TCA0372, TCA0372B 1.0 A Output Current, Dual Power Operational Amplifiers The TCA0372 is a monolithic circuit intended for use as a power operational amplifier in a wide range of applications, including servo amplifiers and power supplies. No deadband crossover distortion provides better performance for driving coils. http://onsemi.com PDIP−8 DP1 SUFFIX CASE 626 Features • • • • • • • • • Output Current to 1.0 A Slew Rate of 1.3 V/ms Wide Bandwidth of 1.1 MHz Internal Thermal Shutdown Single or Split Supply Operation Excellent Gain and Phase Margins Common Mode Input Includes Ground Zero Deadband Crossover Distortion Pb−Free Packages are Available* 8 1 PDIP−16 DP2 SUFFIX CASE 648 16 1 SOIC−16W DW SUFFIX CASE 751G 16 1 SOEIAJ−16 DM2 SUFFIX CASE 966 16 1 ORDERING INFORMATION VCC Current Bias Monitoring See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. DEVICE MARKING INFORMATION See general marking information in the device marking section on page 6 of this data sheet. Inv. Input Output *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Noninv. Input Thermal Protection VEE Figure 1. Representative Block Diagram © Semiconductor Components Industries, LLC, 2005 July, 2005 − Rev. 9 1 Publication Order Number: TCA0372/D TCA0372, TCA0372B MAXIMUM RATINGS Rating Symbol Value Unit VS 40 V Input Differential Voltage Range VIDR Note 1 V Input Voltage Range VIR Note 1 V Supply Voltage (from VCC to VEE) Junction Temperature (Note 2) TJ +150 °C Operating Temperature Range TA −40 to +125 °C Storage Temperature Range Tstg −55 to +150 °C IO 1.0 A Peak Output Current (Nonrepetitive) I(max) 1.5 Thermal Resistance, Junction−to−Air Case 626 Case 648 Case 751G RqJA Thermal Resistance, Junction−to−Case Case 626 Case 648 Case 751G RqJC DC Output Current A °C/W 137 72 80 °C/W 23 10 12 Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Either or both input voltages should not exceed the magnitude of VCC or VEE. 2. Power dissipation must be considered to ensure maximum junction temperature (TJ) is not exceeded. http://onsemi.com 2 TCA0372, TCA0372B DC ELECTRICAL CHARACTERISTICS (VCC = +15 V, VEE = −15 V, RL connected to ground, TA = −40° to +125°C.) Characteristics Symbol Min Typ Max − − 1.0 − 15 20 DVIO/DT − 20 − mV/°C Input Bias Current (VCM = 0) IIB − 100 500 nA Input Offset Current (VCM = 0) IIO − 10 50 nA Large Signal Voltage Gain VO = ±10 V, RL = 2.0 k AVOL 30 100 − V/mV Output Voltage Swing (IL = 100 mA) TA = +25°C TA = Tlow to Thigh TA = +25°C TA = Tlow to Thigh VOH 14.0 13.9 − − 14.2 − −14.2 − − − −14.0 −13.9 Output Voltage Swing (IL = 1.0 A) VCC = +24 V, VEE = 0 V, TA = +25°C VCC = +24 V, VEE = 0 V, TA = Tlow to Thigh VCC = +24 V, VEE = 0 V, TA = +25°C VCC = +24 V, VEE = 0 V, TA = Tlow to Thigh VOH 22.5 22.5 − − 22.7 − 1.3 − − − 1.5 1.5 Input Common Mode Voltage Range TA = +25°C TA = Tlow to Thigh VICR Input Offset Voltage (VCM = 0) TA = +25°C TA, Tlow to Thigh VIO Average Temperature Coefficient of Offset Voltage VOL VOL Unit mV V V V VEE to (VCC −1.0) VEE to (VCC −1.3) Common Mode Rejection Ratio (RS = 10 k) CMRR 70 90 − dB Power Supply Rejection Ratio (RS = 100 W) PSRR 70 90 − dB − − − − 5.0 8.0 − − 10 10 14 14 Power Supply Current TA = +25°C TA = Tlow to Thigh ID TCA0372 TCA0372B TCA0372 TCA0372B mA AC ELECTRICAL CHARACTERISTICS (VCC = +15 V, VEE = −15 V, RL connected to ground, TA = +25°C, unless otherwise noted.) Characteristics Slew Rate (Vin = −10 V to +10 V, RL = 2.0 k, CL = 100 pF) AV = −1.0, TA = Tlow to Thigh Gain Bandwidth Product (f = 100 kHz, CL = 100 pF, RL = 2.0 k) TA = 25°C TA = Tlow to Thigh Symbol Min Typ Max Unit SR 1.0 1.4 − V/ms 0.9 0.7 1.4 − − − GBW MHz Phase Margin TJ = Tlow to Thigh RL = 2.0 k, CL = 100 pF fm − 65 − Degrees Gain Margin RL = 2.0 k, CL = 100 pF Am − 15 − dB Equivalent Input Noise Voltage RS = 100 W, f = 1.0 to 100 kHz en − 22 − nV/ √ Hz THD − 0.02 − % Total Harmonic Distortion AV = −1.0, RL = 50 W, VO = 0.5 VRMS, f = 1.0 kHz NOTE: In case VEE is disconnected before VCC, a diode between VEE and Ground is recommended to avoid damaging the device. http://onsemi.com 3 Vsat , OUTPUT SATURATION VOLTAGE (V) TCA0372, TCA0372B 5.5 4.5 3.5 0 2.0 4.0 6.0 8.0 10 12 14 16 18 VCC−1.0 VCC−2.0 VCC+2.0 VCC+1.0 VEE 0 20 0.5 1.0 IL, LOAD CURRENT (A) Figure 2. Supply Current versus Supply Voltage with No Load Figure 3. Output Saturation Voltage versus Load Current 80 VCC = +15 V VEE = −15 V RL = 2.0 kW 60 70 90 40 100 20 110 120 10 100 130 10000 1000 VCC = +15 V VEE = −15 V RL = 2.0 kW AV = −100 60 50 40 30 20 0 0.4 0.8 1.2 1.6 f, FREQUENCY (kHz) CL, OUTPUT LOAD CAPACITANCE (nF) Figure 4. Voltage Gain and Phase versus Frequency Figure 5. Phase Margin versus Output Load Capacitance VCC = +15 V VEE = −15 V AV = +1.0 RL = 2.0 kW VO,OUTPUT VOLTAGE (5.0 V/DIV) VCC = +15 V VEE = −15 V AV = +1.0 RL = 2.0 kW VO,OUTPUT VOLTAGE (50 mV/DIV) GAIN (dB) VCC = 24 V VEE = 0 V VCC, |VEE|, SUPPLY VOLTAGE (V) 80 −20 1.0 VCC φ m , PHASE MARGIN (DEGREES) 2.5 PHASE (DEGREES) ICC, SUPPLY CURRENT (mA) 6.5 t, TIME (1.0 ms/DIV) t, TIME (10 ms/DIV) Figure 6. Small Signal Transient Response Figure 7. Large Signal Transient Response http://onsemi.com 4 2.0 TCA0372, TCA0372B 5.0 V/DIV VCC = +15 V VEE = −15 V AV = +100 RL = 50 W 200 mV/DIV VCC E1 + + VS/2 − − VS = Logic Supply Voltage Must Have VCC > VS E1, E2 = Logic Inputs t, TIME (100 ms/DIV) Figure 8. Sine Wave Response Figure 9. Bidirectional DC Motor Control with Microprocessor−Compatible Inputs VS 0.1 mF Rx Vin R1 E2 0.1 mF + 10 k − R3 + 5.0 W − R6 10 k R2 R5 10 k 10 k R7 10 k R8 10 k 2R3 @ R1 For circuit stability, ensure that Rx >where, RM = internal resistance of motor. RM VS The voltage available at the terminals of the motor is: VM + 2(V1– ) ) |Ro| @ IM 2 2R3 @ R1 where, |Ro| =and IM is the motor current. Rx Figure 10. Bidirectional Speed Control of DC Motors http://onsemi.com 5 TCA0372, TCA0372B ORDERING INFORMATION Package Shipping † TCA0372DW SOIC−16W 47 Units / Rail TCA0372DWG SOIC−16W (Pb−Free) 47 Units / Rail TCA0372DWR2 SOIC−16W 1000 Tape & Reel TCA0372DWR2G SOIC−16W (Pb−Free) 1000 Tape & Reel TCA0372BDWR2 SOIC−16W 1000 Tape & Reel TCA0372BDWR2G SOIC−16W (Pb−Free) 1000 Tape & Reel PDIP−8 50 Units / Rail TCA0372DP1G PDIP−8 (Pb−Free) 50 Units / Rail TCA0372BDP1 Device TCA0372DP1 PDIP−8 50 Units / Rail TCA0372BDP1G PDIP−8 (Pb−Free) 50 Units / Rail TCA0372DP2 PDIP−16 25 Units / Rail TCA0372DP2G PDIP−16 (Pb−Free) 25 Units / Rail TCA0372DM2EL SOEIAJ−16 2500 Tape & Reel TCA0372DM2ELG SOEIAJ−16 (Pb−Free) 2500 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MARKING DIAGRAMS PDIP−8 DP1 SUFFIX CASE 626 8 PDIP−16 DP2 SUFFIX CASE 648 8 0372DP1 AWL YYWW 16 0372BDP1 AWL YYWW 1 TCA0372DP2 AWLYYWW 1 1 SOIC−16W DW SUFFIX CASE 751G 16 16 TCA0372DW AWLYYWW 1 SOEIAJ−16 DM2 SUFFIX CASE 966 16 TCA0372 ALYW TCA0372BDW AWLYYWW 1 1 A WL, L YY, Y WW, W = Assembly Location = Wafer Lot = Year = Work Week http://onsemi.com 6 TCA0372, TCA0372B PIN CONNECTIONS CASE 648 CASE 626 16 GND Output A 1 15 GND VCC 2 Output A 1 VCC 2 CASE 751G − 8 + 7 Output B 3 14 GND Output B 3 + 6 VEE/GND 4 13 GND VEE/GND 4 − 5 − + 12 GND 5 Inputs B 6 7 Inputs A + − Inputs A Inputs B NC 3 14 NC 4 13 5 12 11 GND NC 6 10 GND 7 10 8 9 Inputs B 9 GND 8 15 NC VEE/GND (Top View) 16 Output A VCC 1 Output B 2 − + + − (Top View) (Top View) *Pins 4 and 9 to 16 are internally connected. CASE 966 16 VEE/GND VEE/GND 1 15 NC NC 2 Output A 3 − 14 VCC 4 + 13 Output B 5 + 12 NC 6 − 11 Inputs A Inputs B 10 NC NC 7 9 VEE/GND VEE/GND 8 (Top View) http://onsemi.com 7 VEE/GND 11 NC Inputs A TCA0372, TCA0372B PACKAGE DIMENSIONS PDIP−8 DP1 SUFFIX CASE 626−05 ISSUE L 8 NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5 −B− 1 4 DIM A B C D F G H J K L M N F −A− NOTE 2 L C J −T− MILLIMETERS MIN MAX 9.40 10.16 6.10 6.60 3.94 4.45 0.38 0.51 1.02 1.78 2.54 BSC 0.76 1.27 0.20 0.30 2.92 3.43 7.62 BSC −−− 10 _ 0.76 1.01 INCHES MIN MAX 0.370 0.400 0.240 0.260 0.155 0.175 0.015 0.020 0.040 0.070 0.100 BSC 0.030 0.050 0.008 0.012 0.115 0.135 0.300 BSC −−− 10_ 0.030 0.040 N SEATING PLANE D M K G H 0.13 (0.005) T A M M B M PDIP−16 DP2 SUFFIX CASE 648−08 ISSUE T NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. −A− 16 9 1 8 B F C L S −T− SEATING PLANE K H D M J G 16 PL 0.25 (0.010) M T A M http://onsemi.com 8 DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 TCA0372, TCA0372B PACKAGE DIMENSIONS SOIC−16W DW SUFFIX CASE 751G−03 ISSUE B A D 9 1 8 16X M 14X e T A S B h X 45 _ S MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 10.15 10.45 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_ L A 0.25 DIM A A1 B C D E e H h L q B B SEATING PLANE A1 H E 0.25 8X M B M 16 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INLCUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. q C T SOEIAJ−16 DM2 SUFFIX CASE 966−01 ISSUE O 16 LE 9 Q1 M_ E HE 1 8 L DETAIL P Z D e VIEW P A DIM A A1 b c D E e HE L LE M Q1 Z A1 b 0.13 (0.005) c M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). 0.10 (0.004) http://onsemi.com 9 MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 −−− 0.78 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 −−− 0.031 TCA0372, TCA0372B ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Phone: 81−3−5773−3850 Email: [email protected] http://onsemi.com 10 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. TCA0372/D