GaAs-IR-Lumineszenzdiode GaAs Infrared Emitter Lead (Pb) Free Product - RoHS Compliant LD 261 Wesentliche Merkmale Features • • • • • • • • • • GaAs-IR-Lumineszenzdiode Hohe Zuverlässigkeit Gruppiert lieferbar Gehäusegleich mit BPX 81 Miniatur-Gehäuse GaAs infrared emitting diode High reliability Available in bins Same package as BPX 81 Miniature package Anwendungen Applications • Miniaturlichtschranken für Gleich- und Wechsellichtbetrieb • Barcodeleser • Industrieelektronik • „Messen/Steuern/Regeln“ • Sensorik • Drehzahlsteuerung • • • • • • Miniature photointerrupters Barcode readers Industrial electronics For control and drive circuits Sensor technology Speed controller Typ Type Bestellnummer Ordering Code Gehäuse Package LD 261 Q62703Q0395 LD 261-5/6 Q65110A3337 Leiterbandgehäuse, klares Epoxy-Gießharz, linsenförmig im 2.54-mm-Raster (1/10’’), Kathodenkennzeichnung: Nase am Lötspieß Lead frame, transparent epoxy resin lens, solder tabs lead spacing 2.54 mm (1/10’’), cathode marking: projection at solder lead 2007-03-30 1 LD 261 Grenzwerte (TA = 25 °C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg – 40 … + 80 °C Sperrschichttemperatur Junction temperature Tj 80 °C Sperrspannung Reverse voltage VR 5 V Durchlassstrom Forward current IF 50 mA Stoßstrom, τ ≤ 10 μs, D = 0 Surge current IFSM 1.6 A Verlustleistung Power dissipation Ptot 70 mW Wärmewiderstand Thermal resistance RthJA RthJL 750 650 K/W K/W Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlänge der Strahlung Wavelength at peak emission IF = 50 mA, tp = 20 ms λpeak 950 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 50 m A, tp = 20 ms Δλ 55 nm Abstrahlwinkel Half angle ϕ ± 15 Grad deg. Aktive Chipfläche Active chip area A 0.25 mm2 Abmessungen der aktiven Chipfläche Dimension of the active chip area L×B L×W 0.5 × 0.5 mm² Abstand Chipoberfläche bis Linsenscheitel Distance chip surface to lens top H 1.3 … 1.9 mm Kennwerte (TA = 25 °C) Characteristics 2007-03-30 2 LD 261 Kennwerte (TA = 25 °C) Characteristics (cont’d) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 50 mA, RL = 50 Ω Switching times, Ie from 10% to 90% and from 90% to 10%, IF = 50 mA, RL = 50 Ω tr , tf 1 μs Kapazität, VR = 0 V Capacitance Co 40 pF VF 1.25 (≤ 1.4) V Sperrstrom, VR = 5 V Reverse current IR 0.01 (≤ 1) μA Gesamtstrahlungsfluss Total radiant flux IF = 50 mA, tp = 20 ms Φe 9 mW Temperaturkoeffizient von Ie bzw. Φe, IF = 50 mA Temperature coefficient of Ie or Φe, IF = 50 mA TCI – 0.55 %/K Temperaturkoeffizient von VF, IF = 50 mA Temperature coefficient of VF, IF = 50 mA TCV – 1.5 mV/K Temperaturkoeffizient von λpeak, IF = 50 mA Temperature coefficient of λpeak, IF = 50 mA TCλ 0.3 nm/K Durchlassspannung Forward voltage IF = 50 mA, tp = 20 μs Gruppierung der Strahlstärke Ie in Achsrichtung gemessen bei einem Raumwinkel Ω = 0.01 sr Grouping of radiant intensity Ie in axial direction at a solid angle of Ω = 0.01 sr Bezeichnung Parameter Strahlstärke Radiant intensity IF = 50 mA, tp = 20 ms 2007-03-30 Symbol Ie Werte Values Einheit Unit LD 261 LD 261-5 LD 261-6 2 … 10 3.2 … 6.3 5 … 10 3 mW/sr LD 261 Relative Spectral Emission Irel = f (λ) Radiant Intensity Single pulse, tp = 20 μs OHRD1938 100 OHR01039 10 2 Ιe Ι e (100 mA) % Ι rel Ιe = f (IF) Ιe 100 mA Max. Permissible Forward Current IF = f (TA) OHR01124 80 Ι F mA 70 80 60 10 1 50 60 40 R thJL = 650 K/W 40 30 10 0 R thJA = 750 K/W 20 20 10 0 880 920 960 1000 nm 10 -1 10 -2 1060 λ Forward Current IF = f (VF), single pulse, tp = 20 μs ΙF 10 0 10 1 A ΙF OHR02182 10 4 Ι F mA typ. 10 0 Permissible Pulse Handling Capability IF = f (τ), TC = 25 °C, duty cycle D = parameter OHR01042 10 1 A 10 -1 max. D= τ T τ D=0 0,005 0,01 0,02 ΙF T 10 3 0,05 0,1 0,2 10 -1 10 2 0,5 DC 10 -2 1 1.5 2 2.5 3 3.5 10 1 -5 10 4 V 4.5 VF 10 -4 10 -3 10 -2 10 -1 s 10 0 τ Radiation Characteristics Irel = f (ϕ) 40 30 20 10 0 ϕ OHR01878 1.0 50 0.8 60 0.6 70 0.4 0.2 80 0 90 100 1.0 2007-03-30 0.8 0.6 0.4 0 20 40 60 80 4 100 120 0 0 20 40 60 80 C 100 TA , TL LD 261 0.25 (0.010) 0.15 (0.006) 0 ... 5˚ 0.7 (0.028) 0.6 (0.024) 3.6 (0.142) 3.2 (0.126) 3.0 (0.118) 0.5 (0.020) 0.4 (0.016) 3.5 (0.138) 2.4 (0.094) 2.1 (0.083) 1.9 (0.075) 1.7 (0.067) Chip position 2.7 (0.106) 2.5 (0.098) Maßzeichnung Package Outlines 2.1 (0.083) 1.5 (0.059) A 2.54 (0.100) spacing 0.4 A Radiant sensitive area (0.4 x 0.4) 1.4 (0.055) 1.0 (0.039) Collector (BPX 81) Cathode (LD 261) 1) Detaching area for tools, flash not true to size. Approx. weight 0.03 g Maße in mm (inch) / Dimensions in mm (inch). 2007-03-30 5 GEOY6021 LD 261 Lötbedingungen Soldering Conditions Wellenlöten (TTW) TTW Soldering (nach CECC 00802) (acc. to CECC 00802) OHLY0598 300 C T 10 s 250 Normalkurve standard curve 235 C ... 260 C Grenzkurven limit curves 2. Welle 2. wave 200 1. Welle 1. wave 150 ca 200 K/s 2 K/s 5 K/s 100 C ... 130 C 100 2 K/s 50 Zwangskühlung forced cooling 0 0 50 100 150 200 s 250 t Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2007-03-30 6