ISSI IS42S32200C1-7BI 512k bits x 32 bits x 4 banks (64-mbit) synchronous dynamic ram Datasheet

ISSI
IS42S32200C1
512K Bits x 32 Bits x 4 Banks (64-MBIT)
SYNCHRONOUS DYNAMIC RAM
FEATURES
• Clock frequency: 183, 166, 143 MHz
• Fully synchronous; all signals referenced to a
positive clock edge
• Internal bank for hiding row access/precharge
• Single 3.3V power supply
®
PRELIMINARY INFORMATION
MAY 2006
OVERVIEW
ISSI's 64Mb Synchronous DRAM IS42S32200C1 is
organized as 524,288 bits x 32-bit x 4-bank for improved
performance. The synchronous DRAMs achieve highspeed data transfer using pipeline architecture. All inputs
and outputs signals refer to the rising edge of the clock
input.
• LVTTL interface
• Programmable burst length:
(1, 2, 4, 8, full page)
• Programmable burst sequence:
Sequential/Interleave
• Self refresh modes
• 4096 refresh cycles every 64 ms
• Random column address every clock cycle
• Programmable CAS latency (2, 3 clocks)
• Burst read/write and burst read/single write
operations capability
• Burst termination by burst stop and precharge
command
KEY TIMING PARAMETERS
Parameter
-55
-6
-7
Unit
Clk Cycle Time
CAS Latency = 3
CAS Latency = 2
5.5
10
6
10
7
10
ns
ns
Clk Frequency
CAS Latency = 3
CAS Latency = 2
183
100
166
100
143
100
Mhz
Mhz
Access Time from Clock
CAS Latency = 3
CAS Latency = 2
5
7.5
5.5
7.5
5.5
8
ns
ns
• Available in Industrial temperature grade
• Available in 400-mil 86-pin TSOP II and 90-ball
BGA
• Available in Lead free
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
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ISSI
IS42S32200C1
®
GENERAL DESCRIPTION
The 64Mb SDRAM is a high speed CMOS, dynamic
random-access memory designed to operate in 3.3V
memory systems containing 67,108,864 bits. Internally
configured as a quad-bank DRAM with a synchronous
interface. Each 16,777,216-bit bank is organized as 2,048
rows by 256 columns by 32 bits.
The 64Mb SDRAM includes an AUTO REFRESH MODE,
and a power-saving, power-down mode. All signals are
registered on the positive edge of the clock signal, CLK.
All inputs and outputs are LVTTL compatible.
The 64Mb SDRAM has the ability to synchronously burst
data at a high data rate with automatic column-address
generation, the ability to interleave between internal banks
to hide precharge time and the capability to randomly
change column addresses on each clock cycle during
burst access.
A self-timed row precharge initiated at the end of the burst
sequence is available with the AUTO PRECHARGE
function enabled. Precharge one bank while accessing one
of the other three banks will hide the precharge cycles and
provide seamless, high-speed, random-access operation.
SDRAM read and write accesses are burst oriented starting
at a selected location and continuing for a programmed
number of locations in a programmed sequence. The
registration of an ACTIVE command begins accesses,
followed by a READ or WRITE command. The ACTIVE
command in conjunction with address bits registered are
used to select the bank and row to be accessed (BA0, BA1
select the bank; A0-A10 select the row). The READ or
WRITE commands in conjunction with address bits registered are used to select the starting column location for
the burst access.
Programmable READ or WRITE burst lengths consist of
1, 2, 4 and 8 locations or full page, with a burst terminate
option.
FUNCTIONAL BLOCK DIAGRAM
DQM0-3
DATA IN
BUFFER
COMMAND
DECODER
&
CLOCK
GENERATOR
32
11
DQ 0-31
SELF
VDD/VDDQ
DATA OUT
BUFFER
REFRESH
A10
CONTROLLER
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
BA0
BA1
32
REFRESH
CONTROLLER
MODE
REGISTER
GND/GNDQ
32
32
11
MULTIPLEXER
REFRESH
COUNTER
ROW
ADDRESS
LATCH
11
11
COLUMN
ADDRESS LATCH
ROW
ADDRESS
BUFFER
ROW DECODER
CLK
CKE
CS
RAS
CAS
WE
2048
2048
2048
2048
MEMORY CELL
ARRAY
BANK 0
SENSE AMP I/O GATE
256
(x 32)
BANK CONTROL LOGIC
BURST COUNTER
COLUMN
ADDRESS BUFFER
2
COLUMN DECODER
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ISSI
IS42S32200C1
®
PIN CONFIGURATIONS
86 pin TSOP - Type II for x32
VDD
1
86
VSS
DQ0
2
85
DQ15
VDDQ
3
84
VSSQ
DQ1
4
83
DQ14
DQ2
5
82
DQ13
VSSQ
6
81
VDDQ
DQ3
7
80
DQ12
DQ4
8
79
DQ11
VDDQ
9
78
VSSQ
DQ5
10
77
DQ10
DQ6
11
76
DQ9
VSSQ
12
75
VDDQ
DQ7
13
74
DQ8
NC
14
73
NC
VDD
15
72
VSS
DQM0
16
71
DQM1
WE
17
70
NC
CAS
18
69
NC
RAS
19
68
CLK
CS
20
67
CKE
NC
21
66
A9
BA0
22
65
A8
BA1
23
64
A7
A10
24
63
A6
A0
25
62
A5
A1
26
61
A4
A2
27
60
A3
DQM2
28
59
DQM3
VDD
29
58
VSS
NC
30
57
NC
DQ16
31
56
DQ31
VSSQ
32
55
VDDQ
DQ17
33
54
DQ30
DQ18
34
53
DQ29
VDDQ
35
52
VSSQ
DQ19
36
51
DQ28
DQ20
37
50
DQ27
VSSQ
38
49
VDDQ
DQ21
39
48
DQ26
DQ22
40
47
DQ25
VDDQ
41
46
VSSQ
DQ23
42
45
DQ24
VDD
43
44
VSS
PIN DESCRIPTIONS
A0-A10
Row Address Input
WE
Write Enable
A0-A7
Column Address Input
DQM0-DQM3
x32 Input/Output Mask
BA0, BA1
Bank Select Address
VDD
Power
DQ0 to DQ31
Data I/O
Vss
Ground
CLK
System Clock Input
VDDQ
Power Supply for I/O Pin
CKE
Clock Enable
VssQ
Ground for I/O Pin
CS
Chip Select
NC
No Connection
RAS
Row Address Strobe Command
CAS
Column Address Strobe Command
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ISSI
IS42S32200C1
®
PIN CONFIGURATION
PACKAGE CODE: B 90 BALL FBGA (Top View) (8.00 mm x 13.00 mm Body, 0.8 mm Ball Pitch)
1 2 3 4 5 6 7 8 9
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
DQ26 DQ24
VSS
VDD DQ23 DQ21
DQ28 VDDQ VSSQ
VDDQ VSSQ DQ19
VSSQ DQ27 DQ25
DQ22 DQ20 VDDQ
VSSQ DQ29 DQ30
DQ17 DQ18 VDDQ
VDDQ DQ31
NC
NC
DQ16 VSSQ
VSS DQM3
A3
A2
DQM2 VDD
A4
A5
A6
A10
A0
A1
A7
A8
NC
NC
BA1
NC
CLK
CKE
A9
BA0
CS
RAS
DQM1
NC
NC
CAS
WE DQM0
VSS
VDD
DQ7 VSSQ
VSSQ DQ10 DQ9
DQ6
DQ5 VDDQ
VSSQ DQ12 DQ14
DQ1
DQ3 VDDQ
VDDQ DQ8
DQ11 VDDQ VSSQ
DQ13 DQ15
VDDQ VSSQ DQ4
VSS
VDD
DQ0
DQ2
PIN DESCRIPTIONS
4
A0-A10
Row Address Input
WE
Write Enable
A0-A7
Column Address Input
DQM0-DQM3
x32 Input/Output Mask
BA0, BA1
Bank Select Address
VDD
Power
DQ0 to DQ31
Data I/O
Vss
Ground
CLK
System Clock Input
VDDQ
Power Supply for I/O Pin
CKE
Clock Enable
VssQ
Ground for I/O Pin
CS
Chip Select
NC
No Connection
RAS
Row Address Strobe Command
CAS
Column Address Strobe Command
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ISSI
IS42S32200C1
®
PIN FUNCTIONS
Symbol
Pin No. (TSOP)
Type
A0-A10
25 to 27
60 to 66
24
Input Pin
Address Inputs: A0-A10 are sampled during the ACTIVE
command (row-address A0-A10) and READ/WRITE command (A0-A7
with A10 defining auto precharge) to select one location out of the memory array
in the respective bank. A10 is sampled during a PRECHARGE command to
determine if all banks are to be precharged (A10 HIGH) or bank selected by
BA0, BA1 (LOW). The address inputs also provide the op-code during a LOAD
MODE REGISTER command.
BA0, BA1
22,23
Input Pin
Bank Select Address: BA0 and BA1 defines which bank the ACTIVE, READ,
WRITE or PRECHARGE command is being applied.
CAS
18
Input Pin
CAS, in conjunction with the RAS and WE, forms the device command. See the
"Command Truth Table" for details on device commands.
CKE
67
Input Pin
The CKE input determines whether the CLK input is enabled. The next rising edge
of the CLK signal will be valid when is CKE HIGH and invalid when LOW. When
CKE is LOW, the device will be in either power-down mode, clock suspend mode,
or self refresh mode. CKE is an asynchronous input.
CLK
68
Input Pin
CLK is the master clock input for this device. Except for CKE, all inputs to this
device are acquired in synchronization with the rising edge of this pin.
CS
20
Input Pin
The CS input determines whether command input is enabled within the device.
Command input is enabled when CS is LOW, and disabled with CS is HIGH. The
device remains in the previous state when CS is HIGH.
DQ Pin
DQ0 to DQ15 are DQ pins. DQ through these pins can be controlled in byte units
using the DQM0-DQM3 pins
16,28,59,71
Input Pin
DQMx control thel ower and upper bytes of the DQ buffers. In read mode,
the output buffers are place in a High-Z state. During a WRITE cycle the input data is
masked. When DQMx is sampled HIGH and is an input mask signal for write accesses
and an output enable signal for read accesses. DQ0 through DQ7 are controlled by
DQM0. DQ8 throughDQ15 are controlled by DQM1. DQ16 through DQ23 are
controlled by DQM2. DQ24 through DQ31 are controlled by DQM3.
RAS
19
Input Pin
RAS, in conjunction with CAS and WE, forms the device command. See the "Command
Truth Table" item for details on device commands.
WE
17
Input Pin
WE, in conjunction with RAS and CAS, forms the device command. See the "Command
Truth Table" item for details on device commands.
VDDQ
3,9,35,41,49,55,75,81
Supply Pin
VDDQ is the output buffer power supply.
VDD
1,15,29,43
Supply Pin
VDD is the device internal power supply.
GNDQ
6,12,32,38,46,52,78,84
Supply Pin
GNDQ is the output buffer ground.
GND
44,58,72,86
Supply Pin
GND is the device internal ground.
DQ0 to 2, 4, 5, 7, 8, 10,11,13
DQ31 74,76,77,79,80,82,83,85
45,47,48,50,51,53,54,56
31,33,34,36,37,39,40,42
DQM0
DQM3
Function (In Detail)
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ISSI
IS42S32200C1
®
FUNCTION (In Detail)
READ
A0-A10 are address inputs sampled during the ACTIVE
(row-address A0-A10) and READ/WRITE command (A0-A7
with A10 defining auto PRECHARGE). A10 is sampled during
a PRECHARGE command to determine if all banks are to
be PRECHARGED (A10 HIGH) or bank selected by BA0,
BA1 (LOW). The address inputs also provide the op-code
during a LOAD MODE REGISTER command.
Bank Select Address (BA0 and BA1) defines which bank the
ACTIVE, READ, WRITE or PRECHARGE command is
being applied.
CAS, in conjunction with the RAS and WE, forms the
device command. See the “Command Truth Table” for
details on device commands.
The CKE input determines whether the CLK input is
enabled. The next rising edge of the CLK signal will be
valid when is CKE HIGH and invalid when LOW. When
CKE is LOW, the device will be in either power-down
mode, CLOCK SUSPEND mode, or SELF-REFRESH
mode. CKE is an asynchronous input.
CLK is the master clock input for this device. Except for
CKE, all inputs to this device are acquired in synchronization with the rising edge of this pin.
The CS input determines whether command input is
enabled within the device. Command input is enabled
when CS is LOW, and disabled with CS is HIGH. The
device remains in the previous state when CS is HIGH. DQ0
through DQ7 are controlled by DQM0. DQ8 through DQ15
are controlled by DQM1. DQ16 through DQ23 are controlled
by DQM2. DQ24 through DQ31 are controlled by DQM3. In
read mode, DQMx control the output buffer. When DQMx is
LOW, the corresponding buffer byte is enabled, and when
HIGH, disabled. The outputs go to the HIGH Impedance
State when DQMx is HIGH. This function corresponds to
OE in conventional DRAMs. In write mode, DQMx control
the input buffer. When DQMx is LOW, the corresponding
buffer byte is enabled, and data can be written to the device.
When DQMx is HIGH, input data is masked and cannot be
written to the device.
RAS, in conjunction with CAS and WE , forms the device
command. See the “Command Truth Table” item for
details on device commands.
WE , in conjunction with RAS and CAS , forms the device
command. See the “Command Truth Table” item for
details on device commands.
VDDQ is the output buffer power supply.
The READ command selects the bank from BA0, BA1
inputs and starts a burst read access to an active row.
Inputs A0-A7 provides the starting column location. When
A10 is HIGH, this command functions as an AUTO
PRECHARGE command. When the auto precharge is
selected, the row being accessed will be precharged at
the end of the READ burst. The row will remain open for
subsequent accesses when AUTO PRECHARGE is not
selected. DQ’s read data is subject to the logic level on
the DQM inputs two clocks earlier. When a given DQM
signal was registered HIGH, the corresponding DQ’s will
be High-Z two clocks later. DQ’s will provide valid data
when the DQM signal was registered LOW.
VDD is the device internal power supply.
GNDQ is the output buffer ground.
GND is the device internal ground.
6
WRITE
A burst write access to an active row is initiated with the
WRITE command. BA0, BA1 inputs selects the bank, and
the starting column location is provided by inputs A0-A7.
Whether or not AUTO-PRECHARGE is used is determined by A10.
The row being accessed will be precharged at the end of
the WRITE burst, if AUTO PRECHARGE is selected. If
AUTO PRECHARGE is not selected, the row will remain
open for subsequent accesses.
A memory array is written with corresponding input data
on DQ’s and DQM input logic level appearing at the same
time. Data will be written to memory when DQM signal is
LOW. When DQM is HIGH, the corresponding data inputs
will be ignored, and a WRITE will not be executed to that
byte/column location.
PRECHARGE
The PRECHARGE command is used to deactivate the
open row in a particular bank or the open row in all banks.
BA0, BA1 can be used to select which bank is precharged
or they are treated as “Don’t Care”. A10 determined
whether one or all banks are precharged. After executing
this command, the next command for the selected banks(s)
is executed after passage of the period tRP, which is the
period required for bank precharging. Once a bank has
been precharged, it is in the idle state and must be
activated prior to any READ or WRITE commands being
issued to that bank.
AUTO PRECHARGE
The AUTO PRECHARGE function ensures that the
precharge is initiated at the earliest valid stage within a
burst. This function allows for individual-bank precharge
without requiring an explicit command. A10 to enables the
AUTO PRECHARGE function in conjunction with a specific READ or WRITE command. For each individual
READ or WRITE command, auto precharge is either
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ISSI
IS42S32200C1
enabled or disabled. AUTO PRECHARGE does not apply
except in full-page burst mode. Upon completion of the
READ or WRITE burst, a precharge of the bank/row that
is addressed is automatically performed.
AUTO REFRESH COMMAND
This command executes the AUTO REFRESH operation.
The row address and bank to be refreshed are automatically
generated during this operation. The stipulated period (tRC)
is required for a single refresh operation, and no other
commands can be executed during this period. This command is executed at least 4096 times every 64ms. During
an AUTO REFRESH command, address bits are “Don’t
Care”. This command corresponds to CBR Auto-refresh.
SELF REFRESH
During the SELF REFRESH operation, the row address to
be refreshed, the bank, and the refresh interval are
generated automatically internally. SELF REFRESH can
be used to retain data in the SDRAM without external
clocking, even if the rest of the system is powered down.
The SELF REFRESH operation is started by dropping the
CKE pin from HIGH to LOW. During the SELF REFRESH
operation all other inputs to the SDRAM become “Don’t
Care”.The device must remain in self refresh mode for a
minimum period equal to tRAS or may remain in self refresh
mode for an indefinite period beyond that.The SELFREFRESH operation continues as long as the CKE pin
remains LOW and there is no need for external control of
any other pins.The next command cannot be executed
until the device internal recovery period (tRC) has elapsed.
Once CKE goes HIGH, the NOP command must be
issued (minimum of two clocks) to provide time for the
completion of any internal refresh in progress. After the
self-refresh, since it is impossible to determine the address of the last row to be refreshed, an AUTO-REFRESH
should immediately be performed for all addresses.
BURST TERMINATE
The BURST TERMINATE command forcibly terminates
the burst read and write operations by truncating either
fixed-length or full-page bursts and the most recently
registered READ or WRITE command prior to the BURST
TERMINATE.
COMMAND INHIBIT
COMMAND INHIBIT prevents new commands from being
executed. Operations in progress are not affected, apart
from whether the CLK signal is enabled
NO OPERATION
When CS is low, the NOP command prevents unwanted
commands from being registered during idle or wait
states.
LOAD MODE REGISTER
During the LOAD MODE REGSITER command the mode
register is loaded from A0-A10. This command can only
be issued when all banks are idle.
ACTIVE COMMAND
When the ACTIVE COMMAND is activated, BA0, BA1
inputs selects a bank to be accessed, and the address
inputs on A0-A10 selects the row. Until a PRECHARGE
command is issued to the bank, the row remains open for
accesses.
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®
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ISSI
IS42S32200C1
®
TRUTH TABLE – COMMANDS AND DQM OPERATION(1)
FUNCTION
COMMAND INHIBIT (NOP)
NO OPERATION (NOP)
ACTIVE (Select bank and activate row)
(3)
(4)
READ (Select bank/column, start READ burst)
(4)
WRITE (Select bank/column, start WRITE burst)
BURST TERMINATE
(5)
PRECHARGE (Deactivate row in bank or banks)
AUTO REFRESH or SELF REFRESH
(Enter self refresh mode)
LOAD MODE REGISTER
(2)
(8)
Write Enable/Output Enable
(8)
Write Inhibit/Output High-Z
(6,7)
CS
RAS
CAS
WE
DQM
ADDR
DQs
H
X
X
X
X
X
X
L
H
H
H
X
X
X
L
L
H
H
X
Bank/Row
X
L
H
L
H
L/H(8)
Bank/Col
X
L
H
L
L
L/H(8)
Bank/Col
Valid
L
H
H
L
X
X
Active
L
L
H
L
X
Code
X
L
L
L
H
X
X
X
L
L
L
L
X
Op-Code
X
—
—
—
—
L
—
Active
—
—
—
—
H
—
High-Z
NOTES:
1. CKE is HIGH for all commands except SELF REFRESH.
2. A0-A10 define the op-code written to the mode register.
3. A0-A10 provide row address, and BA0, BA1 determine which bank is made active.
4. A0-A7 (x32) provide column address; A10 HIGH enables the auto precharge feature (nonpersistent), while A10 LOW disables
auto precharge; BA0, BA1 determine which bank is being read from or written to.
5. A10 LOW: BA0, BA1 determine the bank being precharged. A10 HIGH: All banks precharged and BA0, BA1 are “Don’t Care.”
6. AUTO REFRESH if CKE is HIGH, SELF REFRESH if CKE is LOW.
7. Internal refresh counter controls row addressing; all inputs and DQs are “Don’t Care” except for CKE.
8. Activates or deactivates the DQs during WRITEs (zero-clock delay) and READs (two-clock delay).
8
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ISSI
IS42S32200C1
®
TRUTH TABLE – CKE (1-4)
CURRENT STATE
COMMANDn
ACTIONn
CKEn-1
CKEn
Power-Down
X
Maintain Power-Down
L
L
Self Refresh
X
Maintain Self Refresh
L
L
X
Maintain Clock Suspend
L
L
COMMAND INHIBIT or NOP
Exit Power-Down
L
H
COMMAND INHIBIT or NOP
Exit Self Refresh
L
H
X
Exit Clock Suspend
L
H
All Banks Idle
COMMAND INHIBIT or NOP
Power-Down Entry
H
L
All Banks Idle
AUTO REFRESH
Self Refresh Entry
H
L
Reading or Writing
VALID
Clock Suspend Entry
H
L
H
H
Clock Suspend
(5)
Power-Down
(6)
Self Refresh
Clock Suspend
(7)
See TRUTH TABLE – CURRENT STATE BANK n, COMMAND TO BANK n
NOTES:
1. CKEn is the logic state of CKE at clock edge n; CKEn-1 was the state of CKE at the previous clock edge.
2. Current state is the state of the SDRAM immediately prior to clock edge n.
3. COMMANDn is the command registered at clock edge n, and ACTONn is a result of COMMANDn.
4. All states and sequences not shown are illegal or reserved.
5. Exiting power-down at clock edge n will put the device in the all banks idle state in time for clock edge n+1 (provided that tCKS is met).
6. Exiting self refresh at clock edge n will put the device in all banks idle state once tXSR is met. COMMAND INHIBIT or NOP commands
should be issued on clock edges occurring during the tXSR period. A minimum of two NOP commands must be sent during tXSR period.
7. After exiting clock suspend at clock edge n, the device will resume operation and recognize the next command at clock edge n+1.
TRUTH TABLE – CURRENT STATE BANK n, COMMAND TO BANK n (1-6)
CS RAS CAS WE
CURRENT STATE
COMMAND (ACTION)
Any
COMMAND INHIBIT (NOP/Continue previous operation)
H
X
X
X
NO OPERATION (NOP/Continue previous operation)
L
H
H
H
ACTIVE (Select and activate row)
L
L
H
H
AUTO REFRESH(7)
L
L
L
H
LOAD MODE REGISTER(7)
L
L
L
L
L
L
H
L
L
H
L
H
L
H
L
L
L
L
H
L
L
H
L
H
Idle
PRECHARGE
Row Active
(11)
(10)
READ (Select column and start READ burst)
WRITE (Select column and start WRITE burst)(10)
(8)
PRECHARGE (Deactivate row in bank or banks)
(10)
Read
READ (Select column and start new READ burst)
(Auto
(10)
WRITE (Select column and start WRITE burst)
L
H
L
L
Precharge
PRECHARGE (Truncate READ burst, start PRECHARGE)(8)
L
L
H
L
L
H
H
L
L
H
L
H
L
H
L
L
Disabled)
Write
(9)
BURST TERMINATE
(10)
READ (Select column and start READ burst)
(10)
(Auto
WRITE (Select column and start new WRITE burst)
Precharge
PRECHARGE (Truncate WRITE burst, start PRECHARGE)(8)
L
L
H
L
Disabled)
BURST TERMINATE(9)
L
H
H
L
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®
NOTE:
1. This table applies when CKE n-1 was HIGH and CKE n is HIGH (see Truth Table - CKE) and after tXSR has been met (if the
previous state was SELF REFRESH).
2. This table is bank-specific, except where noted; i.e., the current state is for a specific bank and the commands shown are those
allowed to be issued to that bank when in that state. Exceptions are covered in the notes below.
3. Current state definitions:
Idle: The bank has been precharged, and tRP has been met.
Row Active: A row in the bank has been activated, and tRCD has been met. No data bursts/accesses and no register
accesses are in progress.
Read: A READ burst has been initiated, with auto precharge disabled, and has not yet terminated or been terminated.
Write: A WRITE burst has been initiated, with auto precharge disabled, and has not yet terminated or been terminated.
4. The following states must not be interrupted by a command issued to the same bank. COMMAND INHIBIT or NOP commands, or
allowable commands to the other bank should be issued on any clock edge occurring during these states. Allowable commands to
the other bank are determined by its current state and CURRENT STATE BANK n truth tables.
Precharging: Starts with registration of a PRECHARGE command and ends when tRP is met. Once tRP is met, the bank
will be in the idle state.
Row Activating: Starts with registration of an ACTIVE command and ends when tRCD is met. Once tRCD is met, the bank will
be in the row active state.
Read w/Auto
Precharge Enabled: Starts with registration of a READ command with auto precharge enabled and ends when tRP has been met.
Once tRP is met, the bank will be in the idle state.
Write w/Auto
Precharge Enabled: Starts with registration of a WRITE command with auto precharge enabled and ends when tRP has been met.
Once tRP is met, the bank will be in the idle state.
5. The following states must not be interrupted by any executable command; COMMAND INHIBIT or NOP commands must be
applied on each positive clock edge during these states.
Refreshing: Starts with registration of an AUTO REFRESH command and ends when tRC is met. Once tRC is met, the
SDRAM will be in the all banks idle state.
Accessing Mode
Register: Starts with registration of a LOAD MODE REGISTER command and ends when tMRD has been met. Once
tMRD is met, the SDRAM will be in the all banks idle state.
Precharging All: Starts with registration of a PRECHARGE ALL command and ends when tRP is met. Once tRP is met, all
banks will be in the idle state.
6. All states and sequences not shown are illegal or reserved.
7. Not bank-specific; requires that all banks are idle.
8. May or may not be bank-specific; if all banks are to be precharged, all must be in a valid state for precharging.
9. Not bank-specific; BURST TERMINATE affects the most recent READ or WRITE burst, regardless of bank.
10. READs or WRITEs listed in the Command (Action) column include READs or WRITEs with auto precharge enabled and READs
or WRITEs with auto precharge disabled.
11. Does not affect the state of the bank and acts as a NOP to that bank.
10
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ISSI
IS42S32200C1
®
TRUTH TABLE – CURRENT STATE BANK n, COMMAND TO BANK m (1-6)
CS RAS CAS WE
CURRENT STATE
COMMAND (ACTION)
Any
COMMAND INHIBIT (NOP/Continue previous operation)
H
X
X
X
NO OPERATION (NOP/Continue previous operation)
L
H
H
H
Idle
Any Command Otherwise Allowed to Bank m
X
X
X
X
Row
ACTIVE (Select and activate row)
L
L
H
H
L
H
L
H
Activating,
(7)
READ (Select column and start READ burst)
(7)
Active, or
WRITE (Select column and start WRITE burst)
L
H
L
L
Precharging
PRECHARGE
L
L
H
L
Read
ACTIVE (Select and activate row)
L
L
H
H
L
H
L
H
(Auto
READ (Select column and start new READ burst)
(7,10)
(7,11)
Precharge
WRITE (Select column and start WRITE burst)
L
H
L
L
Disabled)
PRECHARGE(9)
L
L
H
L
Write
ACTIVE (Select and activate row)
L
L
H
H
L
H
L
H
L
H
L
L
L
L
H
L
L
L
H
H
L
H
L
H
WRITE (Select column and start WRITE burst)
L
H
L
L
PRECHARGE(9)
L
L
H
L
L
L
H
H
L
H
L
H
L
H
L
L
L
L
H
L
(Auto
(7,12)
READ (Select column and start READ burst)
Precharge
WRITE (Select column and start new WRITE burst)
Disabled)
PRECHARGE(9)
Read
ACTIVE (Select and activate row)
(With Auto
Precharge)
Write
(With Auto
Precharge)
READ (Select column and start new READ burst)
(7,13)
(7,8,14)
(7,8,15)
ACTIVE (Select and activate row)
(7,8,16)
READ (Select column and start READ burst)
WRITE (Select column and start new WRITE burst)
PRECHARGE(9)
(7,8,17)
NOTE:
1. This table applies when CKE n-1 was HIGH and CKE n is HIGH (Truth Table - CKE) and after tXSR has been met (if the previous
state was self refresh).
2. This table describes alternate bank operation, except where noted; i.e., the current state is for bank n and the commands shown
are those allowed to be issued to bank m (assuming that bank m is in such a state that the given command is allowable). Exceptions are
covered in the notes below.
3. Current state definitions:
Idle: The bank has been precharged, and tRP has been met.
Row Active: A row in the bank has been activated, and tRCD has been met. No data bursts/accesses and no register
accesses are in progress.
Read: A READ burst has been initiated, with auto precharge disabled, and has not yet terminated or been terminated.
Write: A WRITE burst has been initiated, with auto precharge disabled, and has not yet terminated or been terminated.
Read w/Auto
Precharge Enabled: Starts with registration of a READ command with auto precharge enabled, and ends when tRP has been met.
Once tRP is met, the bank will be in the idle state.
Write w/Auto
Precharge Enabled: Starts with registration of a WRITE command with auto precharge enabled, and ends when tRP has been
met. Once tRP is met, the bank will be in the idle state.
4. AUTO REFRESH, SELF REFRESH and LOAD MODE REGISTER commands may only be issued when all banks are idle.
5. A BURST TERMINATE command cannot be issued to another bank; it applies to the bank represented by the current state only.
6. All states and sequences not shown are illegal or reserved.
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IS42S32200C1
ISSI
®
7. READs or WRITEs to bank m listed in the Command (Action) column include READs or WRITEs with auto precharge enabled
and READs or WRITEs with auto precharge disabled.
8. CONCURRENT AUTO PRECHARGE: Bank n will initiate the AUTO PRECHARGE command when its burst has been interrupted by bank m’s burst.
9. Burst in bank n continues as initiated.
10. For a READ without auto precharge interrupted by a READ (with or without auto precharge), the READ to bank m will interrupt the
READ on bank n, CAS latency later (Consecutive READ Bursts).
11. For a READ without auto precharge interrupted by a WRITE (with or without auto precharge), the WRITE to bank m will interrupt
the READ on bank n when registered (READ to WRITE). DQM should be used one clock prior to the WRITE command to prevent
bus contention.
12. For a WRITE without auto precharge interrupted by a READ (with or without auto precharge), the READ to bank m will interrupt
the WRITE on bank n when registered (WRITE to READ), with the data-out appearing CAS latency later. The last valid WRITE to
bank n will be data-in registered one clock prior to the READ to bank m.
13. For a WRITE without auto precharge interrupted by a WRITE (with or without auto precharge), the WRITE to bank m will interrupt
the WRITE on bank n when registered (WRITE to WRITE). The last valid WRITE to bank n will be data-in registered one clock
prior to the READ to bank m.
14. For a READ with auto precharge interrupted by a READ (with or without auto precharge), the READ to bank m will interrupt the
READ on bank n, CAS latency later. The PRECHARGE to bank n will begin when the READ to bank m is registered (Fig CAP 1).
15. For a READ with auto precharge interrupted by a WRITE (with or without auto precharge), the WRITE to bank m will interrupt the
READ on bank n when registered. DQM should be used two clocks prior to the WRITE command to prevent bus contention. The
PRECHARGE to bank n will begin when the WRITE to bank m is registered (Fig CAP 2).
16. For a WRITE with auto precharge interrupted by a READ (with or without auto precharge), the READ to bank m will interrupt the
WRITE on bank n when registered, with the data-out appearing CAS latency later. The PRECHARGE to bank n will begin after
tWR is met, where tWR begins when the READ to bank m is registered. The last valid WRITE to bank n will be data-in registered
one clock prior to the READ to bank m (Fig CAP 3).
17. For a WRITE with auto precharge interrupted by a WRITE (with or without auto precharge), the WRITE to bank m will interrupt the
WRITE on bank n when registered. The PRECHARGE to bank n will begin after tWR is met, where t WR begins when the WRITE
to bank m is registered. The last valid WRITE to bank n will be data registered one clock prior to the WRITE to bank m (Fig CAP 4).
12
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ISSI
IS42S32200C1
®
FUNCTIONAL DESCRIPTION
Initialization
The 64Mb SDRAMs 512K x 32 x 4 banks) are quad-bank
DRAMs which operate at 3.3V and include a synchronous
interface (all signals are registered on the positive edge of
the clock signal, CLK). Each of the 16,777,216-bit banks
is organized as 2,048 rows by 256 columns by 32bits.
Read and write accesses to the SDRAM are burst oriented;
accesses start at a selected location and continue for a
programmed number of locations in a programmed
sequence. Accesses begin with the registration of an
ACTIVE command which is then followed by a READ or
WRITE command. The address bits registered coincident
with the ACTIVE command are used to select the bank
and row to be accessed (BA0 and BA1 select the bank, A0-A10
select the row). The address bits (A0-A7) registered coincident
with the READ or WRITE command are used to select the
starting column location for the burst access.
Prior to normal operation, the SDRAM must be initialized.
The following sections provide detailed information covering
device initialization, register definition, command
descriptions and device operation.
SDRAMs must be powered up and initialized in a
predefined manner.
The 64M SDRAM is initialized after the power is applied
to VDD and VDDQ (simultaneously) and the clock is stable.
A 100µs delay is required prior to issuing any command
other than a COMMAND INHIBIT or a NOP. The COMMAND
INHIBIT or NOP may be applied during the 100us period
and continue should at least through the end of the period.
With at least one COMMAND INHIBIT or NOP command
having been applied, a PRECHARGE command should be
applied once the 100µs delay has been satisfied. All
banks must be precharged. This will leave all banks in an
idle idle state where two AUTO REFRESH cycles must be
performed. After the AUTO REFRESH cycles are complete,
the SRDRAM is then ready for mode register programming.
The mode register should be loaded prior to applying any
operational command because it will power up in an
unknown state.
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ISSI
IS42S32200C1
®
REGISTER DEFINITION
Mode Register
until it is programmed again or the device loses power.
Mode register bits M0-M2 specify the burst length, M3
specifies the type of burst (sequential or interleaved), M4- M6
specify the CAS latency, M7 and M8 specify the operating
mode, M9 specifies the WRITE burst mode, and M10 and
M11 and M12 are reserved for future use.
The mode register must be loaded when all banks are idle,
and the controller must wait the specified time before
initiating the subsequent operation. Violating either of
these requirements will result in unspecified operation.
The mode register is used to define the specific mode of
operation of the SDRAM. This definition includes the
selection of a burst length, a burst type, a CAS\ latency,
an operating mode and a write burst mode, as shown in
MODE REGISTER DEFINITION.
The mode register is programmed via the LOAD MODE
REGISTER command and will retain the stored information
MODE REGISTER DEFINITION
BA0,1
0
(1)
A10/AP
0
A9
A8
A7
A6
A5
A4
(1)
A3
A2
A1
A0
Address Bus
Burst Type
M3Type
0
1
Sequential
Interleaved
Burst Length
M2 M1 M0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Sequential
Interleave
1
2
4
8
Reserved
Reserved
Reserved
Full Page
1
2
4
8
Reserved
Reserved
Reserved
Reserved
Latency Mode
M6 M5 M4
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
CAS Latency
Reserved
Reserved
2
3
Reserved
Reserved
Reserved
Reserved
MRS
M8 M7
MRS
0
—
Mode Register Set
All Other States Reserved
0
—
Write Burst Mode
M9
14
Mode
0
Burst Write
1
Single-Bit Write
Note:
1. Maintain low during Mode Register Set.
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ISSI
IS42S32200C1
®
Burst Length
Read and write accesses to the SDRAM are burst oriented, with the burst length being programmable, as
shown in MODE REGISTER DEFINITION. The burst
length determines the maximum number of column locations that can be accessed for a given READ or WRITE
command. Burst lengths of 1, 2, 4 or 8 locations are
available for both the sequential and the interleaved burst
types, and a full-page burst is available for the sequential
type. The full-page burst is used in conjunction with the
BURST TERMINATE command to generate arbitrary
burst lengths.
Reserved states should not be used, as unknown operation or incompatibility with future versions may result.
When a READ or WRITE command is issued, a block of
columns equal to the burst length is effectively selected.
All accesses for that burst take place within this block,
meaning that the burst will wrap within the block if a
boundary is reached. The block is uniquely selected by
A1-A7 (x32) when the burst length is set to two; by A2-A7
(x32) when the burst length is set to four; and by A3-A7
(x32) when the burst length is set to eight. The remaining
(least significant) address bit(s) is (are) used to select the
starting location within the block. Full-page bursts wrap
within the page if the boundary is reached.
Burst Type
Accesses within a given burst may be programmed to be
either sequential or interleaved; this is referred to as the
burst type and is selected via bit M3.
The ordering of accesses within a burst is determined by
the burst length, the burst type and the starting column
address, as shown in BURST DEFINITION table.
BURST DEFINITION
Burst
Starting Column
Length
Address
Order of Accesses Within a Burst
Type = Sequential
Type = Interleaved
0
0-1
0-1
1
1-0
1-0
A0
2
A1
A0
0
0
0-1-2-3
0-1-2-3
0
1
1-2-3-0
1-0-3-2
1
0
2-3-0-1
2-3-0-1
1
1
3-0-1-2
3-2-1-0
A2
A1
A0
0
0
0
0-1-2-3-4-5-6-7
0-1-2-3-4-5-6-7
0
0
1
1-2-3-4-5-6-7-0
1-0-3-2-5-4-7-6
0
1
0
2-3-4-5-6-7-0-1
2-3-0-1-6-7-4-5
0
1
1
3-4-5-6-7-0-1-2
3-2-1-0-7-6-5-4
1
0
0
4-5-6-7-0-1-2-3
4-5-6-7-0-1-2-3
1
0
1
5-6-7-0-1-2-3-4
5-4-7-6-1-0-3-2
1
1
0
6-7-0-1-2-3-4-5
6-7-4-5-2-3-0-1
1
1
1
7-0-1-2-3-4-5-6
7-6-5-4-3-2-1-0
Cn, Cn + 1, Cn + 2
Cn + 3, Cn + 4...
…Cn - 1,
Cn…
Not Supported
4
8
Full
Page
(y)
n = A0-A7
(location 0-y)
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15
ISSI
IS42S32200C1
®
CAS Latency
reserved for future use and/or test modes. The programmed
burst length applies to both READ and WRITE bursts.
Test modes and reserved states should not be used
because unknown operation or incompatibility with future
versions may result.
The CAS latency is the delay, in clock cycles, between the
registration of a READ command and the availability of the first
piece of output data. The latency can be set to two or three clocks.
If a READ command is registered at clock edge n, and the
latency is m clocks, the data will be available by clock
edge n + m. The DQs will start driving as a result of the
clock edge one cycle earlier (n + m - 1), and provided that
the relevant access times are met, the data will be valid
by clock edge n + m. For example, assuming that the
clock cycle time is such that all relevant access times are
met, if a READ command is registered at T0 and the
latency is programmed to two clocks, the DQs will start
driving after T1 and the data will be valid by T2, as shown
in CAS Latency diagrams. The Allowable Operating
Frequency table indicates the operating frequencies at
which each CAS latency setting can be used.
Reserved states should not be used as unknown operation
or incompatibility with future versions may result.
Write Burst Mode
When M9 = 0, the burst length programmed via M0-M2
applies to both READ and WRITE bursts; when M9 = 1, the
programmed burst length applies to READ bursts, but
write accesses are single-location (nonburst) accesses.
CAS Latency
Allowable Operating Frequency (MHz)
Operating Mode
The normal operating mode is selected by setting M7 and M8
to zero; the other combinations of values for M7 and M8 are
Speed
CAS Latency = 2
CAS Latency = 3
5.5
100
183
6
100
166
7
100
143
CAS Latency
T0
T1
T2
T3
READ
NOP
NOP
CLK
COMMAND
tAC
DOUT
DQ
tOH
tLZ
CAS Latency - 2
T0
T1
T2
T3
T4
READ
NOP
NOP
NOP
CLK
COMMAND
tAC
DOUT
DQ
tLZ
tOH
CAS Latency - 3
DON'T CARE
UNDEFINED
16
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ISSI
IS42S32200C1
OPERATION
®
Activating Specific Row Within Specific Bank
BANK/ROW ACTIVATION
Before any READ or WRITE commands can be issued to
a bank within the SDRAM, a row in that bank must be
“opened.” This is accomplished via the ACTIVE command,
which selects both the bank and the row to be activated
(see Activating Specific Row Within Specific Bank).
After opening a row (issuing an ACTIVE command), a READ
or WRITE command may be issued to that row, subject to
the tRCD specification. Minimum tRCD should be divided by
the clock period and rounded up to the next whole number
to determine the earliest clock edge after the ACTIVE
command on which a READ or WRITE command can be
entered. For example, a tRCD specification of 20ns with a
125 MHz clock (8ns period) results in 2.5 clocks, rounded
to 3. This is reflected in the following example, which
covers any case where 2 < [tRCD (MIN)/tCK] ≤ 3. (The
same procedure is used to convert other specification
limits from time units to clock cycles).
A subsequent ACTIVE command to a different row in the
same bank can only be issued after the previous active
row has been “closed” (precharged). The minimum time
interval between successive ACTIVE commands to the
same bank is defined by tRC.
CLK
CKE
HIGH - Z
CS
RAS
CAS
WE
A0-A10
ROW ADDRESS
BA0, BA1
BANK ADDRESS
A subsequent ACTIVE command to another bank can be
issued while the first bank is being accessed, which
results in a reduction of total row-access overhead. The
minimum time interval between successive ACTIVE commands to different banks is defined by tRRD.
Example: Meeting tRCD (MIN) when 2 < [tRCD (min)/tCK] ≤ 3
T0
T1
T2
ACTIVE
NOP
NOP
T3
T4
CLK
COMMAND
READ or
WRITE
tRCD
DON'T CARE
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ISSI
IS42S32200C1
READS
READ COMMAND
READ bursts are initiated with a READ command, as shown
in the READ COMMAND diagram.
The starting column and bank addresses are provided with the
READ command, and auto precharge is either enabled or
disabled for that burst access. If auto precharge is enabled, the
row being accessed is precharged at the completion of the
burst. For the generic READ commands used in the following
illustrations, auto precharge is disabled.
During READ bursts, the valid data-out element from the
starting column address will be available following the
CAS latency after the READ command. Each subsequent
data-out element will be valid by the next positive clock
edge. The CAS Latency diagram shows general timing
for each possible CAS latency setting.
Upon completion of a burst, assuming no other commands
have been initiated, the DQs will go High-Z. A full-page
burst will continue until terminated. (At the end of the page,
it will wrap to column 0 and continue.)
Data from any READ burst may be truncated with a
subsequent READ command, and data from a fixed-length
READ burst may be immediately followed by data from a
READ command. In either case, a continuous flow of data
can be maintained. The first data element from the new
burst follows either the last element of a completed burst or
the last desired data element of a longer burst which is
being truncated.
The new READ command should be issued x cycles
before the clock edge at which the last desired data
element is valid, where x equals the CAS latency minus
one. This is shown in Consecutive READ Bursts for CAS
latencies of two and three; data element n + 3 is either the
last of a burst of four or the last desired of a longer burst.
The 64Mb SDRAM uses a pipelined architecture and
therefore does not require the 2n rule associated with a
prefetch architecture. A READ command can be initiated
on any clock cycle following a previous READ command.
Full-speed random read accesses can be performed to the
same bank, as shown in Random READ Accesses, or each
subsequent READ may be performed to a different bank.
Data from any READ burst may be truncated with a
subsequent WRITE command, and data from a fixed-length
READ burst may be immediately followed by data from a
WRITE command (subject to bus turnaround limitations).
The WRITE burst may be initiated on the clock edge
immediately following the last (or last desired) data
element from the READ burst, provided that DQ contention
can be avoided. In a given system design, there may be
a possibility that the device driving the input data will go
Low-Z before the SDRAM DQs go High-Z. In this case, at
least a single-cycle delay should occur between the last
read data and the WRITE command.
18
®
CLK
CKE
HIGH-Z
CS
RAS
CAS
WE
A0-A7
COLUMN ADDRESS
A8, A9
AUTO PRECHARGE
A10
NO PRECHARGE
BA0, BA1
BANK ADDRESS
The DQM input is used to avoid DQ contention, as shown
in Figures RW1 and RW2. The DQM signal must be
asserted (HIGH) at least two clocks prior to the WRITE
command (DQM latency is two clocks for output buffers)
to suppress data-out from the READ. Once the WRITE
command is registered, the DQs will go High-Z (or remain
High-Z), regardless of the state of the DQM signal,
provided the DQM was active on the clock just prior to the
WRITE command that truncated the READ command. If
not, the second WRITE will be an invalid WRITE. For
example, if DQM was LOW during T4 in Figure RW2, then
the WRITEs at T5 and T7 would be valid, while the WRITE
at T6 would be invalid.
The DQM signal must be de-asserted prior to the WRITE
command (DQM latency is zero clocks for input buffers)
to ensure that the written data is not masked. Figure RW1
shows the case where the clock frequency allows for bus
contention to be avoided without adding a NOP cycle, and
Figure RW2 shows the case where the additional NOP is
needed.
A fixed-length READ burst may be followed by, or truncated
with, a PRECHARGE command to the same bank (provided
that auto precharge was not activated), and a full-page burst
may be truncated with a PRECHARGE command to the
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IS42S32200C1
same bank. The PRECHARGE command should be issued
x cycles before the clock edge at which the last desired
data element is valid, where x equals the CAS latency
minus one. This is shown in the READ to PRECHARGE
diagram for each possible CAS latency; data element n +
3 is either the last of a burst of four or the last desired of a
longer burst. Following the PRECHARGE command, a
subsequent command to the same bank cannot be issued
until tRP is met. Note that part of the row precharge time is
hidden during the access of the last data element(s).
In the case of a fixed-length burst being executed to
completion, a PRECHARGE command issued at the
optimum time (as described above) provides the same
operation that would result from the same fixed-length
burst with auto precharge. The disadvantage of the
®
PRECHARGE command is that it requires that the command and address buses be available at the appropriate
time to issue the command; the advantage of the
PRECHARGE command is that it can be used to truncate
fixed-length or full-page bursts.
Full-page READ bursts can be truncated with the BURST
TERMINATE command, and fixed-length READ bursts
may be truncated with a BURST TERMINATE command,
provided that auto precharge was not activated. The
BURST TERMINATE command should be issued x cycles
before the clock edge at which the last desired data
element is valid, where x equals the CAS latency minus
one. This is shown in the READ Burst Termination
diagram for each possible CAS latency; data element n +
3 is the last desired data element of a longer burst.
CAS Latency
T0
T1
T2
T3
READ
NOP
NOP
CLK
COMMAND
tAC
DOUT
DQ
tOH
tLZ
CAS Latency - 2
T0
T1
T2
T3
T4
READ
NOP
NOP
NOP
CLK
COMMAND
tAC
DOUT
DQ
tLZ
tOH
CAS Latency - 3
DON'T CARE
UNDEFINED
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Rev. 00E
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19
ISSI
IS42S32200C1
®
Consecutive READ Bursts
T0
T1
T2
T3
T4
T5
T6
READ
NOP
NOP
NOP
READ
NOP
NOP
DOUT n+3
DOUT b
CLK
COMMAND
x =1 cycle
BANK,
COL n
ADDRESS
BANK,
COL b
DQ
DOUT n
DOUT n+1
DOUT n+2
CAS Latency - 2
DON'T CARE
T0
T1
T2
T3
T4
T5
T6
T7
READ
NOP
NOP
NOP
READ
NOP
NOP
NOP
DOUT n+3
DOUT b
CLK
COMMAND
x = 2 cycles
ADDRESS
BANK,
COL n
BANK,
COL b
DQ
DOUT n
DOUT n+1
DOUT n+2
CAS Latency - 3
DON'T CARE
20
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Rev. 00E
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ISSI
IS42S32200C1
®
Random READ Accesses
T0
T1
T2
T3
T4
T5
COMMAND
READ
READ
READ
READ
NOP
NOP
ADDRESS
BANK,
COL n
BANK,
COL b
BANK,
COL m
BANK,
COL x
CLK
DQ
DOUT n
DOUT b
DOUT m
DOUT x
CAS Latency - 2
DON'T CARE
T0
T1
T2
T3
T4
T5
T6
COMMAND
READ
READ
READ
READ
NOP
NOP
NOP
ADDRESS
BANK,
COL n
BANK,
COL b
BANK,
COL m
BANK,
COL x
CLK
DQ
DOUT n
DOUT b
DOUT m
DOUT x
CAS Latency - 3
DON'T CARE
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Rev. 00E
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21
ISSI
IS42S32200C1
®
RW1 - READ to WRITE
T0
T1
T2
T3
T4
COMMAND
READ
NOP
NOP
NOP
ADDRESS
BANK,
COL n
CLK
DQM
WRITE
BANK,
COL b
tHZ
DOUT n
DQ
DIN b
tDS
CAS Lantency 3
DON'T CARE
RW2 - READ to WRITE With Extra Clock Cycle
T0
T1
T2
T3
T4
T5
COMMAND
READ
NOP
NOP
NOP
NOP
WRITE
ADDRESS
BANK,
COL n
CLK
DQM
BANK,
COL b
tHZ
DOUT n
DQ
DIN b
tDS
CAS Lantency 3
22
DON'T CARE
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Rev. 00E
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ISSI
IS42S32200C1
®
READ to PRECHARGE
T0
T1
T2
T3
T4
T5
T6
T7
CLK
tRP
COMMAND
READ
NOP
NOP
NOP
NOP
PRECHARGE
NOP
ACTIVE
x = 1 cycle
ADDRESS
BANK a,
COL n
BANK
(a or all)
DQ
DOUT n
DOUT n+1
BANK a,
ROW
DOUT n+2
DOUT n+3
CAS Latency - 2
DON'T CARE
T0
T1
T2
T3
T4
T5
T6
T7
CLK
tRP
COMMAND
READ
NOP
NOP
NOP
NOP
PRECHARGE
NOP
ACTIVE
x = 2 cycles
ADDRESS
BANK,
COL n
BANK,
COL b
DQ
DOUT n
DOUT n+1
BANK a,
ROW
DOUT n+2
DOUT n+3
CAS Latency - 3
DON'T CARE
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23
ISSI
IS42S32200C1
®
READ Burst Termination
T0
T1
T2
T3
T4
READ
NOP
NOP
NOP
T5
T6
NOP
NOP
CLK
COMMAND
BURST
TERMINATE
x = 1 cycle
BANK a,
COL n
ADDRESS
DQ
DOUT n
DOUT n+1
DOUT n+2
DOUT n+3
CAS Latency - 2
DON'T CARE
T0
T1
T2
T3
READ
NOP
NOP
NOP
T4
T5
T6
T7
NOP
NOP
NOP
CLK
COMMAND
BURST
TERMINATE
x = 2 cycles
ADDRESS
BANK,
COL n
DQ
DOUT n
DOUT n+1
DOUT n+2
DOUT n+3
CAS Latency - 3
DON'T CARE
24
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Rev. 00E
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ISSI
IS42S32200C1
WRITEs
WRITE bursts are initiated with a WRITE command, as
shown in WRITE Command diagram.
WRITE Command
CLK
CKE
HIGH - Z
CS
RAS
CAS
WE
A0-A7
COLUMN ADDRESS
A8, A9
AUTO PRECHARGE
A10
NO PRECHARGE
BA0, BA1
BANK ADDRESS
The starting column and bank addresses are provided with
the WRITE command, and auto precharge is either enabled
or disabled for that access. If auto precharge is enabled, the
row being accessed is precharged at the completion of the
burst. For the generic WRITE commands used in the
following illustrations, auto precharge is disabled.
During WRITE bursts, the first valid data-in element will be
registered coincident with the WRITE command. Subsequent
data elements will be registered on each successive
positive clock edge. Upon completion of a fixed-length
burst, assuming no other commands have been initiated,
the DQs will remain High-Z and any additional input data will
be ignored (see WRITE Burst). A full-page burst will
continue until terminated. (At the end of the page, it will wrap
to column 0 and continue.)
Data for any WRITE burst may be truncated with a
subsequent WRITE command, and data for a fixed-length
WRITE burst may be immediately followed by data for a
WRITE command. The new WRITE command can be issued
on any clock following the previous WRITE command, and
the data provided coincident with the new command applies
to the new command.
An example is shown in WRITE to WRITE diagram. Data
n + 1 is either the last of a burst of two or the last desired
of a longer burst. The 64Mb SDRAM uses a pipelined
architecture and therefore does not require the 2n rule
associated with a prefetch architecture. A WRITE command
can be initiated on any clock cycle following a previous
WRITE command. Full-speed random write accesses
within a page can be performed to the same bank, as
shown in Random WRITE Cycles, or each subsequent
WRITE may be performed to a different bank.
Data for any WRITE burst may be truncated with a
subsequent READ command, and data for a fixed-length
WRITE burst may be immediately followed by a subsequent
READ command. Once the READ com mand is registered, the data inputs will be ignored, and WRITEs will not
be executed. An example is shown in WRITE to READ.
Data n + 1 is either the last of a burst of two or the last
desired of a longer burst.
Data for a fixed-length WRITE burst may be fol lowed by,
or truncated with, a PRECHARGE command to the same
bank (provided that auto precharge was not activated),
and a full-page WRITE burst may be truncated with a
PRECHARGE command to the same bank. The
PRECHARGE command should be issued tWR after the
clock edge at which the last desired input data element is
registered. The auto precharge mode requires a tWR of at
least one clock plus time, regardless of frequency. In
addition, when truncating a WRITE burst, the DQM signal
must be used to mask input data for the clock edge prior
to, and the clock edge coincident with, the PRECHARGE
command. An example is shown in the WRITE to
PRECHARGE diagram. Data n+1 is either the last of a burst
of two or the last desired of a longer burst. Following the
PRECHARGE command, a subsequent command to the
same bank cannot be issued until tRP is met.
In the case of a fixed-length burst being executed to
completion, a PRECHARGE command issued at the optimum time (as described above) provides the same operation
that would result from the same fixed-length burst with auto
precharge. The disadvantage of the PRECHARGE command
is that it requires that the command and address buses be
available at the appropriate time to issue the command; the
advantage of the PRECHARGE command is that it can be
used to truncate fixed-length or full-page bursts.
Fixed-length or full-page WRITE bursts can be truncated
with the BURST TERMINATE command. When truncating
a WRITE burst, the input data applied coincident with the
BURST TERMINATE command will be ignored. The last
data written (provided that DQM is LOW at that time) will
be the input data applied one clock previous to the BURST
TERMINATE command. This is shown in WRITE Burst
Termination, where data n is the last desired data element
of a longer burst.
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Rev. 00E
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®
25
ISSI
IS42S32200C1
®
WRITE Burst
T0
T1
T2
T3
COMMAND
WRITE
NOP
NOP
NOP
ADDRESS
BANK,
COL n
CLK
DQ
DIN n
DIN n+1
DON'T CARE
Burst length = 2 DQM ix low.
WRITE to WRITE
T0
T1
T2
COMMAND
WRITE
NOP
WRITE
ADDRESS
BANK,
COL n
CLK
DQ
BANK,
COL b
DIN n
DIN n+1
DIN b
DQMx is low. Each Write Command
DON'T CARE
may be to any bank.
Random WRITE Cycles
T0
T1
T2
T3
COMMAND
WRITE
WRITE
WRITE
WRITE
ADDRESS
BANK,
COL n
BANK,
COL b
BANK,
COL m
BANK,
COL x
DIN b
DIN m
DIN x
CLK
DQ
DIN n
DQMx is low. Each Write Command
may be to any bank.
26
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Rev. 00E
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ISSI
IS42S32200C1
®
WRITE to READ
T0
T1
T2
T3
T4
T5
COMMAND
WRITE
NOP
READ
NOP
NOP
NOP
ADDRESS
BANK,
COL n
DOUT b
DOUT b+1
CLK
DQ
BANK,
COL b
DIN n
DIN n+1
DON'T CARE
WRITE to PRECHARGE (tWR = 1 CLK (tCK ≥ tWR)
T0
T1
T2
T3
T4
T5
T6
CLK
DQM
tRP
COMMAND
WRITE
ADDRESS
BANK a,
COL n
NOP
PRECHARGE
NOP
BANK
(a or all)
NOP
ACTIVE
NOP
BANK a,
ROW
tWR
DQ
DIN n
DIN n+1
DON'T CARE
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ISSI
IS42S32200C1
®
WRITE to PRECHARGE (tWR = 2 CLK (tWR > tCK)
T0
T1
T2
T3
T4
T5
T6
CLK
DQM
tRP
COMMAND
WRITE
ADDRESS
BANK a,
COL n
NOP
NOP
PRECHARGE
NOP
BANK
(a or all)
NOP
ACTIVE
BANK a,
ROW
tWR
DQ
DIN n
DIN n+1
DON'T CARE
WRITE Burst Termination
T0
T1
T2
COMMAND
WRITE
BURST
TERMINATE
NEXT
COMMAND
ADDRESS
BANK,
COL n
CLK
DQ
DIN n
(ADDRESS)
(DATA)
DON'T CARE
28
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Rev. 00E
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ISSI
IS42S32200C1
®
PRECHARGE Command
PRECHARGE
The PRECHARGE command (see figure) is used to
deactivate the open row in a particular bank or the open
row in all banks. The bank(s) will be available for a
subsequent row access some specified time (tRP) after
the PRECHARGE command is issued. Input A10 determines whether one or all banks are to be precharged, and
in the case where only one bank is to be precharged,
inputs BA0, BA1 select the bank. When all banks are to be
precharged, inputs BA0, BA1 are treated as “Don’t Care.”
Once a bank has been precharged, it is in the idle state and
must be activated prior to any READ or WRITE commands being issued to that bank.
CLK
HIGH - Z
CKE
CS
RAS
CAS
WE
A0-A9
ALL BANKS
A10
POWER-DOWN
Power-down occurs if CKE is registered LOW coincident
with a NOP or COMMAND INHIBIT when no accesses are
in progress. If power-down occurs when all banks are idle,
this mode is referred to as precharge power-down; if powerdown occurs when there is a row active in either bank, this
mode is referred to as active power-down. Entering powerdown deactivates the input and output buffers, excluding
CKE, for maximum power savings while in standby. The
device may not remain in the power-down state longer than
the refresh period (64ms) since no refresh operations are
performed in this mode.
The power-down state is exited by registering a NOP or
COMMAND INHIBIT and CKE HIGH at the desired clock
edge (meeting tCKS). See figure below.
BANK SELECT
BA0, BA1
BANK ADDRESS
POWER-DOWN
CLK
≥ tCKS
tCKS
CKE
COMMAND
NOP
All banks idle
NOP
Input buffers gated off
Enter power-down mode
Exit power-down mode
ACTIVE
tRCD
tRAS
tRC
DON'T CARE
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ISSI
IS42S32200C1
®
CLOCK SUSPEND
Clock suspend mode occurs when a column access/burst
is in progress and CKE is registered LOW. In the clock
suspend mode, the internal clock is deactivated, “freezing”
the synchronous logic.
For each positive clock edge on which CKE is sampled
LOW, the next internal positive clock edge is suspended.
Any command or data present on the input pins at the time
of a suspended internal clock edge is ignored; any data
present on the DQ pins remains driven; and burst counters
are not incremented, as long as the clock is suspended.
(See following examples.)
Clock suspend mode is exited by registering CKE HIGH;
the internal clock and related operation will resume on the
subsequent positive clock edge.
Clock Suspend During WRITE Burst
T0
T1
T2
NOP
WRITE
T3
T4
T5
NOP
NOP
DIN n+1
DIN n+2
CLK
CKE
INTERNAL
CLOCK
COMMAND
BANK a,
COL n
ADDRESS
DQ
DIN n
Burst Length 4 or greater DQM is low.
DON'T CARE
Clock Suspend During READ Burst
T0
T1
T2
COMMAND
READ
NOP
NOP
ADDRESS
BANK a,
COL n
T3
T4
T5
T6
NOP
NOP
NOP
CLK
CKE
INTERNAL
CLOCK
DQ
DOUT n
CAS Latency=2. Burst Length =4 or greater. DQM is low.
30
DOUT n+1
DOUT n+2
DOUT n+3
DON'T CARE
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ISSI
IS42S32200C1
BURST READ/SINGLE WRITE
®
SDRAMs support CONCURRENT AUTO PRECHARGE.
Four cases where CONCURRENT AUTO PRECHARGE
occurs are defined below.
The burst read/single write mode is entered by programming
the write burst mode bit (M9) in the mode register to a logic 1.
In this mode, all WRITE commands result in the access of a
single column location (burst of one), regardless of the
programmed burst length. READ commands access
columns according to the programmed burst length and
sequence, just as in the normal mode of operation (M9 = 0).
READ with Auto Precharge
1. Interrupted by a READ (with or without auto precharge):
A READ to bank m will interrupt a READ on bank n, CAS
latency later. The PRECHARGE to bank n will begin
when the READ to bank m is registered.
2. Interrupted by a WRITE (with or without auto precharge):
A WRITE to bank m will interrupt a READ on bank n
when registered. DQM should be used two clocks prior
to the WRITE command to prevent bus contention. The
PRECHARGE to bank n will begin when the WRITE to
bank m is registered.
CONCURRENT AUTO PRECHARGE
An access command (READ or WRITE) to another bank
while an access command with auto precharge enabled is
executing is not allowed by SDRAMs, unless the SDRAM
supports CONCURRENT AUTO PRECHARGE. ISSI
Fig CAP 1 - READ With Auto Precharge interrupted by a READ
T0
T1
T2
T3
T4
T5
T6
T7
NOP
NOP
NOP
NOP
CLK
NOP
COMMAND
BANK n
READ - AP
BANK n
Page Active
NOP
READ - AP
BANK m
READ with Burst of 4
Interrupt Burst, Precharge
Idle
tRP - BANK n
Internal States
BANK m
Page Active
READ with Burst of 4
BANK n,
COL a
ADDRESS
tRP - BANK m
Precharge
BANK m,
COL b
DQ
DOUT a
DOUT a+1
DOUT b
DOUT b+1
CAS Latency - 3 (BANK n)
DON'T CARE
CAS Latency - 3 (BANK m)
Fig CAP 2 - READ With Auto Precharge interrupted by a WRITE
T0
T1
T2
T3
NOP
NOP
NOP
T4
T5
T6
T7
NOP
NOP
NOP
CLK
COMMAND
Read - AP
BANK n
BANK n
Internal States
READ with Burst of 4
Interrupt Burst, Precharge
Page Active
BANK m
ADDRESS
WRITE - AP
BANK m
tRP - BANK n
Page Active
tRP - BANK m
WRITE with Burst of 4
BANK n,
COL a
Idle
Write-Back
BANK m,
COL b
DQM
DOUT a
DQ
DIN b
DIN b+1
DIN b+2
DIN b+3
CAS Latency - 3 (BANK n)
DON'T CARE
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31
ISSI
IS42S32200C1
®
WRITE with Auto Precharge
3. Interrupted by a READ (with or without auto precharge):
A READ to bank m will interrupt a WRITE on bank n when
registered, with the data-out appearing CAS latency later.
The PRECHARGE to bank n will begin after tWR is met,
where tWR begins when the READ to bank m is registered.
The last valid WRITE to bank n will be data-in registered
one clock prior to the READ to bank m.
4. Interrupted by a WRITE (with or without auto precharge):
AWRITE to bank m will interrupt a WRITE on bank n when
registered. The PRECHARGE to bank n will begin after
tWR is met, where tWR begins when the WRITE to bank
m is registered. The last valid data WRITE to bank n will
be data registered one clock prior to a WRITE to bank m.
Fig CAP 3 - WRITE With Auto Precharge interrupted by a READ
T0
T1
T2
T3
T4
T5
T6
T7
NOP
NOP
NOP
NOP
CLK
NOP
COMMAND
BANK n
WRITE - AP
BANK n
Page Active
NOP
READ - AP
BANK m
WRITE with Burst of 4
Interrupt Burst, Write-Back
Precharge
tWR - BANK n
tRP - BANK n
Internal States
BANK m
Page Active
READ with Burst of 4
BANK n,
COL a
ADDRESS
DQ
DIN a
tRP - BANK m
Precharge
BANK m,
COL b
DIN a+1
DOUT b
DOUT b+1
CAS Latency - 3 (BANK m)
DON'T CARE
Fig CAP 4 - WRITE With Auto Precharge interrupted by a WRITE
T0
T1
T2
T3
NOP
NOP
T4
T5
T6
T7
NOP
NOP
NOP
CLK
NOP
COMMAND
BANK n
WRITE - AP
BANK n
Page Active
WRITE with Burst of 4
WRITE - AP
BANK m
Interrupt Burst, Write-Back
tWR - BANK n
Internal States
BANK m
ADDRESS
DQ
Page Active
DIN a
tRP - BANK n
tRP - BANK m
WRITE with Burst of 4
BANK n,
COL a
Precharge
Write-Back
BANK m,
COL b
DIN a+1
DIN a+2
DIN b
DIN b+1
DIN b+2
DIN b+3
DON'T CARE
32
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Rev. 00E
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ISSI
IS42S32200C1
®
ABSOLUTE MAXIMUM RATINGS(1)
Symbol
Parameters
VDD MAX
VDDQ MAX
VIN
VOUT
PD MAX
ICS
TOPR
Maximum Supply Voltage
Maximum Supply Voltage for Output Buffer
Input Voltage
Output Voltage
Allowable Power Dissipation
Output Shorted Current
Operating Temperature
Com.
Ind.
Storage Temperature
TSTG
Rating
Unit
–1.0 to +4.6
–1.0 to +4.6
–1.0 to +4.6
–1.0 to +4.6
1
50
0 to +70
–40 to +85
–55 to +150
V
V
V
V
W
mA
°C
°C
DC RECOMMENDED OPERATING CONDITIONS(2,5)
(TA = -40 to +85°C for Industrial, TA = 0 to +70°C for Commercial)
Symbol
VDD, VDDQ
VDD, VDDQ
VIH
VIL
Parameter
Min.
Typ.
Max.
Unit
Supply Voltage (-55)
Supply Voltage (-6, -7)
Input High Voltage(3)
Input Low Voltage(4)
3.15
3.0
2.0
-0.3
3.3
3.3
—
—
3.45
3.6
VDD + 0.3
+0.8
V
V
V
V
CAPACITANCE CHARACTERISTICS(1,2) (At TA = 0 to +25°C, VDD = VDDQ = 3.3 ± 0.3V, f = 1 MHz)
Symbol
Parameter
CIN1
CIN2
CI/O
Input Capacitance: A0-A10, BA0, BA1
Input Capacitance: (CLK, CKE, CS, RAS, CAS, WE, LDQM, UDQM)
Data Input/Output Capacitance: DQ0-DQ31
Typ.
Max.
Unit
—
—
—
4
4
5
pF
pF
pF
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
reliability.
2. All voltages are referenced to GND.
3. VIH (max) = VDDQ + 2.0V with a pulse width ≤ 3 ns. The pluse width cannot be greater than one third of the cycle rate.
4. VIL (min) = GND – 2.0V with a pulse < 3 ns. The pluse width cannot be greater than one third of the cycle rate.
5. An initial pause of 100us is required after power up, followed by two AUTO REFRESH commands, before proper device operation
is ensured. (Vdd and VddQ must be powered up simultaneously. GND and GNDQ must be at same potential.) The two AUTO
REFRESH command wake-ups should be repeated anytime the tREF refresh requirement is exceeded.
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Rev. 00E
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33
ISSI
IS42S32200C1
®
DC ELECTRICAL CHARACTERISTICS (Recommended Operation Conditions unless otherwise noted.)
Symbol
Parameter
Test Condition
IIL
Input Leakage Current
IOL
Output Leakage Current
VOH
VOL
Output High Voltage Level
Output Low Voltage Level
0V ≤ VIN ≤ VDD, with pins other than
the tested pin at 0V
Output is disabled
0V ≤ VOUT ≤ VDD
IOUT = –2 mA
IOUT = +2 mA
ICC1
Operating Current(1,2)
ICC2P
ICC2PS
ICC2N
ICC2NS
Precharge Standby Current
(In Power-Down Mode)
Precharge Standby Current
(In Non Power-Down Mode)
ICC3P
Active Standby Current
ICC3PS
(In Power-Down Mode)
ICC3N
ICC3NS
Active Standby Current
(In Non Power-Down Mode)
CKE ≥ VIH (MIN)
ICC4
Operating Current
(In Burst Mode)(1)
tCK = tCK (MIN)
IOUT = 0mA
ICC5
Auto-Refresh Current
tRC = tRC (MIN)
ICC6
Self-Refresh Current
CKE ≤ 0.2V
One Bank Operation,
Burst Length=1
tRC ≥ tRC (min.)
IOUT = 0mA
CKE ≤ VIL (MAX)
CKE ≥ VIH (MIN)
CKE ≤ VIL (MAX)
Speed
Min.
Max.
Unit
—
–5
5
µA
—
–5
5
µA
—
—
2.4
—
—
0.4
V
V
CAS latency = 3
-55
-6
-7
—
—
—
180
140
130
mA
mA
mA
tCK = tCK (MIN)
tCK = ∞
tCK = tCK (MIN)
tCK = ∞
Com.
Ind.
tCK = tCK (MIN) Com.
Ind.
tCK = ∞
Com.
Ind.
tCK = tCK (MIN)
tCK = ∞
Com.
Ind.
CAS latency = 3
—
—
—
—
—
—
—
—
—
—
—
—
-55
-6
-7
-55
-6
-7
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
2
2
45
30
35
7
8
6
7
70
60
65
250
185
180
225
185
160
1.5
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
m
mA
CAS latency = 3
Notes:
1. These are the values at the minimum cycle time. Since the currents are transient, these values decrease as the cycle time
increases. Also note that a bypass capacitor of at least 0.01 µF should be inserted between Vdd and GND for each memory
chip to suppress power supply voltage noise (voltage drops) due to these transient currents.
2. Icc1 and Icc4 depend on the output load. The maximum values for Icc1 and Icc4 are obtained with the output open state.
34
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00E
05/18/06
ISSI
IS42S32200C1
AC ELECTRICAL CHARACTERISTICS
(1,2,3)
Symbol
Parameter
Condition
Min.
tCK3
tCK2
Clock Cycle Time
CAS Latency = 3
CAS Latency = 2
5.5
10
tAC3
tAC2
Access Time From CLK(4)
CAS Latency = 3
CAS Latency = 2
tCH
-55
Max.
-6
-7
Min.
Max.
—
—
6
10
—
—
7 —
10
—
ns
ns
—
—
5
7.5
—
—
5.5
7.5
—
—
5.5
8
ns
ns
CLK HIGH Level Width
2
—
2
—
2.5
—
ns
tCL
CLK LOW Level Width
2
—
2
—
2.5
—
ns
tOH
Output Data Hold Time
2
—
2
—
2.5
—
ns
tLZ
Output LOW Impedance Time
0
—
0
—
0
—
ns
—
—
5.0
7.5
—
—
5.5
7.5
—
—
5.5
8
ns
ns
(5)
CAS Latency = 3
CAS Latency = 2
Min.
Max.
Units
tHZ3
tHZ2
Output HIGH Impedance Time
tDS
Input Data Setup Time
1.5
—
1.5
—
1.5
—
ns
tDH
Input Data Hold Time
0.8
—
0.8
—
0.8
—
ns
tAS
Address Setup Time
1.5
—
1.5
—
1.5
—
ns
tAH
Address Hold Time
0.8
—
0.8
—
0.8
—
ns
tCKS
CKE Setup Time
1
—
1
—
1
—
ns
tCKH
CKE Hold Time
0.8
—
0.8
—
0.8
—
ns
tCKA
CKE to CLK Recovery Delay Time
1CLK+3
—
1CLK+3
—
1CLK+3
—
ns
tCS
Command Setup Time (CS, RAS, CAS, WE, DQM)
1.5
—
1.5
—
2
—
ns
tCH
Command Hold Time (CS, RAS, CAS, WE, DQM)
0.8
—
0.8
—
1
—
ns
tRC
Command Period (REF to REF / ACT to ACT)
55
—
60
—
63
—
ns
tRAS
Command Period (ACT to PRE)
38.7
120K
38.7
120K
38.7
120K
ns
tRP
Command Period (PRE to ACT)
16.5
—
18
—
20
—
ns
tRCD
Active Command To Read / Write Command Delay Time
16.5
—
18
—
20
—
ns
tRRD
Command Period (ACT [0] to ACT[1])
11
—
12
—
14
—
ns
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00E
05/18/06
®
35
ISSI
IS42S32200C1
AC ELECTRICAL CHARACTERISTICS
(1,2,3)
Symbol
Parameter
Condition
-55
Min. Max.
tDPL3
Input Data To Precharge
Command Delay time
CAS Latency = 3
2CLK
—
2CLK
—
2CLK
—
ns
tDPL2
CAS Latency = 2
2CLK
—
2CLK
—
2CLK
—
ns
tDAL3
Input Data To Active / Refresh
CAS Latency = 3
Command Delay time (During Auto-Precharge)
CAS Latency = 2
2CLK+tRP
—
2CLK+tRP
—
2CLK+tRP
—
ns
2CLK+tRP
—
2CLK+tRP
—
2CLK+tRP
—
ns
0.3
1.2
0.3
1.2
0.3
1.2
ns
1CLK+6ns
—
1CLK+7ns
—
tCK
tDAL2
(2)
®
-6
-7
Min.
Max.
Min.
Max.
Units
tT
Transition Time
tWR
Write Recovery Time
tXSR
Exit Self Refresh and Active Command(6)
55
—
70
—
70
—
ns
tRFC
Auto Refresh Period
60
—
60
—
70
—
ns
tREF
Refresh Cycle Time (4096)
—
64
—
64
—
64
ms
1CLK+5.5ns —
Notes:
1. An initial pause of 100us is required after power up, followed by two AUTO REFRESH commands, before proper device
operation is ensured. (VDD and VDDQ must be powered up simultaneously. GND and GNDQ must be at same potential.) The
two AUTO REFRESH command wake-ups should be repeated anytime the tREF refresh requirement is exceeded.
2. Measured with tT = 0.5 ns.
3. The reference level is 1.5V when measuring input signal timing. Rise/fall times are measured between VIH (min.) and VIL
(max.).
4. Access time is measured at 1.5V with the load shown in the figure below.
5. The time tHZ (max.) is defined as the time required for the output voltage to transition by ± 200 mV from VOH (min.) or VOL (max.)
when the output is in the high impedance state.
6. CLK must be toggled a minimum of two times during this period.
36
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00E
05/18/06
ISSI
IS42S32200C1
®
OPERATING FREQUENCY / LATENCY RELATIONSHIPS(1)
SYMBOL
PARAMETER
CONDITION
-55
-6
-7
UNITS
—
Clock Cycle Time
5.5
6
7
ns
—
Operating Frequency
183
166
143
MHz
tCCD
READ/WRITE command to READ/WRITE command
1
1
1
cycle
tCKED
CKE to clock disable or power-down entry mode
1
1
1
cycle
tPED
CKE to clock enable or power-down exit setup mode
1
1
1
cycle
tDQD
DQM to input data delay
0
0
0
cycle
tDQM
DQM to data mask during WRITEs
0
0
0
cycle
tDQZ
DQM to data high-impedance during READs
2
2
2
cycle
tDWD
WRITE command to input data delay
0
0
0
cycle
tDAL
Data-in to ACTIVE command
5
4
5
4
5
4
cycle
tDPL
Data-in to PRECHARGE command
2
2
2
cycle
tBDL
Last data-in to burst STOP command
1
1
1
cycle
tCDL
Last data-in to new READ/WRITE command
1
1
1
cycle
tRDL
Last data-in to PRECHARGE command
2
2
2
cycle
tMRD
LOAD MODE REGISTER command
to ACTIVE or REFRESH command
2
2
2
cycle
tROH
Data-out to high-impedance from
PRECHARGE command
3
2
3
2
3
2
cycle
CL=3
CL=3
CL=2
CL = 3
CL = 2
Note:
1. If CL = 2, the minimum tCK2 is 10ns.
AC TEST CONDITIONS (Input/Output Reference Level: 1.5V)
Input Load
Output Load
tCK
tCL
tCHI
2.75V
50 Ω
CLK 1.5V
0.25V
tCS
I/O
tCH
+1.5V
2.75V
INPUT 1.5V
30 pF
0.25V
tAC
tOH
OUTPUT
1.5V
1.5V
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Rev. 00E
05/18/06
37
ISSI
IS42S32200C1
®
INITIALIZE AND LOAD MODE REGISTER
T0
T1
Tn+1
tCH
tCK
CLK
To+1
tCL
Tp+1
Tp+2
Tp+3
tCKS tCKH
CKE
tCMH tCMS
tCMH tCMS
tCMH tCMS
NOP
PRECHARGE
AUTO
REFRESH
COMMAND
NOP
AUTO
REFRESH
NOP
Load MODE
REGISTER
NOP
ACTIVE
DQM0-DQM3
tAS tAH
A0-A9
ALL BANKS
A10
CODE
tAS tAH
ROW
CODE
ROW
SINGLE BANK
BA0, BA1
BANK
ALL BANKS
DQ
T
Power-up: VCC
and CLK stable
T = 100µs Min.
38
tRP
Precharge
all banks
tRFC
AUTO REFRESH
tRFC
AUTO REFRESH
tMRD
Program MODE REGISTER
DON'T CARE
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00E
05/18/06
ISSI
IS42S32200C1
®
POWER-DOWN MODE CYCLE
T0
T1
tCK
CLK
tCKS tCKH
T2
tCL
Tn+1
Tn+2
tCH
tCKS
tCKS
CKE
tCMS tCMH
COMMAND
PRECHARGE
NOP
NOP
NOP
ACTIVE
DQM0-DQM3
A0-A9
ROW
A10
ALL BANKS
ROW
BA0, BA1
SINGLE BANK
tAS tAH
BANK
DQ
BANK
High-Z
Two clock cycles
Precharge all
active banks
All banks idle, enter
power-down mode
Input buffers gated
off while in
power-down mode
All banks idle
Exit power-down mode
DON'T CARE
CAS latency = 2, 3
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Rev. 00E
05/18/06
39
ISSI
IS42S32200C1
®
CLOCK SUSPEND MODE
T0
T1
tCK
CLK
T2
tCL
tCKS tCKH
T3
T4
T5
T6
NOP
NOP
NOP
T7
T8
T9
tCH
tCKS tCKH
CKE
tCMS tCMH
COMMAND
READ
NOP
NOP
WRITE
NOP
tCMS tCMH
DQM0-DQM3
A0-A9
A10
BA0, BA1
tAS tAH
COLUMN m(2)
tAS tAH
COLUMN n
tAS tAH
BANK
BANK
tAC
DQ
tAC
DOUT m
tLZ
tHZ
DOUT m+1
tDS
tDH
DIN N
DIN N +1
tOH
DON'T CARE
UNDEFINED
CAS latency = 2, burst length = 2
40
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Rev. 00E
05/18/06
ISSI
IS42S32200C1
®
AUTO-REFRESH CYCLE
T0
T1
tCK
CLK
T2
tCL
Tn+1
To+1
tCH
tCKS tCKH
CKE
tCMS tCMH
PRECHARGE
COMMAND
NOP
Auto
Refresh
NOP
Auto
Refresh
NOP
ACTIVE
DQM0-DQM3
A0-A9
A10
ROW
ALL BANKS
ROW
SINGLE BANK
BA0, BA1
DQ
BANK
BANK(s)
tAS tAH
High-Z
tRP
tRFC
tRFC
DON'T CARE
CAS latency = 2, 3
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Rev. 00E
05/18/06
41
ISSI
IS42S32200C1
®
SELF-REFRESH CYCLE
T0
T1
tCK
CLK
T2
tCH
tCKS tCKH
Tn+1
To+1
To+2
tCL
tCKS
≥ tRAS
CKE
tCKS
tCMS tCMH
COMMAND
PRECHARGE
NOP
Auto
Refresh
NOP
NOP
Auto
Refresh
DQM0-DQM3
A0-A9
A10
BA0, BA1
ALL BANKS
SINGLE BANK
tAS tAH
BANK
DQ
High-Z
tRP
Precharge all
active banks
Enter self
refresh mode
tXSR
CLK stable prior to exiting
Exit self refresh mode
self refresh mode
(Restart refresh time base)
DON'T CARE
CAS latency = 2, 3
42
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00E
05/18/06
ISSI
IS42S32200C1
®
READ WITHOUT AUTO PRECHARGE
T0
T1
T2
tCK
CLK
tCL
T3
T4
T5
T6
T7
T8
NOP
ACTIVE
tCH
tCKS tCKH
CKE
tCMS tCMH
COMMAND
ACTIVE
NOP
READ
NOP
NOP
NOP
PRECHARGE
tCMS tCMH
DQM0-DQM3
tAS tAH
A0-A9
ROW
tAS tAH
A10
ROW
tAS tAH
DISABLE AUTO PRECHARGE
SINGLE BANK
BANK
BANK
BANK
BA0, BA1
ROW
COLUMN m
ALL BANKS
ROW
tAC
DQ
tRCD
tLZ
CAS Latency
BANK
tAC
DOUT m
tAC
DOUT m+1
tAC
DOUT m+2
tHZ
DOUT m+3
tOH
tOH
tOH
tOH
tRAS
tRC
DON'T CARE
tRP
UNDEFINED
CAS latency = 2, Burst Length = 4
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00E
05/18/06
43
ISSI
IS42S32200C1
®
READ WITH AUTO PRECHARGE
T0
T1
T2
tCK
CLK
tCL
T3
T4
T5
T6
T7
T8
NOP
ACTIVE
tCH
tCKS tCKH
CKE
tCMS tCMH
COMMAND
ACTIVE
NOP
READ
NOP
NOP
NOP
NOP
tCMS tCMH
DQM0-DQM3
tAS tAH
A0-A9
COLUMN m)
ROW
tAS tAH
A10
ROW
tAS tAH
BA0, BA1
BANK
ROW
ENABLE AUTO PRECHARGE
ROW
BANK
BANK
tAC
DQ
tRCD
tRAS
tRC
tLZ
CAS Latency
tAC
DOUT m
tAC
DOUT m+1
tAC
DOUT m+2
tHZ
DOUT m+3
tOH
tOH
tOH
tOH
DON'T CARE
tRP
UNDEFINED
CAS latency = 2, Burst Length = 4
44
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Rev. 00E
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ISSI
IS42S32200C1
®
SINGLE READ WITHOUT AUTO PRECHARGE
T0
T1
T2
tCK
CLK
tCL
T3
T4
T5
T6
T7
T8
ACTIVE
NOP
tCH
tCKS tCKH
CKE
tCMS tCMH
COMMAND
ACTIVE
NOP
READ
NOP
NOP
PRECHARGE
NOP
tCMS tCMH
DQM0-DQM3
tAS tAH
A0-A9
A10
BA0, BA1
ROW
tAS tAH
ROW
COLUMN m
ALL BANKS
ROW
ROW
tAS tAH
DISABLE AUTO PRECHARGE
BANK
BANK
SINGLE BANK
BANK
tAC
DQ
BANK
tOH
DOUT m
tRCD
tLZ
CAS Latency
tHZ
tRAS
DON'T CARE
tRP
UNDEFINED
tRC
CAS latency = 2, Burst Length = 1
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00E
05/18/06
45
ISSI
IS42S32200C1
®
SINGLE READ WITH AUTO PRECHARGE
T0
T1
tCK
CLK
T2
tCL
T3
T4
T5
T6
T7
NOP
NOP
T8
tCH
tCKS tCKH
CKE
tCMS tCMH
COMMAND
ACTIVE
NOP
NOP
NOP
READ
ACTIVE
NOP
tCMS tCMH
DQM0-DQM3
tAS tAH
A0-A9,
A10
BA0, BA1
ROW
tAS tAH
ROW
COLUMN m
ENABLE AUTO PRECHARGE
ROW
ROW
tAS tAH
BANK
BANK
BANK
tOH
tAC
DQ
DOUT m
tHZ
tRCD
tRAS
DON'T CARE
CAS Latency
tRP
UNDEFINED
tRC
CAS latency = 2, Burst Length = 1
46
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00E
05/18/06
ISSI
IS42S32200C1
®
ALTERNATING BANK READ ACCESSES
T0
T1
tCK
CLK
T2
tCL
T3
T4
T5
T6
T7
T8
NOP
READ
NOP
tCH
tCKS tCKH
CKE
tCMS tCMH
COMMAND
ACTIVE
NOP
READ
NOP
ACTIVE
ACTIVE
tCMS tCMH
DQM0-DQM3
tAS tAH
A0-A9
A10
BA0, BA1
ROW
tAS tAH
COLUMN b(2)
ROW
COLUMN m
ENABLE AUTO PRECHARGE
ROW
ENABLE AUTO PRECHARGE
ROW
tAS tAH
ROW
BANK 0
BANK 0
ROW
BANK 3
tLZ
BANK 3
tOH
tOH
DQ
DOUT m
tAC
tRCD - BANK 0
tRRD
tOH
DOUT m+1
tAC
BANK 0
tAC
tOH
DOUT m+2
tOH
DOUT m+3
tAC
tAC
tRP - BANK 0
CAS Latency - BANK 0
tRCD - BANK 3
DOUT b
tAC
tRCD - BANK 0
CAS Latency - BANK 3
tRAS - BANK 0
tRC - BANK 0
DON'T CARE
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00E
05/18/06
47
ISSI
IS42S32200C1
®
READ - FULL-PAGE BURST
T0
T1
tCK
CLK
T2
tCL
T3
T4
T5
T6
Tn+1
NOP
NOP
NOP
Tn+2
Tn+3
Tn+4
NOP
NOP
tCH
tCKS tCKH
CKE
tCMS tCMH
COMMAND
ACTIVE
NOP
READ
NOP
NOP
BURST TERM
tCMS tCMH
DQM0-DQM3
A0-A9,
A10
BA0, BA1
tAS
tAH
ROW
tAS tAH
COLUMN m
ROW
tAS tAH
BANK
BANK
tAC
DQ
tLZ
tRCD
CAS Latency
tAC
DOUT m
tOH
tAC
DOUT m+1
tAC
DOUT m+2
tOH
each row (x32) has
256 locations
tOH
Full page
completion
48
tAC
DOUT m-1
tAC
DOUT m
tHZ
DOUT m+1
tOH
tOH
tOH
DON'T CARE
Full-page burst not self-terminating.
Use BURST TERMINATE command.
UNDEFINED
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00E
05/18/06
ISSI
IS42S32200C1
®
READ - DQM OPERATION
T0
T1
T2
tCK
CLK
tCL
T3
T4
T5
T6
T7
T8
NOP
NOP
NOP
NOP
NOP
NOP
tCH
tCKS tCKH
CKE
tCMS tCMH
COMMAND
ACTIVE
NOP
READ
tCMS tCMH
DQM0-DQM3
tAS
tAH
A0-A9
ROW
tAS tAH
A10
ROW
tAS tAH
DISABLE AUTO PRECHARGE
BANK
BANK
BA0, BA1
COLUMN m
ENABLE AUTO PRECHARGE
tAC
DQ
tLZ
tRCD
tOH
DOUT m
tHZ
CAS Latency
tAC
tLZ
tOH
DOUT m+2
tAC
tOH
DOUT m+3
tHZ
DON'T CARE
UNDEFINED
CAS Latency = 2, Burst Length = 4
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00E
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49
ISSI
IS42S32200C1
®
WRITE - WITHOUT AUTO PRECHARGE
T0
T1
tCK
CLK
T2
tCL
T3
T4
T5
T6
NOP
NOP
NOP
T7
T8
tCH
tCKS tCKH
CKE
tCMS tCMH
ACTIVE
COMMAND
NOP
WRITE
PRECHARGE
NOP
ACTIVE
tCMS tCMH
DQM0-DQM3
tAS tAH
A0-A9
A10
BA0, BA1
ROW
tAS tAH
COLUMN m
ROW
ALL BANKS
ROW
tAS tAH
ROW
SINGLE BANK
DISABLE AUTO PRECHARGE
BANK
BANK
tDS
DQ
tDH
DIN m
tRCD
tRAS
tRC
BANK
tDS tDH
DIN m+1
tDS tDH
DIN m+2
tDS
BANK
tDH
DIN m+3
tWR
tRP
DON'T CARE
Burst Length = 4
50
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ISSI
IS42S32200C1
®
WRITE - WITH AUTO PRECHARGE
T0
T1
tCK
CLK
T2
tCL
T3
T4
T5
T6
T7
T8
T9
NOP
NOP
NOP
NOP
NOP
NOP
ACTIVE
tCH
tCKS tCKH
CKE
tCMS tCMH
COMMAND
ACTIVE
NOP
WRITE
tCMS tCMH
DQM0-DQM3
tAS tAH
A0-A9
A10
BA0, BA1
ROW
tAS tAH
COLUMN m
ROW
ENABLE AUTO PRECHARGE
ROW
tAS tAH
ROW
BANK
BANK
tDS
DQ
tDH
DIN m
BANK
tDS tDH
DIN m+1
tDS tDH
DIN m+2
tDS
tDH
DIN m+3
tRCD
tRAS
tRC
tWR
tRP
DON'T CARE
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00E
05/18/06
51
ISSI
IS42S32200C1
®
SINGLE WRITE - WITHOUT AUTO PRECHARGE
T0
T1
tCK
CLK
T2
tCL
T3
T4
NOP
NOP
T5
T6
T7
T8
tCH
tCKS tCKH
CKE
tCMS tCMH
COMMAND
ACTIVE
NOP
WRITE
PRECHARGE
NOP
ACTIVE
NOP
tCMS tCMH
DQM0-DQM3
tAS tAH
A0-A9
A10
BA0, BA1
ROW
tAS tAH
COLUMN m
ROW
ALL BANKS
ROW
tAS tAH
ROW
SINGLE BANK
DISABLE AUTO PRECHARGE
BANK
BANK
BANK
BANK
tDS tDH
DQ
DIN m
tRCD
tRAS
tRC
52
tWR
tRP
DON'T CARE
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00E
05/18/06
ISSI
IS42S32200C1
®
SINGLE WRITE - WITH AUTO PRECHARGE
T0
T1
tCK
CLK
T2
tCL
T3
T4
T5
T6
T7
NOP
NOP
NOP
T8
T9
tCH
tCKS tCKH
CKE
tCMS tCMH
COMMAND
ACTIVE
NOP
NOP
NOP
WRITE
ACTIVE
NOP
tCMS tCMH
DQM0-DQM3
tAS
A0-A9
A10
BA0, BA1
tAH
ROW
tAS tAH
ROW
COLUMN m
ENABLE AUTO PRECHARGE
ROW
tAS tAH
ROW
BANK
BANK
tDS
DQ
BANK
tDH
DIN m
tRCD
tRAS
tRC
tWR
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00E
05/18/06
tRP
DON'T CARE
53
ISSI
IS42S32200C1
®
ALTERNATING BANK WRITE ACCESS
T0
T1
tCK
CLK
T2
tCL
T3
T4
T5
T6
T7
T8
T9
NOP
NOP
tCH
tCKS tCKH
CKE
tCMS tCMH
COMMAND
ACTIVE
NOP
WRITE
NOP
ACTIVE
NOP
WRITE
ACTIVE
tCMS tCMH
DQM0-DQM3
tAS tAH
A0-A9
A10
BA0, BA1
ROW
tAS tAH
COLUMN m
COLUMN b
ROW
ENABLE AUTO PRECHARGE
ROW
tAS tAH
ROW
ENABLE AUTO PRECHARGE
ROW
BANK 0
BANK 0
tDS
DQ
tDH
DIN m
tRCD - BANK 0
tRRD
tRAS - BANK 0
tRC - BANK 0
ROW
BANK 1
tDS tDH
DIN m+1
BANK 1
tDS
tDS tDH
DIN m+2
tDH
DIN m+3
tDS
tDH
DIN b
tWR - BANK 0
tRCD - BANK 1
BANK 0
tDS
tDH
DIN b+1
tDS
tDH
DIN b+2
tRP - BANK 0
tDS
tDH
DIN b+3
tRCD - BANK 0
tWR - BANK 1
DON'T CARE
54
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00E
05/18/06
ISSI
IS42S32200C1
®
WRITE - FULL PAGE BURST
T0
T1
tCK
CLK
T2
tCL
T3
T4
T5
Tn+1
Tn+2
NOP
NOP
NOP
NOP
BURST TERM
tCH
tCKS tCKH
CKE
tCMS tCMH
COMMAND
ACTIVE
NOP
WRITE
NOP
tCMS tCMH
DQM0-DQM3
tAS
A0-A9
A10
BA0, BA1
tAH
ROW
tAS tAH
COLUMN m
ROW
tAS tAH
BANK
BANK
tDS
DQ
tDH
DIN m
tDS
tDH
DIN m+1
tDS
tDH
DIN m+2
tRCD
tDS
tDH
DIN m+3
tDS
tDH
tDS
tDH
DIN m-1
256 locations
within same row
Full page completed
Full-page burst does not
self-terminate. Can use
BURST TERMINATE
to stop.
DON'T CARE
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00E
05/18/06
55
ISSI
IS42S32200C1
®
WRITE - DQM OPERATION
T0
T1
T2
tCK
CLK
tCL
T3
T4
T5
T6
T7
NOP
NOP
NOP
NOP
NOP
tCH
tCKS tCKH
CKE
tCMS tCMH
COMMAND
ACTIVE
NOP
WRITE
tCMS tCMH
DQM0-DQM3
tAS tAH
A0-A9
A10
BA0, BA1
ROW
tAS tAH
COLUMN m
ENABLE AUTO PRECHARGE
ROW
tAS tAH
DISABLE AUTO PRECHARGE
BANK
BANK
tDS
DQ
DIN m
tRCD
56
tDH
tDS tDH
tDS
tDH
DIN m+2
DIN m+3
DON'T CARE
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00E
05/18/06
ISSI
IS42S32200C1
®
ORDERING INFORMATION
Commercial Range: 0°°C to +70°°C
Frequency
Speed (ns)
Order Part No.
Package
183 MHz
5.5
IS42S32200C1-55T
400-mil TSOP II
183 MHz
5.5
IS42S32200C1-55TL
400-mil TSOP II, Lead-free
166 MHz
6
IS42S32200C1-6T
400-mil TSOP II
166 MHz
6
IS42S32200C1-6TL
400-mil TSOP II, Lead free
166 MHz
6
IS42S32200C1-6BL
90-ball BGA, Lead free
143 MHz
7
IS42S32200C1-7T
400-mil TSOP II
143 MHz
7
IS42S32200C1-7TL
400-mil TSOP II, Lead free
143 MHz
7
IS42S32200C1-7B
90-ball BGA
143 MHz
7
IS42S32200C1-7BL
90-ball BGA, Lead-free
Order Part No.
Package
Industrial Range: -40°°C to +85°°C
Frequency
Speed (ns)
166 MHz
6
IS42S32200C1-6TI
400-mil TSOP II
166 MHz
6
IS42S32200C1-6TLI
400-mil TSOP II, Lead free
143 MHz
7
IS42S32200C1-7TI
400-mil TSOP II
143 MHz
7
IS42S32200C1-7TLI
400-mil TSOP II, Lead free
143 MHz
7
IS42S32200C1-7BI
90-ball BGA
143 MHz
7
IS42S32200C1-7BLI
90-ball BGA, Lead-free
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00E
05/18/06
57
ISSI
PACKAGING INFORMATION
®
Mini Ball Grid Array
Package Code: B (90-Ball)
ø 0.45 + 0.10/−0.05 (90X)
9 8 7 6 5 4 3 2 1
1 2 3 4 5 6 7 8 9
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
e
D
D1
e
E1
E
A1
A
SEATING PLANE
Notes:
1. Controlling dimensions are in millimeters.
2. 0.8 mm Ball Pitch
mBGA - 8mm x 13mm
MILLIMETERS
Sym. Min.
N0.
Leads
A
Min. Typ.
Max.
90
—
A1
0.30
D
12.90
D1
Typ. Max.
INCHES
—
1.20
0.35
0.40
13.00 13.10
—
—
0.047
0.012 0.014 0.016
0.508 0.512
—
0.441
0.516
—
11.20
—
E
7.90
8.00
8.10
E1
—
6.40
—
—
0.252
—
e
—
0.80
—
—
0.031
—
0.311 0.315
—
0.319
Copyright © 2005 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. C
10/06/05
ISSI
®
PACKAGING INFORMATION
Plastic TSOP 54–Pin, 86-Pin
Package Code: T (Type II)
N
N/2+1
Notes:
1. Controlling dimension: millimieters,
unless otherwise specified.
2. BSC = Basic lead spacing between
centers.
3. Dimensions D and E1 do not include
mold flash protrusions and should be
E
E1
measured from the bottom of the
package.
4. Formed leads shall be planar with
respect to one another within 0.004
inches at the seating plane.
N/2
1
D
SEATING PLANE
A
ZD
b
e
Plastic TSOP (T - Type II)
Millimeters
Inches
Min
Max
Min
Max
Symbol
Ref. Std.
No. Leads (N)
A
A1
A2
b
C
D
E1
E
e
L
L1
ZD
α
—
1.20
0.05 0.15
—
—
0.30 0.45
0.12 0.21
22.02 22.42
10.03 10.29
11.56 11.96
0.80 BSC
0.40 0.60
—
—
0.71 REF
0°
8°
54
—
0.047
0.002 0.006
—
—
0.012 0.018
0.005 0.0083
0.867 0.8827
0.395 0.405
0.455 0.471
0.031 BSC
0.016 0.024
—
—
0°
8°
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. C
01/28/02
L
α
A1
C
Plastic TSOP (T - Type II)
Millimeters
Inches
Symbol Min Max
Min
Max
Ref. Std.
No. Leads (N)
86
A
A1
A2
b
C
D
E1
E
e
L
L1
ZD
α
—
1.20
0.05 0.15
0.95 1.05
0.17 0.27
0.12 0.21
22.02 22.42
10.16 BSC
11.56 11.96
0.50 BSC
0.40 0.60
0.80 REF
0.61 REF
0°
8°
—
0.047
0.002 0.006
0.037 0.041
0.007 0.011
0.005 0.008
0.867 0.8827
0.400 BSC
0.455 0.471
0.020 BSC
0.016 0.024
0.031 REF
0.024 BSC
0°
8°
1