Kemet CBR05C330FAGAC Surface mount multilayer ceramic capacitors (smd mlccs) for high power application Datasheet

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications
Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR
250 VDC, 1 MHz – 50 GHz (RF & Microwave)
Overview
KEMET’s Ultra HiQ-CBR 0505 Series surface mount
multilayer ceramic capacitors (MLCCs) in C0G dielectric
feature a robust and exceptionally stable copper electrode
dielectric system as well as a square case size that offers
excellent low loss performance (ultra high Q). These
devices provide extremely low ESR and high self-resonance
characteristics, and are well-suited for higher power
applications where minimal heating due to I2R losses
are a factor. CBR Series capacitors exhibit no change in
capacitance with respect to time and voltage, and boast a
negligible change in capacitance with reference to ambient
temperature. Capacitance change is limited to ±30 ppm/ºC
from −55°C to +125°C.
CBR Series devices are suitable for many circuit applications
including RF power amplifiers, mixers, oscillators, low noise
amplifiers, filter networks, antenna tuning, timing circuits,
delay lines, and MRI imaging coils.
Benefits
• Ultra high Q and extremely low ESR
• 0505 Square case size for higher SRF versus standard EIA
case sizes
• High thermal stability
• 1 MHz to 50 GHz frequency range
• Operating temperature range of −55°C to +125°C
• Base metal electrode (BME) dielectric system
• Pb-free and RoHS compliant
• DC voltage rating of 250 V
• Capacitance offerings ranging from 0.4 pF up to 100 pF
• Available capacitance tolerances of ±0.05 pF, ±0.1 pF,
±0.25 pF, ±0.5 pF, ±1%, ±2%, and ±5%
Click image above for interactive 3D content
Open PDF in Adobe Reader for full functionality
Ordering Information
1
CBR
05
C
330
F
A
G
Series
Case Size
(L"x W")
Specification/
Series
Capacitance
Code (pF)
Capacitance
Tolerance
Rated
Voltage
(VDC)
Dielectric
CBR
05 = 0505
C = Standard
Two significant digits
and number of zeros
Use 9 for 1.0 – 9.9 pF
Use 8 for 0.1 – 0.99 pF
e.g., 2.2 pF = 229
e.g., 0.5 pF = 508
A = ±0.05 pF
B = ±0.10 pF
C = ±0.25 pF
D = ±0.50 pF
F = ±1%
G = ±2%
J = ±5%
A = 250 V
G = C0G
A
C
Termination
Termination Finish
Style
A = N/A
C = 100% Matte Sn
Packaging/
Grade
(C-Spec)1
Blank =
7" Reel
Unmarked
When ordering CBR Series devices, a "suffix" or "C-Spec" is not required to indicate a 7" reel packaging option. CBR devices are only available and
shipped on 7" reels (paper tape). Bulk bag and cassette packaging options are not available. Please contact KEMET if you have a specific, nonstandard packaging requirement.
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1082_C0G_CBR_0505 • 8/22/2016
1
Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)
Benefits cont'd
• No piezoelectric noise
• No capacitance change with respect to applied
rated DC voltage
• Negligible capacitance change with respect to
temperature
• No capacitance decay with time
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated termination finish allowing for
excellent solderability
Applications
Typical applications include critical timing, tuning, bypass, coupling, feedback, filtering, impedance matching and DC
blocking.
Field applications include wireless and cellular base stations, wireless LAN, subscriber-based wireless services, wireless
broadcast equipment, satellite communications, RF power amplifier (PA) modules, filters, voltage-controlled oscillators
(VCOs), PAs, matching networks, RF modules, satellite communications and medical electronics.
Qualification
RF and microwave products are subject to internal qualification. Details regarding test methods and conditions are
referenced in Table 4, Performance & Reliability.
Environmental Compliance
Pb-free and RoHS compliant.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1082_C0G_CBR_0505 • 8/22/2016
2
Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)
Dimensions – Millimeters (Inches)
W
T
B
L
Case
Size
(in.)
Case
Size
(mm)
L
Length
W
Width
T
Thickness
B
Bandwidth
Mounting
Technique
0505
1414
1.40+0.38/−0.25
(0.055+0.015/−0.01)
1.40±0.38
(0.055±0.015)
1.15±0.15
(0.045±0.006)
0.25+0.25−0.13
(0.010+0.010−0.005)
Solder Reflow Only
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range:
Capacitance Change with Reference to
+25°C and 0 VDC Applied (TCC):
Aging Rate (Maximum % Capacitance Loss/Decade Hour):
Dielectric Withstanding Voltage (DWV):
1
2
3
Quality Factor (Q):
Insulation Resistance (IR) Limit at 25°C:
−55°C to +125°C
0 ±30 ppm/ºC
0%
See Dielectric Withstanding Voltage Table
(5±1 seconds and charge/discharge not exceeding 50 mA)
≥ 1,400 for capacitance values ≥30 pF
≥ 800 + 20ºC for capacitance values < 30 pF
10 GΩ minimum (rated voltage applied for 120±5 seconds)
DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the
capacitor.
2
Capacitance and quality factor (Q) measured at 1 MHz ±100 kHz and 1.0 ±0.2 Vrms.
3
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known
as Automatic Level Control (ALC). The ALC feature should be switched to "ON."
1
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1082_C0G_CBR_0505 • 8/22/2016
3
Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)
Dielectric Withstanding Voltage Table
Rated Voltage (VDC)
250 V
DWV
200%
Electrical Characteristics
SRF (MHz) vs. Cap (pF)
10,000
SRF (MHz)
0402
0603
0505
0805
1,000
100
0.1
1
Cap (pF)
10
100
ESR vs. Frequency 0505
Q vs. Frequency 0505
10,000
1
1 pF
1,000
4.7 pF
4.7 pF
10 pF
0.1
22 pF
Q
ESR (Ohms)
1 pF
10 pF
100
22 pF
47 pF
10
47 pF
68 pF
0.01
100
1,000
Freq (MHz)
10,000
68 pF
1
100
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
1,000
Freq (MHz)
10,000
C1082_C0G_CBR_0505 • 8/22/2016
4
Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)
Table 1 – CBR Series, Capacitance Range Waterfall
Case Size – Inches (mm)
0505 (1414)
mm
(Inches)
mm
(Inches)
mm
(Inches)
mm
(Inches)
Length
Width
Thickness
Bandwidth
1.40 +0.38 / −0.25
(0.055 +0.015 / −0.01)
1.40 ± 0.38
(0.055 ± 0.015)
1.15 ± 0.15
(0.045 ± 0.006)
0.25 + 0.25 − 0.13
(0.010 + 0.010 − 0.005)
Rated Voltage (VDC)
250
Voltage Code
Capacitance
A
Capacitance
Tolerance
Capacitance Code
(Available Capacitance)
A = ±0.05pF
B = ±0.10pF
C = ±0.25pF
D = ±0.50pF
408
508
608
708
808
908
109
119
129
139
149
159
169
179
189
199
209
219
229
239
249
259
269
279
289
299
309
319
329
339
349
359
369
379
389
399
409
419
429
439
449
459
469
479
489
499
509
0.4 pF
0.5 pF
0.6 pF
0.7 pF
0.8 pF
0.9 pF
1.0 pF
1.1 pF
1.2 pF
1.3 pF
1.4 pF
1.5 pF
1.6 pF
1.7 pF
1.8 pF
1.9 pF
2.0 pF
2.1 pF
2.2 pF
2.3 pF
2.4 pF
2.5 pF
2.6 pF
2.7 pF
2.8 pF
2.9 pF
3.0 pF
3.1 pF
3.2 pF
3.3 pF
3.4 pF
3.5 pF
3.6 pF
3.7 pF
3.8 pF
3.9 pF
4.0 pF
4.1 pF
4.2 pF
4.3 pF
4.4 pF
4.5 pF
4.6 pF
4.7 pF
4.8 pF
4.9 pF
5.0 pF
Rated Voltage (VDC)
250
Voltage Code
A
* Available only in "B" ( ±0.1 pF) capacitance tolerance.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1082_C0G_CBR_0505 • 8/22/2016
5
Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)
Table 1 – CBR Series, Capacitance Range Waterfall cont'd
Case Size – Inches (mm)
mm
(Inches)
mm
(Inches)
mm
(Inches)
mm
(Inches)
Length
Width
Thickness
Bandwidth
Rated Voltage (VDC)
Voltage Code
Capacitance
0505 (1414)
1.40 +0.38 / −0.25
(0.055 +0.015 / −0.01)
1.40 ± 0.38
(0.055 ± 0.015)
1.15 ± 0.15
(0.045 ± 0.006)
0.25 + 0.25 − 0.13
(0.010 + 0.010 − 0.005)
250
A
Capacitance
Tolerance
Capacitance Code
(Available Capacitance)
B = ±0.10pF
C = ±0.25pF
D = ±0.50pF
519
529
539
549
559
569
579
589
599
609
619
629
639
649
659
669
679
689
699
709
719
729
739
749
759
769
779
789
799
809
819
829
839
849
859
869
879
889
899
909
919
929
939
949
959
5.1 pF
5.2 pF
5.3 pF
5.4 pF
5.5 pF
5.6 pF
5.7 pF
5.8 pF
5.9 pF
6.0 pF
6.1 pF
6.2 pF
6.3 pF
6.4 pF
6.5 pF
6.6 pF
6.7 pF
6.8 pF
6.9 pF
7.0 pF
7.1 pF
7.2 pF
7.3 pF
7.4 pF
7.5 pF
7.6 pF
7.7 pF
7.8 pF
7.9 pF
8.0 pF
8.1 pF
8.2 pF
8.3 pF
8.4 pF
8.5 pF
8.6 pF
8.7 pF
8.8 pF
8.9 pF
9.0 pF
9.1 pF
9.2 pF
9.3 pF
9.4 pF
9.5 pF
Rated Voltage (VDC)
250
Voltage Code
A
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1082_C0G_CBR_0505 • 8/22/2016
6
Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)
Table 1 – CBR Series, Capacitance Range Waterfall cont'd
Case Size – Inches (mm)
mm
(Inches)
mm
(Inches)
mm
(Inches)
mm
(Inches)
Length
Width
Thickness
Bandwidth
Rated Voltage (VDC)
Voltage Code
Capacitance
0505 (1414)
1.40 +0.38 / −0.25
(0.055 +0.015 / −0.01)
1.40 ± 0.38
(0.055 ± 0.015)
1.15 ± 0.15
(0.045 ± 0.006)
0.25 + 0.25 − 0.13
(0.010 + 0.010 − 0.005)
250
A
Capacitance
Tolerance
Capacitance Code
(Available Capacitance)
F = ±1%
G = ±2%
J = ±5%
969
979
989
999
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
101
9.6 pF
9.7 pF
9.8 pF
9.9 pF
10 pF
11 pF
12 pF
13 pF
15 pF
16 pF
18 pF
20 pF
22 pF
24 pF
27 pF
30 pF
33 pF
36 pF
39 pF
43 pF
47 pF
51 pF
56 pF
62 pF
68 pF
75 pF
82 pF
91 pF
100 pF
Rated Voltage (VDC)
250
Voltage Code
A
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1082_C0G_CBR_0505 • 8/22/2016
7
Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)
Table 2 – Chip Thickness/Reeling Quantities
Chip Size Chip Thickness
Inches (mm)
(mm)
0505 (1414)
1.15 ±0.15
Reel Quantity
7" Paper
13" Paper
3,000
Contact KEMET
for availability.
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 (mm)
Case
Size
(Inches)
Case
Size
(mm)
0505
1414
Density Level A:
Maximum (Most) Land
Protrusion
Density Level B:
Median (Nominal) Land
Protrusion
Density Level C:
Minimum (Least) Land
Protrusion
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
0.92
1.15
1.89
3.99
2.89
0.82
0.95
1.79
3.09
2.29
0.72
0.75
1.69
2.43
1.93
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of 0603(1608) and 0805 (2012) case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1608 case size.
V1
Y
Y
X V2
X
C
C
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1082_C0G_CBR_0505 • 8/22/2016
8
Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)
Soldering Process
Recommended Soldering Technique:
• 0505 case sizes are limited to solder reflow only
Recommended Soldering Profile:
• KEMET recommends following the guidelines outlined in IPC/JEDEC J–STD–020
Recommended Solder Alloys:
Alloy
Composition
Solidus
Liquidous
In50
50 In, 50 Pb
180°C 209°C In52
52 In, 48 Sn
118°C 118°C Sn62
62.5 Sn, 36.1 Pb, 1.4 Ag
179°C 179°C Sn63
63 Sn, 37 Pb
183°C 183°C Pb-free
95.5 Sn, 3.8 Ag, 0.7 Cu
217°C 217°C Hi-Temp
5 Sn, 93.5 Pb, 1.5 Ag
296°C 301°C Sn5
5 Sn, 95 Pb
308°C 312°C © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1082_C0G_CBR_0505 • 8/22/2016
9
Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)
Table 4 – Performance & Reliability: Test Methods & Conditions
Stress
Terminal Strength
Vibration
Resistance
Solderability
Board Flex
Resistance to
Soldering Heat
Test or Inspection Method
Pressurizing force:
0505 case sizes: 5N
Requirements
No visible damage or separation of termination system.
Test time: 10±1 second
Vibration frequency: 10 ~ 55 Hz/minimum
Total amplitude: 1.5 mm
Test time: 6 hours (Two hours each in three mutually
perpendicular directions.)
Solder temperature: 235±5°C
Dipping time: 2±0.5 seconds
Capacitor is mounted to a substrate which is flexed by
means of ram at a rate of 1 mm per second until the
deflection becomes 1 mm. (Deflection is maintained for
5±1 second)
Store at room temperature for 24±2 hours before
measuring electrical properties.
Solder temperature: 260±5°C
Dipping time: 10±1 second
Preheating: 120 to 150°C for 1 minute before immerse
the capacitor in a eutectic solder.
Store at room temperature for 24±2 hours before
measuring electrical properties.
No visible damage.
Capacitance change and Q/DF: To meet initial
specification
95% minimum coverage of termination finish.
No visible damage.
Capacitance change: within ±5.0% or ±0.5 pF, whichever
is larger.
(Capacitance change is monitored during flexure.)
No visible damage.
Capacitance change: within ±2.5% or ±0.25 pF, whichever
is larger.
Q/DF, IR and dielectric strength: To meet initial
requirements.
25% maximum leaching on each edge.
5 cycles of steps 1 – 4:
Temperature
Cycling
Step
Temperature (ºC)
Time (minutes)
1
Minimum operating
temperatue +0/−3
Room temperature
Maximum operating
temperature +3/−0
Room temperature (25ºC)
30±3
2
3
4
2~3
30±3
No visible damage.
Capacitance change: within ±2.5% or ±0.25 pF, whichever
is larger.
Q/DF, IR and dielectric strength: To meet initial
requirements.
2~3
Store at room temperature for 24±2 hours before
measuring electrical properties.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1082_C0G_CBR_0505 • 8/22/2016
10
Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)
Table 4 – Performance & Reliability: Test Methods & Conditions (cont.)
Stress
Test or Inspection Method
Humidity (Damp Heat)
Steady State
Test temperature: 40±2°C
Humidity: 90 ~ 95% RH
Test time: 500 +24/−0 hours
Store at room temperature for 24±2 hours before
measuring electrical properties.
Humidity (Damp Heat)
Load
Test temperature: 40±2°C
Humidity: 90 ~ 95% RH
Test time: 500 +24/−0 hours
Applied voltage: rated voltage
Store at room temperature for 24±2 hours before
measuring electrical properties.
High Temperature Life
Test temperature: 125±3°C
Applied voltage:
200% of rated voltage (6.3 VDC – 250 VDC)
Test time: 1,000 +24/−0 hours
Store at room temperature for 24±2 hours before
measuring electrical properties.
Requirements
No visible damage.
Capacitance change: within ±5.0% or ±0.5 pF, whichever
is larger.
Q/DF value: Capacitance ≥ 30 pF, Q ≥ 350,
10 pF ≤ Capacitance < 30 pF, Q ≥ 275 +2.5°C
Capacitance < 10 pF; Q ≥ 200 +10ºC
IR: ≥ 1GΩ
No visible damage.
Capacitance change: within ±7.5% or ±0.75 pF, whichever
is larger.
Q/DF value: Capacitance ≥ 30 pF, Q ≥ 200,
Capacitance < 30 pF, Q ≥ 100+10/3ºC
IR: ≥ 500MΩ
No visible damage.
Capacitance change: within ±3.0% or ±0.3 pF, whichever
is larger.
Q/DF value: Capacitance ≥ 30 pF, Q ≥350,
10 pF ≤ Capacitance < 30 pF, Q ≥ 275 +2.5°C
Capacitance <10 pF, Q ≥ 200 +10°C
IR: ≥1 GΩ
0505 Case Size
ESR
The ESR should be measured at room temperature and
tested at frequency 1±0.1 GHz.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
0.4pF ≤Capacitance <1.0pF: < 1500mΩ
1.0pF ≤Capacitance <10pF: < 250mΩ
10pF ≤Capacitance ≤100pF: < 200mΩ
C1082_C0G_CBR_0505 • 8/22/2016
11
Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degradedby high temperature –reels may soften or warp,
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C, and maximum
storage humidity not exceed 70% relative humidity. In addition, temperature fluctuations should be minimized to avoid
condensation on the parts, and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized
solderability, chip stock should be used promptly, preferably within 1.5 years of receipt.
Construction
Detailed Cross Section
Dielectric Material
(BaTiO3 Based)
Barrier Layer
(Ni)
Dielectric Material
Termination Finish
(BaTiO3 Based)
(100% Matte Sn)
End Termination/
External Electrode
(Cu)
End
Termination/
External
Electrode
(Cu)
Inner Electrodes
(Cu)
Termination Finish
(100% Matte Sn)
Barrier Layer
(Ni)
Inner Electrodes
(Cu)
Marking
Hi CBR series devices are supplied unmarked.
If you require marked product, please contact KEMET for availablility of a laser-marked option.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1082_C0G_CBR_0505 • 8/22/2016
12
Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)
Tape & Reel Packaging Information
KEMET offers RF and Microwave Multilayer Ceramic Chip Capacitors packaged in 8 mm tape on 7" reels. This packaging
system is compatible with all tape-fed automatic pick and place systems.
Bar Code Label
Anti-Static Reel
®
ET
KEM
Punched Paper Carrier
Sprocket Holes
Punched Cavity
8 mm Carrier Tape
178 mm (7.00")
Anti-Static Cover Tape
(0.10mm (0.004") Maximum Thickness)
Table 5 – Carrier Tape Configuration (mm)
EIA Case Size
Tape Size (W)*
Pitch (P1)*
0505
8
4
*Refer to Figure 1 & 2 for W and P1 carrier tape reference locations.
*Refer to Table 6 for tolerance specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1082_C0G_CBR_0505 • 8/22/2016
13
Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)
Figure 1 – Punched (Paper) Carrier Tape Dimensions
P0
T
E
P2
A0
D0
F
W
B0
D1
P1
K1
A0
Table 6 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
E
P0
P2
R Reference Note 1
K0
8 mm
1.55+0.10
(0.061+0.004)
1.75±0.10
(0.069±0.004)
4.0±0.10
(0.157±0.004)
2.0±0.05
(0.079±0.002)
25.0
(0.984)
Maximum 1.5
(Maximum 0.060)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
A0
8 mm
Single
(4 mm)
Maximum 1.9
(Maximum
0.075)
B0
F
Maximum 1.90
3.5±0.05
(Maximum
(0.138±0.002)
0.075)
P1
T
W
D1
4.0±0.1
(0.157±0.004)
0.23±0.1
(0.009±0.004)
8.0±0.2
(0.315±0.008)
1.00±0.1
(0.039±0.004)
1. The tape with or without components shall pass around R without damage (see Figure 3).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1082_C0G_CBR_0505 • 8/22/2016
14
Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 to 1.0 Newton (10 to 100 gf)
12 and 16 mm
0.1 to 1.3 Newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 2 – Bending Radius
Punched
Carrier
Bending
Radius
R
Figure 3 – Tape Leader & Trailer Dimensions
Punched Carrier
8mm
END
Carrier Tape
Round Sprocket Holes
Leader
Top Cover Tape
Trailer
110mm minimum
Top Cover Tape
Components
20mm
minimum
400mm ~ 560mm
Minimum (empty
cavities and leader)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1082_C0G_CBR_0505 • 8/22/2016
15
Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)
Figure 4 – Maximum Camber
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
Figure 5 – Reel Dimensions
C
A
N
W1
Table 7 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
Reel Size
A
C
8 mm
7
178±0.10
(7.008±0.004)
13.0±0.50
(0.512±0.02)
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
N Minimum
See Note 2, Table 6
60±1.0
(2.362±0.04)
W1
8.4+1.5/−0.0
(0.331+0.059/−0.0)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1082_C0G_CBR_0505 • 8/22/2016
16
Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)
KEMET Electronic Corporation Sales Offices
For a complete list of our global sales offices, please visit www.kemet.com/sales.
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no
obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or
property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1082_C0G_CBR_0505 • 8/22/2016
17