Material Content Data Sheet Sales Product Name IPB014N06N MA# MA000965710 Package PG-TO263-7-3 Issued 29. August 2013 Weight* 1552.50 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead phosphorus iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7439-89-6 7440-50-8 26.819 1.73 0.803 0.05 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.73 17274 17274 517 0.241 0.02 801.714 51.65 51.72 516404 155 517076 12.139 0.78 0.78 7819 7819 8.376 0.54 5395 92.138 5.93 457.900 29.49 35.96 294945 359689 12.317 0.79 0.79 7934 7934 0.269 0.02 0.001 0.00 0.836 0.05 0.669 0.04 31.925 2.06 0.032 0.00 0.106 0.01 106.210 6.84 59349 173 0.02 0 431 2.15 20564 2. 3. 69 6.85 68412 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 21533 21 Important Remarks: 1. 173 538 68502 1000000