Product Folder Sample & Buy Technical Documents Support & Community Tools & Software LM224K, LM224KA, LM324, LM324A, LM324K, LM324KA, LM2902 LM124, LM124A, LM224, LM224A, LM2902V, LM2902K, LM2902KV, LM2902KAV SLOS066W – SEPTEMBER 1975 – REVISED MARCH 2015 LMx24, LMx24x, LMx24xx, LM2902, LM2902x, LM2902xx, LM2902xxx Quadruple Operational Amplifiers 1 Features 2 Applications • • • • • • • • 1 • • • • • • • • 2-kV ESD Protection for: – LM224K, LM224KA – LM324K, LM324KA – LM2902K, LM2902KV, LM2902KAV Wide Supply Ranges – Single Supply: 3 V to 32 V (26 V for LM2902) – Dual Supplies: ±1.5 V to ±16 V (±13 V for LM2902) Low Supply-Current Drain Independent of Supply Voltage: 0.8 mA Typical Common-Mode Input Voltage Range Includes Ground, Allowing Direct Sensing Near Ground Low Input Bias and Offset Parameters – Input Offset Voltage: 3 mV Typical MM A Versions: 2 mV Typical – Input Offset Current: 2 nA Typical – Input Bias Current: 20 nA Typical MMA Versions: 15 nA Typical Differential Input Voltage Range Equal to Maximum-Rated Supply Voltage: 32 V (26 V for LM2902) Open-Loop Differential Voltage Amplification: 100 V/mV Typical Internal Frequency Compensation On Products Compliant to MIL-PRF-38535, All Parameters are Tested Unless Otherwise Noted. On All Other Products, Production Processing Does Not Necessarily Include Testing of All Parameters. • • • • Blu-ray Players and Home Theaters Chemical and Gas Sensors DVD Recorders and Players Digital Multimeter: Bench and Systems Digital Multimeter: Handhelds Field Transmitter: Temperature Sensors Motor Control: AC Induction, Brushed DC, Brushless DC, High-Voltage, Low-Voltage, Permanent Magnet, and Stepper Motor Oscilloscopes TV: LCD and Digital Temperature Sensors or Controllers Using Modbus Weigh Scales 3 Description These devices consist of four independent high-gain frequency-compensated operational amplifiers that are designed specifically to operate from a single supply or split supply over a wide range of voltages. Device Information(1) PART NUMBER LMx24, LMx24x, LMx24xx, LM2902, LM2902x, LM2902xx, LM2902xxx LM124, LM124A PACKAGE BODY SIZE (NOM) SOIC (14) 8.65 mm × 3.91 mm CDIP (14) 19.56 mm × 6.67 mm PDIP (14) 19.30 mm × 6.35 mm CFP (14) 9.21 mm × 5.97 mm TSSOP (14) 5.00 mm × 4.40 mm SO (14) 9.20 mm × 5.30 mm SSOP (14) 6.20 mm × 5.30 mm LCCC (20) 8.90 mm × 8.90 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Symbol (Each Amplifier) − IN− OUT + IN+ 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM224K, LM224KA, LM324, LM324A, LM324K, LM324KA, LM2902 LM124, LM124A, LM224, LM224A, LM2902V, LM2902K, LM2902KV, LM2902KAV SLOS066W – SEPTEMBER 1975 – REVISED MARCH 2015 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 6.7 4 4 4 5 5 6 Absolute Maximum Ratings ...................................... ESD Ratings ............................................................ Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics for LMx24 and LM324K .... Electrical Characteristics for LM2902 and LM2902V Electrical Characteristics for LMx24A and LM324KA ................................................................... 6.8 Operating Conditions ................................................ 6.9 Typical Characteristics .............................................. 7 8 6 7 8 Parameter Measurement Information .................. 9 Detailed Description ............................................ 10 8.1 8.2 8.3 8.4 9 Overview ................................................................. Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ 10 10 11 11 Application and Implementation ........................ 12 9.1 Application Information............................................ 12 9.2 Typical Application ................................................. 12 10 Power Supply Recommendations ..................... 13 11 Layout................................................................... 13 11.1 Layout Guidelines ................................................. 13 11.2 Layout Examples................................................... 14 12 Device and Documentation Support ................. 15 12.1 12.2 12.3 12.4 12.5 Documentation Support ....................................... Related Links ........................................................ Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 15 15 15 15 15 13 Mechanical, Packaging, and Orderable Information ........................................................... 15 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision V (January 2014) to Revision W Page • Added Applications ................................................................................................................................................................. 1 • Added Device Information table ............................................................................................................................................. 1 • Added Device and Documentation Support section............................................................................................................. 15 • Added Mechanical, Packaging, and Orderable Information section..................................................................................... 15 Changes from Revision U (August 2010) to Revision V Page • Updated document to new TI data sheet format - no specification changes. ........................................................................ 1 • Updated Features ................................................................................................................................................................... 1 • Removed Ordering Information table ..................................................................................................................................... 3 • Added ESD warning. ............................................................................................................................................................ 15 2 Submit Documentation Feedback Copyright © 1975–2015, Texas Instruments Incorporated Product Folder Links: LM224K LM224KA LM324 LM324A LM324K LM324KA LM2902 LM124 LM124A LM224 LM224A LM2902V LM2902K LM2902KV LM2902KAV LM224K, LM224KA, LM324, LM324A, LM324K, LM324KA, LM2902 LM124, LM124A, LM224, LM224A, LM2902V, LM2902K, LM2902KV, LM2902KAV www.ti.com SLOS066W – SEPTEMBER 1975 – REVISED MARCH 2015 5 Pin Configuration and Functions FK Package 20-Pin LCCC (Top View) 1IN− 1OUT NC 4OUT 4IN− D, DB, J, N, NS, PW, W 14-Pin SOIC, SSOP, CDIP, PDIP, SO, TSSOP, CFP (Top View) 1IN+ NC VCC NC 2IN+ 4 3 2 1 20 19 18 17 5 6 16 7 15 14 9 10 11 12 13 4IN+ NC GND NC 3IN+ 1 14 2 13 3 12 4 11 5 10 6 9 7 8 4OUT 4IN− 4IN+ GND 3IN+ 3IN− 3OUT 2IN− 2OUT NC 3OUT 3IN− 8 1OUT 1IN− 1IN+ VCC 2IN+ 2IN− 2OUT Pin Functions PIN LCCC NO. SOIC, SSOP, CDIP, PDIP, SO, TSSOP, CFP NO. 1IN– 3 2 I Negative input 1IN+ 4 3 I Positive input 1OUT 2 1 O Output 2IN– 9 6 I Negative input 2IN+ 8 5 I Positive input 2OUT 10 7 O Output 3IN– 13 9 I Negative input 3IN+ 14 10 I Positive input 3OUT 12 8 O Output 4IN– 19 13 I Negative input 4IN+ 18 12 I Positive input 4OUT 20 14 O Output GND 16 11 — Ground — — Do not connect 4 — Power supply NAME I/O DESCRIPTION 1 5 NC 7 11 15 17 VCC 6 Copyright © 1975–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM224K LM224KA LM324 LM324A LM324K LM324KA LM2902 LM124 LM124A LM224 LM224A LM2902V LM2902K LM2902KV LM2902KAV 3 LM224K, LM224KA, LM324, LM324A, LM324K, LM324KA, LM2902 LM124, LM124A, LM224, LM224A, LM2902V, LM2902K, LM2902KV, LM2902KAV SLOS066W – SEPTEMBER 1975 – REVISED MARCH 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) LMx24, LMx24x, LMx24xx, LM2902x, LM2902xx, LM2902xxx LM2902 Supply voltage, VCC (2) Differential input voltage, VID MIN MAX MIN MAX ±13 26 ±16 32 V ±32 V –0.3 to 32 V (3) ±26 Input voltage, VI (either input) –0.3 Duration of output short circuit (one amplifier) to ground at (or below) TA = 25°C, VCC ≤ 15 V (4) 26 Unlimited Operating virtual junction temperature, TJ FK package Lead temperature 1.6 mm (1/16 inch) from case for 60 seconds J or W package 300 Storage temperature, Tstg (1) (2) (3) (4) Unlimited 150 Case temperature for 60 seconds UNIT –65 150 –65 150 °C 260 °C 300 °C 150 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND. Differential voltages are at IN+, with respect to IN−. Short circuits from outputs to VCC can cause excessive heating and eventual destruction. 6.2 ESD Ratings VALUE UNIT LM224K, LM224KA, LM324K, LM324KA, LM2902K, LM2902KV, LM2902KAV V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000 Charged-device model (CDM), per JEDEC specification JESD22-C101 ±1000 V LM124, LM124A, LM224, LM224A, LM324, LM324A, LM2902, LM2902V V(ESD) (1) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±500 Charged-device model (CDM), per JEDEC specification JESD22-C101 ±1000 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) LMx24, LMx24x, LMx24xx, LM2902x, LM2902xx, LM2902xxx LM2902 MIN MAX MIN UNIT MAX VCC Supply voltage 3 26 3 30 V VCM Common-mode voltage 0 VCC – 2 0 VCC – 2 V –55 125 LM324 0 70 LM224 –25 85 LM124 TA Operating free air temperature 4 LM2904 Submit Documentation Feedback –40 125 °C Copyright © 1975–2015, Texas Instruments Incorporated Product Folder Links: LM224K LM224KA LM324 LM324A LM324K LM324KA LM2902 LM124 LM124A LM224 LM224A LM2902V LM2902K LM2902KV LM2902KAV LM224K, LM224KA, LM324, LM324A, LM324K, LM324KA, LM2902 LM124, LM124A, LM224, LM224A, LM2902V, LM2902K, LM2902KV, LM2902KAV www.ti.com SLOS066W – SEPTEMBER 1975 – REVISED MARCH 2015 6.4 Thermal Information LMx24, LM2902 DB (SSOP) N (PDIP) NS (SO) PW (TSSOP) FK (LCCC) J (CDIP) W (CFP) 14 PINS 14 PINS 14 PINS 14 PINS 14 PINS 20 PINS 14 PINS 14 PINS Junction-toambient thermal resistance 86 86 80 76 113 — — — Junction-to-case (top) thermal resistance — THERMAL METRIC RθJA (2) (3) RθJC (4) (1) (2) (3) (4) LMx24 D (SOIC) (1) UNIT °C/W — — — — 5.61 15.05 14.65 For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Short circuits from outputs to VCC can cause excessive heating and eventual destruction. Maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/RθJA. Operating at the absolute maximum TJ of 150°C can affect reliability. Maximum power dissipation is a function of TJ(max), RθJA, and TC. The maximum allowable power dissipation at any allowable case temperature is PD = (TJ(max) – TC)/RθJC. Operating at the absolute maximum TJ of 150°C can affect reliability. 6.5 Electrical Characteristics for LMx24 and LM324K at specified free-air temperature, VCC = 5 V (unless otherwise noted) PARAMETER VIO Input offset voltage IIO Input offset current IIB Input bias current VICR Common-mode input voltage range TEST CONDITIONS (1) VCC = 5 V to MAX, VIC = VICRmin, VO = 1.4 V TA (2) LM124, LM224 MIN 25°C 2 VCC = 5 V to MAX RL = 2 kΩ 25°C RL = 10 kΩ 25°C –20 –250 –500 0 to VCC – 2 VCC – 1.5 VCC – 1.5 26 27 Common-mode rejection ratio VIC = VICRmin kSVR Supply-voltage rejection ratio (ΔVCC /ΔVIO) VO1/ VO2 Crosstalk attenuation (2) (3) –150 0 to VCC – 2 Full range CMRR (1) 50 150 0 to VCC – 1.5 RL ≥ 10 kΩ AVD Supply current (four amplifiers) 2 V V VCC = 15 V, VO = 1 V to 11 V, RL ≥ 2 kΩ ICC 30 0 to VCC – 1.5 26 Large-signal differential voltage amplification Short-circuit output current 9 –300 Full range RL ≤ 10 kΩ IOS –20 RL = 2 kΩ Low-level output voltage Full range 28 5 27 28 25 100 20 100 5 20 mV 25°C 50 Full range 25 25°C 70 80 65 80 dB 25°C 65 100 65 100 dB V/mV f = 1 kHz to 20 kHz 25°C VCC = 15 V, VID = 1 V, VO = 0 25°C –20 Full range –10 25°C 10 VCC = 15 V, VID = –1 V, VO = 15 V 7 nA VOL Output current 3 100 Full range Full range IO MAX nA Full range VO = 1.4 V VCC = MAX 5 UNIT TYP (3) mV 25°C High-level output voltage 3 MIN 7 25°C VOH MAX Full range 25°C VO = 1.4 V LM324, LM324K TYP (3) 15 120 –30 120 –60 –20 –30 dB –60 Source –10 mA 20 10 30 12 20 Sink Full range 5 VID = –1 V, VO = 200 mV 25°C 12 5 VCC at 5 V, VO = 0, GND at –5 V 25°C ±40 ±60 ±40 ±60 VO = 2.5 V, no load Full range 0.7 1.2 0.7 1.2 VCC = MAX, VO = 0.5 VCC, no load Full range 1.4 3 1.4 3 μA 30 mA mA All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX VCC for testing purposes is 26 V for LM2902 and 30 V for the others. Full range is –55°C to 125°C for LM124, –25°C to 85°C for LM224, and 0°C to 70°C for LM324. All typical values are at TA = 25°C Copyright © 1975–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM224K LM224KA LM324 LM324A LM324K LM324KA LM2902 LM124 LM124A LM224 LM224A LM2902V LM2902K LM2902KV LM2902KAV 5 LM224K, LM224KA, LM324, LM324A, LM324K, LM324KA, LM2902 LM124, LM124A, LM224, LM224A, LM2902V, LM2902K, LM2902KV, LM2902KAV SLOS066W – SEPTEMBER 1975 – REVISED MARCH 2015 www.ti.com 6.6 Electrical Characteristics for LM2902 and LM2902V at specified free-air temperature, VCC = 5 V (unless otherwise noted) TEST CONDITIONS (1) PARAMETER VIO VCC = 5 V to MAX, VIC = VICRmin, VO = 1.4 V Input offset voltage ΔVIO/ΔT Input offset voltage temperature drift LM2902 TA (2) Non-A-suffix devices MIN 25°C Input offset current ΔIIO/ΔT Input offset voltage temperature drift 3 1 4 2 VCC = 5 V to MAX 10 25°C Large-signal differential voltage amplification CMRR Common-mode rejection ratio VIC = VICRmin kSVR Supply-voltage rejection ratio (ΔVCC /ΔVIO) VO1/ VO2 Crosstalk attenuation Supply current (four amplifiers) (1) (2) (3) –250 pA/°C –20 –250 –500 –500 0 to VCC – 1.5 0 to VCC – 1.5 0 to VCC – 2 0 to VCC – 2 VCC – 1.5 VCC – 1.5 RL = 2 kΩ Full range 22 26 RL ≥ 10 kΩ Full range 23 24 Full range V V 27 5 20 5 100 25 20 mV 25°C 25 Full range 15 100 25°C 50 80 60 80 dB 25°C 50 100 60 100 dB V/mV f = 1 kHz to 20 kHz 25°C VCC = 15 V, VID = 1 V, VO = 0 25°C –20 Full range –10 25°C 10 Full range 5 15 120 120 –30 –60 –20 dB –30 –60 Source –10 mA VCC = 15 V, VID = –1 V, VO = 15 V ICC –20 25°C RL = 10 kΩ AVD Short-circuit output current 150 nA VCC = 15 V, VO = 1 V to 11 V, RL ≥ 2 kΩ IOS 50 300 Full range RL ≤ 10 kΩ Output current μV/°C 2 Ful range Low-level output voltage IO 50 nA VCC = MAX VOL 2 7 Full range RL = 2 kΩ High-level output voltage 7 10 Ful range Full range VOH 3 Full range RS = 0 Ω VO = 1.4 V Common-mode input voltage range 7 MAX mV 25°C VICR UNIT TYP (3) 25°C A-suffix devices VO = 1.4 V Input bias current MIN 10 25°C IIB MAX Full range 25°C IIO LM2902V TYP (3) 20 10 12 20 Sink 5 μA VID = –1 V, VO = 200 mV 25°C 30 VCC at 5 V, VO = 0, GND at –5 V 25°C ±40 ±60 ±40 40 ±60 VO = 2.5 V, no load Full range 0.7 1.2 0.7 1.2 VCC = MAX, VO = 0.5 VCC, no load Full range 1.4 3 1.4 3 mA mA All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX VCC for testing purposes is 26 V for LM2902 and 32 V for LM2902V. Full range is –40°C to 125°C for LM2902. All typical values are at TA = 25°C. 6.7 Electrical Characteristics for LMx24A and LM324KA at specified free-air temperature, VCC = 5 V (unless otherwise noted) PARAMETER TEST CONDITIONS (1) VIO Input offset voltage VCC = 5 V to 30 V, VIC = VICRmin, VO = 1.4 V IIO Input offset current VO = 1.4 V IIB Input bias current VO = 1.4 V (1) (2) (3) 6 TA (2) LM124A MIN TYP (3) LM224A MAX 25°C 2 Full range 4 25°C 10 Full range 30 MIN LM324A, LM324KA TYP (3) MAX 2 3 MIN UNIT TYP (3) MAX 2 3 mV 4 2 15 5 2 30 nA 25°C –50 Full range –100 30 –15 –80 75 –15 –100 nA –100 –200 All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. Full range is –55°C to 125°C for LM124A, –25°C to 85°C for LM224A, and 0°C to 70°C for LM324A. All typical values are at TA = 25°C. Submit Documentation Feedback Copyright © 1975–2015, Texas Instruments Incorporated Product Folder Links: LM224K LM224KA LM324 LM324A LM324K LM324KA LM2902 LM124 LM124A LM224 LM224A LM2902V LM2902K LM2902KV LM2902KAV LM224K, LM224KA, LM324, LM324A, LM324K, LM324KA, LM2902 LM124, LM124A, LM224, LM224A, LM2902V, LM2902K, LM2902KV, LM2902KAV www.ti.com SLOS066W – SEPTEMBER 1975 – REVISED MARCH 2015 Electrical Characteristics for LMx24A and LM324KA (continued) at specified free-air temperature, VCC = 5 V (unless otherwise noted) TEST CONDITIONS (1) PARAMETER VICR Common-mode input voltage range 25°C VCC = 30 V Full range High-level output voltage VCC = 30 V kSVR Supply-voltage rejection ratio (ΔVCC /ΔVIO) VO1/ VO2 Crosstalk attenuation ICC Supply current (four amplifiers) 0 to VCC – 2 VCC – 1.5 27 VIC = VICRmin IOS 0 to VCC – 2 27 Common-mode rejection ratio Short-circuit output current 0 to VCC − 2 Full range CMRR MIN 0 to VCC – 1.5 RL≥ 10 kΩ VCC = 15 V, VO = 1 V to 11 V, RL ≥ 2 kΩ LM324A, LM324KA MAX 0 to VCC – 1.5 26 Large-signal differential voltage amplification TYP (3) 0 to VCC − 1.5 VCC – 1.5 AVD Full range 20 50 UNIT MAX V 26 28 5 100 TYP (3) V 27 28 20 100 5 25 20 mV 25°C 50 100 Full range 25 25 25°C 70 70 80 65 80 dB 25°C 65 65 100 65 100 dB 120 dB V/mV f = 1 kHz to 20 kHz VCC = 15 V, VID = –1 V, VO = 15 V MIN 26 RL ≤ 10 kΩ Output current LM224A MAX VCC − 1.5 25°C Low-level output voltage IO TYP (3) Full range VOL VCC = 15 V, VID = 1 V, VO = 0 LM124A MIN RL= 2 kΩ RL = 2 kΩ VOH TA (2) 25°C 120 15 120 25°C –20 –20 Full range –10 –10 25°C 10 10 –30 –60 –20 –30 –60 Source –10 mA 20 1 30 12 20 Sink Full range 5 5 VID = −1 V, VO = 200 mV 25°C 12 12 5 VCC at 5 V, GND at –5 V, VO = 0 25°C ±40 ±60 ±40 ±60 ±40 ±60 VO = 2.5 V, no load Full range 0.7 1.2 0.7 1.2 0.7 1.2 VCC = 30 V, VO = 15 V, no load Full range 1.4 3. 1.4 3 1.4 3 μA 30 mA mA 6.8 Operating Conditions VCC = ±15 V, TA = 25°C PARAMETER TEST CONDITIONS TYP UNIT SR Slew rate at unity gain RL = 1 MΩ, CL = 30 pF, VI = ±10 V (see Figure 7) 0.5 V/μs B1 Unity-gain bandwidth RL = 1 MΩ, CL = 20 pF (see Figure 7) 1.2 MHz Vn Equivalent input noise voltage RS = 100 Ω, VI = 0 V, f = 1 kHz (see Figure 8) 35 nV/√Hz Copyright © 1975–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM224K LM224KA LM324 LM324A LM324K LM324KA LM2902 LM124 LM124A LM224 LM224A LM2902V LM2902K LM2902KV LM2902KAV 7 LM224K, LM224KA, LM324, LM324A, LM324K, LM324KA, LM2902 LM124, LM124A, LM224, LM224A, LM2902V, LM2902K, LM2902KV, LM2902KAV SLOS066W – SEPTEMBER 1975 – REVISED MARCH 2015 www.ti.com 6.9 Typical Characteristics 10 Output Voltage Referenced to +Vcc (V) 8 Output Voltage (V) 5 3 2 1 0.5 0.3 0.2 0.1 0.05 0.03 0.02 VCC = 15 V VCC = 5 V VCC = 30 V 0.01 0.001 0.01 0.1 0.2 0.5 1 2 3 5 710 20 Output Sink Current (mA) VCC = 15 V 7 6 5 4 3 2 1 0.001 50 100 0.01 D001 Figure 1. Output Sinking Characteristics 0.1 0.2 0.5 1 2 3 5 710 20 Output Source Current (mA) 50 100 D002 Figure 2. Output Sourcing Characteristics 0.09 3.25 3 0.08 2.75 0.07 Output Voltage (V) 2.5 Iout (A) 0.06 0.05 0.04 0.03 2.25 2 1.75 1.5 1.25 1 0.02 Input Output 0.75 0.01 0.5 0 -55 -40 -25 -10 0.25 5 20 35 50 65 Temperature (qC) 80 0 95 110 125 10 15 20 25 30 Time (PS) 35 40 45 50 D004 Figure 4. Voltage Follower Large Signal Response (50 pF) 90 20 80 17.5 70 Output Swing (Vpp) Common-Mode Rejection Ratio (dB) Figure 3. Source Current Limiting 60 50 40 30 15 12.5 10 7.5 5 20 2.5 10 0 100 200 500 1000 10000 Frequency (Hz) 100000 Figure 5. Common-Mode Rejection Ratio 8 5 D003 Submit Documentation Feedback 1000000 D006 0 1000 2000 5000 10000 100000 Frequency (Hz) 1000000 D007 Figure 6. Maximum Output Swing vs. Frequency (VCC = 15 V) Copyright © 1975–2015, Texas Instruments Incorporated Product Folder Links: LM224K LM224KA LM324 LM324A LM324K LM324KA LM2902 LM124 LM124A LM224 LM224A LM2902V LM2902K LM2902KV LM2902KAV LM224K, LM224KA, LM324, LM324A, LM324K, LM324KA, LM2902 LM124, LM124A, LM224, LM224A, LM2902V, LM2902K, LM2902KV, LM2902KAV www.ti.com SLOS066W – SEPTEMBER 1975 – REVISED MARCH 2015 7 Parameter Measurement Information 900 Ω VCC+ VCC+ − VI VO + 100 Ω − VI = 0 V RS VCC− CL RL VO + VCC− Figure 7. Unity-Gain Amplifier Copyright © 1975–2015, Texas Instruments Incorporated Figure 8. Noise-Test Circuit Submit Documentation Feedback Product Folder Links: LM224K LM224KA LM324 LM324A LM324K LM324KA LM2902 LM124 LM124A LM224 LM224A LM2902V LM2902K LM2902KV LM2902KAV 9 LM224K, LM224KA, LM324, LM324A, LM324K, LM324KA, LM2902 LM124, LM124A, LM224, LM224A, LM2902V, LM2902K, LM2902KV, LM2902KAV SLOS066W – SEPTEMBER 1975 – REVISED MARCH 2015 www.ti.com 8 Detailed Description 8.1 Overview These devices consist of four independent high-gain frequency-compensated operational amplifiers that are designed specifically to operate from a single supply over a wide range of voltages. Operation from split supplies also is possible if the difference between the two supplies is 3 V to 32 V (3 V to 26 V for the LM2902 device), and VCC is at least 1.5 V more positive than the input common-mode voltage. The low supply-current drain is independent of the magnitude of the supply voltage. Applications include transducer amplifiers, DC amplification blocks, and all the conventional operational-amplifier circuits that now can be more easily implemented in single-supply-voltage systems. For example, the LM124 device can be operated directly from the standard 5-V supply that is used in digital systems and provides the required interface electronics, without requiring additional ±15-V supplies. 8.2 Functional Block Diagram VCC ≈6-µA Current Regulator ≈6-µA Current Regulator ≈100-µA Current Regulator OUT IN− † ≈50-µA Current Regulator IN+ † GND To Other Amplifiers COMPONENT COUNT (total device) Epi-FET Transistors Diodes Resistors Capacitors † 10 1 95 4 11 4 ESD protection cells - available on LM324K and LM324KA only Submit Documentation Feedback Copyright © 1975–2015, Texas Instruments Incorporated Product Folder Links: LM224K LM224KA LM324 LM324A LM324K LM324KA LM2902 LM124 LM124A LM224 LM224A LM2902V LM2902K LM2902KV LM2902KAV LM224K, LM224KA, LM324, LM324A, LM324K, LM324KA, LM2902 LM124, LM124A, LM224, LM224A, LM2902V, LM2902K, LM2902KV, LM2902KAV www.ti.com SLOS066W – SEPTEMBER 1975 – REVISED MARCH 2015 8.3 Feature Description 8.3.1 Unity-Gain Bandwidth Gain bandwidth product is found by multiplying the measured bandwidth of an amplifier by the gain at which that bandwidth was measured. These devices have a high gain bandwidth of 1.2 MHz. 8.3.2 Slew Rate The slew rate is the rate at which an operational amplifier can change its output when there is a change on the input. These devices have a 0.5-V/μs slew rate. 8.3.3 Input Common Mode Range The valid common mode range is from device ground to VCC – 1.5 V (VCC – 2 V across temperature). Inputs may exceed VCC up to the maximum VCC without device damage. At least one input must be in the valid input common mode range for output to be correct phase. If both inputs exceed valid range then output phase is undefined. If either input is less than –0.3 V then input current should be limited to 1 mA and output phase is undefined. 8.4 Device Functional Modes These devices are powered on when the supply is connected. This device can be operated as a single supply operational amplifier or dual supply amplifier depending on the application. Copyright © 1975–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM224K LM224KA LM324 LM324A LM324K LM324KA LM2902 LM124 LM124A LM224 LM224A LM2902V LM2902K LM2902KV LM2902KAV 11 LM224K, LM224KA, LM324, LM324A, LM324K, LM324KA, LM2902 LM124, LM124A, LM224, LM224A, LM2902V, LM2902K, LM2902KV, LM2902KAV SLOS066W – SEPTEMBER 1975 – REVISED MARCH 2015 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The LMx24 and LM2902 operational amplifiers are useful in a wide range of signal conditioning applications. Inputs can be powered before VCC for flexibility in multiple supply circuits. 9.2 Typical Application A typical application for an operational amplifier in an inverting amplifier. This amplifier takes a positive voltage on the input, and makes it a negative voltage of the same magnitude. In the same manner, it also makes negative voltages positive. RF RI Vsup+ VOUT VIN + Vsup- Figure 9. Application Schematic 9.2.1 Design Requirements The supply voltage must be chosen such that it is larger than the input voltage range and output range. For instance, this application will scale a signal of ±0.5 V to ±1.8 V. Setting the supply at ±12 V is sufficient to accommodate this application. 9.2.2 Detailed Design Procedure Determine the gain required by the inverting amplifier using Equation 1 and Equation 2: (1) (2) Once the desired gain is determined, choose a value for RI or RF. Choosing a value in the kilohm range is desirable because the amplifier circuit will use currents in the milliamp range. This ensures the part will not draw too much current. This example will choose 10 kΩ for RI which means 36 kΩ will be used for RF. This was determined by Equation 3. (3) 12 Submit Documentation Feedback Copyright © 1975–2015, Texas Instruments Incorporated Product Folder Links: LM224K LM224KA LM324 LM324A LM324K LM324KA LM2902 LM124 LM124A LM224 LM224A LM2902V LM2902K LM2902KV LM2902KAV LM224K, LM224KA, LM324, LM324A, LM324K, LM324KA, LM2902 LM124, LM124A, LM224, LM224A, LM2902V, LM2902K, LM2902KV, LM2902KAV www.ti.com SLOS066W – SEPTEMBER 1975 – REVISED MARCH 2015 Typical Application (continued) 9.2.3 Application Curve 2 VIN 1.5 VOUT 1 Volts 0.5 0 -0.5 -1 -1.5 -2 0 0.5 1 Time (ms) 1.5 2 Figure 10. Input and Output Voltages of the Inverting Amplifier 10 Power Supply Recommendations CAUTION Supply voltages larger than 32 V for a single supply, or outside the range of ±16 V for a dual supply can permanently damage the device (see the Absolute Maximum Ratings). Place 0.1-μF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high impedance power supplies. For more detailed information on bypass capacitor placement, refer to the Layout. 11 Layout 11.1 Layout Guidelines For best operational performance of the device, use good PCB layout practices, including: • Noise can propagate into analog circuitry through the power pins of the circuit as a whole, as well as the operational amplifier. Bypass capacitors are used to reduce the coupled noise by providing low impedance power sources local to the analog circuitry. – Connect low-ESR, 0.1-μF ceramic bypass capacitors between each supply pin and ground, placed as close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single supply applications. • Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes. A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital and analog grounds, paying attention to the flow of the ground current. • To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If it is not possible to keep them separate, it is much better to cross the sensitive trace perpendicular as opposed to in parallel with the noisy trace. • Place the external components as close to the device as possible. Keeping RF and RG close to the inverting input minimizes parasitic capacitance, as shown in Layout Examples. • Keep the length of input traces as short as possible. Always remember that the input traces are the most sensitive part of the circuit. • Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce leakage currents from nearby traces that are at different potentials. Copyright © 1975–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM224K LM224KA LM324 LM324A LM324K LM324KA LM2902 LM124 LM124A LM224 LM224A LM2902V LM2902K LM2902KV LM2902KAV 13 LM224K, LM224KA, LM324, LM324A, LM324K, LM324KA, LM2902 LM124, LM124A, LM224, LM224A, LM2902V, LM2902K, LM2902KV, LM2902KAV SLOS066W – SEPTEMBER 1975 – REVISED MARCH 2015 www.ti.com 11.2 Layout Examples Place components close to device and to each other to reduce parasitic errors Run the input traces as far away from the supply lines as possible RF NC NC IN1í VCC+ IN1+ OUT VCCí NC VS+ Use low-ESR, ceramic bypass capacitor RG GND VIN RIN GND Only needed for dual-supply operation GND VS(or GND for single supply) VOUT Ground (GND) plane on another layer Figure 11. Operational Amplifier Board Layout for Noninverting Configuration VIN RIN RG + VOUT RF Figure 12. Operational Amplifier Schematic for Noninverting Configuration 14 Submit Documentation Feedback Copyright © 1975–2015, Texas Instruments Incorporated Product Folder Links: LM224K LM224KA LM324 LM324A LM324K LM324KA LM2902 LM124 LM124A LM224 LM224A LM2902V LM2902K LM2902KV LM2902KAV LM224K, LM224KA, LM324, LM324A, LM324K, LM324KA, LM2902 LM124, LM124A, LM224, LM224A, LM2902V, LM2902K, LM2902KV, LM2902KAV www.ti.com SLOS066W – SEPTEMBER 1975 – REVISED MARCH 2015 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation For related documentation, see the following: • Circuit Board Layout Techniques, SLOA089 12.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 1. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY LM124 Click here Click here Click here Click here Click here LM124A Click here Click here Click here Click here Click here LM224 Click here Click here Click here Click here Click here LM224A Click here Click here Click here Click here Click here LM324 Click here Click here Click here Click here Click here LM324A Click here Click here Click here Click here Click here LM2902 Click here Click here Click here Click here Click here LM2902V Click here Click here Click here Click here Click here LM224K Click here Click here Click here Click here Click here LM224KA Click here Click here Click here Click here Click here LM324K Click here Click here Click here Click here Click here LM324KA Click here Click here Click here Click here Click here LM2902K Click here Click here Click here Click here Click here LM2902KV Click here Click here Click here Click here Click here LM2902KAV Click here Click here Click here Click here Click here 12.3 Trademarks All trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser based versions of this data sheet, refer to the left hand navigation. Copyright © 1975–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM224K LM224KA LM324 LM324A LM324K LM324KA LM2902 LM124 LM124A LM224 LM224A LM2902V LM2902K LM2902KV LM2902KAV 15 PACKAGE OPTION ADDENDUM www.ti.com 4-Dec-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) 5962-7704301VCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-7704301VC A LM124JQMLV 5962-9950403V9B ACTIVE XCEPT KGD 0 100 TBD Call TI N / A for Pkg Type -55 to 125 5962-9950403VCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9950403VC A LM124AJQMLV 77043012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 77043012A LM124FKB 7704301CA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 7704301CA LM124JB 7704301DA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 7704301DA LM124WB 77043022A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 77043022A LM124AFKB 7704302CA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 7704302CA LM124AJB 7704302DA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 7704302DA LM124AWB JM38510/11005BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510 /11005BCA LM124ADR OBSOLETE SOIC D 14 TBD Call TI Call TI -55 to 125 LM124AFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 77043022A LM124AFKB LM124AJ ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 LM124AJ LM124AJB ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 7704302CA LM124AJB LM124AWB ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 7704302DA LM124AWB LM124D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 LM124 LM124DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 LM124 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 4-Dec-2014 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM124DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 LM124 LM124DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 LM124 LM124FKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 77043012A LM124FKB LM124J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 LM124J LM124JB ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 7704301CA LM124JB LM124N OBSOLETE PDIP N 14 TBD Call TI Call TI -55 to 125 LM124W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 LM124W LM124WB ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 7704301DA LM124WB LM224AD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM224A LM224ADG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM224A LM224ADR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -25 to 85 LM224A LM224ADRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM224A LM224ADRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM224A LM224AN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -25 to 85 LM224AN LM224ANE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -25 to 85 LM224AN LM224D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM224 LM224DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM224 LM224DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -25 to 85 LM224 LM224DRG3 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -25 to 85 LM224 Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 4-Dec-2014 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM224DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM224 LM224KAD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM224KA LM224KADG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM224KA LM224KADR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM224KA LM224KADRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM224KA LM224KAN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -25 to 85 LM224KAN LM224KANE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -25 to 85 LM224KAN LM224KDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM224K LM224KDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM224K LM224KN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -25 to 85 LM224KN LM224KNE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -25 to 85 LM224KN LM224N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -25 to 85 LM224N LM224NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -25 to 85 LM224N LM2902D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2902 LM2902DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2902 LM2902DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 LM2902 LM2902DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2902 LM2902DRG3 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM2902 Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 4-Dec-2014 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM2902DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2902 LM2902KAVQDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2902KA LM2902KAVQDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2902KA LM2902KAVQPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2902KA LM2902KAVQPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2902KA LM2902KD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2902K LM2902KDB ACTIVE SSOP DB 14 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2902K LM2902KDBE4 ACTIVE SSOP DB 14 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2902K LM2902KDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2902K LM2902KDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2902K LM2902KN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 LM2902KN LM2902KNE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 LM2902KN LM2902KNSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2902K LM2902KNSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2902K LM2902KPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2902K LM2902KPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2902K LM2902KPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2902K LM2902KPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2902K Addendum-Page 4 Samples PACKAGE OPTION ADDENDUM www.ti.com 4-Dec-2014 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM2902KVQDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2902KV LM2902KVQDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2902KV LM2902KVQPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2902KV LM2902KVQPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2902KV LM2902N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU | CU SN N / A for Pkg Type -40 to 125 LM2902N LM2902NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 LM2902N LM2902NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2902 LM2902PW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2902 LM2902PWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI -40 to 125 LM2902PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 L2902 LM2902PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2902 LM2902PWRG3 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L2902 LM2902PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2902 LM2902QN OBSOLETE PDIP N 14 TBD Call TI Call TI -40 to 125 LM324AD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM324A LM324ADBLE OBSOLETE SSOP DB 14 TBD Call TI Call TI LM324ADBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM324A LM324ADBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM324A LM324ADE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM324A Addendum-Page 5 Samples PACKAGE OPTION ADDENDUM www.ti.com 4-Dec-2014 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM324ADR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM 0 to 70 LM324A LM324ADRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM324A LM324ADRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM324A LM324AN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 LM324AN LM324ANE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 LM324AN LM324ANSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM324A LM324ANSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM324A LM324APW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L324A LM324APWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L324A LM324APWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L324A LM324APWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI LM324APWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM 0 to 70 L324A LM324APWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L324A LM324APWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L324A LM324D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM324 LM324DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM324 LM324DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM324 LM324DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM 0 to 70 LM324 Addendum-Page 6 Samples PACKAGE OPTION ADDENDUM www.ti.com 4-Dec-2014 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM324DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM324 LM324DRG3 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM324 LM324DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM324 LM324KAD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM324KA LM324KADR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM324KA LM324KADRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM324KA LM324KAN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 LM324KAN LM324KANSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM324KA LM324KAPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L324KA LM324KAPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L324KA LM324KAPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L324KA LM324KD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM324K LM324KDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM324K LM324KN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 LM324KN LM324KNSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM324K LM324KPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L324K LM324KPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L324K LM324KPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L324K Addendum-Page 7 Samples PACKAGE OPTION ADDENDUM www.ti.com 4-Dec-2014 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM324N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU | CU SN N / A for Pkg Type 0 to 70 LM324N LM324NE3 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 70 LM324N LM324NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 LM324N LM324NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM324 LM324NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM324 LM324NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM324 LM324PW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L324 LM324PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L324 LM324PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L324 LM324PWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI 0 to 70 LM324PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM 0 to 70 L324 LM324PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L324 LM324PWRG3 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 L324 LM324PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L324 LM324Y OBSOLETE DIESALE Y 0 TBD Call TI Call TI M38510/11005BCA ACTIVE CDIP J 14 TBD A42 N / A for Pkg Type 1 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 8 -55 to 125 JM38510 /11005BCA Samples PACKAGE OPTION ADDENDUM www.ti.com 4-Dec-2014 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM124, LM124-SP, LM124M, LM2902 : • Catalog: LM124, LM124 • Automotive: LM2902-Q1 • Enhanced Product: LM2902-EP • Military: LM124M, LM124M • Space: LM124-SP, LM124-SP Addendum-Page 9 PACKAGE OPTION ADDENDUM www.ti.com 4-Dec-2014 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects • Enhanced Product - Supports Defense, Aerospace and Medical Applications • Military - QML certified for Military and Defense Applications • Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 10 PACKAGE MATERIALS INFORMATION www.ti.com 20-Aug-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM124DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 LM224ADR SOIC D 14 2500 330.0 16.8 6.5 9.5 2.3 8.0 16.0 Q1 LM224ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 LM224ADRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 LM224ADRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 LM224DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 LM224DR SOIC D 14 2500 330.0 16.8 6.5 9.5 2.3 8.0 16.0 Q1 LM224DRG3 SOIC D 14 2500 330.0 16.8 6.5 9.5 2.3 8.0 16.0 Q1 LM224KADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 LM224KDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 LM2902DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 LM2902DR SOIC D 14 2500 330.0 16.8 6.5 9.5 2.3 8.0 16.0 Q1 LM2902DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 LM2902DRG3 SOIC D 14 2500 330.0 16.8 6.5 9.5 2.3 8.0 16.0 Q1 LM2902DRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 LM2902KAVQPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LM2902KAVQPWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LM2902KDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 20-Aug-2015 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM2902KNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 LM2902KPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LM2902KVQPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LM2902KVQPWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LM2902NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 LM2902PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LM2902PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LM2902PWRG3 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LM2902PWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LM324ADBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 LM324ADR SOIC D 14 2500 330.0 16.8 6.5 9.5 2.3 8.0 16.0 Q1 LM324ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 LM324ADRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 LM324ANSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 LM324APWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LM324APWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LM324APWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LM324DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 LM324DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 LM324DR SOIC D 14 2500 330.0 16.8 6.5 9.5 2.3 8.0 16.0 Q1 LM324DRG3 SOIC D 14 2500 330.0 16.8 6.5 9.5 2.3 8.0 16.0 Q1 LM324DRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 LM324KADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 LM324KANSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 LM324KAPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LM324KDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 LM324KNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 LM324KPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LM324PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LM324PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LM324PWRG3 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LM324PWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 20-Aug-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM124DR SOIC D 14 2500 367.0 367.0 38.0 LM224ADR SOIC D 14 2500 364.0 364.0 27.0 LM224ADR SOIC D 14 2500 333.2 345.9 28.6 LM224ADRG4 SOIC D 14 2500 367.0 367.0 38.0 LM224ADRG4 SOIC D 14 2500 333.2 345.9 28.6 LM224DR SOIC D 14 2500 367.0 367.0 38.0 LM224DR SOIC D 14 2500 364.0 364.0 27.0 LM224DRG3 SOIC D 14 2500 364.0 364.0 27.0 LM224KADR SOIC D 14 2500 367.0 367.0 38.0 LM224KDR SOIC D 14 2500 367.0 367.0 38.0 LM2902DR SOIC D 14 2500 367.0 367.0 38.0 LM2902DR SOIC D 14 2500 364.0 364.0 27.0 LM2902DR SOIC D 14 2500 333.2 345.9 28.6 LM2902DRG3 SOIC D 14 2500 364.0 364.0 27.0 LM2902DRG4 SOIC D 14 2500 333.2 345.9 28.6 LM2902KAVQPWR TSSOP PW 14 2000 367.0 367.0 35.0 LM2902KAVQPWRG4 TSSOP PW 14 2000 367.0 367.0 35.0 LM2902KDR SOIC D 14 2500 367.0 367.0 38.0 LM2902KNSR SO NS 14 2000 367.0 367.0 38.0 LM2902KPWR TSSOP PW 14 2000 367.0 367.0 35.0 Pack Materials-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 20-Aug-2015 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2902KVQPWR TSSOP PW 14 2000 367.0 367.0 35.0 LM2902KVQPWRG4 TSSOP PW 14 2000 367.0 367.0 35.0 LM2902NSR SO NS 14 2000 367.0 367.0 38.0 LM2902PWR TSSOP PW 14 2000 364.0 364.0 27.0 LM2902PWR TSSOP PW 14 2000 367.0 367.0 35.0 LM2902PWRG3 TSSOP PW 14 2000 364.0 364.0 27.0 LM2902PWRG4 TSSOP PW 14 2000 367.0 367.0 35.0 LM324ADBR SSOP DB 14 2000 367.0 367.0 38.0 LM324ADR SOIC D 14 2500 364.0 364.0 27.0 LM324ADR SOIC D 14 2500 367.0 367.0 38.0 LM324ADRG4 SOIC D 14 2500 367.0 367.0 38.0 LM324ANSR SO NS 14 2000 367.0 367.0 38.0 LM324APWR TSSOP PW 14 2000 364.0 364.0 27.0 LM324APWR TSSOP PW 14 2000 367.0 367.0 35.0 LM324APWRG4 TSSOP PW 14 2000 367.0 367.0 35.0 LM324DR SOIC D 14 2500 367.0 367.0 38.0 LM324DR SOIC D 14 2500 333.2 345.9 28.6 LM324DR SOIC D 14 2500 364.0 364.0 27.0 LM324DRG3 SOIC D 14 2500 364.0 364.0 27.0 LM324DRG4 SOIC D 14 2500 333.2 345.9 28.6 LM324KADR SOIC D 14 2500 367.0 367.0 38.0 LM324KANSR SO NS 14 2000 367.0 367.0 38.0 LM324KAPWR TSSOP PW 14 2000 367.0 367.0 35.0 LM324KDR SOIC D 14 2500 367.0 367.0 38.0 LM324KNSR SO NS 14 2000 367.0 367.0 38.0 LM324KPWR TSSOP PW 14 2000 367.0 367.0 35.0 LM324PWR TSSOP PW 14 2000 364.0 364.0 27.0 LM324PWR TSSOP PW 14 2000 367.0 367.0 35.0 LM324PWRG3 TSSOP PW 14 2000 364.0 364.0 27.0 LM324PWRG4 TSSOP PW 14 2000 367.0 367.0 35.0 Pack Materials-Page 4 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated