Order this document by MPX2700/D SEMICONDUCTOR TECHNICAL DATA "##%" !"$%" !#$ "$ "##%" # "# The MPX2700 series device is a silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output — directly proportional to the applied pressure. The sensor is a single monolithic silicon diaphragm with the strain gauge and a thin–film resistor network integrated on–chip. The sensor is laser trimmed for precise span and offset calibration and temperature compensation. Features • Unique Silicon Shear Stress Strain Gauge • ± 0.5% Linearity • Easy to Use Chip Carrier Package • Basic Element, Single and Dual Ported Devices Available • Available in Absolute, Differential and Gauge configurations Application Examples • Pump/Motor Controllers • Pneumatic Control • Tire Pressure Gauges • Robotics • Medical Diagnostics • Pressure Switching • Hydraulics 0 to 700 kPa (0 to 100 psi) 40 mV FULL SCALE SPAN (TYPICAL) BASIC CHIP CARRIER ELEMENT CASE 344–15, STYLE 1 Figure 1 shows a block diagram of the internal circuitry on the stand–alone pressure sensor chip. DIFFERENTIAL PORT OPTION CASE 344C–01, STYLE 1 VS 3 THIN FILM TEMPERATURE COMPENSATION AND CALIBRATION CIRCUITRY X–ducer SENSING ELEMENT NOTE: Pin 1 is the notched pin. 2 4 Vout+ Vout– PIN NUMBER 1 Gnd 3 VS 2 +Vout 4 –Vout 1 GND Figure 1. Temperature Compensated Pressure Sensor Schematic VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the X–ducer is directly proportional to the differential pressure applied. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). This sensor is designed for applications where P1 is always greater than, or equal to P2. Senseon and X–ducer are trademarks of Motorola, Inc. REV 2 Motorola Sensor Device Data Motorola, Inc. 1997 1 MAXIMUM RATINGS Rating Overpressure(8) (P2 v 1 Atmosphere) v 1 Atmosphere) Symbol Value Unit P1max 2800 kPa Burst Pressure(8) (P2 P1burst 5000 kPa Storage Temperature Tstg – 40 to +125 °C TA – 40 to +125 °C Operating Temperature OPERATING CHARACTERISTICS (VCC = 10 Vdc, TA = 25°C unless otherwise noted. P1 w P2; P2 v 1 Atmosphere.) Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 700 kPa Supply Voltage(2) VS — 10 16 Vdc Supply Current Io — 6.0 — mAdc VFSS 38.5 40 41.5 mV Characteristic Full Scale Span(3) Offset(4) Voff –1.0 — 1.0 mV Sensitivity ∆V/∆P — 0.057 — mV/kPa Linearity(5) — – 0.5 — 0.5 %VFSS Pressure Hysteresis(5) (0 to 700 kPa) — — ± 0.1 — %VFSS Temperature Hysteresis(5) (– 40°C to +125°C) — — ± 0.5 — %VFSS TCVFSS –1.0 — 1.0 %VFSS TCVoff –1.0 — 1.0 mV Zin 1300 — 4000 Ω Zout 1400 — 3000 Ω Response Time(6) (10% to 90%) tR — 1.0 — ms Warm–Up(7) — — 20 — ms Temperature Effect on Full Scale Span(5) Temperature Effect on Offset(5) Input Impedance Output Impedance MECHANICAL CHARACTERISTICS Characteristic Weight (Basic Element Case 344–15) Symbol Min Typ Max Unit — — 2.0 — Grams NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm–up is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized. 8. Basic Element only, Case 344–15. 9. P2 max : 500 kPa. 2 Motorola Sensor Device Data LEAST SQUARES FIT EXAGGERATED PERFORMANCE CURVE RELATIVE VOLTAGE OUTPUT LINEARITY Linearity refers to how well a transducer’s output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit or (2) a least squares best line fit (see Figure 3). While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. LEAST SQUARE DEVIATION STRAIGHT LINE DEVIATION END POINT STRAIGHT LINE FIT OFFSET 0 50 PRESSURE (% FULLSCALE) 100 Figure 2. Linearity Specification Comparison ON–CHIP TEMPERATURE COMPENSATION and CALIBRATION Figure 3 shows the output characteristics of the MPX2700 series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. The effects of temperature on Full–Scale Span and Offset are very small and are shown under Operating Characteristics. 50 OUTPUT (mV) 40 VS = 10 V TA = 25°C P1 > P2 30 TYP SILICONE DIE COAT MAX SPAN RANGE (TYP) 20 MIN P1 WIRE BOND 10 0 –5 PSI kPa 20 140 40 280 60 420 80 560 100 700 LEAD FRAME OFFSET Figure 3. Output versus Pressure Differential Figure 4 shows the cross section of the Motorola MPX pressure sensor die in the chip carrier package. A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. MPX2700 series pressure sensor operating characteristics and internal reli- Motorola Sensor Device Data STAINLESS STEEL METAL COVER ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ DIE P2 RTV DIE BOND EPOXY CASE Figure 4. Cross–Section of Differential Pressure Sensor Die in Its Basic Package (Not to Scale) ability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. 3 PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Motorola MPX Part Number MPX2700D Case Type MPX2700A MPX2700DP MPX2700GP MPX2700AP MPX2700GVP MPX2700GS MPX2700AS MPX2700GVS MPX2700GSX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: MPX2700ASX MPX2700GVSX Pressure (P1) Side Identifier 344–15C Stainless Steel Cap 344C–01 Side with Part Marking 344B–01 Side with Port Attached 344D–01 Stainless Steel Cap 344E–01 Side with Port Attached 344A–01 Stainless Steel Cap 344F–01 Side with Port Attached 344G–01 Stainless Steel Cap ORDERING INFORMATION MPX2700 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPX Series D i T Device Type O i Options C Case Type T Order Number Device Marking Basic Element Differential Case 344–15 MPX2700D MPX2700D Ported Elements Differential Case 344C–01 MPX2700DP MPX2700DP Gauge Case 344B–01 MPX2700GP MPX2700GP Gauge Vacuum Case 344D–01 MPX2700GVP MPX2700GVP Gauge Stove Pipe Case 344E–01 MPX2700GS MPX2700D Gauge Vacuum Stove Pipe Case 344A–01 MPX2700GVS MPX2700D Gauge Axial Case 344F–01 MPX2700GSX MPX2700D Gauge Vacuum Axial Case 344G–01 MPX2700GVSX MPX2700D 4 Motorola Sensor Device Data PACKAGE DIMENSIONS NOTES: C 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION –A– IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). POSITIVE PRESSURE (P1) R M B –A– DIM A B C D F G J L M N R N 1 PIN 1 2 3 L 4 –T– SEATING PLANE J POSITIVE PRESSURE (P1) G F D 4 PL 0.136 (0.005) M T A M INCHES MIN MAX 0.595 0.630 0.514 0.534 0.200 0.220 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 30_ NOM 0.475 0.495 0.430 0.450 STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 15.11 16.00 13.06 13.56 5.08 5.59 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.40 17.65 18.42 30_ NOM 12.07 12.57 10.92 11.43 GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344–15 ISSUE W PORT #2 VACUUM PRESSURE (P2) –B– C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A POSITIVE PRESSURE (P1) PIN 1 V 1 2 3 4 K J N R SEATING PLANE S –T– G F D 4 PL 0.13 (0.005) M T B M DIM A B C D F G J K N R S V INCHES MIN MAX 0.690 0.720 0.245 0.255 0.780 0.820 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.345 0.375 0.300 0.310 0.178 0.186 0.220 0.240 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 17.53 18.28 6.22 6.48 19.81 20.82 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.41 8.76 9.53 7.62 7.87 4.52 4.72 5.59 6.10 4.62 4.93 GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344A–01 ISSUE B Motorola Sensor Device Data 5 PACKAGE DIMENSIONS — CONTINUED SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5, 1982. 2. CONTROLLING DIMENSION: INCH. –A– –T– U L R H N PORT #1 POSITIVE PRESSURE (P1) –Q– B 1 2 3 4 PIN 1 K –P– 0.25 (0.010) T Q M S S J F G D 4 PL 0.13 (0.005) C M T S S Q S INCHES MIN MAX 1.145 1.175 0.685 0.715 0.305 0.325 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.230 0.250 0.220 0.240 0.910 BSC DIM A B C D F G H J K L N P Q R S U STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 7.75 8.26 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.10 23.11 BSC GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344B–01 ISSUE B PORT #1 R NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. –A– U V W L H PORT #2 N PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2) –Q– B SEATING PLANE SEATING PLANE 1 2 3 4 PIN 1 K –P– –T– –T– 0.25 (0.010) M T Q S S F J G D 4 PL C 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U V W INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.248 0.278 0.310 0.330 STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 6.30 7.06 7.87 8.38 GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344C–01 ISSUE B 6 Motorola Sensor Device Data PACKAGE DIMENSIONS — CONTINUED NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5, 1982. 2. CONTROLLING DIMENSION: INCH. –A– U L SEATING PLANE –T– R DIM A B C D F G H J K L N P Q R S U H PORT #2 VACUUM (P2) POSITIVE PRESSURE (P1) N –Q– B 1 2 3 4 K PIN 1 S C J F –P– 0.25 (0.010) M T Q G D 4 PL 0.13 (0.005) S M T S S Q S INCHES MIN MAX 1.145 1.175 0.685 0.715 0.305 0.325 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.158 0.230 0.250 0.220 0.240 0.910 BSC STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 7.75 8.26 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.10 23.11 BSC GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344D–01 ISSUE B PORT #1 POSITIVE PRESSURE (P1) –B– C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A BACK SIDE VACUUM (P2) DIM A B C D F G J K N R S V V 4 3 2 1 PIN 1 K J N R SEATING PLANE S –T– INCHES MIN MAX 0.690 0.720 0.245 0.255 0.780 0.820 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.345 0.375 0.300 0.310 0.178 0.186 0.220 0.240 0.182 0.194 MILLIMETERS MIN MAX 17.53 18.28 6.22 6.48 19.81 20.82 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.41 8.76 9.53 7.62 7.87 4.52 4.72 5.59 6.10 4.62 4.93 G F D 4 PL 0.13 (0.005) M T B M STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344E–01 ISSUE B Motorola Sensor Device Data 7 PACKAGE DIMENSIONS — CONTINUED –T– C A E –Q– U N V B R PORT #1 POSITIVE PRESSURE (P1) PIN 1 –P– 0.25 (0.010) M T Q M 4 3 2 1 S K F J NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MIN MAX 1.080 1.120 0.740 0.760 0.630 0.650 0.016 0.020 0.160 0.180 0.048 0.064 0.100 BSC 0.014 0.016 0.220 0.240 0.070 0.080 0.150 0.160 0.150 0.160 0.440 0.460 0.695 0.725 0.840 0.860 0.182 0.194 MILLIMETERS MIN MAX 27.43 28.45 18.80 19.30 16.00 16.51 0.41 0.51 4.06 4.57 1.22 1.63 2.54 BSC 0.36 0.41 5.59 6.10 1.78 2.03 3.81 4.06 3.81 4.06 11.18 11.68 17.65 18.42 21.34 21.84 4.62 4.92 G D 4 PL 0.13 (0.005) T P M S Q STYLE 1: PIN 1. 2. 3. 4. S GROUND V (+) OUT V SUPPLY V (–) OUT CASE 344F–01 ISSUE B –T– C A E –Q– U POSITIVE PRESSURE (P1) N V B R PIN 1 PORT #2 VACUUM (P2) –P– 0.25 (0.010) M T Q M 1 2 3 4 S K J F G D 4 PL 0.13 (0.005) M T P S Q S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MIN MAX 1.080 1.120 0.740 0.760 0.630 0.650 0.016 0.020 0.160 0.180 0.048 0.064 0.100 BSC 0.014 0.016 0.220 0.240 0.070 0.080 0.150 0.160 0.150 0.160 0.440 0.460 0.695 0.725 0.840 0.860 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 27.43 28.45 18.80 19.30 16.00 16.51 0.41 0.51 4.06 4.57 1.22 1.63 2.54 BSC 0.36 0.41 5.59 6.10 1.78 2.03 3.81 4.06 3.81 4.06 11.18 11.68 17.65 18.42 21.34 21.84 4.62 4.92 GROUND V (+) OUT V SUPPLY V (–) OUT CASE 344G–01 ISSUE B 8 Motorola Sensor Device Data Motorola reserves the right to make changes without further notice to any products herein. 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Motorola Sensor Device Data 9 Mfax is a trademark of Motorola, Inc. How to reach us: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315 Mfax: [email protected] – TOUCHTONE 602–244–6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, – US & Canada ONLY 1–800–774–1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 INTERNET: http://motorola.com/sps 10 ◊ MPX2700/D Motorola Sensor Device Data