Light Touch Switches/EVPAX 3.0 mm×2.6 mm Double-action SMD Light Touch Switches Type: EVPAX ■ Features ● External dimensions: 3.0 mm×2.6 mm Height 0.7 mm ■ Recommended Applications ● Camera function (Digital still cameras, Camcorders, Mobile phones, etc.) ■ Explanation of Part Numbers 1 2 3 4 Product Code 5 6 7 8 9 Type ■ Specifications Type Snap action/Push-on type SPDT Rating 10 μA 2 Vdc to 20 mA 15 Vdc (Resistive load) Contact Resistance 500 mΩ max. Insulation Resistance Electrical Mechanical 100 MΩ min. (at 100 Vdc) Dielectric Withstanding Voltage 250 Vac (1 minute) Bouncing 3 ms max. (ON) 20 ms max. (OFF) Operating Force (1st Action) 0.7 N Operating Force (2nd Action) 2.0 N Push Travel (1st Action) 0.07 mm Push Travel (2nd Action) Endurance 0.16 mm Push Strength 30 N (15 seconds) Operating Life 100000 cycles min. –40 °C to +70 °C Operating Temperature –40 °C to +85 °C (Bulk) –20 °C to +60 °C (Taping) 8000 pcs. Embossed Taping (Reel Pack) Storage Temperature Minimum Quantity/Packing Unit Quantity/Carton 40000 pcs. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 2016.09 industrial.panasonic.com/ac/e/ –1– Panasonic Corporation 2016 ANCTB29E 201606-Fd Light Touch Switches/EVPAX ■ Dimensions in mm (not to scale) EVPAXBA1A General dimension tolerance : ± 0.1 ( )dimensions are reference dimensions. 0.7±0.15 This reference specifications are subject to change. B C 2.6 4-0.5 3.4 (0.05) 3 without the film 0.1 max. (film) A A' B C 1st operation A or/and A' shall be used as common terminal 2nd operation Circuit Diagram 2-3.6±0.05 2-2.5±0.05 0.1 max. (film) Land pattern (common terminal) 2-0.4±0.05 2-1.8±0.05 φ0.775 without the film and remnant of the gate A' 2-1.1 A 0.245 Except area needs insulation layer. Land pattern ( Exposed) Soldering thickness t=0.1±0.02 Land pattern plan ■ Recommended Reflow Soldering Conditions ● Embossed Carrier Taping Tape width=12.0 mm (A=12.0 mm) Feeding hole D E Chip pocket F C H 180 150 J I φ G B Fan or Normal Temp. A K Operation Top (°C) MAX. 245 220 C A' B A Tape running direction (Normal Temp.) 90±30 40±10 Soldering Time (s) Part No. Height EVPAX 0.7 A B t Taping condition : Lack of products in the middle of taping should be one MAX, but total quantity specified in the specifications should be secured. Peeling off strength of top tape : It should be within 0.2N to 1.0N at 165 degree in peeling off angle. Joint of carrier tape : One joint per one reel may exist. Unit: mm C 12.0±0.3 1.75±0.10 5.5±0.1 D E F G H I 8.0±0.1 4.0±0.1 2.0±0.1 1.5±0.3 3.8±0.2 J 2.3±0.2 0.75±0.20 K t (10.25) –0.10 0.30+0.15 ● Standard Reel Dimensions in mm (not to scale) G Item E A B C D Rate (mm) φ380.0±2.0 φ80.0±1.0 φ13.0±0.5 φ21.0±1.0 E 2.0±0.5 B C D A Item F G Rate (mm) 13.5±1.0 17.5±1.0 F Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ –2– Panasonic Corporation 2016 ANCTB29E 201606-Fd