!
± SLLS569B − MAY 2003 − REVISED APRIL 2008
D Qualified for Automotive Applications
D ESD Protection Exceeds 2000 V Per
D
D
D
D
D
D
D
D
D
DB OR PW PACKAGE
(TOP VIEW)
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
Meets or Exceeds Requirements of
TIA/EIA-232-F and ITU v.28 Standards
Operates With 3-V to 5.5-V VCC Supply
Operates Up To 250 kbit/s
Five Drivers and Three Receivers
Low Standby Current . . . 1 µA Typical
External Capacitors . . . 4 × 0.1 µF
Accepts 5-V Logic Input With 3.3-V Supply
Always-Active Noninverting Receiver
Output (ROUT1B)
RS-232 Bus-Pin ESD Protection Exceeds
±15 kV Using Human-Body Model (HBM)
C2 +
GND
C2−
V−
DOUT1
DOUT2
DOUT3
RIN1
RIN2
DOUT4
RIN3
DOUT5
FORCEON
FORCEOFF
1
28
2
27
3
26
4
25
5
24
6
23
7
22
8
21
9
20
10
19
11
18
12
17
13
16
14
15
C1+
V+
VCC
C1−
DIN1
DIN2
DIN3
ROUT1
ROUT2
DIN4
ROUT3
DIN5
ROUT1B
INVALID
description/ordering information
The MAX3238 consists of five line drivers, three line receivers, and a dual charge-pump circuit with ±15-kV ESD
(HBM) protection pin to pin (serial-port connection pins, including GND). The device meets the requirements
of TIA/EIA-232-F and provides the electrical interface between notebook and subnotebook computer
applications. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V
supply. In addition, the device includes an always-active noninverting output (ROUT1B), which allows
applications using the ring indicator to transmit data while the device is powered down. These devices operate
at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver output slew rate.
ORDERING INFORMATION{
PACKAGE‡
TA
−40°C to 85°C
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
MAX3238Q
SSOP (DB)
Tape and reel
MAX3238IDBRQ1
TSSOP (PW)
Tape and reel
MAX3238IPWRQ1
MB3238Q
† For the most current package and ordering information, see the Package Option Addendum at
the end of this document, or see the TI web site at http://www.ti.com.
‡ Package
drawings,
thermal
data,
and
symbolization
are
available
at
http://www.ti.com/packaging.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2008, Texas Instruments Incorporated
"#$%&'()"%# "* +,&&-#) (* %$ .,/0"+()"%# 1()-
&%1,+)* +%#$%&' )% *.-+"$"+()"%#* .-& )2- )-&'* %$ -3(* #*)&,'-#)*
*)(#1(&1 4(&&(#)5 &%1,+)"%# .&%+-**"#6 1%-* #%) #-+-**(&"05 "#+0,1)-*)"#6 %$ (00 .(&('-)-&*
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
± !
SLLS569B − MAY 2003 − REVISED APRIL 2008
description/ordering information (continued)
Flexible control options for power management are featured when the serial port and driver inputs are inactive.
The auto-powerdown plus feature functions when FORCEON is low and FORCEOFF is high. During this mode
of operation, if the device does not sense valid signal transitions on all receiver and driver inputs for
approximately 30 s, the built-in charge pump and drivers are powered down, reducing the supply current to
1 µA. By disconnecting the serial port or placing the peripheral drivers off, auto-powerdown plus occurs if there
is no activity in the logic levels for the driver inputs. Auto-powerdown plus can be disabled when FORCEON
and FORCEOFF are high. With auto-powerdown plus enabled, the device automatically activates once a valid
signal is applied to any receiver or driver input. INVALID is high (valid data) if any receiver input voltage is greater
than 2.7 V or less than −2.7 V, or has been between −0.3 V and 0.3 V for less than 30 µs. INVALID is low (invalid
data) if all receiver input voltages are between −0.3 V and 0.3 V for more than 30 µs. Refer to Figure 5 for receiver
input levels.
Function Tables
EACH DRIVER
INPUTS
OUTPUT
DOUT
DRIVER STATUS
X
Z
Powered off
Normal operation with
auto-powerdown plus disabled
DIN
FORCEON
FORCEOFF
TIME ELAPSED SINCE LAST
RIN OR DIN TRANSITION
X
X
L
L
H
H
X
H
H
H
H
X
L
L
L
H
<30 s
H
H
L
H
<30 s
L
L
L
H
>30 s
Z
H
L
H
>30 s
Z
Normal operation with
auto-powerdown plus enabled
Powered off by auto-powerdown
plus feature
H = high level, L = low level, X = irrelevant, Z = high impedance
EACH RECEIVER
INPUTS
RIN1
RIN2−RIN3
OUTPUTS
FORCEOFF
TIME ELAPSED SINCE LAST RIN
OR DIN TRANSITION
ROUT1B
ROUT
L
X
L
X
L
Z
H
X
L
X
H
Z
L
L
H
<30 s
L
H
L
H
H
<30 s
L
L
H
L
H
<30 s
H
H
H
H
H
<30 s
H
L
Open
Open
H
>30 s
L
H
RECEIVER STATUS
Powered off while
ROUT1B is active
Normal operation with
auto-powerdown plus
disabled/enabled
H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
!
± SLLS569B − MAY 2003 − REVISED APRIL 2008
logic diagram (positive logic)
DIN1
DIN2
DIN3
DIN4
DIN5
FORCEOFF
FORCEON
ROUT1B
ROUT1
ROUT2
ROUT3
24
5
23
6
22
7
19
10
17
12
DOUT1
DOUT2
DOUT3
DOUT4
DOUT5
14
13
Auto-powerdown
Plus
15
INVALID
16
21
8
20
9
18
11
RIN1
RIN2
RIN3
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
± !
SLLS569B − MAY 2003 − REVISED APRIL 2008
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
Positive output supply voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V
Negative output supply voltage range, V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to −7 V
Supply voltage difference, V+ − V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V
Input voltage range, VI: Driver (FORCEOFF, FORCEON) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −25 V to 25 V
Output voltage range, VO: Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −13.2 V to 13.2 V
Receiver (INVALID) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VCC + 0.3 V
Package thermal impedance, θJA (see Notes 2 and 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 62°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . 62°C/W
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to network GND.
2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 4 and Figure 6)
VCC = 3.3 V
VCC = 5 V
Supply voltage
VIH
Driver and control high-level input voltage
DIN, FORCEOFF, FORCEON
VIL
VI
Driver and control low-level input voltage
DIN, FORCEOFF, FORCEON
Driver and control input voltage
DIN, FORCEOFF, FORCEON
VI
TA
Receiver input voltage
Operating free-air temperature
VCC = 3.3 V
VCC = 5 V
MAX3238I
MIN
NOM
MAX
3
3.3
3.6
4.5
5
5.5
UNIT
V
2
V
2.4
0.8
V
0
5.5
V
−25
25
V
−40
85
°C
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
II
ICC
Input leakage current
Supply current
(TA = 25
25°C)
C)
TEST CONDITIONS
FORCEOFF, FORCEON
MIN
TYP‡
MAX
±0.01
±1
µA
0.5
2
mA
Auto-powerdown plus
disabled
No load,
FORCEOFF and FORCEON at VCC
Powered off
No load, FORCEOFF at GND
1
10
Auto-powerdown plus
enabled
No load, FORCEOFF at VCC,
FORCEON at GND,
All RIN are open or grounded
1
10
UNIT
µA
‡ All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
!
± SLLS569B − MAY 2003 − REVISED APRIL 2008
DRIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
TEST CONDITIONS
MIN
TYP†
VOH
VOL
High-level output voltage
All DOUT at RL = 3 kΩ to GND
5
5.4
Low-level output voltage
All DOUT at RL = 3 kΩ to GND
−5
−5.4
IIH
IIL
High-level input current
VI = VCC
VI at GND
IOS
Low-level input current
Short-circuit output current‡
±0.01
VCC = 3.6 V,
VCC = 5.5 V,
VO = 0 V
VO = 0 V
MAX
UNIT
V
V
±1
µA
±0.01
±1
µA
±35
±60
±40
±100
mA
Output resistance
VCC, V+, and V− = 0 V,
VO = ±2 V
300
10M
Ω
Ioff
Output leakage current
FORCEOFF = GND,
VO = ±12 V,
VCC = 0 to 5.5 V
±25
µA
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
‡ Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one output
should be shorted at a time.
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
ro
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
TEST CONDITIONS
Maximum data rate
CL = 1000 pF,
One DOUT switching,
RL = 3 kΩ,
See Figure 1
tsk(p)
Pulse skew§
CL = 150 pF to 2500 pF
RL = 3 kΩ to 7 kΩ,
See Figure 2
SR(tr)
Slew rate, transition region
(see Figure 1)
VCC = 3.3 V,
RL = 3 kΩ to 7 kΩ
MIN
TYP†
150
250
kbit/s
100
ns
MAX
CL = 150 pF to 1000 pF
6
30
CL = 150 pF to 2500 pF
4
30
UNIT
V/µs
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
§ Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
± !
SLLS569B − MAY 2003 − REVISED APRIL 2008
RECEIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
VOH
VOL
MIN
TYP†
VCC − 0.6 V
VCC − 0.1 V
TEST CONDITIONS
High-level output voltage
IOH = −1 mA
IOL = 1.6 mA
Low-level output voltage
VIT+
Positive-going input threshold voltage
VCC = 3.3 V
VCC = 5 V
VIT−
Negative-going input threshold voltage
VCC = 3.3 V
VCC = 5 V
Vhys
Ioff
Input hysteresis (VIT+ − VIT−)
MAX
V
0.4
1.5
2.4
1.8
2.4
0.6
1.2
0.8
1.5
FORCEOFF = 0 V
±0.05
V
V
V
0.3
Output leakage current (except ROUT1B)
UNIT
V
±10
µA
ri
Input resistance
VI = ±3 V to ±25 V
3
5
7
kΩ
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4)
PARAMETER
TEST CONDITIONS
tPLH
tPHL
Propagation delay time, low- to high-level output
ten
tdis
Output enable time
Propagation delay time, high- to low-level output
Output disable time
Pulse skew‡
CL = 150 pF, See Figure 3
CL = 150 pF, RL = 3 kΩ,
kΩ See Figure 4
MIN
TYP†
MAX
UNIT
150
ns
150
ns
200
ns
200
ns
tsk(p)
See Figure 3
50
ns
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
‡ Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
!
± SLLS569B − MAY 2003 − REVISED APRIL 2008
AUTO-POWERDOWN PLUS SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
TYP†
MIN
VT+(valid)
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
VT−(valid)
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
−2.7
VT(invalid)
Receiver input threshold
for INVALID low-level output voltage
FORCEON = GND,
FORCEOFF = VCC
−0.3
VOH
INVALID high-level output voltage
IOH = −1 mA, FORCEON = GND,
FORCEOFF = VCC
VOL
INVALID low-level output voltage
IOL = 1.6 mA, FORCEON = GND,
FORCEOFF = VCC
MAX
UNIT
2.7
V
V
0.3
V
VCC − 0.6
V
0.4
V
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
PARAMETER
MIN
TYP†
MAX
UNIT
tvalid
Propagation delay time, low- to high-level output
0.1
µs
tinvalid
Propagation delay time, high- to low-level output
50
µs
ten
tdis
Supply enable time
µs
25
Receiver or driver edge to auto-powerdown plus
15
30
60
s
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
PARAMETER MEASUREMENT INFORMATION
3V
Generator
(see Note B)
Input
RS-232
Output
50 Ω
RL
tTHL
CL
(see Note A)
3V
FORCEOFF
TEST CIRCUIT
0V
Output
6V
SR(tr) +
t THL or t TLH
tTLH
3V
3V
−3 V
−3 V
VOH
VOL
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 1. Driver Slew Rate
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
± !
SLLS569B − MAY 2003 − REVISED APRIL 2008
PARAMETER MEASUREMENT INFORMATION
3V
Generator
(see Note B)
RS-232
Output
50 Ω
Input
0V
CL
(see Note A)
RL
1.5 V
1.5 V
tPHL
tPLH
VOH
3V
FORCEOFF
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
3 V or 0 V
FORCEON
3V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
tPHL
CL
(see Note A)
3V
FORCEOFF
tPLH
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
3V
3 V or 0 V
FORCEON
VCC
S1
Input
1.5 V
0V
tPHZ
(S1 at GND)
RL
3 V or 0 V
1.5 V
GND
VOH
Output
50%
Output
CL
(see Note A)
FORCEOFF
Generator
(see Note B)
0.3 V
tPLZ
(S1 at VCC)
50 Ω
tPZL
(S1 at VCC)
0.3 V
Output
50%
VOL
TEST CIRCUIT
NOTES: A.
B.
C.
D.
VOLTAGE WAVEFORMS
CL includes probe and jig capacitance.
The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
tPLZ and tPHZ are the same as tdis.
tPZL and tPZH are the same as ten.
Figure 4. Receiver Enable and Disable Times
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
!
± SLLS569B − MAY 2003 − REVISED APRIL 2008
PARAMETER MEASUREMENT INFORMATION
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
Valid RS-232 Level, INVALID High
ROUT
Generator
(see Note B)
2.7 V
50 Ω
Indeterminate
0.3 V
0V
If Signal Remains Within This Region
For More Than 30 µs, INVALID Is Low†
−0.3 V
Indeterminate
Autopowerdown
Plus
INVALID
−2.7 V
CL = 30 pF
(see Note A)
Valid RS-232 Level, INVALID High
† Auto-powerdown plus disables drivers and reduces
supply current to 1 µA.
FORCEOFF
FORCEON
DIN
DOUT
TEST CIRCUIT
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following
characteristics: PRR = 5 kbit/s, ZO = 50 Ω,
50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Receiver
Input
3V
2.7 V
0V
0V
−2.7 V
−3 V
tinvalid
tvalid
INVALID
Output
Driver
Input
50%
VCC
50%
0V
3 V to 5 V
50%
50%
0V
≈ 5.5 V
Driver
Output
≈ −5.5 V
tdis
ten
tdis
V+
Supply
Voltages
ten
V+
V+ −0.3 V
V− +0.3 V
V−
V−
Voltage Waveforms and Timing Diagrams
Figure 5. INVALID Propagation-Delay Times and Supply-Enabling Time
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
± !
SLLS569B − MAY 2003 − REVISED APRIL 2008
APPLICATION INFORMATION
CBYPASS = 0.1 µF
+
−
1
2
+
C2
V+
28
27
+
GND
−
−
3
4
+
−
C1+
C2+
C2−
VCC
V−
C1−
C4
DOUT1
DOUT2
DOUT3
RIN1
C3†
+
−
26
C1
25
5
24
6
23
7
22
8
21
9
20
DIN1
DIN2
DIN3
ROUT1
RS-232 Port
RIN2
ROUT2
5 kΩ
DOUT4
RIN3
10
19
11
18
DIN4
ROUT3
5 kΩ
DOUT5
12
17
16
DIN5
ROUT1B
5 kΩ
FORCEON
FORCEOFF
Autopowerdown
Plus
13
14
† C3 can be connected to VCC or GND.
NOTE A: Resistor values shown are nominal.
15
INVALID
VCC vs CAPACITOR VALUES
VCC
3.3 V ± 0.15 V
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
C1
0.1 µF
0.22 µF
0.047 µF
0.22 µF
C2, C3, and C4
0.1 µF
0.22 µF
0.33 µF
1 µF
Figure 6. Typical Operating Circuit and Capacitor Values
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
Logic I/Os
PACKAGE OPTION ADDENDUM
www.ti.com
11-Mar-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
MAX3238IDBG4Q1
ACTIVE
SSOP
DB
28
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3238Q
MAX3238IDBRG4Q1
ACTIVE
SSOP
DB
28
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3238Q
MAX3238IPWG4Q1
ACTIVE
TSSOP
PW
28
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MB3238Q
MAX3238IPWQ1
ACTIVE
TSSOP
PW
28
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MB3238Q
MAX3238IPWRG4Q1
ACTIVE
TSSOP
PW
28
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MB3238Q
MAX3238IPWRQ1
OBSOLETE
TSSOP
PW
28
TBD
Call TI
Call TI
-40 to 85
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Mar-2015
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF MAX3238-Q1 :
• Catalog: MAX3238
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Mar-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
MAX3238IDBRG4Q1
Package Package Pins
Type Drawing
SSOP
DB
28
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
16.4
Pack Materials-Page 1
8.2
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
10.5
2.5
12.0
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Mar-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
MAX3238IDBRG4Q1
SSOP
DB
28
2000
367.0
367.0
38.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated