
RxD pin can be read to detect the
break state.
Start receiving
(2)
Set MPIE bit to 1 in SCR
Read ORER and FER flags
in SSR
FER∨ORER = 1
Yes
No
Read RDRF flag in SSR
No
(3)
RDRF = 1
Yes
Read RDRF flag in SSR
No
Own ID?
Yes
Read ORER and FER flags
in SSR
FER∨ORER = 1
Yes
No
(4)
Read RDRF flag in SSR
RDRF = 1
No
Yes
Read receive data from RDR
No
Finished receiving?
Yes
Clear RE bit to 0 in SCR
(5)
Error handling
(continued on next page)
<End>
Figure 13.12 Sample Flowchart for Receiving Multiprocessor Serial Data (1)
Rev. 2.0, 06/04, page 499 of 980
(5)
Error handling
No
ORER = 1
Yes
Overrun error handling
No
FER = 1
Yes
Break?
Yes
No
Clear RE bit to 0 in SCR
Framing error handling
Clear ORER, PER, and FER
flags to 0 in SSR
<End>
Figure 13.12 Sample Flowchart for Receiving Multiprocessor Serial Data (2)
Rev. 2.0, 06/04, page 500 of 980
Figure 13.13 shows an example of SCI receive operation using a multiprocessor format.
Start
bit
1
0
Stop
MPB bit
Data (ID1)
D0
D7
D1
Start
bit
0
1
1
Stop
MPB bit
Data (data1)
D0
D1
D7
1
0
1
Idle (mark)
state
MPIE
RDRF
RDR value
ID1
MPB detection
MPIE = 0
RXI interrupt
request
(multiprocessor
interrupt)
RXI interrupt handler reads
RDR data and clears
RDRF flag to 0
Not own ID, so MPIE
bit is set to 1 again
No RXI interrupt
request, RDR not
updated
a. Own ID does not match data
Start
bit
1
0
Data (ID2)
D0
D1
MPB
D7
1
Stop
bit
1
Start
bit
Data (data1)
0
D0
D1
Stop
bit
MPB
D7
0
1
1
Idle (mark)
state
MPIE
RDRF
RDR value
ID1
MPB detection
MPIE = 0
ID2
RXI interrupt
request
(multiprocessor
interrupt)
RXI interrupt handler
reads RDR data and
clears RDRF flag to 0
Data2
Own ID, so receiving MPIE bit is set to
continues, with data 1 again
received by RXI
interrupt handler
b. Own ID matches data
Figure 13.13 Example of SCI Receive Operation
(8-Bit Data with Multiprocessor Bit and One Stop Bit)
13.3.4
Synchronous Operation
In synchronous mode, the SCI transmits and receives data in synchronization with clock pulses.
This mode is suitable for high-speed serial communication.
The SCI transmitter and receiver share the same clock but are otherwise independent, so fullduplex communication is possible. The transmitter and the receiver are also double-buffered, so
continuous transmitting or receiving is possible by reading or writing data while transmitting or
receiving is in progress.
Rev. 2.0, 06/04, page 501 of 980
Figure 13.14 shows the general format in synchronous serial communication.
One unit (character or frame) of transfer data
*
*
Serial clock
LSB
Bit 0
Serial data
MSB
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Don't care
Don't care
Note: * High except in continuous transmitting or receiving
Figure 13.14 Data Format in Synchronous Communication
In synchronous serial communication, each data bit is placed on the communication line from one
falling edge of the serial clock to the next. Data is guaranteed valid at the rise of the serial clock.
In each character, the serial data bits are transferred in order from LSB (first) to MSB (last). After
output of the MSB, the communication line remains in the state of the MSB. In synchronous
mode the SCI receives data by synchronizing with the rise of the serial clock.
Communication Format: The data length is fixed at 8 bits. No parity bit or multiprocessor bit
can be added.
Clock: An internal clock generated by the on-chip baud rate generator or an external clock input
from the SCK pin can be selected by means of the C/A bit in SMR and the CKE1 and CKE0 bits
in SCR. See table 13.6 for details of SCI clock source selection.
When the SCI operates on an internal clock, it outputs the clock source at the SCK pin. Eight
clock pulses are output per transmitted or received character. When the SCI is not transmitting or
receiving, the clock signal remains in the high state. If receiving in single-character units is
required, an external clock should be selected.
Transmitting and Receiving Data:
• SCI Initialization (Synchronous Mode): Before transmitting or receiving data, clear the TE and
RE bits to 0 in SCR, then initialize the SCI as follows.
When changing the communication mode or format, always clear the TE and RE bits to 0
before following the procedure given below. Clearing TE to 0 sets the TDRE flag to 1 and
initializes TSR. Note that clearing RE to 0, however, does not initialize the RDRF, PER, and
ORE flags, or RDR, which retain their previous contents.
Rev. 2.0, 06/04, page 502 of 980
Figure 13.15 shows a sample flowchart for initializing the SCI.
Start of initialization
Clear TE and RE bits to 0 in SCR
Set RIE, TIE, TEIE, MPIE, CKE1,
and CKE0 bits in SCR (leaving
TE and RE bits cleared to 0)
(1)
Select communication format
in SMR
(2)
Set value in BRR
Wait
1-bit interval elapsed?
(3)
(1)
Set the clock source in SCR. Clear the RIE,
TIE, TEIE, MPIE, TE, and RE bits to 0.*
(2)
Select the communication format in SMR.
(3)
Write the value corresponding to the bit rate in
BRR.
This step is not necessary when an external
clock is used.
(4)
Wait for at least the interval required to transmit
or receive one bit, then set the TE or RE bit to
1 in SCR.* Set the RIE, TIE, TEIE, and MPIE
bits as necessary. Setting the TE or RE bit
enables the SCI to use the TxD or RxD pin.
Note: * In simultaneous transmitting and receiving,
the TE and RE bits should be cleared to 0 or
set to 1 simultaneously.
No
Yes
Set TE or RE bit to 1 in SCR
Set RIE, TIE, TEIE, and MPIE
bits as necessary
(4)
<Start transmitting or receiving>
Figure 13.15 Sample Flowchart for SCI Initialization
Rev. 2.0, 06/04, page 503 of 980
• Transmitting Serial Data (Synchronous Mode): Figure 13.16 shows a sample flowchart for
transmitting serial data and indicates the procedure to follow.
(1)
Initialize
(1)
SCI initialization: the transmit data output
function of the TxD pin is selected
automatically.
(2)
SCI status check and transmit data write:
read SSR, check that the TDRE flag is 1, then
write transmit data in TDR and clear the
TDRE flag to 0.
(3)
To continue transmitting serial data: after
checking that the TDRE flag is 1, indicating
that data can be written, write data in TDR,
then clear the TDRE flag to 0. When the
DMAC is activated by a transmit-data-empty
interrupt request (TXI) to write data in TDR,
the TDRE flag is checked and cleared
automatically.
Start transmitting
Read TDRE flag in SSR
TDRE = 1
(2)
No
Yes
Write transmit data in TDR
and clear TDRE flag to 0 in SSR
All data transmitted?
No
(3)
Yes
Read TEND flag in SSR
TEND = 1
No
Yes
Clear TE bit to 0 in SCR
<End>
Figure 13.16 Sample Flowchart for Serial Transmitting
Rev. 2.0, 06/04, page 504 of 980
In transmitting serial data, the SCI operates as follows.
• The SCI monitors the TDRE flag in SSR. When the TDRE flag is cleared to 0, the SCI
recognizes that TDR contains new data, and loads this data from TDR into TSR.
• After loading the data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts
transmitting. If the TIE bit is set to 1 in SCR, the SCI requests a transmit-data-empty interrupt
(TXI) at this time.
If clock output is selected, the SCI outputs eight serial clock pulses. If an external clock
source is selected, the SCI outputs data in synchronization with the input clock. Data is output
from the TxD pin n order from LSB (bit 0) to MSB (bit 7).
• The SCI checks the TDRE flag when it outputs the MSB (bit 7). If the TDRE flag is 0, the
SCI loads data from TDR into TSR and begins serial transmission of the next frame. If the
TDRE flag is 1, the SCI sets the TEND flag to 1 in SSR, and after transmitting the MSB (bit
7), holds the TxD pin in the MSB state. If the TEIE bit is set to 1 in SCR, a transmit-end
interrupt (TEI) is requested at this time
• After the end of serial transmission, the SCK pin is held in a constant state.
Figure 13.17 shows an example of SCI transmit operation.
Transmit direction
Serial clock
Serial data
Bit 0
Bit 1
Bit 7
Bit 0
Bit 1
Bit 6
Bit 7
TDRE
TEND
TXI interrupt
request
TEI interrupt
request
TXI interrupt handler TXI interrupt
writes data in TDR
request
and clears TDRE
flag to 0
1 frame
Figure 13.17 Example of SCI Transmit Operation
• Receiving Serial Data (Synchronous Mode): Figure 13.18 shows a sample flowchart for
receiving serial data and indicates the procedure to follow. When switching from
asynchronous to synchronous mode. make sure that the ORER, PER, and FER flags are
cleared to 0. If the FER or PER flag is set to 1 the RDRF flag will not be set and both
transmitting and receiving will be disabled.
Rev. 2.0, 06/04, page 505 of 980
(1)
Initialize
(1)
Start receiving
Read ORER flag in SSR
(2)
Yes
ORER = 1
(3)
No
Error handling
(2)(3) Receive error handling: if a receive
error occurs, read the ORER flag in
SSR, then after executing the
necessary error handling, clear the
ORER flag to 0. Neither transmitting
nor receiving can resume while the
ORER flag remains set to 1.
(4)
SCI status check and receive data
read: read SSR, check that the RDRF
flag is set to 1, then read receive data
from RDR and clear the RDRF flag to
0. Notification that the RDRF flag
has changed from 0 to 1 can also be
given by the RXI interrupt.
(5)
To continue receiving serial data:
check the RDRF flag, read RDR, and
clear the RDRF flag to 0 before the
MSB (bit 7) of the current frame is
received. When the DMAC is
activated by a receive-data-full
interrupt request (RXI) to read RDR,
the RDRF flag is cleared
automatically.
(continued on next page)
Read RDRF flag in SSR
No
(4)
RDRF = 1
Yes
Read receive data from
RDR, and clear RDRF
flag to 0 in SSR
No
Finished receiving?
(5)
SCI initialization: the receive data
input function of the RxD pin is
selected automatically.
Yes
Clear RE bit to 0 in SCR
<End>
Figure 13.18 Sample Flowchart for Serial Receiving (1)
Rev. 2.0, 06/04, page 506 of 980
(3)
Error handling
Overrun error handling
Clear ORER flag to 0 in SSR
<End>
Figure 13.18 Sample Flowchart for Serial Receiving (2)
In receiving, the SCI operates as follows:
• The SCI synchronizes with serial clock input or output and synchronizes internally.
• Receive data is stored in RSR in order from LSB to MSB.
After receiving the data, the SCI checks that the RDRF flag is 0, so that receive data can be
transferred from RSR to RDR. If this check passes, the RDRF flag is set to 1 and the received
data is stored in RDR. If the checks fails (receive error), the SCI operates as shown in table
13.11.
When a receive error has been identified in the error check, subsequent transmit and receive
operations are disabled.
• When the RDRF flag is set to 1, if the RIE bit is set to 1 in SCR, a receive-data-full interrupt
(RXI) is requested. If the ORER flag is set to 1 and the RIE bit in SCR is also set to 1, a
receive-error interrupt (ERI) is requested.
Rev. 2.0, 06/04, page 507 of 980
Figure 13.19 shows an example of SCI receive operation.
Serial clock
Serial data
Bit 7
Bit 0
Bit 7
Bit 0
Bit 1
Bit 6
Bit 7
RDRF
ORER
RXI interrupt
request
RXI interrupt handler
reads data in RDR and
clears RDRF flag to 0
RXI interrupt
request
1 frame
Figure 13.19 Example of SCI Receive Operation
Rev. 2.0, 06/04, page 508 of 980
Overrun error,
ERI interrupt
request
• Transmitting and Receiving Data Simultaneously (Synchronous Mode): Figure 13.20 shows a
sample flowchart for transmitting and receiving serial data simultaneously and indicates the
procedure to follow.
Initialize
(1)
(1)
SCI initialization: the transmit data output function of the
TxD pin and the read data input function of the RxD pin
are selected, enabling simultaneous transmitting and
receiving.
(2)
SCI status check and transmit data write: read SSR, check
that the TDRE flag is 1, then write transmit data in TDR
and clear the TDRE flag to 0.
Notification that the TDRE flag has changed from 0 to 1
can also be given by the TXI interrupt.
(3)
Receive error handling: if a receive error occurs, read the
ORER flag in SSR, then after executing the necessary
error handling, clear the ORER flag to 0.
Neither transmitting nor receiving can resume while the
ORER flag remains set to 1.
(4)
SCI status check and receive data read: read SSR, check
that the RDRF flag is 1, then read receive data from RDR
and clear the RDRF flag to 0. Notification that the RDRF
flag has changed from 0 to 1 can also be given by the RXI
interrupt.
(5)
To continue transmitting and receiving serial data: check
the RDRF flag, read RDR, and clear the RDRF flag to 0
before the MSB (bit 7) of the current frame is received.
Also check that the TDRE flag is set to 1, indicating that
data can be written, write data in TDR, then clear the
TDRE flag to 0 before the MSB (bit 7) of the current frame
is transmitted. When the DMAC is activated by a transmitdata-empty interrupt request (TXI) to write data in TDR,
the TDRE flag is checked and cleared automatically.
When the DMAC is activated by a receive-data-full
interrupt request (RXI) to read RDR, the RDRF flag is
cleared automatically.
Start of transmitting and receiving
Read TDRE flag in SSR
No
(2)
TDRE = 1
Yes
Write transmit data in TDR and
clear TDRE flag to 0 in SSR
Read ORER flag in SSR
ORER = 1
Yes
(3)
No
Error handling
Read RDRF flag in SSR
No
(4)
RDRF = 1
Yes
Read receive data from RDR, and
clear RDRF flag to 0 in SSR
No
End of transmitting
and receiving?
(5)
Yes
Clear TE and RE bits to 0 in SCR
<End>
Note: When switching from transmitting or receiving to simultaneous transmitting and receiving, clear both the TE bit
and the RE bit to 0, then set both bits to 1 simultaneously.
Figure 13.20 Sample Flowchart for Simultaneous Serial Transmitting and Receiving
Rev. 2.0, 06/04, page 509 of 980
13.4
SCI Interrupts
The SCI has four interrupt request sources: the transmit-end interrupt (TEI), receive-error
interrupt (ERI), receive-data-full interrupt (RXI), and transmit-data-empty interrupt (TXI). Table
13.12 lists the interrupt sources and indicates their priority. These interrupts can be enabled or
disabled by the TIE, RIE, and TEIE bits in SCR. Each interrupt request is sent separately to the
interrupt controller.
A TXI interrupt is requested when the TDRE flag is set to 1 in SSR. A TEI interrupt is requested
when the TEND flag is set to 1 in SSR. A TXI interrupt request can activate the DMAC to transfer
data. Data transfer by the DMAC automatically clears the TDRE flag to 0. A TEI interrupt request
cannot activate the DMAC.
An RXI interrupt is requested when the RDRF flag is set to 1 in SSR. An ERI interrupt is
requested when the ORER, PER, or FER flag is set to 1 in SSR. An RXI interrupt can activate the
DMAC to transfer data. Data transfer by the DMAC automatically clears the RDRF flag to 0. An
ERI interrupt request cannot activate the DMAC.
The DMAC can be activated by interrupts from SCI channel 0.
Table 13.12 SCI Interrupt Sources
Interrupt Source
Description
Priority
ERI
Receive error (ORER, FER, or PER)
High
RXI
Receive data register full (RDRF)
TXI
Transmit data register empty (TDRE)
TEI
Transmit end (TEND)
13.5
Usage Notes
13.5.1
Notes on Use of SCI
Low
Note the following points when using the SCI.
TDR Write and TDRE Flag: The TDRE flag in SSR is a status flag indicating the loading of
transmit data from TDR to TSR. The SCI sets the TDRE flag to 1 when it transfers data from
TDR to TSR.
Data can be written into TDR regardless of the state of the TDRE flag. If new data is written in
TDR when the TDRE flag is 0, the old data stored in TDR will be lost because this data has not
yet been transferred to TSR. Before writing transmit data in TDR, be sure to check that the TDRE
flag is set to 1.
Rev. 2.0, 06/04, page 510 of 980
Simultaneous Multiple Receive Errors: Table 13.13 shows the state of the SSR status flags
when multiple receive errors occur simultaneously. When an overrun error occurs the RSR
contents are not transferred to RDR, so receive data is lost.
Table 13.13 SSR Status Flags and Transfer of Receive Data
Receive Data
Transfer
SSR Status Flags
RDRF
ORER
FER
PER
RSR → RDR
Receive Errors
1
1
0
0
×
Overrun error
0
0
1
0
0
0
0
1
1
1
1
0
×
Overrun error +
framing error
1
1
0
1
×
Overrun error +
parity error
0
0
1
1
1
1
1
1
Notes:
Framing error
Parity error
Framing error +
parity error
×
Overrun error +
framing error +
parity error
: Receive data is transferred from RSR to RDR.
× : Receive data is not transferred from RSR to RDR.
Break Detection and Processing: Break signals can be detected by reading the RxD pin directly
when a framing error (FER) is detected. In the break state the input from the RxD pin consists of
all 0s, so the FER flag is set and the parity error flag (PER) may also be set. In the break state the
SCI receiver continues to operate, so if the FER flag is cleared to 0 it will be set to 1 again.
Sending a Break Signal: The input/output condition and level of the TxD pin are determined by
DR and DDR bits. This feature can be used to send a break signal.
After the serial transmitter is initialized, the DR value substitutes for the mark state until the TE
bit is set to 1 (the TxD pin function is not selected until the TE bit is set to 1). The DDR and DR
bits should therefore be set to 1 beforehand.
To send a break signal during serial transmission, clear the DR bit to 0 , then clear the TE bit to 0.
When the TE bit is cleared to 0 the transmitter is initialized, regardless of its current state, so the
TxD pin becomes an input/output outputting the value 0.
Rev. 2.0, 06/04, page 511 of 980
Receive Error Flags and Transmitter Operation (Synchronous Mode Only): When a receive
error flag (ORER, PER, or FER) is set to 1 the SCI will not start transmitting, even if the TDRE
flag is cleared to 0. Be sure to clear the receive error flags to 0 when starting to transmit. Note
that clearing the RE bit to 0 does not clear the receive error flags to 0.
Receive Data Sampling Timing in Asynchronous Mode and Receive Margin: In asynchronous
mode the SCI operates on a base clock with 16 times the bit rate frequency. In receiving, the SCI
synchronizes internally with the fall of the start bit, which it samples on the base clock. Receive
data is latched at the rising edge of the eighth base clock pulse. See figure 13.21.
16 clocks
8 clocks
0
7
15 0
7
15 0
Internal base clock
Receive data
(RxD)
D0
Start bit
D1
Synchronization
sampling timing
Data sampling
timing
Figure 13.21 Receive Data Sampling Timing in Asynchronous Mode
The receive margin in asynchronous mode can therefore be expressed as shown in equation (1).
M=
(0.5 –
1
2N
) – (L – 0.5) F –
D – 0.5
N
(1 + F)
× 100%
. . . . . . . . (1)
M:
N:
D:
L:
F:
Receive margin (%)
Ratio of clock frequency to bit rate (N = 16)
Clock duty cycle (L = 0 to 1.0)
Frame length (L = 9 to 12)
Absolute deviation of clock frequency
Rev. 2.0, 06/04, page 512 of 980
From equation (1), if F = 0 and D = 0.5, the receive margin is 46.875%, as given by equation (2).
D = 0.5, F = 0
M = (0.5 –
1
2 × 16
) × 100%
= 46.875%
. . . . . . . . (2)
This is a theoretical value. A reasonable margin to allow in system designs is 20% to 30%.
Restrictions on Use of DMAC:
• When an external clock source is used for the serial clock, after the DMAC updates TDR,
allow an inversion of at least five system clock (φ) cycles before input of the serial clock to
start transmitting. If the serial clock is input within four states of the TDR update, a
malfunction may occur (see figure 13.22) .
• To have the DMAC read RDR, be sure to select the corresponding SCI receive-data-full
interrupt (RXI) as the activation source with bits DTS2 to DTS0 in DTCR.
SCK
t
TDRE
D0
D1
D2
D3
D4
D5
D6
D7
Note: In operation with an external clock source, be sure that t >4 states.
Figure 13.22 Example of Synchronous Transmission Using DMAC
Rev. 2.0, 06/04, page 513 of 980
Switching from SCK Pin Function to Port Pin Function:
• Problem in Operation: When switching the SCK pin function to the output port function (highlevel output) by making the following settings while DDR = 1, DR = 1, C/A = 1, CKE1 = 0,
CKE0 = 0, and TE = 1 (synchronous mode), low-level output occurs for one half-cycle.
1. End of serial data transmission
2. TE bit = 0
3. C/A bit = 0 ... switchover to port output
4. Occurrence of low-level output (see figure 13.23)
Half-cycle low-level output
SCK/port
1. End of transmission
Data
Bit 6
4. Low-level output
Bit 7
2. TE= 0
TE
C/A
3. C/A= 0
CKE1
CKE0
Figure 13.23 Operation when Switching from SCK Pin Function to Port Pin Function
Rev. 2.0, 06/04, page 514 of 980
• Sample Procedure for Avoiding Low-Level Output: As this sample procedure temporarily
places the SCK pin in the input state, the SCK/port pin should be pulled up beforehand with an
external circuit.
With DDR = 1, DR = 1, C/A = 1, CKE1 = 0, CKE0 = 0, and TE = 1, make the following
settings in the order shown.
1. End of serial data transmission
2. TE bit = 0
3. CKE1 bit = 1
4. C/A bit = 0 ... switchover to port output
5. CKE1 bit = 0
High-level output TE
SCK/port
1. End of transmission
Data
Bit 6
Bit 7
2. TE= 0
TE
4. C/A= 0
C/A
3. CKE1= 1
CKE1
5. CKE1= 0
CKE0
Figure 13.24 Operation when Switching from SCK Pin Function to Port Pin Function
(Example of Preventing Low-Level Output)
Rev. 2.0, 06/04, page 515 of 980
Rev. 2.0, 06/04, page 516 of 980
Section 14 Smart Card Interface
14.1
Overview
An IC card (smart card) interface conforming to the ISO/IEC 7816-3 (Identification Card)
standard is supported as an extension of the serial communication interface (SCI) functions.
Switchover between the normal serial communication interface and the smart card interface is
controlled by a register setting.
14.1.1
Features
Features of the smart card interface supported by the H8/3029 are listed below.
• Asynchronous communication
 Data length: 8 bits
 Parity bit generation and checking
 Transmission of error signal (parity error) in receive mode
 Error signal detection and automatic data retransmission in transmit mode
 Direct convention and inverse convention both supported
• Built-in baud rate generator allows any bit rate to be selected
• Three interrupt sources
 There are three interrupt sources—transmit-data-empty, receive-data-full, and
transmit/receive error—that can issue requests independently.
 The transmit-data-empty interrupt and receive-data-full interrupt can activate the DMA
controller (DMAC) to execute data transfer.
Rev. 2.0, 06/04, page 517 of 980
14.1.2
Block Diagram
Bus interface
Figure 14.1 shows a block diagram of the smart card interface.
Module data bus
RxD
RDR
TDR
RSR
TSR
TxD
SCMR
SSR
SCR
SMR
Transmission/
reception
control
Parity generation
BRR
φ
φ/4
Baud rate
generator
φ/16
φ/64
Clock
Parity check
External clock
SCK
Legend
SCMR:
RSR:
RDR:
TSR:
TDR:
SMR:
SCR:
SSR:
BRR:
TXI
RXI
ERI
Smart card mode register
Receive shift register
Receive data register
Transmit shift register
Transmit data register
Serial mode register
Serial control register
Serial status register
Bit rate register
Figure 14.1 Block Diagram of Smart Card Interface
14.1.3
Pin Configuration
Table 14.1 shows the smart card interface pins.
Table 14.1 Smart Card Interface Pins
Pin Name
Abbreviation
I/O
Function
Serial clock pin
SCK
I/O
Clock input/output
Receive data pin
RxD
Input
Receive data input
Transmit data pin
TxD
Output
Transmit data output
Rev. 2.0, 06/04, page 518 of 980
Internal
data bus
14.1.4
Register Configuration
The smart card interface has the internal registers listed in table 14.2. The BRR, TDR, and RDR
registers have their normal serial communication interface functions, as described in section 13,
Serial Communication Interface.
Table 14.2 Smart Card Interface Registers
1
Channel
Address*
0
H'FFFB0
Serial mode register
SMR
R/W
H'00
H'FFFB1
Bit rate register
BRR
R/W
H'FF
H'FFFB2
Serial control register
SCR
R/W
H'00
H'FFFB3
Transmit data register
TDR
R/W
H'FFFB4
1
2
Name
Abbreviation
R/W
R/(W)*
Initial Value
H'FF
2
Serial status register
SSR
H'84
H'FFFB5
Receive data register
RDR
R
H'00
H'FFFB6
Smart card mode register
SCMR
R/W
H'F2
H'FFFB8
Serial mode register
SMR
R/W
H'00
H'FFFB9
Bit rate register
BRR
R/W
H'FF
H'FFFBA
Serial control register
SCR
R/W
H'00
H'FFFBB
Transmit data register
TDR
R/W
H'FFFBC
Serial status register
SSR
R/(W)*
H'FF
H'FFFBD
Receive data register
RDR
R
H'00
H'FFFBE
Smart card mode register
SCMR
R/W
H'F2
H'FFFC0
Serial mode register
SMR
R/W
H'00
H'FFFC1
Bit rate register
BRR
R/W
H'FF
2
H'84
H'FFFC2
Serial control register
SCR
R/W
H'00
H'FFFC3
Transmit data register
TDR
R/W
H'FF
H'FFFC4
Serial status register
SSR
R/(W)*
H'FFFC5
Receive data register
RDR
R
H'00
H'FFFC6
Smart card mode register
SCMR
R/W
H'F2
2
H'84
Notes: *1 Lower 20 bits of the address in advanced mode.
*2 Only 0 can be written in bits 7 to 3, to clear the flags.
Rev. 2.0, 06/04, page 519 of 980
14.2
Register Descriptions
This section describes the new or modified registers and bit functions in the smart card interface.
14.2.1
Smart Card Mode Register (SCMR)
SCMR is an 8-bit readable/writable register that selects smart card interface functions.
7
6
5
4
3
2
1
0
—
—
—
—
SDIR
SINV
—
SMIF
Initial value
1
1
1
1
0
0
1
0
Read/Write
—
—
—
—
R/W
R/W
—
R/W
Bit
Reserved bits
Reserved bit
Smart card interface
mode select
Enables or disables
the smart card interface
function
Smart card data invert
Inverts data logic levels
Smart card data transfer direction
Selects the serial/parallel conversion format
SCMR is initialized to H'F2 by a reset and in standby mode.
Bits 7 to 4—Reserved: Read-only bits, always read as 1.
Bit 3—Smart Card Data Transfer Direction (SDIR): Selects the serial/parallel conversion
1
format.*
Bit 3
SDIR
Description
0
TDR contents are transmitted LSB-first
1
TDR contents are transmitted MSB-first
Receive data is stored LSB-first in RDR
Receive data is stored MSB-first in RDR
Rev. 2.0, 06/04, page 520 of 980
(Initial value)
Bit 2—Smart Card Data Invert (SINV): Specifies inversion of the data logic level. This
function is used in combination with the SDIR bit to communicate with inverse-convention
2
cards.* The SINV bit does not affect the logic level of the parity bit. For parity settings, see
section 14.3.4, Register Settings.
Bit 2
SINV
Description
0
Unmodified TDR contents are transmitted
(Initial value)
Receive data is stored unmodified in RDR
1
Inverted TDR contents are transmitted
Receive data is inverted before storage in RDR
Bit 1—Reserved: Read-only bit, always read as 1.
Bit 0—Smart Card Interface Mode Select (SMIF): Enables the smart card interface function.
Bit 0
SMIF
Description
0
Smart card interface function is disabled
1
Smart card interface function is enabled
(Initial value)
Notes: *1 The function for switching between LSB-first and MSB-first mode can also be used
with the normal serial communication interface. Note that when the communication
format data length is set to 7 bits and MSB-first mode is selected for the serial data to
be transferred, bit 0 of TDR is not transmitted, and only bits 7 to 1 of the received data
are valid.
*2 The data logic level inversion function can also be used with the normal serial
communication interface. Note that, when inverting the serial data to be transferred,
parity transmission and parity checking is based on the number of high-level periods at
the serial data I/O pin, and not on the register value.
14.2.2
Serial Status Register (SSR)
The function of SSR bit 4 is modified in smart card interface mode. This change also causes a
modification to the setting conditions for bit 2 (TEND).
Rev. 2.0, 06/04, page 521 of 980
7
6
5
4
3
2
1
0
TDRE
RDRF
ORER
ERS
PER
TEND
MPB
MPBT
Initial value
1
0
0
0
0
1
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R
R
R/W
Bit
Transmit end
Status flag indicating end
of transmission
Error signal status (ERS)
Status flag indicating that an error
signal has been received
Note: * Only 0 can be written, to clear the flag.
Bits 7 to 5: These bits operate as in normal serial communication. For details see section 13.2.7,
Serial Status Register (SSR).
Bit 4—Error Signal Status (ERS): In smart card interface mode, this flag indicates the status of
the error signal sent from the receiving device to the transmitting device. The smart card interface
does not detection framing errors.
Bit 4
ERS
Description
0
Indicates normal transmission, with no error signal returned
(Initial value)
[Clearing conditions]
The chip is reset, or enters standby mode or module stop mode
Software reads ERS while it is set to 1, then writes 0.
1
Indicates that the receiving device sent an error signal reporting a parity error
[Setting condition]
A low error signal was sampled.
Note: Clearing the TE bit to 0 in SCR does not affect the ERS flag, which retains its previous
value.
Bits 3 to 0: These bits operate as in normal serial communication. For details see section 13.2.7,
Serial Status Register (SSR). The setting conditions for transmit end (TEND), however, are
modified as follows.
Rev. 2.0, 06/04, page 522 of 980
Bit 2
TEND
0
Description
Transmission is in progress
[Clearing conditions]
Software reads TDRE while it is set to 1, then writes 0 in the TDRE flag.
The DMAC or DTC writes data in TDR.
1
End of transmission
[Setting conditions]
(Initial value)
The chip is reset or enters standby mode.
The TE bit and FER/ERS bit are both cleared to 0 in SCR.
TDRE is 1 and ERS is 0 at a time 2.5 etu after the last bit of a 1-byte serial character
is transmitted (normal transmission).
Note: An etu (elementary time unit) is the time needed to transmit one bit.
14.2.3
Serial Mode Register (SMR)
The function of SMR bit 7 is modified in smart card interface mode. This change also causes a
modification to the function of bits 1 and 0 in the serial control register (SCR).
Bit
7
6
5
4
3
2
1
0
GM
CHR
PE
O/E
STOP
MP
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit 7—GSM Mode (GM): With the normal smart card interface, this bit is cleared to 0. Setting
this bit to 1 selects GSM mode, an additional mode for controlling the timing for setting the
TEND flag that indicates completion of transmission, and the type of clock output used. The
details of the additional clock output control mode are specified by the CKE1 and CKE0 bits in
the serial control register (SCR).
Bit 7
GM
Description
0
Normal smart card interface mode operation
The TEND flag is set 12.5 etu after the beginning of the start bit.
Clock output on/off control only.
1
(Initial value)
GSM mode smart card interface mode operation
The TEND flag is set 11.0 etu after the beginning of the start bit.
Clock output on/off and fixed-high/fixed-low control.
Rev. 2.0, 06/04, page 523 of 980
Bit 6: Only 0 should be written to this bit.
Bits 5 to 2: These bits operate as in normal serial communication. For details see section 13.2.5,
Serial Mode Register (SMR).
Bits 1 and 0: Only 0 should be written to these bits.
14.2.4
Serial Control Register (SCR)
The function of SCR bits 1 and 0 is modified in smart card interface mode
Bit
7
6
5
4
3
2
1
0
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bits 7 to 2: These bits operate as in normal serial communication. For details see section 13.2.6,
Serial Control Register (SCR).
Bits 1 and 0—Clock Enable 1 and 0 (CKE1, CKE0): These bits select the SCI clock source and
enable or disable clock output from the SCK pin. In smart card interface mode, it is possible to
specify a fixed high level or fixed low level for the clock output, in addition to the usual switching
between enabling and disabling of the clock output.
Bit 7
GM
Bit 1
CKE1
Bit 0
CKE0
Description
0
0
0
Internal clock/SCK pin is I/O port
1
Internal clock/SCK pin is clock output
0
Internal clock/SCK pin is fixed at low output
1
1
14.3
Operation
14.3.1
Overview
1
Internal clock/SCK pin is clock output
0
Internal clock/SCK pin is fixed at high output
1
Internal clock/SCK pin is clock output
The main features of the smart card interface are as follows.
• One frame consists of 8-bit data plus a parity bit.
Rev. 2.0, 06/04, page 524 of 980
(Initial value)
• In transmission, a guard time of at least 2 etu (elementary time units: the time for transfer of
one bit) is provided between the end of the parity bit and the start of the next frame.
• If a parity error is detected during reception, a low error signal level is output for a1 etu period
10.5 etu after the start bit.
• If an error signal is detected during transmission, the same data is transmitted automatically
after the elapse of 2 etu or longer.
• Only asynchronous communication is supported; there is no synchronous communication
function.
14.3.2
Pin Connections
Figure 14.2 shows a pin connection diagram for the smart card interface.
In communication with a smart card, since both transmission and reception are carried out on a
single data transmission line, the TxD pin and RxD pin should both be connected to this line. The
data transmission line should be pulled up to VCC with a resistor.
When the smart card uses the clock generated on the smart card interface, the SCK pin output is
input to the CLK pin of the smart card. If the smart card uses an internal clock, this connection is
unnecessary.
The reset signal should be output from one of the H8/3029’s generic ports.
In addition to these pin connections, power and ground connections will normally also be
necessary.
VCC
TxD
RxD
I/O
Data line
SCK
H8/3029
chip
Clock line
Px (port)
Reset line
CLK
RST
Smart card
Card-processing device
Figure 14.2 Smart Card Interface Connection Diagram
Note: A loop-back test can be performed by setting both RE and TE to 1 without connecting a
smart card.
Rev. 2.0, 06/04, page 525 of 980
14.3.3
Data Format
Figure 14.3 shows the smart card interface data format. In reception in this mode, a parity check is
carried out on each frame, and if an error is detected an error signal is sent back to the transmitting
device to request retransmission of the data. In transmission, the error signal is sampled and the
same data is retransmitted if the error signal is low.
No parity error
Ds
D0
D1
D2
D3
D4
D5
D6
D7
Dp
D7
Dp
Output from transmitting device
Parity error
Ds
D0
D1
D2
D3
D4
D5
D6
DE
Output from transmitting device
Legend
Ds:
D0 to D7:
Dp:
DE:
Start bit
Data bits
Parity bit
Error signal
Output from
receiving
device
Figure 14.3 Smart Card Interface Data Format
The operating sequence is as follows.
1. When the data line is not in use it is in the high-impedance state, and is fixed high with a pullup resistor.
2. The transmitting device starts transfer of one frame of data. The data frame starts with a start
bit (Ds, low-level), followed by 8 data bits (D0 to D7) and a parity bit (Dp).
3. With the smart card interface, the data line then returns to the high-impedance state. The data
line is pulled high with a pull-up resistor.
4. The receiving device carries out a parity check. If there is no parity error and the data is
received normally, the receiving device waits for reception of the next data. If a parity error
occurs, however, the receiving device outputs an error signal (DE, low-level) to request
retransmission of the data. After outputting the error signal for the prescribed length of time,
the receiving device places the signal line in the high-impedance state again. The signal line is
pulled high again by a pull-up resistor.
Rev. 2.0, 06/04, page 526 of 980
5. If the transmitting device does not receive an error signal, it proceeds to transmit the next data
frame. If it receives an error signal, however, it returns to step 2 and transmits the same data
again.
14.3.4
Register Settings
Table 14.3 shows a bit map of the registers used in the smart card interface. Bits indicated as 0 or
1 must be set to the value shown. The setting of other bits is described in this section.
Table 14.3 Smart Card Interface Register Settings
Bit
Register Address*
1
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
CKS0
SMR
H'FFFB0
GM
0
1
O/E
1
0
CKS1
BRR
H'FFFB1
BRR7
BRR6
BRR5
BRR4
BRR3
BRR2
BRR1
BRR0
2
SCR
H'FFFB2
TIE
RIE
TE
RE
0
0
CKE1*
TDR
H'FFFB3
TDR7
TDR6
TDR5
TDR4
TDR3
TDR2
TDR1
TDR0
CKE0
SSR
H'FFFB4
TDRE
RDRF
ORER
ERS
PER
TEND
0
0
RDR
H'FFFB5
RDR7
RDR6
RDR5
RDR4
RDR3
RDR2
RDR1
RDR0
SCMR
H'FFFB6
—
—
—
—
SDIR
SINV
—
SMIF
Notes: — Unused bit.
*1 Lower 20 bits of the address in advanced mode.
*2 When GM is cleared to 0 in SMR, the CKE1 bit must also be cleared to 0.
Serial Mode Register (SMR) Settings: Clear the GM bit to 0 when using the normal smart card
interface mode, or set to 1 when using GSM mode. Clear the O/E bit to 0 if the smart card is of the
direct convention type, or set to 1 if of the inverse convention type.
Bits CKS1 and CKS0 select the clock source of the built-in baud rate generator. See section
14.3.5, Clock.
Bit Rate Register (BRR) Settings: BRR is used to set the bit rate. See section 14.3.5, Clock, for
the method of calculating the value to be set.
Serial Control Register (SCR) Settings: The TIE, RIE, TE, and RE bits have their normal serial
communication functions. See section 13, Serial Communication Interface, for details. The CKE1
and CKE0 bits specify clock output. To disable clock output, clear these bits to 00; to enable clock
output, set these bits to 01. Clock output is not performed when the GM bit is set to 1 in SMR.
Clock output can also be fixed low or high.
Rev. 2.0, 06/04, page 527 of 980
Smart Card Mode Register (SCMR) Settings: Clear both the SDIR bit and SINV bit cleared to
0 if the smart card is of the direct convention type, and set both to 1 if of the inverse convention
type. To use the smart card interface, set the SMIF bit to 1.
The register settings and examples of starting character waveforms are shown below for two smart
cards, one following the direct convention and one the inverse convention.
1. Direct Convention (SDIR = SINV = O/E = 0)
(Z)
A
Z
Z
A
Z
Z
Z
A
A
Z
Ds
D0
D1
D2
D3
D4
D5
D6
D7
Dp
(Z)
State
With the direct convention type, the logic 1 level corresponds to state Z and the logic 0 level to
state A, and transfer is performed in LSB-first order. In the example above, the first character
data is H'3B. The parity bit is 1, following the even parity rule designated for smart cards.
2. Indirect Convention (SDIR = SINV = O/E = 1)
(Z)
A
Z
Z
A
A
A
A
A
A
Z
Ds
D7
D6
D5
D4
D3
D2
D1
D0
Dp
(Z)
State
With the indirect convention type, the logic 1 level corresponds to state A and the logic 0 level
to state Z, and transfer is performed in MSB-first order. In the example above, the first
character data is H'3F. The parity bit is 0, corresponding to state Z, following the even parity
rule designated for smart cards.
In the H8/3029, inversion specified by the SINV bit applies only to the data bits, D7 to D0.
For parity bit inversion, the O/E bit in SMR must be set to odd parity mode. This applies to
both transmission and reception.
Rev. 2.0, 06/04, page 528 of 980
14.3.5
Clock
Only an internal clock generated by the on-chip baud rate generator can be used as the
transmit/receive clock for the smart card interface. The bit rate is set with the bit rate register
(BRR) and the CKS1 and CKS0 bits in the serial mode register (SMR). The equation for
calculating the bit rate is shown below. Table 14.5 shows some sample bit rates.
If clock output is selected with CKE0 set to 1, a clock with a frequency of 372 times the bit rate is
output from the SCK pin.
B=
φ
1488 × 22n–1 × (N + 1)
× 106
where, N: BRR setting (0 ≤ N ≤ 255)
B: Bit rate (bit/s)
φ: Operating frequency (MHz)
n: See table 14.4
Table 14.4 n-Values of CKS1 and CKS0 Settings
n
CKS1
CKS0
0
0
0
1
2
1
1
0
3
1
Note: If the gear function is used to divide the clock frequency, use the divided frequency to
calculate the bit rate. The equation above applies directly to 1/1 frequency division.
Table 14.5 Bit Rates (bits/s) for Various BRR Settings (When n = 0)
φ (MHz)
N
10.00
10.7136
13.00
14.2848
16.00
18.00
20.00
25.00
0
13440.9
14400.0
17473.1
19200.0
21505.4
24193.5
26881.7
33602.2
1
6720.4
7200.0
8736.6
9600.0
10752.7
12096.8
13440.9
16801.1
2
4480.3
4800.0
5824.4
6400.0
7168.5
8064.5
8960.6
11200.7
Note: Bit rates are rounded off to one decimal place.
Rev. 2.0, 06/04, page 529 of 980
The following equation calculates the bit rate register (BRR) setting from the operating frequency
and bit rate. N is an integer from 0 to 255, specifying the value with the smaller error.
N=
φ
1488 × 22n–1 × B
× 106 – 1
Table 14.6 BRR Settings for Typical Bit Rates (bits/s) (When n = 0)
φ (MHz)
10.00
10.7136
13.00
14.2848
16.00
18.00
20.00
25.0
bit/s
N Error
N Error
N Error
N Error
N Error
N Error
N Error
N Error
9600
1 30
1 25
1 8.99
1 0.00
1 12.01
2 15.99
2 6.66
3 12.49
Table 14.7 Maximum Bit Rates for Various Frequencies (Smart Card Interface Mode)
φ (MHz)
Maximum Bit Rate (bits/s)
N
n
10.00
13441
0
0
10.7136
14400
0
0
13.00
17473
0
0
14.2848
19200
0
0
16.00
21505
0
0
18.00
24194
0
0
20.00
26882
0
0
25.00
33602
0
0
The bit rate error is given by the following equation:
Error (%) =
φ
1488 × 22n-1 × B × (N + 1)
Rev. 2.0, 06/04, page 530 of 980
× 106 – 1
× 100
14.3.6
Transmitting and Receiving Data
Initialization: Before transmitting or receiving data, the smart card interface must be initialized as
described below. Initialization is also necessary when switching from transmit mode to receive
mode, or vice versa.
1. Clear the TE and RE bits to 0 in the serial control register (SCR).
2. Clear error flags ERS, PER, and ORER to 0 in the serial status register (SSR).
3. Set the parity bit (O/E) and baud rate generator select bits (CKS1 and CKS0) in the serial
mode register (SMR). Clear the C/A, CHR, and MP bits to 0, and set the STOP and PE bits to
1.
4. Set the SMIF, SDIR, and SINV bits in the smart card mode register (SCMR).
When the SMIF bit is set to 1, the TxD pin and RxD pin are both switched from port to SCI
pin functions and go to the high-impedance state.
5. Set a value corresponding to the desired bit rate in the bit rate register (BRR).
6. Set the CKE0 bit in SCR. Clear the TIE, RIE, TE, RE, MPIE, TEIE, and CKE1 bits to 0. If the
CKE0 bit is set to 1, the clock is output from the SCK pin.
7. Wait at least one bit interval, then set the TIE, RIE, TE, and RE bits in SCR. Do not set the TE
bit and RE bit at the same time, except for self-diagnosis.
Transmitting Serial Data: As data transmission in smart card mode involves error signal
sampling and retransmission processing, the processing procedure is different from that for the
normal SCI. Figure 14.5 shows a sample transmission processing flowchart.
1. Perform smart card interface mode initialization as described in Initialization above.
2. Check that the ERS error flag is cleared to 0 in SSR.
3. Repeat steps 2 and 3 until it can be confirmed that the TEND flag is set to 1 in SSR.
4. Write the transmit data in TDR, clear the TDRE flag to 0, and perform the transmit operation.
The TEND flag is cleared to 0.
5. To continue transmitting data, go back to step 2.
6. To end transmission, clear the TE bit to 0.
The above processing may include interrupt handling DMA transfer.
If transmission ends and the TEND flag is set to 1 while the TIE bit is set to 1 and interrupt
requests are enabled, a transmit-data-empty interrupt (TXI) will be requested. If an error occurs in
transmission and the ERS flag is set to 1 while the RIE bit is set to 1 and interrupt requests are
enabled, a transmit/receive-error interrupt (ERI) will be requested.
The timing of TEND flag setting depends on the GM bit in SMR (see figure 14.4).
Rev. 2.0, 06/04, page 531 of 980
If the TXI interrupt activates the DMAC, the number of bytes designated in the DMAC can be
transmitted automatically, including automatic retransmission.
For details, see Interrupt Operations and Data Transfer by DMAC in this section.
Serial data
Dp
Ds
DE
Guard time
(1) GM = 0
TEND
12.5 etu
(2) GM = 1
TEND
11.0 etu
Figure 14.4 Timing of TEND Flag Setting
Rev. 2.0, 06/04, page 532 of 980
Start
Initialization
Start transmitting
No
ERS = 0?
Yes
Error handling
No
TEND = 1?
Yes
Write transmit data in TDR,
and clear TDRE flag
to 0 in SSR
No
All data transmitted?
Yes
No
ERS = 0?
Yes
Error handling
No
TEND = 1?
Yes
Clear TE bit to 0
End
Figure 14.5 Sample Transmission Processing Flowchart
Rev. 2.0, 06/04, page 533 of 980
TDR
1. Data write
Data 1
2. Transfer from TDR to TSR
Data 1
3. Serial data output
Data 1
TSR
(shift register)
Data 1
Data remains in TDR
Data 1
I/O signal
output
In case of normal transmission: TEND flag is set
In case of transmit error:
ERS flag is set
Steps 2 and 3 above are repeated until the
TEND flag is set.
Note: When the ERS flag is set, it should be cleared until transfer of the last bit (D7 in LSB-first
transmission, D0 in MSB-first transmission) of the retransmit data to be transmitted next has
been completed.
Figure 14.6 Relation Between Transmit Operation and Internal Registers
I/O data
Ds
Da
Db
Dc
Dd
De
Df
Dg
Dh
Dp
DE
Guard time
TXI (TEND
interrupt)
12.5 etu
11.0 etu
When GM = 0
When GM = 1
Figure 14.7 Timing of TEND Flag Setting
Receiving Serial Data: Data reception in smart card mode uses the same processing procedure as
for the normal SCI. Figure 14.8 shows a sample reception processing flowchart.
1. Perform smart card interface mode initialization as described in Initialization above.
2. Check that the ORER flag and PER flag are cleared to 0 in SSR. If either is set, perform the
appropriate receive error handling, then clear both the ORER and the PER flag to 0.
3. Repeat steps 2 and 3 until it can be confirmed that the RDRF flag is set to 1.
4. Read the receive data from RDR.
5. To continue receiving data, clear the RDRF flag to 0 and go back to step 2.
6. To end reception, clear the RE bit to 0.
Rev. 2.0, 06/04, page 534 of 980
Start
Initialization
Start receiving
ORER = 0
and PER = 0?
No
Yes
Error handling
No
RDRF = 1?
Yes
Read RDR and clear
RDRF flag to 0 in SSR
No
All data received?
Yes
Clear RE bit to 0
Figure 14.8 Sample Reception Processing Flowchart
The above procedure may include interrupt handling and DMA transfer.
If reception ends and the RDRF flag is set to 1 while the RIE bit is set to 1 and interrupt requests
are enabled, a receive-data-full interrupt (RXI) will be requested. If an error occurs in reception
and either the ORER flag or the PER flag is set to 1, a transmit/receive-error interrupt (ERI) will
be requested.
If the RXI interrupt activates the DMAC, the number of bytes designated in the DMAC will be
transferred, skipping receive data in which an error occurred.
For details, see Interrupt Operations and Data Transfer by DMAC in this section.
If a parity error occurs during reception and the PER flag is set to 1, the received data is
transferred to RDR, so the erroneous data can be read.
Rev. 2.0, 06/04, page 535 of 980
Switching Modes: When switching from receive mode to transmit mode, first confirm that the
receive operation has been completed, then start from initialization, clearing RE to 0 and setting
TE to 1. The RDRF, PER, or ORER flag can be used to check that the receive operation has been
completed.
When switching from transmit mode to receive mode, first confirm that the transmit operation has
been completed, then start from initialization, clearing TE to 0 and setting RE to 1. The TEND
flag can be used to check that the transmit operation has been completed.
Fixing Clock Output: When the GM bit is set to 1 in SMR, clock output can be fixed by means
of the CKE1 and CKE0 bits in SCR. The minimum clock pulse width can be set to the specified
width in this case.
Figure 14.9 shows the timing for fixing clock output. In this example, GM = 1, CKE1 = 0, and the
CKE0 bit is controlled.
Specified pulse
width
Specified pulse
width
CKE1 value
SCK
SCR write
(CKE0 = 0)
SCR write
(CKE0 = 1)
Figure 14.9 Timing for Fixing Cock Output
Interrupt Operations: The smart card interface has three interrupt sources: transmit-data-empty
(TXI), transmit/receive-error (ERI), and receive-data-full (RXI). The transmit-end interrupt
request (TEI) is not available in smart card mode.
A TXI interrupt is requested when the TEND flag is set to 1 in SSR. An RXI interrupt is requested
when the RDRF flag is set to 1 in SSR. An ERI interrupt is requested when the ORER, PER, or
ERS flag is set to 1 in SSR. These relationships are shown in table 14.8.
Rev. 2.0, 06/04, page 536 of 980
Table 14.8 Smart Card Interface Mode Operating States and Interrupt Sources
Flag
Enable Bit
Interrupt
Source
DMAC
Activation
Normal
operation
TEND
TIE
TXI
Available
Error
ERS
RIE
ERI
Not available
Normal
operation
RDRF
RIE
RXI
Available
Error
PER, ORER
RIE
ERI
Not available
Operating State
Transmit Mode
Receive Mode
Data Transfer by DMAC: The DMAC can be used to transmit and receive data in smart card
mode, as in normal SCI operations. In transmit mode, when the TEND flag is set to 1 in SSR, the
TDRE flag is set simultaneously, generating a TXI interrupt. If the TXI request is designated
beforehand as a DMAC activation source, the DMAC will be activated by the TXI request and
will transfer the next transmit data. This data transfer by the DMAC automatically clears the
TDRE and TEND flags to 0. In the event of an error, the SCI automatically retransmits the same
data, keeping the TEND flag cleared to 0 so that the DMAC is not activated. The SCI and DMAC
will therefore automatically transmit the designated number of bytes, including retransmission
when an error occurs. When an error occurs, the ERS flag is not cleared automatically, so the RIE
bit should be set to 1 to enable the error to generate an ERI request, and the ERI interrupt handler
should clear ERS.
When using the DMAC to transmit or receive, first set up and enable the DMAC, then make SCI
settings. DMAC settings are described in section 7, DMA controller.
In receive operations, an RXI interrupt is requested when the RDRF flag is set to 1 in SSR. If the
RXI request is designated beforehand as a DMAC activation source, the DMAC will be activated
by the RXI request and will transfer the received data. This data transfer by the DMAC
automatically clears the RDRF flag to 0. When an error occurs, the RDRF flag is not set and an
error flag is set instead. The DMAC is not activated. The ERI interrupt request is directed to the
CPU. The ERI interrupt handler should clear the error flags.
Rev. 2.0, 06/04, page 537 of 980
Examples of Operation in GSM Mode: When switching between smart card interface mode and
software standby mode, use the following procedures to maintain the clock duty cycle.
• Switching from smart card interface mode to software standby mode
1. Set the P94 data register (DR) and data direction register (DDR) to the values for the fixed
output state in software standby mode.
2. Write 0 in the TE and RE bits in the serial control register (SCR) to stop transmit/receive
operations. At the same time, set the CKE1 bit to the value for the fixed output state in
software standby mode.
3. Write 0 in the CKE0 bit in SCR to stop the clock.
4. Wait for one serial clock cycle. During this period, the duty cycle is preserved and clock
output is fixed at the specified level.
5. Write H'00 in the serial mode register (SMR) and smart card mode register (SCMR).
6. Make the transition to the software standby state.
• Returning from software standby mode to smart card interface mode
1. Clear the software standby state.
2. Set the CKE1 bit in SCR to the value for the fixed output state at the start of software standby
(the current P94 pin state).
3. Set smart card interface mode and output the clock. Clock signal generation is started with the
normal duty cycle.
Normal operation
(1) (2) (3)
Software
standby
(4) (5) (6)
Normal operation
(1) (2) (3)
Figure 14.10 Procedure for Stopping and Restarting the Clock
Use the following procedure to secure the clock duty cycle after powering on.
1. The initial state is port input and high impedance. Use pull-up or pull-down resistors to fix the
potential.
2. Fix at the output specified by the CKE1 bit in SCR.
3. Set SMR and SCMR, and switch to smart card interface mode operation.
4. Set the CKE0 bit to 1 in SCR to start clock output.
Rev. 2.0, 06/04, page 538 of 980
14.4
Usage Notes
The following points should be noted when using the SCI as a smart card interface.
Receive Data Sampling Timing and Receive Margin in Smart Card Interface Mode: In smart
card interface mode, the SCI operates on a base clock with a frequency of 372 times the transfer
rate. In reception, the SCI synchronizes internally with the fall of the start bit, which it samples on
the base clock. Receive data is latched at the rising edge of the 186th base clock pulse. The timing
is shown in figure 14.11.
372 clocks
186 clocks
0
185
185
371 0
371 0
Internal base
clock
Receive data
(RxD)
Start bit
D0
D1
Synchronization
sampling timing
Data sampling
timing
Figure 14.11 Receive Data Sampling Timing in Smart Card Interface Mode
Rev. 2.0, 06/04, page 539 of 980
The receive margin can therefore be expressed as follows.
Receive margin in smart card interface mode:
M = (0.5 –
1
) – (L – 0.5) F –
2N
M:
N:
D:
L:
F:
D – 0.5
(1 + F) × 100%
N
Receive margin (%)
Ratio of clock frequency to bit rate (N = 372)
Clock duty cycle (L = 0 to 1.0)
Frame length (L =10)
Absolute deviation of clock frequency
From the above equation, if F = 0 and D = 0.5, the receive margin is as follows.
When D = 0.5 and F = 0:
M = (0.5 – 1/2 × 372) × 100%
= 49.866%
Retransmission: Retransmission is performed by the SCI in receive mode and transmit mode as
described below.
• Retransmission when SCI is in Receive Mode
Figure 14.12 illustrates retransmission when the SCI is in receive mode.
1. If an error is found when the received parity bit is checked, the PER bit is automatically set to
1. If the RIE bit in SCR is set to the enable state, an ERI interrupt is requested. The PER bit
should be cleared to 0 in SSR before the next parity bit sampling timing.
2. The RDRF bit in SSR is not set for the frame in which the error has occurred.
3. If no error is found when the received parity bit is checked, the PER bit is not set to 1 in SSR.
4. If no error is found when the received parity bit is checked, the receive operation is assumed to
have been completed normally, and the RDRF bit is automatically set to 1 in SSR. If the RIE
bit in SCR is set to the enable state, an RXI interrupt is requested. If RXI is enabled as a DMA
transfer activation source, the RDR contents can be read automatically. When the DMAC
reads the RDR data, the RDRF flag is automatically cleared to 0.
5. When a normal frame is received, the data pin is held in the high-impedance state at the error
signal transmission timing.
Rev. 2.0, 06/04, page 540 of 980
Frame n
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
Frame n+1
Retransmitted frame
DE
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
(DE)
Ds D0 D1 D2 D3 D4
RDRF
[2]
[4]
[1]
[3]
PER
Figure 14.12 Retransmission in SCI Receive Mode
• Retransmission when SCI is in Transmit Mode
Figure 14.13 illustrates retransmission when the SCI is in transmit mode.
6. If an error signal is sent back from the receiving device after transmission of one frame is
completed, the ERS bit is set to 1 in SSR. If the RIE bit in SCR is set to the enable state, an
ERI interrupt is requested. The ERS bit should be cleared to 0 in SSR before the next parity bit
sampling timing.
7. The TEND bit in SSR is not set for the frame for which the error signal was received.
8. If an error signal is not sent back from the receiving device, the ERS flag is not set in SSR.
9. If an error signal is not sent back from the receiving device, transmission of one frame,
including retransmission, is assumed to have been completed, and the TEND bit is set to 1 in
SSR. If the TIE bit in SCR is set to the enable state, a TXI interrupt is requested. If TXI is
enabled as a DMA transfer activation source, the next data can be written in TDR
automatically. When the DMAC writes data in TDR, the TDRE bit is automatically cleared to
0.
Frame n
Frame n+1
Retransmitted frame
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp DE
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
(DE)
Ds D0 D1 D2 D3 D4
TDRE
Transfer from TDR to TSR
Transfer from TDR to TSR
Transfer from TDR to TSR
TEND
[7]
[9]
ERS
[6]
[8]
Figure 14.13 Retransmission in SCI Transmit Mode
Support of Block Transfer Mode: The smart card interface of this LSI supports an IC card
(smart card) interface corresponding to T=0 (character transfer) in ISO/IEC 7816-3.
Rev. 2.0, 06/04, page 541 of 980
Rev. 2.0, 06/04, page 542 of 980
Section 15 A/D Converter
15.1
Overview
The H8/3029 includes a 10-bit successive-approximations A/D converter with a selection of up to
eight analog input channels.
When the A/D converter is not used, it can be halted independently to conserve power. For details
see section 20.6, Module Standby Function.
15.1.1
Features
A/D converter features are listed below.
• 10-bit resolution
• Eight input channels
• Selectable analog conversion voltage range
The analog voltage conversion range can be programmed by input of an analog reference
voltage at the VREF pin.
• High-speed conversion
Conversion time: maximum 5.36 µs per channel (with 25 MHz system clock)
• Two conversion modes
Single mode: A/D conversion of one channel
Scan mode: continuous conversion on one to four channels
• Four 16-bit data registers
A/D conversion results are transferred for storage into data registers corresponding to the
channels.
• Sample-and-hold function
• Three conversion start sources
The A/D converter can be activated by software, an external trigger, or an 8-bit timer compare
match.
• A/D interrupt requested at end of conversion
At the end of A/D conversion, an A/D end interrupt (ADI) can be requested.
• DMA controller (DMAC) activation
The DMAC can be activated at the end of A/D conversion.
Rev. 2.0, 06/04, page 543 of 980
15.1.2
Block Diagram
Figure 15.1 shows a block diagram of the A/D converter.
Internal
data bus
AVSS
AN 0
ADCR
ADCSR
ADDRD
–
AN 2
AN 4
ADDRC
+
AN 1
AN 3
ADDRB
10-bit D/A
ADDRA
VREF
Successiveapproximations register
AVCC
Bus interface
Module data bus
Analog
multiplexer
AN 5
φ/4
Comparator
Control circuit
Sample-andhold circuit
φ/8
AN 6
AN 7
ADI
interrupt signal
ADTRG
Compare match A0
ADTE
8-bit timer TCSR0
Legend
ADCR:
ADCSR:
ADDRA:
ADDRB:
ADDRC:
ADDRD:
A/D control register
A/D control/status register
A/D data register A
A/D data register B
A/D data register C
A/D data register D
Figure 15.1 A/D Converter Block Diagram
Rev. 2.0, 06/04, page 544 of 980
15.1.3
Input Pins
Table 15.1 summarizes the A/D converter’s input pins. The eight analog input pins are divided
into two groups: group 0 (AN0 to AN3), and group 1 (AN4 to AN7). AVCC and AVSS are the power
supply for the analog circuits in the A/D converter. VREF is the A/D conversion reference voltage.
Table 15.1 A/D Converter Pins
Pin Name
Abbreviation
I/O
Analog power supply pin
AVCC
Input
Analog power supply
Analog ground pin
AVSS
Input
Analog ground and reference voltage
Reference voltage pin
VREF
Input
Analog reference voltage
Analog input pin 0
AN0
Input
Group 0 analog inputs
Analog input pin 1
AN1
Input
Analog input pin 2
AN2
Input
Analog input pin 3
AN3
Input
Analog input pin 4
AN4
Input
Analog input pin 5
AN5
Input
Analog input pin 6
AN6
Input
Analog input pin 7
AN7
Input
A/D external trigger input pin ADTRG
Input
Function
Group 1 analog inputs
External trigger input for starting A/D conversion
Rev. 2.0, 06/04, page 545 of 980
15.1.4
Register Configuration
Table 15.2 summarizes the A/D converter’s registers.
Table 15.2 A/D Converter Registers
Address*
1
Name
Abbreviation
R/W
Initial Value
H'FFFE0
A/D data register A H
ADDRAH
R
H'00
H'FFFE1
A/D data register A L
ADDRAL
R
H'00
H'FFFE2
A/D data register B H
ADDRBH
R
H'00
H'FFFE3
A/D data register B L
ADDRBL
R
H'00
H'FFFE4
A/D data register C H
ADDRCH
R
H'00
H'FFFE5
A/D data register C L
ADDRCL
R
H'00
H'FFFE6
A/D data register D H
ADDRDH
R
H'00
H'FFFE7
A/D data register D L
ADDRDL
R
H'FFFE8
A/D control/status register
ADCSR
R/(W)*
H'FFFE9
A/D control register
ADCR
R/W
Notes: *1 Lower 20 bits of the address in advanced mode.
*2 Only 0 can be written in bit 7, to clear the flag.
Rev. 2.0, 06/04, page 546 of 980
H'00
2
H'00
H'7E
15.2
Register Descriptions
15.2.1
A/D Data Registers A to D (ADDRA to ADDRD)
ADDRn
14
12
10
8
6
5
4
3
2
1
0
AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 —
—
—
—
—
—
15
Bit
13
11
9
7
Initial value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Read/Write
(n = A to D)
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
A/D conversion data
10-bit data giving an
A/D conversion result
Reserved bits
The four A/D data registers (ADDRA to ADDRD) are 16-bit read-only registers that store the
results of A/D conversion.
An A/D conversion produces 10-bit data, which is transferred for storage into the A/D data
register corresponding to the selected channel. The upper 8 bits of the result are stored in the
upper byte of the A/D data register. The lower 2 bits are stored in the lower byte. Bits 5 to 0 of an
A/D data register are reserved bits that are always read as 0. Table 15.3 indicates the pairings of
analog input channels and A/D data registers.
The CPU can always read and write the A/D data registers. The upper byte can be read directly,
but the lower byte is read through a temporary register (TEMP). For details see section 15.3, CPU
Interface.
The A/D data registers are initialized to H'0000 by a reset and in standby mode.
Table 15.3 Analog Input Channels and A/D Data Registers
Analog Input Channel
Group 0
Group 1
A/D Data Register
AN0
AN4
ADDRA
AN1
AN5
ADDRB
AN2
AN6
ADDRC
AN3
AN7
ADDRD
Rev. 2.0, 06/04, page 547 of 980
15.2.2
A/D Control/Status Register (ADCSR)
Bit
7
6
5
4
3
2
1
0
ADF
ADIE
ADST
SCAN
CKS
CH2
CH1
CH0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W) *
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Channel select 2 to 0
These bits select analog
input channels
Clock select
Selects the A/D conversion time
Scan mode
Selects single mode or scan mode
A/D start
Starts or stops A/D conversion
A/D interrupt enable
Enables and disables A/D end interrupts
A/D end flag
Indicates end of A/D conversion
Note: * Only 0 can be written, to clear the flag.
ADCSR is an 8-bit readable/writable register that selects the mode and controls the A/D converter.
ADCSR is initialized to H'00 by a reset and in standby mode.
Rev. 2.0, 06/04, page 548 of 980
Bit 7—A/D End Flag (ADF): Indicates the end of A/D conversion.
Bit 7
ADF
Description
0
[Clearing condition]
Read ADF when ADF =1, then write 0 in ADF.
DMAC activated by ADI interrupt.
1
[Setting conditions]
Single mode: A/D conversion ends
Scan mode: A/D conversion ends in all selected channels
(Initial value)
Bit 6—A/D Interrupt Enable (ADIE): Enables or disables the interrupt (ADI) requested at the
end of A/D conversion.
Bit 6
ADIE
Description
0
A/D end interrupt request (ADI) is disabled
1
A/D end interrupt request (ADI) is enabled
(Initial value)
Bit 5—A/D Start (ADST): Starts or stops A/D conversion. The ADST bit remains set to 1 during
A/D conversion. It can also be set to 1 by external trigger input at the ADTRG pin, or by an 8-bit
timer compare match.
Bit 5
ADST
Description
0
A/D conversion is stopped
1
Single mode: A/D conversion starts; ADST is automatically cleared to 0 when
conversion ends.
Scan mode: A/D conversion starts and continues, cycling among the selected
channels, until ADST is cleared to 0 by software, by a reset, or by a transition to
standby mode.
(Initial value)
Rev. 2.0, 06/04, page 549 of 980
Bit 4—Scan Mode (SCAN): Selects single mode or scan mode. For further information on
operation in these modes, see section 15.4, Operation. Clear the ADST bit to 0 before switching
the conversion mode.
Bit 4
SCAN
Description
0
Single mode
1
Scan mode
(Initial value)
Bit 3—Clock Select (CKS): Selects the A/D conversion time. Clear the ADST bit to 0 before
switching the conversion time.
Bit 3
CKS
Description
0
Conversion time = 134 states (maximum)
1
Conversion time = 70 states (maximum)
(Initial value)
Bits 2 to 0—Channel Select 2 to 0 (CH2 to CH0): These bits and the SCAN bit select the analog
input channels. Clear the ADST bit to 0 before changing the channel selection.
Group
Selection
Channel Selection
Description
CH2
CH1
CH0
Single Mode
Scan Mode
0
0
0
AN0 (Initial value)
AN0
1
AN1
AN0, AN1
1
0
AN2
AN0 to AN2
1
AN3
AN0 to AN3
0
0
AN4
AN4
1
AN5
AN4, AN5
0
AN6
AN4 to AN6
1
AN7
AN4 to AN7
1
1
Rev. 2.0, 06/04, page 550 of 980
15.2.3
A/D Control Register (ADCR)
Bit
7
6
5
4
3
2
1
0
TRGE
—
—
—
—
—
—
—
Initial value
0
1
1
1
1
1
1
0
Read/Write
R/W
—
—
—
—
R/W
R/W
R/W
Reserved bits
Trigger enable
Enables or disables starting of A/D conversion
by an external trigger or 8-bit timer compare match
ADCR is an 8-bit readable/writable register that enables or disables starting of A/D conversion by
external trigger input or an 8-bit timer compare match signal. ADCR is initialized to H'7E by a
reset and in standby mode.
Bit 7—Trigger Enable (TRGE): Enables or disables starting of A/D conversion by an external
trigger or 8-bit timer compare match.
Bit 7
TRGE
Description
0
Starting of A/D conversion by an external trigger or 8-bit timer
compare match is disabled
1
A/D conversion is started at the falling edge of the external trigger
signal (ADTRG) or by an 8-bit timer compare match
(Initial value)
External trigger pin and 8-bit timer selection are performed by the 8-bit timer. For details, see
section 10, 8-Bit Timers.
Bits 6 to 3—Reserved: These bits cannot be modified and are always read as 1.
Bit 2, 1—Reserved: These bits can be read or written, but must not be set to 0.
Bit 0—Reserved: This bit can be read or written, but must not be set to 1.
Rev. 2.0, 06/04, page 551 of 980
15.3
CPU Interface
ADDRA to ADDRD are 16-bit registers, but they are connected to the CPU by an 8-bit data bus.
Therefore, although the upper byte can be be accessed directly by the CPU, the lower byte is read
through an 8-bit temporary register (TEMP).
An A/D data register is read as follows. When the upper byte is read, the upper-byte value is
transferred directly to the CPU and the lower-byte value is transferred into TEMP. Next, when the
lower byte is read, the TEMP contents are transferred to the CPU.
When reading an A/D data register, always read the upper byte before the lower byte. It is
possible to read only the upper byte, but if only the lower byte is read, incorrect data may be
obtained.
Figure 15.2 shows the data flow for access to an A/D data register.
Upper-byte read
CPU
(H'AA)
Module data bus
Bus interface
TEMP
(H'40)
ADDRnH
(H'AA)
ADDRnL
(H'40)
(n = A to D)
Lower-byte read
CPU
(H'40)
Module data bus
Bus interface
TEMP
(H'40)
ADDRnH
(H'AA)
ADDRnL
(H'40)
(n = A to D)
Figure 15.2 A/D Data Register Access Operation (Reading H'AA40)
Rev. 2.0, 06/04, page 552 of 980
15.4
Operation
The A/D converter operates by successive approximations with 10-bit resolution. It has two
operating modes: single mode and scan mode.
15.4.1
Single Mode (SCAN = 0)
Single mode should be selected when only one A/D conversion on one channel is required. A/D
conversion starts when the ADST bit is set to 1 by software, or by external trigger input. The
ADST bit remains set to 1 during A/D conversion and is automatically cleared to 0 when
conversion ends.
When conversion ends the ADF bit is set to 1. If the ADIE bit is also set to 1, an ADI interrupt is
requested at this time. To clear the ADF flag to 0, first read ADCSR, then write 0 in ADF.
When the mode or analog input channel must be switched during analog conversion, to prevent
incorrect operation, first clear the ADST bit to 0 in ADCSR to halt A/D conversion. After making
the necessary changes, set the ADST bit to 1 to start A/D conversion again. The ADST bit can be
set at the same time as the mode or channel is changed.
Typical operations when channel 1 (AN1) is selected in single mode are described next.
Figure 15.3 shows a timing diagram for this example.
1. Single mode is selected (SCAN = 0), input channel AN1 is selected (CH2 = CH1 = 0,
CH0 = 1), the A/D interrupt is enabled (ADIE = 1), and A/D conversion is started
(ADST = 1).
2. When A/D conversion is completed, the result is transferred into ADDRB. At the same time
the ADF flag is set to 1, the ADST bit is cleared to 0, and the A/D converter becomes idle.
3. Since ADF = 1 and ADIE = 1, an ADI interrupt is requested.
4. The A/D interrupt handling routine starts.
5. The routine reads ADCSR, then writes 0 in the ADF flag.
6. The routine reads and processes the conversion result (ADDRB).
7. Execution of the A/D interrupt handling routine ends. After that, if the ADST bit is set to 1,
A/D conversion starts again and steps 2 to 7 are repeated.
Rev. 2.0, 06/04, page 553 of 980
Figure 15.3 Example of A/D Converter Operation (Single Mode, Channel 1 Selected)
Rev. 2.0, 06/04, page 554 of 980
Note: * Vertical arrows ( ) indicate instructions executed by software.
ADDRD
ADDRC
ADDRB
Read conversion result
A/D conversion result (2)
Idle
Clear *
A/D conversion result (1)
A/D conversion (2)
Set *
Read conversion result
Idle
State of channel 3
(AN 3)
ADDRA
Idle
State of channel 2
(AN 2)
Idle
Clear *
State of channel 1
(AN 1)
A/D conversion (1)
Set *
Idle
Idle
A/D conversion
starts
State of channel 0
(AN 0)
ADF
ADST
ADIE
Set *
15.4.2
Scan Mode (SCAN = 1)
Scan mode is useful for monitoring analog inputs in a group of one or more channels. When the
ADST bit is set to 1 by software or external trigger input, A/D conversion starts on the first
channel in the group (AN0 when CH2 = 0, AN4 when CH2 = 1). When two or more channels are
selected, after conversion of the first channel ends, conversion of the second channel (AN1 or
AN5) starts immediately. A/D conversion continues cyclically on the selected channels until the
ADST bit is cleared to 0. The conversion results are transferred for storage into the A/D data
registers corresponding to the channels.
When the mode or analog input channel selection must be changed during analog conversion, to
prevent incorrect operation, first clear the ADST bit to 0 in ADCSR to halt A/D conversion. After
making the necessary changes, set the ADST bit to 1. A/D conversion will start again from the
first channel in the group. The ADST bit can be set at the same time as the mode or channel
selection is changed.
Typical operations when three channels in group 0 (AN0 to AN2) are selected in scan mode are
described next. Figure 15.4 shows a timing diagram for this example.
1. Scan mode is selected (SCAN = 1), scan group 0 is selected (CH2 = 0), analog input channels
AN0 to AN2 are selected (CH1 = 1, CH0 = 0), and A/D conversion is started (ADST = 1).
2. When A/D conversion of the first channel (AN0) is completed, the result is transferred into
ADDRA. Next, conversion of the second channel (AN1) starts automatically.
3. Conversion proceeds in the same way through the third channel (AN2).
4. When conversion of all selected channels (AN0 to AN2) is completed, the ADF flag is set to 1
and conversion of the first channel (AN0) starts again. If the ADIE bit is set to 1, an ADI
interrupt is requested at this time.
5. Steps 2 to 4 are repeated as long as the ADST bit remains set to 1. When the ADST bit is
cleared to 0, A/D conversion stops. After that, if the ADST bit is set to 1, A/D conversion
starts again from the first channel (AN0).
Rev. 2.0, 06/04, page 555 of 980
Figure 15.4 Example of A/D Converter Operation (Scan Mode,
Channels AN0 to AN2 Selected)
Rev. 2.0, 06/04, page 556 of 980
Idle
Idle
Idle
A/D conversion (1)
Transfer
Idle
A/D conversion (3)
Idle
Idle
Clear*1
Idle
A/D conversion result (3)
A/D conversion result (2)
A/D conversion result (4)
Idle
A/D conversion (5)*2
A/D conversion time
A/D conversion (4)
A/D conversion result (1)
A/D conversion (2)
Idle
Notes: *1 Vertical arrows ( ) indicate instructions executed by software.
*2 Data currently being converted is ignored.
ADDRD
ADDRC
ADDRB
ADDRA
State of channel 3
(AN 3)
State of channel 2
(AN 2)
State of channel 1
(AN 1)
State of channel 0
(AN 0)
ADF
ADST
Set *1
Continuous A/D conversion
Clear*1
15.4.3
Input Sampling and A/D Conversion Time
The A/D converter has a built-in sample-and-hold circuit. The A/D converter samples the analog
input at a time tD after the ADST bit is set to 1, then starts conversion. Figure 15.5 shows the A/D
conversion timing. Table 15.4 indicates the A/D conversion time.
As indicated in figure 15.5, the A/D conversion time includes tD and the input sampling time. The
length of tD varies depending on the timing of the write access to ADCSR. The total conversion
time therefore varies within the ranges indicated in table 15.4.
In scan mode, the values given in table 15.4 apply to the first conversion. In the second and
subsequent conversions the conversion time is fixed at 128 states when CKS = 0 or 66 states when
CKS = 1.
(1)
φ
Address bus
(2)
Write signal
Input sampling
timing
ADF
tD
t SPL
t CONV
Legend
(1):
ADCSR write cycle
(2):
ADCSR address
tD :
A/D conversion start delay time
t SPL : Input sampling time
t CONV : A/D conversion time
Figure 15.5 A/D Conversion Timing
Rev. 2.0, 06/04, page 557 of 980
Table 15.4 A/D Conversion Time (Single Mode)
CKS = 0
CKS = 1
Symbol
Min
Typ
Max
Min
Typ
Max
Synchronization delay
tD
6
—
9
4
—
5
Input sampling time
tSPL
—
31
—
—
15
—
A/D conversion time
tCONV
131
—
134
69
—
70
Note: Values in the table are numbers of states.
15.4.4
External Trigger Input Timing
A/D conversion can be externally triggered. When the TRGE bit is set to 1 in ADCR and the 8-bit
timer's ADTE bit is cleared to 0, external trigger input is enabled at the ADTRG pin. A high-tolow transition at the ADTRG pin sets the ADST bit to 1 in ADCSR, starting A/D conversion.
Other operations, in both single and scan modes, are the same as if the ADST bit had been set to 1
by software. Figure 15.6 shows the timing.
φ
ADTRG
Internal trigger
signal
ADST
A/D conversion
Figure 15.6 External Trigger Input Timing
Rev. 2.0, 06/04, page 558 of 980
15.5
Interrupts
The A/D converter generates an interrupt (ADI) at the end of A/D conversion. The ADI interrupt
request can be enabled or disabled by the ADIE bit in ADCSR. The ADI interrupt request can be
designated as a DMAC activation source. In this case, an interrupt request is not sent to the CPU.
15.6
Usage Notes
When using the A/D converter, note the following points:
1. Analog Input Voltage Range: During A/D conversion, the voltages input to the analog input
pins should be in the range AVSS ≤ ANn ≤ VREF.
2. Relationships of AVCC and AVSS to VCC and VSS: AVCC, AVSS, VCC, and VSS should be related as
follows: AVSS = VSS. AVCC and AVSS must not be left open, even if the A/D converter is not
used.
3. VREF Programming Range: The reference voltage input at the VREF pin should be in the range
VREF ≤ AVCC.
4. Note on Board Design: In board layout, separate the digital circuits from the analog circuits as
much as possible. Particularly avoid layouts in which the signal lines of digital circuits cross or
closely approach the signal lines of analog circuits. Induction and other effects may cause the
analog circuits to operate incorrectly, or may adversely affect the accuracy of A/D conversion.
The analog input signals (AN0 to AN7), analog reference voltage (VREF), and analog supply
voltage (AVCC) must be separated from digital circuits by the analog ground (AVSS). The
analog ground (AVSS) should be connected to a stable digital ground (VSS) at one point on the
board.
5. Note on Noise: To prevent damage from surges and other abnormal voltages at the analog
input pins (AN0 to AN7) and analog reference voltage pin (VREF), connect a protection circuit
like the one in figure 15.7 between AVCC and AVSS. The bypass capacitors connected to AVCC
and VREF and the filter capacitors connected to AN0 to AN7 must be connected to AVSS. If filter
capacitors like the ones in figure 15.7 are connected, the voltage values input to the analog
input pins (AN0 to AN7) will be smoothed, which may give rise to error. Error can also occur if
A/D conversion is frequently performed in scan mode so that the current that charges and
discharges the capacitor in the sample-and-hold circuit of the A/D converter becomes greater
than that input to the analog input pins via input impedance Rin. The circuit constants should
therefore be selected carefully.
Rev. 2.0, 06/04, page 559 of 980
AV CC
VREF
100 Ω
Rin*2
*1
AN0 to AN7
*1
0.1 µF
AV SS
Notes: *1
10 µF
*2
0.01 µF
Rin: input impedance
Figure 15.7 Example of Analog Input Protection Circuit
Table 15.5 Analog Input Pin Ratings
Item
min
max
Unit
Analog input capacitance
—
20
pF
Allowable signal-source impedance
—
10*
kΩ
Note:
*
When conversion time = 134 states, VCC = 3.0 V to 3.6 V, and φ ≤ 13 MHz. For details
see section 21, Electrical Characteristics.
10 kΩ
AN0 to AN7
To A/D converter
20 pF
Figure 15.8 Analog Input Pin Equivalent Circuit
Note: Numeric values are approximate, except in table 15.5
Rev. 2.0, 06/04, page 560 of 980
6. A/D Conversion Accuracy Definitions: A/D conversion accuracy in the H8/3029 is defined as
follows:
•
Resolution: ...................Digital output code length of A/D converter
•
Offset error:..................Deviation from ideal A/D conversion characteristic of analog input
voltage required to raise digital output from minimum voltage value
0000000000 to 0000000001 (figure 15.10)
•
Full-scale error:............Deviation from ideal A/D conversion characteristic of analog input
voltage required to raise digital output from 1111111110 to
1111111111 (figure 15.10)
•
Quantization error: .......Intrinsic error of the A/D converter; 1/2 LSB (figure 15.9)
•
Nonlinearity error: .......Deviation from ideal A/D conversion characteristic in range from zero
volts to full scale, exclusive of offset error, full-scale error, and
quantization error.
•
Absolute accuracy:.......Deviation of digital value from analog input value, including offset
error, full-scale error, quantization error, and nonlinearity error.
Digital
output
111
Ideal A/D conversion
characteristic
110
101
100
011
010
Quantization error
001
000
1/8 2/8 3/8 4/8 5/8 6/8 7/8 FS
Analog input
voltage
Figure 15.9 A/D Converter Accuracy Definitions (1)
Rev. 2.0, 06/04, page 561 of 980
Full-scale
error
Digital
output
Ideal A/D
conversion
characteristic
Nonlinearity
error
Actual A/D conversion
characteristic
FS
Offset error
Analog input
voltage
Figure 15.10 A/D Converter Accuracy Definitions (2)
7. Allowable Signal-Source Impedance: The analog inputs of the H8/3029 are designed to assure
accurate conversion of input signals with a signal-source impedance not exceeding 10 kΩ. The
reason for this rating is that it enables the input capacitor in the sample-and-hold circuit in the
A/D converter to charge within the sampling time. If the sensor output impedance exceeds 10
kΩ, charging may be inadequate and the accuracy of A/D conversion cannot be guaranteed.
If a large external capacitor is provided in single mode, then the internal 10-kΩ input
resistance becomes the only significant load on the input. In this case the impedance of the
signal source is not a problem.
A large external capacitor, however, acts as a low-pass filter. This may make it impossible to
track analog signals with high dv/dt (e.g. a variation of 5 mV/µs) (figure 15.11). To convert
high-speed analog signals or to use scan mode, insert a low-impedance buffer.
8. Effect on Absolute Accuracy: Attaching an external capacitor creates a coupling with ground,
so if there is noise on the ground line, it may degrade absolute accuracy. The capacitor must be
connected to an electrically stable ground, such as AVSS.
If a filter circuit is used, be careful of interference with digital signals on the same board, and
make sure the circuit does not act as an antenna.
Rev. 2.0, 06/04, page 562 of 980
H8/3029
Sensor output impedance
Sensor
input
10 kΩ
Up to 10 kΩ
Low-pass
filter C
Up to 0.1 µF
Equivalent circuit of
A/D converter
Cin =
15 pF
20 pF
Figure 15.11 Analog Input Circuit (Example)
Rev. 2.0, 06/04, page 563 of 980
Rev. 2.0, 06/04, page 564 of 980
Section 16 D/A Converter
16.1
Overview
The H8/3029 includes a D/A converter with two channels.
16.1.1
Features
D/A converter features are listed below.
• Eight-bit resolution
• Two output channels
• Conversion time: maximum 10 µs (with 20-pF capacitive load)
• Output voltage: 0 V to VREF
• D/A outputs can be sustained in software standby mode
16.1.2
Block Diagram
Bus interface
Figure 16.1 shows a block diagram of the D/A converter.
Module data bus
Internal
data bus
DACR
8-bit D/A
DADR1
DA 0
DADR0
AVCC
DASTCR
VREF
DA 1
AVSS
Legend
DACR:
D/A control register
DADR0: D/A data register 0
DADR1: D/A data register 1
DASTCR: D/A standby control register
Control circuit
Figure 16.1 D/A Converter Block Diagram
Rev. 2.0, 06/04, page 565 of 980
16.1.3
Input/Output Pins
Table 16.1 summarizes the D/A converter's input and output pins.
Table 16.1 D/A Converter Pins
Pin Name
Abbreviation I/O
Function
Analog power supply pin
AVCC
Input
Analog power supply and reference voltage
Analog ground pin
AVSS
Input
Analog ground and reference voltage
Analog output pin 0
DA0
Output
Analog output, channel 0
Analog output pin 1
DA1
Reference voltage input pin VREF
16.1.4
Output
Analog output, channel 1
Input
Analog reference voltage
Register Configuration
Table 16.2 summarizes the D/A converter's registers.
Table 16.2 D/A Converter Registers
Address*
Name
Abbreviation
R/W
Initial Value
H'FFF9C
D/A data register 0
DADR0
R/W
H'00
H'FFF9D
D/A data register 1
DADR1
R/W
H'00
H'FFF9E
D/A control register
DACR
R/W
H'1F
H'EE01A
D/A standby control register
DASTCR
R/W
H'FE
Note:
*
Lower 20 bits of the address in advanced mode.
Rev. 2.0, 06/04, page 566 of 980
16.2
Register Descriptions
16.2.1
D/A Data Registers 0 and 1 (DADR0/1)
Bit
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
The D/A data registers (DADR0 and DADR1) are 8-bit readable/writable registers that store the
data to be converted. When analog output is enabled, the D/A data register values are constantly
converted and output at the analog output pins.
The D/A data registers are initialized to H'00 by a reset and in standby mode.
When the DASTE bit is set to 1 in the D/A standby control register (DASTCR), the D/A registers
are not initialized in software standby mode.
16.2.2
D/A Control Register (DACR)
Bit
7
6
5
4
3
2
1
0
DAOE1
DAOE0
DAE
—
—
—
—
—
Initial value
0
0
0
1
1
1
1
1
Read/Write
R/W
R/W
R/W
—
—
—
—
—
D/A enable
Controls D/A conversion
D/A output enable 0
Controls D/A conversion and analog output
D/A output enable 1
Controls D/A conversion and analog output
DACR is an 8-bit readable/writable register that controls the operation of the D/A converter.
DACR is initialized to H'1F by a reset and in standby mode.
When the DASTE bit is set to 1 in DASTCR, the DACR is not initialized in software standby
mode.
Rev. 2.0, 06/04, page 567 of 980
Bit 7—D/A Output Enable 1 (DAOE1): Controls D/A conversion and analog output.
Bit 7
DAOE1
Description
0
DA1 analog output is disabled
1
Channel-1 D/A conversion and DA1 analog output are enabled
Bit 6—D/A Output Enable 0 (DAOE0): Controls D/A conversion and analog output.
Bit 6
DAOE0
Description
0
DA0 analog output is disabled
1
Channel-0 D/A conversion and DA0 analog output are enabled
Bit 5—D/A Enable (DAE): Controls D/A conversion, together with bits DAOE0 and DAOE1.
When the DAE bit is cleared to 0, analog conversion is controlled independently in channels 0
and 1. When the DAE bit is set to 1, analog conversion is controlled together in channels 0 and 1.
Output of the conversion results is always controlled independently by DAOE0 and DAOE1.
Bit 7
Bit 6
Bit 5
DAOE1 DAOE0 DAE
Description
0
0
—
D/A conversion is disabled in channels 0 and 1
1
0
D/A conversion is enabled in channel 0
D/A conversion is disabled in channel 1
1
0
1
D/A conversion is enabled in channels 0 and 1
0
D/A conversion is disabled in channel 0
D/A conversion is enabled in channel 1
1
1
D/A conversion is enabled in channels 0 and 1
—
D/A conversion is enabled in channels 0 and 1
When the DAE bit is set to 1, even if bits DAOE0 and DAOE1 in DACR and the ADST bit in
ADCSR are cleared to 0, the same current is drawn from the analog power supply as during A/D
and D/A conversion.
Bits 4 to 0—Reserved: These bits cannot be modified and are always read as 1.
Rev. 2.0, 06/04, page 568 of 980
16.2.3
D/A Standby Control Register (DASTCR)
DASTCR is an 8-bit readable/writable register that enables or disables D/A output in software
standby mode.
Bit
7
6
5
4
3
2
1
0
—
—
—
—
—
—
—
DASTE
Initial value
1
1
1
1
1
1
1
0
Read/Write
—
—
—
—
—
—
—
R/W
Reserved bits
D/A standby enable
Enables or disables D/A output
in software standby mode
DASTCR is initialized to H'FE by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bits 7 to 1—Reserved: These bits cannot be modified and are always read as 1.
Bit 0—D/A Standby Enable (DASTE): Enables or disables D/A output in software standby
mode.
Bit 0
DASTE
Description
0
D/A output is disabled in software standby mode
1*
D/A output is enabled in software standby mode
Note:
*
(Initial value)
The D/A accuracy is not guaranteed in software standby mode.
Rev. 2.0, 06/04, page 569 of 980
16.3
Operation
The D/A converter has two built-in D/A conversion circuits that can perform conversion
independently.
D/A conversion is performed constantly while enabled in DACR. If the DADR0 or DADR1 value
is modified, conversion of the new data begins immediately. The conversion results are output
when bits DAOE0 and DAOE1 are set to 1.
An example of D/A conversion on channel 0 is given next. Timing is indicated in figure 16.2.
1. Data to be converted is written in DADR0.
2. Bit DAOE0 is set to 1 in DACR. D/A conversion starts and DA0 becomes an output pin. The
converted result is output after the conversion time.
The output value is
DADR contents
× VREF
256
Output of this conversion result continues until the value in DADR0 is modified or the
DAOE0 bit is cleared to 0.
3. If the DADR0 value is modified, conversion starts immediately, and the result is output after
the conversion time.
4. When the DAOE0 bit is cleared to 0, DA0 becomes an input pin.
Rev. 2.0, 06/04, page 570 of 980
DADR0
write cycle
DACR
write cycle
DADR0
write cycle
DACR
write cycle
φ
Address
Conversion data 1
DADR0
Conversion data 2
DAOE0
DA 0
Conversion
result 2
Conversion
result 1
High-impedance state
t DCONV
t DCONV
Legend
t DCONV : D/A conversion time
Figure 16.2 Example of D/A Converter Operation
16.4
D/A Output Control
In the H8/3029, D/A converter output can be enabled or disabled in software standby mode.
When the DASTE bit is set to 1 in DASTCR, D/A converter output is enabled in software standby
mode. The D/A converter registers retain the values they held prior to the transition to software
standby mode.
When D/A output is enabled in software standby mode, the reference supply current is the same as
during normal operation.
Rev. 2.0, 06/04, page 571 of 980
Rev. 2.0, 06/04, page 572 of 980
Section 17 RAM
17.1
Overview
The H8/3029 has 16 kbytes RAM. The RAM is connected to the CPU by a 16-bit data bus. The
CPU accesses both byte data and word data in two states, making the RAM useful for rapid data
transfer.
The on-chip RAM of the H8/3029 is assigned to addresses H'FBF20 to H'FFF1F in modes 1, 2,
and 7, and to addresses H'FFBF20 to H'FFFF1F in modes 3, 4, and 5. The RAM enable bit
(RAME) in the system control register (SYSCR) can enable or disable the on-chip RAM.
17.1.1
Block Diagram
Figure 17.1 shows a block diagram of the on-chip RAM.
On-chip data bus (upper 8 bits)
On-chip data bus (lower 8 bits)
Bus interface
H'FBF20*
H'FBF21*
H'FBF22*
H'FBF23*
SYSCR
On-chip RAM
H'FFF1E*
H'FFF1F*
Even addresses
Odd addresses
Legend
SYSCR: System control register
Note: * Lower 20 bits of the address in mode 7.
Figure 17.1 RAM Block Diagram
Rev. 2.0, 06/04, page 573 of 980
17.1.2
Register Configuration
The on-chip RAM is controlled by SYSCR. Table 17.1 gives the address and initial value of
SYSCR.
Table 17.1 System Control Register
Address*
Name
Abbreviation
R/W
Initial Value
H'EE012
System control register
SYSCR
R/W
H'09
Note:
17.2
*
Lower 20 bits of the address in advanced mode.
System Control Register (SYSCR)
Bit
7
6
5
4
3
2
1
0
SSBY
STS2
STS1
STS0
UE
NMIEG
SSOE
RAME
Initial value
0
0
0
0
1
0
0
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
RAM enable bit
Enables or disables
on-chip RAM
Software standby
output port enable
NMI edge select
User bit enable
Standby timer select 2 to 0
Software standby
One function of SYSCR is to enable or disable access to the on-chip RAM. The on-chip RAM is
enabled or disabled by the RAME bit in SYSCR. For details about the other bits, see section 3.3,
System Control Register (SYSCR).
Bit 0—RAM Enable (RAME): Enables or disables the on-chip RAM. The RAME bit is
initialized at the rising edge of the input at the RES pin. It is not initialized in software standby
mode.
Bit 0
RAME
Description
0
On-chip RAM is disabled
1
On-chip RAM is enabled
Rev. 2.0, 06/04, page 574 of 980
(Initial value)
17.3
Operation
When the RAME bit is set to 1, the on-chip RAM is enabled. Accesses to addresses H'FBF20 to
H'FFF1F in modes 1, 2, and 7, and to addresses H'FFBF20 to H'FFFF1F in the H8/3029 in modes
3, 4, and 5, are directed to the on-chip RAM. In modes 1 to 5 (expanded modes), when the RAME
bit is cleared to 0, the off-chip address space is accessed. In mode 7 (single-chip mode), when the
RAME bit is cleared to 0, the on-chip RAM is not accessed: read access always results in H'FF
data, and write access is ignored.
Since the on-chip RAM is connected to the CPU by an internal 16-bit data bus, it can be written
and read by word access. It can also be written and read by byte access. Byte data is accessed in
two states using the upper 8 bits of the data bus. Word data starting at an even address is accessed
in two states using all 16 bits of the data bus.
Rev. 2.0, 06/04, page 575 of 980
Rev. 2.0, 06/04, page 576 of 980
Section 18 ROM
18.1
Features
This LSI has an on-chip 512-kbyte flash memory. The flash memory has the following features.
• Two flash-memory MATs according to LSI initiation mode
The on-chip flash memory has two memory spaces in the same address space (hereafter
referred to as memory MATs). The mode setting in the initiation determines which memory
MAT is initiated first. The MAT can be switched by using the bank-switching method after
initiation.
 The user memory MAT is initiated at a power-on reset in user mode: 512 kbytes
 The user boot memory MAT is initiated at a power-on reset in user boot mode:10 kbytes
• Three on-board programming modes and one off-board programming mode
 On-board programming modes
Boot mode: This mode is a program mode that uses an on-chip SCI interface. The user MAT and
user boot MAT can be programmed. This mode can automatically adjust the bit rate between host
and this LSI.
User program mode: The user MAT can be programmed by using the optional interface.
User boot mode: The user boot program of the optional interface can be made and the user MAT
can be programmed.
 Off-board programming mode
PROM mode: This mode uses the PROM programmer. The user MAT and user boot MAT can
be programmed.
• Programming/erasing interface by the download of on-chip program
This LSI has a dedicated programming/erasing program. After downloading this program to
the on-chip RAM, programming/erasing can be performed by setting the argument parameter.
 User branch*
The program processing is performed in 128-byte units. It consists the program pulse application,
verify read, and several other steps. Erasing is performed in one divided-block units and consists
of several steps. The user processing routine can be executed between the steps, this setting for
which is called the user branch addition.
Note: * Not available in the H8/3029.
Rev. 2.0, 06/04, page 577 of 980
• Emulation function of flash memory by using the on-chip RAM
As flash memory is overlapped with part of the on-chip RAM, the flash memory programming
can be emulated in real time.
• Protection modes
There are two protection modes: software protection by the register setting and hardware
protection by the FWE pin. The protection state for flash memory programming/erasing can be
set.
When abnormalities, such as runaway of programming/erasing are detected, these modes enter
the error protection state and the programming/erasing processing is suspended.
• Programming/erasing time
The flash memory programming time is 3 ms (typ) in 128-byte simultaneous programming
and 25 µs per byte. The erasing time is 1000 ms (typ) per 64 kbyte block.
• Number of programming
The number of flash memory programming can be up to minimum 100 times.
Rev. 2.0, 06/04, page 578 of 980
18.2
Overview
18.2.1
Block Diagram
Internal address bus
Internal data bus (16 bits)
FCCS
FPCS
Module bus
FECS
FKEY
Memory MAT unit
Control unit
FMATS
User MAT: 512 kbytes
User boot MAT: 10 kbytes
FTDAR
RAMCR
FVACR
Flash memory
FVADR
FWE pin
Mode pin
Legend
FCCS:
FPCS:
FECS:
FKEY:
FMATS:
FTDAR:
RAMCR:
FVACR:
FVADR:
Operating
mode
Flash code control and status register
Flash program code select register
Flash erase code select register
Flash key code register
Flash MAT select register
Flash transfer destination address register
RAM control register
Flash vector address control register
Flash vector address data register
Figure 18. 1 Block Diagram of Flash Memory
Rev. 2.0, 06/04, page 579 of 980
18.2.2
Operating Mode
When each mode pin and the FWE pin are set in the reset state and reset start is performed, the
microcomputer enters each operating mode as shown in figure 18.2. For the setting of each mode
pin and the FWE pin, see table 18.1.
• Flash memory cannot be read, programmed, or erased in ROM invalid mode.
• Flash memory can be read in user mode, but cannot be programmed or erased.
• Flash memory can be read, programmed, or erased on the board only in user program mode,
user boot mode, and boot mode.
• Flash memory can be read, programmed, or erased by means of the PROM programmer in
PROM mode.
RES=0
RES=0
ROM invalid
mode setting
=0
0
S=
RE
RE
S=0
Bo
S=
o
rm
e
Us
PROM mode
PROM mode setting
RE
s
de
0
g
in
ett
ot g
bo tin
er set
Us de
mo
S
RE
Reset state
Us
mo er p
de rog
se ram
ttin
g
ROM invalid
mode
ot
mo
de
se
ttin
g
FWE=0
User mode
FWE=1
User program
mode
User boot
mode
RAM emulation is enabled
On-board programming mode
Figure 18.2 Mode Transition of Flash Memory
Rev. 2.0, 06/04, page 580 of 980
Boot mode
Table 18.1 Location of FWE and MD Pins and Operating Modes
Mode
Reset
state
Pin
On-chip
ROM
invalid
mode*
On-chip
ROM
valid
mode*
User
program
mode
User
boot
mode
Boot
mode
PROM
mode
RES
0
1
1
1
1
1
1
FWE
0/1
0
0
1
1
1
1
MD0
0/1
0/1
0
1
1
1
1
0
MD1
0/1
0/1
0
0/1
0/1
0/1
0/1
0
MD2
0/1
0
1
1
0
0
0
NMI
0/1
0/1
0/1
0
1
0/1
Note:
18.2.3
*
1
0/1
Modes 1 to 4 are on-chip ROM invalid modes.
Modes 5 and 7 are on-chip ROM valid modes. For details, see section 3, MCU
Operating Modes.
Mode Comparison
The comparison table of programming and erasing related items about boot mode, user program
mode, user boot mode, and PROM mode is shown in table 18.2.
Rev. 2.0, 06/04, page 581 of 980
Table 18.2 Comparison of Programming Modes
Boot mode
User program
mode
User boot mode
PROM mode
Programming/
Erasing
Environment
On-board
programming
On-board
programming
On-board
programming
Off-board
programming
Programming/
Erasing Enable
MAT
User MAT
User boot MAT
User MAT
User MAT
User MAT
User boot MAT
All Erasure
(Automatic)
Block Division
Erasure
*
(Automatic)
×
1
Program Data
Transfer
From host via
SCI
From optional
device via RAM
From optional
device via RAM
Via programmer
User Branch
Function
×
×
×
×
RAM Emulation
×
×
×
2
Reset Initiation
MAT
Embedded
program storage
MAT
User MAT
User boot MAT*
Transition to
User Mode
Mode setting
change and reset
FWE setting
change
Mode setting
change and reset
—
—
Notes: *1 All-erasure is performed. After that, the specified block can be erased.
*2 Initiation starts from the embedded program storage MAT. After checking the flashmemory related registers, initiation starts from the reset vector of the user MAT.
• The user boot MAT can be programmed or erased only in boot mode and PROM mode.
• The user MAT and user boot MAT are erased in boot mode. Then, the user MAT and user
boot MAT can be programmed by means of the command method. However, the contents of
the MAT cannot be read until this state.
Only user boot MAT is programmed and the user MAT is programmed in user boot mode or
only user MAT is programmed because user boot mode is not used.
• The boot operation of the optional interface can be performed by the mode pin setting
different from user program mode in user boot mode.
Rev. 2.0, 06/04, page 582 of 980
18.2.4
Flash MAT Configuration
This LSI’s flash memory is configured by the 512-kbyte user MAT and 10-kbyte user boot MAT.
The start address is allocated to the same address in the user MAT and user boot MAT. Therefore,
when the program execution or data access is performed between two MATs, the MAT must be
switched by using FMATS.
The user MAT or user boot MAT can be read in all modes if it is in ROM valid mode. However,
the user boot MAT can be programmed only in boot mode and PROM mode.
<User MAT>
Address H'000000
<User Boot MAT>
Address H'000000
10 kbytes
Address H'0027FF
512 kbytes
Address H'07FFFF
Figure 18.3 Flash Memory Configuration
The user MAT and user boot MAT have different memory sizes. Do not access a user boot MAT
that is 10 kbytes or more. When a user boot MAT exceeding 10 kbytes is read from, an undefined
value is read.
18.2.5
Block Division
The user MAT is divided into 64 kbytes (seven blocks), 32 kbytes (one block), and 4 kbytes (eight
blocks) as shown in figure 18.4. The user MAT can be erased in this divided-block units and the
erase-block number of EB0 to EB15 is specified when erasing.
The RAM emulation can be performed in the eight blocks of 4 kbytes.
Rev. 2.0, 06/04, page 583 of 980
<User MAT>
Address H'000000
4 kbytes×8
Erase block
EB0
to
*
512 kbytes
EB7
Address H'07FFFF
32 kbytes
EB8
64 kbytes
EB9
64 kbytes
EB10
64 kbytes
EB11
64 kbytes
EB12
64 kbytes
EB13
64 kbytes
EB14
64 kbytes
EB15
Note: *The RAM emulation can be performed in the eight blocks of 4 kbytes.
Figure 18.4 Block Division of User MAT
18.2.6
Programming/Erasing Interface
Programming/erasing is executed by downloading the on-chip program to the on-chip RAM and
specifying the program address/data and erase block by using the interface register/parameter.
The procedure program is made by the user in user program mode and user boot mode. The
overview of the procedure is as follows. For details, see section 18.5.2, User Program Mode.
Rev. 2.0, 06/04, page 584 of 980
Start user procedure
program for
programming/erasing
Select on-chip program
to be downloaded and
set download destination
Download on-chip
program by setting
FKEY and the SCO bits
Initialization execution
(download program execution)
Programming (in 128-byte
units) or erasing (in
one-block units)
(download program execution)
No
Programming/erasing
completed?
Yes
End user procedure
program
Figure 18.5 Overview of User Procedure Program
1. Selection of on-chip program to be downloaded and setting of download destination
This LSI has programming/erasing programs and they can be downloaded to the on-chip RAM.
The on-chip program to be downloaded is selected by setting the corresponding bits in the
programming/erasing interface register. The download destination can be specified by FTDAR.
2. Download of on-chip program
The on-chip program is automatically downloaded by setting the SCO bit in the flash key code
register (FKEY) and the flash code control and status register (FCCS), which are programming/
erasing interface registers.
The user MAT is replaced to the embedded program storage area when downloading. Since the
flash memory cannot be read when programming/erasing, the procedure program, which is
working from download to completion of programming/erasing, must be executed in a space other
than the flash memory to be programmed/erased (for example, on-chip RAM).
Since the result of download is returned to the programming/erasing interface parameters, whether
the normal download is executed or not can be confirmed.
Rev. 2.0, 06/04, page 585 of 980
3. Initialization of programming/erasing
The operating frequency and user branch are set before execution of programming/erasing. The
user branch destination must be area other than the flash memory area or the area where the onchip program is downloaded. These settings are performed by using the programming/erasing
interface parameters.
4. Programming/erasing execution
To program or erase, the FWE pin must be set to 1 and user program mode must be entered.
The program data/programming destination address is specified in 128-byte units when
programming.
The block to be erased is specified in erase-block units when erasing.
These specifications are set by using the programming/erasing interface parameters and the onchip program is initiated. The on-chip program is executed by using the JSR or BSR instruction to
perform the subroutine call of the specified address in the on-chip RAM. The execution result is
returned to the programming/erasing interface parameters.
The area to be programmed must be erased in advance when programming flash memory.
All interrupts are prohibited during programming and erasing. Interrupts must not occur in the
user system.
5. When programming/erasing is executed consecutively
When the processing is not ended by the 128-byte programming or one-block erasure, the
program address/data and erase-block number must be updated and consecutive
programming/erasing is required.
Since the downloaded on-chip program is left in the on-chip RAM after the processing, download
and initialization are not required when the same processing is executed consecutively.
Rev. 2.0, 06/04, page 586 of 980
18.3
Pin Configuration
Flash memory is controlled by the pin as shown in table 18.3.
Table 18.3 Pin Configuration
Pin Name
Abbreviation
Input/Output
Function
Reset
RES
Input
Reset
Flash programming
enable
FWE
Input
Hardware protection when programming
flash memory
Mode 2
MD2
Input
Sets operating mode of this LSI
Mode 1
MD1
Input
Sets operating mode of this LSI
Mode 0
MD0
Input
Sets operating mode of this LSI
Non-maskable
interrupt
NMI
Input
Sets operating mode of this LSI
Transmit data
TxD1
Output
Serial transmit data output (used in boot
mode)
Receive data
RxD1
Input
Serial receive data input (used in boot
mode)
Note: For the pin configuration in PROM mode, see section 18.9, PROM Mode.
Rev. 2.0, 06/04, page 587 of 980
18.4
Register Configuration
18.4.1
Registers
The registers/parameters which control flash memory when the on-chip flash memory is valid are
shown in table 18.4.
There are several operating modes for accessing flash memory, for example, read mode/program
mode.
There are two memory MATs: user MAT and user boot MAT. The dedicated registers/parameters
are allocated for each operating mode and MAT selection. The correspondence of operating
modes and registers/parameters for use is shown in table 18.5.
Rev. 2.0, 06/04, page 588 of 980
Table 18.4 (1)
Register Configuration
Address
Access
Size
H'00*
2
H'80*
H'EE0B0
8
R/W
H'00
H'EE0B1
8
FECS
R/W
H'00
H'EE0B2
8
Flash key code register
FKEY
R/W
H'00
H'EE0B4
8
Flash MAT select register
FMATS
R/W
H'00*
3
H'AA*
H'EE0B5
8
Flash transfer destination
address register
FTDAR
R/W
H'00
H'EE0B6
8
RAM control register
RAMCR
R/W
H'F0
H'EE077
8
Flash vector address code
control register
FVACR
R/W
H'00
H'EE0B7
8
Flash vector address data
register R
FVADRR
R/W
H'00
H'EE0B8
8
Flash vector address data
register E
FVADRE
R/W
H'00
H'EE0B9
8
Flash vector address data
register H
FVADRH
R/W
H'00
H'EE0BA
8
Flash vector address data
register L
FVADRL
R/W
H'00
H'EE0BB
8
Name
Abbreviation
R/W
Flash code control status
register
FCCS
R, W*
Flash program code select
register
FPCS
Flash erase code select
register
Initial
Value
1
2
3
Notes: *1 The bits except the SCO bit are read-only bits. The SCO bit is a programming-only bit.
(The value which can be read is always 0.)
*2 The initial value is H'00 when the FWE pin goes low.
The initial value is H'80 when the FWE pin goes high.
*3 The initial value at initiation in user mode or user program mode is H'00.
The initial value at initiation in user boot mode is H'AA.
Rev. 2.0, 06/04, page 589 of 980
Table 18.4 (2)
Parameter Configuration
Name
Abbreviation
R/W
Initial
Value
Address
Access
Size
Download pass/fail result
DPFR
R/W
Undefined
On-chip RAM*
8, 16, 32
Flash pass/fail result
FPFR
R/W
Undefined
R0L of CPU
8, 16, 32
Flash multipurpose
address area
FMPAR
R/W
Undefined
ER1 of CPU
8, 16, 32
Flash multipurpose data
destination area
FMPDR
R/W
Undefined
ER0 of CPU
8, 16, 32
Flash erase block select
FEBS
R/W
Undefined
ER0 of CPU
8, 16, 32
Flash program and erase
frequency control
FPEFEQ
R/W
Undefined
ER0 of CPU
8, 16, 32
Flash user branch address
set parameter
FUBRA
R/W
Undefined
ER1 of CPU
8, 16, 32
Note:
*
One byte of the start address in the on-chip RAM area specified by FTDAR is valid.
Rev. 2.0, 06/04, page 590 of 980
Table 18.5 Register/Parameter and Target Mode
Download
Initialization
Programming
Erasure
Read
RAM
Emulation
Programming/
FCCS
—
—
—
—
—
erasing
FPCS
—
—
—
—
—
interface
PECS
—
—
—
—
—
registers
FKEY
—
FMATS
Programming/
—
—
—
*
1
*
1
—
*
2
—
FTDAR
—
—
—
—
—
DPFR
—
—
—
—
—
erasing
FPFR
—
—
—
interface
FPEFEQ
—
—
—
—
—
parameter
FUBRA
—
—
—
—
—
FMPAR
—
—
—
—
—
FMPDR
—
—
—
—
—
—
—
—
—
RAM emulation
FEBS
—
—
—
RAMCR
—
—
—
Notes: *1 The setting is required when programming or erasing user MAT in user boot mode.
*2 The setting may be required according to the combination of initiation mode and read
target MAT.
18.4.2
Programming/Erasing Interface Register
The programming/erasing interface registers are as described below. They are all 8-bit registers
that can be accessed in byte. Except for the FLER bit in FCCS, these registers are initialized at a
power-on reset, in hardware standby mode, or in software standby mode. The FLER bit is not
initialized in software standby mode.
(1) Flash Code Control and Status Register (FCCS)
FCCS is configured by bits which request the monitor of the FWE pin state and error occurrence
during programming or erasing flash memory and the download of on-chip program.
Bit :
Initial value :
R/W :
7
6
5
4
3
2
1
0
FWE
—
—
FLER
—
—
—
SCO
1/0
0
0
0
0
0
0
0
R
R
R
R
R
R
R
(R)W
Bit 7—Flash Programming Enable (FWE): Monitors level which is input to the FWE pin that
performs hardware protection of the flash memory programming or erasing. The initial value is 0
or 1 according to the FWE pin state.
Rev. 2.0, 06/04, page 591 of 980
Bit 7
FWE
Description
0
When the FWE pin goes low (in hardware protection state)
1
When the FWE pin goes high
Bits 6 and 5—Reserved: These bits are always read as 0. The write value should always be 0.
Bit 4—Flash Memory Error (FLER): Indicates an error occurs during programming and erasing
flash memory.
When FLER is set to 1, flash memory enters the error protection state.
This bit is initialized at a power-on reset or in hardware standby mode.
When FLER is set to 1, high voltage is applied to the internal flash memory. To reduce the
damage to flash memory, the reset must be released after the reset period of 100 µs which is
longer than normal.
Bit 4
FLER
Description
0
Flash memory operates normally
(Initial value)
Programming/erasing protection for flash memory (error protection) is invalid.
[Clearing condition] At a power-on reset or in hardware standby mode
1
Indicates an error occurs during programming/erasing flash memory.
Programming/erasing protection for flash memory (error protection) is valid.
[Setting condition] See section 18.6.3, Error Protection.
Bits 3 to 1—Reserved: These bits are always read as 0. The write value should always be 0.
Bit 0—Source Program Copy Operation (SCO): Requests the on-chip programming/erasing
program to be downloaded to the on-chip RAM.
When this bit is set to 1, the on-chip program which is selected by FPCS/FECS is automatically
downloaded in the on-chip RAM area specified by FTDAR.
In order to set this bit to 1, RAM emulation state must be canceled, H'A5 must be written to
FKEY, and this operation must be in the on-chip RAM.
Four NOP instructions must be executed immediately after setting this bit to 1.
Since this bit is cleared to 0 when download is completed, this bit cannot be read as 1.
All interrupts are prohibited during programming and erasing. Interrupts must not occur in the
user system.
Rev. 2.0, 06/04, page 592 of 980
Bit 0
SCO
Description
0
Download of the on-chip programming/erasing program to the on-chip RAM is not
executed
(Initial value)
[Clear condition] When download is completed
1
Request that the on-chip programming/erasing program is downloaded to the onchip RAM is occurred
[Clear conditions] When all of the following conditions are satisfied and 1 is written
to this bit
•
FKEY is written to H'A5
•
During execution in the on-chip RAM
•
Not in RAM emulation mode (RAMS in RAMCR = 0)
(2) Flash Program Code Select Register (FPCS)
FPCS selects the on-chip programming program to be downloaded.
Bit :
7
—
6
—
5
—
4
—
3
—
2
—
1
—
0
PPVS
Initial value :
0
0
0
0
0
0
0
0
R/W :
R
R
R
R
R
R
R
R/W
Bits 7 to 1—Reserved: These bits are always read as 0. The write value should always be 0.
Bit 0—Program Pulse Verify (PPVS): Selects the programming program.
Bit 0
PPVS
Description
0
On-chip programming program is not selected
1
On-chip programming program is selected
(Initial value)
[Clear condition] When transfer is completed
Rev. 2.0, 06/04, page 593 of 980
(3) Flash Erase Code Select Register (FECS)
FECS selects download of the on-chip erasing program.
Bit :
7
—
6
—
5
—
4
—
3
—
2
—
1
—
0
EPVB
Initial value :
0
0
0
0
0
0
0
0
R/W :
R
R
R
R
R
R
R
R/W
Bits 7 to 1—Reserved: These bits are always read as 0. The write value should always be 0.
Bit 0—Erase Pulse Verify Block (EPVB): Selects the erasing program.
Bit 0
EPVB
Description
0
On-chip erasing program is not selected
(Initial value)
[Clear condition] When transfer is completed
1
On-chip erasing program is selected
(4) Flash Key Code Register (FKEY)
FKEY is a register for software protection that enables download of on-chip program and
programming/erasing of flash memory. Before setting the SCO bit to 1 in order to download onchip program or executing the downloaded programming/erasing program, these processing
cannot be executed if the key code is not written.
Bit :
Initial value :
R/W :
7
6
5
4
3
2
1
0
K7
K6
K5
K4
K3
K2
K1
K0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bits 7 to 0—Key Code (K7 to K0): Only when H'A5 is written, writing to the SCO bit is valid.
When the value other than H'A5 is written to FKEY, 1 cannot be written to the SCO bit. Therefore
downloading to the on-chip RAM cannot be executed.
Only when H'5A is written, programming/erasing can be executed. Even if the on-chip
programming/erasing program is executed, flash memory cannot be programmed or erased when
the value other than H'5A is written to FKEY.
Rev. 2.0, 06/04, page 594 of 980
Bits 7 to 0
K7 to K0
Description
H'A5
Writing to the SCO bit is enabled (The SCO bit cannot be set by the value other
than H'A5.)
H'5A
Programming/erasing is enabled (The value other than H'5A is in software
protection state.)
H'00
Initial value
(5) Flash MAT Select Register (FMATS)
FMATS specifies whether user MAT or user boot MAT is selected.
Bit :
Initial value :
Initial value :
R/W :
7
MS7
0
1
R/W
6
MS6
0
0
R/W
5
MS5
0
1
R/W
4
MS4
0
0
R/W
3
MS3
0
1
R/W
2
MS2
0
0
R/W
1
MS1
0
1
R/W
0
MS0
0
0
R/W
(When not in
user boot mode)
(When in
user boot mode)
Bits 7 to 0—MAT Select (MS7 to MS0): These bits are in user-MAT selection state when the
value other than H'AA is written and in user-boot-MAT selection state when H'AA is written.
The MAT is switched by writing the value in FMATS.
When the MAT is switched, follow section 18.8, Switching between User MAT and User Boot
MAT. (The user boot MAT cannot be programmed in user programming mode if user boot MAT
is selected by FMATS. The user boot MAT must be programmed in boot mode or in PROM
mode.)
Bits 7 to 0
MS7 to MS0
Description
H'AA
The user boot MAT is selected (in user-MAT selection state when the value of
these bits are other than H'AA)
Initial value when these bits are initiated in user boot mode.
H'00
Initial value when these bits are initiated in a mode except for user boot mode (in
user-MAT selection state)
[Programmable condition] ] These bits are in the process of being executed in the on-chip RAM.
Rev. 2.0, 06/04, page 595 of 980
(6) Flash Transfer Destination Address Register (FTDAR)
FTDAR specifies the on-chip RAM address to which the on-chip program is downloaded. Make
settings for FTDAR before writing 1 to the SCO bit in FCCS. The initial value is H'00 which
points to the start address (H'FFEF20) in on-chip RAM.
Bit :
Initial value :
R/W :
7
6
5
4
3
2
1
0
TDER
TDA6
TDA5
TDA4
TDA3
TDA2
TDA1
TDA0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
R/W
Bit 7—Transfer Destination Address Setting Error (TDER): This bit is set to 1 when there is
an error in the download start address set by bits 6 to 0 (TDA6 to TDA0). Whether the address
setting is erroneous or not is judged by checking whether the setting of TDA6 to TDA0 is between
the range of H'00 and H'03 after setting the SCO bit in FCCS to 1 and performing download.
Before setting the SCO bit to 1 be sure to set the FTDAR value between H'00 to H'03 as well as
clearing this bit to 0.
Bit 7
TDER
Description(Return Value after Download)
0
Setting of TDA6 to TDA0 is normal
1
Setting of TDER and TDA6 to TDA0 is H'04 to H'FF and download has been
aborted
(Initial value)
Bits 6 to 0—Transfer Destination Address (TDA6 to TDA0): These bits specify the download
start address. A value from H'00 to H'03 can be set to specify the download start address in onchip RAM in 4-kbyte units.
A value from H'04 to H'7F cannot be set. If such a value is set, the TDER bit (bit 7) in this register
is set to 1 to prevent download from being executed.
Bits 6 to 0
TDA6 to
TDA0
Description
H'00
Download start address is set to H'FFEF20
H'01
Download start address is set to H'FFDF20
H'02
Download start address is set to H'FFCF20
H'03
Download start address is set to H'FFBF20
H'04 to H'FF
Setting prohibited. If this value is set, the TDER bit (bit 7) is set to 1 to abort the
download processing.
Rev. 2.0, 06/04, page 596 of 980
(Initial value)
18.4.3
Programming/Erasing Interface Parameter
The programming/erasing interface parameter specifies the operating frequency, user branch
destination address, storage place for program data, programming destination address, and erase
block and exchanges the processing result for the downloaded on-chip program. This parameter
uses the general registers of the CPU (ER0 and ER1) or the on-chip RAM area. The initial value is
undefined at a power-on reset or in hardware standby mode.
When download, initialization, or on-chip program is executed, registers of the CPU except for
R0L are stored. The return value of the processing result is written in R0L. Since the stack area is
used for storing the registers except for R0L, the stack area must be saved at the processing start.
(A maximum size of a stack area to be used is 128 bytes.)
The programming/erasing interface parameter is used in the following four items.
(1) Download control
(2) Initialization before programming or erasing
(3) Programming
(4) Erasing
These items use different parameters. The correspondence table is shown in table 18.6.
Here the FPFR parameter returns the results of initialization processing, programming processing,
or erasing processing, but the meaning of the bits differs depending on the type of processing. For
details, refer to the FPFR descriptions for the individual processes.
Rev. 2.0, 06/04, page 597 of 980
Table 18.6 Usable Parameters and Target Modes
Name of
Parameter
Abbreviation
Download
pass/fail result
DPFR
Flash pass/fail
result
FPFR
—
Flash
programming/
erasing
frequency
control
FPEFEQ
—
—
Flash user
branch address
set parameter
FUBRA
—
—
Flash
multipurpose
address area
FMPAR
—
Flash
multipurpose
data destination
area
FMPDR
Flash erase
block select
FEBS
Note:
*
Download
Initialization
Programming
Erasure
R/W
Initial
Value
Allocation
—
—
—
R/
W
Undefined
Onchip
RAM*
R/
W
Undefined
R0L of
CPU
—
R/
W
Undefined
ER0 of
CPU
—
R/
W
Undefined
ER1 of
CPU
—
—
R/
W
Undefined
ER1 of
CPU
—
—
—
R/
W
Undefined
ER0 of
CPU
—
—
R/
W
Undefined
ER0 of
CPU
—
One byte of start address of download destination specified by FTDAR
(1) Download Control
The on-chip program is automatically downloaded by setting the SCO bit to 1. The on-chip RAM
area to be downloaded is the area as much as 4 kbytes starting from the start address specified by
FTDAR. For the address map of the on-chip RAM, see figure 18.10.
The download control is set by using the programming/erasing interface register. The return value
is given by the DPFR parameter.
(a) Download pass/fail result parameter (DPFR: one byte of start address of on-chip RAM
specified by FTDAR)
This parameter indicates the return value of the download result. The value of this parameter can
be used to determine if downloading is executed or not. Since the confirmation whether the SCO
bit is set to 1 is difficult, the certain determination must be performed by setting one byte of the
start address of the on-chip RAM area specified by FTDAR to a value other than the return value
of download (for example, H'FF) before the download start (before setting the SCO bit to 1).
Refer to item 18.5.2 (e) for information on the method for checking the download result.
Rev. 2.0, 06/04, page 598 of 980
Bit :
7
0
6
0
5
0
4
0
3
0
2
SS
1
FK
0
SF
Bits 7 to 3—Unused: Return 0.
Bit 2—Source Select Error Detect (SS): The on-chip program which can be downloaded can be
specified only one type. When more than two types of the program are selected, the program is
not selected, or the program is selected without mapping, error is occurred.
Bit 2
SS
Description
0
Download program can be selected normally
1
Download error is occurred (Multi-selection or program which is not mapped is
selected)
Bit 1—Flash Key Register Error Detect (FK): Returns the check result whether the value of
FKEY is set to H'A5.
Bit 1
FK
Description
0
FKEY setting is normal (FKEY = H'A5)
1
Setting value of FKEY becomes error (FKEY = value other than H'A5)
Bit 0—Success/Fail (SF): Returns the result whether download is ended normally or not. The
judgement result whether program that is downloaded to the on-chip RAM is read back and then
transferred to the on-chip RAM is returned.
Bit 0
SF
Description
0
Downloading on-chip program is ended normally (no error)
1
Downloading on-chip program is ended abnormally (error occurs)
(2) Programming/Erasing Initialization
The on-chip programming/erasing program to be downloaded includes the initialization program.
The specified period pulse must be applied when programming or erasing. The specified pulse
width is made by the method in which wait loop is configured by the CPU instruction. The
operating frequency of the CPU must be set.
The initial program is set as a parameter of the programming/erasing program which has
downloaded these settings.
Rev. 2.0, 06/04, page 599 of 980
(a) Flash programming/erasing frequency parameter (FPEFEQ: general register ER0 of
CPU)
This parameter sets the operating frequency of the CPU.
For the range of the operating frequency of this LSI, see section 21.4.1, Clock Timing.
Bit :
31
0
30
0
29
0
28
0
27
0
26
0
25
0
24
0
Bit :
23
0
22
0
21
0
20
0
19
0
18
0
17
0
16
0
Bit :
15
F15
14
F14
13
F13
12
F12
11
F11
10
F10
9
F9
8
F8
Bit :
7
F7
6
F6
5
F5
4
F4
3
F3
2
F2
1
F1
0
F0
Bits 31 to 16—Unused: Only 0 may be written to these bits.
Bits 15 to 0—Frequency Set (F15 to F0): Set the operating frequency of the CPU. The setting
value must be calculated as the following methods.
1. The operating frequency which is shown in MHz units must be rounded in a number to three
decimal places and be shown in a number of two decimal places.
2. The centuplicated value is converted to the binary digit and is written to the FPEFEQ parameter
(general register R0). For example, when the operating frequency of the CPU is 25.000 MHz,
the value is as follows.
• The number to three decimal places of 25.000 is rounded and the value is thus 25.00.
• The formula that 25.00 × 100 = 2500 is converted to the binary digit and
b'0000,1001,1100,0100 (H'09C4) is set to R0.
Rev. 2.0, 06/04, page 600 of 980
(b) Flash user branch address setting parameter (FUBRA: general register ER1 of CPU)
This parameter sets the user branch destination address. The user program which has been set can
be executed in specified processing units when programming and erasing.
Bit :
31
UA31
30
UA30
29
UA29
28
UA28
27
UA27
26
UA26
25
UA25
24
UA24
Bit :
23
UA23
22
UA22
21
UA21
20
UA20
19
UA19
18
UA18
17
UA17
16
UA16
Bit :
15
UA15
14
UA14
13
UA13
12
UA12
11
UA11
10
UA10
9
UA9
8
UA8
Bit :
7
UA7
6
UA6
5
UA5
4
UA4
3
UA3
2
UA2
1
UA1
0
UA0
Bits 31 to 0—User Branch Destination Address (UA31 to UA0): Not available in the H8/3029,
address 0 (H'00000000) must be set.
The user branch destination must be the area other than the RAM area in which on-chip program
has been transferred or the external bus space.
Note that the CPU must not branch to an area without the execution code and get out of control.
The on-chip program download area and stack area must not be overwritten. If CPU runaway
occurs or the download area or stack area is overwritten, the value of flash memory cannot be
guaranteed.
The download of on-chip program, initialization, initiation of the programming/erasing program
must not be executed in the processing of the user branch destination. Programming or erasing
cannot be guaranteed when returning from the user branch destination. The program data which
has already been prepared must not be programmed.
Moreover, the programming/erasing interface register must not be programmed or RAM
emulation mode must not be entered in the processing of the user branch destination.
After the processing of the user branch is ended, the programming/erasing program must be
returned by using the RTS instruction.
(c) Flash pass/fail parameter (FPFR: general register R0L of CPU)
An explanation of FPFR as the return value indicating the initialization result is provided here.
Bit :
7
6
5
4
3
2
1
0
0
0
0
0
0
BR
FQ
SF
Bits 7 to 3—Unused: Return 0.
Rev. 2.0, 06/04, page 601 of 980
Bit 2—User Branch Error Detect (BR): Returns the check result whether the specified user
branch destination address is in the area other than the storage area of the programming/erasing
program which has been downloaded .
Bit 2
BR
Description
0
User branch address setting is normal
1
User branch address setting is abnormal
Bit 1—Frequency Error Detect (FQ): Returns the check result whether the specified operating
frequency of the CPU is in the range of the supported operating frequency.
Bit 1
FQ
Description
0
Setting of operating frequency is normal
1
Setting of operating frequency is abnormal
Bit 0—Success/Fail (SF): Indicates whether initialization is completed normally.
Bit 0
SF
Description
0
Initialization is ended normally (no error)
1
Initialization is ended abnormally (error occurs)
(3) Programming Execution
When flash memory is programmed, the programming destination address on the user MAT must
be passed to the programming program in which the program data is downloaded.
1. The start address of the programming destination on the user MAT is set in general register
ER1 of the CPU. This parameter is called FMPAR (flash multipurpose address area
parameter).
Since the program data is always in 128-byte units, the lower eight bits (MOA7 to MOA0)
must be H'00 or H'80 as the boundary of the programming start address on the user MAT.
2. The program data for the user MAT must be prepared in the consecutive area. The program
data must be in the consecutive space which can be accessed by using the MOV.B instruction
of the CPU and is not the flash memory space.
When data to be programmed does not satisfy 128 bytes, the 128-byte program data must be
prepared by embedding the dummy code (H'FF).
The start address of the area in which the prepared program data is stored must be set in
general register ER0. This parameter is called FMPDR (flash multipurpose data destination
area parameter).
Rev. 2.0, 06/04, page 602 of 980
For details on the programming procedure, see section 18.5.2, User Program Mode.
(a) Flash multipurpose address area parameter (FMPAR: general register ER1 of CPU)
This parameter indicates the start address of the programming destination on the user MAT.
When an address in an area other than the flash memory space is set, an error occurs.
The start address of the programming destination must be at the 128-byte boundary. If this
boundary condition is not satisfied, an error occurs. The error occurrence is indicated by the WA
bit (bit 1) in FPFR.
FMPAR
Bit :
31
MOA31
30
MOA30
29
MOA29
28
MOA28
27
MOA27
26
MOA26
25
MOA25
24
MOA24
Bit :
23
MOA23
22
MOA22
21
MOA21
20
MOA20
19
MOA19
18
MOA18
17
MOA17
16
MOA16
Bit :
15
MOA15
14
MOA14
13
MOA13
12
MOA12
11
MOA11
10
MOA10
9
MOA9
8
MOA8
Bit :
7
MOA7
6
MOA6
5
MOA5
4
MOA4
3
MOA3
2
MOA2
1
MOA1
0
MOA0
Bits 31 to 0—MOA31 to MOA0: Store the start address of the programming destination on the
user MAT. The consecutive 128-byte programming is executed starting from the specified start
address of the user MAT. Therefore, the specified programming start address becomes a 128-byte
boundary and MOA6 to MOA0 are always 0.
Rev. 2.0, 06/04, page 603 of 980
(b) Flash multipurpose data destination parameter (FMPDR: general register ER0 of CPU):
This parameter indicates the start address in the area which stores the data to be programmed in
the user MAT. When the storage destination of the program data is in flash memory, an error
occurs. The error occurrence is indicated by the WD bit (bit 2) in FPFR.
FMPDR
Bit :
31
MOD31
30
MOD30
29
MOD29
28
MOD28
27
MOD27
26
MOD26
25
MOD25
24
MOD24
Bit :
23
MOD23
22
MOD22
21
MOD21
20
MOD20
19
MOD19
18
MOD18
17
MOD17
16
MOD16
Bit :
15
MOD15
14
MOD14
13
MOD13
12
MOD12
11
MOD11
10
MOD10
9
MOD9
8
MOD8
Bit :
7
MOD7
6
MOD6
5
MOD5
4
MOD4
3
MOD3
2
MOD2
1
MOD1
0
MOD0
Bits 31 to 0—MOD31 to MOD0: Store the start address of the area which stores the program
data for the user MAT. The consecutive 128-byte data is programmed to the user MAT starting
from the specified start address.
(c) Flash pass/fail parameter (FPFR: general register R0L of CPU)
An explanation of FPFR as the return value indicating the programming result is provided here.
Bit :
7
0
6
MD
5
EE
4
FK
3
0
2
WD
1
WA
0
SF
Bit 7—Unused: Returns 0.
Bit 6—Programming Mode Related Setting Error Detect (MD): Returns the check result of
whether the signal input to the FWE pin is high and whether the error protection state is entered.
When a low-level signal is input to the FWE pin or the error protection state is entered, 1 is
written to this bit. The input level to the FWE pin and the error protection state can be confirmed
with the FWE bit (bit 7) and the FLER bit (bit 4) in FCCS, respectively. For conditions to enter
the error protection state, see section 18.6.3, Error Protection.
Bit 6
MD
Description
0
FWE and FLER settings are normal (FWE = 1, FLER = 0)
1
FWE = 0 or FLER = 1, and programming cannot be performed
Rev. 2.0, 06/04, page 604 of 980
Bit 5-Programming Execution Error Detect (EE): 1 is returned to this bit when the specified
data could not be written because the user MAT was not erased or when flash-memory related
register settings are partially changed on returning from the user branch processing.
If this bit is set to 1, there is a high possibility that the user MAT is partially rewritten. In this case,
after removing the error factor, erase the user MAT.
If FMATS is set to H'AA and the user boot MAT is selected, an error occurs when programming
is performed. In this case, both the user MAT and user boot MAT are not rewritten.
Programming of the user boot MAT should be performed in the boot mode or PROM mode.
Bit 5
EE
Description
0
Programming has ended normally
1
Programming has ended abnormally (programming result is not guaranteed)
Bit 4—Flash Key Register Error Detect (FK): Returns the check result of the value of FKEY
before the start of the programming processing.
Bit 4
FK
Description
0
FKEY setting is normal (FKEY = H'5A)
1
FKEY setting is error (FKEY = value other than H'5A)
Bit 3—Unused: Returns 0.
Bit 2—Write Data Address Detect (WD): When flash memory area is specified as the start
address of the storage destination of the program data, an error occurs.
Bit 2
WD
Description
0
Setting of write data address is normal
1
Setting of write data address is abnormal
Bit 1—Write Address Error Detect (WA): When the following area is specified as the start
address of the programming destination, an error occurs.
1. If the start address is outside the flash memory area
2. If the specified address is not a 128-byte boundary (A6 to A0 are not 0)
Rev. 2.0, 06/04, page 605 of 980
Bit 1
WA
Description
0
Setting of programming destination address is normal
1
Setting of programming destination address is abnormal
Bit 0—Success/Fail (SF): Indicates whether the program processing is ended normally or not.
Bit 0
SF
Description
0
Programming is ended normally (no error)
1
Programming is ended abnormally (error occurs)
(4) Erasure Execution
When flash memory is erased, the erase-block number on the user MAT must be passed to the
erasing program which is downloaded. This is set to the FEBS parameter (general register ER0).
One block is specified from the block number 0 to 15.
For details on the erasing processing procedure, see section 18.5.2, User Program Mode.
(a) Flash erase block select parameter (FEBS: general register ER0 of CPU)
This parameter specifies the erase-block number. The several block numbers cannot be specified.
Bit :
31
0
30
0
29
0
28
0
27
0
26
0
25
0
24
0
Bit :
23
0
22
0
21
0
20
0
19
0
18
0
17
0
16
0
Bit :
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
Bit :
7
EBS7
6
EBS6
5
EBS5
4
EBS4
3
EBS3
2
EBS2
1
EBS1
0
EBS0
Bits 31 to 8—Unused: Only 0 may be written to these bits.
Bits 7 to 0—Erase Block (EB7 to EB0): Set the erase-block number in the range from 0 to 15. 0
corresponds to the EB0 block and 15 corresponds to the EB15 block. An error occurs when the
number other than 0 to 15 is set.
Rev. 2.0, 06/04, page 606 of 980
(b) Flash pass/fail parameter (FPFR: general register R0L of CPU)
An explanation of FPFR as the return value indicating the erase result is provided here.
Bit :
7
6
5
4
3
2
1
0
0
MD
EE
FK
EB
0
0
SF
Bit 7—Unused: Returns 0.
Bit 6—Erasure Mode Related Setting Error Detect (MD): Returns the check result of whether
the signal input to the FWE pin is high and whether the error protection state is entered.
When a low-level signal is input to the FWE pin or the error protection state is entered, 1 is
written to this bit. The input level to the FWE pin and the error protection state can be confirmed
with the FWE bit (bit 7) and the FLER bit (bit 4) in FCCS, respectively. For conditions to enter
the error protection state, see section 18.6.3, Error Protection.
Bit 6
MD
Description
0
FWE and FLER settings are normal (FWE = 1, FLER = 0)
1
FWE = 0 or FLER = 1, and erasure cannot be performed
Bit 5—Erasure Execution Error Detect (EE): 1 is returned to this bit when the user MAT could
not be erased or when flash-memory related register settings are partially changed on returning
from the user branch processing.
If this bit is set to 1, there is a high possibility that the user MAT is partially erased. In this case,
after removing the error factor, erase the user MAT.
If FMATS is set to H'AA and the user boot MAT is selected, an error occurs when erasure is
performed. In this case, both the user MAT and user boot MAT are not erased.
Erasing of the user boot MAT should be performed in the boot mode or PROM mode.
Bit 5
EE
Description
0
Erasure has ended normally
1
Erasure has ended abnormally (erasure result is not guaranteed)
Bit 4—Flash Key Register Error Detect (FK): Returns the check result of FKEY value before
start of the erasing processing.
Rev. 2.0, 06/04, page 607 of 980
Bit 4
FK
Description
0
FKEY setting is normal (FKEY = H'5A)
1
FKEY setting is error (FKEY = value other than H'5A)
Bit 3—Erase Block Select Error Detect (EB): Returns the check result whether the specified
erase-block number is in the block range of the user MAT.
Bit 3
EB
Description
0
Setting of erase-block number is normal
1
Setting of erase-block number is abnormal
Bits 2 to 1—Unused: Return 0.
Bit 0—Success/Fail (SF): Indicates whether the erasing processing is ended normally or not.
Bit 0
SF
Description
0
Erasure is ended normally (no error)
1
Erasure is ended abnormally (error occurs)
18.4.4
RAM Control Register (RAMCR)
When the realtime programming of the user MAT is emulated, RAMCR sets the area of the user
MAT which is overlapped with a part of the on-chip RAM. RAMCR is initialized to H'F0 at a
power-on reset or in hardware standby mode and is not initialized in software standby mode. The
RAMCR setting must be executed in user mode or in user program mode.
For the division method of the user-MAT area, see table 18.7. In order to operate the emulation
function certainly, the target MAT of the RAM emulation must not be accessed immediately after
RAMCR is programmed. If it is accessed, the normal access is not guaranteed.
Bit :
7
—
6
—
5
—
4
—
3
RAMS
2
RAM2
1
RAM1
0
RAM0
Initial value :
1
1
1
1
0
0
0
0
R/W :
R
R
R
R
R/W
R/W
R/W
R/W
Bits 7 to 4—Reserved: These bits are always read as 1. The write value should always be 1.
Rev. 2.0, 06/04, page 608 of 980
Bit 3—RAM Select (RAMS): Sets whether the user MAT is emulated or not. When RAMS = 1,
all blocks of the user MAT are in the programming/erasing protection state.
Bit 3
RAMS
Description
0
Emulation is not selected
Programming/erasing protection of all user-MAT blocks is invalid
1
Emulation is selected
Programming/erasing protection of all user-MAT blocks is valid
(Initial value)
Bits 2 to 0—User MAT Area Select: These bits are used with bit 3 and select the user-MAT area
to be overlapped with the on-chip RAM (see table 18.7).
Table 18.7 Division of User MAT Area
RAM Area
Block Name
RAMS
RAM2
RAM1
RAM0
H'FFE000 to H'FFEFFF
RAM area (4 kbytes)
0
*
*
*
H'000000 to H'000FFF
EB0 (4kbytes)
1
0
0
0
H'001000 to H'001FFF
EB1 (4kbytes)
1
0
0
1
H'002000 to H'002FFF
EB2 (4kbytes)
1
0
1
0
H'003000 to H'003FFF
EB3 (4kbytes)
1
0
1
1
H'004000 to H'004FFF
EB4 (4kbytes)
1
1
0
0
H'005000 to H'005FFF
EB5 (4kbytes)
1
1
0
1
H'006000 to H'006FFF
EB6 (4kbytes)
1
1
1
0
H'007000 to H'007FFF
EB7 (4kbytes)
1
1
1
1
Note:
18.4.5
*
Don't care.
Flash Vector Address Control Register (FVACR)
FVACR modifies the space which reads the vector table data of the NMI interrupts. Normally the
vector table data is read from the address spaces from H'00001C to H'00004F. However, the
vector table can be read from the internal I/O register (FVADRR to FVADRL) by the FVACR
setting. FVACR is initialized to H'00 at a power-on reset or in hardware standby mode.
All interrupts including NMI must be prohibited in the programming/erasing processing or during
downloading on-chip program. When if it is not possible to avoid using the NMI interrupt due to
system requirements, such as during system error processing, FVACR and FVADRR to FVADRL
must be set and the interrupt exception processing routine must be set in the on-chip RAM.
Rev. 2.0, 06/04, page 609 of 980
Bit :
7
FVCHGE
Initial value :
R/W :
6
—
5
—
4
—
3
2
1
0
FVSEL3 FVSEL2 FVSEL1 FVSEL0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit 7—Vector Switch Function Valid (FVCHGE): Selects whether the function for modifying
the space which reads the vector table data is valid or invalid. When FVCHGE = 1, the vector
table data can be read from the internal I/O registers (FVADRR to FVADRL).
Bit 7
FVCHGE
Description
0
Function for modifying the space which reads the vector table data is invalid
(Initial value)
1
Function for modifying the space which reads the vector table data is valid
Bits 6 to 4—Reserved: These bits are always read as 0. The write value should always be 0.
Bits 3 to 0—Interrupt Source Select (FVSEL3 to FVSEL0): The vector table of the NMI
interrupt processing can be in the internal I/O registers (FVADRR to FVADRL) by setting this bit.
Interrupt Source Bits
Bit 3
Bit 2
Bit 1
Bit 0
FVSEL3
FVSEL2
FVSEL1
FVSEL0
Function
0
0
0
0
Vector table data is in area 0
(H'00001C to H'00004F)
Setting prohibited
(Initial value)
0
0
0
1
0
0
1
—
0
1
—
—
1
0
0
0
Vector table data is in internal I/O register
(FVADRR to FVADRL)
Setting prohibited
1
0
0
1
1
0
1
—
1
1
—
—
Rev. 2.0, 06/04, page 610 of 980
18.4.6
Flash Vector Address Data Register (FVADR)
When the function for switching the space which reads the vector table data by using FVACR is
valid, FVADR stores the vector data. FVADR is configured by the four 8-bit registers (FVADRR,
FVADRE, FVADRH, and FVADRL). FVADR is initialized to H'00000000 at a power-on reset or
in hardware standby mode.
Bit :
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Initial value :
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
R/W :
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
FVADRR
FVADRE
FVADRH
FVADRL
Vector address is set
Rev. 2.0, 06/04, page 611 of 980
18.5
On-Board Programming Mode
When the pin is set in on-board programming mode and the reset start is executed, the on-board
programming state that can program/erase the on-chip flash memory is entered. On-board
programming mode has three operating modes: user programming mode, user boot mode, and
boot mode.
For details on the pin setting for entering each mode, see table 18.1. For details on the state
transition of each mode for flash memory, see figure 18.2.
18.5.1
Boot Mode
Boot mode executes programming/erasing user MAT and user boot MAT by means of the control
command and program data transmitted from the host using the on-chip SCI. The tool for
transmitting the control command and program data must be prepared in the host. The SCI
communication mode is set to asynchronous mode. When reset start is executed after this LSI's
pin is set in boot mode, the boot program in the microcomputer is initiated. After the SCI bit rate
is automatically adjusted, the communication with the host is executed by means of the control
command method.
The system configuration diagram in boot mode is shown in figure 18.6. For details on the pin
setting in boot mode, see table 18.1. The NMI and other interrupts are ignored in boot mode.
Make sure the NMI and other interrupts do not occur in the user system.
This LSI
Host
Boot
Control command, program data
programming
tool and program
data
Reply response
Control command,
analysis execution
software (on-chip)
Flash
memory
RxD1
On-chip SCI1
TxD1
On-chip RAM
Figure 18.6 System Configuration in Boot Mode
SCI Interface Setting by Host: When boot mode is initiated, this LSI measures the low period of
asynchronous SCI-communication data (H'00), which is transmitted consecutively by the host.
The SCI transmit/receive format is set to 8-bit data, 1 stop bit, and no parity. This LSI calculates
the bit rate of transmission by the host by means of the measured low period and transmits the bit
Rev. 2.0, 06/04, page 612 of 980
adjustment end sign (1 byte of H'00) to the host. The host must confirm that this bit adjustment
end sign (H'00) has been received normally and transmits 1 byte of H'55 to this LSI. When
reception is not executed normally, boot mode is initiated again (reset) and the operation
described above must be executed. The bit rate between the host and this LSI is not matched by
the bit rate of transmission by the host and system clock frequency of this LSI. To operate the SCI
normally, the transfer bit rate of the host must be set to 9,600 bps or 19,200 bps.
The system clock frequency which can automatically adjust the transfer bit rate of the host and the
bit rate of this LSI is shown in table 18.8. Boot mode must be initiated in the range of this system
clock.
Start
bit
D0
D1
D2
D3
D4
D5
Measure low period (9 bits) (data is H'00)
D6
D7
Stop bit
High period of
at least 1 bit
Figure 18.7 Automatic Adjustment Operation of SCI Bit Rate
Table 18.8 System Clock Frequency that Can Automatically Adjust Bit Rate of This LSI
Bit rate of host
System clock frequency which can automatically adjust bit rate of this LSI
9,600 bps
10 to 25 MHz
19,200 bps
16 to 25 MHz
State Transition: The overview of the state transition after boot mode is initiated is shown in
figure 18.8. For details on boot mode, refer to section 18.10.1, Serial Communications Interface
Specification for Boot Mode.
1. Bit rate adjustment
After boot mode is initiated, the bit rate of the SCI interface is adjusted with that of the host.
2. Waiting for inquiry set command
For inquiries about user-MAT size and configuration, MAT start address, and support state,
the required information is transmitted to the host.
3. Automatic erasure of all user MAT and user boot MAT
After inquiries have finished, all user MAT and user boot MAT are automatically erased.
Rev. 2.0, 06/04, page 613 of 980
4. Waiting for programming/erasing command
• When the program preparation notice is received, the state for waiting program data is
entered. The programming start address and program data must be transmitted following the
programming command. When programming is finished, the programming start address must
be set to H'FFFFFFFF and transmitted. Then the state for waiting program data is returned to
the state of programming/erasing command wait.
• When the erasure preparation notice is received, the state for waiting erase-block data is
entered. The erase-block number must be transmitted following the erasing command. When
the erasure is finished, the erase-block number must be set to H'FF and transmitted. Then the
state for waiting erase-block data is returned to the state for waiting programming/erasing
command. The erasure must be executed when reset start is not executed and the specified
block is programmed after programming is executed in boot mode. When programming can be
executed by only one operation, all blocks are erased before the state for waiting
programming/erasing/other command is entered. The erasing operation is not required.
• There are many commands other than programming/erasing. Examples are sum check, blank
check (erasure check), and memory read of the user MAT/user boot MAT and acquisition of
current status information.
Note that memory read of the user MAT/user boot MAT can only read the program data after all
user MAT/user boot MAT has automatically been erased.
Rev. 2.0, 06/04, page 614 of 980
(Bit rate adjustment)
H'00 to H'00 reception
Boot mode initiation
(reset by boot mode)
H'00 transmission
(adjustment completed)
Bit rate adjustment
H'55
2
rece
ption
Inquiry command reception
Wait for inquiry
setting command
Inquiry command response
Processing of
inquiry setting
command
All user MAT and
user boot MAT erasure
3
4
1
Wait for
programming/erasing
command
Read/check command
reception
Processing of
read/check command
Command response
(Erasure command reception)
(Erasure end)
(Program end)
(Program command reception)
(Erase-block specification)
Wait for erase-block
data
(Program data transmission)
Wait for program data
Figure 18.8 Overview of Boot Mode State Transition
18.5.2
User Program Mode
The user MAT can be programmed/erased in user program mode. (The user boot MAT cannot be
programmed/erased.)
Programming/erasing is executed by downloading the program in the microcomputer.
The overview flow is shown in figure 18.9.
High voltage is applied to internal flash memory during the programming/erasing processing.
Therefore, transition to reset or hardware standby must not be executed. Doing so may cause
Rev. 2.0, 06/04, page 615 of 980
damage or destroy flash memory. If reset is executed accidentally, reset must be released after the
reset input period, which is longer than normal 100 µs.
For information on the programming procedure refer to “Programming Procedure in User
Program Mode”, and for information on the erasing procedure refer to “Erasing Procedure in User
Program Mode”, below.
For the overview of a processing that repeats erasing and programming by downloading the
programming program and the erasing program in separate on-chip ROM areas using FTDAR, see
“Erasing and Programming Procedure in User Program Mode” which appears later in this section.
Programming/erasing
start
1. RAM emulation mode must be canceled
in advance. Download cannot be executed
in emulation mode.
When programming,
program data is prepared
FWE=1 ?
No
Yes
Programming/erasing
procedure program is
transferred to the on-chip
RAM and executed
Programming/erasing
end
2. When the program data is made by means
of emulation, use the FTDAR register to change
the download destination. Note that the download
area and the emulation area will overlap if FTDAR
is in its initial status (H'00) or set to H'01.
3. Inputting the FWE pin to high level sets the
FWE bit to 1.
4. Programming/erasing is executed only in
the on-chip RAM. However, if program data
is in a consecutive area and can be accessed
by the MOV.B instruction of the CPU like
SRAM/ROM, the program data can be in an
external space.
5. After programming/erasing is finished, the FWE
pin must be input to low and protected.
Figure 18.9 Programming/Erasing Overview Flow
On-chip RAM Address Map when Programming/Erasing is Executed: Parts of the procedure
program that are made by the user, like download request, programming/erasing procedure, and
judgement of the result, must be executed in the on-chip RAM. The on-chip program that is to be
downloaded is all in the on-chip RAM. Note that area in the on-chip RAM must be controlled so
that these parts do not overlap.
Figure 18.10 shows the program area to be downloaded.
Rev. 2.0, 06/04, page 616 of 980
<On-chip RAM>
RAM emulation area
or area that can be
used by user
Area to be
downloaded
(Size : 2 kbytes)
Unusable area in
programming/erasing
processing period
DPFR
(Return value: 1 byte)
Address
RAMTOP(H'FFBF20)
FTDAR setting
System use area
(15 bytes)
Programming/erasing entry
Initialization process entry
FTDAR setting+16
FTDAR setting+32
Initialization + programming
program or Initialization +
erasing program
FTDAR setting+2048
Area that can be
used by user
RAMEND(H'FFFF1F)
Figure 18.10 RAM Map when Programming/Erasing is Executed
Programming Procedure in User Program Mode: The procedures for download, initialization,
and programming are shown in figure 18.11.
Rev. 2.0, 06/04, page 617 of 980
Select on-chip program
to be downloaded and
set download destination
by FTDAR
(a)
Disable interrupts and bus
master operation other
than CPU
(i)
Set FKEY to H'A5
(b)
Set FKEY to H'5A
(j)
Set SCO to 1 and
execute download
(c)
Set parameter to ER0 and
ER1 (FMPAR and FMPDR)
(k)
Clear FKEY to 0
(d)
Programming
JSR FTDAR setting+16
(l)
(e)
DFPR=0?
Yes
Initialization
1
No
(f)
Initialization
JSR FTDAR setting+32
(g)
Yes
FPFR=0?
Download error processing
Set the FPEFEQ and
FUBRA parameters
FPFR=0?
Programming
Download
Start programming
procedure program
(h)
Yes
No
Required data
programming is
completed?
Initialization error processing
Clear FKEY and
programming
error processing
(n)
Yes
Clear FKEY to 0
No
1
(m)
No
(o)
End programming
procedure program
Figure 18.11 Programming Procedure
The details of the programming procedure are described below. The procedure program must be
executed in an area other than the flash memory to be programmed. Especially the part where the
SCO bit in FCCS is set to 1 for downloading must be executed in the on-chip RAM.
The area that can be executed in the steps of the user procedure program (on-chip RAM, user
MAT, and external space) is shown in section 18.10.3, Procedure Program and Storable Area for
Programming Data.
The following description assumes the area to be programmed on the user MAT is erased and
program data is prepared in the consecutive area. When erasing is not executed, erasing is
executed before writing.
128-byte programming is performed in one program processing. When more than 128-byte
programming is performed, programming destination address/program data parameter is updated
in 128-byte units and programming is repeated.
When less than 128-byte programming is performed, data must total 128 bytes by adding the
invalid data. If the invalid data to be added is H'FF, the program processing period can be shorted.
Rev. 2.0, 06/04, page 618 of 980
(a) Select the on-chip program to be downloaded and the download destination.
When the PPVS bit of FPCS is set to 1, the programming program is selected.
Several programming/erasing programs cannot be selected at one time. If several programs are
set, download is not performed and a download error is returned to the source select error
detect (SS) bit in the DPFR parameter.
Specify the start address of the download destination by FTDAR.
(b) Program H'A5 in FKEY
If H'A5 is not written to FKEY for protection, 1 cannot be written to the SCO bit for download
request.
(c) 1 is written to the SCO bit of FCCS and then download is executed.
To write 1 to the SCO bit, the following conditions must be satisfied.
• RAM emulation mode is canceled.
• H'A5 is written to FKEY.
• The SCO bit writing is executed in the on-chip RAM.
When the SCO bit is set to 1, download is started automatically. When the SCO bit is returned
to the user procedure program, the SCO is cleared to 0. Therefore, the SCO bit cannot be
confirmed to be 1 in the user procedure program.
The download result can be confirmed only by the return value of the DPFR parameter. Before
the SCO bit is set to 1, incorrect judgement must be prevented by setting the DPFR parameter,
that is one byte of the start address of the on-chip RAM area specified by FTDAR, to a value
other than the return value (H'FF).
When download is executed, particular interrupt processing, which is accompanied by the
bank switch as described below, is performed as an internal microcomputer processing. Four
NOP instructions are executed immediately after the instructions that set the SCO bit to 1.
• The user-MAT space is switched to the on-chip program storage area.
• After the selection condition of the download program and the address set in FTDAR
are checked, the transfer processing is executed starting from the on-chip RAM address
specified by FTDAR.
• The SCO bits in FPCS, FECS, and FCCS are cleared to 0.
• The return value is set to the DPFR parameter.
• After the on-chip program storage area is returned to the user-MAT space, the user
procedure program is returned.
The notes on download are as follows.
In the download processing, the values are stored in general registers than CPU.
Rev. 2.0, 06/04, page 619 of 980
No interrupts are accepted during download processing. However, interrupt requests other than
NMI requests are held, so when processing returns to the user procedure program and
interrupts are generated. NMI requests are discarded if the FVACR register value is H'00.
However, if H'80 has been written to the FVACR register, they are held and the NMI
interrupts are generated when processing returns to the user procedure program.
The sources of the interrupt requests from the on-chip module and at the falling edge of the
IRQ are held during downloading. The refresh can be put in the DRAM.
When the level-detection interrupt requests are to be held, interrupts must be put until the
download is ended.
When hardware standby mode is entered during download processing, the normal download
cannot be guaranteed in the on-chip RAM. Therefore, download must be executed again.
Since a stack area of a maximum 128 bytes is used, the area must be saved before setting the
SCO bit to 1.
If flash memory is accessed by the DMAC or BREQ during downloading, the operation
cannot be guaranteed. Therefore, access by the DMAC or BREQ must not be executed.
(d) FKEY is cleared to H'00 for protection.
(e) The value of the DPFR parameter must be checked and the download result must be
confirmed.
A recommended procedure for confirming the download result is shown below.
• Check the value of the DPFR parameter (one byte of start address of the download
destination specified by FTDAR). If the value is H'00, download has been performed
normally. If the value is not H'00, the source that caused download to fail can be
investigated by the description below.
• If the value of the DPFR parameter is the same as before downloading (e.g. H'FF), the
address setting of the download destination in FTDAR may be abnormal. In this case,
confirm the setting of the TDER bit (bit 7) in FTDAR.
• If the value of the DPFR parameter is different from before downloading, check the SS
bit (bit 2) and the FK bit (bit 1) in the DPFR parameter to ensure that the download
program selection and FKEY register setting were normal, respectively.
(f) The operating frequency and user branch destination are set to the FPEFEQ and FUBRA
parameters for initialization.
• The current frequency of the CPU clock is set to the FPEFEQ parameter (general
register: ER0).
Rev. 2.0, 06/04, page 620 of 980
For the settable range of the FPEFEQ parameter, see section 21.4.1, Clock Timing.
When the frequency is set out of this range, an error is returned to the FPFR parameter
of the initialization program and initialization is not performed. For details on the
frequency setting, see the description in 18.4.3(2) (a) Flash programming/erasing
frequency parameter (FPEFEQ: general register ER0 of CPU).
• The start address in the user branch destination is set to the FUBRA parameter (general
register: ER1).
Not available in the H8/3029, 0 must be set to FUBRA.
When the user branch is executed, the branch destination is executed in a user MAT
other than the one that is to be programmed. The area of the on-chip program that is
downloaded cannot be set.
The program processing must be returned from the user branch processing by the RTS
instruction.
See the description in 18.4.3 (2) (b) Flash user branch address setting parameter
(FUBRA: general register ER1 of CPU).
(g) Initialization
When a programming program is downloaded, the initialization program is also downloaded
to the on-chip RAM. There is an entry point of the initialization program in the area from
(download start address set by FTDAR) + 32 bytes. The subroutine is called and initialization
is executed by using the following steps.
MOV.L
#DLTOP+32,ER2
; Set entry address to ER2
JSR
@ER2
; Call initialization routine
NOP
• The general registers other than R0L are saved in the initialization program.
• R0L is a return value of the FPFR parameter.
• Since the stack area is used in the initialization program, a stack area of a maximum
128 bytes must be saved in RAM.
• Interrupts can be accepted during the execution of the initialization program. The
program storage area and stack area in the on-chip RAM and register values must not
be destroyed.
(h) The return value in the initialization program, FPFR (general register R0L) is judged.
(i) All interrupts and the use of a bus master other than the CPU are prohibited.
The specified voltage is applied for the specified time when programming or erasing. If
interrupts occur or the bus mastership is moved to other than the CPU during this time, more
than the specified voltage will be applied and flash memory may be damaged. Therefore,
interrupts and movement of bus mastership to DMAC or BREQ and DRAM refresh other than
the CPU are prohibited.
Rev. 2.0, 06/04, page 621 of 980
The interrupt processing prohibition is set up by setting the bit 7 (I) in the condition code
register (CCR) of the CPU to b'1. Then interrupts other than NMI are held and are not
executed.
The NMI interrupts must not occur in the user system.
The interrupts that are held must be processed in executed after all program processing.
When the bus mastership is moved to DMAC or BREQ or DRAM refresh except for the CPU,
the error protection state is entered. Therefore, reservation of bus mastership by DMAC or
BREQ is prohibited.
(j) FKEY must be set to H'5A and the user MAT must be prepared for programming.
(k) The parameter which is required for programming is set.
The start address of the programming destination of the user MAT (FMPAR) is set to general
register ER1. The start address of the program data storage area (FMPDR) is set to general
register ER0.
• Example of the FMPAR setting
FMPAR specifies the programming destination address. When an address other than
one in the user MAT area is specified, even if the programming program is executed,
programming is not executed and an error is returned to the return value parameter
FPFR. Since the unit is 128 bytes, the lower eight bits (A7 to A0) must be in the 128byte boundary of H'00 or H'80.
• Example of the FMPDR setting
When the storage destination of the program data is flash memory, even if the program
execution routine is executed, programming is not executed and an error is returned to
the FPFR parameter. In this case, the program data must be transferred to the on-chip
RAM and then programming must be executed.
(l) Programming
There is an entry point of the programming program in the area from (download start address
set by FTDAR) + 16 bytes of on-chip RAM. The subroutine is called and programming is
executed by using the following steps.
MOV.L
#DLTOP+16,ER2
; Set entry address to ER2
JSR
@ER2
; Call programming routine
NOP
• The general registers other than R0L are saved in the programming program.
• R0 is a return value of the FPFR parameter.
Rev. 2.0, 06/04, page 622 of 980
• Since the stack area is used in the programming program, a stack area of a maximum
128 bytes must be reserved in RAM
(m) The return value in the programming program, FPFR (general register R0L) is judged.
(n) Determine whether programming of the necessary data has finished.
If more than 128 bytes of data are to be programmed, specify FMPAR and FMPDR in 128byte units, and repeat steps (l) to (m). Increment the programming destination address by 128
bytes and update the programming data pointer correctly. If an address which has already been
programmed is written to again, not only will a programming error occur, but also flash
memory will be damaged.
(o) After programming finishes, clear FKEY and specify software protection.
If this LSI is restarted by a power-on reset immediately after user MAT programming has
finished, secure a reset period (period of RES = 0) that is at least as long as normal 100 µs.
Erasing Procedure in User Program Mode: The procedures for download, initialization, and
erasing are shown in figure 18.12.
1
Start erasing procedure
program
Select on-chip program
to be downloaded and set
download destination
by FTDAR
Disable interrupts and
bus master operation
other than CPU
(a)
Set FKEY to H'5A
Set SCO to 1 and
execute download
Erasing
Download
Set FKEY to H'A5
Clear FKEY to 0
DPFR = 0?
Yes
(b)
Erasing
JSR FTDAR setting+16
(c)
(d)
FPFR=0 ?
No
Yes
Download error processing
Set the FPEFEQ and
FUBRA parameters
Initialization
Set FEBS parameter
No
No
Clear FKEY and erasing
error processing
Required block
erasing is
completed?
Initialization
JSR FTDAR setting+32
(e)
Yes
Clear FKEY to 0
(f)
FPFR=0 ?
No
Yes Initialization error processing
End erasing
procedure program
1
Figure 18.12 Erasing Procedure
Rev. 2.0, 06/04, page 623 of 980
The details of the erasing procedure are described below. The procedure program must be
executed in an area other than the user MAT to be erased. Especially the part where the SCO bit in
FCCS is set to 1 for downloading must be executed in on-chip RAM.
The area that can be executed in the steps of the user procedure program (on-chip RAM, user
MAT, and external space) is shown in section 18.10.3, Procedure Program and Storable Area for
Programming Data.
For the downloaded on-chip program area, refer to the RAM map for programming/erasing in
figure 18.10, RAM Map when Programming/Erasing is Executed.
A single divided block is erased by one erasing processing. For block divisions, refer to figure
18.4, Block Division of User MAT. To erase two or more blocks, update the erase block number
and perform the erasing processing for each block.
(a) Select the on-chip program to be downloaded
Set the EPVB bit in FECS to 1.
Several programming/erasing programs cannot be selected at one time. If several programs are
set, download is not performed and a download error is returned to the source select error
detect (SS) bit in the DPFR parameter.
The procedures to be carried out after setting FKEY, e.g. download and initialization, are the same
as those in the programming procedure. For details, refer to Programming Procedure in User
Program Mode in section 18.5.2.
(b) Set the FEBS parameter necessary for erasure
Set the erase block number of the user MAT in the flash erase block select parameter FEBS
(general register ER0). If a value other than an erase block number of the user MAT is set, no
block is erased even though the erasing program is executed, and an error is returned to the
return value parameter FPFR.
(c) Erasure
Similar to as in programming, there is an entry point of the erasing program in the area from
(download start address set by FTDAR) + 16 bytes of on-chip RAM. The subroutine is called
and erasing is executed by using the following steps.
MOV.L
#DLTOP+16,ER2
; Set entry address to ER2
JSR
@ER2
; Call erasing routine
NOP
• The general registers other than R0L are saved in the erasing program.
• R0 is a return value of the FPFR parameter.
• Since the stack area is used in the erasing program, a stack area of a maximum 128
bytes must be reserved in RAM
Rev. 2.0, 06/04, page 624 of 980
(d) The return value in the erasing program, FPFR (general register R0L) is judged.
(e) Determine whether erasure of the necessary blocks has finished.
If more than one block is to be erased, update the FEBS parameter and repeat steps (b) and (c).
Blocks that have already been erased can be erased again.
(f) After erasure finishes, clear FKEY and specify software protection.
If this LSI is restarted by a power-on reset immediately after user MAT erasure has finished,
secure a reset period (period of RES = 0) that is at least as long as normal 100 µs.
(4) Erasing and Programming Procedure in User Program Mode
By changing the on-chip RAM address of the download destination in FTDAR, the erasing
program and programming program can be downloaded to separate on-chip RAM areas.
Figure 18.13 shows an example of repetitively executing RAM emulation, erasing, and
programming.
1
Set FTDAR to H'02
(Specify H'FFCF20 as
download destination)
Download erasing program
Initialize erasing program
Set FTDAR to H'03
(Specify H'FFBF20 as
download destination)
Download programming
program
Initialize programming
program
Emulation/Erasing/Programming
Programming program
download
Erasing program
download
Start procedure program
Enter RAM emulation mode
and tune data
in on-chip RAM
Cancel RAM emulation mode
Erase relevant block
(execute erasing program)
Set FMPDR to H'FFE000 to
program relevant block
(execute programming
program)
Confirm operation
End ?
No
Yes
1
End procedure program
Figure 18.13 Sample Procedure of Repeating RAM Emulation, Erasing, and Programming
(Overview)
Rev. 2.0, 06/04, page 625 of 980
In the above example, the erasing program and programming program are downloaded to areas
excluding the 4 kbytes (H'FFE000 to H'FFEFFF) from the start of on-chip ROM.
Download and initialization are performed only once at the beginning.
In this kind of operation, note the following:
• Be careful not to damage on-chip RAM with overlapped settings.
In addition to the RAM emulation area, erasing program area, and programming program area,
areas for the user procedure programs, work area, and stack area are reserved in on-chip RAM.
Do not make settings that will overwrite data in these areas.
• Be sure to initialize both the erasing program and programming program.
Initialization by setting the FPEFEQ and FUBRA parameters must be performed for both the
erasing program and the programming program. Initialization must be executed for both entry
addresses: (download start address for erasing program) + 32 bytes (H'FFCF40 in this
example) and (download start address for programming program) + 32 bytes (H'FFBF40 in
this example).
18.5.3
User Boot Mode
This LSI has user boot mode which is initiated with different mode pin settings than those in user
program mode or boot mode. User boot mode is a user-arbitrary boot mode, unlike boot mode that
uses the on-chip SCI.
Only the user MAT can be programmed/erased in user boot mode. Programming/erasing of the
user boot MAT is only enabled in boot mode or programmer mode.
User Boot Mode Initiation: For the mode pin settings to start up user boot mode, see table 18.1.
When the reset start is executed in user boot mode, the built-in check routine runs. The user MAT
and user boot MAT states are checked by this check routine.
While the check routine is running, NMI and all other interrupts cannot be accepted.
Next, processing starts from the execution start address of the reset vector in the user boot MAT.
At this point, H'AA is set to the flash MAT select register FMATS because the execution MAT is
the user boot MAT.
To enable NMI interrupts in a user boot MAT program, after the reset ends (RES = 1) and 400 µs
passes, set NMI to 1.
User MAT Programming in User Boot Mode: For programming the user MAT in user boot
mode, additional processings made by setting FMATS are required: switching from user-bootMAT selection state to user-MAT selection state, and switching back to user-boot-MAT selection
state after programming completes.
Rev. 2.0, 06/04, page 626 of 980
Figure 18.14 shows the procedure for programming the user MAT in user boot mode.
1
Start programming
procedure program
Select on-chip program
to be downloaded and
set download destination
by FTDAR
Set FMATS to value other than
H'AA to select user MAT
Yes
No
Download error processing
Set the FPEFEQ and
FUBRA parameters
Initialization
JSR FTDAR setting+32
FPFR=0 ?
Set parameter to ER0 and
ER1 (FMPAR and FMPDR)
Programming
JSR FTDAR setting+16
Programming
Clear FKEY to 0
User-MAT selection state
Download
Set FKEY to H'5A
Set SCO to 1 and
execute download
DPFR=0 ?
Initialization
User-boot-MAT selection state
Set FKEY to H'A5
MAT
switchover
FPFR=0 ?
No
Yes Clear FKEY and programming
error processing*
No
Required data
programming is
completed?
Yes
No
Clear FKEY to 0
Yes Initialization error processing
Set FMATS to H'AA to
select user boot MAT
Disable interrupts
and bus master operation
other than CPU
1
User-boot-MAT
selection state
MAT
switchover
End programming
procedure program
Note: * The MAT must be switched by FMATS
to perform the programming error
processing in the user boot MAT.
Figure 18.14 Procedure for Programming User MAT in User Boot Mode
The difference between the programming procedures in user program mode and user boot mode is
whether the MAT is switched or not as shown in figure 18.14.
In user boot mode, the user boot MAT can be seen in the flash memory space with the user MAT
hidden in the background. The user MAT and user boot MAT are switched only while the user
MAT is being programmed. Because the user boot MAT is hidden while the user MAT is being
programmed, the procedure program must be located in an area other than flash memory. After
programming finishes, switch the MATs again to return to the first state.
MAT switchover is enabled by writing a specific value to FMATS. However note that while the
MATs are being switched, the LSI is in an unstable state, e.g. access to a MAT is not allowed until
MAT switching is completely finished, and if an interrupt occurs, from which MAT the interrupt
vector is read from is undetermined. Perform MAT switching in accordance with the description
in section 18.8, Switching between User MAT and User Boot MAT.
Rev. 2.0, 06/04, page 627 of 980
Except for MAT switching, the programming procedure is the same as that in user program mode.
The area that can be executed in the steps of the user procedure program (on-chip RAM, user
MAT, and external space) is shown in section 18.10.3, Procedure Program and Storable Area for
Programming Data.
User MAT Erasing in User Boot Mode: For erasing the user MAT in user boot mode, additional
processings made by setting FMATS are required: switching from user-boot-MAT selection state
to user-MAT selection state, and switching back to user-boot-MAT selection state after erasing
completes.
Figure 18.15 shows the procedure for erasing the user MAT in user boot mode.
1
Start erasing
procedure program
Set FMATS to value other
than H'AA to select user MAT
MAT
switchover
Set FKEY to H'5A
Clear FKEY to 0
DPFR=0 ?
Yes
No
Download error processing
Set the FPEFEQ and
FUBRA parameters
Initialization
JSR FTDAR setting+32
FPFR=0 ?
Set FEBS parameter
Programming
JSR FTDAR setting+16
Erasing
Set SCO to 1 and
execute download
User-MAT selection state
Download
Set FKEY to H'A5 and
set download destination
by FTDAR
Initialization
User-boot-MAT selection state
Select on-chip program
to be downloaded
FPFR=0 ?
No
No
Yes Clear FKEY and erasing
error processing
Required
block erasing is
completed?
Yes
No
Clear FKEY to 0
Yes Initialization error processing
Set FMATS to H'AA to
select user boot MAT
Disable interrupts
and bus master operation
other than CPU
1
User-boot-MAT
selection state
MAT
switchover
End erasing
procedure program
Note: The MAT must be switched by FMATS to perform the
erasing error processing in the user boot MAT.
Figure 18.15 Procedure for Erasing User MAT in User Boot Mode
The difference between the erasing procedures in user program mode and user boot mode depends
on whether the MAT is switched or not as shown in figure 18.15.
Rev. 2.0, 06/04, page 628 of 980
MAT switching is enabled by writing a specific value to FMATS. However note that while the
MATs are being switched, the LSI is in an unstable state, e.g. access to a MAT is not allowed until
MAT switching is completed finished, and if an interrupt occurs, from which MAT the interrupt
vector is read from is undetermined. Perform MAT switching in accordance with the description
in section 18.8, Switching between User MAT and User Boot MAT.
Except for MAT switching, the erasing procedure is the same as that in user program mode.
The area that can be executed in the steps of the user procedure program (on-chip RAM, user
MAT, and external space) is shown in section 18.10.3, Procedure Program and Storable Area for
Programming Data.
Rev. 2.0, 06/04, page 629 of 980
18.6
Protection
There are two kinds of flash memory program/erase protection: hardware and software protection.
18.6.1
Hardware Protection
Programming and erasing of flash memory is forcibly disabled or suspended by hardware
protection. In this state, the downloading of an on-chip program and initialization of the flash
memory are possible. However, an activated program for programming or erasure cannot program
or erase locations in a user MAT, and the error in programming/erasing is reported in the
parameter FPFR.
Rev. 2.0, 06/04, page 630 of 980
Table 18.9 Hardware Protection
Function to be Protected
Item
Description
Download
FWE-pin protection
•
The input of a low-level signal on the
FWE pin clears the FWE bit of
FCCS and the device enters a
program/erase-protected state.
—
Reset/standby
protection
•
A power-on reset (including a
power-on reset by the WDT) and
entry to standby mode reinitialize
the program/erase interface register
and the device enters a
program/erase-protected state.
•
Resetting by means of the RES pin
after power is initially supplied will
not make the device enter the reset
state unless the RES pin is held low
until oscillation has stabilized. In the
case of a reset during operation,
hold the RES pin low for the RES
pulse width that is specified in the
section on AC characteristics
section. If the device is reset during
programming or erasure, data
values in the flash memory are not
guaranteed. In this case, after
keeping the RES pin low for at least
100 µs, execute erasure and then
execute programming again.
18.6.2
Program/Erase
Software Protection
Software protection is set up in any of three ways: by disabling the downloading of on-chip
programs for programming and erasing, by means of a key code, and by the RAM-emulation
register.
Rev. 2.0, 06/04, page 631 of 980
Table 18.10 Software Protection
Function to be Protected
Item
Description
Protection by the
SCO bit
•
Clearing the SCO bit in the FCCS
register makes the device enter a
program/erase-protected state, and
this disables the downloading of the
programming/erasing programs.
Protection by the
FKEY register
•
Downloading and
programming/erasing are disabled
unless the required key code is
written in the FKEY register.
Different key codes are used for
downloading and for
programming/erasing.
Emulation
protection
•
Setting the RAMS bit in the RAM
emulation register (RAMER) makes
the device enter a program/eraseprotected state.
18.6.3
Download
Program/Erase
Error Protection
Error protection is a mechanism for aborting programming or erasure when an error occurs, in the
form of the microcomputer entering runaway during programming/erasing of the flash memory or
operations that are not according to the established procedures for programming/erasing. Aborting
programming or erasure in such cases prevents damage to the flash memory due to excessive
programming or erasing.
If the microcomputer malfunctions during programming/erasing of the flash memory, the FLER
bit in the FCCS register is set to 1 and the device enters the error-protection state, and this aborts
the programming or erasure.
The FLER bit is set in the following conditions:
(1) When an interrupt, such as NMI, has occurred during programming/erasing
(2) When the relevant block area of flash memory is read during programming/erasing (including
a vector read or an instruction fetch)
(3) When a SLEEP instruction (including software standby mode) is executed during
programming/erasing
(4) When a bus master other than the CPU, such as DMAC or BREQ, has obtained the bus right
during programming/erasing
Rev. 2.0, 06/04, page 632 of 980
Error protection is cancelled only by a power-on reset or by hardware-standby mode. Note that the
reset should only be released after providing a reset input over a period longer than the normal
100 µs period. Since high voltages are applied during programming/erasing of the flash memory,
some voltage may remain after the error-protection state has been entered. For this reason, it is
necessary to reduce the risk of damage to the flash memory by extending the reset period so that
the charge is released.
The state-transition diagram in figure 18.16 shows transitions to and from the error-protection
state.
Program mode
Erase mode
Read disabled
Programming/erasing
enabled FLER=0
RES = 0 or STBY = 0
Err
Error occurrence
or
occ
or
=0
RES TBY=0
S
(S urren
oft
wa ce
re
sta
nd
Error protection mode
Read enabled
Programming/erasing disabled
FLER=1
by
Reset or standby
(Hardware protection)
Read disabled
Programming/erasing disabled
FLER=0
RES=0 or
STBY=0
Program/erase interface
register is in its initial state.
)
Software-standby mode
Error-protection mode
(Software standby)
Read disabled
Cancel
programming/erasing disabled
software-standby mode
FLER=1
Program/erase interface
register is in its initial state.
Figure 18.16 Transitions to and from the Error-Protection State
Rev. 2.0, 06/04, page 633 of 980
18.7
Flash Memory Emulation in RAM
To provide real-time emulation in RAM of data that is to be written to the flash memory, a part of
the RAM can be overlaid on an area of flash memory (user MAT) that has been specified by the
RAM control register (RAMCR). After the RAMCR setting is made, the RAM is accessible in
both the user MAT area and as the RAM area that has been overlaid on the user MAT area. Such
emulation is possible in both user mode and user-program mode.
Figures 18.17 and 18.18 show an example of the emulation of realtime programming of the user
MAT area.
Start of emulation program
Set RAMCR
Write the data for tuning to
the overlaid RAM area
Execute application program
No
Tuning OK?
Yes
Cancel RAMCR setting
Program the user MAT
with the emulated block
End of emulation program
Figure 18.17 Emulation of Flash Memory in RAM
Rev. 2.0, 06/04, page 634 of 980
This area is accessible as both a RAM
area and as a flash memory area.
H'00000
H'01000
H'02000
EB0
EB1
EB2
H'03000
EB3
H'04000
EB4
H'05000
EB5
H'06000
EB6
H'07000
H'FFBF20
EB7
H'FFE000
H'FFEFFF
H'08000
Flash memory
(user MAT)
On-chip RAM
EB8 to EB15
H'7FFFF
H'FFFF1F
Figure 18.18 Example of a RAM-Overlap Operation
Figure 18.18 shows an example of an overlap on block area EB0 of the flash memory.
Emulation is possible for a single area selected from among the eight areas, from EB0 to EB7, of
user MAT bank 0. The area is selected by the setting of the RAM2 to RAM0 bits in the RAMCR
register.
(1) To overlap a part of the RAM on area EB0, to allow realtime programming of the data for this
area, set the RAMCR register's RAMS bit to 1, and each of the RAM2 to RAM0 bits to 0.
(2) Realtime programming is carried out using the overlaid area of RAM.
In programming or erasing the user MAT, it is necessary to run a program that implements a
series of procedural steps, including the downloading of a on-chip program. In this process, set the
download area with FTDAR so that the overlaid RAM area and the area where the on-chip
program is to be downloaded do not overlap. The initial setting (H'00) of FTDAR or a setting of
H'01 causes part of the tuned data area to overlap with part of the download area. When using the
initial setting of FTDAR, the data that is to be programmed must be saved beforehand in an area
that is not used by the system.
Figure 18.19 shows an example of programming of the data, after emulation has been completed,
to the EB0 area in the user MAT.
Rev. 2.0, 06/04, page 635 of 980
H'00000
H'01000
H'02000
EB0
EB1
EB2
H'03000
EB3
H'04000
EB4
H'05000
EB5
H'06000
EB6
H'07000
EB7
H'08000
(1) Cancel the emulation mode.
(2) Transfer the user-created program/
erase-procedure program.
(3) Download the on-chip programming/erasing
programs, avoiding the tuning <illegible>
data area set in FTDAR.
(4) Execute programming after erasing,
as necessary.
H'FFCF20
Download area
Flash memory
(user MAT)
EB8 to EB15
Area for the
programming-procedure
program
H'FFD720
H'FFE000
Copy of the tuned data
H'FFEFFF
On-chip RAM
H'FFFF1F
H'7FFFF
Figure 18.19 Programming of the Data After Tuning
(1) After the data to be programmed has fixed values, clear the RAMS bit to 0 to cancel the
overlap of RAM.
(2) Transfer the user programming/erasing procedure program to RAM.
(3) Run the programming/erasing procedure program in RAM and download the on-chip
programming/erasing program.
Specify the download start address with FTDAR so that the tuned data area does not overlap
with the download area.
(4) When the EB0 area of the user MAT has not been erased, the programming program will be
downloaded after erasure. Set the parameters FMPAR and FMPDR so that the tuned data is
designated, and execute programming.
Note: Setting the RAMS bit to 1 puts all the blocks in the flash MAT into a program/eraseprotected state regardless of the values of the RAM2 to RAM0 bits (emulation protection).
In this state, downloading of the on-chip programs is also disabled, so clear the RAMS bit
before actual programming or erasure.
Rev. 2.0, 06/04, page 636 of 980
18.8
Switching between User MAT and User Boot MAT
It is possible to alternate between the user MAT and user boot MAT. However, the following
procedure is required because these MATs are allocated to address 0.
(Switching to the user boot MAT disables programming and erasing. Programming of the user
boot MAT should take place in boot mode or PROM mode.)
(1) MAT switching by the FMATS register should always be executed from the on-chip RAM.
(2) To ensure that the MAT that has been switched to is accessible, execute 4 NOP instructions in
the on-chip RAM immediately before or after writing to the FMATS register of the on-chip
RAM (this prevents access to the flash memory during MAT switching).
(3) If an interrupt has occurred during switching, there is no guarantee of which memory MAT is
being accessed. Always mask the maskable interrupts before switching between MATs. In
addition, configure the system so that NMI interrupts do not occur during MAT switching.
(4) After the MATs have been switched, take care because the interrupt vector table will also have
been switched. If interrupt processing is to be the same before and after MAT switching,
transfer the interrupt-processing routines to the on-chip RAM, and use the settings of the
FVACR and FVADR registers to place the interrupt-vector table in the on-chip RAM .
(5) Memory sizes of the user MAT and user boot MAT are different. When accessing the user
boot MAT, do not access addresses above the top of its 10-kbyte memory space. If access goes
beyond the 10-kbyte space, the values read are undefined.
<User MAT>
<On-chip RAM>
<User boot MAT>
Procedure for
switching to the
user boot MAT
Procedure for
switching to
the user MAT
Procedure for switching to the user boot MAT
(1) Mask interrupts
(2) Write H'AA to the FMATS register.
(3) Execute 4 NOP instructions before
accessing the user boot MAT.
Procedure for switching to the user MAT
(1) Mask interrupts
(2) Write a value other than H'AA to the FMATS register.
(3) Execute 4 NOP instructions before or after accessing
the user MAT.
Figure 18.20 Switching between the User MAT and User Boot MAT
Rev. 2.0, 06/04, page 637 of 980
18.8.1
Usage Notes
1. Download time of on-chip program
The programming program that includes the initialization routine and the erasing program that
includes the initialization routine are each 2 kbytes or less. Accordingly, when the CPU clock
frequency is 25 MHz, the download for each program takes approximately 164µs at
maximum.
2. Write to flash-memory related registers by DMAC
While an instruction in on-chip RAM is being executed, the DMAC can write to the SCO bit
in FCCS that is used for a download request or FMATS that is used for MAT switching. Make
sure that these registers are not accidentally written to, otherwise an on-chip program may be
downloaded and damage RAM or a MAT switchover may occur and the CPU get out of
control. Do not use DMAC to program FLASH related registers.
3. Compatibility with programming/erasing program of conventional F-ZTAT H8
microcomputer
A programming/erasing program for flash memory used in the conventional F-ZTAT H8
microcomputer which does not support download of the on-chip program by a SCO transfer
request cannot run in this LSI.
Be sure to download the on-chip program to execute programming/erasing of flash memory in
this LSI.
4. Monitoring runaway by WDT
Unlike the conventional F-ZTAT H8 microcomputer, no countermeasures are available for a
runaway by WDT during programming/erasing by the downloaded on-chip program.
Prepare countermeasures (e.g. use of the user branch routine and periodic timer interrupts) for
WDT while taking the programming/erasing time into consideration as required.
Rev. 2.0, 06/04, page 638 of 980
18.9
PROM Mode
Along with its on-board programming mode, this LSI also has a PROM mode as a further mode
for the writing and erasing of programs and data. In the PROM mode, a general-purpose PROM
programmer can freely be used to write programs to the on-chip ROM. Program/erase is possible
on the user MAT and user boot MAT. The PROM programmer must support Renesas
microcomputers with 512-kbyte flash memory units as a device type.
A status-polling system is adopted for operation in automatic program, automatic erase, and
status-read modes. In the status-read mode, details of the system's internal signals are output after
execution of automatic programming or automatic erasure. In the PROM mode, provide a 12MHz input-clock signal.
Table 18.11 PROM Mode Pin
Pins
Setting
Mode pin: P82, P81, P80
1, 0, 0
18.9.1
Pin Arrangement of the Socket Adapter
Attach the socket adapter to the LSI in the way shown in figure 18.22. This allows conversion to
40 pins. Figure 18.21 shows the memory mapping of the on-chip ROM, and figure 18.22 shows
the arrangement of the socket adapter's pins.
Address in
MCU mode
H'000000
Address in
PROM mode
Address in
MCU mode
H'00000
H'000000
Address in
PROM mode
H'00000
On-chip ROM space
(user boot MAT) 10kB
H'0027FF
H'027FF
On-chip ROM space
(user MAT)
512kB
H'07FFFF
H'7FFFF
Figure 18.21 Mapping of On-Chip Flash Memory
Rev. 2.0, 06/04, page 639 of 980
H8/3029
Pin No.
Pin Name
36
37
Socket Adapter
(40-Pin Conversion)
HN27C4096HG (40 pins)
Pin No.
Pin Name
A0
21
A0
A1
22
A1
38
A2
23
A2
39
A3
24
A3
40
A4
25
A4
41
A5
26
A5
42
A6
27
A6
43
A7
28
A7
45
A8
29
A8
64
A9
31
A9
47
A10
32
A10
48
A11
33
A11
49
A12
34
A12
50
A13
35
A13
51
A14
36
A14
58
A15
37
A15
69
A16
38
A16
70
A17
39
A17
55
A18
10
A18
27
D0
19
I/O0
28
D1
18
I/O1
29
D2
17
I/O2
30
D3
16
I/O3
31
D4
15
I/O4
32
D5
14
I/O5
33
D6
13
I/O6
34
D7
12
I/O7
52
CE
2
CE
46
OE
20
OE
90
WE
3
WE
10
FWE
4
FWE
76,77,62,71,89,35,68
VCC
1,40
VCC
73,74,75,87,88,86,11,22,44,57,65,92,14
VSS
11,30
VSS
63
RES
67
XTAL
66
EXTAL
1
VCL
Other
N.C.(OPEN)
Power-on
reset circuit
Oscillator
circuit
Capacitor
5,6,7
NC
8
A20
9
A19
Legend
FWE
I/O7 to 0
A18 to 0
CE
OE
WE
: Flash-write enable
: Data I/O
: Address input
: Chip enable
: Output enable
: Write enable
Figure 18.22 Pin Arrangement of the Socket Adapter
Rev. 2.0, 06/04, page 640 of 980
18.9.2
PROM Mode Operation
Table 18.12 shows the settings for the operating modes of PROM mode, and table 18.13 lists the
commands used in PROM mode. The following sections provide detailed information on each
mode.
• Memory-read mode: This mode supports reading, in units of bytes, from the user MAT or user
boot MAT.
• Auto-program mode: This mode supports the simultaneous programming of the user MAT and
user boot MAT in 128-byte units. Status polling is used to confirm the end of automatic
programming.
• Auto-erase mode: This mode only supports the automatic erasing of the entire user MAT or
user boot MAT. Status polling is used to confirm the end of automatic erasing.
• Status-read mode: Status polling is used with automatic programming and automatic erasure.
Normal completion can be detected by reading the signal on the I/O6 pin. In status-read mode,
error information is output when an error has occurred.
Table 18.12 Settings for Each Operating Mode of PROM Mode
Pin Name
Mode
FWE
CE
OE
WE
I/O7 to 0
A18 to 0
Read
H or L
L
L
H
Data output
Ain
Output disable
H or L
L
H
H
Hi-Z
X
Command write
H or L
L
H
L
Data input
*Ain
Chip disable
H or L
H
X
X
Hi-Z
X
Notes: 1. The chip-disable mode is not a standby state; internally, it is an operational state.
2. To write commands when making a transition to the auto-program or auto-erase mode,
input a high-level signal on the FWE pin.
* Ain indicates that there is also an address input in auto-program mode.
Rev. 2.0, 06/04, page 641 of 980
Table 18.13 Commands in PROM Mode
Command
Memory-read
mode
Auto-program
mode
Auto-erase
mode
Status-read
mode
Number
Memory
MAT to
of
Cycles
be
Accessed
Mode
Address
Data
Mode
Address
Data
1+n
User MAT
write
X
H'00
read
RA
Dout
User boot
MAT
write
X
H'05
User MAT
write
X
H'40
write
WA
Din
User boot
MAT
write
X
H'45
User MAT
write
X
H'20
write
X
H'20
User boot
MAT
write
X
H'25
Common
to both
MATs
write
X
H'71
129
2
2
st
nd
1 Cycle
2 Cycle
H'25
write
X
H'71
Notes: 1. In auto-program mode, 129 cycles are required in command writing because of the
simultaneous 128-byte write.
2. In memory read mode, the number of cycles varies with the number of address writing
cycles (n).
18.9.3
Memory-Read Mode
(1) On completion of an automatic program, automatic erase, or status read, the LSI enters a
command waiting state. So, to read the contents of memory after these operations, issue the
command to change the mode to the memory-read mode before reading from the memory.
(2) In memory-read mode, the writing of commands is possible in the same way as in the
command-write state.
(3) After entering memory-read mode, continuous reading is possible.
(4) After power has first been supplied, the LSI enters the memory-read mode. For the AC
characteristics in memory read mode, see section 18.10.2, AC Characteristics and Timing in
Writer Mode.
Rev. 2.0, 06/04, page 642 of 980
18.9.4
Auto-Program Mode
(1) In auto-program mode, programming is in 128-byte units. That is, 128 bytes of data are
transferred in succession.
(2) Even in the programming of less than 128 bytes, 128 bytes of data must be transferred. H'FF
should be written to those addresses that are unnecessarily written to.
(3) Set the low seven bits of the address to be transferred to low level. Inputting an invalid address
will result in a programming error, although processing will proceed to the memoryprogramming operation.
nd
rd
(4) The memory address is transferred in the 2 cycle. Do not transfer addresses in the 3 or later
cycles.
(5) Do not issue commands while programming is in progress.
(6) When programming, execute automatic programming once for each 128-byte block of
addresses. Programming the block at an address where programming has already been
performed is not possible.
(7) To confirm the end of automatic programming, check the signal on the I/O6 pin. Confirmation
in the status-read mode is also possible (status polling of the I/O7 pin is used to check the end
status of automatic programming).
(8) Status-polling information on the I/O6 and I/O7 pins is retained until the next command is
written. As long as no command is written, the information is made readable by setting CE and
OE for enabling.
For the AC characteristics in auto-program mode, see section 18.10.2, AC Characteristics and
Timing in Writer Mode.
18.9.5
Auto-Erase Mode
(1) Auto-erase mode only supports erasing of the entire memory.
(2) Do not perform command writing during auto erasing is in progress.
(3) To confirm the end of automatic erasing, check the signal on the I/O6 pin. Confirmation in the
status-read mode is also possible (status polling of the I/O7 pin is used to check the end status
of automatic erasure).
(4) Status polling information on the I/O6 and I/O7 pins is retained until the next command
writing. As long as no command is written, the information is made readable by setting CE
and OE for enabling.
For the AC characteristics in auto-erase mode, see section 18.10.2, AC Characteristics and Timing
in Writer Mode.
Rev. 2.0, 06/04, page 643 of 980
18.9.6
Status-Read Mode
(1) Status-read mode is used to determine the type of an abnormal termination. Use this mode
when automatic programming or automatic erasure ends abnormally.
(2) The return code is retained until writing of a command that selects a mode other than statusread mode.
Table 18.14 lists the return codes of status-read mode.
For the AC characteristics in status-read mode, see section 18.10.2, AC Characteristics and
Timing in Writer Mode.
Table 18.14 Return Codes of Status-Read Mode
Pin Name I/O7
Attribute
I/O6
Normal end Command
indicator
error
I/O5
I/O4
I/O3
Programming error
Erase error —
0
0
Initial value 0
0
Indication
—
Erase
Command Programming error: 1 error:1
error: 1
Otherwise: 0 Otherwise: 0 Otherwise: 0
Normal
end: 0
Abnormal
end: 1
0
I/O2
I/O1
I/O0
—
Programming Invalid
address
or erase
error
count
exceeded
0
0
—
Invalid
Count
exceeded: 1 address
Otherwise: 0 error: 1
Otherwise: 0
0
Note: I/O2 and I/O3 are undefined pins.
18.9.7
Status Polling
(1) The I/O7 status-polling output is a flag that indicates the operating status in auto-program or
auto-erase mode.
(2) The I/O6 status-polling output is a flag that indicates normal/abnormal end of auto-program or
auto-erase mode.
Table 18.15 Truth Table of Status-Polling Output
Pin Name
In Progress
Abnormal End
—
Normal End
I/O7
0
1
0
1
I/O6
0
0
1
1
I/O0 to 5
0
0
0
0
Rev. 2.0, 06/04, page 644 of 980
18.9.8
Time Taken in Transition to PROM Mode
Until oscillation has stabilized and while PROM mode is being set up, the LSI is unable to accept
commands. After the PROM-mode setup time has elapsed, the LSI enters memory-read mode. See
section 18.10.2, AC Characteristics and Timing in Writer Mode.
18.9.9
Notes on Using PROM Mode
(1) When programming addresses which have previously been programmed, apply auto-erasing
before auto-programming (figure 18.24).
(2) When using PROM mode to program a chip that has been programmed/erased in an on-board
programming mode, auto-erasing before auto-programming is recommended.
(3) Do not take the chip out of the PROM programmer or reset the chip during programming or
erasure. Flash memory is susceptible to permanent damage since a high voltage is being
applied during the programming/erasing. When the reset signal is accidentally input to the
chip, the period in the reset state until the reset signal is released should be longer than the
normal 100 µs.
(4) The flash memory is initially in the erased state when the device is shipped by Renesas
Technology. For other chips for which the history of erasure is unknown, auto-erasing as a
check and supplement for the initialization (erase) level is recommended.
(5) This LSI does not support modes such as the product identification mode of general purpose
EPROM. Therefore, the device name is not automatically set in the PROM programmer.
(6) For further information on the PROM programmer and its software version, please refer to the
instruction manual for the socket adapter.
Rev. 2.0, 06/04, page 645 of 980
18.10
Further Information
18.10.1 Serial Communication Interface Specification for Boot Mode
Initiating boot mode enables the boot program to communicate with the host by using the internal
SCI. The serial communication interface specification is shown below.
• Status
The boot program has three states.
(1) Bit-Rate-Adjustment State
In this state, the boot program adjusts the bit rate to communicate with the host. Initiating
boot mode enables starting of the boot program and entry to the bit-rate-adjustment state. The
program receives the command from the host to adjust the bit rate. After adjusting the bit rate,
the program enters the inquiry/selection state.
(2) Inquiry/Selection State
In this state, the boot program responds to inquiry commands from the host. The device name,
clock mode, and bit rate are selected. After selection of these settings, the program is made to
enter the programming/erasing state by the command for a transition to the
programming/erasing state. The program transfers the libraries required for erasure to the
RAM and erases the user MATs and user boot MATs before the transition.
(3) Programming/erasing state
Programming and erasure by the boot program take place in this state. The boot program is
made to transfer the programming/erasing programs to the RAM by commands from the host.
Sum checks and blank checks are executed by sending these commands from the host.
These boot program states are shown in figure 18.23.
Rev. 2.0, 06/04, page 646 of 980
Reset
Bit-Rate-Adjustment
State
Inquiry/Selection
wait
Transition to
Programming/erasing
Inquiry
Selection
Operations for
Inquiry
Operations for
Selection
Operations for Erasing
User MATs and User
Boot MATs
Programming/erasing
selection wait
Programming
Operations for
Programming
Erasing
Checking
Operations for
Erasing
Operations for
Checking
Figure 18.23 Boot Program States
• Bit-Rate-Adjustment state
The bit rate is calculated by measuring the period of transfer of a low-level byte (H'00) from the
host. The bit rate can be changed by the command for a new bit rate selection. After the bit rate
has been adjusted, the boot program enters the inquiry and selection state. The bit-rate-adjustment
sequence is shown in figure 18.24.
Rev. 2.0, 06/04, page 647 of 980
Host
Boot Program
H'00 (30 times maximum)
Measuring the
1-Bit Length
H'00 (Completion of Adjustment)
H'55
H'E6 (Response to Boot)
H'FF (Error)
Figure 18.24 Bit-Rate-Adjustment Sequence
• Communications Protocol
After adjustment of the bit rate, the protocol for communications between the host and the boot
program is as shown below.
(1) One-byte commands and one-byte responses
These commands and responses are comprised of a single byte. These are consists of the
inquiries and the ACK for successful completion.
(2) n-byte commands or n-byte responses
These commands and responses are comprised of n bytes of data. These are selections and
responses to inquiries.
The amount of programming data is not included under this heading because it is determined
in another command.
(3) Error response
The error response is a response to inquiries. It consists of an error response and an error code
and comes two bytes.
(4) Programming of 128 bytes
The size is not specified in commands. The size of n is indicated in response to the
programming unit inquiry.
(5) Memory read response
This response consists of four bytes of data.
Rev. 2.0, 06/04, page 648 of 980
One-Byte Command
or One-Byte Response
Command or Response
n-Byte Command or
n-Byte Response
Data
Size
Checksum
Command or Response
Error Response
Error Code
Error Response
128-Byte Programming
Address
Data (n bytes)
Checksum
Command
Memory Read
Response
Size
Data
Response
Checksum
Figure 18.25 Communication Protocol Format
 Command (1 byte) : Commands including inquiries, selection, programming, erasing, and
checking
 Response (1 byte) : Response to an inquiry
 Size (1 byte) : The amount of data for transmission excluding the command, amount of
data, and checksum
 Checksum (1 byte) : The checksum is calculated so that the total of all values from the
command byte to the SUM byte becomes H'00.
 Data (n bytes) : Detailed data of a command or response
 Error Response (1 byte) : Error response to a command
 Error Code (1 byte) : Type of the error
 Address (4 bytes) : Address for programming
 Data (n bytes) : Data to be programmed (the size is indicated in the response to the
programming unit inquiry.)
 Size (4 bytes) : Four-byte response to a memory read
Rev. 2.0, 06/04, page 649 of 980
• Inquiry and Selection States
The boot program returns information from the flash memory in response to the host's inquiry
commands and sets the device code, clock mode, and bit rate in response to the host's selection
command.
Inquiry and selection commands are listed below.
Table 18.16 Inquiry and Selection Commands
Command
Command Name
Description
H'20
Supported Device Inquiry
Inquiry regarding device codes and
product names of F-ZTAT
H'10
Device Selection
Selection of device code
H'21
Clock Mode Inquiry
Inquiry regarding numbers of clock
modes and values of each mode
H'11
Clock Mode Selection
Indication of the selected clock mode
H'22
Multiplication Ratio Inquiry
Inquiry regarding the number of
frequency-multiplied clock types, the
number of multiplication ratios, and the
values of each multiple
H'23
Operating Clock Frequency Inquiry
Inquiry regarding the maximum and
minimum values of the main clock and
peripheral clocks
H'24
User Boot MAT Information Inquiry
Inquiry regarding the number of user
boot MATs and the start and last
addresses of each MAT
H'25
User MAT Information Inquiry
Inquiry regarding the a number of user
MATs and the start and last addresses
of each MAT
H'26
Block for Erasing Information Inquiry
Inquiry regarding the number of blocks
and the start and last addresses of each
block
H'27
Programming Unit Inquiry
Inquiry regarding the unit of
programming data
H'3F
New Bit Rate Selection
Selection of new bit rate
H'40
Transition to Programming/erasing
State
Erasing of user MAT and user boot
MAT, and entry to programming/erasing
state
H'4F
Boot Program Status Inquiry
Inquiry into the operated status of the
boot program
The selection commands, which are device selection (H'10), clock mode selection (H'11), and new
bit rate selection (H'3F), should be sent from the host in that order. These commands will
Rev. 2.0, 06/04, page 650 of 980
certainly be needed. When two or more selection commands are sent at once, the last command
will be valid.
All of these commands, except for the boot program status inquiry command (H'4F), will be valid
until the boot program receives the programming/erasing transition (H'40). The host can choose
the needed commands out of the commands and inquiries listed above. The boot program status
inquiry command (H'4F) is valid after the boot program has received the programming/erasing
transition command (H'40).
(1) Supported device inquiry
The boot program will return the device codes of supported devices and the product code of the
F-ZTAT in response to the supported device inquiry.
Command H'20
 Command, H'20, (1 byte) : Inquiry regarding supported devices
Response
H'30
Size
A number of
devices
A number of
characters
Device code
Product name
···
SUM
 Response, H'30, (1 byte) : Response to the supported device inquiry
 Size (1 byte) : Number of bytes to be transmitted, excluding the command, amount of data,
and checksum, that is, the amount of data contributes by the product names, the number of
devices, characters, and device codes
 A number of devices (1 byte) : The number of device types supported by the boot program
 A number of characters (1 byte) : The number of characters in the device codes and boot
program’s name
 Device code (4 bytes) : Code of the supporting product
 Product name (n bytes) : Type name of the boot program in ASCII-coded characters
 SUM (1 byte) : Checksum
The checksum is calculated so that the total number of all values from the command byte
to the SUM byte becomes H'00.
(2) Device Selection
The boot program will set the supported device to the specified device code. The program will
return the selected device code in response to the inquiry after this setting has been made.
Command H'10
Size
Device code
SUM
 Command, H'10, (1 byte) : Device selection
Rev. 2.0, 06/04, page 651 of 980
 Size (1 byte) : Amount of device-code data
This is fixed to 4
 Device code (4 bytes) : Device code returned in response to the supported device inquiry
(ASCII-code)
 SUM (1 byte) : Checksum
Response
H'06
 Response, H'06, (1 byte) : Response to the device selection command
ACK will be returned when the device code matches.
Error
response
H'90
ERROR
 Error response, H'90, (1 byte) : Error response to the device selection command
 Error : (1 byte) : Error code
H'11 : Sum check error
H'21 : Device code error, that is, the device code does not match
(3) Clock Mode Inquiry
The boot program will return the supported clock modes in response to the clock mode inquiry.
Command H'21
 Command, H'21, (1 byte) : Inquiry regarding clock mode
Response
H'31
Size
A number of Mode
modes
SUM
 Response, H'31, (1 byte) : Response to the clock-mode inquiry
 Size (1 byte) : Amount of data that represents the number of modes and modes
 A number of clock modes (1 byte) : The number of supported clock modes
H'00 indicates no clock mode or the device allows to read the clock mode.
 Mode (1 byte) : Values of the supported clock modes (i.e. H'01 means clock mode 1.)
 SUM (1 byte) : Checksum
(4) Clock Mode Selection
The boot program will set the specified clock mode. The program will return the selected clockmode information after this setting has been made.
The clock-mode selection command should be sent after the device-selection commands.
Command H'11
Size
Mode
SUM
 Command, H'11, (1 byte) : Selection of clock mode
 Size (1 byte) : Amount of data that represents the modes
Rev. 2.0, 06/04, page 652 of 980
 Mode (1 byte) : A clock mode returned in reply to the supported clock mode inquiry.
 SUM (1 byte) : Checksum
Response
H'06
 Response, H'06, (1 byte) : Response to the clock mode selection command
ACK will be returned when the clock mode matches.
Error
response
H'91
ERROR
 Error response, H'91, (1 byte) : Error response to the clock mode selection command
 ERROR, (1 byte) : Error code
H'11 : Checksum error
H'22 : Clock mode error, that is, the clock mode does not match.
Even when the clock mode value is H'00 or H'01 for clock mode inquiry, clock mode selection is
performed for each value.
(5) Multiplication Ratio-Inquiry
The boot program will return the supported multiplication and division ratios.
Command H'22
 Command, H'22, (1 byte) : Inquiry regarding multiplication ratio
Response
H'32
Size
The
Number
of Clock
The number
Multiplication
ratio
···
of
multiplication
ratios
···
SUM
 Response, H'32, (1 byte) : Response to the multiplication ratio inquiry
 Size (1 byte) : The amount of data that represents the clock sources, the number of
multiplication ratios, and the multiplication ratios
 A number of types (1 byte) : The number of supported multiplied clock types
(e.g. when there are two multiplied clock types, which are the main and peripheral clocks,
the number of types will be H'02.)
Rev. 2.0, 06/04, page 653 of 980
 A number of multiplication ratios (1 byte) : The number of multiplication ratios for each
type
(e.g. the number of multiplication ratios to which the main clock can be set and the
peripheral clock can be set.)
 Multiplication ratio (1 byte)
 Multiplication ratio : The value of the multiplication ratio (e.g. when the clockfrequency multiplier is four, the value of multiplication ratio will be H'04.)
 Division ratio : The inverse of the division ratio, i.e. a negative number (e.g. when the
clock is divided by two, the value of division ratio will be H'FE. H'FE = D'-2) The
number of multiplication ratios returned is the same as the number of multiplication
ratios and as many groups of data are returned as there are types.
 SUM (1 byte) : Checksum
(6) Operating Clock Frequency Inquiry
The boot program will return the number of operating clock frequencies, and the maximum and
minimum values.
Command H'23
 Command, H'23, (1 byte) : Inquiry regarding operating clock frequencies
Response
H'33
Size
The minimum value of operating clock
frequency
A number of
operating clock
frequencies
The maximum value of operating clock
frequency
···
SUM
 Response, H'33, (1 byte) : Response to operating clock frequency inquiry
 Size (1 byte) : The number of bytes that represents the minimum values, maximum values,
and the number of types.
 A number of types (1 byte) : The number of supported operating clock frequency types
(e.g. when there are two operating clock frequency types, which are the main and
peripheral clocks, the number of types will be H'02.)
 Minimum value of operating clock frequency (2 bytes) : The minimum value of the
multiplied or divided clock frequency.
The minimum and maximum values represent the values in MHz, valid to the hundredths
place of MHz, and multiplied by 100. (e.g. when the value is 20.00 MHz, it will be D'2000
and H'07D0.)
 Maximum value (2 bytes) : Maximum value among the multiplied or divided clock
frequencies.
Rev. 2.0, 06/04, page 654 of 980
There are as many pairs of minimum and maximum values as there are operating clock
frequencies.
 SUM (1 byte) : Checksum
(7) User Boot MAT Information Inquiry
The boot program will return the number of user boot MATs and their addresses.
Command H'24
 Command, H'24, (1 byte) : Inquiry regarding user boot MAT information
Response
H'34
Size
A Number
of Areas
Area-Start Address
Area-Last Address
···
SUM
 Response, H'34, (1 byte) : Response to user boot MAT information inquiry
 Size (1 byte) : The number of bytes that represents the number of areas, area-start
addresses, and area-last address
 A Number of Areas (1 byte) : The number of non-consecutive user boot MAT areas
When user boot MAT areas are consecutive, the number of areas returned is H'01.
 Area-Start Address (4 bytes) : Start address of the area
 Area-Last Address (4 bytes) : Last address of the area
There are as many groups of data representing the start and last addresses as there are
areas.
 SUM (1 byte) : Checksum
(8) User MAT Information Inquiry
The boot program will return the number of user MATs and their addresses.
Command H'25
 Command, H'25, (1 byte) : Inquiry regarding user MAT information
Rev. 2.0, 06/04, page 655 of 980
Response
H'35
Size
A Number
of Areas
Area-Start Address
Area-Last Address
···
SUM
 Response, H'35, (1 byte) : Response to the user MAT information inquiry
 Size (1 byte) : The number of bytes that represents the number of areas, area-start address
and area-last address
 A Number of Areas (1 byte) : The number of non-consecutive user MAT areas
When the user MAT areas are consecutive, the number of areas is H'01.
 Area-Start Address (4 bytes) : Start address of the area
 Area-Last Address (4 bytes) : Last address of the area
There are as many groups of data representing the start and last addresses as there are
areas.
 SUM (1 byte) : Checksum
(9) Erased Block Information Inquiry
The boot program will return the number of erased blocks and their addresses.
Command H'26
 Command, H'26, (1 byte) : Inquiry regarding erased block information
Response
H'36
Size
Block Start Address
A number
of blocks
Block Last Address
···
SUM
 Response, H'36, (1 byte) : Response to the number of erased blocks and addresses
 Size (1 byte) : The number of bytes that represents the number of blocks, block-start
addresses, and block-last addresses.
 A number of blocks (1 byte) : Number of erased blocks in flash memory
 Block Start Address (4 bytes) : Start address of a block
 Block Last Address (4 bytes) : Last address of a block
There are as many groups of data representing the start and last addresses as there are blocks.
Rev. 2.0, 06/04, page 656 of 980
 SUM : Checksum
(10) Programming Unit Inquiry
The boot program will return the programming unit used to program data.
Command H'27
 Command, H'27, (1 byte) : Inquiry regarding programming unit
Response
H'37
Size
Programming unit
SUM
 Response, H'37, (1 byte) : Response to programming unit inquiry
 Size (1 byte) : The number of bytes that indicate the programming unit, which is fixed to 2
 Programming unit (2 bytes) : A unit for programming
This is the unit for reception of programming.
 SUM (1 byte) : Checksum
(11) New Bit-Rate Selection
The boot program will set a new bit rate and return the new bit rate.
This selection should be sent after sending the clock mode selection command.
Command H'3F
Size
Bit rate
Input frequency
Number of
Multiplication Multiplication
multiplication ratio 1
ratio 2
ratios
SUM
 Command, H'3F, (1 byte) : Selection of new bit rate
 Size (1 byte) : The number of bytes that represents the bit rate, input frequency, number of
multiplication ratios, and multiplication ratio
 Bit rate (2 bytes) : New bit rate
One hundredth of the value (e.g. when the value is 19200 bps, the bit rate is H'00C0, which
is D'192.)
 Input frequency (2 bytes) : Frequency of the clock input to the boot program
This is valid to the hundredths place and represents the value in MHz multiplied by 100.
(e.g. when the value is 20.00 MHz, the input frequency is H'07D0 (= D'2000).)
 Number of multiplication ratios (1 byte) : The number of multiplication ratios to which the
device can be set. Normally the value is two: main operating frequency and peripheral
module operating frequency. (Should be set to H'01 for this LSI.)
 Multiplication ratio 1 (1 byte) : The value of multiplication or division ratios for the main
operating frequency
Rev. 2.0, 06/04, page 657 of 980
 Multiplication ratio (1 byte) : The value of the multiplication ratio (e.g. when the clock
frequency is multiplied by four, the multiplication ratio will be H'04. With this LSI it
should be set to H'01.)
 Division ratio : The inverse of the division ratio, as a negative number (e.g. when the
clock frequency is divided by two, the value of division ratio will be H'FE. H'FE = D'2. With this LSI it should be set to H'01.)
 Multiplication ratio 2 (1 byte) : The value of multiplication or division ratios for the
peripheral frequency
 Multiplication ratio (1 byte) : The value of the multiplication ratio (e.g. when the clock
frequency is multiplied by four, the multiplication ratio will be H'04. Cannot be set for
this LSI.)
 Division ratio : The inverse of the division ratio, as a negative number (e.g. when the
clock is divided by two, the value of division ratio will be H'FE. H'FE = D'-2. With this
LSI it should be set to H'01.)
 SUM (1 byte) : Checksum
Response
H'06
 Response, H'06, (1 byte) : Response to selection of a new bit rate
When it is possible to set the bit rate, the response will be ACK.
Error
response
H'BF
ERROR
 Error response, H'BF, (1 byte) : Error response to selection of new bit rate
 ERROR : (1 byte) : Error code
H'11
: Sum checking error
H'24
: Bit-rate selection error
The rate is not available.
H'25
: Error in input frequency
This input frequency is not within the specified range.
H'26
: Multiplication-ratio error*
The ratio does not match an available ratio.
H'27
: Operating frequency error*
The frequency is not within the specified range.
Note: * This error does not occur with this LSI.
Rev. 2.0, 06/04, page 658 of 980
• Received data check
The methods for checking of received data are listed below.
(1) Input frequency
The received value of the input frequency is checked to ensure that it is within the range of
minimum to maximum frequencies which matches the clock modes of the specified device.
When the value is out of this range, an input-frequency error is generated.
(2) Multiplication ratio
The received value of the multiplication ratio or division ratio is checked to ensure that it
matches the clock modes of the specified device. When the value is out of this range, an
input-frequency error is generated.
(3) Operating frequency error
Operating frequency is calculated from the received value of the input frequency and the
multiplication or division ratio. The input frequency is input to the LSI and the LSI is
operated at the operating frequency. The expression is given below.
Operating frequency = Input frequency × Multiplication ratio , or
Operating frequency = Input frequency ÷ Division ratio
The calculated operating frequency should be checked to ensure that it is within the range of
minimum to maximum frequencies which are available with the clock modes of the specified
device. When it is out of this range, an operating frequency error is generated.
(4) Bit rate
Peripheral operating clock (φ), bit rate (B), clock select (CKS) in the serial mode register
(SMR).
The error as calculated by the method below is checked to ensure that it is less than 4%. When
it is 4% or more, a bit-rate selection error is generated.
Error (%) = {[
φ × 106
] –1} ×100
(N+1) × B × 64 × 2(2×n-1)
When the new bit rate is selectable, the rate will be set in the register after sending ACK in
response. The host will send an ACK with the new bit rate for confirmation and the boot program
will response with that rate.
Confirmation H'06
 Confirmation, H'06, (1 byte) : Confirmation of a new bit rate
Response
H'06
 Response, H'06, (1 byte) : Response to confirmation of a new bit rate
The sequence of new bit-rate selection is shown in figure 18.26.
Rev. 2.0, 06/04, page 659 of 980
Boot program
Host
Setting a new bit rate
Waiting for one-bit period
at the specified bit rate
H'06 (ACK)
Setting a new bit rate
Setting a new bit rate
H'06 (ACK) with the new bit rate
H'06 (ACK) with the new bit rate
Figure 18.26 New Bit-Rate Selection Sequence
• Transition to Programming/Erasing State
The boot program will transfer the erasing program, and erase the user MATs and user boot
MATs in that order. On completion of this erasure, ACK will be returned and will enter the
programming/erasing state.
The host should select the device code, clock mode, and new bit rate with device selection, clockmode selection, and new bit-rate selection commands, and then send the command for the
transition to programming/erasing state. These procedure should be carried out before sending of
the programming selection command or program data.
Command H'40
 Command, H'40, (1 byte) : Transition to programming/erasing state
Response
H'06
 Response, H'06, (1 byte) : Response to transition to programming/erasing state
The boot program will send ACK when the user MAT and user boot MAT have been
erased by the transferred erasing program.
Error
response
H'C0
H'51
 Error response, H'C0, (1 byte) : Error response for user boot MAT blank check
 Error code, H'51, (1 byte) : Erasing error
An error occurred and erasure was not completed.
Rev. 2.0, 06/04, page 660 of 980
• Command Error
A command error will occur when a command is undefined, the order of commands is incorrect,
or a command is unacceptable. Issuing a clock-mode selection command before a device
selection or an inquiry command after the transition to programming/erasing state command, are
examples.
Error
response
H'80
H'xx
 Error response, H'80, (1 byte) : Command error
 Command, H'xx, (1 byte) : Received command
• Command Order
The order for commands in the inquiry selection state is shown below.
(1) A supported device inquiry (H'20) should be made to inquire about the supported devices.
(2) The device should be selected from among those described by the returned information and set
with a device-selection (H'10) command.
(3) A clock-mode inquiry (H'21) should be made to inquire about the supported clock modes.
(4) The clock mode should be selected from among those described by the returned information
and set.
(5) After selection of the device and clock mode, inquiries for other required information should
be made, such as the multiplication-ratio inquiry (H'22) or operating frequency inquiry (H'23).
(6) A new bit rate should be selected with the new bit-rate selection (H'3F) command, according
to the returned information on multiplication ratios and operating frequencies.
(7) After selection of the device and clock mode, the information of the user boot MAT and user
MAT should be made to inquire about the user boot MATs information inquiry (H'24), user
MATs information inquiry (H'25), erased block information inquiry (H'26), programming unit
inquiry (H'27).
(8) After making inquiries and selecting a new bit rate, issue the transition to
programming/erasing state (H'40) command. The boot program will then enter the
programming/erasing state.
• Programming/erasing State
A programming selection command makes the boot program select the programming method, an
128-byte programming command makes it program the memory with data, and an erasing
selection command and block erasing command make it erase the block. The
programming/erasing commands are listed below.
Rev. 2.0, 06/04, page 661 of 980
Table 18.17 Programming/erasing Command
Command
Command Name
Description
H'42
User boot MAT programming selection
Transfers the user boot MAT
programming program
H'43
User MAT programming selection
Transfers the user MAT programming
program
H'50
128-byte programming
Programs 128 bytes of data
H'48
Erasing selection
Transfers the erasing program
H'58
Block erasing
Erases a block of data
H'52
Memory read
Reads the contents of memory
H'4A
User boot MAT sum check
Checks the checksum of the user boot
MAT
H'4B
User MAT sum check
Checks the checksum of the user MAT
H'4C
User boot MAT blank check
Checks whether the contents of the user
boot MAT are blank
H'4D
User MAT blank check
Checks whether the contents of the user
MAT are blank
H'4F
Boot program status inquiry
Inquires into the boot program's status
• Programming
Programming is executed by a programming-selection command and an 128-byte programming
command.
Firstly, the host should send the programming-selection command and select the programming
method and programming MATs. There are two programming selection commands, and selection
is according to the area and method for programming.
(1) User boot MAT programming selection
(2) User MAT programming selection
After issuing the programming selection command, the host should send the 128-byte
programming command. The 128-byte programming command that follows the selection
command represents the data programmed according to the method specified by the selection
command. When more than 128-byte data is programmed, 128-byte commands should repeatedly
be executed. Sending an 128-byte programming command with H'FFFFFFFF as the address will
stop the programming. On completion of programming, the boot program will wait for selection
of programming or erasing.
Where the sequence of programming operations that is executed includes programming with
another method or of another MAT, the procedure must be repeated from the programming
selection command.
Rev. 2.0, 06/04, page 662 of 980
The sequence for programming-selection and 128-byte programming commands is shown in
figure 18.27.
Host
Boot program
Programming selection (H'42, H'43)
Transfer of the
programming
program
ACK
128-byte programming (address, data)
Repeat
Programming
ACK
128-byte programming (H'FFFFFFFF)
ACK
Figure 18.27 Programming Sequence
(1) User boot MAT programming selection
The boot program will transfer a programming program. The data is programmed to the user boot
MATs by the transferred programming program.
Command H'42
 Command, H'42, (1 byte) : User boot-program programming selection
Response
H'06
 Response, H'06, (1 byte) : Response to user boot-program programming selection
When the programming program has been transferred, the boot program will return ACK.
Error
response
H'C2
ERROR
 Error response : H'C2 (1 byte): Error response to user boot MAT programming selection
 ERROR : (1 byte): Error code
H'54 : Selection processing error (transfer error occurs and processing is not completed)
(2) User MAT programming selection.
The boot program will transfer a programming program. The data is programmed to the user
MATs by the transferred programming program.
Rev. 2.0, 06/04, page 663 of 980
Command H'43
 Command, H'43, (1 byte) : User-program programming selection
Response
H'06
 Response, H'06, (1 byte) : Response to user-program programming selection
When the programming program has been transferred, the boot program will return ACK.
Error
response
H'C3
ERROR
 Error response: H'C3 (1 byte): Error response to user MAT programming selection
 ERROR: (1 byte): Error code
H'54: Selection processing error (transfer error occurs and processing is not completed)
(3) 128-byte programming
The boot program will use the programming program transferred by the programming selection to
program the user boot MATs or user MATs.
Command H'50
Data
Address
···
···
SUM
 Command, H'50, (1 byte) : 128-byte programming
 Programming Address (4 bytes) : Start address for programming
Multiple of the size specified in response to the programming unit inquiry
(i.e. H'00, H'01, H'00, H'00 : H'00010000)
 Programming Data (128 bytes) : Data to be programmed
The size is specified in the response to the programming unit inquiry.
 SUM (1 byte) : Checksum
Response
H'06
 Response, H'06, (1 byte) : Response to 128-byte programming
On completion of programming, the boot program will return ACK.
Error
response
H'D0
ERROR
 Error response, H'D0, (1 byte) : Error response for 128-byte programming
 ERROR : (1 byte) : Error code
H'11 : Checksum Error
H'28 : Address error
The address is not within the specified range.
Rev. 2.0, 06/04, page 664 of 980
H'53 : Programming error
A programming error has occurred and programming cannot be
continued.
The specified address should match the unit for programming of data. For example, when the
programming is in 128-byte units, the lower byte of the address should be H'00 or H'80.
When there are less than 128 bytes of data to be programmed, the host should fill the rest with
H'FF.
Sending the 128-byte programming command with the address of H'FFFFFFFF will stop the
programming operation. The boot program will interpret this as the end of the programming and
wait for selection of programming or erasing.
Command H'50
Address
SUM
 Command, H'50, (1 byte) : 128-byte programming
 Programming Address (4 bytes) : End code is H'FF, H'FF, H'FF, H'FF.
 SUM (1 byte) : Checksum
Response
H'06
 Response: H'06 (1 byte): Response to 128-byte programming
On completion of programming, the boot program will return ACK.
Error
response
H'D0
ERROR
 Error Response, H'D0, (1 byte) : Error response for 128-byte programming
 ERROR : (1 byte) : Error code
H'11 : Checksum error
H'53 : Programming error
An error has occurred in programming and programming cannot be
continued.
• Erasure
Erasure is performed with the erasure selection and block erasure command.
Firstly, erasure is selected by the erasure selection command and the boot program then erases the
specified block. The command should be repeatedly executed if two or more blocks are to be
erased. Sending a block-erasure command from the host with the block number H'FF will stop the
erasure operating. On completion of erasing, the boot program will wait for selection of
programming or erasing.
The sequences of the issuing of erasure selection commands and the erasure of data are shown in
figure 18.28.
Rev. 2.0, 06/04, page 665 of 980
Host
Boot Program
Preparation for Erasure (H'48)
Transfer of Erasure
Program
ACK
Erasure (Erased Block Number)
Repeat
Erasure
ACK
Erasure (H'FF)
ACK
Figure 18.28 Erasure Sequence
(1) Erasure Selection
The boot program will transfer the erasure program. User MAT data is erased by the transferred
erasure program.
Command H'48
 Command, H'48, (1 byte) : Erasure selection
Response
H'06
 Response, H'06, (1 byte) : Response for erasure selection
After the erasure program has been transferred, the boot program will return ACK.
Error
response
H'C8
ERROR
 Error response: H'C8 (1 byte): Error response to erasing selection
 ERROR: (1 byte): Error code
H'54: Selection processing error (transfer error occurs and processing is not completed)
(2) Block Erasure
The boot program will erase the contents of the specified block.
Command H'58
Size
Block Number
SUM
 Command, H'58, (1 byte) : Erasure
 Size (1 byte) : The number of bytes that represents the erasure block number
This is fixed to 1.
Rev. 2.0, 06/04, page 666 of 980
 Block Number (1 byte) : Number of the block to be erased
 SUM (1 byte) : Checksum
Response
H'06
 Response, H'06, (1 byte) : Response to Erasure
After erasure has been completed, the boot program will return ACK.
Error
response
H'D8
ERROR
 Error Response, H'D8, (1 byte) : Error code
 ERROR (1 byte) : Error code
H'11 : Sum check error
H'29 : Block number error
Block number is incorrect.
H'51 : Erasure error
An error has occurred during erasure.
On receiving block number H'FF, the boot program will stop erasure and wait for a
selection command.
Command H'58
Size
Block Number
SUM
 Command, H'58, (1 byte) : Erasure
 Size (1 byte) : The number of bytes that represents the block number
This is fixed to 1.
 Block Number (1 byte) : H'FF
Stop code for erasure
 SUM (1 byte) : Checksum
Response
H'06
 Response, H'06, (1 byte) : Response to end of erasure (ACK)
When erasure is to be performed after the block number H'FF has been sent, the procedure
should be executed from the erasure selection command.
• Memory read
The boot program will return the data in the specified address.
Command H'52
Size
Area
Read size
Read address
SUM
 Command: H'52 (1 byte): Memory read
 Size (1 byte): Amount of data that represents the area, read address, and read size (fixed at
9)
Rev. 2.0, 06/04, page 667 of 980
 Area (1 byte)
H'00 : User boot MAT
H'01 : User MAT
An address error occurs when the area setting is incorrect.
 Read address (4 bytes): Start address to be read from
 Read size (4 bytes): Size of data to be read
 SUM (1 byte): Checksum
Response H'52
Data
Read size
···
SUM
 Response: H'52 (1 byte): Response to memory read
 Read size (4 bytes): Size of data to be read
 Data (n bytes): Data for the read size from the read address
 SUM (1 byte): Checksum
Error
response
H'D2
ERROR
 Error response: H'D2 (1 byte): Error response to memory read
 ERROR: (1 byte): Error code
H'11: Sum check error
H'2A: Address error
The read address is not in the MAT.
H'2B: Size error
The read size exceeds the MAT.
• User-Boot Program Sum check
The boot program will return the byte-by-byte total of the contents of the bytes of the user-boot
program.
Command H'4A
 Command, H'4A, (1 byte) : Sum check for user-boot program
Response
H'5A
Size
 Response, H'5A, (1 byte) :
Checksum of user boot program
SUM
Response to the sum check of user-boot program
 Size (1 byte) : The number of bytes that represents the checksum
This is fixed to 4.
 Checksum of user boot program (4 bytes) : Checksum of user boot MATs
The total of the data is obtained in byte units.
 SUM (1 byte) : Sum check for data being transmitted
Rev. 2.0, 06/04, page 668 of 980
• User-Program Sum check
The boot program will return the byte-by-byte total of the contents of the bytes of the user
program.
Command H'4B
 Command, H'4B, (1 byte) : Sum check for user program
Response
H'5B
Size
Checksum of user program
SUM
 Response, H'5B, (1 byte) : Response to the sum check of the user program
 Size (1 byte) : The number of bytes that represents the checksum
This is fixed to 4.
 Checksum of user boot program (4 bytes) : Checksum of user MATs
The total of the data is obtained in byte units.
 SUM (1 byte) : Sum check for data being transmitted
• User Boot MAT Blank check
The boot program will check whether or not all user boot MATs are blank and return the result.
Command H'4C
 Command, H'4C, (1 byte) : Blank check for user boot MAT
Response
H'06
 Response, H'06, (1 byte) : Response to the blank check of user boot MAT
If all user MATs are blank (H'FF), the boot program will return ACK.
Error
response
H'CC
H'52
 Error Response, H'CC, (1 byte) : Response to blank check for user boot MAT
 Error Code, H'52, (1 byte)
: Erasure has not been completed.
• User MAT Blank Check
The boot program will check whether or not all user MATs are blank and return the result.
Command H'4D
 Command, H'4D, (1 byte) : Blank check for user MATs
Response
H'06
 Response, H'06, (1 byte) : Response to the blank check for user boot MATs
If the contents of all user MATs are blank (H'FF), the boot program will return ACK.
Rev. 2.0, 06/04, page 669 of 980
Error
response
H'CD
H'52
 Error Response, H'CD, (1 byte) : Error response to the blank check of user MATs.
 Error code H'52 (1 byte) : Erasure has not been completed.
• Boot Program State Inquiry
The boot program will return indications of its present state and error condition. This inquiry can
be made in the inquiry/selection state or the programming/erasing state.
Command H'4F
 Command, H'4F, (1 byte) : Inquiry regarding boot program’s state
Response
H'5F
Size
STATUS
ERROR
SUM
 Response, H'5F, (1 byte) : Response to boot program state inquiry
 Size (1 byte) : The number of bytes that represents the STATUS and ERROR.
This is fixed to 2.
 STATUS (1 byte) : State of the boot program
For details, see table 18.18.
 ERROR (1 byte): Error state
ERROR = 0 indicates normal operation.
ERROR = 1 indicates error has occurred
For details, see table 18.19.
 SUM (1 byte): Checksum
Rev. 2.0, 06/04, page 670 of 980
Table 18.18 Status Code
Code
Description
H'11
Device Selection Wait
H'12
Clock Mode Selection Wait
H'13
Bit Rate Selection Wait
H'1F
Programming/Erasing State Transition Wait (Bit rate selection is completed)
H'31
Programming State for Erasure
H'3F
Programming/Erasing Selection Wait (Erasure is completed)
H'4F
Programming Data Receive Wait (Programming is completed)
H'5F
Erasure Block Specification Wait (Erasure is completed)
Table 18.19 Error Code
Code
Description
H'00
No Error
H'11
Sum Check Error
H'12
Program Size Error
H'21
Device Code Mismatch Error
H'22
Clock Mode Mismatch Error
H'24
Bit Rate Selection Error
H'25
Input Frequency Error
H'26
Multiplication Ratio Error
H'27
Operating Frequency Error
H'29
Block Number Error
H'2A
Address Error
H'2B
Data Length Error
H'51
Erasure Error
H'52
Erasure Incompletion Error
H'53
Programming Error
H'54
Selection Error
H'80
Command Error
H'FF
Bit-Rate-Adjustment Confirmation Error
Rev. 2.0, 06/04, page 671 of 980
18.10.2 AC Characteristics and Timing in Writer Mode
Table 18.20 AC Characteristics in Memory Read Mode
Condition : VCC = 3.0 V to 3.6 V, VSS = 0 V, Ta = 25°C ± 5°C
Code
Symbol
Min
Max
Unit
Command write cycle
tnxtc
20
µs
CE hold time
tceh
0
ns
CE setup time
tces
0
ns
Data hold time
tdh
50
ns
Data setup time
tds
50
ns
Programming pulse width
twep
70
WE rise time
tr
30
ns
WE fall time
tf
30
ns
Note
ns
Command write
Memory read mode
Address stable
A18-0
tces
tceh
tnxtc
CE
OE
twep
tf
tr
WE
tds
tdh
I/O7-0
Note : Data is latched at the rising edge of WE.
Figure 18.29 Memory Read Timing after Command Write
Rev. 2.0, 06/04, page 672 of 980
Table 18.21 AC Characteristics in Transition from Memory Read Mode to Others
Condition : VCC = 3.0 V to 3.6 V, VSS = 0 V, Ta = 25°C ± 5°C
Code
Symbol
Min
Command write cycle
tnxtc
20
Max
Unit
µs
CE hold time
tceh
0
ns
CE setup time
tces
0
ns
Data hold time
tdh
50
ns
Data setup time
tds
50
ns
Programming pulse width
twep
70
ns
WE rise time
tr
30
ns
WE fall time
tf
30
ns
Other Mode Command Write
Memory Read Mode
A18-0
Note
Address Stable
tnxtc
tces
tceh
CE
OE
twep
tf
tr
WE
tds
tdh
I/O7-0
Note : WE and OE should not be enabled simultaneously.
Figure 18.30 Timing at Transition from Memory Read Mode to Other Modes
Rev. 2.0, 06/04, page 673 of 980
Table 18.22 AC Characteristics Memory Read Mode
Condition : VCC = 3.0 V to 3.6 V, VSS = 0 V, Ta = 25°C ± 5°C
Code
Symbol
Access time
tacc
Min
Max
Unit
20
µs
CE output delay time
tce
150
ns
OE output delay time
toe
150
ns
Output disable delay time
tdf
100
ns
Data output hold time
toh
5
ns
Address Stable
A18-0
CE
VIL
OE
VIL
WE
VIH
Note
Address Stable
tacc
tacc
toh
toh
I/O7-0
Figure 18.31 CE/OE
CE OE Enable State Read
Address Stable
A18-0
Address Stable
tce
tce
CE
WE
toe
toe
OE
VIH
tacc
tacc
toh
tdf
I/O7-0
Figure 18.32 CE/OE
CE OE Clock Read
Rev. 2.0, 06/04, page 674 of 980
toh
tdf
Table 18.23 AC Characteristics Auto-Write Mode
Condition : VCC = 3.0 V to 3.6 V, VSS = 0 V, Ta = 25°C ± 5°C
Code
Symbol
Min
Command write cycle
tnxtc
20
Max
Unit
Note
µs
CE hold time
tceh
0
ns
CE setup time
tces
0
ns
Data hold time
tdh
50
ns
Data setup time
tds
50
ns
Programming pulse width
twep
70
ns
Status polling start time
twsts
1
ms
Status polling access time
tspa
Address setup time
tas
0
ns
Address hold time
tah
60
ns
Memory programming time
twrite
1
Programming setup time
tpns
100
ns
Programming end setup
time
tpnh
100
ns
WE rise time
tr
30
ns
WE fall time
tf
30
ns
150
ns
3000
ms
tpnh
FWE
Address Stable
A18-0
tpns
tces
tnxtc
tceh
tnxtc
CE
OE
WE
tf
twep
tas
tr
tds
tdh
tah
twsts
Data Transfer
1 byte to 128 bytes
tspa
twrite
I/O7
Identification Signal of
Programming Operation End
I/O6
I/O5-0
Identification Signal of
Programming Operation
Successful End
H'40 or
H'45
H'00
1st byte
Din
128th byte
Din
Figure 18.33 Timing in Auto-Write Mode
Rev. 2.0, 06/04, page 675 of 980
Table 18.24 AC Characteristics Auto-Erase Mode
Condition : VCC = 3.0 V to 3.6 V, VSS = 0 V, Ta = 25°C ± 5°C
Code
Symbol
Min
Command write cycle
tnxtc
20
Max
Unit
Note
µs
CE hold time
tceh
0
ns
CE setup time
tces
0
ns
Data hold time
tdh
50
ns
Data setup time
tds
50
ns
Programming pulse width
twep
70
ns
Status polling start time
tests
1
ms
Status polling access time
tspa
Memory erase time
terase
100
150
ns
40000
ms
Erase setup time
tens
100
ns
Erase end setup time
tenh
100
ns
WE rise time
tr
30
ns
WE fall time
tf
30
ns
tenh
FWE
A18-0
tens
tces
tnxtc
tceh
tnxtc
CE
OE
WE
tf
twep
tests
tr
tds
terase
tdh
I/O7
Erase end
identification
signal
I/O6
I/O5-0
tspa
H'20 or
H'25
H'20 or
H'25
Erase normal
and confirmation
signal
H'00
Figure 18.34 Timing in Auto-Erase Mode
Rev. 2.0, 06/04, page 676 of 980
Table 18.25 AC Characteristics Status Read Mode
Condition : VCC = 3.0 V to 3.6 V, VSS = 0 V, Ta = 25°C ± 5°C
Code
Symbol
Min
Command write cycle
tnxtc
20
Max
Unit
Note
µs
CE hold time
tceh
0
ns
CE setup time
tces
0
ns
Data hold time
tdh
50
ns
Data setup time
tds
50
ns
Programming pulse width
twep
70
ns
OE output delay time
toe
150
ns
Disable delay time
tdf
100
ns
CE output delay time
tce
150
ns
WE rise time
tr
30
ns
WE fall time
tf
30
ns
A18-0
tces
tnxtc
tceh
tces
tnxtc
tceh
tnxtc
CE
tce
OE
WE
twep
tf
tr
tds
I/O7-0
twep
tf
tdh
tds
H'71
toe
tr
tdf
tdh
H'71
Note: I/O3 and I/O2 are undefined.
Figure 18.35 Timing in Status Read Mode
Table 18.26 Stipulated Transition Times to Command Wait State
Condition : VCC = 3.0 V to 3.6 V, VSS = 0 V, Ta = 25°C ± 5°C
Code
Symbol
Min
Max
Unit
Standby release
(oscillation settling time)
tosc1
30
ms
PROM mode setup time
tbmv
10
ms
VCC hold time
tdwn
0
ms
Note
Rev. 2.0, 06/04, page 677 of 980
tosc1
tbmv
Memory read mode
Command wait state
Auto-program mode
Auto-erase mode
Command wait state
Normal/abnormal
end identification tdwn
VCC
RES
FWE
Note: Set the FWE input pin low level, except in the auto-program and auto-erase modes.
Figure 18.36 Oscillation Stabilization Time, PROM Mode Setup Time, and
Power-Down Sequence
18.10.3 Procedure Program and Storable Area for Programming Data
In the descriptions in the previous section, the programming/erasing procedure programs and
storable areas for program data are assumed to be in the on-chip RAM. However, the program
and the data can be stored in and executed from other areas, such as part of flash memory which is
not to be programmed or erased, or somewhere in the external address space.
•
Conditions that Apply to Programming/Erasing
(1) The on-chip programming/erasing program is downloaded from the address set by FTDAR in
on-chip RAM, therefore, this area is not available for use.
(2) The on-chip programming/erasing program will use the 128 bytes as a stack. So, make sure
that this area is secured.
(3) Since download by setting the SCO bit to 1 will cause the MATs to be switched, it should be
executed in on-chip RAM.
(4) The flash memory is accessible until the start of programming or erasing, that is, until the
result of downloading has been judged. When in a mode in which the external address space
is not accessible, such as single-chip mode, the required procedure programs, NMI handling
vector, NMI handler and user branch program should be transferred to the on-chip RAM
before programming/erasing of the flash memory starts.
(5) The flash memory is not accessible during programming/erasing operations, therefore, the
operation program is downloaded to the on-chip RAM to be executed. The NMI-handling
vector and programs such as that which activate the operation program, user program at the
user-branch destination during programming/erasing operation, and NMI handler should thus
be stored in on-chip memory other than flash memory or the external address space.
(6) After programming/erasing, the flash memory should be inhibited until FKEY is cleared.
The reset state (RES = 0) must be in place for more than 100 µs when the LSI mode is
changed to reset on completion of a programming/erasing operation.
Rev. 2.0, 06/04, page 678 of 980
Transitions to the reset state, and hardware standby mode are inhibited during
programming/erasing. When the reset signal is accidentally input to the chip, a longer period
in the reset state than usual (100 µs) is needed before the reset signal is released.
(7) Switching of the MATs by FMATS should be needed when programming/erasing of the user
boot MAT is operated in user-boot mode. The program which switches the MATs should be
executed from the on-chip RAM. See section 18.8, Switching between User MAT and User
Boot MAT. Please make sure you know which MAT is selected when switching between
them.
(8) When the data storable area indicated by programming parameter FMPDR is within the flash
memory area, an error will occur even when the data stored is normal. Therefore, the data
should be transferred to the on-chip RAM to place the address that FMPDR indicates in an
area other than the flash memory.
In consideration of these conditions, there are three factors; operating mode, the bank structure of
the user MAT, and operations.
The areas in which the programming data can be stored for execution are shown in table 18.27.
Table 18.27 Executable MAT
Initiated Mode
Operation
User Program Mode
User Boot Mode*
Programming
Table 18.28 (1)
Table 18.28 (3)
Erasing
Table 18.28 (2)
Table 18.28 (4)
Note:
*
Programming/Erasing is possible to user MATs.
Rev. 2.0, 06/04, page 679 of 980
Table 18.28 (1) Useable Area for Programming in User Program Mode
Storable /Executable Area
Item
On-chip User
RAM
MAT
Programming Storage Area for
Procedure
Program Data
Selected MAT
External Space User
(Expanded Mode) MAT
×*
—
Operation for
Selection of Onchip Program to
be Downloaded
Operation for
Writing H'A5 to
Key Register
Execution of
Writing SC0 = 1
to FCCS
(Download)
×
×
×
×
Operation for
Key Register
Clear
Judgement of
Download Result
Operation for
Download Error
Operation for Settings of Initial
Parameter
Execution of Initialization
Judgement of Initialization
Result
Operation for Initialization Error
Rev. 2.0, 06/04, page 680 of 980
Embedded
Program Storage
Area
—
Storable /Executable Area
On-chip User
RAM
MAT
Item
NMI Handling Routine
Selected MAT
External Space User
(Expanded Mode) MAT
Embedded
Program Storage
Area
×
Operation for Inhibit of Interrupt
Operation for Writing H'5A to
Key Register
Operation for Settings of
Program Parameter
×
Execution of Programming
×
Judgement of Program Result
×
Operation for Program Error
×
Operation for Key Register
Clear
×
Note:
*
×
Transferring the data to the on-chip RAM enables this area to be used.
Rev. 2.0, 06/04, page 681 of 980
Table 18.28 (2) Useable Area for Erasure in User Program Mode
Storable /Executable Area
Item
Erasing
Procedure
On-chip User
RAM
MAT
Selected MAT
External Space User
(Expanded Mode) MAT
Operation for
Selection of Onchip Program to
be Downloaded
Operation for
Writing H'A5 to
Key Register
Execution of
Writing SC0 = 1
to FCCS
(Download)
×
×
×
×
Operation for
Key Register
Clear
Judgement of
Download Result
Operation for Download Error
Operation for Settings of
Default Parameter
Execution of Initialization
Judgement of Initialization
Result
Operation for Initialization Error
NMI Handling Routine
Rev. 2.0, 06/04, page 682 of 980
×
Embedded
Program Storage
Area
Storable /Executable Area
Item
On-chip User
RAM
MAT
Selected MAT
External Space User
(Expanded Mode) MAT
Embedded
Program Storage
Area
Operation for Inhibit of Interrupt
Operation for Writing H'5A to
Key Register
Operation for Settings of
Erasure Parameter
×
Execution of Erasure
×
Judgement of Erasure Result
×
Operation for Erasure Error
×
Operation for Key Register
Clear
×
×
Rev. 2.0, 06/04, page 683 of 980
Table 18.28 (3) Useable Area for Programming in User Boot Mode
Storable/Executable Area
Item
User
On-chip Boot
RAM
MAT
Programming Storage Area for
procedure
Program Data
×*
External Space
(Expanded
User
Mode)
MAT
User
Boot
MAT
—
—
1
Operation for
Selection of Onchip Program to
be Downloaded
Operation for
Writing H'A5 to
Key Register
Execution of
Writing SC0 = 1
to FCCS
(Download)
×
×
×
×
Operation for
Key Register
Clear
Judgement of
Download Result
Operation for
Download Error
Operation for Settings of
Default Parameter
Execution of Initialization
Judgement of Initialization
Result
Operation for Initialization Error
NMI Handling Routine
Rev. 2.0, 06/04, page 684 of 980
×
Selected MAT
Embedded
Program
Storage Area
—
Storable/Executable Area
Item
User
On-chip Boot
RAM
MAT
Selected MAT
External Space
(Expanded
User
Mode)
MAT
User
Boot
MAT
Embedded
Program
Storage Area
Operation for Interrupt Inhibit
Switching MATs by FMATS
×
Operation for Writing H'5A to
Key Register
×
Operation for Settings of
Program Parameter
×
Execution of Programming
×
Judgement of Program Result
×
Operation for Program Error
×*
Operation for Key Register
Clear
×
Switching MATs by FMATS
×
×
×
2
×
Notes: *1 Transferring the data to the on-chip RAM enables this area to be used.
*2 Switching FMATS by a program in the on-chip RAM enables this area to be used.
Rev. 2.0, 06/04, page 685 of 980
Table 18.28 (4) Useable Area for Erasure in User Boot Mode
Storable/Executable Area
Item
Erasing
Procedure
User
On-chip Boot
RAM
MAT
External Space
(Expanded
User
Mode)
MAT
Operation for
Selection of Onchip Program to
be Downloaded
Operation for
Writing H'A5 to
Key Register
Execution of
Writing SC0 = 1
to FCCS
(Download)
×
×
×
×
Operation for
Key Register
Clear
Judgement of
Download Result
Operation for Download Error
Operation for Settings of
Default Parameter
Execution of Initialization
Judgement of Initialization
Result
Operation for Initialization Error
NMI Handling Routine
Rev. 2.0, 06/04, page 686 of 980
×
Selected MAT
User
Boot
MAT
Embedded
Program
Storage Area
Storable/Executable Area
User
On-chip Boot
RAM
MAT
Item
Selected MAT
External Space
(Expanded
User
Mode)
MAT
User
Boot
MAT
Embedded
Program
Storage Area
Operation for Interrupt Inhibit
Switching MATs by FMATS
×
Operation for Writing H'5A to
Key Register
×
Operation for Settings of
Erasure Parameter
×
Execution of Erasure
×
Judgement of Erasure Result
×
Operation for Erasure Error
×*
Operation for Key Register
Clear
×
Switching MATs by FMATS
×
Note:
*
×
×
×
Switching FMATS by a program in the on-chip RAM enables this area to be used.
Rev. 2.0, 06/04, page 687 of 980
Rev. 2.0, 06/04, page 688 of 980
Section 19 Clock Pulse Generator
19.1
Overview
The H8/3029 has a built-in clock pulse generator (CPG) that generates the system clock (φ) and
other internal clock signals (φ/2 to φ/4096). After duty adjustment, a frequency divider divides the
1
clock frequency to generate the system clock (φ). The system clock is output at the φ pin* and
furnished as a master clock to prescalers that supply clock signals to the on-chip supporting
modules. Frequency division ratios of 1/1, 1/2, 1/4, and 1/8 can be selected for the frequency
2
divider by settings in a division control register (DIVCR)* . Power consumption in the chip is
reduced in almost direct proportion to the frequency division ratio.
Notes: *1 Usage of the φ pin differs depending on the chip operating mode and the PSTOP bit
setting in the module standby control register (MSTCR). For details, see section 20.7,
System Clock Output Disabling Function.
*2 The division ratio of the frequency divider can be changed dynamically during
operation. The clock output at the φ pin also changes when the division ratio is
changed. The frequency output at the φ pin is shown below.
φ = EXTAL × n
where, EXTAL: Frequency of crystal resonator or external clock signal
n:
19.1.1
Frequency division ratio (n = 1/1, 1/2, 1/4, or 1/8)
Block Diagram
Figure 19.1 shows a block diagram of the clock pulse generator.
CPG
XTAL
Oscillator
EXTAL
Duty
adjustment
circuit
Frequency
divider
φ
Prescalers
Division
control
register
Data bus
φ pin
φ/2 to φ/4096
Figure 19.1 Block Diagram of Clock Pulse Generator
Rev. 2.0, 06/04, page 689 of 980
19.2
Oscillator Circuit
Clock pulses can be supplied by connecting a crystal resonator, or by input of an external clock
signal.
19.2.1
Connecting a Crystal Resonator
Circuit Configuration: A crystal resonator can be connected as in the example in figure 19.2.
Damping resistance Rd should be selected according to table 19.1 (1), and external capacitances
CL1 and CL2 according to table 19.1 (2). An AT-cut parallel-resonance crystal should be used.
CL1
EXTAL
XTAL
Rd
CL2
Figure 19.2 Connection of Crystal Resonator (Example)
If a crystal resonator with a frequency higher than 20 MHz is connected, the external load
capacitance values in table 19.1 (2) should not exceed 10 pF. Also, in order to improve the
accuracy of the oscillation frequency, a thorough study of oscillation matching evaluation, etc.,
should be carried out when deciding the circuit constants.
Table 19.1 (1)
Damping Resistance Value
Damping
Resistance
Value
10 ≤ f ≤ 13
13 < f ≤ 16
16 < f ≤ 18
18 < f ≤ 25
Rd (Ω)
0
0
0
0
Frequency f (MHz)
Note: A crystal resonator between 10 MHz and 25 MHz can be used. If the chip is to be
operated at less than 10 MHz, the on-chip frequency divider should be used. (A crystal
resonator of less than 10 MHz cannot be used.)
Table 19.1 (2)
External Capacitance Values
Frequency f (MHz)
External Capacitance Value
20 < f ≤ 25
10 ≤ f ≤ 20
CL1 = CL2 (pF)
10
10 to 22
Rev. 2.0, 06/04, page 690 of 980
Crystal Resonator: Figure 19.3 shows an equivalent circuit of the crystal resonator. The crystal
resonator should have the characteristics listed in table 19.2.
CL
L
Rs
XTAL
EXTAL
C0
AT-cut parallel-resonance type
Figure 19.3 Crystal Resonator Equivalent Circuit
Table 19.2 Crystal Resonator Parameters
Frequency (MHz)
10
12
16
18
20
25
Rs max (Ω)
30
30
20
20
20
20
Co (pF)
7 (max)
7 (max)
7 (max)
7 (max)
7 (max)
7 (max)
Use a crystal resonator with a frequency equal to the system clock frequency (φ).
Notes on Board Design: When a crystal resonator is connected, the following points should be
noted:
Other signal lines should be routed away from the oscillator circuit to prevent induction from
interfering with correct oscillation. See figure 19.4.
When the board is designed, the crystal resonator and its load capacitors should be placed as close
as possible to the XTAL and EXTAL pins.
Avoid
C
L2
Signal A
Signal B
H8/3029 chip
XTAL
EXTAL
C
L1
Figure 19.4 Oscillator Circuit Block Board Design Precautions
Rev. 2.0, 06/04, page 691 of 980
19.2.2
External Clock Input
Circuit Configuration: An external clock signal can be input as shown in the examples in figure
19.5. If the XTAL pin is left open, the stray capacitance should not exceed 10 pF. If the stray
capacitance at the XTAL pin exceeds 10 pF in configuration a, use the connection shown in
configuration b instead, and hold the external clock high in standby mode.
EXTAL
XTAL
External clock input
Open
(a) XTAL pin left open
EXTAL
External clock input
XTAL
(b) Complementary clock input at XTAL pin
Figure 19.5 External Clock Input (Examples)
External Clock: The external clock frequency should be equal to the system clock frequency
when not divided by the on-chip frequency divider. Table 19.3 shows the clock timing, figure
19.6 shows the external clock input timing, and figure 19.7 shows the external clock output
settling delay timing. When the appropriate external clock is input via the EXTAL pin, its
waveform is corrected by the on-chip oscillator and duty adjustment circuit.
When the appropriate external clock is input via the EXTAL pin, its waveform is corrected by the
on-chip oscillator and duty adjustment circuit. The resulting stable clock is output to external
devices after the external clock settling time (tDEXT) has passed after the clock input. The system
must remain reset with the reset signal low during tDEXT, while the clock output is unstable.
Rev. 2.0, 06/04, page 692 of 980
Table 19.3 Clock Timing
VCC = 3.0 V to 3.6 V
Item
Symbol Min
Max
Unit
Test Conditions
External clock input low
pulse width
tEXL
15
—
ns
Figure 19.6
External clock input high
pulse width
tEXH
15
—
ns
External clock rise time
tEXr
—
5
ns
External clock fall time
tEXf
—
5
ns
Clock low pulse width
tCL
0.4
0.6
tcyc
Clock high pulse width
tCH
0.4
0.6
tcyc
External clock output
settling delay time
tDEXT*
500
—
µs
Note:
*
Figure 21.13
Figure 19.7
tDEXT includes a RES pulse width (tRESW). tRESW = 20 tcyc
tEXL
tEXH
VCC × 0.7
EXTAL
VCC × 0.5
0.3 V
tEXr
tEXf
Figure 19.6 External Clock Input Timing
Rev. 2.0, 06/04, page 693 of 980
VCC
STBY
VIH
EXTAL
φ (internal or
external)
RES
tDEXT
Figure 19.7 External Clock Output Settling Delay Timing
19.3
Duty Adjustment Circuit
The duty adjustment circuit adjusts the duty cycle of the clock signal from the oscillator to
generate φ.
19.4
Prescalers
The prescalers divide the system clock (φ) to generate internal clocks (φ/2 to φ/4096).
19.5
Frequency Divider
The frequency divider divides the duty-adjusted clock signal to generate the system clock (φ). The
frequency division ratio can be changed dynamically by modifying the value in DIVCR, as
described below. Power consumption in the chip is reduced in almost direct proportion to the
frequency division ratio. The system clock generated by the frequency divider can be output at the
φ pin.
Rev. 2.0, 06/04, page 694 of 980
19.5.1
Register Configuration
Table 19.4 summarizes the frequency division register.
Table 19.4 Frequency Division Register
Address*
Name
Abbreviation
R/W
Initial Value
H'EE01B
Division control register
DIVCR
R/W
H'FC
Note:
19.5.2
Lower 20 bits of the address in advanced mode.
*
Division Control Register (DIVCR)
DIVCR is an 8-bit readable/writable register that selects the division ratio of the frequency
divider.
Bit
7
6
5
4
3
2
1
0
—
—
—
—
—
—
DIV1
DIV0
Initial value
1
1
1
1
1
1
0
0
Read/Write
—
—
—
—
—
—
R/W
R/W
Reserved bits
Divide bits 1 and 0
These bits select the
frequency division ratio
DIVCR is initialized to H'FC by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bits 7 to 2—Reserved: These bits cannot be modified and are always read as 1.
Bits 1 and 0—Divide (DIV1, DIV0): These bits select the frequency division ratio, as follows.
Bit 1
DIV1
Bit 0
DIV0
Frequency Division Ratio
0
0
1/1
0
1
1/2
1
0
1/4
1
1
1/8
(Initial value)
Rev. 2.0, 06/04, page 695 of 980
19.5.3
Usage Notes
The DIVCR setting changes the φ frequency, so note the following points.
• Select a frequency division ratio that stays within the assured operation range specified for the
clock cycle time tcyc in the AC electrical characteristics. Note that φmin = lower limit of the
operating frequency range. Ensure that φ is not below this lower limit.
• All on-chip module operations are based on φ. Note that the timing of timer operations, serial
communication, and other time-dependent processing differs before and after any change in
the division ratio. The waiting time for exit from software standby mode also changes when
the division ratio is changed. For details, see section 20.4.3, Selection of Waiting Time for
Exit from Software Standby Mode.
Rev. 2.0, 06/04, page 696 of 980
Section 20 Power-Down State
20.1
Overview
The H8/3029 has a power-down state that greatly reduces power consumption by halting the CPU,
and a module standby function that reduces power consumption by selectively halting on-chip
modules.
The power-down state includes the following three modes:
• Sleep mode
• Software standby mode
• Hardware standby mode
The module standby function can halt on-chip supporting modules independently of the powerdown state. The modules that can be halted are the 16-bit timer, 8-bit timer, SCI0, SCI1, SCI2,
DMAC, DRAM interface, and A/D converter.
Table 20.1 indicates the methods of entering and exiting the power-down modes and module
standby mode, and gives the status of the CPU and on-chip supporting modules in each mode.
Rev. 2.0, 06/04, page 697 of 980
A/D
Held
φ output
I/O
Ports
φ clock
Modules RAM output *4
Other
Conditions
Exiting
while SSBY = 1
mode
Rev. 2.0, 06/04, page 698 of 980
reset
reset
and
Halted
reset
and
Halted
reset
held*1
reset
and
reset
and
reset
and
reset
and
reset
and
impedance*2
High
impedance
High
output
High
Module Standby Control Register L (MSTCRL).
• STBY
• STBY
• RES
• IRQ0 to IRQ2
• NMI
—
bit to 0*5
• Clear MSTCR
• RES
• STBY
impedance • RES
High
Held
• Interrupt
Software standby bit
MSTCRL: Module standby control register L
MSTCRH: Module standby control register H
System control register
SSBY:
then set up the module registers again.
*5 When a MSTCR bit is set to 1, the registers of the corresponding on-chip supporting module are initialized. To restart the module, first clear the MSTCR bit to 0,
*4 When P67 is used as the φ output pin.
*3 The RAME bit must be cleared to 0 in SYSCR before the transition from the program execution state to hardware standby mode.
SYSCR:
Legend
—
Held*3
Held
Held
*2 State in which the corresponding MSTCR bit was set to 1. For details see section 20.2.2, Module Standby Control Register H (MSTCRH) and section 20.2.3,
Notes: *1 RTCNT and bits 7 and 6 of RTMCSR are initialized. Other bits and registers hold their previous states.
and
and
reset
reset
and
Halted
MSTCR
reset
and
Halted
and
reset
reset
and
Halted
reset
Halted*2 Halted*2 Halted*2 Halted*2 Halted*2 Halted*2 Halted*2 Halted*2 Active
and
and
reset
and
Halted
Active
bit set to 1 in
Halted
Halted
reset
and
Halted
Active
Corresponding Active Active —
reset
and
Halted
reset
and
Halted
Active
standby
and
reset
and
Halted
Active
Module
mined
Halted Halted Undeter- Halted
reset
held*1
and
Halted
Active
reset
STBY pin
and
and
reset
Halted
Halted
and
Halted
Active
mode
standby
Hardware Low input at
in SYSCR
and
tion executed
standby
reset
Halted
Software SLEEP instruc- Halted Halted Held
in SYSCR
Active
• STBY
SCI2
• RES
SCI1
while SSBY = 0
Active
Active
SCI0
tion executed
Timer
SLEEP instruc- Active Halted Held
8-Bit
16-Bit
Interface Timer
DRAM
mode
Registers DMAC
CPU
Sleep
Clock CPU
Conditions
Mode
Entering
State
Table 20.1 Power-Down State and Module Standby Function
20.2
Register Configuration
The H8/3029 has a system control register (SYSCR) that controls the power-down state, and
module standby control registers H (MSTCRH) and L (MSTCRL) that control the module standby
function. Table 20.2 summarizes these registers.
Table 20.2 Control Register
Address*
Name
Abbreviation
R/W
Initial Value
H'EE012
System control register
SYSCR
R/W
H'09
H'EE01C
Module standby control register H
MSTCRH
R/W
H'78
H'EE01D
Module standby control register L
MSTCRL
R/W
H'00
Note:
*
20.2.1
Lower 20 bits of the address in advanced mode.
System Control Register (SYSCR)
Bit
7
6
5
4
3
2
1
0
SSBY
STS2
STS1
STS0
UE
NMIEG
SSOE
RAME
Initial value
0
0
0
0
1
0
0
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
RAM enable
Software standby
output port enable
NMI edge select
User bit enable
Standby timer select 2 to 0
These bits select the
waiting time of the CPU
and peripheral functions
Software standby
Enables transition to
software standby mode
SYSCR is an 8-bit readable/writable register. Bit 7 (SSBY), bits 6 to 4 (STS2 to STS0), and bit 1
(SSOE) control the power-down state. For information on the other SYSCR bits, see section 3.3,
System Control Register (SYSCR).
Rev. 2.0, 06/04, page 699 of 980
Bit 7—Software Standby (SSBY): Enables transition to software standby mode. When software
standby mode is exited by an external interrupt, this bit remains set to 1 after the return to normal
operation. To clear this bit, write 0.
Bit 7
SSBY
Description
0
SLEEP instruction causes transition to sleep mode
1
SLEEP instruction causes transition to software standby mode
(Initial value)
Bits 6 to 4—Standby Timer Select (STS2 to STS0): These bits select the length of time the CPU
and on-chip supporting modules wait for the clock to settle when software standby mode is exited
by an external interrupt. If the clock is generated by a crystal resonator, set these bits according to
the clock frequency so that the waiting time will be at least 7 ms (oscillation settling time). See
table 20.3. If an external clock is used, set these bits so that the waiting time will be at least
100 µs.
Bit 6
STS2
Bit 5
STS1
Bit 4
STS0
Description
0
0
0
Waiting time = 8,192 states
1
Waiting time = 16,384 states
0
Waiting time = 32,768 states
1
Waiting time = 65,536 states
0
Waiting time = 131,072 states
1
Waiting time = 262,144 states
0
Waiting time = 1,024 states
1
Illegal setting
1
1
0
1
(Initial value)
Bit 1—Software Standby Output Port Enable (SSOE): Specifies whether the address bus and
bus control signals (CS0 to CS7, AS, RD, HWR, LWR, UCAS, LCAS, and RFSH) are kept as
outputs or fixed high, or placed in the high-impedance state in software standby mode.
Bit 1
SSOE
Description
0
In software standby mode, the address bus and bus control signals
are all high-impedance
1
In software standby mode, the address bus retains its output state
and bus control signals are fixed high
Rev. 2.0, 06/04, page 700 of 980
(Initial value)
20.2.2
Module Standby Control Register H (MSTCRH)
MSTCRH is an 8-bit readable/writable register that controls output of the system clock (φ). It also
controls the module standby function, which places individual on-chip supporting modules in the
standby state. Module standby can be designated for the SCI0, SCI1, SCI2.
7
6
5
4
3
PSTOP
—
—
—
—
0
1
1
1
1
Bit
Modes 1 to 5 : Initial value
Mode 7 : Initial value
Read/Write
2
1
0
MSTPH2 MSTPH1 MSTPH0
0
0
0
1
1
1
1
1
0
0
0
R/W
—
—
—
—
R/W
R/W
R/W
Reserved bit
Module standby H2 to 0
These bits select modules
to be placed in standby
φ clock stop
Enables or disables
output of the system clock
In modes 1 to 5, MSTCRH is initialized to H'78 by a reset and in hardware standby mode, while
in mode 7 it is initialized to H'F8. It is not initialized in software standby mode.
φ Clock Stop (PSTOP): Enables or disables output of the system clock (φ).
Bit 7—φ
Bit 1
PSTOP
Description
0
System clock output is enabled
(Initial value : When modes 1 to 5 are selected)
1
System clock output is disabled
(Initial value : When mode 7 is selected)
Bits 6 to 3—Reserved: These bits cannot be modified and are always read as 1.
Bit 2—Module Standby H2 (MSTPH2): Selects whether to place the SCI2 in standby.
Bit 2
MSTPH2
Description
0
SCI2 operates normally
1
SCI2 is in standby state
(Initial value)
Rev. 2.0, 06/04, page 701 of 980
Bit 1—Module Standby H1 (MSTPH1): Selects whether to place the SCI1 in standby.
Bit 1
MSTPH1
Description
0
SCI1 operates normally
1
SCI1 is in standby state
(Initial value)
Bit 0—Module Standby H0 (MSTPH0): Selects whether to place the SCI0 in standby.
Bit 0
MSTPH0
Description
0
SCI0 operates normally
1
SCI0 is in standby state
20.2.3
(Initial value)
Module Standby Control Register L (MSTCRL)
MSTCRL is an 8-bit readable/writable register that controls the module standby function, which
places individual on-chip supporting modules in the standby state. Module standby can be
designated for the DMAC, 16-bit timer, DRAM interface, 8-bit timer, and A/D converter modules.
Bit
7
6
MSTPL7
—
Initial value
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
5
4
3
2
1
0
—
MSTPL0
0
0
0
R/W
R/W
R/W
MSTPL5 MSTPL4 MSTPL3 MSTPL2
Reserved bits
Module standby L7, L5 to L2, L0
These bits select modules to be
placed in standby
MSTCRL is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bit 7—Module Standby L7 (MSTPL7): Selects whether to place the DMAC in standby.
Bit 7
MSTPL7
Description
0
DMAC operates normally
1
DMAC is in standby state
Rev. 2.0, 06/04, page 702 of 980
(Initial value)
Bit 6—Reserved: This bit can be written and read.
Bit 5—Module Standby L5 (MSTPL5): Selects whether to place the DRAM interface in
standby.
Bit 5
MSTPL5
Description
0
DRAM interface operates normally
1
DRAM interface is in standby state
(Initial value)
Bit 4—Module Standby L4 (MSTPL4): Selects whether to place the 16-bit timer in standby.
Bit 4
MSTPL4
Description
0
16-bit timer operates normally
1
16-bit timer is in standby state
(Initial value)
Bit 3—Module Standby L3 (MSTPL3): Selects whether to place 8-bit timer channels 0 and 1 in
standby.
Bit 3
MSTPL3
Description
0
8-bit timer channels 0 and 1 operate normally
1
8-bit timer channels 0 and 1 are in standby state
(Initial value)
Bit 2—Module Standby L2 (MSTPL2): Selects whether to place 8-bit timer channels 2 and 3 in
standby.
Bit 2
MSTPL2
Description
0
8-bit timer channels 2 and 3 operate normally
1
8-bit timer channels 2 and 3 are in standby state
(Initial value)
Bit 1—Reserved: This bit can be written and read.
Bit 0—Module Standby L0 (MSTPL0): Selects whether to place the A/D converter in standby.
Bit 0
MSTPL0
Description
0
A/D converter operates normally
1
A/D converter is in standby state
(Initial value)
Rev. 2.0, 06/04, page 703 of 980
20.3
Sleep Mode
20.3.1
Transition to Sleep Mode
When the SSBY bit is cleared to 0 in SYSCR, execution of the SLEEP instruction causes a
transition from the program execution state to sleep mode. Immediately after executing the
SLEEP instruction the CPU halts, but the contents of its internal registers are retained. The DMA
controller (DMAC), DRAM interface, and on-chip supporting modules do not halt in sleep mode.
Modules which have been placed in standby by the module standby function, however, remain
halted.
20.3.2
Exit from Sleep Mode
Sleep mode is exited by an interrupt, or by input at the RES or STBY pin.
Exit by Interrupt: An interrupt terminates sleep mode and causes a transition to the interrupt
exception handling state. Sleep mode is not exited by an interrupt source in an on-chip supporting
module if the interrupt is disabled in the on-chip supporting module. Sleep mode is not exited by
an interrupt other than NMI if the interrupt is masked by interrupt priority settings and the settings
of the I and UI bits in CCR, IPR.
Exit by RES Input: Low input at the RES pin exits from sleep mode to the reset state.
Exit by STBY Input: Low input at the STBY pin exits from sleep mode to hardware standby
mode.
Rev. 2.0, 06/04, page 704 of 980
20.4
Software Standby Mode
20.4.1
Transition to Software Standby Mode
To enter software standby mode, execute the SLEEP instruction while the SSBY bit is set to 1 in
SYSCR.
In software standby mode, current dissipation is reduced to an extremely low level because the
CPU, clock, and on-chip supporting modules all halt. The DMAC and on-chip supporting
modules are reset and halted. As long as the specified voltage is supplied, however, CPU register
contents and on-chip RAM data are retained. The settings of the I/O ports and DRAM interface*
are also held. When the WDT is used as a watchdog timer (WT/IT = 1), the TME bit must be
cleared to 0 before setting SSBY. Also, when setting TME to 1, SSBY should be cleared to 0.
Clear the BRLE bit in BRCR (inhibiting bus release) before making a transition to software
standby mode.
Note: * RTCNT and bits 7 and 6 of RTMCSR are initialized. Other bits and registers hold their
previous states.
20.4.2
Exit from Software Standby Mode
Software standby mode can be exited by input of an external interrupt at the NMI, IRQ0, IRQ1, or
IRQ2 pin, or by input at the RES or STBY pin.
Exit by Interrupt: When an NMI, IRQ0, IRQ1, or IRQ2 interrupt request signal is received, the
clock oscillator begins operating. After the oscillator settling time selected by bits STS2 to STS0
in SYSCR, stable clock signals are supplied to the entire chip, software standby mode ends, and
interrupt exception handling begins. Software standby mode is not exited if the interrupt enable
bits of interrupts IRQ0, IRQ1, and IRQ2 are cleared to 0, or if these interrupts are masked in the
CPU.
Exit by RES Input: When the RES input goes low, the clock oscillator starts and clock pulses are
supplied immediately to the entire chip. The RES signal must be held low long enough for the
clock oscillator to stabilize. When RES goes high, the CPU starts reset exception handling.
Exit by STBY Input: Low input at the STBY pin causes a transition to hardware standby mode.
Rev. 2.0, 06/04, page 705 of 980
20.4.3
Selection of Waiting Time for Exit from Software Standby Mode
Bits STS2 to STS0 in SYSCR and bits DIV1 and DIV0 in DIVCR should be set as follows.
Crystal Resonator: Set STS2 to STS0, DIV1, and DIV0 so that the waiting time (for the clock to
stabilize) is at least 7 ms. Table 20.3 indicates the waiting times that are selected by STS2 to
STS0, DIV1, and DIV0 settings at various system clock frequencies.
External Clock: Set STS2 to STS0, DIV1, and DIV0 so that the waiting time is at least 100 µs.
Table 20.3 Clock Frequency and Waiting Time for Clock to Settle
DIV1 DIV0 STS2 STS1 STS0 Waiting Time 25 MHz
0
0
1
1
0
1
0
1
20 MHz
18 MHz
16 MHz
12 MHz
10 MHz
Unit
0
0
0
8192 states
0.3
0.4
0.46
0.51
0.65
0.8
ms
0
0
1
16384 states
0.7
0.8
0.91
1.0
1.3
1.6
0
1
0
32768 states
1.3
1.6
1.8
2.0
2.7
3.3
0
1
1
65536 states
2.6
3.3
3.6
4.1
5.5
6.6
1
0
0
131072 states 5.2
6.6
7.3*
8.2*
10.9*
13.1*
1
0
1
262144 states 10.5*
13.1*
14.6
16.4
21.8
26.2
1
1
0
1024 states
0.05
0.057
0.064
0.085
0.10
1
1
1
0
0
0
8192 states
0.7
0.8
0.91
1.02
1.4
1.6
0
0
1
16384 states
1.3
1.6
1.8
2.0
2.7
3.3
0
1
0
32768 states
2.6
3.3
3.6
4.1
5.5
6.6
0
1
1
65536 states
5.2
6.6
7.3*
8.2*
10.9*
13.1*
1
0
0
131072 states 10.5*
13.1*
14.6
16.4
21.8
26.2
1
0
1
262144 states 21.0
26.2
29.1
32.8
43.7
52.4
1
1
0
1024 states
0.10
0.11
0.13
0.17
0.20
1
1
1
0
0
0
8192 states
1.3
1.6
1.8
2.0
2.7
3.3
0
0
1
16384 states
2.6
3.3
3.6
4.1
5.5
6.6
0.04
Illegal setting
0.08
ms
Illegal setting
0
1
0
32768 states
5.2
6.6
7.3*
8.2*
10.9*
13.1*
0
1
1
65536 states
10.5*
13.1*
14.6
16.4
21.8
26.2
1
0
0
131072 states 21.0
26.2
29.1
32.8
43.7
52.4
1
0
1
262144 states 41.9
52.4
58.3
65.5
87.4
104.9
1
1
0
1024 states
0.20
0.23
0.26
0.34
0.41
1
1
1
0
0
0
8192 states
2.6
3.3
3.6
4.1
5.5
6.6
0
0
1
16384 states
5.2
6.6
7.3*
8.2*
10.9*
13.1*
0.16
ms
Illegal setting
0
1
0
32768 states
10.5
13.1*
14.6
16.4
21.8
26.2
0
1
1
65536 states
21.0*
26.2
29.1
32.8
43.7
52.4
1
0
0
131072 states 41.9
52.4
58.3
65.5
87.4
104.9
1
0
1
262144 states 83.9
104.9
116.5
131.1
174.8
209.7
1
1
0
1024 states
0.41
0.46
0.51
0.68
0.82
1
1
1
* : Recommended setting
Rev. 2.0, 06/04, page 706 of 980
0.33
Illegal setting
ms
20.4.4
Sample Application of Software Standby Mode
Figure 20.1 shows an example in which software standby mode is entered at the fall of NMI and
exited at the rise of NMI.
With the NMI edge select bit (NMIEG) cleared to 0 in SYSCR (selecting the falling edge), an
NMI interrupt occurs. Next the NMIEG bit is set to 1 (selecting the rising edge) and the SSBY bit
is set to 1; then the SLEEP instruction is executed to enter software standby mode.
Software standby mode is exited at the next rising edge of the NMI signal.
Clock
oscillator
φ
NMI
NMIEG
SSBY
NMI interrupt
handler
NMIEG = 1
SSBY = 1
Software standby
mode (powerdown state)
Oscillator
settling time
(tosc2)
NMI exception
handling
SLEEP
instruction
Figure 20.1 NMI Timing for Software Standby Mode (Example)
20.4.5
Note
The I/O ports retain their existing states in software standby mode. If a port is in the high output
state, its output current is not reduced.
Rev. 2.0, 06/04, page 707 of 980
20.5
Hardware Standby Mode
20.5.1
Transition to Hardware Standby Mode
Regardless of its current state, the chip enters hardware standby mode whenever the STBY pin
goes low. Hardware standby mode reduces power consumption drastically by halting all functions
of the CPU, DMAC, DRAM interface, and on-chip supporting modules. All modules are reset
except the on-chip RAM. As long as the specified voltage is supplied, on-chip RAM data is
retained. I/O ports are placed in the high-impedance state.
Clear the RAME bit to 0 in SYSCR before STBY goes low to retain on-chip RAM data.
The inputs at the mode pins (MD2 to MD0) should not be changed during hardware standby
mode.
Note : Do not select the hardware standby mode during the reset period following power-on.
20.5.2
Exit from Hardware Standby Mode
Hardware standby mode is exited by inputs at the STBY and RES pins. While RES is low, when
STBY goes high, the clock oscillator starts running. RES should be held low long enough for the
clock oscillator to settle. When RES goes high, reset exception handling begins, followed by a
transition to the program execution state.
20.5.3
Timing for Hardware Standby Mode
Figure 20.2 shows the timing relationships for hardware standby mode. To enter hardware standby
mode, first drive RES low, then drive STBY low. To exit hardware standby mode, first drive
STBY high, wait for the clock to settle, then bring RES from low to high.
Rev. 2.0, 06/04, page 708 of 980
Clock
oscillator
RES
STBY
Oscillator
settling time
Reset
exception
handling
Figure 20.2 Hardware Standby Mode Timing
20.5.4 Timing for Hardware Standby Mode at Power-On
Figure 20.3 shows the timing relationships for entering hardware standby mode when the power is
turned on.
To make a transition to hardware standby mode when the power is turned on, hold the RES pin
low for the stipulated time while keeping the STBY pin high. After the reset is cleared, set the
STBY pin low.
For details on exiting hardware standby mode, see section 20.5.3, Timing for Hardware Standby
Mode.
Power
supply
RES
Reset period
STBY
Hardware standby
mode
Figure 20.3 Timing for Hardware Standby Mode at Power-On
Rev. 2.0, 06/04, page 709 of 980
20.6
Module Standby Function
20.6.1
Module Standby Timing
The module standby function can halt several of the on-chip supporting modules (SCI2, SCI1,
SCI0, the DMAC, 16-bit timer, 8-bit timer, DRAM interface, and A/D converter) independently in
the power-down state. This standby function is controlled by bits MSTPH2 to MSTPH0 in
MSTCRH and bits MSTPL7 to MSTPL0 in MSTCRL. When one of these bits is set to 1, the
corresponding on-chip supporting module is placed in standby and halts at the beginning of the
next bus cycle after the MSTCR write cycle.
20.6.2
Read/Write in Module Standby
When an on-chip supporting module is in module standby, read/write access to its registers is
disabled. Read access always results in H'FF data. Write access is ignored.
20.6.3
Usage Notes
When using the module standby function, note the following points.
DMAC: When setting a bit in MSTCR to 1 to place the DMAC in module standby, make sure that
the DMAC is not currently requesting the bus right. If the corresponding bit in MSTCR is set to 1
when a bus request is present, operation of the bus arbiter becomes ambiguous and a malfunction
may occur.
DRAM Interface: When the module standby function is used on the DRAM interface, set the
MSTCR bit to 1 while DRAM space is deselected.
On-Chip Supporting Module Interrupts: Before setting a module standby bit, first disable
interrupts by that module. When an on-chip supporting module is placed in standby by the module
standby function, its registers are initialized, including registers with interrupt request flags.
Pin States: Pins used by an on-chip supporting module lose their module functions when the
module is placed in module standby. What happens after that depends on the particular pin. For
details, see section 8, I/O Ports. Pins that change from the input to the output state require special
care. For example, if SCI1 is placed in module standby, the receive data pin loses its receive data
function and becomes a port pin. If its port DDR bit is set to 1, the pin becomes a data output pin,
and its output may collide with external SCI transmit data. Data collision should be prevented by
clearing the port DDR bit to 0 or taking other appropriate action.
Register Resetting: When an on-chip supporting module is halted by the module standby
function, all its registers are initialized. To restart the module, after its MSTCR bit is cleared to 0,
its registers must be set up again. It is not possible to write to the registers while the MSTCR bit is
set to 1.
Rev. 2.0, 06/04, page 710 of 980
MSTCR Access from DMAC Disabled: To prevent malfunctions, MSTCR can only be accessed
from the CPU. It can be read by the DMAC, but it cannot be written by the DMAC.
20.7
System Clock Output Disabling Function
Output of the system clock (φ) can be controlled by the PSTOP bit in MSTCRH. When the
PSTOP bit is set to 1, output of the system clock halts and the φ pin is placed in the highimpedance state. Figure 20.4 shows the timing of the stopping and starting of system clock output.
When the PSTOP bit is cleared to 0, output of the system clock is enabled. Table 20.4 indicates
the state of the φ pin in various operating states.
MSTCRH write cycle
MSTCRH write cycle
(PSTOP = 1)
(PSTOP = 0)
T1
T2
T3
T1
T2
T3
φ pin
High impedance
Figure 20.4 Starting and Stopping of System Clock Output
Table 20.4 φ Pin State in Various Operating States
Operating State
PSTOP = 0
PSTOP = 1
Hardware standby
High impedance
High impedance
Software standby
Always high
High impedance
Sleep mode
System clock output
High impedance
Normal operation
System clock output
High impedance
Rev. 2.0, 06/04, page 711 of 980
Rev. 2.0, 06/04, page 712 of 980
Section 21 Electrical Characteristics
21.1
Electrical Characteristics of HD64F3029F25 and HD64F3029TE25
21.1.1
Absolute Maximum Ratings
Table 21.1 lists the absolute maximum ratings.
Table 21.1 Absolute Maximum Ratings
Item
Symbol
Value
Unit
–0.3 to +4.6
V
Vin
–0.3 to VCC +0.3
V
Vin
–0.3 to VCC +0.3
V
Input voltage (port 7)
Vin
–0.3 to AVCC +0.3
V
Reference voltage
VREF
–0.3 to AVCC +0.3
V
Analog power supply voltage
AVCC
–0.3 to +4.6
V
Analog input voltage
VAN
–0.3 to AVCC +0.3
Power supply voltage
Input voltage (FWE)*
VCC*
2
Input voltage (except for port 7)*
2
1
Operating temperature
Topr
Regular specifications: –20 to +75*
Storage temperature
Tstg
–55 to +125
V
3
°C
°C
Caution: Permanent damage to the chip may result if absolute maximum ratings are exceeded.
Notes: *1 Do not apply the power supply voltage to the VCL pin. Connect an external capacitor
between this pin and GND.
*2 12 V must not be applied to any pin, as this may cause permanent damage to the
device.
*3 The operating temperature range for flash memory programming/erasing is Ta = 0 to
+75°C (Regular specifications).
Rev. 2.0, 06/04, page 713 of 980
21.1.2
DC Characteristics
Table 21.2 lists the DC characteristics. Table 21.3 lists the permissible output currents.
Table 21.2 DC Characteristics
1
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 to 3.6 V, VREF = 3.0 V to AVCC* ,
1
VSS = AVSS = 0 V* , Ta =–20°C to +75°C (Regular specifications),
[Programming/erasing conditions: Ta = 0°C to +75°C (Regular specifications)]
Item
Symbol
Schmitt trigger Port A,
input voltages P80 to P82
VT
–
Input low
voltage
STBY, RES,
NMI, MD2 to
MD0, FWE
Typ
Max
Unit
VCC × 0.2
—
—
V
—
—
VCC × 0.7
V
VT – VT
VCC × 0.05 —
—
V
VIH
VCC × 0.9
VCC + 0.3
V
V
+
VT
+
Input high
voltage
Min
–
—
EXTAL
VCC × 0.7
—
VCC + 0.3
Port 7
VCC × 0.7
—
AVCC + 0.3 V
Ports 1 to 6,
P83, P84, P90 to
P95, port B
VCC × 0.7
—
VCC + 0.3
V
–0.3
—
VCC × 0.1
V
–0.3
—
VCC × 0.2
V
STBY, RES,
FWE, MD2 to
MD0
VIL
NMI, EXTAL,
ports 1 to 7,
P83, P84, P90 to
P95, port B
Output high
voltage
All output pins
Output low
voltage
All output pins
VOH
VOL
Ports 1, 2,
and 5
Input leakage STBY, RES,
current
NMI, FWE,
MD2 to MD0
|Iin|
Port 7
Rev. 2.0, 06/04, page 714 of 980
Test
Conditions
VCC – 0.5
—
—
V
IOH = –200 µA
VCC – 1.0
—
—
V
IOH = –1 mA
—
—
0.4
V
IOL = 1.6 mA
—
—
1.0
V
IOL = 5 mA
—
—
1.0
µA
Vin = 0.5 V to
VCC – 0.5 V
—
—
1.0
µA
Vin = 0.5 V to
AVCC – 0.5 V
Item
Symbol
Min
Typ
Max
Unit
Test
Conditions
Three-state
leakage
current
Ports 1 to 6,
Ports 8 to B
|ITSI|
—
—
1.0
µA
Vin = 0.5 V to
VCC – 0.5 V
Input pull-up
MOS current
Ports 2, 4,
and 5
–Ip
10
—
300
µA
Vin = 0 V
Input
capacitance
FWE
Cin
—
—
80
pF
NMI
—
—
50
pF
Vin = 0 V,
f = fmin,
Ta = 25°C
All input pins
except NMI
—
—
15
pF
—
20(3.3V)
38
mA
f = 25 MHz
Sleep mode
—
17(3.3V)
35
mA
f = 25 MHz
Module
standby mode
—
16(3.3V)
34
mA
f = 25 MHz
Standby mode
—
15(3.3V)
70
µA
Ta ≤ 50°C
—
—
100
µA
50°C < Ta
—
30(3.3V)
48
mA
f = 25 MHz
(reference
values)
—
0.6
1.5
mA
During A/D
and D/A
conversion
—
0.6
1.5
mA
Idle
—
0.02(3.3V) 5.0
µA
Ta ≤ 50°C
at DASTE = 0
—
—
µA
50°C < Ta
at DASTE = 0
Current
2
dissipation*
Normal
operation
ICC*
3
Flash memory
programming/
4
erasing*
Analog power During A/D
supply current conversion
AICC
15
Rev. 2.0, 06/04, page 715 of 980
Item
Reference
current
During A/D
conversion
Symbol
Min
Typ
Max
Unit
AICC
—
0.25
0.8
mA
—
1.2
3.0
mA
During A/D
and D/A
conversion
Idle
RAM standby voltage
Normal
operation
VCL output
Voltage*
5
VCC start
Voltage*
—
0.02
5.0
µA
VRAM
3.0
—
—
V
VCL
1.5
1.9
2.3
V
Test
Conditions
DASTE = 0
VCC = 3.3V
Ta = 25°C
VCC START
—
0
0.8
V
SVCC
0.05
—
—
V/ms
6
VCC rise rate*
6
Notes: *1 If the A/D converter is not used, do not leave the AVCC, VREF, and AVSS pins open.
Connect AVCC and VREF to VCC, and connect AVSS to VSS.
*2 Current dissipation values are for VIH min = VCC – 0.5 V and VIL max = 0.5 V with all
output pins unloaded and the on-chip MOS pull-up transistors in the off state.
*3 ICC max. (normal operation) = 11 (mA) + 0.13 (mA/(MHz × V)) × VCC × f
ICC max. (sleep mode)
= 11 (mA) + 0.11 (mA/(MHz × V)) × VCC × f
ICC max. (sleep mode + module standby mode)
= 11 (mA) + 0.10 (mA/(MHz × V)) × VCC × f
The Typ values for power consumption are reference values.
*4 Sum of current dissipation in normal operation and current dissipation in program/erase
operations.
*5 This value is applied when the external capacitor of 0.1 µF is connected. This
characteristic does not specify the permissible range of voltage input from the external
circuit but specifies the voltage output by the LSI.
*6 These characteristics are applied under the condition in which the RES pin goes low
when powering on.
Rev. 2.0, 06/04, page 716 of 980
Table 21.3 Permissible Output Currents
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V,
Ta = –20°C to +75°C (Regular specifications)
Item
Permissible output
low current (per pin)
Ports 1, 2, and 5
Other output pins
Permissible output
low current (total)
Total of 20 pins in
Ports 1, 2, and 5
Symbol
Min
Typ
Max
Unit
IOL
—
—
10
mA
—
—
2.0
mA
—
—
80
mA
—
—
120
mA
ΣIOL
Total of all output pins,
including the above
Permissible output
high current (per pin)
All output pins
| –IOH |
—
—
2.0
mA
Permissible output
high current (total)
Total of all output pins
| –ΣIOH |
—
—
40
mA
Notes: 1. To protect chip reliability, do not exceed the output current values in table 21.3.
2. When directly driving a darlington pair or LED, always insert a current-limiting resistor
in the output line, as shown in figures 21.1 and 21.2.
H8/3029F-ZTAT
2 kΩ
Port
Darlington pair
Figure 21.1 Darlington Pair Drive Circuit (Example)
Rev. 2.0, 06/04, page 717 of 980
H8/3029F-ZTAT
600 Ω
Ports 1, 2, 5
LED
Figure 21.2 Sample LED Circuit
Rev. 2.0, 06/04, page 718 of 980
21.1.3
AC Characteristics
Clock timing parameters are listed in table 21.4, control signal timing parameters in table 21.5,
and bus timing parameters in table 21.6. Timing parameters of the on-chip supporting modules are
listed in table 21.7.
Table 21.4 Clock Timing
Condition:
Ta = –20°C to +75°C (Regular specifications),
VCC = 3.0 V to 3.6 V, ACCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V,
fmax = 25 MHz
Item
Symbol
Min
Max
Unit
Test
Conditions
Clock cycle time
tcyc
40
100
ns
Figure 21.13
Clock pulse low width
tCL
10
—
ns
Clock pulse high width
tCH
10
—
ns
Clock rise time
tCr
—
10
ns
Clock fall time
tCf
—
10
ns
Clock oscillator settling
time at reset
tOSC1
20
—
ms
Figure 21.10
7
—
ms
Figure 20.1
Clock oscillator settling tOSC2
time in software standby
Table 21.5 Control Signal Timing
Conditions: Ta = –20°C to +75°C (Regular specifications),
VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V,
fmax = 25 MHz
Item
Symbol
Min
Max
Unit
Test
Conditions
RES setup time
tRESS
150
—
ns
Figure 21.11
RES pulse width
tRESW
20
—
tcyc
Mode programming setup
time
tMDS
200
—
ns
NMI, IRQ setup time
tNMIS
150
—
ns
NMI, IRQ hold time
tNMIH
10
—
ns
NMI, IRQ pulse width
tNMIW
200
—
ns
Figure 21.12
Rev. 2.0, 06/04, page 719 of 980
Table 21.6 Bus Timing
Conditions: Ta = –20°C to +75°C (Regular specifications),
VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V,
fmax = 25 MHz
Item
Symbol
Min
Max
Unit
Test
Conditions
Address delay time
tAD
—
25
ns
Figure 21.13,
Address hold time
tAH
0.5 tcyc – 20
—
ns
Figure 21.14,
Read strobe delay time
tRSD
—
25
ns
Figure 21.16,
Address strobe delay
time
tASD
—
25
ns
Figure 21.17,
Write strobe delay time
tWSD
—
25
ns
Strobe delay time
tSD
—
25
ns
Write strobe pulse
width 1
tWSW1
1.0 tcyc – 25
—
ns
Write strobe pulse
width 2
tWSW2
1.5 tcyc – 25
—
ns
Address setup time 1
tAS1
0.5 tcyc – 20
—
ns
Figure 21.19
Address setup time 2
tAS2
1.0 tcyc – 20
—
ns
Read data setup time
tRDS
25
—
ns
Read data hold time
tRDH
0
—
ns
Write data delay time
tWDD
—
35
ns
Write data setup time 1
tWDS1
1.0 tcyc– 30
—
ns
Write data setup time 2
tWDS2
2.0 tcyc– 30
—
ns
Write data hold time
tWDH
0.5 tcyc– 15
—
ns
Rev. 2.0, 06/04, page 720 of 980
Item
Symbol
Min
Max
Unit
Read data access
time 1
tACC1
—
2.0 tcyc– 45
ns
Read data access
time 2
tACC2
—
3.0 tcyc – 45
ns
Read data access
time 3
tACC3
—
1.5 tcyc – 45
ns
Read data access
time 4
tACC4
—
2.5 tcyc – 45
ns
Precharge time 1
tPCH1
1.0 tcyc – 20
—
ns
Precharge time 2
tPCH2
0.5 tcyc – 20
—
ns
Wait setup time
tWTS
25
—
ns
Wait hold time
tWTH
5
—
ns
Bus request setup time
tBRQS
25
—
ns
Bus acknowledge delay
time 1
tBACD1
—
30
ns
Bus acknowledge delay
time 2
tBACD2
—
30
ns
Bus-floating time
tBZD
—
30
ns
RAS precharge time
tRP
1.5 tcyc – 25
—
ns
CAS precharge time
tCP
0.5 tcyc – 15
—
ns
Low address hold time
tRAH
0.5 tcyc – 15
—
ns
RAS delay time 1
tRAD1
—
25
ns
RAS delay time 2
tRAD2
—
30
ns
CAS delay time 1
tCASD1
—
25
ns
CAS delay time 2
tCASD2
—
25
ns
WE delay time
tWCD
—
25
ns
Test
Conditions
Figure 21.13,
Figure 21.14,
Figure 21.16,
Figure 21.17
Figure 21.15
Figure 21.18
Figure 21.19
to
Figure 21.20
Rev. 2.0, 06/04, page 721 of 980
Item
Symbol
Min
Max
Unit
CAS pulse width 1
tCAS1
1.5 tcyc – 20
—
ns
CAS pulse width 2
tCAS2
1.0 tcyc – 20
—
ns
CAS pulse width 3
tCAS3
1.0 tcyc – 20
—
ns
RAS access time
tRAC
—
2.5 tcyc – 40
ns
Address access time
tAA
—
2.0 tcyc – 50
ns
CAS access time
tCAC
—
1.5 tcyc – 50
ns
WE setup time
tWCS
0.5 tcyc – 20
—
ns
WE hold time
tWCH
0.5 tcyc – 15
—
ns
Write data setup time
tWDS
0.5 tcyc – 20
—
ns
WE write data hold time
tWDH
0.5 tcyc – 15
—
ns
CAS setup time 1
tCSR1
0.5 tcyc – 20
—
ns
CAS setup time 2
tCSR2
0.5 tcyc – 15
—
ns
CAS hold time
tCHR
0.5 tcyc – 15
—
ns
RAS pulse width
tRAS
1.5 tcyc – 15
—
ns
Signal rising time
(all input pins except for
EXTAL)
tSR
—
100
ns
Signal falling time
(all input pins except for
EXTAL)
tSF
—
100
ns
Test
Conditions
Figure 21.19
to
Figure 21.21
Figure 21.30
Note: In order to secure the address hold time relative to the rise of the RD strobe, address
update mode 2 should be used. For details see section 6.3.5, Address Output Method.
Rev. 2.0, 06/04, page 722 of 980
Table 21.7 Timing of On-Chip Supporting Modules
Conditions: Ta = –20°C to +75°C (Regular specifications),
VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V,
fmax = 25 MHz
Module Item
Symbol
Min
Max
Unit
Test
Conditions
Ports
and
TPC
Output data
delay time
tPWD
—
50
ns
Figure 21.22
Input data setup
time
tPRS
50
—
ns
Input data hold
time
tPRH
50
—
ns
Timer output
delay time
tTOCD
—
50
ns
Timer input
setup time
tTICS
50
—
ns
Timer clock
input setup time
tTCKS
50
—
ns
Timer
clock
pulse
width
Single
edge
tTCKWH
1.5
—
tcyc
Both
edges
tTCKWL
2.5
—
tcyc
Timer output
delay time
tTOCD
—
50
ns
Timer input
setup time
tTICS
50
—
ns
Timer clock
input setup time
tTCKS
50
—
ns
Timer
clock
pulse
width
Single
edge
tTCKWH
1.5
—
tcyc
Both
edges
tTCKWL
2.5
—
tcyc
16-bit
timer
8-bit
timer
Figure 21.23
Figure 21.24
Figure 21.23
Figure 21.24
Rev. 2.0, 06/04, page 723 of 980
Min
Max
Unit
Test
Conditions
AsyntScyc
chronous
4
—
tcyc
Figure 21.25
Synchronous
6
—
tcyc
Module Item
SCI
DMAC
Input
clock
cycle
Symbol
Input clock rise
time
tSCKr
—
1.5
tcyc
Input clock fall
time
tSCKf
—
1.5
tcyc
Input clock
pulse width
tSCKW
0.4
0.6
tScyc
Transmit data
delay time
tTXD
—
100
ns
Receive data
setup time
(synchronous)
tRXS
100
—
ns
Receive
data hold
time (synchronous)
tRXH
100
—
ns
0
—
ns
Clock
input
Clock
output
Figure 21.26
TEND delay time 1 tTED1
—
50
ns
TEND delay time 2 tTED2
—
50
ns
Figure 21.27,
Figure 21.28
DREQ setup time
tDRQS
25
—
ns
Figure 21.29
DREQ hold time
tDRQH
10
—
ns
RL
H8/3029F-ZTAT
output pin
C = 90 pF: Ports 4, 6, 8
A19 to A0, D15 to D8
C = 30 pF: Ports 9, A, B
R L = 2.4 k Ω
R H = 12 k Ω
C
RH
Input/output timing measurement
levels
• Low: Vcc 0.2 V
• High: Vcc 0.7 V
Figure 21.3 Output Load Circuit
Rev. 2.0, 06/04, page 724 of 980
21.1.4
A/D Conversion Characteristics
Table 21.8 lists the A/D conversion characteristics.
Table 21.8 A/D Conversion Characteristics
Conditions: Ta = –20°C to +75°C (Regular specifications),
VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V,
fmax = 25 MHz
Item
Min
Typ
Max
Unit
ConverResolution
sion time: Conversion time (single
134 states mode)
10
10
10
bits
5.36
—
—
µs
Analog input capacitance
—
—
20
pF
Permissible φ ≤ 13 MHz
signal-source
impedance
φ> 13 MHz
—
—
10
kΩ
—
—
5
kΩ
Nonlinearity error
—
—
±3.5
LSB
Offset error
—
—
±3.5
LSB
Full-scale error
—
—
±3.5
LSB
Quantization error
—
—
±0.5
LSB
Absolute accuracy
—
—
±4.0
LSB
Item
Min
Typ
Max
Unit
ConverResolution
sion time*: Conversion time (single
70 states mode)
10
10
10
bits
5.38
—
—
µs
Analog input capacitance
—
—
20
pF
Permissible signal-source
impedance
—
—
5
kΩ
Nonlinearity error
—
—
±7.5
LSB
Offset error
—
—
±7.5
LSB
Note:
*
Full-scale error
—
—
±7.5
LSB
Quantization error
—
—
±0.5
LSB
Absolute accuracy
—
—
±8.0
LSB
When using an operating frequency above f = 70 (state) /5.38 (µs) = 13.0 (MHz), do not
select 70-state conversion time.
Rev. 2.0, 06/04, page 725 of 980
21.1.5
D/A Conversion Characteristics
Table 21.9 lists the D/A conversion characteristics.
Table 21.9 D/A Conversion Characteristics
Conditions: Ta = –20°C to +75°C (Regular specifications),
VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V,
fmax = 25 MHz
Item
Min
Typ
Max
Unit
Resolution
8
8
8
bits
Conversion time
(centering time)
—
—
10
µs
20 pF capacitive
load
Absolute accuracy*
—
±2.0
±3.0
LSB
2 MΩ resistive
load
—
—
±2.0
LSB
4 MΩ resistive
load
Note:
*
Except in software standby mode.
Rev. 2.0, 06/04, page 726 of 980
Test Conditions
21.1.6
Flash Memory Characteristics
Table 21.10 shows the flash memory characteristics.
Table 21.10 Flash Memory Characteristics
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VSS = AVSS = 0 V,
Ta = 0°C to +75°C (operating temperature range for programming/erasing :
Regular specifications)
Item
Symbol Min
1,
2,
Programming time* * *
4
Erase time*1, *2, *4
Typ
Max
Unit
tP
—
3
30
ms/128 bytes
tE
—
80
800
ms/4-kbyte
blocks
—
500
5000
ms/32-kbyte
blocks
—
1000
10000 ms/64-kbyte
blocks
Programming time (total)*1, *2, *4
ΣtP
—
10
30
s/512
kbytes
Erase time (total)*1, *2, *4
ΣtE
—
10
30
s/512
kbytes
Programming and erase time (total)*1, *2, *4 ΣtPE
—
20
60
s/512
kbytes
Reprogramming count
NWEC
100*3 —
—
times
tDRP
10
—
year
Data retention time*
4
—
Notes
Ta = 25°C,
(when data is all 0)
Ta = 25°C
Ta = 25°C
Notes: *1 Programming time and erase time depend on data.
*2 Programming time and erase time do not include the data transfer time.
*3 Minimum value when all characteristics after reprogramming are guaranteed (the
characteristics are guaranteed while the reprogramming count is from one to the
minimum reprogramming count).
*4 Characteristics when the flash memory is rewritten within the minimum reprogramming
count.
Rev. 2.0, 06/04, page 727 of 980
21.2
Electrical Characteristics of HD64F3029F25W and
HD64F3029TE25W
21.2.1
Absolute Maximum Ratings
Table 21.11 lists the absolute maximum ratings.
Table 21.11 Absolute Maximum Ratings
Item
Symbol
Power supply voltage
VCC*
1
Value
Unit
–0.3 to +4.6
V
Vin
–0.3 to VCC +0.3
V
Vin
–0.3 to VCC +0.3
V
Input voltage (port 7)
Vin
–0.3 to AVCC +0.3
V
Reference voltage
VREF
–0.3 to AVCC +0.3
V
Analog power supply voltage
AVCC
–0.3 to +4.6
V
Analog input voltage
VAN
–0.3 to AVCC +0.3
Input voltage (FWE)*
2
Input voltage (except for port 7)*
2
Operating temperature
Topr
Wide-range specifications: –40 to +85*
Storage temperature
Tstg
–55 to +125
V
3
°C
°C
Caution: Permanent damage to the chip may result if absolute maximum ratings are exceeded.
Notes: *1 Do not apply the power supply voltage to the VCL pin. Connect an external capacitor
between this pin and GND.
*2 12 V must not be applied to any pin, as this may cause permanent damage to the
device.
*3 The operating temperature range for flash memory programming/erasing is Ta = 0 to
+85°C (Wide-range specifications).
Rev. 2.0, 06/04, page 728 of 980
21.2.2
DC Characteristics
Table 21.12 lists the DC characteristics. Table 21.13 lists the permissible output currents.
Table 21.12 DC Characteristics
1
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC* ,
1
VSS = AVSS = 0 V* , Ta =–40°C to +85°C (Wide-range specifications),
[Programming/erasing conditions: Ta = 0°C to +85°C (Wide-range specifications)]
Item
Symbol
Schmitt trigger Port A,
input voltages P80 to P82
VT
–
Input low
voltage
STBY, RES,
NMI, MD2 to
MD0, FWE
Typ
Max
Unit
VCC × 0.2
—
—
V
—
—
VCC × 0.7
V
VT – VT
VCC × 0.05 —
—
V
VIH
VCC × 0.9
VCC + 0.3
V
V
+
VT
+
Input high
voltage
Min
–
—
EXTAL
VCC × 0.7
—
VCC + 0.3
Port 7
VCC × 0.7
—
AVCC + 0.3 V
Ports 1 to 6,
P83, P84, P90 to
P95, port B
VCC = 0.7
—
VCC + 0.3
V
–0.3
—
VCC × 0.1
V
–0.3
—
VCC × 0.2
V
STBY, RES,
FWE, MD2 to
MD0
VIL
NMI, EXTAL,
ports 1 to 7,
P83, P84, P90 to
P95, port B
Output high
voltage
All output pins
Output low
voltage
All output pins
VOH
VOL
Ports 1, 2,
and 5
Input leakage STBY, RES,
current
NMI, FWE,
MD2 to MD0
Port 7
|Iin|
Test
Conditions
VCC – 0.5
—
—
V
IOH = –200 µA
VCC – 1.0
—
—
V
IOH = –1 mA
—
—
0.4
V
IOL = 1.6 mA
—
—
1.0
V
IOL = 5 mA
—
—
1.0
µA
Vin = 0.5 V to
VCC – 0.5 V
—
—
1.0
µA
Vin = 0.5 V to
AVCC – 0.5 V
Rev. 2.0, 06/04, page 729 of 980
Item
Symbol
Min
Typ
Max
Unit
Test
Conditions
Three-state
leakage
current
Ports 1 to 6,
Ports 8 to B
|ITSI|
—
—
1.0
µA
Vin = 0.5 V to
VCC – 0.5 V
Input pull-up
MOS current
Ports 2, 4,
and 5
–Ip
10
—
300
µA
Vin = 0 V
Input
capacitance
FWE
Cin
—
—
80
pF
NMI
—
—
50
pF
Vin = 0 V,
f = fmin,
Ta = 25°C
All input pins
except NMI
—
—
15
pF
—
2.0(3.3V)
38
mA
f = 25 MHz
Sleep mode
—
17(3.3V)
35
mA
f = 25 MHz
Module
standby mode
—
16(3.3V)
34
mA
f = 25 MHz
Standby mode
—
15(3.3V)
70
µA
Ta ≤ 50°C
—
—
100
µA
50°C < Ta
—
30(3.3V)
48
mA
f = 25 MHz
(reference
values)
—
0.6
1.5
mA
During A/D
and D/A
conversion
—
0.6
1.5
mA
Idle
—
0.02(3.3V) 5.0
µA
Ta ≤ 50°C
at DASTE = 0
—
—
µA
50°C < Ta
at DASTE = 0
Current
2
dissipation*
Normal
operation
ICC*
3
Flash memory
programming/
4
erasing*
Analog power During A/D
supply current conversion
AICC
Rev. 2.0, 06/04, page 730 of 980
15
Item
Reference
current
During A/D
conversion
Symbol
Min
Typ
Max
Unit
AICC
—
0.25
0.8
mA
—
1.2
3.0
mA
During A/D
and D/A
conversion
Idle
RAM standby voltage
Normal
operation
VCL output
voltage*
5
VCC start
Voltage*
—
0.02
5.0
µA
VRAM
3.0
—
—
V
VCL
1.5
1.9
2.3
V
Test
Conditions
DASTE = 0
VCC = 3.3V
Ta = 25°C
VCC START
—
0
0.8
V
SVCC
0.05
—
—
V/ms
6
VCC rise rate*
6
Notes: *1 If the A/D converter is not used, do not leave the AVCC, VREF, and AVSS pins open.
Connect AVCC and VREF to VCC, and connect AVSS to VSS.
*2 Current dissipation values are for VIH min = VCC – 0.5 V and VIL max = 0.5 V with all
output pins unloaded and the on-chip MOS pull-up transistors in the off state.
*3 ICC max. (normal operation) = 11 (mA) + 0.13 (mA/(MHz × V)) × VCC × f
ICC max. (sleep mode)
= 11 (mA) + 0.11 (mA/(MHz × V)) × VCC × f
ICC max. (sleep mode + module standby mode)
= 11 (mA) + 0.10 (mA/(MHz × V)) × VCC × f
The Typ values for power consumption are reference values.
*4 Sum of current dissipation in normal operation and current dissipation in program/erase
operations.
*5 This value is applied when the external capacitor of 0.1 µF is connected. This
characteristic does not specify the permissible range of voltage input from the external
circuit but specifies the voltage output by the LSI.
*6 These characteristics are applied under the condition in which the RES pin goes low
when powering on.
Rev. 2.0, 06/04, page 731 of 980
Table 21.13 Permissible Output Currents
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V,
Ta = –40°C to +85°C (Wide-range specifications),
Item
Permissible output
low current (per pin)
Ports 1, 2, and 5
Other output pins
Permissible output
low current (total)
Total of 20 pins in
Ports 1, 2, and 5
Symbol
Min
Typ
Max
Unit
IOL
—
—
10
mA
—
—
2.0
mA
—
—
80
mA
—
—
120
mA
ΣIOL
Total of all output pins,
including the above
Permissible output
high current (per pin)
All output pins
| –IOH |
—
—
2.0
mA
Permissible output
high current (total)
Total of all output pins
| –ΣIOH |
—
—
40
mA
Notes: 1. To protect chip reliability, do not exceed the output current values in table 21.13.
2. When directly driving a darlington pair or LED, always insert a current-limiting resistor
in the output line, as shown in figures 21.4 and 21.5.
H8/3029F-ZTAT
2 kΩ
Port
Darlington pair
Figure 21.4 Darlington Pair Drive Circuit (Example)
Rev. 2.0, 06/04, page 732 of 980
H8/3029F-ZTAT
600 Ω
Ports 1, 2, 5
LED
Figure 21.5 Sample LED Circuit
Rev. 2.0, 06/04, page 733 of 980
21.2.3
AC Characteristics
Clock timing parameters are listed in table 21.14, control signal timing parameters in table 21.15,
and bus timing parameters in table 21.16. Timing parameters of the on-chip supporting modules
are listed in table 21.17.
Table 21.14 Clock Timing
Condition:
Ta = –40°C to +85°C (Wide-range specifications),
VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V,
fmax = 25 MHz
Item
Symbol
Min
Max
Unit
Test
Conditions
Clock cycle time
tcyc
40
100
ns
Figure 21.13
Clock pulse low width
tCL
10
—
ns
Clock pulse high width
tCH
10
—
ns
Clock rise time
tCr
—
10
ns
Clock fall time
tCf
—
10
ns
Clock oscillator settling
time at reset
tOSC1
20
—
ms
Figure 21.10
7
—
ms
Figure 20.1
Clock oscillator settling tOSC2
time in software standby
Table 21.15 Control Signal Timing
Conditions: Ta = –40°C to +85°C (Wide-range specifications),
VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V,
fmax = 25 MHz
Item
Symbol
Min
Max
Unit
Test
Conditions
RES setup time
tRESS
150
—
ns
Figure 21.11
RES pulse width
tRESW
20
—
tcyc
Mode programming setup
time
tMDS
200
—
ns
NMI, IRQ setup time
tNMIS
150
—
ns
NMI, IRQ hold time
tNMIH
10
—
ns
NMI, IRQ pulse width
tNMIW
200
—
ns
Rev. 2.0, 06/04, page 734 of 980
Figure 21.12
Table 21.16 Bus Timing
Conditions: Ta = –40°C to +85°C (Wide-range specifications),
VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V,
fmax = 25 MHz
Item
Symbol
Min
Max
Unit
Test
Conditions
Address delay time
tAD
—
25
ns
Figure 21.13,
Address hold time
tAH
0.5 tcyc – 20
—
ns
Figure 21.14,
Read strobe delay time
tRSD
—
25
ns
Figure 21.16,
Address strobe delay
time
tASD
—
25
ns
Figure 21.17,
Write strobe delay time
tWSD
—
25
ns
Strobe delay time
tSD
—
25
ns
Write strobe pulse
width 1
tWSW1
1.0 tcyc – 25
—
ns
Write strobe pulse
width 2
tWSW2
1.5 tcyc – 25
—
ns
Address setup time 1
tAS1
0.5 tcyc – 20
—
ns
Figure 21.19
Address setup time 2
tAS2
1.0 tcyc – 20
—
ns
Read data setup time
tRDS
25
—
ns
Read data hold time
tRDH
0
—
ns
Write data delay time
tWDD
—
35
ns
Write data setup time 1
tWDS1
1.0 tcyc– 30
—
ns
Write data setup time 2
tWDS2
2.0 tcyc– 30
—
ns
Write data hold time
tWDH
0.5 tcyc– 15
—
ns
Rev. 2.0, 06/04, page 735 of 980
Item
Symbol
Min
Max
Unit
Read data access
time 1
tACC1
—
2.0 tcyc– 45
ns
Read data access
time 2
tACC2
—
3.0 tcyc – 45
ns
Read data access
time 3
tACC3
—
1.5 tcyc – 45
ns
Read data access
time 4
tACC4
—
2.5 tcyc – 45
ns
Precharge time 1
tPCH1
1.0 tcyc – 20
—
ns
Precharge time 2
tPCH2
0.5 tcyc – 20
—
ns
Wait setup time
tWTS
25
—
ns
Wait hold time
tWTH
5
—
ns
Bus request setup time
tBRQS
25
—
ns
Bus acknowledge delay
time 1
tBACD1
—
30
ns
Bus acknowledge delay
time 2
tBACD2
—
30
ns
Bus-floating time
tBZD
—
30
ns
RAS precharge time
tRP
1.5 tcyc – 25
—
ns
CAS precharge time
tCP
0.5 tcyc – 15
—
ns
Low address hold time
tRAH
0.5 tcyc – 15
—
ns
RAS delay time 1
tRAD1
—
25
ns
RAS delay time 2
tRAD2
—
30
ns
CAS delay time 1
tCASD1
—
25
ns
CAS delay time 2
tCASD2
—
25
ns
WE delay time
tWCD
—
25
ns
Rev. 2.0, 06/04, page 736 of 980
Test
Conditions
Figure 21.13,
Figure 21.14,
Figure 21.16,
Figure 21.17
Figure 21.15
Figure 21.18
Figure 21.19,
Figure 21.20
Item
Symbol
Min
Max
Unit
CAS pulse width 1
tCAS1
1.5 tcyc – 20
—
ns
CAS pulse width 2
tCAS2
1.0 tcyc – 20
—
ns
CAS pulse width 3
tCAS3
1.0 tcyc – 20
—
ns
RAS access time
tRAC
—
2.5 tcyc – 40
ns
Address access time
tAA
—
2.0 tcyc – 50
ns
CAS access time
tCAC
—
1.5 tcyc – 50
ns
WE setup time
tWCS
0.5 tcyc – 20
—
ns
WE hold time
tWCH
0.5 tcyc – 15
—
ns
Write data setup time
tWDS
0.5 tcyc – 20
—
ns
WE write data hold time
tWDH
0.5 tcyc – 15
—
ns
CAS setup time 1
tCSR1
0.5 tcyc – 20
—
ns
CAS setup time 2
tCSR2
0.5 tcyc – 15
—
ns
CAS hold time
tCHR
0.5 tcyc – 15
—
ns
RAS pulse width
tRAS
1.5 tcyc – 15
—
ns
Signal rising time
(all input pins except for
EXTAL)
tSR
—
100
ns
Signal falling time
(all input pins except for
EXTAL)
tSF
—
100
ns
Test
Conditions
Figure 21.19
to
Figure 21.21
Figure 21.30
Note: In order to secure the address hold time relative to the rise of the RD strobe, address
update mode 2 should be used. For details see section 6.3.5, Address Output Method.
Rev. 2.0, 06/04, page 737 of 980
Table 21.17 Timing of On-Chip Supporting Modules
Conditions: Ta = –40°C to +85°C (Wide-range specifications),
VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V,
fmax = 25 MHz
Module Item
Symbol
Min
Max
Unit
Test
Conditions
Ports
and
TPC
Output data
delay time
tPWD
—
50
ns
Figure 21.22
Input data setup
time
tPRS
50
—
ns
Input data hold
time
tPRH
50
—
ns
Timer output
delay time
tTOCD
—
50
ns
Timer input
setup time
tTICS
50
—
ns
Timer clock
input setup time
tTCKS
50
—
ns
Timer
clock
pulse
width
Single
edge
tTCKWH
1.5
—
tcyc
Both
edges
tTCKWL
2.5
—
tcyc
Timer output
delay time
tTOCD
—
50
ns
Timer input
setup time
tTICS
50
—
ns
Timer clock
input setup time
tTCKS
50
—
ns
Timer
clock
pulse
width
Single
edge
tTCKWH
1.5
—
tcyc
Both
edges
tTCKWL
2.5
—
tcyc
16-bit
timer
8-bit
timer
Rev. 2.0, 06/04, page 738 of 980
Figure 21.23
Figure 21.24
Figure 21.23
Figure 21.24
Min
Max
Unit
Test
Conditions
AsyntScyc
chronous
4
—
tcyc
Figure 21.25
Synchronous
6
—
tcyc
Module Item
SCI
DMAC
Input
clock
cycle
Symbol
Input clock rise
time
tSCKr
—
1.5
tcyc
Input clock fall
time
tSCKf
—
1.5
tcyc
Input clock
pulse width
tSCKW
0.4
0.6
tScyc
Transmit data
delay time
tTXD
—
100
ns
Receive data
setup time
(synchronous)
tRXS
100
—
ns
Receive
data hold
time (synchronous)
tRXH
100
—
ns
0
—
ns
Clock
input
Clock
output
Figure 21.26
TEND delay time 1 tTED1
—
50
ns
TEND delay time 2 tTED2
—
50
ns
Figure 21.27,
Figure 21.28
DREQ setup time
tDRQS
25
—
ns
Figure 21.29
DREQ hold time
tDRQH
10
—
ns
RL
H8/3029F-ZTAT
output pin
C = 90 pF: Ports 4, 6, 8
A19 to A0, D15 to D8
C = 30 pF: Ports 9, A, B
R L = 2.4 k Ω
R H = 12 k Ω
C
RH
Input/output timing measurement
levels
• Low: Vcc 0.2 V
• High: Vcc 0.7 V
Figure 21.6 Output Load Circuit
Rev. 2.0, 06/04, page 739 of 980
21.2.4
A/D Conversion Characteristics
Table 21.18 lists the A/D conversion characteristics.
Table 21.18 A/D Conversion Characteristics
Conditions: Ta = –40°C to +85°C (Wide-range specifications),
VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V,
fmax = 25 MHz
Item
Min
Typ
Max
Unit
ConverResolution
sion time: Conversion time (single
134 states mode)
10
10
10
bits
5.36
—
—
µs
Analog input capacitance
—
—
20
pF
Permissible φ ≤ 13 MHz
signal-source
impedance
φ > 13 MHz
—
—
10
kΩ
—
—
5
kΩ
Nonlinearity error
—
—
±3.5
LSB
Offset error
—
—
±3.5
LSB
Full-scale error
—
—
±3.5
LSB
Quantization error
—
—
±0.5
LSB
Absolute accuracy
—
—
±4.0
LSB
Item
Min
Typ
Max
Unit
ConverResolution
sion time*: Conversion time (single
70 states mode)
10
10
10
bits
5.38
—
—
µs
Analog input capacitance
—
—
20
pF
Permissible signal-source
impedance
—
—
5
kΩ
Nonlinearity error
—
—
±7.5
LSB
Offset error
—
—
±7.5
LSB
Note:
*
Full-scale error
—
—
±7.5
LSB
Quantization error
—
—
±0.5
LSB
Absolute accuracy
—
—
±8.0
LSB
When using an operating frequency above f = 70 (state) /5.38 (µs) = 13.0 (MHz), do not
select 70-state conversion time.
Rev. 2.0, 06/04, page 740 of 980
21.2.5
D/A Conversion Characteristics
Table 21.19 lists the D/A conversion characteristics.
Table 21.19 D/A Conversion Characteristics
Conditions: Ta = –40°C to +85°C (Wide-range specifications),
VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V,
fmax = 25 MHz
Item
Min
Typ
Max
Unit
Resolution
8
8
8
bits
Conversion time
(centering time)
—
—
10
µs
20 pF capacitive
load
Absolute accuracy*
—
±2.0
±3.0
LSB
2 MΩ resistive
load
—
—
±2.0
LSB
4 MΩ resistive
load
Note:
*
Test Conditions
Except in software standby mode.
Rev. 2.0, 06/04, page 741 of 980
21.2.6
Flash Memory Characteristics
Table 21.20 lists the flash memory characteristics.
Table 21.20 Flash Memory Characteristics (1)
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VSS = AVSS = 0 V, Ta = 0°C to +85°C
(operating temperature range for programming/erasing: Wide-range specifications)
Item
Symbol
Min
Typ
Max
Unit
Programming time*1, *2, *4
tP
—
3
30
ms/128 bytes
Erase time*1, *2, *4
tE
—
80
800
ms/4-kbyte
block
—
500
5000
ms/32-kbyte
block
—
1000
10000
ms/64-kbyte
block
Programming time (total)*1, *2, *4
ΣtP
—
10
30
s/512
kbytes
Erase time (total)*1, *2, *4
ΣtE
—
10
30
s/512
kbytes
Programming and erase time
(total)*1, *2, *4
ΣtPE
—
20
60
s/512
kbytes
Reprogramming count
NWEC
100*3
—
—
Times
tDRP
10
—
—
Year
Data retention time*
4
Test Conditions
Ta = 25°C,
when data is all 0.
Ta = 25°C
Ta = 25°C
Notes: *1 Programming time and Erase time depend on data.
*2 Programming time and Erase time do not include the data transfer time.
*3 Minimum value when all characteristics after reprogramming are guaranteed (the
characteristics are guaranteed while the reprogramming count is from one to the
minimum reprogramming count).
*4 Characteristics when the flash memory is rewritten within the minimum reprogramming
count.
Rev. 2.0, 06/04, page 742 of 980
21.3
Electrical Characteristics of HD64F3029FBL25 and
HD64F3029TEBL25
21.3.1
Absolute Maximum Ratings
Table 21.21 lists the absolute maximum ratings.
Table 21.21 Absolute Maximum Ratings
Item
Symbol
Power supply voltage
VCC*
1
Value
Unit
–0.3 to +4.6
V
Vin
–0.3 to VCC +0.3
V
Vin
–0.3 to VCC +0.3
V
Input voltage (port 7)
Vin
–0.3 to AVCC +0.3
V
Reference voltage
VREF
–0.3 to AVCC +0.3
V
Analog power supply voltage
AVCC
–0.3 to +4.6
V
Analog input voltage
VAN
–0.3 to AVCC +0.3
V
Operating temperature
Topr
°C
–20 to +75
3
(Standard characteristics specifications)*
Storage temperature
Tstg
–55 to +125
Input voltage (FWE)*
2
Input voltage (except for port 7)*
2
°C
Caution: Permanent damage to the chip may result if absolute maximum ratings are exceeded.
Notes: *1 Do not apply the power supply voltage to the VCL pin. Connect an external capacitor
between this pin and GND.
*2 12 V must not be applied to any pin, as this may cause permanent damage to the
device.
*3 The operating temperature range for flash memory programming/erasing is Ta = 0 to
+75°C (Standard characteristics specifications).
Rev. 2.0, 06/04, page 743 of 980
21.3.2
DC Characteristics
Table 21.22 lists the DC characteristics. Table 21.23 lists the permissible output currents.
Table 21.22 DC Characteristics
1
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC* ,
1
VSS = AVSS = 0 V* , Ta =–20°C to +75°C (Standard characteristics specifications),
[Programming/erasing conditions: Ta = 0°C to +75°C (Standard characteristics
specifications)]
Item
Symbol
Schmitt trigger Port A,
input voltages P80 to P82
VT
–
+
VT
Max
Unit
VCC × 0.2
—
—
V
—
—
VCC × 0.7
V
Test
Conditions
VT – VT
VCC × 0.05 —
—
V
VCC × 0.9
—
VCC + 0.3
V
VCC × 0.7
—
VCC + 0.3
V
Port 7
VCC × 0.7
—
AVCC + 0.3 V
Ports 1 to 6,
P83, P84, P90 to
P95, port B
VCC × 0.7
—
VCC + 0.3
V
–0.3
—
VCC × 0.1
V
–0.3
—
VCC × 0.2
V
VCC – 0.5
—
—
V
VCC – 1.0
—
—
V
IOH = –1 mA
—
—
0.4
V
IOL = 1.6 mA
—
—
1.0
V
IOL = 5 mA
—
—
1.0
µA
Vin = 0.5 V to
VCC – 0.5 V
—
—
1.0
µA
Vin = 0.5 V to
AVCC – 0.5 V
STBY, RES,
NMI, MD2 to
MD0, FWE
EXTAL
Input low
voltage
Typ
VIH
+
Input high
voltage
Min
STBY, RES,
FWE, MD2 to
MD0
VIL
NMI, EXTAL,
ports 1 to 7,
P83, P84, P90 to
P95, port B
Output high
voltage
All output pins
VOH
Output low
voltage
All output pins
VOL
Ports 1, 2,
and 5
Input leakage STBY, RES,
current
NMI, FWE,
MD2 to MD0
|Iin|
Port 7
Rev. 2.0, 06/04, page 744 of 980
–
IOH = –200 µA
Item
Symbol
Min
Typ
Max
Unit
Test
Conditions
Three-state
leakage
current
Ports 1 to 6,
Ports 8 to B
|ITSI|
—
—
1.0
µA
Vin = 0.5 V to
VCC – 0.5 V
Input pull-up
MOS current
Ports 2, 4,
and 5
–Ip
10
—
300
µA
Vin = 0 V
Input
capacitance
FWE
Cin
—
—
80
pF
NMI
—
—
50
pF
Vin = 0 V,
f = fmin,
Ta = 25°C
All input pins
except NMI
—
—
15
pF
—
20(3.3V)
38
mA
f = 25 MHz
Sleep mode
—
17(3.3V)
35
mA
f = 25 MHz
Module
standby mode
—
16(3.3V)
34
mA
f = 25 MHz
Flash memory
programming/
4
erasing*
—
30(3.3V)
48
mA
f = 25 MHz
(reference
values)
—
0.6
1.5
mA
—
0.6
1.5
mA
Current
2
dissipation*
Normal
operation
Analog power During A/D
supply current conversion
During A/D
and D/A
conversion
ICC*
3
AICC
Rev. 2.0, 06/04, page 745 of 980
Item
Reference current
During A/D
conversion
Symbol
Min
Typ
Max
Unit
AICC
—
0.25
0.8
mA
—
1.2
3.0
mA
VRAM
3.0
—
—
V
VCL
1.5
1.9
2.3
V
During A/D and
D/A conversion
RAM standby voltage
VCL output
5
voltage*
Normal
operation
Test
Conditions
VCC = 3.3 V,
Ta = 25°C
Notes: *1 If the A/D converter is not used, do not leave the AVCC, VREF, and AVSS pins open.
Connect AVCC and VREF to VCC, and connect AVSS to VSS.
*2 Current dissipation values are for VIH min = VCC – 0.5 V and VIL max = 0.5 V with all
output pins unloaded and the on-chip MOS pull-up transistors in the off state.
*3 ICC max. (normal operation) = 11 (mA) + 0.13 (mA/(MHz × V)) × VCC × f
ICC max. (sleep mode)
= 11 (mA) + 0.11 (mA/(MHz × V)) × VCC × f
ICC max. (sleep mode + module standby mode)
= 11 (mA) + 0.10 (mA/(MHz × V)) × VCC × f
The Typ values for power consumption are reference values.
*4 Sum of current dissipation in normal operation and current dissipation in program/erase
operations.
*5 This value is applied when the external capacitor of 0.1 µF is connected.
This characteristic does not specify the permissible range of voltage input from the
external circuit but specifies the voltage output by the LSI.
Rev. 2.0, 06/04, page 746 of 980
Table 21.23 Permissible Output Currents
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V ± 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V,
Ta = –20°C to +75°C (Standard characteristics specifications)
Item
Permissible output
low current (per pin)
Ports 1, 2, and 5
Other output pins
Permissible output
low current (total)
Total of 20 pins in
Ports 1, 2, and 5
Symbol
Min
Typ
Max
Unit
IOL
—
—
10
mA
—
—
2.0
mA
—
—
80
mA
—
—
120
mA
ΣIOL
Total of all output pins,
including the above
Permissible output
high current (per pin)
All output pins
| –IOH |
—
—
2.0
mA
Permissible output
high current (total)
Total of all output pins
| –ΣIOH |
—
—
40
mA
Notes: 1. To protect chip reliability, do not exceed the output current values in table 21.23.
2. When directly driving a darlington pair or LED, always insert a current-limiting resistor
in the output line, as shown in figures 21.7 and 21.8.
H8/3029F-ZTAT
2 kΩ
Port
Darlington pair
Figure 21.7 Darlington Pair Drive Circuit (Example)
Rev. 2.0, 06/04, page 747 of 980
H8/3029F-ZTAT
600 Ω
Ports 1, 2, 5
LED
Figure 21.8 Sample LED Circuit
Rev. 2.0, 06/04, page 748 of 980
21.3.3
AC Characteristics
Clock timing parameters are listed in table 21.24, control signal timing parameters in table 21.25,
and bus timing parameters in table 21.26. Timing parameters of the on-chip supporting modules
are listed in table 21.27.
Table 21.24 Clock Timing
Condition:
Ta = –20°C to +75°C (Standard characteristics specifications),
VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V,
fmax = 25 MHz
Item
Symbol
Min
Max
Unit
Test
Conditions
Clock cycle time
tcyc
40
62.5
ns
Figure 21.13
Clock pulse low width
tCL
10
—
ns
Clock pulse high width
tCH
10
—
ns
Clock rise time
tCr
—
10
ns
Clock fall time
tCf
—
10
ns
Clock oscillator settling
time at reset
tOSC1
20
—
ms
Figure 21.10
7
—
ms
Figure 20.1
Clock oscillator settling tOSC2
time in software standby
Table 21.25 Control Signal Timing
Conditions: Ta = –20°C to +75°C (Standard characteristics specifications),
VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V,
fmax = 25 MHz
Item
Symbol
Min
Max
Unit
Test
Conditions
RES setup time
tRESS
150
—
ns
Figure 21.11
RES pulse width
tRESW
20
—
tcyc
Mode programming setup
time
tMDS
200
—
ns
NMI, IRQ setup time
tNMIS
150
—
ns
NMI, IRQ hold time
tNMIH
10
—
ns
NMI, IRQ pulse width
tNMIW
200
—
ns
Figure 21.12
Rev. 2.0, 06/04, page 749 of 980
Table 21.26 Bus Timing
Conditions: Ta = –20°C to +75°C (Standard characteristics specifications),
VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V,
fmax = 25 MHz
Item
Symbol
Min
Max
Unit
Test
Conditions
Address delay time
tAD
—
25
ns
Figure 21.13,
Address hold time
tAH
0.5 tcyc – 20
—
ns
Figure 21.14,
Read strobe delay time
tRSD
—
25
ns
Figure 21.16,
Address strobe delay
time
tASD
—
25
ns
Figure 21.17,
Write strobe delay time
tWSD
—
25
ns
Strobe delay time
tSD
—
25
ns
Write strobe pulse
width 1
tWSW1
1.0 tcyc – 25
—
ns
Write strobe pulse
width 2
tWSW2
1.5 tcyc – 25
—
ns
Address setup time 1
tAS1
0.5 tcyc – 20
—
ns
Figure 21.19
Address setup time 2
tAS2
1.0 tcyc – 20
—
ns
Read data setup time
tRDS
25
—
ns
Read data hold time
tRDH
0
—
ns
Write data delay time
tWDD
—
35
ns
Write data setup time 1
tWDS1
1.0 tcyc– 30
—
ns
Write data setup time 2
tWDS2
2.0 tcyc– 30
—
ns
Write data hold time
tWDH
0.5 tcyc– 15
—
ns
Rev. 2.0, 06/04, page 750 of 980
Item
Symbol
Min
Max
Unit
Read data access
time 1
tACC1
—
2.0 tcyc– 45
ns
Read data access
time 2
tACC2
—
3.0 tcyc – 45
ns
Read data access
time 3
tACC3
—
1.5 tcyc – 45
ns
Read data access
time 4
tACC4
—
2.5 tcyc – 45
ns
Precharge time 1
tPCH1
1.0 tcyc – 20
—
ns
Precharge time 2
tPCH2
0.5 tcyc – 20
—
ns
Wait setup time
tWTS
25
—
ns
Wait hold time
tWTH
5
—
ns
Bus request setup time
tBRQS
25
—
ns
Bus acknowledge delay
time 1
tBACD1
—
30
ns
Bus acknowledge delay
time 2
tBACD2
—
30
ns
Bus-floating time
tBZD
—
30
ns
RAS precharge time
tRP
1.5 tcyc – 25
—
ns
CAS precharge time
tCP
0.5 tcyc – 15
—
ns
Low address hold time
tRAH
0.5 tcyc – 15
—
ns
RAS delay time 1
tRAD1
—
25
ns
RAS delay time 2
tRAD2
—
30
ns
CAS delay time 1
tCASD1
—
25
ns
CAS delay time 2
tCASD2
—
25
ns
WE delay time
tWCD
—
25
ns
Test
Conditions
Figure 21.13,
Figure 21.14,
Figure 21.16,
Figure 21.17
Figure 21.15
Figure 21.18
Figure 21.19,
Figure 21.20
Rev. 2.0, 06/04, page 751 of 980
Item
Symbol
Min
Max
Unit
CAS pulse width 1
tCAS1
1.5 tcyc – 20
—
ns
CAS pulse width 2
tCAS2
1.0 tcyc – 20
—
ns
CAS pulse width 3
tCAS3
1.0 tcyc – 20
—
ns
RAS access time
tRAC
—
2.5 tcyc – 40
ns
Address access time
tAA
—
2.0 tcyc – 50
ns
CAS access time
tCAC
—
1.5 tcyc – 50
ns
WE setup time
tWCS
0.5 tcyc – 20
—
ns
WE hold time
tWCH
0.5 tcyc – 15
—
ns
Write data setup time
tWDS
0.5 tcyc – 20
—
ns
WE write data hold time
tWDH
0.5 tcyc – 15
—
ns
CAS setup time 1
tCSR1
0.5 tcyc – 20
—
ns
CAS setup time 2
tCSR2
0.5 tcyc – 15
—
ns
CAS hold time
tCHR
0.5 tcyc – 15
—
ns
RAS pulse width
tRAS
1.5 tcyc – 15
—
ns
Signal rising time
(all input pins except for
EXTAL)
tSR
—
100
ns
Signal falling time
(all input pins except for
EXTAL)
tSF
—
100
ns
Test
Conditions
Figure 21.19
to
Figure 21.21
Figure 21.30
Note: In order to secure the address hold time relative to the rise of the RD strobe, address
update mode 2 should be used. For details see section 6.3.5, Address Output Method.
Rev. 2.0, 06/04, page 752 of 980
Table 21.27 Timing of On-Chip Supporting Modules
Conditions: Ta = –20°C to +75°C (Standard characteristics specifications),
VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V,
fmax = 25 MHz
Module Item
Symbol
Min
Max
Unit
Test
Conditions
Ports
and
TPC
Output data
delay time
tPWD
—
50
ns
Figure 21.22
Input data setup
time
tPRS
50
—
ns
Input data hold
time
tPRH
50
—
ns
Timer output
delay time
tTOCD
—
50
ns
Timer input
setup time
tTICS
50
—
ns
Timer clock
input setup time
tTCKS
50
—
ns
Timer
clock
pulse
width
Single
edge
tTCKWH
1.5
—
tcyc
Both
edges
tTCKWL
2.5
—
tcyc
Timer output
delay time
tTOCD
—
50
ns
Timer input
setup time
tTICS
50
—
ns
Timer clock
input setup time
tTCKS
50
—
ns
Timer
clock
pulse
width
Single
edge
tTCKWH
1.5
—
tcyc
Both
edges
tTCKWL
2.5
—
tcyc
16-bit
timer
8-bit
timer
Figure 21.23
Figure 21.24
Figure 21.23
Figure 21.24
Rev. 2.0, 06/04, page 753 of 980
Min
Max
Unit
Test
Conditions
AsyntScyc
chronous
4
—
tcyc
Figure 21.25
Synchronous
6
—
tcyc
Module Item
SCI
DMAC
Input
clock
cycle
Symbol
Input clock rise
time
tSCKr
—
1.5
tcyc
Input clock fall
time
tSCKf
—
1.5
tcyc
Input clock
pulse width
tSCKW
0.4
0.6
tScyc
Transmit data
delay time
tTXD
—
100
ns
Receive data
setup time
(synchronous)
tRXS
100
—
ns
Receive
data hold
time (synchronous)
tRXH
100
—
ns
0
—
ns
Clock
input
Clock
output
Figure 21.26
TEND delay time 1 tTED1
—
50
ns
TEND delay time 2 tTED2
—
50
ns
Figure 21.27,
Figure 21.28
DREQ setup time
tDRQS
25
—
ns
Figure 21.29
DREQ hold time
tDRQH
10
—
ns
RL
H8/3029F-ZTAT
output pin
C = 90 pF: Ports 4, 6, 8
A19 to A0, D15 to D8
C = 30 pF: Ports 9, A, B
R L = 2.4 k Ω
R H = 12 k Ω
C
RH
Input/output timing measurement
levels
• Low: Vcc 0.2 V
• High: Vcc 0.7 V
Figure 21.9 Output Load Circuit
Rev. 2.0, 06/04, page 754 of 980
21.3.4
A/D Conversion Characteristics
Table 21.28 lists the A/D conversion characteristics.
Table 21.28 A/D Conversion Characteristics
Conditions: Ta = –20°C to +75°C (Standard characteristics specifications),
VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V,
fmax = 25 MHz
Item
Min
Typ
Max
Unit
ConverResolution
sion time: Conversion time (single
134 states mode)
10
10
10
bits
5.36
—
—
µs
Analog input capacitance
—
—
20
pF
Permissible signal-source
impedance
—
—
5
kΩ
Nonlinearity error
—
—
±3.5
LSB
Offset error
—
—
±3.5
LSB
Full-scale error
—
—
±3.5
LSB
Quantization error
—
—
±0.5
LSB
Absolute accuracy
—
—
±4.0
LSB
Item
Min
Typ
Max
Unit
ConverResolution
sion time*: Conversion time (single
70 states mode)
10
10
10
bits
5.38
—
—
µs
Analog input capacitance
—
—
20
pF
Permissible signal-source
impedance
—
—
5
kΩ
Nonlinearity error
—
—
±7.5
LSB
Offset error
—
—
±7.5
LSB
Full-scale error
—
—
±7.5
LSB
Quantization error
—
—
±0.5
LSB
Absolute accuracy
—
—
±8.0
LSB
Note:
*
When using an operating frequency above f = 70 (state) /5.38 (µs) = 13.0 (MHz), do not
select 70-state conversion time.
Rev. 2.0, 06/04, page 755 of 980
21.3.5
D/A Conversion Characteristics
Table 21.29 lists the D/A conversion characteristics.
Table 21.29 D/A Conversion Characteristics
Conditions: Ta = –20°C to +75°C (Standard characteristics specifications),
VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V,
fmax = 25 MHz
Item
Min
Typ
Max
Unit
Resolution
8
8
8
bits
Conversion time
(centering time)
—
—
10
µs
20 pF capacitive
load
Absolute accuracy*
—
±2.0
±3.0
LSB
2 MΩ resistive
load
—
—
±2.0
LSB
4 MΩ resistive
load
Note:
*
Except in software standby mode.
Rev. 2.0, 06/04, page 756 of 980
Test Conditions
21.3.6
Flash Memory Characteristics
Table 21.30 lists the flash memory characteristics.
Table 21.30 Flash Memory Characteristics
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VSS = AVSS = 0 V, Ta = 0°C to +75°C
(operating temperature range for programming/erasing: Standard characteristics
specifications)
Item
1,
2,
Programming time* * *
4
Erase time*1, *2, *4
Symbol
Min
Typ
Max
Unit
tP
tE
—
3
30
ms/128 bytes
—
80
800
ms/4-kbyte
block
—
500
5000
ms/32-kbyte
block
—
1000
10000
ms/64-kbyte
block
Programming time (total)*1, *2, *4
ΣtP
—
10
30
s/512
kbytes
Erase time (total)*1, *2, *4
ΣtE
—
10
30
s/512
kbytes
Programming and erase time
(total)*1, *2, *4
ΣtPE
—
20
60
s/512
kbytes
Reprogramming count
NWEC
100*3
—
—
Times
tDRP
10
—
—
Year
Data retention time*
4
Test Conditions
Ta = 25°C,
all "0"
Ta = 25°C
Ta = 25°C
Notes: *1 Programming and erase time depend on the data size.
*2 Programming and erase time and excluded the data transfer time.
*3 It is the number of times of min. which guarantees all the characteristics after
reprogramming. (A guarantee is the range of a 1-min. value.)
*4 It is the characteristic when reprogramming is performed by specification within the
limits including a min. value.
Rev. 2.0, 06/04, page 757 of 980
21.4
Operational Timing
This section shows timing diagrams.
21.4.1
Clock Timing
Clock timing is shown as follows:
• Oscillator settling timing
Figure 21.10 shows the oscillator settling timing.
φ
VCC
STBY
tOSC1
tOSC1
RES
Figure 21.10 Oscillator Settling Timing
Rev. 2.0, 06/04, page 758 of 980
21.4.2
Control Signal Timing
Control signal timing is shown as follows:
• Reset input timing
Figure 21.11 shows the reset input timing.
• Interrupt input timing
Figure 21.12 shows the interrupt input timing for NMI and IRQ5 to IRQ0.
φ
tRESS
tRESS
RES
tMDS
tRESW
FWE
MD2 to MD0
Figure 21.11 Reset Input Timing
φ
tNMIS
tNMIH
tNMIS
tNMIH
NMI
IRQ E
tNMIS
IRQ L
IRQ E : Edge-sensitive IRQ i
IRQ L : Level-sensitive IRQ i (i = 0 to 5)
tNMIW
NMI
IRQ j
(j = 0 to 5)
Figure 21.12 Interrupt Input Timing
Rev. 2.0, 06/04, page 759 of 980
21.4.3
Bus Timing
Bus timing is shown as follows:
• Basic bus cycle: two-state access
Figure 21.13 shows the timing of the external two-state access cycle.
• Basic bus cycle: three-state access
Figure 21.14 shows the timing of the external three-state access cycle.
• Basic bus cycle: three-state access with one wait state
Figure 21.15 shows the timing of the external three-state access cycle with one wait state
inserted.
Burst ROM access timing/burst cycle: two-state access
Figure 21.16 shows the timing of the two-state burst cycle.
Burst ROM access timing/burst cycle: three-state access
Figure 21.17 shows the timing of the three-state burst cycle.
Burst release mode timing
Figure 21.18 shows the timing in bus release mode.
Rev. 2.0, 06/04, page 760 of 980
T1
tcyc
T2
tCH
tCL
φ
tCf
tAD
tcyc
tCr
A23 to A0,
CSn
tPCH1
AS
RD
(read)
tASD
tACC3
tASD
tACC3
tSD
tAH
tAS1
tRSD
tPCH2
tAS1
tACC1
tRDH*
tRDS
D15 to D0
(read)
tPCH1
tASD
HWR, LWR
(write)
tSD
tAH
tAS1
tWDD
tWSW1
tWDS1
tWDH
D15 to D0
(write)
Note: * Specification from the earliest negation timing of A23 to A0, CSn, and RD.
Figure 21.13 Basic Bus Cycle: two State Access
Rev. 2.0, 06/04, page 761 of 980
T1
T2
T3
φ
A23 to A0,
CSn
tACC4
AS
tACC4
RD
(read)
tACC2
tRDS
D15 to D0
(read)
tWSD
HWR, LWR
(write)
tWSW2
tAS2
tWDD
tWDS2
D15 to D0
(write)
Figure 21.14 Basic Bus Cycle: three State Access
Rev. 2.0, 06/04, page 762 of 980
T1
T2
TW
T3
φ
A23 to A0,
CSn
AS
RD (read)
D15 to D0
(read)
HWR, LWR
(write)
D15 to D0
(write)
tWTS
tWTH
tWTS
tWTH
WAIT
Figure 21.15 Basic Bus Cycle: three State Access with One Wait State
Rev. 2.0, 06/04, page 763 of 980
T1
T2
T3
T1
T2
φ
tAD
tAD
A23 to A3
CSn
A2 to A0
tASD
AS
tACC4
tAH
tAS1
tASD
tSD
tAH
tAS1
tASD
RD
tSD
tRSD
tACC4
tAS1
tACC2
tRDS
tACC1
tRDH*
tRDS
D15 to D0
Note: * Specification from the earliest negation timing of A23 to A0, CSn, and RD.
Figure 21.16 Burst ROM Access Timing: two State Access
Rev. 2.0, 06/04, page 764 of 980
T1
T2
T3
T1
T2
T3
φ
tAD
tAD
A23 to A3
CSn
A2 to A0
tASD
AS
tACC4
tAH
tAS1
tASD
tSD
tAH
tAS1
tASD
RD
tSD
tRSD
tACC4
tRDH*
tAS1
tACC2
tACC2
tRDS
tRDS
D15 to D0
Note: * Specification from the earliest negation timing of A23 to A0, CSn, and RD.
Figure 21.17 Burst ROM Access Timing: three State Access
φ
tBRQS
tBRQS
BREQ
tBACD2
tBACD1
BACK
A23 to A0,
AS, RD,
HWR, LWR
tBZD
tBZD
Figure 21.18 Bus-Release Mode Timing
Rev. 2.0, 06/04, page 765 of 980
21.4.4
DRAM Interface Bus Timing
DRAM interface bus timing is shown as follows:
• DRAM bus timing: read and write access
Figure 21.19 shows the timing of the read and write access.
• DRAM bus timing: CAS before RAS refresh
Figure 21.20 shows the timing of the CAS before RAS refresh.
• DRAM bus timing: self-refresh
Figure 21.21 shows the timing of the self-refresh.
Rev. 2.0, 06/04, page 766 of 980
Tp
Tr
TC1
TC2
φ
tAD
tAD
tAD
A23 to A0
tAS1
tRAH
tRAD2
tRP
CS5 to CS2
(RAS5 to RAS2)
tRAD1
tCASD2
tASD
tCAS1
UCAS, LCAS
(read)
tCP
RD (WE)
(read)
High
tRAC
tRDS
tRDH*
tAA
D15 to D0
(read)
tCAC
tCASD2
tCASD1
tCAS2
UCAS, LCAS
(write)
tCP
tASD
tWCD
RD (WE)
(write)
tWCS
tWDD
tWCH
tWDS
tWDH
D15 to D0
(write)
RFSH
High
Note: * Specification from the earliest negation timing of RAS and CAS.
Figure 21.19 DRAM Bus Timing (Read/Write)
Rev. 2.0, 06/04, page 767 of 980
TRp
TR1
TR2
φ
tRAD1
tRAD2
tRP
tRAS
CS5 to CS2
(RAS5 to
RAS2)
tCASD1
tCASD2
tCSR1
tCHR
tCAS3
UCAS,
LCAS
RD (WE)
(high)
tRAD2
tRAD1
tCSR1
tCHR
tRAS
RFSH
Figure 21.20 DRAM Bus Timing (CAS Before RAS Refresh)
Rev. 2.0, 06/04, page 768 of 980
φ
tCSR2
CS5 to CS2
(RAS5 to
RAS2)
UCAS,
LCAS
RD (WE)
(high)
tCSR2
RFSH
Figure 21.21 DRAM Bus Timing (Self-Refresh)
21.4.5
TPC and I/O Port Timing
Figure 21.22 shows the TPC and I/O port input/output timing.
T1
T2
T3
φ
tPRS
tPRH
Port 1 to
B (read)
tPWD
Port 1 to
6, 8 to B
(write)
Figure 21.22 TPC and I/O Port Input/Output Timing
Rev. 2.0, 06/04, page 769 of 980
21.4.6
Timer Input/Output Timing
16-bit timer and 8-bit timer timing is shown below.
• Timer input/output timing
Figure 21.23 shows the timer input/output timing.
• Timer external clock input timing
Figure 21.24 shows the timer external clock input timing.
φ
tTOCD
Output
compare*1
tTICS
Input
capture*2
Notes: *1 TIOCA0 to TIOCA2, TIOCB0 to TIOCB2, TMO0, TMO2, TMIO1, TMIO3
*2 TIOCA0 to TIOCA2, TIOCB0 to TIOCB2, TMIO1, TMIO3
Figure 21.23 Timer Input/Output Timing
tTCKS
φ
tTCKS
TCLKA to
TCLKD
tTCKWL
tTCKWH
Figure 21.24 Timer External Clock Input Timing
Rev. 2.0, 06/04, page 770 of 980
21.4.7
SCI Input/Output Timing
SCI timing is shown as follows:
• SCI input clock timing
Figure 21.25 shows the SCI input clock timing.
• SCI input/output timing (synchronous mode)
Figure 21.26 shows the SCI input/output timing in synchronous mode.
tSCKW
tSCKr
tSCKf
SCK0 to SCK2
tScyc
Figure 21.25 SCI Input Clock Timing
tScyc
SCK0,
SCK1
tTXD
TxD0 to TxD2
(transmit
data)
tRXS
tRXH
RxD0 to RxD2
(receive
data)
Figure 21.26 SCI Input/Output Timing in Synchronous Mode
Rev. 2.0, 06/04, page 771 of 980
21.4.8
DMAC Timing
DMAC timing is shown as follows.
• DMAC TEND output timing for 2 state access
Figure 21.27 shows the DMAC TEND output timing for two state access.
• DMAC TEND output timing for 3 state access
Figure 21.28 shows the DMAC TEND output timing for three state access.
• DMAC DREQ input timing
Figure 21.29 shows DMAC DREQ input timing.
T1
T2
φ
tTED1
tTED2
TEND
Figure 21.27 DMAC TEND Output Timing for two State Access
T1
T2
T3
φ
tTED2
tTED1
TEND
Figure 21.28 DMAC TEND Output Timing for three State Access
φ
tDRQS
tDRQH
DREQ
Figure 21.29 DMAC DREQ Input Timing
Rev. 2.0, 06/04, page 772 of 980
21.4.9
Input Signal Timing
Figure 21.30 shows the rising and falling timing for input signals.
All input pins except for the EXTAL pin
tSR
tSF
Figure 21.30 Rising and Falling Timing for Input Signals
Rev. 2.0, 06/04, page 773 of 980
Rev. 2.0, 06/04, page 774 of 980
Appendix A Instruction Set
A.1
Instruction List
Operand Notation
Symbol
Description
Rd
General destination register
Rs
General source register
Rn
General register
ERd
General destination register (address register or 32-bit register)
ERs
General source register (address register or 32-bit register)
ERn
General register (32-bit register)
(EAd)
Destination operand
(EAs)
Source operand
PC
Program counter
SP
Stack pointer
CCR
Condition code register
N
N (negative) flag in CCR
Z
Z (zero) flag in CCR
V
V (overflow) flag in CCR
C
C (carry) flag in CCR
disp
Displacement
→
Transfer from the operand on the left to the operand on the right, or transition from
the state on the left to the state on the right
+
Addition of the operands on both sides
–
Subtraction of the operand on the right from the operand on the left
×
Multiplication of the operands on both sides
÷
Division of the operand on the left by the operand on the right
∧
Logical AND of the operands on both sides
∨
Logical OR of the operands on both sides
⊕
Exclusive logical OR of the operands on both sides
¬
NOT (logical complement)
( ), < >
Contents of operand
Note: General registers include 8-bit registers (R0H to R7H and R0L to R7L) and 16-bit registers
(R0 to R7 and E0 to E7).
Rev. 2.0, 06/04, page 775 of 980
Condition Code Notation
Symbol
Description
Changed according to execution result
*
Undetermined (no guaranteed value)
0
Cleared to 0
1
Set to 1
—
Not affected by execution of the instruction
∆
Varies depending on conditions, described in notes
Rev. 2.0, 06/04, page 776 of 980
Table A.1
Instruction Set
1. Data transfer instructions
2
2
Operation
I
H N
Z
V
C
Normal
Condition Code
Advanced
No. of
States*1
—
@@aa
B
@(d, PC)
B
MOV.B @ERs, Rd
@aa
MOV.B Rs, Rd
@–ERn/@ERn+
2
@(d, ERn)
B
@ERn
#xx
MOV.B #xx:8, Rd
Rn
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
#xx:8 → Rd8
— —
0 —
2
Rs8 → Rd8
— —
0 —
2
@ERs → Rd8
— —
0 —
4
MOV.B @(d:16, ERs), B
Rd
4
@(d:16, ERs) → Rd8
— —
0 —
6
MOV.B @(d:24, ERs), B
Rd
8
@(d:24, ERs) → Rd8
— —
0 —
10
@ERs → Rd8
ERs32+1 → ERs32
— —
0 —
6
MOV.B @ERs+, Rd
B
MOV.B @aa:8, Rd
B
2
@aa:8 → Rd8
— —
0 —
4
MOV.B @aa:16, Rd
B
4
@aa:16 → Rd8
— —
0 —
6
MOV.B @aa:24, Rd
B
6
@aa:24 → Rd8
— —
0 —
8
MOV.B Rs, @ERd
B
Rs8 → @ERd
— —
0 —
4
MOV.B Rs, @(d:16,
ERd)
B
4
Rs8 → @(d:16, ERd)
— —
0 —
6
MOV.B Rs, @(d:24,
ERd)
B
8
Rs8 → @(d:24, ERd)
— —
0 —
10
MOV.B Rs, @-ERd
B
ERd32–1 → ERd32
Rs8 → @ERd
— —
0 —
6
MOV.B Rs, @aa:8
B
2
Rs8 → @aa:8
— —
0 —
4
MOV.B Rs, @aa:16
B
4
Rs8 → @aa:16
— —
0 —
6
MOV.B Rs, @aa:24
B
6
Rs8 → @aa:24
— —
0 —
8
MOV.W #xx:16, Rd
W 4
#xx:16 → Rd16
— —
0 —
4
MOV.W Rs, Rd
W
Rs16 → Rd16
— —
0 —
2
MOV.W @ERs, Rd
W
2
2
2
2
@ERs → Rd16
— —
0 —
4
MOV.W @(d:16, ERs), W
Rd
4
@(d:16, ERs) → Rd16
— —
0 —
6
MOV.W @(d:24, ERs), W
Rd
8
@(d:24, ERs) → Rd16
— —
0 —
10
@ERs → Rd16
ERs32+2 → @ERd32
— —
0 —
6
@aa:16 → Rd16
— —
0 —
6
MOV.W @ERs+, Rd
W
MOV.W @aa:16, Rd
W
2
2
4
Rev. 2.0, 06/04, page 777 of 980
MOV.W Rs, @aa:16
W
MOV.W Rs, @aa:24
W
MOV.L #xx:32, Rd
L
MOV.L ERs, ERd
L
MOV.L @ERs, ERd
L
MOV.L @(d:16, ERs),
ERd
L
6
MOV.L @(d:24, ERs),
ERd
L
10
MOV.L @ERs+, ERd
L
MOV.L @aa:16, ERd
L
MOV.L @aa:24, ERd
L
MOV.L ERs, @ERd
L
MOV.L ERs, @(d:16,
ERd)
L
MOV.L ERs, @(d:24,
ERd)
L
MOV.L ERs, @–ERd
L
MOV.L ERs, @aa:16
L
MOV.L ERs, @aa:24
L
POP.W Rn
W
POP.L ERn
L
I
H N
Z
V
C
@aa:24 → Rd16
— —
0 —
8
Rs16 → @ERd
— —
0 —
4
4
Rs16 → @(d:16, ERd)
— —
0 —
6
8
Rs16 → @(d:24, ERd)
— —
0 —
10
ERd32–2 → ERd32
Rs16 → @ERd
— —
0 —
6
4
Rs16 → @aa:16
— —
0 —
6
6
Rs16 → @aa:24
— —
0 —
8
#xx:32 → Rd32
— —
0 —
6
ERs32 → ERd32
— —
0 —
2
@ERs → ERd32
— —
0 —
8
@(d:16, ERs) → ERd32 — —
0 —
10
@(d:24, ERs) → ERd32 — —
0 —
14
@ERs → ERd32
ERs32+4 → ERs32
— —
0 —
10
6
@aa:16 → ERd32
— —
0 —
10
8
@aa:24 → ERd32
— —
0 —
12
ERs32 → @ERd
— —
0 —
8
6
ERs32 → @(d:16, ERd) — —
0 —
10
10
ERs32 → @(d:24, ERd) — —
0 —
14
ERd32–4 → ERd32
ERs32 → @ERd
— —
0 —
10
6
ERs32 → @aa:16
— —
0 —
10
8
ERs32 → @aa:24
— —
0 —
12
2 @SP → Rn16
SP+2 → SP
— —
0 —
6
4 @SP → ERn32
SP+4 → SP
— —
0 —
10
6
2
2
6
2
4
4
4
Rev. 2.0, 06/04, page 778 of 980
Operation
Advanced
W
Condition Code
Normal
MOV.W Rs, @–ERd
No. of
States*1
—
W
@@aa
MOV.W Rs, @(d:24,
ERd)
@(d, PC)
W
@aa
MOV.W Rs, @(d:16,
ERd)
@–ERn/@ERn+
W
@(d, ERn)
MOV.W Rs, @ERd
@ERn
W
Rn
MOV.W @aa:24, Rd
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
4
No. of
States*1
PUSH.L ERn
L
4 SP–4 → SP
ERn32 → @SP
— —
0 —
10
MOVFPE @aa:16,
Rd
B
4
Cannot be used in the
H8/3029
Cannot be used in the
H8/3029
MOVTPE Rs,
@aa:16
B
4
Cannot be used in the
H8/3029
Cannot be used in the
H8/3029
Operation
I
H N
Z
V
C
Normal
—
Rn
Condition Code
Advanced
6
@@aa
0 —
@(d, PC)
— —
@aa
2 SP–2 → SP
Rn16 → @SP
@(d, ERn)
W
@ERn
PUSH.W Rn
#xx
Mnemonic
Operand Size
@–ERn/@ERn+
Addressing Mode and
Instruction Length (bytes)
2. Arithmetic instructions
L
ADDX.B #xx:8, Rd
B
ADDX.B Rs, Rd
B
2
ADDS.L #1, ERd
L
ADDS.L #2, ERd
L
ADDS.L #4, ERd
I
H N
Z
V
C
Advanced
ADD.L ERs, ERd
Condition Code
Operation
Normal
L
No. of
States*1
—
ADD.L #xx:32, ERd
@@aa
W
@(d, PC)
W 4
ADD.W Rs, Rd
@aa
ADD.W #xx:16, Rd
@–ERn/@ERn+
2
B
@(d, ERn)
B
ADD.B Rs, Rd
@ERn
#xx
ADD.B #xx:8, Rd
Rn
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
Rd8+#xx:8 → Rd8
—
2
Rd8+Rs8 → Rd8
—
2
Rd16+#xx:16 → Rd16
— (1)
4
Rd16+Rs16 → Rd16
— (1)
2
ERd32+#xx:32 →
ERd32
— (2)
6
ERd32+ERs32 →
ERd32
— (2)
2
Rd8+#xx:8 +C → Rd8
—
(3)
2
Rd8+Rs8 +C → Rd8
—
(3)
2
2
ERd32+1 → ERd32
— — — — — —
2
2
ERd32+2 → ERd32
— — — — — —
2
L
2
ERd32+4 → ERd32
— — — — — —
2
INC.B Rd
B
2
Rd8+1 → Rd8
— —
—
2
INC.W #1, Rd
W
2
Rd16+1 → Rd16
— —
—
2
INC.W #2, Rd
W
2
Rd16+2 → Rd16
— —
—
2
2
2
6
2
2
Rev. 2.0, 06/04, page 779 of 980
No. of
States*1
2
ERd32+2 → ERd32
B
2
Rd8 decimal adjust
→ Rd8
SUB.B Rs, Rd
B
2
Rd8–Rs8 → Rd8
—
2
SUB.W #xx:16, Rd
W 4
Rd16–#xx:16 → Rd16
— (1)
4
SUB.W Rs, Rd
W
Rd16–Rs16 → Rd16
— (1)
2
SUB.L #xx:32, ERd
L
ERd32–#xx:32
→ ERd32
— (2)
6
SUB.L ERs, ERd
L
ERd32–ERs32
→ ERd32
— (2)
2
SUBX.B #xx:8, Rd
B
Rd8–#xx:8–C → Rd8
—
(3)
2
SUBX.B Rs, Rd
B
2
Rd8–Rs8–C → Rd8
—
(3)
2
SUBS.L #1, ERd
L
2
ERd32–1 → ERd32
— — — — — —
2
SUBS.L #2, ERd
L
2
ERd32–2 → ERd32
— — — — — —
2
SUBS.L #4, ERd
L
2
ERd32–4 → ERd32
— — — — — —
2
DEC.B Rd
B
2
Rd8–1 → Rd8
— —
—
2
DEC.W #1, Rd
W
2
Rd16–1 → Rd16
— —
—
2
DEC.W #2, Rd
W
2
Rd16–2 → Rd16
— —
—
2
DEC.L #1, ERd
L
2
ERd32–1 → ERd32
— —
—
2
DEC.L #2, ERd
L
2
ERd32–2 → ERd32
— —
—
2
DAS.Rd
B
2
Rd8 decimal adjust
→ Rd8
— *
* —
2
MULXU. B Rs, Rd
B
2
Rd8 × Rs8 → Rd16
— — — — — —
(unsigned multiplication)
14
MULXU. W Rs, ERd
W
2
Rd16 × Rs16 → ERd32 — — — — — —
(unsigned multiplication)
22
MULXS. B Rs, Rd
B
4
Rd8 × Rs8 → Rd16
(signed multiplication)
— —
— —
16
MULXS. W Rs, ERd
W
4
Rd16 × Rs16 → ERd32
(signed multiplication)
— —
— —
24
DIVXU. B Rs, Rd
B
2
Rd16 ÷ Rs8 → Rd16
(RdH: remainder, RdL:
quotient)
(unsigned division)
— — (6) (7) — —
14
2
6
2
2
Rev. 2.0, 06/04, page 780 of 980
Operation
I
H N
Z
V
C
Normal
—
Condition Code
Advanced
L
DAA Rd
@@aa
INC.L #2, ERd
@(d, PC)
— —
@aa
ERd32+1 → ERd32
@(d, ERn)
2
@ERn
L
Rn
INC.L #1, ERd
#xx
Mnemonic
Operand Size
@–ERn/@ERn+
Addressing Mode and
Instruction Length (bytes)
—
2
— —
—
2
— *
* —
2
No. of
States*1
4
Rd16 ÷ Rs8 → Rd16
(RdH: remainder,
RdL: quotient)
(signed division)
— — (8) (7) — —
16
DIVXS. W Rs, ERd
W
4
ERd32 ÷ Rs16 → ERd32 — — (8) (7) — —
(Ed: remainder,
Rd: quotient)
(signed division)
24
CMP.B #xx:8, Rd
B
Rd8–#xx:8
—
2
Rd8–Rs8
—
2
Rd16–#xx:16
— (1)
4
Rd16–Rs16
— (1)
2
ERd32–#xx:32
— (2)
6
2
CMP.B Rs, Rd
B
CMP.W #xx:16, Rd
W 4
CMP.W Rs, Rd
W
CMP.L #xx:32, ERd
L
2
2
6
Operation
I
H N
Z
V
C
Normal
—
Condition Code
Advanced
B
@@aa
DIVXS. B Rs, Rd
@(d, PC)
22
@aa
ERd32 ÷ Rs16 → ERd32 — — (6) (7) — —
(Ed: remainder,
Rd: quotient)
(unsigned division)
@(d, ERn)
2
@ERn
W
Rn
DIVXU. W Rs, ERd
#xx
Mnemonic
Operand Size
@–ERn/@ERn+
Addressing Mode and
Instruction Length (bytes)
CMP.L ERs, ERd
L
2
ERd32–ERs32
— (2)
2
NEG.B Rd
B
2
0–Rd8 → Rd8
—
2
NEG.W Rd
W
2
0–Rd16 → Rd16
—
2
NEG.L ERd
L
2
0–ERd32 → ERd32
—
EXTU.W Rd
W
2
0 → (<bits 15 to 8>
of Rd16)
— — 0
0 —
2
EXTU.L ERd
L
2
0 → (<bits 31 to 16>
of ERd32)
— — 0
0 —
2
EXTS.W Rd
W
2
(<bit 7> of Rd16) →
— —
(<bits 15 to 8> of Rd16)
0
2
EXTS.L ERd
L
2
(<bit 15> of ERd32) →
(<bits 31 to 16> of
ERd32)
0 —
2
— —
2
Rev. 2.0, 06/04, page 781 of 980
3. Logic instructions
L
AND.L ERs, ERd
L
OR.B #xx:8, Rd
B
OR.B Rs, Rd
B
OR.W #xx:16, Rd
W 4
OR.W Rs, Rd
W
OR.L #xx:32, ERd
L
OR.L ERs, ERd
L
XOR.B #xx:8, Rd
B
XOR.B Rs, Rd
B
XOR.W #xx:16, Rd
W 4
XOR.W Rs, Rd
W
XOR.L #xx:32, ERd
L
XOR.L ERs, ERd
Operation
I
H N
Z
V
C
Advanced
AND.L #xx:32, ERd
Condition Code
Normal
W
No. of
States*1
—
W 4
AND.W Rs, Rd
@@aa
AND.W #xx:16, Rd
@(d, PC)
B
@–ERn/@ERn+
AND.B Rs, Rd
@aa
2
@(d, ERn)
B
@ERn
#xx
AND.B #xx:8, Rd
Rn
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
Rd8∧#xx:8 → Rd8
— —
0 —
2
2
Rd8∧Rs8 → Rd8
— —
0 —
2
Rd16∧#xx:16 → Rd16
— —
0 —
4
2
Rd16∧Rs16 → Rd16
— —
0 —
2
ERd32∧#xx:32 → ERd32 — —
0 —
6
4
ERd32∧ERs32 → ERd32 — —
0 —
4
Rd8∨#xx:8 → Rd8
— —
0 —
2
2
Rd8∨Rs8 → Rd8
— —
0 —
2
Rd16∨#xx:16 → Rd16
— —
0 —
4
2
Rd16∨Rs16 → Rd16
— —
0 —
2
ERd32∨#xx:32 → ERd32 — —
0 —
6
4
ERd32∨ERs32 → ERd32 — —
0 —
4
Rd8⊕#xx:8 → Rd8
— —
0 —
2
2
Rd8⊕Rs8 → Rd8
— —
0 —
2
Rd16⊕#xx:16 → Rd16
— —
0 —
4
2
Rd16⊕Rs16 → Rd16
— —
0 —
2
ERd32⊕#xx:32 → ERd32 — —
0 —
6
L
4
ERd32⊕ERs32 → ERd32 — —
0 —
4
NOT.B Rd
B
2
¬Rd8 → Rd8
— —
0 —
2
NOT.W Rd
W
2
¬Rd16 → Rd16
— —
0 —
2
NOT.L ERd
L
2
¬Rd32 → Rd32
— —
0 —
2
6
2
6
2
6
Rev. 2.0, 06/04, page 782 of 980
4. Shift instructions
Operation
I
2
SHAL.W Rd
W
2
SHAL.L ERd
L
2
SHAR.B Rd
B
2
SHAR.W Rd
W
2
SHAR.L ERd
L
2
SHLL.B Rd
B
2
SHLL.W Rd
W
2
SHLL.L ERd
L
2
SHLR.B Rd
B
2
SHLR.W Rd
W
2
SHLR.L ERd
L
2
ROTXL.B Rd
B
2
ROTXL.W Rd
W
2
ROTXL.L ERd
L
2
ROTXR.B Rd
B
2
ROTXR.W Rd
W
2
ROTXR.L ERd
L
2
ROTL.B Rd
B
2
ROTL.W Rd
W
2
ROTL.L ERd
L
2
ROTR.B Rd
B
2
ROTR.W Rd
W
2
ROTR.L ERd
L
2
C
0
MSB
LSB
LSB
C
0
MSB
LSB
0
C
MSB
LSB
C
MSB
LSB
C
MSB
LSB
C
MSB
LSB
C
MSB
LSB
Z
V
C
— —
2
— —
2
— —
C
MSB
H N
Normal
Condition Code
Advanced
No. of
States*1
—
@@aa
@(d, PC)
@–ERn/@ERn+
@aa
@(d, ERn)
@ERn
B
Rn
SHAL.B Rd
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
2
— —
0
2
— —
0
2
— —
0
2
— —
0
2
— —
0
2
— —
0
2
— —
0
2
— —
0
2
— —
0
2
— —
0
2
— —
0
2
— —
0
2
— —
0
2
— —
0
2
— —
0
2
— —
0
2
— —
0
2
— —
0
2
— —
0
2
— —
0
2
— —
0
2
Rev. 2.0, 06/04, page 783 of 980
5. Bit manipulation instructions
BCLR #xx:3, Rd
B
BCLR #xx:3, @ERd
B
BCLR #xx:3, @aa:8
B
BCLR Rn, Rd
B
BCLR Rn, @ERd
B
BCLR Rn, @aa:8
B
BNOT #xx:3, Rd
B
BNOT #xx:3, @ERd
B
BNOT #xx:3, @aa:8
B
BNOT Rn, Rd
B
BNOT Rn, @ERd
B
BNOT Rn, @aa:8
B
BTST #xx:3, Rd
B
BTST #xx:3, @ERd
B
BTST #xx:3, @aa:8
B
BTST Rn, Rd
B
BTST Rn, @ERd
B
BTST Rn, @aa:8
B
BLD #xx:3, Rd
B
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
Rev. 2.0, 06/04, page 784 of 980
Operation
I
H N
Z
V
C
Advanced
B
2
Condition Code
Normal
B
BSET Rn, @aa:8
4
No. of
States*1
—
BSET Rn, @ERd
4
@@aa
B
2
@(d, PC)
BSET Rn, Rd
@aa
B
@–ERn/@ERn+
B
BSET #xx:3, @aa:8
@(d, ERn)
BSET #xx:3, @ERd
@ERn
B
Rn
BSET #xx:3, Rd
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
(#xx:3 of Rd8) ← 1
— — — — — —
2
(#xx:3 of @ERd) ← 1
— — — — — —
8
(#xx:3 of @aa:8) ← 1
— — — — — —
8
(Rn8 of Rd8) ← 1
— — — — — —
2
(Rn8 of @ERd) ← 1
— — — — — —
8
(Rn8 of @aa:8) ← 1
— — — — — —
8
(#xx:3 of Rd8) ← 0
— — — — — —
2
(#xx:3 of @ERd) ← 0
— — — — — —
8
(#xx:3 of @aa:8) ← 0
— — — — — —
8
(Rn8 of Rd8) ← 0
— — — — — —
2
(Rn8 of @ERd) ← 0
— — — — — —
8
(Rn8 of @aa:8) ← 0
— — — — — —
8
(#xx:3 of Rd8) ←
¬ (#xx:3 of Rd8)
— — — — — —
2
(#xx:3 of @ERd) ←
¬ (#xx:3 of @ERd)
— — — — — —
8
(#xx:3 of @aa:8) ←
¬ (#xx:3 of @aa:8)
— — — — — —
8
(Rn8 of Rd8) ←
¬ (Rn8 of Rd8)
— — — — — —
2
(Rn8 of @ERd) ←
¬ (Rn8 of @ERd)
— — — — — —
8
(Rn8 of @aa:8) ←
¬ (Rn8 of @aa:8)
— — — — — —
8
¬ (#xx:3 of Rd8) → Z
— — —
— —
2
¬ (#xx:3 of @ERd) → Z
— — —
— —
6
¬ (#xx:3 of @aa:8) → Z
— — —
— —
6
¬ (Rn8 of @Rd8) → Z
— — —
— —
2
¬ (Rn8 of @ERd) → Z
— — —
— —
6
¬ (Rn8 of @aa:8) → Z
— — —
— —
6
(#xx:3 of Rd8) → C
— — — — —
2
BST #xx:3, @ERd
B
BST #xx:3, @aa:8
B
BIST #xx:3, Rd
B
BIST #xx:3, @ERd
B
BIST #xx:3, @aa:8
B
BAND #xx:3, Rd
B
BAND #xx:3, @ERd
B
BAND #xx:3, @aa:8
B
BIAND #xx:3, Rd
B
4
2
4
4
2
4
4
2
4
4
2
BIAND #xx:3, @ERd B
4
BIAND #xx:3, @aa:8 B
BOR #xx:3, Rd
B
BOR #xx:3, @ERd
B
BOR #xx:3, @aa:8
B
BIOR #xx:3, Rd
B
BIOR #xx:3, @ERd
B
BIOR #xx:3, @aa:8
B
BXOR #xx:3, Rd
B
BXOR #xx:3, @ERd
B
BXOR #xx:3, @aa:8
B
BIXOR #xx:3, Rd
B
BIXOR #xx:3, @ERd B
BIXOR #xx:3, @aa:8 B
4
2
4
4
2
4
4
2
4
4
2
4
4
Operation
I
H N
Z
V
C
Advanced
B
4
Condition Code
Normal
B
BST #xx:3, Rd
2
No. of
States*1
—
BILD #xx:3, @aa:8
4
@@aa
B
4
@(d, PC)
B
BILD #xx:3, @ERd
@aa
BILD #xx:3, Rd
@–ERn/@ERn+
B
@(d, ERn)
BLD #xx:3, @aa:8
@ERn
B
Rn
BLD #xx:3, @ERd
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
(#xx:3 of @ERd) → C
— — — — —
6
(#xx:3 of @aa:8) → C
— — — — —
6
¬ (#xx:3 of Rd8) → C
— — — — —
2
¬ (#xx:3 of @ERd) → C
— — — — —
6
¬ (#xx:3 of @aa:8) → C
— — — — —
6
C → (#xx:3 of Rd8)
— — — — — —
2
C → (#xx:3 of @ERd24)
— — — — — —
8
C → (#xx:3 of @aa:8)
— — — — — —
8
¬ C → (#xx:3 of Rd8)
— — — — — —
2
¬ C → (#xx:3 of @ERd24)
— — — — — —
8
¬ C → (#xx:3 of @aa:8)
— — — — — —
8
C∧(#xx:3 of Rd8) → C
— — — — —
2
C∧(#xx:3 of @ERd24) → C
— — — — —
6
C∧(#xx:3 of @aa:8) → C
— — — — —
6
C∧ ¬ (#xx:3 of Rd8) → C
— — — — —
2
C∧ ¬ (#xx:3 of @ERd24) → C — — — — —
6
C∧ ¬ (#xx:3 of @aa:8) → C
— — — — —
6
C∨(#xx:3 of Rd8) → C
— — — — —
2
C∨(#xx:3 of @ERd24) → C
— — — — —
6
C∨(#xx:3 of @aa:8) → C
— — — — —
6
C∨ ¬ (#xx:3 of Rd8) → C
— — — — —
2
C∨ ¬ (#xx:3 of @ERd24) → C — — — — —
6
C∨ ¬ (#xx:3 of @aa:8) → C
— — — — —
6
C⊕(#xx:3 of Rd8) → C
— — — — —
2
C⊕(#xx:3 of @ERd24) → C
— — — — —
6
C⊕(#xx:3 of @aa:8) → C
— — — — —
6
C⊕ ¬ (#xx:3 of Rd8) → C
— — — — —
2
C⊕ ¬ (#xx:3 of @ERd24) → C
— — — — —
6
C⊕ ¬ (#xx:3 of @aa:8) → C
— — — — —
6
Rev. 2.0, 06/04, page 785 of 980
6. Branching instructions
4
BHI d:8
—
2
BHI d:16
—
4
BLS d:8
—
2
BLS d:16
—
4
BCC d:8 (BHS d:8)
—
2
BCC d:16 (BHS d:16) —
4
BCS d:8 (BLO d:8)
—
2
BCS d:16 (BLO d:16) —
4
BNE d:8
—
2
BNE d:16
—
4
BEQ d:8
—
2
BEQ d:16
—
4
BVC d:8
—
2
BVC d:16
—
4
BVS d:8
—
2
BVS d:16
—
4
BPL d:8
—
2
BPL d:16
—
4
BMI d:8
—
2
BMI d:16
—
4
BGE d:8
—
2
BGE d:16
—
4
BLT d:8
—
2
BLT d:16
—
4
BGT d:8
—
2
BGT d:16
—
4
Rev. 2.0, 06/04, page 786 of 980
If condition Always
is true then
PC ←
PC+d else Never
next;
C⁄Z=0
C⁄Z=1
C=0
C=1
Z=0
Z=1
V=0
V=1
N=0
N=1
N⊕V = 0
N⊕V = 1
Z ⁄ (N⊕V)
=0
Condition Code
I
H N
Z
V
C
Advanced
—
Branch
Operation Condition
Normal
BRN d:16 (BF d:16)
No. of
States*1
—
2
@@aa
4
—
@(d, PC)
—
BRN d:8 (BF d:8)
@aa
BRA d:16 (BT d:16)
@(d, ERn)
2
@ERn
—
Rn
BRA d:8 (BT d:8)
#xx
Mnemonic
Operand Size
@–ERn/@ERn+
Addressing Mode and
Instruction Length (bytes)
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
—
JMP @@aa:8
—
BSR d:8
—
BSR d:16
—
JSR @ERn
—
JSR @aa:24
—
JSR @@aa:8
—
RTS
—
Condition Code
I
H N
Z
V
C
Advanced
JMP @aa:24
Branch
Operation Condition
Normal
—
No. of
States*1
—
JMP @ERn
@@aa
4
@(d, PC)
—
@aa
BLE d:16
@(d, ERn)
2
@ERn
—
Rn
BLE d:8
#xx
Mnemonic
Operand Size
@–ERn/@ERn+
Addressing Mode and
Instruction Length (bytes)
If condition Z ⁄ (N⊕V) = 1
is true then
PC ← PC+d
else next;
— — — — — —
4
— — — — — —
6
PC ← ERn
— — — — — —
4
PC ← aa:24
— — — — — —
PC ← @aa:8
— — — — — —
8
10
2
PC → @–SP
PC ← PC+d:8
— — — — — —
6
8
4
PC → @–SP
PC ← PC+d:16
— — — — — —
8
10
PC → @–SP
PC ← @ERn
— — — — — —
6
8
PC → @–SP
PC ← @aa:24
— — — — — —
8
10
PC → @–SP
PC ← @aa:8
— — — — — —
8
12
2 PC ← @SP+
— — — — — —
8
10
2
4
2
2
4
2
6
Rev. 2.0, 06/04, page 787 of 980
7. System control instructions
No. of
States*1
—
Transition to powerdown — — — — — —
state
2
LDC #xx:8, CCR
B
#xx:8 → CCR
2
Rs8 → CCR
2
@ERs → CCR
6
2
Normal
—
Condition Code
Advanced
SLEEP
@@aa
10
@(d, PC)
CCR ← @SP+
PC ← @SP+
@aa
—
@(d, ERn)
RTE
@ERn
—
Rn
TRAPA #x:2
#xx
Mnemonic
Operand Size
@–ERn/@ERn+
Addressing Mode and
Instruction Length (bytes)
Operation
I
2
PC → @–SP
CCR → @–SP
<vector> → PC
1 — — — — — 14 16
H N
Z
V
C
LDC Rs, CCR
B
LDC @ERs, CCR
W
LDC @(d:16, ERs),
CCR
W
6
@(d:16, ERs) → CCR
8
LDC @(d:24, ERs),
CCR
W
10
@(d:24, ERs) → CCR
12
LDC @ERs+, CCR
W
@ERs → CCR
ERs32+2 → ERs32
8
LDC @aa:16, CCR
W
6
@aa:16 → CCR
8
LDC @aa:24, CCR
W
8
@aa:24 → CCR
10
2
4
4
CCR → Rd8
— — — — — —
2
CCR → @ERd
— — — — — —
6
6
CCR → @(d:16, ERd)
— — — — — —
8
10
CCR → @(d:24, ERd)
— — — — — —
12
ERd32–2 → ERd32
CCR → @ERd
— — — — — —
8
6
CCR → @aa:16
— — — — — —
8
8
CCR → @aa:24
— — — — — —
10
STC CCR, Rd
B
STC CCR, @ERd
W
STC CCR, @(d:16,
ERd)
W
STC CCR, @(d:24,
ERd)
W
STC CCR, @-ERd
W
STC CCR, @aa:16
W
STC CCR, @aa:24
W
ANDC #xx:8, CCR
B
2
CCR∧#xx:8 → CCR
2
ORC #xx:8, CCR
B
2
CCR∨#xx:8 → CCR
2
XORC #xx:8, CCR
B
2
NOP
—
2
4
4
Rev. 2.0, 06/04, page 788 of 980
CCR⊕#xx:8 → CCR
2 PC ← PC+2
2
— — — — — —
2
8. Block transfer instructions
Operation
I
H N
Z
V
C
— — — — — —
Normal
—
@@aa
@(d, PC)
4 if R4 - 0
repeat @R5 → @R6
R5+1 → R5
R6+1 → R6
R4–1 → R4
until
R4=0
else next;
@aa
—
@(d, ERn)
EEPMOV. W
@ERn
4 if R4L - 0
— — — — — — 8+
repeat @R5 → @R6
4n*2
R5+1 → R5
R6+1 → R6
R4L–1 → R4L
until
R4L=0
else next;
Rn
—
#xx
Mnemonic
EEPMOV. B
Condition Code
Advanced
No. of
States*1
Operand Size
@–ERn/@ERn+
Addressing Mode and
Instruction Length (bytes)
8+
4n*2
Notes: *1 The number of states is the number of states required for execution when the
instruction and its operands are located in on-chip memory. For other cases see
section A.3.
*2 n is the value set in register R4L or R4.
(1) Set to 1 when a carry or borrow occurs at bit 11; otherwise cleared to 0.
(2) Set to 1 when a carry or borrow occurs at bit 27; otherwise cleared to 0.
(3) Retains its previous value when the result is zero; otherwise cleared to 0.
(4) Set to 1 when the adjustment produces a carry; otherwise retains its previous value.
(5) The number of states required for execution of an instruction that transfers data in
synchronization with the E clock is variable.
(6) Set to 1 when the divisor is negative; otherwise cleared to 0.
(7) Set to 1 when the divisor is zero; otherwise cleared to 0.
(8) Set to 1 when the quotient is negative; otherwise cleared to 0.
Rev. 2.0, 06/04, page 789 of 980
Rev. 2.0, 06/04, page 790 of 980
MULXU
5
STC
Table A.2
(2)
LDC
3
SUBX
OR
XOR
AND
MOV
C
D
E
F
BILD
BIST
BLD
BST
TRAPA
BNQ
B
BIAND
BAND
AND
RTE
BNE
CMP
BIXOR
BXOR
XOR
BSR
BCS
A
BIOR
BOR
OR
RTS
BCC
MOV.B
Table A.2
(2)
LDC
7
ADDX
BTST
DIVXU
BLS
AND.B
ANDC
6
9
BCLR
MULXU
BHI
XOR.B
XORC
5
ADD
BNOT
DIVXU
BRN
OR.B
ORC
4
MOV
BVS
9
B
JMP
BPL
BMI
MOV
Table A.2 Table A.2
(2)
(2)
Table A.2 Table A.2
(2)
(2)
A
Table A.2 Table A.2
EEPMOV
(2)
(2)
SUB
ADD
Table A.2
(2)
BVC
8
BSR
BGE
C
CMP
MOV
Instruction when most significant bit of BH is 1.
Instruction when most significant bit of BH is 0.
8
7
BSET
BRA
6
2
1
Table A.2 Table A.2 Table A.2 Table A.2
(2)
(2)
(2)
(2)
NOP
0
4
3
2
1
0
AL
1st byte 2nd byte
AH AL BH BL
E
JSR
BGT
SUBX
ADDX
Table A.2
(3)
BLT
D
BLE
Table A.2
(2)
Table A.2
(2)
F
Table A.2
AH
Instruction code:
A.2 Operation Code Map (1)
A.2
Operation Code Maps
Operation Code Map (1)
SUBS
DAS
BRA
MOV
MOV
1B
1F
58
79
7A
1
ADD
ADD
CMP
CMP
BHI
2
SUB
SUB
BLS
NOT
ROTXR
ROTXL
SHLR
SHLL
3
4
OR
OR
BCC
LDC/STC
1st byte 2nd byte
AH AL BH BL
BRN
NOT
17
DEC
ROTXR
13
1A
ROTXL
12
DAA
0F
SHLR
ADDS
0B
11
INC
0A
SHLL
MOV
01
10
0
BH
AH AL
Instruction code:
XOR
XOR
BCS
DEC
EXTU
INC
5
AND
AND
BNE
6
BEQ
DEC
EXTU
INC
7
BVC
SUBS
NEG
9
BVS
ROTR
ROTL
SHAR
SHAL
ADDS
SLEEP
8
BPL
A
MOV
BMI
NEG
CMP
SUB
ROTR
ROTL
SHAR
C
D
BGE
BLT
DEC
EXTS
INC
Table A.2 Table A.2
(3)
(3)
ADD
SHAL
B
BGT
E
BLE
DEC
EXTS
INC
Table A.2
(3)
F
Table A.2
Operation Code Map (2)
Rev. 2.0, 06/04, page 791 of 980
CL
Rev. 2.0, 06/04, page 792 of 980
DIVXS
3
BSET
7Faa7 * 2
BNOT
BNOT
BCLR
BCLR
Notes: *1 r is the register designation field.
*2 aa is the absolute address field.
BSET
7Faa6 * 2
BTST
BCLR
7Eaa7 * 2
BNOT
BTST
BSET
7Dr07 * 1
7Eaa6 * 2
BSET
7Dr06 * 1
BTST
BCLR
MULXS
2
7Cr07 * 1
BNOT
DIVIXS
1
BTST
MULXS
0
BIOR
BOR
BIOR
BOR
OR
4
BIXOR
BXOR
BIXOR
BXOR
XOR
5
BIAND
BAND
BIAND
BAND
AND
6
7
BIST
BILD
BST
BLD
BIST
BILD
BST
BLD
1st byte 2nd byte 3rd byte 4th byte
AH AL BH BL CH CL DH DL
7Cr06 * 1
01F06
01D05
01C05
01406
AH
ALBH
BLCH
Instruction code:
8
LDC
STC
9
A
LDC
STC
B
C
LDC
STC
D
E
LDC
STC
F
Instruction when most significant bit of DH is 1.
Instruction when most significant bit of DH is 0.
Table A.2
Operation Code Map (3)
A.3
Number of States Required for Execution
The tables in this section can be used to calculate the number of states required for instruction
execution by the H8/300H CPU. Table A.4 indicates the number of instruction fetch, data
read/write, and other cycles occurring in each instruction. Table A.3 indicates the number of states
required per cycle according to the bus size. The number of states required for execution of an
instruction can be calculated from these two tables as follows:
Number of states = I • SI + J • SJ + K • SK + L • SL + M • SM + N • SN
Examples of Calculation of Number of States Required for Execution
Examples: Advanced mode, stack located in external address space, on-chip supporting modules
accessed with 8-bit bus width, external devices accessed in three states with one wait state and
16-bit bus width.
BSET #0, @FFFFC7:8
From table A.4, I = L = 2 and J = K = M = N = 0
From table A.3, SI = 4 and SL = 3
Number of states = 2 × 4 + 2 × 3 = 14
JSR @@30
From table A.4, I = J = K = 2 and L = M = N = 0
From table A.3, SI = SJ = SK = 4
Number of states = 2 × 4 + 2 × 4 + 2 × 4 = 24
Rev. 2.0, 06/04, page 793 of 980
Table A.3
Number of States per Cycle
Access Conditions
External Device
On-Chip Supporting Module
Execution State
(Cycle)
Instruction fetch
SI
8-Bit Bus
16-Bit Bus
On-Chip 8-Bit
Memory Bus
16-Bit
Bus
2-State
Access
3-State
Access
2-State
Access
3-State
Access
2
3
4
6 + 2m
2
3+m
6
Branch address read SJ
Stack operation
SK
Byte data access
SL
3
2
3+m
Word data access
SM
6
4
6 + 2m
Internal operation
SN 1
Legend
m:
Number of wait states inserted into external device access
Rev. 2.0, 06/04, page 794 of 980
Table A.4
Number of Cycles per Instruction
Instruction Mnemonic
Byte Data Word Data Internal
Stack
Instruction Branch
Operation
Access
Addr. Read Operation Access
Fetch
N
M
L
K
J
I
ADD
ADD.B #xx:8, Rd
ADD.B Rs, Rd
ADD.W #xx:16, Rd
ADD.W Rs, Rd
ADD.L #xx:32, ERd
ADD.L ERs, ERd
1
1
2
1
3
1
ADDS
ADDS #1/2/4, ERd
1
ADDX
ADDX #xx:8, Rd
ADDX Rs, Rd
1
1
AND
AND.B #xx:8, Rd
AND.B Rs, Rd
AND.W #xx:16, Rd
AND.W Rs, Rd
AND.L #xx:32, ERd
AND.L ERs, ERd
1
1
2
1
3
2
ANDC
ANDC #xx:8, CCR
1
BAND
BAND #xx:3, Rd
BAND #xx:3, @ERd
BAND #xx:3, @aa:8
1
2
2
BRA d:8 (BT d:8)
BRN d:8 (BF d:8)
BHI d:8
BLS d:8
BCC d:8 (BHS d:8)
BCS d:8 (BLO d:8)
BNE d:8
BEQ d:8
BVC d:8
BVS d:8
BPL d:8
BMI d:8
BGE d:8
BLT d:8
BGT d:8
BLE d:8
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Bcc
1
1
Rev. 2.0, 06/04, page 795 of 980
Instruction Mnemonic
Byte Data Word Data Internal
Stack
Instruction Branch
Operation
Access
Addr. Read Operation Access
Fetch
N
M
L
K
J
I
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Bcc
BRA d:16 (BT d:16)
BRN d:16 (BF d:16)
BHI d:16
BLS d:16
BCC d:16 (BHS d:16)
BCS d:16 (BLO d:16)
BNE d:16
BEQ d:16
BVC d:16
BVS d:16
BPL d:16
BMI d:16
BGE d:16
BLT d:16
BGT d:16
BLE d:16
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
BCLR
BCLR #xx:3, Rd
BCLR #xx:3, @ERd
BCLR #xx:3, @aa:8
BCLR Rn, Rd
BCLR Rn, @ERd
BCLR Rn, @aa:8
1
2
2
1
2
2
BIAND #xx:3, Rd
BIAND #xx:3, @ERd
BIAND #xx:3, @aa:8
1
2
2
1
1
BILD #xx:3, Rd
BILD #xx:3, @ERd
BILD #xx:3, @aa:8
1
2
2
1
1
BIOR #xx:8, Rd
BIOR #xx:8, @ERd
BIOR #xx:8, @aa:8
1
2
2
1
1
BIST #xx:3, Rd
BIST #xx:3, @ERd
BIST #xx:3, @aa:8
1
2
2
2
2
BIXOR #xx:3, Rd
BIXOR #xx:3, @ERd
BIXOR #xx:3, @aa:8
1
2
2
1
1
BLD #xx:3, Rd
BLD #xx:3, @ERd
BLD #xx:3, @aa:8
1
2
2
1
1
BIAND
BILD
BIOR
BIST
BIXOR
BLD
Rev. 2.0, 06/04, page 796 of 980
2
2
2
2
Byte Data Word Data Internal
Stack
Instruction Branch
Operation
Access
Addr. Read Operation Access
Fetch
N
M
L
K
J
I
Instruction Mnemonic
BNOT
BOR
BSET
BSR
BNOT #xx:3, Rd
BNOT #xx:3, @ERd
BNOT #xx:3, @aa:8
BNOT Rn, Rd
BNOT Rn, @ERd
BNOT Rn, @aa:8
1
2
2
1
2
2
BOR #xx:3, Rd
BOR #xx:3, @ERd
BOR #xx:3, @aa:8
1
2
2
BSET #xx:3, Rd
BSET #xx:3, @ERd
BSET #xx:3, @aa:8
BSET Rn, Rd
BSET Rn, @ERd
BSET Rn, @aa:8
1
2
2
1
2
2
BSR d:8
2
1
Advanced 2
2
Normal
BSR d:16 Normal
2
2
2
2
1
2
2
2
BTST #xx:3, Rd
BTST #xx:3, @ERd
BTST #xx:3, @aa:8
BTST Rn, Rd
BTST Rn, @ERd
BTST Rn, @aa:8
1
2
2
1
2
2
BXOR #xx:3, Rd
BXOR #xx:3, @ERd
BXOR #xx:3, @aa:8
1
2
2
CMP
CMP.B #xx:8, Rd
CMP.B Rs, Rd
CMP.W #xx:16, Rd
CMP.W Rs, Rd
CMP.L #xx:32, ERd
CMP.L ERs, ERd
1
1
2
1
3
1
DAA
DAA Rd
1
DAS
DAS Rd
1
BXOR
1
1
2
1
2
2
BTST
2
2
Advanced 2
BST #xx:3, Rd
BST #xx:3, @ERd
BST #xx:3, @aa:8
BST
2
2
2
2
1
1
1
1
1
1
Rev. 2.0, 06/04, page 797 of 980
Byte Data Word Data Internal
Stack
Instruction Branch
Operation
Access
Addr. Read Operation Access
Fetch
N
M
L
K
J
I
Instruction Mnemonic
DEC
DEC.B Rd
DEC.W #1/2, Rd
DEC.L #1/2, ERd
1
1
1
DIVXS
DIVXS.B Rs, Rd
DIVXS.W Rs, ERd
2
2
12
20
DIVXU
DIVXU.B Rs, Rd
DIVXU.W Rs, ERd
1
1
12
20
EEPMOV
EEPMOV.B
EEPMOV.W
2
2
EXTS
EXTS.W Rd
EXTS.L ERd
1
1
EXTU
EXTU.W Rd
EXTU.L ERd
1
1
INC
INC.B Rd
INC.W #1/2, Rd
INC.L #1/2, ERd
1
1
1
JMP
JMP @ERn
2
JMP @aa:24
2
JMP @@aa:8 Normal
JSR
JSR @ERn
2n + 2*1
2n + 2*1
2
2
1
2
Advanced 2
2
2
Normal
2
1
Advanced 2
2
JSR @aa:24 Normal
2
Advanced 2
JSR @@aa:8 Normal
LDC
1
2
2
2
2
1
1
Advanced 2
2
2
LDC #xx:8, CCR
LDC Rs, CCR
LDC @ERs, CCR
LDC @(d:16, ERs), CCR
LDC @(d:24, ERs), CCR
LDC @ERs+, CCR
LDC @aa:16, CCR
LDC @aa:24, CCR
Rev. 2.0, 06/04, page 798 of 980
1
1
2
3
5
2
3
4
1
1
1
1
1
1
2
Instruction Mnemonic
MOV
Byte Data Word Data Internal
Stack
Instruction Branch
Operation
Access
Addr. Read Operation Access
Fetch
N
M
L
K
J
I
MOV.B #xx:8, Rd
MOV.B Rs, Rd
MOV.B @ERs, Rd
MOV.B @(d:16, ERs), Rd
MOV.B @(d:24, ERs), Rd
MOV.B @ERs+, Rd
MOV.B @aa:8, Rd
MOV.B @aa:16, Rd
MOV.B @aa:24, Rd
MOV.B Rs, @ERd
MOV.B Rs, @(d:16, ERd)
MOV.B Rs, @(d:24, ERd)
MOV.B Rs, @–ERd
MOV.B Rs, @aa:8
MOV.B Rs, @aa:16
MOV.B Rs, @aa:24
1
1
1
2
4
1
1
2
3
1
2
4
1
1
2
3
MOV.W #xx:16, Rd
MOV.W Rs, Rd
MOV.W @ERs, Rd
MOV.W @(d:16, ERs), Rd
MOV.W @(d:24, ERs), Rd
MOV.W @ERs+, Rd
MOV.W @aa:16, Rd
MOV.W @aa:24, Rd
MOV.W Rs, @ERd
MOV.W Rs, @(d:16, ERd)
MOV.W Rs, @(d:24, ERd)
MOV.W Rs, @–ERd
MOV.W Rs, @aa:16
MOV.W Rs, @aa:24
2
1
1
2
4
1
2
3
1
2
4
1
2
3
1
1
1
1
1
1
1
1
1
1
1
1
MOV.L #xx:32, ERd
MOV.L ERs, ERd
MOV.L @ERs, ERd
MOV.L @(d:16, ERs), ERd
MOV.L @(d:24, ERs), ERd
MOV.L @ERs+, ERd
MOV.L @aa:16, ERd
MOV.L @aa:24, ERd
MOV.L ERs, @ERd
MOV.L ERs, @(d:16, ERd)
MOV.L ERs, @(d:24, ERd)
MOV.L ERs, @–ERd
MOV.L ERs, @aa:16
MOV.L ERs, @aa:24
3
1
2
3
5
2
3
4
2
3
5
2
3
4
2
2
2
2
2
2
2
2
2
2
2
2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
2
2
2
2
2
Rev. 2.0, 06/04, page 799 of 980
Byte Data Word Data Internal
Stack
Instruction Branch
Operation
Access
Addr. Read Operation Access
Fetch
N
M
L
K
J
I
Instruction Mnemonic
MOVFPE
MOVFPE @aa:16, Rd*2 2
1
2
MOVTPE
MOVTPE Rs, @aa:16* 2
MULXS
MULXS.B Rs, Rd
MULXS.W Rs, ERd
2
2
12
20
MULXU
MULXU.B Rs, Rd
MULXU.W Rs, ERd
1
1
12
20
NEG
NEG.B Rd
NEG.W Rd
NEG.L ERd
1
1
1
NOP
NOP
1
NOT
NOT.B Rd
NOT.W Rd
NOT.L ERd
1
1
1
OR
OR.B #xx:8, Rd
OR.B Rs, Rd
OR.W #xx:16, Rd
OR.W Rs, Rd
OR.L #xx:32, ERd
OR.L ERs, ERd
1
1
2
1
3
2
ORC
ORC #xx:8, CCR
1
POP
POP.W Rn
POP.L ERn
1
2
1
2
2
2
PUSH
PUSH.W Rn
PUSH.L ERn
1
2
1
2
2
2
ROTL
ROTL.B Rd
ROTL.W Rd
ROTL.L ERd
1
1
1
ROTR
ROTR.B Rd
ROTR.W Rd
ROTR.L ERd
1
1
1
ROTXL
ROTXL.B Rd
ROTXL.W Rd
ROTXL.L ERd
1
1
1
ROTXR
ROTXR.B Rd
ROTXR.W Rd
ROTXR.L ERd
1
1
1
RTE
RTE
2
Rev. 2.0, 06/04, page 800 of 980
1
2
2
Byte Data Word Data Internal
Stack
Instruction Branch
Operation
Access
Addr. Read Operation Access
Fetch
N
M
L
K
J
I
Instruction Mnemonic
RTS
RTS
Normal
2
1
2
Advanced 2
2
2
SHAL
SHAL.B Rd
SHAL.W Rd
SHAL.L ERd
1
1
1
SHAR
SHAR.B Rd
SHAR.W Rd
SHAR.L ERd
1
1
1
SHLL
SHLL.B Rd
SHLL.W Rd
SHLL.L ERd
1
1
1
SHLR
SHLR.B Rd
SHLR.W Rd
SHLR.L ERd
1
1
1
SLEEP
SLEEP
1
STC
1
STC CCR, Rd
2
STC CCR, @ERd
STC CCR, @(d:16, ERd) 3
STC CCR, @(d:24, ERd) 5
2
STC CCR, @–ERd
3
STC CCR, @aa:16
4
STC CCR, @aa:24
1
1
1
1
1
1
2
1
2
1
3
1
SUB
SUB.B Rs, Rd
SUB.W #xx:16, Rd
SUB.W Rs, Rd
SUB.L #xx:32, ERd
SUB.L ERs, ERd
SUBS
SUBS #1/2/4, ERd
1
SUBX
SUBX #xx:8, Rd
SUBX Rs, Rd
1
1
TRAPA
TRAPA #x:2 Normal
2
1
2
4
Advanced 2
2
2
4
XOR
XOR.B #xx:8, Rd
XOR.B Rs, Rd
XOR.W #xx:16, Rd
XOR.W Rs, Rd
XOR.L #xx:32, ERd
XOR.L ERs, ERd
1
1
2
1
3
2
XORC
XORC #xx:8, CCR
1
Notes: *1 n is the value set in register R4L or R4. The source and destination are accessed n + 1
times each.
*2 Not available in the H8/3029.
Rev. 2.0, 06/04, page 801 of 980
Appendix B Internal I/O Registers
B.1
Addresses (EMC = 1)
Address
(Low)
Data
Register Bus
Width Bit 7
Name
H'EE000
P1DDR
8
H'EE001
P2DDR
8
H'EE002
P3DDR
H'EE003
Bit Names
Bit 1
Bit 0
Module
Name
P17DDR P16DDR P15DDR P14DDR P13DDR P12DDR
P11DDR
P10DDR
Port 1
P27DDR P26DDR P25DDR P24DDR P23DDR P22DDR
P21DDR
P20DDR
Port 2
8
P37DDR P36DDR P35DDR P34DDR P33DDR P32DDR
P31DDR
P30DDR
Port 3
P4DDR
8
P47DDR P46DDR P45DDR P44DDR P43DDR P42DDR
P41DDR
P40DDR
Port 4
H'EE004
P5DDR
8
—
—
P53DDR P52DDR
P51DDR
P50DDR
Port 5
H'EE005
P6DDR
8
—
P66DDR P65DDR P64DDR P63DDR P62DDR
P61DDR
P60DDR
Port 6
H'EE006
—
—
—
—
—
Bit 6
Bit 5
—
Bit 4
—
—
—
Bit 3
—
Bit 2
—
H'EE007
P8DDR
8
—
—
—
P84DDR P83DDR P82DDR
P81DDR
P80DDR
Port 8
H'EE008
P9DDR
8
—
—
P95DDR P94DDR P93DDR P92DDR
P91DDR
P90DDR
Port 9
H'EE009
PADDR
8
PA7DDR PA6DDR PA5DDR PA4DDR PA3DDR PA2DDR
PA1DDR
PA0DDR
Port A
H'EE00A
PBDDR
8
PB7DDR PB6DDR PB5DDR PB4DDR PB3DDR PB2DDR
PB1DDR
PB0DDR
Port B
H'EE00B
—
—
—
—
—
—
—
—
—
H'EE00C
—
—
—
—
—
—
—
—
—
H'EE00D
—
—
—
—
—
—
—
—
—
H'EE00E
—
—
—
—
—
—
—
—
—
H'EE00F
—
—
—
—
—
—
—
—
—
H'EE010
—
—
—
—
—
—
—
—
—
H'EE011
MDCR
8
—
—
—
—
—
MDS2
MDS1
MDS0
H'EE012
SYSCR
8
SSBY
STS2
STS1
STS0
UE
NMIEG
SSOE
RAME
H'EE013
BRCR
8
A23E
A22E
A21E
A20E
—
—
—
BRLE
Bus controller
H'EE014
ISCR
8
—
—
IRQ5SC IRQ4SC IRQ3SC IRQ2SC
IRQ1SC
IRQ0SC
H'EE015
IER
8
—
—
IRQ5E
IRQ4E
IRQ3E
IRQ2E
IRQ1E
IRQ0E
Interrupt
controller
H'EE016
ISR
8
—
—
IRQ5F
IRQ4F
IRQ3F
IRQ2F
IRQ1F
IRQ0F
H'EE017
—
—
—
—
—
—
—
—
—
H'EE018
IPRA
8
IPRA7
IPRA6
IPRA5
IPRA4
IPRA3
IPRA2
IPRA1
IPRA0
H'EE019
IPRB
8
IPRB7
IPRB6
IPRB5
—
IPRB3
IPRB2
IPRB1
—
H'EE01A
DASTCR 8
—
—
—
—
—
—
—
DASTE
D/A converter
H'EE01B
DIVCR
—
—
—
—
—
—
DIV1
DIV0
H'EE01C
MSTCRH 8
PSTOP
—
—
—
—
MSTPH2 MSTPH1 MSTPH0
System
control
8
System
control
H'EE01D
MSTCRL 8
MSTPL7 —
MSTPL5 MSTPL4 MSTPL3 MSTPL2 —
H'EE01E
ADRCR
8
—
—
—
—
—
—
—
ADRCTL Bus controller
H'EE01F
CSCR
8
CS7E
CS6E
CS5E
CS4E
—
—
—
—
Rev. 2.0, 06/04, page 802 of 980
MSTPL0
Address
(Low)
Data
Register Bus
Width Bit 7
Name
Bit Names
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
H'EE020
ABWCR
8
ABW7
ABW6
ABW5
ABW4
ABW3
ABW2
ABW1
ABW0
H'EE021
ASTCR
8
AST7
AST6
AST5
AST4
AST3
AST2
AST1
AST0
H'EE022
WCRH
8
W71
W70
W61
W60
W51
W50
W41
W40
H'EE023
WCRL
8
W31
W30
W21
W20
W11
W10
W01
W00
H'EE024
BCR
8
ICIS1
ICIS0
BROME BRSTS1 BRSTS0 —
RDEA
WAITE
H'EE025
—
—
—
—
—
—
—
—
—
BE
H'EE026
DRCRA
8
DRAS2
DRAS1
DRAS0
—
RDM
SRFMD
RFSHE
H'EE027
DRCRB
8
MXC1
MXC0
CSEL
RCYCE —
TPC
RCW
RLW
H'EE028
RTMCSR 8
CMF
CMIE
CKS2
CKS1
CKS0
—
—
—
H'EE029
RTCNT
8
H'EE02A
RTCOR
8
H'EE02B
—
—
—
—
—
—
—
—
—
H'EE02C
—
—
—
—
—
—
—
—
—
H'EE02D
—
—
—
—
—
—
—
—
—
H'EE02E
—
—
—
—
—
—
—
—
—
H'EE02F
—
—
—
—
—
—
—
—
—
H'EE030
—
—
—
—
—
—
—
—
—
H'EE031
—
—
—
—
—
—
—
—
—
H'EE032
—
—
—
—
—
—
—
—
—
H'EE033
—
—
—
—
—
—
—
—
—
H'EE034
—
—
—
—
—
—
—
—
—
H'EE035
—
—
—
—
—
—
—
—
—
H'EE036
—
—
—
—
—
—
—
—
—
H'EE037
—
—
—
—
—
—
—
—
—
H'EE038
Reserved area (access prohibited)
P21PCR
P20PCR
Module
Name
Bus
controller
DRAM
Interface
H'EE039
H'EE03A
H'EE03B
H'EE03C
P2PCR
8
P27PCR P26PCR P25PCR P24PCR P23PCR P22PCR
—
—
H'EE03D
—
—
—
H'EE03E
P4PCR
8
P47PCR P46PCR P45PCR P44PCR P43PCR P42PCR
P41PCR
P40PCR
Port 4
H'EE03F
P5PCR
8
—
P51PCR
P50PCR
Port 5
—
—
—
—
—
—
—
Port 2
P53PCR P52PCR
Rev. 2.0, 06/04, page 803 of 980
Address
(Low)
Data
Register Bus
Width Bit 7
Name
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
H'EE040
—
—
—
—
—
—
—
—
—
H'EE041
—
—
—
—
—
—
—
—
—
H'EE042
—
—
—
—
—
—
—
—
—
H'EE043
—
—
—
—
—
—
—
—
—
H'EE044
—
—
—
—
—
—
—
—
—
H'EE045
—
—
—
—
—
—
—
—
—
H'EE046
—
—
—
—
—
—
—
—
—
H'EE047
—
—
—
—
—
—
—
—
—
H'EE048
—
—
—
—
—
—
—
—
—
Bit Names
H'EE049
—
—
—
—
—
—
—
—
—
H'EE04A
—
—
—
—
—
—
—
—
—
H'EE04B
—
—
—
—
—
—
—
—
—
H'EE04C
—
—
—
—
—
—
—
—
—
H'EE04D
—
—
—
—
—
—
—
—
—
H'EE04E
—
—
—
—
—
—
—
—
—
H'EE04F
—
—
—
—
—
—
—
—
—
H'EE050
—
—
—
—
—
—
—
—
—
H'EE051
—
—
—
—
—
—
—
—
—
H'EE052
—
—
—
—
—
—
—
—
—
H'EE053
—
—
—
—
—
—
—
—
—
H'EE054
—
—
—
—
—
—
—
—
—
H'EE055
—
—
—
—
—
—
—
—
—
H'EE056
—
—
—
—
—
—
—
—
—
H'EE057
—
—
—
—
—
—
—
—
—
H'EE058
—
—
—
—
—
—
—
—
—
H'EE059
—
—
—
—
—
—
—
—
—
H'EE05A
—
—
—
—
—
—
—
—
—
H'EE05B
—
—
—
—
—
—
—
—
—
H'EE05C
—
—
—
—
—
—
—
—
—
H'EE05D
—
—
—
—
—
—
—
—
—
H'EE05E
—
—
—
—
—
—
—
—
—
H'EE05F
—
—
—
—
—
—
—
—
—
Rev. 2.0, 06/04, page 804 of 980
Module
Name
Address
(Low)
Data
Register Bus
Width Bit 7
Name
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
H'EE060
—
—
—
—
—
—
—
—
—
H'EE061
—
—
—
—
—
—
—
—
—
H'EE062
—
—
—
—
—
—
—
—
—
H'EE063
—
—
—
—
—
—
—
—
—
H'EE064
—
—
—
—
—
—
—
—
—
H'EE065
—
—
—
—
—
—
—
—
—
H'EE066
—
—
—
—
—
—
—
—
—
H'EE067
—
—
—
—
—
—
—
—
—
H'EE068
—
—
—
—
—
—
—
—
—
Bit Names
H'EE069
—
—
—
—
—
—
—
—
—
H'EE06A
—
—
—
—
—
—
—
—
—
H'EE06B
—
—
—
—
—
—
—
—
—
H'EE06C
—
—
—
—
—
—
—
—
—
H'EE06D
—
—
—
—
—
—
—
—
—
H'EE06E
—
—
—
—
—
—
—
—
—
H'EE06F
—
—
—
—
—
—
—
—
—
H'EE070
—
—
—
—
—
—
—
—
—
H'EE071
—
—
—
—
—
—
—
—
—
H'EE072
—
—
—
—
—
—
—
—
—
H'EE073
—
—
—
—
—
—
—
—
—
H'EE074
Reserved area (access prohibited)
Module
Name
H'EE075
H'EE076
H'EE077
RAMCR
H'EE078
—
8
—
—
—
—
RAMS
RAM2
RAM1
RAM0
—
—
—
—
—
—
—
—
Flash
memory*
H'EE079
—
—
—
—
—
—
—
—
—
H'EE07A
—
—
—
—
—
—
—
—
—
H'EE07B
—
—
—
—
—
—
—
—
—
H'EE07C
—
—
—
—
—
—
—
—
—
H'EE07D
—
—
—
—
—
—
—
—
—
H'EE07E
—
—
—
—
—
—
—
—
—
H'EE07F
—
—
—
—
—
—
—
—
—
Rev. 2.0, 06/04, page 805 of 980
Address
(Low)
Register
Name
Data
Bus
Width Bit 7
Bit Names
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
H'EE080
—
—
—
—
—
—
—
—
—
H'EE081
—
—
—
—
—
—
—
—
—
H'EE082
—
—
—
—
—
—
—
—
—
H'EE083
—
—
—
—
—
—
—
—
—
H'EE084
—
—
—
—
—
—
—
—
—
H'EE085
—
—
—
—
—
—
—
—
—
H'EE086
—
—
—
—
—
—
—
—
—
H'EE087
—
—
—
—
—
—
—
—
—
H'EE088
—
—
—
—
—
—
—
—
—
H'EE089
—
—
—
—
—
—
—
—
—
H'EE08A
—
—
—
—
—
—
—
—
—
H'EE08B
—
—
—
—
—
—
—
—
—
H'EE08C
—
—
—
—
—
—
—
—
—
H'EE08D
—
—
—
—
—
—
—
—
—
H'EE08E
—
—
—
—
—
—
—
—
—
H'EE08F
—
—
—
—
—
—
—
—
—
H'EE090
—
—
—
—
—
—
—
—
—
H'EE091
—
—
—
—
—
—
—
—
—
H'EE092
—
—
—
—
—
—
—
—
—
H'EE093
—
—
—
—
—
—
—
—
—
H'EE094
—
—
—
—
—
—
—
—
—
H'EE095
—
—
—
—
—
—
—
—
—
H'EE096
—
—
—
—
—
—
—
—
—
H'EE097
—
—
—
—
—
—
—
—
—
H'EE098
—
—
—
—
—
—
—
—
—
H'EE099
—
—
—
—
—
—
—
—
—
H'EE09A
—
—
—
—
—
—
—
—
—
H'EE09B
—
—
—
—
—
—
—
—
—
H'EE09C
—
—
—
—
—
—
—
—
—
H'EE09D
—
—
—
—
—
—
—
—
—
H'EE09E
—
—
—
—
—
—
—
—
—
H'EE09F
—
—
—
—
—
—
—
—
—
Rev. 2.0, 06/04, page 806 of 980
Module
Name
Address
(Low)
Register
Name
Data
Bus
Width Bit 7
Bit Names
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
H'EE0A0
—
—
—
—
—
—
—
—
—
H'EE0A1
—
—
—
—
—
—
—
—
—
H'EE0A2
—
—
—
—
—
—
—
—
—
H'EE0A3
—
—
—
—
—
—
—
—
—
H'EE0A4
—
—
—
—
—
—
—
—
—
H'EE0A5
—
—
—
—
—
—
—
—
—
H'EE0A6
—
—
—
—
—
—
—
—
—
H'EE0A7
—
—
—
—
—
—
—
—
—
H'EE0A8
—
—
—
—
—
—
—
—
—
H'EE0A9
—
—
—
—
—
—
—
—
—
H'EE0AA
—
—
—
—
—
—
—
—
—
H'EE0AB
—
—
—
—
—
—
—
—
—
H'EE0AC
—
—
—
—
—
—
—
—
—
H'EE0AD
—
—
—
—
—
—
—
—
—
H'EE0AE
—
—
—
—
—
—
—
—
—
H'EE0AF
—
—
—
—
—
—
—
—
—
H'EE0B0
FCCS
8
FWE
—
—
FLER
—
—
—
SCO
H'EE0B1
FPCS
8
—
—
—
—
—
—
—
PPVS
H'EE0B2
FECS
8
—
—
—
—
—
—
—
EPVB
H'EE0B3
Reserved area (access prohibited)
H'EE0B4
FKEY
8
K7
K6
K5
K4
K3
K2
K1
K0
H'EE0B5
FMATS
8
MS7
MS6
MS5
MS4
MS3
MS2
MS1
MS0
TDA6
TDA2
TDA1
TDA0
H'EE0B6
FTDAR
8
TDER
H'EE0B7
FVACR
8
FVCHG —
H'EE0B8
FVADRR
8
H'EE0B9
FVADRE
8
H'EE0BA
FVADRH
8
H'EE0BB
FVADRL
8
TDA5
TDA4
TDA3
—
—
FVSEL FVSEL FVSEL FVSEL
E
3
2
1
0
H'EE0BC
Reserved area (access prohibited)
H'EE0BD
—
—
—
—
—
—
—
—
—
H'EE0BE
—
—
—
—
—
—
—
—
—
H'EE0BF
—
—
—
—
—
—
—
—
—
Module
Name
Flash memory*
Rev. 2.0, 06/04, page 807 of 980
Address
(Low)
Register
Name
Data
Bus
Width Bit 7
H'FFF20
MAR0AR
8
H'FFF21
MAR0AE
8
H'FFF22
MAR0AH
8
H'FFF23
MAR0AL
8
H'FFF24
ETCR0AH 8
H'FFF25
ETCR0AL 8
H'FFF26
IOAR0A
8
H'FFF27
DTCR0A
8
H'FFF28
MAR0BR
8
H'FFF29
MAR0BE
8
H'FFF2A
MAR0BH
8
H'FFF2B
MAR0BL
8
H'FFF2C
ETCR0BH 8
H'FFF2D
ETCR0BL 8
H'FFF2E
IOAR0B
8
H'FFF2F
DTCR0B
8
H'FFF30
MAR1AR
8
H'FFF31
MAR1AE
8
H'FFF32
MAR1AH
8
H'FFF33
MAR1AL
8
H'FFF34
ETCR1AH 8
H'FFF35
ETCR1AL 8
H'FFF36
IOAR1A
8
H'FFF37
DTCR1A
8
H'FFF38
MAR1BR
8
H'FFF39
MAR1BE
8
H'FFF3A
MAR1BH
8
H'FFF3B
MAR1BL
8
H'FFF3C
ETCR1BH 8
H'FFF3D
ETCR1BL 8
H'FFF3E
IOAR1B
8
H'FFF3F
DTCR1B
8
Bit Names
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
DMAC channel 0A
DTE
DTSZ
DTID
RPE
DTIE
DTS2
DTE
DTSZ
SAID
SAIDE
DTIE
DTS2A DTS1A DTS0A Full address mode
DTS1
DTS0
Short address mode
DMAC channel 0B
DTE
DTSZ
DTID
RPE
DTIE
DTS2
DTME
—
DAID
DAIDE
TMS
DTS2B DTS1B DTS0B Full address mode
DTS1
DTS0
Short address mode
DMAC ch