Spec. No. : C269S6R Issued Date : 2003.05.23 Revised Date : 2011.02.22 Page No. : 1/6 CYStech Electronics Corp. Dual PNP Digital Transistors HBA143TS6R Features •Built-in bias resistors enable the configuration of an inverter circuit without connecting external input resistors (see equivalent circuit). •The bias resistors consist of thin-film resistors with complete isolation to allow positive biasing of the input. They also have the advantage of almost completely eliminating parasitic effects. •Only the on/off conditions need to be set for operation, making device design easy. •Two DTA143T chips in a SOT-363 package. •Mounting by SOT-323 automatic mounting machines is possible. •Mounting cost and area can be cut in half. •Transistor elements are independent, eliminating interference. •Complements the HBC143TS6R. •Pb-free package. Equivalent Circuit Outline SOT-363R HBA143TS6R RB2 TR1 TR2 RB1 RB1=4.7kΩ , RB2=4.7 kΩ HBA143TS6R CYStek Product Specification Spec. No. : C269S6R Issued Date : 2003.05.23 Revised Date : 2011.02.22 Page No. : 2/6 CYStech Electronics Corp. Absolute Maximum Ratings (Each Transistor,Ta=25℃) Parameter Symbol Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Power Dissipation Junction Temperature Storage Temperature Limits VCBO VCEO VEBO IC Pd Tj Tstg Unit -50 -50 -5 -100 200 (Note) 150 -55~+150 V V V mA mW °C °C Note: 150mW per element must not be exceeded. Characteristics (Each Transistor, Ta=25℃) Parameter Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage Emitter-Base Breakdown Voltage Collector-Base Cutoff Current Emitter-Base Cutoff Current Collector-Emitter Saturation Voltage DC Current Gain Input Resistance Transition Frequency Symbol VCBO Min. Typ. Max. Unit Test Conditions -50 V IC=-50μA VCEO -50 - - V IC=-1mA VEBO ICBO IEBO -5 - - -0.5 -0.5 V μA μA IE=-50μA VCB=-50V VEB=-4V VCE(sat) - 0.1 -0.3 V IC=-5mA, IB=-0.25mA hFE R fT 100 3.29 - 4.7 250 600 VCE=-5V, IC=-1mA 6.11 kΩ MHz VCE=-10V, IC=-5mA, f =100MHz * * Transition frequency of the device Ordering Information Device HBA143TS6R HBA143TS6R Package SOT-363 (Pb-free) Shipping Marking 3000 pcs / Tape & Reel 0F CYStek Product Specification CYStech Electronics Corp. Spec. No. : C269S6R Issued Date : 2003.05.23 Revised Date : 2011.02.22 Page No. : 3/6 Characteristic Curves Saturation Voltage vs Collector Current Current Gain vs Collector Current 1000 1000 VCE=5V Current Gain---HFE Saturation Voltage---(mV) VCE(SAT)@IC=20IB 100 10 100 0.1 1 10 Collector Current---IC(mA) 100 0.1 1 10 100 Collector Current---IC(mA) Power Derating Curves Power Dissipation---(mW) 250 Dual 200 S ingle 150 100 50 0 0 50 100 150 200 Ambient Temperature---TA(℃) HBA143TS6R CYStek Product Specification CYStech Electronics Corp. Spec. No. : C269S6R Issued Date : 2003.05.23 Revised Date : 2011.02.22 Page No. : 4/6 Reel Dimension Carrier Tape Dimension HBA143TS6R CYStek Product Specification CYStech Electronics Corp. Spec. No. : C269S6R Issued Date : 2003.05.23 Revised Date : 2011.02.22 Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. HBA143TS6R CYStek Product Specification CYStech Electronics Corp. Spec. No. : C269S6R Issued Date : 2003.05.23 Revised Date : 2011.02.22 Page No. : 6/6 SOT-363 Dimension Marking: Date Code: Year + Month Year : 6→2006, 7→2007,…, etc Month : 1→Jan 2→Feb, …, 9→ Sep, A→Oct, B →Nov, C→Dec 0F Device Code 6-Lead SOT-363R Plastic Surface Mounted Package CYStek Package Code: S6R Style: Pin 1. Emitter1 (E1) Pin 2. Base1 (B1) Pin 3. Collector2 (C2) Pin 4. Emitter2 (E2) Pin 5. Base2 (B2) Pin 6. Collector1 (C1) Millimeters Min. Max. 0.900 1.100 0.000 0.100 0.900 1.000 0.150 0.350 0.080 0.150 2.000 2.200 1.150 1.350 DIM A A1 A2 b c D E Inches Min. Max. 0.035 0.043 0.000 0.004 0.035 0.039 0.006 0.014 0.003 0.006 0.079 0.087 0.045 0.053 DIM E1 e e1 L L1 θ Millimeters Min. Max. 2.150 2.450 0.650 TYP 1.200 1.400 0.525 REF 0.260 0.460 0° 8° Inches Min. Max. 0.085 0.096 0.026 TYP 0.047 0.055 0.021 REF 0.010 0.018 0° 8° Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : Pure tin plated. • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. HBA143TS6R CYStek Product Specification