MC74LCX244 Low-Voltage CMOS Octal Buffer With 5 V−Tolerant Inputs and Outputs (3−State, Non−Inverting) The MC74LCX244 is a high performance, non−inverting octal buffer operating from a 2.3 to 3.6 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. A VI specification of 5.5 V allows MC74LCX244 inputs to be safely driven from 5 V devices. The MC74LCX244 is suitable for memory address driving and all TTL level bus oriented transceiver applications. Current drive capability is 24 mA at the outputs. The Output Enable (OE) input, when HIGH, disables the output by placing them in a HIGH Z condition. Features • • • • • • • • • • • Designed for 2.3 to 3.6 V VCC Operation 5 V Tolerant − Interface Capability With 5 V TTL Logic Supports Live Insertion and Withdrawal IOFF Specification Guarantees High Impedance When VCC = 0 V LVTTL Compatible LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current in All Three Logic States (10 mA) Substantially Reduces System Power Requirements Latchup Performance Exceeds 500 mA ESD Performance: ♦ Human Body Model >2000 V ♦ Machine Model >200 V These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant http://onsemi.com MARKING DIAGRAMS 20 20 1 LCX244 AWLYYWWG SOIC−20 WB DW SUFFIX CASE 751D 1 20 20 LCX 244 ALYW G G 1 TSSOP−20 DT SUFFIX CASE 948E 1 1 LCX 244 ALYWG G QFN20 MN SUFFIX CASE 485AA A L, WL Y, YY W, WW G or G = = = = = Assembly Location Wafer Lot Year Work Week Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. © Semiconductor Components Industries, LLC, 2012 July, 2012 − Rev. 11 1 Publication Order Number: MC74LCX244/D MC74LCX244 VCC 2OE 1O0 2D0 1O1 2D1 1O2 2D2 1O3 2D3 20 19 18 17 16 15 14 13 12 11 1OE 1D0 1D1 1 2 3 4 5 6 7 8 9 10 1OE 1D0 2O0 1D1 2O1 1D2 2O2 1D3 2O3 GND 1D2 1D3 19 1 2 18 4 16 6 14 8 12 1O0 1O1 1O2 1O3 12 11 20 QFN PIN #1 2OE 19 10 2D0 2 9 2D1 17 3 15 5 13 7 11 9 2O0 2O1 Figure 1. Pinouts: 20−Lead (Top View) 2D2 PIN NAMES PINS FUNCTION 2D3 nOE Output Enable Inputs 1Dn, 2Dn Data Inputs 1On, 2On 3−State Outputs 1OE 2OE OUTPUTS 1Dn 2Dn 1On, 2On L L L L H H H X Z 2O3 Figure 2. Logic Diagram TRUTH TABLE INPUTS 2O2 H = High Voltage Level L = Low Voltage Level Z = High Impedance State X = High or Low Voltage Level and Transitions are Acceptable For ICC reasons, DO NOT FLOAT Inputs http://onsemi.com 2 MC74LCX244 MAXIMUM RATINGS Symbol VCC Parameter Value DC Supply Voltage Condition Units −0.5 to +7.0 V V VI DC Input Voltage −0.5 ≤ VI ≤ +7.0 VO DC Output Voltage −0.5 ≤ VO ≤ +7.0 Output in 3−State V −0.5 ≤ VO ≤ VCC + 0.5 Output in HIGH or LOW State (Note 1) V IIK DC Input Diode Current −50 VI < GND mA IOK DC Output Diode Current −50 VO < GND mA +50 VO > VCC mA IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA ±100 mA −65 to +150 °C IGND DC Ground Current Per Ground Pin TSTG Storage Temperature Range MSL Moisture Sensitivity Level 1 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. IO absolute maximum rating must be observed. RECOMMENDED OPERATING CONDITIONS Symbol VCC Parameter Supply Voltage Operating Data Retention Only Min Typ Max 2.0 1.5 2.5, 3.3 2.5, 3.3 3.6 3.6 VI Input Voltage 0 5.5 VO Output Voltage HIGH or LOW State 3−State 0 0 VCC 5.5 IOH HIGH Level Output Current VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V −24 −12 IOL LOW Level Output Current VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V 24 12 TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V http://onsemi.com 3 Units V V V mA mA −55 +125 °C 0 10 ns/V MC74LCX244 DC ELECTRICAL CHARACTERISTICS TA = −55°C to +125°C Symbol Characteristic VIH HIGH Level Input Voltage (Note 2) VIL LOW Level Input Voltage (Note 2) VOH HIGH Level Output Voltage Condition Min 2.3 V ≤ VCC ≤ 2.7 V 1.7 2.7 V ≤ VCC ≤ 3.6 V 2.0 Max V 2.3 V ≤ VCC ≤ 2.7 V 0.7 2.7 V ≤ VCC ≤ 3.6 V VOL LOW Level Output Voltage IOZ 3−State Output Current IOFF Power Off Leakage Current IIN Input Leakage Current ICC Quiescent Supply Current DICC Increase in ICC per Input Units V 0.8 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA VCC − 0.2 VCC = 2.3 V; IOH = −8 mA 1.8 VCC = 2.7 V; IOH = −12 mA 2.2 VCC = 3.0 V; IOH = −18 mA 2.4 VCC = 3.0 V; IOH = −24 mA 2.2 V 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA 0.2 VCC = 2.3 V; IOL = 8 mA 0.6 VCC = 2.7 V; IOL = 12 mA 0.4 VCC = 3.0 V; IOL = 16 mA 0.4 V VCC = 3.0 V; IOL = 24 mA 0.55 VCC = 3.6 V, VIN = VIH or VIL, VOUT = 0 to 3.6 V ±5 mA VCC = 0, VIN = 3.6 V or VOUT = 3.6 V 10 mA VCC = 0 to 3.6 V, VIN = 3.6 V or GND ±5 mA VCC = 3.6 V, VIN = 3.6 V or VOUT = 3.6 V 10 mA 2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V 500 mA 2. These values of VI are used to test DC electrical characteristics only. AC CHARACTERISTICS (tR = tF = 2.5 ns; RL = 500 W) Limits TA = −55°C to +125°C VCC = 3.0 V to 3.6 V CL = 50 pF Symbol Parameter VCC = 2.7 V CL = 50 pF VCC = 2.5 V ± 0.2 CL = 30 pF Waveform Min Max Min Max Min Max Units tPLH tPHL Propagation Delay Input to Output 1 1.5 1.5 6.5 6.5 1.5 1.5 7.5 7.5 1.5 1.5 7.8 7.8 ns tPZH tPZL Output Enable Time to High and Low Level 2 1.5 1.5 8.0 8.0 1.5 1.5 9.0 9.0 1.5 1.5 10 10 ns tPHZ tPLZ Output Disable Time From High and Low Level 2 1.5 1.5 7.0 7.0 1.5 1.5 8.0 8.0 1.5 1.5 8.4 8.4 ns tOSHL tOSLH Output−to−Output Skew (Note 3) 1.0 1.0 ns 3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter guaranteed by design. http://onsemi.com 4 MC74LCX244 DYNAMIC SWITCHING CHARACTERISTICS TA = +25°C Symbol Characteristic Condition Min Typ Max Units VOLP Dynamic LOW Peak Voltage (Note 4) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V 0.8 0.6 V VOLV Dynamic LOW Valley Voltage (Note 4) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V −0.8 −0.6 V 4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is measured in the LOW state. CAPACITIVE CHARACTERISTICS Symbol CIN Parameter Condition Typical Units VCC = 3.3 V, VI = 0 V or VCC 7 pF VCC = 3.3 V, VI = 0 V or VCC 8 pF 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF Input Capacitance COUT Output Capacitance CPD Power Dissipation Capacitance VCC Vmi 1Dn, 2Dn Vmi 0V tPLH tPHL VOH Vmo 1On, 2On Vmo VOL WAVEFORM 1 − PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns VCC Vmi 1OE, 2OE Vmi 0V tPZH tPHZ VCC VOH - 0.3 V Vmo 1On, 2On ≈0V tPZL tPLZ ≈ 3.0 V Vmo 1On, 2On VOL + 0.3 V GND WAVEFORM 2 − OUTPUT ENABLE AND DISABLE TIMES tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Figure 3. AC Waveforms VCC Symbol 3.3 V ± 0.3 V 2.7 V 2.5 V ± 0.2 V Vmi 1.5 V 1.5 V VCC/2 Vmo 1.5 V 1.5 V VCC/2 VHZ VOL + 0.3 V VOL + 0.3 V VOL + 0.15 V VLZ VOH − 0.3 V VOH − 0.3 V VOH − 015 V http://onsemi.com 5 MC74LCX244 VCC PULSE GENERATOR DUT RT CL RL TEST SWITCH tPLH, tPHL Open tPZL, tPLZ 6 V at VCC = 3.3 ± 0.3 V 6 V at VCC = 2.5 ± 0.2 V Open Collector/Drain tPLH and tPHL 6V tPZH, tPHZ GND CL = CL = RL = RT = 6V OPEN GND R1 50 pF at VCC = 3.3 ± 0.3 V or equivalent (includes jig and probe capacitance) 30 pF at VCC = 2.5 ± 0.2 V or equivalent (includes jig and probe capacitance) R1 = 500 W or equivalent ZOUT of pulse generator (typically 50 W) Figure 4. Test Circuit ORDERING INFORMATION Package Shipping† MC74LCX244DWG SOIC−20 WB (Pb−Free) 38 Units / Rail MC74LCX244DWR2G SOIC−20 WB (Pb−Free) 1000 / Tape & Reel MC74LCX244DTG TSSOP−20 (Pb−Free) 75 Units / Rail MC74LCX244DTR2G TSSOP−20 (Pb−Free) 2500 / Tape & Reel MC74LCX244MNTWG QFN20 (Pb−Free) 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 6 MC74LCX244 PACKAGE DIMENSIONS SOIC−20 WB CASE 751D−05 ISSUE G A 20 q X 45 _ E h 1 10 20X B B 0.25 M T A S B S A L H M 10X 0.25 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. 11 B M D 18X e A1 SEATING PLANE C T http://onsemi.com 7 DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_ MC74LCX244 PACKAGE DIMENSIONS TSSOP−20 CASE 948E−02 ISSUE C 20X 0.15 (0.006) T U 2X L K REF 0.10 (0.004) S L/2 20 M T U S V K K1 ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ S J J1 11 B −U− PIN 1 IDENT SECTION N−N 0.25 (0.010) N 1 10 M 0.15 (0.006) T U S A −V− N F DETAIL E C G D H DETAIL E 0.100 (0.004) −T− SEATING NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 6.40 6.60 0.252 0.260 B 4.30 4.50 0.169 0.177 C --1.20 --0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC −W− H 0.27 0.37 0.011 0.015 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC M 0_ 8_ 0_ 8_ PLANE SOLDERING FOOTPRINT 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS http://onsemi.com 8 MC74LCX244 PACKAGE DIMENSIONS QFN20, 2.5x4.5 MM CASE 485AA−01 ISSUE B D PIN ONE REFERENCE A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. B ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ DIM A A1 A3 b D D2 E E2 e K L E 2X 0.15 C 2X 0.15 C TOP VIEW MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.50 BSC 0.85 1.15 4.50 BSC 2.85 3.15 0.50 BSC 0.20 --0.35 0.45 0.10 C A 20X 0.08 C (A3) A1 SIDE VIEW C SEATING PLANE D2 11 20X L e 9 12 e E2 20X b 0.10 C A B 0.05 C NOTE 3 19 2 1 20 20X K BOTTOM VIEW ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. 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