LT1030C QUADRUPLE LOW-POWER LINE DRIVER SLLS048F – APRIL 1989 – REVISED APRIL 1998 D D D D D D D D D Low Supply Voltage . . . ±5 V to ±15 V Supply Current . . . 500 µA Typical Zero Supply Current When Shut Down Outputs Can Be Driven ±30 V Output Open When Off (3-State) 10-mA Output Drive Outputs of Several Devices Can Be Connected in Parallel Meets or Exceeds the Requirements of ANSI EIA/TIA-232-F Specifications Designed to Be Interchangeable With Linear Technology LT1030 D OR N PACKAGE (TOP VIEW) VCC– IN1 OUT1 ON/OFF IN2 OUT2 GND 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC+ STROBE IN4 OUT4 NC IN3 OUT3 NC – No internal connection description The LT1030C is an EIA/TIA-232-F line driver that operates over a ±5-V to ±15-V supply-voltage range on low supply current. The device can be shut down to zero supply current. Current limiting fully protects the outputs from externally applied voltages of ±30 V. Since the output swings to within 200 mV of the positive supply and to within 1 V of the negative supply, supply-voltage requirements are minimized. A major advantage of the LT1030C is the high-impedance output state when the device is off or powered down. This feature allows several different drivers on the same bus. The device can be used as an EIA/TIA-232-F driver, micropower interface, or level translator, among others. The LT1030C is characterized for operation from 0°C to 70°C. AVAILABLE OPTIONS PACKAGE SMALL OUTLINE (D) PLASTIC DIP (N) LT1030CD LT1030CN The D package is available taped and reeled. Add the suffix R to the device type (i.e., LT1030CDR). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 1998, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 LT1030C QUADRUPLE LOW-POWER LINE DRIVER SLLS048F – APRIL 1989 – REVISED APRIL 1998 logic symbol† STROBE 13 ON/OFF IN1 IN2 IN3 IN4 G1 4 EN 2 3 1 5 6 9 8 12 11 OUT1 OUT2 OUT3 OUT4 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. logic diagram ON/OFF STROBE IN1 IN2 IN3 IN4 4 13 3 2 6 5 8 9 11 12 OUT1 OUT2 OUT3 OUT4 Terminal Functions TERMINAL NAME 2 DESCRIPTION NO. GND 7 Ground terminal IN1 IN2 IN3 IN4 2 5 9 12 Logic inputs. INx operate properly on TTL or CMOS levels. Output valid from VI = VCC– + 2 V to 15 V. Connect to 5 V when not used. ON/OFF 4 ON/OFF shuts down the entire circuit. It cannot be left open. For normally on operation, connect between 5 V and 10 V. If VIL is at or near 0.8 V, significant settling time may be required. OUT1 OUT2 OUT3 OUT4 3 6 8 11 Line driver outputs STROBE 13 STROBE forces all outputs low. Drive with 3 V. Strobe terminal input impedance is approximately 2 kΩ to GND. Leave STROBE open when not used. VCC+ VCC– 14 Positive supply 1 Negative supply POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 LT1030C QUADRUPLE LOW-POWER LINE DRIVER SLLS048F – APRIL 1989 – REVISED APRIL 1998 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to 15 V Supply voltage range, VCC– . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to –15 V Input voltage range, logic inputs, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC– to 25 V Input voltage range at ON/OFF, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to 12 V Output voltage range, VO (any output) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC+ – 30 V to VCC– + 30 V Duration of output short circuit to ±30 V at (or below) 25°C (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . Unlimited Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, except differential voltages, are with respect to GND. 2. The output may be shorted to either supply. Temperature and/or supply voltages must be limited to ensure that the maximum dissipation rating is not exceeded. 3. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace length of zero. recommended operating conditions MIN MAX Supply voltage, VCC+ 5 15 V Supply voltage, VCC– –5 –15 V 2 15 V High-level input voltage, VIH (see Note 4) Low-level input voltage, VIL (see Note 4) Operating free-air temperature, TA 0 UNIT 0.8 V 70 °C NOTE 4: These VIH and VIL specifications apply only for inputs IN1–IN4. For operating levels for ON/OFF, see Figure 2. electrical characteristics over operating free-air temperature range, VCC± = ±5 V to ±15 V (unless otherwise noted) PARAMETER TEST CONDITIONS VOM+ VOM– Maximum positive peak output voltage swing IIH IIL High-level input current Maximum negative peak output voltage swing Low-level input current II current ON/OFF Input current, IO Output current IOZ Off-state output current ICC Supply current (all outputs low) ICC( CC(off) ff) Off state supply current Off-state IO = –2 mA, IO = 2 mA, TA = 25°C TA = 25°C VI ≥ 2 V, VI ≤ 0.8 V, TA = 25°C TA = 25°C MIN VCC+–0.3 VI ≥ at 2.4 V, IO = 0 ON/OFF at 0.4 V ON/OFF at 0.1 V VCC+–0.1 VCC–+0.9 5 MAX UNIT V VCC–+1.4 20 µA –10 –20 µA –0.1 –10 30 65 2 VI = 0 VI = 5 V TA = 25°C VO = ±15 V, TA = 25°C, ON/OFF at 0.4 V TYP‡ 12 V µA mA ±2 ±100 µA 500 1000 µA 10 150 10 µA ‡ All typical values are at VCC± = ±12 V, TA = 25°C. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 LT1030C QUADRUPLE LOW-POWER LINE DRIVER SLLS048F – APRIL 1989 – REVISED APRIL 1998 operating characteristics, VCC± = ±5 V to ±15 V, TA = 25°C PARAMETER SR TEST CONDITIONS Driver slew rate RL = 3 kΩ, MIN TYP† MAX UNIT 4 15 30 V/µs CL = 51 pF † All typical values are at VCC± = ±12 V, TA = 25°C. TYPICAL CHARACTERISTICS MAXIMUM PEAK OUTPUT VOLTAGE vs OUTPUT CURRENT ON/OFF TERMINAL VOLTAGE vs FREE-AIR TEMPERATURE 1.8 VCC+ –0.2 Output High VCC+ –0.4 VCC– +1.4 VCC– +1.2 VCC– +1 Output Low VCC– +0.8 VCC– +0.6 VCC– +0.4 VCC± = ±12 V TA = 25°C VCC– +0.2 VCC– 0 ±1 ±2 ±3 VCC± = ±12 V RL = 3 kΩ 1.6 ON/OFF Terminal Voltage – V VOM VOM – Maximum Peak Output Voltage – V VCC+ ±4 1.4 Min On Voltage 1.2 1 Max Off Voltage IO < 200 µA 0.8 0.6 0.4 Max Off Voltage IO < 20 µA 0.2 ±5 GND 0 10 IO–Output Current – mA Figure 1 4 20 30 40 50 60 TA – Free-Air Temperature – °C Figure 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 70 LT1030C QUADRUPLE LOW-POWER LINE DRIVER SLLS048F – APRIL 1989 – REVISED APRIL 1998 TYPICAL CHARACTERISTICS ON/OFF TERMINAL CURRENT vs ON/OFF TERMINAL VOLTAGE VCC+ 140 VCC+ –0.2 120 IO = 1 mA IO = 5 mA VCC+ –0.4 ON/OFF Terminal Current – µ A VOM VOM – Maximum Peak Output Voltage – V MAXIMUM PEAK OUTPUT VOLTAGE vs FREE-AIR TEMPERATURE VCC– +1.4 IO = –5 mA VCC– +1.2 VCC– +1 IO = –1 mA VCC– +0.8 100 80 60 40 20 0 VCC± = ±12 V VCC– +0.6 0 10 20 30 40 50 VCC± = ±12 V TA = 25°C 60 –20 70 0 2.5 TA – Free-Air Temperature – °C 5 7.5 10 12.5 ON/OFF Terminal Voltage – V Figure 3 15 Figure 4 TYPICAL CHARACTERISTICS OUTPUT CURRENT vs FREE-AIR TEMPERATURE OFF-STATE OUTPUT CURRENT vs FREE-AIR TEMPERATURE 30 –1 I OZ ICC – Off-State Output Current – µ A VCC± = ±12 V I O – Output Current – mA IO 27.5 25 Sinking 22.5 20 17.5 Sourcing 15 0 10 20 30 40 50 60 TA – Free-Air Temperature – °C 70 VCC± = ±12 V VO = –25 V –0.1 –0.01 25 30 Figure 5 35 40 45 50 55 60 TA – Free-Air Temperature – °C 65 70 Figure 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 LT1030C QUADRUPLE LOW-POWER LINE DRIVER SLLS048F – APRIL 1989 – REVISED APRIL 1998 TYPICAL CHARACTERISTICS OFF-STATE SUPPLY CURRENT vs FREE-AIR TEMPERATURE SUPPLY CURRENT vs TOTAL SUPPLY VOLTAGE 5 VCC± = ±12 V ON/OFF at 0.4 V 0.07 TA = 25°C 4.5 4 ICC I CC – Supply Current – mA ICCoff – Off-State Supply Current – µ A I CC(off) 0.1 0.05 0.03 ÁÁÁ ÁÁÁ ÁÁÁ 3.5 3 All Outputs High 2.5 2 1.5 1 All Outputs Low 0.5 0.01 45 50 55 60 65 0 70 TA – Free-Air Temperature –°C 10 12.5 15 17.5 20 22.5 25 27.5 |VCC+ – VCC–| – Total Supply Voltage – V Figure 7 30 Figure 8 TYPICAL CHARACTERISTICS SUPPLY CURRENT vs FREE-AIR TEMPERATURE SLEW RATE vs FREE-AIR TEMPERATURE 4 17 VCC± = ±12 V VCC± = ±12 V RL = 3 kΩ CL = 51 pF 3 SR – Slew Rate – V/ V/us µs ICC mA A I CC – Supply Current – m 3.5 All Outputs High 2.5 2 1.5 1 16 Falling 15 Rising 14 All Outputs Low 0.5 0 0 10 60 20 30 40 50 TA – Free-Air Temperature – °C 70 13 0 10 Figure 9 6 20 30 40 50 60 TA – Free-Air Temperature – °C Figure 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 70 LT1030C QUADRUPLE LOW-POWER LINE DRIVER SLLS048F – APRIL 1989 – REVISED APRIL 1998 APPLICATION INFORMATION forward biasing the substrate As with other bipolar integrated circuits, forward biasing the substrate diode can cause problems. The LT1030C draws high current from VCC+ to GND when VCC– is open circuited or pulled above ground. Connecting a diode from VCC– to GND (if possible) prevents the high-current state. Any low-cost diode can be used (see Figure 11). LT1030C 1 14 7 8 1N4001 Figure 11. Connecting a Diode From VCC– to GND POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LT1030CD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 LT1030C LT1030CDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 LT1030C LT1030CDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 LT1030C LT1030CN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 LT1030CN (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device LT1030CDR Package Package Pins Type Drawing SOIC D 14 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 9.0 2.1 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LT1030CDR SOIC D 14 2500 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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