Material Content Data Sheet Sales Product Name BSC030N04NS G MA# MA001272214 Package PG-TDSON-8-1 Issued 5. December 2014 Weight* 120.88 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal noble metal non noble metal non noble metal noble metal non noble metal inorganic material non noble metal non noble metal inorganic material non noble metal < 10% silicon iron phosphorus copper copper carbon black epoxy resin silicondioxide tin silver silver tin lead silver iron phosphorus copper iron phosphorus copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 7440-22-4 7439-89-6 7723-14-0 7440-50-8 7439-89-6 7723-14-0 7440-50-8 2.391 1.98 0.038 0.03 wire encapsulation leadfinish plating solder CLIP plating heatspreader heat sink CLIP *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.98 19782 19782 313 0.011 0.01 37.762 31.23 31.27 312398 94 312805 0.042 0.03 0.03 344 344 0.084 0.07 692 5.935 4.91 35.777 29.60 34.58 295980 345772 1.452 1.20 1.20 12009 12009 0.166 0.14 0.14 1369 1369 0.057 0.05 0.046 0.04 2.173 1.80 1.89 17977 18824 1.289 1.07 1.07 10668 10668 0.011 0.01 0.003 0.00 11.320 9.36 0.022 0.02 0.007 0.01 22.292 18.44 49100 471 376 94 28 9.37 93649 55 18.47 184416 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 93771 185 184656 1000000