ON NCR169DG General purpose sensitive gate silicon controlled rectifier Datasheet

NCR169D
General Purpose
Sensitive Gate
Silicon Controlled Rectifier
Reverse Blocking Thyristor
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PNPN device designed for line-powered general purpose
applications such as relay and lamp drivers, small motor controls, gate
drivers for larger thyristors, and sensing and detection circuits.
Supplied in a cost effective plastic TO-226AA package.
SCR
0.8 AMPERES RMS
400 VOLTS
Features
• Sensitive Gate Allows Direct Triggering by Microcontrollers and
•
•
•
•
•
•
Other Logic Circuits
On−State Current Rating of 0.8 Amperes RMS at 80°C
Surge Current Capability − 10 Amperes
Immunity to dV/dt − 20 V/μsec Minimum at 110°C
Glass-Passivated Surface for Reliability and Uniformity
Device Marking: NCR169D, Date Code
Pb−Free Packages are Available
G
A
K
MARKING
DIAGRAM
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Peak Repetitive Off−State Voltage (Note 1.)
(TJ = *40 to 110°C, Sine Wave, 50 to
60 Hz; Gate Open)
VDRM,
VRRM
400
Volts
On-State RMS Current
(TC = 80°C) 180° Conduction Angles
IT(RMS)
0.8
Amp
ITSM
10
Amps
I2t
0.415
A2s
PGM
0.1
Watt
PG(AV)
0.10
Watt
Forward Peak Gate Current
(TA = 25°C, Pulse Width v 1.0 μs)
IGM
1.0
Amp
Reverse Peak Gate Voltage
(TA = 25°C, Pulse Width v 1.0 μs)
VGRM
5.0
Volts
Operating Junction Temperature Range
@ Rate VRRM and VDRM
TJ
−40 to
110
°C
Storage Temperature Range
Tstg
−40 to
150
°C
Peak Non-Repetitive Surge Current
(1/2 Cycle, Sine Wave, 60 Hz,
TJ = 25°C)
Circuit Fusing Consideration (t = 10 ms)
Forward Peak Gate Power
(TA = 25°C, Pulse Width v 1.0 μs)
Forward Average Gate Power
(TA = 25°C, t = 20 ms)
K
G
October, 2005 − Rev. 1
A
TO−92
(TO−226AA)
CASE 029
STYLE 10
1
2
3
A
= Assembly Location
L
= Wafer Lot
Y
= Year
WW = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN ASSIGNMENT
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. VDRM and VRRM for all types can be applied on a continuous basis. Ratings
apply for zero or negative gate voltage; however, positive gate voltage shall
not be applied concurrent with negative potential on the anode. Blocking
voltages shall not be tested with a constant current source such that the
voltage ratings of the devices are exceeded.
© Semiconductor Components Industries, LLC, 2005
NCR
169D
ALYWWG
G
1
1
Cathode
2
Gate
3
Anode
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
Publication Order Number:
NCR169D/D
NCR169D
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
RθJC
RθJA
75
200
°C/W
TL
260
°C
Thermal Resistance − Junction to Case
− Junction to Ambient
Lead Solder Temperature
(t1/16″ from case, 10 secs max)
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
−
−
−
−
10
0.1
μA
mA
VTM
−
−
1.7
Volts
OFF CHARACTERISTICS
Peak Repetitive Forward or
Reverse Blocking Current (Note 1.)
(VD = Rated VDRM and VRRM; RGK = 1.0 kΩ)
IDRM, IRRM
TC = 25°C
TC = 110°C
ON CHARACTERISTICS
Peak Forward On−State Voltage(*)
(ITM = 1.0 Amp Peak @ TA = 25°C)
Gate Trigger Current (Continuous dc) (Note 2.)
(VAK = 12 V, RL = 100 Ohms)
TC = 25°C
IGT
−
40
200
μA
Holding Current (Note 2.)
(VAK = 12 V, IGT = 0.5 mA)
TC = 25°C
TC = −40°C
IH
−
−
0.5
−
5.0
10
mA
Latch Current
(VAK = 12 V, IGT = 0.5 mA, RGK = 1.0 k)
TC = 25°C
TC = −40°C
IL
−
−
0.6
−
10
15
mA
Gate Trigger Voltage (Continuous dc) (Note 2.)
(VAK = 12 V, RL = 100 Ohms, IGT = 10 mA)
TC = 25°C
TC = −40°C
VGT
−
−
0.62
−
0.8
1.2
Volts
Critical Rate of Rise of Off−State Voltage
(VD = Rated VDRM, Exponential Waveform, RGK = 1000 Ohms,
TJ = 110°C)
dV/dt
20
35
−
V/μs
Critical Rate of Rise of On−State Current
(IPK = 20 A; Pw = 10 μsec; diG/dt = 1.0 A/μsec, Igt = 20 mA)
di/dt
−
−
50
A/μs
DYNAMIC CHARACTERISTICS
*Indicates Pulse Test: Pulse Width ≤ 1.0 ms, Duty Cycle ≤ 1%.
1. RGK = 1000 Ohms included in measurement.
2. Does not include RGK in measurement.
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NCR169D
Voltage Current Characteristic of SCR
+ Current
Symbol
Parameter
VDRM
Peak Repetitive Off State Forward Voltage
IDRM
Peak Forward Blocking Current
VRRM
Peak Repetitive Off State Reverse Voltage
IRRM
Peak Reverse Blocking Current
VTM
Peak on State Voltage
IH
Holding Current
Anode +
VTM
on state
IH
IRRM at VRRM
Reverse Blocking Region
(off state)
Reverse Avalanche Region
+ Voltage
IDRM at VDRM
Forward Blocking Region
(off state)
100
1.0
90
0.9
GATE TRIGGER VOLTAGE (VOLTS)
GATE TRIGGER CURRENT ( m A)
Anode −
80
70
60
50
40
30
20
10
−40 −25 −10
5
20 35 50 65 80
TJ, JUNCTION TEMPERATURE (°C)
95
0.8
0.7
0.6
0.5
0.4
0.3
0.2
−40 −25 −10
5
20 35 50
65 80
TJ, JUNCTION TEMPERATURE (°C)
110
Figure 1. Typical Gate Trigger Current versus
Junction Temperature
95
110
Figure 2. Typical Gate Trigger Voltage versus
Junction Temperature
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NCR169D
1000
LATCHING CURRENT ( m A)
HOLDING CURRENT (m A)
1000
100
10
−40 −25 −10
5
20 35 50 65 80
TJ, JUNCTION TEMPERATURE (°C)
95
100
10
−40 −25 −10
5
20 35 50 65 80
TJ, JUNCTION TEMPERATURE (°C)
110
120
110
100
90
DC
80
70
180°
60
50
40
30°
0
60°
90°
120°
0.1
0.2
0.3
0.4
IT(RMS), RMS ON-STATE CURRENT (AMPS)
110
Figure 4. Typical Latching Current versus
Junction Temperature
0.5
I T, INSTANTANEOUS ON−STATE CURRENT (AMPS)
TC, MAXIMUM ALLOWABLE CASE TEMPERATURE ( °C)
Figure 3. Typical Holding Current versus
Junction Temperature
95
10
MAXIMUM @ TJ = 25°C
MAXIMUM @ TJ = 110°C
1
0.1
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
VT, INSTANTANEOUS ON-STATE VOLTAGE (VOLTS)
Figure 5. Typical RMS Current Derating
Figure 6. Typical On−State Characteristics
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NCR169D
TO−92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL
H2A
H2A
H2B
H2B
H
W2
H4 H5
T1
L1
H1
W1 W
L
F1
T2
F2
P2
D
P2
P1
T
P
Figure 7. Device Positioning on Tape
Specification
Inches
Symbol
Item
Millimeter
Min
Max
Min
Max
0.1496
0.1653
3.8
4.2
D
Tape Feedhole Diameter
D2
Component Lead Thickness Dimension
0.015
0.020
0.38
0.51
Component Lead Pitch
0.0945
0.110
2.4
2.8
F1, F2
H
Bottom of Component to Seating Plane
H1
Feedhole Location
H2A
Deflection Left or Right
H2B
Deflection Front or Rear
H4
Feedhole to Bottom of Component
H5
.059
.156
1.5
4.0
0.3346
0.3741
8.5
9.5
0
0.039
0
1.0
0
0.051
0
1.0
0.7086
0.768
18
19.5
Feedhole to Seating Plane
0.610
0.649
15.5
16.5
L
Defective Unit Clipped Dimension
0.3346
0.433
8.5
11
L1
Lead Wire Enclosure
0.09842
−
2.5
−
P
Feedhole Pitch
0.4921
0.5079
12.5
12.9
P1
Feedhole Center to Center Lead
0.2342
0.2658
5.95
6.75
P2
First Lead Spacing Dimension
0.1397
0.1556
3.55
3.95
0.06
0.08
0.15
0.20
−
0.0567
−
1.44
T
Adhesive Tape Thickness
T1
Overall Taped Package Thickness
T2
Carrier Strip Thickness
0.014
0.027
0.35
0.65
W
Carrier Strip Width
0.6889
0.7481
17.5
19
W1
Adhesive Tape Width
0.2165
0.2841
5.5
6.3
W2
Adhesive Tape Position
.0059
0.01968
.15
0.5
NOTES:
1. Maximum alignment deviation between leads not to be greater than 0.2 mm.
2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.
3. Component lead to tape adhesion must meet the pull test requirements.
4. Maximum non−cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.
5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.
6. No more than 1 consecutive missing component is permitted.
7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.
8. Splices will not interfere with the sprocket feed holes.
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NCR169D
ORDERING & SHIPPING INFORMATION: MCR100 Series packaging options, Device Suffix
Device
Description of TO92 Tape Orientation
Shipping
NCR169D
N/A, Bulk
Bulk in Box (5K/Box)
NCR169DG
N/A, Bulk
Bulk in Box (5K/Box)
(Pb−Free)
NCR169DRLRA
Round side of TO92 and adhesive tape visible
Radial Tape and Reel (2K/Reel)
NCR169DRLRAG
Round side of TO92 and adhesive tape visible
Radial Tape and Reel (2K/Reel)
(Pb−Free)
NCR169DRLRM
Flat side of TO92 and adhesive tape visible
Radial Tape and Fan Fold Box (2K/Box)
NCR169DRLRMG
Flat side of TO92 and adhesive tape visible
Radial Tape and Fan Fold Box (2K/Box)
(Pb−Free)
NCR169DRLRP
Flat side of TO92 and adhesive tape visible
Radial Tape and Fan Fold Box (2K/Box)
NCR169DRLRPG
Flat side of TO92 and adhesive tape visible
Radial Tape and Fan Fold Box (2K/Box)
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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NCR169D
PACKAGE DIMENSIONS
TO−92 (TO−226AA)
CASE 029−11
ISSUE AL
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
B
R
P
L
SEATING
PLANE
K
D
X X
G
J
H
V
C
SECTION X−X
1
N
DIM
A
B
C
D
G
H
J
K
L
N
P
R
V
INCHES
MIN
MAX
0.175
0.205
0.170
0.210
0.125
0.165
0.016
0.021
0.045
0.055
0.095
0.105
0.015
0.020
0.500
−−−
0.250
−−−
0.080
0.105
−−−
0.100
0.115
−−−
0.135
−−−
STYLE 10:
PIN 1. CATHODE
2. GATE
3. ANODE
N
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7
MILLIMETERS
MIN
MAX
4.45
5.20
4.32
5.33
3.18
4.19
0.407
0.533
1.15
1.39
2.42
2.66
0.39
0.50
12.70
−−−
6.35
−−−
2.04
2.66
−−−
2.54
2.93
−−−
3.43
−−−
NCR169D
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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For additional information, please contact your
local Sales Representative.
NCR169D/D
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