BFN24, BFN26 NPN Silicon High-Voltage Transistors • Suitable for video output stages in TV sets 2 3 and switching power supplies 1 • High breakdown voltage • Low collector-emitter saturation voltage • Complementary type: BFN27 (PNP) • Pb-free (RoHS compliant) package 1) • Qualified according AEC Q101 Type Marking Pin Configuration Package BFN24 FHs 1=B 2=E 3=C SOT23 BFN26 FJs 1=B 2=E 3=C SOT23 Maximum Ratings Parameter Symbol Collector-emitter voltage VCEO Value V BFN24 250 BFN26 300 Collector-base voltage Unit VCBO BFN24 250 BFN26 300 6 Emitter-base voltage VEBO Collector current IC 200 Peak collector current ICM 500 Base current IB 100 Peak base current IBM 200 Total power dissipation- Ptot 360 mW Junction temperature Tj 150 °C Storage temperature Tstg mA TS ≤ 74 °C 1Pb-containing -65 ... 150 package may be available upon special request 1 2007-04-20 BFN24, BFN26 Thermal Resistance Parameter Junction - soldering point 1) Symbol RthJS Value ≤ 210 Unit K/W Electrical Characteristics at TA = 25°C, unless otherwise specified Symbol Values Unit Parameter min. typ. max. DC Characteristics Collector-emitter breakdown voltage V(BR)CEO V IC = 1 mA, IB = 0 , BFN24 250 - - IC = 1 mA, IB = 0 , BFN26 300 - - 250 - - 300 - - 6 - - Collector-base breakdown voltage V(BR)CBO IC = 100 µA, IE = 0 , BFN24 IC = 100 µA, IE = 0 , BFN26 Emitter-base breakdown voltage V(BR)EBO IE = 100 µA, IC = 0 Collector-base cutoff current µA I CBO VCB = 200 V, IE = 0 , BFN24 - - 0.1 VCB = 250 V, IE = 0 , BFN26 - - 0.1 VCB = 200 V, IE = 0 , T A = 150 °C, BFN24 - - 20 VCB = 250 V, IE = 0 , T A = 150 °C, BFN26 - - 20 - - 100 Emitter-base cutoff current I EBO nA VEB = 5 V, IC = 0 DC current gain2) - h FE IC = 1 mA, VCE = 10 V 25 - - IC = 10 mA, VCE = 10 V 40 - - IC = 30 mA, VCE = 10 V, BFN24 40 - - IC = 30 mA, VCE = 10 V, BFN26 30 - - Collector-emitter saturation voltage2) V VCEsat IC = 20 mA, IB = 2 mA, BFN24 - - 0.4 IC = 20 mA, IB = 2 mA, BFN26 - - 0.5 - - 0.9 Base emitter saturation voltage 2) VBEsat IC = 20 mA, IB = 2 mA 1For calculation of RthJA please refer to Application Note Thermal Resistance 2Pulse test: t < 300µs; D < 2% 2 2007-04-20 BFN24, BFN26 Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. fT - 70 - MHz Ccb - 1.5 - pF AC Characteristics Transition frequency IC = 20 mA, VCE = 10 V, f = 20 MHz Collector-base capacitance VCB = 30 V, f = 1 MHz 3 2007-04-20 BFN24, BFN26 DC current gain hFE = ƒ(IC) VCE = 10 V 10 3 Operating range I C = ƒ(VCEO) TA = 25°C, D = 0 BFN 24/26 EHP00627 10 3 EHP00624 mA 5 h FE BFN 24/26 ΙC 2 10 2 10 2 5 10 µs 100 µs 1 ms 5 100 ms 10 1 2 5 500 ms 10 1 DC 10 0 5 5 2 10 0 -1 10 5 10 0 5 10 1 5 10 2 mA 10 10 -1 10 0 3 5 10 1 5 10 2 ΙC Collector cutoff current ICBO = ƒ(TA) VCB = 200 V VCE = 10 V BFN 24/26 10 3 V CEO Collector current I C = ƒ(VBE) 10 3 V 5 EHP00625 10 4 nA mA ΙC Ι CB0 10 2 BFN 24/26 EHP00626 max 10 3 5 5 10 2 5 10 1 5 typ 10 1 5 10 0 10 0 5 5 10 -1 0 0.5 V 1.0 10 -1 1.5 V BE 0 50 ˚C 150 100 TA 4 2007-04-20 BFN24, BFN26 Transition frequency fT = ƒ(IC) VCE = parameter in V, f = 2 GHz 10 3 BFN 24/26 Collector-base capacitance Ccb = ƒ(V CB) Emitter-base capacitance Ceb = ƒ(VEB) EHP00622 90 pF MHz CCB(C EB) fT 70 60 50 10 2 40 CEB 5 30 20 10 CCB 10 1 10 0 5 10 1 5 10 2 mA 5 0 0 10 3 4 8 12 16 V 22 VCB(VEB) ΙC Total power dissipation Ptot = ƒ(TS) Permissible Pulse Load Ptotmax/P totDC = ƒ(tp) 10 3 400 BFN 24/26 Ptot max 5 Ptot DC mW EHP00623 D= tp T tp T Ptot 300 10 2 D= 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 250 5 200 150 10 1 100 5 50 0 0 15 30 45 60 75 90 105 120 10 0 10 -6 °C 150 TS 10 -5 10 -4 10 -3 10 -2 s 10 0 tp 5 2007-04-20 Package SOT23 BFN24, BFN26 0.4 +0.1 -0.05 1) 2 0.08...0.1 C 0.95 1.3 ±0.1 1 2.4 ±0.15 3 0.1 MAX. 10˚ MAX. B 1 ±0.1 10˚ MAX. 2.9 ±0.1 0.15 MIN. Package Outline A 5 0...8˚ 1.9 0.2 0.25 M B C M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 0.9 1.3 0.9 0.8 1.2 Marking Layout (Example) Manufacturer EH s 2005, June Date code (YM) Pin 1 BCW66 Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 8 2.13 2.65 0.9 Pin 1 1.15 3.15 6 2007-04-20 BFN24, BFN26 Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 7 2007-04-20